Light-emitting display device

Abstract

To reduce the increase in leakage current between adjacent pixels.SOLUTION: A light emitting display device is provided in which the outer contour of the white pixel is wrapped with a fluorine-based protective layer, and a light emitting display device can include a substrate containing display and non-display areas, white and color pixels provided in the display area; and a fluorine-based protective layer encasing the outer contour of the white pixel.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to a light-emitting display device. [Background technology]

[0002] Light-emitting display devices are installed in electronic products such as televisions, monitors, laptops, smartphones, tablet computers, electronic pads, wearable devices, watch phones, portable information devices, navigation systems, or vehicle control display devices, and perform the function of displaying images.

[0003] As the resolution of light-emitting display panels continues to increase, leakage current between adjacent pixels increases, which causes undesirable lighting.

[0004] Furthermore, light emitting elements provided in pixels of a light emitting display panel may be affected by moisture that has entered from the outside. However, as the resolution of light emitting display panels continues to increase, it is becoming increasingly difficult to prevent moisture from penetrating between pixels. Summary of the Invention [Problem to be solved by the invention]

[0005] The problem to be solved by the present specification is to provide a light emitting display device in which the outer periphery of a white pixel is covered with a fluorine-based protective layer. [Means for solving the problem]

[0006] An organic light emitting display device according to an embodiment of the present specification may include a substrate including a display area and a non-display area, a white pixel and a color pixel provided in the display area, and a fluorine-based protective layer surrounding the outer periphery of the white pixel.

[0007] Specific matters according to various examples of the present specification other than the means for solving the above-mentioned problems are included in the following description and drawings.

[0008] According to an embodiment of the present disclosure, leakage current between a pixel having a color filter and a white pixel can be prevented or reduced.

[0009] According to an embodiment of the present disclosure, moisture transfer between pixels having color filters and white pixels can be prevented or reduced.

[0010] Therefore, according to an embodiment of the present specification, the reliability of the light emitting display device can be improved, and thus the quality of the light emitting display device can be improved.

[0011] Furthermore, according to one embodiment of the present specification, it is possible to prevent or reduce moisture transfer between pixels having color filters and white pixels, thereby extending the life of the light-emitting display device and providing a low-power light-emitting display device. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is an exemplary diagram showing a configuration of a light-emitting display device according to the present specification; [Figure 2] 1 is a diagram illustrating an example of a pixel structure applied to a light emitting display device according to the present disclosure; [Figure 3] 1 is an exemplary diagram illustrating a structure of a control driver applied to a light emitting display device according to the present specification; [Figure 4] FIG. 2 is a plan view showing pixels arranged in region A of FIG. [Figure 5] 1. FIG. 4 is yet another plan view showing pixels arranged in region A of FIG. [Figure 6] 5 is an exemplary view showing a cross section taken along line KK' shown in FIG. 4. FIG. [Figure 7] 5 is an exemplary view showing a cross section taken along line LL' shown in FIG. 4. FIG. [Figure 8] 5 is still another exemplary view showing a cross section taken along the line KK' shown in FIG. 4. FIG. [Figure 9A]1A to 1C are exemplary views illustrating a method for manufacturing a light-emitting display panel according to the present disclosure. [Figure 9B] 1A to 1C are exemplary views illustrating a method for manufacturing a light-emitting display panel according to the present disclosure. [Figure 9C] 1A to 1C are exemplary views illustrating a method for manufacturing a light-emitting display panel according to the present disclosure. [Figure 9D] 1A to 1C are exemplary views illustrating a method for manufacturing a light-emitting display panel according to the present disclosure. [Figure 9E] 1A to 1C are exemplary views illustrating a method for manufacturing a light-emitting display panel according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0013] The advantages and features of the present invention, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be configured in various different forms. The embodiments are provided solely to complete the disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art.

[0014] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating the embodiments of this specification are illustrative only and do not limit the present specification to the details shown in the drawings. The same reference numerals refer to the same elements throughout this specification. In addition, if a detailed description of related prior art is deemed to unnecessarily obscure the gist of this specification, the detailed description will be omitted. When terms such as "comprise," "have," and "consist of" are used in this specification, other parts may be added unless "only" is used. When a component is expressed in the singular, it also includes the plural unless otherwise explicitly stated.

[0015] When interpreting elements, the error range is interpreted as being included even if there is no separate explicit description of the error range.

[0016] In the case of a description of a positional relationship, for example, when the positional relationship of two parts is described using "above," "on top," "below," or "beside," one or more other parts may be located between the two parts, unless the words "immediately" or "directly" are used.

[0017] When describing a temporal relationship, for example, when the temporal precedence relationship is described using "after," "following," "next to," or "before," it can also include cases where the relationship is not consecutive, unless the words "immediately" or "directly" are used.

[0018] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a first component referred to below may also be a second component within the technical concept of this specification.

[0019] In describing components in this specification, terms such as first, second, A, B, a, b, etc. may be used. Such terms are used merely to distinguish the component from other components, and do not limit the nature, order, sequence, or number of the components. When a component is described as being "coupled," "coupled," or "connected" to another component, it should be understood that the component can be directly coupled or connected to the other component, but unless otherwise explicitly stated, the component can also be indirectly coupled or connected with another component "intervening" between them.

[0020] The term "at least one" should be understood to include all combinations of one or more of the associated components. For example, the meaning of "at least one of the first, second, and third components" can include not only the first, second, or third component, but also all combinations of two or more of the first, second, and third components.

[0021] The features of each of the several embodiments of this specification can be partially or wholly combined or combined with each other, and various technical interlocking and driving mechanisms are possible, and each embodiment can be implemented independently of each other or can be implemented together in a linked relationship.

[0022] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and examples. The scales of the components shown in the drawings are different from the actual scales for the convenience of explanation, and are not limited to the scales shown in the drawings.

[0023] FIG. 1 is an exemplary diagram showing the configuration of a light-emitting display device according to the present specification, FIG. 2 is an exemplary diagram showing the structure of a pixel applied to a light-emitting display device according to the present specification, and FIG. 3 is an exemplary diagram showing the structure of a control driver applied to a light-emitting display device according to the present specification.

[0024] The light emitting display device according to the present specification may be or may be included in various electronic devices. For example, the electronic device may be a smartphone, a tablet PC, a television, a monitor, etc., and may constitute a smartphone, a tablet PC, a television, a monitor, etc.

[0025] As shown in FIG. 1, the light emitting display device according to the present specification includes a light emitting display panel 100 including a display area (DA) where an image is output and a non-display area (NDA) provided around the display area (DA), a gate driver 200 that supplies gate signals to gate lines (GL1 to GLg) provided in the display area (DA) of the light emitting display panel 100, a data driver 300 that supplies data voltages to data lines (DL1 to DLd) provided in the light emitting display panel 100, a control driver 400 that controls driving of the gate driver 200 and the data driver 300, and a power supply unit 500 that supplies power to the control driver 400, the gate driver 200, the data driver 300, and the light emitting display panel 100.

[0026] First, the light-emitting display panel 100 includes a display area (DA) and a non-display area (NDA). The display area (DA) may include gate lines (GL1 to GLg), data lines (DL1 to DLd), and pixels (P). Therefore, the display area (DA) can output an image. g and d are natural numbers. The non-display area (NDA) may be provided to surround the outer periphery of the display area (DA), or may be provided inside the display area (DA). No image is output to the non-display area (NDA).

[0027] For example, when a camera hole is provided in the display area (DA), a non-display area (NDA) where no image is output may be provided around the camera hole.

[0028] As shown in FIG. 2, a pixel (P) provided in the light-emitting display panel 100 may include a pixel driving circuit (PDC) including a switching transistor (Tsw1), a storage capacitor (Cst), a driving transistor (Tdr) and a sensing transistor (Tsw2), and a light-emitting element (ED).

[0029] A first terminal of the driving transistor Tdr is connected to a first voltage supply line PLA to which a first voltage EVDD is supplied, and a second terminal of the driving transistor Tdr is connected to the light emitting element ED.

[0030] A first terminal of the switching transistor (Tsw1) is connected to the data line (DL), a second terminal of the switching transistor (Tsw1) is connected to the gate of the driving transistor (Tdr), and a gate of the switching transistor (Tsw1) is connected to the gate line (GL).

[0031] A data voltage (Vdata) is supplied to the data line (DL), and a gate signal (GS) is supplied to the gate line (GL).

