Multi-component systems and methods for producing multi-component systems, particularly for microelectronic applications

Abstract

The present invention relates to a conductive multi-component system 10, 110 comprising at least one first material S1 and at least one substrate B, wherein a) the first material S1 is present in one or more material moieties, b) at least one first material moiety is formed with at least one first functional group R and is equipped with a first linker L, and / or the substrate B is formed with at least one second functional group R and is equipped with a second linker L, c) the first functional group R reacts with the second functional group R and / or the substrate via a predefined interaction to connect them to each other, and / or the second functional group R reacts with the first functional group R and / or the first material S1 via a predefined interaction to connect them to each other, and d) the material moieties of the first material S1 are present as or in particles and are at least partially conductive. Additionally, the present invention relates to a method for producing the electrically conductive multi-component system 10, 110.

Description

[Technical Field]

[0001] The present invention relates to multi-component systems and methods for producing multi-component systems, particularly for microelectronic applications. [Background technology]

[0002] Multi-component systems are already known from the prior art.

[0003] From US Pat. No. 5,629,999 a capsule system is already known which reacts to pressure and releases a liquid accordingly.

[0004] Further capsule systems are known, for example, from US Pat. No. 5,629,299, ... and US Pat. No. 5,629,299.

[0005] A method for forming a conductive layer having a molecular moiety in which a plurality of conductive nanoparticles are linked together is known from US Pat. No. 5,629,999.

[0006] The functionalization of metal nanoparticles is known, for example, from US Pat. No. 5,629,299, US Pat. No. 5,629,299 and US Pat. No. 5,629,299.

[0007] Non-Patent Document 1 describes a method for using molecules in electronic applications, in which a self-assembled monolayer (SAM) sandwich structure is used.

[0008] Thiol functionalization is known, for example, from Non-Patent Document 2, further Non-Patent Document 3, further Non-Patent Document 4, and Non-Patent Document 5, as well as Non-Patent Document 6.

[0009] Further solutions regarding selective conductivity are known from US Pat. No. 5,629,299, ... and US Pat. No. 5,629,299. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] U.S. Patent Application Publication No. 2012 / 0107601 [Patent Document 2] International Publication No. 2017 / 192407 [Patent Document 3] U.S. Patent No. 8,747,999 [Patent Document 4] International Publication No. 2017 / 042709 [Patent Document 5] International Publication No. 2016 / 049308 [Patent Document 6] International Publication No. 2018 / 028058 [Patent Document 7] U.S. Patent Application Publication No. 2018 / 0062076 [Patent Document 8] International Publication No. 2015 / 103028 [Patent Document 9] Canadian Patent No. 2712306 [Patent Document 10] U.S. Patent No. 8,790,552 [Patent Document 11] U.S. Patent No. 5,731,073 [Patent Document 12] U.S. Patent No. 5,498,467 [Patent Document 13] European Patent No. 0841698 [Patent Document 14] International Publication No. 2017 / 139654 [Patent Document 15] International Publication No. 2017 / 138483 [Patent Document 16] Korean Patent No. 101195732 [Patent Document 17] U.S. Patent Application Publication No. 2010 / 0327237 [Non-patent literature]

[0011] [Non-Patent Document 1] Puebla-Hellmann G., et al. (2018), ("Metallic nanoparticle contacts for high-yield, ambient-stable molecular-monolayer devices", Nature, Vol. 559)

Wood 2

Table 3

Fashion 4

Wood 5

[0012] The object of the present invention is to provide an electrically conductive multi-component system and a method for producing an electrically conductive multi-component system, in particular with the aim of being able to control the dosage of the individual components of the multi-component system and their arrangement, thereby improving the efficiency of the reaction of the multi-component system on the one hand and enabling precise and precisely defined electrical conduction on the other hand. [Means for solving the problem]

[0013] The above problem is solved according to the invention by a multi-component system having the features of claim 1. According to this, there is provided a conductive multi-component system comprising at least one first substance and at least one substrate, a) the first substance is present in one or more substance portions; b) at least one first material moiety has at least one first functional group formed thereon and is provided with a first linker, and / or the substrate has at least one second functional group formed thereon and is provided with a second linker; c) the first functional group reacts with the second functional group and / or the substrate via a predefined interaction to connect them to each other, and / or the second functional group reacts with the first functional group and / or the first substance via a predefined interaction to connect them to each other; d) It is contemplated that conductive multi-component systems are provided in which the material portions of the first material are present as or in particles and are at least partially conductive.

[0014] The present invention is based on the basic idea that at least one first substance and at least one substrate are arranged in a defined spatial arrangement relative to one another with the aid of connections via linkers and functional groups. Therefore, it is now possible to arrange the first substance and the substrate at a defined ratio and distance. By corresponding activation, specific conductivity can be achieved in the region where the first substance is bonded to the substrate. Even in very small structures, conductivity can be generated in a very specific and defined manner. In particular, this specification contemplates the creation of conductive connections in the micrometer or nanometer range or even smaller, which are usually created by bonding, brazing, adhesives, etc., using this multi-component system. The at least one particle may be, in particular, a microparticle or nanoparticle.

[0015] In particular, the conductivity of the material portion may be intended to be electrical and / or thermal and / or signal conductive.

[0016] It is believed that one or more particles can be self-assembled or self-aligned, where the particles can autonomously align in a predeterminable or predetermined direction on the substrate, such as a conductor track.

[0017] Self-assembly can be achieved, for example, by thiol groups (SAM surfaces, see also below), Janus (nano)particles, and / or patch particles, and / or by magnetism (particle and surface magnetism), and / or via electrostatic interactions. Such interactions can be achieved, for example, by positively charged surfaces, negatively charged surfaces, and / or via weak interactions and / or via chemical reaction(s) such as click chemistry (e.g., thiol-ene click chemistry), Michael reactions, etc.

[0018] Furthermore, it may be intended that the distance between the functional group and the substance moiety and the substrate is determined by the respective linkers.

[0019] The substrate can be, for example, a circuit board or printed circuit board or a conductor track in the field of semiconductor technology (wafers (e.g., silicon wafers or silicon wafers) or chips). In particular in the field of microelectronics, i.e., when connecting conductor tracks on circuit boards or chips or in the case of 3D integration, etc., conductive connections that are in the correct position, more durable, have higher electrical conductivity, are less prone to short circuits, and allow miniaturization are very useful. Multi-component systems allow the production of conductive connections on the substrate by first positioning the multi-component system, where position correction is also possible. The multi-component system is then activated (e.g., as described below) to produce the conductive connection.

[0020] If a (single) particle is used, a conductive connection can be created, for example, between two conductor tracks by bringing the particle into contact with both conductor tracks and then immobilizing it there accordingly by activation.

[0021] If several particles are present, the particles come into contact with one another and create a "continuous path" between the two conductor tracks, which in turn creates a correspondingly conductive connection.

[0022] Activation releases the particles, which then self-assemble (self-assemble) at the intended location, for example, via terminal thiol groups or conductive polymers, or via Janus (nano)particles. This process can also be assisted, for example, by magnetic and / or electric fields.

[0023] The substrate may also be intended to be the second material.

[0024] In particular, it may be intended that functional groups of the material moieties of the first material and functional groups of the substrate specifically inter-bond.

[0025] In particular, the functional groups of the material moieties may be intended to selectively bind to metal surfaces, for example SAM surfaces (self-assembled monolayers).

[0026] The nanoparticles may consist at least in part of silver, gold and / or copper, and / or composites, and / or other metals or alloys thereof, and / or other materials.

[0027] Alternatively, the substrate may be or have a surface. The surface may be, for example, a wafer, a (micro)chip, flexible electronics, a printed circuit board, etc. Furthermore, it is conceivable that the surface is a conductive substrate. Furthermore, the substrate may be a substrate with conductor tracks. The conductor tracks may be, for example, vapor-deposited, printed, or etched. Furthermore, the conductor tracks may be applied to the substrate by thin-film technology or other techniques.

[0028] In particular, it may be intended that the size of the nanoparticles is smaller than the distance between the conductor tracks.

[0029] It is conceivable that the first linker is longer than the second linker or vice versa, which has the advantage that, for example, the first substances are at a greater or lesser distance from each other after corresponding binding than from the first substances to the substrate.

[0030] Alternatively, both linkers can be the same length.

[0031] The linker can be any form of connection between the substance moiety and the functional group.

[0032] The linker may also be any kind of direct connection between the substance moiety and / or capsule and / or substrate and the functional group.

[0033] Possible linkers include biopolymers, proteins, silk, polysaccharides, cellulose, starch, chitin, nucleic acids, synthetic polymers, homopolymers, DNA, halogens, polyethylene, polypropylene, polyvinyl chloride, polylactams, natural rubber, polyisoprene, copolymers, random copolymers, gradient copolymers, alternating copolymers, block copolymers, graft copolymers, acrylonitrile-butadiene-styrene (ABS), styrene-acrylonitrile (SAN), butyl rubber, polymer blends, polymer alloys, inorganic polymers, polysiloxanes, polyphosphazenes, polysilazanes, ceramics, basalt, isotactic polymers, syndiotactic polymers, atactic polymers, linear polymers, crosslinked polymers, elastomers, thermoplastic elastomers, thermosets, partially crystalline linkers, thermoplastics, cis-trans polymers, conducting polymers, and supramolecular polymers.

