Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing device and a substrate processing method which can prevent a processing liquid from dripping from a nozzle in such a state that a substrate processing device is not performing substrate processing.SOLUTION: A substrate processing device 100 includes a liquid feeding pipe 41, a supply pipe 43, a return pipe 44, a branch part 42, a first valve 47 and a second valve 48. The branch part 42 is a branch point of the liquid feeding pipe 41, the supply pipe 43 and the return pipe 44. The first valve 47 is provided in the liquid feeding pipe 41 and can adjust the flow rate of the processing liquid. The second valve 48 is provided in the return pipe 44. By turning the first valve 47 in the open state and turning the second valve 48 in the close state, the state becomes the discharge state of discharging the processing liquid from a chemical nozzle 21 by circulating the processing liquid from the liquid feeding pipe 41 to the supply pipe 43. By turning the second valve 48 from the close state to the open state, the state becomes the processing liquid return state of circulating the processing liquid to the return pipe 44 from the supply pipe 43.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in manufacturing processes of devices including substrates, such as semiconductor devices and liquid crystal display devices, substrate processing apparatuses are used to process substrates, such as semiconductor wafers or glass substrates for liquid crystal display devices.

[0003] Patent Document 1 discloses a single-wafer substrate processing apparatus that processes substrates one by one. The substrate processing apparatus described in Patent Document 1 includes a spin chuck and a processing liquid supply device. The spin chuck rotates the substrate. The processing liquid supply device supplies processing liquid to the substrate held by the spin chuck. The processing liquid supply device includes a nozzle, a supply pipe, and a valve. The nozzle ejects processing liquid toward the substrate. The supply pipe supplies processing liquid to the nozzle. The valve is provided on the supply pipe. The processing liquid is ejected from the nozzle and supplied to the substrate. The valve has a valve body and a valve seat. The valve is closed when the valve body comes into contact with the valve seat, and is opened when the valve body moves away from the valve seat. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-222189 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the substrate processing apparatus described in Patent Document 1, processing liquid sometimes remains between the valve and the nozzle after the valve is closed. In this case, the processing liquid remaining between the valve and the nozzle may drip from the nozzle when the substrate processing apparatus is not processing a substrate.

[0006] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can prevent processing liquid from dripping from a nozzle when the substrate processing apparatus is not processing a substrate. [Means for solving the problem]

[0007] A substrate processing apparatus according to a first aspect of the present invention processes a substrate by supplying a processing liquid to the substrate from a nozzle. The substrate processing apparatus includes a liquid delivery pipe, a supply pipe, a return pipe, a branching section, a first valve, and a second valve. The liquid delivery pipe guides the processing liquid. The supply pipe guides the processing liquid guided by the liquid delivery pipe to the nozzle. The return pipe guides the processing liquid guided by the liquid delivery pipe along a path different from that of the supply pipe. The branching section is a branching point of the liquid delivery pipe, the supply pipe, and the return pipe. The first valve is provided in the liquid delivery pipe and is capable of adjusting the flow rate of the processing liquid supplied from the liquid delivery pipe to the branching section. The second valve is provided in the return pipe. By opening the first valve and closing the second valve, the processing liquid flows from the liquid delivery pipe to the supply pipe, resulting in an ejection state in which the processing liquid is ejected from the nozzle. By changing the second valve from a closed state to an open state, a treatment liquid return state is established in which the treatment liquid flows from the supply pipe to the return pipe.

[0008] In the substrate processing apparatus according to the first aspect of the present invention, the first valve may be a valve that does not completely close the processing liquid flow path of the liquid supply pipe when in a closed state.

[0009] In the substrate processing apparatus according to the first aspect of the present invention, the flow paths through which the processing liquid passes may include a first flow path located on the liquid delivery pipe side of the branching portion, a second flow path located on the supply pipe side of the branching portion, and a third flow path located on the return pipe side of the branching portion. The first angle may be larger than the second angle. The second angle may be an angle formed by a first direction from the branching portion toward the first flow path and a second direction from the branching portion toward the second flow path. The first angle may be an angle formed by the first direction and a third direction from the branching portion toward the third flow path.

[0010] In the substrate processing apparatus according to the first aspect of the present invention, the first flow path and the third flow path may extend in a substantially horizontal direction from the branching portion, and the second flow path may extend upward from the branching portion.

[0011] The substrate processing apparatus according to the first aspect of the present invention may further include a storage tank that stores the processing liquid supplied from the return pipe, and a tip of the nozzle may be disposed at a position higher than an outlet of the return pipe.

[0012] In the substrate processing apparatus according to the first aspect of the present invention, the liquid delivery pipe and the supply pipe may not be provided with any valve other than the first valve.

[0013] The substrate processing apparatus according to the first aspect of the present invention may further include a control unit that controls the first valve and the second valve. The control unit may be capable of switching the opening degree of the first valve between at least a first opening degree and a second opening degree. The second opening degree may be smaller than the first opening degree. The control unit may set the opening degree of the first valve to the first opening degree and close the second valve to establish the discharge state. The control unit may also set the opening degree of the first valve to the second opening degree and open the second valve to establish the processing liquid return state.

[0014] In the substrate processing apparatus according to the first aspect of the present invention, the control unit may be capable of switching the aperture of the first valve to at least the first aperture, the second aperture, and a third aperture. The third aperture may be smaller than the second aperture. The control unit may change the aperture of the first valve from the second aperture to the third aperture and maintain the second valve in the open state, thereby establishing a discharge stop state in which a smaller amount of the processing liquid than in the discharge state is circulated from the liquid supply pipe to the return pipe. The first valve may be a valve that opens at the third opening degree in a closed state.

[0015] The substrate processing apparatus according to the first aspect of the present invention may further include a moving mechanism that moves the nozzle between a processing position and a retracted position. The processing position may be a position above the substrate. The retracted position may be a position separated from above the substrate. The control unit may control the moving mechanism. The control unit may be capable of switching an opening degree of the first valve among the first opening degree, the second opening degree, the third opening degree, and a fourth opening degree. The fourth opening degree may be smaller than the first opening degree and larger than the second opening degree. The control unit may, with the nozzle disposed at the retracted position, change the opening degree of the first valve from the third opening degree to the fourth opening degree and change the second valve from the open state to the closed state, thereby circulating the processing liquid from the liquid delivery pipe to the supply pipe and discharging the processing liquid from the nozzle. The control unit may, with the nozzle disposed at the retracted position, change the aperture of the first valve from the fourth aperture to the second aperture and change the second valve from the closed state to the open state, thereby establishing a preliminary-ejection-treatment-liquid-return state in which the treatment liquid flows from the supply pipe to the return pipe. The control unit may, before the treatment liquid inside the supply pipe is depleted in the preliminary-ejection-treatment-liquid-return state, move the nozzle from the retracted position to the treatment position, and change the aperture of the first valve from the second aperture to the first aperture and change the second valve from the open state to the closed state, thereby establishing the discharge state.

[0016] A substrate processing method according to a second aspect of the present invention is a substrate processing method for processing a substrate by supplying a processing liquid to the substrate from a nozzle. The substrate processing method according to the second aspect of the present invention includes the steps of opening a first valve provided on a processing liquid supply pipe and closing a second valve provided on a return pipe connected to the processing liquid supply pipe, thereby circulating the processing liquid from the processing liquid supply pipe to a supply pipe connected to the processing liquid supply pipe, the return pipe, and the nozzle, and discharging the processing liquid from the nozzle to process the substrate, and opening the second valve from the closed state to circulate the processing liquid from the supply pipe to the return pipe.

[0017] In the substrate processing method according to the second aspect of the present invention, the process may include a step of discharging the processing liquid from the nozzle by setting the opening degree of the first valve to a first opening degree and closing the second valve, and a step of circulating the processing liquid through the return pipe by setting the opening degree of the first valve to a second opening degree smaller than the first opening degree and opening the second valve.

[0018] The substrate processing method according to a second aspect of the present invention may further include a step of changing an opening degree of the first valve from the second opening degree to a third opening degree smaller than the second opening degree, and maintaining the second valve in the open state, thereby circulating the processing liquid from the liquid supply pipe to the return pipe in an amount smaller than that in the step of discharging the processing liquid from the nozzle. The first valve may be a valve that, in a closed state, does not completely close the treatment liquid flow path of the liquid supply pipe and opens at the third opening degree smaller than the second opening degree.

