Method for transporting object to be processed and processing apparatus

Abstract

To provide a conveying method of an object to be processed capable of suppressing displacement of the object to be processed on the mounting surface of a mounting table and dust generation from lift pins.SOLUTION: The conveying method of an object to be processed includes step a), step b), step c), and step d). In step a), a tilt of the mounting table that has a mountable surface capable of placing the object to be processed is adjusted so that the mounting surface is tilted with respect to the horizontal plane. In step b), before or after step a), an object to be processed is received from a carrier that carries an object to be processed by raising multiple lift pins provided to the mounting table. In step c), the object to be processed is placed on an inclined mounting surface by lowering the multiple lift pins and / or raising the mounting table. In step d), the tilt of the mounting table is adjusted so that the mounting surface on which the object to be processed is placed is parallel to the horizontal plane.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a method for transporting an object to be processed and a processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a technology in which a workpiece transported above a mounting table by a transport device is received from the mounting table by raising multiple lift pins of different lengths, and then the workpiece is placed on the mounting surface of the mounting table by lowering the multiple lift pins. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-53627 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can suppress displacement of a workpiece on the mounting surface of a mounting table and generation of dust from lift pins. [Means for solving the problem]

[0005] A method for transporting a workpiece according to one embodiment of the present disclosure includes steps a), b), c), and d). In step a), the tilt of a mounting table having a mounting surface on which the workpiece can be placed is adjusted so that the mounting surface is inclined relative to a horizontal plane. In step b), before or after step a), multiple lift pins provided on the mounting table are raised to receive the workpiece from a transport device that transports the workpiece. In step c), the lift pins are lowered and / or the mounting table is raised to place the workpiece on the inclined mounting surface. In step d), the tilt of the mounting table is adjusted so that the mounting surface on which the workpiece is placed is parallel to the horizontal plane. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to suppress the displacement of the workpiece on the mounting surface of the mounting table and the generation of dust from the lift pins. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a vacuum processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a top view of the mounting table according to the embodiment. [Figure 3] FIG. 3 is a flowchart showing an example of a processing operation when a substrate is carried in the vacuum processing apparatus according to one embodiment. [Figure 4] FIG. 4 is a diagram for explaining a specific example of a processing operation when a substrate is carried in the vacuum processing apparatus according to one embodiment. [Figure 5] FIG. 5 is a diagram for explaining a specific example of a processing operation when a substrate is carried in the vacuum processing apparatus according to one embodiment. [Figure 6] FIG. 6 is a diagram for explaining a specific example of a processing operation when a substrate is carried in the vacuum processing apparatus according to one embodiment. [Figure 7] FIG. 7 is a diagram for explaining a specific example of a processing operation when a substrate is carried in the vacuum processing apparatus according to one embodiment. [Figure 8] FIG. 8 is a diagram showing an example of the amount of deviation indicated by the positional deviation information. [Figure 9] FIG. 9 is a flowchart showing an example of a processing operation when a substrate is unloaded from a vacuum processing apparatus according to an embodiment. [Figure 10] FIG. 10 is a diagram for explaining a specific example of a processing operation when a substrate is unloaded from a vacuum processing apparatus according to an embodiment. [Figure 11] FIG. 11 is a diagram for explaining a specific example of a processing operation when a substrate is unloaded from a vacuum processing apparatus according to an embodiment. [Figure 12]FIG. 12 is a diagram for explaining a specific example of a processing operation when a substrate is unloaded from a vacuum processing apparatus according to an embodiment. [Figure 13] FIG. 13 is a diagram for explaining an example of tilt adjustment of the mounting table. DETAILED DESCRIPTION OF THE INVENTION

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method for transporting a target object and a processing apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the disclosed technology is not limited to the following embodiments.

[0009] In the above-described conventional technology, a workpiece is supported by multiple lift pins of different lengths in an inclined position relative to a horizontal plane. As the lift pins descend, the workpiece, supported in an inclined position by the multiple lift pins of different lengths, gradually contacts the mounting surface of the mounting table, starting with the relatively lower edge of the workpiece, and is finally placed on the mounting surface in a horizontal position. As a result, even if gas remains between the workpiece and the mounting surface of the mounting table, the remaining gas can be released from the relatively higher edge of the workpiece, thereby suppressing displacement of the workpiece on the mounting surface of the mounting table due to the remaining gas.

[0010] However, when a plurality of lift pins of different lengths are used to receive a workpiece from a transport device, the load caused by contact with the workpiece is concentrated on the relatively long lift pins, which can cause the relatively long lift pins to wear out more than the other lift pins, potentially generating dust.

[0011] Therefore, it is expected that the displacement of the object to be processed on the mounting surface of the mounting table and the generation of dust from the lift pins will be suppressed.

[0012] [Configuration of vacuum processing apparatus 100] Fig. 1 is a schematic cross-sectional view showing an example of the configuration of a vacuum processing apparatus (an example of a processing apparatus) 100 according to one embodiment. The vacuum processing apparatus 100 shown in Fig. 1 is an apparatus that performs film formation in a vacuum atmosphere. For example, the vacuum processing apparatus 100 shown in Fig. 1 is an apparatus that performs CVD (Chemical Vapor Deposition) processing on a substrate W using plasma.

[0013] The vacuum processing apparatus 100 includes a processing vessel 1 formed in a generally cylindrical shape from a metal such as aluminum or nickel having an anodized oxide coating formed on its surface. The processing vessel 1 has a bottom wall 1b and a side wall 1f. The processing vessel 1 is grounded. The processing vessel 1 is configured to be airtight so that a vacuum atmosphere can be maintained inside. An opening 1a is formed in the side wall 1f of the processing vessel 1 for loading and unloading a substrate W (an example of an object to be processed) such as a semiconductor wafer. The opening 1a is opened and closed by a gate valve G.

