Mounting Equipment

Abstract

To provide a mounting device for achieving highly accurate mounting by acquiring position information of a substrate recognition mark even in the case that a chip component covers the substrate recognition mark in face-down mounting.SOLUTION: A mounting device is provided, which includes an attachment tool for holding an opposite surface of a surface having a chip recognition mark of a chip component, a substrate stage for holding a substrate, a light source for reflection for reflecting for irradiating light including a wavelength transmitting the chip component toward the surface from the attachment tool side to the substrate, and recognition means for recognizing reflection light of the light irradiated by the light source for reflection. The recognition means acquires an image by the light that transmits the chip component and is reflected on the substrate, and acquires position information of the substrate recognition mark.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus for mounting chip components on a substrate, and more particularly to a mounting apparatus for mounting chip components with the electrode surface of the chip component facing the electrode surface of the substrate. [Background technology]

[0002] 2. Description of the Related Art One form of mounting chip components such as semiconductor chips on a substrate such as a wiring board is face-down mounting, in which the electrode surface of the chip component faces the electrode surface of the substrate.

[0003] FIG. 13 shows an example of a substrate S for face-down mounting. Chip components are attached to each of the mounting locations SC on the substrate S, with their electrode surfaces facing each other. If the chip components are not accurately positioned at each mounting location SC on the substrate S, the electrical connection between the substrate S and the chip components will be incomplete, resulting in poor quality semiconductor devices. For this reason, as shown in FIG. 13, each mounting location SC on the substrate S has a first substrate recognition mark AS1 and a second substrate recognition mark AS2 on the electrode side as substrate recognition marks AS. Meanwhile, a first substrate recognition mark AC1 and a second substrate recognition mark AC2 are also provided on the electrode side of the chip components. As shown in FIG. 14, the relative position of the chip component C (in the in-plane direction of the substrate S) with respect to the mounting locations SC on the substrate S can be determined from the positional relationship between the first substrate recognition mark AS1 and the first substrate recognition mark AC1, and the positional relationship between the second substrate recognition mark AS2 and the second substrate recognition mark AC2. Correcting this determination improves positional accuracy.

[0004] Conventionally, when determining the relative position of the chip recognition mark AC and the substrate recognition mark AS, a dual-view camera 500 with an upper and lower field of view, as shown in FIG. 15, is used, and the upper field of view 50U of the dual-view camera 500 captures the first chip recognition mark AC1 (or the second chip recognition mark AC2) and the lower field of view 50D captures the first substrate recognition mark AS1 (or the second substrate recognition mark AS2).

[0005] By using this two-view camera 500 for upper and lower fields of view to determine and correct the relative position (in the in-plane direction of the substrate S) of the chip component C with respect to the mounting location SC of the substrate S, mounting with a maximum error of about several μm is possible.

[0006] A maximum error of several μm was sufficient in face-down mounting, also known as flip-chip mounting, when the electrode pitch was 100 μm or more, using solder bumps as the electrodes of chip component C. However, there is no room for error when the electrode pitch is just over 50 μm, using Cu pillar bumps, and in the current situation where high-density mounting is progressing and the electrode pitch is becoming narrower, there are some applications where this precision is insufficient.

[0007] Therefore, we are trying to further improve accuracy by using two cameras with upper and lower fields of view. However, even if the chip component C is aligned with the mounting location SC on the board S with an error of less than 1 μm (in the in-plane direction of the board S) in the state shown in Figure 15, the maximum error during the mounting stage can exceed 1 μm. This is due to the slight tilt in the direction of descent of the chip C as it descends toward the board S from the state shown in Figure 15. We are trying to solve this problem by increasing the processing accuracy and rigidity of each part of the mounting device so that the descent direction is perpendicular to the surface holding the board S, but this affects the cost of the device. Furthermore, with two cameras with upper and lower fields of view, it is difficult to align the optical axes of the upper and lower cameras, which causes relative misalignment, and therefore, the relative misalignment must be corrected.

[0008] Therefore, in order to improve the accuracy of face-down mounting without significantly affecting the cost of the equipment, the inventors of the present application have discovered a method that combines the alignment method used in face-up mounting and enables alignment to be performed while the chip component is as close as possible to the board (Patent Document 1 ).

[0009] In this method, as shown in Fig. 16, a tool recognition mark is first attached to an attachment tool 42 that holds a chip component C, and alignment is performed via this tool recognition means. Specifically, the chip position recognition means 8 captures images of the first chip recognition mark AC1 and the first tool recognition mark AT1 within the same field of view in the state shown in Fig. 16(a) to obtain relative position information, and similarly obtains relative position information of the second chip recognition mark AC2 and the second tool recognition mark AT2 in the state shown in Fig. 16(b). Then, as shown in Fig. 17(a), the chip component C is brought close to the substrate S, and the positional relationship between the first tool recognition mark AT1 and the first substrate recognition mark AS1 is determined. Then, the positional relationship between the second tool recognition mark AT2 and the second substrate recognition mark AS2 is determined as shown in Fig. 17(b), and the relative alignment of the chip component C and the substrate S is then performed (Patent Document 1). This method uses images captured by a single camera, so there is no problem with relative misalignment, as occurs with cameras with two fields of view, one above and one below. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Patent application No. 2022-007513 [Patent Document 2] Japanese Patent Application Publication No. 2018-093140 Summary of the Invention [Problem to be solved by the invention]

[0011] In recent years, a new configuration has emerged in which the mounting location SC is arranged on the board S with a small gap, as shown in Fig. 18. In this configuration, unlike the configuration in which the board recognition mark AS is located outside the mounting location SC as shown in Fig. 13, the board recognition mark AS is provided within the mounting location SC as shown in Fig. 19, and the board recognition mark AS is covered by the chip component C during the mounting stage.

