Composition, liquid sealant, resin composite, sealant, method for producing sealant, and electronic device

Abstract

To provide a liquid composition which can lower viscosity while lowering a coefficient of thermal expansion of a cured product, and a composite material obtained by curing the liquid composition.SOLUTION: A composition contains a resin, a zeolite having a particle diameter of 1.0 μm or more and 10 μm or less, and a dispersant having at least one functional group of an amino group and an amine salt.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a composition, a liquid encapsulant, a resin composite, an encapsulant, a method for producing an encapsulant, and an electronic device. [Background technology]

[0002] Liquid sealants used as underfill materials are required to have excellent injectability, adhesion, curing properties, storage stability, etc., and to be free of voids. Furthermore, the areas sealed with the liquid sealant are required to have excellent moisture resistance, thermal cycle resistance, reflow resistance, crack resistance, warpage resistance, etc. To satisfy the above requirements, liquid sealants based on epoxy resins are widely used as underfill materials.

[0003] Furthermore, in order to improve the moisture resistance and thermal cycle resistance, particularly the thermal cycle resistance, of the portion sealed with the liquid sealant, it is known that adding a filler made of an inorganic substance such as silica filler (hereinafter referred to as "inorganic filler") to the liquid sealant is effective in controlling the difference in thermal expansion coefficient between the substrate made of an organic material such as epoxy resin and the semiconductor element, and in reinforcing the bump electrodes (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-56070 Summary of the Invention [Problem to be solved by the invention]

[0005] Liquid sealants using inorganic fillers such as silica fillers do not have a sufficiently low coefficient of thermal expansion, and there is a demand for a further reduction in the coefficient of thermal expansion from the viewpoint of thermal cycle resistance, etc. Zeolite is known as an inorganic filler with a low coefficient of thermal expansion, but liquid compositions containing zeolite tend to have high viscosity, which reduces injectability when used as an underfill material, making it difficult to obtain a liquid sealant with good injectability while reducing the coefficient of thermal expansion of the cured product.

[0006] Therefore, an object of the present invention is to provide a liquid composition that can reduce the thermal expansion coefficient of the cured product while also reducing the viscosity, and an epoxy resin composite material obtainable by curing the liquid composition. Another object of the present invention is to provide a liquid composition containing zeolite that can prevent the viscosity from increasing, and an epoxy resin composite obtained from the composition, and a resin composite suitable for various applications requiring suppression of thermal expansion. [Means for solving the problem]

[0007] The gist of the present invention is as follows. [1] A composition containing a resin, a zeolite, and a dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt. [2] The composition according to the above [1], wherein the resin is at least one selected from the group consisting of epoxy resins and polyimide resins. [3] The composition according to [1] or [2] above, wherein the particle size of the zeolite is 1.0 μm or more and 10 μm or less. [4] The composition according to any one of the above [1] to [3], wherein the zeolite contains d6r as CBU and is an aluminosilicate. [5] The composition according to any one of the above [1] to [4], wherein the zeolite is spherical. [6] The composition according to any one of the above [1] to [5], wherein the c-axis length of the lattice constant of the zeolite is 14.80 Å or less. [7] The composition according to any one of the above [1] to [6], wherein the resin is an epoxy resin, the content of the zeolite is 40 to 70 mass %, and the composition is in a liquid state having a viscosity at 23°C of 0.1 Pa·s or more and 250 Pa·s or less. [8] The composition according to any one of the above [1] to [7], which is in a liquid state and has a viscosity at 23°C of 1 Pa·s or more and 30 Pa·s or less. [9] A liquid sealant comprising the composition according to any one of the above [1] to [8].

[10] A resin composite material obtained by curing the composition according to any one of the above [1] to [8] to a gel fraction of 80% or more.

[11] A resin composite material comprising the composition according to any one of [1] to [8] above.

[12] The resin composite material according to

[10] or

[11] above, having an average thermal expansion coefficient of 0 ppm / K or more and 200 ppm / K or less, as determined by the following method: (The average thermal expansion coefficient is determined by measuring the temperature change in the amount of change in sample length at 25 to 100°C using the compression method in accordance with JIS K7197 (2012).)

[13] The resin composite material according to the above

[12] , wherein the average thermal expansion coefficient at 25 to 100°C is 10 to 30 ppm / K.

[14] An encapsulant comprising the resin composite material according to any one of

[11] to

[13] above.

[15] An electronic device comprising the resin composite material according to any one of

[11] to

[13] above.

[16] A method for producing a sealing material, comprising filling a gap with the composition according to any one of the above [1] to [8], and then curing the composition. [Effects of the Invention]

[0008] According to the present invention, by using a specific dispersant, it is possible to provide a liquid composition that is less likely to become viscous, and a resin composite material obtained by curing the liquid composition and having a reduced thermal expansion coefficient.Furthermore, it is also possible to provide a resin composite material that is suitable for various applications requiring suppression of thermal expansion. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a chart showing the particle size distribution of the zeolite of Experimental Example 1. [Figure 2] 1 is a chart showing the particle size distribution of the zeolite of Experimental Example 2. [Figure 3] 1 is a chart showing the particle size distribution of the zeolite of Experimental Example 5. DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention will be described below with reference to embodiments. <Composition> A composition according to an embodiment of the present invention contains a resin, a zeolite, and a dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt. The composition of the present invention may be in a liquid, gel, or solid state, but hereinafter, the term "liquid" means that the composition is in a liquid state at room temperature (23° C.). In a preferred embodiment, the composition of the present invention can be in a liquid state when the resin is an epoxy resin.

[0011] (resin) The resin used in the composition of the present invention is not particularly limited as long as it exhibits the effects of the present invention, but from the viewpoint of further exhibiting the effects as a composite material, it is preferably at least one selected from the group consisting of epoxy resins and polyimide resins. Epoxy resins are particularly preferred when used as a liquid composition useful as a sealant, etc. Furthermore, polyimide resins are preferred when used as a composition useful as a substrate, etc. From the viewpoint of both maintaining the excellent physical properties of the resin and achieving heat resistance (resistance to thermal expansion) as a cured resin composition, the amount of resin contained in the composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, based on the total amount of the composition, while being preferably 50% by mass or less, more preferably 25% by mass or less, and particularly preferably 15% by mass or less.

[0012] (epoxy resin) The epoxy resin used in the present invention is preferably an epoxy compound having an aromatic ring, such as a bisphenol A skeleton, a bisphenol F skeleton, or a biphenyl skeleton, because the thermal expansion coefficient of the epoxy resin composite obtained by curing the liquid composition is likely to be low. Specific examples include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, naphthalene ring-containing epoxy resins, epoxy resins having a dicyclopentadiene skeleton, phenol novolac epoxy resins, cresol novolac epoxy resins, triphenylmethane epoxy resins, aminophenol epoxy resins, aliphatic epoxy resins, and copolymer epoxy resins of aliphatic epoxy resins and aromatic epoxy resins. Among these, bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, biphenyl epoxy resins, naphthalene ring-containing epoxy resins, and aminophenol epoxy resins are preferred, and bisphenol A epoxy resins, bisphenol F epoxy resins, naphthalene ring-containing epoxy resins, aminophenol epoxy resins, and biphenyl epoxy resins are more preferred.

[0013] The use of a polyfunctional epoxy resin is preferred because the glass transition temperature of the epoxy resin composite obtained by heat-curing the liquid composition is likely to be high. Examples of polyfunctional epoxy resins include glycidyl ether polyfunctional epoxy resins such as phenolic compounds such as phenol novolac resin, cresol novolac resin, bisphenol A novolac resin, dicyclopentadiene phenolic resin, phenol aralkyl resin, naphthol novolac resin, biphenyl novolac resin, terpene phenolic resin, and heavy oil-modified phenolic resin, and epoxy resins produced from epihalohydrin and various phenolic compounds such as polyhydric phenolic resins obtained by condensation reaction of various phenols with various aldehydes such as hydroxybenzaldehyde, crotonaldehyde, and glyoxal.

[0014] From the viewpoint of fluidity, the epoxy resin used in the present invention preferably has a viscosity at 23°C of 5 Pa·s or less, and more preferably 0.1 to 3 Pa·s. The method for measuring the viscosity of epoxy resins is specified in JIS K7233 (1986), and the single cylinder rotational viscometer method is suitable. The viscosity of the epoxy resin used in the present invention at 23°C can be measured using a B-type rotational viscometer ("LVDV-1 Pri", Brookfield, spindle: S62), which is one of the single cylinder rotational viscometer methods.

[0015] From the viewpoint of viscosity control, the epoxy resin preferably has an epoxy equivalent of 50 g / eq to 500 g / eq, more preferably 90 g / eq to 150 g / eq. A high epoxy equivalent is preferable in terms of excellent heat resistance. On the other hand, a low epoxy equivalent is preferable in terms of improving the filling properties of the liquid composition and increasing the bonding properties due to the low melting point and viscosity of the epoxy resin. The epoxy resin may be used alone or in any combination and ratio of two or more kinds, but in the case of a mixture, the epoxy equivalent weight is the equivalent weight of the mixture.

[0016] The content of the epoxy resin in the composition of the present invention is preferably low, since this results in a relatively high content of inorganic fillers and the like, making it easier to reduce the thermal expansion coefficient. On the other hand, a high content is preferable, since it makes it easier to maintain the excellent physical properties of the epoxy resin. Specifically, the content is preferably 5% by mass or more, and more preferably 10% by mass or more, relative to the total composition. On the other hand, the content is preferably 50% by mass or less, more preferably 25% by mass or less, and particularly preferably 15% by mass or less.

[0017] (hardening agent) The liquid composition of the present invention preferably further contains a curing agent. The curing agent is a substance that contributes to the crosslinking reaction between crosslinking groups of the epoxy resin. The curing agent is not particularly limited, and those generally known as epoxy resin curing agents can be used. Examples include phenol-based curing agents, amine-based curing agents such as aliphatic amines, polyetheramines, alicyclic amines, and aromatic amines, acid anhydride-based curing agents, amide-based curing agents, tertiary amines, imidazole and its derivatives, organic phosphines, phosphonium salts, tetraphenylboron salts, organic acid dihydrazides, boron halide amine complexes, polymercaptan-based curing agents, isocyanate-based curing agents, blocked isocyanate-based curing agents, and dicyandiamine compounds. From the viewpoints of imparting fluidity and fast curing, acid anhydride-based curing agents are preferred as the curing agent.

[0018] Specific examples of phenolic curing agents include bisphenol A, bisphenol F, 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, 1,4-bis(4-hydroxyphenoxy)benzene, 1,3-bis(4-hydroxyphenoxy)benzene, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, phenol novolac, bisphenol A novolac, o-cresol novolac, m-cresol novolac, p-cresol novolac, xylenol novolac, poly-p-hydroxystyrene, hydroquinone, resorcinol, catechol, t-butylcatechol, t-butylhydroquinone, fluoroglycinol, pyrogallol, t-butylpyrogallol, allylated pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, Examples include 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allylated products or polyallylated products of the above dihydroxynaphthalenes, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, and allylated pyrogallol.

