Ceramic Electronic Components

Abstract

To provide a ceramic electronic component in which a crack to be generated in a ceramic element assembly is reduced.SOLUTION: The present invention relates to a ceramic electronic component comprising: a ceramic element assembly including an end face along a first axis and a side face across the end face and along a second axis; an end face electrode formed on the end face of the ceramic element assembly; and a lead terminal bonded to the end face electrode by a solder. The lead terminal includes an adjacent part overlapped with the end face electrode in a side view in a direction along the second axis, and an extension part extending from an end of the adjacent part in a direction away from a surface including a side face. A first recess which is recessed in a direction away from a surface including the end face is formed in the extension part, and the first recess exists at a position close to the end of the adjacent part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a ceramic electronic component with lead terminals. [Background technology]

[0002] Ceramic electronic components with lead terminals, such as those shown in Patent Document 1, are known as electronic components mounted on circuit boards and the like. In these ceramic electronic components, the lead terminals are generally joined to a ceramic element having terminal electrodes formed thereon using solder. Specifically, as disclosed in Patent Document 1, the lead terminals are soldered by sandwiching the ceramic element between a pair of lead terminals and dipping the ceramic element in this state into a solder bath.

[0003] During this process, a fillet forms between the lead terminal and the terminal electrode as the solder spreads. At the end of the ceramic element that is in contact with this fillet, cracks are likely to form inside the element due to contraction stress generated when the solder solidifies. The presence of cracks inside the element is problematic because it degrades the electronic component's properties, such as moisture resistance and mechanical strength. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 61-234519 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a ceramic electronic component in which cracks occurring in the ceramic body are reduced. [Means for solving the problem]

[0006] In order to achieve the above object, a ceramic electronic component according to the present invention comprises: a ceramic body having an end face along a first axis (Z-axis) and a side face intersecting the end face and along a second axis (X-axis); an end surface electrode formed on the end surface of the ceramic body; a lead terminal joined to the end surface electrode by solder; The lead terminal is an adjacent portion overlapping the end surface electrode when viewed from a side along the second axis; an extension portion extending from an end of the adjacent portion in a direction away from a surface including the side surface, The extension portion has a first recess formed therein that is recessed in a direction away from a surface including the end surface, The first recess is located in proximity to the end of the adjacent portion.

[0007] When lead terminals are soldered by dipping, solder fillets are formed inside the intersection angle between the side surface of the ceramic body and the lead terminal, and these solder fillets affect the occurrence of cracks in the ceramic body. In the ceramic electronic component of the present invention, a first recess is formed at a predetermined position on the extension, so that during soldering, molten solder that accumulates where the solder fillet is formed is drawn toward the first recess. As a result, the angle of the solder fillet with respect to the side surface of the body is reduced, and the occurrence of cracks inside the ceramic body can be suppressed.

[0008] Preferably, the first recess is open and not closed in the direction of a third axis (Y axis), which is an axis substantially perpendicular to the first axis and the second axis. The first recess has the above characteristics, which makes it easier for molten solder remaining in the solder fillet formation area to be drawn toward the first recess, thereby reducing the angle of the solder fillet. Furthermore, the first recess is open in the third axis direction, reducing stress generated in the solder joint area. As a result, cracks occurring inside the ceramic body can be more effectively suppressed.

[0009] In the second axis direction, the maximum width of the adjacent portion is Wx1, and the maximum width of the extending portion at the deepest portion of the first recess is Wx2, where Wx2 / Wx1 is preferably 0.4 to 0.8. The inside of the first recess is filled with molten solder drawn from the solder fillet side, forming a solder pool. When Wx2 / Wx1 satisfies the above condition, a sufficient volume of the solder pool can be secured, making it easier for molten solder to be drawn from the solder fillet side. As a result, the angle of the solder fillet becomes smaller, and cracks occurring inside the ceramic body can be more effectively suppressed.

[0010] If the height of the ceramic body in the first axis direction is L0 and the perpendicular distance from the lower end of the first recess in the first axis direction to the surface including the side surface is L1, then L1 / L0 is preferably 0.3 or more, more preferably 0.3 to 0.7, and even more preferably 0.4 to 0.6. By setting the lower end position of the first recess according to the above conditions, the molten solder on the solder fillet side is more easily drawn toward the first recess, and the angle of the solder fillet becomes smaller, which makes it possible to more effectively prevent cracks from occurring inside the ceramic body.

[0011] Preferably, a portion of the first recess exists in the first axial direction, spanning from the upper end of the extension portion to a portion of the adjacent portion, and the upper end of the first recess is located higher in the first axial direction than the side surface. The upper end of the first recess in the first axial direction may be located at the boundary between the adjacent portion and the extending portion, but by positioning the upper end of the first recess higher in the first axial direction than the side surface of the ceramic body, the molten solder on the solder fillet side is more likely to be drawn toward the first recess. As a result, the angle of the solder fillet becomes smaller, which can more effectively prevent cracks from occurring inside the ceramic body. In addition, the bonding strength of the lead terminal to the end surface electrode is improved.

[0012] Furthermore, if the perpendicular distance from the lower end of the first recess in the first axial direction to the surface including the side surface is L1, and the perpendicular distance from the upper end of the first recess in the first axial direction to the surface including the side surface is L2, preferably, the relationship between L1 and L2 is L1>L2, and more preferably, L1 / L2 is 1.2 to 4.0. When the upper end of the first recess is located higher than the side surface of the ceramic body in the first axial direction, the solder puddle formed inside the first recess exists across the extending portion and the adjacent portion. In such a case, if the relationship between L1 and L2 is L1 > L2, the volume of the solder puddle in the extending portion will be larger than the volume of the solder puddle in the adjacent portion. As a result, the angle of the solder fillet becomes smaller, and cracks occurring inside the ceramic body can be more effectively suppressed.

[0013] Preferably, a perpendicular distance L2 from the upper end of the first recess in the first axis direction to a plane including the side surface is 0.2 times or less than L0. By setting the upper end position of the first recess according to the above conditions, the molten solder on the solder fillet side is more easily drawn to the first recess, and the angle of the solder fillet becomes smaller, which makes it possible to more effectively prevent cracks from occurring inside the ceramic body.