[0014] A mounting table 2 for placing a substrate W thereon is provided inside the processing vessel 1. The mounting table 2 is formed in a flat, approximately cylindrical shape and is made of a metal such as aluminum or nickel, or aluminum nitride (AlN) with an embedded metal mesh electrode. The substrate W is placed on the upper surface of the mounting table 2. That is, the upper surface of the mounting table 2 is a mounting surface 2c on which the substrate W can be placed. The mounting table 2 also functions as a lower electrode. The mounting table 2 is supported from below by a support member 2a. The support member 2a is formed in an approximately cylindrical shape, extends vertically downward from the mounting table 2, and penetrates the bottom wall 1b of the processing vessel 1. The lower end of the support member 2a is located outside the processing vessel 1 and is connected to a rotation drive mechanism 6. The support member 2a is rotated by the rotation drive mechanism 6. The mounting table 2 is configured to rotate in response to the rotation of the support member 2a. An adjustment mechanism 7 is provided at the lower end of the support member 2a. The adjustment mechanism 7 can adjust the position and inclination of the mounting table 2 by changing the position and inclination of the support member 2a.

[0015] The mounting table 2 has a built-in heater 2b. The heater 2b generates heat in response to power supplied from outside the processing chamber 1, and heats the substrate W placed on the mounting table 2. Although not shown, a flow path is formed inside the mounting table 2 to supply a coolant whose temperature is controlled by a chiller unit provided outside the processing chamber 1. By heating with the heater 2b and cooling with the coolant supplied from the chiller unit, the mounting table 2 can control the temperature of the substrate W to a predetermined temperature. Note that the mounting table 2 may not be provided with the heater 2b, and the temperature of the substrate W may be controlled by the coolant supplied from the chiller unit.

[0016] Although not shown, an electrode that generates an electrostatic force by an externally supplied voltage is embedded inside the mounting table 2. The electrostatic force generated by this electrode enables the mounting table 2 to attract and hold the substrate W placed on its upper surface (i.e., the mounting surface 2c).

[0017] 1 and 2, the mounting table 2 is provided with a plurality of lift pins 21 that can be raised and lowered from the mounting surface 2c. FIG. 2 is a top view of the mounting table 2 according to one embodiment. FIG. 2 shows the mounting surface 2c of the mounting table 2 in a disk shape. The mounting table 2 is provided with a plurality of (e.g., three) pin through holes 20, and the plurality of lift pins 21 are arranged inside these pin through holes 20. The plurality of pin through holes 20 and the plurality of lift pins 21 are arranged at equal intervals along the circumferential direction of the mounting surface 2c. FIG. 2 shows the arrangement positions of the plurality of pin through holes 20 and the plurality of lift pins 21. The plurality of pin through holes 20 and the plurality of lift pins 21 are arranged, for example, such that the angle formed by the line segment connecting the center O of the mounting surface 2c and each of the plurality of pin through holes 20 is 120°.

[0018] Returning to the explanation of FIG. 1 , the pin through holes 20 are provided so as to penetrate from the mounting surface 2c (upper surface) of the mounting table 2 to the back surface (lower surface) opposite to the mounting surface 2c. The lift pins 21 are slidably inserted into the pin through holes 20. When the lift pins 21 are lowered relative to the mounting table 2, the upper ends of the lift pins 21 are suspended from the mounting surface side of the pin through holes 20. That is, the upper ends of the lift pins 21 have a larger diameter than the pin through holes 20, and the upper ends of the pin through holes 20 are formed with recesses that are larger in diameter and thickness than the upper ends of the lift pins 21 and that can accommodate the upper ends of the lift pins 21. The upper ends of the lift pins 21 are suspended from the mounting surface side of the pin through holes 20 by being accommodated in the recesses of the pin through holes 20.

[0019] The lift pins 21 have the same length. The lift pins 21 are float-type lift pins, and their lower ends protrude from the rear surface of the mounting table 2 toward the bottom wall 1b of the processing vessel 1 and can come into contact with the lifting member 22. The lifting member 22 is connected to a drive mechanism 23 and moves up or down in response to drive control by the drive mechanism 23. The lift pins 21 move up or down relative to the mounting surface 2c of the mounting table 2 in response to the lifting member 22 moving up or down.

[0020] A showerhead 3 formed in a substantially circular plate shape and made of a conductive metal such as aluminum or nickel is provided above the mounting table 2. The space between the lower surface of the showerhead 3 and the upper surface of the mounting table 2 is a processing space where a film formation process is performed. The showerhead 3 is supported on the upper part of the mounting table 2 via an insulating member 1d made of ceramic or the like. This electrically insulates the processing chamber 1 and the showerhead 3. The showerhead 3 forms the ceiling of the processing chamber 1.

[0021] The shower head 3 has a top plate 3a and a shower plate 3b. The top plate 3a is provided to close the interior of the processing chamber 1 from above. The shower plate 3b is provided below the top plate 3a to face the mounting table 2. A gas diffusion chamber 3c is formed in the top plate 3a. A plurality of gas outlet holes 3d communicating with the gas diffusion chamber 3c are formed in the top plate 3a and the shower plate 3b.

[0022] The top plate 3a is formed with a gas inlet 3e for introducing gas into the gas diffusion chamber 3c. A gas supply unit 35 is connected to the gas inlet 3e via a pipe 36. The gas supply unit 35 has gas supply sources for various gases used in the film formation process and gas supply lines connected to the respective gas supply sources. Each gas supply line is provided with control devices such as valves and flow rate controllers for controlling the gas flow. The gas supply unit 35 supplies various gases, the flow rates of which are controlled by the control devices provided on each gas supply line, to the showerhead 3 via the pipe 36. The gases supplied to the showerhead 3 diffuse within the gas diffusion chamber 3c and are discharged from the respective gas discharge holes 3d into the processing space below the showerhead 3.

