Dry film laminate, screen mask, and method for manufacturing screen mask

Abstract

To provide a dry film laminate, a screen mask, and a method for manufacturing the screen mask which are capable of improving handleability.SOLUTION: The dry film laminate according to one embodiment includes a base film member, a cover emulsion layer laminated on one side of the base film, a base emulsion layer laminated on one side of the cover emulsion layer, and a cover film member laminated on one side of the base emulsion layer. The cover emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator and a silicone compound. The base emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin and a photoinitiator.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a dry film laminate, a screen mask, and a method for manufacturing a screen mask. Regarding. [Background technology]

[0002] Screen printing, a printing technique, is a method of forming a desired print on a substrate using a screen mask with a predetermined pattern of openings formed from a resin composition on a mesh substrate. This screen printing method is used for various printing processes, such as printing of wiring, electrodes, and fluorescent materials, and is used in a variety of fields, including electronic components.

[0003] For example, a screen mask includes a mesh with holes that allow the coating material to pass through and a mask film with pattern openings provided in the mesh. The pattern openings formed in the mask film have a shape corresponding to, for example, a printing pattern and a predetermined width. For example, an emulsion that forms the mask film is applied to the mesh, and then the pattern openings are formed by an exposure process. In such a screen mask, one method of forming the mask film on the mesh involves using a coating tool called a bucket to apply a photosensitive resin layer by layer, and repeating the application until a predetermined thickness is achieved. However, this method takes time to adjust the thickness and is prone to uneven thickness. Furthermore, a photomask may be used during exposure, but the photomask placed during exposure or the medium used during printing may adhere to the surface of the mask film, making it difficult to remove, and improved handleability is therefore desired. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-129954 A Summary of the Invention [Problem to be solved by the invention]

[0005] There is a demand for a dry film laminate, a screen mask, and a method for manufacturing a screen mask that can improve the handleability of such a screen mask. [Means for solving the problem]

[0006] A dry film laminate according to one embodiment comprises a base film member, a cover emulsion layer laminated on one side of the base film, a base emulsion layer laminated on one side of the cover emulsion layer, and a cover film member laminated on one side of the base emulsion layer, wherein the cover emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator. The silicone compound content of the cover emulsion layer is higher than that of the base emulsion layer, and the silicone compound content changes continuously at the boundary between the cover emulsion layer and the base emulsion layer. [Effects of the Invention]

[0007] According to the embodiments of the present invention, it is possible to provide a dry film laminate, a screen mask, and a method for manufacturing a screen mask, which can improve the handleability. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view of a screen printing apparatus according to first and second embodiments. [Figure 2] FIG. [Figure 3] FIG. 2 is an explanatory diagram showing the configuration of a DFR laminated member of the screen mask according to the embodiment. [Figure 4] FIG. 2 is an explanatory diagram showing the change in silicone concentration in the depth direction of the DFR laminated member according to the embodiment. [Figure 5] FIG. 2 is an explanatory diagram showing a method for manufacturing a DFR laminated member according to the embodiment. [Figure 6] FIG. 2 is an explanatory diagram showing a method for manufacturing a DFR laminated member according to the embodiment. [Figure 7]3A to 3C are explanatory views showing a method for manufacturing a screen mask according to the embodiment. [Figure 8] 3A to 3C are explanatory views showing a method for manufacturing a screen mask according to the embodiment. [Figure 9] FIG. 2 is an explanatory diagram showing a coating method for a DFR laminated member according to the embodiment. [Figure 10] FIG. 10 is an explanatory diagram showing the relationship between the content of the diazo compound in the mask film and the thickness of the base layer according to the second embodiment. [Figure 11] 10A and 10B are explanatory views of mask films according to Examples 1 and 2 of the second embodiment. [Figure 12] FIG. 2 is an explanatory diagram showing the configuration of a mask film according to the first and second embodiments. [Figure 13] FIG. 10 is an explanatory diagram showing the PVA content and the monomer content in the mask film according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] A screen printing apparatus 10 and a screen mask 20 according to a first embodiment of the present invention will be described below with reference to FIGS. 1 to 5. FIG. 1 is a plan view of the screen printing apparatus 10 according to this embodiment, and FIG. 2 is a cross-sectional view. FIG. 3 is an explanatory diagram showing the configuration of a DFR laminate member 230A, and FIG. 4 is an explanatory diagram showing the change in silicone concentration in the depth direction of a DFR laminate member according to this embodiment. FIGS. 5 and 6 are explanatory diagrams showing a manufacturing method for the DFR laminate member 230A. FIGS. 7 and 8 are explanatory diagrams showing a manufacturing method for a screen mask. Note that in each figure, the configuration is enlarged, reduced, or omitted as appropriate for ease of explanation. In the figures, arrows X, Y, and Z indicate three mutually perpendicular directions. As an example, the Z axis in the figures will be described as being along the thickness direction and depth direction.

[0010] As shown in FIG. 1, the screen printing apparatus 10 includes a screen mask 20, a squeegee 13 configured to be movable while in contact with the back surface (other surface) opposite the printing surface of the screen mask 20, a moving unit that moves the squeegee 13, and a support unit that supports the screen mask 20 facing the printing medium B.

[0011] The screen printing apparatus 10 forms various printing materials in predetermined patterns on the surface of a printing medium. For example, the screen printing apparatus 10 is used in the manufacture of chip components (capacitors, chip resistors, inductors, thermistors, etc.), touch panels, liquid crystal display (LCD) substrate seals, LTCC (Low Temperature Co-fired ceramics) substrates, solar cell electrodes, and other electronic components.