[0019] Specific examples of amine-based curing agents include aliphatic amines such as ethylenediamine, 1,3-diaminopropane, 1,4-diaminopropane, hexamethylenediamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminobispropylamine, bis(hexamethylene)triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-hydroxyethylethylenediamine, and tetra(hydroxyethyl)ethylenediamine. Examples of polyetheramines include triethylene glycol diamine, tetraethylene glycol diamine, diethylene glycol bis(propylamine), polyoxypropylene diamine, polyoxypropylene triamines, and the like. Examples of alicyclic amines include isophoronediamine, methacenediamine, N-aminoethylpiperazine, bis(4-amino-3-methyldicyclohexyl)methane, bis(aminomethyl)cyclohexane, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane, and norbornenediamine. Examples of aromatic amines include tetrachloro-p-xylylenediamine, m-xylylenediamine, p-xylylenediamine, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, 2,4-diaminoanisole, 2,4-toluenediamine, 2,4-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 4,4'-diamino-1,2-diphenylethane, 2,4-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, m-aminophenol, m-aminobenzylamine, benzyldimethylamine, 2-dimethylaminomethylphenol, triethanolamine, methylbenzylamine, α-(m-aminophenyl)ethylamine, α-(p-aminophenyl)ethylamine, diaminodiethyldimethyldiphenylmethane, and α,α'-bis(4-aminophenyl)-p-diisopropylbenzene.

[0020] Specific examples of acid anhydride curing agents include dodecenyl succinic anhydride, polyadipic anhydride, polyazelaic anhydride, polysebacic anhydride, poly(ethyloctadecanedioic) anhydride, poly(phenylhexadecanedioic) anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhimic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexene dicarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone, Examples of the dianhydride include phenone tetracarboxylic acid anhydride, ethylene glycol bistrimellitate dianhydride, HET anhydride, Nadic anhydride, methylnadic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylic acid anhydride, 3,4-dimethyl-6-(2-methyl-1-propenyl)-4-cyclohexene-1,2-dicarboxylic acid anhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic acid dianhydride, and 1-methyl-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic acid dianhydride.

[0021] Examples of amide-based curing agents include dicyandiamide and polyamide resins. Examples of tertiary amines include 1,8-diazabicyclo(5,4,0)undecene-7, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol. Examples of imidazole and its derivatives include 1-cyanoethyl-2-phenylimidazole, 2-phenylimidazole, 2-ethyl-4(5)-methylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyano-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazole] Examples include 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and adducts of the above imidazoles with epoxy resins or polymer-encapsulated imidazole.

[0022] Examples of organic phosphines include tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, and phenylphosphine. Examples of phosphonium salts include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium ethyltriphenylborate, and tetrabutylphosphonium tetrabutylborate. Examples of tetraphenylboron salts include 2-ethyl-4-methylimidazole tetraphenylborate and N-methylmorpholine tetraphenylborate. These curing agents may be used singly or in any combination and ratio of two or more.

[0023] When the liquid composition of the present invention contains a curing agent, the content of the curing agent is preferably such that the equivalent ratio of the epoxy groups in the epoxy resin to the functional groups in the curing agent (functional groups in the curing agent / epoxy groups in the epoxy resin) is in the range of 0.8 to 2.0, and more preferably in the range of 0.8 to 1.5, when the curing agent is a phenolic curing agent, an amine curing agent, or an acid anhydride curing agent, because this is unlikely to be affected by residual unreacted epoxy groups or functional groups of the curing agent.

[0024] When the curing agent is an amide curing agent, a tertiary amine, imidazole and its derivatives, organic phosphines, phosphonium salts, tetraphenylboron salts, organic acid dihydrazides, boron halide amine complexes, polymercaptan curing agents, isocyanate curing agents, or blocked isocyanate curing agents, it is preferably used in an amount of 0.1 part by mass or more, more preferably 0.5 parts by mass or more, per 100 parts by mass of the epoxy resin, while it is preferably used in an amount of 20 parts by mass or less, more preferably 10 parts by mass or less. In the case of a dicyandiamine compound, it is preferably used in an amount of 0.1 part by mass or more, more preferably 0.5 part by mass or more, relative to 100 parts by mass of the epoxy resin, and is preferably used in an amount of 10 parts by mass or less, more preferably 6 parts by mass or less.

[0025] <<Polyimide resin>> The polyimide resin used in the present invention is preferably a polyimide obtained from a tetracarboxylic dianhydride and a diamine, particularly an aromatic polyimide obtained from an aromatic tetracarboxylic dianhydride and an aromatic diamine, because the thermal expansion coefficient of the resin composite is likely to be low and the resin composite has excellent properties such as heat resistance, mechanical strength, electrical properties, and solvent resistance. More specifically, it is preferable to use a polyimide powder obtained by granulating a polyimide resin powder obtained by polymerizing and imidizing an aromatic tetracarboxylic acid component and p-phenylenediamine, followed by spraying a polyimide precursor solution on the polyimide resin powder, and then combine the polyimide powder with a filler to form a resin composite material. The polyimide powder is granulated by bonding the polyimide powder particles together with the polyimide precursor, and the polyimide precursor acts as a binder in the aggregates. The polyimide precursor may be, for example, a polyamic acid. The polyimide precursor solution used as the raw material is a polyamic acid produced by reacting a tetracarboxylic dianhydride with a diamine in the presence of a basic compound with a pKa of 7.5 or higher, using water and / or an alcohol-based solvent as the reaction solvent.

[0026] (dispersant) Dispersants are mainly added to liquid compositions containing a resin and a filler, which have a large difference in polarity, to improve the interface between the two and enhance compatibility, thereby achieving effects such as lowering viscosity, improving filler dispersibility, and preventing filler aggregation and sedimentation. The composition of the present invention contains zeolite. Zeolite has a large specific surface area due to its porous structure, and when incorporated in large quantities, the viscosity of the liquid composition tends to increase. As a result of various studies, the present invention has found that by incorporating a dispersant having at least one functional group selected from an amino group and an amine salt in addition to zeolite into the liquid composition, the thermal expansion coefficient of the resin composite can be reduced by incorporating zeolite into the resin, while preventing an increase in viscosity, thereby achieving a low viscosity liquid composition.

[0027] The dispersant in the present invention preferably has an amino group at its terminal from the viewpoint of reducing the viscosity of the liquid composition. The amine salt may be modified with an acid group such as phosphoric acid. In an embodiment of the present invention, the use of a specific dispersant can prevent the viscosity of the liquid composition from increasing even when zeolite is used as the inorganic filler.

[0028] Examples of dispersants include acrylic dispersants and polymeric dispersants. Here, "polymeric dispersant" refers to a dispersant with a weight-average molecular weight of 1,000 or more. The dispersant is preferably a polymeric dispersant. The main chain skeleton of the polymeric dispersant is not particularly limited, but examples include a polyurethane skeleton, a polyacrylic skeleton, a polyester skeleton, a polyamide skeleton, a polyimide skeleton, and a polyurea skeleton. In terms of storage stability, a polyurethane skeleton, a polyacrylic skeleton, and a polyester skeleton are preferred. The structure of the polymeric dispersant is also not particularly limited, but examples include a random structure, a block structure, a comb structure, and a star structure. Similarly, in terms of storage stability, a block structure or a comb structure is preferred. Furthermore, the dispersant is preferably a solvent-free dispersant, particularly a solvent-free polymer dispersant, which can prevent voids from being generated due to the dispersant volatilizing when the composition is heat-cured. Commercially available dispersants can be used as the dispersant. Examples of commercially available dispersants include the following dispersants, and among these, a dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt may be used.

[0029] Commercially available polymeric dispersants include 101, 102, 103, 106, 108, 109, 110, 111, 112, 116, 130, 140, 142, 145, 161, 162, 163, 164, 166, 167, 168, 170, 171, 174, 108, 182, 183, 184, 185, 2000, 2001, 2008, 2020, 2050, 2070, 2096, 2150, 2152, and 2155 of the DISPERBYK wetting and dispersing agent series available from BYK-Chemie, and 4008 of the EFKA series available from BASF Japan. 4009, 4010, 4015, 4020, 4046, 4047, 4050, 4055, 4060, 4080, 4300, 4330, 4340, 4400, 4401, 4402, 4403, 4406, 4800, 5010, 5044, 5054, 5055, 5063, 5064, 5065, 5066, 5070, 5244, and 3000, 5000, 11200, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000SC, and 24 000GR, 26000, 28000, 31845, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35200, 36000, 36600, 37500, 38500, 39000, 53095, 54000, 55000, 56000, 71000, 1210, 1220, 1831, 1850, 1860, 2100, 2150, 2200, 7004, KS-260, KS-273N, KS-860, KS-873N, PW-36, DN-900, and the DISPARLON series commercially available from Kusumoto Chemicals Co., Ltd. DA-234, DA-325, DA-375, DA-550, DA-1200, DA-1401, DA-7301, PB-711, PB-821, PB-822, PN-411, PA-111 of the Ajisper series commercially available from Ajinomoto Co., Inc., 104A, 104C, 104E, 104H, 104S, 104BC, 104DPM, 104PA, 104PG-50, 420, 440, DF110D, DF110L, DF37, DF58, DF75, DF210, CT111, CT121 of the Surfynol series commercially available from Air Products Co., Ltd.Examples of such a surfactant include CT131, CT136, GA, TG, TGE, STG and E1004 from the Olfin series commercially available from Nissin Chemical Industry Co., Ltd., 70, 2120, and 2190 from the SN Sparse series manufactured by San Nopco Ltd., the Adekacol and Adekatol series commercially available from ADEKA Corporation, and the Sannonik series, Naroacty CL series, Emulmin series, Newpol PE series, Ionet M series, Ionet D series, Ionet S series, Ionet T series, and Sunseparator 100 commercially available from Sanyo Chemical Industries, Ltd.

[0030] In an embodiment of the present invention, the content of the dispersant is preferably high, for example, in order to facilitate uniform dispersion of the inorganic filler when the composition is in a liquid state. On the other hand, the content of the dispersant is preferably low, in order to prevent an increase in the thermal expansion coefficient due to phase separation between the inorganic filler and a resin such as an epoxy resin. In order to facilitate filling the liquid composition into a narrow space and to facilitate a low thermal expansion coefficient after curing, the content of the dispersant is preferably 0.1% by mass or more and 30% by mass or less, and more preferably 0.1% by mass or more and 25% by mass or less, relative to the total amount of the composition.

[0031] The zeolite contained in the composition of the present invention will now be described. <<Zeolite structure>> Zeolites are compounds that contain silicon or aluminum and oxygen and have a TO4 unit (where T element is an element other than oxygen that constitutes the framework) as a basic unit. Specific examples of zeolites include crystalline porous aluminosilicates, crystalline porous aluminophosphates (ALPOs), and crystalline porous silicoaluminophosphates (SAPOs). Zeolite is made up of structural units called Composite Building Units (hereinafter sometimes referred to as "CBUs"), which are made up of several (several to several tens) TO4 units connected together, and therefore has regular channels (tubular pores) and cavities. The crystal structure of this CBU and zeolite, which will be described later, can be expressed using the code that specifies the structure of zeolites established by the International Zeolite Association (IZA). The structure of a zeolite can be identified using the Zeolite Structure Database 2018 Edition (http: / / www.iza-structure.org / databases / ) based on the X-ray diffraction pattern obtained using an X-ray structure analyzer (for example, the BRUKER D2PHASER tabletop X-ray diffractometer).