[0034] Similarly, it is conceivable that the functional groups may be of the same or different types. For example, it is conceivable that the substance and the associated functional group are of different types, i.e., different functional groups may be used. For example, this is desirable when, for example, a specific linker is initially provided with a protecting group during production, so that the linker is used for a specific bond, such as bonding a first substance to a first substance or further bonding a first substance to a substrate (or further bonding a substrate to a substrate). It is also conceivable that a first functional group allows for the connection of two substance moieties, and a second, different functional group allows for the bonding of the first substance on the substrate. It is also conceivable that a first functional group allows for the bonding of a substance moiety, and a second, different functional group allows for the modification of the capsule's properties, such as biocompatibility, solubility, aggregation, or similar properties. It is also conceivable that different functional groups allow for the construction of three- or more-component systems.

[0035] Alternatively, instead of a protecting group, it may be contemplated that there are two bonds, the first bond connecting the capsules to each other and the second bond connecting the capsule or material moiety or material to a substrate, surface, fiber, etc.

[0036] However, it is also conceivable that all functional groups are homogeneous, i.e., identically configured. In the case of heterogeneous configurations, this can be combined with differences in other properties or linker configurations (e.g., length, angle, type of linker, etc.).

[0037] It is further conceivable that the material portions of the first substance are arranged in capsules, in particular nanocapsules and / or microcapsules. Encapsulation easily allows for a defined mass or volume of the first substance for conductive multi-component systems. In multi-capsule systems or, for example, two-component capsule systems (2K capsule systems), where the capsules have the same contents, the contents of the capsules can be bound to each other in a defined number and / or a defined ratio or number and distance in separate spaces until the capsules are activated and the contents can react with each other or are forced to react or mix with each other. One or more material portions of one substance are arranged or packaged in each capsule. It is also conceivable that one capsule contains multiple material portions. A capsule structure containing a first substance (or a second or third substance) may also be called a capsule complex, and functions almost like a (mini) reaction flask, where, after activation, the reagents are mixed with each other at a defined time point to allow the substances to react with each other. A large number of these capsule complexes allow for a convergence of modes of action, resulting in greater effectiveness or improved mixing and reaction of materials. Further advantages result from more thorough mixing of the individual materials or reaction components with one another, so that higher conversion rates can be achieved with the simultaneous use of less material compared to conventional systems.

[0038] Possible capsule types include, for example, double capsules, multicore capsules, capsules with cationic or anionic properties, capsules with different shell materials, Janus particles, patch particles, porous capsules, capsules with multiple shells, capsules with metal nanoparticles, matrix capsules and / or hollow capsules, capsules with multiple layers of shell material (so-called multilayer microcapsules) and / or empty porous capsules (e.g. for encapsulating odors).

[0039] Furthermore, it may be intended that the capsules for the first substance have the same size, thereby adjusting the ratio of the volume of the first substance to the substrate (or vice versa) and / or adjusting the activation behavior (if at least part of the multi-component system is activatable).

[0040] It is conceivable that at least a portion of the multi-component system is activatable, and that activation of the multi-component system is achieved by a change in at least one of pressure, pH value, UV radiation, osmosis, temperature, light intensity, moisture, etc. This has the advantage that the time point of activation can be precisely controlled.

[0041] It is conceivable that more than one activation mechanism is intended. When multiple activation mechanisms are intended, redundant activation opportunities are provided, for example, to ensure that activation is always possible.

[0042] Furthermore, it may be provided that one or more nanoparticles are made of a metallic material and have a surface coating, in particular a metallic surface coating and / or a surface functionalization. In particular, it is possible that the nanoparticles may have electrical conductivity and / or magnetic properties.

[0043] The metallic surface coating may comprise any metal and / or any metal alloy, in particular gold, silver, copper and / or bronze.

[0044] It is therefore possible to obtain, in particular, magnetic conductive nanoparticles (coated with a conductive metal).

[0045] The metal surface of the nanoparticles can be functionalized with terminal reactive groups, particularly polymers having at least one thiol group such as, for example, 11-mercaptoundecanoic acid, or dithiols, particularly polymers having multiple thiol groups such as 1,2-ethanedithiol, 1,3-propanedithiol, 1,4-butanedithiol, 1,5-pentanedithiol, benzene-1,4-dithiol, 2,2'-ethylenedioxydiethanethiol, 1,6-hexanedithiol, tetra(ethylene glycol)dithiol, 1,8-octanedithiol, 1,9-nonanedithiol, 1,11-undecanedithiol, hexa(ethylene glycol)dithiol, 1,16-hexadecanedithiol, and the like.

[0046] Furthermore, the nanoparticles may be, for example, round, elliptical, rectangular, rod-shaped, diamond-shaped, spherical, oval, rectangular, cylindrical, conical, or star-shaped, or may take any other common or uncommon shape.

[0047] Furthermore, it is possible that the surface coating and / or surface functionalization is at least partially, in particular completely, formed by terminal functional groups and / or linkers which selectively bind to the metal surface and / or by SAM surfaces and / or stabilizers.

[0048] In general, the stabilization of the nanoparticles can be carried out by steric, electrostatic and / or electrochemical stabilization and / or further stabilization methods.

[0049] In particular, it may be intended that the stabilizer is polyethylene glycol (PEG) and / or polyvinyl alcohol (PVA) and / or citrate, and / or organic ligands, and the like.

[0050] Additionally, the surface coating can be an electrically conductive surface coating, such as an electrically conductive polymer.

[0051] It is further believed that the nanoparticles are stabilized by a matrix, particularly the surrounding matrix.

[0052] Alternatively, it may be contemplated that the matrix consists of at least one polymer, adhesive, or other non-conductive material.

[0053] Furthermore, it is conceivable that the nanoparticles have at least one shell and at least one core, respectively, for example so-called core-shell nanoparticles or core-shell-shell nanoparticles.

[0054] It is further contemplated that the core may include a surrounding matrix.

[0055] It is further contemplated that the nanoparticles are contained within a particle having at least one core and at least one shell, wherein the core or at least one of the cores comprises at least one nanoparticle.

[0056] It is conceivable that the core consists of at least one magnetic metal, in particular iron, nickel, cobalt, gadolinium, terbium, dysprosium, holmium and / or erbium.

[0057] It is possible that the nanoparticles are magnetic nanoparticles and / or are not provided with functional groups.

[0058] It is believed that the surface coating is formed in a polar solvent with terminal functional groups and / or linkers, and / or SAM surfaces and / or stabilizers that selectively bind to the metal surface.

[0059] It is further conceivable that at least a portion of the nanoparticles are disposed within a first capsule, and similarly, a second substance portion is disposed within at least one capsule, wherein each capsule is activatable.

[0060] The nanoparticles may have essentially the same size, and / or the second material portion may have essentially the same size. Size may particularly refer to spatial extent, but may also refer to mass or occupied volume. It is conceivable that the nanoparticles and the second material portion each have the same size or amount.

[0061] However, it is also conceivable, in particular, that the nanoparticles and the second material moieties have different sizes.

[0062] For example, nanoparticles can be in a first capsule and adhesive, particularly epoxy resin, PU adhesive, or acrylate adhesive, can be in a second capsule. In particular, it is intended to form double microcapsules. Activation can result in the release of nanoparticles in the first capsule and the release of epoxy resin in the second capsule. This allows the formation of conductive adhesive dots. Activation can be carried out as described above. In particular, this can allow for precise (temporal and spatial) control of the electrical conductivity of the substrate.

[0063] All forms of one-component adhesives and / or resins in the sense of adhesives are contemplated.

[0064] Any form of multi-component adhesive is also contemplated, in particular resin and hardener. In the case of multi-component adhesives, the individual components may be present in different capsules and / or capsule clusters and / or capsule types. Two-component adhesives are also contemplated (e.g., capsules for particles, capsules for the first adhesive component, and second capsules for the second adhesive component).

[0065] It is contemplated that the capsules (or portions of material) may be activated simultaneously and emptied simultaneously.

[0066] It is contemplated that the capsules may be activated sequentially and emptied sequentially.

[0067] The choice of size also determines the respective (local) volume and / or the respective local concentration of the respective substance.

[0068] The multi-component system can have a network structure with interstices, where the network structure is formed from material portions of a first material, in which the surrounding medium and, possibly, at least partially, respectively, at least one material portion of a second material are arranged within the interstices.

[0069] The capsules are formed with or functionalized with linkers and functional groups. The linkers should bridge the capsules to each other. The functional groups may still be provided with protecting groups. The distance between capsules can be determined by the length of the linkers. The length of the linkers should be selected so that the radius of the discharged liquid contents of a capsule slightly overlaps the contents of adjacent capsules to ensure cross-linking. In the case of a more viscous surrounding medium, the length of the linkers should be selected to be shorter than in the case of a less viscous medium such as a paste or liquid.

