Processing device, evaluation device and evaluation method

The processing device evaluates post-machining quality by comparing forced and actual vibration wave frequencies, addressing the need for real-time quality assessment and reducing processing time and inspections.

JP7770952B2Active Publication Date: 2025-11-17HONDA MOTOR CO LTD
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Patent Information

Application Number
JP2022028207
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-02-25
Publication Date
2025-11-17
Estimated Expiration
2042-02-25

AI Technical Summary

Technical Problem

Existing technologies are unable to evaluate the post-machining quality of a workpiece during machining, requiring additional processing time and steps for quality measurement, and may not be feasible due to workpiece shape.

Method used

A processing device and method that utilize a processing unit, measurement unit, and evaluation unit to compare the frequencies of forced and actual vibration waves from processing sound to evaluate the quality of the workpiece during machining.

Benefits of technology

Enables real-time evaluation of post-machining quality, reducing processing time and man-hours by eliminating the need for separate quality inspections, and ensuring quality even when measurement is impossible due to workpiece shape.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

To provide a processing device, an evaluation device and an evaluation method that are capable of evaluating the quality of a workpiece after being processed during processing to reduce processing time and processing steps.SOLUTION: A processing device 1 includes a processing unit 2 for processing a workpiece W, a measurement unit 7 for measuring a processing sound of the workpiece W, and an evaluation unit 11 for evaluating quality after processing by comparing a fundamental wave and a multiple wave of a forced oscillation wave provided by a vibration system of the processing unit 2 with a fundamental wave and a multiple wave of an actual vibration wave obtained from the processing sound.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to a processing device, an evaluation device, and an evaluation method. [Background technology]

[0002] Generally, when processing a workpiece, the processing quality (surface roughness, dimensional accuracy, etc.) is measured after processing, and if the quality after processing is poor, the poor condition is fed back and the processing conditions are reset. Conventionally, a system has been proposed that monitors the machining state during machining by determining the relationship between the workpiece being machined and the machining tool, etc., using parameters that can be measured during machining (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-095951 Summary of the Invention [Problem to be solved by the invention]

[0004] However, Patent Document 1 is a technology for monitoring the machining state during machining, and is not capable of evaluating the post-machining quality of the workpiece during machining. When feedback of post-processing quality to the processing conditions is used, the post-processing quality must be measured every time, which requires additional processing time and processing steps, and depending on the shape of the workpiece, it may not be possible to measure the post-processing quality. The present invention has been made in view of the above background, and aims to provide a processing device, an evaluation device, and an evaluation method that can evaluate the post-processing quality of a workpiece during processing, thereby reducing processing time and processing man-hours. [Means for solving the problem]

[0005] In this aspect, a processing unit that processes a workpiece, a measurement unit that measures processing noise of the workpiece, and a vibration system of the processing unit occurs within A forced vibration wave and an actual vibration wave obtained from the processing sound. The frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave, and the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration wave, By contrasting of the workpiece and an evaluation unit for evaluating the quality after processing. The evaluation unit compares the frequencies of the peak positions of the fundamental wave and the harmonic wave of the forced vibration wave and the actual vibration wave to evaluate the quality of the processed workpiece after processing. Examples include processing equipment.

[0006] In this embodiment, The apparatus comprises a processing unit that processes a workpiece, a measurement unit that measures the processing sound of the workpiece, and an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the real vibration wave, for the forced vibration wave generated in the vibration system of the processing unit and the real vibration wave obtained from the processing sound, and the evaluation unit evaluates the quality of the processed workpiece to be high when the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the forced vibration wave and the real vibration wave are similar. Examples include processing equipment.

[0007] In this embodiment, The apparatus comprises a processing unit that processes a workpiece, a measurement unit that measures the processing sound of the workpiece, and an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration wave for the forced vibration wave generated in the vibration system of the processing unit and the actual vibration wave obtained from the processing sound, and the evaluation unit compares at least all of the triple harmonic waves, quadruple harmonic waves, and quintuple harmonic waves. Examples include processing equipment.