[0014] The adjacent portion has a facing surface facing the end electrode. The facing surface may have a second recess formed therein, recessed in a direction away from the end electrode. The presence of a recess in the facing surface also tends to improve the bonding strength of the lead terminal to the end electrode. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a simplified perspective view showing a ceramic electronic component according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. [Figure 3] FIG. 3 is an enlarged cross-sectional view of a main part of FIG. [Figure 4] FIG. 4 is a schematic perspective view showing the shape of the tip of a lead terminal in one embodiment of the present invention. [Figure 5] FIG. 5 is a schematic perspective view showing a modified example of the tip shape of the lead terminal. [Figure 6] FIG. 6 is a schematic perspective view showing the tip shape of a conventional lead terminal. [Figure 7] FIG. 7 is an enlarged cross-sectional view of a main portion of a ceramic electronic component using the lead terminal shown in FIG. [Figure 8] FIG. 8 is a schematic perspective view showing the shape of the tip of the lead terminal used in the reference example. DETAILED DESCRIPTION OF THE INVENTION

[0016] The present invention will be described below based on the embodiments shown in the drawings, but the present invention is not limited to the following embodiments.

[0017] 1 and 2, a ceramic electronic component with lead terminals 2 according to one embodiment of the present invention has a ceramic body 4 and a pair of lead terminals 8. In this embodiment, as an example of a ceramic electronic component, a case will be described in which the ceramic body 4 is configured as a multilayer ceramic capacitor.

[0018] 2, the entire ceramic body 4 and a portion of the lead terminal 8 are covered with an exterior 20 indicated by a two-dot chain line. The coverage of the exterior 20 is not particularly limited, but it is sufficient that it covers at least the entire ceramic body 4 and the joint portion between the ceramic body 4 and the lead terminal 8 (i.e., the portion where the solder 10 described below exists). The material of the exterior 20 is not particularly limited as long as it has insulating properties, but is preferably a halogen-free insulating resin, and examples of such materials include thermosetting resins such as epoxy resins.

[0019] The ceramic body 4 shown in FIGS. 1 and 2 has two end faces 4a facing each other in the X-axis direction and four side faces 4b connecting the two end faces 4a. In this embodiment, of the four side faces 4b, the face along the X-axis and positioned below in the Z-axis direction is referred to as the bottom face 4b1. The side face opposite the bottom face 4b1 is referred to as the top face 4b2. The dimensions of the ceramic body 4 are not particularly limited and may be determined appropriately depending on the purpose and application. For example, the dimensions of the ceramic body 4 may be a length in the X-axis direction of 0.6 to 6.5 mm, a width in the Y-axis direction of 0.3 to 5.0 mm, and a height in the Z-axis direction (L0 shown in FIG. 2A) of 0.2 to 3.5 mm.

[0020] In each drawing, the X-axis, Y-axis, and Z-axis are substantially perpendicular to each other, the end face 4a is substantially parallel to the Z-axis, and the bottom face 4b1 is substantially parallel to the X-axis. In this embodiment, "substantially parallel (or perpendicular)" means that most of the surface is parallel (or perpendicular), but some portions may be slightly non-parallel (or perpendicular). For example, this means that the end face 4a or the bottom face 4b1 may be slightly uneven or tilted. In this embodiment, the concepts of "upper" and "lower" are defined based on the state of mounting on a substrate. In other words, in the mounted state, the side on which the ceramic body is located is the "upper side (above the Z-axis)," and the end side of the lead terminal extending from the ceramic body and connected to the substrate is the "lower side (below the Z-axis)."

[0021] Inside the ceramic body 4, internal electrode layers 16 and 18 are alternately stacked with ceramic layers 14 interposed between them. The internal electrode layer 16 is exposed at one end face 4a of the ceramic body 4 in the X-axis direction, and the internal electrode layer 18 is exposed at the other end face 4a of the ceramic body 4.

[0022] A pair of terminal electrodes 6 is formed on both ends of the ceramic body 4 in the X-axis direction. More specifically, the terminal electrode 6 is formed from the end face 4a of the ceramic body 4, wrapping around to a portion of the side face 4b, and includes an end face electrode 6a that covers the end face 4a and a side face electrode 6b that is continuous with the end face electrode 6a and covers a portion of the side face 4b. The internal electrodes 16 and 18 are electrically connected to the end face electrode 6a at the exposed end face 4a. The pair of terminal electrodes 6 are insulated from each other, and the pair of terminal electrodes 6 and the internal electrode layers 16 and 18 form a capacitor circuit.

[0023] In this embodiment, the ceramic layer 14 is made of a dielectric composition. The dielectric composition used is not particularly limited, and any known material may be used. For example, barium titanate (BaTiO3), calcium titanate (CaTiO3), strontium titanate (SrTiO3), calcium zirconate (CaZrO3), potassium niobate (KNbO3), or the like may be used as the main component. In addition to these main components, rare earth oxides, alkaline earth metal oxides, transition metal oxides, magnesium oxide, or the like may be added as secondary components. The thickness and number of layers of the ceramic layer 14 are also not particularly limited, and may be of a common thickness and number.

[0024] The internal electrode layers 16, 18 contain a conductive metal as a main component. The conductive metal to be used is not particularly limited, and any known material may be used. Examples include nickel, copper, silver, gold, palladium, and alloys containing at least one of these metal elements. The thickness of the internal electrode layers 16, 18 is also not particularly limited, and any common thickness may be used. The number of layers of the internal electrode layers 16, 18 is determined according to the number of layers of the ceramic layers 14.

[0025] The terminal electrode 6 may also be made of any material, as long as it contains a conductive metal as its main component. The terminal electrode 6 typically contains copper, copper alloy, nickel, nickel alloy, etc. as its main component, but silver or a silver-palladium alloy can also be used. The terminal electrode 6 may contain glass frit or resin in addition to the conductive metal. The thickness of the terminal electrode 6 is not particularly limited and is typically about 10 to 50 μm. The surface of the terminal electrode 6 may be coated with at least one plating layer selected from nickel, copper, tin, etc. In this case, the thickness of each plating layer is preferably 1 to 10 μm, and the plating layer may have a multilayer structure. For example, the terminal electrode 6 may have a multilayer structure consisting of a Cu sintered electrode layer, a Ni plating layer, and a Sn plating layer.

[0026] In this embodiment, as shown in FIG. 2, a pair of lead terminals 8 are provided corresponding to the two end faces 4a of the ceramic body 4. Each lead terminal 8 extends along the Z-axis direction and has an adjacent portion 8a and an extending portion 8e. In this embodiment, each portion of the lead terminal 8 is integrally formed by processing a conductive wire. However, the lead terminal 8 may also be formed by processing a conductive metal plate.

