Elastomer film, method for manufacturing elastomer film, electric circuit body, health care sensor, wearable sensor, and method for manufacturing elastomer film processed product

Abstract

To provide an elastomer film which is flexible and has high restorability and also has superior metal paste printability, a method for manufacturing an elastomer film, an electric circuit body, a healthcare sensor, a wearable sensor, and a method for manufacturing an elastomer film processed product.SOLUTION: An elastomer film has a resin layer A and a surface layer B, and satisfies the following condition 1 and condition 2. Condition 1: a swelling ratio by butyl carbitol acetate of the elastomer film is 200% or less, and condition 2: a surface free energy of the surface layer B is 25 mN / m or more.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an elastomer film that is flexible, has high recovery, and is excellent in suitability for metal paste printing, a method for producing an elastomer film, an electric circuit body, a healthcare sensor, a wearable sensor, and a method for producing an elastomer film processed product. [Background technology]

[0002] As the IoT (Internet of Things) society advances, sensors that detect minute changes in pressure, temperature, distortion, etc. are being attached to various objects in our daily lives, and utilizing this data is helping to improve our quality of life.

[0003] Furthermore, if devices that allow such sensors to be attached to the human body for long periods of time without causing discomfort become commercially available, it will become possible to easily obtain long-term data on the human body that could previously only be obtained for short periods of time using special equipment. This could lead to major changes in our lives, such as the prevention of diseases that were previously difficult to detect, and the improvement of skills in sports and music.

[0004] Small devices equipped with sensors and other components have been developed to date, and resin films have been used as their base material. However, films with rigid chemical bonds, such as polyimide, can be bent freely, but are difficult to deform easily and quickly restore. Therefore, there is a demand for resin films that can be bent and stretched freely. These films also need to be as durable as existing film materials in that they do not degrade the sensors and wiring under operating conditions.

[0005] As an example of an existing resin film that can be freely bent and stretched, Patent Document 1 proposes "a polyurethane produced by reacting a polyether polyol (a) having a carbonate bond with an isocyanate compound (b), wherein the hydroxyl value of the polyether polyol (a) is 55 or less."

[0006] Furthermore, Patent Document 2 proposes "an active energy ray-curable resin composition containing at least (a-1) polyisocyanate, (a-2) a low-molecular-weight polyol having an alicyclic structure and a number-average molecular weight of 500 or less, and (a-3) a urethane (meth)acrylate oligomer (A) which is a reaction product of a hydroxyalkyl (meth)acrylate, wherein the calculated network molecular weight between crosslinks in the composition is 1000 or more and 6000 or less." Furthermore, Non-Patent Document 1 proposes a crosslinkable industrial silicone film.

[0007] Furthermore, as materials that have excellent elasticity and are easy to handle as a resin film, Patent Document 3 proposes "a composition for forming a flexible resin, which contains (A) an elastomer containing a monomer unit derived from styrene, (B) a polymerizable compound, and (C) a polymerization initiator, wherein the mass ratio of the monomer unit derived from styrene to the total amount of the elastomer (A) is 27 mass% or more," and Patent Document 4 proposes "a curable resin composition for forming a flexible resin, which contains (A) a styrene-based elastomer, (B) a polymerizable monomer, and (C) a polymerization initiator, wherein the polymerizable monomer includes a silicone compound having a (meth)acryloyloxy group." [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-189886 [Patent Document 2] Japanese Patent Application Laid-Open No. 2010-222568 [Patent Document 3] Japanese Patent Application Publication No. 2018-172460 [Patent Document 4] Japanese Patent Application Publication No. 2018-203827 [Non-patent literature]

[0009] [Non-Patent Document 1] Asahi Kasei Wacker homepage “ELASTOSIL” (registered trademark) FILM2030 http: / / www.aws-silicone.com / dcms_media / other / EL%20FILM.pdf Summary of the Invention [Problem to be solved by the invention]

[0010] Resin films used as circuit materials in devices such as the aforementioned so-called wearable sensors and healthcare sensors require high flexibility and resilience, allowing them to bend and stretch freely when attached to the human body, as well as the ability to form circuits on their surfaces. These circuits can be formed using conventional FPC (flexible printed circuit) fabrication techniques, in which copper foil is laminated to the surface of the resin film, or by printable electronics techniques using metal pastes that can follow the expansion and contraction of the resin film. In the latter case, the resin film must be resistant to the solvents contained in the metal paste, heat-resistant enough to withstand the drying of the metal paste, and highly adhesive to the formed circuit pattern. Furthermore, when forming stretchable wiring using screen printing, printability is also required to prevent the wiring from bleeding or fading during screen printing.

[0011] In response to the above demands, the present inventors investigated the prior art and found that the resin film made from the resin proposed in Patent Document 1 was insufficient in terms of recovery, heat resistance to withstand subsequent processes, solvent resistance during circuit printing, and durability of the circuit-printed portion in a high-humidity environment. Furthermore, the resin film made from the resin described in Patent Document 2 was insufficient in terms of recovery, solvent resistance, and durability of the circuit-printed portion in a high-humidity environment. Furthermore, the silicone film described in Non-Patent Document 1 was insufficient in terms of adhesion of the circuit pattern and durability of the circuit-printed portion in a high-humidity environment. Furthermore, the resin film made from the resin composition described in Patent Document 3 had good printability, heat resistance, and adhesion, but was insufficient in terms of flexibility and recovery. Furthermore, the resin film made from the resin composition described in Patent Document 4 had good flexibility, printability, and heat resistance, but was insufficient in terms of recovery and adhesion.

[0012] In view of the above, an object of the present invention is to provide an elastomer film that is flexible, has high recovery, and is excellent in suitability for metal paste printing, a method for producing an elastomer film, an electrical circuit body, a healthcare sensor, a wearable sensor, and a method for producing an elastomer film processed product. [Means for solving the problem]

[0013] In order to solve the above problems, the present inventors have conducted extensive research and have completed the following invention. That is, a preferred embodiment of the present invention is as follows. An elastomeric film, The elastomer film has a resin layer A and a surface layer B, Condition 1 below 、 Condition 2 and at least one of conditions 6 to 10 Meet the elastomer film. Condition 1: The swelling ratio of the elastomer film with butyl carbitol acetate is 2 Below 00%. Condition 2: The surface free energy of surface layer B is 25 mN / m or more. Condition 6: The surface roughness Sa of the surface layer B is 150 nm or more and 5,000 nm or less. Condition 7: Surface layer B is a particle layer containing resin particles and the segment of Chemical Formula 8. Condition 8: Surface layer B contains resin particles, and the number average particle size of the resin particles is 2 μm or more and 20 μm or less. Condition 9: The skewness Ssk of the surface layer B is a positive value. Condition 10: The maximum peak height Sp and maximum valley depth Sv of the surface layer B satisfy Equation 4. Equation 4: |Sp| / |Sv| ≧ 1 [ka] [Effects of the Invention]

[0014] It is possible to provide an elastomer film that is flexible, has high recovery, and is excellent in suitability for printing with metal paste, a method for producing an elastomer film, and a method for producing an electric circuit body, a healthcare sensor, a wearable sensor, and an elastomer film processed product. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a cross-sectional view showing an example of an elastomer film according to the present invention. [Figure 2] 1 is a schematic diagram showing an example of a method for producing an elastomer film in the present invention, in which a particle layer is formed in the state of a laminate. [Figure 3] 1 is a cross-sectional view showing an example of a laminate using an elastomer film of the present invention. [Figure 4] 1 is a cross-sectional view showing an example of a laminate using an elastomer film of the present invention. [Figure 5] 1 is a cross-sectional view showing an example of a laminate using an elastomer film of the present invention. [Figure 6] 1 is a cross-sectional view showing an example of a laminate using an elastomer film of the present invention. [Figure 7] 1 is a cross-sectional view showing an example of a laminate using an elastomer film of the present invention. [Figure 8] 1 is a cross-sectional view showing an example of a laminate using an elastomer film of the present invention. [Figure 9] 1 is a plan view showing an example of an electric circuit body according to the present invention. [Figure 10] FIG. 2 is a cross-sectional view showing an example of the surface irregularities of the elastomer film of the present invention. [Figure 11] FIG. 2 is a cross-sectional view showing an example of the surface irregularities of the elastomer film of the present invention. [Figure 12] 1 is a cross-sectional view showing an example of an electric circuit body according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] [Comparison of the present invention and the prior art] Before describing the embodiments of the present invention, the present inventors considered the following reasons why the problems of the present invention cannot be solved by the prior art.

[0017] The polyurethane described in Patent Document 1 functions as an elastomer because the polymer contains flexible soft segments and hard segments with high cohesive strength, forming a microphase-separated structure. The deformation of the flexible soft segments provides extensibility, while physical crosslinking due to the cohesive strength between the hard segments provides recovery. However, to achieve a high level of recovery and heat resistance sufficient to withstand subsequent processing, as is the subject of the present invention, strengthened crosslinking is required, which requires hard segments with stronger cohesive strength. This requires increasing the volume of the hard segments, but this in turn increases the modulus of elasticity. As a result, there is a trade-off between high levels of flexibility, recovery, and heat resistance, resulting in insufficient recovery and heat resistance.

[0018] The cured urethane acrylate material described in Patent Document 2 has physical crosslinks due to the cohesive force between hard segments as well as chemical crosslinks due to acrylate crosslinks, but this material requires the use of a low-molecular-weight polyol with a number-average molecular weight of 500 or less. This acts as a chain extender, increasing the volume of the hard segments and creating a microphase-separated structure, resulting in the appearance of a long-period structure and insufficient recovery.

[0019] Furthermore, in the resins of Patent Documents 1 and 2, the soft segments necessary for flexibility are formed from segments with relatively high polarity. Therefore, they have a strong affinity with the binder components contained in the metal paste, resulting in good adhesion of the circuit pattern. However, they have a high affinity with the polar solvent contained in the metal paste, which causes the polar solvent to penetrate and swell during printing, resulting in insufficient solvent resistance. Furthermore, under high humidity conditions, the film's water content increases and its moisture permeability is also high, which is believed to be why the durability of the printed circuit is insufficient.

[0020] The silicone film described in Non-Patent Document 1 is composed of a dimethylsiloxane skeleton that is highly flexible and hydrophobic, which means that it has low affinity with the polar solvent contained in the metal paste. As a result, although it has good solvent resistance, it has poor affinity with the binder components contained in the metal paste, resulting in insufficient adhesion of the circuit pattern.

[0021] Furthermore, the silicone film has a molecular structure with many gaps, which is thought to have resulted in high moisture permeability, resulting in insufficient durability of the printed circuit area.

[0022] In response to this, the present inventors investigated a method for solving the above-mentioned problems by forming small, strong chemical crosslinks at a low density within the film to achieve the crosslinked structure necessary for the development of recovery and heat resistance, rather than relying solely on physical crosslinks caused by aggregation between hard segments as in conventional techniques. They found that this method achieves both high levels of flexibility and heat resistance. Furthermore, they found that solvent resistance to polar solvents contained in metal pastes, adhesion of circuit patterns, and durability in high-humidity environments can be achieved by functionally separating the polymer skeleton of the film.

[0023] Furthermore, the reason why the technology described in Patent Document 3 provides good printability is believed to be that the styrene content of the styrene-based elastomer is set to a certain value or more to increase the modulus of elasticity, while the surface free energy is lowered to reduce tack and suppress the adhesion of the printing plate. However, an increase in modulus of elasticity reduces flexibility, and an increase in the styrene content increases physical crosslinking, which is thought to reduce recovery. For this reason, there is a trade-off between printability, flexibility, and recovery, making it difficult to achieve both.

[0024] The reason why the technology described in Patent Document 4 has good printability is thought to be that lowering the surface free energy reduces tack and suppresses the sticking of the printing plate. However, low surface free energy causes the problem of poor adhesion of metal wiring, and there is a trade-off between printability and adhesion, making it difficult to achieve both.

[0025] Unlike these conventional techniques, the present inventors have succeeded in achieving both flexibility, restorability, and suitability for subsequent processing by focusing on the surface shape of the film.

[0026] [Embodiments of the present invention] Hereinafter, embodiments of the present invention will be specifically described.

[0027] A preferred embodiment of the elastomer film of the present invention has a resin layer A and a surface layer B, and preferably satisfies the following conditions 1 and 2.

[0028] Condition 1: The swelling rate of the elastomer film with butyl carbitol acetate is 200% or less.

[0029] Condition 2: The surface free energy of surface layer B is 25 mN / m or more.

[0030] The methods for measuring the swelling ratio and surface free energy will be described later. In the present invention, the term "elastomeric film" refers to a film made of an elastomer. An elastomer generally refers to a resin that exhibits elasticity around room temperature. From the viewpoint of flexibility and recovery, the elastomer film of the present invention preferably has a 5% strain stress of 10 MPa or less and an elastic recovery rate at 20% elongation of 50% or more, more preferably a 5% strain stress of 5 MPa or less and an elastic recovery rate at 100% elongation of 80% or more. The methods for measuring the 5% strain stress, the elastic recovery rate at 20% elongation, and the elastic recovery rate at 100% elongation will be described later.

