Multilayer coil components

Abstract

To provide a laminated coil part capable of inhibiting generation of though hole breaking.SOLUTION: In a laminated coil part 1, a first conductive pattern 12 and a second conductive pattern 16 each has a parallel parts P1 where the conductive patterns overlap with each other in a lamination direction, and a non-parallel part P2 where the conductive patterns do not overlap with each other. the parallel parts P1, P1 of a set of the first conductive pattern 12 and the second conductive pattern 16 are connected to each other via a first through hole T1, and the non-parallel parts P2, P2 of a set of the first conductive pattern 12 and the second conductive pattern 16 adjacent to each other in the lamination direction are connected to each other via a second through hole T2.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a laminated coil component. [Background technology]

[0002] An example of a conventional multilayer coil component is the multilayer inductor described in Patent Document 1. This conventional multilayer inductor includes a laminate made of multiple insulator layers, external electrodes formed on the outside of the laminate, and a coil conductor formed in a spiral shape inside the laminate. The conductor patterns that make up the coil body are of only two types: C-shaped patterns and I-shaped patterns, with the number of C-shaped patterns being greater than the number of I-shaped patterns. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-162101 Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional multilayer inductor described above, layers having the same conductor pattern are stacked in the stacking direction. As a result, the through holes connecting the conductor patterns of adjacent layers in the stacking direction are also continuous in the stacking direction at the same position, which creates the problem of increased conductor volume at the same position. Because stress is easily applied at positions where the conductor volume is increased, it is thought that the through holes are more likely to break when thermal expansion or thermal contraction occurs.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a laminated coil component that can suppress the occurrence of breakage of through holes. [Means for solving the problem]

[0006] A laminated coil component according to one aspect of the present disclosure is a laminated coil component including a coil portion inside an insulating element body having a laminated structure, the coil portion having a plurality of sets including a first conductor pattern layer having a first conductor pattern and a second conductor pattern layer having a second conductor pattern, each of the first conductor pattern and the second conductor pattern having a parallel portion overlapping each other in the stacking direction, a non-parallel portion not overlapping each other in the stacking direction, and a pad portion used for connecting the conductor patterns, and in one set, the parallel portion of the first conductor pattern and the parallel portion of the second conductor pattern The first pads provided on the first and second portions are connected to each other via a first through hole, the second pads provided on the non-parallel portions of the first conductor patterns of one set are connected to the third pads provided on the non-parallel portions of the second conductor patterns of the set located on one side of the first set in the stacking direction via a second through hole, and the third pads provided on the non-parallel portions of the second conductor patterns of one set are connected to the second pads provided on the non-parallel portions of the first conductor patterns of the set located on the other side of the first set in the stacking direction via a second through hole.

[0007] In this laminated coil component, a first through hole connecting a first conductor pattern and a second conductor pattern of one set connects first pads provided in the parallel portions, and a second through hole connecting a first conductor pattern and a second conductor pattern of one set and an adjacent set connects second and third pads provided in the non-parallel portions. This allows the positions of the first through holes and the second through holes to be dispersed when viewed from the stacking direction. Dispersing the positions of the through holes prevents an increase in conductor volume at the same position. Therefore, even when thermal expansion or thermal contraction occurs, breakage of the through holes can be suppressed.

[0008] In one set, the second pad portion and the third pad portion may overlap each other in the stacking direction, which maintains the distributed relationship between the positions of the first through holes and the second through holes, while increasing the symmetry of the first conductor pattern and the second conductor pattern and simplifying the pattern.

[0009] In one set, a gap may exist between the second pad portion and the third pad portion, in which case the gap can make the electrical resistivity between the second pad portion and the third pad portion higher than that of the base material, thereby improving the withstand voltage of the multilayer coil component.

[0010] In one set, a recess may be provided on at least one of the surface of the second pad portion facing the third pad portion and the surface of the third pad portion facing the second pad portion, in which case the recess can ensure a sufficient interlayer space between the second pad portion and the third pad portion, thereby improving the withstand voltage of the laminated coil component.

[0011] The distance in the stacking direction between the first conductor pattern and the second conductor pattern in one set may be smaller than the distance in the stacking direction between the first conductor pattern of one set and the second conductor pattern of the set located on one side of the set in the stacking direction, and the distance in the stacking direction between the second conductor pattern of one set and the first conductor pattern of the set located on the other side of the set in the stacking direction. In this case, a sufficient distance can be ensured between the layers of adjacent sets in the stacking direction, thereby improving the withstand voltage of the multilayer coil component.

