High Current Contact Device

Abstract

To provide an improved large current contact device for transmitting electric energy.SOLUTION: A large current contact device 10 includes a contact housing, a first contact element 20, and a temperature measurement device 25. The first contact element 20 extends along a mating shaft 45. The temperature measurement device 25 has a circuit carrier including a first heat conduction path 120 and a first temperature sensor 105. The circuit carrier is disposed laterally adjacent to the first contact element 20. A first heat conduction path 120 has an elastic and thermally conductive first heat conduction element 125 containing a contact surface 135. The contact surface 135 comes in contact with a first outer peripheral surface 140 of the first contact element 20. The first heat conduction element 125 thermally couples the first contact element 20 to the first temperature sensor 105. The first temperature sensor 105 measures temperature of the first contact element 20.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The invention relates to a high-current contact device according to claim 1. [Background technology]

[0002] A plug device insert is known from DE 10 2016 107 401 A1, which includes contact elements, such as contact pins, for conducting electrical current. The contact elements include a contact area where the contact element contacts a complementary contact element and a connection area where a conductor is connected. The temperature of at least one contact element is detected in a measuring area located between the contact area and the connection area. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] DE102016107401A1 Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION It is an object of the present invention to provide an improved high current contact device for transferring electrical energy. [Means for solving the problem]

[0005] This object is achieved by a high-current contact device according to claim 1. Advantageous embodiments emerge from the dependent claims.

[0006] It has been recognized that an improved high-current contact device designed to transmit electrical energy can be provided, the high-current contact device including a contact housing, at least a first contact element disposed in the contact housing, and a temperature measurement device. The first contact element extends at least in part along the mating axis. The temperature measurement device includes a first heat conduction path and at least one circuit carrier including a first temperature sensor. The first temperature sensor is disposed on the circuit carrier, which is laterally adjacent to the first contact element. The first heat conduction path includes a resilient, thermally conductive first heat conduction element including a contact surface, the contact surface abutting a first outer peripheral surface of the first contact element. The first heat conduction element thermally couples the first contact element to the first temperature sensor. The first temperature sensor is designed to measure the temperature of the first contact element.

[0007] This configuration has the advantage that the temperature sensor does not need to be directly fastened to the contact element due to the heat conduction path, but is nevertheless thermally coupled to the first contact element in a very effective manner, allowing for dynamic and accurate temperature measurement of the first contact element. Therefore, high-current contact devices can be configured with great geometric flexibility. Furthermore, this configuration has the advantage that temperatures can be detected almost in real time. Therefore, early interruption of current transmission is possible to prevent destruction or damage to the contact device. Furthermore, it is also possible to determine temperatures in the cryogenic range, for example, down to -40°C.

[0008] In a further embodiment, the first heat-conducting element is pressed against the first outer peripheral surface by the first contact surface, and the first heat-conducting element can exhibit, at least in the region adjacent to the contact surface, an elastic deformation of preferably at least 1 percent, preferably 10 percent, preferably 20 percent to 40 percent, in particular up to 30 percent, which results in a particularly low thermal contact resistance between the outer peripheral surface and the first heat-conducting element.

[0009] In a further embodiment, the circuit carrier has a feedthrough, the first contact element passes through the feedthrough, and the first thermally conductive element is disposed adjacent to the feedthrough on the circuit carrier, and the first thermally conductive element is preferably connected to the circuit carrier by a material fit, which prevents the thermally conductive element from becoming detached when the first contact element passes through the feedthrough.

[0010] It is particularly advantageous if the first heat conducting element is designed in the shape of a ring or a hollow cylinder, the contact surface being arranged on its inner circumferential surface so as to extend continuously around the mating axis and sealingly abutting the first outer circumferential surface of the first contact element, thereby making it possible to dispense with an additional seal for sealing the first contact element.

[0011] In a further embodiment, the first heat conducting element has at least one support web, preferably a plurality of support webs arranged circumferentially offset relative to one another when viewed in relation to the mating axis, extending from the radially inner to the radially outer direction and arranged on a side of the first heat conducting element remote from the contact surface when viewed in the radial direction relative to the mating axis, which makes the first heat conducting element particularly mechanically stable.

[0012] In a further embodiment, the first temperature sensor is connected to the first heat conducting element by a material fit, and the first temperature sensor is preferably embedded in the first heat conducting element, in particular is preferably completely molded at least in some parts into the matrix material of the heat conducting element. This avoids moisture penetration into the temperature sensor, which can lead to corrosion of the temperature sensor. Furthermore, this prevents stray voltages in the temperature sensor that could distort the temperature measurement.

[0013] In a further embodiment, the first thermal conduction path includes a second thermal conduction element disposed on the circuit carrier, the second thermal conduction element having at least one metallization layer on and / or within the circuit carrier. The second thermal conduction element is thermally coupled to the first temperature sensor, particularly abutting the first temperature sensor at a first end, and the second thermal conduction element thermally connects the first thermal conduction element to the first temperature sensor. This results in a particularly low thermal resistance between the contact element and the temperature sensor.

[0014] In a further embodiment, the second heat conducting element has a thermal coupling surface on a side of the circuit carrier for contacting the first heat conducting element, the thermal coupling surface of the second heat conducting element being arranged at an angle, preferably perpendicular, to the end face of the circuit carrier.

[0015] Advantageously, the feedthrough is designed like a bore and the second heat conducting element is designed in the shape of at least a partial ring around the feedthrough.

[0016] In a further embodiment, the first heat-conducting element is composed of at least one matrix material, including at least silicone and / or polyethylene and / or polyurethane, and / or a temperature-stable plastic. At least one of the following filler materials in particulate form is embedded in the matrix material: copper, aluminum, silver, aluminum oxide, aluminum nitrate, silicon oxide, silicon nitrate, boron, boron nitride, conductive metals, preferably non-conductive and thermally conductive metal compounds based on iron or non-ferrous metals, and / or the second heat-conducting element is composed of aluminum and / or copper. The first heat-conducting element thus has a thermal conductivity of 0.3 W / (m·K) to 2 W / (m·K), in particular 0.3 W / (m·K) to 1.7 W / (m·K).

[0017] In a further embodiment, the high-current contact device has contact fixing means comprising a carrier displaceable between a first position and a second position. In the first position, the carrier is arranged to release the first contact element from the engagement part, and in the second position, the carrier fixes the first contact element against removal, and the first heat conducting element is fastened to the carrier, and in the first position, the first heat conducting element is arranged to be spaced from the first outer peripheral surface of the first contact element, and in the second position, the contact surface abuts against the first outer peripheral surface and is thermally connected to the first outer peripheral surface. Thus, the temperature sensor can be thermally connected to the associated contact element in a particularly simple manner.

[0018] In a further embodiment, the carrier has a receptacle disposed adjacent to the feedthrough, a first thermally conductive element disposed with a first portion within the receptacle, the first thermally conductive element protruding from the receptacle into the feedthrough with a second portion, and a contact surface disposed on the second portion.

[0019] In a further embodiment, the high-current contact device has a second contact element that is offset from the first contact element and that is offset in a direction perpendicular to the mating axis, and the temperature measuring device has a second heat conduction path that thermally connects the first temperature sensor to the second contact element. The temperature sensor thereby measures the temperatures of both the first and second contact elements. Therefore, the high-current contact device can be designed in a particularly simple and cost-effective manner.

[0020] In a further embodiment, the circuit carrier is designed as a printed circuit board or an injection-molded circuit carrier, which allows for a reduced number of parts and allows for flexible adaptation of the circuit carrier to geometric boundary conditions.