[0012] 1 to 3, the screen mask 20 includes a frame 21, a mesh 22 that is a base material (support material) stretched over the frame 21, and a mask film 23 formed on the mesh 22. In the screen mask 20, the side that faces the surface of the printing medium B supported by the support 12 during printing is called the front side, and the opposite side, to which the coating material Pe is supplied, is called the back side.

[0013] The frame 21 has two pairs of parallel edges and is configured in the shape of a frame with, for example, a rectangular opening of a desired size. The frame 21 supports the outer periphery of the mesh 22, and the mesh 22 is stretched across the opening. In this embodiment, as an example, a frame 21 with an opening dimension of 275 mm in the Y direction and 275 mm in the X direction is used.

[0014] The frame 21 also functions as a frame for holding a predetermined amount of coating material on the rear surface of the mask film 23. The frame 21 and the mesh 22 are joined at the joints with, for example, a synthetic rubber or cyanoacrylate adhesive.

[0015] The mesh 22 is a woven fabric formed by weaving warp threads 22a and weft threads 22b, and has many holes 22c that allow the coating material to pass through. The warp threads 22a and weft threads 22b are wires or fibers made of, for example, metal such as stainless steel or resin such as polyester. The warp threads 22a and weft threads 22b each extend obliquely with respect to, for example, the movement direction of the squeegee 13 (first direction).

[0016] A mask film 23 having a predetermined pattern of openings 24 is formed on the mesh 22. That is, the mesh 22 holds the mask film 23 in the opening portion of the frame 21.

[0017] The mask film 23 has a dry film resist 230 as a dry film laminate having a laminated structure.

[0018] Specifically, the mask film 23 includes a base coat layer 231 applied to the mesh 22 and a dry film resist 230 attached onto the base coat layer 231.

[0019] The base coat layer 231 is made of at least polyvinyl alcohol, a diazonium compound, an ultraviolet curing resin, and a photoinitiator. The base coat layer 231 is a resin layer of a predetermined thickness that adheres closely to the mesh 22 by applying a liquid base coat material 231a to the mesh 22 before applying the dry film resist 230, and then applying and drying the dry film resist 230 before the base coat material 231a dries.

[0020] The dry film resist 230 is a laminate including multiple resin layers, and is formed into a sheet by drying multiple liquid emulsions. The dry film resist 230 has a two-layer structure including a base emulsion layer 233 and a cover emulsion layer 234. As an example, before being attached to the mesh 22, the dry film resist 230 is configured as a DFR (dry film resist) laminated member 230A, which is configured by laminating a base film 232 (base film member), a cover emulsion layer 234, a base emulsion layer 233, and a cover film 235 (cover film member) in this order in the thickness direction. The cover film 235 is peeled off just before the DFR laminated member 230A is attached to the mesh 22, and the base film 232 is peeled off after attachment, thereby providing the two-layer dry film resist 230 on the mesh 22.

[0021] The base film 232 is a film member made of, for example, PET and has a sheet-like shape. For example, the thickness of the base film 232 is 50 μm to 125 μm.

[0022] The cover film 235 is a film member formed into a sheet shape from, for example, PE. The thickness of the cover film 235 is, for example, 10 to 30 μm.

[0023] The base emulsion layer 233 is a resin layer formed from an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator.

[0024] The cover emulsion layer 234 is a resin layer formed from an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curing resin, a photoinitiator, and a silicone compound (silicone).

[0025] Examples of ultraviolet curable resins include the KAYARAD series manufactured by Nippon Kayaku and the UV series manufactured by Mitsubishi Chemical.

[0026] Examples of the photoinitiator include the KAYACURE series manufactured by Nippon Kayaku, the Nikkacure series manufactured by Nippon Chemical Industry Co., Ltd., and the Adeka Arcles series manufactured by ADEKA.

[0027] The silicone compound content (wt %) of the cover emulsion layer 234 is higher than that of the base emulsion layer 233. The silicone compound content of the cover emulsion layer 234 is 0.1 to 10% by weight.

[0028] In the dry film resist 230, the content of the silicone compound changes continuously at the boundary between the base emulsion layer 233 and the cover emulsion layer 234. That is, the content of the silicone compound gradually decreases with increasing depth from the surface of the cover emulsion layer 234, forming a curve with an inflection point.

[0029] Figure 4 is a graph showing the change in silicone concentration along the depth of a DFR laminate, showing the continuous change in silicone concentration at the boundary between the first and second layers. The concentration here refers to the weight of the silicone component relative to the weight of the solid content of the formed film. The vertical axis represents the silicone concentration (%), and the horizontal axis represents the position (μm) in the thickness direction (depth direction) of the dry film resist 230 from the surface on the cover emulsion layer 234 side.

[0030] The thickness (thickness), which is the dimension in the stacking direction of the mask film 23, is set to, for example, 10 μm to 100 μm. For example, in the mask film 23, the thickness of the cover emulsion layer 234 is smaller than the thickness of the base emulsion layer 233. As an example, the thickness of the cover emulsion layer 234 is set to 1% to 40% of the thickness of the base emulsion layer 233. For example, in this embodiment, the thickness of the base emulsion layer 233, which is the main emulsion, is set to be 3 μm to 100 μm, and the thickness of the cover emulsion layer 234, which is the cover coat layer, is set to be 0.5 μm to 5 μm.

[0031] For example, when the thickness of the emulsion layers 233, 234 of the DFR laminated member 230A is minimum, the base film 232 is 75 μm, the base emulsion layer 233 is 3 μm, the cover emulsion layer 234 is 0.5 μm, and the cover film 235 is 25 μm; when the thickness of the emulsion layers 233, 234 is maximum, the base film 232 is 75 μm, the base emulsion layer 233 is 100 μm, the cover emulsion layer 234 is 5 μm, and the cover film 235 is 25 μm.