[0012] The element body may be formed by laminating magnetic layers containing a plurality of metal magnetic particles, and the number of metal magnetic particles between the second pad portion and the third pad portion in one set may be greater than the number of metal magnetic particles located between the first conductor pattern and the second conductor pattern in one set. By relatively increasing the number of metal magnetic particles between the second pad portion and the third pad portion, the withstand voltage of the multilayer coil component can be improved. [Effects of the Invention]

[0013] According to the present disclosure, it is possible to suppress the occurrence of breakage of through holes. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing an embodiment of a laminated coil component. [Figure 2] FIG. 2 is a diagram showing a layer structure of a laminated coil component. [Figure 3] FIG. 3 is a diagram showing the connection relationship between a first conductor pattern layer and a second conductor pattern layer. [Figure 4] FIG. 2 is a cross-sectional view of a main part of the laminated coil component. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, preferred embodiments of a laminated coil component according to one aspect of the present disclosure will be described in detail with reference to the drawings.

[0016] FIG. 1 is a perspective view showing one embodiment of a laminated coil component. As shown in FIG. 1, the laminated coil component 1 includes a rectangular parallelepiped element body 2 and a pair of terminal electrodes 3, 3. The pair of terminal electrodes 3, 3 are arranged at both ends of the element body 2 and are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The laminated coil component 1 can be used, for example, as a bead inductor or a power inductor.

[0017] The rectangular parallelepiped element body 2 has a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d, and a pair of opposing side faces 2e, 2f. In the following description, the opposing direction of the pair of end faces 2a, 2b is referred to as a first direction D1, and the opposing direction of the pair of main faces 2c, 2d is referred to as a second direction D2. The opposing direction of the pair of side faces 2e, 2f is referred to as a third direction D3. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to one another. In this embodiment, the pair of end faces 2a, 2b are square-shaped, and the pair of main faces 2c, 2d and the pair of side faces 2e, 2f are rectangular-shaped. The main face 2c (bottom face in FIG. 1) can serve as a mounting surface. The mounting surface is the surface that faces another electronic device (such as a circuit board or electronic component) when the laminated coil component 1 is mounted on the other electronic device.

[0018] The element body 2 is configured by stacking multiple magnetic layers 11 (see FIG. 2). The magnetic layers 11 are stacked in the direction in which the main surfaces 2c, 2d face each other. That is, the stacking direction of each magnetic layer 11 coincides with the second direction D2 (hereinafter, the facing direction of the main surfaces 2c, 2d may also be referred to as the "stacking direction"). Each magnetic layer 11 has a substantially rectangular shape. In the actual element body 2, the magnetic layers 11 are integrated to the extent that the boundaries between the layers are not visible.

[0019] The element body 2 includes a plurality of metal magnetic particles (not shown). The metal magnetic particles are made of, for example, a soft magnetic alloy. The soft magnetic alloy is, for example, an Fe-Si alloy. When the soft magnetic alloy is an Fe-Si alloy, it may contain P. The soft magnetic alloy may be, for example, an Fe-Ni-Si-M alloy. "M" includes one or more elements selected from Co, Cr, Mn, P, Ti, Zr, Hf, Nb, Ta, Mo, Mg, Ca, Sr, Ba, Zn, B, Al, and rare earth elements.

[0020] In the element body 2, the metal magnetic particles are bonded to each other. The bonding between the metal magnetic particles is realized, for example, by bonding between oxide films formed on the surfaces of the metal magnetic particles. The element body 2 also includes portions filled with resin. The resin is present at least partially between the plurality of metal magnetic particles. The resin is a resin having electrical insulating properties. Examples of resins that can be used include silicone resin, phenol resin, acrylic resin, and epoxy resin. There may be gaps between the plurality of metal magnetic particles that are not filled with resin.

[0021] The pair of terminal electrodes 3, 3 each have a flat rectangular parallelepiped shape and are arranged to cover the end faces 2a, 2b of the element body 2, respectively. The terminal electrode 3 is made of a conductive material, such as Ag or Pd. The terminal electrode 3 is, for example, a fired electrode, made of a sintered body of a conductive paste. The conductive paste contains a conductive metal powder and glass frit. The conductive metal powder is, for example, Ag powder or Pd powder. A plating layer may be formed on the surface of the terminal electrode 3. The plating layer is formed by, for example, electroplating. The electroplating is, for example, Ni electroplating or Sn electroplating.

