Mounting system and mounting method

Abstract

To improve the productivity.SOLUTION: A mounting system 10 includes a board loading portion 27 and a board holding portion 9. The board loading portion 27 loads a board. The board holding portion 9 holds the board supplied from the board loading portion 27. The board holding portion 9 includes a mover 92. The mover 92 can move in a magnetically levitated state with respect to a stator 261 due to the magnetic force generated between the mover 92 and the stator 261.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure generally relates to a mounting system and a mounting method, and more particularly to a mounting system including a substrate holder that holds a substrate, and a mounting method used in the mounting system. [Background technology]

[0002] Patent Document 1 describes a mounting machine that includes a supply section, a board holding section, and a head section. The supply section has multiple supply units that each supply components. The board holding section holds the board on which the components will be mounted. The head section has multiple nozzles that each pick up components from the supply section and mount them on the board.

[0003] In the mounting machine described in Patent Document 1, a head unit is moved over a board held by a board holder, and a plurality of components held by a plurality of nozzles are mounted onto the board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-271094 Summary of the Invention [Problem to be solved by the invention]

[0005] In a mounting system (mounting machine) such as that described in Patent Document 1, improvement in productivity is desired.

[0006] An object of the present disclosure is to provide a mounting system and a mounting method that can improve productivity. [Means for solving the problem]

[0007] A mounting system according to an aspect of the present disclosure includes a substrate loading unit, a substrate holding unit, A head portion andThe substrate loading unit loads a substrate, and the substrate holding unit holds the substrate supplied from the substrate loading unit. The head unit has a component holding unit that holds components to be mounted on the board, and mounts the components held by the component holding unit onto the board held by the board holding unit. The substrate holder has a mover that is movable relative to the stator in a magnetically levitated state by a magnetic force generated between the mover and the stator. When the board holding unit and the head unit are positioned at a component mounting position where the component is mounted on the board, the component is mounted on the board by simultaneously moving the board holding unit in a direction in which the movable element approaches the stator and moving the component holding unit holding the component in a direction in which it approaches the board held by the board holding unit.

[0008] A mounting method according to one aspect of the present disclosure includes a moving step in which, with a substrate held by a substrate holder having a mover, the substrate holder is moved while being magnetically levitated relative to the stator by a magnetic force generated between the mover and a stator. The head unit has a component holder that holds a component to be mounted on the board, and mounts the component held by the component holder on the board held by the board holder. The mounting method further includes a mounting step. In the mounting step, while the board holder and the head unit are positioned at a component mounting position where the component is mounted on the board, the component is mounted on the board by concurrently performing an operation of moving the board holder in a direction in which the mover approaches the stator and an operation of moving the component holder holding the component in a direction in which the mover approaches the board held by the board holder. [Effects of the Invention]

[0009] According to the mounting system and mounting method according to one aspect of the present disclosure, it is possible to improve productivity. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a block diagram of a mounting system according to the first embodiment. [Figure 2] FIG. 2 is a schematic view showing a state before a substrate is supplied to a first substrate holding unit located at a substrate supply position, in relation to a first operation of the mounting system. [Figure 3] FIG. 3 is a schematic diagram showing a state in which a substrate is supplied to a first substrate holding unit located at a substrate supply position, in relation to a first operation of the mounting system. [Figure 4] Figure 4 is a schematic diagram showing the first operation of the mounting system, in which the first substrate holding unit moves to the component mounting position, the second substrate holding unit moves to the substrate supply position, and the third substrate holding unit moves to the standby position. [Figure 5] FIG. 5 is a schematic diagram showing a state in which a substrate is supplied to a second substrate holding unit located at a substrate supply position, in relation to a first operation of the mounting system. [Figure 6]Figure 6 is a schematic diagram showing the first operation of the mounting system, in which the first substrate holding unit moves to the substrate unloading position, the second substrate holding unit moves to the component mounting position, and the third substrate holding unit moves to the substrate supply position. [Figure 7] FIG. 7 is a schematic diagram showing a state in which the substrate has been moved from the first substrate holding unit located at the substrate unloading position to the substrate unloading unit in the first operation of the mounting system. [Figure 8] FIG. 8 is a schematic diagram showing a first state of the substrate holding unit in the mounting system. [Figure 9] FIG. 9 is a schematic view showing a second state of the substrate holding unit in the mounting system. [Figure 10] FIG. 10 is a schematic diagram showing a state in which the head unit and the substrate holding unit are fixed to the stator, in relation to a second operation of the mounting system. [Figure 11] FIG. 11 is a schematic diagram showing a state in which the head portion and the substrate holding portion are respectively floating above the stator, in relation to a second operation of the mounting system. [Figure 12] FIG. 12 is a schematic diagram showing a state in which the head unit moves to the component removal position and the board holding unit moves to the component mounting position, in relation to a second operation of the mounting system. [Figure 13] FIG. 13 is a schematic diagram showing a state in which the component holder of the head unit is picking up a component, in relation to a second operation of the mounting system. [Figure 14] FIG. 14 is a schematic diagram illustrating a state in which the component holder of the head unit is moving upward while holding a component, in relation to a second operation of the mounting system. [Figure 15] FIG. 15 is a schematic diagram showing a state in which the head unit and the substrate holding unit are respectively moving to component mounting positions in the second operation of the mounting system. [Figure 16] FIG. 16 is a schematic diagram illustrating a state in which the component holder of the head unit is moving toward the board, in connection with a second operation of the mounting system. [Figure 17]FIG. 17 is a schematic diagram illustrating a second operation of the mounting system, in which the board holding part and the component holding part of the head part are respectively moving downward. [Figure 18] FIG. 18 is a schematic diagram showing a state in which the component holder of the head unit is mounting components, in relation to a second operation of the mounting system. [Figure 19] FIG. 19 is a schematic diagram illustrating a state in which the component holder of the head unit is moving upward after component mounting, in connection with a second operation of the mounting system. [Figure 20] FIG. 20 is a schematic diagram showing a second operation of the mounting system, in which the head unit and the substrate holding unit are each moving for the next process. [Figure 21] FIG. 21 is a schematic diagram showing the configuration of a mounting system according to the second embodiment. [Figure 22] FIG. 22 is a schematic diagram showing the configuration of a mounting system according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The mounting systems according to the first and second embodiments will be described below with reference to the drawings. The drawings described in the following first and second embodiments are schematic diagrams, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Furthermore, the configurations described in the following first and second embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following first and second embodiments, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0012] (Embodiment 1) (1) Overview of the implemented system First, an overview of the mounting system 10 according to the first embodiment will be described.

[0013] 1 to 7, a mounting system 10 according to the first embodiment is a mounting device (mounting machine) for mounting components 100 on a mounting surface 201 of a substrate 200. The mounting system 10 is used in the production of various products such as electronic devices, automobiles, clothing, food, medicines, and crafts in facilities such as factories, laboratories, offices, and educational facilities.

[0014] In this embodiment, a case will be described in which the mounting system 10 is used in the manufacture of electronic devices in a factory. Typical electronic devices have various circuit boards, such as power supply circuits and control circuits. In the manufacture of these circuit boards, for example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a board (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the board. In the soldering process, for example, the board with the components mounted thereon is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 10 mounts the components 100 on the mounting surface 201 of the board 200.

[0015] Thus, the mounting system 10 used to mount the component 100 on the board 200 includes the board carry-in unit 27 and the board holding unit 9.

[0016] The substrate loading section 27 loads the substrate 200. The substrate holding section 9 holds the substrate 200 supplied from the substrate loading section 27. The substrate holding section 9 has a mover 92. The mover 92 is movable in a state of being magnetically levitated relative to the stator 261 by the magnetic force generated between the mover 92 and the stator 261.

[0017] In such a mounting system 10, the substrate holding unit 9 can be moved by the magnetic force generated between the mover 92 and the stator 261. This makes it possible to shorten the operation time compared to when the substrate holding unit is fixed, thereby improving the productivity of the mounting system 10. Furthermore, since the substrate holding unit 9 is levitated relative to the stator 261 and does not come into contact with the stator 261, it is possible to suppress wear, dust, etc. on at least one of the stator 261 and the substrate holding unit 9.

[0018] (2) Details of the implemented system Next, the mounting system 10 according to the first embodiment will be described in detail.

[0019] (2.1) Premise In this embodiment, as an example, a case will be described in which mounting system 10 is used to mount component 100 using surface mount technology (SMT). That is, component 100 is a surface mount device (SMD), and is mounted by being placed on the surface (mounting surface 201) of substrate 200. However, this is not limiting, and mounting system 10 may also be used to mount component 100 using insertion mount technology (IMT). In this case, component 100 is an insertion mount component having lead terminals, and is mounted on the surface (mounting surface 201) of substrate 200 by inserting the lead terminals into holes in substrate 200.

[0020] In this disclosure, "the substrate holder moves" refers to the displacement of the substrate holder while it is floating above the stator due to the magnetic repulsion force generated between the stator and the mover. Also, in this disclosure, "the substrate holder stops" refers to the stop of the substrate holder in close contact with the stator due to the magnetic attraction force generated between the stator and the mover.

[0021] In this disclosure, "the component recognition unit, the component disposal unit, or the nozzle replacement unit moves" refers to the component recognition unit, the component disposal unit, or the nozzle replacement unit being displaced while floating above the stator due to the magnetic repulsive force generated between the stator and the mover. Also, in this disclosure, "the component recognition unit, the component disposal unit, or the nozzle replacement unit stops" refers to the component recognition unit, the component disposal unit, or the nozzle replacement unit being stopped in close contact with the stator due to the magnetic attractive force generated between the stator and the mover.

[0022] In this disclosure, "orthogonal" refers not only to a state where the angle between two elements is exactly 90 degrees, but also to a state where the angle between two elements is within a tolerance range (for example, ±5 degrees) where a substantial effect is obtained. Similarly, in this disclosure, "parallel" refers not only to a state where the angle between two elements is exactly 0 degrees, but also to a state where the angle between two elements is within a tolerance range (for example, ±5 degrees) where a substantial effect is obtained.

[0023] In the following description, as an example, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are defined. The axes parallel to the surface (mounting surface 201) of the substrate 200 are defined as the "X-axis" and the "Y-axis," and the axis parallel to the thickness direction of the substrate 200 is defined as the "Z" axis. Furthermore, one of the two directions along the Z-axis is defined as the upward direction, and the other is defined as the downward direction. For example, when the head unit 1 faces the mounting surface 201 of the substrate 200, the substrate 200 is positioned below the head unit 1. The X-axis, the Y-axis, and the Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are merely shown for the purpose of explanation and do not have any physical substance. Furthermore, these directions are not intended to limit the directions in which the mounting system 10 is used.

[0024] (2.2) Configuration Next, each component of the mounting system 10 according to the first embodiment will be described with reference to FIGS.

[0025] As shown in Figures 1 to 7, the mounting system 10 of embodiment 1 includes a head unit 1, a first drive unit 2, multiple power units 3, a first control unit 4, multiple (five in the illustrated example) component supply units 5, a component recognition unit 6, multiple (three in the illustrated example) component disposal units 7, multiple (three in the illustrated example) nozzle replacement units 8, multiple (three in the illustrated example) substrate holding units 9, a receiver / transmitter unit 25, a second drive unit 26, a substrate loading unit 27, and a substrate unloading unit 28.