[0032] A sensing transistor (Tsw2) may be provided to measure the threshold voltage or mobility of the driving transistor (Tdr). A first terminal of the sensing transistor (Tsw2) may be connected to a second terminal of the driving transistor (Tdr) and the light emitting element (ED), a second terminal of the sensing transistor (Tsw2) may be connected to a sensing line (SL) to which a reference voltage (Vref) is supplied, and a gate of the sensing transistor (Tsw2) may be connected to a sensing control line (SCL) to which a sensing control signal (SS) is supplied.

[0033] The sensing line (SL) may be connected to the data driver 300, and may also be connected to the power supply unit 500 via the data driver 300. That is, the reference voltage (Vref) supplied from the power supply unit 500 may be supplied to the pixel (P) via the sensing line (SL), and the sensing signal transmitted from the pixel (P) may be processed by the data driver 300.

[0034] The light emitting element (ED) may include a first electrode receiving a first voltage (EVDD) via a driving transistor (Tdr), a second electrode connected to a second voltage supply line (PLB) receiving a second voltage (EVSS), and a light emitting layer disposed between the first and second electrodes. The first electrode may be an anode, and the second electrode may be a cathode.

[0035] The structure of the pixel (P) applied in this specification is not limited to the structure shown in Fig. 2. Therefore, the structure of the pixel (P) can be changed into various forms.

[0036] The gate driver 200 can be mounted in the non-display area (NDA) after being configured as an integrated circuit. Alternatively, the gate driver 200 can be directly built into the non-display area (NDA) using a gate-in-panel (GIP) method. When using the gate-in-panel method, the transistors constituting the gate driver 200 can be provided in the non-display area (NDA) through the same process as the transistors provided in each pixel (P) of the display area (DA). Alternatively, the gate driver 200 can be provided in the display area (DA) where the light-emitting elements (ED) are provided.

[0037] The gate driver 200 can supply gate pulses to the gate lines (GL1 to GLg).

[0038] When a gate pulse generated by the gate driver 200 is supplied to the gate of a switching transistor Tsw1 provided in a pixel P, the switching transistor Tsw1 can be turned on. When the switching transistor Tsw1 is turned on, the data voltage Vdata supplied via the data line DL can be supplied to the pixel P.

[0039] When the gate-off signal generated by the gate driver 200 is supplied to the switching transistor Tsw1, the switching transistor Tsw1 can be turned off. When the switching transistor Tsw1 is turned off, the data voltage Vdata is no longer supplied to the pixel P.

[0040] The gate signal (GS) supplied to the gate line (GL) includes a gate pulse and a gate-off signal.

[0041] Next, the power supply unit 500 generates various power supplies and supplies the generated power supplies to the control driver 400 , the gate driver 200 , the data driver 300 and the light-emitting display panel 100 .

[0042] Next, the data driver 300 may be connected to the data lines DL1 to DLd and the sensing lines SL. Each of the sensing lines may be commonly connected to unit pixels that can display white among pixels connected to one gate line, or may be connected to each of the pixels that constitute the unit pixel.

[0043] The data driver 300 can output a data voltage (Vdata) using the data control signal (DCS) and image data (Data) transmitted from the control driver 400 .

[0044] Finally, the control driver 400 can realign the input image data (Ri, Gi, Bi) transmitted from the external system using the timing synchronization signal (TSS) transmitted from the external system, and generate control signals (GCS, DCS) to be supplied to the data driver 300 and the gate driver 200.

[0045] To this end, as shown in FIG. 3, the control driver 400 may include a data aligner 430 for realigning input image data (Ri, Gi, Bi) to generate image data (Data) and supplying the image data (Data) to the data driver 300, a control signal generator 420 for generating gate control signals (GCS) and data control signals (DCS) using a timing synchronization signal (TSS), a control unit 410 for receiving the timing synchronization signal (TSS) and input image data (Ri, Gi, Bi) from an external system and transmitting them to the control signal generator 420 and the data aligner 430, and an output unit 440 for supplying the image data (Data) generated by the data aligner 430 and the data control signal (DCS) generated by the control signal generator 420 to the data driver 300 and outputting the gate control signal (GCS) generated by the control signal generator 420 to the gate driver 200.

[0046] The control signal generator 420 can also generate a power control signal to be supplied to the power supply unit 500 .

[0047] The control driver 400 may further include a storage unit 450 for storing various information. The storage unit 450 may be included in the control driver 400 as shown in FIG. 3, or may be provided separately from the control driver 400.

[0048] The external system performs the function of driving the control driver 400 and the electronic device. For example, if the electronic device is a television (TV), the external system can receive various types of audio information, video information, text information, etc. via a communication network and transmit the received video information to the control driver 400. In this case, the video information can be input video data (Ri, Gi, Bi).

[0049] FIG. 4 is a plan view showing pixels arranged in the area A of FIG. 1, and FIG. 5 is another plan view showing pixels arranged in the area A of FIG.

[0050] This specification can be applied to a light-emitting display panel 100 that includes a transmissive area (TA), and can also be applied to a light-emitting display panel 100 that does not include a transmissive area (TA). The transmissive area (TA) is an area that allows light to pass through.

[0051] For convenience of explanation, the light-emitting display panel 100 including the transmissive area (TA) will be described below as an example of the light-emitting display panel according to this specification.

[0052] The display area (DA) may include a transmissive area (TA) (or transparent area) and a non-transmissive area (NTA). The transmissive area (TA) may be an area that transmits most of the light incident from the outside. The non-transmissive area (NTA) may be an area that does not transmit most of the light incident from the outside. The non-transmissive area (NTA) may also refer to an area where pixels (P) are provided.

[0053] The transmissive area (TA) allows an object or background located behind (or behind) the emissive display panel 100 to be seen from the front of the emissive display panel 100 .

[0054] The non-transmitting areas (NTA) are disposed between adjacent transmitting areas (TA), and pixels (P) and signal lines can be disposed in the non-transmitting areas (NTA).

[0055] In particular, the non-transmitting area (NTA) can include an emitting area (EA) from which light is emitted, and a non-emitting area (NEA) from which light is not emitted.

[0056] The light-emitting area (EA) of the non-transmitting area (NTA) can emit light by the light-emitting element (ED), and the non-light-emitting area (NEA) of the non-transmitting area (NTA) can be provided with a pixel driving circuit that configures the pixel (P) and a signal line connected to the pixel (P).

[0057] Additionally, the non-emissive area (NEA) may include a bank that encases the emissive area (EA).

[0058] The signal lines may include first signal lines extending in a first direction (or the Y-axis direction in an XYZ coordinate system) in the non-transmissive area (NTA) and second signal lines extending in a second direction (or the X-axis direction in an XYZ coordinate system) different from the first direction. For example, the first signal lines may include data lines (DL) and sensing lines (SL), and the second signal lines may include gate lines (GL).

[0059] The non-transmitting area (NTA) may have a unit pixel (UP) including four pixels (P). White light may be emitted through the unit pixel (UP).

[0060] The unit pixel (UP) can include a first pixel (P1), a second pixel (P2), a third pixel (P3), and a white pixel (PW). The first pixel (P1) includes a first light-emitting area (EA1) that emits light of a first color, the second pixel (P2) includes a second light-emitting area (EA2) that emits light of a second color, the third pixel (P3) includes a third light-emitting area (EA3) that emits light of a third color, and the white pixel (PW) includes a white light-emitting area (EAW) that emits white light.

[0061] For example, the first light-emitting region (EA1) can emit blue light, the second light-emitting region (EA2) can emit red light, the third light-emitting region (EA3) can emit green light, and the white light-emitting region (EAW) can emit white light.

[0062] That is, the unit pixel (UP) applied in this specification is necessarily provided with a white light emitting area (EAW) that emits white light.

[0063] The transmissive area (TA) may be disposed between adjacent non-transmissive areas (NTA), and the transmissive area (TA) may not include the light-emitting elements and pixel driving circuits (PDC) that make up the pixels (P1, P2, P3, PW).

[0064] That is, the transmissive area (TA) may not have any non-transmissive or opaque elements disposed therein, and thus the transmissive area (TA) may be an area with high light transmittance.

[0065] For example, the transmissive region (TA) may not overlap with the pixel driving circuit that configures the pixel (P1, P2, P3, PW). Also, the transmissive region (TA) may not overlap with the light-emitting element that configures the pixel (P1, P2, P3, PW).

[0066] For example, the transmissive areas (TA) can be arranged alternately with the non-transmissive areas (NTA) along a first direction (or Y-axis direction) and can be arranged alternately with the non-transmissive areas (NTA) along a second direction (or X-axis direction), as shown in Figures 4 and 5.