[0022] 2 is a diagram showing the layer structure of a laminated coil component. As shown in the figure, a coil portion C is provided inside an element body 2. The multiple layers forming the coil portion C include a cover layer Lc, a first conductor pattern layer L1, a second conductor pattern layer L2, a connecting conductor layer L3, and an extraction conductor layer L4. The cover layer Lc is a layer composed only of a magnetic layer containing metal magnetic particles. Multiple cover layers Lc are arranged on each of the main surface 2c side and the main surface 2d side of the element body 2.

[0023] Each layer except the cover layer Lc has a conductor portion formed in a predetermined pattern. The conductor portion is made of, for example, a metal material. The material of the metal material is not particularly limited, but examples thereof include Ag, Cu, Au, Al, Pd, and Pd / Ag alloys. The metal material may contain a Ti compound, a Zr compound, or a Si compound. The conductor portion can be formed by, for example, a printing method or a thin film growth method.

[0024] The first conductor pattern layer L1 and the second conductor pattern layer L2 are layers that form the main portion (winding portion) of the coil portion C. In this embodiment, one first conductor pattern layer L1, one second conductor pattern layer L2, and one connecting conductor layer L3 are laminated in this order to form one set. Within the element body 2, multiple sets are provided in the laminated structure according to the number of windings required for the coil portion C.

[0025] The first conductor pattern layer L1 has a first conductor pattern 12. The first conductor pattern 12 has a generally rectangular ring shape as a whole. The first conductor pattern 12 has a first portion 12a extending in the third direction D3 on the end face 2a side, a second portion 12b extending in the first direction D1 on the side face 2e side, and a third portion 12c extending in the third direction D3 on the end face 2b side. The first conductor pattern 12 also has a fourth portion 12d extending in the first direction D1 on the side face 2f side.

[0026] In the first conductor pattern 12, one end of the fourth portion 12d is connected to the end of the third portion 12c on the side surface 2f side, and the other end of the fourth portion 12d is located at the center of the first conductor pattern layer L1 in the first direction D1. A first pad portion 13 is provided at the end of the first portion 12a on the side surface 2f side and at the connection portion between the third portion 12c and the fourth portion 12d. A second pad portion 14 is provided at the other end of the fourth portion 12d.

[0027] The second conductor pattern layer L2 has a second conductor pattern 16. The second conductor pattern 16 has a generally rectangular ring shape as a whole. The second conductor pattern 16 has a first portion 16a extending in the third direction D3 on the end face 2a side, a second portion 16b extending in the first direction D1 on the side face 2e side, and a third portion 16c extending in the third direction D3 on the end face 2b side. The second conductor pattern 16 also has a fourth portion 16d extending in the first direction D1 on the side face 2f side.

[0028] In the second conductor pattern 16, one end of the fourth portion 16d is connected to the end of the first portion 16a on the side surface 2f side, and the other end of the fourth portion 16d is located at the center of the first conductor pattern layer L1 in the first direction D1. A first pad portion 13 is provided at the connection portion between the first portion 16a and the fourth portion 16d and at the end of the third portion 16c on the side surface 2f side. A third pad portion 17 is provided at the other end of the fourth portion 16d.

[0029] In this embodiment, as described above, the other end of the fourth portion 12d of the first conductor pattern 12 where the second pad portion 14 is provided and the other end of the fourth portion 16d of the second conductor pattern 16 where the third pad portion 17 is provided are both located at the center in the first direction D1. Therefore, the second pad portion 14 and the third pad portion 17 are overlapped with each other in the stacking direction.

[0030] The connecting conductor layer L3 functions as a layer that secures interlayer space between the first conductor pattern layer L1 and the second conductor pattern layer L2 that are adjacent to each other in the stacking direction. The connecting conductor layer L3 has only a pad portion 18 as a conductor portion. The pad portion 18 is disposed corresponding to the second pad portion 14 of the first conductor pattern 12 and the third pad portion 17 of the second conductor pattern 16. In other words, the pad portion 18, the second pad portion 14, and the third pad portion 17 are overlapped with each other in the stacking direction.

