Control equipment and control panels

Abstract

This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first heating element (40a) is mounted to a front surface (FS) of the main circuit board (40). The second heating element (40b) is mounted to a rear surface (RS) of the main circuit board (40). The structure (ST) has a first protruding part (42a) and a second protruding part (20a). The first heat dissipation sheet (41) is sandwiched between the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is sandwiched between the second heating element (40b) and the second protruding part (20a). The first heat dissipation sheet (41) is in contact with the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is in contact with the second heating element (40b) and the second protruding part (20a).

Description

[Technical Field]

[0001] The present disclosure relates to control devices and control panels. [Background technology]

[0002] Conventionally, modules equipped with heat dissipation substrates for dissipating heat generated by heat-generating components have been proposed. For example, Japanese Patent Laid-Open Publication No. 2010-3718 (Patent Document 1) describes a module equipped with a heat dissipation substrate. In the module described in this publication, multiple heat-generating components are arranged on one side of the heat dissipation substrate. The heat dissipation substrate sandwiches a circuit board with the inter-board connection terminals of the heat dissipation substrate bent. This allows the module to be made smaller, which in turn makes it possible to miniaturize the device into which the module is incorporated. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-3718 Summary of the Invention [Problem to be solved by the invention]

[0004] In the module described in the above publication, the circuit board is sandwiched between heat-generating components mounted on a heat dissipation board, and the circuit board is heated by the heat-generating components. This causes heat to build up inside the device in which the module is installed. Furthermore, because the heat dissipation board is folded, the projected area of ​​the module is small, but the depth of the module is large. This makes it difficult to make the device in which the module is installed thinner.

[0005] The present disclosure has been made in view of the above-mentioned problems, and its purpose is to provide a control device and a control panel that can achieve an efficient cooling configuration and a thin design. [Means for solving the problem]

[0006] The control device of the present disclosure includes a main circuit board, a first heat generating element, a second heat generating element, a structure, a first heat dissipation sheet, and a second heat dissipation sheet. The main circuit board has a front surface and a back surface. The first heat generating element is mounted on the front surface of the main circuit board. The second heat generating element is mounted on the back surface of the main circuit board. The structure has a first protrusion and a second protrusion. The first protrusion protrudes toward the first heat generating element. The second protrusion protrudes toward the second heat generating element. The first heat dissipation sheet is sandwiched between the first heat generating element and the first protrusion. The second heat dissipation sheet is sandwiched between the second heat generating element and the second protrusion. The first heat dissipation sheet is in contact with the first heat generating element and the first protrusion. The second heat dissipation sheet is in contact with the second heat generating element and the second protrusion. The structure includes a heat spreader, which faces the front surface of the main circuit board and has the first protrusion. The structure also includes a base metal member, which holds the main circuit board and the heat spreader, faces the back surface of the main circuit board, and has the second protrusion. [Effects of the Invention]

[0007] According to the control device and control panel of the present disclosure, it is possible to provide a control device that can achieve an efficient cooling configuration and a thin design. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view showing a schematic configuration of a control device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional perspective view taken along line II-II in FIG. [Figure 3] FIG. 2 is a cross-sectional perspective view taken along line III-III in FIG. [Figure 4] 1 is a perspective view schematically illustrating the internal configuration of a control device according to a first embodiment. [Figure 5] FIG. 5 is a cross-sectional perspective view taken along line VV in FIG. [Figure 6] FIG. 6 is an enlarged view of a portion VI in FIG. 5. [Figure 7] FIG. 7 is a cross-sectional perspective view taken along line VII-VII in FIG. 4. [Figure 8] FIG. 8 is an enlarged view of a portion VIII in FIG. 7. [Figure 9] FIG. 10 is a perspective view schematically illustrating the internal configuration of a control device according to a second embodiment. [Figure 10] FIG. 10 is a cross-sectional perspective view taken along line XX in FIG. 9. [Figure 11] FIG. 11 is an enlarged view of a portion XI in FIG. [Figure 12] FIG. 10 is a cross-sectional perspective view taken along line XII-XII in FIG. 9. [Figure 13] FIG. 13 is an enlarged view of a portion XIII in FIG. 12. [Figure 14] 10 is a cross-sectional perspective view schematically showing a state in which a control device according to a second embodiment is attached to a metal plate bracket member. FIG. [Figure 15] FIG. 15 is an enlarged view of a portion XV in FIG. 14. [Figure 16] FIG. 10 is a cross-sectional view showing a schematic configuration of a control panel according to a second embodiment. [Figure 17] FIG. 10 is a front view schematically showing the configuration of a control panel according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and their description will not be repeated. For convenience of drawing, cross sections are not hatched in the drawings.

