Imaging module and electronic device

Abstract

The present application discloses an imaging module and electronic device, including a bracket (100), a lens (200) mounted on the bracket (100), a substrate (300) connected to the bracket (100), and a photodetector module (400) mounted on the substrate (300) and electrically connected to the substrate (300), facing the lens (200) and having a light-receiving surface (410) facing the lens (200), the light-receiving surface (410) being concave and joined together by a plurality of protrusions (411) distributed in an array. The present application also discloses an electronic device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This invention claims priority to a Chinese patent application filed with the China Patent Office on May 28, 2020, bearing application number 202010470005.6 and entitled "Imaging Module and Electronic Device," the entire contents of which are incorporated herein by reference. [Technical Field]

[0002] The present application relates to the technical field of communication devices, and in particular to an imaging module and an electronic device. [Background technology]

[0003] 2. Description of the Related Art With the rapid development of electronic devices, their applications are becoming more and more widespread, and electronic devices such as mobile phones, tablet computers, etc. are becoming increasingly useful in people's work, life, entertainment, etc.

[0004] Currently, users' demands for the photographic effects of electronic devices are also increasing. Generally, natural light is a mixture of various light, so that in the process of photographing by the imaging module of an electronic device, after light of different wavelengths is refracted by the lens of the imaging module, the refractive index of the lens of different light rays is also different according to the wavelength of the light rays.

[0005] Therefore, in order to calibrate and focus light beams of different wavelengths on the same plane, a relatively large and relatively complex lens may be used so that most of the light beams can be refracted by the lens to the light-receiving chip of the imaging module. However, since the light-receiving chip of the imaging module generally has a planar structure, image distortion is likely to occur in the process of collecting an image using a light-receiving chip with a planar structure, and distortion of the formed image is likely to occur. In addition, the processing of a lens with a complex outline is relatively difficult, which is disadvantageous to cost control of electronic devices, and the relatively large size of the lens is also disadvantageous to the miniaturization design of electronic devices. Summary of the Invention [Problem to be solved by the invention]

[0006] The present application discloses an imaging module and an electronic device, which can solve the problem of poor imaging quality of imaging modules in current electronic devices. [Means for solving the problem]

[0007] In order to solve the above technical problems, the present application is realized as follows.

[0008] According to a first aspect, an embodiment of the present application discloses an imaging module, the imaging module comprising: A bracket and a lens mounted on the bracket; a substrate connected to the bracket; and a photodetector chip module mounted on the substrate and electrically connected to the substrate, positioned opposite the lens, and having a light receiving surface facing the lens, the light receiving surface being concave and being joined together by a plurality of protrusions distributed in an array.

[0009] According to a second aspect, an embodiment of the present application discloses an electronic device including the imaging module described above. [Effects of the Invention]

[0010] The technical solution adopted in this application can achieve the following beneficial effects:

[0011] In the imaging module disclosed in the embodiments of the present application, the difference between the distance between the center of the light-receiving surface and the lens and the distance between the outer part of the light-receiving surface and the lens is relatively small, so that the optical path length of the obliquely incident light to the outer part can be shortened and the difference in optical path length between the center and outer parts can be relatively small, effectively reducing image distortion.Of course, the light-receiving surface can refract most of the light to the light-receiving chip module through the lens, facilitating the miniaturization of the lens.At the same time, the light-receiving surface formed by joining a plurality of protrusions distributed in an array can re-focus the light focused by the lens, thereby reducing the light-receiving area required for the light-receiving chip module and further favoring the miniaturization of the imaging module. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a structural schematic diagram of an imaging module disclosed in an embodiment of the present application; [Figure 2] FIG. 10 is a structural schematic diagram of an imaging module disclosed in another embodiment of the present application. [Figure 3] 1 is a schematic diagram of a partial structure of an imaging module disclosed in an embodiment of the present application. [Figure 4] FIG. 4 is a local enlarged schematic view of the dotted-line frame portion in FIG. 3. [Figure 5] FIG. 10 is a partial structural schematic diagram of an imaging module disclosed in another embodiment of the present application. [Figure 6] FIG. 6 is a local enlarged schematic view of the portion enclosed by the dotted line in FIG. 5. DETAILED DESCRIPTION OF THE INVENTION

[0013] The following clearly and completely describes the technical solutions in the embodiments of the present application, in conjunction with the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without any creative efforts fall within the scope of protection of the present application.