[0021] In a further embodiment, the first heat conducting element is designed in the shape of a cylinder or as a solid body, and the contact surface of the first heat conducting element is arranged on the second outer circumferential surface of the first heat conducting element, which allows the first heat conducting element to be pressed into the receptacle of the contact fastening means and attached in a particularly simple manner.

[0022] The invention will now be explained in more detail with reference to the drawings. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a perspective view of a high current contact device according to a first embodiment; [Figure 2] FIG. 2 is a detailed plan view of the high-current contact device shown in FIG. [Figure 3] 3 shows detail A labeled in FIG. 2 of the high current contact device shown in FIG. 2. [Figure 4] 4 is a cross-sectional view of the high current contact device shown in FIG. 3 along section BB shown in FIG. 3. [Figure 5] FIG. 5 is a perspective view of a first heat-conducting element of the high-current contact device shown in FIGS. [Figure 6] FIG. 10 is a perspective view of a high current contact device according to a second embodiment. [Figure 7] FIG. 7 is a side view of the high-current contact device shown in FIG. 6. [Figure 8] 8 is a cross-sectional view of the high-current contact device shown in FIGS. 6 and 7 along section CC shown in FIG. 7. [Figure 9] FIG. 9 is a detailed view of the second carrier shown in FIGS. 6 to 8. [Figure 10] FIG. 10 is a plan view of the high-current contact device shown in FIGS. [Figure 11] FIG. 10 is a plan view of the high-current contact device shown in FIGS. [Figure 12] FIG. 12 is a plan view of a temperature measuring device for the high-current contact device shown in FIGS. 6 to 11. [Figure 13]13 is a cross-sectional view of the high current contact device shown in FIG. 12 along section DD shown in FIG. 12. [Figure 14] 9 is a detailed cross-sectional view of the high current contact device shown in FIG. 8 along section EE shown in FIG. 8. [Figure 15] FIG. 15 is a side view of the high-current contact device shown in FIGS. [Figure 16] FIG. 10 is a perspective view of a circuit carrier of a high-current contact device according to a third embodiment. [Figure 17] 17 is a plan view of a temperature measurement device of the high current contact device shown in FIG. 16. [Figure 18] FIG. 10 is a perspective view of a high current contact device according to a fourth embodiment. [Figure 19] FIG. 19 is a side view of the high current contact device shown in FIG. [Figure 20] FIG. 20 is a rear view of the high current contact device shown in FIGS. 18 and 19. DETAILED DESCRIPTION OF THE INVENTION

[0024] In the following diagrams, reference is made to a coordinate system, which by way of example is configured as a right-handed system, with an x-axis (longitudinal), a y-axis (lateral), and a z-axis (vertical).

[0025] FIG. 1 is a perspective view of a high current contact device 10 according to a first embodiment.

[0026] The high-current contact device 10 comprises a contact housing 15 , at least a first contact element 20 arranged in the contact housing 15 , and a temperature measuring device 25 .

[0027] The high-current contact device 10 is designed to establish contact with a further high-current contact device 30. In Figure 1, the further high-current contact device 30 is shown diagrammatically by a dashed line. The further high-current contact device 30 is arranged on the side away from the viewer.

[0028] The high current contact device 10 and the further high current contact device 30 may be designed to be hermetically sealed to prevent the ingress of moisture, liquids and / or other corrosive media into the housing interior 35 of the contact housing 15 .

[0029] On the side facing the observer, the high-current contact device 10 can be connected, for example, to a high-current cable 40, which is connected, for example, to an electrical energy storage device, a drive motor of a vehicle, or a control device. Alternatively, the high-current contact device 10 can be connected to a connecting rail. The high-current cable 40 can be connected to a charging device that provides a charging current for charging the electrical energy storage device.

[0030] In the embodiment, the first contact element 20 extends linearly along a mating axis 45. The mating axis 45 is aligned to extend parallel to the x-axis. The high-current contact device 10 may further include at least one second contact element 50. The second contact element 50 is spaced apart from the first contact element 20 in a direction perpendicular to the mating axis 45. The first contact element 20 and the second contact element 50 may be designed differently or identically to each other, as shown in FIG. 1 . The second contact element 50, like the first contact element 20, is also disposed within the housing interior 35.

[0031] Furthermore, the high-current contact device 10 can have further contact elements 55 in the housing interior 35. The number of contact elements 20, 50, 55 arranged in the housing interior 35 is substantially limited only by the installation space of the housing interior 35. By way of example, the further contact elements 55 are designed differently from the first contact element 20 of FIG.

[0032] The first contact element 20 is, for example, designed as a pin contact and serves to establish an electrical contact with a mating contact 60, for example designed as a socket contact. In FIG. 1, the mating contact 60 is covered. The first contact element 20 is further designed to transmit electrical energy to the mating contact 60. In this case, the first contact element 20 is designed to transmit a current of at least 30 to 1000 amperes, in particular 50 to 500 amperes, for a time of at least 30 seconds.

[0033] The electrical energy transmitted via the first contact element 20 can be used, for example, to supply an electric drive motor of a motor vehicle with electrical energy. The electrical energy can also be used to charge an electrical energy storage device of the motor vehicle with electrical energy. The electrical energy can be supplied, for example, by regeneration or from a stationary electric energy network.

[0034] In the embodiment, the first contact element 20 is connected to, for example, a first electrode and the second contact element 50 is connected to a second electrode of a DC voltage energy source, for example an electrical energy storage device or a charging station, with the contact housing 15 and the circuit carrier 65 electrically insulating the contact elements 20, 50, 55 from each other. The voltage applied between the first contact element 20 and the second contact element 50 can be, for example, 48 V to 500 V and is therefore significantly different from conventional automotive 12 V or 24 V networks.

[0035] During the transmission of electrical energy by the high current cable 40 through the first contact element 20 and the mating contact 60, the first contact element 20 heats up due to its ohmic internal resistance and the ohmic contact resistance of the first contact element 20 to the mating contact 60.

[0036] By way of example, the further contact element 55 is designed differently from the first contact element 20 and the second contact element 50. The further contact element 55 is modified with respect to the first contact element 20 in that the outer diameter of the further contact element 55 is smaller compared to the first contact element 20. However, the functional design of the second contact element 50 and the further contact element 55 is identical to the functional design of the first contact element 20, so that the explanations given below in the context of the first contact element 20 also apply to the second contact element 50 and the further contact element 55. If there are any differences between the first contact element 20 and the second contact element 50, these will be specified below. In this regard, for example, the first contact element 20 and the second contact element 50 can serve to transmit direct current, while alternating current is transmitted by the further contact element 55.

[0037] The temperature measuring device 25 is arranged in the housing interior 35 of the contact housing 15. The temperature measuring device 25 has at least one circuit carrier 65. The circuit carrier 65 can be designed as a printed circuit board. It is particularly advantageous if the circuit carrier 65 is designed as an injection-molded circuit carrier, also commonly known as a molded integrated device (MID).

[0038] The temperature measuring device 25 has at least one interface 70. As shown in FIG. 1, the temperature measuring device 25 may have multiple interfaces 70, for example. The interfaces 70 can be electrically connected to an evaluation device of the vehicle. The interfaces 70 are arranged on an end face of the circuit carrier 65, facing the observer and the mating contacts 60. For example, the interface 70 has a contact device 90. The contact device 90 is designed to transmit a data signal.

