Multilayer electronic components

Abstract

To provide a multilayer electronic component which decreases equivalent series inductance while protecting a body of the multilayer electronic component from thermal and mechanical stress transferred from a substrate.SOLUTION: A multilayer electronic component includes: a capacitor 100 that includes a body 110 comprising first and second internal electrodes 121 and 122 alternately disposed with a dielectric layer therebetween, and that also includes first and second external electrodes 131 and 132 disposed on end surfaces of the body, respectively; and first and second metal frames 141 and 142 disposed on the first and second external electrodes, respectively. When L is a dimension of the capacitor in a length direction and W is a dimension of the capacitor in a width direction, W>L is satisfied. The first and second metal frames include: support portions 141a and 142a in contact with the first and second external electrodes; extension portions 141b and 142b extending from the support portions in a thickness direction of the body and disposed to be spaced apart from the body and the first and second external electrodes; and mounting portions 141c and 142c disposed to extend from one end of the extension portions in a length direction of the body.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have advantages of being small in size, high in capacitance, and easy to mount, and can be used as components in various electronic devices.

[0004] Recently, there has been an increasing demand for multilayer ceramic capacitors required for power drive systems and infotainment systems in automobiles in the fields of environmentally friendly automobiles and electric automobiles.

[0005] Multilayer electronic components, such as multilayer ceramic capacitors, used in automobiles are required to have high levels of thermal reliability and electrical reliability in the high-temperature, high-vibration, and high-pressure environments of automobiles. Therefore, there is an increasing need for multilayer electronic components that are highly durable against external vibrations and deformations and have high electrical reliability.

[0006] As the environment in which multilayer electronic components are used becomes more severe, they are more susceptible to cracks caused by vibrations and mechanical deformation of the mounting board. With conventional multilayer electronic components, when mounted on a board, the main body of the multilayer electronic component comes into direct contact with the board via solder, and heat and mechanical deformation generated by the board or adjacent components are directly transmitted to the multilayer electronic component, making it difficult to ensure a high level of reliability.

[0007] Therefore, recently, a method has been proposed in which a metal frame is bonded to the side of the multilayer ceramic capacitor to secure a gap between the multilayer ceramic capacitor and the mounting substrate, thereby preventing thermal and mechanical stress from being directly transmitted to the multilayer ceramic capacitor from the substrate.

[0008] However, since the metal frame has a certain thickness and is connected to a current-carrying part such as an external electrode, the current path increases, which causes a problem of an increase in equivalent series inductance (ESL).

[0009] Therefore, there is a need for a multilayer electronic component that can protect a multilayer ceramic capacitor from thermal and mechanical stress transmitted from a substrate while achieving low equivalent series inductance (ESL). Summary of the Invention [Problem to be solved by the invention]

[0010] One of several objects of the present invention is to solve the problem that heat and mechanical deformation generated in a substrate are transferred to a multilayer ceramic capacitor. One of several objects of the present invention is to solve the problem that when a metal frame is joined to a multilayer capacitor, the current path increases, resulting in an increase in equivalent series inductance (ESL).

[0011] However, the purpose of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] a first metal frame disposed on the first external electrode of the capacitor; and a second metal frame disposed on the second external electrode of the capacitor, wherein the size of the capacitor in the second direction is L and the size of the capacitor in the third direction is W, where L is the size of the capacitor in the second direction and W is the size of the capacitor in the third direction, and W>L. The first and second metal frames may include a support portion in contact with the first and second external electrodes, an extension portion extending from the support portion in the first direction and spaced apart from the body and the first and second external electrodes, and a mounting portion extending from one end of the extension portion in the second direction. [Effects of the Invention]

[0013] One of the advantages of the present invention is that it protects a multilayer ceramic capacitor from thermal and mechanical stress transmitted from a substrate. Another advantage of the present invention is that it shortens a current path to reduce equivalent series inductance (ESL). Another advantage of the present invention is that it shortens a current path to reduce equivalent series inductance (ESL) when a metal frame is joined to protect a multilayer ceramic capacitor from thermal and mechanical stress transmitted from a substrate.

