Fluid supply device and gas supply method

Abstract

To attain space saving by efficiently disposing a plurality of flow passages and a gas control apparatus in a gas supply system for supplying a heat conductive gas to an adsorption surface of an electrostatic chuck device.SOLUTION: The present invention relates to a fluid supply device configured to supply a heat conductive gas to an adsorption surface of an electrostatic chuck device and comprising a block body in which a plurality of flow passages are formed, a gas control apparatus being provided in the middle and the flow passages being configured to control the heat conductive gas flowing inside. In the fluid supply device, the plurality of flow passages are formed to constitute a double layer structure inside of the block body. In the plurality of flow passages, a plurality of gas supply passages supplying the heat conductive gas to the adsorption surface are formed to constitute one layer in the double layer structure. An exhaust passage exhausting the heat conductive gas in the plurality of gas supply passages is formed to constitute the other layer in the double layer structure.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a fluid supply device used in a gas supply system for an electrostatic chuck device and a gas supply method using the same. [Background technology]

[0002] Conventionally, in semiconductor manufacturing processes using plasma processing equipment such as plasma etching equipment and plasma CVD equipment, electrostatic chuck devices are used to secure samples such as silicon wafers in vacuum chambers. These electrostatic chuck devices include a chucking plate that attracts the target object using electrostatic force and a metal base plate that contacts the back surface of the chucking plate. By using the electrostatic chuck device to attract the back surface (attached surface) of the silicon wafer with the chucking plate, the silicon wafer is secured in place and, for example, plasma heat applied to the silicon wafer is dissipated to the base plate side for cooling, thereby achieving a uniform surface temperature distribution.

[0003] The chucking surface of the chucking plate and the attracted surface of the silicon wafer have minute irregularities. Therefore, even when the silicon wafer is chucked by an electrostatic chuck device, a minute space of about 10 μm thick is created between the attracted surface and the attracted surface. This reduces the physical contact area and reduces the efficiency of heat conduction. Therefore, a gas supply system with multiple gas supply ports on the chucking surface of the chucking plate is used to supply a thermally conductive gas (so-called backside gas) into the space between the attracted surface of the silicon wafer and the attracting surface of the chucking plate, thereby efficiently dissipating the plasma heat applied to the silicon wafer toward the chucking plate (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-053576 Summary of the Invention [Problem to be solved by the invention]

[0005] In the semiconductor manufacturing process using the above-described plasma processing apparatus, it is necessary to improve the uniformity of the surface temperature of the object, such as a wafer. The uniformity of the wafer surface temperature depends on the pressure and flow rate of the thermally conductive gas in the multiple regions between the attracting surface and the receiving surface. Therefore, it is desirable for the above-described gas supply system to have multiple gas supply passages corresponding to each region, and to be able to individually adjust the flow rate and pressure of the thermally conductive gas flowing through these multiple passages using a gas control device so that the gas can be supplied from each gas supply passage.

[0006] Furthermore, in the above-described gas supply system, if the pressure of the thermally conductive gas supplied to the backside of the wafer or the like is too high, there is a risk that the wafer will separate from the adsorption surface, so an exhaust flow path is usually provided to exhaust excess thermally conductive gas flowing through the gas supply flow path.

[0007] However, in semiconductor manufacturing equipment equipped with a gas supply system, the physical space available for installing these flow paths and gas control devices is limited, and therefore, it is necessary to efficiently install multiple gas supply flow paths, exhaust flow paths, and various gas control devices in this limited space.

[0008] The present invention has been made to meet the above-mentioned demands, and has as its main object to provide a gas supply system that supplies a thermally conductive gas to an attracting surface of an electrostatic chuck device, in which a plurality of flow paths and gas control devices can be efficiently arranged to save space. [Means for solving the problem]

[0009] That is, the fluid supply device according to the present invention is for supplying a thermally conductive gas to an attracting surface of an electrostatic chuck device, and includes a block body having formed therein a plurality of flow paths configured such that a gas control device is provided midway so as to control the thermally conductive gas flowing therethrough, the plurality of flow paths being formed so as to form a two-layer structure within the block body, and among the plurality of flow paths, a plurality of gas supply flow paths for supplying a thermally conductive gas to the attracting surface are formed so as to form one layer of the two-layer structure, and an exhaust flow path for exhausting the thermally conductive gas from within the plurality of gas supply flow paths are formed so as to form the other layer of the two-layer structure.