[0014] The terms "first," "second," etc. in the specification and claims of this application are used to distinguish between similar objects and are not intended to describe a particular order or sequence. It should be understood that such terms, when used, are interchangeable where appropriate, so that embodiments of this application may be performed in orders other than those illustrated or described herein. Note that "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the related objects.

[0015] The imaging module according to the embodiments of the present application will be described in detail below through specific examples and application scenarios in conjunction with the drawings.

[0016] 1, an embodiment of the present application discloses an imaging module that may be applied to an electronic device. The imaging module includes a bracket 100, a lens 200, a substrate 300, and a photodetector module 400.

[0017] The bracket 100 can provide a mounting position for other components of the imaging module, and a storage space may be opened in the bracket 100, and the other components of the imaging module may be installed within the storage space to make the structure of the imaging module more compact.

[0018] By installing the lens 200 on the bracket 100, the lens 200 is supported by the bracket 100, and the lens 200 can collect light rays so that the light receiving chip module 400 in the imaging module can obtain an image by sensing the light rays that pass through the lens 200.

[0019] The substrate 300 is connected to the bracket 100 and is used to mount elements such as the photoreceiver module 400. Specifically, the photoreceiver module 400 is mounted on the substrate 300 and electrically connected to the substrate 300. In this case, the substrate 300 not only supports the photoreceiver module 400 but also controls the photoreceiver module 400. The substrate 300 may be a PCB (Printed Circuit Board) or a rigid-flexible substrate, but the embodiments of the present application are not limited thereto.

[0020] The photodetector module 400 is disposed opposite the lens 200, so that the lens 200 can focus the light onto the photodetector module 400, and finally the photodetector module 400 can receive the light and form an image.

[0021] In the embodiment of the present application, the photo-detecting chip module 400 has a light-receiving surface 410 facing the lens 200. The light-receiving surface 410 is concave and is joined by a plurality of protrusions 411 distributed in an array. In this case, the light-receiving surface 410 is concave in a direction away from the lens 200, so that the difference between the distance between the center of the light-receiving surface 410 and the lens 200 and the distance between the outer portion of the light-receiving surface 410 and the lens 200 is relatively small. The plurality of protrusions 411 refract the light, thereby realizing the collimation of the light, and allowing the light to propagate in the photo-detecting chip module 400 in a direction perpendicular to the light-receiving surface.

[0022] The central portion of the light receiving surface 410 is positioned opposite the lens 200, and the optical path length of the light ray that passes through the lens 200 and enters the central portion is L1, and the optical path length of the light ray that passes through the lens 200 and enters the outer portion is L. If the surface of the light receiving chip module 400 facing the lens 200 is flat, the distance from the central portion of the lens 200 is shorter than the distance from the outer portion of the lens 200, so that the optical path length of the light ray that enters the outer portion is longer than the optical path length of the light ray that enters the central portion, and ultimately the image distortion becomes relatively large.

[0023] However, in the embodiment of the present application, since the height of the outer portion is relatively large and the height of the central portion is relatively small, L2 can be made small and the difference between L2 and L1 can be made relatively small, and as shown in Figure 3, the arrow points in the direction of light emission.

[0024] In the imaging module disclosed in the embodiments of the present application, the difference between the distance between the center portion of the light-receiving surface 410 and the lens 200 and the distance between the outer portion of the light-receiving surface 410 and the lens 200 is relatively small, which shortens the optical path length of the obliquely incident light to the outer portion and relatively reduces the difference in optical path length between the center portion and the outer portion, effectively reducing image distortion. Furthermore, the light-receiving surface 410 refracts most of the light rays through the lens 200 to the light-receiving chip module 400, facilitating the miniaturization of the lens 200. At the same time, the light-receiving surface 410, which is formed by joining together a plurality of protrusions 411 distributed in an array, can re-focus the light rays focused by the lens 200, thereby reducing the light-receiving area required for the light-receiving chip module 400 and further contributing to the miniaturization of the imaging module.