[0019] A substrate processing method according to a second aspect of the present invention may further include the steps of: changing an aperture of the first valve from the third aperture to a fourth aperture that is smaller than the first aperture and larger than the second aperture, and switching the second valve from the open state to the closed state, while the nozzle is disposed at a retracted position away from above the substrate, thereby circulating the processing liquid from the liquid delivery pipe to the supply pipe and discharging the processing liquid from the nozzle; changing an aperture of the first valve from the fourth aperture to the second aperture, and switching the second valve from the closed state to the open state, while the nozzle is disposed at the retracted position, thereby circulating the processing liquid from the supply pipe to the return pipe; and moving the nozzle from the retracted position to a processing position above the substrate before the processing liquid inside the supply pipe is exhausted, and discharging the processing liquid from the nozzle and processing the substrate, by changing an aperture of the first valve from the second aperture to the first aperture and switching the second valve from the open state to the closed state. [Effects of the Invention]

[0020] According to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method that can prevent processing liquid from dripping from a nozzle when the substrate processing apparatus is not processing a substrate. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a plan view schematically showing the configuration of a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a side view schematically showing the configuration of a processing unit. [Figure 3] FIG. 2 is a flowchart showing an example of processing performed on a substrate by the substrate processing apparatus. [Figure 4] FIG. 2 is a schematic diagram showing the configuration of a chemical liquid supply device. [Figure 5] FIG. 2 is a schematic diagram showing the configuration of the periphery of a supply mechanism. [Figure 6] FIG. [Figure 7]FIG. 4 is a schematic diagram showing the pressure of a chemical solution. [Figure 8] FIG. 10 is a schematic diagram showing a state in which the second valve is in a closed state. [Figure 9] FIG. 10 is a schematic diagram showing a state in which the second valve is in an open state. [Figure 10] 10 is a flowchart showing an example of an operation of the substrate processing apparatus in a chemical liquid supplying process for supplying a chemical liquid to a substrate. [Figure 11] 10 is a timing chart showing the opening degree of a first valve, the opening degree of a second valve, and the flow rate of the chemical liquid flowing through the chemical liquid nozzle in a chemical liquid supply process for supplying the chemical liquid to a substrate. FIG. [Figure 12] FIG. 10 is a flowchart showing an example of an operation in a chemical liquid supply process of the substrate processing apparatus according to the second embodiment. [Figure 13] FIG. 10 is a timing chart showing the opening degree of the first valve, the opening degree of the second valve, the flow rate of the chemical liquid flowing through the chemical liquid nozzle, and the position of the chemical liquid nozzle in a chemical liquid supply process in the substrate processing apparatus of the second embodiment. [Figure 14] FIG. 10 is a view showing a structure around an interposition member of a substrate processing apparatus according to a first modified example of the present invention. [Figure 15] FIG. 10 is a view showing a structure around a supply mechanism of a substrate processing apparatus according to a second modified example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the accompanying drawings, in which the same or corresponding parts are designated by the same reference numerals and will not be described repeatedly.

[0023] (First embodiment) A substrate processing apparatus 100 according to a first embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a plan view schematically showing the configuration of the substrate processing apparatus 100 according to the first embodiment of the present invention.

[0024] As shown in FIG. 1, the substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one by one.

[0025] The substrate W is, for example, a silicon wafer, a resin substrate, or a glass / quartz substrate. In this embodiment, a substantially disk-shaped semiconductor substrate is exemplified as the substrate W. However, the shape of the substrate W is not particularly limited. The substrate W may be formed, for example, in a rectangular shape.

[0026] The substrate processing apparatus 100 includes a plurality of load ports LP, a plurality of processing units 1, a storage unit 2, and a control unit 3.

[0027] The load port LP holds a substrate container C that accommodates a substrate W. The processing unit 1 processes the substrate W transferred from the load port LP with a processing fluid. The processing fluid refers to, for example, a processing liquid or a processing gas.

[0028] The storage unit 2 includes a main storage device (e.g., a semiconductor memory) such as a read-only memory (ROM) and a random access memory (RAM), and may further include an auxiliary storage device (e.g., a hard disk drive). The main storage device and / or the auxiliary storage device store various computer programs executed by the control unit 3.

[0029] The control unit 3 includes a processor such as a CPU (Central Processing Unit) and an MPU (Micro Processing Unit). The control unit 3 controls each element of the substrate processing apparatus 100.

[0030] The substrate processing apparatus 100 further includes a transport robot. The transport robot transports the substrate W between the load port LP and the processing unit 1. The transport robot includes an indexer robot IR and a center robot CR. The indexer robot IR transports the substrate W between the load port LP and the center robot CR. The center robot CR transports the substrate W between the indexer robot IR and the processing unit 1. The indexer robot IR and the center robot CR each include a hand that supports the substrate W.

[0031] The substrate processing apparatus 100 further includes a plurality of fluid boxes 4 and a chemical cabinet 5. The plurality of fluid boxes 4 and the processing unit 1 are disposed inside a housing 100a of the substrate processing apparatus 100. The chemical cabinet 5 is disposed outside the housing 100a of the substrate processing apparatus 100. The chemical cabinet 5 may be disposed on the side of the substrate processing apparatus 100. Alternatively, the chemical cabinet 5 may be disposed below (underground) a clean room in which the substrate processing apparatus 100 is installed.

[0032] The processing units 1 are stacked one above the other to form a tower TW. A plurality of towers TW are provided. The towers TW are arranged so as to surround the center robot CR in a plan view.

[0033] In this embodiment, three processing units 1 are stacked in the tower TW. Four towers TW are provided. The number of processing units 1 constituting the tower TW is not particularly limited. The number of towers TW is also not particularly limited.

[0034] The plurality of fluid boxes 4 correspond to the plurality of towers TW, respectively. The chemical liquid in the chemical liquid cabinet 5 is supplied to the tower TW corresponding to the fluid box 4 via the fluid box 4. As a result, the chemical liquid is supplied to all of the processing units 1 included in the tower TW.

[0035] The processing unit 1 will be described with reference to Fig. 2. Fig. 2 is a side view showing a schematic configuration of the processing unit 1.

[0036] As shown in FIG. 2, the processing unit 1 includes a chamber 6, a spin chuck 10, and a cup 14.

[0037] The chamber 6 includes a partition wall 8, a shutter 9, and an FFU 7 (fan filter unit). The partition wall 8 has a hollow shape. A transfer port is provided in the partition wall 8. The shutter 9 opens and closes the transfer port. The FFU 7 forms a downflow of clean air in the chamber 6. The clean air is air that has been filtered by a filter.

[0038] The center robot CR carries the substrate W into the chamber 6 through the transfer port, and carries the substrate W out of the chamber 6 through the transfer port.

[0039] The spin chuck 10 is disposed in the chamber 6. The spin chuck 10 holds the substrate W horizontally and rotates it about a rotation axis A1. The rotation axis A1 is a vertical imaginary axis that passes through the center of the substrate W.

[0040] The spin chuck 10 includes a plurality of chuck pins 11 , a spin base 12 , a spin motor 13 , a cup 14 , and a lifting unit 15 .

[0041] The spin base 12 is a disk-shaped member. A plurality of chuck pins 11 hold the substrate W in a horizontal position on the spin base 12. The spin motor 13 rotates the plurality of chuck pins 11, thereby rotating the substrate W around a rotation axis A1.

[0042] The spin chuck 10 of this embodiment is a clamping type chuck that brings multiple chuck pins 11 into contact with the outer peripheral surface of the substrate W. However, the present invention is not limited to this. The spin chuck 10 may also be a vacuum type chuck. A vacuum type chuck holds the substrate W horizontally by adsorbing the back surface (lower surface) of the substrate W, which is not the surface on which devices are formed, to the upper surface of the spin base 12.

[0043] The cup 14 receives the processing liquid discharged from the substrate W. The cup 14 includes an inclined portion 14a, a guide portion 14b, and a liquid receiving portion 14c. The inclined portion 14a is a cylindrical member extending obliquely upward toward the rotation axis A1. The inclined portion 14a includes an annular upper end having an inner diameter larger than the substrate W and the spin base 12. The upper end of the inclined portion 14a corresponds to the upper end of the cup 14. The upper end of the cup 14 surrounds the substrate W and the spin base 12 in a plan view. The guide portion 14b is a cylindrical member extending downward from the lower end (outer end) of the inclined portion 14a. The liquid receiving portion 14c is located below the guide portion 14b and forms an annular groove that opens upward.

[0044] The lifting unit 15 raises and lowers the cup 14 between an elevated position and a lowered position. When the cup 14 is in the elevated position, the upper end of the cup 14 is positioned above the spin chuck 10. When the cup 14 is in the lowered position, the upper end of the cup 14 is positioned below the spin chuck 10.

[0045] The cup 14 is in the raised position when the processing liquid is supplied to the substrate W. The processing liquid splashed outward from the substrate W is received by the inclined portion 14a and then guided by the guide portion 14b and collected in the liquid receiving portion 14c.

[0046] The processing unit 1 further includes a rinse liquid nozzle 16, a rinse liquid pipe 17, and a rinse liquid valve 18. The rinse liquid nozzle 16 ejects a rinse liquid toward the substrate W held on the spin chuck 10. The rinse liquid nozzle 16 is connected to the rinse liquid pipe 17. The rinse liquid pipe 17 is provided with the rinse liquid valve 18.