[0032] The mask film 23 is formed on a mesh 22 that is placed in the opening portion of the frame 21. A predetermined pattern opening 24 for printing is formed in the mask film 23 by exposure.

[0033] Furthermore, the mask film 23 may have steps such as recesses in addition to the pattern openings 24 which are through holes.

[0034] The minimum opening width of the pattern opening 24, i.e., the width dimension of the opening at the narrowest part of the pattern opening 24, is 30 μm or less. Here, as an example, the dimension at the surface of the mask film 23, i.e., the surface facing the printing medium B, is used as the standard.

[0035] The pattern openings 24 are pattern holes having a shape corresponding to the printing pattern, and penetrate the mask film 23 in the thickness direction (depth direction). For example, the pattern openings 24 are formed by combining slits or the like. The pattern openings 24 are configured to be able to hold a coating material. The shape of the printing pattern can be set as appropriate. As an example, in this embodiment, the pattern shape is one in which a plurality of identical pattern units are arranged in a matrix.

[0036] The mask film 23 has a pattern opening 24 where no photosensitive resin is present, and therefore the pattern opening 24 passes through the holes in the mesh 22, forming a printed portion through which the coating material can pass from the back surface to the front surface. The areas of the mask film 23 other than the pattern opening 24 where the holes in the mesh 22 are blocked with photosensitive resin form a non-printed portion that does not allow ink as a coating material to pass through.

[0037] The mesh 22 on which the mask film 23 is formed is configured to be elastically deformable so that it is flexed and deformed by the pressing force of the squeegee 13 arranged on the back surface side, which is the upper side in Fig. 2, and returns to its original shape when the pressing force is released. With the coating material held in the pattern openings 24 of the mask film 23, the mask film 23 comes into contact with and separates from the printing medium B due to the elastic deformation of the mesh 22 and the mask film 23, and the coating material Pe is transferred from the pattern openings 24 to the printing medium B arranged opposite the printing surface side of the mask film 23.

[0038] The squeegee 13 is formed, for example, in the shape of a thin plate from a material such as urethane rubber, silicone rubber, synthetic rubber, metal, or plastic. For example, the squeegee 13 is chamfered to reduce the thickness of the tip. The squeegee 13 is configured to be movable relative to the frame 21. For example, the squeegee 13 has a length that spans the entire length of the area of ​​the mask film 23 in a direction perpendicular to the direction of movement. The tip of the squeegee 13 abuts against the back surface of the screen mask 20 and is pressed against the front surface. When the squeegee 13 moves in the direction indicated by the arrow in FIG. 1, it presses against the entire surface of the mask film 23 and pushes the coating material Pe to the front surface from the pattern openings 24 that have been pre-filled with the coating material.

[0039] Next, a method for manufacturing the screen mask 20 according to this embodiment will be described with reference to Fig. 5 to Fig. 8. Fig. 5 and Fig. 6 are explanatory views showing a method for manufacturing the DFR laminate member 230A. Fig. 7 and Fig. 8 are explanatory views showing a method for manufacturing the screen mask 20.

[0040] First, a description will be given of a method for manufacturing the DFR laminated member 230A. The manufacturing process for the DFR laminated member 230A includes a first coating treatment ST11, a first drying treatment ST12, a first winding treatment ST13, a second coating treatment ST14, a second drying treatment ST15, and a second winding treatment ST16.

[0041] First, prior to ST11, a cover coating agent 234a is prepared as a first emulsion. Specifically, an emulsion containing polyvinyl alcohol, a diazo compound, an ultraviolet-curable monomer, a photopolymerization initiator, and a silicone compound is mixed to a solid content of 15% and a viscosity of 600 mPa·s to prepare the cover coating agent. The liquid emulsion is adjusted so that the silicone compound in the solid content is 0.1 to 10 wt% (preferably 0.3 to 1.0 wt%).

[0042] In ST11, a first coating process is performed to apply the cover coating agent 234a to the base film 232. As the coating method, various methods such as offset gravure, gravure, and slot die can be used, but the gravure method is used as an example.

[0043] 5, while a base film 232, which is a sheet material wound in advance into a roll, is unwound and conveyed along a predetermined conveyance path, a liquid cover coating material 234a contained in a first tank 73 is supplied to the base film 232 by a first application head 74 and rubbed onto the base film 232 to apply it. At this time, the thickness is set so that the thickness after drying is 0.5 to 5.0 μm, preferably 1.0 to 2.0 μm. In ST12, the cover coating agent 234a is dried. Specifically, as shown in Fig. 5, the base film 232 to which the cover coating agent 234a has been applied is sent into a first drying oven 72 and passed through the drying oven 72 for a predetermined time.

[0044] At this time, the drying time can be adjusted by the coating speed and the length of the drying area L1. For example, in a 10 m drying area, the coating speed can be set to 5 m / min, and drying can be performed for about 120 seconds.

[0045] The liquid cover coating agent 234 a is hardened by the drying process in ST 12 , and a cover emulsion layer 234 is formed on the base film 232 .

[0046] Then, in ST13, the laminate 234A in which the cover emulsion layer 234 is formed on the dried base film 232 is wound into a roll.

[0047] Next, steps ST14 to ST16 will be described with reference to FIG.

