Method for manufacturing a bonded body and apparatus for manufacturing a bonded body

Abstract

To prevent positional deviation of a holding member for holding an assembly.SOLUTION: A joining process in a manufacturing method of an assembly includes a holding step for fitting a laminate to a holding device. The holding device is equipped with a press member for pressing the laminate, a base member for holding the press member, a holding member for holding the laminate, and a fixing mechanism for fixing the holding member to the base member. In the holding step, the holding member is fixed to the base member by the fixing mechanism.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method and apparatus for producing a bonded body by bonding substrates. [Background technology]

[0002] As is well known, LED elements and other electronic elements are housed in airtight packages to prevent deterioration. The airtight package is formed as a bonded assembly by bonding a first substrate, which is a base material, to a second substrate, which is a glass substrate, for example.

[0003] For example, Patent Document 1 discloses a method for producing a bonded body by interposing a sealing material (bonding material) between a first substrate, which is a base material (member to be bonded), and a second substrate made of a glass member, and heating the sealing material.

[0004] In this manufacturing method, a laminate having a sealing material disposed between a first substrate and a second substrate is prepared, the laminate is attached to a jig, and the pressure inside the jig is adjusted to press the laminate. Furthermore, while the laminate is pressed, a laser beam is irradiated onto the sealing material to form a bonded portion from the sealing material, thereby producing a bonded body (see paragraphs 0036 to 0046 of the same document).

[0005] The jig used in this manufacturing method includes a jig body that supports the laminate and a cover for the jig body that presses the laminate.

[0006] The jig body further includes a biasing portion that biases the stack placed in the recess of the jig body toward the jig body cover. The biasing portion includes a biasing portion main body that resists compression force, and a biasing plate that is disposed between the biasing portion main body and the stack.

[0007] The biasing unit main body includes a plurality of plungers and a base on which the plungers are mounted. The biasing plate is supported by the plungers of the biasing unit main body, and can transmit the biasing force of the biasing unit main body more uniformly to the stack. The stack is placed on the biasing plate when it is accommodated in the recess of the jig main body. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Patent Publication No. 2021-31306 Summary of the Invention [Problem to be solved by the invention]

[0009] In the conventional manufacturing method of a joined body as described above, the biasing plate of the biasing part is supported in a state of contact with the plunger of the biasing part main body, and therefore, it is prone to shifting in position when the laminate is placed on it. If the position of the biasing plate shifts, the position of the laminate placed on the biasing plate also changes, so it becomes necessary to adjust the irradiation position of the laser light on the laminate, which could make the work complicated.

[0010] The present invention has been made in view of the above circumstances, and has as its technical object to prevent displacement of a support member that supports a joined body. [Means for solving the problem]

[0011] The present invention has been made to solve the above-mentioned problems, and provides a method for manufacturing a bonded body including a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate, the method comprising: a laminating step of forming a laminate by interposing a sealing material between the first substrate and the second substrate and overlapping the first substrate and the second substrate; and a bonding step of forming the sealing layer by irradiating the sealing material in the laminate with laser light, wherein the bonding step comprises a supporting step of mounting the laminate on a supporting device, a pressing step of pressing the laminate, and a laser irradiation step of irradiating the sealing material with the laser light to form the sealing layer, the supporting device comprising: a pressing member that presses the laminate, a base member that supports the pressing member, a supporting member that supports the laminate, and a fixing mechanism that fixes the supporting member to the base member, and the supporting step involves fixing the supporting member to the base member by the fixing mechanism.

[0012] According to this configuration, by fixing the support member to the base member by the fixing mechanism, it is possible to reliably prevent the support member from shifting in position during the supporting process.

[0013] The fixing mechanism may include a fixing member having a head and a shaft, and a hole formed in the support member and through which the shaft can be inserted, thereby enabling the support member to be fixed to the base member in an appropriate manner.

[0014] The fixing mechanism may include a fixing member having a head and a shaft, a hole formed in the support member through which the head and the shaft can be inserted, a recess formed in the support member for engaging the head, and a guide groove formed in the support member for moving the shaft relatively between the hole and the recess.

[0015] According to this configuration, the support member can be easily attached to and detached from the base member.

[0016] The shaft of the fixing member may have a male thread, and the base member may have a threaded hole that engages with the male thread. With this configuration, the position of the support member can be adjusted by changing the position of the shaft of the fixing member that is engaged with the threaded hole of the base member.

[0017] The base member may include an elastic member that supports the support member, and in the supporting step, the fixing member may fix the support member to the base member while the elastic member is elastically deformed, thereby allowing the support member to be biased by the elastic restoring force of the elastic member when pressing the laminate.