[0012] For this reason, when performing alignment in the state shown in FIG. 17, the board recognition mark AS cannot be observed.

[0013] Therefore, we tried to use light (for example, near-infrared light) with a wavelength that transmits through silicon, which is used in wafer bonding, etc. Figure 20 shows an example of an apparatus configuration used for alignment when bonding silicon wafers together, and by observing near-infrared light emitted from a transmission light source 702 with a recognition means 502 (sensitive to near-infrared light), the recognition mark AWB on the lower wafer shown in Figure 21(a) and the recognition mark AWT on the upper wafer shown in Figure 21(b) can be observed as shown in Figure 21(c) (for example, Patent Document 2).

[0014] However, as shown in Figure 22, when a chip component C was mounted on a substrate S using an apparatus configuration similar to that of Figure 20, it was not possible to observe using transmitted light in the same way as with silicon wafer bonding. This is because the internal wiring CW present in the substrate S blocks near-infrared light, making it impossible to identify the substrate recognition mark AS (and chip recognition mark AC). Also, because a heater is often built into the substrate stage that holds the substrate, it is not possible to install a light source below the heater.

[0015] The present invention has been made in consideration of the above problems, and provides a mounting device that can acquire position information of a board recognition mark to achieve high-precision mounting even when a chip component covers the board recognition mark in face-down mounting, in which electrode surfaces are mounted opposite each other. [Means for solving the problem]

[0016] In order to solve the above problem, the invention described in claim 1 is: A mounting apparatus that mounts a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark and a surface having the substrate recognition mark facing each other, in a state in which the substrate recognition mark is covered by the chip component, an attachment tool that holds a surface of the chip component opposite to a surface having the chip recognition mark; a substrate stage for holding the substrate; a reflection light source that irradiates light including a wavelength that is transmitted through the chip component from the attachment tool side toward a surface of the substrate, and recognition means that recognizes reflected light of the light irradiated by the reflection light source, The recognition means is a mounting device that acquires an image of light that has passed through the chip component and is reflected by the board, and acquires position information of the board recognition mark.

[0017] The invention described in claim 2 is the mounting device described in claim 1, the recognition means acquires an image of light emitted from the reflection light source, transmitted through the chip component, and reflected by a surface of the chip component having the chip recognition mark, thereby acquiring position information of the chip recognition mark; The mounting device aligns the substrate and the chip using the position information of the substrate recognition mark and the position information of the chip recognition mark.

[0018] The invention described in claim 3 is the mounting device described in claim 1, a transmission light source that irradiates light including a wavelength that is transmitted through the chip component from below the chip component toward the chip component, the recognition means acquires an image of light of a wavelength that is irradiated from the transmission light source and passes through the chip component, and acquires position information of the chip recognition mark; The mounting device aligns the substrate and the chip using the position information of the substrate recognition mark and the position information of the chip recognition mark.

[0019] The invention described in claim 4 is the mounting device described in claim 3, After the recognition means acquires the position information of the chip recognition mark, the attachment tool is moved toward the substrate stage, and the chip component is brought close to the substrate so that the substrate recognition mark is within the depth of field of the recognition means, and the mounting device acquires the position information of the substrate recognition mark.

[0020] The invention described in claim 5 is the mounting device described in claim 4, The mounting apparatus maintains the relative position of the recognition means with respect to the attachment tool from the time when the position information of the chip recognition mark is acquired until the time when the position information of the board recognition mark is acquired.

[0021] The invention described in claim 6 is the mounting device described in claim 1, the attachment tool has a tool recognition mark, and further includes a transmission light source that irradiates the chip component from below with light including a wavelength that is transmitted through the chip component, toward the chip component; The recognition means acquires position information of the chip recognition mark and position information of the tool recognition mark from an image formed by light of a wavelength that is irradiated from the transmissive light source and passes through the chip component and the attachment tool, and then the recognition means acquires position information of the substrate recognition mark and position information of the tool recognition mark from an image formed by light of a wavelength that is irradiated from the reflective light source and passes through the chip component and the attachment tool after being reflected by the substrate, and uses the relative position information with the tool recognition mark to determine the positional relationship between the substrate recognition mark and the chip recognition mark, thereby aligning the substrate and the chip.

[0022] The invention described in claim 7 is the mounting device described in claim 6, This is an implementation device that acquires position information of the substrate recognition mark and the tool recognition mark while bringing the chip component close to the substrate so that both the substrate recognition mark and the tool recognition mark are within the depth of field of the recognition means. [Effects of the Invention]

[0023] The present invention provides a mounting device that can acquire position information of a board recognition mark and achieve high-precision mounting even when the board recognition mark is covered by a chip component in face-down mounting, where electrode surfaces are mounted opposite each other. [Brief explanation of the drawings]