[0008] In this aspect, an evaluation device for evaluating the quality of a workpiece after processing includes a vibration system of a processing unit that processes the workpiece. occurs within Forced vibration wave and actual vibration wave obtained from the machining sound of the workpiece The frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave, and the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration wave, By contrasting of the workpiece Equipped with an evaluation section to evaluate the quality after processing The evaluation unit compares the frequencies of the peak positions of the fundamental wave and the harmonic wave of the forced vibration wave and the actual vibration wave to evaluate the quality of the processed workpiece after processing. Evaluation equipment is included.

[0009] In this embodiment, An evaluation device for evaluating the quality of a processed workpiece, comprising an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the forced vibration waves generated in the vibration system of a processing unit that processes the workpiece and the actual vibration waves obtained from the processing sound of the workpiece, with the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the actual vibration waves, and the evaluation unit evaluates the quality of the processed workpiece as high when the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the forced vibration waves and the actual vibration waves are similar. Evaluation equipment is included.

[0010] In this embodiment, An evaluation device for evaluating the quality of a processed workpiece, comprising an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the forced vibration waves generated in the vibration system of a processing unit that processes the workpiece and the actual vibration waves obtained from the processing sound of the workpiece, with the frequencies of the peak positions of the fundamental and harmonic waves of the sound pressure of the actual vibration waves, and the evaluation unit compares at least all of the triple harmonic waves, quadruple harmonic waves, and quintuple harmonic waves. Evaluation equipment is included.

[0011] In this embodiment , covered Vibration system of the processing part that processes the workpiece occurs within A forced vibration wave is obtained, and an actual vibration wave obtained from the machining sound of the workpiece is obtained. The frequency of the peak position of the fundamental wave and harmonic waves of the sound pressure and 、 The actual vibration wave The frequency of the peak position of the fundamental wave and harmonic waves of the sound pressure In contrast to of the workpiece Evaluating quality after processing The evaluation method includes comparing the frequencies of the peak positions of the fundamental wave and the harmonic wave of the forced vibration wave and the actual vibration wave to evaluate the quality of the processed workpiece after machining. Evaluation methods include:

[0012] In this embodiment, This is an evaluation method for evaluating the quality of a processed workpiece by determining a forced vibration wave generated in a vibration system of a processing part that processes a workpiece, determining an actual vibration wave obtained from the processing sound of the workpiece, and comparing the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the actual vibration wave, and evaluating the quality of the processed workpiece as being high when the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the forced vibration wave and the actual vibration wave are similar. Evaluation methods include:

[0013] In this embodiment, This is an evaluation method for evaluating the quality of a processed workpiece by determining a forced vibration wave generated in a vibration system of a processing part that processes a workpiece, determining an actual vibration wave obtained from the processing sound of the workpiece, and comparing the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the actual vibration wave, and evaluating the quality of the processed workpiece by comparing at least all of the triple multiple waves, quadruple multiple waves, and quintuple multiple waves. Evaluation methods include: [Effects of the Invention]

[0014] According to this aspect, since an evaluation unit for evaluating the quality after processing is provided, the process of quality inspection during or after processing can be omitted, and processing time and man-hours can be significantly reduced. Furthermore, even if the quality after processing cannot be measured due to the shape of the workpiece, the quality of the workpiece after processing can be guaranteed. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 illustrates a first embodiment. [Figure 2] FIG. 1 is a diagram of a forced oscillatory wave. [Figure 3] 1A shows vibration waves of cutting noise, and FIG. 1B shows actual vibration waves of sound pressure levels of cutting noise obtained by FFT analysis. [Figure 4] FIG. 10 is a diagram of an actual vibration wave generated by a generating unit. [Figure 5] 1A shows the vibration wave of the cutting sound when the processing quality is high, and FIG. 1B shows the vibration wave of the cutting sound when the processing quality is poor. [Figure 6] FIG. 10 illustrates a third embodiment. [Figure 7] Graphs A and B show the correlation with the quality after processing. [Figure 8] 10A shows the correlation of the bottom surface roughness with respect to the processing quality parameter Fs index, and FIG. 10B shows the correlation of the side surface displacement amount with respect to the same. DETAILED DESCRIPTION OF THE INVENTION