[0018] The support member may have a housing portion for housing the stack. By housing the stack in the housing portion, it is possible to prevent the stack from shifting in position relative to the support member.

[0019] The present invention has been made to solve the above-mentioned problems, and provides an apparatus for manufacturing a bonded body including a first substrate, a second substrate, and a sealing layer that bonds the first substrate and the second substrate, the apparatus comprising: a support device that supports a laminate formed by overlapping the first substrate and the second substrate with a sealing material interposed between the first substrate and the second substrate; and a laser irradiation device that forms the sealing layer by irradiating the sealing material in the laminate with laser light, wherein the support device comprises a pressing member that presses the laminate, a base member that supports the pressing member, a support member that supports the laminate, and a fixing mechanism that fixes the support member to the base member, and is configured to fix the support member to the base member by the fixing mechanism.

[0020] According to this configuration, by fixing the support member to the base member by the fixing mechanism, it is possible to reliably prevent the support member from shifting in position when the stack is supported by the support member. [Effects of the Invention]

[0021] According to the present invention, it is possible to prevent the support member that supports the joined body from being displaced. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. [Figure 2] FIG. 2 is a cross-sectional view taken along the line II-II of FIG. [Figure 3] FIG. 10 is a bottom view of the second substrate. [Figure 4] FIG. 2 is a cross-sectional view showing a manufacturing apparatus for a bonded body. [Figure 5] FIG. 2 is a plan view showing a part of the support device. [Figure 6] FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] 10A to 10C are cross-sectional views showing a method for attaching a support member to a base member. [Figure 11] 10A and 10B are plan views showing a method for attaching the support member to the base member. [Figure 12] 12 is a cross-sectional view taken along the line of arrows XII-XII in FIG. 11. [Figure 13] 10 is a flowchart showing a method for manufacturing a bonded body. [Figure 14] FIG. 4 is a cross-sectional view showing a lamination process. [Figure 15] 10 is a flowchart showing a bonding process. [Figure 16] FIG. [Figure 17] FIG. [Figure 18] FIG. 10 is a plan view showing a manufacturing apparatus for a bonded body according to a second embodiment. [Figure 19] FIG. [Figure 20] 10A to 10C are cross-sectional views showing a method for attaching a support member to a base member. [Figure 21] FIG. [Figure 22] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0023] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figures 1 to 17 show a first embodiment of a method and apparatus for manufacturing a bonded body according to the present invention.

[0024] 1 and 2 show an example of an airtight package as an assembly manufactured by the present invention. The assembly 1 includes a first substrate 2 serving as a base material, a second substrate 3 overlaid on the first substrate 2, a plurality of sealing layers 4 bonding the first substrate 2 and the second substrate 3 together, and an element 5 housed inside the sealing layers 4 between the first substrate 2 and the second substrate 3.

[0025] The first substrate 2 is configured, for example, in a rectangular shape, but is not limited to this shape. The first substrate 2 has a first main surface 2a on which the elements 5 are mounted and a second main surface 2b located on the opposite side of the first main surface 2a. The first main surface 2a may have a recess capable of accommodating the elements 5.

[0026] The first substrate 2 is made of a highly thermally conductive substrate, such as a silicon substrate, but is not limited to this and may be made of other metal substrates, ceramic substrates, semiconductor substrates, or other various substrates. The thickness of the first substrate 2 is within the range of 0.1 to 5.0 mm, but is not limited to this range.

[0027] The thermal conductivity of the first substrate 2 may be higher than the thermal conductivity of the second substrate 3. The thermal conductivity of the first substrate 2 at 20°C is preferably 10 to 500 W / m·K, more preferably 30 to 300 W / m·K, even more preferably 70 to 250 W / m·K, and particularly preferably 100 to 200 W / m·K, but is not limited to this range.

[0028] The second substrate 3 is made of, for example, a rectangular transparent glass substrate, but is not limited to this shape. The second substrate 3 has a first main surface 3a and a second main surface 3b located on the opposite side of the first main surface 3a.

[0029] Examples of glass that can be used to form the second substrate 3 include alkali-free glass, borosilicate glass, soda-lime glass, quartz glass, and crystallized glass with a low thermal expansion coefficient. There are no particular limitations on the thickness of the second substrate 3, but a thickness in the range of 0.01 to 2.0 mm is used. The thermal conductivity of the second substrate 3 at 20°C is preferably 0.5 to 5 W / m K, but is not limited to this range.

[0030] The plurality of sealing layers 4 are formed in a predetermined arrangement pattern on the bonded body 1. The sealing layers 4 are formed by interposing a plurality of sealing materials between the first substrate 2 and the second substrate 3, and irradiating the sealing materials with laser light to heat them and soften and flow them.