[0047] When the rinse liquid valve 18 is opened, the rinse liquid is supplied from the rinse liquid pipe 17 to the rinse liquid nozzle 16. Then, the rinse liquid is discharged from the rinse liquid nozzle 16. The rinse liquid is, for example, pure water (deionized water). The rinse liquid is not limited to pure water, and may be carbonated water, electrolytic ionized water, hydrogen water, ozone water, and / or diluted hydrochloric acid water. The diluted concentration is, for example, 10 ppm or more and 100 ppm or less.

[0048] The processing unit 1 further includes a chemical nozzle 21 and a nozzle moving unit 22. The chemical nozzle 21 discharges a chemical solution toward the substrate W held by the spin chuck 10. The nozzle moving unit 22 moves the chemical nozzle 21 between a processing position and a retracted position. The processing position indicates the position where the chemical nozzle 21 discharges the chemical solution toward the substrate W. The processing position is a position above the substrate W. The retracted position indicates a position where the chemical nozzle 21 is separated from the substrate W. The retracted position is a position separated from above the substrate W. The nozzle moving unit 22 moves the chemical nozzle 21 by, for example, rotating the chemical nozzle 21 about a swing axis A2. The swing axis A2 is a vertical imaginary axis located around the periphery of the cup 14. The chemical nozzle 21 is an example of a "nozzle" in the present invention. The nozzle moving unit 22 is an example of a "moving mechanism" in the present invention.

[0049] The substrate processing apparatus 100 further includes a chemical liquid supply device 30. The chemical liquid supply device 30 supplies a chemical liquid to the chemical liquid nozzle 21 of the processing unit 1. The chemical liquid supplied to the chemical liquid nozzle 21 includes, for example, isopropyl alcohol (IPA). The chemical liquid is an example of the "processing liquid" of the present invention.

[0050] An example of processing performed on a substrate W by the substrate processing apparatus 100 will be described with reference to Fig. 3. Fig. 3 is a flow chart showing an example of processing performed on a substrate W by the substrate processing apparatus 100.

[0051] 3, in step S1, the control unit 3 performs a transfer process for transferring the substrate W into the chamber 6. The procedure of the transfer process will be described below.

[0052] First, with the chemical nozzle 21 retracted from above the substrate W, the center robot CR supports the substrate W with its hand and moves the hand into the chamber 6. Then, the center robot CR places the substrate W supported by its hand on the spin chuck 10. As a result, the substrate W is transported onto the spin chuck 10.

[0053] When the substrate W is transferred onto the spin chuck 10, the chuck pins 11 grip the substrate W. Then, the spin motor 13 rotates the chuck pins 11. As a result, the substrate W rotates. Once the substrate W has rotated, the process proceeds to step S2.

[0054] In step S2, the control unit 3 performs a chemical liquid supplying process to supply a chemical liquid to the substrate W. The procedure of the chemical liquid supplying process will be described below.

[0055] First, nozzle moving unit 22 moves chemical liquid nozzle 21 to the processing position. Then, lifting unit 15 raises cup 14 to the raised position. Then, chemical liquid supply device 30 starts supplying the chemical liquid to chemical liquid nozzle 21. As a result, chemical liquid nozzle 21 discharges the chemical liquid toward substrate W.

[0056] The chemical liquid discharged from chemical liquid nozzle 21 lands on the upper surface of substrate W, and then flows outward from substrate W while following the upper surface of substrate W that is rotating. As a result, a liquid film of the chemical liquid is formed so as to cover the entire upper surface of substrate W. Note that while chemical liquid nozzle 21 is discharging the chemical liquid, nozzle moving unit 22 may keep chemical liquid nozzle 21 stationary or may scan it above substrate W.

[0057] When a predetermined time has elapsed since the start of supply of the chemical liquid to chemical liquid nozzle 21, the supply of the chemical liquid to chemical liquid nozzle 21 is stopped. Then, nozzle moving unit 22 moves chemical liquid nozzle 21 to the retracted position. When chemical liquid nozzle 21 reaches the retracted position, the process proceeds to step S3.

[0058] In step S3, the control unit 3 performs a rinse liquid supply process of supplying pure water, which is an example of a rinse liquid, to the substrate W. The procedure of the rinse liquid supply process will be described below.

[0059] First, the rinse liquid valve 18 is opened, and the rinse liquid nozzle 16 starts to discharge pure water. The pure water that has landed on the upper surface of the substrate W flows outward from the substrate W while following the upper surface of the substrate W that is rotating. The chemical liquid on the substrate W is washed away by the pure water discharged from the rinse liquid nozzle 16. As a result, a liquid film of pure water is formed over the entire upper surface of the substrate W.

[0060] When a predetermined time has elapsed since the rinsing liquid valve 18 was opened, the rinsing liquid valve 18 is closed to stop the discharge of the pure water onto the substrate W. When the discharge of the pure water onto the substrate W is stopped, the process proceeds to step S4.

[0061] In step S4, the control unit 3 performs a drying process to dry the substrate W by rotating the substrate W. The procedure of the drying process will be described below.

[0062] First, the spin motor 13 rotates the substrate W at a high speed (for example, several thousand rpm) that is higher than the rotation speed of the substrate W during the chemical liquid supply process and the rotation speed of the substrate W during the rinse liquid supply process. As a result, the liquid is removed from the substrate W, and the substrate W is dried.

[0063] When a predetermined time has elapsed since the high-speed rotation of the substrate W started, the spin motor 13 stops the rotation of the substrate W. When the rotation of the substrate W stops, the process proceeds to step S5.

[0064] In step S5, the control unit 3 performs an unloading process to unload the substrate W from the chamber 6. The procedure of the unloading process will be described below.

[0065] First, the lifting unit 15 lowers the cup 14 to the lower position. Then, the center robot CR moves its hand into the chamber 6. Then, the plurality of chuck pins 11 release the grip on the substrate W.

[0066] After the plurality of chuck pins 11 release the grip of the substrate W, the center robot CR supports the substrate W on the spin chuck 10 with its hand. Then, while supporting the substrate W with its hand, the center robot CR retracts the hand from the inside of the chamber 6. As a result, the processed substrate W is carried out of the chamber 6.

[0067] When the processed substrate W is unloaded from the chamber 6, the unloading process shown in step S5 is completed.

[0068] By repeating the processes shown in steps S1 to S5, the plurality of substrates W transferred to the substrate processing apparatus 100 are processed one by one.

[0069] Next, the chemical liquid supplying device 30 will be described with reference to Fig. 4. Fig. 4 is a schematic diagram showing the configuration of the chemical liquid supplying device 30.

[0070] A plurality of chemical liquid supply devices 30 are provided. The plurality of chemical liquid supply devices 30 correspond to the plurality of towers TW (see FIG. 1), respectively. Each chemical liquid supply device 30 supplies chemical liquids to all of the processing units 1 that constitute the corresponding tower TW.

[0071] In this embodiment, one tower TW is made up of three processing units 1. Therefore, one chemical liquid supply device 30 supplies chemical liquid to the three processing units 1.

[0072] As shown in FIG. 4, the chemical liquid supply device 30 includes a supply tank 31, a circulation pipe 32, a circulation pump 33, a circulation filter , and a circulation heater .

[0073] The supply tank 31 stores the chemical solution. The circulation pipe 32 is a tubular member. A circulation path is formed within the circulation pipe 32, through which the chemical solution circulates. The circulation pipe 32 has an upstream end 32a and a downstream end 32b. The circulation pipe 32 communicates with the supply tank 31. Specifically, the upstream end 32a and the downstream end 32b of the circulation pipe 32 communicate with the supply tank 31.

[0074] The circulation pump 33 sends the chemical liquid in the supply tank 31 to the circulation pipe 32. When the circulation pump 33 operates, the chemical liquid in the supply tank 31 is sent to the upstream end 32a of the circulation pipe 32. The chemical liquid sent to the upstream end 32a is transported inside the circulation pipe 32 and discharged from the downstream end 32b into the supply tank 31. As the circulation pump 33 continues to operate, the chemical liquid continues to flow inside the circulation pipe 32 from the upstream end 32a toward the downstream end 32b. As a result, the chemical liquid circulates through the circulation pipe 32.

[0075] The circulation filter 34 removes foreign matter such as particles from the chemical solution circulating through the circulation pipe 32. The circulation heater 35 adjusts the temperature of the chemical solution by heating the chemical solution. The circulation heater 35 maintains the temperature of the chemical solution at a constant temperature (e.g., 60°C) that is higher than room temperature, for example. The temperature of the chemical solution circulating through the circulation pipe 32 is maintained at a constant temperature by the circulation heater 35.

[0076] A circulation pump 33 , a circulation filter 34 , and a circulation heater 35 are installed in the circulation pipe 32 .

[0077] The supply tank 31 , the circulation pump 33 , the circulation filter 34 , and the circulation heater 35 are installed in the chemical cabinet 5 .

[0078] A pressure applying device may be provided instead of the circulation pump 33. The pressure applying device increases the air pressure in the supply tank 31, thereby sending the chemical liquid in the supply tank 31 to the circulation pipe 32.