[0070] In general, intramolecular cross-linking of capsules is possible, in which capsules of one capsule population are cross-linked to one another.

[0071] Generally, it is possible to crosslink capsules with the same contents via intramolecular crosslinking.

[0072] Generally, alternatively or additionally, intertype crosslinking of capsules is possible, in which capsules from at least two different capsule populations are crosslinked with one another.

[0073] In general, capsules with different contents can be crosslinked together via intertypic crosslinking.

[0074] It is also possible to achieve selected release profiles via capsules of multi-component capsule systems, for example two-component capsule systems, e.g., gradual and / or delayed release of any kind of substance is conceivable.

[0075] It is also conceivable that two capsule populations of a two-component capsule system with the same content but different activation mechanisms can be interconnected by homogeneous cross-linking in a batch process on a carrier material, which may allow for a longer sustained release compared to a one-component capsule system.

[0076] Generally, capsules can be manufactured by physical, chemical, physicochemical, and / or similar methods.

[0077] In general, capsules can be produced by solvent evaporation, thermal gelation, gel formation, interfacial polycondensation, polymerization, spray drying, fluidized bed, droplet freezing, extrusion, supercritical fluids, coacervation, air suspension, pan coating, coextrusion, solvent extraction, molecular encapsulation, spray crystallization, phase separation, emulsification, in situ polymerization, insolubility, interfacial separation, emulsification with nanomolecular sieves, ionotropic gelation, coacervation phase separation, matrix polymerization, interfacial crosslinking, coagulation, centrifugal extrusion, and / or one or more further methods.

[0078] Generally, the capsule shell can comprise at least one polymer, wax, resin, protein, polysaccharide, gum arabic, maltodextrin, inulin, metal, ceramic, acrylate, microgel, phase change material, and / or one or more additional substances.

[0079] Generally, the capsule shell can be non-porous or completely non-porous. Generally, the capsule shell can be nearly completely impermeable or completely impermeable.

[0080] In general, the core of the capsule can be solid, liquid, and / or gaseous.

[0081] In general, the capsules can be formed from linear polymers, polymers with multiple valencies, star-shaped polyethylene glycols, self-assembled monolayers (SAMs), carbon nanotubes, cyclic polymers, DNA, dendrimers, ladder polymers, and / or similar materials.

[0082] The SAM surface may be made of disulfites, phosphates, silanes, thiols, and polyelectrolytes, particularly acetylcysteine, dimercaptosuccinic acid, dimercaptopropanesulfonic acid, ethanethiol (ethyl mercaptan), dithiothreitol (DTT), dithioerythritol (DTE), captopril, coenzyme A, cysteine, penicillamine, 1-propanethiol, 2-propanethiol, glutathione, homocysteine, mesna, mercaptoundecanoic acid, mercaptoundecanol, methanethiol (methyl mercaptan), and / or thiophenol.

[0083] The present invention further provides a method for producing a conductive multi-component system comprising at least one first material and at least one substrate, the first material being present in one or more material portions, the method comprising the steps of: forming at least one first functional group and equipping at least one or more first material moieties with a first linker, and / or forming at least one second functional group and equipping at least one second linker on the substrate; Including, The present invention relates to a method in which a first functional group reacts with a second functional group and / or a substrate via a predefined interaction to create a conductive connection, and / or a second functional group reacts with a first functional group and / or a first material via a predefined interaction to create a conductive connection.

[0084] In particular, the method comprises providing an electrically conductive multi-component system comprising at least one first material and at least one second material, the first material being present in a plurality of material portions, and comprising the steps of: forming at least one first functional group and equipping a first material portion with a first linker; forming at least one second functional group and equipping a second material with a second linker; Including, the first functional group reacts with the second functional group via a predefined interaction to connect them together; and It is conceivable that the distance between the functional group and each substance moiety is configured to be determined by each linker.

[0085] In particular, the first material portion is provided with at least one third functional group and a third linker, and the third functional groups each have at least one protecting group, so that only correspondingly functionalized material portions of the first material can be bonded to the material portion of the first material, and the method can be intended to include at least a further step in which the protecting group is initially present and is removed only when the first material portions are to be connected to each other via the third functional group. This prevents the material portion of the first material, in particular the capsule (i.e., the first material portion), from being connected to another material portion of the first material, preferably already. The protecting group can be removed after introduction into a gas phase, a low-viscosity phase, a liquid phase, a high-viscosity phase, or a solid phase, thereby causing intramolecular crosslinking.

[0086] Furthermore, it may be intended that the multi-component system is a multi-component system according to any one of claims 1 to 12.

[0087] Possible protecting groups include acetyl, benzoyl, benzyl, β-methoxyethoxymethyl ether, methoxytriyl, (4-methoxyphenyl)diphenylmethyl, dimethoxytrityl, bis-(4-methoxyphenyl)phenylmethyl, methoxymethyl ether, p-methoxybenzyl ether, methylthiomethyl ether, pivaloyl, tetrahydrofuryl, tetrahydropyranyl, trityl, triphenylmethyl, silyl ether, tert-butyldimethylsilyl, tri-isopropylsilyloxymethyl, triisopropylsilyl, methyl ether, ethoxyethyl ether, methyl ... Examples of suitable aryl esters include methyl ether, p-methoxybenzylcarbonyl, tert-butyloxycarbonyl, 9-fluorenylmethyloxycarbonyl, carbamate, p-methoxybenzyl, 3,4-dimethoxybenzyl, p-methoxyphenyl, one or more tosyl or nosyl groups, methyl ester, benzyl ester, tert-butyl ester, 2,6-disubstituted phenol ester (e.g., 2,6-dimethylphenol, 2,6-diisopropylphenol, 2,6-di-tert-butylphenol), silyl ester, orthoester, and / or oxazoline.

[0088] Possible materials for capsule coatings include albumin, gelatin, collagen, agarose, chitosan, starch, carrageenan, polystarch, polydextran, lactide, glycolide and copolymers, polyalkyl cyanoacrylates, polyanhydrides, polyethyl methacrylate, acrolein, glycidyl methacrylate, epoxy polymers, gum arabic, polyvinyl alcohol, methyl cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, arabinogalactan, polyacrylic acid, ethyl cellulose, polyethylene, polymethacrylate, polyamide (nylon), polyethylene vinyl acetate, cellulose nitrate, silicones, poly(lactide-co-glycolide), paraffin, carnauba wax, spermaceti, beeswax, stearic acid, stearyl alcohol, glycerin stearate, shellac, cellulose acetate phthalate, zein, hydrogels, and the like.

[0089] Possible functional groups include alkanes, cycloalkanes, alkenes, alkynes, phenyl substituents, benzyl substituents, vinyl, allyl, carbene, alkyl halides, phenols, ethers, epoxides, ethers, peroxides, ozonides, aldehydes, hydrates, imines, oximes, hydrazones, semicarbazones, hemiacetals, hemiketals, lactols, acetals / ketals, aminals, carboxylic acids, carboxylic esters, lactones, orthoesters, anhydrides, imides, halogenated carboxylic acids, carboxylic acid derivatives, amides, lactams, peroxyacids, nitriles, carbamates, ureas, guanidines, carbodiimides, amines, anilines, hydroxylamines, hydrazines, hydrazones, azo compounds, nitro compounds, thiols, mercaptans, sulfides, phosphines, P-Ylene, P-Ylide, biotin, streptavidin, metallocenes, and the like.

[0090] Possible release mechanisms include diffusion, dissolution, controlled degradation, erosion, pressure, induction, ultrasound, and the like.

[0091] It is contemplated that a combination of release mechanisms may be used.

[0092] Possible fields of application of the method or system according to the invention include biotechnology, electrical engineering, mechanical engineering, medical technology and / or microtechnology.

[0093] In principle, other fields of application are also possible.

[0094] Further details and advantages of the invention will now be explained on the basis of exemplary embodiments shown in more detail in the drawings. [Brief explanation of the drawings]

[0095] [Figure 1] 1 shows an exemplary embodiment of a multi-component system according to the present invention comprising a first substance and a substrate. [Figure 2] FIG. 2 shows a further exemplary embodiment of a multi-component system according to the invention comprising a first substance and a second substance. [Figure 3] 2 shows a further exemplary embodiment of the multi-component system according to the invention according to FIG. 1. FIG. [Figure 4] 1 or 3 according to a further exemplary embodiment of the multi-component system according to the invention. [Figure 5] 1 shows an exemplary embodiment of the intertypographic crosslinking of two different material moieties according to the invention. [Figure 6] FIG. 1 shows an exemplary embodiment of the inventive intramolecular cross-linking of two identical material parts. [Figure 7] 1 and 2 show further exemplary embodiments of the multi-component system 10, 110 according to the invention. [Figure 8] FIG. 1 shows an exemplary embodiment of an inter-crosslinked capsule system according to the present invention. [Figure 9] 8 shows an exemplary embodiment of an inter- and intra-crosslinked multi-component system according to the invention according to FIG. 7. FIG. [Figure 10] 1 is a flow diagram of a workflow for manufacturing an electrically conductive multi-component system according to the present invention; [Figure 11] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 12] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 13] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 14] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 15] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 16] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 17] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 18] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 19]2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 20] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 21] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 22] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 23] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 24] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 25] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 26] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 27] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 28] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 29] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 30] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 31] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 32] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 33] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 34] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; [Figure 35] 2 is a schematic diagram of a further exemplary embodiment according to the invention of a multi-component system; DETAILED DESCRIPTION OF THE INVENTION

[0096] 1 shows an exemplary embodiment of an electrically conductive multi-component system 10 according to the invention, comprising a first substance S1 and a substrate B. In principle, any kind of conductivity (electrical conductivity, thermal conductivity, signal conductivity, etc.) can be generated in this way.