[0027] The conductive wire material constituting the lead terminal 8 can be a metal wire containing copper (Cu), nickel (Ni), iron (Fe), silver (Ag), or the like. It is particularly preferable that the lead terminal 8 contains copper. More specifically, it is preferable to use a copper-based metal wire (hereinafter referred to as a Cu wire) whose core material is pure copper or a copper alloy containing copper as a main component. Alternatively, it is preferable to use a copper-coated steel wire (hereinafter referred to as a CP wire) whose surface is coated with a copper coating layer. In the case of a CP wire, the core material is pure iron or an iron alloy containing iron as a main component. Furthermore, when a CP wire is used, the thickness of the copper coating layer formed on the surface of the core material is preferably 5 μm to 10 μm.

[0028] The diameter of the conductive wire constituting the lead terminal 8 is determined appropriately depending on the dimensions of the ceramic body 4. For example, the diameter may be 0.5 mm to 1.0 mm, and preferably 0.5 mm to 0.6 mm.

[0029] Next, a detailed description will be given of the features of each portion of the lead terminal 8. In the following description, one of the pair of lead terminals 8 will be illustrated, but the other lead terminal 8 also has similar features.

[0030] 2, the tip side (upper side along the Z axis) of the lead terminal 8 is an adjacent portion 8a that is adjacent to the ceramic body 4. Specifically, the adjacent portion 8a is a portion that overlaps with the end surface electrode 6a in a side view along the X axis, and the adjacent portion 8a is joined to the end surface electrode 6a via solder 10.

[0031] The adjacent portion 8a is formed by crushing only the tip end of the conductive wire, and has an overall shape resembling a semi-cylindrical cylinder. More specifically, as shown in FIGS. 2 and 4, a portion of a first recess 9 (described later) is present below the adjacent portion 8a, and the upper side of the adjacent portion 8a is semi-cylindrical. An opposing surface 8aa is formed in the semi-cylindrical portion of the adjacent portion 8a by crushing. The opposing surface 8aa is substantially parallel to the Y-axis and Z-axis and faces the end electrode 6a.

[0032] In this embodiment, the maximum width Wx1 of the adjacent portion 8a in the X-axis direction is smaller than the maximum width Wx3 of the extending portion 8e that has not been subjected to the crushing process in the X-axis direction. More specifically, the ratio of the maximum width W1 to the maximum width W3 (Wx1 / Wx3) is preferably 1 / 2 to 7 / 10. By setting Wx1 / Wx3 within the above range, the elastic force of the lead terminal 8 can be sufficiently ensured. Note that the maximum width Wx3 of the extending portion 8e in the X-axis direction is synonymous with the diameter of the conductive wire.

[0033] Furthermore, the width Wy1 of the opposing surface 8aa in the Y-axis direction is preferably in the range of approximately 0.7 to 1.1 times the width of the ceramic body 4 in the Y-axis direction. Furthermore, the length L4 of the opposing surface 8aa in the Z-axis direction may be approximately the same as the height L0 of the ceramic body 4 in the Z-axis direction, or may be longer or shorter than L0, and may be in the range of 0.6 to 0.9 times L0, for example. Setting the dimensions of the opposing surfaces 8aa in the adjacent portion 8a within the above range allows the pair of lead terminals 8 to firmly hold the ceramic body 4, and tends to improve the bonding strength between the terminal electrode 6 and the lead terminal 8.

[0034] 3, a gap 86 with solder 10 interposed therein exists between the opposing surface 8aa and the end surface electrode 6b. Because this gap 86 is adjacent to the internal electrode layer 16 (18) of the ceramic body 4, it is preferable that the amount of solder 10 interposed in the gap 86 be controlled within an appropriate range. Specifically, the width Wx4 of the gap 86 in the X-axis direction is preferably 100 μm or less, and more preferably 30 μm or less. When the width of the gap 86 satisfies the above condition, the electrical resistance of the solder joint can be reduced and the heat dissipation of the ceramic electronic component 2 can be improved.

[0035] The extending portion 8e of the lead terminal 8 extends from the lower end of the adjacent portion 8a in a direction away from the plane including the bottom surface 4b1. Here, the "plane including the bottom surface 4b1" refers to an imaginary plane extending from the bottom surface 4b1 along the X-axis and Y-axis, and the "direction away from the plane including the bottom surface 4b1" includes the direction perpendicular to the imaginary plane (i.e., the Z-axis direction) and also includes a direction inclined from the perpendicular direction toward the mounting board (not shown).

[0036] As shown in FIG. 2, the extension portion 8e is composed of an upper support portion 8ea, a lower support portion 8eb, and a leg portion 8ec, and each portion of the extension portion 8e is integrally continuous. The upper support portion 8ea extends downward in the Z-axis direction from the lower end of the adjacent portion 8a, approximately parallel to the Z-axis. On the other hand, the lower support portion 8eb is continuous with the lower end of the upper support portion 8ea, and the pair of lead terminals 8 are bent in a direction separating them in the X-axis direction. These upper support portion 8ea and lower support portion 8eb play a role in supporting the electronic component body on the substrate after mounting on the substrate. Furthermore, the lower support portion 8eb acts as a kink that limits the erection height when the ceramic electronic component 2 is mounted on the substrate.

[0037] The leg portion 8ec is integrally formed on the lower end of the lower support portion 8eb in the Z-axis direction and extends linearly and substantially parallel to the Z-axis. The leg portion 8ec is connected to a mounting substrate such as a printed circuit board or a flexible substrate to form a mounting portion. The method for mounting the ceramic electronic component 2 on the substrate is not particularly limited, but mounting techniques such as soldering, welding, and crimping can be applied.

[0038] The extension 8e is not flattened except for the portion where the first recess 9 (described later) is formed, and the XY cross section of the extension 8e is circular. The length of the extension 8e in the Z-axis direction is not particularly limited. For example, the lengths of the upper support portion 8ea and the lower support portion 8eb may be determined appropriately taking into consideration the erection height after mounting on the board.