[0032] <<Zeolite Composition>> The zeolite of the present invention is not particularly limited as long as the effects of the present invention are not impaired, but an aluminosilicate containing at least aluminum atoms and silicon atoms in its framework structure is preferred because it is advantageous for use as a filler. One type of zeolite may be used alone, or two or more types may be used in any combination and ratio.

[0033] <<Zeolite framework>> The zeolite skeleton is not particularly limited as long as the composition of the present invention exhibits preferable performance. The zeolite skeleton preferably contains at least one of a d6r and mtw structure as the CBU, and more preferably d6r, because this facilitates the production of a resin composite with a low thermal expansion coefficient. The composition of the present invention particularly preferably contains 1 mass % or more of a zeolite having the above-described preferable structure as the CBU, and a resin.

[0034] Examples of zeolites having d6r as CBU include AEI, AFT, AFV, AFX, AVL, CHA, EAB, EMT, ERI, FAU, GME, JSR, KFI, LEV, LTL, LTN, MOZ, MSO, MWW, OFF, SAS, SAT, SAV, SBS, SBT, SFW, SSF, SZR, TSC, and zeolites with a -WEN structure. Examples of zeolites having mtw as CBU include zeolites with *BEA, BEC, CSV, GON, ISV, ITG, *-ITN, IWS, MSE, MTW, SFH, SFN, SSF, *-SSO, UOS, and UOV structure types. In order to have three-dimensional interactions with some of the epoxy groups contained in the epoxy resin, zeolites that further have three-dimensional channels are preferred. Examples include zeolites with AEI, AFT, AFX, *BEA, BEC, CHA, EMT, ERI, FAU, GME, ISV, ITG, *-ITN, IWS, JSR, KFI, MOZ, MSE, OFF, SAT, SAV, SBS, SBT, SFW, SZR, TSC, UOS, UOV, and -WEN structure types. Among these, zeolites having an oxygen ring structure of 8 or less are particularly preferred from the viewpoint of easy particle size control. Zeolites having an oxygen ring structure of 8 or less include AEI, AFT, AFX, CHA, ERI, KFI, SAT, SAV, SFW, and TSC type structures. Among these, zeolites having an AEI, AFX, CHA, or ERI structure are more preferred because the structure is stable even when the shape is controlled, and those having a CHA structure are most preferred. In this specification, a structure having an 8-membered oxygen ring means a structure in which the number of oxygen elements is 8 when the number of oxygen elements is the largest among the pores formed by oxygen and T elements (elements other than oxygen that form the framework) that form the zeolite framework.

[0035] <<Average thermal expansion coefficient of zeolite>> The average thermal expansion coefficient of the zeolite is not particularly limited as long as the composition of the present invention exhibits desirable performance. A low average thermal expansion coefficient of the zeolite is preferred because a small amount can easily reduce the average thermal expansion coefficients of the liquid composition and resin composite described below. A small amount is also preferred because the various physical properties of the resin are less likely to change with the addition of zeolite. A low average thermal expansion coefficient is particularly preferred because it can suppress an increase in the viscosity of the liquid composition described below. Specifically, the average thermal expansion coefficient of the zeolite is usually less than 0 ppm / K, preferably −2 ppm / K or less, more preferably −3 ppm / K or less, even more preferably −5 ppm / K or less, particularly preferably −6 ppm / K or less, and most preferably −8 ppm / K or less.

[0036] On the other hand, considering the liquid composition and resin composite containing zeolite and a resin described below, the average thermal expansion coefficient of zeolite is preferably high so that the difference with the average thermal expansion coefficient of the resin is small and the zeolite and the resin are less likely to peel off. Therefore, the average thermal expansion coefficient of zeolite is usually -1000 ppm / K or higher, preferably -900 ppm / K or higher, more preferably -800 ppm / K or higher, even more preferably -700 ppm / K or higher, particularly preferably -500 ppm / K or higher, and even more preferably -300 ppm / K or higher. In particular, when used in applications where the zeolite comes into contact with other materials such as sealing materials or substrates, a high average thermal expansion coefficient is preferable. Specifically, it is preferably -100 ppm / K or higher, more preferably -50 ppm / K or higher, even more preferably -40 ppm / K or higher, particularly preferably -30 ppm / K or higher, even more preferably -25 ppm / K or higher, and most preferably -20 ppm / K or higher. The average thermal expansion coefficient of zeolite can be measured by calculating the lattice constant using a BRUKER X-ray diffractometer "D8ADVANCE" and X-ray diffraction analysis software "JADE." Note that the zeolite is measured in a dry state to eliminate the influence of moisture desorption. The average thermal expansion coefficient of zeolite is usually measured in the range of 50 to 100°C. That is, it is a numerical value representing the change in lattice constant per degree Celsius from the average lattice constant at 50°C to the average lattice constant at 100°C when the temperature of the zeolite is raised. Here, the average lattice constant at each temperature is the average value of the lattice constants of the a-axis, b-axis, and c-axis. The average thermal expansion coefficient is measured by gradually raising the temperature after waiting until the lattice constant has stabilized. Resins generally have a high thermal expansion coefficient in the high temperature range. Therefore, it is preferable that the average thermal expansion coefficient of zeolite is low, especially when the temperature is raised to a high temperature range. Specifically, the average thermal expansion coefficient (high temperature range) in the range of 50 to 350°C is preferably -9.5 ppm / K or less, more preferably -10.0 ppm / K or less, and even more preferably -12.5 ppm / K or less. Here, the average thermal expansion coefficient (high temperature range) of zeolite is a numerical value representing the deviation in lattice constant per degree Celsius from the average lattice constant at 50°C and the average lattice constant at 350°C when the zeolite is heated.

[0037] <<Zeolite shape>> The shape of the zeolite is not particularly limited as long as the composition of the present invention exhibits desirable performance, and may be spherical, whisker-like, fibrous, plate-like, or an aggregate thereof. Zeolite is preferably spherical because it can be easily incorporated into a resin while suppressing an increase in viscosity when added to the resin. Specifically, the sphericity and roundness are preferably as follows:

[0038] <<Sphericity>> The sphericity of the zeolite is preferably 0.6 or more, more preferably 0.65 or more, and particularly preferably 0.70 or more. There is no particular upper limit to the sphericity, as long as it is 1 or less. In addition, the sphericity of cubic zeolites, which are common in ordinary zeolites, is 0.58. In this specification, "sphericity" is defined as "the ratio of the minimum diameter to the maximum diameter of a particle." The maximum diameter and the minimum diameter can be determined by observation using a scanning electron microscope (SEM).

[0039] <<Roundness>> The circularity of the zeolite is preferably 0.786 or more, more preferably 0.790 or more, even more preferably 0.795 or more, even more preferably 0.800 or more, even more preferably 0.805 or more, particularly preferably 0.810 or more, especially preferably 0.815 or more, and most preferably 0.820 or more. There is no particular upper limit to the circularity, and it may be 1 or less. In the case of a cubic zeolite, which is common in ordinary zeolites, the circularity is 0.785. In this specification, "roundness" is defined as "4 x π x area / (circumference) 2 The area and circumference can be determined by observation using a scanning electron microscope (SEM).

[0040] <<Zeolite c-axis length>> The c-axis length of the lattice constant of the zeolite is preferably short. It is believed that a short c-axis length increases lateral lattice vibration, causing negative expansion and making it easier for the average thermal expansion coefficient to be low. Specifically, the c-axis length is preferably 14.80 Å or less, more preferably 14.78 Å or less, even more preferably 14.76 Å or less, particularly preferably 14.74 Å or less, even more preferably 14.72 Å or less, and most preferably 14.70 Å or less. In this specification, the c-axis length refers to the length of the c-axis at room temperature (23° C.). The lattice constant of zeolite can be measured using an X-ray diffractometer "D8ADVANCE" manufactured by BRUKER, and calculated by the least squares method using X-ray diffraction analysis software "JADE."

[0041] <<Zeolite framework density>> The framework density of the zeolite is not particularly limited as long as the effects of the present invention are not impaired. The framework density of the zeolite is preferably low in that structural vibration of the zeolite is likely to occur and the average thermal expansion coefficient is likely to be low. Therefore, the framework density of the zeolite is preferably 17.0T / 1000Å. 3 or less, more preferably 16.0T / 1000Å 3 The following is the result. On the other hand, a high framework density of the zeolite is preferable in that the structural stability of the zeolite is likely to be high. The framework density of the zeolite is preferably 12.0T / 1000Å. 3 More preferably, 13.0T / 1000Å or more 3 More preferably, 14.0T / 1000Å 3 When the framework density is within the above range, the zeolite can be used as a stable filler. The framework density refers to the number of T atoms present per unit volume of zeolite, and is a value determined by the structure of the zeolite. In this specification, the values ​​listed in the IZA Zeolite Structure Database 2017 Edition (http: / / www.iza-structure.org / databases / ) may be used.

[0042] Framework density: 16.0T / 1000Å 3 Larger, 17.0T / 1000Å 3 Examples of the following zeolites include CSV, ERI, ITG, LTL, LTN, MOZ, MSE, OFF, SAT, SFH, SFN, SSF, *-SSO, and -WEN structure zeolites. Framework density: 15.0T / 1000Å 3 Larger, 16.0T / 1000Å 3 Examples of the following zeolites include zeolites of the AEI, AFT, AFV, AFX, AVL, *BEA, BEC, EAB, GME, *-ITN, LEV, MWW and SFW type structures. Framework density: 14.0T / 1000Å 3 Larger, 15.0T / 1000Å 3 Examples of the following zeolites include zeolites of the CHA, ISV, IWS, KFI, SAS and SAV structure types. Framework density: 14.0T / 1000Å 3Examples of zeolites within the following ranges include EMT, FAU, JSR, SBS, SBT, and TSC structure zeolites.

[0043] <<Zeolite Silica / Alumina Molar Ratio (SAR)>> The silica / alumina molar ratio of the zeolite (sometimes referred to as "SAR," "Si / Al2 molar ratio," or "Si / Al2 ratio") is not particularly limited as long as the effects of the present invention are not impaired. A high SAR (Si / Al2 ratio) of the zeolite is preferable in that it increases the moisture resistance of the resin composite material described below and makes it easier to control the amount of countercations. Therefore, the SAR (Si / Al2 ratio) of the zeolite is usually 2 or more, preferably 3 or more, more preferably 3.5 or more, even more preferably 4 or more, particularly preferably 4.5 or more, and most preferably 5 or more. On the other hand, a low SAR (Si / Al2 ratio) of zeolite is preferable in terms of easy and inexpensive production. Therefore, the SAR (Si / Al2 ratio) of zeolite is usually 2000 or less, preferably 1000 or less, more preferably 500 or less, and even more preferably 100 or less. When the Si / Al2 ratio is within the above range, the amount of counter cations is easily controlled, and the production cost of the zeolite is also low.

