Target material separation control device using laser diode

Abstract

A target material separation control device using a laser diode according to an embodiment of the present invention may include a separation disk including a plurality of chambers and channels connecting the plurality of chambers, and separating a target material from a sample by centrifugal force generated by rotation, a printed circuit board assembly that is detachably connected to the separation disk and includes a laser diode that irradiates a valve in the channel with a laser to generate heat to open and close the valve, and a coupling portion that is inserted through the printed circuit board assembly and couples and fixes the printed circuit board to the separation disk.

Description

[Technical Field]

[0001] The present invention relates to a target material separation control device using a laser diode, and more particularly to a target material separation control device using a laser diode that uses a laser diode to increase the wax temperature of a valve installed in a channel connecting chambers of a separation disk, thereby accurately and smoothly opening and closing the valve. [Background technology]

[0002] Most deaths from malignant tumors are due to metastasis to tissues and organs distant from the initial site of tumor formation. Therefore, early detection of metastasis is an important determinant of a cancer patient's chances of survival.

[0003] Early detection of tumors and monitoring of tumor growth are considered critical elements in the successful treatment of cancer patients.

[0004] Cancer diagnosis generally utilizes histopathological diagnostic techniques, which use tissue samples obtained from biopsies to diagnose tumors. This histopathological approach allows direct observation of tumor cells.

[0005] Meanwhile, circulating tumor cells (CTCs) are known to be found in patients before tumors are first detected. Therefore, circulating tumor cells may play an important role in the early diagnosis and prognosis of cancer. Since cancer generally metastasizes via the blood, circulating tumor cells can also serve as a marker for diagnosing cancer metastasis.

[0006] For this reason, disc-type devices for extracting target cells, such as circulating tumor cells, from samples such as blood are being researched and developed.

[0007] Conventional disk devices, for example, include a disk with multiple chambers, which is rotated to generate centrifugal force, and the centrifugal force is used to separate target cells, such as circulating tumor cells, from blood.

[0008] The plurality of chambers may generally include a main chamber and a separation chamber connected to the main chamber by a channel, and a valve may be provided in the channel to allow material transfer by opening and closing the valve.

[0009] In conventional disk devices, the valve is generally made of wax or the like that can react to heat, and there is a risk that heat may not be transmitted sufficiently to the valve, causing errors in the valve's operation.

[0010] In response to this, there is a demand for the development of a cell separation control device with a new configuration that can operate the valves accurately and enable the separation of target cells to be carried out accurately and smoothly.

[0011] This invention is the result of a project under the Korea Research Foundation under the Ministry of Science and ICT's Biomedical Technology Development (R&D) program, which involves the production and operational performance verification of a mass-produced targeted cell separation device, and the development of inertial centrifugal microfluidic technology for the separation of fetal cells from pregnant women's blood for non-invasive early prenatal diagnosis. Summary of the Invention [Problem to be solved by the invention]

[0012] An embodiment of the present invention provides a target material separation control device using a laser diode, which uses a laser diode to increase the wax temperature of a valve installed in a channel connecting chambers of a separation disk, thereby accurately and smoothly opening and closing the valve.

[0013] The problems to be solved by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0014] A target material separation control device using a laser diode according to an embodiment of the present invention may include a separation disk including a plurality of chambers and channels connecting the plurality of chambers, and separating target materials from a sample by centrifugal force generated by rotation; a printed circuit board assembly detachably connected to the separation disk and including a laser diode that irradiates a valve in the channel with a laser to generate heat and thereby opens and closes the valve; and a coupling portion that penetrates the printed circuit board assembly and couples and fixes the printed circuit board to the separation disk.

[0015] According to one aspect, the printed circuit board assembly may include a first circuit board for control and a second circuit board on which the laser diode is mounted.

[0016] According to one aspect, the printed circuit board assembly may further include a connector disposed between the first circuit board and the second circuit board, the connector determining a position and angle of the second circuit board relative to the separation disc.

[0017] According to one aspect, the upper surface of the separation disk may have a shape that slopes downward from the center to the periphery, and the connecting portion may have a shape that slopes downward from the center to correspond to the slope of the upper surface of the separation disk, and the second circuit board may be coupled to a lower surface of the connecting portion.