[0016] [First embodiment] Referring to FIG. 1, an embodiment of a processing device 1 according to the present embodiment will be described. The processing device 1 is equipped with a processing unit 2 that processes a workpiece W. The processing unit 2 is configured by attaching an end mill (a tool unit that uses rotary cutting) 5 to a gripping unit 4 of a processing machine body 3. The workpiece W is supported and fixed by a holding unit 6. The processing device 1 is configured to include a microphone (measuring unit) 7 that measures the sound pressure of the processing sound (cutting sound) of the workpiece W. The microphone 7 measures with high precision the sound pressure of the cutting sound generated when the processing unit 2 cuts the workpiece W, over a frequency range from low to high.

[0017] The processing device 1 includes a control unit (evaluation device) 8. The control unit 8 is a computer and includes a processor, a memory device, a storage device, and an interface circuit. The processor executes a control program stored in the memory device or the storage device to realize various functions of the control unit 8. The processor is, for example, a CPU (Central Processing Unit) or an MPU (Micro-Processing Unit). The memory device is, for example, a ROM (Read Only Memory) or a RAM (Random Access Memory). The storage device is, for example, an HDD (Hard Disk Drive) or an SSD (Solid State Drive).

[0018] The control unit 8 includes a memory unit 9, a generation unit 10, and an evaluation unit 11. The memory unit 9 stores forced vibration waves provided by the vibration system of the processing unit 2. The generation unit 10 generates actual vibration waves during processing obtained from the sound pressure of the processing sound. The evaluation unit 11 compares the actual vibration waves during processing obtained from the sound pressure of the processing sound with the forced vibration waves provided by the vibration system of the processing unit 2 to evaluate the quality of the processed workpiece.

[0019] FIG. 2 is a diagram of a forced vibration wave provided in the vibration system of the processing unit 2. Forced vibration is vibration that occurs within a vibration system when a periodic external force (force) is applied to the system, and its frequency is equal to the frequency of the force. The fundamental wave of the forced vibration of the vibration system of the processing part 2 is expressed by formula (1). The forced vibration wave appears in the frequency range from low frequency to high frequency, with a fundamental wave Hz1, a second harmonic Hz2, a third harmonic Hz3, ..., and an nth harmonic Hzn. Fundamental wave of forced vibration [Hz] = (spindle rotation speed × number of teeth of end mill) / 60…(1) The spindle rotation speed is the number of rotations of the end mill 5 per minute.

[0020] 3 and 4 are diagrams of the actual vibration wave generated by the generating unit 10. FIG. As shown in Fig. 3A, the generator 10 acquires the vibration waves of the cutting sound measured by the microphone 7, and generates the actual vibration waves of the sound pressure of the cutting sound (peak positions of the sound pressure level) using FFT (Fast Fourier Transformation) analysis, as shown in Fig. 3B. The actual vibration waves appear as a fundamental wave Hz1, a second harmonic wave Hz2, a third harmonic wave Hz3, a fourth harmonic wave Hz4, and a fifth harmonic wave Hz5, as shown in Fig. 4. K is a resonant wave.

[0021] The evaluation unit 11 compares the fundamental wave Hz1, second harmonic Hz2, third harmonic Hz3, ..., nth harmonic Hzn of the forced vibration wave shown in Figure 2 with the fundamental wave Hz1, second harmonic Hz2, third harmonic Hz3, fourth harmonic Hz4, and fifth harmonic Hz5 of the actual vibration wave generated by the generation unit 10 shown in Figure 4, and evaluates the quality after processing (e.g., surface roughness, dimensional accuracy) based on the comparison results.