[0044] In addition, when elements such as gallium, iron, boron, titanium, zirconium, tin, zinc, phosphorus, etc. are used instead of silicon or aluminum, the molar ratio of the oxide of the element used instead can be converted into the molar ratio of alumina or silica.Specifically, when gallium is used instead of aluminum, the molar ratio of gallium oxide can be converted into the molar ratio of alumina. The Si / Al2 ratio of zeolite can be adjusted by the type and ratio of the silicon-containing compound and aluminum-containing compound used as raw materials, the type and amount of structure-directing agent, the use of seed crystals, and synthesis conditions such as temperature and time.

[0045] <<Zeolite counter cation>> The counter cation of the zeolite is not particularly limited as long as the effects of the present invention are not impaired. The counter cation of the zeolite is usually a proton, an alkali metal ion, or an alkaline earth metal ion. Preferably, it is a proton or an alkali metal ion, and more preferably, it is a proton, a Li ion, a Na ion, or a K ion. In the case of an alkali metal ion or an alkaline earth metal ion, the smaller the size, the more likely the zeolite will exhibit an average thermal expansion coefficient of less than 0 ppm / K, which is preferable. In particular, the counter cation of the zeolite is preferably a proton, since this makes it easier to reduce the average thermal expansion coefficient of the resin composite. That is, the zeolite is preferably a proton type or an alkali metal type, more preferably a proton type, a Li type, a Na type, or a K type, and particularly preferably a proton type. The structure-directing agent refers to a template used in the production of the zeolite.

[0046] <<Zeolite crystallinity>> The crystallinity of the zeolite is not particularly limited as long as the effects of the present invention are not impaired. This is because the Composite Building Unit (CBU) is presumed to be a factor that has a greater impact on the average thermal expansion coefficient of an epoxy resin composite than the structure specified by the IZA code. The crystallinity of the zeolite can be determined by comparing a certain X-ray diffraction peak determined using an X-ray diffractometer (e.g., a BRUKER D2PHASER benchtop X-ray diffractometer) with the X-ray diffraction peak of a reference zeolite. A specific calculation example is the crystallinity of LTA zeolite in Scientific Reports 2016, 6, Article number: 29210.

[0047] <<Zeolite surface treatment>> The zeolite may be surface-treated by silylation or the like, as long as the effects of the present invention are not impaired. The surface treatment is not limited to a physical treatment or a chemical treatment.

[0048] <<Zeolite particle size>> When the zeolite of the present invention is added to a resin, the particle size of the zeolite is preferably large so that the viscosity of the resin is not easily increased, and on the other hand, the particle size of the zeolite is preferably small so that the zeolite can be easily mixed uniformly with other components such as the resin and the surface can be easily smoothed. Therefore, the particle size of the zeolite contained in the composition of the present invention is preferably 1.0 μm or more, more preferably 1.5 μm or more, and even more preferably 2.0 μm or more, and on the other hand, is 10 μm or less, more preferably 8 μm or less, and even more preferably 5 μm or less (hereinafter, sometimes referred to as "large particle size zeolite"). When using zeolite, it is usually used as a group of multiple zeolite particles rather than a single zeolite particle. That is, in one embodiment of the present invention, it is preferable to use a group of zeolite particles containing at least zeolite particles having the particle diameter described above. In one embodiment of the present invention, the zeolite consisting of multiple zeolite particles preferably has an average particle diameter in the range of 1.1 to 4.0 μm, more preferably 1.5 to 3.8 μm, and even more preferably 2.0 to 3.5 μm. The average particle diameter of the zeolite is determined by measuring the particle diameters of 50 randomly selected zeolite particles (powder, particles in a liquid composition or resin composite material described below). Furthermore, the particle size distribution of the zeolite on a volume basis is preferably such that the median diameter (d50) is in the range of 0.5 to 5.0 μm, more preferably 1.5 to 5.0 μm, and even more preferably 2.0 to 4.0 μm. By having the median diameter in this range, the proportion of zeolite that exhibits the effects of the present invention increases, making it easier to obtain the effects of the present invention with a smaller amount.

[0049] <<Zeolite manufacturing method>> Known methods can be used to produce zeolites. For example, CHA-type zeolite can be produced by referring to the method described in JP 2009-097856 A. To produce zeolites with large particle sizes, hydrothermal synthesis can be performed by appropriately controlling the types and ratios of raw materials, synthesis time, temperature, and the like. Specifically, for example, zeolites with large particle sizes can be produced by the method described in Microporous and Mesoporous Materials 21 (1998) 24., where the amount of water used during synthesis is increased and the raw material concentration is diluted. The above-mentioned preferred zeolite can be produced by the following method (hereinafter, sometimes referred to as "the method for producing the zeolite according to the present invention"). The method for producing a zeolite of the present invention includes a step of hydrothermally synthesizing a raw material composition containing a silicon atom raw material, a water-soluble aluminum atom raw material, an organic structure-directing agent, and water, followed by a step of calcining the raw material composition. Here, the content of alkali metal atoms other than the organic structure-directing agent in the raw material composition is 0.05 mol or less per mol of Si atoms. If necessary, a desired zeolite (hereinafter sometimes referred to as "seed zeolite") may be used.

[0050] <<Silicon atom raw material>> The silicon atom source used in the present invention is not particularly limited, and various known substances can be used. For example, colloidal silica, amorphous silica, sodium silicate, trimethylethoxysilane, tetraethyl orthosilicate, aluminosilicate gel, and zeolite can be used. Among these, amorphous silica is preferred because it contains less alkali metal. These may be used alone, or two or more may be used in any combination and ratio.

[0051] <<Aluminum atomic raw material>> The aluminum atom source is a water-soluble source. Aluminum hydroxide is preferred because it has a low alkali metal content, and water-soluble amorphous aluminum hydroxide is particularly preferred because it allows zeolite to grow into a spherical shape without aging.

[0052] <<Alkali metal atom source>> An alkali metal atom raw material may not be used, but if used, the content of alkali metal atoms other than the organic structure-directing agent per mole of Si atoms should be 0.05 moles or less. When an alkali metal atom raw material is used, the alkali metal atoms are not particularly limited, and known alkali metal atoms used in zeolite synthesis can be used, but at least one alkali metal selected from the group consisting of lithium, sodium, potassium, rubidium, and cesium is preferred. The amount of alkali metal used, expressed as a molar ratio to silicon (Si) contained in the raw material composition, is preferably 0.045 or less, more preferably 0.04 or less, even more preferably 0.035 or less, and particularly preferably 0.03 or less. It is believed that a small amount of alkali metal atom raw material makes it easier for the zeolite to grow spherically, shortening the c-axis length of the crystal lattice and increasing the average negative thermal expansion coefficient.

[0053] <<Organic structure directing agent>> As the organic structure-directing agent, various known substances such as tetraethylammonium hydroxide (TEAOH) and tetrapropylammonium hydroxide (TPAOH) can be used. Among these, N,N,N-trimethyl-1-adamantaammonium hydroxide (TMAdaOH) is preferred. The amount of organic structure-directing agent used is, in terms of molar ratio to silicon (Si) contained in the raw material composition, usually 0.01 or more, preferably 0.02 or more, more preferably 0.03 or more, particularly preferably 0.04 or more, and most preferably 0.05 or more. On the other hand, it is usually 1 or less, preferably 0.6 or less, more preferably 0.55 or less, and even more preferably 0.5 or less. It is believed that within this range, high-purity spherical zeolite with few by-products can be easily grown.

[0054] <<Seed Zeolite>> In the production method of the present invention, seed zeolite may be used. When seed zeolite is used, one type may be used alone, or two or more types may be used in any combination and ratio.

[0055] <<Wed>> When using seed zeolite, the amount of water used is, from the viewpoint of facilitating crystal formation, typically 5 or more, preferably 7 or more, more preferably 9 or more, and even more preferably 10 or more in terms of the molar ratio to silicon (Si) contained in the raw material composition other than the seed zeolite. Setting the amount within this range is preferable because crystals are more likely to form. Furthermore, synthesis under conditions in which the amount of water is increased and the raw material concentration is diluted is thought to facilitate the production of zeolite with a large particle size. To fully achieve the effect of reducing costs associated with waste liquid treatment, the molar ratio to silicon (Si) is typically 50 or less, preferably 40 or less, more preferably 30 or less, and even more preferably 20 or less.

[0056] <<Mixing of raw materials (preparation of pre-reaction raw material composition)>> The raw material composition can usually be obtained by mixing the silicon atom raw material, the aluminum atom raw material, the organic structure-directing agent, and water, and then adding seed zeolite, if used. In the present invention, in addition to the above-mentioned components, components such as an acid component for accelerating the reaction and a metal stabilizer such as polyamine may be added at any step as required.

[0057] <<Aging>> The raw material composition prepared as described above may be hydrothermally synthesized immediately after preparation, but to obtain a zeolite with higher crystallinity, it is preferable to age the raw material for a certain period of time under specified temperature conditions. Particularly when scaling up the reaction, it is preferable to age the raw material while stirring it for a certain period of time, as this improves stirrability and makes it easier to make the raw material more uniform. The temperature during aging is usually 100°C or less, preferably 95°C or less, and more preferably 90°C or less. There is no particular lower limit, but it is usually 0°C or more, preferably 10°C or more. The aging temperature may be constant during aging, or it may be changed stepwise or continuously. The aging time is not particularly limited, but is usually 2 hours or more, preferably 3 hours or more, and more preferably 5 hours or more. It is usually 30 days or less, preferably 10 days or less, and more preferably 4 days or less.

[0058] <<Hydrothermal synthesis>> Next, the obtained raw material composition is subjected to hydrothermal synthesis. Hydrothermal synthesis is usually carried out by placing the raw material composition prepared as described above or an aqueous gel obtained by aging the raw material composition in a pressure-resistant container, and maintaining the mixture at a predetermined temperature under self-generated pressure or under gas pressure to an extent that does not inhibit crystallization, while stirring, rotating or shaking the container, or leaving it stationary. The reaction temperature during hydrothermal synthesis is usually 120°C or higher, preferably 130°C or higher, more preferably 140°C or higher, and particularly preferably 150°C or higher, in order to increase the reaction rate. On the other hand, it is usually 230°C or lower, preferably 220°C or lower, more preferably 200°C or lower, and even more preferably 190°C or lower. The reaction time is not particularly limited, but is usually 2 hours or higher, preferably 3 hours or higher, and more preferably 5 hours or higher. On the other hand, it is usually 30 days or lower, preferably 10 days or lower, more preferably 7 days or lower, and even more preferably 5 days or lower. The reaction temperature may be constant during the reaction, or may be changed stepwise or continuously. The reason why the above-described preferred zeolite can be produced by the zeolite production method of the present invention is presumed to be as follows: When producing a zeolite, raw material components are generally dissolved using an alkali metal. In contrast, in the zeolite production method of the present invention, alkali metals are not used, or even if they are used, they are used in a certain amount or less. As a result, crystals tend to grow from the organic structure-directing agent in the raw material composition, and spherical crystals tend to grow from these starting points. It is presumed that distortion occurs in the crystal lattice during the spherical crystal growth process, and that this distortion is fixed by calcination. This presumption is supported by the fact that the c-axis lengths of the crystal lattices in Experimental Examples 1 to 3 (produced by the zeolite production method of the present invention) described below are shorter than those in Experimental Examples 4 (without calcination) and 5 (using sodium hydroxide). It is presumed that the presence of this distortion in the crystal lattice causes the preferred zeolite to have a low average thermal expansion coefficient. That is, it is believed that the distortion in the crystal lattice causes the zeolite to shrink when heated because the distortion is eliminated. For the same reason, it is presumed that the preferred zeolite described above is particularly likely to have a low average thermal expansion coefficient in the high temperature range (50 to 350°C). This presumption is also supported by the fact that, in a comparison between Examples 1 to 3 and Comparative Examples 1 and 2 described below, the average thermal expansion coefficients of Experimental Examples 1 to 3, which have a short c-axis length of the crystal lattice, are lower than those of Experimental Examples 4 and 5.