[0010] Embodiment 1 The configuration of a control device 1000 according to a first embodiment will be described with reference to Figs. 1 to 8. As shown in Figs. 1 to 3, an air conditioning control device will be described as an example of the control device 1000 in the first embodiment. In the first embodiment, the control device 1000 is attached to a wall via a wall-mounting frame member (not shown). Fig. 1 is a perspective view showing the control device 1000 according to the first embodiment from the rear side. Fig. 2 is a perspective view of a vertical cross section at the center position of a first heat generating element 40a on a main circuit board 40. Fig. 3 is a perspective view of a vertical cross section at the center position of a second heat generating element 40b on a main circuit board 40. Arrows in Figs. 2 and 3 indicate the flow of air.

[0011] The control device 1000 according to the first embodiment mainly includes a housing member 8, a base metal member 20, a main circuit board 40, a first heat generating element 40a, a second heat generating element 40b, a first heat dissipation sheet 41, a second heat dissipation sheet 23, a heat spreader 42, and a housing cover member 60. In the first embodiment, the structure ST includes the base metal member 20 and the heat spreader 42.

[0012] The base sheet metal member 20, the main circuit board 40, the first heat generating element 40a, the second heat generating element 40b, the first heat dissipation sheet 41, the second heat dissipation sheet 23, and the heat spreader 42 are covered by a housing cover member. The housing member 8 is disposed on the front side of the control device 1000. The housing cover member 60 is disposed on the rear side of the control device 1000. The housing cover member 60 is fixed to the housing member 8.

[0013] A display device 1 is mounted on the front surface of the control device 1000. The display device 1 is fixed to a housing cover member 60. The display device 1 constitutes an operation unit. The display device 1 is equipped with a touch panel (not shown).

[0014] The housing cover member 60 is provided with a plurality of intake slits 60c and a plurality of exhaust slits 60d. The plurality of intake slits 60c and the plurality of exhaust slits 60d are provided to penetrate the wall surface on the rear side of the housing cover member 60. The plurality of intake slits 60c are for drawing air from the outside to the inside of the housing cover member 60. The plurality of exhaust slits 60d are for exhausting air from the inside of the housing cover member 60 to the outside. The plurality of intake slits 60c are provided in the lower part of the housing cover member 60. The plurality of exhaust slits 60d are provided in the upper part of the housing cover member 60.

[0015] The main circuit board 40 has a front surface FS and a back surface RS. A first heating element 40a is mounted on the front surface FS of the main circuit board 40. The first heating element 40a is, for example, a CPU (Central Processing Unit). A second heating element 40b is mounted on the back surface RS of the main circuit board 40. The second heating element 40b is, for example, a PMIC (Power Management Integrated Circuit: power supply type IC). In other words, heating elements are mounted on both sides of the main circuit board 40. Note that the first heating element 40a is thermally more severe (generates more heat) than the second heating element 40b, and therefore requires more heat dissipation than the second heating element 40b.

[0016] The first heat-generating element 40a, the second heat-generating element 40b, the first heat-dissipating sheet 41, and the second heat-dissipating sheet 23 are arranged between the main circuit board 40 and the base metal sheet member 20 and the heat spreader 42. The first heat-dissipating sheet 41 and the second heat-dissipating sheet 23 are, for example, silicone-based heat-dissipating sheets. The main circuit board 40, the base metal sheet member 20, and the heat spreader 42 are configured to allow air to flow from the multiple air intake slits 60c through the spaces between the main circuit board 40, the base metal sheet member 20, and the heat spreader 42 to the multiple air exhaust slits 60d.