[0031] A preferred embodiment of the elastomer film of the present invention has a resin layer A and a surface layer B. It may be a two-layer structure consisting of the resin layer A and the surface layer B, or a three-layer structure consisting of the resin layer A, the surface layer B, and one or more additional layers. It is particularly preferred that the elastomer film has a resin layer A and a surface layer B on one surface of the elastomer film, and that the surface roughness Sa of the surface layer B is greater than the surface roughness Sa of the surface of the elastomer film opposite the surface layer B. Here, a layer refers to a region having a boundary surface distinguishable from adjacent regions in the thickness direction and having a finite thickness. More specifically, a layer refers to a region that can be distinguished by the presence or absence of a discontinuous boundary surface when the cross section of the elastomer film is observed with a scanning electron microscope (SEM). Even if the composition changes in the thickness direction of the film, if there is no boundary surface between them, the region is treated as a single layer. The specific cross-sectional observation method involves cutting a film embedded in UV-curable resin together with the embedded resin using a microtome (a rotary microtome RMS manufactured by Nippon Microtome Co., Ltd.) to obtain a cross-section in the thickness direction. Platinum is then vapor-deposited onto the cross-section using an auto-fine coater at 30 mA x 20 seconds x 2 times to obtain a test specimen, which is then observed using a scanning electron microscope (SEM JSM-6700F manufactured by JEOL Ltd.) in LEI (lower secondary electron image) mode, at a magnification of 5000x, an accelerating voltage of 3 kV, and a WD (sample distance) of 8.0 mm.

[0032] The swelling ratio of the elastomer film in butyl carbitol acetate under condition 1 refers to the mass change rate after immersion of the elastomer film in butyl carbitol acetate for 30 minutes in an environment of 25°C, and is preferably 200% or less, more preferably 150% or less. The measurement method is shown in the Examples section. By ensuring that the swelling ratio of the elastomer film in butyl carbitol acetate is 200% or less, it is possible to prevent bleeding and reduce deterioration in print reproducibility when circuits are printed on the surface of the elastomer film using metal paste, and to reduce deterioration in dimensional accuracy.

[0033] The surface free energy of surface layer B under condition 2 refers to a value found by measuring the static contact angles of water, ethylene glycol, formamide, and diiodomethane at 25°C on surface layer B of the elastomer film, and then introducing the static contact angles for each liquid and the dispersion term, polar term, and hydrogen bond term of the surface free energy of each liquid described in Non-Patent Document 3 below into the "Extended Hawks' Equation of Hata and Kitazaki" described in Non-Patent Document 2 below, and solving the simultaneous equations. The measurement method will be described in detail later. Non-patent document 2: Kitazaki, Y. and Hata, T.: Japan Adhesion Association Journal, 8, (3) 131 (1972). Non-Patent Document 3: J. Panzer: J. Colloid Interface Sci., 44, 142 (1973).

[0034] The surface free energy of the surface layer B is preferably 25 mN / m or more, more preferably 35 mN / m or more. A surface free energy of 25 mN / m or more can prevent insufficient adhesion of the circuit to the elastomer film surface, reduce a decrease in the S / N ratio of the signal obtained from the sensor when a circuit pattern is formed on the elastomer film and the film is repeatedly stretched and contracted, and further prevent poor conductivity due to breakage of the circuit pattern.

[0035] From the same viewpoint as above and from the viewpoint of productivity, the surface free energy of at least one surface of the elastomer film after 1 μm of the outermost surface is scraped off is preferably 25 mN / m or more, more preferably 35 mN / m or more. The scraping can be performed by a known method such as a microtome.

[0036] A preferred method for obtaining an elastomer film that satisfies conditions 1 and 2 is to form a resin layer constituting the elastomer film, the resin layer including at least one segment selected from the group consisting of a segment of Chemical Formula 1 described below, and a segment of Chemical Formula 2, a segment of Chemical Formula 3, a segment of Chemical Formula 4, a segment of Chemical Formula 5, and hydrogenated segments thereof, all of which are described below.

[0037] Furthermore, to achieve a 5% strain stress of 10 MPa or less and an elastic recovery rate of 80% or more at 20% elongation for the elastomer film, it is important that the polymer has flexible soft segments and hard segments with high cohesive strength, which form a microphase-separated structure. It is also important that these hard segments form small, strong chemical crosslinks, such as acrylic crosslinks, at a low density while minimizing the contribution of physical crosslinks, such as π-π interactions and hydrogen bonds. To allow physical crosslinks, such as π-π interactions and hydrogen bonds, to function as hard segments, the volume of the hard segments must be increased. This increases the elastic modulus and reduces flexibility. Therefore, it is necessary to form small, strong chemical crosslinks at a low density. A preferred method for satisfying conditions 1 and 2 while maintaining the 5% strain stress of the elastomer film at 10 MPa or less and the elastic recovery rate at 20% elongation at 80% or more is to have the elastomer film contain a crosslinked resin precursor containing a segment (P) of Chemical Formula 1 (described below), a segment (Q) derived from a high-molecular-weight polyol having a number-average molecular weight of more than 500 g / mol and having one or more segments selected from the group consisting of segments of Chemical Formula 2, Chemical Formula 3, Chemical Formula 4, Chemical Formula 5, and hydrogenated versions thereof (described below), and a segment (R) derived from a bifunctional isocyanate. In particular, the ratios (by number) of P, Q, and R contained in the elastomer film are more preferably P:Q = 1:10 to 1:40 and P:R = 1:0.5 to 1:2.0. The above ratios are based on the solids. 13 This can be determined by C-NMR. Furthermore, in order to keep the 5% strain stress and elastic recovery at 20% elongation within the above ranges, the proportion of segments derived from low-molecular-weight polyols with a molecular weight of 500 g / mol or less is preferably 0.1 or less when Q is 1 on a number basis. Furthermore, the proportion of segments derived from tri- or higher-functional isocyanates is preferably 0.1 or less when R is 1. Additionally, the ash content in 100% by mass of the elastomer film is preferably 1% by mass or less. Here, ash refers to the components when heated at 500°C under nitrogen for 1 hour.

[0038] The elastomeric film of the present invention preferably comprises a segment of Formula 1.

[0039] Here, the segment of Chemical Formula 1 refers to a (meth)acrylic residue obtained by crosslinking a (meth)acrylic group. By having a (meth)acrylic residue obtained by crosslinking a (meth)acrylic group, the elastomer film of the present invention can avoid the trade-off between flexibility, recovery, and heat resistance seen in Patent Document 1. From the same viewpoint and from the viewpoint of improving productivity through functional separation, it is preferable that resin layer A has a segment of Chemical Formula 1.

[0040] [ka]

[0041] R 1 refers to a hydrogen or methyl group.

[0042] R 2 refers to one of the following: Substituted or unsubstituted alkylene groups Substituted or unsubstituted arylene groups An alkylene group having an ether group, an ester group, or an amide group therein an arylene group having an ether group, an ester group, or an amide group therein Unsubstituted alkylene group having an ether group, ester group, or amide group inside An unsubstituted arylene group having an ether group, an ester group, or an amide group therein.

[0043] Furthermore, the elastomer film of the present invention preferably satisfies the following condition 3.

[0044] Condition 3: The moisture permeability of the elastomer film according to condition B of JIS Z0208-1976 is 100 g / m 2 ·Less than 24 hours.

[0045] The moisture permeability of elastomer film according to condition B of JIS Z0208-1976 is 50g / m 2 24 hours or less is preferable, 25g / m 2 A period of 24 hours or less is particularly preferable. By reducing the moisture permeability of the elastomer film, deterioration of the wiring material and sensors can be prevented. The means for satisfying condition 3 will be described later.

[0046] The elastomer film of the present invention is preferably a cured product obtained by crosslinking a resin precursor containing a specific segment, so that the 5% strain stress of the elastomer film is 10 MPa or less, the elastic recovery at 20% elongation is 80% or more, and the elastomer film satisfies the above-mentioned conditions 1, 2, and 3. Specifically, the resin precursor is preferably a resin precursor containing a polydiene-based segment, more specifically a resin precursor containing at least one segment selected from the group consisting of segments of Chemical Formula 2, Chemical Formula 3, Chemical Formula 4, Chemical Formula 5, and hydrogenated products thereof, more preferably a resin precursor containing at least one segment selected from the group consisting of segments of Chemical Formula 2, Chemical Formula 3, Chemical Formula 4, and Chemical Formula 5, and particularly preferably a resin precursor containing a segment of a hydrogenated product of Chemical Formula 2 or a segment of a hydrogenated product of Chemical Formula 3. From the same viewpoint and from the viewpoint of improving productivity through functional separation, it is more preferable that the resin layer A has the above-mentioned preferred embodiment and contains at least one segment selected from the group consisting of segments of chemical formula 2, segments of chemical formula 3, segments of chemical formula 4, segments of chemical formula 5, and segments of hydrogenated products thereof. The degree of polymerization of the segments of chemical formulas 2 to 5 in the resin precursor is preferably 5 or more, more preferably 7 or more. The resin precursor will be described later.

[0047] [ka]

[0048] [ka]

[0049] [ka]

[0050] [ka]

[0051] By using a resin precursor containing segments of chemical formulas 2 to 5 and their hydrogenated derivatives, the elastomer film can exhibit low polarity and high flexibility. This can impart solvent resistance and flexibility. Regarding chemical formulas 2 to 5, any substituent can be used for the omitted substituents, but hydrogen atoms are preferred. From a similar perspective, resin layer A constituting the elastomer film of the present invention is preferably a cured product obtained by crosslinking a resin precursor containing a segment of chemical formula 6. A resin precursor refers to a compound having a site that can be crosslinked.

[0052] [ka]

[0053] R 3 refers to a hydrogen or methyl group.

[0054] R 4 , R 5 refers to one of the following: Substituted or unsubstituted alkylene groups Substituted or unsubstituted arylene groups An alkylene group having an ether group, an ester group, or an amide group therein an arylene group having an ether group, an ester group, or an amide group therein Unsubstituted alkylene group having an ether group, ester group, or amide group inside An unsubstituted arylene group having an ether group, an ester group, or an amide group therein.

[0055] R 6 refers to one of the following: Substituted or unsubstituted alkylene groups a substituted or unsubstituted alkenylene group;

[0056] The segment of Chemical Formula 6 indicates that a (meth)acrylic group represented by X is at the end, and that a polyisocyanate residue represented by Y is adjacent to it. Furthermore, it indicates that the other end of the polyisocyanate residue represented by Y is a polyol residue represented by Z.

[0057] The resin precursor containing (meth)acrylic groups allows for the introduction of (meth)acrylic residues obtained by crosslinking the (meth)acrylic groups into the elastomer film, thereby avoiding the trade-off between flexibility, recovery, and heat resistance seen in Patent Document 1. Furthermore, the resin precursor containing polyisocyanate residues promotes the crosslinking reaction of the (meth)acrylic groups, allowing the few crosslinking points to react with high reactivity. Furthermore, the presence of highly polar polyisocyanate residues can impart affinity to the binder components contained in the metal paste. Furthermore, the resin precursor containing polyol residues can impart flexibility to the elastomer film.

[0058] Furthermore, it is preferable that the resin layer A constituting the elastomer film of the present invention is a cured product obtained by crosslinking a resin precursor containing a segment of chemical formula 6, and that the resin precursor satisfies the following condition 5.

[0059] Condition 5: The average (meth)acryloyl group equivalent of the resin precursor is 4,000 g / eq or more and 12,000 g / eq or less The average (meth)acryloyl group equivalent of the resin precursor refers to the weight-average molecular weight of the resin precursor divided by the number of (meth)acryloyl groups designed in the resin precursor. The average (meth)acryloyl group equivalent of the resin precursor is preferably 4,000 g / eq or more and 12,000 g / eq or less, and more preferably 5,000 g / eq or more and 10,000 g / eq or less. When the average (meth)acryloyl group equivalent of the resin precursor is 4,000 g / eq or more, solvent resistance can be made more sufficient, and when it is 12,000 g / eq or less, recovery can be made more sufficient.

[0060] The elastomer film of the present invention preferably satisfies the following condition 4.

[0061] Condition 4: The distance (D), dispersion term (δD), polar term (δP), and hydrogen bond term (δH) of the Hansen solubility parameter calculated from the swelling ratio of the elastomer film satisfy Equation 1 and Equation 2.

[0062] Equation 1: D <20(J / cm 3 ) 0.5 Equation 2: (δP+δH) / D<0.5.

[0063] The solubility parameter (hereinafter, SP value) is a physical property defined as the square root of the cohesive energy density proposed by Hildebrand, and is a numerical value that indicates the solubility behavior of a solvent. In contrast, the Hansen solubility parameter (hereinafter, HSP value) takes into account the polarity and non-polarity of the SP value by dividing the SP value into three components: the dispersion term (δD), the polar term (δP), and the hydrogen bonding term (δH). This parameter is used not only to evaluate the solubility of substances, but also to evaluate the solvent and water resistance of polymeric materials, the solubility of pharmaceuticals, and the aggregation and decomposition properties of fine particles in solvents. The dispersion term (δD), polar term (δP), and hydrogen bonding term (δH) of the elastomer film of the present invention were determined from the swelling behavior in solvents with known HSP values. Details of the measurement method will be described later.