[0023] The shower plate 3b is paired with the mounting table 2 and also functions as an electrode plate for forming a capacitively coupled plasma (CCP) in the processing space. An RF (Radio Frequency) power supply 30 is connected to the showerhead 3 via a matching box 31. The RF power supply 30 supplies RF power to the showerhead 3 via the matching box 31. The RF power supplied from the RF power supply 30 to the showerhead 3 is supplied into the processing space from the underside of the showerhead 3. The gas supplied into the processing space is converted into plasma by the RF power supplied into the processing space. The RF power supply 30 may supply RF power to the mounting table 2 instead of the showerhead 3. In this case, the showerhead 3 is grounded. The RF power supply 30 may supply RF power of different frequencies and magnitudes to both the mounting table 2 and the showerhead 3.

[0024] An exhaust port 40 is formed in the bottom wall 1b of the processing vessel 1. An exhaust device 42 is connected to the exhaust port 40 via a pipe 41. The exhaust device 42 includes a vacuum pump, a pressure adjustment valve, etc. The exhaust device 42 can reduce the pressure inside the processing vessel 1 to a predetermined vacuum level.

[0025] The control unit 102 has a memory, a processor, and an input / output interface. The memory stores programs executed by the processor, recipes including the conditions for each process, and the like. The processor executes the programs read from the memory and controls each part of the main body 101 via the input / output interface based on the recipes stored in the memory.

[0026] [Processing operations when carrying in boards] In the vacuum processing apparatus 100, when the substrate W transferred into the processing chamber 1 by the transfer device is placed on the mounting surface 2c of the mounting table 2, the substrate W may float and slide laterally on the mounting surface 2c due to residual gas between the substrate W and the mounting surface 2c, resulting in a positional deviation. The positional deviation of the substrate W on the mounting surface 2c of the mounting table 2 is undesirable because it reduces the uniformity of the processing performed on the substrate W.

[0027] In response to this, a technique has been proposed in which a plurality of lift pins of different lengths are raised from the mounting table 2 to receive the substrate W, and then the plurality of lift pins of different lengths are lowered to place the substrate W on the mounting surface 2c of the mounting table 2. In this technique, the substrate W is supported by a plurality of lift pins of different lengths in an inclined position relative to the horizontal plane. As the lift pins lower, the substrate W supported in an inclined position by the plurality of lift pins of different lengths gradually contacts the mounting surface 2c of the mounting table 2, starting from the relatively lower edge side of the substrate W, and is finally placed on the mounting surface 2c in a horizontal position. As a result, if gas remains between the substrate W and the mounting surface 2c of the mounting table 2, the remaining gas can be released from the relatively higher edge side of the substrate W, thereby suppressing positional displacement of the substrate W on the mounting surface 2c of the mounting table 2 due to the remaining gas.

[0028] However, in the above-described technique, when a plurality of lift pins of different lengths are used to receive a workpiece from a transport device, the load caused by contact with the substrate W is concentrated on the relatively long lift pins, which may result in the relatively long lift pins being worn more than the other lift pins and generating dust.

[0029] Therefore, in the vacuum processing apparatus 100 of this embodiment, when the substrate W is transferred into the processing chamber 1 by the transfer device, the adjustment mechanism 7 adjusts the inclination of the mounting table 2 so that the mounting surface 2c is inclined with respect to the horizontal plane. The vacuum processing apparatus 100 then raises the multiple lift pins 21 from the mounting table 2 to horizontally receive the substrate W from the transfer device that transfers the substrate W, and then lowers the multiple lift pins 21 to place the substrate W on the inclined mounting surface 2c. This allows the residual gas to escape from the relatively lower edge of the mounting surface 2c, even if gas remains between the substrate W and the mounting surface 2c of the mounting table 2, and prevents the substrate W from shifting in position on the mounting surface 2c of the mounting table 2 due to the residual gas. Furthermore, since the substrate W is horizontally received by the multiple lift pins 21, the load associated with contact between the multiple lift pins 21 and the substrate W can be distributed among the multiple lift pins 21, thereby reducing wear on specific lift pins 21. As a result, the vacuum processing apparatus 100 of this embodiment can suppress the displacement of the substrate W on the mounting surface 2c of the mounting table 2 and the generation of dust from the lift pins 21.

[0030] Fig. 3 is a flowchart showing an example of a processing operation when a substrate W is loaded into the vacuum processing apparatus 100 according to one embodiment. Figs. 4 to 7 are views for explaining a specific example of a processing operation when a substrate W is loaded into the vacuum processing apparatus 100 according to one embodiment. Each step shown in Fig. 3 is realized by the control unit 102 controlling each part of the main body 101.

[0031] The inclination of the mounting table 2 is set so that the mounting surface 2c is parallel to the horizontal plane during periods when loading / unloading of the substrate W is not being performed. When loading / unloading the substrate W, the control unit 102 adjusts the inclination of the mounting table 2 so that the mounting surface 2c is inclined with respect to the horizontal plane (step S10, first inclination adjustment step). That is, as shown in FIG. 4, for example, the control unit 102 controls the adjustment mechanism 7 to adjust the inclination of the mounting table 2 so that the mounting surface 2c is inclined at an inclination angle θ with respect to the horizontal plane. At this time, the control unit 102 adjusts the inclination of the mounting table 2 so that the mounting surface 2c is inclined in an attitude in which the height at the position of a specific lift pin 21 (the left lift pin 21 in FIG. 4) among the multiple lift pins 21 is the lowest. The inclination angle θ of the mounting surface 2c with respect to the horizontal plane is preferably, for example, 0.5° or more and 2° or less, from the viewpoint of preventing the substrate W from slipping off the mounting surface 2c when the substrate W is placed on the mounting surface 2c and from the viewpoint of realizing gas release from the gap between the mounting surface 2c and the substrate W. Next, the transport device carries the substrate W into the processing vessel 1 while holding it on an arm, and moves it to above the mounting table 2.