[0039] FIG. 2 is a detailed plan view of the high current contact device 10 shown in FIG.

[0040] The circuit carrier 65 includes a first carrier 75. The first carrier 75 is electrically insulating and is composed of a first matrix material, such as a plastic, particularly a temperature stable plastic.

[0041] The first carrier 75 is designed to be flat at a first end face 80 facing the further high-current contact device 30. The first carrier 75 further has at least one reinforcing part 85 at the first end face 80, which is designed, for example, in the shape of a ring and protrudes above the first end face 80. It is particularly advantageous if a respective reinforcing part 85 is provided for each contact element 20, 50, 55. The interface 70 is also arranged at the first end face 80.

[0042] Furthermore, a separating web 95 of the first carrier 75 can be formed between the paired first contact elements 20 and second contact elements 50. The separating web 95 protrudes beyond the first end face 80 in the x-direction.

[0043] It is particularly advantageous if the first carrier 75, the reinforcement 85 and the separating web 95 are manufactured integrally from the same material, for example in an injection molding process.

[0044] The first carrier 75 has a respective feedthrough 100 for each contact element 20, 50, 55. The feedthroughs 100 are designed like bores. The feedthroughs 100 extend along the mating axis 45.

[0045] In an embodiment, the number of contact elements 20, 50, 55 corresponds to the number of feedthroughs 100. In this case, one of the contact elements 20, 50, 55 passes through each of the feedthroughs 100. The inner diameter of the feedthroughs 100 can be selected so that the contact elements 20, 50, 55 pass through their associated feedthroughs 100 with little radial clearance. In particular, the contact elements 20, 50, 55 can be pressed into the feedthroughs 100. The first carrier 75 mechanically holds each associated contact element 20, 50, 55 to the feedthroughs 100 by means of the reinforcement portions 85. Furthermore, the first carrier 75 electrically insulates the contact elements 20, 50, 55 from one another, and these contact elements are each positioned in the feedthroughs 100 offset from one another.

[0046] The temperature measuring device 25 comprises at least a first temperature sensor 105. By way of example, the temperature measuring device 25 comprises a second temperature sensor 106 for the second contact element 50. Further temperature sensors 107, 108 can be provided for the further contact elements 55 as well.

[0047] The first temperature sensor 105 and / or the second temperature sensor 106 and / or the further temperature sensor 107, 108 can be designed, for example, as an SMD component, in particular, for example, as an NTC element. The first temperature sensor 105 and / or the second temperature sensor 106 and / or the further temperature sensor 107, 108 are arranged, when viewed with respect to the mating axis 45, to be spaced radially outward from the associated first contact element 20 and / or second contact element 50 and / or further contact element 55, respectively.

[0048] The circuit carrier 65 has a first electrical connection 110 and preferably a second electrical connection 115. The first electrical connection 110 and the second electrical connection 115 are arranged on an end face of the first carrier 75. The first electrical connection 110 and the second electrical connection 115 electrically connect the first temperature sensor 105 to the interface 70. Furthermore, the circuit carrier 65 has a further electrical connection 116 that electrically connects the second temperature sensor 106 and the further temperature sensors 107 and 108 to the interface 70, respectively.

[0049] The first electrical connection 110, the second electrical connection 115 and / or the further electrical connection 116 are, for example, designed as traces of the first carrier 75. The first carrier 75 electrically insulates the electrical connections 110, 115, 116 from one another.

[0050] In an embodiment, the first electrical connection 110 and the second electrical connection 115 extend over the reinforcement 85 and the first end face 80 between the interface 70 and the first temperature sensor 105 so as to be offset parallel to each other without direct contact.

[0051] The first electrical connection 110, the second electrical connection 115, and the further electrical connection 116 may be manufactured by known manufacturing processes for producing injection molded circuit carriers (MIDs).

[0052] FIG. 3 is a diagram of the high current contact device 10 of FIG. 2, showing Detail A as labeled in FIG.

[0053] The descriptions given below for the first contact element 20 and the temperature measuring device 25 apply equally to the second contact element 50 and the further contact element 55 and to the second temperature sensor 106 and the further temperature sensors 107, 108.

[0054] In FIG. 3, the first temperature sensor 105 is arranged on the first carrier 75 at a radial distance from the first contact element 20 when viewed with respect to the mating axis 45 .

[0055] Each of the temperature sensors 105, 106, 107, 108 is thermally connected to a respective associated contact element 20, 50, 55 by an associated first thermally conductive path 120 of the temperature measuring device 25. In this regard, for example, the first temperature sensor 105 is thermally connected to the first contact element 20 by the first thermally conductive path 120 of the temperature measuring device 25.

[0056] The first heat conduction path 120 includes a first heat conduction element 125 and a second heat conduction element 130 that is partially covered by the first heat conduction element 125 in FIG. 3. The first heat conduction element 125 has a basic shape of a generally hollow cylinder. The first heat conduction element 125 extends substantially along the mating axis 45.

[0057] The first heat conducting element 125 has a contact surface 135 on an inner peripheral surface 131 of the first heat conducting element 125. At the contact surface 135, the first heat conducting element 125 abuts a first outer peripheral surface 140 of the first contact element 20 and is thermally connected to the first contact element 20.

[0058] The hollow cylindrical configuration of the first heat-conducting element 125 has the advantage that the contact surface 135 is designed to extend completely around the mating axis 45 on the inner circumferential surface 131 of the first heat-conducting element 125. The contact surface 135 therefore has a particularly large surface area. The contact surface 135 abuts over a large area against the first outer circumferential surface 140, and can seal the housing interior 35 at the first contact element 20 from the environment.

[0059] It is particularly advantageous here if the first heat conducting element 125 is made of an elastically deformable second matrix material, such as silicone and / or polyurethane and / or polyethylene and / or heat-resistant plastic, and can be reversibly elastically deformed, in particular stretched or crushed, by at least 10 percent, preferably at least 30 percent, and preferably at least 40 percent, without damaging the second matrix material.

[0060] The thermal conductivity of the second matrix material can be improved by embedding, for example, particulate filler materials in the second matrix material. Examples of filler materials include copper and / or aluminum and / or silver and / or aluminum oxide and / or aluminum nitrate and / or silicon oxide and / or silicon nitrate and / or boron and / or boron nitride and / or conductive metals and / or non-conductive, thermally conductive metal compounds, preferably based on iron or non-ferrous metals. The first heat conduction element 125 has a thermal conductivity of at least 0.3 W / (m·K) to 2 W / (m·K), particularly 0.3 W / (m·K) to 1.7 W / (m·K). Therefore, the first heat conduction path 120 has a thermal conductivity of approximately 0.5 to 400 W / (m·K). The second heat conduction element 130 is disposed on the end face of the reinforcing part 85, facing the additional high-current contact device 30. In particular here, the second heat-conducting element 130 is designed as a metallization layer 132 (included in the PCB diagram) which extends in the shape of a partial ring around the first contact element 20 when viewed with respect to the mating axis 45. The first temperature sensor 105 and the first and second electrical connections 110, 115 are arranged on the reinforcement part 85 in the region of a gap 145 in the second heat-conducting element 130. By means of the gap 145, an electrical connection between the first and second electrical connections 110, 115 and with the first temperature sensor 105 is prevented by the electrically insulating first carrier 75.

[0061] The second heat conducting element 130 is made of copper and / or aluminum. It is particularly advantageous if the metallization layer 132 has a layer thickness of 15 μm, preferably between 20 μm and 400 μm.