[0031] 3 shows a bottom view of the second substrate 3 before being bonded to the first substrate 2. When a sealing material is interposed between the first substrate 2 and the second substrate 3, for example, a sealing material 6 may be adhered in advance to the first main surface 3a of the second substrate 3. However, the sealing material may be adhered to the first substrate 2 in advance, or a sheet-like sealing material may be interposed between the first substrate 2 and the second substrate 3.

[0032] Various materials can be used as the sealing material. Among them, a composite material (glass frit) containing bismuth-based glass powder and refractory filler powder is preferably used from the viewpoint of increasing the sealing strength. In addition to bismuth-based glass, glass powders such as silver phosphate glass and tellurium glass can also be used as the sealing material.

[0033] Various materials can be used as the refractory filler powder, but it is preferable that the refractory filler powder is composed of one or more materials selected from cordierite, zircon, tin oxide, niobium oxide, zirconium phosphate ceramics, willemite, β-eucryptite, and β-quartz solid solution.

[0034] 1, the sealing layer 4 is configured in a closed curve shape so as to join the space that accommodates the element 5. In the present invention, the term "closed curve" includes not only a shape that is made up of curves only, but also a shape that is made up of a combination of curves and straight lines, and a shape that is made up of straight lines only (for example, a quadrangle or other polygonal shape).

[0035] The thickness of the sealing layer 4 is preferably 1 μm to 20 μm, more preferably 3 to 8 μm. The width W of the sealing layer 4 is preferably 50 to 2000 μm, more preferably 100 to 1000 μm.

[0036] The element 5 is mounted on the first main surface 2a of the first substrate 2. The element 5 is disposed in a space (cavity) defined by the first main surface 2a of the first substrate 2, the first main surface 3a of the second substrate 3, and the sealing layer 4. The element 5 may be any of a variety of elements, such as a light-emitting element such as a deep ultraviolet LED (Light Emitting Diode), a MEMS (Micro Electro Mechanical Systems) element, or a CCD (Charge Coupled Device) element.

[0037] 4 to 12 show a manufacturing apparatus 7 for manufacturing the bonded body 1. As shown in Fig. 4, the manufacturing apparatus 7 includes a supporting device 8 for supporting a laminate LM formed by laminating a first substrate 2 and a second substrate 3 with a sealing material 6 interposed therebetween, and a laser irradiation device 9 for forming a sealing layer 4 by irradiating the sealing material 6 of the laminate LM with laser light L.

[0038] As shown in Figures 4 to 9, the support device 8 includes a support member 10 that supports the laminate LM, a pressing member 11 that presses the laminate LM, a base member 12 that supports the pressing member 11, a fixing mechanism 13 that fixes the support member 10 to the base member 12, a frame 14 that fixes the pressing member 11 to the base member 12, a sealing member 15 that is arranged between the pressing member 11 and the base member 12, a storage space 16 for the laminate LM that is formed between the pressing member 11 and the base member 12, and an air pressure adjustment device 17 that adjusts the air pressure in the storage space 16.

[0039] The support member 10 is disposed in the accommodation space 16 together with the laminate LM. The support member 10 is formed of, for example, a circular plate member made of metal (stainless steel, etc.) (see FIG. 7). The material and shape of the support member 10 are not limited to those in this embodiment. The support member 10 has a first surface 10a and a second surface 10b located on the opposite side of the first surface 10a. The first surface 10a has an accommodation portion 18 that accommodates the laminate LM. In this embodiment, the accommodation portion 18 is formed of a recess that can accommodate the laminate LM, but the configuration of the accommodation portion 18 is not particularly limited as long as it is capable of positioning the laminate LM. For example, the first surface 10a of the support member 10 may be provided with a plurality of positioning protrusions, and the space inside these may serve as the accommodation portion 18.

[0040] 8, the pressing member 11 is, for example, a circular transparent glass plate. The thickness of the pressing member 11 is preferably, for example, 3 to 10 mm. The Young's modulus of the pressing member 11 is preferably 50 to 80 GPa, and more preferably 60 to 70 GPa. The pressing member 11 has a first surface 11a that contacts the sealing member 15 and the laminate LM, and a second surface 11b that contacts the frame 14.

[0041] The base member 12 is made of metal (for example, stainless steel), but may be made of other materials. The base member 12 has a wall portion 19 and a bottom portion 20 for forming the storage space 16.

[0042] 5 shows a plan view of the base member 12 to which the support member 10 is fixed by the fixing mechanism 13. The wall portion 19 of the base member 12 is configured to be cylindrical, but is not limited to this shape. A support seat portion 21 to which the seal member 15 is attached is formed midway on the inside of the wall portion 19. The support seat portion 21 is a surface that faces the pressing member 11 attached to the base member 12. The support seat portion 21 is formed with a groove portion 21a that is annular in plan view, to which the seal member 15 is attached.