[0064] The distance (D) of the Hansen solubility parameter is calculated using Equation 3, and corresponds to the distance from the origin when a three-dimensional space is created with the dispersion term (δD), polar term (δP), and hydrogen bond term (δH) of the Hansen solubility parameter on each axis. It is also a value equivalent to the Hildebrand solubility parameter, and is a measure of the strength of intermolecular forces.

[0065] Equation 3: D=((δD) 2 +(δP) 2 +(δH) 2 ) 1 / 2 .

[0066] Furthermore, the left side of Equation 2 indicates the proportion of the non-dispersion term in the Hansen solubility parameter, and is an index that indicates the magnitude of polarity; the smaller the value, the lower the polarity.

[0067] D in Equation 1 is 20 (J / cm 3 ) 0.5 Preferably less than 19 (J / cm 3 ) 0.5 (ΔP+ΔH) / D in formula 2 is preferably less than 0.5, more preferably less than 0.4.

[0068] D in Equation 1 is 20 (J / cm 3 ) 0.5 By ensuring that the value of (ΔP+ΔH) / D in formula 2 is less than 0.5, bleeding can be suppressed when printing circuits using the metal paste, and improvements in print reproducibility and dimensional accuracy can be expected.

[0069] A preferred means for satisfying condition 4 is to set the 5% strain stress of the elastomer film to 10 MPa or less and the elastic recovery rate at 20% elongation to 80% or more, while also taking the form described in the means for satisfying conditions 1, 2, and 3 above.

[0070] The elastomer film of the present invention preferably satisfies the following condition 6.

[0071] Condition 6: The surface roughness Sa of the surface layer B is 150 nm or more and 5,000 nm or less.

[0072] The method for measuring the surface roughness will be described later.

[0073] By setting the surface roughness Sa of the surface layer B to 150 nm or more, it is possible to prevent the elastomer film from adhering to the screen during printing, thereby deteriorating printability, and to reduce the problem of the elastomer film adhering to a roll during transport, which would result in poor handling in subsequent processes. From the same perspective, the surface roughness Sa of the surface layer B is more preferably 200 nm or more, and particularly preferably 400 nm or more. On the other hand, if the surface roughness Sa is extremely high, the elastomer film may break when stretched, so Sa is preferably 5,000 nm or less. Furthermore, from the viewpoint of preventing extreme deformation of the surface shape when a load is applied in subsequent processes such as printing, Sa is more preferably 1,000 nm or less, and even more preferably 780 nm or less.

[0074] In the elastomer film of the present invention, the surface layer B is preferably a particle layer containing resin particles. Here, resin particles refer to particles that are entirely made of resin or particles whose surfaces are coated with resin. Details of particles and resin particles will be described later. By using resin particles as the particles, the particles can be well dispersed within the particle layer, resulting in the formation of a desirable surface shape. Furthermore, since the resin particles can follow the elasticity of the elastomer film, by including resin particles in the particle layer, defects caused by particle detachment during expansion and contraction can be suppressed, resulting in high elasticity that is comparable to that of an elastomer film without particles.

[0075] Here, it is preferable that the particle layer and resin layer A are different layers from the viewpoint of improving the stretchability. In particular, it is more preferable that the particle layer be provided on at least one surface of the elastomer film from the viewpoint of forming appropriate unevenness. On the other hand, it is more preferable that the particle layer is obtained by crosslinking a resin precursor containing a segment of Chemical Formula 1 and a segment of Chemical Formula 7.

[0076] [ka]

[0077] R 7 refers to one of the following: Substituted or unsubstituted alkylene groups Substituted or unsubstituted arylene groups An alkylene group having an ether group, an ester group, or an amide group therein an arylene group having an ether group, an ester group, or an amide group therein Unsubstituted alkylene group having an ether group, ester group, or amide group inside An unsubstituted arylene group having an ether group, an ester group, or an amide group therein.

[0078] In the elastomer film of the present invention, the surface layer B is more preferably a particle layer containing resin particles and a segment of the following Chemical Formula 8. Furthermore, the particle layer further preferably contains a segment of Chemical Formula 8 and a segment of Chemical Formula 9.

[0079] [ka]

[0080] [ka]

[0081] R Y1 indicates a group having at its terminal one or more groups selected from a (meth)acrylic group, an epoxy group, a vinyl group, a phenyl group and an amino group.

[0082] R Y2 indicates one or more alkyl groups selected from alkyl groups having 1 to 4 carbon atoms.

[0083] Here, the segment of Chemical Formula 8 is preferably a polyolefin modified with maleic anhydride and / or a maleic anhydride copolymerized polyolefin.

[0084] By including a segment of Chemical Formula 8 in the particle layer, the affinity between the particle layer and resin layer A is increased, improving adhesion between the particle layer and resin layer A and further improving adhesion when an electrical circuit is formed on the surface of the elastomer film. Furthermore, since materials containing a segment of Chemical Formula 8 have excellent elasticity and excellent adhesion to resin particles, including a segment of Chemical Formula 8 in the particle layer can suppress defects caused by particle detachment during stretching and improve the elasticity of the elastomer film due to its high elasticity. In particular, when an elastomer film generally has a resin layer A and a particle-containing layer, it is difficult to achieve appropriate surface roughness while following the elasticity of the resin layer A. However, a particle layer containing a segment of Chemical Formula 8 can closely follow the elasticity of the resin layer A, suppress peeling between the resin layer A and the particle layer during stretching, suppress detachment of resin particles during stretching, and further enable the formation of appropriate surface roughness.

[0085] When the particle layer contains the segment of Chemical Formula 9, the affinity between the particle layer and resin layer A is increased, which can improve the adhesion between the particle layer and resin layer A and can also improve the adhesion when an electric circuit body is formed on the surface of the elastomer film.

[0086] The segment of Chemical Formula 9 is preferably a polyalkoxysilane segment, that is, a hydrolysis condensate of an alkoxysilane described in Compound Group 1 below.

[0087] (Compound Group 1) At least one alkoxysilane selected from the group consisting of (meth)acryloxyalkoxysilane, epoxyalkoxysilane, vinylalkoxysilane, phenylalkoxysilane, and aminoalkoxysilane.

[0088] The hydrolysis condensate refers to a product in which the alkoxy groups of the alkoxysilane are partially hydrolyzed to form silanol groups (Si—OH), and then undergo silanol condensation to form siloxane bonds (Si—O—Si).

[0089] From the above viewpoint, the alkoxysilane is more preferably an aminoalkoxysilane among the above-mentioned compound group 1. Among them, as the amino group, a secondary amine is more preferable than a primary amine, and phenylamine is particularly preferable.

[0090] Specific examples of alkoxysilanes include vinyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-acryloxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, 5-hexenyltrimethoxysilane, trifluoropropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldiisopropenoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, phenyltrimethoxysilane, and phenyldimethoxysilane.

[0091] In addition, from the viewpoint of further improving adhesiveness, it is more preferable that the particle layer contains a segment of Chemical Formula 8 and a segment of Chemical Formula 9.

[0092] Whether the particle layer contains the segment of chemical formula 8 or the segment of chemical formula 9 can be determined by various analytical methods, but pyrolysis GC-MS is the most convenient method. It can also be determined from the raw materials that form the elastomer film.

[0093] Furthermore, in the elastomer film of the present invention, it is preferable that the surface layer B contains resin particles, and the number average particle size of the resin particles is 2 μm or more and 20 μm or less.

[0094] The size of the resin particles is preferably a number average particle diameter of 2 μm or more and 20 μm or less, more preferably 4 μm or more and 10 μm or less, from the viewpoints of reducing tackiness, preventing resin particle shedding, and reworkability. By having the resin particles have a number average particle diameter of 2 μm or more, the effect of reducing surface tackiness can be sufficiently obtained. From the same viewpoint, the size of the resin particles is more preferably a number average particle diameter of 4 μm or more.

[0095] Furthermore, by setting the resin particle size to a number-average particle diameter of 20 μm or less, it is possible to prevent the resin particles from falling off from the surface layer B. Additionally, it is possible to reduce tackiness and improve the reworkability described below. Regarding the relationship between the reworkability and the number-average particle diameter of the resin particles, the inventors believe as follows: To increase the irregularity of the surface layer B, in other words, to increase the surface roughness Sa, it is generally considered preferable to use resin particles with a larger number-average particle diameter. Generally, particles with a larger number-average particle diameter have a larger curvature, while particles with a smaller number-average particle diameter have a smaller curvature. In the present invention, using particles with a smaller number-average particle diameter makes it easier to obtain a tendency for the convex (mountain) side of the irregularity shape described below to be sharper. Therefore, similar to the effect of the skewness Ssk described below, it is considered preferable to use particles with a smaller number-average particle diameter from the perspective of reworkability. To maintain the surface roughness Sa and skewness Ssk within preferred ranges, a number-average particle diameter of 2 μm or more and 20 μm or less is preferred, and a number-average particle diameter of 4 μm or more and 10 μm or less is more preferred.

[0096] The size of the resin particles can be adjusted to the above range by appropriately selecting the material and particle size of the resin particles used and the method for forming the particle layer.

[0097] The number average particle diameter of resin particles is measured by observing the cross section of the elastomer film with a scanning electron microscope (SEM). Observation is performed at a magnification where the number of primary particle aggregates per field of view is 10 to 50. The diameter of the circumscribed circle of the primary particle is calculated from the image obtained, and this is used as the equivalent particle diameter. The number of observations is increased to 100 primary particles, and the number average particle diameter is calculated from the value measured.

[0098] The thickness of the surface layer B is not particularly limited as long as the above-mentioned surface shape can be achieved, but is preferably 1 μm to 25 μm, more preferably 1 μm to 20 μm. In the case where the resin layer A and the surface layer B are provided from the viewpoint of improving the stretchability, the thickness of the resin layer A is preferably 10 μm to 500 μm, and the thickness of the surface layer B is preferably 1 μm to 25 μm. From the same viewpoint, the value of the thickness (μm) of the resin layer A / the thickness (μm) of the surface layer B is preferably 2 to 50.

[0099] The ratio of resin to resin particles in the particle layer is preferably 10% by mass or more and 50% by mass or less, relative to 100% by mass of the entire particle layer. By having the resin particle ratio of 10% by mass or more, a desirable surface shape can be formed, and the effect of reducing surface tack can be sufficiently obtained.

[0100] On the other hand, by making the proportion of resin particles in the particle layer 50% by mass or less, sufficient stretchability can be obtained when used in an elastomer film.

[0101] Furthermore, the elastomer film of the present invention satisfies the following conditions: 9 It is preferable that the following is satisfied.

[0102] conditions 9 : The skewness Ssk of the surface layer B is a positive value.

[0103] The method for measuring the skewness Ssk will be described later.

[0104] Skewness Ssk represents the deviation of the height distribution from the mean plane / mean line, and indicates the asymmetry of peaks and valleys. When Ssk is 0, the height distribution is symmetrical from top to bottom, and peaks and valleys are present to the same extent. When Ssk is positive, the roughness curve is biased toward the concave side, as shown in Figure 10, indicating a sharp surface. On the other hand, when Ssk is negative, the roughness curve is biased toward the convex side, as shown in Figure 11, indicating a smooth surface.

[0105] From the viewpoints of reducing tack and reworkability, it is preferable for the skewness Ssk to be a positive value. Reworkability here refers to the ease of positioning and adjusting the position during product processing and product use, such as the ease of positioning and adjusting components during printing, adhesive processing, component mounting, product assembly, packaging, and product use. Higher reworkability not only makes the product easier to use for product processors and users, but also makes product processing easier, which is preferable from the perspective of reducing waste materials and manufacturing costs. Regarding the relationship between skewness Ssk and reworkability, the inventors believe that a positive value for skewness Ssk indicates a sharp convex side (mountain side). A positive value for the skewness Ssk of the surface layer B can reduce the contact area with a mating member when the elastomer film is brought into contact with the mating member. Furthermore, even when the elastomer film deforms under load, the sharp surface side is thought to suppress an increase in the contact area due to deformation. As a result, the contact area between the elastomer film and the mating member can be reduced, and it is believed that sticking can be suppressed even for materials that are generally considered to be prone to sticking, such as elastomer films, thereby reducing tack and improving reworkability. From the same viewpoint, the skewness Ssk of the surface layer B is more preferably 0.01 or more and 1.10 or less, and even more preferably 0.15 or more and 1.00 or less.

[0106] Furthermore, the elastomer film of the present invention satisfies the following conditions: 10 It is preferable that the following is satisfied.

[0107] conditions 10 : The maximum peak height Sp and maximum valley depth Sv of the surface layer B satisfy Equation 4.

[0108] Equation 4: |Sp| / |Sv| ≧ 1 The method for measuring the maximum peak height and maximum valley depth will be described later.