[0048] First, prior to ST14, a base agent 233a is prepared as the second emulsion to be applied as the second layer. For example, an emulsion containing polyvinyl alcohol, a diazo compound, an ultraviolet-curable monomer, and a photopolymerization initiator is mixed to a solids ratio of 25 to 30% and a viscosity of 1350 mPa·s.

[0049] In ST14, a second coating process is performed to coat the base agent 233a onto the cover emulsion layer 234. Various coating methods can be used, such as gravure, slot die, knife coater, comma coater, and roll coater. As an example, coating is performed using a slot die.

[0050] 6, a laminate of a cover emulsion layer 234 and a base film 232 wound into a roll is unwound and transported along a predetermined transport path, while a liquid base material 233a contained in a second tank 76 is supplied and coated onto the cover emulsion layer 234 by a slot die head 77. At this time, the thickness is set so that the thickness after drying is 3 to 100 μm, preferably 5 to 75 μm.

[0051] Subsequently, in ST15, the base agent 233a is dried. Specifically, as shown in Fig. 6, the base film 232 coated with the base agent 233a is sent into a drying oven 78 and passed through the drying oven 78 for a predetermined time.

[0052] At this time, the drying time can be adjusted by the coating speed and length L2. For example, a 10 m drying area can be set at 2 m / min and dried for about 300 seconds.

[0053] The liquid base agent 233a is hardened by the drying treatment in ST15, and a laminate in which the cover emulsion layer 234 and the base layer 233 are laminated on the base film 232 is formed.

[0054] Next, in ST16, the laminate in which the cover emulsion layer 234 and the base layer 233 are laminated on the base film 232 is overlaid with the cover film 235 and wound into a roll. At this time, the cover film 235 is wound and overlaid facing the base emulsion layer 233 to form the roll. Then, by cutting at predetermined lengths, the DFR laminated member 230A wound into a roll is completed.

[0055] Next, a method for manufacturing the screen mask 20 will be described with reference to FIGS.

[0056] The manufacturing method of the screen mask 20 according to this embodiment includes a base film forming process ST21 for forming a base coat layer on the mesh 22, a pasting process ST22 (DFR pasting process) for pasting a dry film resist 230 onto the base coat layer, a drying process ST23 for drying the dry film resist 230, an exposure process ST24, and a development process ST25.

[0057] First, in ST21, a base coat layer 231 is formed on the mesh 22. Specifically, a bucket is used to apply a base coat material 231a from one end side to the other end side.

[0058] Next, in ST22, the dry film resist 230 is attached to the mesh 22 on which the liquid base coat material 231a has been formed. Specifically, the cover film 235 of the DFR laminated member 230A prepared in advance is peeled off, and the dry film resist 230 is attached so that the exposed base emulsion layer 233 side faces the base coat layer 231a.

[0059] After the attachment, the base film 232 is peeled off, so that the two-layered dry film resist 230 is formed on the mesh 22 .

[0060] Next, in ST23, the substrate is placed in a drying chamber 79 and dried. As a result, the dry film resist 230 and the base coat layer 231 are solidified, and the mask film 23 is formed.

[0061] Next, in ST24, an exposure process is performed. The exposure process is an exposure process in which light is irradiated from the printing surface side, and by exposing with a predetermined pattern, the area corresponding to the exposure pattern is hardened. In the exposure process, a photomask M having a predetermined pattern is placed on top of the dry film resist 230, and an exposure process in which light is irradiated from the printing surface side is performed. Specifically, in the predetermined exposure pattern area, the surface side of the dry film is placed facing an irradiation head such as an ultraviolet lamp or ultraviolet LED, and light is irradiated from the irradiation head to illuminate the surface of the dry film resist 230.

[0062] For example, in ST24, in a predetermined exposure pattern area, the front side of the DFR is placed facing a light source such as an ultraviolet lamp or ultraviolet LED, and light is emitted from the light source to illuminate the surface of the emulsion. For example, the portions of the DFR surface that are exposed by the exposure process become hardened portions Pa that are hardened by ultraviolet light, while the portions that are not exposed become unhardened portions Pb where the emulsion does not harden. These first unhardened portions Pb (unexposed portions) constitute the removal target portions that will be removed in a later process to form openings 24. That is, in this embodiment, in the patterning process, the portions that will become pattern openings 24 are called unhardened portions Pb, and the other regions are called hardened portions Pa. Note that, depending on the emulsion, the opposite may be true: exposed portions are unhardened, unexposed portions are hardened, and exposed portions are hardened portions, with the exposed portions being the portions to be removed by etching.

[0063] Subsequently, in a development process ST25, at least one side of the mask film 23 is washed away with water or a solvent. This process washes away the unhardened portion Pb of the emulsion, and forms an opening 24 that penetrates from the front side to the back side in the thickness direction.

[0064] Next, a method for producing a printed matter by a screen printing method using the screen printing apparatus 10 according to this embodiment will be described with reference to Figures 1 and 2. First, the front side of the screen mask 20 is placed facing the surface of the printing medium B. At this time, the screen mask 20 is positioned using a positioning member such as a positioning pin, for example.

[0065] Then, a highly viscous paste-like coating material Pe is supplied from the rear surface side of the screen mask 20, that is, the surface opposite to the printing medium B, and the coating material is filled into the pattern openings 24.

[0066] Next, a squeegee 13 is placed on the back surface of the screen mask 20, i.e., the surface opposite the printing surface. At this time, for example, the squeegee 13 is placed at a predetermined angle with respect to the front surface of the printing medium B. Then, the squeegee 13 is moved at a predetermined speed while pressing the mesh 22 and the back surface of the mask film 23 toward the printing medium B with a predetermined printing pressure. The squeegee 13 presses against the mask film 23 over the entire back surface of the mask film 23. The pressure of the squeegee 13 causes the pressed portion of the mask film 23 to deform so that it is displaced toward the front surface and comes into contact with the printing medium B. The coating material Pe pressed by the passage of the squeegee 13 is pushed out from the pattern openings 24 toward the printing medium B.