[0097] In this exemplary embodiment, the electrically conductive multi-component system 10 comprises a first substance S1.

[0098] The first substance S1 is present in a plurality of substance portions.

[0099] The first substance portion has one functional group R (R2) formed thereon.

[0100] Alternatively, two or more functional groups R may be formed on the first substance portion.

[0101] The first substance moiety comprises one first linker L (L1).

[0102] Alternatively, the electrically conductive multi-component system may include two or more first substances S1.

[0103] In this exemplary embodiment, the electrically conductive multi-component system 10 includes one substrate B.

[0104] Alternatively, the electrically conductive multi-component system 10 may include two or more substrates B.

[0105] In this exemplary embodiment, the substrate B has at least one second functional group R (R21) formed thereon.

[0106] In this exemplary embodiment, the substrate B is provided with a second linker L (L2).

[0107] Not shown in FIG. 1 is that the first functional group R (R2) reacts with the second functional group R (R21) through a predefined interaction to connect them together.

[0108] The distance between the functional groups R (R2, R21) and the material moieties and the substrate B is determined by the respective linkers L (L1, L2), where the material moieties of the first material S1 are present as or in nanoparticles and are at least partially electrically conductive, which is not shown in FIG. 1.

[0109] Not shown in FIG. 1 is that the nanoparticles are ferromagnetic nanoparticles and are coated with a conductive metal surface coating.

[0110] However, in general, other magnetic nanoparticles or conductive surfaces are also contemplated.

[0111] It is not shown in FIG. 1 that substrate B can be or is a surface.

[0112] Not shown in FIG. 1 is that the surface may be a wafer, a printed circuit board, or the like.

[0113] Not shown in FIG. 1 is that the surface may be a conductive substrate B.

[0114] Alternatively, the surface may be provided with conductor tracks, which are not shown in FIG.

[0115] Furthermore, not shown in FIG. 1 is that the first linker L (L1) may be longer than the second linker L (L2) or vice versa.

[0116] Furthermore, it is not shown in FIG. 1 that the functional groups R (R2, R21) may be the same or different.

[0117] Furthermore, it is not shown in FIG. 1 that the substance portions of the first substance S1 may be arranged in capsules K, in particular nanocapsules and / or microcapsules.

[0118] It is not explicitly shown in FIG. 1 that the capsules K1 for the first substance S1 may have the same dimensions.

[0119] Furthermore, not shown in FIG. 1 is that at least a portion of the multi-component system 10 is activatable, and activation of the multi-component system 10 occurs through at least one change in pressure, pH value, UV radiation, osmosis, temperature, light intensity, moisture, ultrasound, etc.

[0120] That is, not shown in FIG. 1 is that an electrically conductive system may be possible through activation of one or more portions of a multi-component system.

[0121] Furthermore, it is not shown in FIG. 1 that one or more nanoparticles may be made of a metallic material and have a surface coating, in particular a metallic surface coating and / or a surface functionalization.

[0122] Furthermore, not shown in FIG. 1 is that the surface coating and / or surface functionalization may be formed at least in part, in particular completely, by terminal functional groups R and / or linkers L that selectively bind to the metal surface and / or by SAM surfaces and / or stabilizers.

[0123] Not shown in FIG. 1 is that in general the nanoparticles may be stabilized by a matrix, in particular the surrounding matrix.

[0124] Furthermore, it is not shown in FIG. 1 that the nanoparticles each have at least one shell S and at least one core C.

[0125] Furthermore, not shown in FIG. 1 is that nanoparticles are contained within particles having at least one core C and at least one shell S, where the core C or at least one core C contains at least one nanoparticle.

[0126] Furthermore, it is contemplated that at least a portion of the nanoparticles are arranged in a first capsule K1 and also in at least one capsule K, a second substance portion S3, where each capsule K is activatable, is also contemplated, not shown in FIG. 1 .

[0127] A corresponding method for manufacturing an electrically conductive multi-component system comprising at least one first substance S1 and at least one substrate B, the first substance S1 being present in a plurality of substance portions, comprising the following steps: forming at least one first functional group R (R2) and equipping a first linker L (L1) on a first substance portion S1; forming at least one second functional group R (R21) and equipping a substrate B with a second linker L (L2); Including, The first functional group R (R2) reacts with the second functional group R (R21) via a predefined interaction to connect them together; and The manner in which the distance between the functional group R (R2, R21) and the respective substance moiety is determined by the respective linker L (L1, L2) is not shown in FIG.

[0128] Furthermore, the first substance portion is provided with at least one third functional group R (R1) and is equipped with a third linker L (L3), wherein the third functional groups R (R1) can each have at least one protecting group, so that only correspondingly functionalized substance portions of the first substance S1 can be bonded to the substance portions of the first substance S1, and the method further comprises at least a step, not shown in FIG. 1, in which the protecting group is initially present and is only removed when the first substance portions are to be connected to each other via the third functional group R (R1).

[0129] Furthermore, it is not shown in FIG. 1 that the multi-component system is a multi-component system according to any one of claims 1-12.

[0130] It is not shown in FIG. 1 that the functional groups R1, R2, and R21 can each be replaced with another functional group R.

[0131] In general, all manner of bonding functional groups R together are conceivable.

[0132] FIG. 2 shows a further exemplary embodiment of a multi-component system 10, 110 according to the invention comprising a first substance S1 and a second substance S3.

[0133] Multi-component system 110 includes all of the structural and functional features of multi-component system 10 shown in FIG.

[0134] In this exemplary embodiment, at least a portion of the nanoparticles are disposed within a first capsule K1.

[0135] Furthermore, in this exemplary embodiment, a second substance portion S3 is also provided, which is arranged in at least one capsule K2, wherein the capsules K1, K2 are each activatable.

[0136] In this exemplary embodiment, the capsules K1, K2 are activatable by a change in pressure.

[0137] Alternatively, activation of capsules K1 and / or capsules K2 can be carried out by a change in pH value, UV radiation, osmosis, temperature, light intensity, ultrasound, induction, moisture, etc.

[0138] The functional groups of capsule K1 and capsule K2 are connected to each other.

[0139] Not shown in FIG. 2 is that the second material and / or second material portion S3 is an adhesive, in particular an epoxy resin, polyurethane, acrylate, silicone, combinations thereof, or the like.

[0140] That is, in this exemplary embodiment, double microcapsules D are contemplated.

[0141] Generally, according to the same principle, any other form of multi-microcapsule is also possible.

[0142] Not shown in FIG. 2 is that activation results in the release of nanoparticles in the first capsule K1 and the release of adhesive, for example epoxy resin, in the second capsule K2.

[0143] This allows for the formation of conductive adhesive dots, which is not shown in FIG.

[0144] Not shown in FIG. 2 is the production of multiple microcapsules, e.g., double microcapsules, via microfluidics.

[0145] Not shown in FIG. 2 is that the free functional group R is blocked by a blocking agent.

[0146] Not shown in FIG. 2 is that the free functional group R is blocked by ethanolamine.

[0147] FIG. 3 shows a further exemplary embodiment of a multi-component system 10, 110 according to the invention according to FIG.

[0148] In this exemplary embodiment, at least a portion of the nanoparticles are disposed within a first capsule K1.

[0149] In this exemplary embodiment, a second substance portion S3 is also provided, which is arranged in at least one capsule K2, whereby the capsules K1, K2 are each activatable.

[0150] The first capsule K1 and the second capsule K2 are connected to each other.

[0151] The capsules K1 and K2 each comprise a shell S and a core C.

[0152] That is, as in the exemplary embodiment of FIG. 2, the multi-component system in this exemplary embodiment comprises two different substances S1, S3 and / or capsule populations K1, K2.

[0153] Not shown in FIG. 3 is that the first capsule K1 and / or the second capsule may be or can be bound to substrate B (FIG. 1) (via functional group R).

[0154] In this exemplary embodiment, the first material portion and the second material portion are different.

[0155] That is, in this exemplary embodiment, capsules K1 of the first capsule population and capsules K2 of the second capsule population are different.

[0156] In this exemplary embodiment, the first material portion is connected or connectable to a greater number of material portions than the second material portion.

[0157] That is, in this exemplary embodiment, capsule K1 is connected or connectable to a larger number of capsules K than capsule K2.

[0158] Alternatively, the second material portion may be connected or connectable to a greater number of material portions than the first material portion.

[0159] Alternatively, the second capsule K2 can be connected or connectable to the same number of capsules K as the first capsule K1.