[0067] As another example, a transmissive area (TA) can be arranged to surround a non-transmissive area (NTA), or a non-transmissive area (NTA) can be arranged to surround a transmissive area (TA).

[0068] Hereinafter, for convenience of explanation, among the four pixels (P1, P2, P3, PW) constituting the unit pixel (UP), the remaining pixels (P1, P2, P3) excluding the white pixel (PW) will be referred to as color pixels. In particular, when there is no need to distinguish color pixels, the reference numerals of the color pixels may be given the same letter P as the pixel.

[0069] That is, the display area (DA) of the light-emitting display panel 100 is provided with unit pixels (UP), and each of the unit pixels (UP) may include one white pixel (PW) and three color pixels (P1, P2, P3).

[0070] As described above, the color pixels (P1, P2, P3) can emit blue light, red light, and green light, but the present specification is not limited thereto. Therefore, the color pixels (P1, P2, P3) can also emit other combinations of color light.

[0071] Each of the color pixels (P1, P2, P3) is provided with a color filter, which determines the color of the light emitted from each of the color pixels (P1, P2, P3).

[0072] Since the white pixels (PW) emit white light, the white pixels (PW) do not have a color filter.

[0073] As shown in FIGS. 4 and 5, the outer periphery of the white pixel (PW) may be provided with a fluorine-based protective layer (FSL) that encases the outer periphery of the white pixel (PW).

[0074] In particular, a fluorine-based protective layer (FSL) may be provided on the top of the bank surrounding the white pixel (PW). As described above, the bank may be provided in the non-emissive area (NEA) surrounding the emissive area (EA).

[0075] In this case, the light-emitting layer provided inside the fluorine-based protective layer (FSL) and the light-emitting layer provided outside the fluorine-based protective layer (FSL) can be separated by the fluorine-based protective layer (FSL).

[0076] Even if the light-emitting layer provided inside the fluorine-based protective layer (FSL) and the light-emitting layer provided outside the fluorine-based protective layer (FSL) are not completely separated by the fluorine-based protective layer (FSL), the length between the light-emitting layer provided inside the fluorine-based protective layer (FSL) and the light-emitting layer provided outside the fluorine-based protective layer (FSL) may be increased by the fluorine-based protective layer (FSL).

[0077] This can block or lengthen the moisture permeation path through the light-emitting layer.

[0078] Therefore, it is possible to prevent moisture from penetrating from the color pixels (P1, P2, P3) to the white pixels (PW), and it is also possible to prevent moisture from penetrating from the white pixels (PW) to the color pixels (P1, P2, P3).

[0079] The fluorine-based protective layer (FSL) may include a fluorine-based material used in the manufacturing process of the light-emitting display panel 100. For example, the fluorine-based material may be a material that can function as an etching stopper for the organic layer or a pattern mask in the process of patterning the organic layer of the light-emitting display panel 100.

[0080] More specifically, the fluorine-based material may be a fluoropolymer, which is a polymer in which carbon-carbon bonds are continuously arranged in a chain structure and the functional groups of the fluoropolymer contain a large amount of fluorine (F).

[0081] Fluorine-based materials contain a large amount of fluorine (F) and therefore possess orthogonality. Orthogonality can refer to the property of two things existing independently of each other. As a result, fluorine-based materials can possess both hydrophobicity, which means they have a low affinity for water, and oleophobicity, which means they have a low affinity for oil. This orthogonality allows fluorine-based materials to separate from or repel water. The application of fluorine-based materials can be confirmed by TOF-SIMS (Time of Flight Secondary Ion Mass Spectrometer) analysis.

[0082] Thus, as mentioned above, a fluorine-based protective layer (FSL) can prevent or reduce moisture penetration and moisture transfer between pixels.

[0083] In addition, the light-emitting layer provided inside the fluorine-based protective layer (FSL) and the light-emitting layer provided outside the fluorine-based protective layer (FSL) may be completely or partially separated by the fluorine-based protective layer (FSL), and the length between the light-emitting layer provided inside the fluorine-based protective layer (FSL) and the light-emitting layer provided outside the fluorine-based protective layer (FSL) may be increased by the fluorine-based protective layer (FSL).

[0084] This can reduce leakage current through the light-emitting layer.

[0085] For example, the fluorine-based protective layer (FSL) can have an inverse tapered structure, which allows the light-emitting layer formed of an organic material to be cut off by the fluorine-based protective layer (FSL), thereby reducing or eliminating leakage current from the color pixel to the white pixel (PW) and from the white pixel (PW) to the color pixel.

[0086] In addition, since the fluorine-based protective layer (FSL) has a higher resistance component than the light-emitting layer, if the light-emitting layer is not cut, leakage current may flow through the light-emitting layer rather than the fluorine-based protective layer (FSL). However, since the length of the light-emitting layer provided between the color pixel and the white pixel (PW) is increased by the fluorine-based protective layer (FSL), leakage current between the color pixel and the white pixel (PW) can be reduced.

[0087] In this case, the cathode provided on the upper end of the light-emitting layer can be provided on the light-emitting display panel using a sputtering process with high step coverage, so that the fluorine-based protective layer (FSL) having an inverse tapered shape can be formed continuously.

[0088] Therefore, all pixels can be supplied with the same voltage via the cathode.

[0089] The white pixel (PW) may be provided in a form as shown in Fig. 4 or in a form as shown in Fig. 5. In particular, at least one of the outer peripheries of the white pixel (PW) may be provided with a transmissive area (TA) through which light passes.

[0090] For example, as shown in Figure 4, white pixels (PW) are provided along the data lines (DL) and may be provided only on one side of the data lines (DL). Specifically, a white pixel (PW) provided along an n-th data line (DLn) may be provided only on the right side of the n-th data line (DLn), where n is a natural number.

[0091] In this case, any one of the color pixels may be provided between the white pixels (PW), and a transmissive area (TA) may be provided to the right of the white pixels (PW).

[0092] Specifically, unit pixels (UP) are provided along an nth data line (DLn) provided on the substrate 101, and each unit pixel (UP) includes three color pixels (P1, P2, P3) and a white pixel (PW). Of the three color pixels (P1, P2, P3), the first color pixel (P1) and the second color pixel (P2) may be arranged on the boundary of the nth data line (DLn), and the third color pixel (P3) and the white pixel (PW) may be arranged on the boundary of the nth data line (DLn). For example, the third color pixel (P3) may be provided on the left side of the nth data line (DLn), and the white pixel (PW) may be provided on the right side of the nth data line (DLn).

[0093] Of the three color pixels (P1, P2, P3) and the white pixel (PW) included in the unit pixel (UP), only the outer periphery of the white pixel (PW) may be provided with a fluorine-based protective layer (FSL).

[0094] In this case, a light-transmitting transmissive area (TA) (e.g., a first transmissive area) may be provided on the left side of the first pixel (P1) and the third pixel (P3) provided on the left side of the nth data line (DLn), and a light-transmitting transmissive area (TA) (e.g., a second transmissive area) may be provided on the right side of the second pixel (P2) and the white pixel (PW) provided on the right side of the nth data line (DLn).

[0095] As described above, moisture that flows in through the transmissive area (TA) adjacent to the white pixel (PW) is prevented from being transmitted to the color pixel adjacent to the white pixel (PW) by the fluorine-based protective layer (FSL) surrounding the white pixel (PW), and moisture that flows into the color pixel is also prevented from being transmitted to the white pixel (PW) by the fluorine-based protective layer (FSL) surrounding the white pixel (PW).

[0096] Furthermore, a fluorine-based passivation layer (FSL) can prevent or reduce leakage current between a color pixel adjacent to a white pixel (PW) and the white pixel (PW).

[0097] As another example, the white pixels (PW) may be alternately provided on the left and right sides of the data lines (DL) as shown in Fig. 5. In particular, at least one of the outer edges of the white pixels (PW) may have a transmissive area (TA) through which light passes.

[0098] Specifically, unit pixels (UP) are provided along the nth data line (DLn), and the white pixel (PW) provided in the first unit pixel (UP1) of the unit pixels (UP) is provided on the right side of the nth data line (DLn), the white pixel (PW) provided in the second unit pixel (UP2) of the unit pixels (UP) is provided on the left side of the nth data line (DLn), and the white pixel (PW) provided in the third unit pixel (UP3) of the unit pixels (UP) is provided on the right side of the nth data line (DLn).