[0026] It should be noted that the head unit 1, first drive unit 2, power unit 3, first control unit 4, component supply unit 5, component recognition unit 6, component disposal unit 7, nozzle replacement unit 8, receiver / transmitter unit 25, second drive unit 26, and substrate carry-out unit 28 are not essential components of the mounting system 10. In other words, all or some of the head unit 1, first drive unit 2, power unit 3, first control unit 4, component supply unit 5, component recognition unit 6, component disposal unit 7, nozzle replacement unit 8, receiver / transmitter unit 25, second drive unit 26, and substrate carry-out unit 28 do not have to be included as components of the mounting system 10.

[0027] In addition, in this embodiment, the multiple power units 3 and the multiple component supply units 5 correspond one-to-one, but the multiple power units 3 and the multiple component supply units 5 do not have to correspond one-to-one. In other words, the multiple power units 3 may be more or less than the multiple component supply units 5.

[0028] (2.2.1) Head The head unit 1 has at least one component holding unit 12. In this embodiment, the head unit 1 has one component holding unit 12. The head unit 1 moves the component holding unit 12 closer to the component supply unit 5, causing the component holding unit 12 to hold a component 100. The head unit 1 also moves the component holding unit 12 closer to the board 200 while the component 100 is being held by the component holding unit 12, and mounts the component 100 on the mounting surface 201 of the board 200. In other words, the head unit 1 holds the component holding unit 12 so that it can move toward the board 200. In short, the head unit 1 has the component holding unit 12 that holds the component 100 to be mounted on the board 200, and mounts the component 100 held by the component holding unit 12 on the board 200 held by the board holding unit 9.

[0029] In this embodiment, the head unit 1 further includes, in addition to the component holder 12, a mover 11, a first pressure accumulator container 13, a second pressure accumulator container 14, a storage battery 15, an actuator 16, a magnet 17, and a second control unit 18. In the mounting system 10 according to the first embodiment, one head unit 1 holds one each of the mover 11, component holder 12, first pressure accumulator container 13, second pressure accumulator container 14, storage battery 15, and actuator 16. This allows one component 100 to be held by one component holder 12 in the head unit 1.

[0030] The mover 11, together with the stator 21 described below, constitutes a planar motor (planar servo motor). The mover 11 faces the stator 21 in the Z-axis direction. More specifically, the mover 11 is located below the stator 21 in the Z-axis direction (up-down direction). The mover 11 is controlled by a first motor driver 41 of the first control unit 4 described below, and is movable along a plane 211 of the stator 21 (see FIG. 10).

[0031] The component holder 12 is, for example, a suction nozzle. The component holder 12 is controlled by a second control unit 18 (described later) and can switch between a holding state in which the component 100 is held and a release state in which the component 100 is released (released). To hold the component 100 using the component holder 12, the head unit 1 receives air pressure (vacuum) as power and operates. In this embodiment, the head unit 1 switches the component holder 12 between the holding state and the release state by opening and closing the valve of the first pressure accumulator container 13. When opening the valve of the first pressure accumulator container 13 to release the component 100, it is preferable to also open the valve of the second pressure accumulator container 14. In this case, the component holder 12 is pushed away from the component holder 12 by air released by opening the valve of the second pressure accumulator container 14, making it easier for the component 100 to be released from the component holder 12.

[0032] The first pressure accumulator container (first pressure accumulator chamber) 13 is, for example, an air tank. The internal pressure of the first pressure accumulator container 13 is adjusted by an air adjustment unit 31, which will be described later. More specifically, the internal pressure of the first pressure accumulator container 13 is adjusted to a negative pressure by the air adjustment unit 31 sucking in air. For example, when the head unit 1 is located at the first position, the internal pressure of the first pressure accumulator container 13 is adjusted to a negative pressure by the air adjustment unit 31. When the internal pressure of the first pressure accumulator container 13 is adjusted to a negative pressure, the component holder 12 holds (sucks) the component 100. When the valve of the first pressure accumulator container 13 is opened and atmospheric air flows into the first pressure accumulator container 13, the internal pressure of the first pressure accumulator container 13 changes from negative pressure to atmospheric pressure, and the component holder 12 is released from the holding state. The first position is, for example, a component pick-up position P5 (see FIG. 2) where the component holder 12 picks up the component 100 from the component supply unit 5.

[0033] The second pressure accumulator container (second pressure accumulator chamber) 14 is, for example, an air tank, similar to the first pressure accumulator container 13. The internal pressure of the second pressure accumulator container 14 is adjusted by the air adjustment unit 31. More specifically, the internal pressure of the second pressure accumulator container 14 is adjusted to a positive pressure by the air adjustment unit 31 supplying air. For example, when the head unit 1 is located in the first position, the internal pressure of the second pressure accumulator container 14 is adjusted to a positive pressure by the air adjustment unit 31. The valve of the second pressure accumulator container 14 is opened, and the air in the second pressure accumulator container 14 is released at low pressure to blow air, pushing the component 100 away from the component holder 12. As a result, the internal pressure of the second pressure accumulator container 14 becomes atmospheric pressure.

[0034] The storage battery 15 is, for example, an electric double-layer capacitor (EDLC). Power is supplied to the storage battery 15 by a power supply unit 32, which will be described later. Power supply from the power supply unit 32 to the storage battery 15 may be contact or non-contact. For example, when the head unit 1 is located at the second position, power is supplied to the storage battery 15 from the power supply unit 32. The second position is, for example, a component pick-up position P5 (see FIG. 2 ) where the component holder 12 picks up a component 100 from the component supply unit 5. That is, in this embodiment, the first position and the second position are the same position.

[0035] The actuator 16 moves the component holder 12 linearly in the Z-axis direction. Furthermore, the actuator 16 rotates the component holder 12 in a rotational direction (hereinafter referred to as the "θ" direction) around an axis along the Z-axis direction. In this embodiment, as an example, the actuator 16 drives the component holder 12 in the Z-axis direction by a driving force generated by a linear motor. Furthermore, the actuator 16 drives the component holder 12 in the θ-direction by a driving force generated by a rotary motor. Meanwhile, as described below, the head unit 1 moves linearly in the X-axis direction and the Y-axis direction along the plane 211 (see FIG. 10 ) of the stator 21 of the first drive unit 2. As a result, the component holder 12 included in the head unit 1 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-direction by the first drive unit 2 and the actuator 16.

[0036] The magnet 17 includes a plurality of permanent magnets arranged in a matrix in the X-axis direction and the Y-axis direction.

[0037] The first pressure accumulator container 13, the second pressure accumulator container 14, the storage battery 15, the actuator 16, and the magnet 17 are housed in a housing 19 of the head unit 1 (see FIG. 10). The housing 19 of the head unit 1 is made of, for example, metal and is formed in a hollow cylindrical shape. The housing 19 of the head unit 1 also holds the component holder 12 via the actuator 16. The housing 19 of the head unit 1 is attached to the mover 11, and is movable in the X-axis and Y-axis directions as the mover 11 moves in the X-axis and Y-axis directions.

[0038] The second control unit 18 controls each part of the head unit 1. The second control unit 18 can be realized by a computer system having one or more processors and one or more memories. That is, the second control unit 18 functions as a computer system in which one or more processors execute a program recorded in one or more memories of the computer system. Here, the program is pre-recorded in the memory of the second control unit 18, but it may also be provided via a telecommunications line such as the Internet, or may be provided by recording it on a non-transitory recording medium such as a memory card.

[0039] 1, the second control unit 18 includes a second motor driver 181. The second motor driver 181 is electrically connected to the actuator 16. The second motor driver 181 outputs a control signal to the actuator 16 to move the actuator 16 in the Z-axis direction and the θ direction.

[0040] In addition, the second control unit 18 controls the opening and closing of the valve of the first pressure accumulator container 13 and the opening and closing of the valve of the second pressure accumulator container 14. This makes it possible to switch between a holding state and a release state of the component 100 by the component holder 12.

[0041] In the head unit 1 described above, the component holder 12 can hold (suck) the component 100 by using the air stored in the first pressure accumulator container 13 when the head unit 1 is located at the first position (component removal position P5 in this embodiment). In addition, in the head unit 1, power is stored in the storage battery 15 when the head unit 1 is located at the second position (component removal position P5 in this embodiment). Then, when the head unit 1 is located at the component mounting position P2 (see FIG. 2), the power stored in the storage battery 15 allows the component holder 12 to move in the Z-axis direction and the θ direction.

[0042] Here, the head unit 1 uses the component holder 12 to pick up the component 100 from the component supply unit 5 at a component pick-up position P5, which serves as the first position. More specifically, when the head unit 1 is located at the first position, the head unit 1 lowers the component holder 12 toward the component supply unit 5 to hold the component 100 in the component holder 12, and then raises the component holder 12 holding the component 100. Therefore, while the component holder 12 is picking up the component 100, it is possible to adjust the internal pressure of the first pressure accumulator container 13 and the second pressure accumulator container 14 and supply power to the storage battery 15.

[0043] (2.2.2) First drive unit The first drive unit 2 has a stator 21 and a magnet 22. The stator 21 is, for example, a rectangular flat plate when viewed from above in the Z-axis direction (up and down direction). The stator 21 has a plane 211 (see FIG. 10). The stator 21, together with the mover 11 described above, constitutes a planar motor. The first drive unit 2 is controlled by a first motor driver 41 of the first control unit 4 (described later), and drives the head unit 1 so that the head unit 1 (mover 11) moves along the plane 211 (see FIG. 10) of the stator 21.

[0044] The magnet 22 includes a plurality of electromagnets arranged in a matrix in the X-axis and Y-axis directions. Each of the electromagnets has a coil, and when current is applied to the coil, a magnetic pole (north pole or south pole) is generated at both ends of the coil in the direction of the winding axis.

[0045] (2.2.3) Power section As described above, the multiple power units 3 correspond one-to-one to the multiple component supply units 5. Although not shown in Figures 2 to 7, the multiple power units 3 are arranged at equal intervals along the X-axis direction. Each of the multiple power units 3 has an air adjustment unit 31 and an electric power supply unit 32, as shown in Figure 1.

[0046] The air adjustment unit 31 includes, for example, an air pump capable of sucking in and supplying air. When the head unit 1 is located at the first position (in this embodiment, the component removal position P5), the air adjustment unit 31 sucks in air using the air pump to adjust the internal pressure of the first pressure accumulator container 13 to a negative pressure. Furthermore, when the head unit 1 is located at the first position, the air adjustment unit 31 supplies air using the air pump to adjust the internal pressure of the second pressure accumulator container 14 to a positive pressure.

[0047] The power supply unit 32 includes, for example, an AC-DC converter. The power supply unit 32 supplies electric power (DC power) to the storage battery 15 when the head unit 1 is located at the second position (in this embodiment, the component removal position P5).

[0048] (2.2.4) First control section The first control unit 4 controls each unit of the mounting system 10. The first control unit 4 can be realized by a computer system having one or more processors and one or more memories. That is, the first control unit 4 functions as the first control unit 4 by having one or more processors execute a program recorded in one or more memories of the computer system. Here, the program is pre-recorded in the memory of the first control unit 4, but it may also be provided via a telecommunications line such as the Internet, or may be recorded on a non-transitory recording medium such as a memory card and provided.