[0160] That is, it is possible that capsule K2 is connected or connectable to a larger number of capsules K than capsule K1.

[0161] FIG. 4 shows a further exemplary embodiment of the multi-component system according to the invention according to FIG. 1 or FIG.

[0162] In this exemplary embodiment, the first material portion and the second material portion have substantially different sizes.

[0163] In this exemplary embodiment, the first capsule K1 has a substantially larger size than the second capsule K2.

[0164] In general, the capsule K1 for the first substance S1 can have a different size than the capsule K2 for the second substance S3, and in particular, the capsule K1 for the first substance S1 is larger than the capsule K2 for the second substance S3.

[0165] Alternatively, the second material portion can have a size that is substantially larger than the first material portion.

[0166] Alternatively, the first material portion and the second material portion can have essentially the same size.

[0167] There is no indication that the first material portions may have essentially the same size and / or that the second material portions may have essentially the same size.

[0168] The capsules K1 and K2 each comprise a shell S and a core C.

[0169] FIG. 5 shows an exemplary embodiment of the inter-crosslinking according to the invention of two different material moieties.

[0170] In this exemplary embodiment, capsules K1 and K2 are cross-linked.

[0171] In this exemplary embodiment, capsule K1 and capsule K2 are inter-crosslinked via functional groups R2 and R21.

[0172] It is not shown in FIG. 5 that the functional groups R2 and R21 can each be replaced with another functional group R.

[0173] In general, all manner of bonding functional groups R together are conceivable.

[0174] It is not shown in FIG. 5 that inter-type cross-linking between the first capsule K1 and the substrate B (instead of the second capsule K2) can take place (see FIG. 1).

[0175] The capsules K1 and K2 each comprise a shell S and a core C.

[0176] Alternatively, the capsules K1, K2 may not include a shell S and / or a core.

[0177] FIG. 6 shows an exemplary embodiment of the inventive intramolecular crosslinking of two identical material parts.

[0178] In this exemplary embodiment, the two capsules K1 are intramolecularly crosslinked.

[0179] In this exemplary embodiment, two capsules K1 are intra-homomorphically cross-linked via the functional group R(R2).

[0180] The capsules K1 and K2 each comprise a shell S and a core C.

[0181] Alternatively, the capsules K1, K2 may not include a shell S and / or a core.

[0182] FIG. 7 shows a further exemplary embodiment of a multi-component system 10, 110 (according to FIGS. 1 and 2) according to the invention.

[0183] In this exemplary embodiment, the multi-component system is a microcapsule system.

[0184] In particular, two different capsule populations K1 and K2 are shown, where a first substance is in the first capsule K1 and a second substance is in the second capsule K2.

[0185] The capsules K1 and K2 shown represent a large number of capsules K1 and K2, for example called a capsule population.

[0186] In this exemplary embodiment, the first substance S1 in the capsule K1 is a nanoparticle.

[0187] That is, the first material portion is present as nanoparticles.

[0188] In this exemplary embodiment, the second substance S3 in the second capsule K2 is the second component.

[0189] In this exemplary embodiment, the second substance S3 is an adhesive.

[0190] In this exemplary embodiment, the second substance S3 is an epoxy resin.

[0191] Generally, any form of adhesive is possible.

[0192] That is, the first substance S1 and the second substance S3 are components of a multi-component system.

[0193] That is, the first material S1 and the second material S3 are components of an electrically conductive multi-component system 10,110.

[0194] In general, two different capsule populations K1 and K2 can be produced in separate batch reactors.

[0195] Capsules K1 and K2 of both capsule populations are functionalized.

[0196] Two different linkers L1 and L3 of different lengths and different functional groups R1 and R2 were formed on the surface of the first capsule K1 (surface functionalization).

[0197] That is, the functional groups R are formed of different types.

[0198] In an alternative exemplary embodiment, the functional groups R can be formed homogeneously.

[0199] The second capsule K2 was provided with a linker L2 and a functional group R21.

[0200] The functional group R21 of the second capsule K2 reacts covalently with the functional group R2 of the first capsule K1.

[0201] It is not shown in FIG. 7 that the functional groups R1, R2, and R21 can each be replaced with another functional group R.

[0202] In general, all manner of bonding functional groups R together are conceivable.

[0203] In this exemplary embodiment, it is possible that the first capsule K1 is connected or connectable to a larger number of capsules K than the second capsule K2.

[0204] In an alternative exemplary embodiment, the second capsule K2 may be connected or connectable to a larger number of capsules K than the first capsule K1.

[0205] The linker L3 should bridge the first capsules K1 to each other (intra-homotypic bridge).

[0206] Via linker L1 and linker L2, capsule K2 is covalently linked to the first capsule K1 (intertypic cross-linking).

[0207] Activation of both capsules K1 and K2 may release the contents of capsules K1 and K2.

[0208] In general, it is possible to determine the number of second capsules K2 bound to a first capsule K1 via the density of surface functionalization of the first capsule K1 or the number of functional groups R2.

[0209] Generally, the two substances S1, S3 are encapsulated separately from each other in capsules K1 and K2 and can be linked in a specific ratio, inter alia, by covalent bonding (e.g., click chemistry), via weak interactions, biochemically (e.g., biotin-streptavidin), covalently, or in other ways and modes.

[0210] In general, three or more different capsules Kn can encapsulate three or more different substances, for example reactive substances.

[0211] In general, different capsules Kn can be functionalized with three or more linkers Ln and different functional groups Rn.

[0212] In general, the linker L can be any form of connection between the capsule and the functional group.

[0213] In general, in the case of heterogeneous functionalization, the functional group R can be used to bond to surfaces, conductor tracks, fibers or textiles.

[0214] Activation of the multi-component system can be achieved by a change in at least one of pressure, pH value, UV radiation, osmosis, temperature, light intensity, moisture, ultrasound, induction, and the like.

[0215] In general, the multi-component capsule system can be used in any desired medium.

[0216] It is not shown in FIG. 7 that the first capsule K1 and / or the second capsule may be or may be attached to substrate B (FIG. 1).

[0217] Thus, a conductive structure, in particular a conductive substrate B, may be provided, which is not shown in FIG.

[0218] FIG. 8 shows an exemplary embodiment of an intramolecularly crosslinked capsule system according to the present invention.

[0219] In this exemplary embodiment, the homogeneously crosslinked capsule system according to the invention is a homogeneously crosslinked microcapsule system.

[0220] A one-component system is shown.

[0221] Capsule population K1 is shown.

[0222] The capsule K1 is filled with one substance.

[0223] That is, the capsule K1 should be considered as a material part of the first material.

[0224] The material moieties are present as nanoparticles.

[0225] In this exemplary embodiment, the nanoparticles are present as magnetic nanoparticles with an electrically conductive surface coating.

[0226] In this exemplary embodiment, the nanoparticles are present as ferromagnetic nanoparticles with an electrically conductive silver surface coating.

[0227] Alternatively, other conductive surface coatings and / or magnetic nanoparticles are contemplated.

[0228] Capsule K1 was functionalized.

[0229] A linker L3 was formed on the capsule K1.

[0230] It is not shown that capsule K1 is functionalized with functional group R1 (on linker L3).

[0231] The linker L3 bridges the capsules K1 to each other (intra-homomeric bridge).

[0232] The distance between capsules K1 can be determined by the length of the linker L3.

[0233] Depending on the density of the surface functionalization R1, the degree of intramolecular cross-linking between capsules K1 can be determined.

[0234] The length of the linker L3 should be selected so that the nanoparticles are at a desired distance from each other.

[0235] FIG. 9 shows an exemplary embodiment of an inter- and intra-crosslinked multi-component system according to the invention according to FIG.

[0236] The first capsule K1 and the second capsule K2 are filled with different substances.

[0237] In this exemplary embodiment, the capsules K1 have essentially the same size.

[0238] In this exemplary embodiment, the capsules K2 have essentially the same size.

[0239] In this exemplary embodiment, capsule K1 and capsule K2 have different sizes.

[0240] In an alternative exemplary embodiment, capsule K1 and capsule K2 can have essentially the same size.

[0241] The basic system corresponds to the diagram in FIG.

[0242] In this exemplary embodiment, the first substance S1 in the capsule K1 is a nanoparticle.

[0243] That is, the first material portion is present as nanoparticles.

[0244] In this exemplary embodiment, the second substance S3 in the second capsule K2 is the second component.

[0245] In this exemplary embodiment, the second substance S3 is an adhesive.

[0246] In this exemplary embodiment, the second substance S3 is an epoxy resin.

[0247] Generally, any form of adhesive is possible.

[0248] That is, the first substance S1 and the second substance S3 are components of a multi-component system.

[0249] That is, the first material S1 and the second material S3 are components of an electrically conductive multi-component system 10,110.

[0250] Furthermore, the first capsule K1 is functionalized with a heterologous linker L1.

[0251] To the linker L1 is attached a second capsule population K2 (see Figure 2, Figure 3, Figure 4 or Figure 7).

[0252] That is, the multi-component system has a network structure with gaps, where the network structure is formed from first capsules K1 and at least one capsule K2 is respectively arranged at least partially within the gaps.