[0079] The chemical liquid supply device 30 further includes a plurality of supply mechanisms 40. In this embodiment, three supply mechanisms 40 are provided.

[0080] Each of the plurality of supply mechanisms 40 is in communication with the circulation pipe 32. The chemical liquid circulating through the circulation pipe 32 is supplied to each of the plurality of supply mechanisms 40.

[0081] The plurality of supply mechanisms 40 correspond to the plurality of processing units 1. The supply mechanisms 40 supply chemicals to the corresponding processing units 1. The chemicals supplied to the processing units 1 are discharged from the chemical nozzles 21.

[0082] The chemical liquid supply device 30 further includes a recovery tank 51, a recovery pipe 52, a recovery pump 53, and a recovery filter 54. The recovery tank 51 is an example of the "storage tank" of the present invention.

[0083] The recovery tank 51 communicates with each of the plurality of supply mechanisms 40. The recovery tank 51 stores the chemical liquid that has passed through each of the plurality of supply mechanisms 40 without being discharged from the chemical liquid nozzle 21. A through-hole 51a is formed in the upper surface of the recovery tank 51. As a result, even if the chemical liquid and gas are recovered from the supply mechanism 40 to the recovery tank 51 in a mixed state, the gas can be discharged to the outside through the through-hole 51a. In other words, the recovery tank 51 functions as a gas-liquid separator that separates the gas from the liquid. This makes it possible to prevent the chemical liquid mixed with gas from being supplied from the recovery tank 51 to the supply tank 31.

[0084] The recovery pipe 52 is a tubular member. The recovery pipe 52 guides the chemical liquid in the recovery tank 51 to the supply tank 31. The recovery pipe 52 includes an upstream end 52a and a downstream end 52b. The upstream end 52a communicates with the recovery tank 51. The downstream end 52b communicates with the supply tank 31.

[0085] The recovery pump 53 is installed in the recovery pipe 52. The recovery pump 53 pumps the chemical liquid in the recovery tank 51 through the recovery pipe 52 to the supply tank 31. The recovery filter 54 is installed in the recovery pipe 52. The recovery filter 54 removes foreign matter from the chemical liquid flowing through the recovery pipe 52.

[0086] Next, the supply mechanism 40 will be described with reference to Fig. 5. Fig. 5 is a schematic diagram showing the configuration of the supply mechanism 40 and its surroundings.

[0087] 5, the supply mechanism 40 includes a liquid supply pipe 41, a branching portion 42, a supply pipe 43, and a return pipe 44. The liquid supply pipe 41, the supply pipe 43, and the return pipe 44 are connected to each other via the branching portion 42.

[0088] The liquid supply pipe 41 is a tubular member. The liquid supply pipe 41 guides the chemical liquid circulating through the circulation pipe 32 to the outside of the circulation pipe 32. The liquid supply pipe 41 includes an upstream end 41a and a downstream end 41b. The upstream end 41a is in communication with the circulation pipe 32.

[0089] Supply pipe 43 is a tubular member. Supply pipe 43 guides the chemical liquid guided by liquid delivery pipe 41 to chemical liquid nozzle 21. Supply pipe 43 includes upstream end 43a and downstream end 43b. Upstream end 43a communicates with downstream end 41b of liquid delivery pipe 41 via branch portion 42. Downstream end 43b communicates with chemical liquid nozzle 21.

[0090] The return pipe 44 is a tubular member. The return pipe 44 guides the processing liquid guided by the liquid supply pipe 41 along a path different from that of the supply pipe 43. In this embodiment, the return pipe 44 guides the chemical liquid to the recovery tank 51. The return pipe 44 includes an upstream end 44a and a downstream end 44b. The upstream end 44a communicates with the downstream end 41b of the liquid supply pipe 41 and the upstream end 43a of the supply pipe 43 via the branch portion 42. The downstream end 44b communicates with the recovery tank 51.

[0091] The supply mechanism 40 further includes a flow meter 45, an interposing member 46, a first valve 47, and a second valve 48.

[0092] The flow meter 45 detects the flow rate of the chemical liquid flowing through the liquid supply pipe 41. The flow meter 45 is installed in the liquid supply pipe 41. The flow rate of the chemical liquid, in detail, indicates the amount of the chemical liquid flowing through a predetermined position in the liquid supply pipe 41 per unit time.

[0093] The interposing member 46 is disposed at the branching portion 42. The interposing member 46 is a hollow member. The interposing member 46 is, for example, an ejector. The interposing member 46 is interposed between the liquid supply pipe 41, the supply pipe 43, and the return pipe 44. The liquid supply pipe 41, the supply pipe 43, and the return pipe 44 are connected to one another via the interposing member 46.

[0094] The first valve 47 is installed in the liquid supply pipe 41. In this embodiment, the first valve 47 is capable of adjusting the flow rate of the chemical liquid supplied from the liquid supply pipe 41 to the branch section 42. In other words, the first valve 47 is capable of adjusting the opening degree. The opening degree indicates the degree to which the first valve 47 is open. The smaller the opening degree of the first valve 47, the smaller the degree to which the first valve 47 is open.

[0095] The first valve 47 includes a drive source such as a motor, and changes its opening degree using the power of the drive source. The control unit 3 shown in FIG. 1 controls the opening degree of the first valve 47 by operating the drive source. The first valve 47 is, for example, a motor needle valve. However, the first valve 47 may be, for example, a valve other than a motor needle valve, such as a diaphragm valve.

[0096] The second valve 48 is installed in the return pipe 44. In this embodiment, the second valve 48 opens and closes the return pipe 44. The opening degree of the second valve 48 cannot be adjusted. In other words, the second valve 48 switches between allowing and preventing the passage of the chemical solution in the return pipe 44.

[0097] Next, the flow of the chemical liquid inside the chemical liquid supply device 30 will be described with reference to FIGS.

[0098] 4 and 5, the chemical liquid circulating through the circulation piping 32 flows from the circulation piping 32 into the liquid supply piping 41, and is guided by the liquid supply piping 41 to the branching section 42. The chemical liquid supplied from the branching section 42 to the supply piping 43 is discharged from the chemical liquid nozzle 21. The chemical liquid supplied from the branching section 42 to the return piping 44 is discharged from the return piping 44 to the recovery tank 51. The chemical liquid discharged to the recovery tank 51 is supplied to the supply tank 31 through the recovery piping 52. The chemical liquid supplied to the supply tank 31 circulates through the circulation piping 32.

[0099] Next, the interposing member 46 will be described with reference to Fig. 6. Fig. 6 is a cross-sectional end view of the interposing member 46.

[0100] 6, the interposing member 46 has a first member 46a, a second member 46b, and a third member 46c. The first member 46a, the second member 46b, and the third member 46c are hollow members that communicate with one another. The void where the first member 46a, the second member 46b, and the third member 46c communicate with one another constitutes the branching portion 42.

[0101] The first member 46a and the third member 46c protrude in opposite directions from the branching portion 42. The second member 46b protrudes from the branching portion 42 in a direction perpendicular to the first member 46a and the third member 46c. Note that in FIGS. 5 and 6, the first member 46a and the third member 46c are arranged to extend in the vertical direction (the direction along the X direction), but the first member 46a and the third member 46c may be arranged to extend in a direction other than the vertical direction (for example, a substantially horizontal direction).

[0102] The first member 46a has a first opening 4A. The first opening 4A connects the inside and outside of the first member 46a. A downstream end 41b of the liquid delivery pipe 41 is connected to the first opening 4A.

[0103] The second member 46b has a second opening 4B. The second opening 4B connects the inside and outside of the second member 46b. An upstream end 43a of the supply pipe 43 is connected to the second opening 4B.

[0104] The third member 46c has a third opening 4C. The third opening 4C connects the inside and outside of the third member 46c. The upstream end 44a of the return pipe 44 is connected to the third opening 4C.

[0105] The chemical liquid flowing through the liquid supply pipe 41 is supplied to the interior of the interposed member 46 through the first opening 4A. The chemical liquid inside the interposed member 46 is supplied to the supply pipe 43 through the second opening 4B. The chemical liquid inside the interposed member 46 is supplied to the return pipe 44 through the third opening 4C.

[0106] The flow path of the chemical liquid includes a branching section 42, a first flow path R1, a second flow path R2, and a third flow path R3. The branching section 42 is a branching point of the liquid delivery pipe 41, the supply pipe 43, and the return pipe 44. The first flow path R1 is a flow path of the chemical liquid located on the liquid delivery pipe 41 side with respect to the branching section 42. The first flow path R1 is located between the branching section 42 and the upstream end 41a of the liquid delivery pipe 41 (see FIG. 5). The second flow path R2 is a flow path of the chemical liquid located on the supply pipe 43 side with respect to the branching section 42. The second flow path R2 is located between the branching section 42 and the downstream end 43b of the supply pipe 43. The third flow path R3 is a flow path of the chemical liquid located on the return pipe 44 side with respect to the branching section 42. The third flow path R3 is located between the branching section 42 and the downstream end 44b of the return pipe 44.