[0014] The various beneficial advantages and effects of the present invention are not limited to the above, but can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0015] [Figure 1]FIG. 2 is a perspective view schematically illustrating a main body according to an embodiment of the present invention. [Figure 2] 1 is a perspective view schematically illustrating a capacitor according to an embodiment of the present invention; [Figure 3] FIG. 2 is a cross-sectional view taken along line II' of FIG. [Figure 4] FIG. 10 is a perspective view schematically illustrating a multilayer electronic component according to a comparative example. [Figure 5] 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention; [Figure 6] FIG. 6 is a cross-sectional view taken along line II-II' in FIG. 5. [Figure 7] 1 is a graph showing impedance values ​​as a function of frequency for a multilayer electronic component according to one embodiment of the present invention and a multilayer electronic component in a comparative example. [Figure 8] FIG. 1 is a perspective view schematically showing a first modified example of a multilayer electronic component according to an embodiment of the present invention. [Figure 9] FIG. 10 is a perspective view schematically showing a second modified example of the multilayer electronic component according to one embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view schematically showing a third modified example of the multilayer electronic component according to one embodiment of the present invention. [Figure 11] FIG. 10 is a perspective view schematically showing a fourth modified example of the multilayer electronic component according to one embodiment of the present invention. [Figure 12] FIG. 10 is a perspective view schematically showing a fifth modified example of the multilayer electronic component according to one embodiment of the present invention. [Figure 13] FIG. 10 is a perspective view schematically showing a sixth modified example of the multilayer electronic component according to one embodiment of the present invention. [Figure 14] FIG. 10 is a perspective view schematically showing a seventh modified example of the multilayer electronic component according to one embodiment of the present invention. [Figure 15] 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention; [Figure 16] 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention; [Figure 17]1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention; [Figure 18] 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention; [Figure 19] 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0017] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation have been omitted, and the size and thickness of each component shown in the drawings have been arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Components that have the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain component, this does not exclude other components, but means that the part may further include other components, unless otherwise specified to the contrary.

[0018] In the drawings, the first direction can be defined as the stacking direction or thickness direction, the second direction as the length direction, and the third direction as the width direction.

[0019] Multilayer electronic components FIG. 1 is a perspective view schematically showing a main body 110 of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a perspective view schematically showing a capacitor 100 according to one embodiment of the present invention, FIG. 3 is a cross-sectional view showing a cross section taken along line II' in FIG. 1, FIG. 4 is a perspective view schematically showing a multilayer electronic component 2000 according to a comparative example, FIG. 5 is a perspective view schematically showing a multilayer electronic component 1000 according to one embodiment of the present invention, and FIG. 6 is a cross-sectional view showing a cross section taken along line II-II' in FIG.

[0020] A multilayer electronic component 1000 according to one embodiment of the present invention will be described in detail below with reference to FIGS.

[0021] A multilayer electronic component 1000 according to one embodiment of the present invention may include a body including a dielectric layer 111 and first and second internal electrodes 121, 122 arranged alternately with the dielectric layer 111 sandwiched therebetween, and including first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other in the third direction.

[0022] FIG. 1 is a perspective view that schematically shows a main body 110 of a multilayer electronic component according to one embodiment of the present invention. The body 110 is formed by alternately laminating dielectric layers 111 and first and second internal electrodes 121, 122.

[0023] Although there is no particular limitation on the specific shape of the body 110, as shown in the figure, the body 110 may have a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0024] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and facing each other in the third direction.

[0025] The plurality of dielectric layers 111 forming the body 110 are in a sintered state, and the boundaries between adjacent dielectric layers 111 can be so integrated that they are difficult to see without using a scanning electron microscope (SEM).

[0026] The raw material for forming the dielectric layer 111 is not particularly limited as long as a sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can contain BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc.

[0027] The material for forming the dielectric layer 111 can be a powder such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, binders, dispersants, etc. can be added according to the purpose of the present invention.

[0028] Referring to FIG. 3, the main body 110 may include a capacitance forming portion that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed facing each other with a dielectric layer 111 therebetween to form a capacitance, and cover portions 112 and 113 that are formed on the upper and lower parts of the capacitance forming portion. The capacitance forming portion is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 sandwiched therebetween.

[0029] The cover parts 112 and 113 may include an upper cover part 112 disposed at an upper part of the capacitance forming part in the first direction and a lower cover part 113 disposed at a lower part of the capacitance forming part in the first direction.

[0030] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0031] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 . The thickness tc of the upper and lower cover parts 112, 113 does not need to be particularly limited and may be adjusted to prevent damage to the internal electrodes.

[0032] The internal electrodes 121 , 122 may be arranged alternately with the dielectric layers 111 . The internal electrodes 121, 122 may include first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 are alternately arranged to face each other with the dielectric layer 111 constituting the main body 110 sandwiched therebetween, and may be in contact with the first and second external electrodes 131, 132 on the third and fourth surfaces 3, 4 of the main body 110, respectively.

[0033] Referring to FIG. 3, the first internal electrode 121 can be spaced apart from the fourth surface 4 and in contact with the first external electrode 131 at the third surface 3, and the second internal electrode 122 can be spaced apart from the third surface 3 and in contact with the second external electrode 132 at the fourth surface 4. In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by a dielectric layer 111 disposed therebetween.