[0109] From the viewpoint of tack reduction and reworkability, the maximum peak height Sp and maximum valley depth Sv of the surface layer B preferably satisfy Equation 4, more preferably a value of 1.1 or greater, and particularly preferably a value of 1.2 or greater. Regarding the relationship between the maximum peak height Sp and maximum valley depth Sv of the surface layer B, the inventors believe as follows: When the maximum peak height Sp and maximum valley depth Sv of the surface layer B satisfy Equation 4, this means that the uneven portion farthest from the reference plane / reference line is located on the convex side (peak side), meaning that the convex side (peak side) is sharper. Therefore, satisfying Equation 4 reduces the contact area with the mating member when the elastomer film is brought into contact with the mating member. Furthermore, even when the elastomer film deforms due to the application of a load, the sharpness of the convex side (peak side) is believed to suppress an increase in the contact area due to deformation. As a result, the contact area between the elastomer film and the mating member can be reduced, thereby suppressing sticking even with materials that are generally considered to be prone to sticking, such as elastomer films, and thus improving tack reduction and reworkability.

[0110] Furthermore, in the elastomer film of the present invention, the resin constituting the resin layer A is preferably not a thermoplastic resin, since if the resin constituting the resin layer A is not a thermoplastic resin, the occurrence of wrinkles and unevenness due to thermal deformation can be suppressed when the film is exposed to high temperatures during printing processing or use as a product.

[0111] Here, when an electrical circuit was created using the elastomer film or elastomer film / adhesive layer laminate of the present invention, it was found to have the effect of suppressing changes in the resistance value of the conductor circuit when the electrical circuit was stretched or contracted. It is speculated that the effect of suppressing changes in the resistance value of the conductor circuit when the electrical circuit was stretched or contracted was achieved because satisfying conditions 1 and 2 resulted in excellent suitability for metal paste printing and excellent metal paste adhesion. Furthermore, this makes the product suitable for applications such as stretchable wiring boards for wearable devices.

[0112] [Elastomer film] The elastomer film of the present invention preferably has two or more layers including a resin layer A and a surface layer B.

[0113] In addition to the desired properties of flexibility, recovery, solvent resistance, heat resistance, and circuit pattern adhesion, the elastomer film of the present invention may have other functions such as fingerprint resistance, formability, designability, scratch resistance, stain resistance, antireflection, antistatic properties, conductivity, heat ray reflection, near-infrared absorption, and electromagnetic wave shielding, and in such cases, one or more layers may be further formed. For example, a functional layer having the above-mentioned functions, an adhesive layer, an electronic circuit layer, a printing layer, an optical adjustment layer, or other functional layers may be provided.

[0114] The thickness of the elastomer film of the present invention is not particularly limited and is appropriately selected depending on the application. The lower limit of the thickness of the elastomer film cannot be determined in general because it is affected by the elastic modulus, breaking elongation, peeling force and peeling angle of the elastomer film itself from the laminate, etc. However, when the laminate manufacturing method described below is used to achieve physical properties equivalent to those of a general flexible material, the lower limit is about 1 μm.

[0115] [Resin precursor] The resin precursor is not particularly limited as long as it is a compound having a site that can be crosslinked, but a resin precursor containing at least one segment selected from the group consisting of a segment of chemical formula 2, a segment of chemical formula 3, a segment of chemical formula 4, a segment of chemical formula 5, and a segment of a hydrogenated product thereof, and a segment of chemical formula 6 is preferred.

[0116] As mentioned above, the segment of Chemical Formula 6 has a (meth)acrylic group, represented by X in the diagram, at its terminal, and this terminal (meth)acrylic group (X) corresponds to a site that can be crosslinked. Furthermore, the (meth)acrylic group (X) is adjacent to a polyisocyanate residue, represented by Y in the diagram. This also means that the other end of the urethane bond of the polyisocyanate residue, represented by Y, is adjacent to a polyol residue, represented by Z.

[0117] The polyisocyanate residue (Y) of Chemical Formula 6 is preferably a residue of a polyisocyanate such as TDI (tolylene diisocyanate), MDI (4,4'-diphenylmethane diisocyanate), NDI (1,5-naphthalene diisocyanate), TODI (tolidine diisocyanate), XDI (xylylene diisocyanate), PPDI (paraphenylene diisocyanate), TMXDI (tetramethylxylylene diisocyanate), HMDI (hexamethylene diisocyanate), IPDI (isophorone diisocyanate), H6XDI (hydrogenated xylylene diisocyanate), or H12MDI (dicyclohexylmethane diisocyanate). The polyol residue of Chemical Formula 7 is preferably at least one segment selected from the group consisting of polyester polyols, polyether polyols, polycarbonate polyols, segments of Chemical Formula 2, segments of Chemical Formula 3, segments of Chemical Formula 4, segments of Chemical Formula 5, and segments of hydrogenated products thereof, and more preferably a polyol containing at least one segment selected from the group consisting of segments of Chemical Formula 2, segments of Chemical Formula 3, segments of Chemical Formula 4, segments of Chemical Formula 5, and segments of hydrogenated products thereof, from the viewpoint of achieving both solvent resistance and flexibility.

[0118] [Laminate] The elastomer film of the present invention may form a laminate having a supporting substrate on one side thereof. The laminate is preferably a laminate in which the peel strength between the supporting substrate and the elastomer film is 1 N / 50 mm or less. Note that a supporting substrate having a peel strength of 1 N / 50 mm or less from the elastomer film will be referred to hereinafter as a releasable supporting substrate.

[0119] As described above, in the laminate of the present invention, the peel strength between the support substrate and the elastomer film is preferably 1 N / 50 mm or less, and more preferably 800 mN / 50 mm or less. There is no particular lower limit to the peel strength between the support substrate and the elastomer film, but if it is less than 10 mN / 50 mm, the support substrate and the elastomer film may peel off or float during the manufacturing process, so the peel strength between the support substrate and the elastomer film is preferably 10 mN / 50 mm or more.

[0120] [Support base material] The supporting substrate used in the laminate may be either a thermoplastic resin or a thermosetting resin, and may be a homoresin, a copolymer, or a blend of two or more types. The resin constituting the supporting substrate is preferably one that has good moldability, and from this point of view, a thermoplastic resin is more preferred.

[0121] Examples of thermoplastic resins that can be used include polyolefin resins such as polyethylene, polypropylene, polystyrene, and polymethylpentene, alicyclic polyolefin resins, polyamide resins such as nylon 6 and nylon 66, aramid resin, polyimide resin, polyester resin, polycarbonate resin, polyarylate resin, polyacetal resin, polyphenylene sulfide resin, fluororesins such as tetrafluoroethylene resin, trifluoroethylene resin, trifluorochloroethylene resin, tetrafluoroethylene-hexafluoropropylene copolymer, and vinylidene fluoride resin, acrylic resin, methacrylic resin, polyacetal resin, polyglycolic acid resin, and polylactic acid resin.

[0122] Examples of the thermosetting resin that can be used include phenol resin, epoxy resin, urea resin, melamine resin, unsaturated polyester resin, polyurethane resin, polyimide resin, and silicone resin.

[0123] The thermoplastic resin is preferably a resin having sufficient stretchability and conformability. From the viewpoints of strength, heat resistance, and transparency, the thermoplastic resin is more preferably a polyester resin, a polycarbonate resin, an acrylic resin, or a methacrylic resin.

[0124] In the present invention, polyester resin is a general term for polymers in which ester bonds are the main bonding chains in the main chain, and is obtained by polycondensation of an acid component, its ester, and a diol component. Specific examples include polyethylene terephthalate, polypropylene terephthalate, polyethylene-2,6-naphthalate, and polybutylene terephthalate. These may also be copolymerized with other dicarboxylic acids and their esters or diol components as the acid component or diol component. Among these, polyethylene terephthalate and polyethylene-2,6-naphthalate are particularly preferred in terms of transparency, dimensional stability, heat resistance, and the like.

[0125] The support substrate may also contain various additives, such as antioxidants, antistatic agents, crystal nucleating agents, inorganic particles, organic particles, viscosity reducers, heat stabilizers, lubricants, infrared absorbers, ultraviolet absorbers, and dopants for adjusting the refractive index.

[0126] Furthermore, the supporting substrate may have either a single layer structure or a laminated structure.

[0127] Furthermore, it is also possible to provide a functional layer such as an easy-adhesion layer, an antistatic layer, an undercoat layer, an ultraviolet absorbing layer, or a release layer on the surface of the support substrate in advance, separate from the elastomer film of the present invention. In the present invention, the support substrate preferably has a release layer to reduce the peel force between the support substrate and the elastomer film. Details of the release layer will be described later.

[0128] Examples of support substrates provided with a release layer include "Therapeel" (registered trademark) manufactured by Toray Advanced Film Co., Ltd., "Unipeel" (registered trademark) manufactured by Unitika Ltd., "Panapeel" (registered trademark) manufactured by Panac Corporation, "Toyobo Ester" (registered trademark) manufactured by Toyobo Co., Ltd., and "Purex" (registered trademark) manufactured by Teijin Limited, and these products can also be used.

[0129] The surface of the supporting substrate may be subjected to various surface treatments before the elastomer film is formed. Examples of surface treatments include chemical treatment, mechanical treatment, corona discharge treatment, flame treatment, ultraviolet irradiation treatment, high-frequency treatment, glow discharge treatment, active plasma treatment, laser treatment, sandblasting treatment, mixed acid treatment, and ozone oxidation treatment. Among these, glow discharge treatment, ultraviolet irradiation treatment, corona discharge treatment, and flame treatment are preferred, and glow discharge treatment and ultraviolet treatment are more preferred.

[0130] [Release layer] The support substrate used in the laminate preferably has a release layer. A support substrate having a release layer is also called a release film. The release layer may be composed of multiple layers from the viewpoint of imparting adhesion, antistatic properties, solvent resistance, etc., and may be present on both sides of the support substrate.

[0131] The composition and thickness of the release layer are not particularly limited as long as the peel strength from the elastomer film can be within the preferred range described above. However, from the viewpoints of the in-plane uniformity, quality, and peel strength of the release layer, it is preferably 10 nm or more and 500 nm or less, and more preferably 20 nm or more and 300 nm or less.

[0132] [Protective material] The laminate described above may have a protective material on the side of the elastomer film opposite the supporting substrate, as shown in FIG. 5. The protective material and supporting substrate are distinguished by the fact that, in the laminate manufacturing method, the supporting substrate is the one to which the coating composition is applied, and the protective material is the one to which the elastomer film is attached after formation. The protective material may be the same as or different from the supporting substrate described above, but it is preferable that the protective material have a different peel strength from the supporting substrate described above when used in a subsequent process. The magnitude relationship between the peel strength of the protective material and the supporting substrate from the elastomer film is appropriately selected depending on the method of use in the subsequent process. Therefore, the protective material may have a release layer as shown in FIG. 6, an adhesive layer as shown in FIG. 7, or a single layer as shown in FIG. 8.

[0133] [Method of manufacturing elastomer film] The method for producing the elastomer film of the present invention is not particularly limited, but preferably includes the steps of applying a coating composition containing a resin precursor containing one or more segments selected from the group consisting of segments of Chemical Formula 2, Chemical Formula 3, Chemical Formula 4, Chemical Formula 5, and hydrogenated products thereof, a segment of Chemical Formula 1, and a segment of Chemical Formula 6 onto a supporting substrate to form a coating layer (Step 1), then removing the solvent from the coating layer and drying it (Step 2), irradiating it with active energy rays to crosslink the resin precursor (Step 3), and peeling the supporting substrate from the laminate (Step 4).

[0134] Furthermore, it is preferable that, after the aforementioned "Step 3", a step of applying a coating composition for a particle layer containing particles and a resin component to form a coating layer and a step of removing the solvent from the coating layer are carried out in this order, or, after "Step 3", a step of applying a coating composition for a particle layer containing particles and a resin precursor to form a coating layer, a step of removing the solvent from the coating layer, and a step of irradiating with active energy rays to crosslink the resin precursor and form a laminate having an elastomer film on a supporting substrate are carried out in this order.

[0135] Furthermore, when a support substrate having a surface texture such as an uneven surface is used as the support substrate, the surface texture such as the uneven surface of the support substrate can be transferred to the surface of the elastomer film obtained in the aforementioned "Step 4" that was in contact with the support substrate, thereby forming a surface texture on the surface of the elastomer film. In this process, the surface texture of the support substrate and the surface texture of the elastomer film are inverted. Therefore, when the surface texture is inverted, if the skewness of the surface texture of the support substrate is positive, the skewness of the surface texture of the elastomer film can be negative, and if the skewness of the surface texture of the support substrate is negative, the skewness of the surface texture of the elastomer film can be positive.

[0136] The method for applying the coating composition onto the support substrate in step 1 is not particularly limited as long as it is possible to apply the coating composition onto the support substrate and form a uniform coating layer within the surface. The coating method onto the support substrate can be appropriately selected from dip coating, roller coating, wire bar coating, gravure coating, die coating (U.S. Pat. No. 2,681,294), etc. Here, the coating layer refers to a "liquid layer" formed by the coating step.