[0049] The first control unit 4 includes a first motor driver 41. The first motor driver 41 is electrically connected to the first driving unit 2. The first motor driver 41 controls the first driving unit 2 so that the head unit 1 (movable element 11) moves in the X-axis direction and the Y-axis direction along the plane 211 of the stator 21 (see FIG. 10).

[0050] The first control unit 4 is further electrically connected to each of the plurality of power units 3, the plurality of component supply units 5, the component recognition unit 6, the plurality of board holders 9, the second drive unit 26, the board carry-in unit 27, and the board carry-out unit 28. The first control unit 4 controls each of the plurality of power units 3 so as to adjust the internal pressure of the first pressure accumulator container 13 and the second pressure accumulator container 14, and to supply power to the storage battery 15. The first control unit 4 also controls each of the plurality of component supply units 5 so as to send out components 100 to the component removal position P5.

[0051] Furthermore, the first control unit 4 controls the component recognition unit 6 to capture an image at the component recognition unit 6 and to acquire the captured image of the component recognition unit 6 from the component recognition unit 6. The first control unit 4 also controls each of the plurality of substrate holding units 9 to hold the substrate 200 at each of the plurality of substrate holding units 9. The first control unit 4 also controls the second drive unit 26 to move the component recognition unit 6, the plurality of component disposal units 7, the plurality of nozzle replacement units, and the plurality of substrate holding units 9 along the plane 2611 of the stator 261 of the second drive unit 26 (see FIG. 2).

[0052] Furthermore, first control unit 4 controls substrate carry-in unit 27 so that substrate 200 is carried into substrate carry-in unit 27 and that substrate 200 carried into substrate carry-in unit 27 is transported to substrate holding unit 9 (first substrate holding unit 9A in FIG. 3) located at substrate supply position P1 (see FIG. 3). Also, first control unit 4 controls substrate carry-out unit 28 so that substrate 200 is transported from substrate holding unit 9 (first substrate holding unit 9A in FIG. 7) located at substrate carry-out position P3 (see FIG. 7) to substrate carry-out unit 28.

[0053] (2.2.5) Parts Supply Department As described above, the multiple component supply units 5 correspond one-to-one to the multiple power units 3, and are arranged at equal intervals along the X-axis direction (see FIG. 2). Each of the multiple component supply units 5 supplies a component 100 held by a component holder 12 of the head unit 1. Each of the multiple component supply units 5 has, for example, a part feeder that supplies the component 100 housed on a carrier tape. The head unit 1 holds a component 100 from one of the multiple component supply units 5 by the component holder 12.

[0054] (2.2.6) Part Recognition Unit As shown in FIG. 1, the component recognition unit 6 has a camera 61. The camera 61 captures an image of the head unit 1 moving between a component pick-up position P5 (see FIG. 2) and a component mounting position P2 (see FIG. 2) from below. Therefore, the image captured by the camera 61 captures the component holder 12 and the component 100 held by the component holder 12. In other words, the image captured by the camera 61 contains information about the relative positional relationship between the component holder 12 and the component 100, in other words, information about the misalignment of the component 100 with respect to the component holder 12. In other words, the component recognition unit 6 is an imaging unit located between the component pick-up position P5, where the component holder 12 picks up the component 100 from the component supply unit 5 that supplies the component 100, and the component mounting position P2, where the component 100 is mounted on the board 200, and captures an image of the component holder 12 holding the component 100.

[0055] It is preferable that the camera 61 does not capture images all the time, but rather captures images when the component holder 12 holding the component 100 passes above the camera 61. The camera 61 may also be installed below the component supply unit 5. The mounting system 10 may further include an illumination device that illuminates the image capture area of ​​the camera 61. In this case, the illumination device preferably includes a mover, similar to the board holder 9 described below, and is configured to move along the movement path of the component holder 12 as needed. If an illumination device is not required, the illumination device can be moved to a position away from the movement path of the component holder 12, and the board holder 9 can be moved closer to the component supply unit 5, thereby minimizing the movement distance of the component holder 12.

[0056] The component recognition unit 6 also has a mover 62 and a magnet 63. The mover 62 configures a planar motor together with a stator 261, which will be described later. The mover 62 faces the stator 261 in the Z-axis direction. More specifically, the mover 62 is located above the stator 261 in the Z-axis direction (up and down direction). The mover 62 is controlled by a first motor driver 41 of the first control unit 4, and is movable along a plane 2611 (see FIG. 2) of the stator 261. That is, the component recognition unit 6 has a second mover (mover 62) different from the first mover (mover 92) as the mover 92, and is movable in a magnetically levitated state relative to the stator 261 by a magnetic force (magnetic repulsion) generated between the mover 62 and the stator 261.

[0057] The magnet 63 includes a plurality of permanent magnets arranged in a matrix in the X-axis direction and the Y-axis direction.

[0058] (2.2.7) Parts Disposal Department Each of the multiple component disposal units 7 is a space for disposing of defective components 100 among the components 100 taken out from the component supply unit 5 by the component holding unit 12. Here, a "defective component" refers to a component that has, for example, scratches or the like on its surface and may not be able to function as a component.

[0059] For example, when the first control unit 4 determines that the component 100 has an abnormality such as a crack or chip based on an image captured by the camera 61 of the component recognition unit 6, it instructs the component disposal unit 7 to discard the component 100. When the head unit 1 is positioned above the component disposal unit 7, the head unit 1 opens the valves of the first pressure accumulator container 13 and the second pressure accumulator container 14 to release low-pressure air from the component holding unit 12, thereby blowing the component 100 away from the component holding unit 12. As a result, the component 100 is discarded in the component disposal unit 7. In other words, the component disposal unit 7 is a disposal unit that discards the component 100 held in the component holding unit 12.

[0060] Furthermore, the head unit 1 may clean the component holder (suction nozzle) 12 after disposing of the component 100 in the component disposal unit 7. For example, the inside of the component holder 12 can be cleaned by opening the valve of the second pressure accumulator vessel 14 and blowing high-pressure air.

[0061] Each of the multiple part discarding units 7 has a mover 71 and a magnet 72. The mover 71, together with a stator 261 described below, constitutes a planar motor. The mover 71 faces the stator 261 in the Z-axis direction. More specifically, the mover 71 is located above the stator 261 in the Z-axis direction (up-down direction). The mover 71 is controlled by a first motor driver 41 of the first control unit 4, and is movable along a plane 2611 (see FIG. 2) of the stator 261. That is, the part discarding unit 7 has a second mover (mover 71) different from the first mover (mover 92) as the mover 92, and is movable in a state of being magnetically levitated relative to the stator 261 by a magnetic force (magnetic repulsion force) generated between the mover 71 and the stator 261.

[0062] The magnet 72 includes a plurality of permanent magnets arranged in a matrix in the X-axis direction and the Y-axis direction.

[0063] As described above, each of the component discarding units 7 has a mover 71. This makes it possible to move each component discarding unit 7 to a position that avoids the movement path of the component holder 12.

[0064] (2.2.8) Nozzle replacement part Each of the multiple nozzle replacement units 8 has multiple types of component holders (suction nozzles) 12. The multiple types of component holders 12 correspond to the respective sizes (dimensions) of the components 100. The head unit 1 replaces the component holders 12 depending on the size of the components 100 held by the component holders 12. In other words, the nozzle replacement unit 8 is a replacement unit that has multiple types of component holders 12 and replaces one of the multiple types of component holders 12 with a corresponding component holder 12 depending on the type of component 100 to be mounted on the board 200.

[0065] Each of the plurality of nozzle replacement units 8 has a mover 81 and a magnet 82. The mover 81 constitutes a planar motor together with a stator 261, which will be described later. The mover 81 faces the stator 261 in the Z-axis direction. More specifically, the mover 81 is located above the stator 261 in the Z-axis direction (up-down direction). The mover 81 is controlled by a first motor driver 41 of the first control unit 4, and is movable along a plane 2611 (see FIG. 2) of the stator 261. That is, the nozzle replacement unit 8 has a second mover (mover 81) different from the first mover (mover 92) as the mover 92, and is movable in a state of being magnetically levitated relative to the stator 261 by a magnetic force (magnetic repulsion force) generated between the second mover and the stator 261.

[0066] The magnet 82 includes a plurality of permanent magnets arranged in a matrix in the X-axis direction and the Y-axis direction.

[0067] As described above, each of the plurality of nozzle replacement units 8 has a mover 81. This makes it possible to move each nozzle replacement unit 8 to a position that avoids the movement path of the component holder 12.

[0068] (2.2.9) Board holder The plurality of substrate holders 9 each hold a substrate 200 supplied from a substrate carry-in unit 27, which will be described later. Each of the plurality of substrate holders 9 includes a conveyor 91, a mover 92, and a magnet 93, as shown in FIG.

[0069] As shown in Figures 8 and 9, the conveyor 91 includes a belt 911, four pulleys 912, and a pair of bearings 913. A mover 92 is attached to the underside of each of the pair of bearings 913. Two pulleys 912 are rotatably attached to one bearing 913 (left side in Figure 8), and one pulley 912 is rotatably attached to the other bearing 913 (right side in Figure 8). The remaining pulley 912 is movable along the X-axis direction (see arrow A0 in Figure 8).

[0070] In this conveyor 91, the remaining pulley 912 moves along the X-axis direction, thereby changing the length L1 of the conveyor 91 in the X-axis direction. That is, the length L1 of the conveyor 91 is variable in the transport direction (in this embodiment, the X-axis direction) of the board 200 from the board carry-in unit 27 to each of the multiple board holders 9. More specifically, the length L1 of the conveyor 91 can be adjusted between L11 (see FIG. 8 ) and L12 (see FIG. 9 ) depending on the length of the board 200 in the X-axis direction. This makes it possible to shorten the travel distance of the board 200 in the board holders 9, thereby eliminating the wait time required to wait for the board 200 to be transported after the mounting of components 100 has been completed, and thereby shortening the operation time.

[0071] The mover 92 constitutes a planar motor together with the stator 261 of the second drive unit 26. The mover 92 faces the stator 261 in the Z-axis direction. More specifically, the mover 92 is located above the stator 261 in the Z-axis direction (up-down direction). In other words, the stator 261 is located below the mover 92 in the Z-axis direction. The mover 92 is controlled by the first motor driver 41 of the first control unit 4, and is movable along the plane 2611 (see FIG. 2) of the stator 261. In other words, the mover 92 is movable in a magnetically levitated state relative to the stator 261 due to the magnetic force (magnetic repulsion) generated between the mover 92 and the stator 261.

[0072] The magnet 93 includes a plurality of permanent magnets arranged in a matrix in the X-axis direction and the Y-axis direction.

[0073] (2.2.10) Transmitting and receiving unit The receiver / transmitter 25 is configured to communicate with a higher-level system directly or indirectly via a network, a repeater, etc. The receiver / transmitter 25 receives a first control signal, a second control signal, a third control signal, a fourth control signal, a fifth control signal, and a sixth control signal from the higher-level system.

[0074] The first control signal is a signal for controlling the magnet 22 of the first drive unit 2, and is output from the receiver-transmitter 25 to the first control unit 4. The second control signal is a signal for controlling the air adjustment unit 31 and the power supply unit 32 of the power unit 3, and is output from the receiver-transmitter 25 to the first control unit 4.