[0010] In this configuration, the entire fluid supply device can be miniaturized by integrating multiple gas supply channels, exhaust channels, and gas control devices into a block body. Furthermore, by forming multiple channels in a two-layer structure within the block body, with the multiple gas supply channels constituting one layer and the exhaust channel constituting the other layer, the total area occupied by each channel in the block body can be reduced compared to when all of these channels are arranged in the same layer. Furthermore, by forming multiple gas supply channels and exhaust channels in two layers, the gas supply channels and exhaust channels can be closer to each other than when they are arranged in the same layer, thereby shortening the length of the channels connecting them. Furthermore, by opening the ends of the channels connecting the two layers, for example, from the block body, the design can be modified to allow fluid resistance elements such as ceramic restrictors to be inserted at any position. In this way, multiple channels and gas control devices can be efficiently arranged in a limited space, thereby saving space.

[0011] In this specification, the phrase "multiple flow paths are formed to form a two-layer structure inside the block body" means that, in a plan view from the side of the device mounting surface on which the gas control device is mounted in the block body, the multiple flow paths are formed to flow a thermally conductive gas along the in-plane direction and are offset from each other in the depth direction. The flow paths forming the two-layer structure may or may not have overlapping portions in a plan view.

[0012] Furthermore, in this specification, the phrase "a plurality of gas supply channels are formed to constitute one layer, and an exhaust channel is formed to constitute the other layer" does not preclude an exhaust channel being formed in one layer and a gas supply channel being formed in the other layer. In other words, it is intended to include a case where a part of an exhaust channel is formed together with a plurality of gas supply channels to constitute one layer, or a case where a gas supply channel is formed together with a gas supply channel to constitute the other layer.

[0013] The gas supply device is preferably formed so that the plurality of gas supply channels and the exhaust channel overlap each other in a plan view. This reduces the total area occupied by the flow paths in plan view, thereby achieving further space savings.

[0014] The gas supply device preferably has, within the block body, connecting passages that connect the gas supply passages and the exhaust passages to each other at overlapping portions of the passages. In this way, each gas supply flow path and the exhaust flow path can be connected in the shortest distance, thereby achieving further space saving.

[0015] It is preferable that a portion of each of the gas supply flow paths opens onto the mounting surface of the block body on which the gas control device is mounted, and that a fluid resistance element is inserted into each of the gas supply flow paths from the opening on the mounting surface. In this way, the flow path configuration of the gas supply device can be flexibly changed by, for example, changing the position of the fluid resistance element in accordance with the use or purpose of the gas supply system.

[0016] A specific embodiment of the fluid resistance element includes a tubular member and a flow path forming member that is inserted into the tubular member and forms a flow path that serves as resistance.

[0017] It is preferable that the plurality of gas supply channels are connected to the inside of the block body, and that a common gas channel be formed to introduce the thermally conductive gas into the plurality of gas supply channels. In this way, gas control devices such as pressure sensors that measure the pressure of the thermally conductive gas introduced into each gas supply flow path can be installed in the common gas flow path and made common rather than being installed individually in each gas supply flow path, which reduces the number of gas control devices attached to the block body and enables further space savings.

[0018] In a configuration including a common gas flow path, it is preferable that the gas supply flow paths are formed so as to branch out and extend to the left and right from the common gas flow path in a plan view. In this way, when there are multiple gas supply passages, by forming the gas supply passages on the left and right of the common gas passage in a balanced manner, it is possible to reduce variations in the pressure and flow rate of the thermally conductive gas introduced into each gas supply passage. Furthermore, by forming the gas supply passages in a balanced manner on the left and right (for example, symmetrically) in this way, the overall size can be made compact, and the distance from each gas supply passage to the attraction surface of the electrostatic chuck device can be shortened. This effect becomes more pronounced as the number of gas supply passages increases.

[0019] It is preferable that outlet ports of the plurality of gas supply channels are provided on the opposing left and right side surfaces of the block body. In this way, when there are many gas supply flow paths, the layout of the piping can be made simpler than when a plurality of outlet ports are all provided on one side surface.

[0020] It is preferable that the block body has a through hole formed therein for inserting a cable of a gas control device along the thickness direction, which is the direction in which the multiple flow paths forming the two-layer structure overlap. In this way, the cable of the gas control device attached to one surface (for example, the top surface) of the block body can be passed through the through hole of the block body and connected to the control device, etc., provided on the underside, thereby enabling neater cable routing and more space savings.

[0021] Furthermore, a gas supply method of the present invention is a method for supplying a thermally conductive gas to an attracting surface of an electrostatic chuck device, and is characterized in that the thermally conductive gas is supplied to the attracting surface of the electrostatic chuck device using a fluid supply apparatus including a block body having a plurality of flow paths formed therein, the flow paths being configured to control the thermally conductive gas flowing therethrough by providing a gas control device therein, the plurality of flow paths being formed to form a two-layer structure within the block body, and among the plurality of flow paths, a plurality of gas supply flow paths for supplying a thermally conductive gas to the attracting surface are formed to form one layer of the two-layer structure, and an exhaust flow path for exhausting the thermally conductive gas from within the plurality of gas supply flow paths are formed to form the other layer of the two-layer structure. Such a gas supply method can achieve the same effects as the fluid supply device of the present invention described above. [Effects of the Invention]