[0107] The supply mechanism 40 further includes a throttle portion 46d. The throttle portion 46d is disposed in the first flow path R1. The throttle portion 46d functions as an orifice that narrows the flow path area of ​​the first flow path R1. The flow path area is the cross-sectional area of ​​the flow path of the chemical liquid perpendicular to the direction in which the chemical liquid flows.

[0108] In the present embodiment, the throttle portion 46d is formed in the first member 46a of the interposing member 46. The throttle portion 46d faces the branch portion 42. The throttle portion 46d sprays the chemical solution toward the branch portion 42. In the present embodiment, the throttle portion 46d is located near the branch portion 42. Therefore, the chemical solution flows into the branch portion 42 immediately after being sprayed from the throttle portion 46d.

[0109] 6 shows a first direction Q1, a second direction Q2, and a third direction Q3. The first direction Q1 indicates the direction from the branching portion 42 toward the first flow path R1. The second direction Q2 indicates the direction from the branching portion 42 toward the second flow path R2. The third direction Q3 indicates the direction from the branching portion 42 toward the third flow path R3.

[0110] FIG. 6 further shows a first angle θ1 and a second angle θ2. The first angle θ1 indicates the angle between the first direction Q1 and the third direction Q3. Specifically, the first angle θ1 indicates the smallest angle between the first direction Q1 and the third direction Q3. The second angle θ2 indicates the angle between the first direction Q1 and the second direction Q2. Specifically, the second angle θ2 indicates the smallest angle between the first direction Q1 and the second direction Q2.

[0111] The first angle θ1 is larger than the second angle θ2 (first angle θ1>second angle θ2). That is, the third flow path R3 is less curved with respect to the first flow path R1 than the second flow path R2. Therefore, the chemical solution flowing from the first flow path R1 to the branching portion 42 is mainly guided to the third flow path R3. In other words, the restricting portion 46d sprays the chemical solution toward the third flow path R3.

[0112] In this embodiment, the first angle θ1 is approximately 180 degrees, and the second angle θ2 is approximately 90 degrees.

[0113] The pressure of the chemical liquid will be described with reference to Fig. 7. Fig. 7 is a schematic diagram showing the pressure of the chemical liquid.

[0114] 7 shows a first pressure P1, a second pressure P2, and a third pressure P3. The first pressure P1 indicates the pressure of the liquid medicine located in a region of the first flow path R1 upstream of the throttle section 46d. The second pressure P2 indicates the pressure of the liquid medicine located in the branch section 42. The third pressure P3 indicates the pressure of the liquid medicine located in the second flow path R2.

[0115] 7 further shows a first movement direction X1 and a first movement speed V1. The first movement direction X1 indicates the movement direction of the chemical liquid flowing upstream of the throttle section 46d in the first flow path R1. The first movement speed V1 indicates the movement speed of the chemical liquid flowing upstream of the throttle section 46d in the first flow path R1.

[0116] 7 further shows a second movement direction X2 and a second movement speed V2. The second movement direction X2 indicates the movement direction of the chemical liquid when it flows from the first flow path R1 into the branching portion 42. The second movement direction X2 is the opposite direction to the first direction Q1 shown in FIG. 6. The second movement speed V2 indicates the movement speed of the chemical liquid when it flows from the first flow path R1 into the branching portion 42.

[0117] In this embodiment, when the chemical liquid ejected from the narrowed portion 46d flows from the first flow path R1 into the branch portion 42, it moves in the second moving direction X2 at the second moving speed V2.

[0118] 7, the flow path area of ​​the throttle section 46d is smaller than the flow path area upstream of the throttle section 46d. Therefore, according to Bernoulli's theorem, the flow velocity of the chemical solution increases and the pressure of the chemical solution decreases at the throttle section 46d compared to upstream of the throttle section 46d. As a result, the chemical solution is accelerated and decompressed at the throttle section 46d, and then ejected from the throttle section 46d.

[0119] The chemical solution is accelerated and decompressed in the throttle section 46d and then ejected from the throttle section 46d, so that the second movement speed V2 is greater than the first movement speed V1 (second movement speed V2>first movement speed V1), and the second pressure P2 is smaller than the first pressure P1 (second pressure P2<first pressure P1).

[0120] The first pressure P1 is changed by changing the aperture of the first valve 47 shown in Fig. 5. As the aperture of the first valve 47 decreases, the flow path area of ​​the first flow path R1 where the first valve 47 is located decreases. As a result, the flow rate of the chemical solution passing through the first valve 47 per unit time decreases, and the first pressure P1 decreases. Furthermore, as the first pressure P1 decreases, the second pressure P2 decreases.

[0121] 5 is changed between an open state and a closed state, the second pressure P2 is changed. When the second valve 48 is closed, the flow rate of the chemical liquid passing through the third flow path R3 becomes zero, and the second pressure P2 increases. On the other hand, when the second valve 48 is open, the flow rate of the chemical liquid passing through the third flow path R3 increases, and the second pressure P2 decreases.

[0122] The opening degree of the first valve 47 is adjusted and the open / close state of the second valve 48 is switched by the control unit 3 shown in FIG.

[0123] FIG. 7 shows a first diameter D1, a second diameter D2, a third diameter D3, a fourth diameter D4, and a fifth diameter D5. The first diameter D1 indicates the diameter of a portion of the first flow path R1 located upstream of the narrowed portion 46d. The second diameter D2 indicates the diameter of the narrowed portion 46d. The third diameter D3 indicates the diameter of a portion of the first flow path R1 located downstream of the narrowed portion 46d. The fourth diameter D4 indicates the diameter of the upstream portion of the third flow path R3. The upstream portion of the third flow path R3 indicates the vicinity of the branched portion 42 of the third flow path R3. The fifth diameter D5 indicates the diameter of the upstream portion of the second flow path R2. The upstream portion of the second flow path R2 indicates the vicinity of the branched portion 42 of the second flow path R2.

[0124] The first diameter D1 is larger than the second diameter D2 (first diameter D1 > second diameter D2). The third diameter D3 is larger than the second diameter D2 (third diameter D3 > second diameter D2). The fourth diameter D4 is larger than or equal to the third diameter D3 (fourth diameter D4 ≧ third diameter D3). The fourth diameter D4 is larger than or equal to the fifth diameter D5 (fourth diameter D4 ≧ fifth diameter D5). The size relationship between the fourth diameter D4 and the fifth diameter D5 is not particularly limited. The fourth diameter D4 may be smaller than the fifth diameter D5.

[0125] 7 to 9, the relationship between the opening degree of first valve 47, the open / closed state of second valve 48, and the amount of chemical solution discharged from chemical solution nozzle 21 will be described. Fig. 8 is a schematic diagram showing a state in which second valve 48 is closed. Fig. 9 is a schematic diagram showing a state in which second valve 48 is open.

[0126] 7 and 8, the control unit 3 closes the second valve 48 (see FIG. 5), causing the chemical liquid supplied from the first flow path R1 to the branching portion 42 to flow into the second flow path R2. In this embodiment, all of the chemical liquid supplied from the first flow path R1 to the branching portion 42 flows into the second flow path R2. The control unit 3 also adjusts the opening of the first valve 47, thereby adjusting the flow rate of the chemical liquid supplied from the first flow path R1 to the branching portion 42. This adjusts the amount of chemical liquid discharged from the chemical liquid nozzle 21.

[0127] On the other hand, as shown in Figures 7 and 9, the control unit 3 can adjust the pressure difference between the second pressure P2 and the third pressure P3 by adjusting the opening degree of the first valve 47 while keeping the second valve 48 (see Figure 5) in an open state.

[0128] For example, by making the second pressure P2 smaller than the third pressure P3, a pressure difference between the second pressure P2 and the third pressure P3 (second pressure P2<third pressure P3) generates a drawing force F1. The drawing force F1 represents a force that draws the chemical solution in the second flow path R2 into the branching portion 42. The larger the opening of the first valve 47, the larger the drawing force F1.

[0129] The generation of the retraction force F1 causes a suck-back. The suck-back indicates that all or part of the chemical liquid in the second flow path R2 is drawn into the branching portion 42 by the retraction force F1. As a result, the discharge of the chemical liquid from the chemical liquid nozzle 21 is stopped.

[0130] The chemical liquid that flows from the second flow path R2 to the branching portion 42 due to the suck back is caught in the flow X of the chemical liquid that is ejected from the throttle portion 46d, and is supplied to the third flow path R3 (aspiration effect). Then, the chemical liquid supplied to the third flow path R3 is supplied to the recovery tank 51.