[0018] According to one aspect, the plurality of chambers connected to the channels may be provided in a total of four sets along the circumferential direction of the separation disk, and four second circuit boards may be provided. When the printed circuit board assembly is coupled to the separation disk by the coupling portion, the positions of the four second circuit boards and the four sets of chambers may be aligned, and the positions of the laser diodes on the second circuit boards and the valves in the channels may coincide.

[0019] According to one aspect, the coupling portion may include a penetrating member that penetrates a center of the printed circuit board assembly and is inserted into a coupling hole provided in a center of the separation disk, and a rotating member that is provided at an upper end of the penetrating member and that presses the penetrating member to insert it into the coupling hole and then rotates the penetrating member to fix the penetrating member to the coupling hole and couple the printed circuit board assembly to the separation disk.

[0020] According to one aspect, the connecting holes of the separation disk may be provided with straight holes spaced at 180-degree intervals, and the lower end of the penetrating member may be provided with straight protrusions at 180-degree intervals corresponding to the shape of the connecting holes. After inserting the penetrating member into the connecting holes, the penetrating member may be rotated so that the straight protrusions of the penetrating member engage with the lower ends of the connecting holes and become fixed.

[0021] According to one aspect, the coupling portion may further include an elastic member sandwiched between the penetrating member so as to be positioned between the rotating member and an upper surface of the printed circuit board assembly through which the penetrating member penetrates, and which generates a force pressing the rotating member against the printed circuit board assembly, thereby strengthening the coupling force of the printed circuit board assembly to the separation disk.

[0022] According to one aspect, the printed circuit board assembly may further include a communication unit provided on the first circuit board for wirelessly communicating with an external device to control operation of the laser diode mounted on the second circuit board.

[0023] According to one aspect, a laser beam in the range of 750 nm to 890 nm may be irradiated through the laser diode to melt the bulb made of a thermoplastic resin or a phase transition material. [Effects of the Invention]

[0024] According to an embodiment of the present invention, the temperature of the wax in the valve provided in the channel connecting the chambers of the separation disk is increased using a laser diode, thereby enabling accurate and smooth opening and closing operations.

[0025] Furthermore, according to the embodiment of the present invention, the connection of the printed circuit board assembly to the separation disk can be performed quickly and accurately by the connection part, thereby enabling accurate alignment of the positions of the laser diode and the bulb.

[0026] In addition, according to an embodiment of the present invention, compared to the laser-controlled opening and closing method that rotates in synchronization with the existing disk, there is no restriction on the rotation speed and rotation direction, and full valve opening and closing is possible via wireless communication, so it can be effectively applied to improving the performance of target material separation control devices. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a front view of a target material separation control device using a laser diode according to an embodiment of the present invention. [Figure 2] FIG. 2 is an exploded perspective view of FIG. 1. [Figure 3] FIG. 2 is a perspective view of the separation disk of FIG. 1. [Figure 4] 2 is a bottom view of the printed circuit board assembly shown in FIG. 1. [Figure 5] 1A and 1B are diagrams showing another structure of a separation disk and a printed circuit board assembly coupled thereto, as a modified diagram of FIG. [Figure 6] 2 is a view showing a printed circuit board assembly being coupled to a separation disk by the coupling portion shown in FIG. 1; [Figure 7] 7A and 7B are sequential views illustrating the internal structure of the coupling hole shown in FIG. 6, in which a penetrating member of a coupling part is inserted into the coupling hole. DETAILED DESCRIPTION OF THE INVENTION

[0028] The advantages and / or features of the present invention, and methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. These embodiments are provided solely to complete the disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art. The present invention is defined only by the scope of the claims. The same reference numerals refer to the same elements throughout the specification.

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0030] FIG. 1 is a front view of a target material separation control device using a laser diode according to one embodiment of the present invention, FIG. 2 is an exploded perspective view of FIG. 1, FIG. 3 is a perspective view of the separation disk of FIG. 1, FIG. 4 is a view of the printed circuit board assembly shown in FIG. 1 from below, FIG. 5 is a modified view of FIG. 1, showing another structure of the separation disk and the printed circuit board assembly coupled thereto, FIG. 6 is a view showing the printed circuit board assembly coupled to the separation disk by the coupling part shown in FIG. 1, and FIG. 7 is a sequential view illustrating the internal structure of the coupling hole shown in FIG. 6, showing the structure in which the penetrating member of the coupling part is inserted into the coupling hole.