[0022] According to the present invention configured as described above, in a gas supply system that supplies a thermally conductive gas to the attraction surface of an electrostatic chuck device, a plurality of flow paths and gas control devices can be efficiently arranged, thereby saving space. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a schematic diagram showing the overall configuration of an electrostatic chuck device and a gas supply system according to an embodiment of the present invention; [Figure 2] FIG. 2 is a fluid circuit diagram of a gas supply system in the embodiment. [Figure 3] FIG. 2 is a perspective view showing the overall configuration of the fluid supply device according to the embodiment. [Figure 4] FIG. 2 is a schematic diagram illustrating the fluid supply device in the same embodiment, excluding a gas controller. [Figure 5] FIG. 2 is a plan view showing the configuration of an internal flow path of the fluid supply device according to the embodiment. [Figure 6] FIG. 2 is a flow isometric view of the fluid supply device according to the embodiment. [Figure 7] FIG. 3 is a cross-sectional view showing the configuration of a common gas flow path and an exhaust flow path of the fluid supply device according to the embodiment. [Figure 8] FIG. 3 is a cross-sectional view showing the configuration of a gas supply flow path of the fluid supply device in the embodiment. [Figure 9] FIG. 3 is a perspective view schematically showing the configuration of a sub-exhaust flow path and a connecting flow path of the fluid supply device in the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0024] A fluid supply device 3 according to the present invention will be described below with reference to the drawings.

[0025] The fluid supply device 3 of this embodiment constitutes part of a gas supply system 2 for an electrostatic chuck device 1 that supplies a thermally conductive gas to the chucking surface 1s of the electrostatic chuck device 1, which attracts an object such as a wafer W by electrostatic force.

[0026] First, as shown in FIG. 1 , this electrostatic chuck device 1 is disposed in a vacuum chamber VC of, for example, a plasma-based semiconductor manufacturing apparatus, for electrostatically attracting a wafer W to be processed. Specifically, this electrostatic chuck device 1 includes a circular, flat chucking plate 11 made of an insulating material such as ceramic or glass and having an attracting surface 1s for electrostatically attracting the wafer W, an internal electrode 12 embedded in the chucking plate 11, and a power supply 13 for applying a voltage to the internal electrode 12. When the power supply 13 applies a voltage to the internal electrode 12, a dielectric polarization phenomenon occurs within the chucking plate 11, and the upper surface of the chucking plate 11 becomes a generally flat attracting surface 1s. The vacuum chamber VC is configured to be evacuated by a vacuum pump.

[0027] A plurality of suction areas are preliminarily set on the suction surface 1s of the suction plate 11, and a plurality of gas supply ports 2p for blowing out a thermally conductive gas are formed in each suction area. Each gas supply port 2p is formed by a through-hole provided so as to penetrate the suction plate 11 in the plate thickness direction.

[0028] The gas supply system 2 is for supplying a thermally conductive gas (so-called backside gas) to the space between the attracting surface 1s of the electrostatic chuck device 1 and the attracting surface of the wafer W. The gas supply system 2 is configured to supply a thermally conductive gas, the flow rate and pressure of which are individually adjusted for each attracting region, from a gas supply port 2p provided in each attracting region. The thermally conductive gas may be a single gas such as helium gas or argon gas, or may be any gas such as a mixed gas in which multiple gases are mixed in any ratio.

[0029] The gas supply system 2 includes a fluid supply device 3 that adjusts the flow rate and pressure of the thermally conductive gas supplied from a gas supply source and supplies the gas to each attraction region of the electrostatic chuck device 1, and a control device C that controls each component of the fluid supply device 3. The fluid circuit structure of the fluid supply device 3, including peripheral circuits, will be described with reference to FIG.

[0030] The fluid supply device 3 is provided with a common gas flow path 31 through which a thermally conductive gas flows, a plurality of gas supply flow paths 32 arranged in parallel with each other and connected at their upstream ends to the common gas flow path 31, an exhaust flow path 33 whose upstream end is connected to the common gas flow path 31, and connection flow paths 34 connecting each gas supply flow path 32 to the exhaust flow path 33. Gas control devices such as pressure sensors, fluid control valves, and on-off valves OV are arranged along each flow path.

[0031] The common gas flow path 31 introduces the thermally conductive gas supplied from the gas supply source into each gas supply flow path 32. A gas introduction port Pi (also referred to as an inlet port) is connected to the upstream end of the common gas flow path 31, and the thermally conductive gas is fed from the gas supply source through an external pipe connected to this gas introduction port Pi.