[0034] The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked sheets.

[0035] The conductive metal contained in the internal electrodes 121, 122 may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but the present invention is not limited thereto.

[0036] The internal electrodes 121 and 122 may be formed by printing a conductive paste on the ceramic green sheet, and the method for printing the conductive paste for the internal electrodes may be screen printing or gravure printing, although the present invention is not limited thereto.

[0037] The multilayer electronic component 1000 according to an embodiment of the present invention may include first and second external electrodes 131 and 132 disposed on the body 110 . 3, the first external electrode 131 may contact the first internal electrode 121 on the third surface 3, and the second external electrode 132 may contact the second internal electrode on the fourth surface 4. Therefore, the first external electrode 131 may be disposed on the third surface 3 of the body 110, and the second external electrode 132 may be disposed on the fourth surface 4 of the body 110.

[0038] The first and second external electrodes 131, 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may be arranged on multiple surfaces of the main body 110.

[0039] For example, the first external electrode 131 may be disposed on the third surface 3 and extended to a portion of at least one of the first and second surfaces 1 and 2, and the second external electrode 132 may be disposed on the fourth surface 4 and extended to a portion of at least one of the first and second surfaces.

[0040] However, without being limited thereto, the first external electrode 131 may be arranged on the third surface 3 and extended to a portion of at least one of the first, second, fifth and sixth surfaces of the main body 110, and the second external electrode 132 may be arranged on the fourth surface 4 and extended to a portion of at least one of the first, second, fifth and sixth surfaces of the main body 110.

[0041] This allows the first external electrode 131 to contact the first internal electrode 121 on the third surface 3 , and the second external electrode 132 to contact the second internal electrode 122 on the fourth surface 4 .

[0042] With the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122. At this time, the capacitance of the capacitor 100 is proportional to the area of ​​the first and second internal electrodes 121 and 122 that overlap each other in the stacking direction in the capacitance forming portion.

[0043] 5 and 6, a multilayer electronic component 1000 according to an embodiment of the present invention includes a first metal frame 141 disposed on the first external electrode 131 of the capacitor 100 and a second metal frame 142 disposed on the second external electrode 132 of the capacitor 100, thereby ensuring a gap between the capacitor 100 and a substrate (not shown) and preventing stress from the substrate from being directly transmitted to the capacitor 100, thereby improving the thermal reliability, mechanical reliability, and bending deformation resistance of the multilayer electronic component 1000.

[0044] The first and second metal frames 141 and 142 may include supporting portions 141a and 142a, extending portions 141b and 142b, and mounting portions 141c and 142c. In this case, a conductive adhesive (not shown) may be provided between the first and second external electrodes 131 and 132 and the supporting portions 141a and 142a to further improve the electrical and physical connectivity between the first and second external electrodes 131 and 132 and the first and second metal frames 141 and 142. Such conductive adhesive may be made of high-temperature solder or a conductive adhesive material, but the present invention is not limited thereto.

[0045] Meanwhile, in order to more strongly couple the support portions 141a, 142a of the first and second metal frames 141, 142 to the first and second external electrodes 131, 132, the metal frames 141, 142 may further include support portions extending from the support portions 141a, 142a to a portion of at least one of the first, second, fifth and sixth surfaces.

[0046] The support parts 141a and 142a are parts that contact the first and second external electrodes 131 and 132, and can electrically and physically connect the first and second external electrodes 131 and 132 to the first and second metal frames 141 and 142.

[0047] The extensions 141b and 142b may extend in a first direction from the support portions 141a and 142a and may be spaced apart from the body 110 and the first and second external electrodes 131 and 132.

[0048] Therefore, since the metal frames 141 and 142 include the extensions 141b and 142b, the capacitor 100 is positioned away from the mounting surface, thereby reducing vibrations generated by the piezoelectric phenomenon in the capacitor and reducing acoustic noise.

[0049] The mounting portions 141c and 142c may be arranged to extend from one end of the extension portions 141b and 142b in the second direction. Therefore, the multilayer electronic component 1000 can be stably mounted on the substrate, the adhesive strength of the multilayer electronic component 1000 can be increased, and heat or vibrations transmitted from the substrate can be absorbed to reduce the possibility of damage to the capacitor 100. Meanwhile, the material of the metal frame is not particularly limited.

[0050] 4, the size L of the capacitor 100′ in the second direction is larger than the size W of the capacitor 100′ in the third direction. In the past, as in the multilayer electronic component 2000 of the comparative example, there have been attempts to prevent stress from the substrate from being directly transmitted to the capacitor 100′ by arranging first and second metal frames 141′, 142′ on the first and second external electrodes 131′, 132′ of the capacitor 100′.