[0039] 2 and 3, a first recess 9 is formed in a portion of a lead terminal 8 in a ceramic electronic component 2 according to this preferred embodiment. This first recess 9 is recessed in a direction away from a surface including the end face 4a, and the inside of the first recess 9 is filled with solder 10 to form a solder pool. The "surface including the end face 4a" refers to a virtual plane extending from the end face 4a along the Y-axis and Z-axis, and is indicated by the symbol YZ in FIG. 3. "Recessed in a direction away from the surface including the end face 4a" means that the lead terminal 8 is recessed in a direction that reduces its width in the X-axis direction, and the width of the lead terminal 8 at the location where the first recess 9 is formed is smaller than the width of the adjacent portion 8a.

[0040] Furthermore, the first recess 9 is formed at a position that takes into consideration the position where the solder fillet 10a will be formed. Specifically, the first recess 9 is formed in the extending portion 8e at a position close to the lower end of the adjacent portion 8a, and is located at the top of the extending portion 8e in the Z-axis direction. When the first recess 9 is formed at such a position, the first recess 9 is located to the side of the solder fillet 10a in the X-axis direction, and the wall surface 9a of the first recess 9 faces the solder fillet 10a.

[0041] Here, the solder fillet 10a refers to the portion where excess solder 10 protrudes and accumulates between the lead terminal 8 and the end surface electrode 6a. When the lead terminal 8 is soldered to the ceramic body 4 by dipping, the solder fillet 10a is formed outside the side surface electrode 6b (below the Z axis) in the space defined by the plane YZ including the end surface 4a and the bottom surface 4b1 (see FIG. 3).

[0042] In conventional ceramic electronic components manufactured by dipping, shrinkage stress occurs near the solder fillet, making it easy for cracks to form inside the ceramic body. Furthermore, in the solder fillet where the solder remains, strain accumulates as the solder solidifies. Therefore, even after the solder solidifies, cracks are likely to form inside the ceramic body (especially near the solder fillet) when an external force is applied to the lead terminal. In particular, cracks are more likely to occur when the volume of the solder fillet is large and the contact angle of the solder fillet with the ceramic body is large (obtuse).

[0043] In this embodiment, by forming the first recess 9 at the predetermined position described above, molten solder remaining outside the side electrode 6b is drawn toward the first recess 9 during soldering of the lead terminal 8. As a result, solder is less likely to remain below the side electrode 6b in the Z-axis direction, and the contact angle θ of the solder fillet 10a with respect to the ceramic body 4 is reduced to at least less than 40 degrees, preferably less than 35 degrees. Furthermore, the reduced contact angle θ reduces the stress that the solder fillet 10a exerts on the ceramic body 4, thereby preventing cracks from occurring inside the ceramic body 4. In other words, in the ceramic electronic component 2 of this embodiment, the effect of reducing the contact angle θ by the first recess 9 is thought to prevent cracks from occurring inside the ceramic body 4.

[0044] The contact angle θ of the solder fillet 10a refers to the angle formed between the bottom surface 4b1 of the ceramic body 4 and the outer edge 10ab of the solder fillet 10a at the tip 10aa of the solder fillet 10a in the X-axis direction. This contact angle θ can be measured by taking a cross-sectional photograph of the XZ cross section shown in FIG. 3 using an SEM or an optical microscope and analyzing the cross-sectional photograph. In this case, the sample for observation is obtained by cutting the ceramic electronic component 2 so that the XZ cross section is located approximately at the center of the lead terminal 8 in the Y-axis direction, and then mirror-polishing it.

[0045] As described above, in this embodiment, the first recess 9 can suppress the occurrence of cracks inside the element body, but the crack suppression effect can be further enhanced by optimizing the shape and dimensions of the first recess 9. The optimal form of the first recess 9 will be described below.

[0046] First, as shown in FIGS. 1 and 4 , the first recess 9 preferably extends along the Y-axis direction and is open and unblocked in the Y-axis direction. In this case, the open portion of the first recess 9 in the Y-axis direction is located below the plane XY including the bottom surface 4b1 in the Z-axis direction. Because the first recess 9 has the above characteristics, excess molten solder is more likely to flow out of the lead terminal 8 during soldering and be drawn toward the first recess 9. As a result, the contact angle θ of the solder fillet 10a becomes smaller (acute), further enhancing the crack suppression effect. Furthermore, because the first recess 9 is not blocked in the Y-axis direction, it is believed that strain generated as the solder 10 solidifies is less likely to accumulate in the solder puddle inside the first recess 9. This is because strain is dispersed from the open portion in the Y-axis direction toward the outside of the lead terminal 8. As a result of the reduction in strain in the solder puddle as described above, the crack suppression effect of the first recess 9 is further improved.

[0047] Furthermore, if the maximum width in the X-axis direction of the extending portion 8e at the deepest portion of the first recess 9 is Wx2, the ratio (Wx2 / Wx1) of the maximum width Wx2 to the maximum width Wx1 of the adjacent portion 8a is preferably 0.4 to 0.8 (see FIG. 3 ). By setting Wx2 / Wx1 within the above range, the depth of the first recess 9 in the X-axis direction is sufficiently deep, thereby ensuring a sufficient volume of solder pool in the first recess 9. Furthermore, molten solder remaining in the formation area of ​​the solder fillet 10a is more likely to be drawn toward the first recess 9, thereby further reducing the contact angle θ of the solder fillet 10a. Note that, as shown in FIGS. 2 and 3 , the wall surface 9a of the first recess 9 is preferably curved in an arc shape. A gently curved wall surface 9a, rather than a right-angled corner on the wall surface 9a, makes it easier for the solder 10 to fill the inside of the first recess 9, thereby further reducing the contact angle θ of the solder fillet 10a.

[0048] In this embodiment, it is preferable that the lower end 9b and upper end 9c of the first recess 9 in the Z-axis direction are located at predetermined positions. Here, the lower end 9b of the first recess 9 is the edge of the crushed portion, and an upper support portion 8ea having a circular cross section extends substantially parallel to the Z-axis below the lower end 9b in the Z-axis direction. Meanwhile, the upper end 9c of the first recess 9 is the boundary edge between the first recess 9 and the opposing surface 8aa, and extends substantially parallel to the X-axis. Preferred aspects of the lower end 9b and upper end 9c will be described in detail below.