[0032] The common gas flow path 31 is configured to be able to control the total flow rate of the thermally conductive gas introduced into each gas supply flow path 32. Specifically, the common gas flow path 31 is provided with, in this order from upstream, an on-off valve OV that opens and closes the flow path, a first fluid control valve FV1 that changes the flow rate of the thermally conductive gas flowing through the common gas flow path 31, and a first pressure sensor PS1 that measures the pressure of the thermally conductive gas introduced into each gas supply flow path 32. It can be said that the on-off valve OV, the first fluid control valve FV1, and the first pressure sensor PS1 are common to each gas supply flow path 32.

[0033] Each gas supply flow path 32 is provided corresponding to each adsorption region on the adsorption surface 1s. The upstream end of each gas supply flow path 32 is connected to the common gas flow path 31 downstream of the first fluid control valve FV1, and the downstream end is connected to a gas supply port Ps (also referred to as an outlet port). Each gas supply flow path 32 is configured to supply the thermally conductive gas introduced from the common gas flow path 31 to each adsorption region via an external pipe connected to the gas supply port Ps.

[0034] Each gas supply flow path 32 is provided with, in this order from upstream, a fluid resistance element R, a second pressure sensor PS2 that measures the pressure of the thermally conductive gas downstream of the fluid resistance element R, a second fluid control valve FV2 that changes the flow rate of the thermally conductive gas passing through, and a third pressure sensor PS3 that measures the pressure of the thermally conductive gas downstream of the second fluid control valve FV2.

[0035] The exhaust flow path 33 is used to exhaust excess thermally conductive gas flowing through the common gas flow path 31 and the gas supply flow path 32 at a predetermined flow rate. The upstream end of the exhaust flow path 33 is connected to the common gas flow path 31 downstream of the first fluid control valve FV1, and the downstream end is connected to the gas exhaust port Pe, and is configured to be exhausted by a vacuum pump provided on an external pipe connected to the gas exhaust port Pe. The exhaust flow path 33 is provided with, in order from upstream, a fluid resistance element R, a fourth pressure sensor PS4 that measures the pressure of the thermally conductive gas downstream of the fluid resistance element R, a third fluid control valve FV3 that changes the flow rate of the thermally conductive gas passing through, and a fifth pressure sensor PS5 that measures the pressure of the thermally conductive gas downstream of the third fluid control valve FV3.

[0036] The connecting flow path 34 is for introducing a portion of the thermally conductive gas flowing through the gas supply flow path 32 into the exhaust flow path 33, and its upstream end is connected to the gas supply flow path 32 downstream of the second fluid control valve FV2, and its downstream end is connected to the exhaust flow path 33. A fluid resistance element R is provided in the connecting flow path 34.

[0037] The fluid resistance element R provided in each flow path described above provides resistance to the flow of the thermally conductive gas, and has a unique flow rate characteristic that determines the mass flow rate of the gas passing through based on the primary pressure, secondary pressure, and gas temperature, and is, for example, a laminar flow element resistor.

[0038] In addition, the first fluid control valve FV1, second fluid control valve FV2, and third fluid control valve FV3 provided in each of the above-mentioned flow paths change the flow rate of the thermally conductive gas flowing through each flow path by changing the valve opening in response to a control signal from the control device C, and are, for example, piezoelectric actuator valves, solenoid actuator valves, thermal actuator valves, etc.

[0039] The control device C is a general-purpose or dedicated computer that incorporates a CPU, internal memory, etc., and performs at least the functions of a flow rate calculation unit C1 and a valve control unit C2 by the CPU and its peripheral devices working together based on a predetermined program stored in the internal memory.

[0040] The flow rate calculation unit C1 calculates the flow rate Q of the thermally conductive gas introduced from the common gas flow path 31 to each gas supply flow path 32. in , the flow rate Q of the thermally conductive gas introduced from the common gas flow path 31 to the exhaust flow path 33 vac1 , the flow rate Q of the thermally conductive gas introduced from each gas supply passage 32 into the exhaust passage vac2 Specifically, the flow rate calculation unit C1 calculates the flow rate Q of the thermally conductive gas introduced into each flow path based on the inherent flow rate characteristics of the fluid resistance elements R provided in each gas supply flow path 32 and the primary and secondary pressures of each fluid resistance element R. in , Q vac1 , Q vac2 The method is configured to calculate

[0041] Specifically, the flow rate calculation unit C1 calculates the mass flow rate Q based on a flow rate characteristic function indicating the flow rate characteristics of the fluid resistance element R provided in the gas supply flow path 32, the primary pressure acquired from the first pressure sensor PS1, and the secondary pressure acquired from the second pressure sensor PS2. in This flow characteristic function is, for example, a map or the like expressed by a function in which the primary pressure applied to the fluid resistance element R, the secondary pressure applied to the fluid resistance element R, and the temperature of the thermally conductive gas passing through the fluid resistance element R are input variables, and the mass flow rate passing through the fluid resistance element R is an output variable, and is stored in advance in a predetermined area of ​​the memory. The calculated mass flow rate Qin is the mass flow rate of the thermally conductive gas passing through the fluid resistance element R provided in each gas supply flow path 32.