[0051] However, since the size L of capacitor 100' in the second direction is larger than the size W of capacitor 100' in the third direction, the current path increases, the equivalent series inductance (ESL) cannot be reduced, and the capacitor 100' has a high impedance value at high frequencies.

[0052] Furthermore, this problem occurs because the current path is further increased by placing metal frames 141' and 142' on capacitor 100', which causes the multilayer electronic component 2000 to have a higher impedance value at high frequencies.

[0053] Referring to FIG. 2, a capacitor 100 according to one embodiment of the present invention can satisfy W>L, where L is the size of the capacitor 100 in the second direction and W is the size of the capacitor 100 in the third direction.

[0054] This narrows the distance between the external electrodes 131, 132 arranged in the second direction, thereby reducing the current path, reducing the equivalent series inductance (ESL) of the capacitor 100, and allowing it to have a low impedance value at high frequencies.

[0055] On the other hand, in the capacitor 100 according to one embodiment of the present invention in which W>L is satisfied, the length of the external electrodes 131, 132 in contact with the substrate increases, which may result in a problem in that the possibility of damage to the capacitor 100 due to deformation of the substrate may increase.

[0056] Referring to FIG. 5, a multilayer electronic component 1000 according to one embodiment of the present invention may include a first metal frame 141 disposed on the first external electrode 131 of the capacitor 100 and a second metal frame 142 disposed on the second external electrode 132 of the capacitor 100.

[0057] As a result, first and second metal frames 141, 142 prevent heat and mechanical deformation generated on the board from being directly transmitted to capacitor 100, thereby improving the durability of capacitor 100 relative to the mounting board.

[0058] FIG. 7 is a graph showing the magnitude of impedance as a function of frequency for a multilayer electronic component 1000 according to one embodiment of the present invention and a multilayer electronic component 2000 as a comparative example.

[0059] Specifically, the example corresponds to the case where W is 20 μm, L is 12 μm, and W / L is 1.67 in the multilayer electronic component 1000 according to one embodiment of the present invention, where W>L is satisfied. The comparative example corresponds to a case where W is 12 μm, L is 20 μm, and W / L is 0.60, which does not satisfy W>L.

[0060] In the case of the example, the magnitude of the impedance at 100 MHz corresponds to 0.05 Ω, and in the case of the comparative example, it corresponds to 0.13 Ω, so it can be confirmed that the magnitude of the impedance of the example is smaller in the high frequency range than the magnitude of the impedance of the comparative example.

[0061] Therefore, the multilayer electronic component 1000 according to one embodiment of the present invention satisfies W>L, thereby reducing the current path and thereby reducing the equivalent series inductance (ESL), thereby providing a multilayer electronic component with low impedance.

[0062] In the case of a multilayer electronic component including a metal frame, vibration and heat of the substrate are transmitted to the capacitor through the metal frame. Furthermore, when bending occurs in the substrate, there is a possibility that bending will also occur in the mounting portion where the substrate and the metal frame come into contact due to bending stress.

[0063] Furthermore, if the third-direction dimension W of the capacitor 100 of the multilayer electronic component 1000 is increased to reduce the ESL, the length or area of ​​contact between the metal frame and the substrate increases, which may result in increased distortion of the multilayer electronic component 1000 due to bending of the substrate.

[0064] Therefore, in a multilayer electronic component including a metal frame, there is a need for a multilayer electronic component that reduces the current path to reduce ESL, while protecting the capacitor from thermal and mechanical stress transmitted through the metal frame in the substrate and having robust properties against deformation due to bending of the substrate.

[0065] Various modifications of the multilayer electronic component 1000 according to one embodiment of the present invention will be described below, but descriptions that overlap with those of the multilayer electronic component 1000 according to one embodiment of the present invention will be omitted.

[0066] (Variation 1) 8 is a perspective view schematically illustrating a first modified example (1001) of the multilayer electronic component 1000 according to an embodiment of the present invention. Referring to FIG. 8, the first modified example (1001) of the multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-1 and 142-1 disposed on the external electrodes 131 and 132.

[0067] The first and second metal frames 141-1 and 142-1 may include support portions 141a-1 and 142a-1, extension portions 141b-1 and 142b-1, and mounting portions 141c-1 and 142c-1. The extension portions 141b-1 and 142b-1 may be spaced apart in both directions in the third direction. Therefore, the extension portions 141b-1 and 142b-1 may have a shape spaced apart in both directions in the third direction with a space therebetween. This allows the space to block the transmission of heat and vibrations generated in the substrate, thereby effectively protecting the multilayer electronic component 1001 from heat and vibrations of the substrate.