[0031] As shown in these drawings, particularly with reference to Figures 1 and 2, a target material separation control device 100 using a laser diode according to one embodiment of the present invention may include a separation disk 120, a disk rack 115 to which the separation disk 120 is attached, a disk fixing portion 190 for fixing the separation disk 120, a printed circuit board assembly 150 attached to the separation disk 120, a connecting portion 180 for connecting the printed circuit board assembly 150 to the separation disk 120, and a rotor 110 equipped with a fixing pin 112 fixed to the disk rack 115 and a motor (not shown) for generating rotational force.

[0032] To explain each component, the separation disk 120 of this embodiment, as shown in Figures 1 and 2, is rotated together with the rotor 110 by a motor that generates a driving force for rotation, and the centrifugal force generated thereby can be used to separate target substances from a sample, for example, target cells from blood.

[0033] More specifically, the rotor 110 is coupled to a disc rack 115 with a separation disc 120 inserted therein by a fixing pin 112, and the coupled separation disc 120 can be rotated together with the rotation of the rotor 110.

[0034] Here, the rotation speed of the rotor 110 is determined by the control of the control unit, and centrifugal force is generated in proportion to the rotation speed, which is used to smoothly separate target cells from blood within the separation disk 120.

[0035] In this embodiment, the above description concerns the case where a target substance, e.g., target cells such as circulating tumor cells, are separated from a sample, i.e., blood, through the operation of the separation disc 120. However, this is not limited to this, and the target substance separation control device 100 of this embodiment can be used to separate particles or cells contained in a biological sample, for example, the cells can be circulating tumor cells (CTCs).

[0036] 2 and 3, the separation disc 120 of this embodiment may include a plurality of unit chamber sets 130 each consisting of a plurality of groove-shaped chambers 132, 133, 134, 135, and 136, which are inserted into and coupled to the disc rack 115. With this configuration, circulating tumor cells, which are target cells, may be separated from blood in each unit chamber set 130 by using centrifugal force generated when the separation disc 120 coupled to the disc rack 115 rotates in accordance with the rotation of the rotor 110.

[0037] 3, a total of four unit chamber sets 130 are provided in this embodiment and may be arranged at 90-degree intervals along the circumference of the disc rack 115. As will be described later, some structures of the printed circuit board assembly 150 have corresponding structures, so that circulating tumor cells can be smoothly separated in each unit chamber set 130.

[0038] As mentioned above, each unit chamber set 130 includes multiple chambers 132, 133, 134, 135, and 136, which may include a main chamber 132, a plasma separation chamber 136, a mixing chamber 133, a separation chamber 134, and a target cell containing chamber 135, as shown in Figure 3.

[0039] For example, circulating tumor cells can be separated from blood using this chamber structure, but for this process to proceed smoothly, the valve 138 of the channel 137 connecting the chambers 132, 133, 134, 135, and 136 must operate smoothly.

[0040] Furthermore, the channel 137 connecting one chamber 132, 133, 134, 135, 136 to the adjacent other chambers 132, 133, 134, 135, 136, more specifically, the channel 137 connecting the main chamber 132 and the mixing chamber 133, is equipped with a valve 138 that is opened and closed by heat applied from the outside. In this embodiment, by precisely controlling the heat for opening and closing the valve 138, separated substances can move through the channel 137 connecting the chambers.

[0041] That is, the valves 138 must be opened and closed precisely by precisely irradiating the laser at the position of the valves 138 in the channel 137 to generate heat. In this embodiment, the opening and closing of each valve 138 can be precisely controlled through the printed circuit board assembly 150, which is integrated with the separation disk 120 and is provided so that the position of the valves 138 and the laser diode 175 are precisely aligned.

[0042] First, we will explain the valve 138 provided in the channel 137 of this embodiment. The valve 138 of this embodiment maintains a solid state when blocking the passage of the channel 137, and is also a thermoplastic resin or phase transition material that melts when heat is applied via the laser diode 175.

[0043] In this embodiment, the bulb 138 may be made of wax as a phase change material, which may be, but is not limited to, paraffin wax, microcrystalline wax, petrolatum wax, animal or vegetable synthetic wax, or natural wax.