[0025] Furthermore, in the embodiments disclosed in the present application, in one alternative solution, the photodetector chip module 400 may include a chip assembly 420 and a light-collecting member 430. Referring to Figures 3 and 4, the chip assembly 420 may be mounted on the substrate 300 and electrically connected to the substrate 300. In this case, the chip assembly 420 can not only be supported by the substrate 300, but also controlled by the substrate 300.

[0026] The light-collecting member 430 may be installed on the chip assembly 420, and the surface of the light-collecting member 430 facing the lens 200 may be the light-receiving surface 410. This method not only effectively reduces the distortion of the imaging module's image, but also further avoids the cost of the imaging module being too high due to the light-receiving surface 410 being provided on the light-collecting member 430, and also ensures the integrity of the chip assembly 420.

[0027] Of course, the light-collecting member 430 may be an optical adhesive member, and since the optical adhesive has characteristics such as colorless transparency and high light transmittance, it is advantageous for light to pass through the light-collecting member 430 and be irradiated onto the chip assembly 420. In addition, the light-collecting member 430 formed with the optical adhesive has excellent adhesion performance, so that the entire structure formed by the light-collecting member 430 and the chip assembly 420 can meet the requirements of the optical path design, thereby maintaining the imaging effect of the chip assembly 420. Of course, the optical adhesive may be a natural resin optical adhesive or a synthetic resin optical adhesive, and the embodiments of the present application are not limited thereto.

[0028] Furthermore, when the focusing member 430 is made of an optical adhesive, the focusing member 430 may be a molded product. During specific processing, an optical adhesive is first applied to the surface of the chip assembly 420 facing the lens 200, and then the required focusing member 430 is formed using the optical adhesive through molding. This method not only facilitates molding of the focusing member 430, but also allows the focusing member 430 to be better attached to the chip assembly 420, so that the entire structure formed by the focusing member 430 and the chip assembly 420 can better meet the requirements of the optical path design, and thereby maintain the imaging effect of the chip assembly 420.

[0029] In another alternative embodiment of the present application, the photodetector chip module 400 may include a chip assembly 420, and the chip assembly 420 may include a photodetector chip 421 and a micro-convex mirror array 422. Referring to Figures 5 and 6, the photodetector chip 421 is a device that converts optical signals into electrical signals. The photodetector chip 421 may be mounted on the substrate 300 so that the substrate 300 can mount and control the photodetector chip 421, and may be electrically connected to the substrate 300. The photodetector chip 421 may be a CCD (Charge-Coupled Device) photodetector chip or a CMOS (Complementary Metal Oxide Semiconductor) photodetector chip.

[0030] The micro-convex mirror array 422 may be installed on the light-receiving chip 421, and the micro-convex mirror array 422 may face the lens 200. The micro-convex mirror array 422 can form collimated parallel light rays through refraction of the light rays, so that the light rays propagate in a direction perpendicular to the light-receiving surface of the light-receiving chip 421, and further improve the imaging effect of the light-receiving chip 421.

[0031] Furthermore, in the embodiment of the present application, the micro-convex mirror array 422 may include a plurality of micro-convex mirrors, the height of which may gradually increase from the center of the light-receiving chip 421 toward the periphery. The ends of the micro-convex mirrors facing the lens 200 may be protrusions 411, and the surfaces of the micro-convex mirrors facing the lens 200 may be joined to form a light-receiving surface 410. In this case, not only can the distortion of the imaging module be effectively reduced, but the presence of the light-receiving surface 410 in the micro-convex mirror array 422 can further avoid the cost of the imaging module being too high due to the light-receiving surface 410 being provided on the light-receiving chip 421. In this manner, the integrity of the light-receiving chip 421 can be ensured, and the light-receiving chip 421 may be a planar light-receiving chip. The light-receiving chip 421 may be a flexible planar light-receiving chip or a rigid planar light-receiving chip, and the embodiment of the present application is not limited thereto.

[0032] Of course, the micro-convex mirror array 422 may be an optical adhesive material, which can maintain the imaging effect of the light-receiving chip 421 and facilitate the molding of the micro-convex mirror array 422. Specifically, the micro-convex mirror array 422 may be a molded product, and during processing, an optical adhesive may be dotted on the surface of the light-receiving chip 421 facing the lens 200, and then the required micro-convex mirror array 422 may be formed by the optical adhesive through mold molding, so that the micro-convex mirror array 422 can be better attached to the light-receiving chip 421.