[0031] The lead conductor layer L4 is a layer that connects the coil portion C to the terminal electrodes 3, 3. In this embodiment, the lead conductor layer L4 has a lead conductor layer L4A arranged on the principal surface 2c side and a lead conductor layer L4B arranged on the principal surface 2d side. The lead conductor layer L4A is arranged on the lower layer side (principal surface 2c side) of the connection conductor layer L3 in the set closest to the principal surface 2c. The lead conductor layer L4A has a pad portion 19 arranged to overlap the pad portion 18 of the connection conductor layer L3 in the stacking direction, and a lead conductor 20A extending from the pad portion 19 toward the edge on the end face 2b side. The pad portion 19 is electrically connected to the pad portion 18 of the connection conductor layer L3 via a through hole (not shown). The lead conductor 20A is connected to the terminal electrode 3 covering the end face 2b at the end face 2b.

[0032] On the principal surface 2d side, a connecting conductor layer L3 is arranged on the upper layer side (principal surface 2d side) of the first conductor pattern layer L1 of the set located closest to the principal surface 2d. The leading conductor layer L4B has a pad portion 19 arranged to overlap the pad portion 18 of the connecting conductor layer L3 in the stacking direction, and a leading conductor 20B extending from the pad portion 19 toward the edge on the end surface 2a side. The pad portion 19 is electrically connected to the pad portion 18 of the connecting conductor layer L3 via a through hole (not shown). The leading conductor 20B is connected at the end surface 2a to a terminal electrode 3 covering the end surface 2a.

[0033] Next, the connection relationship between the first conductor pattern layer L1 and the second conductor pattern layer L2 will be described in more detail. Fig. 3 is a diagram showing the connection relationship between the first conductor pattern layer L1 and the second conductor pattern layer L2. As shown in the figure, when connecting the first conductor pattern layer L1 and the second conductor pattern layer L2, the first conductor pattern 12 and the second conductor pattern 16 each have a parallel portion P1 that overlaps with each other in the stacking direction and a non-parallel portion P2 that does not overlap with each other in the stacking direction.

[0034] In this embodiment, the first portions 12a, 16a, the second portions 12b, 16b, and the third portions 12c, 16c of the first conductor pattern 12 and the second conductor pattern 16 form a parallel portion P1, and the fourth portions 12d, 16d form a non-parallel portion P2. In one set, the first pads 13, 13 provided on the parallel portion P1 of the first conductor pattern 12 and the parallel portion P1 of the second conductor pattern 16 are connected to each other via a first through hole T1. On the other hand, in another set, the second pad 14 provided on the non-parallel portion P2 of the first conductor pattern 12 and the third pad 17 provided on the non-parallel portion P2 of the second conductor pattern 16 are not connected to each other.

[0035] The second pad portion 14 and the third pad portion 17 are used to connect one set to another set adjacent to the set in the stacking direction. In the example of Fig. 3, the second pad portion 14 provided on the non-parallel portion P2 of the first conductor pattern 12 of one set and the third pad portion 17 provided on the non-parallel portion P2 of the second conductor pattern 16 of the set located on one side of the set in the stacking direction are connected to each other via the pad portion 18 of the connecting conductor layer L3 and the second through-hole T2. Also, the third pad portion 17 provided on the non-parallel portion P2 of the second conductor pattern 16 of the one set and the second pad portion 14 provided on the non-parallel portion P2 of the first conductor pattern 12 of the set located on the other side of the set in the stacking direction are connected to each other via the pad portion 18 of the connecting conductor layer L3 and the second through-hole T2.

[0036] FIG. 4 is a cross-sectional view of a main portion of the laminated coil component. This figure shows a cross section of the element body 2 cut in the stacking direction at the dashed line K in FIG. 3. As described above, the second pad portion 14 and the third pad portion 17 in one set are not connected. However, as shown in FIG. 4, a gap G exists between the layers of the second pad portion 14 and the third pad portion 17 in one set. The gap G can be formed, for example, by the difference in thermal contraction rate between the element body 2 and the conductor portion constituting the coil portion C. The gap G may also be formed by sandwiching a gap-forming member between the layers of the second pad portion 14 and the third pad portion 17 during formation of the element body 2. Furthermore, when the element body 2 includes a portion filled with a plurality of metal magnetic particles and resin, as in this embodiment, some of the resin may enter the gap G.

[0037] In addition, in this embodiment, in one set, a recess 21 is provided on at least one of the surface of the second pad 14 facing the third pad 17 and the surface of the third pad 17 facing the second pad 14. In this embodiment, recesses 21 are provided on both of these surfaces. Due to these recesses 21, 21, the distance L1 in the stacking direction between the second pad 14 and the third pad 17 in one set is larger than the distance L2 in the stacking direction between the first conductor pattern 12 and the second conductor pattern 16 in one set.