[0253] In general, it is possible to introduce capsules K1 and K2 with different contents into the gas phase.

[0254] The substrate B and / or surface may also be coated with this dispersion.

[0255] In general, capsules K1 and K2 with different contents can be introduced into a paste-like medium, which is inert and easily processable until the capsules are activated and react with each other.

[0256] The advantages of the ideal composition of the capsule system can also be utilized in liquid systems: since the two capsules K1 and K2 of a two-component capsule system are present in close proximity, capsules K1 and K2 are much more likely to react with each other more quickly and precisely than if they were dispersed separately.

[0257] FIG. 10 shows a workflow flow diagram for the fabrication of an electrically conductive multi-component system 10, 110 according to the present invention.

[0258] FIG. 10 is essentially based on a multi-component capsule system according to FIG. 2, FIG. 3, FIG. 4 or FIG.

[0259] In this exemplary embodiment, the first substance S1 in the capsule K1 is a nanoparticle.

[0260] That is, the first material portion is present as nanoparticles.

[0261] In this exemplary embodiment, the second substance S3 in the second capsule K2 is the second component.

[0262] In this exemplary embodiment, the second substance S3 is an adhesive.

[0263] In this exemplary embodiment, the second substance S3 is an epoxy resin.

[0264] Generally, any form of adhesive is possible.

[0265] That is, the first substance S1 and the second substance S3 are components of a multi-component system.

[0266] That is, the first material S1 and the second material S3 are components of an electrically conductive multi-component system 10,110.

[0267] Overall, the production of the electrically conductive multi-component system according to the invention is divided into four steps St1 to St4.

[0268] In a first step St1, the first capsule K1 and the second capsule K2 are functionalized (see FIG. 7).

[0269] In this multi-component system, a first capsule K1 carrying two linkers L1 and L3 is heterogeneously functionalized with functional groups R1 and R2.

[0270] In a separate batch approach, a second population of capsules K2 bearing linker L2 is functionalized with functional group R21.

[0271] The functional group R21 should be selected such that it reacts (covalently) with the functional group R2 of the first capsule K1 in a separate reaction step.

[0272] In a second step St2, the functionalized second capsules K2 are added to the functionalized first capsules K1.

[0273] The functional group R2 and the functional group R21 are bonded to each other (by a covalent bond).

[0274] In general, it is also possible to add a third capsule population or any number of further capsule populations K3 to Kn to the first capsule population K1 and / or the second capsule population K2.

[0275] Each additional capsule population K3 through Kn may again be functionalized with at least one functional group.

[0276] In the third step St3, a predetermined (intra-homogeneous) cross-linking reaction occurs.

[0277] In a fourth step St4, the crosslinked multicomponent capsule population is applied to a substrate B.

[0278] Substrate B is similarly provided with a linker L and a functional group R.

[0279] Not shown in FIG. 10 is that capsule K1 and / or capsule K2 may be attached to a functional group R of substrate B via a linker L bearing a functional group R.

[0280] It is not shown that in step St1, a protecting group may still be formed on the functional group R1 of the linker L3 so that the first capsules K1 do not crosslink with each other prematurely during functionalization.

[0281] In step St3, the removal of the protecting group is not shown.

[0282] Thus, a conductive structure, in particular a conductive substrate B, may be provided, which is not shown in FIG.

[0283] In general, it is possible for the capsules K to be formed as nanocapsules or microcapsules.

[0284] In principle, nanoparticles can be used in all the above and below exemplary embodiments.

[0285] Quantum dots, metal nanoparticles, metal salt nanoparticles, oxides, sulfides, core-shell particles, self-assembled particles, doped nanoparticles, magnetic semiconductor nanoparticles, doped nanoparticles such as TiO2 doped nanoparticles including cobalt, and multilayers such as Fe / Si, Cu / Ni, Co / Pt, semiconductor nanoparticles such as ZnS, CdS, ZnO.

[0286] The nanoparticle form includes essentially any conceivable form of nanoparticles.

[0287] The homogeneous functionalization of the nanoparticles can be carried out with thiol or dithiol groups.

[0288] The exemplary embodiment shown in Figures 11-16 relates to an exemplary embodiment having one linker.

[0289] FIG. 11 shows a further exemplary embodiment of a multi-component system 210 according to the present invention.

[0290] Here, the functionalized substrate B is present together with the substance S1, which is now present directly as particles. A variant involving a linker is concerned.

[0291] Substrate B is functionalized with a functional group R1. The (nano)particles are bound to the functional group and thus to substrate B.

[0292] FIG. 12 shows a further exemplary embodiment of a multi-component system 310 according to the present invention.

[0293] The substance S1 is a functionalized (nano)particle and is associated with a substrate B.

[0294] In this case, the (nano)particles are functionalized with a functional group R1. The functionalized (nano)particles are attached to a substrate B.

[0295] FIG. 13 shows a further exemplary embodiment of a multi-component system 410 according to the present invention.

[0296] Here, it concerns a functionalized substrate B and (nano)particles in the substance part S1, here in the form of microcapsules.

[0297] The substrate B is functionalized with a functional group R1. The (nano)particles are present in the substance portion S1. Activation of the substance portion releases the (nano)particles, which then bind to the functional group of the substrate B.

[0298] FIG. 14 shows a further exemplary embodiment of a multi-component system 510 according to the present invention.

[0299] Here, functionalized (nano)particles in substance part S1 (microcapsules) and substrate B are concerned.

[0300] The (nano)particle is functionalized with a functional group R1 and is present in a substance portion S1. Activation of the substance portion results in the (nano)particle being attached to the substrate B.

[0301] FIG. 15 shows a further exemplary embodiment of a multi-component system 610 according to the present invention.

[0302] Here, it concerns a substrate B functionalized with a functional group R1 and (nano)particles in a material portion S1 which also have (metal) particles on their surface.

[0303] The substrate B is functionalized with a functional group R1. The nanoparticles are present in the substance portion S1. Activation of the substance portion S1 results in the (nano)particles being attached to the substrate B.

[0304] FIG. 16 shows a further exemplary embodiment of a multi-component system 710 according to the present invention.

[0305] Here, it concerns a functionalized substance portion S1 with (nano)particles and a substrate B.

[0306] The substance moiety S1, in which the (nano)particle resides, is functionalized with a functional group R1. The substance moiety S1 can be precisely positioned via the bonding of the functional group of the substance moiety S1 to the substrate B. Upon activation, the (nano)particle is bonded to the substrate B.

[0307] The exemplary embodiment shown in Figures 17-20 pertains to a variation having two linkers.

[0308] FIG. 17 shows a further exemplary embodiment of a multi-component system 810 according to the present invention.

[0309] Here, we are concerned with a functionalized substrate B and functionalized (nano)particles.

[0310] Substrate B is functionalized with functional group R1. The (nano)particle is functionalized with functional group R2. Through activation / reaction, it is bound to substrate B by functional groups R1 and R2.

[0311] FIG. 18 shows a further exemplary embodiment of a multi-component system 910 according to the present invention.

[0312] Here, it concerns a functionalized substrate B and a functionalized substance portion S1 in which at least one (nano)particle resides.

[0313] Substrate B is functionalized with a functional group R1. Substance portion S1 is functionalized with a functional group R3. Within substance portion S1, at least one (nano)particle is present. Through the complementary functional groups R1 and R3, substance portion S1 can be precisely positioned. Upon activation / reaction, the (nano)particle is released and bound to substrate B.

[0314] FIG. 19 shows a further exemplary embodiment of a multi-component system 1010 according to the present invention.

[0315] Here, it concerns a functionalized substrate B and functionalized (nano)particles present in the substance portion S1.

[0316] The substrate B is functionalized with a functional group R1. Within the substance portion S1 there is at least one (nano)particle functionalized with a functional group R2.

[0317] FIG. 20 shows a further exemplary embodiment of a multi-component system 1110 according to the present invention.

[0318] Here, we are concerned with a functionalized substrate B and a functionalized (nano)particle present in a similarly functionalized substance portion S1. Substrate B is functionalized with a functional group R1. The (nano)particle is functionalized with a functional group R2. Substance portion S1 is functionalized with a functional group R3. Thus, the substance portion can be precisely positioned via functional groups R1 and R3. Via activation of substance portion S1, the (nano)particle is released in a site-specific manner. The shell of substance portion S1 can stabilize the (nano)particle.

[0319] FIG. 21 shows a further exemplary embodiment according to the invention of a multi-component system 1210, namely a system comprising double microcapsules with functionalization of the (nano)particles.

[0320] In this case, capsule K10 is filled with adhesive and capsule K20 is filled with (electrically) conductive particles (for example one or more rod-shaped nanoparticles).

[0321] In this embodiment, the adhesive is present in a first microcapsule and at least one (nano)particle and / or carbon nanotube is present in a second microcapsule.

[0322] The adhesive is encapsulated in the microcapsule K10. At least one (nano)particle made of an (electrically) conductive material is present in the microcapsule K20.