[0042] The flow rate calculation unit C1 calculates a mass flow rate Q based on a flow rate characteristic function indicating the flow rate characteristics of the fluid resistance element R provided in the exhaust flow path 33, the primary pressure acquired from the first pressure sensor PS1, and the secondary pressure acquired from the fourth pressure sensor PS4. vac1 This calculated mass flow rate Q vac1 is the mass flow rate of the thermally conductive gas passing through the fluid resistance element R provided in the exhaust flow path 33.

[0043] The flow rate calculation unit C1 calculates a mass flow rate Q based on a flow rate characteristic function indicating the flow rate characteristics of the fluid resistance element R provided in the connection flow path 34, the primary pressure acquired from the third pressure sensor PS3, and the secondary pressure acquired from the fifth pressure sensor PS5. vac2 This calculated mass flow rate Q vac2 is the mass flow rate of the thermally conductive gas passing through the fluid resistance element R provided in the connecting flow path 34.

[0044] The valve control unit C2 transmits control signals to the first fluid control valve FV1, the second fluid control valve FV2, and the third fluid control valve FV3 to control the valve openings. Specifically, the valve control unit C2 calculates the mass flow rates Q in , Q vac1 , Q vac2 The flow rate calculation unit C1 compares the mass flow rate Q in , Q vac1 , Q vac2 The openings of the fluid control valves FV1, FV2, and FV3 are feedback-controlled so that the respective values ​​match the target values.

[0045] With this configuration, the thermally conductive gas supplied from the gas supply source is distributed from the common gas flow path 31 to each gas supply flow path 32, and the flow rate and pressure are adjusted in each gas supply flow path 32 before being output from the corresponding gas supply port Ps. Excess thermally conductive gas flowing through the common gas flow path 31 and each gas supply flow path 32 is introduced into the exhaust flow path 33 and exhausted via the gas exhaust port Pe.

[0046] Next, the physical configuration of this fluid supply device 3 will be described with reference to FIGS.

[0047] The gas supply device 3 is an integrated type in which a plurality of flow paths and gas control devices are integrated. Specifically, the gas supply device 3 includes a block body 4 having flow paths such as the common gas flow path 31, the gas supply flow path 32, the exhaust flow path 33, and the connection flow path 34 formed therein, each gas control device attached to the block body 4, and additional piping fixtures that form a gas inlet port Pi, a gas supply port Ps, and a gas exhaust port Pe.

[0048] As shown in FIGS. 3 to 5, the block body 4 is made of resin and has a roughly plate-like shape. The top surface 41 of the block body 4 is rectangular in plan view (or top view) and functions as an equipment mounting surface on which the gas control devices are mounted. Specifically, the top surface 41 is formed with a plurality of valve mounting portions MV0 to MV3 (e.g., recesses) for mounting the fluid control valves and on-off control valves, and a plurality of sensor mounting portions MS1 to MS5 (e.g., recesses) for mounting the pressure sensors PS1 to PS5. These mounting portions are arranged in a matrix (i.e., a grid pattern along the vertical and horizontal directions), with the direction along one pair of opposing side surfaces of the block body 4 in plan view being the vertical direction (the up-down direction in FIG. 5) and the direction along the other pair of opposing side surfaces being the horizontal direction (the left-right direction in FIG. 5). More specifically, these mounting portions are arranged at equal intervals along the vertical direction and are formed symmetrically with respect to the center line of the block body 4 in the horizontal direction.

[0049] The above-mentioned accessory piping fixtures are attached to the side surfaces of the block body 4. Specifically, a plurality of accessory piping fixtures (here, a total of 12) are attached to a pair of opposing side surfaces along the vertical direction of the block body 4. In plan view, the multiple accessory piping fixtures are formed on both the left and right side surfaces at equal intervals along the vertical direction and symmetrically, with the same number (six on each side). Of the multiple accessory piping fixtures, one functions as a gas inlet port Pi, another functions as a gas exhaust port Pe, and the remaining ten function as gas supply ports Ps. In this example, the upper left accessory piping fixture in plan view functions as the gas inlet port Pi, and the upper right accessory piping fixture functions as the gas exhaust port Pe.

[0050] 5, each flow path is formed in a substantially straight line along the vertical and horizontal directions in a plan view. Each flow path is partially open at valve mounting portions MV0 to MV3 and sensor mounting portions MS1 to MS5 on the upper surface 41 of the block body 4, and a fluid control valve or a pressure sensor is attached so as to cover this opening.