[0022] Through various experimental studies, the inventors have found that the frequency deviation of each peak position between the fundamental and harmonic waves of the forced vibration wave and the fundamental and harmonic waves of the actual vibration wave significantly affects the quality of the processed surface (e.g., surface roughness, dimensional accuracy). It was found that when the frequency deviation of each peak position is greater than a predetermined threshold, the processed quality is poor. The predetermined threshold for determining the magnitude of the deviation may be set based on, for example, the half-width of the peak position, or the magnitude of half the half-width may be set as the predetermined threshold. When the frequencies of the peak positions of the fundamental wave Hz1, the second harmonic Hz2, the third harmonic Hz3, ..., and nth harmonic Hzn of the forced vibration wave shown in Figure 2 are similar to the frequencies of the peak positions of the fundamental wave Hz1, the second harmonic Hz2, the third harmonic Hz3, ..., and nth harmonic Hzn of the actual vibration wave shown in Figure 4 (the deviation is smaller than a predetermined threshold), the processed surface appears glossy and mirror-like, resulting in high quality of the processed surface. Furthermore, when the deviation is greater than a predetermined threshold, machining marks appear on the machined surface, resulting in a rough surface and poor quality after machining.

[0023] It was found that the accuracy of evaluating the quality after processing can be improved by comparing the frequency shifts of both peak positions, including the frequencies of the harmonics of the forced vibration wave (second harmonic Hz2, third harmonic Hz3, fourth harmonic Hz4, fifth harmonic Hz5).

[0024] According to this embodiment, the evaluation unit 11 evaluates that the quality after processing is high when the frequencies at the peak positions of the forced vibration wave and the actual vibration wave are similar to each other. The evaluation unit 11 compares the frequencies of the harmonic waves of the forced vibration wave (second harmonic wave Hz2, third harmonic wave Hz3, fourth harmonic wave Hz4, fifth harmonic wave Hz5). According to this embodiment, since the evaluation unit 11 evaluates the post-machining quality, if the post-machining quality is evaluated as poor, the machining operation can be stopped even during machining, and the post-machining quality can be fed back to the machining conditions. Furthermore, unlike conventional methods, there is no need to measure the post-machining quality every time, which eliminates the need for quality inspection during or after machining, thereby significantly reducing the machining time and number of machining steps. Even if the post-machining quality cannot be measured because the shape of the workpiece W makes it impossible to bring a measuring device close, the post-machining quality is guaranteed.

[0025] [Second embodiment] 5A and 5B show the resonance waves in the vibration waves of the cutting sound measured by the microphone 7. In Fig. 5, the vertical axis represents sound pressure, and the horizontal axis represents frequency. The inventors have found that, as shown in Fig. 5A, when resonance waves K are observed only around the fundamental wave Hz1 and the second harmonic Hz2 of the actual vibration wave generated by the generation unit 10, and when resonance waves K are not observed around the third harmonic Hz3, the fourth harmonic Hz4, and the fifth harmonic Hz5, the machined surface appears shiny and has high post-machining quality. In contrast, as shown in Fig. 5B, when a large number of resonance waves K are observed around the fundamental wave Hz1, the second harmonic Hz2, the third harmonic Hz3, the fourth harmonic Hz4, and the fifth harmonic Hz5 of the actual vibration wave, machining marks and a rough surface appear on the machined surface, resulting in poor post-machining quality. In other words, it was found that the number of resonance waves K appearing in the actual vibration wave affects the quality of the processed product.

[0026] In the second embodiment, the evaluation unit 11 evaluates the post-processing quality based on the magnitude of the resonant wave K. This eliminates the need to measure the post-processing quality every time, as in the past, and can omit the process of quality inspection during or after processing, significantly reducing the processing time and processing man-hours. Even if the post-processing quality cannot be measured due to the shape of the workpiece W, the post-processing quality is guaranteed.

[0027] Furthermore, the inventors have found that, as shown in Figure 5A, when resonance waves K are observed only around the fundamental wave Hz1 and second harmonic wave Hz2 of the actual vibration wave (resonance waves K are not observed around the third harmonic wave Hz3, fourth harmonic wave Hz4, and fifth harmonic wave Hz5), the quality after processing is high, and that, as shown in Figure 5B, when a large number of resonance waves K are observed around the third harmonic wave Hz3, fourth harmonic wave Hz4, and fifth harmonic wave Hz5, the quality after processing is poor.