[0024] [Figure 1]1 is a schematic diagram of a mounting apparatus according to an embodiment of the present invention. [Figure 2] 1A and 1B are a front view and a side view, respectively, illustrating an optical configuration according to an embodiment of the present invention. [Figure 3] FIG. 2 is a block diagram showing a control system according to an embodiment of the present invention. [Figure 4] 1A and 1B are diagrams showing a state in which the recognition means of a mounting device according to an embodiment of the present invention acquires position information of a first board recognition mark, and a state in which the recognition means acquires position information of a second board recognition mark. [Figure 5] FIG. 1 is a schematic diagram of a first modified example of a mounting device according to an embodiment of the present invention. [Figure 6] 1A and 1B are diagrams showing a state in which the recognition means of a mounting device according to an embodiment of the present invention, in which (a) the recognition means is acquiring position information of a first chip recognition mark, and (b) the recognition means is acquiring position information of a second chip recognition mark; [Figure 7] FIG. 10 is a schematic diagram of a second modified example of the mounting device according to the embodiment of the present invention. [Figure 8] 10A and 10B are diagrams showing a state in which the recognition means of a mounting device according to a second variant embodiment of the present invention acquires (a) position information of the chip recognition first mark and position information of the tool recognition first mark, and (b) position information of the chip recognition second mark and position information of the tool recognition second mark. [Figure 9] FIG. 10 is a diagram showing a state in which the recognition means of a mounting device according to a second variant embodiment of the present invention (a) acquires position information of the substrate recognition first mark and position information of the tool recognition first mark, and (b) acquires position information of the substrate recognition second mark and position information of the tool recognition second mark. [Figure 10] This figure shows (a) the state in which position information of the chip recognition mark is acquired, and (b) the state in which position information of the substrate recognition mark is acquired, in an apparatus configuration in which an image capture unit is arranged for each combination of substrate recognition mark and chip recognition mark, which is variant example 3 of an embodiment of the present invention. [Figure 11]This figure shows a device configuration having an image capture unit with a field of view that can capture multiple combinations of substrate recognition marks and chip recognition marks, which is variant example 4 of an embodiment of the present invention, in which (a) the state in which position information of the chip recognition mark is being acquired and (b) the state in which position information of the substrate recognition mark is being acquired. [Figure 12] 10A and 10B are diagrams showing an apparatus configuration in which a mounting head, which is a variant 5 of an embodiment of the present invention, picks up chips from a chip supply unit, (a) showing a state in which a chip component is being picked up, (b) showing a state in which position information of a chip recognition mark is being acquired, and (c) showing a state in which position information of a board recognition mark is being acquired. [Figure 13] 1A and 1B are diagrams illustrating mounting locations for mounting individual chip components and individual board recognition marks on a board on which a plurality of chip components are mounted. [Figure 14] 10 is a diagram showing a state in which the chip recognition mark and the board recognition mark face each other when the chip component is mounted on the board. FIG. [Figure 15] 10A and 10B are diagrams illustrating a conventional example in which a chip recognition mark of a chip component and a board recognition mark of a board are opposed to each other to perform alignment. [Figure 16] 1A shows a state in which a chip position recognition means acquires position information of a first chip recognition mark and a first tool recognition mark in a conventional example of high-precision alignment, and FIG. 1B shows a state in which a chip position recognition means acquires position information of a second chip recognition mark and a second tool recognition mark in a conventional example of high-precision alignment. [Figure 17] 1A shows a state in which the recognition means acquires position information of the substrate recognition first mark and the tool recognition first mark in a conventional example of high-precision alignment, and FIG. 1B shows a state in which the recognition means acquires position information of the substrate recognition second mark and the tool recognition second mark. [Figure 18] 10A and 10B are diagrams illustrating mounting locations for mounting individual chip components and individual board recognition marks on a board on which multiple chip components are mounted with small gaps between them. [Figure 19] 10A and 10B are diagrams showing a state in which a chip recognition mark and a board recognition mark face each other when multiple chip components are mounted with a small gap between them. [Figure 20] 1A and 1B are diagrams illustrating alignment using near-infrared light transmission used in wafer bonding. [Figure 21] 1A and 1B are diagrams showing examples of the shape of the recognition mark on the lower wafer, (b) examples of the shape of the recognition mark on the upper wafer, and (c) a transmission image of the upper and lower recognition marks after alignment is completed. [Figure 22] 10A and 10B are diagrams for explaining problems that arise when applying alignment using near-infrared light transmission to mounting chip components on a substrate with internal wiring. DETAILED DESCRIPTION OF THE INVENTION

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a schematic diagram of a mounting apparatus 1 according to an embodiment of the present invention.

[0026] Mounting devices are used to mount chip components on substrates such as wiring boards, and the mounting device 1 in Figure 1 is configured to perform face-down mounting, in which the electrode surface of the chip component is mounted facing the electrode surface of the substrate.

[0027] The mounting device 1 comprises a substrate stage 2, lifting means 3, mounting head 4, recognition means 5, chip transport means 6, and light source 7 (reflective light source 71, and transmissive light source 72 as required).

[0028] 1, the substrate stage 2 is composed of a stage movement control means 20 and an adsorption table 23. The adsorption table 23 adsorbs and holds a substrate placed on its surface, and the adsorption table 23 can be moved in an in-plane direction of the substrate surface by the stage movement control means 20 while holding the substrate.

[0029] The stage movement control means 20 is composed of a Y-direction stage movement control means 22 that can linearly move a suction table 23 in the Y direction, and an X-direction stage movement control means 21 that can linearly move the Y-direction stage movement control means 22 in the X direction and is provided on a base 200. The Y-direction movement control means 22 has the suction table 23 mounted on a movable part that is arranged on a slide rail, and the movement and position of the movable part are controlled by a Y-direction servo 221. Furthermore, the X-direction movement control means 21 has the Y-direction movement control means 22 mounted on a movable part that is arranged on a slide rail, and the movement and position of the movable part are controlled by an X-direction servo 211.