[0051] 5 and 6, the common gas flow path 31 includes an inlet flow path portion 311 that extends horizontally from the gas inlet port Pi to the center of the block body 4, and a central flow path portion 312 that extends vertically and is connected to the inlet flow path portion 311 at the center of the block body 4. As shown in Fig. 7, the common gas flow path 31 is formed to communicate between the gas inlet port Pi, valve mounting portions MV0 and MV1 that mount the on-off valve OV and the first fluid control valve FV1, a sensor mounting portion MS1 ​​that mounts the first pressure sensor PS1, and the central flow path portion 312.

[0052] The gas supply flow paths 32 extend from the central flow path portion 312 of the common gas flow path 31 in the horizontal direction, branching out to both the left and right sides, and are formed so that their downstream ends are connected to the corresponding gas supply ports Ps. The gas supply flow paths 32 are all arranged parallel to each other in the horizontal direction and are equally spaced apart in the vertical direction.

[0053] 8, each gas supply flow path 32 is formed to communicate with the central flow path portion 312 of the common gas flow path 31, the sensor mounting portions MS2 and MS3 for mounting the second pressure sensor PS2 and the third pressure sensor PS3, the valve mounting portion MV2 for mounting the second fluid control valve FV2, and the gas supply port Ps. In each gas supply flow path 32, the fluid resistance element R is provided between the central flow path portion 312 and the sensor mounting portion MS2 corresponding to the second pressure sensor PS2.

[0054] Specifically, the fluid resistance element R is composed of a tubular member made of resin, metal, or the like, and a flow path forming member that is inserted into the tubular member to form a flow path that serves as resistance (hereinafter also referred to as a resistance flow path). The flow path forming member is, for example, a cylindrical member made of ceramic, or the like, and the resistance flow path is, for example, a linear member with a circular cross section that penetrates the flow path forming member in the axial direction. The fluid resistance element R is inserted and attached (inserted) through the opening of each gas supply flow path 32 formed in the sensor attachment portion MS2 corresponding to the second pressure sensor PS2.

[0055] In the fluid supply device 3 of this embodiment, the multiple internal flow paths are formed to form an upper and lower two-layer structure along the thickness direction of the block body 4. More specifically, the multiple gas supply flow paths 32 are formed to form one layer (upper layer), and the exhaust flow path 33 is formed to form the other layer (lower layer).

[0056] 5 and 6, the exhaust flow path 33 has a main exhaust flow path section 331 whose upstream end is connected to the central flow path section 312 and whose downstream end is connected to the gas exhaust port Pe, a sub-exhaust flow path section 332 that extracts a portion of the thermally conductive gas flowing in each gas supply flow path 32 and directs it to the main exhaust flow path section 331, and a communication flow path section 333 that connects these. Of the exhaust flow path 33, the main exhaust flow path section 331 is formed to form an upper layer together with the common gas flow path 31 and the gas supply flow path 32, and the sub-exhaust flow path section 332 is formed to form a lower layer.

[0057] In a plan view, the main exhaust flow path section 331 is formed in a substantially linear shape along the lateral direction from the center of the block body 4 toward the gas exhaust port Pe. The main exhaust flow path section 331 is formed symmetrically with the introduction flow path section 311 with respect to the central flow path section 312 as the axis of symmetry, and is formed parallel to each of the gas supply flow paths 32. As shown in FIG. 7 , the main exhaust flow path section 331 is formed to communicate with the central flow path section 312, the valve mounting section MV3 for mounting the third fluid control valve FV3, the sensor mounting sections MS4 and MS5 for mounting the fourth pressure sensor PS4 and the fifth pressure sensor PS5, and the gas exhaust port Pe. A fluid resistance element R is provided in the main exhaust flow path section 331 between the sensor mounting section MS4 corresponding to the fourth pressure sensor PS4 and the central flow path section 312. Similar to the fluid resistance element R in the gas supply flow path 32, the fluid resistance element R is inserted and attached through an opening of the main exhaust flow path section 331 formed in the sensor mounting section MS4 corresponding to the fourth pressure sensor PS4.

[0058] As shown in FIGS. 6, 8, and 9, the sub-exhaust passage section 332 is formed below each gas supply passage 32 in the thickness direction of the block body 4 and is formed to overlap (specifically, intersect) with all of the multiple gas supply passages 32 in a plan view. Specifically, the sub-exhaust passage section 332 includes an inflow passage section 332a into which the thermally conductive gas flows from the multiple gas supply passages 32. The inflow passage section 332a is formed substantially linearly along the vertical direction in a plan view and intersects with each of the multiple gas supply passages 32 by cutting through the multiple gas supply passages 32. Here, the sub-exhaust passage section 332 includes two inflow passage sections 332a formed symmetrically on either side of the central passage section 312, and each inflow passage section 332a intersects with the gas supply passages 32 branching to the left and right from the central passage section 312. In a plan view, the inflow passage section 332a overlaps (intersects with) each of the gas supply passages 32 at the sensor mounting section MS3 corresponding to the third pressure sensor PS3. That is, the inflow channel portion 332a is formed so as to pass directly below the sensor attachment portion MS3 corresponding to the third pressure sensor PS3.