[0099] In this case, the white pixel (PW) may be adjacent to the transmissive region (TA) provided on the left and right sides of the unit pixel alternately. For example, the white pixel (PW) provided in the first unit pixel (UP1) may be adjacent to the transmissive region (TA) provided on the right side of the first unit pixel (UP1), the white pixel (PW) provided in the second unit pixel (UP2) may be adjacent to the transmissive region (TA) provided on the left side of the second unit pixel (UP2), and the white pixel (PW) provided in the third unit pixel (UP3) may be adjacent to the transmissive region (TA) provided on the right side of the third unit pixel (UP3).

[0100] Therefore, moisture that flows into the white pixel (PW) from the transmissive area (TA) on the left side of the unit pixel (UP) is not transmitted to the color pixel adjacent to the white pixel (PW) due to the fluorine-based protective layer (FSL) surrounding the white pixel (PW), and moisture that flows into the color pixel from the transmissive area (TA) on the right side of the unit pixel (UP) is also not transmitted to the white pixel (PW) due to the fluorine-based protective layer (FSL) surrounding the white pixel (PW).

[0101] In addition, moisture that flows into the white pixel (PW) from the transmissive area (TA) on the right side of the unit pixel (UP) is not transmitted to the color pixel adjacent to the white pixel (PW) due to the fluorine-based protective layer (FSL) surrounding the white pixel (PW), and moisture that flows into the color pixel from the transmissive area (TA) on the left side of the unit pixel (UP) is also not transmitted to the white pixel (PW) due to the fluorine-based protective layer (FSL) surrounding the white pixel (PW).

[0102] Furthermore, a fluorine-based passivation layer (FSL) can prevent or reduce leakage current between a color pixel adjacent to a white pixel (PW) and the white pixel (PW).

[0103] Therefore, according to the light emitting display device of the present specification, moisture transfer between the white pixel (PW) and the color pixels (P1, P2, P3) can be prevented or reduced, and leakage current between the color pixels (P1, P2, P3) can be reduced or prevented, thereby improving the quality of the light emitting display device.

[0104] Fig. 6 is an exemplary view showing a cross section taken along line K-K' in Fig. 4, and Fig. 7 is an exemplary view showing a cross section taken along line L-L' in Fig. 4. Fig. 8 is another exemplary view showing a cross section taken along line K-K' in Fig. 4. In particular, Fig. 6 is an exemplary view showing a cross section of adjacent color pixels (e.g., third pixel P3) and a white pixel PW, Fig. 7 is an exemplary view showing a cross section of two adjacent color pixels (e.g., first color pixel P1 and second color pixel P2), and Fig. 8 is an exemplary view showing a cross section in which a foreign substance is contained in the white pixel PW.

[0105] As described above, the light emitting display device according to the present specification may include a substrate 101 including a display area (DA) and a non-display area (NDA), a white pixel (PW) provided in the display area (DA), and a fluorine-based protective layer (FSL) that surrounds the outer periphery of the color pixel (P) and the white pixel (PW).

[0106] 6 and 7, a pixel driving circuit layer 102 is provided on a substrate 101, the pixel driving circuit layer 102 is covered with a planar layer 103, an anode (AN) is provided on the upper end of the planar layer 103, the outer periphery of the anode (AN) is covered with a bank (BK), the anode (AN) and the bank (BK) are covered with an emitting layer (EL), the emitting layer is covered with a cathode (CA), and the cathode (CA) is covered with an encapsulation layer 104. Color filters (CF) are provided on the upper end of the encapsulation layer 104 in areas corresponding to the color pixels (P1, P2, P3), and a black matrix (BM) is provided between the color filters (CF). The color filters (CF) and the black matrix (BM) may be provided on an encapsulation substrate 105.

[0107] First, the substrate 101 can be a transparent glass substrate or a transparent plastic substrate.

[0108] A pixel driving circuit layer 102 may be provided on the substrate 101. The pixel driving circuit layer 102 includes at least two insulating layers and at least two metal layers, and may include the transistors (Tsw1, Tsw2, Tdr) described with reference to FIG. 2. FIGS. 6 and 7 show the driving transistor (Tdr) among the transistors (Tsw1, Tsw2, Tdr) shown in FIG. 2. The light-emitting display panel 100 shown in FIGS. 6 and 7 includes a color filter (CF) on the upper end of the cathode (CA). Therefore, light generated in the light-emitting element (ED) can be emitted to the outside through the cathode (CA) and the color filter (CF). Therefore, the light-emitting area (EA) may include at least one of the transistors (Tsw1, Tsw2, Tdr) included in the pixel driving circuit (PDC), and may include a driving transistor (Tdr) as shown in FIGS. 6 and 7. Therefore, in the following description, when there is no need to particularly refer to the drive transistor (Tdr), the drive transistor (Tdr) shown in FIGS. 6 and 7 can be referred to as a transistor.

[0109] The pixel driving circuit layer 102 may include a light-shielding layer (LS), a buffer layer 102a covering the light-shielding layer (LS), an active layer (ACT) on the upper end of the buffer layer 102a, a gate insulating layer (GI) on the upper end of the active layer (ACT), a gate (G) on the upper end of the gate insulating layer (GI), a protective layer 102b covering the gate (G), and a source / drain (SD) on the protective layer 102b. The pixel driving circuit layer 102 may further include another protective layer covering the source / drain (SD). The other protective layer may also be included in the planar layer 103.

[0110] The light-shielding layer (LS) may be disposed in the non-transmitting area (NTA). The light-shielding layer (LS) may be disposed so as to overlap with the transistors included in the pixel driving circuit layer 102, and in particular, may be disposed so as to overlap with the driving transistors (Tdr).

[0111] For example, the light-shielding layer (LS) may be disposed to overlap the active (ACT) of the driving transistor (Tdr) and serve to block external light from entering the active (ACT) from the outside. The light-shielding layer (LS) may be made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, and may be formed as a single layer or multiple layers.

[0112] A light-shielding layer (LS) and signal lines may be provided on the substrate 101. The signal lines may be, for example, data lines (DL).

[0113] The buffer layer 102a, the gate insulating layer (GI) and the protective layer 102b may be insulating layers, and the light-shielding layer (LS), the gate (G) and the source / drain (SD) may be metal layers.

[0114] Each of the transistors (Tsw1, Tsw2, Tdr) included in the pixel driving circuit layer 102 can be formed by an active layer (ACT), a gate insulating layer (GI), and a gate (G).

[0115] The buffer layer 102a may be formed as a single layer or as at least two inorganic layers. For example, the buffer layer 102a may be formed as a single layer using any one of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiOxNy). The buffer layer 102a may also be formed as a multilayer using at least two materials selected from silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiOxNy).

[0116] The buffer layer 102a can be formed over the entire upper surface of the substrate 101 to block ions and impurities diffusing from the substrate 101 and to block moisture from penetrating into the thin film transistors (TFTs) and light-emitting elements through the substrate 101.

[0117] An active layer (ACT) may be disposed on the buffer layer 102a. The active layer (ACT) may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. The active layer (ACT) may include a channel region overlapping with the gate (G) and source / drain regions provided on both ends of the channel region.

[0118] A gate insulating layer (GI) may be provided on the active layer (ACT). The gate insulating layer (GI) may function to insulate the active layer (ACT) from the gate (G). The gate insulating layer (GI) may be formed of an inorganic insulating material. For example, the gate insulating layer (GI) may be formed as a single layer using any one of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiOxNy). The gate insulating layer (GI) may also be formed as a multi-layer using at least two materials selected from silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiOxNy).

[0119] As shown in FIG. 6, the gate insulating layer (GI) may be provided only in the area corresponding to the gate (G) on the top of the active (ACT), or may be provided to cover the entire active (ACT).

[0120] Therefore, the gate insulating layer (GI) can be provided only in the non-transmitting area (NTA). Also, even if the gate insulating layer (GI) is provided in the transmitting area (TA), the gate insulating layer (GI) can be disposed only in a part of the transmitting area (TA) in order to improve the light transmittance of the transmitting area (TA).

[0121] A gate (G) can be provided on the gate insulating layer (GI). The gate (G) can be provided so as to overlap with the active (ACT) with the gate insulating layer (GI) sandwiched therebetween.

[0122] The gate (G) can be formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu), or an alloy thereof, and can be formed in a single layer or multiple layers.

[0123] A protective layer 102b may be provided on the gate (G) and the buffer layer 102a. The protective layer 102b may be provided to cover the gate (G). The protective layer 102b may function to protect the transistor. The protective layer 102b may be formed as a single layer or multiple layers using at least one of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiOxNy).