[0033] In the embodiment disclosed herein, to more effectively reduce image distortion, the height of the protrusions 411 may optionally be gradually increased from the center to the edge of the photodetector module 400, such that the light-receiving surface 410 is formed by joining together a plurality of protrusions 411 distributed in an array. In this case, the light-receiving surface 410 formed by joining together a plurality of protrusions 411 distributed in an array corresponds to a tapered surface. By making the center portion of the light-receiving surface 410 lower than the edge portions of the light-receiving surface 410, the difference in optical path length between the center portion of the light-receiving surface 410 and the edge portions of the light-receiving surface 410 can be further reduced, thereby more effectively reducing image distortion. Furthermore, this structure of the light-receiving surface 410 allows a relatively large portion of the light rays to be refracted into the photodetector module 400 through the lens 200, making it easier to miniaturize the lens 200.

[0034] In the embodiments of the present application, the receiver chip module 400 and the substrate 300 may be electrically connected in various ways. In one preferred embodiment, connection bumps 440 may be provided on the side of the receiver chip module 400 facing the substrate 300. Referring to FIG. 1 , the receiver chip module 400 may be electrically connected to the substrate 300 via the connection bumps 440. In this case, the connection bumps 440 can more stable the electrical connection between the receiver chip module 400 and the substrate 300, and the connection bumps 440 can also raise the receiver chip module 400 above the substrate 300 to prevent the substrate 300 from interfering with the operation of the receiver chip module 400.

[0035] Furthermore, a plurality of spaced apart connection bumps 440 may be provided on the side of the photodetector module 400 facing the substrate 300, and the photodetector module 400 may be electrically connected to the substrate 300 by the plurality of connection bumps 440. In this case, the plurality of connection bumps 440 may better secure the photodetector module 400 to the substrate 300, thereby improving the mounting reliability of the photodetector module 400.

[0036] In another alternative embodiment, the receiver module 400 and the substrate 300 may be electrically connected by a connecting wire 450. Referring to FIG. 2, this method can improve the reliability of the electrical connection between the receiver module 400 and the substrate 300, allowing the substrate 300 to better control the receiver module 400. In this manner, the receiver module 400 may be directly positioned on the surface of the substrate 300 to improve the mounting stability of the receiver module 400. The connecting wire 450 may be made of a conductive material such as a metal, alloy, or non-metal.

[0037] In the embodiments of the present application, when the imaging module is used in an electronic device, the imaging module needs to be electrically connected to a functional device (e.g., a motherboard, a battery, etc.) in the electronic device so that the imaging module can perform operations such as data transmission and charging. In one optional embodiment, the imaging module may further include a flexible circuit board 500, which may be electrically connected to the substrate 300 so that the imaging module can be electrically connected to the functional device in the electronic device through the flexible circuit board 500. The flexible circuit board 500 may be flexibly installed according to the specific spatial layout inside the electronic device, thereby reducing the design difficulty for the designer. At the same time, the flexible circuit board 500 has the advantages of high wiring density, light weight, and thin thickness, which is also advantageous for designing thin electronic devices.

[0038] Generally, the flexible circuit board 500 may be directly welded and connected to a functional device in an electronic device, but this method makes the operation relatively complicated and inconvenient when the flexible circuit board 500 is damaged and needs to be replaced. Based on this, in one alternative embodiment, the imaging module may further include a connector 600, which may be electrically connected to the flexible circuit board 500. The flexible circuit board 500 may be electrically connected to the functional device in the electronic device through the connector 600. The connection of the connector 600 is relatively reliable and can detachably connect the flexible circuit board 500 and the functional device in the electronic device, which simplifies the operation of replacing the flexible circuit board 500 and thereby improves the maintainability of the electronic device.