[0062] FIG. 4 is a cross-sectional view of the high current contact device 10 shown in FIG. 3 along section line BB shown in FIG.

[0063] The first heat conducting element 125 is arranged directly adjacent to the first carrier 75 in the region of the break 145. It is particularly advantageous here if the first heat conducting element 125 is connected to the first carrier 75 by a material fit. Radially inside (when viewed with respect to the fit axis 45), the first heat conducting element 125 is arranged adjacent to the feedthrough 100.

[0064] The first temperature sensor 105 is connected to the first matrix material of the first heat conducting element 125 by a material fit. It is particularly advantageous if the first temperature sensor 105 is embedded and molded into the first heat conducting element 125. Embedded in this case is understood to mean that the first temperature sensor 105 is almost completely surrounded in the circumferential direction by the first heat conducting element 125. This can be done, for example, by an injection molding procedure.

[0065] To prevent direct contact between the first contact element 20 and the second heat-conducting element 130, a (narrow) radial gap 150 can be provided between the second heat-conducting element 130 and the first outer circumferential surface 140, the radial gap 150 being filled by the first heat-conducting element 125. It is also possible for the second heat-conducting element 130 to reach radially inward substantially to the first outer circumferential surface 140 of the first contact element 20. Electrical contact between the second heat-conducting element 130 and the first temperature sensor 105 is prevented by the electrically insulating first carrier 75 and the gap 145.

[0066] In the axial direction when viewed with respect to the mating axis 45, the first heat conduction element 125 is designed to be significantly wider than the second heat conduction element 130. For example, in the axial direction, the first heat conduction element 125 has an extent that corresponds to at least half the radial extent of the first contact element 20 in the area of ​​the first heat conduction element 125. It is particularly advantageous if the axial extent is no more than three times the radial extent of the first contact element 20 in the area of ​​the heat conduction element 125. This configuration has the advantage that good thermal contact between the first heat conduction element 125 and the first contact element 20 can be ensured as well as good mechanical rigidity of the first heat conduction element 125.

[0067] The first contact element 20 heats up when electrical energy (e.g., 10 kW to 300 kW) with a high current (e.g., 30 A to 500 A) is transmitted through the high-current contact device 10 and the further high-current contact device 30. To measure the temperature of the first contact element 20, a portion of the heat from the first contact element 20 is dispersed to the contact surface 135 via the first outer peripheral surface 140, and the heated first contact element 20 heats the first heat-conducting element 125. The heat flow is symbolically indicated by arrows in FIGS. 3 and 4. Due to the good thermal conductivity of the first heat-conducting element 125, the first heat-conducting element 125 transfers a first portion of the dispersed heat to the second heat-conducting element 130. The second portion is then transferred directly to the first temperature sensor 105 embedded in the first heat-conducting element 125 via the first heat-conducting element 125.

[0068] By configuring the second heat-conducting element 130 in the shape of a partial ring, the first portion absorbed by the second heat-conducting element 130 is conducted around the first contact element 20 towards the gap 145. At the gap 145, the first portion is returned by the second heat-conducting element 130 to the first heat-conducting element 125. Due to the relatively high thermal conductivity of the second heat-conducting element 130, the first portion of the heat is conducted particularly quickly towards the gap 145.

[0069] Because the gap 145 is designed to be narrow so as to accommodate only the first temperature sensor 105 and the first electrical connection 110 and the second electrical connection 115, the thermal path between the end of the gap 145 in the second heat conduction element 130 and the first temperature sensor 105 via the first heat conduction element 125 is particularly short.

[0070] 1 to 4 has the advantage that the first temperature sensor 105 is thermally coupled in a particularly effective manner to the first contact element 20 via the first thermal conduction path 120. The temperature measuring device 25 is therefore particularly suitable for dynamically determining the temperature of the first contact element 20.

[0071] By embedding the first temperature sensor 105 in the first heat-conducting element 125, the first temperature sensor 105 measures the temperature of the first contact element 20 particularly accurately. The first temperature sensor 105 provides information about the measured temperature of the first contact element 20 to the interface 70 via the first electrical connection 110 and the second electrical connection 115. The first information can be taken into account by an evaluation device when controlling electrical energy, for example, when controlling the charging current or the drive current, and the evaluation device is designed, for example, to be integrated into a vehicle control device. In particular, thermal loads on the high-current contact device 10, 30 can be prevented by fast and dynamic measurement of the temperature of the first contact element 20.

[0072] 1 and 2, the temperature measuring device 25 measures the temperatures of the second contact element 50 and the further contact element 55, respectively. The temperature sensors 106, 107 each provide the corresponding measured temperature as second information to the interface 70.

[0073] FIG. 5 is a perspective view of the first heat conducting element 125 of the high current contact device 10 shown in FIGS.

[0074] The first heat conduction element 125, for example, has at least one, preferably several, first support webs 155 arranged offset from one another in the circumferential direction when viewed with respect to the mating axis 45. The first support webs 155 extend linearly along the mating axis 45 and have a substantially constant cross section in the axial direction when viewed with respect to the mating axis 45. The first support webs 155 extend from the radially inner side to the radially outer side. In this case, the first support webs 155 are arranged radially on a side of the first heat conduction element 125 remote from the contact surface 135 when viewed with respect to the mating axis 45. The remote side corresponds to a second outer peripheral surface 160 of the first heat conduction element 125.

[0075] Furthermore, the second support web 165, which is arranged circumferentially offset from the other first support web 155, is designed to be wider in the circumferential direction than the first support web 155. The second support web 165 overlaps the gap 145 in the axial direction, and the first temperature sensor 105 is embedded in the second support web 165. Overlapping is understood to mean that two parts, for example the gap 145 and the second support web 165, project in the axial direction in a projecting plane perpendicular to the mating axis 45, so that these parts overlap each other at the projecting plane. In this case, the second support web 165 can be designed to be wider than the first support web 155 both in the radial direction and in the circumferential direction.

[0076] The mechanical function of the support webs 155, 165 is to ensure that the first heat-conducting element 125 is designed to be particularly stable. In particular, the first heat-conducting element 125 is not destroyed when the first contact element 20 is inserted into the feedthrough 100 and the first heat-conducting element 125. Furthermore, the large outer surface of the first heat-conducting element 125 allows heat to be released particularly quickly into the environment of the first heat-conducting element 125 during cooling, for example, due to a reduction in the electrical energy transmitted through the first contact element 20. Therefore, the temperature of the contact elements 20, 50, 55 can also be measured particularly accurately by the temperature sensors 105, 106, 107, 108 when the transmitted electrical energy is reduced.

[0077] It is particularly advantageous that in the disassembled state of the contact elements 20, 50, 55, the contact surface 135 has a smaller radial extent, as viewed in relation to the mating axis 45, than the first outer peripheral surface 140 of the contact elements 20, 50, 55. When the contact elements 20, 50, 55 are inserted into the feedthrough 100 during assembly of the high-current contact device 10, the contact elements 20, 50, 55 expand, undergo elastic deformation and are particularly subjected to tension. When the contact elements 20, 50, 55 are in their final position, the pre-tensioned first heat-conducting element 125 exerts a radially inward tension force F on the side of the mating axis 45. s , pressing the contact surface 135 against the first outer peripheral surface 140. This ensures particularly good thermal contact between the first heat-conducting element 125 and the contact elements 20, 50, 55. Furthermore, this ensures that the housing interior 35 is sealed at the contact elements 20, 50, 55 by the first heat-conducting element 125.

[0078] FIG. 6 is a perspective view of a high-current contact device 10 according to a second embodiment.

