Photosensitive resin composition for sandblasting and dry film

Abstract

To provide a photosensitive resin composition for sandblasting that allows for the formation of highly sensitive and fine patterns while exhibiting excellent alkali developability and sand blast resistance.SOLUTION: A photosensitive resin composition for sandblasting contains (A) alkali-soluble resin, (B) a photopolymerization initiator, (C) a urethane methacrylate compound free of a carboxy group, and (D) a specific pentaerythritol tetra acrylate compound.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin composition for sandblasting and a dry film having a photosensitive resin layer formed using the same. [Background technology]

[0002] Conventionally, sandblasting has been used to cut glass, stone, metal, plastic, ceramic, etc., to form reliefs. Sandblasting is a process in which a resin layer patterned by photolithography or other methods is provided on the surface to be treated as a mask, and then an abrasive is sprayed onto the surface to selectively cut the unmasked portion.

[0003] The photosensitive resin composition used as a mask material for this sandblasting treatment is, for example, a dry film having a photosensitive resin layer on a support such as a polyester film. The photosensitive resin layer generally contains an alkali-soluble resin, a urethane (meth)acrylate, and a photopolymerization initiator. The alkali-soluble resin used is a cellulose derivative or a carboxyl group-containing acrylic resin (for example, JP-A-10-239840 (Patent Document 1) or JP-A-10-69851 (Patent Document 2)). In this specification, "(meth)acrylate" refers to both or either of acrylate and methacrylate.

[0004] As photolithography technology becomes increasingly finer, there is a demand for the ability to form fine patterns of, for example, 100 μm or less when cutting a workpiece using sandblasting. As a photosensitive resin composition for sandblasting capable of forming fine patterns, Japanese Patent Laid-Open Publication No. 8-54734 (Patent Document 3) describes a photosensitive resin composition containing a carboxy-modified urethane (meth)acrylate compound having a specific acid value and a glass transition temperature after curing, an alkali-soluble polymer compound having a specific acid value, and a photopolymerization initiator. However, further improvement is desired in terms of achieving both fine pattern reproducibility and sandblasting resistance.

[0005] On the other hand, as a photosensitive resin composition capable of forming fine patterns, International Publication No. 2020 / 027024 (Patent Document 4) describes a photosensitive resin composition containing an alkali-soluble resin, a photopolymerization initiator, and a specific ethylene oxide-modified pentaerythritol tetraacrylate. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 10-239840 [Patent Document 2] Japanese Patent Application Publication No. 10-69851 [Patent Document 3] Japanese Patent Application Publication No. 8-54734 [Patent Document 4] International Publication No. 2020 / 027024 Brochure Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a photosensitive resin composition that is capable of forming a fine pattern with high sensitivity, has excellent alkaline developability, and is excellent in sandblast resistance. [Means for solving the problem]

[0008] The present inventors have found that the above problems can be solved by the following means.

[0009] (1) A photosensitive resin composition for sandblasting, comprising (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a urethane (meth)acrylate compound having no carboxy group, and (D) an ethylene oxide-modified pentaerythritol tetraacrylate compound represented by the following general formula (i):

[0010] [ka]

[0011] In the general formula (i), the total value of l, m, n, and o is 4 to 8.

[0012] (2) A dry film having a photosensitive resin layer containing at least the photosensitive resin composition for sandblasting described in (1) above on one surface of a support, and a cover film on the photosensitive resin layer. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a photosensitive resin composition that is capable of forming a fine pattern with high sensitivity, has excellent alkaline developability, and is excellent in sandblast resistance. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic cross-sectional view showing an example of a dry film produced using the photosensitive resin composition of the present invention. [Figure 2] Schematic cross-sectional view showing another example of a dry film produced using the photosensitive fertilization composition of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] The photosensitive resin composition for sandblasting (hereinafter sometimes abbreviated as "photosensitive resin composition") of the present invention will be described in detail below.

[0016] The photosensitive resin composition of the present invention contains (A) an alkali-soluble resin, such as an alkali-soluble cellulose derivative or a carboxyl group-containing acrylic resin.

[0017] Examples of alkali-soluble cellulose derivatives include cellulose acetate phthalate, hydroxypropyl methylcellulose phthalate, hydroxypropyl methylcellulose acetate phthalate, and hydroxypropyl methylcellulose acetate succinate.

[0018] Examples of carboxyl group-containing acrylic resins include acrylic polymers obtained by copolymerizing (meth)acrylate with an ethylenically unsaturated carboxylic acid. Other copolymerizable monomers having an ethylenically unsaturated group may also be copolymerized.