[0067] After the squeegee 13 has passed, the mask film 23 and mesh 22 deform to restore their original shape and separate from the print medium B, and some of the coating material Pe is transferred and remains on the print medium B, thereby printing a pattern on the print medium B and completing the print. At this time, part of the back side of the coating material Pe may remain on the mask film 23 side. The coating material Pe may be made of various materials including, for example, metal materials and resin materials, and a variety of materials are used depending on the type of printing object, such as electronic components or displays.

[0068] The screen mask 20 configured as described above has a cover emulsion layer 234, which is a cover coat layer, formed on a base emulsion layer 233, which is the main emulsion, and the silicone compound contained in the cover emulsion layer 234 has mold-releasability. This makes it easy to peel the photomask M from the screen mask 20 after exposure, and also prevents adhesion to the printing medium B, such as a substrate, during printing, reducing print bleeding.

[0069] Furthermore, since the mask film 23 is formed by applying the dry film resist 230 to the mesh 22, thickness adjustment is easy. Specifically, by applying multiple types of 230 with different thicknesses with high precision in advance, selecting the thickness of the dry film resist 230 according to the specifications of the screen mask, and applying it to the mesh, the thickness is easier to adjust, time is saved, and foreign matter is less likely to be mixed in compared to a method of repeatedly applying it using an application jig (bucket). Furthermore, the effect of the unevenness of the mesh 22 is less noticeable, improving smoothness. Furthermore, the use of the dry film resist 230 improves the linearity of the pattern and makes it less susceptible to damage. Therefore, physical damage to the pattern edges can be prevented when printing is repeated.

[0070] Furthermore, in the above embodiment, the base film 232 and cover film 235 are pre-installed as film components, and the base film 232 is attached to the mesh 22 and dried, so the smoothness of the base film 232 is maintained even after drying. Therefore, smoothness is maintained even after the base film 232 is peeled off, allowing for the production of a screen mask 20 with excellent smoothness. Furthermore, the inclusion of silicone in the cover emulsion layer 234 reduces friction with the printing medium B during screen printing, improving durability during printing. Furthermore, stickiness of the surface can be prevented during pattern exposure using the photomask M, enabling more precise patterning. Furthermore, the inclusion of a silicone compound on the surface provides water- and oil-repellent properties, which has the advantage of being less likely to cause damage when cleaning the screen mask with solvents and allowing it to dry more quickly.

[0071] That is, screen masks are required to have different properties, such as surface stickiness prevention, printing durability, and high resolution. Adding a silicone compound can often be effective in preventing stickiness and achieving high resolution. However, adding silicone can cause a deterioration in resolution, and increasing the amount of silicone and decreasing the amount of photosensitive resin reduces the resolution during pattern formation. Therefore, in the screen mask according to the above embodiment, adding a silicone compound only to the layer that constitutes the surface on the screen printing side ensures stickiness prevention and printing durability, while the base emulsion portion (base emulsion layer 233) is configured without adding a silicone compound, emphasizing high resolution, thereby achieving both of these different properties.

[0072] [Second embodiment] The mask film 23A according to the second embodiment will be described below with reference to FIGS.

[0073] In the mask film 23A according to this embodiment, the cover layer 234 contains a fluorine compound, and the weight ratio of the fluorine compound contained in the cover layer 234 is greater than the weight ratio of the silicone compound. The amount of the diazo compound contained in the cover layer 234 is equal to or greater than the amount of the diazo compound contained in the base layer 233, and the emulsion of the cover layer 234 is made of a material that is softer than the emulsion of the base layer 233. The amount of PVA in the cover layer 234 is greater than the amount of the monomer, while the amount of PVA in the base layer 233 is less than the amount of the monomer. Other configurations are the same as those of the mask film 23, so redundant explanations will be omitted.

[0074] The mask film 23A has a dry film resist 230 as a dry film laminate having a laminated structure.

[0075] Specifically, the mask film 23A includes a base coat layer 231 applied to the mesh 22 and a dry film resist 230 attached onto the base coat layer 231.

[0076] The base coat layer 231 is made of at least polyvinyl alcohol, a diazonium compound, an ultraviolet curing resin, and a photoinitiator. The base coat layer 231 is a resin layer of a predetermined thickness that adheres closely to the mesh 22 by applying a liquid base coat material 231a to the mesh 22 before applying the dry film resist 230, and then applying and drying the dry film resist 230 before the base coat material 231a dries.

[0077] The dry film resist 230 is a laminate including multiple resin layers, and is formed into a sheet by drying multiple liquid emulsions. The dry film resist 230 has a two-layer structure including a base emulsion layer 233 and a cover emulsion layer 234. As an example, before being attached to the mesh 22, the dry film resist 230 is configured as a DFR (dry film resist) laminated member 230A, which is configured by laminating a base film 232 (base film member), a cover emulsion layer 234, a base emulsion layer 233, and a cover film 235 (cover film member) in this order. The cover film 235 is peeled off just before the DFR laminated member 230A is attached to the mesh 22, and the base film 232 is peeled off after attachment, thereby providing the two-layer dry film resist 230 on the mesh 22.

[0078] The base film 232 is a film member made of, for example, PET and has a sheet-like shape. For example, the thickness of the base film 232 is 50 μm to 125 μm.