[0079] The high current contact device 10 is designed substantially identically to the high current contact device 10 shown in Figures 1 to 5. Only the differences of the high current contact device 10 shown in Figure 6 compared to the high current contact device 10 shown in Figures 1 to 5 will be described below.

[0080] For clarity, the contact housing 15 is only indicated schematically by dashed lines in Figure 6. The number of contact elements 20, 50, 55 shown is reduced compared to the first embodiment shown in Figures 1 to 5. Furthermore, by way of example, the contact elements 20, 50, 55 are designed identically to one another. By way of example, the contact elements 20, 50, 55 are designed, for example, as pin contacts.

[0081] By way of example, the circuit carrier 65 is designed as a printed circuit board and is screwed into the contact housing 15. To ensure the axial position of the contact elements 20, 50, 55 with respect to the mating axis 45, the high-current contact device 10 has contact fixing means 170. The contact fixing means 170 can be designed, for example, as a secondary contact fixing means.

[0082] The contact fixing means 170 has a second carrier 175, which is designed to be substantially planar in a sub-region 176 facing the observer and the contact regions 305 of the contact elements 20, 50, 55 and extends in the yz-plane. The contact elements 20, 50, 55 establish electrical contact with the corresponding mating contacts 60 via the contact regions 305. The second carrier 175 is displaceable along a displacement axis 195 between a first position and a second position. The second position is shown in FIG. 6 and corresponds to the locked position. In the second position, the second carrier 175 prevents the contact elements 20, 50, 55 from being disengaged or displaced axially relative to the mating axis 45.

[0083] To fasten the second carrier 175, in the second position the second carrier 175 can be screwed onto the contact housing, for example by means of a threaded connection 180. Latching means 185, for example latching lugs, can further be provided on the second carrier 175, which are, for example, designed to engage in recesses in the contact housing 15 to fasten the second carrier 175 to the contact housing 15 in the second position (locked position).

[0084] 1-5, the second carrier 175 has a feedthrough 100. In an embodiment, the feedthrough 100 extends along a displacement axis 195. By way of example, the displacement axis 195 is aligned parallel to the z-axis.

[0085] The feedthroughs 100 can be designed, for example, in the shape of an elongated hole or can be designed to be open on one side in the z-direction. The feedthroughs 100 have a feedthrough contour 200. One contact element 20, 50, 55 is arranged in each feedthrough 100, and each contact element 20, 50, 55 passes through the feedthrough 100 in the x-direction.

[0086] In the assembled state of the high-current contact device 10, the first end face 80 of the first carrier 75 faces the second end face 205 of the second carrier 175. In Figure 6, the second end face 205 is located on the side of the second carrier 175 that is away from the viewer. The first end face 80 and the second end face 205 can be designed to be substantially planar in at least some areas.

[0087] FIG. 7 is a side view of the high current contact device 10 shown in FIG.

[0088] In an embodiment, the interface 70 is located at a third end face 210 of the first carrier 75. A fourth end face 215 of the second carrier 175 is located away from the first carrier 75. The fourth end face 215 is designed to be substantially planar in the area of ​​the contact elements 20, 50, 55 and possibly in a sub-area 176.

[0089] FIG. 8 is a cross-sectional view of the high current contact device 10 shown in FIGS. 6 and 7 along section CC shown in FIG.

[0090] For clarity, non-sectional components of the high current contact device 10 are not included in the illustration.

[0091] The second carrier 175 defines at least one receptacle 220. For example, the receptacle 220 is designed as a blind hole in the second carrier 175. In this case, the receptacle 220 is designed to be open at the fourth end face 215 and closed at the second end face 205. Preferably, a respective receptacle 220 is arranged in the second carrier 175 for each contact element 20, 50, 55. A first heat conduction element 125 is arranged in each receptacle 220.

[0092] In an embodiment, the first heat conducting element 125 is designed as a solid body, in particular as a cylinder. It is particularly advantageous if the first heat conducting element 125 is fastened to the receptacle 220 at least partially by form-fitting, for example by an undercut, so that the second outer peripheral surface 160 can establish a friction fit with the receptacle 220, connecting the first heat conducting element 125 to the second carrier 175 by means of the friction fit. The contact surface 135 is arranged on the second outer peripheral surface 160 of the first heat conducting element 125.

[0093] By way of example, the first heat conducting element 125 may be designed to be axially shorter than the receptacle 220 when viewed with respect to the mating axis 45 .

[0094] The first contact element 20 preferably has a groove 230 designed to extend in the circumferential direction, the groove 230 having approximately the same axial width in the axial direction as the second carrier 175 at the groove 230. The groove 230 has a groove base 245 laterally defined by groove flanks 250.

[0095] FIG. 9 is a detailed view of the second carrier 175 shown in FIGS.

[0096] The receptacle 220 is adjacent to the feedthrough 100. In this case, the receptacle 220 is positioned in the second carrier 175 so that the receptacle 220 opens laterally into the feedthrough 100. In this case, the receptacle 220 and the feedthrough profile 200 are contiguous.

[0097] The second carrier 175 has an engagement portion 225 adjacent to the feedthrough contour 200. The second carrier 175 can be designed in the shape of a plate at least at the engagement portion 225. The engagement portion 225 is preferably adjacent to the receptacle 220 so as to be directly adjacent to the receptacle 220.

[0098] FIG. 10 is a plan view of the high current contact device 10 shown in FIGS. 6 to 9, with the contact securing means 170 in a first position.

[0099] In the first position, the engagement portion 225 (shown in dashed lines in FIG. 10) is positioned so as to be spaced apart from the contact elements 20, 50, 55. Furthermore, the second carrier 175 and the circuit carrier 65 are positioned so as to generally overlap one another.

[0100] When the first heat-conducting element 125 is assembled in the receptacle 220, the first portion 235 is arranged in the receptacle 220. The second portion 240 of the first heat-conducting element 125 protrudes from the receptacle 220 into the feedthrough 100. In the circumferential direction, the contact surface 135 is arranged on the second portion 240. In this case, the second portion 240 may be designed in the shape of a circular arc, as shown by the dashed line in FIG. 10 .

[0101] FIG. 11 is a plan view of the configuration of the high-current contact device 10 shown in FIGS.

[0102] In contrast to the configuration of Fig. 10, in Fig. 11 the contact fixing means 170 is placed in a second position, which means that the second carrier 175 is separated from the circuit carrier 65. In this case, the engagement portion 225 engages with the groove 230 of the contact element 20, 50, 55, and the second end face 205 and / or the fourth end face 215 abuts or butts against one of the groove side faces 250 of the groove 230, thereby preventing movement of the contact element 20, 50, 55 in the x-direction.

[0103] When the contact fastening means 170, and therefore the engagement portion 225, is inserted into the groove 230, the first heat conducting element 125 also moves together with the second carrier 175. In this case, the first heat conducting element 125 is introduced into the groove 230, and the first heat conducting element 125 is pressed into the groove 230. This ensures that the contact surface 135 abuts particularly firmly against the groove base 245, thereby ensuring particularly good thermal contact between the first heat conducting element 125 and the contact element 20, 50, 55.

[0104] The elastic deformation of the first heat conducting elements 125 also allows the first heat conducting elements 125 to abut with their end faces against the groove side surfaces 250 of the grooves 230. The surface for heat transfer between the contact elements 20, 50, 55 and the respective associated first heat conducting elements 125 is therefore particularly large, resulting in a particularly low thermal contact resistance between the contact elements 20, 50, 55 and the first heat conducting elements 125.