[0019] Examples of the (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, n-hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, glycidyl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-(dimethylamino)ethyl (meth)acrylate, 2-(diethylamino)ethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, and 2,2,3,3-tetrafluoropropyl (meth)acrylate.

[0020] As the ethylenically unsaturated carboxylic acid, monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid are preferably used, and dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid, as well as anhydrides and half esters thereof, can also be used. Among these, acrylic acid and methacrylic acid are particularly preferred.

[0021] Examples of the other copolymerizable monomers having an ethylenically unsaturated group include styrene, α-methylstyrene, p-methylstyrene, p-ethylstyrene, p-methoxystyrene, p-ethoxystyrene, p-chlorostyrene, p-bromostyrene, (meth)acrylonitrile, (meth)acrylamide, diacetone acrylamide, vinyltoluene, vinyl acetate, and vinyl-n-butyl ether.

[0022] The acid value of (A) alkali-soluble resin is preferably 30 to 500 mgKOH / g, and more preferably 100 to 300 mgKOH / g. If the acid value is less than 30 mgKOH / g, the alkaline development time tends to be long, while if the acid value exceeds 500 mgKOH / g, the blast resistance may decrease. The acid value is a value measured in accordance with JIS K2501:2003.

[0023] The weight average molecular weight of the alkali-soluble resin (A) is preferably 10,000 to 200,000, and more preferably 10,000 to 150,000. If the weight average molecular weight is less than 10,000, it may be difficult to form the photosensitive resin composition of the present invention into a film, while if it exceeds 200,000, the solubility in an alkaline developer tends to decrease.

[0024] The photosensitive resin composition of the present invention contains (B) a photopolymerization initiator. Examples of (B) photopolymerization initiators include benzophenone, N,N,N',N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N,N,N',N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propanone. aromatic ketones such as 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone, and other quinones; benzoin methyl ether benzoin ether compounds such as benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, methylbenzoin and ethylbenzoin; benzyl derivatives such as benzil dimethyl ketal; 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2,4,5-triarylimidazole dimers such as 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer; acylphosphine compounds such as diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide and phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; acridine derivatives such as 9-phenylacridine and 1,7-bis(9,9′-acridinyl)heptane; N-phenylglycine, N-phenylglycine derivatives, and coumarin compounds.The substituents on the aryl groups of the two 2,4,5-triarylimidazoles in the 2,4,5-triarylimidazole dimer may be the same to give a symmetrical compound, or may be different to give an asymmetrical compound. Furthermore, a thioxanthone compound may be combined with a tertiary amine compound, such as the combination of diethylthioxanthone and dimethylaminobenzoic acid. These compounds may be used alone or in combination of two or more.

[0025] The photosensitive resin composition of the present invention contains (C) a urethane (meth)acrylate compound that does not have a carboxy group. Although the reason for this is unclear, the inclusion of a urethane acrylate having a carboxy group in the photosensitive resin composition increases its solubility in alkaline developers, making it easier to remove the photosensitive resin layer containing the photosensitive resin composition. However, this increases the energy required to cure the photosensitive resin composition, making it difficult to form highly sensitive, fine patterns. Even if highly sensitive, fine patterns can be formed, the resulting coating lacks elasticity and flexibility, resulting in reduced sandblasting resistance.

[0026] (C) Examples of urethane (meth)acrylate compounds without a carboxyl group include reaction products of compounds having a terminal isocyanate group, which are formed by the reaction of a compound having a polyvalent hydroxyl group with a polyvalent isocyanate compound, and a (meth)acrylate compound having a hydroxyl group. Examples of compounds having a polyvalent hydroxyl group include polyesters and polyethers having a hydroxyl group. Examples of polyesters include polyesters obtained by ring-opening polymerization of lactones, polycarbonates, and polyesters obtained by the condensation reaction of alkylene glycols such as ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, and dipropylene glycol with dicarboxylic acids such as maleic acid, fumaric acid, glutaric acid, and adipic acid. Specific examples of lactones include δ-valerolactone, ε-caprolactone, β-propiolactone, α-methyl-β-propiolactone, β-methyl-β-propiolactone, α,α-dimethyl-β-propiolactone, and β,β-dimethyl-β-propiolactone. Specific examples of the polycarbonates include reaction products of diols such as bisphenol A, hydroquinone, and dihydroxycyclohexanone with carbonyl compounds such as diphenyl carbonate, phosgene, and succinic anhydride.Specific examples of the polyethers include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polypentamethylene glycol.