[0032] When the substrate W reaches above the mounting table 2, the control unit 102 raises the plurality of lift pins 21 to receive the substrate W from the transport device (step S11, receiving step). That is, as shown in FIG. 5, for example, the control unit 102 controls the drive mechanism 23 to raise the lifting member 22 and bring the lifting member 22 into contact with the lower ends of the plurality of lift pins 21. When the lifting member 22 rises, the plurality of lift pins 21 supported by the lifting member 22 rise together with the lifting member 22, protrude from the mounting surface 2c of the mounting table 2, and receive the substrate W from the transport device. Because the plurality of lift pins 21 protruding from the mounting surface 2c of the mounting table 2 have the same length, the tips of the plurality of lift pins 21 are positioned on the same horizontal plane. Therefore, the substrate W is received and supported horizontally by the plurality of lift pins 21. In this way, by receiving the substrate W horizontally by the multiple lift pins 21, the load caused by contact between the multiple lift pins 21 and the substrate W is distributed to each of the multiple lift pins 21, thereby suppressing dust generation caused by wear of a particular lift pin 21.

[0033] The order of the first tilt adjusting step (step S10) and the receiving step (step S11) can be reversed. That is, after the substrate W is received by the plurality of lift pins 21, the tilt of the mounting table 2 may be adjusted so that the mounting surface 2c is inclined with respect to the horizontal plane.

[0034] After adjusting the inclination of the mounting table 2 and receiving the substrate W by the plurality of lift pins 21, the control unit 102 lowers the plurality of lift pins 21 to mount the substrate W on the inclined mounting surface 2c (step S12, mounting step). That is, as shown in FIG. 6, for example, the control unit 102 controls the drive mechanism 23 to lower the lifting member 22. When the lifting member 22 lowers, the plurality of lift pins 21 supported by the lifting member 22 lower together with the lifting member 22, and the substrate W is mounted on the inclined mounting surface 2c. When the substrate W, which is supported horizontally by the plurality of lift pins 21, is mounted on the inclined mounting surface 2c, it gradually comes into contact with the mounting surface 2c from a relatively higher edge of the mounting surface 2c (the right edge in FIG. 6) toward a relatively lower edge of the mounting surface 2c (the left edge in FIG. 6). 6, the substrate W contacting the edge of the relatively high mounting surface 2c (the right edge in FIG. 6) is shown by a dashed line. In this way, the horizontally supported substrate W gradually contacts the inclined mounting surface 2c, so that even if gas remains between the substrate W and the mounting surface 2c of the mounting table 2, the gas can be released from the edge of the relatively low mounting surface 2c (the left edge in FIG. 6). As a result, displacement of the substrate W on the mounting surface 2c of the mounting table 2 due to the residual gas can be suppressed.

[0035] Thereafter, the control unit 102 adjusts the inclination of the mounting table 2 so that the mounting surface 2c on which the substrate W is placed is parallel to the horizontal plane (step S13, second inclination adjustment step). That is, as shown in Fig. 7, for example, the control unit 102 controls the adjustment mechanism 7 to adjust the inclination of the mounting table 2 until the inclination angle θ of the mounting surface 2c with respect to the horizontal plane becomes 0. This is the processing operation when the substrate W is loaded into the vacuum processing apparatus 100 according to one embodiment.

[0036] In the above-described first tilt adjustment step, the tilt of the mounting table 2 is adjusted so that the mounting surface 2c is tilted in a posture in which the height at the position of a specific lift pin 21 among the multiple lift pins 21 is the lowest, but the posture of the mounting surface 2c is not limited to this. For example, in the first tilt adjustment step, the tilt of the mounting table 2 may be adjusted so that the mounting surface 2c is tilted in a posture in which the height at the positions of the multiple lift pins 21 gradually decreases along the circumferential direction of the mounting surface 2c.

[0037] Furthermore, in the above-described placing step, an example has been shown in which the substrate W is placed on the inclined placing surface 2c by lowering the plurality of lift pins 21, but the substrate W may also be placed on the placing surface 2c by raising the placing table 2. Alternatively, the substrate W may also be placed on the placing surface 2c by lowering the plurality of lift pins 21 and raising the placing table 2. The raising of the placing table 2 can be achieved by the control unit 102 controlling the adjustment mechanism 7.

[0038] In the above-described placing step, when the substrate W is placed on the inclined placing surface 2c, it comes into contact with the placing surface 2c from the relatively high edge (the right edge in FIG. 6) of the placing surface 2c and rotates toward the placing surface 2c around the contact position with the placing surface 2c. That is, the substrate W gradually tilts around the contact position with the relatively high placing surface 2c as a fulcrum. As the substrate W rotates, the center of the substrate W placed on the placing surface 2c is slightly shifted from the center of the placing surface 2c.

[0039] Therefore, in the above-described mounting step, the control unit 102 may adjust the position of the mounting table 2 before lowering the plurality of lift pins 21 to correct the misalignment between the center of the mounting surface 2c and the center of the substrate W mounted on the mounting surface 2c. Specifically, the control unit 102 first acquires, from a memory included in the control unit 102, positional deviation information indicating the amount of deviation between the edge position of the substrate W when the substrate W is mounted on the inclined mounting surface 2c and a predetermined reference edge position. The reference edge position is the edge position of the substrate W when the substrate W is normally mounted on the mounting surface 2c (i.e., when the substrate W is mounted on the mounting surface 2c so that the center of the mounting surface 2c coincides with the center of the substrate W mounted on the mounting surface 2c). FIG. 8 is a diagram showing an example of the amount of deviation indicated by the positional deviation information. In FIG. 8, the substrate W mounted on the mounting surface 2c so that the center of the mounting surface 2c coincides with the center of the substrate W mounted on the mounting surface 2c is indicated by a dashed line. When the substrate W is placed on the inclined mounting surface 2c, the deviation amount a between the edge position of the substrate W and the reference edge position is expressed as a=(R-Rcosθ) / 2, where R is the diameter of the substrate W and θ is the inclination angle of the mounting surface 2c relative to the horizontal plane. The control unit 102 then controls the adjustment mechanism 7 based on the positional deviation information to adjust the position of the mounting table 2. That is, the control unit 102 adjusts the horizontal position of the mounting table 2 so that the deviation amount a indicated by the positional deviation information becomes zero. This causes the edge position of the substrate W to coincide with the reference edge position when the substrate W is placed on the inclined mounting surface 2c, thereby correcting the deviation between the center of the mounting surface 2c and the center of the substrate W placed on the mounting surface 2c. After adjusting the position of the mounting table 2, the control unit 102 then lowers the multiple lift pins 21. This allows the substrate W to be placed on the mounting surface 2c so that the center of the mounting surface 2c coincides with the center of the substrate W placed on the mounting surface 2c.