[0105] FIG. 12 is a plan view of the temperature measuring device 25 of the high-current contact device 10 of FIGS. 6 to 11, with the contact fixing means in a second position.

[0106] The temperature sensors 105, 106, 107, 108 are arranged, for example, inwardly relative to the third end face 210 of the first carrier 75. Each of the temperature sensors 105, 106, 107, 108 is electrically connected to the interface 70. This configuration has the advantage that the high-current contact device 10 is compact, particularly laterally.

[0107] The first carrier 75 further includes a second heat-conducting element 130. The second heat-conducting element 130 is designed to be integrated into the circuit carrier 65. In this case, the circuit carrier 65 may be designed, for example, as a multilayer printed circuit board, and the second heat-conducting element 130 is formed from at least one metallization layer 132 on the first carrier 75 or at least one metallization layer 132 in the second carrier 175. The metallization layer 132 may have a layer thickness of 15 μm to 400 μm. The metallization layer 132 may be made of, for example, copper and / or aluminum and is designed to be thermally conductive.

[0108] FIG. 13 is a cross-sectional view of the high current contact device 10 shown in FIG. 12 along section DD shown in FIG.

[0109] The second heat-conducting element 130 terminates at the feedthrough contour 200. The second heat-conducting element 130 has a first thermal coupling surface 255 on a side of the circuit carrier 65. The first thermal coupling surface 255 is disposed at an angle, preferably perpendicular, to the third end surface 210 of the circuit carrier 65.

[0110] The second heat conducting element 130 is thermally coupled to the first temperature sensor 105 on the side remote from the first thermal coupling surface 255 .

[0111] FIG. 14 is a detailed cross-sectional view of the high current contact device 10 shown in FIG. 8 along section EE shown in FIG.

[0112] In the second position of the contact fixing means, the first heat conducting element 125 is pressed by the contact surface 135 against the first thermal coupling surface 255, so that the contact surface 135 and the first thermal coupling surface 255 are thermally connected to each other. The first heat conducting element 125 abuts the groove 230.

[0113] FIG. 15 is a side view of the high-current contact device 10 shown in FIGS.

[0114] For ease of understanding, only the first contact element 20, the first heat-conducting element 125, and the circuit carrier 65 are shown in FIG.

[0115] In the assembled state, the first heat conducting element 125 contacts the first carrier 75 in the area of ​​the first thermal coupling surface 255. In this case, the first heat conducting element 125 can be elastically deformed.

[0116] In particular, the contact surface 135 is pressed against the first thermal coupling surface 255, thereby maintaining a particularly low thermal contact resistance between the first heat conducting element 125 and the second heat conducting element 130. Thus, the thermal resistance of the first electrical heat conducting path 120 is particularly low.

[0117] In essence, the first thermal conduction path 120 is closed in the second position and the first thermal conduction path 120 is open in the first position.

[0118] The description given with respect to the first temperature sensor 105 equally applies to the second temperature sensor 106 and the further temperature sensors 107, 108, which are in this case thermally connected to the associated contact elements 50, 55 via their associated first thermal conduction paths 120.

[0119] 1-5, the contact elements 20, 50, 55 heat up during operation of the high current contact device 10. Due to the thermal coupling and good thermal conductivity of both the first heat conduction element 125 and the second heat conduction element 130 formed from the metallization layer 132, the temperature of each associated contact element 20, 50, 55 can be accurately and dynamically measured by the temperature sensors 105, 106, 107, 108. In particular, temperature measurement of the respective contact element also allows overheating of one of the contact elements 20, 50, 55 to be detected, for example in case of damage and / or corrosion of one of the contact elements 20, 50, 55.

[0120] By incorporating the first heat conducting element 125 into the contact fixing means 170, the temperature sensors 105, 106, 107, 108 can be positioned at a distance from the contact elements 20, 50, 55, and the temperature difference between the temperature measured by the temperature sensors 105, 106, 107, 108 and the actual temperature of the contact elements 20, 50, 55 is particularly small due to the above-mentioned configuration of the high current contact device.

[0121] Furthermore, the particularly good thermal conductivity of the heat conduction path 120 results in a particularly small time delay in measuring the temperature increase or decrease of the contact elements 20, 50, 55, which means that the temperature measuring device 25 shown in Figures 7 to 13 is also particularly suitable for determining the temperature of the contact elements 20, 50, 55 in the case of dynamic loads, for example in the case of AC loads. Thermal overloads of the contact elements 20, 50, 55 can therefore also be detected particularly quickly and reliably at an early stage.

[0122] FIG. 16 is a perspective view of a circuit carrier 65 of a high-current contact device 10 according to a third embodiment.

[0123] The high-current contact device 10 is designed substantially identically to the high-current contact device 10 shown in Figures 6 to 15. Only the differences of the high-current contact device 10 shown in Figure 16 or its temperature measuring device 25 compared to the configuration of the high-current contact device 10 according to the second embodiment shown in Figures 6 to 15 will be described below.

[0124] In the embodiment, the temperature measuring device 25 only has the first temperature sensor 105. The further temperature sensors 106, 107, 108 are omitted. Furthermore, the second heat conducting element 130 has a second thermal coupling surface 260 in addition to the first thermal coupling surface 255.

[0125] The second thermal coupling surface 260 is likewise arranged laterally of the second carrier 175 and therefore at an angle, preferably perpendicular, to the third end face 210 of the second carrier 75. In an embodiment, the first temperature sensor 105 is arranged approximately centrally with respect to the arrangement of the four contact elements 20, 50, 55. In this case, the first thermal coupling surface 255 and the second thermal coupling surface 260 can preferably be aligned parallel to one another. Here, it is particularly advantageous if the first thermal coupling surface 255 and the second thermal coupling surface 260 extend in the xz plane. Furthermore, by way of example, the first thermal coupling surface 255 and / or the second thermal coupling surface 260 are designed to be planar. It is also conceivable to form the first thermal coupling surface 255 and / or the second thermal coupling surface 260 concavely or convexly.

[0126] FIG. 17 is a plan view of the temperature measuring device 25 of the high-current contact device 10 shown in FIG.

[0127] The second heat conduction element 130 has a generally V-shaped configuration with two limbs 270, 275. The second heat conduction element 130 thermally connects the first thermal coupling surface 255 to the second thermal coupling surface 260. Different configurations of the second heat conduction element 130 are also possible. In this regard, the second heat conduction element 130 may be designed to be arc-shaped, U-shaped, or linear.

[0128] The second heat-conducting element 130 has an extraction surface 265. The extraction surface 265 can be arranged, for example, on the third end surface 210 of the circuit carrier 65. In FIG. 17 , the extraction surface is arranged near the branching point of the limbs 270, 275 of the second heat-conducting element 130. Different arrangements of the extraction surface 265 are also conceivable. At the extraction surface 265, the first temperature sensor 105 abuts the second heat-conducting element 130 and is thermally connected to the second heat-conducting element 130. Furthermore, a thermally conductive material, for example a thermally conductive paste, can be arranged between the first temperature sensor 105 and the extraction surface 265 to ensure a particularly good thermal connection between the first temperature sensor 105 and the extraction surface 265.

[0129] The second heat conducting element 130 thermally couples the first heat conducting element 125, which abuts the first contact element 20 in the assembled state, and the first heat conducting element 125, which abuts the second contact element 50 in the assembled state, to the first temperature sensor 105. This configuration has the advantage of reducing the number of temperature sensors 105, 106, 107, 108 compared to the configurations shown in Figures 1 to 15.