[0027] Specific examples of polyisocyanate compounds that react with the compound having a polyvalent hydroxy group include aliphatic or alicyclic diisocyanate compounds such as dimethylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, heptamethylene diisocyanate, 2,2-dimethylpentane-1,5-diisocyanate, octamethylene diisocyanate, 2,5-dimethylhexane-1,6-diisocyanate, 2,2,4-trimethylpentane-1,5-diisocyanate, nonamethylene diisocyanate, 2,2,4-trimethylhexane diisocyanate, decamethylene diisocyanate, and isophorone diisocyanate. These compounds may be used alone or in mixtures of two or more.

[0028] Specific examples of the (meth)acrylate compound having a hydroxy group include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl acrylate, and 3-hydroxypropyl methacrylate, as well as compounds in which 1 to 10 mol of ε-caprolactone is added to 1 mol of any of these.

[0029] The photosensitive resin composition of the present invention contains (D) an ethylene oxide-modified pentaerythritol tetraacrylate compound represented by general formula (i). In general formula (i), the total value of l, m, n, and o is 4 to 8. This allows for the formation of fine patterns, and provides a photosensitive resin composition with excellent alkaline developability and sandblasting resistance. If the total value of l, m, n, and o in general formula (i) is less than 4, it becomes difficult to leave fine images, particularly isolated fine images. If the total value of l, m, n, and o is greater than 8, it becomes difficult to remove fine non-image areas. From the viewpoint of a balance between fine pattern formation and alkaline developability, it is preferable that the total value of l, m, n, and o in general formula (i) is 4.

[0030] [ka]

[0031] In the general formula (i), the total value of l, m, n, and o is 4 to 8.

[0032] The photosensitive resin composition of the present invention may contain components other than the above components (A) to (D) as needed. Examples of such components include photopolymerizable monomers, solvents, thermal polymerization inhibitors, plasticizers, colorants (dyes, pigments), photocoloring agents, photocolor-reducing agents, thermal color-development inhibitors, fillers, defoamers, flame retardants, adhesion promoters, leveling agents, release promoters, antioxidants, fragrances, thermosetting agents, water repellents, and oil repellents. Each of these components may be contained in an amount of 0.01 to 20% by mass relative to the total amount of components (A) to (D). These components may be used alone or in combination of two or more.

[0033] The photopolymerizable monomer is a compound having at least one polymerizable ethylenically unsaturated group in the molecule, other than component (C) a urethane (meth)acrylate compound not having a carboxy group and component (D) a pentaerythritol tetraacrylate compound represented by general formula (i). Examples include compounds obtained by reacting a polyhydric alcohol with an α,β-unsaturated carboxylic acid, bisphenol A (meth)acrylate compounds, compounds obtained by reacting a glycidyl group-containing compound with an α,β-unsaturated carboxylic acid, (meth)acrylic acid alkyl esters, and ethylene oxide- or propylene oxide-modified (meth)acrylates. These photopolymerizable monomers can be used alone or in combination of two or more.

[0034] Furthermore, as the photopolymerizable monomer, a compound having three or more polymerizable ethylenically unsaturated groups in the molecule may be used. Examples of the photopolymerizable monomer having three or more polymerizable ethylenically unsaturated groups in the molecule include trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and trimethylolpropane triglycidyl ether tri(meth)acrylate, and these may be used alone or in combination of two or more.

[0035] In the photosensitive resin composition of the present invention, the amount of component (A) is preferably 3 to 50 mass % and more preferably 20 to 40 mass % based on the total amount of components (A), (B), (C), and (D). If the amount of component (A) is less than 3 mass %, the film-forming properties may be insufficient or the alkali developability may be reduced. If the amount of component (A) is more than 50 mass %, the sandblasting resistance may be reduced.

[0036] The amount of component (B) is preferably 0.1 to 10% by mass, more preferably 0.3 to 6.5% by mass, based on the total amount of components (A), (B), (C), and (D). If the amount of component (B) is less than 0.1% by mass, photopolymerization tends to be insufficient. On the other hand, if it exceeds 10% by mass, absorption of actinic rays at the surface of the photosensitive resin layer during exposure tends to increase, resulting in insufficient photocrosslinking within the photosensitive resin layer.

[0037] The blending amount of component (C) is preferably 30 to 80 mass% and more preferably 50 to 70 mass% based on the total amount of components (A), (B), (C), and (D). If the blending amount of component (C) is less than 30 mass%, sandblast resistance tends to decrease and photosensitivity tends to be insufficient. On the other hand, if it exceeds 80 mass%, the adhesion of the film surface tends to increase.

