Quartz glass module and its manufacturing method
A simplified quartz glass module with a protected functional film integrated under controlled conditions addresses structural complexity and cost issues, ensuring high-quality bonding and void-free production.
Patent Information
- Application Number
- JP2025011783
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-01-27
- Publication Date
- 2025-11-10
- Estimated Expiration
- 2045-01-27
AI Technical Summary
Existing quartz glass modules for semiconductor manufacturing, particularly gradient-force electrostatic chucks, face issues such as complex structures, high production costs, damage to metal materials, and the formation of voids due to excessive pressure during thermal bonding, which can lead to deformation and fractures.
A simplified quartz glass module design incorporating a functional film of metal or metal compound on a quartz glass substrate, protected by a quartz glass protective film, integrated via a quartz glass joining member under controlled pressure and temperature conditions, eliminating voids and reducing stress on the glass and metal components.
The solution simplifies the structure, reduces production costs, prevents damage to the functional film, and ensures high-quality bonding without voids, enabling efficient and cost-effective manufacturing of quartz glass modules.
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Abstract
Citation Information
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