[0039] In an embodiment of the present application, the imaging module may further include an optical filter 700, which may be installed on the bracket 100 and located between the lens 200 and the receiver module 400. The optical filter 700 may filter stray light and improve the imaging quality of the imaging module. For example, the optical filter 700 may be used to filter infrared light, which may reduce the influence of infrared light on the receiver module 400, thereby preventing infrared flare from being generated in the receiver module 400 and further improving the imaging quality. Of course, the optical filter 700 may filter other stray light, and the embodiment of the present application is not limited thereto.

[0040] In the imaging module disclosed in the embodiments of the present application, the bracket 100 and the substrate 300 may form an installation space 110, the photodetector module 400 may be located in the installation space 110, and the opening of the installation space 110 may face the lens 200. This method can make the structure of the imaging module more compact, and when the imaging module is used in an electronic device, this method can prevent other components in the electronic device from affecting the operation of the photodetector module 400.

[0041] Based on the imaging module disclosed in the embodiments of the present application, the embodiments of the present application further disclose an electronic device including the imaging module described in any one of the above embodiments, specifically, the electronic device may include a case, the imaging module may be installed in the case, and optionally, a light-transmitting area may be opened in the case, and the imaging module may face the light-transmitting area so that the imaging module can perform imaging operations through the light-transmitting area.

[0042] The electronic devices disclosed in the embodiments of the present application may be devices such as smartphones, tablet computers, e-book readers, wearable devices (e.g., smart watches), electronic game consoles, etc., and the embodiments of the present application do not limit the specific types of electronic devices.

[0043] Although the embodiments of the present application have been described above in conjunction with the drawings, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not limiting. Those skilled in the art can create many forms based on the suggestions of the present application without departing from the spirit and scope of protection of the claims, and all of them fall within the scope of protection of the present application. [Explanation of symbols]

[0044] 100-bracket, 110-mounting space, 200-lens, 300-substrate, 400—light-receiving chip module, 410—light-receiving surface, 411—protrusion, 420—chip assembly, 421—light-receiving chip, 422—micro-convex mirror array, 430—light-collecting element, 440—connection bump, 450—connection line, 500-Flexible circuit board, 600-connector, 700-Optical filter.

Claims

1. An imaging module, A bracket (100); a lens (200) mounted on the bracket (100); a substrate (300) connected to the bracket (100); a photodetector chip module (400) mounted on the substrate (300) and electrically connected to the substrate (300), facing the lens (200), and having a light-receiving surface (410) facing the lens (200), the light-receiving surface (410) being concave and joined together by a plurality of protrusions (411) distributed in an array; The light-receiving chip module (400) includes a chip assembly (420), which includes a light-receiving chip (421) and a micro-convex mirror array (422), the light-receiving chip (421) is mounted on the substrate (300) and is electrically connected to the substrate (300), the micro-convex mirror array (422) is mounted on the light-receiving chip (421), the micro-convex mirror array (422) includes a plurality of micro-convex mirrors, the heights of which gradually increase from the center to the periphery of the light-receiving chip (421), the ends of the micro-convex mirrors facing the lens (200) are the protrusions (411), and the surfaces of the micro-convex mirrors facing the lens (200) are joined together to form the light-receiving surface (410); The imaging module, wherein the lens (200) has a stepped shape and the cross-sectional area of ​​the lens (200) gradually decreases along a direction away from the photodetector chip module (400).

2. The imaging module of claim 1, wherein connection bumps (440) are provided on the side of the photodetector chip module (400) facing the substrate (300), and the photodetector chip module (400) is electrically connected to the substrate (300) by the connection bumps (440).

3. 2. The imaging module according to claim 1, wherein the photodetector chip module (400) and the substrate (300) are electrically connected by a connecting wire (450).

4. The imaging module of claim 1 , further comprising a flexible circuit board (500) electrically connected to the substrate (300).

5. The imaging module of claim 4, further comprising a connector (600) electrically connected to the flexible circuit board (500).

6. 2. The imaging module of claim 1, further comprising an optical filter (700) mounted on the bracket (100) and positioned between the lens (200) and the photodetector chip module (400).

7. 2. The imaging module of claim 1, wherein the bracket (100) and the substrate (300) form an installation space (110), the photodetector chip module (400) is positioned in the installation space (110), and an opening of the installation space (110) is provided opposite the lens (200).

8. An electronic device comprising the imaging module according to any one of claims 1 to 7.

Images