[0017] FIG. 4 is a perspective view showing a state in which the housing cover member 60 has been removed from the housing member 8. As shown in FIGS. 2 to 4, a base sheet metal member 20 is disposed on the rear side of the display device 1. The base sheet metal member 20 is made of, for example, a zinc-plated steel plate (iron-based) material. A sheet metal case member 30 is fixed to the rear side of the base sheet metal member 20 with screws 403. A power supply board 33 is fixed to the sheet metal case member 30. A main circuit board 40 is disposed on the rear side of the base sheet metal member 20. The base sheet metal member 20 holds the main circuit board 40. The base sheet metal member 20 holds a heat spreader 42. The heat spreader 42 is made of, for example, aluminum. In other words, since the first heat generating element 40a is thermally more severe than the second heat generating element 40b, the heat spreader 42 is made of a material with better heat dissipation properties than the base sheet metal member 20. Furthermore, the heat spreader 42 is advantageous for heat dissipation because it is made of a plate material that is thicker than the base sheet metal member 20. The base sheet metal member 20 faces the rear surface RS of the main circuit board 40.

[0018] A heat spreader 42 is disposed on the rear side of the main circuit board 40. The heat spreader 42 faces the front surface FS of the main circuit board 40. A transmission system board 51 is fixed to the rear side of the heat spreader 42 with screws 404. The heat spreader 42 is fixed to the base sheet metal member 20 with the screws 404 that pass through holes provided in the main circuit board 40.

[0019] FIG. 5 is a vertical cross-sectional perspective view taken at the center of the first heat-generating element 40a. FIG. 6 is an enlarged view of the periphery of the first heat-generating element 40a in FIG. 5. As shown in FIGS. 2, 5, and 6, the heat spreader 42 has a first protrusion 42a. The first protrusion 42a protrudes toward the first heat-generating element 40a. The first protrusion 42a has a tapered shape. The first heat-dissipating sheet 41 contacts the underside of the first protrusion 42a. The first heat-dissipating sheet 41 is sandwiched between the first heat-generating element 40a and the first protrusion 42a. A through-hole is provided on the surface of the first protrusion 42a where the first heat-dissipating sheet 41 is placed. This through-hole is provided to ensure that the first heat-dissipating sheet 41 is reliably positioned in a predetermined position when the main circuit board 40 and the heat spreader 42 are assembled. The first heat-dissipating sheet 41 contacts the first heat-generating element 40a and the first protrusion 42a. The first heat dissipation sheet 41 has a thermal conductivity greater than that of air. When the heat spreader 42 is fixed with the screws 404, the first protrusions 42a come into contact with the first heat dissipation sheet 41, causing half of the thickness of the first heat dissipation sheet 41 to be crushed. Bosses with screw holes are provided around the first protrusions 42a. In particular, a pair of bosses are provided to sandwich the first protrusions 42a. The height of the bosses is greater than the height of the first protrusions 42a and less than the height of the first protrusions 42a and the height of the first heat dissipation sheet 41 before being crushed. By screwing the screws into the bosses, the distance between the main circuit board 40 and the first protrusions 42a decreases, resulting in the first heat dissipation sheet 41 being crushed, allowing reliable contact to be maintained.