[0049] The position of the lower end 9b of the first recess 9 preferably satisfies the following condition: If the perpendicular distance from the lower end 9b of the first recess 9 in the Z-axis direction to the plane XY including the bottom surface 4b1 is L1, the ratio (L1 / L0) of the perpendicular distance L1 to the height L0 of the ceramic body 4 is preferably 0.3 or more, more preferably 0.3 to 0.7, and even more preferably 0.4 to 0.6. By setting L1 / L0 within the above range, the opening surface of the first recess 9 in the X-axis direction can be made sufficiently wide relative to the location where the solder fillet 10a is formed. Therefore, the molten solder remaining in the location where the solder fillet 10a is formed is more likely to be attracted toward the first recess 9, thereby further reducing the contact angle θ.

[0050] Furthermore, it is preferable that the lower end 9b of the first recess 9 coincides with the lower end 10ac of the solder fillet 10a in the Z-axis direction. By satisfying this condition, the molten solder is more likely to be attracted toward the first recess 9, and the contact angle θ can be made smaller.

[0051] As described above, the lower end 9b of the first recess 9 is a crushed edge, so that the maximum width in the X-axis direction of the extending portion 8e at the lower end 9b is approximately the same as the diameter of the conductive wire constituting the lead terminal (i.e., approximately the same as Wx3). Therefore, the lower end 9b of the first recess 9 is located inside in the X-axis direction of the plane YZ including the end face 4a.

[0052] On the other hand, the upper end 9c of the first recess 9 may be located at the boundary between the adjacent portion 8a and the extending portion 8e in the Z-axis direction, or may be located below the bottom surface 4b1. However, as shown in FIG. 3, it is preferable that a portion of the first recess 9 straddles a portion of the adjacent portion 8a from the upper end of the extending portion 8e in the Z-axis direction. In this case, the upper end 9c of the first recess 9 is located above the plane XY including the bottom surface 4b1 in the Z-axis direction. When soldering the lead terminal 8 by dipping, the adjacent portion 8a side of the lead terminal 8 is immersed in a solder bath facing downward in the direction of gravity. If the upper end 9c of the first recess 9 is located above the bottom surface 4b1 in the Z-axis direction, a solder pool is formed by the first recess 9 below the location where the solder fillet 10a is formed during dipping. Therefore, molten solder remaining at the location where the solder fillet 10a is formed is easily attracted toward the first recess 9.

[0053] Furthermore, when the upper end 9c of the first recess 9 is positioned higher on the Z axis than the bottom surface 4b1, the intersection angle 6ab between the end electrode 6a and the side electrode 6b is covered by the solder pool formed by the first recess 9. In other words, the solder pool formed inside the first recess 9 exists across from the upper end of the extension 8e to part of the adjacent portion 8a. The presence of the solder pool formed by the first recess 9 also on the lower end side of the adjacent portion 8a improves the bonding strength of the lead terminal 8 to the ceramic body 4.

[0054] Furthermore, if the perpendicular distance from the top end 9c to the plane XY including the bottom surface 4b1 is L2, the relationship between L1 and L2 is preferably L1 > L2. Furthermore, the ratio of L1 to L2 (L1 / L2) is preferably 1.2 to 4.0, and more preferably 1.5 to 2.0. When the above conditions are satisfied, the volume of the solder pool in the extension portion 8e is larger than the volume of the solder pool in the adjacent portion 8a. In this way, the larger volume of the solder pool on the extension portion 8e side makes it easier for the molten solder to be drawn toward the first recess 9, thereby making it possible to further reduce the contact angle θ of the solder fillet 10a. Furthermore, the crack suppression effect can be further improved.

[0055] Furthermore, the ratio (L2 / L0) of the perpendicular distance L2 to the height L0 of the ceramic body 4 is preferably 0 to 0.2. Furthermore, the length L3 of the first recess 9 in the Z-axis direction is preferably 0.5 to 1.0 times L0.

[0056] The positions of the lower end 9b and upper end 9c of the first recess 9 can be adjusted by changing the dimensions of the mold used in the crushing process, or by controlling the fixing position of the ceramic body 4 relative to the lead terminal during soldering.

[0057] When the shape and dimensions of the first recess 9 satisfy the above conditions, the occurrence of cracks inside the ceramic body 4 can be more effectively suppressed.

[0058] A known method for suppressing cracks due to solder fillets is to form a non-compatible layer with poor solder wettability on a portion of the lead terminal. This non-compatible layer can be formed, for example, by oxidizing a portion of the surface of the lead terminal. Alternatively, a non-compatible layer can be formed by removing a plating layer (a coating layer with good solder wettability) on the surface of the lead terminal by mechanical polishing or laser processing. In other words, this conventional technique suppresses the formation of solder fillets by forming a portion of the lead terminal that is not wettable by solder. This conventional technique is also expected to be effective in suppressing cracks. However, locally forming a non-compatible layer on the lead terminal is not necessarily easy, and it becomes particularly difficult as the size of the ceramic body 4 decreases. Furthermore, the non-compatible layer narrows the solder bonding area, thereby reducing the bonding strength of the lead terminal to the ceramic body.

[0059] In contrast, in the present embodiment, the first recess 9 can be easily formed by crushing using a mold. Therefore, even when the size of the ceramic body 4 is reduced, cracks can be reliably suppressed, and manufacturing costs can be reduced. Furthermore, in the ceramic electronic component 2 of the present embodiment, the inside of the first recess 9 serves as a solder pool, which suppresses cracks and allows the lead terminal 8 to be joined more firmly than in the prior art.

[0060] In this embodiment, there is no particular limitation on the material of the solder 10 used to join the lead terminals 8. For example, tin-antimony, tin-silver-copper, tin-copper, or tin-bismuth lead-free solder can be used.

[0061] Although not shown in FIGS. 2 and 3 , a coating layer such as a metal plating layer may be formed on the surface of the lead terminal 8. The type of coating layer is not particularly limited, and different types of coating layers may be formed on the leading end (adjacent portion side) and the trailing end (leg portion side) of the lead terminal 8. In particular, a coating layer with better solder wettability than the core material of the lead terminal 8 is preferably formed on the surface of the lead terminal 8 that comes into contact with the solder 10 (the adjacent portion 8a and a part of the upper support portion 8ea including the first recess 9). An example of a "coating layer with good solder wettability" is an alloy layer containing copper and tin. More specifically, an alloy layer containing Cu6Sn5 is preferable. Forming such a coating layer on the surface that comes into contact with the solder 10 can further reduce the contact angle θ of the solder fillet 10a.