[0038] The recesses 21 can be formed, for example, by printing a magnetic material in the same shape as the second pad portion 14 at the position of the second pad portion 14 before forming the first conductor pattern 12 by printing or the like on the magnetic layer 11. The recesses 21 can also be formed in the third pad portion 17 by disposing a magnetic material between the second pad portion 14 and the third pad portion 17 and allowing the magnetic material to penetrate into the third pad portion 17 side in the process of laminating and pressing the magnetic layer 11.

[0039] In this embodiment, the distance L2 in the stacking direction between the first conductor pattern 12 and the second conductor pattern 16 in one set is smaller than the distance L3 in the stacking direction between the first conductor pattern 12 of one set and the second conductor pattern 16 of the set located on one side of the set in the stacking direction, and the distance L4 in the stacking direction between the second conductor pattern 16 of one set and the first conductor pattern 12 of the set located on the other side of the set in the stacking direction. In the example of FIG. 4, the distance L3 and the distance L4 are equal, and L2 <L3=L4となっている。

[0040] In addition, in this embodiment, the number of metal magnetic particles between the second pad portion 14 and the third pad portion 17 in one set is greater than the number of metal magnetic particles located between the first conductive pattern 12 and the second conductive pattern 16 in one set (between the parallel portions P1, P1). That is, in this embodiment, the number of metal magnetic particles aligned in the stacking direction at the above-mentioned interval L1 is greater than the number of metal magnetic particles aligned in the stacking direction at the above-mentioned interval L2. The number of metal magnetic particles may be compared by comparing average values ​​at multiple positions.

[0041] As described above, in the laminated coil component 1, the first through hole T1 connecting the first and second conductor patterns 12 and 16 of one set connects the first pads 13, 13 provided in the parallel portion P1, and the second through hole T2 connecting the first and second conductor patterns 12 and 16 of one set to the adjacent set connects the second and third pads 14, 17 provided in the non-parallel portion P2. This allows the positions of the first through holes T1 and the second through holes T2 to be spaced apart when viewed from the stacking direction in the laminated coil component 1. Spaced apart the positions of the first and second through holes T1 and T2, it is possible to prevent an increase in the conductor volume at the same position. Therefore, even if thermal expansion or thermal contraction occurs, breaks in the through holes T1 and T2 can be suppressed.

[0042] In the laminated coil component 1, the second pad portion 14 and the third pad portion 17 in one set overlap each other in the stacking direction. In this case, the distributed relationship between the positions of the first through holes T1 and the second through holes T2 is maintained, while the symmetry of the first conductor pattern 12 and the second conductor pattern 16 is enhanced, thereby simplifying the pattern.

[0043] In the laminated coil component 1, a gap G exists between the second pad portion 14 and the third pad portion 17 in one set. This gap G makes it possible to increase the interlayer electrical resistivity between the second pad portion 14 and the third pad portion 17 compared to the element material, thereby improving the withstand voltage of the laminated coil component 1. Furthermore, in the laminated coil component 1, in one set, recesses 21 are provided on both the surface of the second pad portion 14 facing the third pad portion 17 and the surface of the third pad portion 17 facing the second pad portion 14. These recesses 21 ensure a sufficient interlayer space between the second pad portion 14 and the third pad portion 17, thereby improving the withstand voltage of the laminated coil component 1.

[0044] In the laminated coil component 1, the distance L2 in the stacking direction between the first conductor pattern 12 and the second conductor pattern 16 in one set is smaller than the distance L3 in the stacking direction between the first conductor pattern 12 of one set and the second conductor pattern 16 of the set located on one side of the set in the stacking direction, and the distance L4 in the stacking direction between the second conductor pattern 16 of one set and the first conductor pattern 12 of the set located on the other side of the set in the stacking direction. This ensures a sufficient gap between the layers of adjacent sets in the stacking direction, thereby improving the withstand voltage of the laminated coil component 1.

[0045] In the laminated coil component 1, the element body 2 is formed by stacking magnetic layers 11 containing a plurality of metal magnetic particles. The number of metal magnetic particles between the second pad portion 14 and the third pad portion 17 in one set is greater than the number of metal magnetic particles located between the first conductor pattern 12 and the second conductor pattern 16 in one set. By relatively increasing the number of metal magnetic particles between the second pad portion 14 and the third pad portion 17, the withstand voltage of the laminated coil component 1 can be improved.