[0028] In another embodiment, the evaluation unit 11 may evaluate the quality after processing based on the amount of resonance waves K around the third harmonic wave Hz3 or higher of the actual vibration wave. According to another embodiment, the quality after processing is evaluated based on the magnitude of the resonant wave K around the third harmonic wave Hz3 or higher. This eliminates the need to measure the quality after processing every time, as in the past. This eliminates the need for quality inspection during or after processing, significantly reducing processing time and processing man-hours. Even if the shape of the workpiece W makes it impossible to measure the quality after processing, the quality after processing is guaranteed. It is desirable to use a microphone with high sensitivity in the high-frequency range for the microphone 7. For example, it is desirable for the microphone 7 to be able to accurately measure sounds with frequencies from 20 Hz to 20,000 Hz, which is the frequency range from low to high.

[0029] [Third embodiment] Fig. 6 is a configuration diagram of the third embodiment. Note that the same parts as in Fig. 1 are given the same reference numerals and their explanation will be omitted. The control unit 18 differs from the control unit 8 of the first embodiment in that it includes a calculation unit 20 and an evaluation unit 21. The calculation unit 20 calculates a processing quality parameter Fs (Formulated Sound) index expressed by the following equation (2): The evaluation unit 21 evaluates the quality after processing from the processing quality parameter Fs.

[0030] The inventors have found that the forced vibration wave of the workpiece W behaves similarly to the resonant wave K, and that the waveform in the high frequency range correlates with the quality of the workpiece after machining. When the sensitivity in the high frequency range is particularly high, the quality of the workpiece after machining can be evaluated as being low. Based on this knowledge, we created a machining quality parameter Fs index expressed by equation (2), which incorporates high-frequency sensitivity to cutting noise during cutting, which has a strong correlation with quality.

number

[0031]

number

[0032] The processing quality parameter Fs is calculated by measuring the sound pressure Pa in the frequency range from low to high, calculating the average sound pressure Pi for each frequency band, and then multiplying the average sound pressure Pi by the frequency for each frequency band to obtain the average value for all frequency bands.Since the processing quality parameter Fs is the sum of the sound pressure components in the high frequency band and the low frequency band of the fundamental wave, it has a high correlation with processing quality.

[0033] 7A and 7B are diagrams showing correlations with quality after processing. As shown in FIG. 7A, when examining the correlation between the peak value of the sound pressure level of the cutting sound and the quality after machining, the correlation coefficient in this case is R=0.67. In the third embodiment, the quality after processing is evaluated based on the correlation with the parameter Fs in equation (2). In this case, as shown in Fig. 7B, the correlation is higher than that shown in Fig. 7A, with a correlation coefficient of R = 0.86.

[0034] In the third embodiment, the calculation unit 20 calculates a processing quality parameter Fs from the cutting sound measured by the microphone 7, and the evaluation unit 21 evaluates the quality of the processed product based on the processing quality parameter Fs. When the processing quality parameter Fs is within a specific range, the evaluation unit 21 evaluates that the quality of the processed product is good. The machining quality parameter Fs is expressed by equation (2), which incorporates the high-frequency sensitivity to cutting noise during machining, which has a strong correlation with quality. Therefore, by using this Fs index, the quality of the workpiece W can be evaluated more accurately in a short period of time.

[0035] According to the third embodiment, the post-machining quality is evaluated based on whether the machining quality parameter Fs is within a specific range. Therefore, if the post-machining quality is evaluated as poor, for example, the machining operation can be stopped even during machining, and the post-machining quality can be fed back to the machining conditions. Unlike conventional methods, there is no need to measure the post-machining quality every time, which eliminates the need for quality inspection during or after machining, significantly reducing the machining time and number of steps. Even if the post-machining quality cannot be measured due to the shape of the workpiece W, the post-machining quality is guaranteed.