[0059] The communicating flow path 333 connects the main exhaust flow path 331 constituting the upper layer with the sub-exhaust flow path 332 constituting the lower layer, and is specifically configured as a substantially straight flow path formed along the thickness direction of the block body 4 as shown in Fig. 7. In plan view, the main exhaust flow path 331 and the sub-exhaust flow path 332 overlap at the sensor attachment portion MS5 corresponding to the fifth pressure sensor PS5, and the communicating flow path 333 is formed in this overlapping portion.

[0060] The auxiliary exhaust flow path section 332 of the exhaust flow path 33 and each gas supply flow path 32 are connected at their overlapping portions (intersecting portions in this case) by the connecting flow paths 34. Specifically, as shown in FIGS. 8 and 9, the connecting flow paths 34 are configured as substantially straight flow paths formed along the thickness direction of the block body 4. The lower end of the connecting flow path 34 along the thickness direction is connected to the auxiliary exhaust flow path section 332, and the upper end opens to a sensor mounting portion MS3 on the top surface 41 of the block body 4 that corresponds to the third pressure sensor PS3. The connecting flow path 34 is provided with a fluid resistance element R. Like the fluid resistance element R in the gas supply flow path 32 and the main exhaust flow path section 331, the fluid resistance element R is inserted and attached through an opening of the main exhaust flow path section 331 that is formed in the sensor mounting portion MS3 that corresponds to the third pressure sensor PS3.

[0061] Block body 4 of this embodiment is also provided with cable insertion portions 5 for inserting the cables of each gas control device attached to upper surface 41 to the lower surface side. This cable insertion portion 5 includes a first cable insertion portion 51 for inserting the cables of each control device corresponding to gas supply flow path 32, and a second cable insertion portion 52 for inserting the cables of each control device corresponding to common gas flow path 31 and exhaust flow path 33.

[0062] Specifically, the first cable insertion portion 51 is a through-hole formed to penetrate vertically along the thickness direction of the block body 4. As shown in Fig. 5 , the first cable insertion portion 51 is an elongated hole extending horizontally in a plan view, and is formed to be parallel to each gas supply flow path 32. Each first cable insertion portion 51 is formed between each gas supply flow path 32.

[0063] The second cable insertion portion 52 is a notched groove (recess) formed in the side surface of the block body 4 close to the common gas flow path 31 and the exhaust flow path 33. This notched groove is formed in the side surface of the block body 4 from the upper surface 41 to the lower surface.

[0064] According to the fluid supply device 3 of this embodiment configured as described above, the integration of the multiple gas supply channels 32, exhaust channels 33, and gas control devices allows the entire fluid supply device 3 to be miniaturized. Furthermore, the multiple channels are formed in a two-layer structure inside the block body 4, with the multiple gas supply channels 32 forming one layer and the exhaust channels 33 forming the other layer. This reduces the total area occupied by the channels in the block body 4 compared to when all of these channels are arranged in the same layer. Furthermore, by forming the multiple gas supply channels 32 and exhaust channels 33 in two layers, the gas supply channels 32 and exhaust channels 33 can be closer to each other than when they are arranged in the same layer, thereby shortening the length of the channels connecting them. In this way, the multiple channels and gas control devices can be efficiently arranged in a limited space, thereby saving space.

[0065] Furthermore, in a plan view, the gas supply flow paths 32 and the exhaust flow paths 33 are formed so as to overlap with each other, and connecting flow paths 34 are formed at the overlapping portions to connect these flow paths to each other. This allows each gas supply flow path 32 and the exhaust flow path 33 to be connected in the shortest distance, thereby achieving even greater space savings.

[0066] The present invention is not limited to the above-described embodiment.

[0067] For example, in the above embodiment, the number and positions of the pressure sensors and fluid control valves in each flow path are shown as examples, and in other embodiments, they may be arranged in different positions and in different numbers. Furthermore, the fluid supply device 3 in the above embodiment has only one common gas flow path 31 that introduces the thermally conductive gas into each gas supply flow path 32, but it may have multiple common gas flow paths 31. Furthermore, the fluid supply device 3 in other embodiments may have multiple exhaust flow paths 33.

[0068] In the above embodiment, the flow paths are configured so that the upper left accessory piping fixture functions as the gas inlet port Pi and the upper right accessory piping fixture functions as the gas exhaust port Pe when viewed from above the block body 4. However, this is not limited to this. In other embodiments, the flow paths may be configured so that different accessory piping fixtures function as the gas inlet port Pi and the gas exhaust port Pe.