[0059] (Zeolite content) When the composition of the present invention is liquid (hereinafter sometimes referred to as the "liquid composition of the present invention"), the content of the zeolite particles contained in the resin composition is, from the viewpoint of suppressing an increase in viscosity and lowering the thermal expansion coefficient, preferably 25% by mass or more, more preferably 30% by mass or more, even more preferably 35% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and especially preferably 50% by mass or more, based on the total amount of the composition. On the other hand, the content is preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, and particularly preferably 70% by mass or less.

[0060] (inorganic filler) The composition of the present invention may contain an inorganic filler other than zeolite. Inorganic fillers other than zeolite include at least one selected from the group consisting of metals, carbon, metal carbides, metal oxides, and metal nitrides. Examples of metals include silver, copper, aluminum, gold, nickel, iron, and titanium. Examples of carbon include carbon black, carbon fiber, graphite, fullerene, and diamond. Examples of metal carbides include silicon carbide, titanium carbide, and tungsten carbide. Examples of metal oxides include magnesium oxide, aluminum oxide (alumina), silicon oxides such as silica, calcium oxide, zinc oxide, yttrium oxide, zirconium oxide, cerium oxide, ytterbium oxide, and sialon (ceramics composed of silicon, aluminum, oxygen, and nitrogen). Examples of metal nitrides include boron nitride, aluminum nitride, and silicon nitride.

[0061] (Small particle size inorganic filler) The composition of the present invention may contain an inorganic filler having a particle size of 0.1 μm or more and less than 1.0 μm (hereinafter also referred to as a "small particle size inorganic filler"). The small particle size inorganic filler may be zeolite or an inorganic filler other than zeolite, specific examples of which are as described above. From the viewpoint of reducing the thermal expansion coefficient, the small particle size inorganic filler is preferably zeolite, metal nitride, metal oxide, etc. Note that the zeolite used as the small particle size inorganic filler is preferably a zeolite similar to the above-mentioned zeolite except for the particle size. Zeolite is an inorganic filler with a low coefficient of thermal expansion, which can reduce the coefficient of thermal expansion of an epoxy resin composite, which is a cured product of a liquid composition according to a preferred embodiment of the present invention. However, due to its porous structure, zeolite has a large specific surface area, and adding a large amount of zeolite to a liquid composition tends to increase the viscosity of the liquid composition. Therefore, the present invention has discovered that by adding a small-particle-size inorganic filler to a liquid composition in addition to a large-particle-size zeolite, it is possible to reduce the coefficient of thermal expansion of the liquid epoxy resin composite while preventing an increase in viscosity, thereby achieving a low viscosity of the liquid composition. Therefore, the composition of the present invention preferably contains the above-mentioned large-particle-size zeolite and a small-particle-size inorganic filler. When the composition of the present invention contains large-particle-size zeolite and a filler other than large-particle-size zeolite, the content of the large-particle-size zeolite in all fillers is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, even more preferably 70% by mass or more, and most preferably 90% by mass or more, because this reduces the increase in viscosity during resin kneading and makes it easier to reduce the thermal expansion coefficient of the cured product.

[0062] The content of the small particle size inorganic filler is preferably high in order to ensure that the effects of using the filler are fully exhibited. On the other hand, in the case of a liquid composition, a low content is preferred in order to increase the fluidity of the liquid composition and make it easier to fill a narrow space. In particular, since the small particle size inorganic filler has a large specific surface area and is prone to increase viscosity, reducing the amount used makes it easier to increase fluidity. In the composition of the present invention, the content of the small particle size inorganic filler is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the composition, and is preferably 50% by mass or less, more preferably 45% by mass or less, and even more preferably 40% by mass or less.

[0063] (Total inorganic filler amount) The total content of all inorganic fillers (total inorganic fillers), including zeolite, contained in the composition of the present invention is preferably high in order to facilitate the development of the filler's effects. On the other hand, a low content is preferable in order to ensure high fluidity in the case of a liquid composition and to facilitate filling into narrow spaces. Specifically, in the composition of the present invention, the total content of all inorganic fillers is preferably 30% by mass or more, more preferably 35% by mass or more, and particularly preferably 40% by mass or more, based on the total amount of the composition. On the other hand, it is preferably 95% by mass or less, more preferably 90% by mass or less, and particularly preferably 85% by mass or less.

[0064] (Shape of small particle size inorganic filler) The shape of the small particle size inorganic filler is not particularly limited as long as the liquid composition and resin composite exhibit desirable performance, and may be spherical, whisker-like, fibrous, plate-like, or an aggregate thereof, but a spherical shape is preferred because it can be contained while suppressing an increase in viscosity. The sphericity of the small particle size inorganic filler is preferably 0.6 or more, more preferably 0.65 or more, and particularly preferably 0.70 or more. There is no particular upper limit to the sphericity, and it is sufficient if it is 1 or less. Therefore, in an embodiment of the present invention, the sphericity of both the large particle size zeolite and the small particle size inorganic filler is preferably 0.6 or more, more preferably 0.65 or more, and particularly preferably 0.70 or more. Furthermore, it is preferable that the small particle size inorganic filler has a higher sphericity than the large particle size zeolite. The circularity of the small particle size inorganic filler is preferably 0.786 or more, more preferably 0.790 or more, even more preferably 0.795 or more, even more preferably 0.800 or more, still more preferably 0.805 or more, particularly preferably 0.810 or more, especially preferably 0.815 or more, and most preferably 0.820 or more. There is no particular upper limit to the circularity, and it is sufficient if it is 1 or less. The methods for measuring sphericity and circularity are as described above.

[0065] (reactive diluent) The liquid composition of the present invention may contain a reactive diluent. The reactive diluent is not particularly limited as long as it contains at least one monofunctional epoxy compound. Monofunctional epoxy compounds are epoxy compounds having one epoxy group and have traditionally been used as reactive diluents to adjust the viscosity of epoxy resin compositions. Monofunctional epoxy compounds are broadly classified into aliphatic monofunctional epoxy compounds and aromatic monofunctional epoxy compounds, and aromatic monofunctional epoxy compounds are preferred from the viewpoint of viscosity.

[0066] (Other additives) In addition to the above, the liquid composition may appropriately contain other additives selected from a coupling agent, an ultraviolet inhibitor, an antioxidant, a plasticizer, a flame retardant, a colorant, a flow improver, an antifoaming agent, an ion trapping agent, and the like.

[0067] In addition, in this embodiment, the liquid composition is preferably solvent-free. By using a solvent-free system, it is possible to prevent the solvent from volatilizing and generating voids when the liquid composition is heat-cured. Note that the term "solvent" refers to a volatile component, and in this specification, this term encompasses water and organic solvents. A solvent-free liquid composition is one that does not substantially contain a solvent, and for example, the solvent content of the entire liquid composition is preferably less than 3% by mass, more preferably less than 1% by mass, and most preferably 0% by mass.

[0068] (Viscosity of liquid composition) In the present invention, the liquid composition is a composition that has fluidity at room temperature (23°C). When the composition of the present invention is a liquid composition, the viscosity of the liquid composition is preferably low so that the composition can be easily filled into a narrow space. On the other hand, a high viscosity is preferable so that dripping and the like are less likely to occur when the composition is filled. The viscosity of the liquid composition at room temperature (23°C) is preferably 0.1 Pa·s or more, more preferably 1 Pa·s or more, even more preferably 5 Pa·s or more, and particularly preferably 10 Pa·s or more. On the other hand, it is preferably 250 Pa·s or less, more preferably 200 Pa·s or less, even more preferably 150 Pa·s or less, and particularly preferably 30 Pa·s or less. The viscosity of the liquid composition can be measured in the same manner as the viscosity measurement method for epoxy resins described above. The viscosity of the liquid composition used in the present invention at 23°C can be measured using a B-type rotational viscometer, which is one of the single-cylinder rotational viscometer methods. The B-type rotational viscometer described in the Examples section, for example, can be used.

[0069] <Preferred embodiment of liquid resin composition> A preferred embodiment of the composition of the present invention is a liquid resin composition that uses an epoxy resin as a resin and contains the large particle size zeolite described above, wherein the liquid resin composition has a viscosity of 1 Pa s to 30 Pa s and a zeolite content of 40 to 70 mass%. The liquid resin composition is useful as an underfill material (sometimes called a "liquid sealant"), and after curing, it can reduce the average coefficient of thermal expansion, making it suitable as a sealant.

[0070] <Preferred embodiment as a resin composite material> Another preferred embodiment of the composition of the present invention is a resin composite that uses an epoxy resin as the resin and contains the large particle size zeolite described above, wherein the content of the zeolite is 40 to 70 mass % and the average thermal expansion coefficient at 25 to 100°C is 10 to 30 ppm / K. The resin composite has a low average coefficient of thermal expansion at 25 to 100°C and is therefore useful as a variety of materials, particularly for electronic devices.

[0071] (average thermal expansion coefficient) The average coefficient of thermal expansion (CTE1) of the liquid composition of the present invention when cured is preferably low so that the epoxy resin composite is less likely to deform due to the ambient temperature environment, heat generation, etc. On the other hand, it is preferable that the average coefficient of thermal expansion is close to that of the surrounding components so that damage, etc., due to differences in average thermal expansion from the surrounding components is less likely to occur. Therefore, when the liquid composition is used as an underfill material or the like in the manufacture of semiconductor devices, it is preferable that the average coefficient of thermal expansion is close to that of the semiconductor substrate (e.g., 3 to 4 ppm / K). From the above viewpoints, the liquid composition of the present invention, when cured, preferably has an average coefficient of thermal expansion (CTE1) of 0 ppm / K or more, more preferably 2 ppm / K or more, even more preferably 4 ppm / K or more, and particularly preferably 10 ppm / K or more, while preferably 200 ppm / K or less, more preferably 100 ppm / K or less, and even particularly preferably 30 ppm / K or less.

[0072] The average coefficient of thermal expansion of the cured product obtained by curing the liquid composition and the glass transition temperature (Tg) described below can be determined by measuring the average coefficient of thermal expansion of the epoxy resin composite (cured product) obtained by curing the liquid composition to a gel fraction of 80% or more. The average coefficient of thermal expansion (CTE1) is determined in accordance with JIS K7197 (2012) by measuring the temperature change in the change in sample length at 25 to 100°C using the compression method using thermomechanical analysis, and then calculating the slope of the tangent. Specific measurement conditions for the average coefficient of thermal expansion are as described in the Examples.