[0036] FIG. 8A shows the correlation of the bottom surface roughness with respect to the processing quality parameter Fs index, and FIG. 8B shows the correlation of the side surface displacement with respect to the processing quality parameter Fs index. The bottom surface roughness is the surface roughness of the bottom surface of the workpiece W cut with the end mill 5, as shown in Figure 1, and the correlation coefficient is R = 0.857. The side displacement amount is the amount of displacement of the side surface of the workpiece W cut with the end mill 5 relative to the design value, as also shown in Figure 1, and the correlation coefficient is R = 0.861. Both show high correlation coefficients of R = 0.7 or higher.

[0037] The present invention is not limited to the above-described embodiment. The above-described embodiment is directed to the machining quality when machining with an end mill 5, but may be directed to machining with any rotary tool, such as a drilling tool.

[0038] [Configuration supported by the above embodiment] The above embodiment is a specific example of the following configuration.

[0039] (Configuration 1) A processing device characterized by comprising: a processing unit that processes a workpiece; a measurement unit that measures the processing sound of the workpiece; and an evaluation unit that evaluates the quality of the processed product by comparing the forced vibration wave provided by the vibration system of the processing unit with the actual vibration wave obtained from the processing sound. According to the processing device of Configuration 1, since it is equipped with an evaluation unit that evaluates the quality after processing, it is possible to omit the process of quality inspection during or after processing, thereby significantly reducing processing time and man-hours. Furthermore, even if the shape of the workpiece is such that the quality after processing cannot be measured, the quality of the workpiece after processing can be guaranteed.

[0040] (Configuration 2) The processing device according to Configuration 1, wherein the evaluation unit compares each fundamental wave and each harmonic wave of the forced vibration wave and the actual vibration wave to evaluate the quality after processing. According to the processing device of configuration 2, the quality after processing can be easily evaluated by comparing the fundamental waves and multiple waves of the forced vibration wave and the actual vibration wave.

[0041] (Configuration 3) The processing device according to configuration 1 or 2, wherein the evaluation unit evaluates the post-processing quality as high when the peak positions of the forced vibration wave and the actual vibration wave are similar to each other. According to the processing device of configuration 3, the peak positions are close to each other, so that the quality after processing can be easily evaluated.

[0042] (Configuration 4) The processing device according to any one of configurations 1 to 3, wherein the evaluation unit compares at least 3 to 5 multiple waves. According to the processing device of configuration 3, by comparing at least 3 to 5 times the multiple waves, the quality after processing can be easily evaluated.

[0043] (Configuration 5) A processing device characterized by comprising: a processing unit that processes a workpiece; a measurement unit that measures the processing sound of the workpiece; and an evaluation unit that acquires resonant waves that appear in actual vibration waves obtained from the processing sound, corresponding to the fundamental wave and harmonic waves of the forced vibration wave provided in the vibration system of the processing unit, and evaluates the quality after processing based on the amount of the resonant waves. According to the processing device of configuration 5, since it is equipped with an evaluation unit that evaluates the quality after processing based on the amount of resonance waves, it is possible to omit the process of quality inspection during or after processing, thereby significantly reducing processing time and labor.

[0044] (Configuration 6) A processing device characterized by comprising: a processing unit that processes a workpiece; a measurement unit that measures the processing sound of the workpiece; a calculation unit that acquires the magnitude of sound pressure in frequency bands from the low frequency region to the high frequency region of the processing sound, calculates the average sound pressure for each frequency band, and obtains an average value from the total value of all frequency bands obtained by multiplying the average sound pressure by the frequency for each frequency band; and an evaluation unit that evaluates the quality of the processed product from the average value. According to the processing device of configuration 6, since it is equipped with an evaluation unit that evaluates the quality after processing from the average value, it is possible to omit the process of quality inspection during or after processing, and it is possible to significantly reduce processing time and man-hours.

[0045] (Configuration 7) The processing device according to configuration 6, wherein the evaluation unit evaluates the processed quality as high when the average value is within a specific range. According to the processing device of configuration 7, the average value is within a specific range, so that the quality after processing can be easily evaluated.