[0323] In this case, the surface of the (nano)particles may be functionalized with functional groups, such as terminal thiol groups, or other functional groups R. The shell of microcapsule K10 may consist of the same material and have the same thickness as the shell of microcapsule K20. Furthermore, microcapsule K10 may have the same dimensions as microcapsule K20. However, these parameters may differ from each other in at least one or more respects.

[0324] This mechanism can be a parallel opening mechanism:

[0325] These microcapsules are applied to a metal area / surface. A second metal surface is then placed parallel to the first. A defined activation mechanism simultaneously opens both microcapsules, releasing their contents. The released nanoparticles, functionalized with terminal functional groups, e.g., thiol groups, then bond to both parallel-mounted metal surfaces. The (nano)particles form a network with each other. This can occur through aggregation and / or mutual bonding of functional groups, e.g., thiol groups (inter-type cross-linking). After activation of the adhesive-filled microcapsules K10, the adhesive is expelled, stabilizing the (nano)particle connection in an (electrically) conductive connection. Furthermore, the adhesive bonds the upper and lower surfaces together.

[0326] A sequential release mechanism is also possible:

[0327] These microcapsules are applied to a metal area, where microcapsules K10 have a different opening mechanism than microcapsules K20. A second metal surface is then placed parallel to the first metal surface. The microcapsules with the (nano)particles are first opened and their contents released by a defined activation mechanism, e.g., temperature. The released nanoparticles, functionalized with terminal functional groups R2, e.g., thiol groups, then bond to both surfaces of the parallel-mounted metal surfaces. The (nano)particles form a network with each other. This can occur by aggregation and / or by mutual bonding of functional groups, e.g., thiol groups (inter- and intra-type crosslinking). By means of a second opening mechanism, this is advantageously achieved by microcapsules K10 having a different shell material and / or a different shell material size and / or thickness than microcapsules K10. Second activation mechanisms are conceivable, e.g., ultrasound, a change in pH, induction, pressure, etc. Furthermore, sequential activation can be achieved by alternatives to the first activation mechanism, e.g., by increasing the temperature. After activation of the adhesive-filled microcapsules 1, the adhesive is expelled and the (electrically) conductive (nano)particle-to-particle connections are stabilized, and the adhesive further bonds the upper and lower surfaces together.

[0328] FIG. 22 shows a further exemplary embodiment according to the invention of a multi-component system 1310, namely a variant with (electrically) conductive surface functionalization.

[0329] In this case, an adhesive is encapsulated in microcapsules K10. In microcapsules K20, (nano)particles made of (electrically) conductive material are present. In this case, the (electrically) conductive surface of the conductor tracks is functionalized with terminal thiol groups. The (nano)particles are not functionalized.

[0330] This mechanism can be a parallel opening mechanism:

[0331] These microcapsules are applied to a metal area. A second metal surface is then placed parallel to the first. By a defined activation mechanism, both microcapsules simultaneously open and release their contents. In this case, the released nanoparticles bind to both surfaces of the parallel-mounted metal surfaces, which are functionalized with terminal thiol groups. The (nano)particles form a network with each other. This occurs by mutual aggregation.

[0332] A sequential release mechanism is also possible:

[0333] The attachment mechanism is identical to that described in the exemplary embodiment of FIG. 21, except that here it is the surface rather than the (nano)particles that is functionalized.

[0334] FIG. 23 shows a further exemplary embodiment according to the invention of a multi-component system 1410, namely a variant with functionalization of both the (nano)particles and the (electrically) conductive surface.

[0335] An adhesive is encapsulated in microcapsule K10. Microcapsule K20 contains (nano)particles made of (electrically) conductive material, where both the surface of the (nano)particles and the (electrically) conductive surface of the conductor track (i.e., substrate B) are functionalized with terminal thiol groups.

[0336] Again, both parallel and sequential opening mechanisms are contemplated (see above discussion in connection with the exemplary embodiment of Figures 21 and 22).

[0337] Figure 24 shows a further exemplary embodiment of the multi-component system 1510 according to the invention, namely a variant involving both homogeneous functionalization of the (nano)particles and functionalization of the (electrically)conductive surface with reactive functional groups other than thiols.

[0338] In this variant, the microcapsules K10 are filled with adhesive. Microcapsules K20 with functionalized (nano)particles. The (electrically) conductive surface is functionalized with functional groups complementary to the functional groups of the (nano)particles.

[0339] The opening mechanisms can occur in parallel or sequentially (see above description in connection with the exemplary embodiment of Figures 21 and 22).

[0340] Figure 25 shows a further exemplary embodiment of the multi-component system 1610 according to the invention, namely a variant involving both homogeneous functionalization of the (nano)particles (substance S1) and functionalization of the (electrically) conductive surface (substrate B) with reactive functional groups.

[0341] In this exemplary embodiment, the surfaces of both the (nano)particles and the (electrically) conductive surface of substrate B are (i.e.) "charged". In this case, the surface of the (nano)particles has a negative charge. The surface of the (electrically) conductive surface (of substrate B) has a positive charge. In a further variant, the surfaces may be oppositely charged, i.e. the (nano)particles are positively charged and the (electrically) conductive surface or substrate B is negatively charged.

[0342] Figure 26 shows a further exemplary embodiment of the multi-component system 1710 according to the invention, namely a variant with both heterogeneous functionalization of the (nano)particles (substance S1) for inter- and intra-type crosslinking and functionalization of the (electrically) conductive surface (substrate B).

[0343] In this exemplary embodiment, the (nano)particles are functionalized with two different functional groups. In this case, one functional group can be a terminal thiol R4 and the other a carboxyl group R2. The (electrically) conductive surface is functionalized with a functional group complementary to the (nano)particles, in this example a terminal primary amine R1. The (nano)particles are crosslinked to each other (by inter- and / or intra-type crosslinking) via the thiol groups.

[0344] FIG. 27 shows a further exemplary embodiment according to the invention of a multi-component system 1810, namely a variant with functionalization of the microcapsules (substance S1).

[0345] Double microcapsules are produced as described above. Additional functional groups that are not involved in the bonding of the microcapsules to each other are attached to the (electrically) conductive surface (substrate B). For this purpose, a terminal thiol that selectively bonds only to the metal area should be used. In this way, the microcapsules can be placed only in the desired location (for example) on the metal surface, so that conductivity in the x direction does not occur.

[0346] FIG. 28 shows a further exemplary embodiment according to the invention of a multi-component system 1910, namely a variant with functionalization of an (electrically) conductive surface (substrate B).

[0347] In this exemplary embodiment, the (electrically) conductive surface is functionalized with a terminal thiol group R1. At least one nanocapsule and / or microcapsule has metal (nano)particles on its surface. By applying the microcapsules onto the surface, the microcapsules with the metal (nano)particles selectively bind only to the surface with the terminal thiol group.

[0348] Instead of metal (nano)particles, microcapsules may be completely and / or partly covered by a metal surface.

[0349] FIG. 29 shows a further exemplary embodiment according to the invention of a multi-component system 2010, namely a variant with functionalization of microcapsules (substance S1) with metals (nanoparticles) and a surface (substrate B).

[0350] In this case, the surface of the microcapsules is provided with metal nanoparticles. The (nano)capsules and / or microcapsules can be functionalized by adding a chemical compound R3, such as a thiol compound, with a terminal polymer. The second functional group of the polymer may be provided with a further functional group R5. The thiol group R3 is thus bonded to the metal particle of the (nano)capsules and / or microcapsules. The second functional group remains active and available for further reaction. The microcapsules thus have a defined number of defined functional groups.

[0351] Dithiols allow the functionalization of microcapsules and also the attachment to (electrically) conductive surfaces.

[0352] 30 and 31 respectively show further exemplary embodiments of the multi-component system 2110 or the multi-component system 2210 according to the present invention, namely variations on functionalization with thiol groups.

[0353] In order to bind the microcapsules K10, K20 to the (electrically) conductive surface (substrate B), the (nano)capsules and / or microcapsules K10, K20 are provided with functional groups R3 and the (electrically) conductive surface B is coated with complementary functional groups R1.

[0354] In this case, only one of the double microcapsules may be provided with a functional group (see Figure 30), or both microcapsules of the double microcapsule may be provided with a functional group (see Figure 31).

[0355] Figures 32-34 show further exemplary embodiments 2310, 2410, 2510, and 2610, respectively, of multi-component systems comprising multiple microcapsules (each suitable for connection to a substrate (not shown in Figures 32-34)) according to the present invention.

[0356] The exemplary embodiment shown in Figures 32-34 can be manufactured according to the manufacturing processes described above and below, and therefore can correspondingly have the corresponding features of other systems.

[0357] The adhesive (glue) may be a one-component or two-component adhesive, where the adhesive may be present in the same and / or separate material parts. When referring to a multi-component adhesive, it is even conceivable that a corresponding number of components are intended.

[0358] Figure 32 shows a multi-component system 2310 having (viewed from left to right) adhesive 1 in a first capsule material portion K10 (far left), a single nanoparticle in a second capsule K20, and a further capsule K10 having adhesive 1. Embodiments with multiple nanoparticles in one capsule are also possible.