[0131] It is also possible to maintain the retention end position Z of the chemical liquid at a constant position, for example, by maintaining the opening of first valve 47 at a predetermined value. In this case, the greater the opening of first valve 47, the higher the retention end position Z is maintained at. The higher retention end position Z, the closer retention end position Z is to branch section 42. The lower retention end position Z, the closer retention end position Z is to chemical liquid nozzle 21.

[0132] 5, in this embodiment, the tip of liquid chemical nozzle 21 is positioned higher than outlet 44c of downstream end 44b of return pipe 44. Therefore, by switching second valve 48 from a closed state to an open state, suck-back occurs due to the siphon principle. In other words, the liquid chemical in second flow path R2 is drawn into branching portion 42, and discharge of the liquid chemical from liquid chemical nozzle 21 is stopped.

[0133] In this embodiment, the tip of chemical liquid nozzle 21 is positioned higher than outlet 44c of return pipe 44, and therefore, by switching second valve 48 from a closed state to an open state, the chemical liquid in second flow path R2 is drawn into branch portion 42 regardless of the opening degree of first valve 47. Furthermore, the greater the opening degree of first valve 47, the faster the chemical liquid in second flow path R2 is drawn into branch portion 42.

[0134] In this embodiment, first valve 47 is a valve that does not completely close the processing liquid flow path (part of first flow path R1) of liquid supply pipe 41 when in a closed state. In other words, when first valve 47 is at a minimum opening, first valve 47 is not closed but is open. In this case, first valve 47 is slightly open. Therefore, during the period when the chemical liquid is not being discharged from chemical liquid nozzle 21, second valve 48 is opened, causing the chemical liquid supplied from first flow path R1 to branch portion 42 to flow into third flow path R3.

[0135] 5 to 9, by opening first valve 47 and closing second valve 48, a discharge state is established in which the chemical liquid flows from liquid delivery pipe 41 to supply pipe 43 and is discharged from chemical liquid nozzle 21. On the other hand, by opening second valve 48 from a closed state, a processing liquid return state is established in which the chemical liquid flows from supply pipe 43 to return pipe 44. Therefore, by opening second valve 48 from a closed state, it is possible to prevent the chemical liquid from dripping from chemical liquid nozzle 21 when substrate W is not being processed by substrate processing apparatus 100.

[0136] As described above, the first valve 47 does not completely close the processing liquid flow path (part of the first flow path R1) of the liquid supply pipe 41 when it is closed. Therefore, unlike a configuration in which the first valve 47 completely closes the flow path of the liquid supply pipe 41 when it is closed, the generation of particles at the first valve 47 due to the opening and closing operation of the first valve 47 can be suppressed. Specifically, for example, in a configuration in which the first valve is closed by bringing the valve body and the valve seat into contact with each other, particles are generated by the repeated contact and separation between the valve body and the valve seat. In this embodiment, the first valve 47 is a valve that does not completely close, and therefore the generation of particles at the first valve 47 due to the opening and closing operation of the first valve 47 can be suppressed. Since the generation of particles at the first valve 47 can be suppressed in this way, the discharge of particles from the chemical liquid nozzle 21 can be suppressed. Consequently, contamination of the substrate W can be suppressed.

[0137] Furthermore, in this embodiment, no valve that completely closes the flow path in a closed state is provided upstream of chemical liquid nozzle 21. In this embodiment, at least the flow path from chemical liquid nozzle 21 to circulation filter 34 is not provided with a valve that completely closes the flow path in a closed state. Furthermore, in this embodiment, no valves other than first valve 47 are provided in liquid delivery pipe 41 and supply pipe 43. Therefore, particles can be further prevented from being discharged from chemical liquid nozzle 21, and therefore contamination of substrate W can be further prevented.

[0138] 10 and 11, the operation of the substrate processing apparatus 100 in the chemical liquid supply process (step S2) for supplying the chemical liquid to the substrate W will be described in detail. Fig. 10 is a flow chart showing an example of the operation of the substrate processing apparatus 100 in the chemical liquid supply process (step S2) for supplying the chemical liquid to the substrate W. Fig. 11 is a timing chart showing the opening degree of the first valve 47, the opening degree of the second valve 48, and the flow rate of the chemical liquid flowing through the chemical liquid nozzle 21 in the chemical liquid supply process (step S2) for supplying the chemical liquid to the substrate W.

[0139] 10 and 11, in step S21, the substrate processing apparatus 100 is in a discharge stop state. The discharge stop state is a state in which the chemical liquid is not discharged from the chemical liquid nozzle 21. In the discharge stop state, the chemical liquid nozzle 21 is disposed at a retracted position. In addition, in the discharge stop state, the control unit 3 closes the first valve 47 (a third opening degree described later) and opens the second valve 48. In this embodiment, the first valve 47 is not completely closed.

[0140] Next, in step S22, control unit 3 moves chemical liquid nozzle 21 from the retracted position to the processing position.

[0141] Next, in step S23, the control unit 3 sets the opening degree of the first valve 47 to a first opening degree and closes the second valve 48. The first opening degree is the opening degree of the first valve 47 when supplying the processing liquid to the substrate W. The first opening degree is set appropriately depending on the processing conditions for the substrate W, such as the type of processing liquid and the film to be processed on the substrate W.

[0142] The opening degree of the first valve 47 is set to the first opening degree, and the second valve 48 is closed, so that the processing liquid is supplied from the chemical liquid nozzle 21 to the substrate W. In other words, the processing liquid is in a discharge state. After a predetermined processing time has elapsed, the process proceeds to step S24.

[0143] Next, in step S24, the control unit 3 opens the second valve 48 and changes the opening of the first valve 47 from the first opening to the second opening. As a result, as described above, a pulling force F1 is generated, causing suck-back. In other words, a processing liquid return state is created. Hereinafter, suck-back may be referred to as processing liquid return.

[0144] In this embodiment, the second opening is smaller than the first opening. The second opening is not particularly limited, but a smaller second opening is preferable because the chemical solution passing through first valve 47 is not discharged from chemical solution nozzle 21 in step S24. The second opening may be set to the same value as the first opening, but if second valve 48 is suddenly changed from a closed state to an open state while the second opening is large, air bubbles may be generated in supply pipe 43 due to a sudden suck-back. From this perspective, it is preferable to set the second opening smaller than the first opening. As described above, adjusting the second opening to adjust the retraction force F1 also makes it possible to maintain chemical solution retention end position Z at a predetermined position in supply pipe 43.

[0145] However, as described above, in this embodiment, the tip of chemical solution nozzle 21 is positioned higher than outlet 44c of downstream end 44b of return pipe 44, and therefore in step S24 the chemical solution in chemical solution nozzle 21 and supply pipe 43 is recovered into recovery tank 51 via branch 42 and return pipe 44. Furthermore, when the tip of chemical solution nozzle 21 is positioned higher than outlet 44c of return pipe 44, suckback occurs even if first valve 47 is closed.

[0146] Next, in step S25, the control unit 3 changes the opening degree of the first valve 47 from the second opening degree to a third opening degree while keeping the second valve 48 in an open state. The third opening degree is smaller than the second opening degree. The third opening degree is an opening degree that closes the first valve 47. In this embodiment, the third opening degree is an opening degree that does not completely close the liquid supply pipe 41.

[0147] Furthermore, in step S24 or step S25, control unit 3 moves liquid nozzle 21 from the discharge position to the retracted position. This stops discharge. Note that the timing for moving liquid nozzle 21 from the discharge position to the retracted position is not particularly limited as long as it occurs after the suck-back in step S24 occurs.

[0148] 10 and 11 , the substrate processing method of this embodiment includes a step (step S23) of opening first valve 47 and closing second valve 48 to cause the chemical liquid to flow from liquid delivery pipe 41 to supply pipe 43 and discharge the chemical liquid from chemical nozzle 21. The substrate processing method also includes a step (step S24) of changing second valve 48 from a closed state to an open state to cause the chemical liquid to flow from supply pipe 43 to return pipe 44. Therefore, by changing second valve 48 from a closed state to an open state, it is possible to prevent the chemical liquid from dripping from chemical nozzle 21 when substrate W is not being processed by substrate processing apparatus 100.

[0149] Furthermore, as described above, the step (step S24) of circulating the chemical solution through the return pipe 44 is executed by changing the second valve 48 from a closed state to an open state and changing the opening degree of the first valve 47 from the first opening degree to the second opening degree. Therefore, the suck-back can be performed appropriately. For example, it is possible to prevent air bubbles from being generated in the supply pipe 43 due to a sudden suck-back.

[0150] As described above, the substrate processing method of this embodiment also includes a step (step S25) of changing the opening degree of the first valve 47 from the second opening degree to the third opening degree and keeping the second valve 48 open, thereby causing a smaller amount of chemical liquid to flow from the liquid supply pipe 41 to the return pipe 44 than in the step (step S23) of discharging the chemical liquid. Therefore, when the chemical liquid is not being discharged onto the substrate W, it is possible to prevent the chemical liquid from flowing from the liquid supply pipe 41 to the return pipe 44 to the recovery tank 51.