[0075] The third control signal is a signal for controlling the opening and closing of the valve of the first pressure accumulator container 13 and the opening and closing of the valve of the second pressure accumulator container 14, and is output from the receiver-transmitter 25 to the second control unit 18 of the head unit 1. The fourth control signal is a signal for controlling the actuator 16, and is output from the receiver-transmitter 25 to the second control unit 18 of the head unit 1.

[0076] The fifth control signal is a signal for controlling the magnet 262 of the second drive unit 26 described below, and is output from the receiver-transmitter 25 to the first control unit 4. The sixth control signal is a signal for controlling the conveyor 91 of the substrate holder 9, the conveyor of the substrate carry-in unit 27, and the conveyor of the substrate carry-out unit 28, and is output from the receiver-transmitter 25 to the first control unit 4.

[0077] (2.2.11) Second drive unit As shown in Fig. 1, the second driving unit 26 has a stator 261 and a magnet 262. The stator 261 has, for example, a rectangular flat plate shape when viewed from above in the Z-axis direction. That is, as shown in Fig. 2, the stator 261 has a flat surface 2611. The flat surface 2611 is large enough to allow the multiple substrate holders 9 to move. That is, the flat surface 2611 is large enough to accommodate the range of movement of the multiple substrate holders 9 or larger.

[0078] The stator 261 constitutes a planar motor together with the above-mentioned movers 62, 71, 81, and 92. The second drive unit 26 is controlled by the first motor driver 41 of the first control unit 4, and controls the magnetic poles of the magnet 262 so that the component recognition unit 6, each component disposal unit 7, each nozzle replacement unit 8, and each board holder 9 can move along the plane 2611 of the stator 261.

[0079] The magnet 262 includes a plurality of electromagnets, which are arranged in a matrix in the X-axis and Y-axis directions. Each of the electromagnets has a coil, and when current is applied to the coil, a magnetic pole (north pole or south pole) is generated at both ends of the coil in the direction of the winding axis.

[0080] (2.2.12) Substrate loading area The substrate carry-in unit 27 supplies (carries in) the substrate 200 to the substrate holding unit 9 (first substrate holding unit 9A in FIG. 3) located at the substrate supply position P1 (see FIG. 3). The substrate carry-in unit 27 has, for example, a belt conveyor. The belt conveyor transports the substrate 200, for example, along the X-axis direction. The substrate carry-in unit 27 holds the substrate 200 while the belt conveyor is stopped. That is, the mounting system 10 includes the substrate carry-in unit 27 that carries in the substrate 200.

[0081] (2.2.13) Substrate unloading section The board 200 on which components 100 are mounted is transported to the board unloading unit 28 from the board holding unit 9 (first board holding unit 9A in FIG. 7) located at the board unloading position P3 (see FIG. 7). The board unloading unit 28 has, for example, a belt conveyor. The belt conveyor transports the board 200, for example, along the X-axis direction. The board unloading unit 28 holds the board 200 while the belt conveyor is stopped. That is, the mounting system 10 further includes a board unloading unit 28 that unloads the board 200.

[0082] (3) Operation of the implemented system Next, the operation of the mounting system 10 according to the first embodiment will be described.

[0083] (3.1) First action First, a first operation of mounting system 10 will be described with reference to FIGS. 2 to 7. In the first operation, multiple substrate holding units 9 are transported in sequence to substrate supply position P1, component mounting position P2, substrate unloading position P3, and standby position P4. In this embodiment, as shown in FIGS. 2 to 7, an example is shown in which there are three substrate holding units 9 (first substrate holding unit 9A, second substrate holding unit 9B, and third substrate holding unit 9C). However, the number of substrate holding units 9 is not limited to three, and may be one, two, or four or more. That is, multiple substrate holding units 9 include first substrate holding unit 9A and second substrate holding unit 9B. Furthermore, multiple substrate holding units 9 further include a third substrate holding unit 9C that is different from first substrate holding unit 9A and second substrate holding unit 9B.

[0084] In Fig. 2, an unmounted board 200 is being carried into board carry-in section 27. Also in Fig. 2, first board holding section 9A is located at board supply position P1, second board holding section 9B is located at standby position P4, and third board holding section 9C is located at board unloading position P3. Also in Fig. 2, component recognition section 6, component disposal section 7, and nozzle replacement section 8 are aligned in the X-axis direction between component mounting position P2 and component removal position P5 in the Y-axis direction.

[0085] Here, the board supply position P1 is a position where an unmounted board 200 is supplied from the board carry-in section 27, and is adjacent to the board carry-in section 27 in the X-axis direction (see FIG. 2). The component mounting position P2 is a position where the components 100 held by the component holder 12 are mounted on the mounting surface 201 of the board 200. The board unloading position P3 is a position where the mounted board 200 is moved (transported) to the board unloading section 28, and is adjacent to the board unloading section 28 in the X-axis direction (see FIG. 2). The standby position P4 is a position before the board supply position P1 in the X-axis direction and is located between the board unloading position P3 and the board supply position P1. The component removal position P5 is a position where the component holder 12 removes the components 100 from the component supply section 5, and is located on the opposite side of the board supply position P1, the board unloading position P3, and the standby position P4 from the component mounting position P2 in the Y-axis direction.

[0086] From the state shown in Figure 2, by moving the belt conveyor of the substrate loading section 27 and the conveyor 91 of the first substrate holding section 9A, the substrate 200 is transported (supplied) from the substrate loading section 27 to the first substrate holding section 9A (see arrow A1 in Figure 3).

[0087] Next, first board holding unit 9A moves from board supply position P1 to component mounting position P2 while holding board 200 (see arrow A2 in FIG. 4). At this time, second board holding unit 9B moves to board supply position P1 after first board holding unit 9A, which is located at board supply position P1, moves to component mounting position P2 (see arrow A3 in FIG. 4). Furthermore, third board holding unit 9C moves to standby position P4 after second board holding unit 9B, which is located at standby position P4, moves to board supply position P1 (see arrow A4 in FIG. 4). Furthermore, the next unmounted board 200 is carried into board carry-in unit 27 (see arrow A5 in FIG. 4).

[0088] In FIG. 4, a component 100 is mounted on a board 200 on the first board holding unit 9A, which is located at component mounting position P2. Here, in FIG. 4, the position of the first board holding unit 9A in the X-axis direction is adjusted so that the component 103 to be mounted and the position on the board 200 where the component 103 will be mounted are aligned on the same line along the Y-axis direction. Therefore, the head unit 1 moves linearly along the Y-axis direction relative to the board 200 held by the first board holding unit 9A (see arrow A6 in FIG. 4). That is, the component mounting position P2 is the position where the movement distance of the head unit 1 relative to the board 200 held by the first board holding unit 9A is the shortest. Also, as shown in FIG. 4, the distance between the head unit 1 and the component mounting position P2 is shorter than the distance between the head unit 1 and the board supply position P1. These factors reduce the time required to mount the component 100 on the board 200. In addition, in Figure 4, the part disposal unit 7 and the nozzle replacement unit 8, which were located on either side of the part recognition unit 6, move from the position shown by the dashed double-dashed line to the position shown by the solid line so as not to interfere with the movement of the part recognition unit 6.

[0089] Next, as shown in FIG. 5, while components 100 are being mounted on the board 200 on the first board holding unit 9A, which is positioned at component mounting position P2, the board 200 is supplied (carried in) from board carry-in unit 27 to second board holding unit 9B, which is positioned at board supply position P1 (see arrow A7 in FIG. 5). At this time, first board holding unit 9A moves in the X-axis direction (see arrow A8 in FIG. 5) to mount a component 102 different from component 103 mounted on mounting surface 201 of board 200 in FIG. 4. This makes it possible to mount component 102 on mounting surface 201 of board 200 simply by moving head unit 1 linearly along the Y-axis direction (see arrow A9 in FIG. 5). Furthermore, component recognition unit 6 moves along the X-axis direction from the position indicated by the two-dot chain line to the position indicated by the solid line to capture an image of head unit 1 moving toward component mounting position P2.

[0090] Next, after a predetermined number of components 100 (five in FIG. 6) have been mounted on board 200 at component mounting position P2, first board holding unit 9A moves to board unloading position P3 (see arrow A10 in FIG. 6). At this time, second board holding unit 9B moves from board supply position P1 to component mounting position P2 after first board holding unit 9A has moved from component mounting position P2 to board unloading position P3 (see arrow A11 in FIG. 6). Furthermore, third board holding unit 9C moves to board supply position P1 after second board holding unit 9B, which is located at board supply position P1, moves to component mounting position P2 (see arrow A12 in FIG. 6). Here, if second board holding unit 9B does not move to component mounting position P2 and remains at board supply position P1, third board holding unit 9C waits at standby position P4. Furthermore, the next unmounted board 200 is carried into the board carrying-in section 27 (see arrow A13 in FIG. 6). Furthermore, the component recognition section 6 moves along the X-axis direction from the position indicated by the two-dot chain line to the position indicated by the solid line.

[0091] In Fig. 7, components 100 are mounted on board 200 on second board holding unit 9B, which is positioned at component mounting position P2. Here, head unit 1 moves linearly along the Y-axis direction relative to board 200, which is positioned at component mounting position P2 (see arrow A14 in Fig. 7). At this time, first board holding unit 9A, at board unloading position P3, transports board 200 on which components have been mounted to board unloading unit 28 (see arrow A15 in Fig. 7). Also, while components 100 are being mounted on board 200, which is positioned at component mounting position P2, board 200 is supplied (carried in) from board loader 27 to third board holding unit 9C, which is positioned at board supply position P1 (see arrow A16 in Fig. 7).

[0092] After transporting the mounted board 200 to the board unloading section 28, the first board holding section 9A moves from the board unloading position P3 to the standby position P4. In this embodiment, as shown in Fig. 6, the third board holding section 9C is moved from the standby position P4 to the board supply position P1 when the second board holding section 9B moves from the board supply position P1 to the component mounting position P2. Alternatively, the third board holding section 9C may be moved from the standby position P4 to the board supply position P1 when the first board holding section 9A, which is located at the board unloading position P3, starts to move to the standby position P4.

[0093] Here, in the first operation, a movement step (first movement step) is executed in which each of the first substrate holding unit 9A, the second substrate holding unit 9B and the third substrate holding unit 9C moves from the substrate supply position P1 to the component mounting position P2, from the component mounting position P2 to the substrate unloading position P3, from the substrate unloading position P3 to the standby position P4, and from the standby position P4 to the substrate supply position P1.

[0094] Furthermore, the step of moving first board holding unit 9A located at board supply position P1 to component mounting position P2 and then moving second board holding unit 9B to board supply position P1 is the second movement step. That is, the mounting method further includes the above-mentioned second movement step, which is different from the first movement step as a movement step.

[0095] (3.2)Second operation Next, a second operation of mounting system 10 will be described with reference to Figures 10 to 20. In the second operation, components 100 are mounted on board 200 held by board holder 9.