[0020] FIG. 7 is a vertical cross-sectional perspective view taken at the center of the second heat-generating element 40b. FIG. 8 is an enlarged view of the periphery of the second heat-generating element 40b in FIG. 7. As shown in FIGS. 3, 7, and 8, the base sheet metal member 20 has a second protrusion 20a. The second protrusion 20a protrudes toward the second heat-generating element 40b. The second protrusion 20a has a tapered shape. A second heat-dissipating sheet 23 contacts the upper surface of the second protrusion 20a. The second heat-dissipating sheet 23 is sandwiched between the second heat-generating element 40b and the second protrusion 20a. A through-hole is provided on the surface of the second protrusion 20a where the second heat-dissipating sheet 23 is placed. This through-hole is provided to ensure that the second heat-dissipating sheet 23 is reliably positioned in a predetermined position when the main circuit board 40 and the base sheet metal member 20 are assembled. The second heat-dissipating sheet 23 contacts the second heat-generating element 40b and the second protrusion 20a. The first heat dissipation sheet 41 has a thermal conductivity greater than that of air. When the main circuit board 40 is fixed to the base metal member 20, the second protrusions 20a come into contact with the second heat dissipation sheet 23, causing half of the second heat dissipation sheet to be crushed. Bosses with screw holes are provided around the second protrusions 20a. In particular, a pair of bosses are provided to sandwich the second protrusions 20a. The height of the bosses is greater than the height of the second protrusions 20a and less than the height of the second protrusions 20a and the height of the second heat dissipation sheet 23 before being crushed. By screwing the screws into the bosses, the distance between the main circuit board 40 and the second protrusions 20a is reduced, resulting in the second heat dissipation sheet 23 being crushed, allowing reliable contact to be maintained.

[0021] A fire-prevention partition sheet metal member 22 is fixed to the base sheet metal member 20. A bent portion 42d is provided on the heat spreader 42. When the control device 1000 is installed on a wall, the bent portion 42d is located at the upper end of the main circuit board 40.

[0022] Electrical components such as connectors that are connected to the power supply board 33 and subjected to high voltages are mounted on the main circuit board 40. There is a risk of tracking (ignition) occurring from these mounted components. If tracking (ignition) occurs from a connector or the like mounted on the main circuit board 40, the bent portion 42d functions as a fire wall that confines the fire. The fire partition metal member 22 is located on the back side of the main circuit board 40 and also functions as a fire wall.

[0023] A leaf spring component 40c is mounted on the main circuit board 40. When the heat spreader 42 is fixed to the base sheet metal member 20, the leaf spring component 40c comes into contact with the surface of the heat spreader 42 facing the main circuit board 40 and is pressed against the heat spreader 42. This reduces the height dimension of the leaf spring component 40c. The contact of the leaf spring component 40c with the surface facing the heat spreader 42 strengthens the ground connection of the main circuit board 40 and reduces noise radiation generated by the electrical components mounted on the main circuit board 40. Because the heat spreader 42 itself partially covers the main circuit board 40, the heat spreader 42 also functions as a shield against noise radiation.

[0024] Next, the air flow and heat dissipation of the control device 1000 according to the first embodiment will be described with reference to FIGS.

[0025] As shown in FIG. 2, when the control device 1000 is installed on a wall, air enters the control device 1000 through the multiple air intake slits 60c, rises through the gap between the main circuit board 40 and the heat spreader 42, and is released to the outside of the control device 1000 through the multiple air exhaust slits 60d. Heat generated by the first heating element 40a is transferred to the first protrusion 42a via the first heat dissipation sheet 41 and diffused to the heat spreader 42. The heat diffused to the heat spreader 42 is dissipated to the outside of the control device 1000 by the air flow. Air blowing against the first protrusion 42a enhances heat dissipation. The tapered side of the first protrusion 42a is positioned approximately perpendicular to the wind direction. Air impinging on the tapered side of the first protrusion 42a removes the heat from the first heating element 40a that was transferred to the first protrusion 42a via the first heat dissipation sheet 41.

[0026] The first protrusion 42a includes a lower surface on which the first heat dissipation sheet 41 is disposed, and at least two first side surfaces that connect the lower surface to the main surface of the heat spreader 42. One of the at least two first side surfaces is disposed approximately perpendicular to the direction of the airflow passing through the gap between the main circuit board 40 and the heat spreader 42.

[0027] One of the at least two first side surfaces has a first side connected to the bottom surface, a second side connected to the main surface of the heat spreader 42, and a third side connected to the first and second sides and connected to the other of the at least two first side surfaces. The second side is longer than the first side.