[0124] The protective layer 102b can be disposed in the non-transmitting area (NTA). Also, even if the protective layer 102b is provided in the transmitting area (TA), the protective layer 102b can be provided only in a part of the transmitting area (TA) in order to improve the light transmittance of the transmitting area (TA).

[0125] A source / drain (SD) may be disposed on the protective layer 102b, and the source / drain (SD) may be connected to a first electrode or a second electrode of a transistor through a transistor contact hole formed in the protective layer 102b.

[0126] The first electrode or the second electrode of the transistor may be a source / drain region provided on either side of an active channel region.

[0127] For example, any one of the source / drains (SD) provided on the protective layer 102b can be connected to a first electrode of a transistor, and another of the source / drains (SD) provided on the first protective layer 102b can be connected to a second electrode of the transistor.

[0128] The source / drain (SD) may be formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, and may be formed as a single layer or multiple layers.

[0129] Next, a planarization layer 103 may be provided on the upper end of the pixel driving circuit layer 102. The planarization layer 103 may cover and protect the transistors, and may also planarize the upper end of the pixel driving circuit layer 102.

[0130] The planarization layer 103 can be formed using at least one of an organic material and an inorganic material, and can be formed as a single layer or multiple layers.

[0131] For example, the planarization layer 103 may be formed as a single layer or multiple layers using at least one of a silicon oxide film (SiOx), a silicon nitride film (SiNx), and a silicon oxynitride film (SiOxNy).

[0132] A step may be formed at the boundary between the non-transmitting area (NTA) and the transmitting area (TA) of the planar layer 103. In this case, as shown in Figures 6 and 7, the height (A) of the planar layer 103 provided in the transmitting area (TA) may be lower than the height (B) of the planar layer 103 provided in the non-transmitting area (NTA). As the height of the planar layer 103 decreases, the light transmittance in the transmitting area (TA) can be improved.

[0133] The step in the flat layer 103 at the boundary between the transmissive area (TA) and the non-transmissive area (NTA) can be formed by etching the flat layer 103 provided in the transmissive area (TA), or it can be formed because the buffer layer 102a and the gate insulating layer (GI) are not provided at the lower end of the flat layer 103 in the transmissive area (TA).

[0134] An anode (AN) can then be provided on top of the planar layer 103. The anode (AN) can be disposed in the non-transparent area (NTA).

[0135] The anode (AN) may be connected to the first or second electrode of the driving transistor (Tdr) through a transistor contact hole that penetrates the planar layer 103 .

[0136] The anode (AN) can be formed of a metal, a metal alloy, or a combination of a metal and an oxide. For example, the anode (AN) can be formed of a multilayer structure including a transparent electrode layer made of a transparent conductive material and a reflective electrode layer made of an opaque conductive material with high reflective efficiency.

[0137] The transparent electrode layer of the anode (AN) can be made of a material with a relatively high work function, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The reflective electrode layer of the anode (AN) can be made of any one of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), tungsten (W), or an alloy of these.

[0138] Specifically, the anode (AN) may be formed in a structure in which a transparent electrode layer, a reflective electrode layer, and a transparent electrode layer are sequentially stacked, or in a structure in which a transparent electrode layer and a reflective electrode layer are sequentially stacked, or may be formed in various other combinations.

[0139] Next, a bank (BK) may be provided around the outer periphery of the anode (AN). In particular, the bank (BK) may be provided in the non-transmitting area (NTA).

[0140] For example, the bank (BK) may be made of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiOxNy), or may be made of an organic material such as polyimide, acrylate, or benzocyclobutene series resin.

[0141] The bank (BK) covers the edge of the anode (AN). The area of ​​the anode (AN) that is not covered by the bank (BK) (hereinafter simply referred to as the opening) can emit light. Therefore, the opening of the anode (AN) exposed by the bank (BK) can become the light-emitting area (EA), and the part where the bank (BK) is formed can become the non-light-emitting area (NEA).

[0142] In addition, the color pixels (P1, P2, P3) and the white pixels (PW) can be separated by the banks (BK), and the transmissive area (TA) and the non-transmissive area (NTA) can be distinguished by the banks (BK).

[0143] In this case, the bank (BK) adjacent to the transmissive area (TA) may include an inclined surface corresponding to the inclined surface of the flat layer 103, as shown in FIGS.

[0144] For example, the inclined surface of the bank (BK) may have the same or similar inclination angle as the inclined surface of the flat layer 103, in which case the inclined surface of the bank (BK) and the inclined surface of the flat layer 103 may be continuously connected. Alternatively, the inclined surface of the bank (BK) may have a lower inclination angle than the inclined surface of the flat layer 103, in which case the inclined surface of the bank (BK) and the inclined surface of the flat layer 103 may be continuously connected. Alternatively, the inclined surface of the bank (BK) may be offset from the inclined surface of the flat layer 103, in which case a staircase-like structure may be formed between the bank (BK) and the flat layer 103.

[0145] Next, a fluorine-based protective layer (FSL) may be provided on the top of the bank (BK) surrounding the outer periphery of the white pixel (PW) among the banks (BK).

[0146] For example, as shown in Figures 4 to 6, a fluorine-based protective layer (FSL) may be provided on the top of the bank (BK) surrounding the white pixel (PW), so that the opening of the white pixel can be surrounded by the fluorine-based protective layer (FSL).

[0147] However, as shown in FIGS. 4 to 7, the fluorine-based protective layer (FSL) is not provided on the top of the bank (BK) surrounding the color pixels (P1, P2, P3).

[0148] In this case, the bank (BK) adjacent to the white pixel (PW) among the banks (BK) surrounding the color pixels (P1, P2, P3) may be provided with a fluorine-based protective layer (FSL). However, the fluorine-based protective layer (FSL) provided on the bank (BK) adjacent to the white pixel (PW) among the banks (BK) surrounding the color pixels (P1, P2, P3) surrounds the outer periphery of each of the color pixels (P1, P2, P3).

[0149] For example, as shown in Figures 4 and 6, a fluorine-based protective layer (FSL) may be provided on the top of the bank (BK) provided between the third color pixel (P3) and the white pixel (PW). However, the fluorine-based protective layer (FSL) provided on the top of the bank (BK) between the third color pixel (P3) and the white pixel (PW) encloses the entire four outer edges of the white pixel (PW) and only encloses one of the four edges of the third color pixel (P3).

[0150] The fluorine-based protective layer (FSL) can be formed with an inverted tapered structure, where the width of the bottom edge is smaller than the width of the top edge. Due to the inverted tapered structure of the fluorine-based protective layer (FSL), an organic light-emitting layer (EL) cannot be formed continuously on the fluorine-based protective layer (FSL).

[0151] The fluorine-based protective layer (FSL) can be formed of one of various materials used in the manufacturing process of the light-emitting display panel 100.

[0152] For example, a fluorine-based protective layer (FSL) can be formed from a fluoropolymer, which is a polymer in which carbon-carbon bonds are arranged in a continuous chain structure and the functional groups of the fluoropolymer contain a large amount of fluorine (F).

[0153] As described above, the fluorine-based protective layer (FSL) contains a large amount of fluorine (F) and therefore has orthogonality. Orthogonality can be understood as the property of two things existing independently of each other. This allows the fluorine-based protective layer (FSL) to have both hydrophobic properties (having a low affinity for water) and oleophobic properties (having a low affinity for oil). This orthogonality allows the fluorine-based protective layer (FSL) to separate from or repel moisture.

[0154] Therefore, as described above, the fluorine-based protective layer (FSL) can prevent moisture penetration and moisture transfer between the white pixel (PW) and the color pixel.

[0155] Next, an emitting layer (EL) is provided on the top of the anode (AN) and the bank (BK).

[0156] Therefore, the light-emitting layer (EL) can be provided in the non-transmissive area (NTA). However, the light-emitting layer (EL) can also be provided in the transmissive area (TA). Figures 6 and 7 show a light-emitting display panel 100 having a light-emitting layer (EL) only in the non-transmissive area (NTA).

[0157] As described above, the fluorine-based protective layer (FSL) may be formed with an inverted tapered structure in which the width of the bottom end is smaller than the width of the top end, i.e., the width of the top end of the fluorine-based protective layer (FSL) may be larger than the width of the bottom end of the fluorine-based protective layer (FSL).

[0158] This makes it impossible to form an organic light-emitting layer (EL) continuously with a fluorine-based protective layer (FSL).

[0159] In particular, an EL element surrounded by a fluorine-based protective layer (FSL) and an EL element provided outside the fluorine-based protective layer (FSL) may be separated by the fluorine-based protective layer (FSL).