[0359] 33 shows a multi-component system 2410 having (from left to right) Adhesive 1 in a first capsule K10 (far left), a second Adhesive 2 in capsule K30, and a single nanoparticle in a third capsule. Adhesive 1 and Adhesive 2 can be components of a one-component adhesive, a two-component adhesive, or a multi-component adhesive.

[0360] 34 shows a multi-component system 2510 having (from left to right) adhesive 2 in a first capsule K10, a second adhesive 1 in capsule K30, and a single nanoparticle in a third capsule K20. Adhesive 1 and adhesive 2 can be components of a two-component adhesive or a multi-component adhesive.

[0361] 35 shows a multi-component system 2610 having (from left to right) an adhesive 2 in a first capsule K10 (far left), a single nanoparticle in a second capsule K20, and a second adhesive 1 in a third capsule K30. Adhesive 1 and adhesive 2 can be components of a one-component adhesive, a two-component adhesive, or a multi-component adhesive.

[0362] In principle, in the above exemplary embodiments, (electrical) conductivity can be achieved in a specific predetermined or predeterminable direction as follows, where conductivity is not limited to electrical conductivity only, but can also relate to the transfer of electricity, heat, data, etc.

[0363] (Nano)particles functionalized with terminal thiol groups or magnetic particles or substrates and / or particles provided with functional groups are used. Electrostatic interactions can also be used.

[0364] In this case, the terminal functional group may be provided with a protecting group.

[0365] For example, nanoparticles and adhesives may be encapsulated within microcapsules.

[0366] In that case, you can do the following: 1. Microcapsules encapsulating (nanoparticles) are brought together in a surrounding medium (e.g., adhesive) as in (our first patent). 2. Opening the microcapsules and releasing the particles via an activation mechanism (e.g., temperature). 3. Self-aligning the particles in the desired direction through chemical reaction, self-assembly, magnetism, or other mechanisms. 4. Immobilization of the particles via a surrounding medium which is also hardened by heat, for example.

[0367] In this case, the opening of the microcapsules, the alignment of the particles, and the hardening of the surrounding medium can be carried out in parallel or sequentially.

[0368] In further exemplary embodiments, it may be composed of, for example, three layers: a surface (substrate), then a first layer (e.g., a surrounding medium, e.g., an adhesive, a SAM coating, etc.), then a second layer containing microcapsules in which the nanoparticles are encapsulated, and then a third layer (surrounding medium, e.g., an adhesive).

[0369] In this case, the surface or substrate is first coated.

[0370] This is followed by coating with functionalized capsules containing nanoparticles that can be released via a defined activation mechanism.

[0371] In this case, the terminal functional group may be blocked with a protecting group.

[0372] The particles are aligned in the X direction by chemical reactions such as self-assembly, electrostatic interactions, magnetism, etc.

[0373] In all the above exemplary embodiments, it is possible in principle that multiple nanoparticles can be used within one capsule.

[0374] Isolation and placement of single nanoparticles within capsules can be achieved, for example, via Nanoporetech technology (see Venkatesan, Bala Murali, and Rhashid Bashir, Nanopore Sensors for nucleic acid analysis, Nature Nanotechnology 6.10 (2011): 615). This method allows only single DNA strands to pass through an isolation channel and can also be used to isolate nanoparticles. [Explanation of symbols]

[0375] 10 Multi-component system 110 Multi-component system 210 Multi-component system 310 Multi-component system 410 Multi-component system 510 Multi-component system 610 Multi-component system 710 Multi-component system 810 Multi-component system 910 Multi-component system 1010 Multi-component system 1110 Multi-component system 1210 Multi-component system 1310 Multi-component system 1410 Multi-component system 1510 Multi-component system 1610 Multi-component system 1710 Multi-component system 1810 Multi-component system 1910 Multi-component system 2010 Multi-component system 2110 Multi-component system 2210 Multi-component system 2310 Multi-component system 2410 Multi-component system 2510 Multi-component system 2610 Multi-component system B Base material C core D Double Microcapsules K Capsule / Capsule Group K1 Capsule 1 / Capsule Group 1 K2 Capsule 2 / Capsule Group 2 K10 Capsule 10 / Capsule Group 10 K20 Capsule 20 / Capsule Group 20 K30 Capsules 30 / Capsule Group 30 Kn Capsule n / Capsule group n L Linker L1 linker L2 Linker L3 Linker R functional group R1 functional group R2 functional group R3 functional group R4 functional group R5 functional group R21 functional group Rn Functional group n S Capsule / Shell S1 Substance / Substance part S3 Substance / Substance part St1 process 1 St2 process 2 St3 process 3 St4 process 4

Claims

1. A conductive multi-component system (10, 110) comprising at least one first substance (S1) and at least one substrate (B), a) the first substance (S1) is present in a plurality of substance portions, wherein the substance portions of the first substance (S1) are arranged in capsules (K1); b) the first material portion is formed with at least one first functional group (R) and is provided with a first linker (L), and / or the substrate (B) is formed with at least one second functional group (R) and is provided with a second linker (L); c) the first functional group (R) reacts with the second functional group (R) and / or the substrate via a predefined interaction, thereby connecting them to each other, and / or the second functional group (R) reacts with the first functional group (R) and / or the first substance (S1) via a predefined interaction, thereby connecting them to each other; d) the material portions of the first material (S1) are present as or in particles and are at least partially conductive; and A conductive multi-component system, wherein the first material portions have at least one third functional group (R) formed thereon and are equipped with a third linker (L3), and the first material portions are connected to each other by the third functional group (R).

2. 2. A multi-component system (10, 110) according to claim 1, characterized in that the conductivity of the material parts is electrical and / or thermal and / or signal conductive.

3. 3. A multi-component system (10, 110) according to claim 1 or 2, characterized in that the distance between the first functional group (R) and the substance moiety and the distance between the second functional group (R) and the substrate (B) are determined by respective linkers (L).

4. A multi-component system (10, 110) according to any one of claims 1 to 3, characterized in that the substrate (B) is a circuit board or a printed circuit board or a conductor track.

5. A multi-component system (10, 110) according to any one of claims 1 to 3, characterized in that the substrate (B) is a second material.

6. 6. A multi-component system (10, 110) according to claim 5, characterized in that the second substance is present in one or more substance portions.

7. A multi-component system (10, 110) according to any one of claims 1 to 6, characterized in that the first linker (L) is longer than the second linker (L) or vice versa.

8. A multi-component system (10, 110) according to any one of claims 1 to 7, characterized in that the functional groups (R) are formed of the same or different types.

9. A multi-component system (10, 110) according to any one of claims 1 to 8, characterized in that the capsules (K) are nanocapsules or microcapsules.

10. 10. A multi-component system (10, 110) according to claim 9, characterized in that the capsules (K) for the first substance (S1) have the same size.

11. A multi-component system (10, 110) according to any one of claims 1 to 10, characterized in that at least a part of the multi-component system is activatable and activation of the multi-component system is achieved by a change in at least one of pressure, pH value, UV radiation, osmosis, temperature, light intensity or moisture.

12. A multi-component system (10, 110) according to any one of claims 1 to 11, characterized in that the substance portions of the first substance (S1) are present as or in nanoparticles.

13. 13. A multi-component system (10, 110) according to claim 12, characterized in that the nanoparticles consist of a metallic material and have a surface coating, in particular a metallic surface coating or a surface functionalization.

14. 14. A multi-component system (10, 110) according to claim 13, characterized in that the surface coating or surface functionalization is formed at least partly, in particular completely, by terminal functional groups (R) and linkers (L) which selectively bind to the metal surface, or by SAM surfaces or stabilizers.

15. A multi-component system (10, 110) according to any one of claims 12 to 14, characterized in that the nanoparticles are stabilized by a matrix, in particular a surrounding matrix.

16. A multi-component system (10, 110) according to any one of claims 12 to 15, characterized in that the nanoparticles each have at least one shell and at least one core.

17. A multi-component system (10, 110) according to any one of claims 12 to 16, characterized in that the nanoparticles are contained within particles having at least one core and at least one shell, wherein the at least one core contains the at least one nanoparticle.

18. A method for producing a conductive multi-component system (10, 110) comprising at least one first material (S1) and at least one substrate (B), said first material (S1) being present in a plurality of material portions, comprising the following steps: forming at least one first functional group (R) and providing a first linker (L) on the first material portion, and / or forming at least one second functional group (R) and providing a second linker (L) on the substrate (B); Including, the first functional group (R) reacts with the second functional group (R) and / or the substrate via a predefined interaction to create a conductive connection; and / or the second functional group (R) reacts with the first functional group (R) and / or the first substance (S1) via a predefined interaction to create a conductive connection; The first material moiety is provided with at least one third functional group (R) and is equipped with a third linker (L), wherein the third functional groups (R) each have at least one protecting group, so that only correspondingly functionalized material moieties of the first material (S1) can be bound to the material moiety of the first material (S1), and the method further comprises at least a step in which the protecting groups are initially present and are only removed when the first material moieties are to be connected to each other via the third functional groups (R).

19. Method according to claim 18, characterized in that the multi-component system (10, 110) is a multi-component system (10, 110) according to any one of claims 1 to 17.

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