[0073] (glass transition temperature) The glass transition temperature (Tg) of an epoxy resin composite obtained by curing the liquid composition of the present invention is not particularly limited, but for example, when the Tg of the underfill material is high, the area sealed with the underfill material is considered preferable because it provides high protection for bumps at high temperatures and has excellent thermal cycle resistance (see, for example, JP 2017-110146 A). From this perspective, the glass transition temperature (Tg) of the cured product is preferably 50°C or higher, more preferably 80°C or higher. Furthermore, since warping at room temperature (23°C) tends to be less severe when the glass transition temperature is 150°C or lower, the glass transition temperature (Tg) is preferably 50 to 150°C, and more preferably 80 to 150°C. The glass transition temperature (Tg) can be measured using a thermomechanical analyzer (TMA). Specifically, it can be measured by the method described in the Examples.

[0074] (Method for producing liquid composition) The liquid composition of the present invention can usually be obtained by mixing and kneading a resin such as an epoxy resin, a zeolite having a particle size of 1.0 μm to 10 μm, a dispersant having at least one functional group selected from an amino group and an amine salt, a small particle size inorganic filler used as needed, a curing agent, a reactive diluent, and other additive components using a vacuum mixer, mixing roll, planetary mixer, etc., and degassing as needed. The order in which these components are mixed is arbitrary, as long as there are no particular problems such as the generation of reactions or precipitates. Any two or more of the constituent components may be mixed in advance, and the remaining components may then be mixed, or all of the components may be mixed at once.

[0075] <Resin composite material> In one embodiment of the present invention, a resin composite can be obtained by curing the composition of the present invention. For example, when the resin is an epoxy resin, an epoxy resin composite can be obtained. When the resin is an epoxy resin, the composition before curing is preferably a liquid composition. The epoxy resin in the epoxy resin composite is preferably 5% by mass or more, more preferably 10% by mass or more, based on the total amount of the epoxy resin composite, from the viewpoints of easily reducing the thermal expansion coefficient and easily maintaining the excellent physical properties of the epoxy resin, while being preferably 50% by mass or less, more preferably 25% by mass or less, and particularly preferably 15% by mass or less.

[0076] <Epoxy resin composite material> A preferred embodiment of the present invention is an epoxy resin composite. The epoxy resin composite can be obtained by curing a liquid composition containing the above-mentioned epoxy resin. The epoxy resin composite contains an epoxy resin, zeolite, and a dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt. By including zeolite and a dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt, the epoxy resin composite according to the present invention can be produced from a liquid composition with a relatively low viscosity while maintaining a low thermal expansion coefficient.

[0077] In the epoxy resin composite according to an embodiment of the present invention, the epoxy resin, inorganic filler, and dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt are as described above. Furthermore, the epoxy resin composite may contain, in addition to the epoxy resin, inorganic filler, and dispersant having at least one functional group selected from the group consisting of an amino group and an amine salt, other components contained in the liquid composition as appropriate. The content of each component in the epoxy resin composite is as described above, except that the content is based on the entire epoxy resin composite instead of the entire composition. Furthermore, the epoxy resin composite may be cured to a gel fraction of 80% or more, and is preferably cured by the curing agent contained in the liquid composition.

[0078] From the same viewpoints as above, the preferred ranges of the average coefficient of thermal expansion (CTE1) and glass transition temperature of the epoxy resin composite in an embodiment of the present invention are the same as the preferred ranges when the liquid composition is cured. The average coefficient of thermal expansion and glass transition temperature of the epoxy resin composite can be measured by the above-mentioned measurement methods.

[0079] (Method of manufacturing epoxy resin composite material) The epoxy resin composite can be obtained by curing the liquid composition. The curing is preferably performed by heating. The method for producing the epoxy resin composite is not particularly limited as long as the epoxy resin composite exhibits desirable properties, and can be performed appropriately using a known method depending on the blending component composition of the liquid composition, etc.

[0080] The epoxy resin composite is preferably formed by, for example, filling the gaps between components of various products such as electronic devices with a liquid composition and curing it. Alternatively, the epoxy resin composite may be formed by applying the liquid composition to the components of various products and curing it. Alternatively, the liquid composition can be molded into a desired shape, for example, by curing it while it is contained in a mold. Such molded articles can be produced by injection molding, injection compression molding, extrusion molding, or compression molding. The molding, i.e., curing, of the epoxy resin composite can be carried out under the respective curing temperature conditions. The epoxy resin composite can also be obtained by cutting a cured product of the liquid composition into a desired shape. The heating temperature during thermal curing is not particularly limited and is affected by the curing agent used, but is usually 30° C. or higher, preferably 50° C. or higher, more preferably 60° C. or higher, and even more preferably 80° C. or higher. On the other hand, the heating temperature is usually 400° C. or lower, preferably 350° C. or lower, more preferably 300° C. or lower, and even more preferably 250° C. or lower. When the curing temperature is within the above range, a high-quality resin composite material can be easily obtained in a short time.

[0081] <Polyimide resin composite> When the resin is a polyimide resin, a polyimide resin composite can be obtained. The polyimide resin composite can be produced, for example, by the method described below.

[0082] (Method of manufacturing polyimide resin composite material) Various known thermoplastic resin molding presses can be used to mold polyimide resin composites. While the temperature is not particularly limited and depends on the properties of the resin used, for polyamide resins, the temperature is typically 250°C or higher, preferably 300°C or higher, more preferably 350°C or higher, and even more preferably 390°C or higher. Furthermore, to prevent resin deterioration during heat pressing, it is preferable to use a vacuum press that can reduce the amount of oxygen inside the press during heating, or a press equipped with a nitrogen replacement device.

[0083] (Application) The composition and resin composite of the present invention can be used, for example, in catalyst modules, molecular sieve membrane modules, optical components, moisture-absorbing components, foods, building components, and components and packaging materials for electronic devices, and is particularly preferably used in electronic devices. Therefore, in a preferred embodiment, the present invention provides an electronic device containing a resin composite, and more preferably an electronic device containing an epoxy resin composite. An electronic device is a device that has two or more electrodes and controls the current flowing between the electrodes or the voltage generated between the electrodes using electricity, light, magnetism, or chemicals, or that generates light, an electric field, or a magnetic field using an applied voltage or current. Specific examples include resistors, rectifiers (diodes), switching elements (transistors, thyristors), amplifier elements (transistors), memory elements, chemical sensors, etc., or devices that combine or integrate these elements. Other examples include photodiodes or phototransistors that generate photocurrent, electroluminescent elements that emit light when an electric field is applied, and optical elements such as photoelectric conversion elements or solar cells that generate electromotive force when exposed to light. The electronic device is preferably a semiconductor device. The semiconductor device preferably has at least a semiconductor substrate, and examples include devices in which a semiconductor chip is mounted on a substrate and devices in which semiconductor chips and semiconductor substrates are stacked in multiple layers.

[0084] The liquid composition of the present invention is preferably used as a liquid sealant, and in this case, the epoxy resin composite material formed by curing the liquid composition preferably serves as the sealant. The liquid sealant can be used as a sealant that fills gaps formed in components and then hardens to fill the gaps. Furthermore, the liquid sealant may be used as a sealant to fill gaps between various components, for example, by applying the liquid sealant to various components, overlaying another component on the liquid sealant, and then appropriately curing the liquid sealant. In this case, the liquid sealant may be appropriately cured to a B-stage before the other component is overlaid. Among these, the liquid composition of the present invention is preferably used for filling gaps and curing it. That is, it is preferable to produce a sealant by filling a gap with the liquid composition of the present invention and then curing it. The liquid composition of the present invention has a low viscosity, and can be used to fill even narrow gaps without causing voids or the like.

[0085] The liquid composition of the present invention is preferably used as a liquid encapsulant, and particularly preferably as an underfill material. The underfill material is preferably used in the manufacture of electrical devices, particularly semiconductor devices, and is preferably used to fill gaps formed, for example, between a substrate and a semiconductor chip, or between substrates or between semiconductor chips. Any known substrate can be used as the substrate, and it is preferable to use a substrate made of an organic material such as an epoxy resin substrate or a phenolic resin substrate. Furthermore, it is preferable to form the semiconductor chip from a semiconductor substrate such as a silicon substrate. The liquid composition of the present invention has a low coefficient of thermal expansion when cured, and when used as an underfill material, the difference in the coefficient of thermal expansion between the composition and semiconductor substrates and the like is reduced, thereby improving thermal cycle resistance and the like.

[0086] The underfill material is preferably used as a sealant that fills the gap between the substrate and the semiconductor chip in a laminate in which a semiconductor chip is mounted on a substrate, and then hardens by heating to seal the gap between the substrate and the chip. In this case, the semiconductor chip may be bonded to the surface of the substrate on which a wiring pattern is formed via bumps, for example, by reflow or the like, before the underfill material is filled.

[0087] The underfill material may be used in the manufacture of semiconductor devices using a pre-apply method. Specifically, the underfill material is filled between the bumps on the surface of a semiconductor chip on which multiple bumps are formed, forming an underfill layer. The filled underfill material may be B-staged as necessary. The semiconductor chip on which the underfill layer is formed may then be placed on the surface of the substrate with the underfill layer facing the substrate. The underfill layer is then cured by heating and pressurizing, etc., to form an encapsulant, and the semiconductor chip may be bonded via the bumps to the surface of the substrate on which a wiring pattern is formed.

[0088] In the pre-apply method, an underfill layer may be formed by applying an underfill to the surface of a substrate on which a wiring pattern has been formed. The applied underfill layer may be B-staged as necessary. The semiconductor chip on which the bumps have been formed may then be placed on the substrate on which the underfill layer has been formed, with the bump-formed surface facing the surface of the substrate on which the underfill layer has been formed. The underfill layer is then cured by heating and pressurizing, etc., to form an encapsulant, and the semiconductor chip may be bonded to the surface of the substrate on which the wiring pattern has been formed via the bumps.

[0089] In the above description, the underfill material is used as a sealing material to fill the gap between the substrate and the semiconductor chip, but the use of the underfill material is not particularly limited, and it may be used to fill the gap between semiconductor chips, or as a sealing material to fill the gap between substrates, etc. Furthermore, the substrate is not limited to a substrate made of an organic material, and may be a semiconductor substrate, etc. [Example]

[0090] The present invention will be described in more detail below using examples, comparative examples, and reference examples, but the present invention is not limited to the following examples, comparative examples, and reference examples as long as they do not deviate from the spirit of the present invention. <Zeolite synthesis> [Experimental Example 1] (Production of Zeolite Filler A1) N,N,N-trimethyl-1-adamantaammonium hydroxide (TMAdaOH) manufactured by Seichem Co., Ltd. as a structure-directing agent (SDA), Kyoward 200S manufactured by Kyowa Chemical Industry Co., Ltd. as aluminum hydroxide, and AEROSIL 200 manufactured by Nippon Aerosil Co., Ltd. as silica were sequentially added to a vessel. The composition and molar ratio of the resulting mixture was SiO2:Al2O3:TMAdaOH:HO = 1.0:0.025:0.4:20. After thorough mixing, the resulting mixture was placed in a pressure-resistant vessel and subjected to hydrothermal synthesis in an oven at 150 °C for 48 hours. The mixture was suction-filtered, washed, and then dried. The resulting powder was calcined at 600 °C for 6 hours in an air stream to remove the structure-directing agent (SDA), TMAdaOH, and obtain CHA-type zeolite. The resulting zeolite had a particle size distribution as shown in Figure 1, with each particle having a particle size ranging from 1.0 μm to 10 μm, and an average primary particle size of 3.1 μm. The average primary particle size was determined as the average particle size of 50 randomly selected primary particles. The average thermal expansion coefficient at 50 to 100°C was -9.0 ppm / K, the average thermal expansion coefficient at 50 to 350°C was -17.0 ppm / K, the Si / Al2 ratio was 27.8, the sphericity was 0.85, the circularity was 0.845, the c-axis length was 14.67 Å, ​​and the counter cation was proton type.