[0043] As shown in FIGS. 4 and 5, the wall portion 19 has an end face 19a (upper face), inner circumferential faces 19b and 19c, and an outer circumferential face 19d.

[0044] The frame 14 is fixed to an end surface 19a of the wall portion 19 via a fixing member 22. The fixing member 22 is formed of, for example, a bolt or a screw member, and has a head 22a and a shaft 22b. A plurality of screw holes 23 are formed in the end surface 19a, into which the shafts 22b of the fixing member 22 are engaged.

[0045] The inner circumferential surfaces 19b, 19c of the wall portion 19 include a first inner circumferential surface 19b that functions as a guide surface that guides the pressing member 11 to the support seat portion 21, and a second inner circumferential surface 19c through which the support member 10 can be inserted. The diameter of the first inner circumferential surface 19b is larger than the diameter of the pressing member 11. The diameter of the second inner circumferential surface 19c is larger than the diameter of the support member 10.

[0046] The bottom 20 of the base member 12 is formed inside the cylindrical wall portion 19. The bottom 20 is formed by a surface that is circular in plan view.

[0047] As shown in Figures 4 to 6, the fixing mechanism 13 includes an elastic member 24 that supports the support member 10, a fixing member 25 that fixes the support member 10 to the base member 12, an insertion hole 26 formed in the support member 10 through which a portion of the fixing member 25 can be inserted, a locking recess 27 formed in the support member 10 that locks a portion of the fixing member 25, and a guide groove 28 formed in the support member 10 that allows the fixing member 25 to move relatively between the insertion hole 26 and the locking recess 27.

[0048] The elastic members 24 are attached to the bottom 20 of the base member 12. A plurality of elastic members 24 are arranged on the bottom 20. The elastic members 24 are formed, for example, from compression coil springs, but are not limited to this and may be formed from other springs, rubber, or other materials. A plurality of mounting recesses 29 are formed in the bottom 20 to accommodate portions of the elastic members 24. One end of each elastic member 24 is inserted into the mounting recess 29, and the other end protrudes from the bottom 20. The elastic members 24 have the function of biasing the support member 10 by their elastic restoring force.

[0049] The fixing member 25 is formed of, for example, a bolt or a screw member, and has a head 25a and a shaft 25b. The head 25a has a dimension (diameter) larger than the diameter of the shaft 25b. The shaft 25b has a male thread 30. The shaft 25b is fixed to the bottom 20 of the base member 12. The bottom 20 of the base member 12 has a threaded hole 31 formed therein, into which the shaft 25b fits.

[0050] 7, the insertion hole 26 is configured to have a circular shape in a plan view, but is not limited to this shape. The insertion hole 26 has a diameter larger than the size (diameter) of the head 25a so that the head 25a and the shaft 25b of the fixing member 25 can be inserted therethrough.

[0051] The locking recess 27 has a side wall surface 27a into which the head 25a of the fixing member 25 can be inserted, and a bottom surface 27b that locks the head 25a. The side wall surface 27a is circular in plan view, but is not limited to this shape. The side wall surface 27a has a diameter larger than the size of the head 25a of the fixing member 25 so as not to come into contact with the head 25a. The bottom surface 27b is configured to come into contact with the head 25a.

[0052] The guide groove 28 penetrates the support member 10 in its thickness direction so that the shaft portion 25b of the fixing member 25 can be inserted therethrough. The guide groove 28 is connected to the insertion hole 26 of the fixing member 25 and the bottom surface 27b of the locking recess 27 so that the shaft portion 25b of the fixing member 25 can move relatively between the insertion hole 26 and the locking recess 27. Specifically, one end of the guide groove 28 communicates with the inner circumferential surface of the insertion hole 26. The other end of the guide groove 28 is located at the center of the bottom surface 27b of the locking recess 27.

[0053] Guide groove 28 is configured to have an arc-like or linear shape in a plan view. Guide groove 28 allows shaft portion 25b of fixing member 25 to move relatively between insertion hole 26 and locking recess 27 by rotating support member 10 around its center.

[0054] 9, frame body 14 is a plate-like member configured in a circular ring shape in a plan view. Frame body 14 is fixed to end surface 19a of wall portion 19 of base member 12 by fixing member 22. Frame body 14 includes an insertion hole 32 through which shaft portion 22b of fixing member 22 is inserted, a locking recess 33 that accommodates head portion 22a of fixing member 22, a tubular portion 34, and an opening 35.