[0137] The method for removing the solvent in step 2, i.e., the drying method, is not particularly limited as long as it can remove the solvent from the coating layer formed on the support substrate. Drying methods include heat transfer drying (contact with a high-temperature object), convection heat transfer (hot air), radiation heat transfer (infrared rays), and others (microwaves, induction heating), but among these, in the production method of the present invention, a method using convection heat transfer or radiation heat transfer is preferred because it is necessary to precisely uniform the drying speed even in the width direction.

[0138] In the crosslinking method of step 3, the coating layer from which the solvent has been removed after drying is irradiated with active energy rays to cause a reaction and crosslink the coating film.

[0139] Crosslinking by active energy rays is preferably performed using electron beams (EB) and / or ultraviolet rays (UV) from the viewpoint of versatility. The types of ultraviolet lamps used for irradiating ultraviolet rays include, for example, discharge lamps, flash lamps, laser lamps, and electrodeless lamps. When ultraviolet curing is performed using a high-pressure mercury lamp, which is a discharge lamp, the illuminance of the ultraviolet rays should be 100 to 3,000 (mW / cm). 2 ), and more preferably 200 to 2,000 (mW / cm 2 ), more preferably 300 to 1,500 (mW / cm 2 ), and the cumulative amount of ultraviolet light is 100 to 3,000 (mJ / cm 2 ), and more preferably 200 to 2,000 (mJ / cm 2 ), more preferably 300 to 1,500 (mJ / cm 2 ) is the radiation intensity per unit area, which varies depending on the lamp output, light-emitting spectral efficiency, diameter of the light-emitting bulb, design of the reflector, and the distance between the irradiated object and the light source. However, irradiance does not vary depending on the transport speed. Furthermore, the cumulative amount of UV light is the radiation energy per unit area, which is the total amount of photons that reach the surface. The cumulative amount of light is inversely proportional to the radiation speed passing under the light source, and proportional to the number of irradiations and the number of lamps.

[0140] [Paint composition] The "coating composition" used in the aforementioned method for producing an elastomer film is not particularly limited as long as it can be applied uniformly in-plane onto a supporting substrate and can form an elastomer film exhibiting the properties of the present invention, but it is preferably a coating composition suitable for the aforementioned method for producing a laminate. Specifically, it is preferable to prepare a coating composition by adding the aforementioned resin precursor to a solvent and other components described below.

[0141] [solvent] The coating composition used in the above-described method for producing an elastomer film may contain a solvent, and preferably contains a solvent in order to form a uniform coating layer within the surface. The number of types of solvents is preferably 1 to 20, more preferably 1 to 10, even more preferably 1 to 6, and particularly preferably 1 to 4.

[0142] Here, the term "solvent" refers to a substance that is liquid at room temperature and pressure and can be evaporated almost entirely in the drying step described above.

[0143] Here, the type of solvent is determined by the molecular structure that constitutes the solvent. In other words, solvents that have the same elemental composition and the same type and number of functional groups but different bonding relationships (structural isomers), and solvents that are not structural isomers but do not exactly overlap in any conformation in three-dimensional space (stereoisomers) are treated as different types of solvents. For example, 2-propanol and n-propanol are treated as different solvents. Furthermore, when a solvent is included, it is preferable that the solvent exhibits the following characteristics:

[0144] Property 1: When solvent B is the solvent with the lowest relative evaporation rate (ASTM D3539-87(2004)) based on n-butyl acetate, the relative evaporation rate of solvent B is 0.4 or less.

[0145] Here, the relative evaporation rate based on the solvent n-butyl acetate is the evaporation rate measured in accordance with ASTM D3539-87 (2004). Specifically, it is a value defined as the relative value of the evaporation rate based on the time required for 90% by mass of n-butyl acetate to evaporate in dry air.

[0146] If the relative evaporation rate of the solvent is greater than 0.4, the time required for the aforementioned polysiloxane segments and / or polydimethylsiloxane segments and fluorine compound segments to be oriented to the outermost surface in resin layer A will be shortened, which may result in a decrease in the solvent resistance of resin layer A in the resulting laminate. The lower limit of the relative evaporation rate of the solvent is not a problem as long as the solvent can be evaporated and removed from the coating film in the drying step, and in a typical coating step, a value of 0.005 or higher will suffice.

[0147] Solvents include isobutyl ketone (relative evaporation rate: 0.2), isophorone (relative evaporation rate: 0.026), diethylene glycol monobutyl ether (relative evaporation rate: 0.004), diacetone alcohol (relative evaporation rate: 0.15), oleyl alcohol (relative evaporation rate: 0.003), ethylene glycol monoethyl ether acetate (relative evaporation rate: 0.2), nonylphenoxyethanol (relative evaporation rate: 0.25), propylene glycol monoethyl ether (relative evaporation rate: 0.1), and cyclohexanone (relative evaporation rate: 0.32).

[0148] [Other components in the coating composition] The coating composition used in the aforementioned method for producing an elastomer film preferably contains an antioxidant, a polymerization initiator, a curing agent, and a catalyst. The polymerization initiator and catalyst are used to promote crosslinking of the elastomer film. The polymerization initiator is preferably one that can initiate or promote polymerization, condensation, or crosslinking reactions of the components contained in the coating composition through anionic, cationic, or radical polymerization reactions, etc.

[0149] Antioxidants are broadly classified into radical chain initiation inhibitors, radical scavengers, and peroxide decomposers based on their mechanism of action. Any of these can achieve the effects of the present invention, namely, inhibiting deterioration under high-temperature conditions. However, radical scavengers or peroxide decomposers are more preferred, and hindered phenol-based or semi-hindered phenol-based radical scavengers, or phosphite-based or thioether-based peroxide decomposers are particularly preferred.

[0150] Various polymerization initiators, curing agents, and catalysts can be used. The polymerization initiators, curing agents, and catalysts may be used alone, or multiple polymerization initiators, curing agents, and catalysts may be used simultaneously. Furthermore, an acidic catalyst or a thermal polymerization initiator may be used in combination. Examples of acidic catalysts include aqueous hydrochloric acid, formic acid, and acetic acid. Examples of thermal polymerization initiators include peroxides and azo compounds. Examples of photopolymerization initiators include alkylphenone compounds, sulfur-containing compounds, acylphosphine oxide compounds, and amine compounds. Examples of crosslinking catalysts that promote the urethane bond-forming reaction include dibutyltin dilaurate and dibutyltin diethylhexoate.

[0151] As the photopolymerization initiator, an alkylphenone compound is preferable from the viewpoint of curability. Specific examples of the alkylphenone compound include 1-hydroxy-cyclohexyl-phenyl-ketone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-phenyl)-1-butane, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-phenyl)-1-butane, 2-benzyl-2-dimethylamino-1-(4- Examples include 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butane, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butane, 1-cyclohexyl-phenyl ketone, 2-methyl-1-phenylpropan-1-one, 1-[4-(2-ethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, bis(2-phenyl-2-oxoacetic acid)oxybisethylene, and polymerized versions of these materials.

[0152] Furthermore, a leveling agent, a lubricant, an antistatic agent, etc. may be added to the coating composition used to form the elastomer film, as long as the effects of the present invention are not impaired. As a result, the elastomer film can contain the leveling agent, the lubricant, the antistatic agent, etc.

[0153] Examples of the leveling agent include acrylic copolymers, silicone-based, and fluorine-based leveling agents. Examples of the antistatic agent include metal salts such as lithium salts, sodium salts, potassium salts, rubidium salts, cesium salts, magnesium salts, and calcium salts.

[0154] [Application example] The elastomer film of the present invention has high flexibility and recovery, and can be suitably used in applications requiring various post-processing steps. Because the elastomer film of the present invention is flexible, has high recovery, and is excellent in suitability for metal paste printing, it can be particularly suitably used for electronic device circuit board applications. One example is a healthcare sensor or wearable sensor using the elastomer film of the present invention. Another example is the use of the elastomer film in wearable devices and healthcare device stretchability, stretchable sensors, and stretchable actuators.

[0155] In addition, from the viewpoint of high flexibility and resilience, it can be suitably used for various surface, internal, constituent and manufacturing process materials, including adhesive tape substrates that require resilience, shock absorbing materials for displays, medical film substrates, automotive surface protection film substrates, pressure sensor core materials, plastic molded products such as eyeglasses and sunglasses, cosmetic boxes and food containers, aquariums, showcases for exhibitions and other uses, smartphone housings, touch panels, color filters, flat panel displays, flexible displays, flexible devices, sensors, circuit materials, electrical and electronic applications, home appliances such as keyboards and TV and air conditioner remote controls, mirrors, window glass, buildings, dashboards, car navigation systems and touch panels, vehicle parts such as rearview mirrors and windows, as well as various printed materials, medical films, sanitary material films, medical films, agricultural films and building material films.

[0156] [Electrical circuit body] The electric circuit body of the present invention is not particularly limited as long as it is the aforementioned elastomer film or elastomer film / adhesive layer laminate in which a conductor circuit is formed on at least one surface of the elastomer film. An example of the configuration of the electric circuit body will be described with reference to FIG. 9. In electric circuit body 27, electric circuit 29 is formed on elastomer film 28. There are no particular limitations on the method for forming the electric circuit, and a general method for forming a flexible printed circuit (FPC) or a screen printing method may be used.

[0157] [Healthcare Sensor] The healthcare sensor of the present invention is not particularly limited as long as it is the aforementioned elastomer film or elastomer film / adhesive layer laminate in which a conductor circuit is formed on at least one surface of the elastomer film. The healthcare sensor of the present invention refers to a sensor that is directly attached to a living body to continuously record biological information such as respiratory rate, heart rate, body temperature, blood pressure, electrocardiogram, and brain wave, with the aim of maintaining health and improving the quality of medical care, and a device using such a sensor.

[0158] An example of a method for manufacturing a healthcare sensor is described below. After forming electrodes by printing a paste (LS-453-6B, manufactured by Asahi Chemical Research Institute Co., Ltd.) on an elastomer film, an overcoat (CR-120T, manufactured by Asahi Chemical Research Institute Co., Ltd.) is printed on the film, leaving two exposed electrode sections. An overcoat (CR-120T, manufactured by Asahi Chemical Research Institute Co., Ltd.) is then printed to protect the electrodes. Next, one exposed electrode section is connected to an electrocardiogram recorder (EV-301, manufactured by Parama Tech Co., Ltd.), and the other exposed electrode section is placed in contact with the chest. The sensor is then attached to the living body using adhesive tape (9917, manufactured by 3M Japan Limited). This completes the manufacturing process of a healthcare sensor for electrocardiogram measurement.

[0159] [Wearable sensors] The wearable sensor of the present invention is not particularly limited as long as it is the aforementioned elastomer film or elastomer film / adhesive layer laminate in which a conductor circuit is formed on at least one side of the elastomer film. The wearable sensor of the present invention refers to medical and health devices such as the aforementioned healthcare sensors, as well as devices such as atmospheric pressure sensors, temperature sensors, acceleration sensors, and strain sensors, sensors that continuously record various data in fields such as fitness and sports, and devices using such sensors.

[0160] An example of a manufacturing method for a wearable sensor is described below. A paste (LS-453-6B, manufactured by Asahi Chemical Research Institute Co., Ltd.) and an overcoat (CR-120T, manufactured by Asahi Chemical Research Institute Co., Ltd.) are printed on both sides of an elastomer film to form electrodes. The electrodes are then connected to a data logger (NR-500, manufactured by Keyence Corporation). A wearable sensor is then manufactured by attaching adhesive tape (1504XL, manufactured by 3M Japan Limited) to one side of the electrode-printed elastomer film. By attaching the tape to the elbow, it can be used as a wearable strain sensor.

[0161] [Manufacturing method for elastomer film processed products] A preferred embodiment of the method for producing an elastomer film product of the present invention includes a step of processing the elastomer film side of the elastomer film of the present invention or the elastomer film-adhesive layer laminate of the present invention by screen printing. Because the elastomer film of the present invention does not easily stick to the screen printing plate, an elastomer film product with excellent stretchability can be efficiently obtained. [Example]

[0162] The present invention will now be described with reference to examples, but the present invention is not necessarily limited to these. The components and abbreviations used in the examples and comparative examples are as follows:

[0163] [Synthesis of resin precursor] [Synthesis of half-adduct H1A] A 1 L four-neck flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 2 moles of isophorone diisocyanate and a polymerization inhibitor (BHT: dibutylhydroxytoluene), and while maintaining the temperature at 60°C, 2 moles of hydroxyethyl acrylate was added through the dropping funnel to obtain a half-adduct H1A.

[0164] [Synthesis of half-adduct T1A] A four-necked flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 2 moles of toluene diisocyanate and a polymerization inhibitor (BHT). While maintaining the temperature at 60°C, 2 moles of hydroxyethyl acrylate was added from the dropping funnel to obtain a half-adduct T1A.

[0165] [Synthesis of half-adduct T1M] A four-necked flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 2 moles of toluene diisocyanate and a polymerization inhibitor (BHT). While maintaining the temperature at 60°C, 2 moles of hydroxyethyl methacrylate was added through the dropping funnel to obtain a half-adduct T1M.