[0030] The lifting means 3 is fixed to a gate-shaped frame (not shown), and its vertical drive shaft is set perpendicular to the suction table 23, with the mounting head 4 connected to the vertical drive shaft. The lifting means 3 drives the mounting head 4 up and down, and also has the function of applying a pressure force according to a setting. Furthermore, in the mounting device 1, the lifting means 3 is supported from two directions (by a gate-shaped frame (not shown)) and is connected linearly to the mounting head 4, so that lateral force is unlikely to be applied to the mounting head 4 when pressure is applied.

[0031] The mounting head 4 holds the chip component C and presses it parallel to the substrate (held on the suction table 23 of the substrate stage 2). The mounting head 4 is composed of a head main body 40, a heater unit 41, an attachment tool 42, and a tool position control means 43. The head main body 40 is connected to the lifting means 3 via the tool position control means 43, and the heater unit 41 is fixedly disposed on its underside. The heater unit 41 has a heat generating function and heats the chip component C via the attachment tool 42. The heater unit 41 also has a function of suction-holding the attachment tool 42 using a reduced-pressure flow path. The attachment tool 42 suctions and holds the chip component C and is replaced depending on the shape of the chip component C. The tool position control means 43 fine-tunes the position of the head main body 40 in a vertical plane relative to the up / down drive shaft of the lifting means 3, thereby adjusting the positions (in the XY plane in the figure) of the attachment tool 42 and the chip component C held by the attachment tool 42.

[0032] The tool position control means 43 includes, as its constituent elements, an X-direction tool position control means 431, a Y-direction tool position control means 432, and a tool rotation control means 433. In the embodiment shown in Fig. 1, the tool rotation control means 433 adjusts the rotation direction of the head main body 40, the Y-direction tool position control means 432 adjusts the Y-direction position of the tool rotation control means 433, and the X-direction tool position control means 431 adjusts the X-direction position of the Y-direction position control means, but this is not limiting, and the tool rotation control means 433 may be disposed above the X-direction tool position control means 431 (on the lifting means 3 side), and the point is that it is sufficient if the X-direction position, Y-direction position, and rotation angle of the attachment tool 42 can be adjusted.

[0033] 2 shows mainly the periphery of the head main body 40 (front view in FIG. 2(a) and side view in FIG. 2(b)), and in the face-down mounting of this embodiment, chip recognition marks AC (first chip recognition mark AC1 and second chip recognition mark AC2) are provided at diagonal positions on the electrode surface of the chip component C, and board recognition marks AS (first board recognition mark AS1 and second board recognition mark AS2) are provided at guide positions diagonal to the chip component mounting location on the electrode surface of the board S. Here, it is desirable that the chip recognition marks AC and board recognition marks AS have the property of reflecting light of a wavelength that passes through the chip component C (which is made of silicon), which will be described later.

[0034] The mounting device 1 is configured so that the directions of the board recognition marks AS and the chip recognition marks AC can be observed through the mounting head 4. The attachment tool 42 is either transparent to light with wavelengths that pass through the chip components or has a through-hole aligned with the position of the board recognition marks AS. The heater unit 41 must also be made of a material that allows the board recognition marks AS to be observed or have an opening. In this embodiment, through-hole 41H is provided, as shown in FIG. 2. Furthermore, to obtain high-resolution position information of the board recognition marks AS and / or the chip recognition marks AC, it is desirable to capture images at multiple locations (for each combination of board recognition marks AS and chip recognition marks AC). This requires space for the image capture unit 50 of the recognition means 5 to move. In this embodiment, a head space 40V is provided in the mounting head 4, as shown in FIG. 2. The head main body 40 is configured with side plates connected above the heater 41 and a top plate connecting the side plates.

[0035] The recognition means 5 is sensitive to light of a wavelength that passes through the chip component C, and is able to capture images of the board recognition mark AS and the chip recognition mark AC, and obtain position information for the board recognition mark AS and the chip recognition mark from the placement position information of the recognition means 5 and the coordinates within the field of view captured by the recognition means 5. In this embodiment, the board position recognition means 5 is composed of an image capture unit 50, an optical path 52, and an imaging means 53 connected to the optical path 52. Here, the imaging means 53 is sensitive to light of a wavelength that passes through the chip component C.

[0036] The image capturing unit 50 is disposed opposite to the target to be recognized, the image of which is to be captured by the imaging means 53, and brings the target into its field of view.

[0037] The recognition means 5 is configured so that the image capture unit 50 can be moved in the in-plane direction of the substrate S (and chip components C) within the head space 40V by a drive mechanism (not shown). Furthermore, it is desirable that the substrate S can also be moved in the vertical direction (Z direction) so that the focal position can be adjusted.

[0038] The mounting head 4 is moved by the lifting means 3 in a direction perpendicular to the substrate S, but this operation can be performed independently of the operation of the recognition means 5. For this reason, it is necessary to design the head space 40V to have dimensions such that even if the mounting head 4 moves vertically, the recognition means 5 that has entered the head space 40V will not interfere.

[0039] In addition, the movable range of the image capture unit 50 of the recognition means 5 is not limited to within the head space 40V, but it is also possible to move outside the head space 40V and on the substrate S to obtain position information of the substrate recognition mark AS.