[0062] When the coating layer is formed as described above, the thickness of the coating layer can be about 0.5 μm to 10 μm, preferably 1.0 μm to 7.0 μm, and more preferably 1.0 μm to 3.0 μm. The thickness of the coating layer can be measured by cross-sectional observation using a scanning electron microscope (SEM) or the like, and the components constituting the coating layer can be confirmed by techniques such as an electron probe microanalyzer (EPMA) or electron beam diffraction.

[0063] Next, an example of a method for manufacturing the ceramic electronic component 2 will be described below.

[0064] First, a capacitor chip is prepared as the ceramic element 4. The capacitor chip may be manufactured by a known method. For example, green sheets on which electrode patterns are formed are stacked by a doctor blade method, screen printing, or other method to obtain a laminate. The resulting laminate is then pressurized and fired to obtain the capacitor chip.

[0065] Next, a pair of terminal electrodes 6 is formed on the prepared capacitor chip. The method for forming the terminal electrodes 6 is not particularly limited. For example, the terminal electrodes 6 can be formed by immersing the capacitor chip in a conductive paste for electrodes and then performing a baking process. Alternatively, the terminal electrodes 6 can be formed by applying a conductive paste containing a thermosetting resin and then hardening the resin by a heat treatment. Furthermore, the surface of the baked electrodes or resin electrodes can be appropriately plated.

[0066] Next, a method for manufacturing the lead terminal 8 will be described. In manufacturing the lead terminal 8, first, a conductive wire is prepared. In this embodiment, the conductive wire to be prepared is preferably a Cu wire having a tin-plated layer formed on its surface, or a CP wire having a Cu-plated layer and a tin-plated layer formed on its surface. Here, the tin-plated layer formed on the surface of the Cu wire or the CP wire preferably contains 90 mol % or more of tin, and preferably has a thickness of 1 μm to 10 μm.

[0067] However, instead of a tin-plated layer, the surface of the conductive wire may be formed with a silver-plated layer, a gold-plated layer, a palladium-plated layer, a copper-tin-plated layer, etc. Furthermore, when a gold-plated layer or a palladium-plated layer is formed, a nickel-plated layer may be formed as a base.

[0068] The prepared conductive wire is cut to a predetermined length and then bent to form an overall U-shape. Next, the U-shaped conductive wire is attached and fixed to a carrier tape. At this time, the conductive wire is fixed so that both ends of the U-shape protrude from the carrier tape.

[0069] With the conductive wire attached to the carrier tape in this manner, the tip of the conductive wire is processed into the shape shown in FIG. 4. Specifically, first, both ends of the conductive wire are bent to form the upper support portion 8ea and the lower support portion 8eb. Then, the tip of the conductive wire is crushed (pressed) to form the shape of the adjacent portion 8a having the opposing surface 8aa and the first recess 9. The bending and crushing processes may be performed in reverse order. During mass production, multiple conductive wires may be attached to a carrier tape, and the above-mentioned tip processing may be performed simultaneously.

[0070] Next, the ceramic element 4 manufactured by the above procedure is bonded to the lead terminals 8 to obtain the ceramic electronic component 2 with lead terminals. For example, when forming an alloy layer containing copper and tin, which has good solder wettability, on the surface of the lead terminals 8 (particularly the portion that comes into contact with the solder), the lead terminals 8 are bonded to the ceramic element 4 by the procedure shown below.

[0071] First, only the tip of the lead terminal 8 attached to the carrier tape is immersed in a solder bath to form an alloy layer containing copper and tin on the surface of the lead terminal 8 (step of immersing the lead terminal 8).

[0072] The type of solder bath used in the above immersion step may be the same as or different from the solder bath used in the soldering step of the ceramic body 4 described below. The temperature of the solder bath used also varies depending on the solder composition, but for example, in the case of tin-antimony solder, it can be 270°C to 320°C. In particular, it is preferable that the temperature of the solder bath in the immersion step is about 0.9 to 1.1 times the temperature of the solder bath in the soldering step described below.

[0073] The immersion time in the solder bath in the immersion step is preferably about 10 to 60 times longer than the immersion time in the soldering step described below, and more specifically, is preferably about 10 to 60 seconds.

[0074] In the immersion process, the tin-plated layer formed on the surface of the conductive wire at the immersed portion is dissolved in the solder bath, forming an alloy layer containing copper and tin. The tin-plated layer remains on the surface of the leg portion 8ec, the lower support portion 8eb, and the upper support portion 8ea of ​​the lead terminal 8 that are not immersed in the solder bath.

[0075] After the above immersion step, the ceramic body 4 on which the terminal electrodes 6 are formed is placed between the adjacent portions 8a of the pair of lead terminals 8, and the ceramic body 4 is sandwiched between the pair of opposing surfaces 8aa, thereby temporarily fixing the ceramic body 4. During temporary fixing, the upper ends of the adjacent portions 8a (tips of the lead terminals 8) and the upper end (upper surface 4b2) of the ceramic body 4 may be misaligned in the Z-axis direction, but it is preferable to align the upper ends of the adjacent portions 8a and the upper end of the ceramic body 4. By temporarily fixing in this manner, the lead terminals 8 are positioned appropriately relative to the ceramic body 4, thereby reducing manufacturing errors.

[0076] Next, the ceramic body 4 sandwiched between the lead terminals 8 is immersed in a solder bath to solder the terminal electrodes 6 and the lead terminals 8 (soldering process: dipping). At this time, the tip side of the lead terminals 8 (the upper end side of the adjacent portion 8a on the Z axis) is immersed in the solder bath facing downward in the direction of gravity. In this soldering process, the immersion time in the solder bath is about 0.5 to 2 seconds, and it is particularly preferable to keep it short, about 0.8 to 1.5 seconds. By keeping the immersion time in the soldering process within the above range, the thermal effects on the ceramic body 4 can be minimized.

[0077] After the soldering process, the portion immersed in the solder bath is immersed in a bath of liquid insulating resin so that at least the soldered portions of the ceramic body 4 and the lead terminals 8 are immersed in the bath of insulating resin. Then, depending on the type of insulating resin used, heat treatment or cooling and drying treatment is performed as appropriate, and an exterior 20 is formed to cover the ceramic body 4 and portions of the lead terminals 8.

[0078] The series of bonding steps described above may be performed with the lead terminals 8 attached and fixed to the carrier tape. After the exterior packaging 20 is formed, the connecting portion (i.e., the arc portion of the U-shape) of the pair of lead legs 8d is cut, and the lead terminals 8 are removed from the carrier tape, thereby obtaining the ceramic electronic component 2 shown in FIGS. 1 and 2.