[0068] In one embodiment, the mounting portions 141c-1 and 142c-1 may be arranged to be separated in both directions of the third direction. Therefore, the mounting portions 141c-1 and 142c-1 may have a shape separated in both directions of the third direction with a space therebetween. This can prevent bending stress from being directly transmitted to the multilayer electronic component 1001 when bending occurs in the substrate, thereby improving the bending strength of the multilayer electronic component 1001.

[0069] (Variation 2) 9 is a perspective view that schematically shows a second modified example (1002) of the multilayer electronic component 1000 according to one embodiment of the present invention. In the case of a multilayer electronic component that uses a metal frame, if the position and direction of the metal frame deviate from the correct position as designed when mounted on a board, the edge of the mounting portion of the metal frame comes into contact with other adjacent land patterns, which is likely to cause short-circuit defects between components.

[0070] 9, a second modified example (1002) of a multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-2 and 142-2 disposed on the external electrodes 131 and 132. The first and second metal frames 141-2 and 142-2 may include supporting portions 141a-2 and 142a-2, extending portions 141b-2 and 142b-2, and mounting portions 141c-2 and 142c-2.

[0071] In one embodiment, the size of the extensions 141b-2 and 142b-2 in the third direction may be smaller than the size of the support portions 141a-2 and 142a-2 in the third direction, thereby reducing the area through which heat and vibration from the substrate are transferred, thereby effectively protecting the multilayer electronic component 1002 from heat and vibration from the substrate.

[0072] In this case, the size in the third direction of mounting portions 141c-2 and 142c-2 may be substantially the same as the size in the third direction of extension portions 141b-2 and 142b-2. This prevents mounting portions 141c-2 and 142c-2 from contacting other adjacent land patterns even if metal frames 141-2 and 142-2 are misaligned when mounting multilayer electronic component 1002 on a substrate, thereby preventing short circuits between components mounted on the substrate.

[0073] (Variation 3) 10 is a perspective view schematically illustrating a third modification (1003) of a multilayer electronic component 1000 according to one embodiment of the present invention. In the case of a multilayer electronic component using a metal frame, if the metal frame surrounds the entire surface of the external electrodes, the degree of transmission of vibration and heat from the substrate increases, and it may be difficult to protect the capacitor 100 from heat and vibration.

[0074] 10, a third modification (1003) of a multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-3 and 142-3 disposed on the external electrodes 131 and 132. The first and second metal frames 141-3 and 142-3 may include supporting portions 141a-3 and 142a-3, extending portions 141b-3 and 142b-3, and mounting portions 141c-3 and 142c-3.

[0075] In this case, by making the size in the third direction of the support parts 141a-3 and 142a-3 smaller than the size W in the third direction of the capacitor 100, the degree to which heat, vibration, and bending stress transmitted from the substrate through the metal frames 141-3 and 142-3 are transmitted to the capacitor 100 is reduced, thereby improving thermal and mechanical reliability and resistance to bending deformation.

[0076] In this case, the size in the third direction of the support portions 141a-3 and 142a-3 may be smaller than the size in the third direction of the extension portions 141b-3 and 142b-3. More preferably, in addition to this, the size in the third direction of the mounting portions 141c-3 and 142c-3 may be substantially the same as the size in the third direction of the extension portions 141b-3 and 142b-3. This increases the length or area of ​​the mounting portions 141c-3 and 142c-3 that contact the substrate, thereby increasing the fixing strength of the multilayer electronic component 1003.

[0077] (Variation 4) 11 is a perspective view schematically illustrating a fourth modified example (1004) of the multilayer electronic component 1000 according to an embodiment of the present invention. Referring to FIG. 11, the fourth modified example (1004) of the multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-4 and 142-4 disposed on the external electrodes 131 and 132. The first and second metal frames 141-4 and 142-4 may include supporting portions 141a-4 and 142a-4, extending portions 141b-4 and 142b-4, and mounting portions 141c-4 and 142c-4.

[0078] In one embodiment, by making the third-direction size of the support parts 141a-4, 142a-4 smaller than the third-direction size W of the capacitor 100, the degree to which heat, vibration, and bending stress transmitted from the substrate through the metal frames 141-4, 142-4 are transmitted to the capacitor 100 is reduced, thereby improving thermal and mechanical reliability and resistance to bending deformation.

[0079] In one embodiment, the size in the third direction of the extensions 141b-4 and 142b-4 may be substantially the same as the size in the third direction of the support portions 141a-4 and 142a-4, thereby reducing the area through which heat and vibration from the substrate are transferred, thereby effectively protecting the multilayer electronic component 1004 from heat and vibration from the substrate.