[0079] The cover film 235 is a film member formed into a sheet shape from, for example, PE. The thickness of the cover film 235 is, for example, 10 to 30 μm.

[0080] The base emulsion layer 233 is a resin layer formed from an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curing resin, and a photoinitiator. For example, the base layer 233 does not contain a fluorine compound.

[0081] The cover emulsion layer 234 is a resin layer formed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound (silicone). The cover emulsion layer 234 also contains a fluorine compound. Here, the content in the cover emulsion layer 234 is, in weight percent, fluorine compound > silicone compound. As an example, the content in the cover emulsion layer 234 is, in weight percent, fluorine compound:silicone compound = 2:1.

[0082] Examples of ultraviolet curable resins include the KAYARAD series manufactured by Nippon Kayaku and the UV series manufactured by Mitsubishi Chemical.

[0083] Examples of the photoinitiator include the KAYACURE series manufactured by Nippon Kayaku, the Nikkacure series manufactured by Nippon Chemical Industry Co., Ltd., and the Adeka Arcles series manufactured by ADEKA.

[0084] The silicone compound content (wt %) of the cover emulsion layer 234 is higher than that of the base emulsion layer 233. The silicone compound content of the cover emulsion layer 234 is 0.1 to 10% by weight.

[0085] In the dry film resist 230, the content of the silicone compound changes continuously at the boundary between the base emulsion layer 233 and the cover emulsion layer 234. That is, the content of the silicone compound gradually decreases with increasing depth from the surface of the cover emulsion layer 234, forming a curve with an inflection point.

[0086] The thickness of the mask film 23A, which is the dimension in the stacking direction, is set to, for example, 10 μm to 100 μm. For example, in the mask film 23A, the thickness of the cover emulsion layer 234 is smaller than the thickness of the base emulsion layer 233. As an example, the thickness of the cover emulsion layer 234 is set to 1% to 40% of the thickness of the base emulsion layer 233. For example, in this embodiment, the thickness of the base emulsion layer 233, which is the main emulsion, is set to be 3 μm to 100 μm, and the thickness of the cover emulsion layer 234, which is the cover coat layer, is set to be 0.5 μm to 5 μm.

[0087] For example, when the thickness of the emulsion layers 233 and 234 of the DFR laminated member 230A is minimum, the base film 232 is 75 μm, the base emulsion layer 233 is 3 μm, the cover emulsion layer 234 is 0.5 μm, and the cover film 235 is 25 μm; when the thickness of the emulsion layers 233 and 234 is maximum, the base film 232 is 75 μm, the base emulsion layer 233 is 100 μm, the cover emulsion layer 234 is 5 μm, and the cover film 235 is 25 μm.

[0088] In this embodiment, the mask film 23A preferably has a diazonium compound content in the cover layer 234≧the diazonium compound content in the base layer 233 in terms of weight percent. FIG. 10 is an explanatory diagram showing the correspondence between the content of the diazonium compound and the thickness of the base layer 233 for two examples 1 and 2, which have different contents of the diazonium compound, in the mask film 23A according to this embodiment.

[0089] In Example 1, the base layer had a thickness of 20 μm and contained 3 wt % of the diazonium compound, while the cover layer had a thickness of 1.5 μm and contained 4 wt % of the diazonium compound. In Example 2, the base layer had a thickness of 40 μm and contained 2 wt % of the diazonium compound, while the cover layer had a thickness of 1.5 μm and contained 4 wt % of the diazonium compound.

[0090] Regarding the relationship between the amount of diazonium compound and the hardening of the emulsion, when the emulsion is thick, the less diazonium compound there is, the easier it is for the innermost emulsion to harden. For example, when the diazonium compound content is high, the diazonium compounds at the innermost part, far from the light source of the exposure, cannot receive light, making the innermost emulsion less likely to harden. On the other hand, when the diazonium compound content is low, the diazonium compounds at the innermost part of the exposure can also receive light, making the entire emulsion more likely to harden.

[0091] FIG. 11 is a graph showing how the diazonium solidifies when the mask film 23A has two layers. In the graph of FIG. 11, the horizontal axis represents the dimension in the thickness direction, and the vertical axis represents the degree of hardening. FIG. 11 is a graph comparing the degrees of hardening for Example 1, in which the diazonium content of the cover layer 234 is 4 wt% and the diazonium content of the base layer 233 is 3 wt%, and Example 2, in which the diazonium content of the cover layer 234 is 4 wt% and the diazonium content of the base layer 233 is 2 wt%. FIG. 11 shows that when the emulsion in the base layer 233 is thick, reducing the amount of diazonium makes it easier for the emulsion to solidify deep inside.

[0092] Regarding the cover layer 234, the relationship between thickness and amount of diazonium compound is preferably 2.5 to 4.5 wt % for a thickness of 1 to 2 μm, and 3.5 to 5.5 wt % for a thickness of 1 μm or less. At 1.5 μm, it is set to 4%.

[0093] FIG. 12 shows the wt % of the liquid emulsion in the cover layer 234 and the base layer 233 in the dried state (DFR state) for Examples 1 and 2.

[0094] Since the cover layer 234 is thinner than the base layer 233, it needs to be firmly solidified, and so the diazonium content is set to 4 wt%. On the other hand, the content of the diazonium compound in the base layer 233 is set to 3 wt% or 2 wt% depending on the thickness, and the content is set to correspond to the thickness. For example, the thickness (μm) x diazonium content (wt%) of the base layer 233 is set to be 120 or less.

[0095] 13, in the mask film 23A, the PVA content in the base layer 233 is less than the monomer content, which means that the base layer 233 contains a large amount of monomer since resolution is important.