[0096] 10, the head unit 1 is fixed to the flat surface (lower surface) 211 of the stator 21 by a magnetic attraction force F11 generated between the stator 21 of the first driving unit 2 (see FIG. 1) and the mover 11 of the head unit 1 (see FIG. 1). Also, in FIG. 10, the substrate holding unit 9 is fixed to the flat surface (upper surface) 2611 of the stator 261 by a magnetic attraction force F21 generated between the stator 261 of the second driving unit 26 (see FIG. 1) and the mover 92 of the substrate holding unit 9 (see FIG. 1).

[0097] 10, by reversing the polarity of the magnet 22 of the first driving unit 2, a magnetic repulsive force F12 is generated between the stator 21 and the mover 11, and this magnetic repulsive force F12 causes the head unit 1 to levitate from the stator 21 (see FIG. 11). Also, in the state shown in FIG. 10, by reversing the polarity of the magnet 262 of the second driving unit 26, a magnetic repulsive force F22 is generated between the stator 261 and the mover 92 (see FIG. 1), and this magnetic repulsive force F22 causes the head unit 1 to levitate from the stator 21 (see FIG. 11).

[0098] Next, by controlling the polarity of magnet 22, the components of the magnetic force generated between stator 21 and mover 11 (see FIG. 1) along the X-axis and Y-axis directions, which are in turn responsible for the movement of head unit 1 from the position indicated by the two-dot chain line to the position indicated by the solid line along the X-axis and Y-axis directions (see arrow B1 in FIG. 12). Here, the position of head unit 1 indicated by the solid line in FIG. 12 is the component removal position P5 (see FIG. 2) described above. Furthermore, by controlling the polarity of magnet 262, the components of the magnetic force generated between stator 261 and mover 92 (see FIG. 1) along the X-axis and Y-axis directions, which are in turn responsible for the movement of board holder 9 from the position indicated by the two-dot chain line to the position indicated by the solid line along the X-axis and Y-axis directions (see arrow B2 in FIG. 12).

[0099] When the head unit 1 reaches the component pick-up position P5 (see FIG. 2), the polarity of the magnet 22 is controlled to generate a magnetic attraction force F11 between the stator 21 and the mover 11 (see FIG. 1), thereby fixing the head unit 1 to the stator 21 (see FIG. 13). Fixing the head unit 1 to the stator 21 in this way improves the holding accuracy (suction accuracy) of the component 100 by the component holder 12. With the head unit 1 fixed to the stator 21, the component holder 12 is then lowered toward the component supply unit 5 (see arrow B3 in FIG. 13), causing the component holder 12 to hold (suction) the component 100. At this time, the board holder 9 moves from the position indicated by the two-dot chain line along the X-axis and Y-axis to the position indicated by the solid line along the X-axis and Y-axis (see arrow B4 in FIG. 13) due to the components of the magnetic force along the X-axis and Y-axis directions that are generated between the stator 261 and the mover 92 (see FIG. 1) by controlling the polarity of the magnet 262.

[0100] Next, head unit 1 raises component holder 12 while holding component 100 (see arrow B5 in FIG. 14). At this time, head unit 1 levitates relative to stator 21 due to magnetic repulsive force F12 generated by reversing the polarity of magnet 22 (see FIG. 14). Furthermore, by controlling the polarity of magnet 262, components of the magnetic force along the X-axis and Y-axis directions generated between stator 261 and mover 92 (see FIG. 1) move board holder 9 from the position indicated by the two-dot chain line to the position indicated by the solid line along the X-axis and Y-axis (see arrow B6 in FIG. 14).

[0101] Next, with the component 100 held by the component holder 12, the head unit 1 moves from the position indicated by the two-dot chain line to the position indicated by the solid line along the Y axis by controlling the polarity of the magnet 22, due to the component along the Y axis of the magnetic force generated between the stator 21 and the mover 11 (see FIG. 1) by controlling the polarity of the magnet 22 (see arrow B7 in FIG. 15). At this time, the board holder 9 moves from the position indicated by the two-dot chain line to the position indicated by the solid line along the X axis and the Y axis by controlling the polarity of the magnet 262, due to the component along the X axis and the Y axis of the magnetic force generated between the stator 261 and the mover 92 (see FIG. 1) by controlling the polarity of the magnet 262 (see arrow B8 in FIG. 15). Here, the position of the board holder 9 indicated by the solid line in FIG. 15 is the component mounting position P2 (see FIG. 2) described above. In the mounting system 10, as shown in FIG. 15, the direction in which the head unit 1 moves and the direction in which the board holder 9 moves are opposite to each other in the Y axis direction. In other words, by shortening the movement distance of the head unit 1 by bringing the head unit 1 and the substrate holding unit 9 closer to each other, it is possible to reduce the time required to mount the component 100 on the substrate 200 compared to when the head unit is moved relative to a fixed substrate holding unit, and as a result, it is possible to improve the productivity of the mounting system 10.

[0102] Next, components 100 are mounted on the board 200 held by the board holder 9. As shown in Fig. 16, the board holder 9 is levitated relative to the stator 261 by a magnetic repulsive force F22 generated between the stator 261 and the mover 92 (see Fig. 1). The head unit 1 is fixed to the stator 21 by a magnetic attractive force F11 generated between the stator 21 and the mover 11 (see Fig. 1), and lowers the component holder 12 toward the board holder 9 levitating relative to the stator 261 (see arrow B9 in Fig. 16).

[0103] When the component holder 12 reaches the position shown in FIG. 16, the magnitude of the magnetic force generated between the stator 261 and the mover 92 (see FIG. 1) is controlled, and thereby the board holder 9 starts to descend (see arrow B10 in FIG. 17). That is, in FIG. 17, the component holder 12 holding the component 100 moves toward the board 200, and the board holder 9 holding the board 200 moves in a direction (downward) away from the component holder 12. In other words, in the mounting system 10, when the head unit 1 and the board holder 9 are located at the component mounting position P2 (see FIG. 2), the component 100 is mounted on the board 200 by concurrently performing an operation of moving the board holder 9 in a direction in which the mover 92 approaches the stator 261 and an operation of moving the component holder 12 holding the component 100 in a direction in which the mover 92 approaches the board 200 held by the board holder 9.

[0104] Here, it is preferable to bring component 100 into contact with substrate 200 held by substrate holding unit 9 while substrate holding unit 9, which is floating relative to stator 261, is moved (lowered) in a direction approaching stator 261. This makes it possible to mitigate the impact on component 100 when it comes into contact with substrate 200, thereby making it possible to prevent deformation, damage, etc. of component 100. Furthermore, since it is not necessary to provide head unit 1 with a function for mitigating the impact when component 100 comes into contact with substrate 200, it is possible to reduce the size and weight of head unit 1. As a result, it is possible to improve the mounting speed of head unit 1, leading to improved productivity.

[0105] As shown in FIG. 18, the head unit 1 mounts the component 100 on the substrate 200 (see arrow B12 in FIG. 18) while the substrate holding unit 9 is fixed to the stator 261 by the magnetic attraction force F21 generated between the stator 261 and the movable element 92 (see FIG. 1).

[0106] After mounting component 100 on board 200, head unit 1 releases component holder 12 from its holding state of component 100 and raises component holder 12 (see arrow B13 in FIG. 19). At this time, head unit 1 levitates relative to stator 21 due to magnetic repulsion force F12 generated between stator 21 and mover 11 (see FIG. 1) by reversing the polarity of magnet 22. Furthermore, board holder 9 levitates relative to stator 261 due to magnetic repulsion force F22 generated between stator 261 and mover 92 (see FIG. 1) by reversing the polarity of magnet 262.

[0107] The head unit 1 moves to the component removal position P5 (see FIG. 2) to have the component holder 12 hold the next component 100 to be mounted on the board 200. More specifically, the head unit 1 moves from the position indicated by the two-dot chain line to the position indicated by the solid line along the X-axis and Y-axis toward the component removal position P5 (see FIG. 2) by controlling the polarity of the magnet 22, thereby controlling the components along the X-axis and Y-axis of the magnetic force generated between the stator 21 and the mover 11 (see FIG. 1) in the X-axis and Y-axis directions (see arrow B14 in FIG. 20). Meanwhile, the board holder 9 moves from the position indicated by the two-dot chain line to the position indicated by the solid line along the X-axis and Y-axis toward the next component mounting position P2 (see FIG. 2) by controlling the polarity of the magnet 262, thereby controlling the components along the X-axis and Y-axis of the magnetic force generated between the stator 261 and the mover 92 (see FIG. 1) in the X-axis and Y-axis directions (see arrow B15 in FIG. 20). Thereafter, the second operation of mounting the component 100 on the board 200 is repeated in the same manner.

[0108] Incidentally, in the mounting system 10 according to the first embodiment, as described above, it is possible to levitate the substrate holding unit 9 relative to the stator 261 by controlling the polarity of the magnet 262 of the second driving unit 26. In the example described above, the substrate holding unit 9 is levitated parallel to the plane 2611 of the stator 261. However, for example, it is also possible to levitate the substrate holding unit 9 so that it is oblique to the plane 2611 of the stator 261. Furthermore, it is also possible to rotate the substrate holding unit 9 along the plane 2611 of the stator 261. Therefore, for example, when correcting a misalignment between the outer shape of the substrate 200 and the circuit pattern within the substrate 200, the correction can be made by adjusting the state (height, angle, orientation, etc.) of the substrate holding unit 9. This allows the head unit 1 to perform processing to correct only the misalignment of the component 100 relative to the component holder 12, and since the correction processing can be completed in advance at a different timing than when the head unit 1 corrects both the misalignment of the circuit pattern relative to the board 200 and the misalignment of the component 100 relative to the component holder 12, it is possible to reduce the processing load on the head unit 1. As a result, it is possible to further improve the productivity of the mounting system 10.

[0109] In this case, the first control unit 4 only needs to separately calculate the positional misalignment of the circuit pattern relative to the substrate 200 and the positional misalignment of the component 100 relative to the component holding unit 12, which makes it possible to shorten the time required for the calculation process and, as a result, further improve the productivity of the mounting system 10.

[0110] In this case, it is also possible to correct for warpage of the substrate 200 by adjusting the height of the substrate holder 9 relative to the stator 261 in the Z-axis direction. Therefore, unlike the conventional method, a height correction function such as a backup pin is not required, and accordingly, it is possible to reduce the size and cost of the mounting system 10.

[0111] Here, in the second operation, a moving step (first moving step) is executed by moving the board holding unit 9 in a direction in which the mover 92 approaches the stator 261. Furthermore, the moving step may include an operation of moving the board holding unit 9 to the component mounting position P2.

[0112] Furthermore, in a state where the board holding unit 9 and the head unit 1 are positioned at the component mounting position P2, the mounting step is a step of mounting the component 100 on the board 200 by concurrently performing an operation of moving the board holding unit 9 in a direction in which the mover 92 approaches the stator 261 and an operation of moving the component holding unit 12 holding the component 100 in a direction in which the mover 92 approaches the board 200 held by the board holding unit 9. In other words, the mounting method further includes the above-mentioned mounting step.

[0113] (4) Effects In the mounting system 10 according to the first embodiment, the plurality of substrate holding units 9 can be moved individually by the magnetic force generated between the mover 92 and the stator 261. Therefore, for example, while a component 100 is being mounted on a substrate 200 held by one of the plurality of substrate holding units 9 (e.g., a first substrate holding unit 9A), the substrate 200 can be supplied (transported) to another substrate holding unit 9 (e.g., a second substrate holding unit 9B). As a result, compared to a conventional configuration in which the substrates 200 are carried in one by one in order, the time required for mounting the component 100 on the substrate 200 can be shortened, and the productivity of the mounting system 10 can be improved.