[0160] The EL layer (EL) surrounded by the fluorine-based protective layer (FSL) may refer to the EL layer covering the anode (AN) provided in the white pixel (PW). The EL layer (EL) provided outside the fluorine-based protective layer (FSL) may refer to the EL layer (EL) covering the anode (AN) provided in the color pixels (P1, P2, P3).

[0161] More specifically, the light-emitting layer (EL) covering the anode (AN) of the white pixel (PW) and the light-emitting layer (EL) covering the anode (AN) of the color pixels (P1, P2, P3) may be separated by a fluorine-based protective layer (FSL).

[0162] Hereinafter, for the convenience of explanation, the EL layer enclosed by the fluorine-based protective layer (FSL) will be referred to as the white EL layer (ELW), and the EL layer provided outside the fluorine-based protective layer (FSL) will be referred to as the color EL layer (ELC).

[0163] Since the white light-emitting layer (ELW) and the color light-emitting layer (ELC) are separated by a fluorine-based protective layer (FSL), moisture that has entered the white light-emitting layer (ELW) cannot be transferred to the color light-emitting layer (ELC), and moisture that has entered the color light-emitting layer (ELC) cannot be transferred to the white light-emitting layer (ELW).

[0164] Therefore, it is possible to prevent deterioration in quality and shortening of life of the light emitting device (ED) due to moisture penetration.

[0165] Furthermore, even if a connection occurs between the white light-emitting layer (ELW) and the color light-emitting layer (ELC), moisture cannot penetrate the fluorine-based protective layer (FSL) made of a fluorine-based material, so moisture is transmitted through the white light-emitting layer (ELW) and the color light-emitting layer (ELC). However, the fluorine-based protective layer (FSL) increases the distance between the white light-emitting layer (ELW) and the color light-emitting layer (ELC), which can lengthen the path for moisture penetration. Therefore, moisture is less likely to be transmitted through the white light-emitting layer (ELW) and the color light-emitting layer (ELC), and the period during which moisture is transmitted through the white light-emitting layer (ELW) and the color light-emitting layer (ELC) can also be extended. This prevents degradation of the quality and shortened lifespan of the light-emitting element (ED) due to moisture penetration.

[0166] In addition, the white light-emitting layer (ELW) and the color light-emitting layer (ELC) are separated by a fluorine-based protective layer (FSL), which prevents leakage current between the white pixel (PW) and the color pixels (P1, P2, P3).

[0167] For example, leakage current between pixels is transmitted through the light-emitting layer. However, as mentioned above, because the white light-emitting layer (ELW) and the color light-emitting layer (ELC) are separated by the fluorine-based protective layer (FSL), leakage current generated in the white pixel (PW) is difficult to transmit to the color pixels (P1, P2, P3), and leakage current generated in the color pixels (P1, P2, P3) is also difficult to transmit to the white pixel (PW).

[0168] This makes it possible to prevent degradation of image quality due to leakage current.

[0169] Next, a cathode (CA) is provided on top of the light-emitting layer (EL), and the cathode (CA) is not separated by a fluorine-based protective layer (FSL).

[0170] The cathode (CA) may be provided only in the non-transmissive area (NTA), or may be provided in the entire transmissive area (TA) or only in a part of the transmissive area (TA). Figures 6 and 7 show a light-emitting display panel 100 in which the cathode (CA) is provided only in the non-transmissive area (NTA).

[0171] As described above, the cathode (CA) can be provided on the light-emitting display panel by a sputtering process with high step coverage, and can be continuously formed along the inversely tapered fluorine-based protective layer (FSL).

[0172] Therefore, the same voltage can be supplied to all pixels (P) via the cathode (CA).

[0173] Next, a sealing layer 104 can be provided on the entire surface of the substrate 101. The sealing layer 104 can be provided on both the transmissive area (TA) and the non-transmissive area (NTA).

[0174] The encapsulation layer 104 may include, for example, lithium fluoride (LiF), or may include inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiOxNy). The encapsulation layer 104 may also be composed of multiple layers including organic and inorganic materials.

[0175] The encapsulation layer 104 may be an adhesive material for bonding the substrate 101 to an encapsulation substrate 105 having a color filter (CF) and a black matrix (BM).

[0176] Next, color filters (CF) may be provided on the upper end of the encapsulation layer 104 in areas corresponding to the color pixels (P1, P2, P3). That is, color filters (CF) may be provided on the upper ends of the color pixels (P1, P2, P3). In particular, the color filters (CF) may be provided to correspond to the anodes (AN) provided in the color pixels (P1, P2, P3).

[0177] For example, the first pixel (P1) may be provided with a blue color filter (CF), the second pixel (P2) may be provided with a red color filter (CF), and the third pixel (P3) may be provided with a green color filter (CF), so that the first pixel (P1) can output blue light, the second pixel (P2) can output red light, and the third pixel (P3) can output green light.

[0178] However, since the white pixel (PW) itself outputs white light, a color filter (CF) is not provided in the region corresponding to the white pixel (PW) on the upper end of the encapsulation layer 104. In other words, a color filter is not provided on the upper end of the white pixel (PW).

[0179] Next, a black matrix (BM) may be provided between the color filters (CF). The color filters (CF) can be separated by the black matrix (BM). The black matrix (BM) may be provided to face the bank (BK) surrounding the pixel (P).

[0180] A black matrix (BM) may also be provided on top of the fluorine-based protective layer (FSL) provided on the bank (BK) surrounding the white pixel (PW), so that the black matrix (BM) may be provided to surround the white pixel.

[0181] Finally, an encapsulation substrate 105 may be provided on top of the black matrix (BM) and color filter (CF).

[0182] For example, the encapsulation substrate 105 can be attached to the top of the black matrix (BM) and the color filter (CF).

[0183] However, the color filter (CF) and the black matrix (BM) may be provided on the encapsulation substrate 105, and the encapsulation substrate 105 having the color filter (CF) and the black matrix (BM) may be bonded to the substrate 101 having the pixel (P) via the encapsulation layer 104.

[0184] Alternatively, the encapsulation substrate 105 having the color filter (CF) and black matrix (BM) can be bonded to the substrate 101 having the pixel (P) via an adhesive material applied to the top of the encapsulation layer 104.

[0185] In this case, the sealing substrate 105 can be a transparent glass substrate or a transparent plastic substrate.

[0186] Therefore, an encapsulation layer 104 may be provided between the anode (AN) provided in the color pixel (P1, P2, P3) and the color filter (CF), and an encapsulation layer 104 may be provided between the anode (AN) provided in the white pixel (PW) and the encapsulation substrate 105.

[0187] As mentioned above, since the fluorine-based protective layer (FSL) can be formed with an inverse tapered structure, the light-emitting layer (EL) made of organic material cannot be formed continuously on the fluorine-based protective layer (FSL). In addition, the fluorine-based protective layer (FSL) has a higher resistance characteristic than the light-emitting layer (EL).

[0188] Therefore, it is possible to prevent the transmission of moisture through the light emitting layer (EL), and also to prevent leakage current through the light emitting layer (EL).

[0189] In addition, even if the EL layer is continuously formed on top of the fluorine-based protective layer (FSL), moisture and leakage current cannot be transmitted through the fluorine-based protective layer (FSL). In this case, the fluorine-based protective layer (FSL) lengthens the path of the EL layer, which may slow down the transmission speed of moisture and leakage current.

[0190] This makes it possible to prevent or reduce degradation in the performance of the pixel (P).

[0191] Also, as shown in FIG. 8, a black matrix (BM) is provided on the top of the bank (BK), and in particular, a black matrix (BM) may also be provided on the top of the bank (BK) surrounding the white pixel (PW).

[0192] In this case, a fluorine-based protective layer (FSL) may be provided on the top of the bank (BK) surrounding the white pixel (PW), and a black matrix (BM) may be provided on the top of the fluorine-based protective layer (FSL).

[0193] Therefore, as shown in Figure 8, the distance (D) between the fluorine-based protective layer (FSL) and the black matrix (BM) is smaller than the distance (C) between the bank (BK) surrounding the color pixels (P1, P2, P3) and the black matrix (BM).

[0194] Therefore, moisture (W) that has entered the encapsulation layer 104 in the transmissive area (TA) is unlikely to be transmitted into the white pixels (PW) through the gap (D) between the fluorine-based protective layer (FSL) and the black matrix (BM). In addition, because the fluorine-based protective layer (FSL) and the black matrix (BM) are provided between the color pixels (P1, P2, P3) and the white pixels (PW), even if moisture enters the encapsulation layer 104 inside the white pixels (PW), it is unlikely that the moisture that has entered the encapsulation layer 104 inside the white pixels (PW) will be transmitted to the color pixels (P1, P2, P3) through the narrow gap (D) between the fluorine-based protective layer (FSL) and the black matrix (BM).