[0080] In one embodiment, the size in the third direction of the mounting portions 141c-4 and 142c-4 may be substantially the same as the size in the third direction of the extension portions 141b-4 and 142b-4. This prevents the mounting portions 141c-4 and 142c-4 from contacting other adjacent land patterns even if the metal frames 141-4 and 142-4 are misaligned when mounting the multilayer electronic component 1004 on a substrate, thereby preventing short circuits between the components mounted on the substrate.

[0081] (Variation 5) Fig. 12 is a perspective view schematically illustrating a fifth modified example (1005) of the multilayer electronic component 1000 according to an embodiment of the present invention. Referring to Fig. 12, the fifth modified example (1005) of the multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-5 and 142-5 disposed on the external electrodes 131 and 132. The first and second metal frames 141-5 and 142-5 may include supporting portions 141a-5 and 142a-5, extending portions 141b-5 and 142b-5, and mounting portions 141c-5 and 142c-5.

[0082] In one embodiment, the support portions 141a-5 and 142a-5 may be spaced apart in both directions in the third direction, thereby reducing the degree to which heat, vibration, and bending stress transmitted from the substrate through the metal frames 141-5 and 142-5 are transmitted to the capacitor 100, thereby improving thermal and mechanical reliability and resistance to bending deformation.

[0083] (Variation 6) Fig. 13 is a perspective view schematically illustrating a sixth modified example (1006) of the multilayer electronic component 1000 according to an embodiment of the present invention. Referring to Fig. 13, the sixth modified example (1006) of the multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-6 and 142-6 disposed on the external electrodes 131 and 132. The first and second metal frames 141-6 and 142-6 may include supporting portions 141a-6 and 142a-6, extending portions 141b-6 and 142b-6, and mounting portions 141c-6 and 142c-6.

[0084] In one embodiment, the support portions 141a-6 and 142a-6 may include grooves 140a. The grooves 140a not only reduce the degree to which vibration or heat is transmitted through the metal frames 141-6 and 142-6, but also improve the adhesive strength between the metal frames 141-6 and 142-6 and the external electrodes 131 and 132 by disposing a conductive adhesive in the grooves 140a.

[0085] In one embodiment, the groove 140a may be disposed apart from the ends of the support portions 141a-6 and 142a-6 in the first direction and the third direction, but is not limited thereto. The groove 140a may be disposed so as to penetrate the metal frame and expose the external electrodes, and the conductive adhesive may be disposed on the surfaces of the exposed external electrodes. In this case, the groove 140a may occupy 50% or more of the area of ​​the external electrodes in the direction in contact with the metal frame so that the metal frame and the capacitor are sufficiently bonded to each other.

[0086] (Variation 7) 14 is a perspective view schematically illustrating a seventh modified example (1007) of the multilayer electronic component 1000 according to an embodiment of the present invention. Referring to FIG. 14, the seventh modified example (1007) of the multilayer electronic component 1000 according to an embodiment of the present invention may include first and second metal frames 141-7 and 142-7 disposed on the external electrodes 131 and 132. The first and second metal frames 141-7 and 142-7 may include supporting portions 141a-7 and 142a-7, extending portions 141b-7 and 142b-7, and mounting portions 141c-7 and 142c-7.

[0087] The support portions 141a-7 and 142a-7 may include grooves 140a, and the extension portions 141b-7 and 142b-7 may include through-holes 140b. The through-holes 140b may be spaced apart from the first and third ends of the extension portions 141b-7 and 142b-7 and may be disposed to penetrate the extension portions. This effectively reduces heat and vibrations transmitted from the board while maintaining the strength of the metal frame.

[0088] Hereinafter, a multilayer electronic component according to an embodiment of the present invention will be described, but descriptions that overlap with those of the multilayer electronic component according to an embodiment of the present invention and various modified examples will be omitted.

[0089] 15 is a perspective view schematically illustrating a multilayer electronic component 2000 according to an embodiment of the present invention. Referring to FIG. 15, the multilayer electronic component 2000 according to the embodiment may include a plurality of capacitors 100. Specifically, the multilayer electronic component 2000 may have a structure in which a plurality of capacitors 100 are aligned, and a first metal frame 241 may be disposed on the first external electrodes 131 of the plurality of capacitors 100, and a second metal frame 242 may be disposed on the second external electrodes 132 of the plurality of capacitors 100. That is, the first metal frame may be in contact with each of the first external electrodes of the plurality of capacitors 100 simultaneously, and the second metal frame may be in contact with each of the second external electrodes of the plurality of capacitors 100 simultaneously.

[0090] Even if the multilayer electronic component 2000 includes a plurality of capacitors 100, the plurality of capacitors are stacked in the first direction or the third direction, thereby minimizing the gap between the first and second metal frames 241 and 242. Furthermore, since each of the capacitors 100 has a structure in which the dimension W in the third direction is larger than the dimension L in the second direction, when the capacitors 100 are stacked in the first or third direction, the dimension in the third direction of the entire capacitor array including the plurality of capacitors 100 can be larger than the dimension in the second direction.