[0114] Furthermore, in the mounting system 10 according to embodiment 1, the substrate holding part 9 is raised above the stator 261, and the substrate holding part 9 does not come into contact with the stator 261, so that it is possible to suppress wear, dust, etc. of at least one of the stator 261 and the substrate holding part 9.

[0115] Furthermore, in the mounting system 10 according to embodiment 1, a permanent magnet is provided on the side of the mover 92 and an electromagnet is provided on the side of the stator 261, so that no wiring or piping is required on the side of the mover 92, which has the advantage that the operating sequence and movement path of the mover 92 are not restricted.

[0116] Furthermore, in the mounting system 10 according to the first embodiment, the component mounting position P2 is the position where the movement distance of the head unit 1 relative to the substrate 200 held by the first substrate holding unit 9A is the shortest. This makes it possible to shorten the movement time of the head unit 1, and as a result, it becomes possible to further improve the productivity of the mounting system 10.

[0117] Furthermore, in the mounting system 10 according to the first embodiment, the distance between the head unit 1 and the component mounting position P2 is shorter than the distance between the head unit 1 and the board supply position P1. This makes it possible to reduce the movement time of the head unit 1 when mounting the components 100 on the board 200, thereby further improving the productivity of the mounting system 10.

[0118] Furthermore, in the mounting system 10 according to the first embodiment, the first substrate holding unit 9A transports the substrate 200 to the substrate transport unit 28 at the substrate transport position P3 adjacent to the substrate transport unit 28. This makes it possible to shorten the transport distance of the substrate 200, and as a result, it becomes possible to further improve the productivity of the mounting system 10.

[0119] Furthermore, in mounting system 10 according to embodiment 1, second substrate holding unit 9B moves to component mounting position P2 after first substrate holding unit 9A moves from component mounting position P2 to substrate unloading position P3. This makes it possible to move second substrate holding unit 9B to component mounting position P2 that has become vacant by moving first substrate holding unit 9A.

[0120] Furthermore, in mounting system 10 according to embodiment 1, third substrate holding unit 9C starts moving toward substrate supply position P1 when first substrate holding unit 9A moves from substrate unloading position P3. Furthermore, when second substrate holding unit 9B is located at substrate supply position P1, third substrate holding unit 9C waits at standby position P4 just before substrate supply position P1. This makes it possible to move third substrate holding unit 9C in accordance with the operations of first substrate holding unit 9A and second substrate holding unit 9B.

[0121] Furthermore, in the mounting system 10 according to the first embodiment, when the board holding unit 9 and the head unit 1 are positioned at the component mounting position P2, the components 100 are mounted on the board 200 by simultaneously moving the board holding unit 9 in a direction in which the mover 92 approaches the stator 261 and moving the component holding unit 12 in a direction in which the mover 92 approaches the board 200. This makes it possible to mitigate the impact on the component 100 when it comes into contact with the board 200, thereby preventing deformation, damage, etc. of the component 100. As a result, it is now possible to allocate the time that would previously have been required for impact mitigation, thereby reducing the time required for mounting and contributing to improved productivity.

[0122] Furthermore, in the mounting system 10 according to the first embodiment, the stator 261 has a flat surface 2611 and is located below the mover 92. The mover 92 is movable along the flat surface 2611 of the stator 261. This makes it possible to move the substrate holder 9 along the flat surface 2611 of the stator 261.

[0123] Furthermore, in the mounting system 10 according to the first embodiment, the plane 2611 of the stator 261 is larger than the movable range of the plurality of substrate holders 9. This allows the plurality of substrate holders 9 to move simultaneously along the plane 2611 of the stator 261.

[0124] Furthermore, in the mounting system 10 according to the first embodiment, each of the plurality of substrate holders 9 has a conveyor 91. This makes it possible to hold and transport the substrate 200.

[0125] Furthermore, in the mounting system 10 according to the first embodiment, the length L1 of the conveyor 91 is variable in the transport direction of the substrate 200 from the substrate carry-in unit 27 to each of the plurality of substrate holders 9. This makes it possible to adjust the length L1 of the conveyor 91 according to the length of the substrate 200 in the transport direction.

[0126] Furthermore, in the mounting system 10 according to the first embodiment, the component recognition unit 6, the component disposal unit 7, and the nozzle replacement unit 8 can also move in a magnetically levitated state due to the magnetic force generated between them and the stator 261. This allows the component recognition unit 6, the component disposal unit 7, and the nozzle replacement unit 8 to be moved individually.

[0127] (5) Variations The first embodiment is merely one of various embodiments of the present disclosure. Various modifications of the first embodiment are possible depending on the design, etc., as long as the object of the present disclosure can be achieved. Modifications of the first embodiment are listed below. The modifications described below can be applied in appropriate combinations.

[0128] The mounting system 10 of the present disclosure includes a computer system, for example, in the first control unit 4 and the second control unit 18. The computer system is primarily composed of a processor and memory as hardware. The processor executes a program stored in the memory of the computer system to realize the functions of the mounting system 10 of the present disclosure. The program may be pre-stored in the memory of the computer system, provided via a telecommunications line, or provided in a non-transitory recording medium readable by the computer system, such as a memory card, optical disk, or hard disk drive. The processor of the computer system is composed of one or more electronic circuits, including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuits, such as ICs and LSIs, are referred to by different names depending on the degree of integration, and include integrated circuits called system LSIs, very large-scale integrations (VLSIs), or ultra-large-scale integrations (ULSIs). Furthermore, field-programmable gate arrays (FPGAs), which are programmed after the LSI is manufactured, or logic devices that allow the reconfiguration of internal connections or circuit partitions within the LSI, can also be used as processors. The electronic circuits may be integrated into one chip or distributed across multiple chips. The chips may be integrated into one device or distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0129] Furthermore, it is not essential for the mounting system 10 that multiple functions are concentrated in one housing. The components of the mounting system 10 may be distributed across multiple housings. Furthermore, at least some of the functions of the mounting system 10 may be realized by the cloud (cloud computing) or the like.

[0130] Conversely, in the first embodiment, at least some of the functions of the mounting system 10 that are distributed among multiple devices may be integrated into one housing. For example, some of the functions that are distributed between the head unit 1 and the first control unit 4 may all be integrated into the head unit 1.

[0131] In the first embodiment, the storage battery 15 is an electric double layer capacitor, but the storage battery 15 is not limited to an electric double layer capacitor and may be, for example, a secondary battery.

[0132] In the first embodiment, magnet 22 includes an electromagnet, but magnet 17 may include an electromagnet, or both magnets 17 and 22 may include electromagnets. Also, in the first embodiment, magnet 17 includes a permanent magnet, but magnet 22 may include a permanent magnet, or both magnets 17 and 22 may include permanent magnets.

[0133] In the first embodiment, the magnet 262 includes an electromagnet, but the magnets 63, 72, 82, and 93 may also include electromagnets, or all of the magnets 63, 72, 82, 93, and 262 may also include electromagnets. Also, in the first embodiment, the magnets 63, 72, 82, and 93 include permanent magnets, but the magnet 262 may also include a permanent magnet, or all of the magnets 63, 72, 82, 93, and 262 may also include permanent magnets.

[0134] In the first embodiment, each component supply unit 5 has a part feeder, but each component supply unit 5 may have, for example, a part tray on which a plurality of components 100 are placed. Alternatively, each component supply unit 5 may have both a part feeder and a part tray.

[0135] In the first embodiment, the head unit 1 has one component holder 12, but the head unit 1 may have two or more component holders 12 as long as they can be attached to the mover 11.

[0136] In the first embodiment, the first position and the second position are the same position (component removal position P5), but the first position and the second position may be different positions. For example, the first position may be the component removal position P5, and the second position may be the component mounting position P2.

[0137] Although the first embodiment uses one stator 21, the stator 21 may be divided into multiple parts. In this case, the stator 21 may be divided into two or more parts in the X-axis direction, or into two or more parts in the Y-axis direction, or into two or more parts in both the X-axis direction and the Y-axis direction.

[0138] In the first embodiment, there is one stator 261, but the stator 261 may be divided into multiple parts. In this case, the stator 261 may be divided into two or more parts in the X-axis direction, or into two or more parts in the Y-axis direction, or into two or more parts in both the X-axis direction and the Y-axis direction.

[0139] In the first embodiment, the first pressure accumulation operation for creating a negative internal pressure in the first pressure accumulation container 13, the second pressure accumulation operation for creating a positive internal pressure in the second pressure accumulation container 14, and the charging operation for the storage battery 15 are performed at the component removal position P5. However, the second pressure accumulation operation and the charging operation are not limited to the component removal position P5. The second pressure accumulation operation may be performed, for example, when the head unit 1 is positioned above the component recognition unit 6, the component disposal unit 7, or the nozzle replacement unit 8. That is, the second pressure accumulation operation is performed when the head unit 1 is stopped to hold the component 100, recognize the component 100, discard the component 100, or replace the component holder 12. The first pressure accumulation operation is performed when the head unit 1 is stopped to hold the component 100. On the other hand, the charging operation may be performed when the head unit 1 is stopped at any of the above positions, or when the head unit 1 is moving.

[0140] In the first embodiment, component 100 is brought into contact with substrate 200 while substrate holder 9 is floating above stator 261. However, component 100 may be brought into contact with substrate 200 after substrate holder 9 is fixed to stator 261. In this case, component holder 12 is lowered onto substrate 200 on substrate holder 9 fixed to stator 261, and component 100 is mounted on mounting surface 201 of substrate 200. This makes it possible to improve the mounting accuracy of component 100 on substrate 200.

[0141] Alternatively, the component 100 may be brought into contact with the substrate 200 while the substrate holder 9 is levitated and stopped relative to the stator 261. In this case, the component holder 12 is lowered toward the substrate 200 on the substrate holder 9, which is stopped while levitated relative to the stator 261, and the component 100 is brought into contact with the mounting surface 201 of the substrate 200, after which the substrate holder 9 is lowered. This improves productivity compared to a case where the component 100 is brought into contact with the substrate 200 after the substrate holder 9 is fixed to the stator 261. Furthermore, since the component 100 is brought into contact with the substrate 200 while the substrate holder 9 is levitated, it is also possible to mitigate the impact on the component 100 when it comes into contact with the substrate 200. As a result, deformation, damage, etc. of the component 100 can be suppressed.

[0142] In the first embodiment, each of the multiple nozzle replacement units 8 has multiple types of component holders 12. Alternatively, for example, each of the multiple nozzle replacement units 8 may have component holders 12 of different sizes, and the nozzle replacement unit 8 having the component holder 12 corresponding to the size of the component 100 to be mounted may be configured to move to the nozzle replacement position.

[0143] (Embodiment 2) A mounting system 10a according to the second embodiment will be described with reference to Fig. 21. Regarding the mounting system 10a according to the second embodiment, the same components as those of the mounting system 10 according to the first embodiment (see Fig. 1) are denoted by the same reference numerals, and the description thereof will be omitted.