[0055] 4 and 9, the insertion holes 32 and the locking recesses 33 are formed concentrically in a plan view. A plurality of insertion holes 32 and locking recesses 33 are formed in the frame 14. The tubular portion 34 is formed in a cylindrical shape so as to correspond to the shape of the wall portion 19 of the base member 12. The diameter of the inner peripheral surface of the tubular portion 34 is larger than the diameter of the outer peripheral surface 19d of the wall portion 19 of the base member 12. The opening 35 is formed in a circular shape in a plan view. The diameter of the opening 35 is smaller than the diameter of the pressing member 11.

[0056] The sealing member 15 is made of an elastic member such as rubber (for example, an O-ring). As shown in Figures 4 and 5, the sealing member 15 is disposed in an annular groove 21a formed in the support seat 21 of the base member 12. The sealing member 15 comes into close contact with the pressing member 11, thereby sealing the accommodation space 16.

[0057] 8, the sealing member 15 is configured to surround the laminate LM in a circular shape between the pressing member 11 and the base member 12. The diameter of the circular shape of the sealing member 15 is smaller than the diameter of the pressing member 11 and larger than the diameter of the support member 10.

[0058] The accommodation space 16 for the laminated body LM is a space formed by the pressing member 11, the base member 12, and the sealing member 15. The accommodation space 16 is made airtight by bringing the pressing member 11 into close contact with the sealing member 15 attached to the support seat portion 21 of the base member 12. The accommodation space 16 can accommodate the laminated body LM, the support member 10, and the fixing mechanism 13.

[0059] 4, air pressure adjustment device 17 is formed in base member 12 and mainly comprises a flow path 36 for discharging gas from storage space 16, a pipe 37 connected to flow path 36, an adjustment valve 38 provided midway through pipe 37, and a pump 39. Flow path 36 includes an intake port 36a formed in bottom 20 of base member 12 and an exhaust port 36b formed on the outer surface of base member 12. By using pump 39 to suck air from storage space 16, air pressure adjustment device 17 can reduce the air pressure in storage space 16 and make storage space 16 a negative pressure relative to the atmosphere.

[0060] The laser irradiation device 9 is preferably one that emits a semiconductor laser, but is not limited to this, and devices that emit various types of lasers such as a YAG laser, a green laser, and an ultrashort pulse laser may also be used.

[0061] A method for fixing the support member 10 to the base member 12 by the fixing mechanism 13 will be described below. First, as shown in Fig. 10, with the shaft portion 25b of the fixing member 25 attached to the screw hole 31 of the base member 12, the support member 10 is brought close to the base member 12 from above. Thereafter, while the support member 10 is being lowered, the head portion 25a and the shaft portion 25b of the fixing member 25 are inserted into the insertion hole 26 as shown in Figs. 11 and 12. In this case, the upper end portion of the elastic member 24 attached to the base member 12 comes into contact with the second surface 10b of the support member 10.

[0062] Thereafter, the support member 10 is pressed against the elastic member 24 so that the head 25a of the fixing member 25 protrudes from the first surface 10a of the support member 10 as shown in Fig. 12. The elastic member 24 contracts while elastically deforming. As a result, the elastic member 24 generates an elastic restoring force that resists the force pressing the support member 10.

[0063] Next, while maintaining the head 25a in the protruding state, the support member 10 is rotated counterclockwise in plan view as shown by the arrow in Fig. 11. As a result, the shaft 25b inserted into the insertion hole 26 moves relatively toward the locking recess 27 through the guide groove 28. As shown by the two-dot chain line in Fig. 12, the fixing member 25 moves relatively toward the locking recess 27 by the guide groove 28, and the head 25a is positioned above the locking recess 27.

[0064] Thereafter, when the force pressing the support member 10 against the elastic member 24 is released, the biasing force of the elastic member 24 pushes the support member 10 up. As a result, the head 25a of the fixing member 25 enters the locking recess 27. The bottom surface 27b of the locking recess 27 comes into contact with the head 25a, so that the locking recess 27 is locked to the fixing member 25. In this state, it is desirable that the elastic member 24 not return to its free length, but continue to bias the support member 10 by its elastic restoring force.

[0065] The force with which the elastic member 24 urges the support member 10 can be adjusted by rotating the fixing member 25 about its axis and changing the position of the head 25a in the axial direction. To enable this position adjustment, it is preferable that the end of the shaft 25b of the fixing member 25 is positioned midway through the screw hole 31 formed in the base member 12, rather than at the bottom of the screw hole 31.

[0066] When removing the support member 10 from the base member 12, the support member 10 is pressed against the elastic member 24 to contract the elastic member 24, and the support member 10 is moved downward so that the head 25a of the fixing member 25 comes out of the locking recess 27. Then, the support member 10 is rotated clockwise in a plan view. This causes the shaft portion 25b of the fixing member 25 to engage with the guide groove 28. Then, due to the relative movement between the support member 10 and the fixing member 25, the shaft portion 25b is positioned in the insertion hole 26.