[0091] This maintains the effect of reducing the current path, reduces the equivalent series inductance of the multilayer electronic component 2000, and enables the multilayer electronic component 2000 to have a low impedance value at high frequencies. Also, by joining tens to hundreds of small-capacity capacitors 100, the multilayer electronic component 2000 can be thermally stable while improving its capacitance and reliability.

[0092] Meanwhile, the first and second metal frames 241, 242 may include support portions 241a, 242a that contact the first and second external electrodes 131, 132 of the plurality of capacitors 100, extension portions 241b, 242b that extend from the support portions in a first direction and are spaced apart from the main body and the first and second external electrodes, and mounting portions 241c, 242c that extend from one end of the extension portions in a second direction.

[0093] 16 is a perspective view schematically illustrating a multilayer electronic component 2001 according to an embodiment of the present invention. Referring to FIG. 16, first and second metal frames 241-1 and 242-1 of the multilayer electronic component 2001 according to the embodiment may include support portions 241a-1 and 242a-1 that contact the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b-1 and 242b-1 that extend from the support portions in a first direction and are spaced apart from the body and the first and second external electrodes, and mounting portions 241c-1 and 242c-1 that extend from one end of the extension portions in a second direction.

[0094] In one embodiment, the support portions 241a-1 and 242a-1 of the first and second metal frames 241-1 and 242-1 may be spaced apart in both directions in the third direction, thereby reducing the degree to which heat, vibration, and bending stress transmitted from the substrate through the metal frames 241-1 and 242-1 are transmitted to the plurality of capacitors 100, thereby improving thermal and mechanical reliability and resistance to bending deformation.

[0095] 17 is a perspective view schematically illustrating a multilayer electronic component 2002 according to an embodiment of the present invention. Referring to FIG. 17, first and second metal frames 241-2 and 242-2 of the multilayer electronic component 2002 according to the embodiment may include support portions 241a-2 and 242a-2 that contact the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b-2 and 242b-2 that extend from the support portions in a first direction and are spaced apart from the body and the first and second external electrodes, and mounting portions 241c-2 and 242c-2 that extend from one end of the extension portions in a second direction.

[0096] In one embodiment, the support portions 241a-2 and 242a-2 may include grooves 240. The grooves 240a not only reduce the degree to which vibration or heat is transmitted through the metal frames 241-2 and 242-2, but also improve the adhesive strength between the metal frames 241-2 and 142-2 and the external electrodes 131 and 132 by disposing a conductive adhesive in the grooves 240a.

[0097] In one embodiment, the groove 240a may be disposed apart from the ends of the support portions 241a-2 and 242a-2 in the first direction and the third direction, but is not limited thereto. The groove 240a may be disposed so as to penetrate the metal frame and expose the external electrodes, and the conductive adhesive may be disposed on the surfaces of the exposed external electrodes. In this case, the groove 240a may occupy 50% or more of the area of ​​the external electrodes in the direction in contact with the metal frame to ensure sufficient adhesion between the metal frame and the capacitor.

[0098] 18 is a perspective view schematically illustrating a multilayer electronic component 2003 according to an embodiment of the present invention. First and second metal frames 241-3 and 242-3 of the multilayer electronic component 2003 according to the embodiment may include support portions 241a-3 and 242a-3 that contact the first and second external electrodes 131 and 132 of the plurality of capacitors 100, extension portions 241b-3 and 242b-3 that extend from the support portions in a first direction and are spaced apart from the body and the first and second external electrodes, and mounting portions 241c-3 and 242c-3 that extend from one end of the extension portions in a second direction.

[0099] In this case, the support portions 241a-3 and 242a-3 may include grooves 240a, and the extension portions 241b-3 and 242b-3 may include through-holes 240b. The through-holes 240b may be spaced apart from the first and third direction ends of the extension portions 241b-3 and 242b-3 and may be disposed to penetrate the extension portions. This makes it possible to effectively reduce heat and vibrations transmitted from the substrate while maintaining the strength of the metal frame.

[0100] 19 is a perspective view schematically illustrating a multilayer electronic component 3000 according to an embodiment of the present invention. Referring to FIG. 19, the multilayer electronic component 3000 according to the embodiment may include a capacitor array in which a plurality of capacitors 100 are stacked in a first direction, and may include first and second metal frames 341 and 342 disposed on first and second external electrodes.