[0144] The mounting system 10a according to the second embodiment differs from the mounting system 10 according to the first embodiment in that it includes a plurality of mounting units 20.

[0145] (1) Composition 21, the mounting system 10a according to the second embodiment includes a plurality of (two in the illustrated example) mounting units 20, one carry-out unit 30, and a plurality of (three in the illustrated example) transport units 40. The mounting system 10a further includes a plurality of substrate holders 9. The plurality of mounting units 20 include a first mounting unit 20a and a second mounting unit 20b.

[0146] Similar to the mounting system 10 according to the first embodiment, each of the first mounting unit 20a and the second mounting unit 20b includes a head unit 1 (see FIG. 1), a first drive unit 2 (see FIG. 1), a plurality of power units 3 (see FIG. 1), a first control unit 4 (see FIG. 1), a plurality of (five in the illustrated example) component supply units 5, a component recognition unit 6 (see FIG. 1), a plurality of component disposal units 7 (see FIG. 1), a plurality of nozzle replacement units 8 (see FIG. 1), a transmitter-receiver unit 25 (see FIG. 1), and a second drive unit 26. Therefore, in each of the first mounting unit 20a and the second mounting unit 20b, the substrate holder 9 can be moved by the magnetic force generated between the first mounting unit 20a and the second mounting unit 20b and the stator 261 of the second drive unit 26.

[0147] Like the first mounting unit 20a and the second mounting unit 20b, the unloading unit 30 and each of the plurality of transport units 40 are configured so that the substrate holding unit 9 can move in a magnetically levitated state. That is, each of the unloading unit 30 and each of the plurality of transport units 40 has a stator, and can control the movement of the substrate holding unit 9 by controlling the magnetic force generated between the stator and the mover 92 (see FIG. 1) of the substrate holding unit 9.

[0148] In the example shown in FIG. 21, transport units 40 are respectively arranged between the first mounting unit 20a and the second mounting unit 20b, between the second mounting unit 20b and the unloading unit 30, and between the unloading unit 30 and the first mounting unit 20a.

[0149] In the mounting system 10a configured as described above, first, the board holding unit 9 holding the unmounted board 200 is carried into the first mounting unit 20a. The board holding unit 9 carried into the first mounting unit 20a moves to the component mounting position P2 (see FIG. 2), and after components 100 are mounted on the board 200, moves to the transport unit 40 following the second mounting unit 20b. The board holding unit 9 then moves from the transport unit 40 to the second mounting unit 20b. That is, the first mounting unit 20a mounts components 100 supplied from the component supply unit 5 onto the board 200 held by the board holding unit 9 carried to the first mounting unit 20a, and then transports the board holding unit 9 to the second mounting unit 20b.

[0150] The board holding unit 9 that has moved to the second mounting unit 20b then moves to the component mounting position P2 (see FIG. 2), and after components 100 have been mounted on the board 200, moves to the transport unit 40 that follows the carry-out unit 30. The board holding unit 9 then moves from the transport unit 40 to the carry-out unit 30. Then, the board holding unit 9 that has moved to the carry-out unit 30 carries out the mounted board 200, and then moves to the transport unit 40 that follows the first mounting unit 20a.

[0151] Here, the transport step is a step of mounting components 100 on board 200 held by board holder 9 transported to first mounting unit 20a, and then transporting board holder 9 to second mounting unit 20b. That is, the mounting method further includes the transport step described above.

[0152] (2) Effects In the mounting system 10a according to the second embodiment, multiple substrate holders 9 can be moved simultaneously, which makes it possible to reduce the working time compared to the conventional configuration in which the substrates 200 are loaded one by one in sequence, thereby improving the productivity of the mounting system 10a.

[0153] Furthermore, in the mounting system 10a according to the second embodiment, the substrate 200 is not attached or detached when being transported from the first mounting unit 20a to the second mounting unit 20b, and when being transported from the second mounting unit 20b to the unloading unit 30, so that it is possible to prevent equipment stoppage due to misalignment of the substrate 200, etc.

[0154] (3) Variations In the mounting system 10a according to the second embodiment, a transport unit 40 is provided between the first mounting unit 20a and the second mounting unit 20b, and between the second mounting unit 20b and the carry-out unit 30. In contrast, as shown in Fig. 22, the transport unit 40 between the first mounting unit 20a and the second mounting unit 20b and the transport unit 40 between the second mounting unit 20b and the carry-out unit 30 may be omitted. A mounting system 10b according to a modified example will be described below with reference to Fig. 22.

[0155] The mounting system 10b according to the modified example differs from the mounting system 10a according to the second embodiment in that the transport unit 40 between the first mounting unit 20a and the second mounting unit 20b and the transport unit 40 between the second mounting unit 20b and the carry-out unit 30 are omitted. This makes it possible to shorten the movement path of the substrate holder 9, thereby further improving the productivity of the mounting system 10b. Furthermore, because two transport units 40 can be omitted, it is possible to reduce the size and cost of the mounting system 10b.

[0156] (Aspect) The present specification discloses the following aspects.

[0157] A mounting system (10) according to a first aspect includes a substrate loading unit (27) and a substrate holding unit (9). The substrate loading unit (27) loads a substrate (200). The substrate holding unit (9) holds the substrate (200) supplied from the substrate loading unit (27). The substrate holding unit (9) has a mover (92). The mover (92) is movable in a state of being magnetically levitated relative to the stator (261) by a magnetic force (F22) generated between the mover (92) and the stator (261).

[0158] According to this embodiment, the substrate holding portion (9) can be moved, which makes it possible to shorten the operation time compared to when the substrate holding portion is fixed, and as a result, it is possible to improve the productivity of the mounting system (10).

[0159] A mounting system (10) according to a second aspect is the same as that according to the first aspect, but includes a plurality of substrate holding units (9). The plurality of substrate holding units (9) include a first substrate holding unit (9A) and a second substrate holding unit (9B). The first substrate holding unit (9A), which is located at a substrate supply position (P1) where a substrate (200) is supplied from a substrate carry-in unit (27), moves to a component mounting position (P2) where a component (100) is mounted on the substrate (200), and then moves to the substrate supply position (P1).

[0160] According to this aspect, the first substrate holding portion (9A) and the second substrate holding portion (9B) can be moved simultaneously, which makes it possible to shorten the operation time and, as a result, improve the productivity of the mounting system (10).

[0161] A mounting system (10) according to a third aspect is the same as that according to the second aspect, but further includes a head unit (1). The head unit (1) has a component holder (12) that holds a component (100), and mounts the component (100) held by the component holder (12) on a board (200) held by a first board holder (9A). The component mounting position (P2) is the position where the moving distance of the head unit (1) relative to the board (200) held by the first board holder (9A) is the shortest.

[0162] According to this embodiment, the productivity of the mounting system (10) can be further improved by moving the head unit (1) over the shortest distance.

[0163] In the mounting system (10) according to the fourth aspect, in the third aspect, the distance between the head unit (1) and the component mounting position (P2) is shorter than the distance between the head unit (1) and the board supply position (P1).

[0164] According to this embodiment, it is possible to improve the productivity of the mounting system 10 compared to when the distance between the head section 1 and the component mounting position P2 is equal to or greater than the distance between the head section 1 and the board supply position P1. Also, by sharing the board holding section 9 with multiple mounting units 20, it is possible to reduce the number of board holding sections 9, which in turn makes it possible to reduce mounting costs.

[0165] The mounting system (10) according to a fifth aspect is any one of the second to fourth aspects, and further includes a substrate unloading section (28). The substrate unloading section (28) unloads the substrate (200). After components (100) are mounted on the substrate (200) at the component mounting position (P2), the first substrate holding section (9A) moves to a substrate unloading position (P3) adjacent to the substrate unloading section (28), and at the substrate unloading position (P3) moves the substrate (200) to the substrate unloading section (28).

[0166] According to this embodiment, it is possible to shorten the transport distance of the substrate (200) from the substrate holding section (9) to the substrate unloading section (28), thereby further improving the productivity of the mounting system (10).

[0167] In the mounting system (10) according to the sixth aspect, in the fifth aspect, the second substrate holding unit (9B) moves from the substrate supply position (P1) to the component mounting position (P2) after the first substrate holding unit (9A) moves from the component mounting position (P2) to the substrate unloading position (P3).

[0168] According to this aspect, by moving the first board holding part (9A), it is possible to move the second board holding part (9B) to the vacant component mounting position (P2).

[0169] In a mounting system (10) according to a seventh aspect, in the fifth or sixth aspect, the plurality of substrate holding units (9) further includes a third substrate holding unit (9C). The third substrate holding unit (9C) is different from the first substrate holding unit (9A) and the second substrate holding unit (9B). The third substrate holding unit (9C) starts moving toward the substrate supply position (P1) when the first substrate holding unit (9A) moves from the substrate unloading position (P3). When the second substrate holding unit (9B) is located at the substrate supply position (P1), the third substrate holding unit (9C) waits at a standby position (P4) just before the substrate supply position (P1).

[0170] According to this aspect, it is possible to move the third substrate holding part (9C) in response to the operation of the first substrate holding part (9A) and the second substrate holding part (9B).

[0171] The mounting system (10) according to the eighth aspect is the same as that of the first aspect, but further includes a head unit (1). The head unit (1) has a component holder (12) that holds a component (100) to be mounted on a board (200), and mounts the component (100) held by the component holder (12) on the board (200) held by the board holder (9). When the board holder (9) and the head unit (1) are positioned at a component mounting position (P2), the system mounts the component (100) on the board (200) by simultaneously performing an operation of moving the board holder (9) in a direction in which the mover (92) approaches the stator (261) and an operation of moving the component holder (12) holding the component (100) in a direction in which the mover (92) approaches the board (200) held by the board holder (9). The component mounting position (P2) is a position where the component (100) is mounted on the board (200).

[0172] According to this embodiment, it is possible to reduce the impact on the component (100) when it comes into contact with the substrate (200), and as a result, it is possible to prevent deformation, damage, etc. of the component (100).

[0173] In the mounting system (10) according to the ninth aspect, in any one of the first to eighth aspects, the stator (261) has a flat surface (2611) and is located below the mover (92). The mover (92) is movable along the flat surface (2611) of the stator (261).

[0174] According to this embodiment, the substrate holder (9) can be moved along the plane (2611) of the stator (261).

[0175] A mounting system (10) according to a tenth aspect is the ninth aspect and includes a plurality of substrate holders (9). The plane (2611) is larger than or equal to the movable range of the plurality of substrate holders (9).

[0176] According to this embodiment, it is possible to simultaneously move a plurality of substrate holders (9) along the plane (2611) of the stator (261).

[0177] In a mounting system (10) according to an eleventh aspect, in any one of the first to tenth aspects, the substrate holder (9) has a conveyor (91).

[0178] According to this embodiment, it is possible to hold and transport the substrate (200).

[0179] In the mounting system (10) according to the twelfth aspect, in the eleventh aspect, the length (L1) of the conveyor (91) is variable in the transport direction (e.g., the X-axis direction) of the substrate (200) from the substrate loading section (27) to the substrate holding section (9).

[0180] According to this embodiment, the length (L1) of the conveyor (91) can be adjusted in accordance with the length of the substrate (200) in the transport direction.