[0040] The chip transport means 6 is composed of a transport rail 60 and a chip slider 61, and the chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it below the attachment tool 42 to transport it.

[0041] Here, a chip supply unit (not shown) places the chip component C at a predetermined position on the chip slider 61. If necessary, the placement position of the chip component C placed on the chip slider 61 may be recognized by a recognition mechanism (not shown). The chip transport means 6 may also have a position adjustment means for adjusting the position of the chip component C mounted on the chip slider 61 in the in-plane direction (X and Y directions). In this way, by controlling the positions of the chip slider 61 and the chip component C to be placed on the chip slider 61, it is possible to transfer the chip component C within a predetermined range of the attachment tool 42. After the attachment tool 42 holds the chip component C, the chip slider 61 releases its hold on the chip component C and moves to a retracted position.

[0042] The light source 7 requires a reflection light source 71. The reflection light source 71 irradiates light from above the attachment tool 42 toward the substrate S, and the light emitted by the reflection light source contains a wavelength that is transmitted through the chip components C. Here, the wavelength that is transmitted through the chip components C is preferably in the near-infrared region, but is not limited to this.

[0043] The control unit 10 shown in Figure 3 essentially consists of a CPU and a storage device as its main components, with interfaces between the devices as needed. The control unit 10 also has a built-in program, which allows it to perform calculations using acquired data and output the results of the calculations. It is also desirable for the control unit 10 to have the ability to record acquired data and calculation results and use them as data for new calculations.

[0044] The control unit 10 is connected to the substrate stage 2, and controls the operation of the X-direction stage movement control means 21 and the Y-direction stage movement control means 22 to control the in-plane movement of the suction table 23. The control unit 10 also controls the suction table 23 to control the suction holding and release of the substrate S.

[0045] The control unit 10 is connected to the lifting means 3 and has the function of controlling the position of the mounting head 4 in the vertical direction (Z direction) and also controlling the pressure applied when the chip component C is pressure-bonded to the substrate S.

[0046] The control unit 10 is connected to the mounting head 4 and has the function of controlling the suction, holding and release of the chip component C by the attachment tool 42, the heating temperature of the heater unit 41, and the position of the head main body 40 (and the heater unit 41 and attachment tool 42) in the XY plane using a tool position control means 43.

[0047] The control unit 10 is connected to the recognition means 5 and has the function of controlling the horizontal (in the XY plane) and vertical (Z direction) positions of the image capture unit 50, as well as controlling the imaging means 53 to acquire image data. Furthermore, the control unit 10 has an image processing function, and has the function of calculating the relative positional relationship between the board recognition mark AS and the tool recognition mark AT from the position information of the image capture unit 50 and the image acquired by the imaging means 53, and the position of the board recognition mark AS and / or the tool recognition mark AT in combination with the position information of the image capture unit 50. The control unit 10 is connected to the chip transport means 6 and has the function of controlling the position of a chip slider 61 that moves along a transport rail 60 .

[0048] The control unit 10 is connected to the reflection light source 71 and has a function of controlling whether or not light is irradiated and the irradiation power.

[0049] Below, we will explain the process by which the mounting device 1 aligns and mounts chip components at the mounting locations SC of the substrate S, but prior to this, the substrate S has undergone a substrate holding process and is held on the substrate stage 2 of the mounting device 1. Here, it is desirable that information about the position of the substrate S relative to the suction table 23 of the substrate stage 2 is obtained by image recognition means or the like and stored in the control unit 10.

[0050] The chip components C are transported by the chip transport means 6 and undergo a chip holding process in which they are held by the attachment tool 42. Here, the chip components C are transferred from a chip supply unit (not shown) to the chip slider 61, and when transferred from the chip slider 61 to the attachment tool 42, a predetermined positional accuracy is ensured, and the chip components C are held by the attachment tool 42 with the predetermined positional accuracy.

[0051] FIG. 4 is a diagram illustrating the board position acquisition process for acquiring position information of the board recognition mark AS. In FIG. 4, the reflective light source 71 irradiates light containing a wavelength that is transmitted through the chip component C. Therefore, in FIG. 4(a), the light of a wavelength that is transmitted through the chip component C is reflected on the surface of the board S, and an image that is transmitted through the chip component C is obtained by the recognition means 5, and position information of the board recognition first mark AS1 is obtained from this image. In addition, by moving the recognition means 5 horizontally, position information of the board recognition second mark AS2 can also be obtained (similar to the board recognition first mark AS1). Through the above process, the arrangement state of the board S (mounting location SC thereof) can be determined.

[0052] Here, position information of the chip recognition mark AC can also be obtained in the state shown in FIG. 4. That is, in the case of FIG. 4(a), part of the light entering the chip component C is reflected by the underside of the chip. If the reflectivity of the first chip recognition mark AC1 differs from that of other parts, it is possible to observe the first board recognition mark AS1 simultaneously with the first board recognition mark AS1. In particular, when the chip component C is brought close to the substrate S, accurate position information of the first board recognition mark AS1 and the first chip recognition mark AC1 can be obtained by observing both the first board recognition mark AS1 and the first chip recognition mark AC1 within the depth of field. The same is true for the second board recognition mark AS2 and the second chip recognition mark AC2 in FIG. 4(b), and alignment can also be performed using only the operations shown in FIGS. 4(a) and 4(b).