[0028] As shown in FIG. 3, air enters the control device 1000 through the multiple intake slits 60c, rises through the gap between the main circuit board 40 and the base metal member 20, and is released to the outside of the control device 1000 through the multiple exhaust slits 60d. Heat generated by the second heating element 40b is transferred to the second protrusion 20a via the second heat dissipation sheet 23 and diffused to the base metal member 20. The heat diffused to the base metal member 20 is dissipated to the outside of the control device 1000 by the air flow. Air blowing against the second protrusion 20a improves heat dissipation. The tapered side of the second protrusion 20a is positioned approximately perpendicular to the wind direction. Air impinging on the tapered side of the second protrusion 20a removes the heat from the second heating element 40b that was transferred to the second protrusion 20a via the second heat dissipation sheet 23.

[0029] The second protrusion 20a includes an upper surface on which the second heat dissipation sheet 23 is disposed, and at least two second side surfaces that connect the upper surface to the main surface of the base sheet metal member 20. One of the at least two second side surfaces is disposed approximately perpendicular to the direction of the airflow passing through the gap between the main circuit board 40 and the heat spreader 42.

[0030] One of the at least two second side surfaces has a fourth side connected to the top surface, a fifth side connected to the main surface of the base sheet metal member 20, and a sixth side connected to the fourth and fifth sides and connected to the other of the at least two second side surfaces. The fifth side is longer than the fourth side.

[0031] The gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base metal sheet member 20. The height of the first protrusion 42a is lower than the height of the second protrusion 20a. When the same amount of wind enters each gap, the gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base metal sheet member 20, so the wind speed in the gap between the main circuit board 40 and the heat spreader 42 is faster than the wind speed in the gap between the main circuit board 40 and the base metal sheet member 20. This makes it possible to improve heat dissipation on the side of the first heating element 40a, which is thermally more severe.

[0032] Next, the effects of control device 1000 according to the first embodiment will be described. In the control device 1000 according to the first embodiment, the first heat dissipation sheet 41 contacts the first heat generating element 40a and the first protrusion 42a, and the second heat dissipation sheet 23 contacts the second heat generating element 40b and the second protrusion 20a. Therefore, heat generated by the first heat generating element 40a is transferred to the first protrusion 42a via the first heat dissipation sheet 41, and heat generated by the second heat generating element 40b is transferred to the second protrusion 20a via the second heat dissipation sheet 23. This prevents heat from building up inside the control device 1000. This allows for an efficient cooling configuration. Furthermore, the first heat generating element 40a is mounted on the front surface FS of the main circuit board 40, and the second heat generating element 40b is mounted on the rear surface RS of the main circuit board 40. This allows for a thinner design compared to when the main circuit board 40 is folded. Therefore, the control device 1000 can be provided with an efficient cooling configuration and a thinner design.

[0033] According to control device 1000 of the first embodiment, main circuit board 40 and structure ST are configured to allow air to flow from the plurality of air intake slits 60c between main circuit board 40 and structure ST to the plurality of air exhaust slits 60d. Therefore, heat dissipated from first heat generating element 40a to first protrusion 42a via first heat dissipation sheet 41 and heat dissipated from second heat generating element 40b to second protrusion 20a via second heat dissipation sheet 23 can be cooled by air flowing from the plurality of air intake slits 60c between main circuit board 40 and structure ST to the plurality of air exhaust slits 60d.

[0034] Furthermore, in the control device 1000 according to the first embodiment, the control device 1000 is not molded with molding resin, and therefore air can flow inside the control device 1000. This can improve the cooling efficiency.

[0035] According to the control device 1000 of the first embodiment, the structure ST includes the heat spreader 42. The heat spreader 42 faces the front surface FS of the main circuit board 40 and has a first protrusion 42a. Therefore, the heat spreader 42 can be used to diffuse heat.

[0036] According to the control device 1000 of the first embodiment, the structure ST includes the base sheet metal member 20. The base sheet metal member 20 holds the main circuit board 40 and the heat spreader 42, faces the rear surface RS of the main circuit board 40, and has the second protrusion 20a. Therefore, the base sheet metal member 20 can be used to diffuse heat.