[0044] Meanwhile, a thermoplastic resin may be used as the valve 138, and examples of the thermoplastic resin include COC (cyclic olefin copolymer), PMMA (polymethylmethacrylate), PC (polycarbonate), PS (polystyrene), POM (polyoxymethylene), PFA (perfluoralkoxy), PVC (polyvinylchloride), PP (polypropylene), PET (polyethylene terephthalate), PEEK (polyetheretherketone), PA (polyamide), PSU (polysulfone), and PVDF (polyvinylidene fluoride).

[0045] Meanwhile, the printed circuit board assembly 150 of this embodiment is coupled to the separation disk 120 as shown in FIGS. 1 to 4, and is provided with laser diodes 175 corresponding to each position of the valve 138 in the channel 137 of the separation disk 120, thereby enabling the opening and closing of the valve 138.

[0046] Furthermore, a plurality of laser diodes 175 are provided on the underside of the printed circuit board assembly 150 to correspond to the positions of the valves 138 of the aforementioned channels 137, and heat is generated by irradiating the valves 138, which are provided as wax, from the laser diodes 175, thereby opening the valves 138 and stopping the heat generation, thereby solidifying the valves 138 and blocking the channels 137.

[0047] To this end, the printed circuit board assembly 150 has a structure optimized for transferring heat to the bulb 138 through the laser diode 175, and is configured as follows.

[0048] As shown in Figures 1 to 4, the printed circuit board assembly 150 of this embodiment may include a first circuit board 151 for control, a connection part 160 connected to the lower part of the first circuit board 151, and a second circuit board 170 connected to the lower end of the connection part 160 and having a laser diode 175 mounted thereon.

[0049] First, as shown in FIG. 3, the first circuit board 151 of this embodiment has a circular plate shape corresponding to the shape of the separation disc 120, and a number of components for control can be mounted thereon.

[0050] For example, the first circuit board 151 may be provided with a communication unit (not shown) for wirelessly communicating with an external device and controlling the operation of the laser diode 175 mounted on the second circuit board 170. For example, the external device may issue a command signal to the communication unit for operating the laser diode 175, and the control unit provided on the first circuit board 151 may drive the laser diode 175 based on the command signal received by the communication unit to control the opening and closing of the valve 138 in the channel 137.

[0051] Additionally, by mutual operation of the communication unit and the control unit, it is possible to control not only the driving of the laser diode 175 but also the rotation speed and direction of the rotor.

[0052] Meanwhile, the connecting portion 160 of this embodiment is coupled to the lower end of the first circuit board 151 as shown in FIGS. 1 and 4, thereby determining the position and inclination angle of the second circuit board 170 described later.

[0053] As described above, the separation disk 120 of this embodiment has a total of four unit chamber sets 130, each consisting of a plurality of chambers 132, 133, 134, 135, and 136, spaced at 90-degree intervals. Referring to FIG. 4, the connection parts 160 of this embodiment may also be provided in total of four, corresponding to the positions of the unit chamber sets 130.

[0054] 1 to 3, the upper surface of the separation disk 120 may be flat, or may have a shape that slopes downward from the center of the separation disk 120a to the outside as shown in Fig. 5. The shapes and coupling structures of the separation disk 120a and the printed circuit board assembly 150a will now be described with reference to Fig. 4.

[0055] FIG. 5 is a diagram showing another structure of the separation disk and the printed circuit board assembly coupled thereto, as a modified diagram of FIG.

[0056] As shown in the figure, in order to further ensure the separation of target materials in each unit chamber set 130a of the separation disk 120a, the separation disk 120a may have a shape that slopes downward from the center to the outside, and the connecting portion 160a also has a corresponding shape that slopes downward from the center, and therefore the position and slope angle of the second circuit board 170a coupled to the lower end surface of the connecting portion 160a may also correspond to the sloped shape of the separation disk 120a.

[0057] Therefore, when the printed circuit board assembly 150a is coupled to the separation disk 120a, the second circuit boards 170a coupled to the divided connecting portions 160a respectively tightly cover the corresponding unit chamber sets 130a. At this time, the laser diode 175 (see FIG. 1) mounted on the second circuit board 170a is accurately positioned at the position of the valve 138 in the channel 137, so that heat can be accurately provided from the laser diode 175 to the valve 138.