[0166] [Synthesis of half-adduct H3A] A four-neck flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 2 moles of isophorone diisocyanate and a polymerization inhibitor (BHT). While maintaining the temperature at 60°C, 2 moles of pentaerythritol triacrylate was added through the dropping funnel to obtain a half-adduct H3A.

[0167] [Synthesis of Resin Precursor A] A four-neck flask equipped with a stirrer, condenser, thermometer, and dropping funnel was charged with 0.2 moles of hydrogenated polybutadiene (GI-3000 manufactured by Nippon Soda Co., Ltd.) having a number-average molecular weight of approximately 3,100 and hydroxyl groups at its terminals, and 0.15 moles of isophorone diisocyanate. The mixture was reacted at 80°C for 4 hours to obtain an average tetramer of GI-3000. Next, 0.1 moles of the half-adduct H3A was added and reacted at 80°C for 6 hours to obtain a bifunctional urethane acrylate, designated Resin Precursor A. The molecular weight of Resin Precursor A was confirmed by GPC, and its weight-average molecular weight, calculated as polystyrene, was 14,000.

[0168] [Synthesis of Resin Precursor B] A four-neck flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 0.2 mol of hydrogenated polybutadiene (GI-3000 manufactured by Nippon Soda Co., Ltd.) having a number-average molecular weight of approximately 3,100 and having hydroxyl groups at its terminals, and 0.16 mol of isophorone diisocyanate, and the mixture was reacted at 80°C for 4 hours to obtain an average pentamer of GI-3000.

[0169] Next, 0.04 mol of the half-adduct H3A was added and reacted at 80° C. for 6 hours, and then 0.04 mol of the half-adduct H1A was added and reacted at 80° C. for 6 hours to obtain a tetrafunctional urethane acrylate, which was designated as Resin Precursor B. When the molecular weight of Resin Precursor B was confirmed by GPC, its weight average molecular weight was 17,400 in terms of polystyrene.

[0170] [Synthesis of Resin Precursor C] A four-neck flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 0.2 mol of hydrogenated polybutadiene (GI-3000 manufactured by Nippon Soda Co., Ltd.) having a number-average molecular weight of approximately 3,100 and having hydroxyl groups at its terminals, and 0.13 mol of isophorone diisocyanate, and the mixture was reacted at 80°C for 4 hours to obtain a GI-3000 trimer.

[0171] Next, 0.067 mol of the half-adduct H3A was added and reacted at 80° C. for 6 hours, and then 0.067 mol of the half-adduct H1A was added and reacted at 80° C. for 6 hours to obtain a tetrafunctional urethane acrylate, which was designated as Resin Precursor C. When the molecular weight of Resin Precursor C was confirmed by GPC, its weight average molecular weight was 10,000 in terms of polystyrene.

[0172] [Synthesis of Resin Precursor D] A four-neck flask equipped with a stirrer, condenser, thermometer, and dropping funnel was charged with 0.2 mol of hydrogenated polybutadiene (GI-1000 manufactured by Nippon Soda Co., Ltd.) having a number average molecular weight of approximately 1,500 and 0.4 mol of the half adduct T1A, and the mixture was reacted at 80°C for 6 hours to obtain a bifunctional urethane acrylate, which was designated Resin Precursor D. The molecular weight of Resin Precursor D was confirmed by GPC, and its weight average molecular weight, calculated as polystyrene, was 2,000.

[0173] [Synthesis of Resin Precursor E] A four-neck flask equipped with a stirrer, condenser, thermometer, and dropping funnel was charged with 0.2 mol of polybutadiene (G-3000 manufactured by Nippon Soda Co., Ltd.) having a number average molecular weight of approximately 3100 and 0.4 mol of the half adduct T1M, and the mixture was reacted at 80°C for 6 hours to obtain a bifunctional urethane methacrylate, which was designated as Resin Precursor E. The molecular weight of Resin Precursor E was confirmed by GPC, and its weight average molecular weight, calculated as polystyrene, was 3,500.

[0174] [Synthesis of Resin Precursor F] A four-neck flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 0.2 mol of hydrogenated polybutadiene (GI-2000 manufactured by Nippon Soda Co., Ltd.) having a number average molecular weight of approximately 1,900 and having hydroxyl groups at its terminals, 0.1 mol of pyromellitic acid, and 0.001 mol of benzyldimethylamine, and the mixture was reacted at 80°C for 12 hours to obtain an acid dimer of GI-2000.

[0175] Next, a polymerization inhibitor (BHT) and a catalyst (tetrabutoxytitanium) were charged, and 0.2 moles of methyl acrylate was added while stirring to carry out a reaction, yielding a bifunctional polyester acrylate, which was designated as Resin Precursor F. When the molecular weight of Resin Precursor F was confirmed by GPC, its weight average molecular weight was found to be 5,000 in terms of polystyrene.

[0176] [Synthesis of Resin Precursor G] A four-neck flask equipped with a stirrer, condenser, thermometer, and dropping funnel was charged with 0.2 moles of polybutadiene (G-3000 manufactured by Nippon Soda Co., Ltd.) having a number average molecular weight of approximately 3,000 and hydroxyl groups at its terminals, a polymerization inhibitor (BHT), and a catalyst (tetrabutoxytitanium). While stirring, 0.2 moles of methyl acrylate was added to carry out the reaction, yielding a bifunctional polyester acrylate, designated Resin Precursor G. The molecular weight of Resin Precursor G was confirmed by GPC, and its weight average molecular weight, calculated as polystyrene, was found to be 3,200.

[0177] [Resin precursor H] As resin precursor H, bifunctional methacrylic-modified polyisoprene having methacrylic groups on the side chains ("Kurapren" (registered trademark) UC-102AM, weight average molecular weight 17,000, manufactured by Kuraray Co., Ltd.) was used.

[0178] [Synthesis of Resin Precursor J] A four-neck flask equipped with a stirrer, a condenser, a thermometer, and a dropping funnel was charged with 0.3 mol of polybutadiene (G-3000 manufactured by Nippon Soda Co., Ltd.) having a number average molecular weight of approximately 3,000 and hydroxyl groups at its terminals, 0.2 mol of pyromellitic acid, and 0.001 mol of benzyldimethylamine, and the mixture was reacted at 80°C for 12 hours to obtain the acid trimer of G-3000.

[0179] Next, a polymerization inhibitor (BHT) and a catalyst (tetrabutoxytitanium) were charged, and 0.2 mol of methyl acrylate was added while stirring to carry out a reaction, yielding a bifunctional polyester acrylate, which was designated as Resin Precursor J. When the molecular weight of Resin Precursor J was confirmed by GPC, its weight-average molecular weight was 10,000 in terms of polystyrene.

[0180] [Synthesis of Resin Precursor K] A four-neck flask equipped with a stirrer, condenser, thermometer, and dropping funnel was charged with 0.43 mol% isophorone diisocyanate (IPDI) and 0.29 mol% polytetramethylene glycol (PTMG2000 manufactured by Mitsubishi Chemical Corporation), diluted with toluene to a solids concentration of 60% by mass, and reacted at 90 ° C. When the residual isocyanate groups reached 1.4% by mass of the initial amount added, the temperature was lowered to 70 ° C., and 0.29 mol of hydroxyacrylate (HEA) was added and reacted. When the residual isocyanate groups reached 0.3% by mass of the initial amount added, the reaction was terminated, and toluene was added to adjust the solids concentration to 60% by mass, resulting in a toluene solution of resin precursor K. The molecular weight of this resin precursor K was confirmed by GPC, and its weight average molecular weight, calculated as polystyrene, was 29,000.

[0181] [Paint composition formulation] [Paint composition 1] The following materials were diluted with methyl ethyl ketone to obtain elastomer film-forming coating composition 1 with a solid content concentration of 40 mass %.

[0182] Resin precursor A: 100 parts by mass Photopolymerization initiator "IRGACURE" (registered trademark) 184 (manufactured by BASF Japan Ltd.): 3 parts by mass.

[0183] [Preparation of coating compositions 2 to 10] Coating compositions 2 to 10 were prepared in the same manner as in the preparation of coating composition 1, except that the resin precursors were changed to the combinations of resin precursors shown in Table 1.

[0184] [11 formulations of coating compositions] A hydrogenated styrene-based thermoplastic elastomer ("SOE" (registered trademark) S1606 manufactured by Asahi Kasei Corporation) was dissolved in toluene to obtain a coating composition 11 having a solids concentration of 40 mass %.

[0185] [12 formulations of coating composition] Thermoplastic urethane ("Miractran" (registered trademark) XN-2001, manufactured by Nippon Miractoran Co., Ltd.) was dissolved in toluene to obtain a coating composition 12 having a solids concentration of 40 mass %.

[0186] [Preparation of coating composition for particle layer] [Raw materials for compounding coating composition for particle layer] The raw materials used in the preparation of the coating composition for the particle layer are as follows: Resin A for particle layer: Acid-modified SEBS-B: "TUFTECH" (registered trademark) M1911 (manufactured by Asahi Kasei Corporation, maleic anhydride-modified SEBS, hydrogenation rate 100%, content of styrene-based monomer in hydrogenated product before acid modification 30% by mass, weight-average molecular weight of hydrogenated product 100,000, amount of acid modification 0.2% by mass). Resin B for particle layer: acid-modified ethylene-α-olefin copolymer "AMPLIFY" (registered trademark) GR216 (manufactured by Dow Chemical, maleic anhydride-modified ethylene-α-olefin copolymer, acid modification amount 0.5% by mass). Additive 1: Fluorine-based leveling agent "Ftergent" (registered trademark) 650AC (manufactured by Neos Corporation, active ingredient 30% by mass). Resin particles 1: urethane particles "Art Pearl" (registered trademark) C-800 transparent (manufactured by Negami Chemical Industrial Co., Ltd., solid content concentration 99 mass%, number average particle diameter 6 μm). Resin particles 2: Urethane particles "Art Pearl" (registered trademark) C-1000 transparent (manufactured by Negami Chemical Industrial Co., Ltd., solid content concentration 99 mass%, number average particle diameter 3 μm). Alkoxysilane 1: N-phenyl-3-aminopropyltrimethoxysilane KBM-573 (Shin-Etsu Chemical Co., Ltd.).

[0187] [Coating composition 1 for particle layer] The following materials were diluted with toluene to obtain a coating composition 1 for particle layer with a solid content concentration of 20 mass %. ·Resin A for particle layer: 80 parts by mass. ·Resin particles 1: 20 parts by mass. Additive 1: 0.03 parts by mass.

[0188] [Coating composition 2 for particle layer] The following materials were diluted with toluene to obtain coating composition 2 for particle layer with a solid content concentration of 20 mass %. ·Resin B for particle layer: 80 parts by mass. ·Resin particles 1: 20 parts by mass. Additive 1: 0.03 parts by mass.

[0189] [Coating composition for particle layer 3] The following materials were diluted with toluene to obtain coating composition 3 for particle layer with a solid content concentration of 20 mass %. ·Resin B for particle layer: 80 parts by mass. ·Resin particles 1: 20 parts by mass. Additive 1: 0.03 parts by mass. ·Alkoxysilane 1: 1 part by mass.

[0190] [Coating composition for particle layer 4] The following materials were diluted with toluene to obtain coating composition 4 for particle layer with a solid content concentration of 20 mass %. ·Resin B for particle layer: 70 parts by mass. ·Resin particles 1: 30 parts by mass. Additive 1: 0.03 parts by mass. ·Alkoxysilane 1: 1 part by mass.

[0191] [Coating composition for particle layer 5] The following materials were diluted with toluene to obtain coating composition 5 for particle layer with a solid content concentration of 20 mass %. ·Resin A for particle layer: 80 parts by mass. ·Resin particles 2: 20 parts by mass. Additive 1: 0.03 parts by mass. "Formulation of coating composition for release layer" [Raw materials for compounding coating composition for release layer] The raw materials used in the preparation of the coating composition for the release layer are as follows: Alkyd compound 1: Acrylic-modified alkyd resin Hariftal KV-905 (manufactured by Harima Chemicals Co., Ltd., solid content concentration 53% by mass). Melamine compound 1: isobutyl alcohol-modified melamine resin "Melan" (registered trademark) 2650L (manufactured by Hitachi Chemical Co., Ltd., solid content concentration 60% by mass). Silicone compound 1: Side-chain carbinol-modified silicone oil (X-22-4015, manufactured by Shin-Etsu Chemical Co., Ltd., solid content: 100% by mass). Silicone compound 2: Double-ended polyether-modified reactive silicone oil (X-22-4952, manufactured by Shin-Etsu Chemical Co., Ltd., solid content: 100% by mass). · Paratoluenesulfonic acid.

[0192] [Release layer coating composition 1] The following materials were mixed and diluted with a mixed solvent of methyl ethyl ketone and isopropyl alcohol (mixing ratio by mass: 50 / 50) to obtain coating composition 1 for a release layer having a solids concentration of 5 mass %. ·Alkyd compound 1: 100 parts by mass. Melamine compound 1: 20 parts by weight. · Paratoluenesulfonic acid: 5 parts by mass. Silicone compound 1: 5 parts by weight. Silicone compound 2: 5 parts by weight.