[0053] However, due to the influence of an insulating layer formed on the electrode surface of a chip component C having a chip recognition mark AC, the contrast of the chip recognition mark AC is lower than that of the board recognition mark AS, making it difficult to identify even using image processing, and it may not be possible to obtain position information.

[0054] In such a case, it is necessary to obtain the position information of the chip recognition mark AC by another method. Therefore, as a first modification of the mounting apparatus 1, it is decided to obtain the position information of the chip recognition mark AC by a mounting apparatus 1001 having the configuration shown in FIG. 5. The difference shown in FIG. 5 from the mounting apparatus 1 shown in FIG. 1 is the presence of a transmission light source 72. Here, the transmission light source 72 emits light containing wavelengths that are transmitted through the chip component, similar to the reflection light source 71. The transmission light source 72 is also connected to the control unit 10 and is controlled by the control unit 10.

[0055] A method for acquiring position information of the chip recognition mark using this transmission light source 72 will be described with reference to Fig. 6. In Figs. 6(a) and 6(b), the board S is retracted from below the chip component C and the transmission light source 72 is positioned therein. In this state, the height of the mounting head 4 is set to the state shown in Fig. 4, where the chip component C is close to the board S. Furthermore, when the recognition means 5 acquires an image, the reflection light source 71 is not turned on, and the transmission light source 72 irradiates light toward the chip component C.

[0056] In the state shown in Fig. 6(a), the recognition means 5 can obtain a clear image of the first chip recognition mark AC1 from the image capture unit 50 using light of a wavelength that passes through the chip component C, and the control unit 10, which has obtained this image information, can obtain position information of the first chip recognition mark AC1. Similarly, in the state shown in Fig. 6(b), position information of the second chip recognition mark AC2 can be obtained.

[0057] 4 and 6 show a state in which the chip component C is close to the substrate S, so it is possible to obtain positional information of the first substrate recognition mark AS1 and the first chip recognition mark AC1, and positional information of the second substrate recognition mark AS2 and the second chip recognition mark AC2 under the same conditions, and to calculate the amount of positional deviation of the chip component C from the mounting location SC on the substrate S. Therefore, in order to correct this positional deviation, the positions of at least one of the substrate stage 2 and the attachment tool 42 are adjusted to align the chip component C with the mounting location SC, and then the mounting head 4 is lowered to mount the chip component C in close contact with the substrate S.

[0058] Incidentally, it does not matter whether the position information of the board recognition mark AS in the state shown in Figure 4 or the position information of the chip recognition mark AC in the state shown in Figure 6 is acquired first, but it is necessary to move the substrate stage 2 horizontally, and in some cases the mounting head 4 needs to be moved up and down. For this reason, depending on the repeatability accuracy of the mechanisms that move the substrate stage 2 and the mounting head 4, an error will occur in the amount of positional deviation of the chip component C relative to the mounting location SC, and high-precision alignment cannot be guaranteed. In addition, the substrate stage 2 needs to be moved by a relatively large amount, and the movement time may affect the mounting takt time.

[0059] A second modification of the mounting apparatus 1 that takes such a situation into consideration is shown in Fig. 7. In the mounting apparatus 1002 shown in Fig. 7, the attachment tool 42 is separated from the substrate S, and in a state in which the attachment tool 42 holds the chip component C delivered by the chip slider 61, the transmissive light source 72 disposed between the substrate S and the chip component C irradiates light toward the chip component C.

[0060] 8 shows a specific state, but in Modification 2, a tool recognition mark AT is provided on the attachment tool 42. Here, the first tool recognition mark AT1 and the second tool recognition mark AT2 are provided on the attachment tool 42 so that when the attachment tool 42 holds a chip component C, the first tool recognition mark AT1 is located near the first chip recognition mark AC1, and the second tool recognition mark AT2 is located near the second chip recognition mark AC2. The tool recognition mark AT is drawn using a material that has low transmittance (and preferably high reflectivity) for light of a wavelength that is included in the wavelength of the transmission light source 72 and that passes through the chip component C.

[0061] In the state shown in FIG. 8(a), the recognition means 5 can obtain images of the first chip recognition mark AC1 and the first tool recognition mark AT1 from the image capture unit 50 using light of a wavelength that is transmitted through the chip component C and the attachment tool 42. The control unit 10, which obtains this image information, can obtain and store relative position information between the first chip recognition mark AC1 and the first tool recognition mark AT1. Similarly, in the state shown in FIG. 8(b), it can obtain and store relative position information between the second chip recognition mark AC2 and the second tool recognition mark AT2. As a result, the first chip recognition mark AC1 and the second chip recognition mark AC2 can be calculated from the position information between the first tool recognition mark AT1 and the second tool recognition mark AT2.

[0062] Next, the transmissive light source 72 (and chip slider 61) is retracted, and then, as in FIG. 4, the chip component C is brought as close as possible to the substrate S without coming into contact with it, and an image is acquired using the reflective light source 71. This state is shown in FIG. 9, but unlike FIG. 4, in FIG. 9, the tool recognition mark AT is also observed in addition to the substrate recognition mark AS. Note that in FIG. 9, it is desirable that the substrate recognition mark AS and the tool recognition mark AT are within the depth of field of the recognition means 5.

[0063] 9(a), the recognition means 5 acquires images of the substrate recognition mark AS1 and the tool recognition mark AT1 from the image acquisition unit 50, and the control unit 10, which obtains the image information, obtains relative position information of the first substrate recognition mark AS1 and the first tool recognition mark AT1. However, since the relative positional relationship between the first chip recognition mark AC1 and the first tool recognition mark AT1 has been obtained first, the position information of the first substrate recognition mark AS1 and the first chip recognition mark AC1 can be calculated. Similarly, from the observation in the state of FIG. 9(b), the position information of the second substrate recognition mark AS2 and the second chip recognition mark AC2 can be calculated.