[0151] In this embodiment, the second valve 48 is maintained in an open state except for the step of discharging the chemical liquid (step S23). Therefore, even if the first valve 47 cannot be maintained in a closed state due to a malfunction or the like, the chemical liquid that has passed through the first valve 47 can be recovered in the recovery tank 51 via the second valve 48 and the return pipe 44.

[0152] (Second embodiment) Next, with reference to FIGS. 12 and 13, the operation of the chemical liquid supply process (step S2) of the substrate processing apparatus 100 according to the second embodiment of the present invention will be described. In the second embodiment, unlike the chemical liquid supply process shown in FIGS. 10 and 11, an example will be described in which contamination of the supply pipe 43 and the chemical liquid nozzle 21 is reduced before the step of discharging the chemical liquid onto the substrate W (step S23). FIG. 12 is a flow chart showing an example of the operation of the chemical liquid supply process (step S2) of the substrate processing apparatus 100 according to the second embodiment. FIG. 13 is a timing chart showing the aperture of the first valve 47, the aperture of the second valve 48, the flow rate of the chemical liquid flowing through the chemical liquid nozzle 21, and the position of the chemical liquid nozzle 21 during the chemical liquid supply process (step S2) of the substrate processing apparatus 100 according to the second embodiment.

[0153] 12 and 13, in step S21, substrate processing apparatus 100 is in a discharge stop state, as in the first embodiment. The discharge stop state is a state in which no chemical liquid is discharged from chemical liquid nozzle 21. In the discharge stop state, chemical liquid nozzle 21 is positioned at the retracted position. In addition, in the discharge stop state, control unit 3 closes first valve 47 (third opening) and opens second valve 48. In this embodiment, first valve 47 is not completely closed.

[0154] Next, in step S211, the control unit 3 supplies the chemical liquid to the supply pipe 43 and the chemical liquid nozzle 21 and discharges (preliminary discharges) the chemical liquid from the chemical liquid nozzle 21. This allows the insides of the supply pipe 43 and the chemical liquid nozzle 21 to be filled with the chemical liquid, thereby cleaning the insides of the supply pipe 43 and the chemical liquid nozzle 21. Specifically, due to the above-described processing liquid return, gas within the chamber 6 flows into the insides of the supply pipe 43 and the chemical liquid nozzle 21. Therefore, the insides of the supply pipe 43 and the chemical liquid nozzle 21 may be contaminated by the gas that has flowed in. In this embodiment, by circulating the chemical liquid through the supply pipe 43 and the chemical liquid nozzle 21, the insides of the supply pipe 43 and the chemical liquid nozzle 21 can be cleaned. Therefore, in the subsequent chemical liquid discharge step (step S23), it is possible to prevent a contaminated chemical liquid from being discharged onto the substrate W.

[0155] In step S211, the control unit 3 changes the opening degree of the first valve 47 from the third opening degree to the fourth opening degree, and changes the second valve 48 from an open state to a closed state. This causes the chemical liquid to be supplied to the substrate W from the chemical liquid nozzle 21. In other words, a preliminary discharge state is entered. The fourth opening degree is smaller than the first opening degree and larger than the second opening degree. By making the fourth opening degree smaller than the first opening degree, consumption of the chemical liquid can be reduced by preliminary discharge. Note that the fourth opening degree may be, for example, the same as the first opening degree, or may be larger than the first opening degree.

[0156] Next, in step S212, the control unit 3 opens the second valve 48 and changes the aperture of the first valve 47 from the fourth aperture to the second aperture. This generates a pulling force F1, causing a suckback. In other words, a preliminary-ejection processing liquid return state is achieved. The aperture of the first valve 47 in step S212 may be smaller than the aperture of the first valve 47 in step S24. In other words, the aperture of the first valve 47 in step S212 may be set to a fifth aperture, which is smaller than the second aperture. In this case, the speed at which the chemical liquid inside the chemical liquid nozzle 21 and the supply pipe 43 returns to the branch portion 42 is slowed down.

[0157] Next, in step S22, control unit 3 moves chemical liquid nozzle 21 from the retracted position to the processing position. In this embodiment, control unit 3 moves chemical liquid nozzle 21 from the retracted position to the processing position before the chemical liquid inside supply pipe 43 runs out in the preliminary discharge processing liquid return state.

[0158] Next, in step S23, the control unit 3 changes the opening degree of the first valve 47 to the first opening degree and closes the second valve 48. In this embodiment, before the chemical liquid inside the supply pipe 43 runs out in the preliminary discharge processing liquid return state, the control unit 3 changes the opening degree of the first valve 47 from the second opening degree to the first opening degree and changes the second valve 48 from the open state to the closed state, thereby setting the discharge state.

[0159] Note that steps S24 and S25 in this embodiment are similar to steps S24 and S25 in the first embodiment, and therefore a description thereof will be omitted.

[0160] 12 and 13 , the substrate processing method of this embodiment includes steps (steps S22 and S23) of discharging the chemical liquid from chemical liquid nozzle 21 to process substrate W before the chemical liquid inside supply pipe 43 is depleted, by moving chemical liquid nozzle 21 from the retracted position to the processing position, changing the opening degree of first valve 47 from the second opening degree to the first opening degree, and changing second valve 48 from the open state to the closed state. Therefore, it is possible to prevent gas from flowing into the entire interior of supply pipe 43 and chemical liquid nozzle 21 during the period from the time of preliminary discharge until chemical liquid nozzle 21 is moved to the processing position and the chemical liquid is discharged from chemical liquid nozzle 21. This makes it possible to prevent the interior of supply pipe 43 and chemical liquid nozzle 21 from being contaminated by gas.

[0161] Other configurations, substrate processing methods, and effects of the second embodiment are similar to those of the first embodiment.

[0162] (First Modification) Next, a substrate processing apparatus 100 according to a first modified example of the present invention will be described with reference to Fig. 14. Fig. 14 is a diagram showing the structure around the interposition member 46 of the substrate processing apparatus 100 according to the first modified example of the present invention. In the first modified example, an example will be described in which the first flow path R1 and the third flow path R3 extend in a substantially horizontal direction from the branching portion 42.

[0163] 14, in the first modified example, first member 46a and third member 46c of interposing member 46 are disposed to extend in a substantially horizontal direction. Second member 46b is disposed to extend upward. In other words, first flow path R1 and third flow path R3 extend in a substantially horizontal direction from branching portion 42. Second flow path R2 extends upward from branching portion 42. Therefore, in the discharge-stopped state, the chemical solution in interposing member 46 can be prevented from flowing out into supply pipe 43, thereby further preventing the chemical solution from dripping from chemical solution nozzle 21. Note that when first flow path R1 and third flow path R3 extend in a substantially horizontal direction, second flow path R2 may extend downward.

[0164] (Second Modification) Next, a substrate processing apparatus 100 according to a second modified example of the present invention will be described with reference to Fig. 15. Fig. 15 is a diagram showing the structure of the periphery of a supply mechanism 40 of the substrate processing apparatus 100 according to the second modified example of the present invention. In the second modified example, an example will be described in which an intervening member 46 is not provided at a branching portion 42, which is a branching point of a liquid delivery pipe 41, a supply pipe 43, and a return pipe 44.

[0165] 15, in the second modified example, no interposition member 46 is provided at the branching section 42, which is the branching point of the liquid delivery pipe 41, the supply pipe 43, and the return pipe 44. Specifically, no restriction section 46d that restricts the flow path area of ​​the first flow path R1 is provided around the branching section 42. Even if no restriction section 46d is provided, the chemical liquid can be circulated from the supply pipe 43 to the return pipe 44, as described above.

[0166] Furthermore, in this second embodiment, the supply mechanism 40 includes an interposing member 146. Note that in a configuration in which the interposing member 46 is not provided in the branching portion 42, the interposing member 146 does not necessarily have to be provided.

[0167] Interposition member 146 has a first member 46a, a second member 46b, and a third member 46c. Interposition member 146 has the same configuration and function as interposition member 46, and therefore a detailed description of interposition member 146 will be omitted.

[0168] A return pipe 44 is connected to the second member 46b of the interposed member 146. Air, nitrogen gas, or the like flows into the first member 46a. The third member 46c is connected to the recovery tank 51 via a pipe. By adjusting the amount of air or nitrogen gas flowing into the first member 46a, it is possible to adjust the internal pressure after passing through the throttle section 46d (not shown). Therefore, the chemical solution in the second member 46b can be sucked toward the third member 46c, and the flow rate of the chemical solution passing through the return pipe 44 can be adjusted. As a result, the speed at which the chemical solution is returned from the chemical solution nozzle 21 and the supply pipe 43 to the branch section 42 can be adjusted.

[0169] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0170] Furthermore, the drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0171] In the above embodiment, the first valve 47 is a valve that does not completely close the flow path of the liquid supply pipe 41 when closed, but the present invention is not limited to this. The first valve 47 may be a valve that completely closes the flow path of the liquid supply pipe 41 when closed. In this case, however, it is preferable to use, for example, a motor needle valve, which has a relatively small contact area between the valve body and the valve seat.