[0195] In addition, since a fluorine-based protective layer (FSL) and a black matrix (BM) are provided between the color pixels (P1, P2, P3) and the white pixels (PW), it is difficult for moisture that has entered the sealing layer 104 inside the color pixels (P1, P2, P3) to be transmitted to the white pixels (PW) through the narrow gap (D) between the fluorine-based protective layer (FSL) and the black matrix (BM).

[0196] Therefore, the problem of the light emitting element (ED) provided in the pixel (P) being damaged by moisture can be eliminated or prevented.

[0197] As described above, the white pixel (PW) does not have a color filter (CF), but the color pixels (P1, P2, P3) have color filters (CF). Therefore, the color filters (CF) are provided on the upper ends of the cathodes (CA) provided in the color pixels (P1, P2, P3), and the encapsulation substrate 105 is provided on the upper ends of the cathodes (CA) provided in the white pixel (PW).

[0198] In this case, the distance between the upper end of the cathode (CA) provided in the white pixel (PW) and the encapsulation substrate 105 is larger than the distance between the upper end of the cathode (CA) provided in the color pixels (P1, P2, P3) and the color filter (CF).

[0199] Therefore, during the manufacturing process of the light-emitting display panel 100, even if a foreign object (M) is placed between the cathode (CA) of the white pixel (PW) and the encapsulation substrate 105 as shown in FIG. 8, the probability that the foreign object (M) will be pressed down by the encapsulation substrate 105 can be reduced.

[0200] If the foreign matter (M) is pressed down by the sealing substrate 105, the foreign matter (M) is more likely to cause contact between the cathode (CA) and the anode (AN), which increases the possibility that the white pixel (PW) having the foreign matter (M) becomes a defective pixel.

[0201] In particular, if a white pixel (PW) becomes a defective pixel, the brightness may decrease significantly, and therefore the unit pixel (UP) including the white pixel (PW) may not be able to operate normally, which may reduce the yield of the light-emitting display panel.

[0202] However, in the light-emitting display panel 100 according to the present specification, the distance between the upper end of the cathode (CA) in the white pixel (PW) and the encapsulation substrate 105 is larger than the distance between the upper end of the cathode (CA) in the color pixels (P1, P2, P3) and the color filter (CF), so even if a foreign substance (M) is placed between the cathode (CA) in the white pixel (PW) and the encapsulation substrate 105, the probability that the foreign substance will cause the white pixel (PW) to become a defective pixel is low. Therefore, the yield and quality of the light-emitting display panel 100 can be improved.

[0203] In the light-emitting display panel 100 according to the present specification, as described above, when the unit pixel (UP) includes three color pixels (P1, P2, P3) and a white pixel (PW), a fluorine-based protective layer (FSL) is provided only on the upper end of the bank (BK) surrounding the white pixel (PW).

[0204] The reason why the fluorine-based protective layer (FSL) is provided only on the top of the bank (BK) surrounding the white pixel (PW) is as follows.

[0205] For example, since the white pixel (PW) has a large effect on the brightness control of the unit pixel (UP), the size of the white pixel (PW) can be formed larger than the size of each of the color pixels (P1, P2, P3). Also, the color pixels (P1, P2, P3) need to be provided with a color filter (CF), but the white pixel (PW) does not need to be provided with a color filter (CF).

[0206] Therefore, the height and thickness of the fluorine-based protective layer (FSL) provided on the bank (BK) surrounding the white pixel (PW) can be freely selected regardless of the resolution of the light-emitting display panel 100. As a result, the fluorine-based protective layer (FSL) having various heights and thicknesses can be provided on the upper end of the bank (BK) surrounding the white pixel (PW).

[0207] 9A to 9E are exemplary views showing a method for manufacturing a light-emitting display panel according to the present specification. In the following description, content that is the same as or similar to the content described with reference to FIGS. 1 to 8 will be omitted or will be briefly described.

[0208] First, referring to FIG. 9A, a pixel driving circuit layer 102 including a light-shielding layer (LS), a buffer layer 102a, an active layer (ACT), a gate insulating layer (GI), a gate (G), and a source / drain (SD) may be provided on a substrate 101.

[0209] A planarization layer 103 may be provided on the pixel driving circuit layer 102 .

[0210] On the planarization layer 103, an anode (AN) may be provided.

[0211] The outer periphery of the anode (AN) may be provided with a bank (BK).

[0212] The substrate 101 may include a non-transmissive area (NTA) and a transmissive area (TA) in which pixels (P1, P2, P3, PW) are provided.

[0213] The pixel driving circuit layer 102 provided in the non-transmitting area (NTA) may include non-transmitting or opaque elements such as transistors (Tsw1, Tsw2, Tdr) and a light-shielding layer (LS).

[0214] The pixel driving circuit layer 102 provided in the transmissive region (TA) may include a buffer layer 102a, a gate insulating layer (GI), and a protective layer 102b, but may not include any non-transmissive or opaque elements. In addition, the transmissive region (TA) may not include at least one of the buffer layer 102a, the gate insulating layer (GI), and the protective layer 102b that constitute the pixel driving circuit layer 102 in order to improve the light transmittance of the transmissive region (TA).

[0215] A step may be formed between the transmissive area (TA) and the non-transmissive area (NTA) of the planar layer 103 provided on the substrate 101, and an inclined surface may be formed by the step.

[0216] The anodes (AN) can be provided at positions corresponding to the pixels (P1, P2, P3, PW).

[0217] The anode (AN) can be formed of a metal, a metal alloy, or a combination of a metal and an oxide. For example, the anode (AN) can be formed of a multilayer structure including a transparent electrode layer made of a transparent conductive material and a reflective electrode layer made of an opaque conductive material with high reflective efficiency.

[0218] The transparent electrode layer of the anode (AN) can be made of a material with a relatively high work function, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The reflective electrode layer of the anode (AN) can be made of any one of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), and tungsten, or an alloy of these.

[0219] Specifically, the anode (AN) may be formed in a structure in which a transparent electrode layer, a reflective electrode layer, and a transparent electrode layer are sequentially stacked, or in a structure in which a transparent electrode layer and a reflective electrode layer are sequentially stacked, or may be formed in various other combinations.

[0220] A bank (BK) may be provided around the outer periphery of the anode (AN). In particular, the bank (BK) may be provided in the non-transmitting area (NTA).

[0221] For example, the bank (BK) may be made of an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiOxNy), or may be made of an organic material such as polyimide, acrylate, or benzocyclobutene series resin.

[0222] The bank (BK) covers the end of the anode (AN). The area (opening) of the anode (AN) that is not covered by the bank (BK) can emit light. Therefore, the opening of the anode (AN) exposed by the bank (BK) can be the light-emitting area (EA), and the part where the bank (BK) is formed can be the non-light-emitting area (NEA).

[0223] Also, the color pixels (P1, P2, P3) and the white pixel (PW) can be separated by the bank (BK), and the transmissive area (TA) and the non-transmissive area (NTA) can be separated.

[0224] In this case, the bank (BK) adjacent to the transmissive area (TA) may include an inclined surface corresponding to the inclined surface of the flat layer 103, as shown in FIGS.

[0225] For example, the inclined surface of the bank (BK) may have the same or similar inclination angle as the inclined surface of the flat layer 103, in which case the inclined surface of the bank (BK) and the inclined surface of the flat layer 103 may be continuously connected. Alternatively, the inclined surface of the bank (BK) may have a lower inclination angle than the inclined surface of the flat layer 103, in which case the inclined surface of the bank (BK) and the inclined surface of the flat layer 103 may be continuously connected. Alternatively, the inclined surface of the bank (BK) may be offset from the inclined surface of the flat layer 103, in which case a staircase-like structure may be formed between the bank (BK) and the flat layer 103.

[0226] Next, as shown in Figure 9B, the planar layer 103, the bank (BK), and the anode (AN) are covered with a fluorine-based material (SL). The fluorine-based material (SL) can be, for example, a fluoropolymer material. In a fluoropolymer, carbon-carbon bonds are continuously formed in a chain structure, and the functional groups of the fluoropolymer contain a large amount of fluorine (F).