[0040] [Processing operations when unloading the board] In the vacuum processing apparatus 100, reaction by-products (so-called deposits) accumulate on the mounting table 2 during processing of multiple substrates W. The deposits accumulated on the mounting table 2 are charged by the voltage supplied to the electrodes inside the mounting table 2, and the charge on the deposits may remain even after the voltage supplied to the electrodes is removed. When the deposits are charged, an attraction force corresponding to electrostatic force remains between the mounting surface 2c of the mounting table 2 and the substrate W. If the attraction force remaining between the mounting surface 2c of the mounting table 2 and the substrate W is excessively large, the substrate W may jump up when the processed substrate W is lifted by the lift pins 21.

[0041] Therefore, in the vacuum processing apparatus 100 of this embodiment, when the substrate W is transferred from the processing chamber 1 by the transfer device, the adjustment mechanism 7 adjusts the inclination of the mounting table 2 so that the mounting surface 2c is inclined with respect to the horizontal plane. Then, the vacuum processing apparatus 100 raises the plurality of lift pins 21 from the mounting table 2 to lift the substrate W from the inclined mounting surface 2c. This allows the substrate W to be gradually peeled off from the relatively low edge of the mounting surface 2c, even if an adhesive force remains between the mounting surface 2c of the mounting table 2 and the substrate W. As a result, the vacuum processing apparatus 100 of this embodiment gradually releases the contact between the mounting surface 2c and the substrate W, preventing the substrate W from bouncing up.

[0042] Fig. 9 is a flowchart showing an example of processing operations when the substrate W is unloaded from the vacuum processing apparatus 100 according to one embodiment. Figs. 10 to 12 are views for explaining specific examples of processing operations when the substrate W is unloaded from the vacuum processing apparatus 100 according to one embodiment. Each step shown in Fig. 9 is realized by the control unit 102 controlling each part of the main body 101.

[0043] The inclination of the mounting table 2 is set so that the mounting surface 2c is parallel to the horizontal plane during periods when loading / unloading of the substrate W is not being performed. When unloading the substrate W, the control unit 102 adjusts the inclination of the mounting table 2 so that the mounting surface 2c is inclined with respect to the horizontal plane (step S20, third inclination adjustment step). That is, as shown in FIG. 10, for example, the control unit 102 controls the adjustment mechanism 7 to adjust the inclination of the mounting table 2 so that the mounting surface 2c is inclined at an inclination angle θ with respect to the horizontal plane. At this time, the control unit 102 adjusts the inclination of the mounting table 2 so that the mounting surface 2c is inclined in an attitude in which the height at the position of a specific lift pin 21 (the left lift pin 21 in FIG. 10) among the multiple lift pins 21 is the lowest. The inclination angle θ of the support surface 2c with respect to the horizontal plane is preferably, for example, 0.5° or more and 2° or less, from the viewpoint of preventing the substrate W placed on the support surface 2c from slipping off and from the viewpoint of realizing peeling of the substrate W from the support surface 2c.

[0044] After adjusting the tilt of the mounting table 2, the control unit 102 raises the plurality of lift pins 21 to lift the substrate W from the inclined mounting surface 2c (step S21, lifting step). That is, as shown in FIG. 11 , for example, the control unit 102 controls the drive mechanism 23 to raise the lifting member 22 and bring it into contact with the lower ends of the plurality of lift pins 21. When the lifting member 22 rises, the plurality of lift pins 21 supported by the lifting member 22 rise together with the lifting member 22 and protrude from the mounting surface 2c of the mounting table 2, thereby lifting the substrate W from the inclined mounting surface 2c. Since the plurality of lift pins 21 have the same length, the tips of the plurality of lift pins 21 are located on the same horizontal plane. For this reason, when the multiple lift pins 21 protrude from the inclined mounting surface 2c, the substrate W first comes into contact with a specific lift pin 21 (the left lift pin 21 in FIG. 11) located on the relatively lower edge (the left edge in FIG. 11) side of the mounting surface 2c. As a result, the substrate W is gradually peeled off from the edge (the left edge in FIG. 11) side of the relatively lower mounting surface 2c by the multiple lift pins 21. In FIG. 11, the substrate W that has been peeled off from the mounting surface 2c by first coming into contact with a specific lift pin 21 (the left lift pin 21 in FIG. 11) located on the edge (the left edge in FIG. 11) side of the relatively lower mounting surface 2c is shown by a dashed line. In this way, the substrate W is gradually peeled off from the edge (the left edge in FIG. 11) side of the relatively lower mounting surface 2c by the multiple lift pins 21, gradually releasing the contact between the mounting surface 2c and the substrate W, thereby preventing the substrate W from jumping up.

[0045] With the substrate W lifted from the placement surface 2c by the plurality of lift pins 21, the arm of the transfer device enters the processing chamber 1 and stops below the substrate W. Thereafter, the control unit 102 lowers the plurality of lift pins 21 to transfer the substrate W supported by the plurality of lift pins 21 to the transfer device (step S22, transfer step). That is, for example, as shown in FIG. 12 , the control unit 102 controls the drive mechanism 23 to lower the lifting member 22. When the lifting member 22 lowers, the plurality of lift pins 21 supported by the lifting member 22 lower together with the lifting member 22, and the arm (not shown) of the transfer device receives the substrate W supported by the plurality of lift pins 21. The arm of the transfer device moves to the outside of the processing chamber 1 while holding the substrate W, and transfers the substrate W out. This is the processing operation when transferring the substrate W out of the vacuum processing device 100 according to one embodiment.