[0181] A mounting system (10) according to a thirteenth aspect is any one of the first to twelfth aspects, and further includes a head unit (1), an imaging unit (6), a replacement unit (8), and a disposal unit (7). The head unit (1) has a component holding unit (12) that holds a component (100) to be mounted on a board (200), and mounts the component (100) held by the component holding unit (12) on the board (200) held by the board holding unit (9). The imaging unit (6) is located between a component removal position (P5) where the component (100) is removed by the component holding unit (12) from a component supply unit (5) that supplies the component (100), and a component mounting position (P2) where the component (100) is mounted on the board (200), and captures an image of the component holding unit (12) holding the component (100). The replacement unit (8) has multiple types of component holders (12) and replaces one of the multiple types of component holders (12) with a corresponding component holder (12) depending on the type of component (100) to be mounted on the board (200). The disposal unit (7) discards the component (100) held in the component holder (12). Each of the imaging unit (6), replacement unit (8), and disposal unit (7) has a second mover (62, 71, 81) different from the first mover (92) as the mover (92), and is movable in a magnetically levitated state relative to the stator (261) by magnetic force generated between the second mover (62, 71, 81 and the stator (261).

[0182] According to this embodiment, the imaging unit (6), the exchange unit (8), and the disposal unit (7) can also be moved individually.

[0183] A mounting system (10a; 10b) according to a fourteenth aspect is any one of the first to thirteenth aspects and includes a plurality of mounting units (20). The plurality of mounting units (20) includes a first mounting unit (20a) and a second mounting unit (20b). The first mounting unit (20a) mounts components (100) supplied from a component supply unit (5) on a board (200) held by a board holding unit (9) transported to the first mounting unit (20a), and then transports the board holding unit (9) to the second mounting unit (20b).

[0184] According to this embodiment, the substrate holding portion (9) can be moved, which makes it possible to shorten the work time compared to when the substrate holding portion is fixed, and as a result, it is possible to improve the productivity of the mounting system (10a; 10b).

[0185] A mounting method according to a fifteenth aspect includes a moving step in which, with a substrate (200) held by a substrate holder (9), the substrate holder (9) is moved while being magnetically levitated relative to the stator (261) by a magnetic force generated between the mover (92) and the stator (261). The substrate holder (9) includes a mover (92).

[0186] According to this embodiment, the substrate holding portion (9) can be moved, which makes it possible to shorten the operation time compared to when the substrate holding portion is fixed, and as a result, it is possible to improve the productivity of the mounting system (10).

[0187] A mounting method according to a sixteenth aspect is the same as that of the fifteenth aspect, but with a plurality of substrate holding units (9). The plurality of substrate holding units (9) include a first substrate holding unit (9A) and a second substrate holding unit (9B). The mounting method further includes a second movement step different from the first movement step. In the second movement step, the first substrate holding unit (9A), which is located at a substrate supply position (P1) where a substrate (200) is supplied, is moved to a component mounting position (P2) where a component (100) is mounted on the substrate (200), and then the second substrate holding unit (9B) is moved to the substrate supply position (P1).

[0188] According to this aspect, the first substrate holding portion (9A) and the second substrate holding portion (9B) can be moved simultaneously, which makes it possible to shorten the operation time and, as a result, improve the productivity of the mounting system (10).

[0189] In a mounting method according to a seventeenth aspect, in the sixteenth aspect, a head unit (1) having a component holder (12) for holding a component (100) mounts the component (100) held by the component holder (12) onto a board (200) held by a first board holder (9A). The component mounting position (P2) is a position where the moving distance of the head unit (1) relative to the board (200) held by the first board holder (9A) is the shortest.

[0190] According to this embodiment, the productivity of the mounting system (10) can be further improved by moving the head unit (1) over the shortest distance.

[0191] In a mounting method according to an eighteenth aspect, in the fifteenth aspect, a head unit (1) having a component holder (12) for holding a component (100) to be mounted on a substrate (200) mounts the component (100) held by the component holder (12) on the substrate (200) held by the substrate holder (9). The mounting method further includes a mounting step. In the mounting step, while the substrate holder (9) and the head unit (1) are positioned at a component mounting position (P2) where the component (100) is mounted on the substrate (200), the component (100) is mounted on the substrate (200) by concurrently performing an operation of moving the substrate holder (9) in a direction in which the mover (92) approaches the stator (261) and an operation of moving the component holder (12) holding the component (100) in a direction in which the mover (92) approaches the substrate (200) held by the substrate holder (9).

[0192] According to this embodiment, it is possible to reduce the impact on the component (100) when it comes into contact with the substrate (200), and as a result, it is possible to prevent deformation, damage, etc. of the component (100).

[0193] A mounting method according to a 19th aspect is any one of the 15th to 18th aspects, wherein the plurality of mounting units (20) includes a first mounting unit (20a) and a second mounting unit (20b). The mounting method further includes a transport step. In the transport step, components (100) supplied from a component supply unit (5) are mounted on a board (200) held by a board holding unit (9) transported to the first mounting unit (20a), and then the board holding unit (9) is transported to the second mounting unit (20a).

[0194] According to this embodiment, the substrate holding portion (9) can be moved, which makes it possible to shorten the work time compared to when the substrate holding portion is fixed, and as a result, it is possible to improve the productivity of the mounting system (10a; 10b).

[0195] The configurations according to the second to fourteenth aspects are not essential for the mounting system (10; 10a; 10b) and can be omitted as appropriate.

[0196] The configurations according to the sixteenth to nineteenth aspects are not essential for the mounting method and can be omitted as appropriate. [Explanation of symbols]

[0197] 1 Head 5. Parts Supply Department 6 Part recognition unit (imaging unit) 7 Parts Disposal Department (Disposal Department) 8 Nozzle replacement part (replacement part) 9 Board holding part 9A 1st board holder 9B 2nd board holder 9C Third board holder 10, 10a, 10b Mounting system 12 Parts holder 20 Mounting Unit 20a First mounting unit 20b Second mounting unit 27 Board loading area 28 Substrate unloading section 62,71,81 Mover (2nd mover) 91 Conveyor 92 Mover (1st mover) 200 boards 261 Stator 2611 plane L1 length P1 Board supply position P2 Component mounting position P3 Board unloading position P4 Standby position P5 Parts removal position

Claims

1. a substrate loading section for loading a substrate; a substrate holding unit that holds the substrate supplied from the substrate loading unit; a head unit that has a component holding unit that holds components to be mounted on the board, and that mounts the components held by the component holding unit onto the board held by the board holding unit, the substrate holder has a mover that is movable in a magnetically levitated state relative to a stator by a magnetic force generated between the mover and the stator, When the board holding unit and the head unit are positioned at a component mounting position where the component is mounted on the board, the component is mounted on the board by concurrently performing an operation of moving the board holding unit in a direction in which the mover approaches the stator and an operation of moving the component holding unit holding the component in a direction in which the mover approaches the board held by the board holding unit. Implementation system.

2. a plurality of the substrate holders; the plurality of substrate holders include a first substrate holder and a second substrate holder; the second substrate holding unit moves to the substrate supply position after the first substrate holding unit, which is located at a substrate supply position where the substrate is supplied from the substrate carry-in unit, moves to the component mounting position; The mounting system according to claim 1 .

3. The head unit mounts the component held in the component holding unit onto the substrate held in the first substrate holding unit, the component mounting position is a position where the movement distance of the head unit relative to the board held by the first board holding unit is shortest. The mounting system according to claim 2 .

4. the distance between the head unit and the component mounting position is shorter than the distance between the head unit and the board supply position; The mounting system according to claim 3 .

5. Further provided is a substrate unloading unit that unloads the substrate, the first board holding unit moves to a board unloading position adjacent to the board unloading unit after the components are mounted on the board at the component mounting position, and moves the board to the board unloading unit at the board unloading position. The mounting system according to any one of claims 2 to 4.

6. the second substrate holding unit moves from the substrate supply position to the component mounting position after the first substrate holding unit moves from the component mounting position to the substrate unloading position. The mounting system according to claim 5 .

7. the plurality of substrate holding units further include a third substrate holding unit different from the first substrate holding unit and the second substrate holding unit; The third substrate holding unit is when the first substrate holding part moves from the substrate unloading position, it starts moving toward the substrate supply position; When the second substrate holding unit is located at the substrate supply position, the second substrate holding unit waits at a waiting position in front of the substrate supply position. The mounting system according to claim 5 or 6.

8. The stator has a flat surface and is located below the movable element, The mover is movable along the plane of the stator. The mounting system according to any one of claims 1 to 7.

9. A substrate holding unit including a plurality of the substrate holding units, the plane has a size equal to or larger than the movable range of the plurality of substrate holders; The mounting system according to claim 8 .

10. The substrate holder has a conveyor. The mounting system according to any one of claims 1 to 9.

11. The length of the conveyor is variable in the transport direction of the substrate from the substrate loading section to the substrate holding section. The mounting system according to claim 10 .

12. An imaging unit located between a component removal position where the component is removed by the component holding unit from the component supply unit that supplies the component, and the component mounting position, and which images the component holding unit holding the component; an exchange unit having a plurality of types of component holders, and exchanging the component holders for corresponding ones of the plurality of types of component holders depending on the type of component to be mounted on the board; a disposal unit that discards the component held by the component holding unit, each of the imaging unit, the exchanging unit, and the discarding unit has a second movable element different from the first movable element as the movable element, and is movable in a magnetically levitated state relative to the stator by a magnetic force generated between the second movable element and the stator; The mounting system according to any one of claims 1 to 11.

13. A plurality of mounting units including a first mounting unit and a second mounting unit, the first mounting unit mounts the components supplied from a component supply unit onto the board held by the board holding unit transported to the first mounting unit, and then transports the board holding unit to the second mounting unit. The mounting system according to any one of claims 1 to 12.

14. A moving step is provided in which, with a substrate held by a substrate holding part having a movable element, the substrate holding part is moved while being magnetically levitated relative to the stator by a magnetic force generated between the movable element and the stator, a head unit having a component holder for holding a component to be mounted on the board, the component held by the component holder being mounted on the board held by the board holder; The method further includes a mounting step of mounting the component on the board by concurrently performing an operation of moving the board holding unit in a direction in which the mover approaches the stator and an operation of moving the component holding unit holding the component in a direction in which the mover approaches the board held by the board holding unit, while the board holding unit and the head unit are positioned at a component mounting position where the component is mounted on the board. How to implement it.

15. The substrate holder is a plurality of members, the plurality of substrate holders include a first substrate holder and a second substrate holder; The moving step further includes a second moving step different from the first moving step, In the second moving step, the first board holding unit, which is located at a board supply position where the board is supplied, is moved to the component mounting position, and then the second board holding unit is moved to the board supply position. The mounting method according to claim 14.

16. The head unit mounts the component held in the component holding unit onto the substrate held in the first substrate holding unit, the component mounting position is a position where the movement distance of the head unit relative to the board held by the first board holding unit is shortest. The mounting method according to claim 15.

17. The plurality of mounting units includes a first mounting unit and a second mounting unit, a transport step of transporting the board holding unit to the second mounting unit after mounting the components supplied from a component supply unit on the board held by the board holding unit transported to the first mounting unit, The mounting method according to any one of claims 14 to 16.

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