[0058] Furthermore, the size of the laser wavelength irradiated through the laser diode 175 is in the wavelength range of 750 nm to 890 nm, and the energy output therethrough is in the range of 0.7 to 2.5 W.

[0059] However, even if a laser is irradiated from the laser diode 175, if the transfer of the laser heat is insufficient, the valve 138 will not open or close properly. Therefore, it is important that the printed circuit board assembly 150 is accurately coupled to the separation disk 120, that the contact between the laser diode 175 and the valve 138 is accurate, and that the heat transfer is sufficient. For this reason, this embodiment further includes a coupling part 180.

[0060] As shown in Figures 6 and 7, the coupling portion 180 of this embodiment has a structure in which it is coupled to the printed circuit board assembly 150 so as to penetrate therethrough and is partially coupled to the disc rack 115, thereby facilitating coupling and decoupling of the printed circuit board assembly 150 to the separation disc 120.

[0061] Referring to FIG. 6, the coupling part 180 of this embodiment may include a penetrating member 181 that penetrates the center of the printed circuit board assembly 150 and is inserted into a coupling hole 140 provided in the center of the disc rack 115, and a rotating member 185 that is provided at the upper end of the penetrating member 181 and presses the penetrating member 181 to insert it into the coupling hole 140, and then rotates the penetrating member 181 to fix the penetrating member 181 to the coupling hole 140, ultimately firmly coupling the printed circuit board assembly 150 to the separation disc 120.

[0062] Referring to FIG. 7, a fixing groove 146 having a shape perpendicular to the hole 145 is provided inside the coupling hole 140. After the protrusion 183 of the piercing member 181 is inserted through the hole 145, the piercing member 181 is rotated 90 degrees, and then the pressure on the piercing member 181 is released, whereby the protrusion 183 can be fixed to the fixing groove 146 provided inside the coupling hole 140.

[0063] As shown in FIG. 7, the coupling hole 140 provided at the center of the disk rack 115 may have straight holes 145 at 180-degree intervals.

[0064] The lower end of the through-hole 181 is provided with linear protrusions 183 at 180-degree intervals to correspond to the shape of the coupling hole 140. With this configuration, when the through-hole 181 is inserted into the coupling hole 140 and then rotated, the linear protrusions 183 of the through-hole 181 are hooked onto the lower end of the coupling hole 140 and fixed thereto, and based on this principle, the printed circuit board assembly 150 can be fixed to the disk rack 115 via the coupling part 180.

[0065] Meanwhile, the coupling portion 180 of this embodiment may further include an elastic member 187 to strengthen the coupling between the printed circuit board assembly 150 and the separation disk 120. The elastic member 187 of this embodiment is sandwiched between the penetrating member 181 and positioned between the rotating member 185 and the upper surface of the printed circuit board assembly 150 through which the penetrating member 181 penetrates, as shown in Fig. 6, to generate a force pressing the rotating member 185 upward, thereby generating an effect of pressing the printed circuit board assembly 150 toward the separation disk 120, thereby strengthening the coupling force between the separation disk 120 and the printed circuit board assembly 150.

[0066] That is, once the connection of the printed circuit board assembly 150 to the separation disk 120 is completed using the connection part 180, the position of the laser diode 175 on the second circuit board 170 coincides with the position of the valve 138 provided in the channel 137 connecting the chambers 132, 133, 134, 135, and 136. Through this, heat can be accurately transferred from the laser diode 175 to the valve 138, thereby accurately opening and closing the channel 137 using the valve 138.

[0067] However, the coupling structure of the separation disk 120 and the printed circuit board assembly 150 by the coupling part 180 is not limited thereto, and it goes without saying that, for example, a screw coupling method, a fitting method, a magnetic coupling method, etc. may be applied.

[0068] As described above, according to the embodiment of the present invention, the laser diode 175 is used to increase the wax temperature of the valve 138 provided in the channel 137 of the separation disk 120, thereby allowing the valve 138 to be opened and closed accurately and smoothly.

[0069] In addition, the connection of the printed circuit board assembly 150 to the separation disk 120 can be performed quickly and accurately by the connection part 180, and thus the positions of the laser diode 175 and the bulb 138 can be aligned accurately.