[0046] In the above third tilt adjustment step, the tilt of the mounting table 2 is adjusted so that the mounting surface 2c is inclined in a posture in which the height at the position of a specific lift pin 21 among the multiple lift pins 21 is the lowest. However, the posture of the mounting surface 2c is not limited to this. For example, in the third tilt adjustment step, the tilt of the mounting table 2 may be adjusted so that the mounting surface 2c is inclined in a posture in which the height at the positions of the multiple lift pins 21 gradually decreases along the circumferential direction of the mounting surface 2c. Such tilt adjustment of the mounting table 2 will be described with reference to FIG. 13. FIG. 13 is a diagram for explaining an example of tilt adjustment of the mounting table 2. In FIG. 13, the mounting surface 2c of the mounting table 2 is shown in a disk shape. For convenience of explanation, lift pins 21-1 to 21-3 are shown as the multiple lift pins 21 in FIG. 13. 13, the X1-axis is an axis that is parallel to the line segment connecting the positions of the lift pins 21-1 and 21-2 and passes through the center O of the mounting surface 2c, and the Y1-axis is an axis that is perpendicular to the X1-axis and passes through the center O of the mounting surface 2c. In the third tilt adjustment process, first, the tilt of the mounting table 2 is adjusted so that the mounting surface 2c rotates in a rotational direction around the X1-axis shown in FIG. 13. As a result, the mounting surface 2c is tilted in an attitude where the height at the positions of the lift pins 21-1 and 21-2 is lower than the height at the position of the lift pin 21-3. Next, in the third tilt adjustment process, the tilt of the mounting table 2 is adjusted so that the mounting surface 2c rotates in a rotational direction around the Y1-axis shown in FIG. 13. As a result, the mounting surface 2c is tilted in an attitude where the height gradually decreases along the circumferential direction of the mounting surface 2c in the order of the positions of the lift pins 21-3, 21-2, and 21-1. In this way, the inclination of the mounting table 2 is adjusted so that the mounting surface 2c is inclined in an attitude in which the height at the positions of the multiple lift pins 21 gradually decreases along the circumferential direction of the mounting surface 2c. When the multiple lift pins 21 rise and protrude from the mounting surface 2c while the mounting surface 2c is inclined in this attitude, the substrate W comes into contact with the multiple lift pins 21 in sequence along the circumferential direction of the mounting surface 2c. In the example of FIG. 13, the substrate W comes into contact with the lift pins 21-1, 21-2, and 21-3 in this order along the circumferential direction of the mounting surface 2c. As a result, the substrate W is gradually peeled off the mounting surface 2c by the multiple lift pins 21 along the circumferential direction, and as a result, the substrate W can be more stably prevented from bouncing up.

[0047] Furthermore, in the third tilt adjustment step, the position of the plurality of lift pins 21 along the circumferential direction of the mounting surface 2c where the height of the mounting surface 2c after tilting is lowest may be sequentially switched depending on the cumulative number of substrates W transported by the transport device. This allows the lift pins 21 that first come into contact with the substrates W to be switched depending on the cumulative number of substrates W transported, thereby preventing a situation in which only certain lift pins 21 among the plurality of lift pins 21 are worn out.

[0048] [effect] The method for transporting an object according to the above embodiment includes step a) (e.g., step S10, a first tilt adjusting step), step b) (e.g., step S11, a receiving step), step c) (e.g., step S12, a placing step), and step d) (e.g., step S13, a second tilt adjusting step). Step a) adjusts the tilt of a mounting table (e.g., mounting table 2) having a mounting surface (e.g., mounting surface 2c) on which an object to be processed (e.g., a substrate W) can be placed so that the mounting surface is inclined with respect to a horizontal plane. Step b) receives the object to be processed from a transport device that transports the object by raising multiple lift pins (e.g., lift pins 21) provided on the mounting table before or after step a). Step c) places the object to be processed on the inclined mounting surface by lowering the multiple lift pins and / or raising the mounting table. In step d), the tilt of the mounting table is adjusted so that the mounting surface on which the object is placed is parallel to the horizontal plane. As a result, the method for transporting an object according to the embodiment can suppress displacement of the object on the mounting surface of the mounting table and generation of dust from the lift pins.

[0049] In the above embodiment, the plurality of lift pins may be arranged at equal intervals along the circumferential direction of the mounting surface. In step a), the tilt of the mounting table may be adjusted so that the mounting surface is tilted in a position where the height of a specific lift pin among the plurality of lift pins is the lowest. This allows the method for transporting a workpiece according to the embodiment to align the lowest point of the tilted mounting surface with the position of the specific lift pin.

[0050] In the above embodiment, the plurality of lift pins may be arranged at equal intervals along the circumferential direction of the mounting surface. In step a), the tilt of the mounting table may be adjusted so that the mounting surface is tilted in a manner such that the height at the positions of the plurality of lift pins gradually decreases along the circumferential direction of the mounting surface. This allows the height of the tilted mounting surface to be gradually decreased along the circumferential direction of the mounting surface according to the method for transporting a workpiece according to the embodiment.

[0051] In the above embodiment, step c) may include steps c-1), c-2), and c-3). Step c-1) may acquire positional deviation information indicating the amount of deviation between the edge position of the workpiece when the workpiece is placed on the inclined placement surface and a predetermined reference edge position. Step c-2) may adjust the position of the placement table based on the positional deviation information. Step c-3) may lower the multiple lift pins and / or raise the placement table after adjusting the position of the placement table. As a result, according to the method for transporting a workpiece according to the embodiment, the workpiece can be placed on the placement surface so that the center of the placement surface coincides with the center of the workpiece placed on the placement surface.