[0046] The present disclosure is not limited to the above-described embodiment. For example, in the above-described embodiment, the recesses 21 are provided on both the surface of the second pad portion 14 facing the third pad portion 17 and the surface of the third pad portion 17 facing the second pad portion 14. However, the recesses 21 may be provided on only one of these surfaces, or on neither surface. The gap G between the second pad portion 14 and the third pad portion 17 does not necessarily have to be provided.

[0047] The element body 2 does not necessarily need to be configured to include metal magnetic particles, and may be configured of ferrite (e.g., Ni-Cu-Zn ferrite, Ni-Cu-Zn-Mg ferrite, Cu-Zn ferrite), a dielectric material, etc. In addition, in the above embodiment, one set is configured of one first conductor pattern layer L1, one second conductor pattern layer L2, and one connecting conductor layer L3, but the connecting conductor layer L3 may be omitted, and one set may be configured of one first conductor pattern layer L1 and one second conductor pattern layer L2. [Explanation of symbols]

[0048] 1...multilayer coil component, 2...element body, 12...first conductive pattern, 13...first pad portion, 14...second pad portion, 17...third pad portion, 16...second conductive pattern, 21...recess, C...coil portion, L1...first conductive pattern layer, L2...second conductive pattern layer, P1...parallel portion, P2...non-parallel portion, T1...first through hole, T2...second through hole, G...gap.

Claims

1. A laminated coil component including a coil portion inside an insulating element body having a laminated structure, the coil portion has a plurality of sets including a first conductor pattern layer having a first conductor pattern and a second conductor pattern layer having a second conductor pattern; the first conductor pattern and the second conductor pattern each overlap each other in a stacking direction, and each have parallel portions disposed on one long side and two short sides of a rectangle as viewed in the stacking direction, and two first pad portions provided on both ends of the parallel portions; the first conductor pattern has a second pad portion and a non-parallel portion extending between one of the two first pad portions and the second pad portion; the second conductor pattern has a third pad portion and a non-parallel portion extending between the other of the two first pad portions and the third pad portion; In one set, the parallel portions are electrically connected only by connecting the two first pad portions to each other via a first through hole; the second pad portion of the first conductor pattern of the one set is connected to the third pad portion of the second conductor pattern of the set located on one side of the one set in the stacking direction via a second through hole; a multilayer coil component in which the third pad portion of the second conductor pattern of the one set is connected to the second pad portion of the first conductor pattern of the set located on the other side of the one set in the stacking direction via the second through hole.

2. A laminated coil component including a coil portion inside an insulating element body having a laminated structure, the coil portion has a plurality of sets including a first conductor pattern layer having a first conductor pattern and a second conductor pattern layer having a second conductor pattern; each of the first conductor pattern and the second conductor pattern has a parallel portion that overlaps with each other in a stacking direction, and two first pad portions provided on both ends of the parallel portion; the first conductor pattern has a second pad portion and a non-parallel portion extending between one of the two first pad portions and the second pad portion; the second conductor pattern has a third pad portion and a non-parallel portion extending between the other of the two first pad portions and the third pad portion; the second pad portion and the third pad portion overlap each other in the stacking direction at a midpoint of a line segment connecting the two first pad portions; In one set, the first pad portions are connected to each other via a first through hole, the second pad portion of the first conductor pattern of the one set is connected to the third pad portion of the second conductor pattern of the set located on one side of the one set in the stacking direction via a second through hole; a multilayer coil component in which the third pad portion of the second conductor pattern of the one set is connected to the second pad portion of the first conductor pattern of the set located on the other side of the one set in the stacking direction via the second through hole.

3. 3. The laminated coil component according to claim 1, wherein in each set, the second pad portion and the third pad portion overlap each other in the stacking direction.

4. 4. The laminated coil component according to claim 1, wherein in the one set, a recess is provided on at least one of a surface of the second pad portion facing the third pad portion and a surface of the third pad portion facing the second pad portion.

5. the element body is formed by stacking magnetic layers each containing a plurality of metal magnetic particles; 5. The laminated coil component according to claim 1, wherein the number of the metal magnetic particles between the second pad portion and the third pad portion in the set is greater than the number of the metal magnetic particles located between the first conductor pattern and the second conductor pattern in the set.

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