[0038] The amount of component (D) is preferably 1 to 30% by mass, more preferably 3 to 15% by mass, based on the total amount of components (A), (B), (C), and (D). If the amount of component (D) is less than 1% by mass, adhesion tends to decrease. On the other hand, if it exceeds 30% by mass, sandblasting resistance tends to decrease.

[0039] The photosensitive resin composition of the present invention may be configured as a dry film laminated with a support 1, a photosensitive resin layer 3, and a cover film 4, as shown in FIG. 1. Alternatively, it may be configured as a dry film laminated with a support 1, a release layer 2, a photosensitive resin layer 3, and a cover film 4, as shown in FIG. 2. The support 1 is preferably a transparent film that transmits actinic rays. A thinner film is preferable because it reduces light refraction, while a thicker film is preferable because it provides excellent coating stability, with a thickness of 10 to 100 μm being preferred. Examples of such films include polyethylene terephthalate and polycarbonate. Examples of the release layer 2 include polyvinyl alcohol and mixtures of alkali-soluble resins and urethane (meth)acrylate. The cover film 4 may be a film with high releasability that can peel off the uncured or cured photosensitive resin layer 3. Examples include polyethylene film, polypropylene film, and polyethylene film coated with a release agent such as silicone. The photosensitive resin layer 3 is formed by applying the photosensitive resin composition of the present invention to the support 1 or the release layer 2 and drying it.

[0040] The method for applying the photosensitive resin layer is not particularly limited, and various application methods can be used, such as spraying, roll coating, spin coating, slit coating, extrusion coating, curtain coating, die coating, wire bar coating, applicator bar coating, knife coating, etc. Drying conditions vary depending on the types and content ratios of each component, but are usually at 60 to 110°C for 30 seconds to 15 minutes.

[0041] Dry film can be used in two ways: directly and indirectly. In the direct method, the cover film 4 is first removed, and then the photosensitive resin layer 3 is attached to the substrate using a laminator or similar tool so that it is in contact with the substrate. Next, the substrate is exposed to light from the support 1 side through a mask film that matches the desired relief image, and then the support 1 is peeled off. Alternatively, if high resolution is required, the substrate is exposed to light from the side from which the support 1 was peeled off through a mask film that matches the desired relief image. The exposed areas are then hardened. The unexposed areas are then washed away with an alkaline developer (if a peel layer 2 is present, it is removed at the same time), followed by a water rinse. The substrate is then sandblasted through the patterned resin layer to process it.

[0042] The indirect method is often used when laminating a dry film to the substrate or contact exposure is not possible. First, the dry film is exposed through a mask film that matches the desired relief image, and then the support 1 is peeled off. Alternatively, if high resolution is required, the support 1 is peeled off and then exposed from the peeled side through a mask film that matches the desired relief image. The exposed areas are cured. Next, the unexposed areas are washed away with an alkaline developer (if a release layer 2 is present, it is removed at the same time), followed by water rinsing. This results in a patterned resin layer being formed on the cover film 4. Next, the patterned resin layer surface is attached to the substrate using a water-based adhesive or the like, the cover film 4 is peeled off, and the patterned resin layer is left on the substrate. Next, the substrate is sandblasted through the patterned resin layer to process it.

[0043] The thickness of the photosensitive resin layer is preferably 10 to 150 μm, and more preferably 20 to 120 μm. If the photosensitive resin layer is too thick, problems such as reduced resolution and increased costs are likely to occur. Conversely, if the photosensitive resin layer is too thin, sandblasting resistance tends to decrease. [Example]

[0044] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0045] (Examples 1 to 16, Comparative Examples 1 to 3) The components shown in Table 1 were mixed to obtain a coating solution of a photosensitive resin composition. The content of each component in Table 1 is expressed in parts by mass. The obtained coating solution was applied to a polyethylene terephthalate (PET) film (support, product name: R310, 25 μm thick, manufactured by Mitsubishi Chemical Corporation) using an applicator bar, and the film was dried at 70°C for 8 minutes to remove the solvent component, forming a photosensitive resin layer (50 μm thick) containing the photosensitive resin composition on one side of the PET film. A polyethylene film (cover film, product name: GF1, 50 μm thick, manufactured by Tamapoly Corporation) was then attached to the surface of the photosensitive resin layer to produce a dry film.