[0037] According to the control device 1000 of the first embodiment, the gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base sheet metal member 20. Therefore, by changing the wind speeds flowing through the gap between the main circuit board 40 and the heat spreader 42 and the gap between the main circuit board 40 and the base sheet metal member 20, the first heat generating element 40a and the second heat generating element 40b can be effectively cooled. This makes it possible to improve the heat dissipation performance of the first heat generating element 40a, which is thermally more severe.

[0038] According to control device 1000 of embodiment 1, first protrusion 42a has a height less than that of second protrusion 20a. Therefore, the gap between main circuit board 40 and heat spreader 42 can be made narrower than the gap between main circuit board 40 and base metal member 20.

[0039] According to control device 1000 of embodiment 1, one of the at least two first side surfaces is arranged substantially perpendicular to the direction of airflow passing through the gap between main circuit board 40 and heat spreader 42. Furthermore, one of the at least two second side surfaces is arranged substantially perpendicular to the direction of airflow passing through the gap between main circuit board 40 and heat spreader 42. This allows first heat generating element 40a and second heat generating element 40b to be cooled effectively.

[0040] According to control device 1000 of embodiment 1, the second side of first protrusion 42a is longer than the first side. Also, the fifth side of second protrusion 20a is longer than the fourth side of second protrusion 42a. This allows first protrusion 42a and second protrusion 20a to have a tapered shape.

[0041] In air conditioning control devices that are installed on a wall, there are often space constraints inside the wall, and therefore a need exists for thinner devices. Control device 1000 according to the first embodiment faces main circuit board 40 on which multiple heat-generating components are mounted, and can diffuse heat generated by the heat-generating components to structure ST that has various other functions. In addition, air can be efficiently circulated over the surface of structure ST. Therefore, when control device 1000 according to the first embodiment is applied to air conditioning control devices, a thinner air conditioning control device can be achieved.

[0042] Embodiment 2 Unless otherwise specified, the control device according to the second embodiment has the same configuration, operation, and effects as the control device according to the first embodiment.

[0043] The configuration of a control device 1000 according to the second embodiment will be described with reference to Figs. 9 to 13. Fig. 9 is a perspective view showing a state in which a housing cover member 60 (see Fig. 14) has been removed from a sheet-metal outer casing 200. As shown in Fig. 9, the control device 1000 according to the second embodiment includes the sheet-metal outer casing 200. In the second embodiment, a structure ST includes the sheet-metal outer casing 200. The sheet-metal outer casing 200 is arranged on the front side of the control device 1000. The sheet-metal outer casing 200 does not have a display device. The sheet-metal outer casing 200 holds a main circuit board 40. The main circuit board 40, a heat spreader 42, a transmission system board 51, a power supply system board 33, and a sheet-metal outer casing member 30 are fixed to the sheet-metal outer casing 200. A housing cover member 60 is attached to the sheet-metal outer casing 200 (see Fig. 14).

[0044] FIG. 10 is a vertical cross-sectional perspective view taken at the center of the first heating element 40a. FIG. 11 is an enlarged view of the periphery of the first heating element 40a in FIG. 10. As shown in FIGS. 10 and 11, the heat spreader 42 faces the front surface FS of the main circuit board 40. The heat spreader 42 has a first protrusion 42a. The first protrusion 42a protrudes toward the first heating element 40a. The first heat dissipation sheet 41 is sandwiched between the first heating element 40a and the first protrusion 42a. The first heat dissipation sheet 41 is in contact with the first heating element 40a and the first protrusion 42a. Heat generated by the first heating element 40a is conducted to the first protrusion 42a of the heat spreader 42 via the first heat dissipation sheet 41 and is diffused across the surface of the heat spreader 42.