[0079] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments and can be modified in various ways within the scope of the present invention.

[0080] (Variation) For example, the lead terminal 8 may have a configuration as shown in FIG. 5. In the lead terminal 81 shown in FIG. 5, a second recess 91 is formed in the opposing surface 8aa of the adjacent portion 8a. This second recess 91 extends along the Z axis from the upper end to the lower end of the opposing surface 8aa. Furthermore, the lower end of the second recess 91 in the Z axis direction is connected to the first recess 9, and the second recess 91 and the first recess 9 are in communication. Even when the lead terminal 81 shown in FIG. 5 is used, a crack suppression effect can be expected. Furthermore, when the lead terminal 81 is used, the amount of solder 10 present in the gap 86 between the opposing surface 8aa and the end surface electrode 6a increases, which tends to improve the bonding strength of the lead terminal 81.

[0081] 2 and 3, the upper support portion 8ea extends substantially parallel to the Z-axis, but the extension direction of the upper support portion 8ea is not limited to this. For example, the upper support portion 8ea may be bent from the lower end 9b of the first recess 9 toward the outside in the X-axis direction. The outside in the X-axis direction is the direction in which the pair of lead terminals move away from each other. By bending the upper support portion 8ea in this way, the contact angle θ of the solder fillet 10a tends to become smaller. [Example]

[0082] (Sample 1) For Sample 1, 30 capacitor samples were fabricated using lead terminals 8 having the tip shape shown in FIG. 4, and the crack occurrence rate was evaluated.

[0083] First, a capacitor chip having a length in the X-axis direction of 1.6 mm, a width in the Y-axis direction of 0.8 mm, and a height L0 in the Z-axis direction of 0.8 mm was prepared as the ceramic body 4. Then, a terminal electrode 6 consisting of a Cu sintered electrode layer, a Ni plated layer, and a Sn plated layer was formed on the capacitor chip.

[0084] Furthermore, a Cu wire with a wire diameter of 0.5 mm and a tin-plated surface was prepared as the raw material for the lead terminal 8. This Cu wire was then processed into the shape shown in FIG. 4 and soldered to a capacitor chip according to the procedure described in the embodiment. The detailed dimensions of the lead terminal 8 actually used are shown below. Note that the following dimensions are average values, and were measured by observing the cross sections of 30 completed capacitor samples with an SEM and performing image analysis on the cross-sectional photographs obtained. Wx1 / Wx3=0.75 Wx2 / Wx1=0.72 L1 / L0=0.50 L2 / L0=0.20

[0085] (Evaluation of crack occurrence rate) The capacitor samples produced using the above procedure were inspected for the presence or absence of cracks. The presence or absence of cracks was confirmed by observing the cross section of the capacitor sample with an optical microscope, and samples with even the slightest crack inside the element (capacitor chip) were deemed NG. This inspection was carried out on 30 samples, and the percentage of samples with cracks was calculated as the crack occurrence rate.

[0086] (Comparative Example 1) In Comparative Example 1, a conventional lead terminal 82 shown in FIGS. 6 and 7 was used. Here, the features of the lead terminal 82 shown in FIGS. 6 and 7 will be described. In the lead terminal 82, the adjacent portion 8a is crushed to form an opposing surface 8aa, but the lead terminal 82 does not have a first recess 9. In the lead terminal 82, a step surface 11 that is substantially parallel to the X-axis and Y-axis is formed by crushing at the boundary between the adjacent portion 8a and the extending portion 8e (upper support portion 8ea). The step surface 11 abuts against the side electrode 6b during soldering, and serves to adjust the positional relationship between the lead terminal 82 and the capacitor chip.

[0087] Lead terminals 82 having the above characteristics were soldered to a capacitor chip in the same manner as in Sample 1, to obtain a capacitor sample according to Comparative Example 1. The crack occurrence rate of Comparative Example 1 was then calculated in the same manner as in Sample 1.

[0088] (Sample 2: Reference Example) Sample 2 used a lead terminal 83 shown in FIG. 8. Here, the features of the lead terminal 83 shown in FIG. 8 will be described. In the lead terminal 83, similar to the conventional lead terminal 82 shown in FIG. 7, the adjacent portion 8a is crushed, and a step surface 11 is formed at the boundary between the adjacent portion 8a and the extending portion 8e. In this lead terminal 83, a third recess 92 is formed in the step surface 11, and a fourth recess 93 is formed in the opposing surface 8aa. The third recess 92 extends in the X-axis direction, and the fourth recess 93 extends in the Z-axis direction. The third recess 92 and the fourth recess 93 are connected at an intersection angle between the opposing surface 8aa and the step surface 11.

[0089] A lead terminal 83 having the above characteristics was soldered to a capacitor chip using the same method as for Sample 1, to obtain a capacitor sample according to Sample 2. After soldering, the perpendicular distance L1 from the lower end of the third recess 92 to the plane including the bottom surface 4b1 was measured, and the perpendicular distance was approximately 0.2 times the height L0 of the capacitor chip (0.2 × L0). The capacitor sample 2 was also evaluated for the presence or absence of cracks using the same method as for Sample 1.

[0090] Evaluation results The crack occurrence rate in Comparative Example 1 was 63%, meaning that cracks occurred in more than half of the samples in Comparative Example 1. FIG. 7 is an enlarged cross-sectional view of a main portion of a capacitor sample in Comparative Example 1. As shown in FIG. 7, conventional lead terminal 82 does not have a recess formed in a location corresponding to solder fillet 10a. Therefore, in the capacitor sample in Comparative Example 1, a large amount of solder remained between bottom surface 4b1 of the element body and the extending portion of lead terminal 82, and the contact angle θ of solder fillet 10a became an obtuse angle of over 50 degrees. It is believed that the obtuse angle of solder fillet 10a caused many cracks to occur in Comparative Example 1.

[0091] 7, a gap 61 filled with solder exists between the step surface 11 and the side electrode 6b. However, the width Wx5 of this gap 61 is at most about 20 μm, and the gap 61 does not have the function of attracting the solder remaining on the solder fillet 10a and reducing the contact angle θ. Therefore, the gap 61 cannot be considered a recess.