[0046] [Table 1]

[0047] In Table 1, the components are as follows: (A-1) Cellulose acetate phthalate (acid value: 200 mg KOH / g, mass average molecular weight: 60,000) (B-1) 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer (B-2) Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (B-3) N,N,N',N'-Tetraethyl-4,4'-diaminobenzophenone (C-1) Shiko (registered trademark) UV-3000B (manufactured by Mitsubishi Chemical Corporation) Urethane (meth)acrylate compound without a carboxyl group (C-2) Shiko (registered trademark) UV-2000B (manufactured by Mitsubishi Chemical Corporation) Urethane (meth)acrylate compound without a carboxyl group (C-3) DAUA-167 (Kyoeisha Chemical Co., Ltd.) is a 53% by mass solution of a urethane acrylate compound having a carboxy group, with carbitol acetate as the solvent. The values ​​in the table are the blend amounts of only the urethane acrylate, without the solvent. (D-1) Ethylene oxide-modified pentaerythritol tetraacrylate (l+m+n+o=4 in general formula (i)) (D-2) Ethylene oxide-modified pentaerythritol tetraacrylate (l+m+n+o=12 in general formula (i)) (D-3) Ethylene oxide-modified pentaerythritol tetraacrylate (l+m+n+o=0 in general formula (i))

[0048] The cover film of each of the dry films in Examples 1 to 16 and Comparative Examples 1 to 3 was peeled off, and the dry films were attached to a 3 mm thick glass plate with the photosensitive resin layer in contact with it using a laminator heated to 100°C. Next, the photosensitive resin layer was irradiated with a metal halide lamp (100 mJ / cm) through a photomask having line and space patterns of 60 & 60, 80 & 80, 100 & 100, and 200 & 200 μm. 2 ) and exposed to light. Next, the PET film was peeled off, and alkaline development was carried out with a 0.2% by mass aqueous solution of sodium carbonate to remove the photosensitive resin layer in the unexposed areas, forming a patterned resin layer on the glass plate. Next, the resolution and sandblasting resistance of the patterned resin layer were evaluated. The resolution was evaluated according to the following evaluation criteria. The results are shown in Table 2.

[0049] (resolution) ○: Lines and spaces up to 60 & 60 μm were reproduced. ○△: Lines and spaces of 60&60 μm could not be reproduced, but lines and spaces of 80&80 μm or more could be reproduced. △: Lines and spaces of 80 & 80 μm or less could not be reproduced, but lines and spaces of 100 & 100 μm or more could be reproduced. △×: 100&100μm lines and spaces cannot be reproduced. ×: The photosensitive resin layer in the unexposed area cannot be removed.

[0050] Regarding sandblasting resistance, a glass plate having the above-mentioned 200 x 200 μm line and space patterned resin layer was sandblasted using silicon carbide powder (GC#1200, manufactured by Naniwa Kenma Kogyo) at a blast pressure of 0.4 MPa, and the depth that could be cut while the patterned resin layer was held on the glass plate surface was evaluated according to the following evaluation criteria. The results are shown in Table 2. Note that in Comparative Example 2, the photosensitive resin layer in the unexposed areas could not be removed, so sandblasting resistance could not be evaluated.

[0051] (Sandblast resistance) ○: Cutting was possible to a depth of 1000 μm. ○△: Cutting was possible to a depth of 500 μm or more and less than 1000 μm. △: Cutting was possible to a depth of 200 μm or more and less than 500 μm. ×: Unable to cut to a depth of 200 μm.

[0052] [Table 2]

[0053] As can be seen from the results in Table 2, the photosensitive resin compositions for sandblasting of Examples 1 to 16 are superior in alkaline developability, are capable of forming fine patterns, and are superior in sandblasting resistance compared to the comparative examples. [Explanation of symbols]

[0054] 1 Support 2. Peel layer 3 Photosensitive resin layer 4 Cover film

Claims

1. A photosensitive resin composition for sandblasting, comprising (A) an alkali-soluble resin, (B) a photopolymerization initiator, (C) a urethane (meth)acrylate compound having no carboxy group, and (D) an ethylene oxide-modified pentaerythritol tetraacrylate compound represented by general formula (i), wherein the amount of (C) blended is 30 to 80 mass% based on the total amount of (A), (B), (C), and (D). 【Chemical 1】 (In general formula (i), the total value of l, m, n, and o is 4 to 8.)

2. (A) A photosensitive resin composition for sandblasting as described in claim 1, wherein the alkali-soluble resin is an alkali-soluble cellulose derivative.

3. A dry film having a photosensitive resin layer containing at least the photosensitive resin composition for sandblasting according to claim 1 or 2 on one surface of a support, and a cover film on the photosensitive resin layer.

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