[0045] FIG. 12 is a vertical cross-sectional perspective view taken at the center of the second heating element 40b. FIG. 13 is an enlarged view of the periphery of the second heating element 40b in FIG. 12. As shown in FIGS. 12 and 13, the sheet metal outer casing 200 faces the rear surface RS of the main circuit board 40. The sheet metal outer casing 200 has a second protrusion 20a. The second protrusion 20a protrudes toward the second heating element 40b. The second heat dissipation sheet 23 is sandwiched between the second heating element 40b and the second protrusion 20a. The second heat dissipation sheet 23 is in contact with the second heating element 40b and the second protrusion 20a. Heat generated by the second heating element 40b is conducted to the second protrusion 20a of the sheet metal outer casing 200 via the second heat dissipation sheet 23 and is diffused over the surface of the sheet metal outer casing 200.

[0046] 14 and 15, a state in which controller 1000 according to the second embodiment is attached to plate bracket member 120 will be described.

[0047] Fig. 14 is a vertical cross-sectional perspective view at the center of the second heat generating element 40b with the sheet metal outer casing 200 attached to the sheet metal bracket member 120. Fig. 15 is an enlarged view of the periphery of the second heat generating element 40b. The arrows in Figs. 14 and 15 indicate the flow of heat. As shown in Figs. 14 and 15, the sheet metal outer casing 200 is attached to the sheet metal bracket member 120. The sheet metal bracket member 120 is fixed to a metal wall material 3000a (see Fig. 16) of the control panel 3000 with screws 501.

[0048] The heat generated by the second heating element 40b is transferred to the second protrusion 20a of the sheet metal outer casing 200 via the second heat dissipation sheet 23, and is diffused into the sheet metal outer casing 200. The heat transferred downward is transferred to the surface of the sheet metal bracket member 120 via the contact portion between the sheet metal outer casing 200 and the sheet metal bracket member 120.

[0049] A state in which control device 1000 according to the second embodiment is installed on control panel 3000 will be described with reference to FIGS.

[0050] FIG. 16 is a cross-sectional view of the control panel 3000 with the control device 1000 installed in the control panel 3000. FIG. 17 is a front view of the control panel 3000 with the control device 1000 installed in the control panel 3000. For ease of explanation, the front cover of the control panel 3000 is not shown in FIG. 17. As shown in FIGS. 16 and 17, the sheet metal bracket member 120 is attached to a metal wall material 3000a inside the control panel 3000. Heat transferred to the sheet metal bracket member 120 is transferred to the metal wall material 3000a, which has a large area, as indicated by the arrows in FIG. 16.

[0051] In this embodiment, four control devices 1000 are housed in the control panel 3000, but the number of control devices 1000 is not limited to four.

[0052] Next, the effects of the control device 1000 and the control panel 3000 according to the second embodiment will be described.

[0053] According to the control device 1000 of the second embodiment, the structure ST includes a sheet metal outer casing 200. The sheet metal outer casing 200 holds the main circuit board 40, faces the rear surface RS of the main circuit board 40, and has a second protrusion 20a. Therefore, the sheet metal outer casing 200 can be used to diffuse heat.

[0054] The control panel 3000 according to the second embodiment includes a sheet metal bracket member 120 to which the sheet metal outer casing 200 of the control device 1000 is attached, and a metal wall material 3000a to which the sheet metal bracket member 120 is attached. Therefore, heat can be diffused via the route of the sheet metal outer casing 200, the sheet metal bracket member 120, and the metal wall material 3000a.

[0055] In the control panel 3000 on which the air conditioning control device is installed, heat from the heat-generating components mounted on the main circuit board 40 can be diffused via the structure ST corresponding to the main circuit board 40, the sheet metal outer case 200, the sheet metal bracket member 120, and the control panel 3000. Even if a large number of heat-generating components are mounted on the main circuit board 40, it is possible to prevent heat from building up inside the control device 1000. This makes it possible to achieve an efficient cooling configuration. Therefore, when the control device 1000 according to the second embodiment is applied to an air conditioning control device, an efficient cooling structure can be achieved.

