Condensation-curable resin composition, cured product, molded product, and semiconductor device

A condensation-curable resin composition using specific organosilicon and organometallic compounds addresses heat resistance and embrittlement issues in semiconductor devices, ensuring thermal stability and optical performance.

JP7766390B2Active Publication Date: 2025-11-10JNC CORP
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Patent Information

Application Number
JP2018227101
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2018-12-04
Publication Date
2025-11-10
Estimated Expiration
2038-12-04

AI Technical Summary

Technical Problem

Existing encapsulants for semiconductor devices, particularly those based on polydimethylsiloxane, suffer from insufficient heat resistance, embrittlement, and discoloration when exposed to high temperatures for extended periods, while glass or sintered plates used as alternatives increase costs and require adhesives, posing additional heat resistance issues.

Method used

A condensation-curable resin composition comprising an organosilicon compound with specific structural units and an organometallic compound, optionally with a condensation catalyst, solvent, phosphor, white pigment, or inorganic oxide, which forms a cured product resistant to embrittlement and discoloration even at high temperatures.

Benefits of technology

The composition provides a molded article and semiconductor device with enhanced crack resistance and thermal stability, maintaining mechanical strength and optical properties over long exposure to high temperatures.

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Abstract

To provide a condensed curable resin composition capable of providing a molded body hardly generating embrittlement and coloring even though exposed to high temperature for long time, a cured article, and a molded body and a semiconductor device using them.SOLUTION: There is provided a condensed curable resin composition containing (A) an organic silicon compound which is a siloxane polymer containing a silsesquioxane structure, and has SiOH groups at both terminals of a molecule chain respectively, and weight average molecular weight of 10,000 to 10,000,000, and (B) an organic metal compound having 3 or more condensation reactive group.SELECTED DRAWING: None
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Citation Information

Patent Citations

  • Crosslinkable siloxane polymer, siloxane-based crosslinkable composition and silicone membrane

    JP2008280420A

  • Siloxane polymer, siloxane-based crosslinkable composition and silicone membrane

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  • Crosslinkable silicon compound, method for producing the same, crosslinkable composition, siloxane polymer, silicone membrane, silicon compound used as raw material of the crosslinkable silicon compound, and method for producing the same

    JP2010116464A

  • Siloxane polymer crosslinking-cured product

    JP2011190413A

  • Ultraviolet light-emitting diode sealed with organic-inorganic hybrid polymer, and method for manufacturing the same

    JP2015222767A