[0046] (Configuration 8) An evaluation device for evaluating the quality of a workpiece after processing, characterized in that it has an evaluation unit that evaluates the quality after processing by comparing the forced vibration wave provided by the vibration system of the processing unit that processes the workpiece with the actual vibration wave obtained from the processing sound of the workpiece. According to the evaluation device of configuration 8, since it is equipped with an evaluation unit that compares the forced vibration wave with the actual vibration wave to evaluate the quality after processing, it is possible to omit the process of quality inspection during or after processing, and it is possible to significantly reduce the processing time and man-hours.

[0047] (Configuration 9) An evaluation device for evaluating the quality of a workpiece after processing, characterized in that it has an evaluation unit that acquires resonant waves that appear in the actual vibration waves obtained from the processing sound of the workpiece, corresponding to the fundamental wave and harmonic waves of the forced vibration wave provided in the vibration system of the processing part that processes the workpiece, and evaluates the quality of the processed workpiece based on the amount of the resonant waves. According to the evaluation device of configuration 9, since it is equipped with an evaluation unit that evaluates the quality after processing based on the amount of resonance waves, it is possible to omit the process of quality inspection during or after processing, and it is possible to significantly reduce the processing time and man-hours.

[0048] (Configuration 10) An evaluation device for evaluating the quality of a workpiece after processing, comprising: a calculation unit that acquires the magnitude of sound pressure in frequency bands from the low frequency range to the high frequency range of the processing sound of the workpiece, calculates the average sound pressure for each frequency band, and calculates an average value from the total value of all frequency bands obtained by multiplying the average sound pressure by the frequency for each frequency band; and an evaluation unit that evaluates the quality of the workpiece after processing from the average value. According to the evaluation device of configuration 10, since it is equipped with an evaluation unit that evaluates the quality after processing from the average value, it is possible to omit the process of quality inspection during or after processing, and it is possible to significantly reduce the processing time and man-hours.

[0049] (Configuration 11) An evaluation method for evaluating the quality of a workpiece after processing, characterized in that the method determines a forced vibration wave provided in a vibration system of a processing part that processes the workpiece, determines an actual vibration wave obtained from the processing sound of the workpiece, and evaluates the quality after processing by comparing the forced vibration wave with the actual vibration wave. According to the evaluation method of configuration 11, the quality after processing is evaluated by comparing the forced vibration wave with the actual vibration wave, so that the process of quality inspection during or after processing can be omitted, and processing time and man-hours can be significantly reduced.

[0050] (Configuration 12) A method for evaluating the quality of a workpiece after processing, characterized in that a resonant wave that appears in the actual vibration wave obtained from the processing sound of the workpiece is determined in correspondence with the fundamental wave and harmonic waves of the forced vibration wave provided in the vibration system of the processing part that processes the workpiece, and the quality after processing is evaluated based on the number of said resonant waves. According to the evaluation method of configuration 12, the quality after processing is evaluated based on the amount of resonance waves, so that the process of quality inspection during or after processing can be omitted, and processing time and man-hours can be significantly reduced.

[0051] (Configuration 13) A method for evaluating the quality of a workpiece after processing, characterized in that the magnitude of the sound pressure in the frequency band from the low frequency range to the high frequency range of the processing sound of the workpiece is obtained, the average sound pressure for each frequency band is calculated, an average value is obtained from the total value of all frequency bands obtained by multiplying the average sound pressure and frequency for each frequency band, and the quality of the workpiece after processing is evaluated from the average value. According to the evaluation method of configuration 13, the quality after processing is evaluated from the average value, so that the process of quality inspection during or after processing can be omitted, and processing time and man-hours can be significantly reduced. [Explanation of symbols]

[0052] 1 Processing equipment 2 Processing section 3 Processing machine body 5 End mill (rotary tool part) 7 Microphone (measurement unit) 8 Control unit (evaluation device) 9 Memory section 10 Generation part 11, 21 Evaluation Section 20 Arithmetic section