[0091] [Experimental Example 2] (Production of Zeolite Filler A2) CHA-type zeolite was obtained in the same manner as in Experimental Example 1, except that the hydrothermal synthesis was performed while rotating the heat-resistant container in the hydrothermal synthesis step. The obtained zeolite had a particle size distribution as shown in FIG. 2, with 99% of the particles having a particle size in the range of 1.0 μm to 10 μm on a volume basis. The average primary particle size was 2.4 μm. The average primary particle size was measured in the same manner as in Experimental Example 1. The average thermal expansion coefficient at 50 to 100°C was -9.0 ppm / K, the average thermal expansion coefficient at 50 to 350°C was -12.1 ppm / K, the Si / Al2 ratio was 27.8, the sphericity was 0.82, the circularity was 0.829, the c-axis length was 14.59 Å, and the counter cation was a proton type.

[0092] [Experimental Example 3] (Production of Zeolite Filler A3) In Experimental Example 2, hydrothermal synthesis, drying, and calcination were performed in the same manner as in Experimental Example 2, except that the composition and molar ratio of the raw material mixture was SiO2:Al2O3:TMAdaOH:HO = 1.0:0.020:0.4:20. CHA-type zeolite was obtained through hydrothermal synthesis, drying, and calcination. The obtained zeolite had 81% by volume of particles with a particle size ranging from 1.0 μm to 10 μm. The average primary particle size was 1.2 μm. The average primary particle size was measured in the same manner as in Experimental Example 1. The average thermal expansion coefficient at 50 to 100°C was -13.7 ppm / K, the average thermal expansion coefficient at 50 to 350°C was -12.9 ppm / K, the Si / Al2 ratio was 28.2, the sphericity was 0.84, the circularity was 0.835, the c-axis length was 14.59 Å, and the counter cation was proton type.

[0093] [Experimental Example 4] (Production of Zeolite Filler A4) N,N,N-trimethyl-1-adamantaammonium hydroxide (TMAdaOH) manufactured by Seichem Corporation and aluminum hydroxide manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. were sequentially added to a vessel as a structure-directing agent (SDA). After aging at 80°C for 12 hours, Cabot Corporation's "CAB-O-SIL M-5" silica was added. The composition and molar ratio of the resulting mixture was SiO2:Al2O3:TMAdaOH:HO = 1.0:0.025:0.4:20. After thorough mixing, the resulting mixture was placed in a pressure-resistant vessel and subjected to hydrothermal synthesis in an oven at 150°C for 48 hours. CHA-type zeolite was obtained by suction filtration and washing. The resulting zeolite had particle sizes ranging from 1.0 μm to 10 μm, with an average primary particle size of 3.1 μm. The average primary particle size was measured as in Experimental Example 1. The average thermal expansion coefficient between 50 and 100°C was -5.0 ppm / K, but because TMAdaOH decomposed when heated above 300°C, the average thermal expansion coefficient between 50 and 350°C could not be measured. The Si / Al2 ratio was 27.8, the sphericity was 0.84, the roundness was 0.840, and the c-axis length was 14.87 Å.

[0094] [Experimental Example 5] (Production of Zeolite Filler A5) The following structure-directing agents (SDAs) were added to the vessel: N,N,N-trimethyl-1-adamantaammonium hydroxide (TMAdaOH) manufactured by Seichem Co., Ltd.; sodium hydroxide manufactured by Kishida Chemical Co., Ltd.; potassium hydroxide manufactured by Kishida Chemical Co., Ltd.; aluminum hydroxide manufactured by Aldrich; and "Snowtex 40" manufactured by Nissan Chemical Co., Ltd. as silica. The composition and molar ratio of the resulting mixture was SiO2:Al2O3:NaOH:KOH:TMAdaOH:HO = 1.0:0.033:0.1:0.06:0.07:20. After adding 2% by mass of CHA-type zeolite as seed crystals relative to SiO2 and mixing thoroughly, the resulting mixture was placed in a pressure-resistant vessel and subjected to hydrothermal synthesis in a 160°C oven for 48 hours while rotating the heat-resistant vessel. The powder obtained by suction filtration and washing was calcined at 600°C for 6 hours under air flow to remove the structure-directing agent, thereby obtaining CHA-type zeolite. The resulting zeolite had a particle size distribution as shown in Figure 3, with 17% of the particles by volume ranging in size from 1.0 μm to 10 μm. The average primary particle size was 0.5 μm. The average primary particle size was measured in the same manner as in Experimental Example 1. The average thermal expansion coefficient at 50 to 100°C was -4.9 ppm / K, the average thermal expansion coefficient at 50 to 350°C was -5.87 ppm / K, the Si / Al2 ratio was 20.0, and the zeolite had a cubic shape. The sphericity was 0.59, the circularity was 0.785, the c-axis length was 14.83 Å, and the countercations were sodium and potassium types. The results of Experimental Examples 1 to 5 are summarized in Table 1.

[0095] [Table 1]

[0096] The results in Table 1 indicate that large-particle-size zeolite has a large average primary particle size, and is spherical based on the sphericity and roundness results. Furthermore, the thermal expansion coefficient is large in the negative direction, indicating a large thermal shrinkage rate. Therefore, it is believed that by using this zeolite in combination with a resin, a resin composite with reduced thermal expansion can be obtained. Furthermore, the zeolite of Experimental Example 4, which was not calcined after hydrothermal synthesis, had a c-axis length comparable to that of the zeolite of Experimental Example 5, which was produced by a conventional production method. In contrast, the zeolite of Example 1, which was produced by calcining after hydrothermal synthesis, had a shorter c-axis length. Therefore, it is presumed that the large particle size zeolite had a lower thermal expansion coefficient due to its shorter c-axis length.

[0097] Next, examples of the composition and resin composite material of the present invention will be described below. <Composition ingredients> The ingredients used to prepare the liquid composition are as follows: <Inorganic filler> As the zeolite fillers A1, A3 and A4, the zeolite fillers A1, A3 and A4 produced in the above-mentioned Experimental Examples were used. Inorganic fillers other than the zeolite fillers A1 to A5 are as follows. Silica filler A: Tatsumori Co., Ltd., product name "HL-3100" (average particle size 45 μm, spherical silica filler) Silica filler B: Admatechs Co., Ltd. product name "SC2053-SQ" (average particle size 0.5 μm, silica with particle sizes between 0.1 μm and 1.0 μm, sphericity 0.95) Zeolite filler B: (CHA zeolite with particle size of less than 1.0 μm, average primary particle size 0.1 to 0.2 μm, sphericity 0.58)

[0098] <Epoxy resin> Mitsubishi Chemical Corporation, product name "jER630" (p-aminophenol type epoxy resin, epoxy equivalent: 97g / equivalent) <Polyimide powder> Ube Industries, Ltd., product name "UIP-R" (polyimide, average particle size: 7 μm, specific gravity 1.39) <Curing agent> Acid anhydride curing agent: Hitachi Chemical Co., Ltd., product name "HN-2200" (methyltetrahydrophthalic anhydride, amine equivalent 83g / equivalent) <Dispersant> Dispersant A: BYK Japan, wetting and dispersing agent, product name "DISPERBYK-2152" (amino group-containing ultra-molecular weight polyester, comb type, solvent-free) Dispersant B: BYK Japan, wetting and dispersing agent, product name "DISPERBYK-145" (comb-type polymer polyester, terminal phosphate-modified amine salt, solvent-free) Dispersant C: BYK Japan, wetting and dispersing agent, product name "BYK-W9010" (phosphate polyester, solvent-free)

[0099] (Physical property evaluation) The physical properties were evaluated as follows. (gel fraction) The gel fraction of the resin composite was measured using the following procedure. A resin composite sample was prepared under conditions of 80°C for 2 hours and then 120°C for 2 hours. A 0.5-0.6g sample was cut out from the sample and placed on a wire mesh. The wire mesh was left immersed in acetone for 24 hours. The wire mesh was then removed from the acetone and vacuum dried. The ratio of the weight of the sample after immersion to the weight before immersion was taken as the gel fraction. (Viscosity of liquid composition) The viscosity of the liquid composition at 23°C was measured using a Brookfield "LVDV-1 Pri" rotational viscometer with spindles S64 and S63 when the viscosity was 0.1 to 100 Pa·s, and a Brookfield "HBDV-E" rotational viscometer with spindle S-07 when the viscosity exceeded 100 Pa·s. The value measured at 20 rpm was used as the representative viscosity value for each sample.

[0100] (Average coefficient of thermal expansion (CTE1) of epoxy resin and epoxy resin composites) The average coefficient of thermal expansion of epoxy resin composites obtained by curing the liquid composition to a gel fraction of 80% or more was measured by thermomechanical analysis according to JIS K7197 (2012). Measurements were performed using a thermomechanical analyzer (TMA SS7100, manufactured by SII NanoTechnology) using the compression method. Specifically, the epoxy resin composites were cut into pieces measuring 6 mm in diameter and 10 mm in length. The temperature was lowered from 200°C to 20°C at a rate of 5°C / min using the thermomechanical analyzer. The change in sample length with temperature from 25°C to 100°C was measured, and the slope of the tangent was taken as the average coefficient of thermal expansion (CTE).

[0101] (Average coefficient of thermal expansion (CTE1) of polyimide resin and polyimide resin composites) The average coefficient of thermal expansion of polyimide resin composites cured to a gel fraction of 80% or greater was measured by thermomechanical analysis according to JIS K7197 (2012). Measurements were performed using a thermomechanical analyzer (TMA SS7100, manufactured by SII NanoTechnology) using the compression method. Specifically, polyimide resin composites were cut into pieces 10 mm wide, 6 mm thick, and 10 mm high. The temperature was lowered from 200°C to 20°C at a rate of 5°C / min using the thermomechanical analyzer. The change in sample length with temperature from 25°C to 100°C was measured, and the slope of the tangent was taken as the average coefficient of thermal expansion (CTE).