[0227] Fluorine-based substances (SL) contain a large amount of fluorine (F) and therefore can have orthogonality. Orthogonality can be understood as the property of two things existing independently of each other. This allows fluorine-based substances (SL) to have both hydrophobicity, meaning they have little affinity for water, and oleophobicity, meaning they have little affinity for oil. This orthogonality allows fluorine-based substances (SL) to separate from or repel water.

[0228] The fluorine-based material (SL) can be provided on the substrate 101 using a spin coating or slit coating technique.

[0229] A photoresist layer (PR) may be formed on the fluorine-based material (SL). The photoresist layer (PR) may be formed using either a positive or negative photoresist material. In addition, a silicon-based surfactant may be added to the photoresist material constituting the photoresist layer (PR) to enhance the interfacial adhesion properties.

[0230] 9C, after the fluorine-based material (SL) and the photoresist layer (PR) are provided, an exposure process may be performed to form a photoresist pattern (PRa) that exposes a portion of the surface of the fluorine-based material (SL). The exposure process may be performed by exposing the portion of the photoresist layer (PR) to be removed to light such as ultraviolet (UV) light.

[0231] After the exposure process, the exposed portion is removed using a developer to form a photoresist pattern (PRa) that exposes a portion of the surface of the fluorine-based material (SL). For example, the development of the photoresist pattern (PRa) can be carried out using a basic chemical solution (tetramethyl ammonium hydroxide (TMAH)).

[0232] 9D, after forming the photoresist pattern (PRa), a mask patterning process is performed using the photoresist pattern (PRa) as a mask pattern, thereby forming a fluorine-based protective layer (FSL). In particular, the fluorine-based protective layer (FSL) can be formed by a patterning process that removes a portion of the fluorine-based material (SL) underneath the photoresist pattern (PRa).

[0233] The patterning process for the fluorine-based protective layer (FSL) can be carried out using a fluorine (F)-based organic solvent. The fluorine (F)-based organic solvent, which contains a large amount of fluorine (F) in the functional group, penetrates into the fluorine-based material (SL) and selectively removes only a portion of the fluorine-based material (SL), thereby forming the fluorine-based protective layer (FSL).

[0234] In this case, depending on the characteristics of the fluorine (F)-based organic solvent, the fluorine-based material (SL), and the photoresist pattern (PRa), a fluorine-based protective layer (FSL) having an inverted tapered structure in which the width of the bottom end is smaller than the width of the top end, as shown in Figure 9D, can be formed.

[0235] For example, the angle of the inverse tapered shape can be controlled depending on the type and content of surfactant contained in the photoresist layer (PR), and the angle and shape of the inverse tapered shape can also be controlled by the adhesive properties between the photoresist layer (PR) and the fluorine-based material (SL).

[0236] Next, as shown in FIG. 9E, the photoresist pattern (PRa) is removed by a cleaning process, leaving only the fluorine-based protective layer (FSL).

[0237] Next, an emitting layer (EL), a cathode (CA) and a sealing layer 104 are provided in this order on top of the fluorine-based protective layer (FSL).

[0238] Finally, a color filter (CF), a black matrix (BM) and an encapsulation substrate 105 are sequentially provided on top of the encapsulation layer 104, or the encapsulation substrate 105 having the color filter (CF) and black matrix (BM) is bonded to the encapsulation layer 104, thereby completing the manufacture of the light-emitting display panel 100.

[0239] The features of the light emitting display device according to an embodiment of the present specification can be briefly summarized as follows.

[0240] An organic light emitting display device according to an embodiment of the present disclosure may include a substrate including a display area and a non-display area, a white pixel and a color pixel provided in the display area, and a fluorine-based protective layer surrounding the white pixel.

[0241] The fluorine-based protective layer may be provided on the top of the bank surrounding the white pixel.

[0242] The white pixel and the color pixel are provided with a light-emitting layer, and the light-emitting layer enclosed by the fluorine-based protective layer and the light-emitting layer provided outside the fluorine-based protective layer can be separated by the fluorine-based protective layer.

[0243] The cathode provided on the upper end of the light-emitting layer is not separated by the fluorine-based protective layer.

[0244] The width of the upper end of the fluorine-based protective layer may be greater than the width of the lower end of the fluorine-based protective layer.

[0245] The light emitting display device according to an embodiment of the present disclosure may further include a color filter disposed on an upper end of the color pixel.

[0246] The upper end of the white pixel does not have a color filter.

[0247] A black matrix may be provided on the upper end of the fluorine-based protective layer.

[0248] The color filters may be disposed on an encapsulation substrate, the encapsulation layer may be disposed between the color pixels and the color filters, and another encapsulation layer may be disposed between the white pixels and the encapsulation substrate.

[0249] At least one of the outer edges of the white pixel may include a light-transmitting region.

[0250] Unit pixels are provided along an nth data line provided on the substrate, and each of the unit pixels includes three color pixels and the white pixel, and a first color pixel and a second color pixel of the three color pixels are arranged on a boundary of the nth data line, and a third color pixel and the white pixel of the three color pixels are arranged on a boundary of the nth data line.

[0251] Of the three color pixels and the white pixel included in the unit pixel, the fluorine-based protective layer may be provided only on the outer periphery of the white pixel.

[0252] A first light-transmitting region may be provided on the left side of a pixel provided on the left side of the nth data line as a boundary, and a second light-transmitting region may be provided on the right side of a pixel provided on the right side of the nth data line as a boundary.

[0253] Unit pixels are provided along the nth data line, and a white pixel provided in a first unit pixel among the unit pixels is provided on the right side of the nth data line, a white pixel provided in a second unit pixel among the unit pixels is provided on the left side of the nth data line, and a white pixel provided in a third unit pixel among the unit pixels is provided on the right side of the nth data line.

[0254] Those skilled in the art will understand that the present specification may be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. The scope of the present specification is defined by the claims set forth below, rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present specification. [Explanation of symbols]

[0255] 100: Illuminated display panel 200: Gate driver 300: Data driver 400: Control driver

Claims

1. a substrate including a display area and a non-display area; white pixels and color pixels provided in the display area; and a fluorine-based protective layer that covers only the outer periphery of the white pixel among the white pixel and the color pixel provided in the display area; A light-emitting display device comprising:

2. The light emitting display device of claim 1 , wherein the fluorine-based protective layer is provided on an upper end of a bank that surrounds the white pixel.

3. 2. The light-emitting display device of claim 1, wherein a light-emitting layer is provided in the white pixel and the color pixel, and the light-emitting layer enclosed by the fluorine-based protective layer and the light-emitting layer provided outside the fluorine-based protective layer are separated by the fluorine-based protective layer.

4. 4. The light-emitting display device according to claim 3, wherein the cathode provided on the light-emitting layer is not separated by the fluorine-based protective layer.

5. The light-emitting display device according to claim 1 , wherein the width of the upper end of the fluorine-based protective layer is greater than the width of the lower end of the fluorine-based protective layer.

6. The light emitting display device of claim 1 , further comprising a color filter disposed over the color pixels.

7. The light emitting display device of claim 6 , wherein the white pixel is not provided with a color filter.

8. The light emitting display device of claim 6 , further comprising a black matrix disposed on an upper end of the fluorine-based protective layer.

9. The color filter is provided on an encapsulation substrate, an encapsulation layer is provided between the color pixels and the color filters; The light emitting display device of claim 6 , wherein the encapsulation layer is disposed between the white pixel and the encapsulation substrate.

10. The light emitting display device of claim 1 , wherein at least one of the outer edges of the white pixel comprises a transmissive region through which light passes.

11. A unit pixel is provided along an n-th data line provided on the substrate, where n is a natural number; Each of the unit pixels includes three color pixels and a white pixel; The first and second color pixels of the three color pixels are arranged with an n-th data line therebetween; The light emitting display device of claim 1 , wherein a third color pixel and the white pixel among the three color pixels are disposed with the nth data line interposed therebetween.

12. The light emitting display device of claim 11, wherein the fluorine-based protective layer is formed only on an outer periphery of the white pixel among the three color pixels and the white pixel included in the unit pixel.

13. A first transmission area through which light passes is provided on the left side of the pixel provided on the left side of the nth data line, The light emitting display device of claim 11, wherein a second transmissive region that transmits light is provided on the right side of the pixel provided on the right side of the nth data line.

14. a white pixel included in a first unit pixel among the unit pixels is provided on the right side of the nth data line; a white pixel included in a second unit pixel of the unit pixels is provided on the left side of the nth data line; The light emitting display device of claim 13, wherein a white pixel included in a third unit pixel of the unit pixels is provided on the right side of the nth data line.

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