[0130] Furthermore, the temperature measuring device 25 may have a second heat conduction path 285. As an example, in Fig. 17, the second heat conduction path 285 is designed to be mirror symmetrical with respect to a symmetry plane 280, which is designed as an xz plane centered with respect to the circuit carrier 65. The second heat conduction path 285 may also be designed differently from that shown in Fig. 17. In particular, the second heat conduction path 285 may be designed differently from the first heat conduction path 120.

[0131] The second heat conduction path 285 has a third heat conduction element 290 and a fourth heat conduction element 295. In this case, the number of third heat conduction elements 290 approximately corresponds to the number of further contact elements 55. By way of example, the third heat conduction element 290 is designed identically to the first heat conduction element 125 as a solid body and is composed of both the first matrix material and the filler material, so that the third heat conduction element 290 has particularly good thermal conductivity.

[0132] The fourth heat conducting element 295 is designed as a metallization layer of the circuit carrier 65. The fourth heat conducting element 295 also has a configuration designed, for example, in a V-shape, and a further extraction surface 300 is arranged on the third end face 210 at the apex of the fourth heat conducting element 295. The first temperature sensor 105 is arranged on the further extraction surface 300, which is arranged so as to be spaced apart from the extraction surface 265 in the y-direction by a gap, and is thermally connected to the further extraction surface 300.

[0133] In the second position of the contact fastening means 170, the third heat conducting element 290 abuts against the further contact element 55 and is thermally coupled to the further contact element 55. Furthermore, the fourth heat conducting element 295 is pressed laterally against the contact surface 135 of the third heat conducting element 290 by means of its respective third heat conducting surface. The fourth heat conducting element 295 is therefore thermally connected to the further contact element 55. The fourth heat conducting element 295 thermally connects the third heat conducting element 290 to the further extraction surface 300.

[0134] Thus, the first temperature sensor 105 is connected to all of the contact elements 20 , 50 , 55 via the first thermally conductive path 120 and the second thermally conductive path 285 .

[0135] 17, the heat transfer from the contact elements 20, 50, 55 to the first temperature sensor 105 is shown by dashed lines. When electrical energy is transferred through one of the contact elements 20, 50, 55, the respective contact element 20, 50, 55 heats up.

[0136] 17, the four contact elements 20, 50, 55 can carry three-phase current, where three of the contact elements 20, 50, 55 can be connected to respective outer conductors L1, L2, L3, and one of the contact elements 20, 50, 55 can be connected to the ground conductor N.

[0137] The heated first and second contact elements 20 and 50 heat the respective first heat-conducting elements 125 that abut the associated first and second contact elements 20 and 50. The first heat-conducting elements 125 transfer heat to the second heat-conducting element 130 via the first thermal coupling surface 255. The metallic material of the second heat-conducting element 130 makes it particularly thermally conductive and transfers heat particularly quickly from the first heat-conducting element 125 to the extraction surface 265 for the temperature sensor 105.

[0138] A second heat conduction path 285 couples the further contact element 55 to the first temperature sensor 105. In this case, heat from the heated further contact element 55 is conducted to a fourth heat conduction element 295 via a third heat conduction element 290 abutting the further contact element 55. The fourth heat conduction element 295 conducts heat to a further extraction surface 300 to which the first temperature sensor 105 is thermally connected to the fourth heat conduction element 295.

[0139] The first temperature sensor 105 measures the temperature applied to the extraction surface 265 and / or the further extraction surface 300 and provides corresponding information about the measured temperature to the interface 70 .

[0140] In this case, the first temperature sensor 105 will substantially always measure the temperature of the hottest contact element 20, 50, 55.

[0141] This configuration has the advantage that the third embodiment shown in Figures 16 and 17 is particularly cost-effective due to the reduced number of temperature sensors compared to the embodiment shown in Figures 1 to 15. Furthermore, despite the reduced number of temperature sensors, the temperature of the contact elements 20, 50, 55 can be monitored particularly accurately and dynamically.

[0142] FIG. 18 is a perspective view of a high-current contact device 10 according to a fourth embodiment.

[0143] The high current contact device 10 is designed substantially identically to the high current contact device 10 shown in Figures 6 to 15. Only the differences of the fourth embodiment of the high current contact device 10 shown in Figure 18 compared to the high current contact device 10 shown in Figures 6 to 15 will be described below.

[0144] The circuit carrier 65 and the second carrier 175 shown in Figures 6 to 15 are designed as an integrated circuit carrier 310 in Figure 18. In this case, by way of example, the first carrier 75 and the second carrier 175 are designed integrally from the same material. The traces of the circuit carrier 65 are designed, for example, as a metallization layer of the integrated circuit carrier 310. Here, it is particularly advantageous if the integrated circuit carrier 310 is designed, for example, as an injection-molded circuit carrier (also known as a molded integrated device, abbreviated as MID).

[0145] This configuration has the advantage that the two-part structure of the contact fixing means 170 of the circuit carrier 65 as shown in FIGS. 6 to 15 can be omitted.

[0146] FIG. 19 is a side view of the high current contact device 10 shown in FIG.

[0147] In an embodiment, the interface 70 is illustratively located on the side of the contact elements 20, 50, 55 away from the contact area 305. In this case, the interface 70 may be located on the integrated circuit carrier 310.

[0148] FIG. 20 is a rear view of the high current contact device 10 shown in FIGS.

[0149] For clarity, the traces on the integrated circuit carrier 310 have been omitted from Figure 20. In an embodiment, each contact element 20, 50, 55 is thermally connected to its associated temperature sensor 105, 106, 107, 108, respectively, via a first thermal conduction path 120. In contrast to the configuration as a metallization layer shown in Figures 6-15, a second thermal conduction element 130 is formed on or within the aggregate carrier 310 and thermally couples each of the temperature sensors 105, 106, 107, 108 to the first thermal conduction element 125, respectively.

[0150] This configuration has the advantage that the assembly force for displacing the contact fixing means 170 from the first position to the second position and assembling the contact fixing means 170 to the contact elements 20, 50, 55 is approximately half compared to the configurations shown in Figures 6 to 15, since the first heat conducting elements 125 are only pressed against their associated contact elements 20, 50, 55 and no pressing occurs when sliding the contact fixing means 170 onto the second heat conducting element 130.

[0151] 18 to 20 has the further advantage that the high-current contact device 10 can be designed in a particularly simple and cost-effective manner, due to the reduced number of parts provided by the integrated circuit carrier 310. Furthermore, the geometry of the integrated circuit carrier 310 can be designed almost freely.

[0152] Furthermore, the temperature sensors 105, 106, 107, 108 can be positioned in a thermally optimal manner, preferably as close as possible to the associated contact elements 20, 50, 55.