Claims

1. a processing unit that processes a workpiece; a measuring unit that measures the processing sound of the workpiece; an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave generated in the vibration system of the processing unit and the actual vibration wave obtained from the processing sound with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration wave; Equipped with The evaluation unit compares the frequencies of the peak positions of the fundamental wave and the harmonic wave of the forced vibration wave and the actual vibration wave to evaluate the quality of the processed workpiece after machining. A processing device characterized by:

2. a processing unit that processes a workpiece; a measuring unit that measures the processing sound of the workpiece; an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave generated in the vibration system of the processing unit and the actual vibration wave obtained from the processing sound with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration wave; Equipped with The evaluation unit evaluates the post-machining quality of the workpiece as high when the frequencies of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave and the actual vibration wave are similar to each other. A processing device characterized by:

3. a processing unit that processes a workpiece; a measuring unit that measures the processing sound of the workpiece; an evaluation unit that evaluates the quality of the processed workpiece by comparing the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave generated in the vibration system of the processing unit and the actual vibration wave obtained from the processing sound with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration wave; Equipped with The evaluation unit compares at least three multiples, four multiples, and five multiples. A processing device characterized by:

4. An evaluation device for evaluating the quality of a workpiece after processing, comprising: An evaluation unit is provided which compares the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration waves generated in the vibration system of the processing unit which processes the workpiece and the actual vibration waves obtained from the processing sound of the workpiece, with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration waves, thereby evaluating the quality of the processed workpiece; The evaluation unit compares the frequencies of the peak positions of the fundamental wave and the harmonic wave of the forced vibration wave and the actual vibration wave to evaluate the quality of the processed workpiece after machining. An evaluation device characterized by:

5. An evaluation device for evaluating the quality of a workpiece after processing, comprising: An evaluation unit is provided which compares the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration waves generated in the vibration system of the processing unit which processes the workpiece and the actual vibration waves obtained from the processing sound of the workpiece, with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration waves, thereby evaluating the quality of the processed workpiece; The evaluation unit evaluates the post-machining quality of the workpiece as high when the frequencies of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave and the actual vibration wave are similar to each other. An evaluation device characterized by:

6. An evaluation device for evaluating the quality of a workpiece after processing, comprising: An evaluation unit is provided which compares the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the forced vibration waves generated in the vibration system of the processing unit which processes the workpiece and the actual vibration waves obtained from the processing sound of the workpiece, with the frequencies of the peak positions of the fundamental wave and harmonic waves of the sound pressure of the actual vibration waves, thereby evaluating the quality of the processed workpiece; The evaluation unit compares at least three multiples, four multiples, and five multiples. An evaluation device characterized by:

7. An evaluation method for evaluating the quality of a processed workpiece by determining a forced vibration wave generated in a vibration system of a processing part that processes the workpiece, determining an actual vibration wave obtained from the processing sound of the workpiece, and comparing the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the actual vibration wave, The frequency of the peak positions of each fundamental wave and each harmonic wave of the forced vibration wave and the actual vibration wave is compared to evaluate the quality of the processed workpiece after processing. An evaluation method characterized by:

8. An evaluation method for evaluating the quality of a processed workpiece by determining a forced vibration wave generated in a vibration system of a processing part that processes the workpiece, determining an actual vibration wave obtained from the processing sound of the workpiece, and comparing the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the actual vibration wave, When the frequencies of the fundamental wave and harmonic waves of the sound pressure of the forced vibration wave and the actual vibration wave are similar to each other, the quality of the processed workpiece is evaluated as high. An evaluation method characterized by:

9. An evaluation method for evaluating the quality of a processed workpiece by determining a forced vibration wave generated in a vibration system of a processing part that processes the workpiece, determining an actual vibration wave obtained from the processing sound of the workpiece, and comparing the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the forced vibration wave with the frequencies of the peak positions of the fundamental wave and multiple waves of the sound pressure of the actual vibration wave, At least triple, quadruple and quintuple multiple waves are included and compared to evaluate the quality of the processed workpiece after processing. An evaluation method characterized by:

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