[0052] Furthermore, the method for transporting an object according to the above embodiment includes step e) (e.g., step S20, a third tilt adjustment step), step f) (e.g., step S21, a lifting step), and step g) (e.g., step S22, a delivery step). Step e) adjusts the inclination of a mounting table having a mounting surface on which the object is placed so that the mounting surface is inclined relative to a horizontal plane. Step f) lifts the object from the inclined mounting surface by raising multiple lift pins provided on the mounting table. Step g) delivers the object supported by the multiple lift pins to a transport device that transports the object. As a result, the method for transporting an object according to the embodiment gradually releases contact between the mounting surface and the object, preventing the object from bouncing up.

[0053] In the above embodiment, the plurality of lift pins may be arranged at equal intervals along the circumferential direction of the mounting surface. Then, in step e), the tilt of the mounting table may be adjusted so that the mounting surface is tilted in a posture in which the height of a specific lift pin among the plurality of lift pins is the lowest. This allows the method for transporting a workpiece according to the embodiment to align the lowest point of the tilted mounting surface with the position of the specific lift pin.

[0054] In the above embodiment, the plurality of lift pins may be disposed at equal intervals along the circumferential direction of the mounting surface. In step e), the tilt of the mounting table may be adjusted so that the mounting surface is tilted in a manner such that the height at the positions of the plurality of lift pins gradually decreases along the circumferential direction of the mounting surface. This allows the height of the tilted mounting surface to be gradually decreased along the circumferential direction of the mounting surface, according to the method for transporting a workpiece according to the embodiment. Furthermore, according to the method for transporting a workpiece according to the embodiment, the workpiece is gradually peeled off the mounting surface by the plurality of lift pins along the circumferential direction of the mounting surface, thereby more stably preventing the workpiece from bouncing up.

[0055] In the above embodiment, in step e), the position of the lift pins along the circumferential direction of the mounting surface may be sequentially switched depending on the cumulative number of workpieces transported by the transport device. In this way, according to the method for transporting workpieces according to the embodiment, the lift pin that first comes into contact with the workpiece is switched depending on the cumulative number of workpieces transported, thereby preventing a situation in which only a specific lift pin among the multiple lift pins is worn out.

[0056] In the above embodiment, the lower ends of the plurality of lift pins may contact the lifting member, and the lift pins may rise or fall in accordance with the rise or fall of the lifting member. Thus, according to the method for transporting a workpiece according to the embodiment, when using floating lift pins, it is possible to suppress displacement of the workpiece on the mounting surface of the mounting table and generation of dust from the lift pins. Furthermore, according to the method for transporting a workpiece according to the embodiment, when using floating lift pins, it is possible to gradually release the contact between the mounting surface and the workpiece, thereby preventing the workpiece from bouncing up.

[0057] In the above embodiment, the inclination angle of the placement surface with respect to the horizontal plane may be 0.5° or more and 2° or less. This makes it possible to prevent the object from slipping off the placement surface and to release gas from the gap between the placement surface and the object. Furthermore, the method for transporting an object according to the embodiment makes it possible to prevent the object from slipping off the placement surface and to peel the object from the placement surface.

[0058] [Other variations] The technology disclosed in this application is not limited to the above-described embodiment, and various modifications are possible within the scope of the gist thereof.

[0059] For example, in the above-described embodiment, the multiple lift pins 21 are floating lift pins that are not fixed to the lifting member 22, but the disclosed technology is not limited to this. The multiple lift pins 21 may also be rigid lift pins. That is, the multiple lift pins 21 may be fixed at their lower ends to the lifting member 22 and rise or fall in accordance with the rise or fall of the lifting member. As a result, according to the modified example of the method for transporting a workpiece, when rigid lift pins are used, it is possible to suppress displacement of the workpiece on the mounting surface of the mounting table and dust generation from the lift pins. Furthermore, according to the modified example of the method for transporting a workpiece, when rigid lift pins are used, it is possible to gradually release the contact between the mounting surface and the workpiece, thereby preventing the workpiece from bouncing up.

[0060] In the above embodiment, the vacuum processing apparatus 100 is described as using a capacitively coupled plasma (CCP) as an example of a plasma source to process the substrate W, but the plasma source is not limited to this. Examples of plasma sources other than the capacitively coupled plasma include an inductively coupled plasma (ICP), a microwave-excited surface wave plasma (SWP), an electron cyclotron resonance plasma (ECP), and a helicon wave-excited plasma (HWP).

[0061] Furthermore, in the above embodiment, the vacuum processing apparatus 100 that performs film formation has been described as an example, but the disclosed technology is not limited to this. That is, the disclosed technology can also be applied to other vacuum processing apparatuses, such as etching apparatuses and heating apparatuses, as long as the vacuum processing apparatus processes the substrate W in a reduced pressure environment.

[0062] It should be noted that the disclosed embodiments are illustrative in all respects and should not be considered limiting. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0063] 1. Processing container 2 Mounting table 2c Placement surface 7 Adjustment mechanism 20 pin through holes 21 Lift pin 22 Lifting members 23 Drive mechanism 100 Vacuum processing equipment 101 Main Unit 102 Control section W substrate

Claims

1. a) adjusting the inclination of a mounting table having a mounting surface on which an object to be processed can be placed so that the mounting surface is inclined relative to a horizontal plane; b) before or after step a), lifting a plurality of lift pins provided on the stage to receive the object from a transfer device that transfers the object; c) lowering the lift pins and / or raising the stage to place the object on the inclined placement surface; d) adjusting the inclination of the mounting table so that the mounting surface on which the object to be processed is placed is parallel to the horizontal plane; Including, The c) is c-1) acquiring positional deviation information indicating a deviation amount between an edge position of the object to be processed and a predetermined reference edge position when the object to be processed is placed on the inclined placement surface; c-2) adjusting the position of the mounting table based on the positional deviation information; c-3) lowering the lift pins and / or raising the mounting table after adjusting the position of the mounting table; A method for transporting an object to be processed, comprising:

2. the plurality of lift pins are arranged at equal intervals along a circumferential direction of the mounting surface; 2. The method for transporting a workpiece according to claim 1, wherein in step a), the tilt of the mounting table is adjusted so that the mounting surface is tilted in a position where the height at the position of a specific lift pin among the plurality of lift pins is the lowest.