[0153] Furthermore, the embodiment shown in Figures 18 to 20 can be combined with the third embodiment shown in Figures 15 to 17. Furthermore, further electrical components, for example LEDs, can be positioned in / on the integrated circuit carrier. The components and / or temperature sensors 105, 106, 107, 108 can be soldered to the electrical connections 110, 115, 116. For this purpose, for example, a reflow process can be used. The temperature sensors 105, 106, 107, 108 can also be electrically and mechanically connected to the electrical connections 110, 115, 116 by means of a conductive adhesive, for example a silver conductive adhesive. [Explanation of symbols]

[0154] 10 High Current Contact Device 15 Contact housing 20 First Contact Element 25 Temperature measuring devices 30 Further high current contact devices 35 Inside the housing 40 High Current Cable 45 Mating shaft 50 Second Contact Element 55 Further Contact Elements 60 Counterpart Contact 65 Circuit Carrier 70 Interface 75 First Career 80 First end face 85 Reinforcement 90 Contact Devices 95 Separation Web 100 Feedthrough 105 First temperature sensor 106 Second temperature sensor 107 More Temperature Sensors 110 first electrical connection part 115 second electrical connection 116 Further Electrical Connections 120 First heat conduction path 125 First Heat Conduction Element 130 Second heat transfer element 131 Inner peripheral surface 132 Metallized layer 135 Contact surface 140 first outer peripheral surface 145 Break 150 Radial clearance 155 First Support Web 160 Second outer peripheral surface 165 Second Support Web 170 Contact fixing means 175 Second Career 176 sub-areas 180 threaded connection 185 Latching means 186 Guide Elements 190 Guide surface 195 Displacement axis 200 Feedthrough Contours 205 Second end face 210 Third end face 215 Fourth End 220 Receptacle 225 Engagement part 230 Groove 235 First Part 240 Second Part 245 Groove base 250 groove side 255 First thermal bonding surface 260 Second thermal bonding surface 265 Extraction surface 270 First Limb 275 Second Limb 280 Symmetry Plane 285 Second Heat Conduction Path 290 Third Heat Conduction Element 295 Fourth Heat Conduction Element 300 additional extraction surface 305 Contact area 310 Integrated Circuit Carrier

Claims

1. A high current contact device (10) for transmitting electrical energy, said high current contact device (10) comprising: a contact housing (15), - at least a first contact element (20) arranged in said contact housing (15); - a temperature measuring device (25), The first contact element (20) extends at least in some portions along a mating axis (45); The temperature measuring device (25) has at least one circuit carrier (65, 310) including a first temperature sensor (105) and a first heat conducting path (120); the first temperature sensor (105) is disposed on the circuit carrier (65, 310), the circuit carrier (65, 310) being disposed laterally adjacent to the first contact element (20); the first heat conduction path (120) comprises a resilient and thermally conductive first heat conduction element (125) including a contact surface (135); The contact surface (135) abuts against a first outer peripheral surface (140) of the first contact element (20); the first heat conducting element (125) thermally couples the first contact element (20) to the first temperature sensor (105); The first temperature sensor (105) is designed to measure the temperature of the first contact element (20); The first heat conducting element (125) has at least one support web (155); the support web (155) extends from the radially inner side to the radially outer side and is disposed on a side of the first heat conducting element (125) away from the contact surface (135) when viewed radially with respect to the mating axis (45). High current contact device.

2. the first heat conducting element (125) is pressed against the first outer peripheral surface (140) by a first of the contact surfaces (135); the first heat conducting element (125) exhibits elastic deformation at least in an area adjacent to the contact surface (135); The high current contact device (10) of claim 1.

3. the circuit carrier (65, 310) has a feedthrough (100); The first contact element (20) passes through the feedthrough (100); the first heat conducting element (125) is disposed adjacent to the feedthrough (100) on the circuit carrier (65, 310); the first heat conducting element (125) is connected to the circuit carrier (65, 310) by a material fit; A high current contact device (10) according to claim 1 or 2.

4. said first heat conducting element (125) is designed in the shape of a ring or a hollow cylinder; the contact surface (135) is disposed on an inner circumferential surface of the first heat conducting element (125) so as to extend continuously around the mating axis (45); the contact surface (135) sealingly abuts the first outer peripheral surface (140) of the first contact element (20); A high current contact device (10) according to any one of claims 1 to 3.

5. The first heat conduction element (125) has, as the support web (155), a plurality of support webs (155) arranged circumferentially offset from one another when viewed with respect to the fitting axis (45). A high current contact device (10) according to any one of claims 1 to 4.

6. the first temperature sensor (105) is connected to the first heat conducting element (125) by a material fit; or the first temperature sensor (105) is embedded in the first heat conducting element (125); A high current contact device (10) according to any one of claims 1 to 5.

7. the first heat conduction path (120) has a second heat conduction element (130) disposed on the circuit carrier (65, 310); the second heat conducting element (130) has at least one metallization layer (132) on and / or within the circuit carrier (65, 310); the second heat conducting element (130) is thermally coupled to the first temperature sensor (105), in particular abutting the first temperature sensor (105) at a first end thereof; the second heat conducting element (130) thermally connects the first heat conducting element (125) to the first temperature sensor (105); A high current contact device (10) according to any one of claims 1 to 6.

8. the second heat-conducting element (130) has a thermal coupling surface (255, 260) on a side of the circuit carrier (65, 310) for contacting the first heat-conducting element (125); the thermal coupling surface (255, 260) of the second heat conducting element (130) is disposed at an angle or perpendicular to the end surface (80) of the circuit carrier (65, 310); The high current contact device (10) of claim 7.

9. the feedthrough (100) is designed as a bore and the second heat conducting element (130) is designed in the shape of at least a partial ring around the feedthrough (100); A high current contact device (10) according to claim 7 or claim 8 when dependent on claim 3.

10. the first heat conducting element (125) is made of at least one matrix material including at least silicone and / or polyethylene and / or polyurethane; At least one of the following filler materials is embedded in the matrix material: aluminum oxide, aluminum nitrate, silicon oxide, silicon nitrate, boron, conductive metals, ferrous or non-ferrous metal based non-conductive and thermally conductive metal compounds; A high current contact device (10) according to any one of claims 1 to 9.

11. The second heat conduction element (130) is made of aluminum and / or copper. The high current contact device (10) of claim 7.

12. a contact fixing means (170) including a carrier (175) displaceable between a first position and a second position; In the first position, the carrier (175) is positioned to be spaced from the engagement portion (225) to release the first contact element (20), and in the second position, the carrier (175) secures the first contact element (20) to prevent it from being removed; the first heat conducting element (125) is fastened to the carrier (175); In the first position, the first heat conducting element (125) is spaced apart from the first outer peripheral surface (140) of the first contact element (20); In the second position, the contact surface (135) abuts the first outer peripheral surface (140) and is thermally connected to the first outer peripheral surface (140). A high current contact device (10) according to any one of claims 1 to 11.

13. The carrier (175) has a receptacle (220); the receptacle (220) is positioned adjacent to a feedthrough (100) of the circuit carrier (65, 310); the first heat conducting element (125) is positioned with a first portion (235) within the receptacle (220); the first heat conducting element (125) protrudes from the receptacle (220) into the feedthrough (100) by a second portion (240); The contact surface (135) is disposed on the second portion (240). The high current contact device (10) of claim 12.

14. The high current contact device (10) has at least one second contact element (50), The second contact element (50) is arranged offset from the first contact element (20) and offset in a direction perpendicular to the mating axis (45); The temperature measuring device (25) has a second heat conduction path (285); the second thermally conductive path (285) thermally connects the first temperature sensor (105) to the second contact element (50); A high current contact device (10) according to any one of claims 1 to 13.

15. The circuit carrier (65, 310) is designed as a printed circuit board or an injection-molded circuit carrier (65, 310). A high current contact device (10) according to any one of claims 1 to 14.

16. said first heat conducting element (125) is designed in the shape of a cylinder or as a solid body; the contact surface (135) of the first heat conduction element (125) is disposed on a second outer circumferential surface (160) of the first heat conduction element (125); A high current contact device (10) according to any one of the preceding claims.

Images