[0070] In addition, unlike the existing laser-controlled opening and closing method that rotates in synchronization with the disk, this method is not limited by the rotation speed and direction, and allows for full valve opening and closing via wireless communication, so it can be effectively applied to improving the performance of target material separation control devices.

[0071] While specific embodiments of the present invention have been described above, it goes without saying that various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be determined solely by the described embodiments, but should be determined not only by the claims but also by equivalents to the claims.

[0072] As described above, even if the present invention has been described using limited embodiments and drawings, the present invention is not limited to the above embodiments, and various modifications and variations can be made by those skilled in the art to which the present invention pertains. Therefore, the spirit of the present invention should be grasped only by the scope of the claims, and all equivalent or similar modifications should be understood to fall within the spirit of the present invention.

Claims

1. a plurality of chambers; and a channel connecting the plurality of chambers; a separation disk that separates the target substance from the sample by centrifugal force generated by rotation; a printed circuit board assembly detachably coupled to the separation disk and including a laser diode for irradiating a valve in the channel with a laser to generate heat and thereby open and close the valve; a coupling portion that is provided to penetrate the printed circuit board assembly and that couples and fixes the printed circuit board assembly to the separation disk; a connector provided on the printed circuit board assembly for determining the position and angle of the laser diode relative to the separation disk; A target substance separation control device using a laser diode, comprising:

2. The printed circuit board assembly includes: a first circuit board for control; 2. The apparatus for controlling separation of a target material using a laser diode according to claim 1, further comprising: a second circuit board on which the laser diode is mounted.

3. The connecting portion is a first circuit board and a second circuit board, the second circuit board being disposed between the first circuit board and the second circuit board, the second circuit board being positioned and angled relative to the separation disc; 3. The target material separation control device using a laser diode according to claim 2, wherein the laser diode is formed in a shape corresponding to the shape of the separation disk.

4. The upper surface of the separation disk has a flat shape or a shape that slopes downward from the center to the outside, 4. The target material separation control device using a laser diode according to claim 3, wherein when the upper surface of the separation disk has the inclined shape, the connecting portion has a shape that is inclined downward from the center to correspond to the inclination angle of the upper surface of the separation disk, and the second circuit board is bonded to the lower surface of the connecting portion.

5. a total of four sets of the plurality of chambers connected to the channels are provided along the circumferential direction of the separation disk; The second circuit board is provided in four pieces, 5. The device for controlling separation of a target material using a laser diode according to claim 4, wherein when the printed circuit board assembly is coupled to the separation disk by the coupling portion, the positions of the four second circuit boards and the four sets of chambers are aligned, and the positions of the laser diodes on the second circuit boards and the valves in the channels coincide with each other.

6. The coupling portion is a through-hole that passes through the center of the printed circuit board assembly and is inserted into a coupling hole formed in the center of the separation disc; 2. The target material separation control device using a laser diode according to claim 1, further comprising a rotating member provided at an upper end of the penetrating member, which presses the penetrating member to insert it into the coupling hole, and then rotates the penetrating member to fix the penetrating member to the coupling hole and couple the printed circuit board assembly to the separation disk.

7. The connecting holes provided in the separation disc are provided with straight holes at 180-degree intervals, and straight protrusions corresponding to the shapes of the connecting holes are provided at 180-degree intervals on a lower end of the penetrating member, 7. A target material separation control device using a laser diode as described in claim 6, wherein the penetrating member is inserted into the coupling hole and then rotated so that the linear protrusion of the penetrating member is hooked onto the lower end of the coupling hole and fixed.

8. The coupling portion is 7. The device for controlling separation of a target material using a laser diode according to claim 6, further comprising an elastic member sandwiched between the penetrating member and an upper surface of the printed circuit board assembly through which the penetrating member penetrates, the elastic member generating a force pressing the rotating member against the printed circuit board assembly and strengthening a bonding force of the printed circuit board assembly to the separation disk.

9. The printed circuit board assembly includes:

3. The target material separation control device using a laser diode according to claim 2, further comprising a communication unit provided on the first circuit board for wirelessly communicating with an external device to control the operation of the laser diode mounted on the second circuit board.

10. 2. The target material separation control device using a laser diode according to claim 1, wherein a laser beam in the range of 750 to 890 nm is irradiated through the laser diode to melt the bulb made of a thermoplastic resin or a phase transition material.

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