[0096] On the other hand, it is preferable that the PVA content is greater than the monomer content in the cover layer 234. For example, since the cover layer 234 forms the surface of the screen printing plate, increasing the PVA content can ensure extensibility and printing durability.

[0097] In this embodiment, the emulsion of the cover layer 234 constituting the mask membrane 23 is made of a material that is softer than the emulsion of the base layer 233. The softness is measured by forming the emulsions of the cover layer and base layer into films separately, exposing them, and then stretching each film using a tensile tester to measure the amount of elongation until it breaks. The film with the larger elongation amount is judged to be softer. The thickness of the film is preferably 30 to 50 μm. The other configurations are the same as those of the mask film 23 in the first embodiment.

[0098] According to this embodiment, the inclusion of a fluorine compound in the cover layer makes it less susceptible to cleaning and facilitates peeling of the photomask from the emulsion surface after exposure. This results in the effect of preventing the paste of the printed material from re-adhering to the plate. Furthermore, fluorine compounds have greater water- and oil-repellent effects than silicone compounds at smaller amounts. Therefore, if the amount of fluorine compound in the entire mask film (DFR) is too large, the repellency becomes too great during DFR production, which is undesirable. Fluorine compounds have excellent durability, and while fluorine compounds repel water and oil, silicone compounds only repel water. Silicone compounds, on the other hand, have excellent flexibility. Therefore, in this embodiment, the advantages of fluorine compounds can be utilized by configuring the cover layer to primarily contain fluorine compounds.

[0099] In addition, adjusting the diazonium compound content according to the thickness can improve exposure performance by allowing light to penetrate deeper. Therefore, if the overall emulsion thickness is thick, reducing the content of the diazonium compound allows light to penetrate deeper, increasing the inner thickness of the emulsion and shortening the exposure time.

[0100] The configuration and arrangement of the pattern openings 24 are not limited to those described above, and can be changed as appropriate depending on the print shape, and the height can also be set. For example, a configuration with a step may be used. Two separate layers may be attached to form the step.

[0101] The pattern openings 24 may have different depth dimensions depending on the region. For example, the pattern openings 24 may have multiple independent openings, or may be continuous openings with different thicknesses depending on the region. For example, in continuous line-shaped pattern openings 24, the coating thickness may be increased or decreased in some regions, or multiple pattern openings 24 with different coating thicknesses may be formed. For example, the pattern openings 24 can be set to various shapes, such as slit-shaped line patterns, or angular or circular openings. Also, while an example has been shown in which the unexposed regions are removed by etching, the opposite may also be true. Exposure and materials may be used such that the exposed regions form openings.

[0102] In addition, in each of the above embodiments, a so-called single mesh is exemplified as the mesh 22, but this is not limiting. For example, the mesh 22 may have a so-called combination mesh structure that includes a main mesh 26 and a support mesh 27 provided on the outer periphery of the main mesh 26. Furthermore, the mask film 23 may be formed only on a portion of the central part of the mesh 22, or may be formed over the entire area.

[0103] Furthermore, the shape of the pattern openings 24 of the mask film 23 is not limited to that in the above embodiment. For example, the pattern openings 24 may be openings whose cross-sectional shape changes in the depth direction, and the depth of the pattern openings 24 can also be set. Alternatively, it is also possible to form protrusions that are continuous with the openings 24.

[0104] Furthermore, the features of the different embodiments described above may be combined.

[0105] The present invention is not limited to the above-described embodiments, and in the implementation stage, the components can be modified and embodied without departing from the spirit of the invention.

[0106] In addition, the components illustrated in the above embodiments may be deleted, or the shape, structure, material, etc. of each component may be changed. Various inventions can be created by appropriately combining the multiple components disclosed in the above embodiments. By adjusting the dimensional ratio of the material, the difference in the amount of stretch between the length and width can be reduced, thereby improving printing accuracy. The following is a description equivalent to the invention described in the claims of the original application. (1) a base film member; a cover emulsion layer laminated on one side of the base film member; a base emulsion layer laminated on one side of the cover emulsion layer; a cover film member laminated on one side of the base emulsion layer; Equipped with the cover emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound; The dry film laminate comprises a base emulsion layer comprising an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator. (2) The dry film laminate according to (1), wherein the silicone compound content of the cover emulsion layer is higher than the silicone compound content of the base emulsion layer. (3) The dry film laminate according to (2), wherein the silicone compound content of the cover emulsion layer is 0.1 to 10% by weight. (4) The dry film laminate according to (2), wherein the content of the silicone compound changes continuously at the boundary between the cover emulsion layer and the base emulsion layer. (5) The dry film laminate according to (1), wherein the cover emulsion layer contains a fluorine compound. (6) The dry film laminate according to (5), wherein the weight ratio of the silicone compound in the cover emulsion layer is smaller than the weight ratio of the fluorine compound. (7) The dry film laminate according to (1), wherein the amount of the diazonium compound in the cover emulsion layer is greater than the amount of the diazonium compound in the base emulsion layer. (8) a support material having holes that allow the coating material to pass through; a mask film provided on the support material and having a pattern opening formed therein that can hold a coating material; the mask film is attached to the support material and is made of a dry film resist including a base emulsion layer and a cover emulsion layer laminated on one side of the base emulsion layer; A screen mask, wherein the cover emulsion layer is an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer is an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator. (9) a DFR lamination process for laminating a surface of a dry film resist on the base emulsion layer side, the surface of the dry film resist comprising a base emulsion layer and a cover emulsion layer laminated on the base emulsion layer, the cover emulsion layer being an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer being an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator, to a support material having holes that allow a coating material to pass through; an exposure treatment in which the dry film resist is exposed to light from the cover emulsion layer side in a predetermined exposure pattern; Equipped with A method for manufacturing a screen mask, comprising forming an opening in the dry film resist according to the pattern of the exposure. (10) The method for manufacturing a screen mask described in (9), wherein in the DFR attachment process, the cover film of a dry film resist comprising a base film, a cover emulsion layer laminated on one side of the base film, a base emulsion layer laminated on one side of the cover emulsion layer, and a cover film laminated on one side of the base emulsion layer is peeled off, the surface of the base emulsion layer is attached to the support material, and then the base film is peeled off. (11) (9) The method for manufacturing a screen mask according to (9), wherein in the exposure treatment, a photomask is placed on one side of the surface, and light is irradiated from the one side. [Explanation of symbols]