[0069] In the above embodiment, the communicating flow path portion 333 and the connecting flow path 34 are formed along the thickness direction of the block body 4, but this is not limiting. In other embodiments, the communicating flow path portion 333 and the connecting flow path 34 may be formed so as to be inclined with respect to the thickness direction, as long as they can communicate the upper layer and the lower layer.

[0070] In the above embodiment, the sub-exhaust flow path portion 332 is formed so as to intersect with all of the gas supply flow paths 32 at their overlapping portions in a plan view, but this is not limited thereto. In other embodiments, the sub-exhaust flow path portion 332 may be formed so as to face in the same direction as some or all of the gas supply flow paths 32 at their overlapping portions in a plan view.

[0071] In addition, in the above embodiment, the exhaust flow path portion 332 is formed so as to overlap with all of the multiple gas supply flow paths 32 in a plan view, but in other embodiments, it may be formed so as to overlap with only some of the gas supply flow paths 32.

[0072] In addition, the block body 4 in other embodiments may not be provided with the cable insertion portion 5.

[0073] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0074] 1. Electrostatic chuck device 2. Gas supply system 3...Fluid supply device 31 Common gas flow path 32 Gas supply passage 33 Exhaust flow path 4 Block letters

Claims

1. A fluid supply device for supplying a thermally conductive gas to an attracting surface of an electrostatic chuck device, the fluid supply device including a block body having a plurality of flow paths formed therein, the flow paths being configured so that a gas control device is provided midway and the thermally conductive gas flowing therethrough can be controlled, The plurality of flow paths are formed to form a two-layer structure inside the block body, and among the plurality of flow paths, a plurality of gas supply channels for supplying a thermally conductive gas to the adsorption surface are formed so as to constitute one layer of the two-layer structure; an exhaust flow path that exhausts the thermally conductive gas in the plurality of gas supply flow paths is formed so as to constitute the other layer of the two-layer structure; a plurality of connection flow paths are formed in the block body, the connection flow paths connecting each of the plurality of gas supply flow paths to the exhaust flow path; A fluid supply device in which a fluid resistance element having a ceramic flow path forming member that forms a flow path that acts as resistance is disposed in at least one of the gas supply flow path and the connecting flow path.

2. The fluid supply device according to claim 1 , wherein the plurality of gas supply channels and the exhaust channel are formed so as to overlap each other in a plan view.

3. 3. The fluid supply device according to claim 2, wherein the connecting flow passages are formed in the block body at overlapping portions between the gas supply flow passages and the exhaust flow passages.

4. a portion of each of the gas supply channels opens to a mounting surface of the block body to which the gas control device is attached, 4. The fluid supply device according to claim 1, wherein the fluid resistance elements are inserted into the gas supply flow paths from openings on the mounting surface.

5. 5. The fluid supply device according to claim 4, wherein the fluid resistance element includes a tubular member and the flow path forming member inserted into the tubular member.

6. 6. The fluid supply device according to claim 1, wherein the plurality of gas supply flow paths are connected to an interior of the block body, and a common gas flow path is formed to introduce the thermally conductive gas into the plurality of gas supply flow paths.

7. 7. The fluid supply device according to claim 6, wherein, in a plan view, the gas supply flow paths are formed so as to branch out and extend to the left and right from the common gas flow path.

8. 8. The fluid supply device according to claim 7, wherein outlet ports of the plurality of gas supply channels are provided on the opposing left and right side surfaces of the block body.

9. A fluid supply device as described in any one of claims 1 to 8, wherein the block body has a through hole formed in the thickness direction, which is the direction in which the multiple flow paths forming the two-layer structure overlap, for inserting a cable of a gas control device.

10. A method for supplying a thermally conductive gas to an adsorption surface of an electrostatic chuck device, A fluid supply device including a block body having a plurality of flow paths formed therein, the flow path being configured so that a gas control device is provided midway and the thermally conductive gas flowing therethrough can be controlled, The plurality of flow paths are formed to form a two-layer structure inside the block body, and among the plurality of flow paths, a plurality of gas supply channels for supplying a thermally conductive gas to the adsorption surface are formed so as to constitute one layer of the two-layer structure; an exhaust flow path that exhausts the thermally conductive gas in the plurality of gas supply flow paths is formed so as to constitute the other layer of the two-layer structure; a plurality of connection flow paths are formed in the block body, the connection flow paths connecting each of the plurality of gas supply flow paths to the exhaust flow path; a fluid supply device in which a fluid resistance element having a ceramic flow path forming member that forms a flow path that serves as resistance is disposed in at least one of the gas supply flow path and the connecting flow path, and the thermally conductive gas is supplied to the attracting surface of the electrostatic chuck device.

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