[0067] Next, the support member 10 is lifted from the first surface 10a side toward the second surface 10b side so that the head 25a of the fixing member 25 passes through the insertion hole 26. As a result, the support member 10 is removed from the base member 12.

[0068] As described above, the fixing mechanism 13 makes it possible to easily attach or detach the support member 10 to or from the base member 12. Furthermore, by adjusting the position of the fixing member 25 relative to the screw hole 31, it is possible to adjust the fixing position of the support member 10 in accordance with the thickness of the laminate LM.

[0069] A method for manufacturing the bonded body 1 using the manufacturing apparatus 7 having the above configuration will be described below with reference to Figures 13 to 17. As shown in Figure 13, this method includes a laminating step S1 and a bonding step S2.

[0070] 14, in the lamination step S1, first, the first substrate 2 and the second substrate 3 are overlapped with each other so that the first main surface 2a of the first substrate 2 faces the first main surface 3a of the second substrate 3. An element 5 is previously placed on the first main surface 2a of the first substrate 2. The first substrate 2 and the second substrate 3 are laminated with each other so that the element 5 is located inside the sealing material 6, thereby forming a laminate LM.

[0071] As shown in FIG. 15, the joining step S2 includes a supporting step S21, a pressing step S22, and a laser irradiation step S23.

[0072] In the supporting step S21, the laminate LM formed in the stacking step S1 is mounted on the supporting device 8. That is, as shown in Fig. 16, first, the laminate LM is accommodated in the accommodation portion 18 of the supporting member 10 attached to the base member 12 by the fixing mechanism 13.

[0073] 17, it is preferable that the thickness dimension TLM of the laminate LM is larger than the depth dimension D of the accommodation portion 18. The laminate LM is accommodated in the accommodation portion 18 so that a portion of the second substrate 3 in the thickness direction protrudes from the accommodation portion 18 toward the pressing member 11. It is preferable that the dimension PD1 by which the portion of the second substrate 3 in the thickness direction protrudes from the recess is 0.05 to 0.95 times the thickness dimension T of the second substrate 3 (0.05T≦PD1≦0.95T).

[0074] Next, the pressing member 11 is placed on the sealing member 15 attached to the support seat 21 of the base member 12. This brings the first surface 11a of the pressing member 11 into contact with the sealing member 15. In this case, it is preferable that the pressing member 11, the sealing member 15, and the laminate LM are arranged concentrically. In this state, the first surface 11a of the pressing member 11 may also come into contact with the second main surface 3b of the second substrate 3 in the laminate LM.

[0075] Thereafter, the frame body 14 is placed on the end surface 19a of the wall portion 19 of the base member 12, and the frame body 14 is fixed to the wall portion 19 by the fixing member 22. That is, the insertion hole 32 of the frame body 14 is aligned with the screw hole 23 of the wall portion 19 of the base member 12, and the shaft portion 22b of the fixing member 22 is inserted into the insertion hole 32 and then engaged with the screw hole 23, thereby tightening the fixing member 22. In this state, the frame body 14 and the sealing member 15 sandwich the pressing member 11. Furthermore, the opening 35 of the frame body 14 exposes a portion of the second surface 11b of the pressing member 11 toward the laser irradiation device 9. This completes the attachment of the laminated body LM to the supporting device 8. As a result, the laminated body LM is accommodated in the accommodation space 16 together with the supporting member 10.

[0076] In the supporting step S21, the accommodation space 16 may be filled with, for example, dry air. This allows the cavity formed in the manufactured laminate LM to have a low moisture content, thereby preventing performance degradation of the element 5 in the airtight package. Here, dry air refers to gas from which moisture has been removed by a drying process, and refers to gas that does not produce water even when the pressure fluctuates. As the dry air, for example, dried gas in the environment where the manufacturing apparatus 7 is located or high-purity nitrogen gas can be used.

[0077] For example, it is preferable to place the supporting device 8 in a work space filled with dry air and perform the supporting step S21 in this work space, thereby filling the accommodation space 16 with dry air. This results in the dry air being filled not only in the accommodation space 16, but also in the space between the first substrate 2 and the second substrate 3 in the laminate LM and inside the sealing material 6 (the accommodation space for the element 5).

[0078] In the subsequent pressing step S22, the gas in the accommodation space 16 is sucked by the pump 39 through the flow path 36 of the air pressure adjusting device 17 and discharged to the outside. As a result, the air pressure in the accommodation space 16 drops and becomes negative relative to the atmosphere. Due to the action of this negative pressure, the first surface 11a of the pressing member 11 comes into close contact with the seal member 15 and presses against the second substrate 3 of the laminate LM. Note that in the pressing step S22, the pressure in the accommodation space 16 can be adjusted by operating the adjustment valve 38. The air pressure in the accommodation space 16 is preferably 100 to 95,000 Pa, and more preferably 1,000 to 85,000 Pa.