[0193] [Support base material] The supporting substrate used in the production of the elastomer film is as follows. Support substrate 1: Toray Industries, Inc.'s "Lumirror" (registered trademark) U48 (highly smooth product) 50 μm. Support substrate 2: Toray Industries, Inc.'s "Lumirror" (registered trademark) X42G (low gloss product), 50 μm. Support substrate 3: Toray Industries, Inc.'s "Lumirror" (registered trademark) S10 50 μm, sandblasted.

[0194] [Formation of release layer] Using a coating device with a small-diameter gravure coater, a combination of the support substrate and release layer coating composition listed in Table 1 was used, and the gravure roll line count, gravure roll peripheral speed, and solids concentration of the release layer coating composition were adjusted so that the release layer thickness would be 200 nm.The coating was then dried and crosslinked by holding the hot air at 140°C for 30 seconds, forming a release layer.

[0195] [Formation of Resin Layer A] Resin layer A was formed on the release layer prepared on the support substrate in the previous section by using the combination of the above-mentioned resin layer coating composition and the resin layer formation method described below in the combination shown in Table 1.

[0196] [Method 1 for forming a resin layer] In step 1, the aforementioned resin layer coating composition was applied to the release layer side of the support substrate using a continuous coating device such as a slot die coater, adjusting the discharge flow rate so that the thickness of the resin layer A after crosslinking would be the film thickness shown in the table, thereby forming a coating layer.

[0197] In step 2, the coating layer formed in step 1 was dried under the following conditions to remove the solvent. ·Blow temperature: Temperature: 80℃. ·Wind speed: Application side: 5m / sec, non-application side: 5m / sec. Wind direction: Coated side: parallel to the surface of the substrate, non-coated side: perpendicular to the surface of the substrate. Dwell time: 2 minutes.

[0198] In step 3, the coating layer (uncrosslinked resin layer) obtained by removing the solvent was irradiated with active energy rays under the following conditions to crosslink the layer, thereby obtaining a resin layer A and a laminate. · Light source: High pressure mercury lamp. Irradiation output: 400W / cm 2 . Accumulated light output: 120mJ / cm 2 . Oxygen concentration: 0.1% by volume.

[0199] [Method 2 for forming a resin layer] In step 1, the aforementioned resin layer coating composition was applied to the release layer side of the support substrate using a continuous coating device such as a slot die coater, adjusting the discharge flow rate so that the thickness of the resin layer A after crosslinking would be the film thickness shown in the table, thereby forming a coating layer.

[0200] In step 2, the coating layer formed in step 1 was dried under the following conditions to remove the solvent. ·Blow temperature: Temperature: 80℃. ·Wind speed: Application side: 5m / sec, non-application side: 5m / sec. Wind direction: Coated side: parallel to the surface of the substrate, non-coated side: perpendicular to the surface of the substrate. Dwell time: 2 minutes.

[0201] In step 3, the coating layer (uncrosslinked resin layer) obtained by removing the solvent was irradiated with active energy rays under the following conditions to crosslink the layer, thereby obtaining a resin layer A and a laminate. · Light source: High pressure mercury lamp. Irradiation output: 400W / cm 2 . Accumulated light output: 120mJ / cm 2 . Oxygen concentration: 0.1% by volume.

[0202] In step 4, the adhesive layer side of "Panaprotect" (registered trademark) HUCB Type 2 manufactured by Panac Corporation was bonded to the resin layer A side of the laminate obtained in step 3, and then the support substrate of "Panaprotect" (registered trademark) was peeled off to obtain a laminate.

[0203] [Formation of particle layer] A particle layer was formed on the resin layer A prepared in the previous section by using the combination of the coating composition for the particle layer described above and the method for forming the particle layer described below in the combination shown in Table 1.

[0204] [Method 1 for forming particle layer] In step 1, the coating composition for the particle layer described above was applied to the surface of the laminate on the resin layer A side using a continuous coating device such as a slot die coater, with the discharge flow rate adjusted so that the thickness of the particle layer after step 2 would be the film thickness shown in the table.

[0205] In step 2, the layer coated in step 1 was dried under the following conditions to remove the solvent. ·Blow temperature: Temperature: 80℃. ·Wind speed: Application side: 5m / sec, non-application side: 5m / sec. Wind direction: Coated side: parallel to the surface of the substrate, non-coated side: perpendicular to the surface of the substrate. Dwell time: 2 minutes.

[0206] [Method for producing elastomer film] The support substrate and release layer were peeled off from the laminate produced by the above method to produce elastomer films of Examples 1 to 10, Comparative Examples 1 to 3 and 5, and Reference Examples 3 and 4. In Comparative Example 4, a silicone film ("ELASTOSIL" (registered trademark) FILM2030 manufactured by Wacker Asahi Kasei Silicones Co., Ltd.) was used.

[0207] In addition, in Reference Example 1, supporting substrate 2 was used, and in Reference Example 2, supporting substrate 3 was used.

[0208] Table 2 also shows whether or not each segment of Chemical Formulas 1 to 6 is contained in the elastomer film.

[0209] In Table 2, "including" in the column for Chemical Formula 1 means that each Example contains a segment of Chemical Formula 1, and "not including" means that each Example does not contain a segment of Chemical Formula 1. The same applies to Chemical Formulas 2 to 5. Furthermore, "including" in the column for Chemical Formula 6 means that each Example is a cured product obtained by crosslinking a resin precursor containing a segment of Chemical Formula 6, and "not including" means that each Example is not a cured product obtained by crosslinking a resin precursor containing a segment of Chemical Formula 6.

[0210] [Table 1]

[0211] [Table 2]

[0212] [Evaluation of elastomer film] The following performance evaluations were carried out on the elastomer films. Unless otherwise specified, measurements were taken three times for each sample in each Example, Comparative Example, and Reference Example, at different locations, and the average value was used.

[0213] [Swelling ratio with butyl carbitol acetate] The film was cut into 1.5 cm squares, and the mass (A) before immersion in the solvent was measured using an electronic balance. Next, 10 ml of butyl carbitol acetate and one piece of the cut film were placed in a glass container, the container was stopped, and the container was left to stand for 30 minutes in an environment of 25°C. The film was then removed from the glass container, and any droplets on the surface were wiped off with gauze. Then, the mass (B) after immersion in the solvent was measured using an electronic balance. The swelling ratio of the film in butyl carbitol acetate was calculated by substituting A and B into Equation 5.

[0214] Equation 5: Swelling rate=B / A×100(%).

[0215] [Surface free energy] The surface free energy of the elastomer film was measured by measuring the static contact angle at 25° C. with water, ethylene glycol, formamide, and diiodomethane for the surface layer B. The static contact angle was measured according to the following procedure.

[0216] The film was fixed onto a glass plate and left for 12 hours in an environment of 25°C. The contact angle was measured using a Drop Master DM-501 manufactured by Kyowa Interface Science Co., Ltd., under conditions that allowed for the creation of droplets as small as possible without causing the droplets to creep up the needle. An image was then taken 5 seconds after the droplets landed on the film surface, and the value calculated using the θ / 2 method was used to determine the static contact angle of the liquid.

[0217] The static contact angle for each liquid and the dispersion term, polar term, and hydrogen bond term of the surface free energy of each liquid described in Non-Patent Document 3 were introduced into the "extended Hawks' equation of Hata and Kitazaki" described in Non-Patent Document 2, and the simultaneous equations were solved to obtain the results.

[0218] [Moisture permeability according to condition B of JIS Z0208-1976] The moisture permeability of the film under condition B of JIS Z0208-1976 was calculated based on the cup method of JIS Z0208-1976 from the mass and area of ​​water vapor that permeated the film over 24 hours in an environment with a temperature of 40°C and a relative humidity of 90%. The measurement was performed in two configurations so that each surface was in contact with water vapor, and the measurement results were taken as the average of the two configurations.

[0219] [Hansen solubility parameter] The swelling ratios for the following 14 solvents were determined in the same manner as for the swelling ratio of the elastomer film in butyl carbitol acetate described above, and were classified into the following five levels. The swelling ratio scores for each solvent were then entered into the score field of Hansen Solubility Parameter in Practice (HSPiP) ver. 3.1.17 (http: / / www.hansen-solubility.com / index.php). The dispersion term (δD), polar term (δP), and hydrogen bond term (δH) of the Hansen solubility parameters for each film were calculated using Advanced Sphere Fitting, Classic GA mode, Inside set to 2, and Fitting Accuracy set to Higher. Furthermore, the obtained δD, δP, and δH were substituted into Equation 3 to calculate the distance (D) of the Hansen solubility parameter and the proportion of the non-dispersion term of the Hansen solubility parameter, as described in Equation 2.

[0220] <Solvents used>: A total of 14 solvents: acetone, 1-butanol, MEK (methyl ethyl ketone), THF (tetrahydrofuran), toluene, ethyl acetate, 1,4-dioxane, NMP (N-methylpyrrolidone), cyclohexanone, DMF (N,N-dimethylformamide), DMSO (dimethyl sulfoxide), acetonitrile, cyclohexane, and butyl carbitol acetate.

[0221] <Classification of swelling ratio> Change rate: 100% or more but less than 120%: 5 points Change rate: 120% or more but less than 150%: 4 points Change rate: 150% or more but less than 200%: 3 points Change rate: 200% or more but less than 250%: 2 points Change rate of 250% or more: 1 point.

[0222] [Average (meth)acryloyl group equivalent] The average (meth)acryloyl group equivalent of the resin precursor was determined by dividing the polystyrene-equivalent weight average molecular weight of the resin precursor by the number of functional groups designed in the resin precursor. Note that if the elastomer film is not a cured product obtained by crosslinking the resin precursor, or if the resin precursor does not contain (meth)acryloyl groups, it is recorded as "not contained."

[0223] [Flexibility evaluation] The laminate was cut into a rectangle measuring 10 mm wide x 150 mm long, and the elastomer film was then peeled off from the supporting substrate to prepare a test piece.

[0224] Using a tensile testing machine (Orientec Co., Ltd. "Tensilon" (registered trademark) UCT-100), a tensile test was carried out at an initial tensile chuck distance of 50 mm, a tensile speed of 300 mm / min, and a measurement temperature of 23°C.

[0225] Read the load b (N) applied to the sample when the chuck distance is a (mm), and use the following formula to calculate the strain x (%) and stress y (N / mm 2 ) was calculated, where the sample thickness before the test is k (mm). Strain amount: x = ((a-50) / 50) x 100 Stress: y=b / (k×10) Of the data obtained above, the stress at a strain of 5% was defined as the 5% strain stress.

[0226] [Evaluation of resilience] The elastomer film was cut into a rectangular shape measuring 10 mm wide x 150 mm long to prepare a test piece. Using a tensile tester (Orientec Co., Ltd., "Tensilon" (registered trademark) UCT-100), the test was carried out at a temperature of 23°C under two conditions with different deformation speeds to determine the superiority or inferiority of recovery properties.

[0227] Condition A (elastic recovery rate at 20% elongation): The sample was stretched to a strain of 20% with an initial chuck distance of 50 mm and a tensile speed of 50 mm / min. After that, the tensile load on the sample was released, and the distance marked as the initial test length before the measurement was measured and recorded as L mm. The elastic recovery rate z1 (%) was calculated using the following formula.

[0228] Elastic recovery rate z1 = (1-(L-50) / 100) x 100 (%).

[0229] Condition B (elastic recovery rate at 100% elongation): After the sample was elongated to a strain of 100% with an initial chuck distance of 50 mm and a tensile speed of 300 mm / min, the tensile load on the sample was released, and the distance marked as the initial test length before the measurement was measured and defined as L mm. The elastic recovery rate z2 (%) was calculated using the following formula.

[0230] Elastic recovery rate z2 = (1-(L-50) / 100) x 100 (%) Those that broke during the evaluation were recorded as "broken."

[0231] [Evaluation of heat resistance] The elastomer film was cut into a 10 mm wide rectangle to prepare a test piece. Measurements of the film were carried out using a Seiko Instruments Inc. DMS6100 dynamic viscoelasticity measuring device based on the tensile vibration-non-resonance method (dynamic viscoelasticity method) specified in JIS K7244 (1999).

[0232] Measurement mode: Tensile Chuck distance: 20mm Test piece width: 10 mm Frequency: 1Hz Distortion amplitude: 10μm Minimum tension: 20mN Initial force amplitude: 40 mN Measurement temperature: -100℃ to 200℃ Heating rate: 5°C / min At this time, the dL value (output value of the LVDT (Linear Variable Differential Transformer)) is obtained, which represents the value corresponding to the dimension of the test piece at the time of measurement. The dL value at 30°C is defined as a30 (μm) and the dL value at 150°C is defined as a150 (μm), and the dimensional change rate was calculated using the following formula.

[0233] Dimensional change rate = ((a150-a30) / 20,000) x 100(%) Furthermore, the absolute value of the dimensional change rate at 150°C was calculated based on the dimension at 30°C obtained by the above formula.