[0172] In the above embodiment, the tip of chemical liquid nozzle 21 is positioned higher than outlet 44c of downstream end 44b of return pipe 44, but the present invention is not limited to this. The tip of chemical liquid nozzle 21 may be positioned at the same position as outlet 44c of downstream end 44b of return pipe 44, or at a lower position than outlet 44c. In this case, suck-back due to the siphon principle does not occur.

[0173] Furthermore, when the tip of the chemical liquid nozzle 21 is positioned at the same height as the discharge outlet 44c of the downstream end 44b of the return pipe 44, or at a position lower than the discharge outlet 44c, it is also possible to keep the stagnation end position Z at a predetermined position from the tip of the chemical liquid nozzle 21 to the upstream end 43a of the supply pipe 43 by adjusting the opening degree of the first valve 47.

[0174] Furthermore, in the above embodiment, an example has been described in which the opening degree of first valve 47 is adjustable, but the present invention is not limited to this, and the opening degree of first valve 47 does not have to be adjustable. In other words, first valve 47 may be changeable between two states: an open state and a closed state.

[0175] Furthermore, for example, in the second embodiment, an example has been described in which preliminary discharge is performed to clean the inside of supply pipe 43 and chemical nozzle 21 in order to prevent contaminated chemical from being discharged onto substrate W in the chemical discharge step (step S23), but the present invention is not limited to this. For example, branch portion 42 may be disposed near chemical nozzle 21 to shorten supply pipe 43. In this case, the amount of contamination inside supply pipe 43 can be reduced, thereby preventing substrate W from being contaminated by contaminated chemical.

[0176] Furthermore, in the above embodiment, an example was described in which a chemical liquid was used as the processing liquid, but the present invention is not limited to this. A rinse liquid may also be used as the processing liquid. [Industrial Applicability]

[0177] The present invention can be used in the fields of substrate processing apparatuses and substrate processing methods. [Explanation of symbols]

[0178] 3: Control section 21: Chemical nozzle (nozzle) 22: Nozzle moving unit (moving mechanism) 41: Liquid delivery piping 42: Branch 43: Supply piping 44: Return pipe 44c: Discharge port 47: First valve 48: Second valve 51: Recovery tank (storage tank) 100: Substrate processing apparatus Q1 :1st direction Q2 :Second direction Q3: The third direction R1: First flow path R2: Second flow path R3: Third flow path W: Substrate θ1: 1st angle θ2: 2nd angle

Claims

1. 1. A substrate processing apparatus for processing a substrate by supplying a processing liquid from a nozzle onto the substrate, a liquid supply pipe for guiding the treatment liquid; a supply pipe that guides the treatment liquid guided by the liquid delivery pipe to the nozzle; a return pipe that guides the treatment liquid guided by the liquid delivery pipe along a path different from the supply pipe; a branching portion where the liquid transfer pipe, the supply pipe, and the return pipe branch off; a first valve provided in the liquid supply pipe and capable of adjusting a flow rate of the treatment liquid supplied from the liquid supply pipe to the branch portion; a second valve provided in the return pipe; a control unit that controls the first valve and the second valve; Equipped with by opening the first valve and closing the second valve, the treatment liquid is caused to flow from the liquid delivery pipe to the supply pipe, and a discharge state is achieved in which the treatment liquid is discharged from the nozzle; By changing the second valve from a closed state to an open state, a treatment liquid return state is established in which the treatment liquid flows from the supply pipe to the return pipe, the control unit is capable of switching the opening degree of the first valve to at least a first opening degree, a second opening degree, and a third opening degree; the second opening degree is smaller than the first opening degree, and the third opening degree is smaller than the second opening degree; the first valve is a valve that, in a closed state, does not completely close a treatment liquid flow path of the liquid sending pipe and opens at the third opening degree, The control unit The opening degree of the first valve is set to the first opening degree, and the second valve is set to a closed state, thereby achieving the discharge state; The substrate processing apparatus is configured to set the processing liquid return state by setting the opening degree of the first valve to the second opening degree and opening the second valve.

2. The flow path through which the treatment liquid passes is a first flow path located on the liquid supply pipe side with respect to the branching portion; a second flow path located on the supply pipe side with respect to the branching portion; a third flow path located on the return pipe side with respect to the branching portion; and The first angle is greater than the second angle; the second angle is an angle between a first direction from the branch portion toward the first flow path and a second direction from the branch portion toward the second flow path, The substrate processing apparatus according to claim 1 , wherein the first angle is an angle formed between the first direction and a third direction from the branch portion toward the third flow path.

3. the first flow path and the third flow path extend from the branching portion in a substantially horizontal direction, The substrate processing apparatus according to claim 2 , wherein the second flow path extends upward from the branch portion.

4. a storage tank for storing the treatment liquid supplied from the return pipe; The substrate processing apparatus according to claim 1 , wherein a tip of the nozzle is disposed at a position higher than a discharge port of the return pipe.

5. The substrate processing apparatus according to claim 1 , wherein the liquid delivery pipe and the supply pipe are not provided with any valve other than the first valve.

6. The control unit changes the opening degree of the first valve from the second opening degree to the third opening degree and maintains the second valve in the open state, thereby bringing about a discharge stop state in which a smaller amount of the processing liquid than in the discharge state is circulated from the liquid supply pipe to the return pipe, in the substrate processing apparatus described in claim 5.

7. a movement mechanism that moves the nozzle between a processing position and a retracted position; the processing position is a position above the substrate; the retracted position is a position spaced apart from above the substrate, The control unit Controlling the moving mechanism the opening degree of the first valve is switchable among the first opening degree, the second opening degree, the third opening degree, and a fourth opening degree; the fourth opening degree is smaller than the first opening degree and larger than the second opening degree; The control unit with the nozzle disposed at the retracted position, changing the opening degree of the first valve from the third opening degree to the fourth opening degree and changing the second valve from the open state to the closed state, thereby causing the treatment liquid to flow from the liquid delivery pipe to the supply pipe, and creating a preliminary discharge state in which the treatment liquid is discharged from the nozzle; with the nozzle disposed at the retracted position, the opening degree of the first valve is changed from the fourth opening degree to the second opening degree, and the second valve is changed from the closed state to the open state, thereby creating a preliminary-ejection processing liquid return state in which the processing liquid is circulated from the supply pipe to the return pipe; 7. The substrate processing apparatus according to claim 6, wherein the ejection state is achieved by moving the nozzle from the retracted position to the processing position, changing the opening degree of the first valve from the second opening degree to the first opening degree, and changing the second valve from the open state to the closed state before the processing liquid inside the supply pipe is depleted in the preliminary ejection processing liquid return state.

8. 1. A substrate processing method for processing a substrate by supplying a processing liquid from a nozzle onto the substrate, comprising: a step of opening a first valve provided on a liquid supply pipe and closing a second valve provided on a return pipe connected to the liquid supply pipe, thereby causing the processing liquid to flow from the liquid supply pipe to a supply pipe connected to the liquid supply pipe, the return pipe, and the nozzle, and discharging the processing liquid from the nozzle to process the substrate; changing the second valve from the closed state to an open state, thereby allowing the processing liquid to flow from the supply pipe to the return pipe; Including, a step of discharging the processing liquid from the nozzle by setting the opening degree of the first valve to a first opening degree and closing the second valve; a step of setting the opening degree of the first valve to a second opening degree smaller than the first opening degree and opening the second valve to allow the treatment liquid to flow through the return pipe; The substrate processing method, wherein the first valve is a valve that, in a closed state, does not completely close the processing liquid flow path of the liquid supply pipe and opens at a third opening degree that is smaller than the second opening degree.

9. 9. The substrate processing method according to claim 8, further comprising the step of changing an opening degree of the first valve from the second opening degree to the third opening degree smaller than the second opening degree, and maintaining the second valve in the open state, thereby circulating the processing liquid from the liquid supply pipe to the return pipe in an amount smaller than that in the step of discharging the processing liquid from the nozzle.

10. a step of discharging the processing liquid from the nozzle by changing the opening degree of the first valve from the third opening degree to a fourth opening degree that is smaller than the first opening degree and larger than the second opening degree and changing the second valve from the open state to the closed state, while the nozzle is placed at a retracted position spaced apart from above the substrate; a step of circulating the treatment liquid from the supply pipe to the return pipe by changing the opening degree of the first valve from the fourth opening degree to the second opening degree and changing the second valve from the closed state to the open state while the nozzle is disposed at the retracted position; before the processing liquid inside the supply pipe is depleted, the nozzle is moved from the retracted position to a processing position above the substrate, and the opening degree of the first valve is changed from the second opening degree to the first opening degree, and the second valve is changed from the open state to the closed state, thereby discharging the processing liquid from the nozzle to process the substrate; The substrate processing method of claim 9 , further comprising:

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