3. the plurality of lift pins are arranged at equal intervals along a circumferential direction of the mounting surface; 2. The method for transporting a workpiece according to claim 1, wherein in step a), the inclination of the mounting table is adjusted so that the mounting surface is inclined in a position in which the height at the positions of the plurality of lift pins gradually decreases along the circumferential direction of the mounting surface.

4. e) adjusting the inclination of a mounting table having a mounting surface on which the object to be processed is placed so that the mounting surface is inclined relative to a horizontal plane; f) lifting the workpiece from the inclined mounting surface by raising a plurality of lift pins provided on the mounting table; g) transferring the workpiece supported by the plurality of lift pins to a transfer device that transfers the workpiece; Including, the plurality of lift pins are arranged at equal intervals along a circumferential direction of the mounting surface; In the step e), the tilt of the mounting table is adjusted so that the mounting surface is tilted in a posture in which the height at a position of a specific lift pin among the plurality of lift pins is the lowest; In the above e), the method for transporting objects to be processed comprises sequentially switching the position of the plurality of lift pins along the circumferential direction of the loading surface to determine the lowest height of the loading surface after tilting, depending on the cumulative number of objects to be processed transported by the transport device.

5. e) adjusting the inclination of a mounting table having a mounting surface on which the object to be treated is placed so that the mounting surface is inclined relative to a horizontal plane; f) lifting the workpiece from the inclined mounting surface by raising a plurality of lift pins provided on the mounting table; g) transferring the workpiece supported by the plurality of lift pins to a transfer device that transfers the workpiece; Including, the plurality of lift pins are arranged at equal intervals along a circumferential direction of the mounting surface; In the step e), the tilt of the mounting table is adjusted so that the mounting surface is tilted in a posture in which the height at the positions of the plurality of lift pins gradually decreases along the circumferential direction of the mounting surface; In the above e), the method for transporting objects to be processed comprises sequentially switching the position of the plurality of lift pins along the circumferential direction of the loading surface to determine the lowest height of the loading surface after tilting, depending on the cumulative number of objects to be processed transported by the transport device.

6. 6. The method for transporting a processing object according to claim 1, wherein the plurality of lift pins are capable of contacting a lifting member at their lower ends, and rise or fall in response to the rise or fall of the lifting member.

7. 7. The method for transporting a processing object according to claim 1, wherein the plurality of lift pins are fixed at their lower ends to a lifting member, and rise or fall in response to the rise or fall of the lifting member.

8. 8. The method for transporting an object to be processed according to claim 1, wherein the tilt angle of the placement surface relative to the horizontal plane is 0.5° or more and 2° or less.

9. a mounting table having a mounting surface on which an object to be processed can be placed; an adjustment mechanism for adjusting the tilt of the mounting table; a plurality of lift pins provided on the mounting table; a lifting mechanism that raises and lowers the plurality of lift pins; Control unit and Equipped with The control unit a) adjusting the inclination of the mounting table so that the mounting surface is inclined with respect to a horizontal plane; b) before or after a), receiving the object from a transfer device that transfers the object by raising the plurality of lift pins; c) lowering the lift pins and / or raising the stage to place the object on the inclined placement surface; d) adjusting the inclination of the mounting table so that the mounting surface on which the object to be processed is placed is parallel to the horizontal plane; and causing each unit to execute a method for transporting the object to be processed, including The c) is c-1) acquiring positional deviation information indicating a deviation amount between an edge position of the object to be processed and a predetermined reference edge position when the object to be processed is placed on the inclined placement surface; c-2) adjusting the position of the mounting table based on the positional deviation information; c-3) lowering the lift pins and / or raising the mounting table after adjusting the position of the mounting table; a processing device comprising:

10. a mounting table having a mounting surface on which an object to be processed can be placed; an adjustment mechanism for adjusting the tilt of the mounting table; a plurality of lift pins provided on the mounting table; a lifting mechanism that raises and lowers the plurality of lift pins; Control unit and Equipped with The control unit e) adjusting the inclination of the mounting table so that the mounting surface on which the object to be processed is placed is inclined with respect to a horizontal plane; f) lifting the workpiece from the inclined mounting surface by raising the plurality of lift pins; g) transferring the workpiece supported by the plurality of lift pins to a transfer device that transfers the workpiece; and causing each unit to execute a method for transporting the object to be processed, including the plurality of lift pins are arranged at equal intervals along a circumferential direction of the mounting surface; In the step e), the tilt of the mounting table is adjusted so that the mounting surface is tilted in a posture in which the height at a position of a specific lift pin among the plurality of lift pins is the lowest; In the step e), the processing device sequentially switches the position of the plurality of lift pins along the circumferential direction of the loading surface so that the position where the height of the loading surface after tilting is lowest is determined according to the cumulative number of the workpieces transported by the transport device.

11. A mounting table having a mounting surface on which an object to be processed can be placed; an adjustment mechanism for adjusting the tilt of the mounting table; a plurality of lift pins provided on the mounting table; a lifting mechanism that raises and lowers the plurality of lift pins; Control unit and Equipped with The control unit e) adjusting the inclination of the mounting table so that the mounting surface on which the object to be processed is placed is inclined with respect to a horizontal plane; f) lifting the workpiece from the inclined mounting surface by raising the plurality of lift pins; g) transferring the workpiece supported by the plurality of lift pins to a transfer device that transfers the workpiece; and causing each unit to execute a method for transporting the object to be processed, including the plurality of lift pins are arranged at equal intervals along a circumferential direction of the mounting surface; In the step e), the tilt of the mounting table is adjusted so that the mounting surface is tilted in a posture in which the height at the positions of the plurality of lift pins gradually decreases along the circumferential direction of the mounting surface; In the step e), the processing device sequentially switches the position of the plurality of lift pins along the circumferential direction of the loading surface so that the position of the loading surface is lowest after tilting, depending on the cumulative number of the workpieces transported by the transport device.

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