[0107] 10...screen printing device, 13...squeegee, 20...screen mask, 21...frame, 22...mesh, 22a...warp thread, 22b...weft thread, 22c...hole portion, 23...mask film, 230...dry film resist, 230A...DFR laminated member, 232...base film (base film member), 233...base emulsion layer, 234...cover emulsion layer, 235...cover film (cover film member), 24...pattern opening.

Claims

1. a base film member; a cover emulsion layer laminated on one side of the base film member; a base emulsion layer laminated on one side of the cover emulsion layer; a cover film member laminated on one side of the base emulsion layer; Equipped with the cover emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound; the base emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator; the silicone compound content of the cover emulsion layer is higher than the silicone compound content of the base emulsion layer; A dry film laminate in which the content of the silicone compound changes continuously at the boundary between the cover emulsion layer and the base emulsion layer.

2. 2. The dry film laminate according to claim 1, wherein the silicone compound content of the cover emulsion layer is 0.1 to 10% by weight.

3. The dry film laminate according to claim 1 , wherein the cover emulsion layer comprises a fluorine compound.

4. a base film member; a cover emulsion layer laminated on one side of the base film member; a base emulsion layer laminated on one side of the cover emulsion layer; a cover film member laminated on one side of the base emulsion layer; Equipped with the cover emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound; The base emulsion layer is composed of an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator. the cover emulsion layer contains a fluorine compound, A dry film laminate in which the weight ratio of the silicone compound in the cover emulsion layer is smaller than the weight ratio of the fluorine compound.

5. 2. The dry film laminate according to claim 1, wherein the amount of the diazonium compound in the cover emulsion layer is greater than the amount of the diazonium compound in the base emulsion layer.

6. a support material having holes that allow the coating material to pass through; a mask film provided on the support material and having a pattern opening formed therein that can hold a coating material; the mask film is attached to the support material and is made of a dry film resist including a base emulsion layer and a cover emulsion layer laminated on one side of the base emulsion layer; the cover emulsion layer is an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer is an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator, the silicone compound content of the cover emulsion layer is higher than the silicone compound content of the base emulsion layer; A screen mask in which the content of the silicone compound changes continuously at the boundary between the cover emulsion layer and the base emulsion layer.

7. a support material having holes that allow the coating material to pass through; a mask film provided on the support material and having a pattern opening formed therein that can hold a coating material; the mask film is attached to the support material and is made of a dry film resist including a base emulsion layer and a cover emulsion layer laminated on one side of the base emulsion layer; the cover emulsion layer is an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer is an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator, the cover emulsion layer contains a fluorine compound, A screen mask in which the weight ratio of the silicone compound in the cover emulsion layer is less than the weight ratio of the fluorine compound.

8. a DFR pasting process for pasting a surface of a dry film resist on the base emulsion layer side, the surface of the dry film resist comprising a base emulsion layer and a cover emulsion layer laminated on the base emulsion layer, the cover emulsion layer being an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer being an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator, to a support material having holes that allow a coating material to pass through; an exposure treatment in which the dry film resist is exposed to light from the cover emulsion layer side in a predetermined exposure pattern; Equipped with forming an opening in the dry film resist according to the pattern of the exposure; the silicone compound content of the cover emulsion layer is higher than the silicone compound content of the base emulsion layer; the content of the silicone compound changes continuously at the boundary between the cover emulsion layer and the base emulsion layer; A method for manufacturing a screen mask.

9. a DFR pasting process for pasting a surface of a dry film resist on the base emulsion layer side, the surface of the dry film resist comprising a base emulsion layer and a cover emulsion layer laminated on the base emulsion layer, the cover emulsion layer being an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, a photoinitiator, and a silicone compound, and the base emulsion layer being an emulsion containing at least polyvinyl alcohol, a diazonium compound, an ultraviolet curable resin, and a photoinitiator, to a support material having holes that allow a coating material to pass through; an exposure treatment in which the dry film resist is exposed to light from the cover emulsion layer side in a predetermined exposure pattern; Equipped with the cover emulsion layer contains a fluorine compound, A method for producing a screen mask, wherein the weight ratio of the silicone compound in the cover emulsion layer is less than the weight ratio of the fluorine compound.

10. The method for manufacturing a screen mask described in claim 8 or 9, wherein in the DFR attachment process, the cover film of a dry film resist comprising a base film, a cover emulsion layer laminated on one side of the base film, a base emulsion layer laminated on one side of the cover emulsion layer, and a cover film laminated on one side of the base emulsion layer is peeled off, the surface of the base emulsion layer is attached to the support material, and then the base film is peeled off.

11. 10. The method for manufacturing a screen mask according to claim 8, wherein in the exposure treatment, a photomask is placed on one surface, and light is irradiated from the one side.

Images