[0064] In this way, it is possible to obtain positional information of the first board recognition mark AS1 and the first chip recognition mark AC1, and positional information of the second board recognition mark AS2 and the second chip recognition mark AC2, and to calculate the amount of positional deviation of the chip component C relative to the mounting location SC on the board S. Therefore, in order to correct this positional deviation, the position of at least one of the board stage 2 and the attachment tool 42 is adjusted to align the chip component C with the mounting location SC, and then the mounting head 4 is lowered to mount the chip component C in close contact with the board S.

[0065] In this modified example 2, the relative positional relationship between the chip recognition mark AC and the tool recognition mark AT is not related to the distance between the attachment tool 42 and the substrate S, and alignment can be performed with the chip component C close to the substrate S, making it possible to perform mounting with high-precision alignment with few error factors. Also, because position information about the chip recognition mark AC and the tool recognition mark AT can be obtained at the height where the attachment tool 42 receives the chip component C from the chip slider 61, there is no need to operate the substrate stage 2, and there is only a slight impact on the mounting takt time.

[0066] Incidentally, if the relative position of the image capture unit 50 with respect to the attachment 42 is the same in Figures 8(a) and 9(a), images can be obtained at the same position for the chip component C in Figures 8(a) and 9(a). Therefore, the position information of the first chip recognition mark AC1 obtained and stored in the state of Figure 8(a) can be compared with the position information of the first board recognition mark AS1 obtained in Figure 9(a) in the same field of view and at the same coordinates. Therefore, the position information of the first tool recognition mark AT1 becomes unnecessary. Similarly, if the relative position of the image capture unit 50 with respect to the attachment 42 is the same in Figures 8(b) and 9(b), the position information of the second tool recognition mark AT2 becomes unnecessary. However, in an apparatus configuration in which one image capture unit 50 moves horizontally (within the XY plane) and vertically (in the Z direction) to acquire position information for each recognition mark, it is difficult to perfectly match the relative position of the image capture unit 50 with respect to the attachment 42 in Figures 8(a) and 9(a) (the same applies to Figures 8(b) and 9(b)), so it is desirable to obtain the relative position information of the chip recognition mark AC and the substrate recognition mark AS via the tool recognition mark AT.

[0067] On the other hand, if the image capture unit 50 is kept in a state where its relative position with respect to the attachment tool 42 is maintained (fixed) from the time when the position information of the chip recognition mark AC is acquired until the time when the position information of the substrate recognition mark AS is acquired, precise alignment can be performed without using the tool recognition mark AT.

[0068] An example of such a configuration is Modification 3 shown in FIG. 10. In Modification 3 of FIG. 10, an image capture unit 501 for acquiring positional information of the first chip recognition mark AC1 and the first board recognition mark AS1, and an image capture unit 502 for acquiring positional information of the second chip recognition mark AC2 and the second board recognition mark AS2 are separately provided. In the state of FIG. 10(a), the transmissive light source 721 is turned on, and an image (not shown) is captured by the image capture unit 501 and the imaging means 531 obtains an image of the first chip recognition mark AC1. If the imaging means 531 is connected to the control unit 10, the control unit 10 can perform calculation processing to determine and store positional information of the first chip recognition mark AC1 within the field of view of the imaging means 531. Similarly, the positional information of the chip recognition second mark AC2 within the field of view of the imaging means 532 can be obtained and stored (by the control unit 10 connected to the imaging means 532) from the image of the chip recognition second mark AC2 obtained by the imaging means 532 after turning on the transmission light source 722 and capturing it from the image capturing unit 502 (not shown).

[0069] Thereafter, the transmissive light sources 721 and 722 are retracted, and the relative positions of the image capture units 501 and 502 are maintained (fixed) with respect to the head main body 40 (and attachment tool 42), and the chip component C is brought close to the board S, as shown in FIG. 10(b). In the state of FIG. 10(b), the reflective light source 71 is turned on, and the imaging means 531 acquires an image of the board recognition first mark AS1 acquired from the image capture unit 501 using light of a wavelength that transmits through the chip component C, and the control unit 10 determines positional information of the board recognition first mark AS1 within the field of view of the imaging means 531. Similarly, the imaging means 532 acquires an image of the board recognition first mark AS1 acquired from the image capture unit 502, and determines positional information of the board recognition second mark AS2 within the field of view of the imaging means 532.

[0070] Therefore, the positional deviation (rotation angle in the XY direction and Z direction) of the chip component C relative to the substrate S can be calculated from the positional relationship between the first chip recognition mark AC1 and the first substrate recognition mark AS1, and the positional relationship between the second chip recognition mark AC2 and the second substrate recognition mark AS2, which are determined using the same field of view and the same coordinate system, and the position of the attachment tool 42 can be corrected by the tool position control means 43 to correct the positional deviation.