[0234] [Evaluation of Solvent Resistance] The elastomer film was fixed onto a glass plate, and a silver paste (LS-453-6B, manufactured by Asahi Chemical Research Institute Co., Ltd.) was applied onto the surface layer B using an applicator so that the coating thickness after drying would be approximately 5 μm and the coating width would be approximately 15 mm. After drying at 80°C for 30 minutes, the elastomer film was observed and scored based on the following criteria. The average values ​​of three evaluations were rounded to the nearest whole number and are shown in the table.

[0235] 5 points: No changes in shape such as waviness at the boundary between the coated and uncoated areas 3 points: There are swelling marks at the boundary between the coated and uncoated areas, accompanied by deformation such as wavy shapes. 1 point: The boundary between the coated and uncoated areas is significantly deformed, and partial peeling of the coating is observed.

[0236] [Evaluation of Metal Paste Adhesion] An elastomer film was fixed onto a glass plate, and a paste (LS-453-6B, manufactured by Asahi Chemical Research Institute Co., Ltd.) was applied onto the surface layer B using an applicator so that the coating thickness after drying would be 5 μm. After drying at 80°C for 30 minutes, adhesion was evaluated according to the adhesion (cross-cut method) described in JIS K5600-5-6 (1999), and the result was classified into categories 0 to 5 of JIS K5600-5-6 (1999).

[0237] [Surface roughness Sa, skewness Ssk, maximum peak height Sp, maximum valley depth Sv] The surface roughness Sa, skewness Ssk, maximum peak height Sp, and maximum valley depth Sv of the elastomer film were measured using a scanning white light interference microscope "VertScan" (registered trademark) VS1540 manufactured by Hitachi High-Tech Corporation, and the measurements were calculated using the attached analysis software. The conditions are as follows, and each value was the arithmetic mean value of five measurements. The results for surface layer B are shown in the table.

[0238] In Examples 1 to 10, the particle layer side of the elastomer film was surface layer B. In Comparative Examples 1 to 5, since the film was a single layer and did not have resin layer A or surface layer B, the surface of the film facing away from the supporting substrate, which had a large surface roughness Sa, was measured. In Reference Example 1, an arbitrary surface was measured, and in Reference Example 2, the surface that had been subjected to sandblasting treatment was measured, and in Reference Examples 3 and 4, the surface that had been in contact with the peeled supporting substrate was measured.

[0239] (conditions) Measurement mode: WAVE. Objective lens: 50x. ·Telescope lens: 1x Wavelength filter: 530nm white Measurement software: VS-Measure Version 10.0.5.0 Analysis software: VS-Viewer Version 10.0.4.0 Completion: Full Completion Surface correction: 4th order Filter: Median (3x3) ·Measurement area 113×113μm.

[0240] [Measurement of Resistance Change Rate] The rate of change in resistance was measured by measuring the resistance with a digital multimeter while stretching the electric circuit body on which the circuit wiring was formed with a tensile tester. <Creating test specimens> A screen printing plate (100 x 100, SUS325-28-C, NU-55, emulsion thickness 5 μm, manufactured by Nakanuma Art Screen Co., Ltd.) with a wiring pattern having a 1 mm wide, 50 mm long straight section between the electrodes shown in Figure 12 was attached to a small screen printing machine (LS-150, manufactured by Newlong Precision Industry Co., Ltd.), and a printing paste (LS-453-6B, manufactured by Asahi Chemical Research Institute Co., Ltd.) was placed on the screen printing plate. Next, the elastomer film was fixed on the printing machine stage, and a wiring pattern was printed on the surface of surface layer B. This was then dried at 80°C for 30 minutes to create an electrical circuit. A 20 mm wide x 150 mm long electrical circuit was cut out of the wiring pattern at the center to serve as a test specimen. The 150 mm long direction was aligned with the longitudinal direction of the elastomer film.

[0241] <Measurement> A 30 mm square copper plate was attached to the electrode of the test specimen and secured in place with tape. The test specimen and copper plate were connected to a tensile testing machine (Orientec "Tensilon" (registered trademark) UCT-100). The chuck distance was set to 50 mm, adjusted so that the distance between the chucks coincided with the straight section. The copper plate was connected to a digital multimeter (Keysight Technologies "Digital Multimeter" 34465A) via clips. While recording the resistance value with the digital multimeter, the sample was stretched to a strain of 20% at a tensile speed of 100 mm / min, held for 10 seconds, restored to 0%, and held for 10 seconds, repeating this cycle 20 times. The maximum resistance value in the first cycle was defined as P (Ω), and the maximum resistance value in the 20th cycle was defined as Q (Ω), and the rate of change in resistance, Q / P, was calculated.

[0242] When the longitudinal direction was unknown, a sample was prepared in an arbitrary direction, and then samples were prepared at 60° and 120° rotations, and the measurement results of a total of three samples were averaged for evaluation.

[0243] [Evaluation of printability using metal paste] An electrical circuit with the circuit pattern shown in FIG. 9 was printed by screen printing using an elastomer film, a printing plate, and conductive ink. Specifically, a printing plate with a mesh size of 200 made of synthetic fibers such as polyester was prepared, and the conductive ink was pressed onto the elastomer film with a squeegee to print the conductive ink onto the elastomer film (printing speed: 100 mm / sec, printing angle: 60°). The elastomer film was visually observed for adhesion to the printing plate (sticking during printing), separation between the separator and elastomer film (lifting during printing), and bleeding or blurring of the printed wiring. The results were evaluated using the following four-point scale. For Examples 1 to 10, the surface of the elastomer film on the surface layer B side was evaluated, while for Comparative Examples 1 to 5, the surface of the film on the non-support substrate side was evaluated.

[0244] A: There is no sticking or lifting during printing, and the wiring does not bleed or fade.

[0245] B: There is no lifting during printing, but there is some sticking and some bleeding and fading of the wiring can be seen.

[0246] C: There is no lifting during printing, but the print is strongly adhered, and bleeding and fading of the wiring can be seen in most areas.

[0247] D: There is strong adhesion during printing, causing lifting during printing.

[0248] [Evaluation of particle layer adhesion] A Hi-Ze Gauze NT-4 (manufactured by Ozu Sangyo Co., Ltd.) was placed vertically on the particle layer side of the elastomer film so as to apply two different load conditions, and the approximate remaining rate of the particle layer as visually observed after the film was moved back and forth 10 times over a length of 5 cm was determined.

[0249] Condition C: Load 50g / cm 2 .

[0250] Condition D: Load 250g / cm 2 .

[0251] [Evaluation of reworkability] The elastomer film was placed on a glass plate and pressed against it with a load applied in the direction perpendicular to the elastomer film. The elastomer film was then pulled in its planar direction, and its behavior was evaluated according to the following criteria. For Examples 1 to 10, the surface of the elastomer film on the side of surface layer B was measured, and for Comparative Examples 1 to 5, the surface of the film on the non-support substrate side was measured. 10 points: Able to move and adjust position with little resistance. 7 points: Can be moved with minimal force and position corrected. 4 points: Can be moved with a little force and position can be corrected. 1 point: Other (Can be moved but requires a lot of force, cannot be moved, etc.).

[0252] Tables 3 and 4 summarize the evaluation results of each of the Examples, Comparative Examples, and Reference Examples.

[0253] [Table 3]

[0254] [Table 4] [Explanation of symbols]

[0255] 1, 28: Elastomer film 2: Surface layer B 3: Resin particles 4, 9, 17, 19, 22, 25: Laminates 5, 21: Release layer 6, 8: Supporting base material 7: Resin layer A 18, 20, 23, 26: Protective material 24:Adhesive layer 27: Electrical circuit body 29: Electrical Circuits 31, 32: Surface of surface layer B or resin layer A 41: Elastomer film 42:Wiring circuit 43: Electrode part 44: Electrical circuit body [Industrial Applicability]

[0256] The elastomer film of the present invention has high flexibility and recovery, and can be suitably used in applications requiring various post-processing steps.

[0257] For example, the material can be suitably used for stretchability in wearable devices, healthcare devices, stretchable sensors, and stretchable actuators.

[0258] In addition, from the viewpoint of high flexibility and resilience, it can be suitably used for various surface, internal, constituent and manufacturing process materials, including adhesive tape substrates that require resilience, shock absorbing materials for displays, medical film substrates, automotive surface protection film substrates, pressure sensor core materials, plastic molded products such as eyeglasses and sunglasses, cosmetic boxes and food containers, aquariums, showcases for exhibitions and other uses, smartphone housings, touch panels, color filters, flat panel displays, flexible displays, flexible devices, sensors, circuit materials, electrical and electronic applications, home appliances such as keyboards and TV and air conditioner remote controls, mirrors, window glass, buildings, dashboards, car navigation systems and touch panels, vehicle parts such as rearview mirrors and windows, as well as various printed materials, medical films, sanitary material films, medical films, agricultural films and building material films.

Claims

1. An elastomeric film, the elastomer film has a resin layer A and a surface layer B, An elastomer film that satisfies at least one of the following conditions 1, 2, and 6 to 10: Condition 1: The swelling ratio of the elastomer film with butyl carbitol acetate is 2 Below 00%. Condition 2: The surface free energy of the surface layer B is 25 mN / m or more. Condition 6: The surface roughness Sa of the surface layer B is 150 nm or more and 5,000 nm or less. Condition 7: The surface layer B is a particle layer containing resin particles and the segment of Chemical Formula 8. Condition 8: The surface layer B contains resin particles, and the number average particle size of the resin particles is 2 μm or more and 20 μm or less. Condition 9: The skewness Ssk of the surface layer B is a positive value. Condition 10: The maximum peak height Sp and the maximum valley depth Sv of the surface layer B satisfy Expression 4. Equation 4: |Sp| / |Sv| ≧ 1 【Chemical 1】

2. The elastomer film according to claim 1 , wherein the resin layer A comprises a segment of Chemical Formula 1. 。 【Chemistry 2】 R １ refers to a hydrogen or methyl group. R ２ refers to one of the following: Substituted or unsubstituted alkylene groups Substituted or unsubstituted arylene groups An alkylene group having an ether group, an ester group, or an amide group therein an arylene group having an ether group, an ester group, or an amide group therein Unsubstituted alkylene group having an internal ether group, ester group, or amide group An unsubstituted arylene group having an ether group, an ester group, or an amide group therein.

3. The elastomer film according to claim 1 or 2, which satisfies the following condition 3: Condition 3: Permeability of elastomer film according to condition B of JIS Z0208-1976 Humidity is 100g / m ２ ・Less than 24 hours.

4. The elastomer film according to any one of claims 1 to 3, which satisfies the following condition 4: Condition 4: The Hansen solubility parameter calculated from the swelling ratio of the elastomer film The distance (D), dispersion term (δD), polar term (δP), and hydrogen bond term (δH) are expressed in Eq. and satisfies formula 2. Formula 1: D < 20 (J / cm ３ ) ０．５ Equation 2: (δP+δH) / D <0.

5.

5. The resin layer A comprises a segment of Chemical Formula 2, a segment of Chemical Formula 3, a segment of Chemical Formula 4, and a a segment of the formula 5, and a segment of a hydrogenated product thereof; The elastomer fiber according to any one of claims 1 to 4, comprising at least one segment. Film. 【Chemistry 3】 【Chemistry 4】 【Chemistry 5】 【Chemistry 6】

6. The resin layer A constituting the elastomer film is a resin precursor containing a segment of Chemical Formula 6 The elastomer according to any one of claims 1 to 5, which is a cured product obtained by crosslinking a precursor. film. 【Chemistry 7】 R ３ refers to a hydrogen or methyl group. R ４ , R ５ refers to one of the following: Substituted or unsubstituted alkylene groups Substituted or unsubstituted arylene groups An alkylene group having an ether group, an ester group, or an amide group therein an arylene group having an ether group, an ester group, or an amide group therein Unsubstituted alkylene group having an internal ether group, ester group, or amide group An unsubstituted arylene group having an ether group, an ester group, or an amide group therein R ６ refers to one of the following: Substituted or unsubstituted alkylene groups Substituted or unsubstituted alkenylene groups

7. The elastomer film according to claim 6 , wherein the resin precursor satisfies condition 5. Condition 5: the average (meth)acryloyl group equivalent of the resin precursor is 4,000 g / eq or more, 12,000g / eq or less.

8. A method for producing an elastomer film according to any one of claims 1 to 7, comprising: A method for manufacturing an elastomer comprising a step of applying a coating composition for a surface layer containing particles to form a surface layer B. Manufacturing method of mer film.

9. An elastomer film according to any one of claims 1 to 7, and An electrical circuit assembly comprising a conductor circuit formed on a film.

10. An elastomer film according to any one of claims 1 to 7, and A healthcare sensor comprising a conductive circuit formed on a film.

11. An elastomer film according to any one of claims 1 to 7, and A wearable sensor including a conductive circuit formed on a film.

12. A method of processing the elastomer film according to any one of claims 1 to 7 by screen printing. A method for producing an elastomer film processed product, comprising the steps of:

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