[0056] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0057] 1 display device, 8 housing components, 20 base sheet metal components, 20a second protrusion, 22 fireproof partition sheet metal components, 23 second heat dissipation sheet, 30 sheet metal case components, 33 power supply board, 40 main circuit board, 40a first heat generating element, 40b second heat generating element, 40c leaf spring component, 41 first heat dissipation sheet, 42 heat spreader, 42a first protrusion, 42d bent portion, 51 transmission board, 60 housing cover components, 60c intake slit, 60d exhaust slit, 120 sheet metal bracket components, 200 sheet metal outer case, 403, 404, 501 screws, 1000 control equipment, 3000 control panel, 3000a metal wall material, FS surface, RS back surface, ST structure.

Claims

1. a main circuit board having a front surface and a back surface; a first heating element mounted on the surface of the main circuit board; a second heating element mounted on the rear surface of the main circuit board; a structure having a first protrusion protruding toward the first heat generating element and a second protrusion protruding toward the second heat generating element; a first heat dissipation sheet sandwiched between the first heat generating element and the first protrusion; a second heat dissipation sheet sandwiched between the second heat generating element and the second protrusion, the first heat dissipation sheet is in contact with the first heat generating element and the first protrusion, the second heat dissipation sheet is in contact with the second heat generating element and the second protrusion, the structure includes a heat spreader; the heat spreader faces the surface of the main circuit board and has the first protrusion, the structure includes a base sheet metal member; The base metal member holds the main circuit board and the heat spreader, faces the back surface of the main circuit board, and has the second protrusion.

2. The control device according to claim 1 , wherein a gap between the main circuit board and the heat spreader is narrower than a gap between the main circuit board and the base metal plate member.

3. The control device according to claim 2 , wherein the height of the first protrusion is lower than the height of the second protrusion.

4. the first protrusion includes a lower surface on which the first heat dissipation sheet is disposed and at least two first side surfaces connecting the lower surface and a main surface of the heat spreader; one of the at least two first side surfaces is disposed substantially perpendicular to a direction of airflow passing through the gap between the main circuit board and the heat spreader; the second protrusion includes an upper surface on which the second heat dissipation sheet is disposed and at least two second side surfaces connecting the upper surface and a main surface of the base metal sheet member, The control device according to claim 2 , wherein one of the at least two second side surfaces is disposed approximately perpendicular to the direction of airflow passing through the gap between the main circuit board and the heat spreader.

5. a main circuit board having a front surface and a back surface; a first heating element mounted on the surface of the main circuit board; a second heating element mounted on the rear surface of the main circuit board; a structure having a first protrusion protruding toward the first heat generating element and a second protrusion protruding toward the second heat generating element; a first heat dissipation sheet sandwiched between the first heat generating element and the first protrusion; a second heat dissipation sheet sandwiched between the second heat generating element and the second protrusion, the first heat dissipation sheet is in contact with the first heat generating element and the first protrusion, the second heat dissipation sheet is in contact with the second heat generating element and the second protrusion, the structure includes a heat spreader and a base metal plate member; the first protrusion includes a lower surface on which the first heat dissipation sheet is disposed and at least two first side surfaces connecting the lower surface and a main surface of the heat spreader; the second protrusion includes an upper surface on which the second heat dissipation sheet is disposed and at least two second side surfaces connecting the upper surface and a main surface of the base metal sheet member, one of the at least two first side surfaces has a first side connected to the bottom surface, a second side connected to the main surface of the heat spreader, and a third side connected to the first side and the second side and connected to the other of the at least two first side surfaces; the second side is longer than the first side, one of the at least two second side surfaces has a fourth side connected to the top surface, a fifth side connected to the main surface of the base sheet metal member, and a sixth side connected to the fourth side and the fifth side and connected to the other of the at least two second side surfaces; The fifth side is longer than the fourth side.

6. Further provided with a sheet metal outer case, the structure includes the sheet metal outer case, The control device according to claim 1 , wherein the sheet metal outer case holds the main circuit board, faces the rear surface of the main circuit board, and has the second protrusion.

7. The control device according to claim 6; a metal bracket member to which the metal outer case of the control device is attached; and A control panel comprising a metal wall material to which the sheet metal bracket member is attached.

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