[0079] In the pressing step S22, it is preferable that the pressing member 11 bends due to the action of the negative pressure in the accommodation space 16 so as to press the laminate LM.

[0080] 4, in the laser irradiation step S23, the sealing material 6 of the laminate LM is irradiated with laser light L from a laser irradiation device 9, thereby heating the sealing material 6 (heating step). The laser light L is transmitted through the pressing member 11 and the second substrate 3 and irradiated onto the sealing material 6. In the bonding step S2, the sealing material 6 is heated by the irradiation of the laser light L to a temperature equal to or higher than the softening point of the sealing material 6 or to a temperature at which the sealing material 6 softens and flows. The laser light L is irradiated so as to circle along the closed curve of the sealing material 6.

[0081] The wavelength of the laser light L is preferably 600 to 1600 nm. The laser used is preferably a semiconductor laser, but is not limited to this, and various lasers such as a YAG laser, a green laser, and an ultrashort pulse laser may also be used.

[0082] When heated by the laser light L, the sealing material 6 softens and flows, and then solidifies. This forms a sealing layer 4 that airtightly bonds the first substrate 2 and the second substrate 3. In this manner, the bonded body 1 including the first substrate 2, the second substrate 3, and the sealing layer 4 is manufactured. After the frame 14 and the pressing member 11 are removed from the base member 12, the bonded body 1 is removed from the support member 10.

[0083] According to the manufacturing method and manufacturing apparatus 7 for the bonded body 1 of this embodiment described above, by fixing the support member 10 to the base member 12 using the fixing mechanism 13, it is possible to reliably prevent the support member 10 from shifting in position when the laminated body LM is accommodated in the accommodation portion 18 of the support member 10 in the supporting step S21.

[0084] 18 to 22 show a second embodiment of the present invention. In this embodiment, the configuration of the laminate LM and the configuration of the supporting device 8 of the manufacturing apparatus 7 are different from those of the first embodiment.

[0085] As shown in FIG. 18, the pressing member 11 of the supporting device 8 has a protrusion 40 that is inserted into the accommodation portion 18 of the supporting member 10. The protrusion 40 is formed on the first surface 11a of the pressing member 11. The protrusion 40 is configured in a cylindrical shape, but is not limited to this shape. The protrusion dimension PD2 of the protrusion 40 is smaller than the depth dimension D of the accommodation portion 18 (see FIG. 21). The protrusion 40 has a pressing surface 41 that comes into surface contact with the second main surface 3b of the second substrate 3 of the laminate LM.

[0086] 19, the support member 10 of the support device 8 has a receiving portion 18 that is circular in plan view. The laminate LM is configured to be circular in plan view (not shown) so as to engage with this receiving portion 18. In other words, the first substrate 2 and the second substrate 3 of the laminate LM are configured to be disk-shaped.

[0087] 18 to 22, the fixing mechanism 13 has the same elastic member 24 and fixing member 25 as in the first embodiment, as well as an insertion hole 26 and a locking recess 27 formed in the support member 10. Note that the support member 10 according to this embodiment does not have the guide groove 28 of the first embodiment.

[0088] The diameter of insertion hole 26 is larger than the diameter of shaft portion 25b of fixing member 25 and smaller than the diameter of head portion 25a. Therefore, insertion hole 26 can allow shaft portion 25b of fixing member 25 to pass through, but cannot allow head portion 25a to pass through.

[0089] As in the first embodiment, the locking recess 27 has a side wall surface 27a that is circular in plan view, and a bottom surface 27b that locks the head 25a of the fixing member 25. The locking recess 27 is formed concentrically with the insertion hole 26 in plan view.

[0090] The support member 10 according to this embodiment is attached to the base member 12 as follows: First, as shown in Fig. 20, the fixing member 25 of the fixing mechanism 13 is removed from the screw hole 31 of the base member 12, and the support member 10 is placed on the elastic member 24 attached to the base member 12.

[0091] Next, in a plan view, the insertion hole 26 of the support member 10 is aligned with the screw hole 31 of the base member 12, and the shaft portion 25b of the fixing member 25 is inserted into the insertion hole 26. Thereafter, the shaft portion 25b is engaged with the screw hole 31. As a result, the head portion 25a of the fixing member 25 comes into contact with the bottom surface 27b of the locking recess 27, locking the support member 10. In this way, the support member 10 is fixed to the base member 12 by the fixing mechanism 13.