[0092] On the other hand, in sample 2 (reference example) using lead terminal 83 shown in Fig. 8, the crack occurrence rate was 40%, which was a reduction in cracks compared to comparative example 1. Furthermore, in sample 2, the contact angle θ of solder fillet 10a was more acute than in comparative example 1. In lead terminal 83, third recess 92 formed in step surface 11 is located to the side of solder fillet 10a, which is thought to be why the molten solder is attracted to third recess 92, resulting in the acute contact angle θ.

[0093] Furthermore, Sample 1, which used lead terminal 8 shown in FIG. 4, was able to reduce the crack occurrence rate the most. Specifically, in Sample 1, the contact angle θ of solder fillet 10a was more acute than in Comparative Example 1 and even more acute than in Sample 2. The crack occurrence rate in Sample 1 was 13%, which means that crack occurrence was more effectively suppressed than in Sample 2. The following reasons are thought to be the reasons why the crack occurrence rate in Sample 1 was higher than that in Sample 2.

[0094] First, it is thought that the difference in the size of the recesses is related. The third recesses 92 of Sample 2 have an L1 / L0 ratio of about 0.2, while the first recesses 9 of Sample 1 have an L1 / L0 ratio of 0.5. Therefore, it is thought that the first recesses 9 of Sample 1 have a stronger effect of drawing in molten solder than the third recesses 92 of Sample 2.

[0095] The opening direction of the recess is also thought to be a factor. The third recess 92 of Sample 2 extends in the X-axis direction and is closed by the recess wall in the Y-axis direction. That is, the inside of the third recess 92 forms a solder pool, but the solder pool formed by the third recess 92 is surrounded by the wall of the third recess 92 and the wall of the fourth recess 93. On the other hand, the first recess 9 of Sample 1 is open in the Y-axis direction, so the solder pool in the first recess 9 is not constrained by the wall of the first recess 9 in the Y-axis direction. Therefore, in Sample 1, strain generated during solder solidification is likely to be dispersed to the outside of the lead terminal 8 and is less likely to accumulate in the solder pool in the first recess 9. As a result, it is thought that Sample 1 was able to suppress cracking more effectively than Sample 2.

[0096] In the above example, Cu wire was used as the conductive wire for the lead terminal, but the same experiment was also performed using CP wire. When CP wire was used, the same results as in the above example were obtained, and the crack occurrence rate was reduced the most with the lead terminal shape shown in Figure 4. [Explanation of symbols]

[0097] 2. Ceramic electronic components 4... Ceramic body 4a … End face 4b…side 4b1 … Bottom 4b2 …Top surface 6 … Terminal electrode 6a... End electrode 6b … Side electrode 6ab … Intersection angle 8,81~83 ... Lead terminals 8a ... adjacent area 8aa ... Opposite surface 91 ... Second recess 8e … Extension part 8ea … Upper side support part 8eb … Lower side support part (kink) 8ec... Legs (board mounting part) 9 ... First recess 9a … Wall 9b…lower end 9c…Top end 10... solder 10a...Solder fillet 10aa... Tip 10ab...outer edge 10ac…lower end 11 … Step surface 20 … Exterior

Claims

1. a ceramic body having an end surface along a first axis and a side surface intersecting the end surface and along a second axis; an end surface electrode formed on the end surface of the ceramic body; a lead terminal joined to the end surface electrode by solder; The lead terminal is an adjacent portion overlapping the end surface electrode when viewed from a side along the second axis; an extension portion extending from an end of the adjacent portion in a direction away from a surface including the side surface, The extension portion has a first recess formed therein, the first recess being recessed in a direction away from a plane including the end face, the first recess is located at a position adjacent to the end of the adjacent portion, In the second axial direction, a maximum width of the adjacent portion is defined as Wx1, and a maximum width of the extending portion at the deepest portion of the first recess is defined as Wx2, A ceramic electronic component, wherein Wx2 / Wx1 is 0.4 to 0.

8.

2. an axis perpendicular to the first axis and the second axis is defined as a third axis; The ceramic electronic component according to claim 1 , wherein the first recess is open and not closed in the direction of the third axis.

3. a height of the ceramic body in the first axial direction is defined as L0; 3. The ceramic electronic component according to claim 1, wherein L1 / L0 is 0.3 or more, where L1 is a perpendicular distance from a lower end of the first recess in the first axial direction to a surface including the side surface.

4. A ceramic body having an end face along a first axis and a side face intersecting the end face and along a second axis; an end surface electrode formed on the end surface of the ceramic body; a lead terminal joined to the end surface electrode by solder; The lead terminal is an adjacent portion overlapping the end surface electrode when viewed from a side along the second axis; an extension portion extending from an end of the adjacent portion in a direction away from a surface including the side surface, The extension portion has a first recess formed therein, the first recess being recessed in a direction away from a plane including the end face, the first recess is located at a position adjacent to the end of the adjacent portion, a portion of the first recessed portion is present across from an upper end of the extending portion to a portion of the adjacent portion in the first axial direction, A ceramic electronic component in which an upper end of the first recess is located higher in the first axial direction than the side surface.

5. A ceramic body having an end face along a first axis and a side face intersecting the end face and along a second axis; an end surface electrode formed on the end surface of the ceramic body; a lead terminal joined to the end surface electrode by solder; The lead terminal is an adjacent portion overlapping the end surface electrode when viewed from a side along the second axis; an extension portion extending from an end of the adjacent portion in a direction away from a surface including the side surface, The extension portion has a first recess formed therein, the first recess being recessed in a direction away from a plane including the end face, the first recess is located at a position adjacent to the end of the adjacent portion, a portion of the first recessed portion is present across from an upper end of the extending portion to a portion of the adjacent portion in the first axial direction, an upper end of the first recess is located above the side surface in the first axial direction, a height of the ceramic body in the first axial direction is defined as L0; a perpendicular distance from a lower end of the first recess in the first axial direction to a surface including the side surface is defined as L1; a perpendicular distance from an upper end of the first recess in the first axial direction to a surface including the side surface is defined as L2, A ceramic electronic component in which the relationship between L1 and L2 is L1>L2.

6. 6. The ceramic electronic component according to claim 5, wherein L1 / L2 is 1.2 to 4.

0.

7. 7. The ceramic electronic component according to claim 5, wherein a perpendicular distance L2 from an upper end of the first recess in the first axial direction to a surface including the side surface is 0.2 times or less L0.

8. the adjacent portion has an opposing surface facing the end electrode, 8. The ceramic electronic component according to claim 1, wherein the opposing surface has a second recess formed therein, the second recess being recessed in a direction away from the end electrode.

Images