[0101] The first and second metal frames 341 and 342 may include support portions 341a and 342a that contact the first and second external electrodes, extension portions 341b and 342b that extend in a third direction and are spaced apart from the main body 110 and the first and second external electrodes, and mounting portions 341c and 342c that extend in a second direction from one end of the extension portions 341b and 342b.

[0102] The support portions 341a and 342a may include grooves 340a, and the extension portions 341b and 342b may include through-holes 340b, thereby improving the adhesive strength between the external electrodes 131 and 132 and the metal frames 341 and 342, maintaining the strength of the metal frames, and effectively reducing heat and vibrations transmitted from the substrate through the metal frames 341 and 342.

[0103] Even if the multilayer electronic component 3000 includes a plurality of capacitors 100, the plurality of capacitors are stacked in the first direction, thereby minimizing the gap between the first and second metal frames 341 and 342. Furthermore, since each of the capacitors 100 has a structure in which the dimension W in the third direction is larger than the dimension L in the second direction, when the capacitors 100 are stacked in the first direction, the dimension in the third direction of the entire capacitor array including the plurality of capacitors 100 can be larger than the dimension in the second direction.

[0104] This maintains the effect of reducing the current path, reduces the equivalent series inductance of the multilayer electronic component 3000, and enables the multilayer electronic component 3000 to have a low impedance value at high frequencies. Also, by joining tens to hundreds of small-capacity capacitors 100, the multilayer electronic component 3000 can be thermally stable while improving its capacitance and reliability.

[0105] Meanwhile, a plurality of grooves 340a and through-holes 340b may be formed depending on the number of arranged capacitors 100. Therefore, in one embodiment, the support portions 341a and 342a may include a plurality of grooves, and the extension portions 341b and 342b may include a plurality of through-holes. This may improve the adhesive strength between the metal frames 341 and 342 and the capacitors 100, and may effectively suppress heat and vibrations transmitted from the substrate to the capacitor array.

[0106] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the appended claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0107] 1000, 1001, 1002, 1003, 1004, 2000, 3000: Multilayer electronic components 100: Capacitor 110:Main body 111: Dielectric layer 112, 113: Cover part 121, 122: Internal electrode 131, 132: External electrode 141, 142, 241, 242, 341, 342: Metal frame 141a, 142a, 241a, 242a, 341a, 342a: Support part 141b, 142b, 241b, 242b, 341b, 342b: Extension part 141c, 142c, 241c, 242c, 341c, 342c: Mounting section 140a, 240a, 340a: Groove 140b, 240b, 340b: Penetration

Claims

1. a capacitor including a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and facing each other in the third direction, and a first external electrode disposed on the third surface of the body and a second external electrode disposed on the fourth surface of the body; a first metal frame disposed on the first external electrode of the capacitor; a second metal frame disposed on the second external electrode of the capacitor; In a multilayer electronic component comprising: the first metal frame and the second metal frame include a support portion in contact with the first external electrode and the second external electrode, an extension portion extending from the support portion in the first direction and spaced apart from the body and the first external electrode and the second external electrode, and a mounting portion extending from one end of the extension portion in the second direction, a size of the first internal electrode and the second internal electrode in the third direction is greater than a distance between a support portion of the first metal frame and a support portion of the second metal frame in the second direction; a size of the extension portion in the third direction being smaller than a size of the support portion in the third direction; a size of the mounting portion in the third direction is substantially the same as a size of the extension portion in the third direction; the multilayer electronic component includes a plurality of the capacitors, The plurality of capacitors are stacked and arranged in the first direction, a size of the support portion in the first direction and a total size of the first external electrodes and the second external electrodes of the plurality of capacitors in the first direction are substantially the same along the third direction.

2. 2. The multilayer electronic component according to claim 1, wherein the size of said support portion in said third direction is larger than the sizes of said first internal electrode and said second internal electrode in said third direction.

3. 2. The multilayer electronic component according to claim 1, wherein W>L is satisfied, where L is the size of said capacitor in said second direction and W is the size of said capacitor in said third direction.

4. 2. The multilayer electronic component according to claim 1, wherein the size of the mounting portion in the third direction is substantially the same as the size of the extension portion in the third direction.

5. 2. The multilayer electronic component according to claim 1, wherein the first external electrode of the capacitor is disposed on the third surface and extends to a portion of at least one of the first surface and the second surface, and the second external electrode of the capacitor is disposed on the fourth surface and extends to a portion of at least one of the first surface and the second surface.

6. 2. The multilayer electronic component according to claim 1, wherein conductive adhesive portions are disposed between the first and second external electrodes of the capacitor and the first and second metal frames.

7. 2. The multilayer electronic component according to claim 1, wherein the first metal frame and the second metal frame further include a support portion extending from the support portion to a portion on at least one of the first surface, the second surface, the fifth surface, and the sixth surface.

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