[0102] (glass transition temperature of epoxy resin composite) The glass transition temperature (Tg) of the epoxy resin composite obtained by curing the liquid composition to a gel fraction of 80% or more was measured using a thermomechanical analyzer (TMA). Specifically, measurements were performed using the same equipment and conditions as in the evaluation of the thermal expansion coefficient described above, and a graph was created with temperature on the X-axis and the linear expansion coefficient on the Y-axis. CTE'1 was determined from the slope of the tangent line of this graph between 15 and 75°C, and CTE'2 was determined from the slope of the tangent line between 150 and 200°C, and the glass transition temperature Tg (°C) was determined from the intersection of CTE'1 and CTE'2.

[0103] [Example 1] 13 g of epoxy resin, 17 g of curing agent, 59 g of zeolite filler A1, 10 g of silica filler B, and 1 g of dispersant A were weighed and mixed in a cup to obtain the formulation shown in Table 2. The mixture was then mixed at 1500 rpm for 5 minutes using a vacuum mixer (EME Corporation, "V-mini 300") to prepare a liquid composition. The viscosity of this liquid composition at 23°C was measured using a rotational viscometer. The mixture was then poured into a mold and heated at 80°C for 2 hours, then at 120°C for 2 hours to cure to a gel fraction of 80% or more. The mixture was then demolded to obtain an epoxy resin composite.

[0104] [Comparative Example 1] 21 g of epoxy resin, 29 g of curing agent, and 50 g of silica filler A were weighed into a cup and mixed by hand to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio. Comparative Example 2 17 g of epoxy resin, 23 g of curing agent, and 60 g of zeolite filler B were weighed into a cup and mixed by hand to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0105] [Reference example 1] 21 g of epoxy resin, 29 g of curing agent, and 50 g of zeolite filler A1 were weighed into a cup and mixed by hand to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0106] [Reference example 2] 17.2 g of epoxy resin, 23.2 g of curing agent, and 59.6 g of zeolite filler A1 were weighed into a cup and mixed by hand to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0107] [Reference example 3] 17 g of resin, 23 g of curing agent, 59 g of zeolite filler A1, and 1 g of dispersant C were weighed and mixed in a cup to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0108] [Example 2] 17 g of epoxy resin, 23 g of curing agent, 59 g of zeolite filler A1, and 1 g of dispersant A were weighed and mixed in a cup to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0109] [Example 3] 17 g of epoxy resin, 23 g of curing agent, 59 g of zeolite filler A1, and 1 g of dispersant B were weighed and mixed in a cup to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0110] [Example 4] 9.9 g of epoxy resin, 14.9 g of curing agent, 49.5 g of zeolite filler A1, 24.7 g of silica filler B, and 1 g of dispersant A were weighed into a cup and mixed by hand to obtain the formulation shown in Table 2. A liquid composition and a resin composite were obtained in the same manner as in Example 1 except for the formulation ratio.

[0111] The viscosity of the liquid compositions was measured in Examples 1 to 4, Comparative Examples 1 and 2, and Reference Examples 1 to 3, and the average coefficient of thermal expansion (CTE1) and glass transition temperature Tg of the epoxy resin composite materials were also measured. The results are shown in Table 2.

[0112] [Table 2]

[0113] Comparative Example 3 A liquid composition and a resin composite were obtained in the same manner as in Reference Example 2, except that the zeolite filler was not used. The viscosity of the liquid composition was 0.4 Pa s, and the average coefficient of thermal expansion (CTE1) of the epoxy resin composite was 64 ppm / K.

[0114] [Reference example 4] A liquid composition and a resin composite were obtained in the same manner as in Reference Example 2, except that Zeolite Filler A3 was used instead of Zeolite Filler A1 in Reference Example 2. The average coefficient of thermal expansion (CTE1) of the epoxy resin composite was 20 ppm / K.

[0115] [Reference example 5] A liquid composition and a resin composite were obtained in the same manner as in Reference Example 2, except that Zeolite Filler A4 was used instead of Zeolite Filler A1 in Reference Example 2. The average coefficient of thermal expansion (CTE1) of the epoxy resin composite was 30 ppm / K.

[0116] Comparing Examples 2 and 3 with Reference Examples 2 and 3, it was found that the addition of Dispersant A or B had a viscosity-reducing effect, confirming that Dispersants A and B, which contain amino groups or amine salts, are effective in reducing viscosity. Furthermore, the addition of a dispersant ensures that the resin composites of Examples 2 and 3 have sufficiently high glass transition temperatures Tg, excellent thermal cycle resistance, and an average thermal expansion coefficient that makes them suitable for use as underfill materials.

[0117] Furthermore, in Examples 1 and 4, the use of a small-particle-size inorganic filler in combination reduced the coefficient of thermal expansion of the epoxy resin composite obtained by curing the liquid composition, while also reducing the viscosity of the liquid composition. In contrast, in Comparative Example 1, a large-particle-size silica filler was added at a content similar to that of the large-particle-size zeolite in Example 4, resulting in a lower viscosity liquid composition but a higher average coefficient of thermal expansion (CTE1). This demonstrates that the use of a zeolite, a dispersant containing an amino group or an amine salt, and a small-particle-size inorganic filler in combination can produce a low-viscosity liquid composition, and that curing this liquid composition can produce a resin composite with a particularly low coefficient of thermal expansion. Furthermore, Example 4 and Reference Example 1 contain similar amounts of large-particle zeolite, but both were able to reduce the average coefficient of thermal expansion (CTE1) to a certain extent while also reducing the viscosity. In particular, Example 4 had a lower average coefficient of thermal expansion (CTE1) than Reference Example 1. Furthermore, the above results confirm that by including large-particle size zeolite, a liquid composition with low viscosity can be obtained, and that the thermal expansion coefficient of the resin composite material obtained by curing this liquid composition can be reduced. In particular, a comparison between Example 3 and Reference Example 4, which contain the zeolite of Experimental Example 1 or 3, and Reference Example 5, which contains the zeolite of Experimental Example 4, confirmed that the inclusion of large-particle size zeolite results in a resin composite with a low thermal expansion coefficient. Compared to the resin composite of Comparative Example 1, which contained a large-particle size silica filler, the resin composites of Reference Examples 1 and 2, which contained large-particle size zeolite, had lower thermal expansion coefficients. Also, compared to the liquid composition of Comparative Example 2, which contained a small-particle size zeolite, the liquid compositions of Reference Examples 1 and 2, which contained large-particle size zeolite, had lower viscosity. That is, it was demonstrated that by including large-particle size zeolite, a liquid composition with low viscosity can be obtained, and the thermal expansion coefficient of the resin composite obtained by curing this liquid composition can be reduced. In Comparative Example 2 and Reference Example 2, when a zeolite filler was added and the content was increased further than in Comparative Example 1 and Reference Example 1, the average coefficient of thermal expansion (CTE1) was lowered. Here, the viscosity of the liquid composition in Reference Example 2 was not increased compared to Comparative Example 2, and therefore it was considered suitable as an underfill material to be used by filling gaps. In other words, it was confirmed that by using the large particle size zeolite of the present invention, a low-viscosity liquid composition can be obtained, and by curing this, a resin composite material with a low coefficient of thermal expansion can be obtained.

[0118] [Reference example 6] 21 g of polyimide powder and 9 g of zeolite filler A1 produced in Experimental Example 1 were weighed into a cup, mixed, and then spread into a pressing mold. The mold was placed in a high-temperature vacuum press (Kitagawa Seiki Co., Ltd.) and pressed at a temperature of 390°C and a pressure of 8 MPa for 30 minutes. The mold was then demolded to obtain a molded product measuring 11 cm in length, 2.5 cm in width, and 6 mm in thickness. This was cut into 10 mm pieces from the edge, and the average thermal expansion coefficient was measured. The results are shown in Table 3.

[0119] Comparative Example 4 A molded body was produced in the same manner as in Reference Example 5, except that the zeolite filler A4 produced in Experimental Example 4 was used as the zeolite in Reference Example 5, and its average thermal expansion coefficient was measured. The results are shown in Table 3.

[0120] Comparative Example 5 A molded body was produced in the same manner as in Reference Example 5, except that the zeolite filler was not used, and its average thermal expansion coefficient was measured. The results are shown in Table 3.

[0121] [Table 3]

[0122] It has been confirmed that the use of the large-particle zeolite of the present invention in polyimide resin composites can produce resin composites with a low thermal expansion coefficient, similar to the case of epoxy resins. Therefore, it is believed that the use of a dispersant containing an amino group or an amine salt in combination with the large-particle zeolite can produce compositions with even lower viscosity. [Industrial Applicability]

[0123] According to the present invention, a low-viscosity liquid composition can be provided. Furthermore, by curing this liquid composition, a resin composite material having a low thermal expansion coefficient can be provided. That is, the composition of the present invention can provide an encapsulant having excellent injectability and heat resistance, and is particularly useful as an underfill material. The resin composite material of the present invention having a low thermal expansion coefficient is also useful as a sealing material produced by press molding or the like.

Claims

1. A liquid composition containing a resin, a zeolite, and a dispersant having at least one functional group selected from an amino group and an amine salt, The content of the zeolite contained in the liquid composition is 25% by mass or more based on the total amount of the liquid composition, The liquid composition, wherein the particle size of the zeolite is 1.0 μm or more and 10 μm or less.

2. 2. The liquid composition according to claim 1, wherein the resin is at least one selected from the group consisting of epoxy resins and polyimide resins.

3. 3. The liquid composition according to claim 1, wherein the zeolite contains d6r as a CBU and is an aluminosilicate.

4. The liquid composition according to any one of claims 1 to 3, wherein the zeolite is spherical.

5. The liquid composition according to any one of claims 1 to 4, wherein the c-axis length of the lattice constant of the zeolite is 14.80 Å or less.

6. The resin is an epoxy resin, the content of the zeolite is 40 to 70 mass%, and the viscosity at 23 ° C. is 0.1 Pa s or more and 250 Pa s or less. The liquid composition according to any one of claims 1 to 5.

7. The liquid composition according to any one of claims 1 to 6, which is in a liquid state and has a viscosity at 23°C of 1 Pa·s or more and 30 Pa·s or less.

8. A liquid composition described in any one of claims 1 to 7, wherein the content of the zeolite contained in the liquid composition is 90 mass% or less relative to the total amount of the liquid composition.

9. A liquid sealant comprising the liquid composition according to any one of claims 1 to 8.

10. A resin composite material obtained by curing the liquid composition according to any one of claims 1 to 8 to a gel fraction of 80% or more.

11. A resin composite material comprising the liquid composition according to any one of claims 1 to 8.

12. 12. The resin composite material according to claim 10, wherein the average thermal expansion coefficient determined by the following method is 0 ppm / K or more and 200 ppm / K or less. (Note that the average coefficient of thermal expansion is determined in accordance with JIS K7197 (2012) by measuring the temperature change in the amount of change in sample length at 25 to 100°C using a compression method using thermomechanical analysis, and then determining it from the slope of the tangent.)

13. The resin composite material according to claim 12, wherein the average thermal expansion coefficient at 25 to 100°C is 10 to 30 ppm / K.

14. A sealing material comprising the resin composite material according to any one of claims 11 to 13.

15. An electronic device comprising the resin composite material according to any one of claims 11 to 13.

16. A method for producing a sealing material, comprising filling a gap with the liquid composition according to any one of claims 1 to 8 and then curing the liquid composition.

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