[0092] As shown in Figures 18, 21, and 22, the support device 8 includes an adjustment plate 42 that engages with the storage portion 18. In this embodiment, one adjustment plate 42 is illustrated as an example, but multiple adjustment plates 42 may also be used. The adjustment plate 42 is made of, for example, a circular glass plate or metal plate. The adjustment plate 42 adjusts the depth of the storage portion 18 by being placed on the bottom of the storage portion 18. This usage is not limited to this, and the adjustment plate 42 may also be a transparent glass plate, and the adjustment plate 42 may be used by overlapping it on the second main surface 3b of the second substrate 3 in the laminate LM stored in the storage portion 18.

[0093] The fixing mechanism 13 and the adjusting plate 42 according to this embodiment may be used in the support device 8 according to the first embodiment.

[0094] 21 , in the manufacturing method of a bonded body according to this embodiment, differences from the first embodiment will be described. In the manufacturing method of a bonded body according to this embodiment, in the supporting step S21, the adjusting plate 42 is accommodated in the accommodation portion 18 of the supporting member 10, and then the laminate LM is accommodated in this accommodation portion 18.

[0095] 22, the depth dimension D of the accommodation portion 18 according to this embodiment is larger than the thickness dimension TLM of the laminate LM. Therefore, in the laminate LM, no part of the second substrate 3 protrudes from the accommodation portion 18, and the entire second substrate 3 is accommodated in the accommodation portion 18.

[0096] Next, the pressing member 11 is placed on the sealing member 15 attached to the base member 12. At this time, the convex portion 40 of the pressing member 11 is inserted into the accommodation portion 18 of the support member 10. The pressing surface 41 of the convex portion 40 comes into contact with the second main surface 3b of the second substrate 3 in the laminate LM accommodated in the accommodation portion 18.

[0097] In a pressing step S22, the pressing surface 41 presses the second substrate 3 of the laminate LM. In a subsequent laser irradiation step S23, the laser light L passes through the convex portion 40 of the pressing member 11 and the second substrate 3 of the laminate LM, and is irradiated onto the sealing material 6.

[0098] Other configurations of this embodiment are the same as those of the first embodiment, and the same components as those of the first embodiment are denoted by the same reference numerals.

[0099] The present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects. The present invention can be modified in various ways without departing from the spirit of the present invention. [Explanation of symbols]

[0100] 1 zygote 2 First board 3 Second board 4 Sealing layer 6 Sealing material 8 Support device 10 Support member 11 Pressing member 12 Base member 13 Fixing mechanism 18 Storage section 24 Elastic member 25 Fixing member of fixing mechanism 26 Insertion hole 27 Locking recess 28 Guide groove 30 Male thread 31 screw holes L laser light LM laminate S1 Lamination process S2 Joining process S21 Support process S22 Pressing process S23 Laser irradiation process

Claims

1. A method for manufacturing a bonded body including a first substrate, a second substrate, and a sealing layer that bonds the first substrate and the second substrate, comprising: a lamination step of forming a laminate by interposing a sealing material between the first substrate and the second substrate and overlapping the first substrate with the second substrate, and a bonding step of forming the sealing layer by irradiating a laser beam onto the sealing material in the laminate, the joining step includes a supporting step of mounting the laminate on a supporting device, a pressing step of pressing the laminate, and a laser irradiation step of irradiating the sealing material with the laser light to form the sealing layer, the support device includes a pressing member that presses the stack, a base member that supports the pressing member, a support member that supports the stack, and a fixing mechanism that fixes the support member to the base member; In the supporting step, the supporting member is fixed to the base member by the fixing mechanism; The fixing mechanism includes a fixing member having a head and a shaft, a hole formed in the support member through which the head and the shaft can be inserted, a recess formed in the support member for engaging the head, and a guide groove formed in the support member for moving the shaft relatively between the hole and the recess.

2. The method for manufacturing a bonded body according to claim 1 , wherein the support member has a housing portion for housing the laminate.

3. An apparatus for manufacturing a bonded body including a first substrate, a second substrate, and a sealing layer that bonds the first substrate and the second substrate, a supporting device that supports a laminate formed by overlapping the first substrate and the second substrate with a sealing material interposed between the first substrate and the second substrate, and a laser irradiation device that forms the sealing layer by irradiating a laser beam onto the sealing material in the laminate, the support device includes a pressing member that presses the stack, a base member that supports the pressing member, a support member that supports the stack, and a fixing mechanism that fixes the support member to the base member; The fixing mechanism is configured to fix the support member to the base member; The fixing mechanism includes a fixing member having a head and a shaft, a hole formed in the support member through which the head and the shaft can be inserted, a recess formed in the support member for engaging the head, and a guide groove formed in the support member for moving the shaft relatively between the hole and the recess.

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