[0071] In the third modification, two imaging means are provided: an imaging means 531 for obtaining positional information of the first chip recognition mark AC1 and the first board recognition mark AS1, and an imaging means 532 for obtaining positional information of the second chip recognition mark AC2 and the second board recognition mark AS2. However, a single imaging means may be used as long as the positional information of the first chip recognition mark AC1 and the first board recognition mark AS1 and the positional information of the second chip recognition mark AC2 and the second board recognition mark AS2 can be obtained with the accuracy required for alignment. That is, in the fourth modification of the embodiment of the present invention, the transmission light source 72 is turned on in the state shown in FIG. 11( a), and the imaging means 530 obtains images of the first chip recognition mark AC1 and the second chip recognition mark AC2 by capturing them from the image capturing unit 500 (not shown), and the control unit 10 connected to the imaging means 530 obtains and stores positional information of the first chip recognition mark AC1 and the second chip recognition mark AC2. 11(b) shows the state in which the transmissive light source 72 is then retracted, and the chip component C is brought close to the board S while the image capture unit 500 is maintained (fixed) in its relative position with respect to the head main body 40. In the state in FIG. 11(b), the reflective light source 71 is turned on, and the imaging means 530 obtains images of the board recognition first mark AS1 and the board recognition second mark AS2 captured by the image capture unit 500 using light of a wavelength that transmits through the chip component C, and the control unit 10 determines positional information of the board recognition first mark AS1 within the field of view of the imaging means 531.

[0072] Next, the positional deviation (rotation angle in the XY direction and Z direction) of the chip component C relative to the substrate S is calculated from the positional relationship between the first chip recognition mark AC1 and the first substrate recognition mark AS1, and the positional relationship between the second chip recognition mark AC2 and the second substrate recognition mark AS2, which are determined using the same field of view and the same coordinate system, and the position of the attachment tool 42 is adjusted by the tool position control means 43 so as to correct the positional deviation.

[0073] Incidentally, as shown in Figures 10 and 11, if the image capture unit 50 of the recognition means 5 is configured to maintain (fix) its relative position with respect to the attachment tool 42 from the time it acquires the position information of the chip recognition mark AC until it acquires the position information of the board recognition mark AS, the present invention can be implemented even with an apparatus configuration in which the mounting head 4 moves significantly.

[0074] As an example, modified example 5 of the embodiment is shown in Figure 12. In the device configuration of Figure 12, the mounting head 4 picks up a chip component C from the wafer W as shown in Figure 12(a), then moves to above the substrate stage 2 (Figure 12(c)), and mounts the chip component C on the substrate S. However, while the mounting head 4 is moving, a transmitted light source 72 may be disposed (as shown in Figure 12(b)) to acquire position information of the chip recognition mark AC. After this, position information of the substrate recognition mark AS is acquired in the state shown in Figure 12(c), and as long as the relative positions of the recognition means 5 (image capture unit 50) and the attachment tool 42 are maintained during the movement, the position information of the chip recognition mark AC and the substrate recognition mark AS can be compared as they are at the same coordinates.

[0075] The present invention is particularly effective when mounting is performed in a state in which the board recognition mark AS is covered by the chip component C as shown in Fig. 18, but it is also effective when the board recognition mark AS is not covered by the board as shown in Fig. 13. In other words, since an image of the chip recognition mark AC transmitted through the chip component C can be obtained, the chip position recognition means 8 as shown in Fig. 16 is not required. [Explanation of symbols]

[0076] 1 Mounting equipment 2. Substrate stage 3 Lifting means 4 Mounting head 5 Recognition means 6 Chip transport means 7 light source 10 Control Unit 20 Stage movement control means 21 X-direction stage movement control means 22 Y-direction stage movement control means 23 Vacuum table 40 Head body 41 Heater section 42 Attachment Tools 43 Tool position control means 50 Image capture unit 52 Light path 53 Imaging means 60 Transport rail 61 Tip Slider 71 Reflection light source 72 Transmission light source AC, AC1, AC2 chip recognition mark AS, AS1, AS2 board recognition marks AT, AT1, AT2 tool recognition mark C Chip parts S board SC (chip component) mounting location

Claims

1. A mounting apparatus that mounts a chip component having a chip recognition mark for alignment and a substrate having a substrate recognition mark for alignment, with a surface having the chip recognition mark and a surface having the substrate recognition mark facing each other, in a state in which the substrate recognition mark is covered by the chip component, an attachment tool that holds a surface of the chip component opposite to a surface having the chip recognition mark; a substrate stage for holding the substrate; a reflection light source that irradiates light including a wavelength that is transmitted through the chip component from the attachment tool side toward a surface of the substrate; a transmission light source that irradiates light including a wavelength that is transmitted through the chip component from below the chip component toward the chip component and the attachment tool; a recognition means for recognizing reflected light of light irradiated by the reflection light source and light irradiated by the transmission light source, the attachment tool has a tool recognition mark; The recognition means acquiring position information of the chip recognition mark and position information of the tool recognition mark from an image formed by light of a wavelength that is irradiated from the transmission light source and passes through the chip component and the attachment tool; acquiring positional information of the tool recognition mark and the board recognition mark from an image formed by light of a wavelength that is irradiated from the reflection light source, passes through the attachment tool, and is reflected by the tool recognition mark, and light that is passed through the attachment tool and the chip component, and is reflected by the board; A mounting apparatus that uses relative position information of the tool recognition mark to determine the positional relationship between the substrate recognition mark and the chip recognition mark, and aligns the substrate and the chip.

2. The mounting device according to claim 1, An implementation device that acquires position information of the substrate recognition mark and the tool recognition mark while bringing the chip component close to the substrate so that both the substrate recognition mark and the tool recognition mark are within the depth of field of the recognition means.

Images