Power Supply

Abstract

The power supply module includes a first substrate, a control IC, a capacitor, a first electronic component, a second electronic component, a third electronic component, and a fourth electronic component on a main surface of the first substrate, a first submodule including a second substrate on the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component, a fifth electronic component, a sixth electronic component, and a seventh electronic component on the main surface of the second substrate, and resin covering an upper portion of the first submodule.

Description

[Technical Field]

[0001] The present invention relates to a power supply module including a substrate on which electronic components that provide a predetermined function are mounted. [Background technology]

[0002] A known power supply module includes electronic components arranged on a substrate. For example, Patent Document 1 discloses such a known power supply module. In recent years, as servers and other devices have become smaller and more multifunctional, there has been an increasing demand for smaller and more highly integrated modules that integrate multiple electronic components to provide multiple functions. To meet such demands, for example, Patent Document 1 discloses a power supply module in which multiple electronic components are arranged on a single substrate and packaged as a single module. In the power supply module described in Patent Document 1, an additional substrate is arranged on a common substrate on which electronic components are mounted, and additional electronic components are also mounted on the additional substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-114259 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the power supply module of Patent Document 1, if additional electronic components are mounted on a separate substrate above the common substrate to increase the integration density of the power supply module, the area of ​​this upper substrate must be increased. As the area of ​​this upper substrate increases, the strength of the upper substrate can become an issue. That is, as more electronic components are added to the power supply module, the upper substrate cannot support the weight of the additional components, resulting in deformation or distortion. This can result in problems such as poor electrical connections between the electronic components mounted on the upper substrate and between the electronic components on the common substrate. [Means for solving the problem]

[0005] In order to solve the above problems, a preferred embodiment of the present invention provides a power supply module that can be mounted with more electronic components and allows high flexibility in design, such as function, size, and performance, depending on the application and performance requirements.

[0006] More specifically, by using multiple second substrates or sub-modules arranged in a direction perpendicular or substantially perpendicular to the main surface of the first substrate within the manufacturing error range and / or measurement error range, various electronic components can be arranged not only on the main surface of the first substrate but also on these second substrates or sub-modules, thereby allowing the use of more electronic components than if only the first substrate were included.

[0007] Furthermore, by using multiple second substrates or submodules, adjustments can be made, such as reducing the area of ​​each second substrate or submodule. As a result, it is possible to ensure sufficient strength of these second substrates or submodules. The number, shape, and size of various electronic components arranged on the power module can also be changed depending on the shape and size of the first substrate and second substrate or submodule. The number and type of electronic components included on the second substrate or submodule can be changed. This makes it possible to provide power modules with a variety of functions.

[0008] Multiple sub-modules can be disposed on the main surface of the first substrate. For example, increasing the number of sub-modules can increase the achievable power output. When two or more sub-modules are used, the sub-modules can be electrically connected to each other.

[0009] According to a preferred embodiment of the present invention, a power supply module includes a first substrate, a control IC, a capacitor, a first electronic component, a second electronic component, a third electronic component, and a fourth electronic component on a main surface of the first substrate, and a sub-module including a second substrate on the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component, and a fifth electronic component, a sixth electronic component, and a seventh electronic component on the main surface of the second substrate. Product includes, sub-modules, and,.

[0010] The first electronic component may be an inductor. The second electronic component may be a ground terminal. The third electronic component may be a voltage input terminal. The fourth electronic component may be a signal transmission board. The fifth electronic component may be a power element. The module may further include a heat sink on the power element. The sixth electronic component may be a capacitor. The seventh electronic component may be a resistor. The module may further include one or more additional sub-modules, and the sub-module and the one or more additional sub-modules may be electrically connected to each other.

[0011] According to a preferred embodiment of the present invention, a power supply module includes a first substrate, a control IC, a capacitor, a first electronic component, a second electronic component, a third electronic component, and a fourth electronic component on a main surface of the first substrate, and a sub-module including a second substrate on the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component, and a fifth electronic component, a sixth electronic component, and a seventh electronic component on the main surface of the second substrate. Product Contains submodules and ,of include.

[0012] The first electronic component may be an inductor. The second electronic component may be a ground terminal. The third electronic component may be a voltage input terminal. The fourth electronic component may be a signal transmission board. The fifth electronic component may be a power element. The module may further include a heat sink on the power element. The sixth electronic component may be a capacitor. The seventh electronic component may be a resistor. The module may further include one or more additional sub-modules, and the sub-module and the one or more additional sub-modules may be electrically connected to each other.

[0013] According to a preferred embodiment of the present invention, a power supply module includes a first substrate, and a first sub-module and a second sub-module, each of the first sub-module and the second sub-module including a second substrate, a signal transmission substrate connected between the first substrate and the second substrate, a power element on a first main surface of the second substrate opposite the first substrate, and an inductor on a second main surface of the second substrate facing the first substrate and electrically connected to the power element.

[0014] The module may further include a metal plate on a major surface of the first substrate on which the first sub-module and the second sub-module are not disposed. The module may further include a third sub-module and a fourth sub-module, where the first sub-module and the second sub-module are arranged in a first line, and the third sub-module and the fourth sub-module are arranged in a second line adjacent to the first line. The module may further include a control IC on the first substrate.

[0015] The module may further include a first electronic component and a second electronic component mounted on the first substrate, wherein the first electronic component may be under a portion of the inductor of the first sub-module and the second electronic component may be under a portion of the second sub-module.

[0016] Each of the first sub-module and the second sub-module can include a resin covering an upper portion thereof. Each of the first sub-module and the second sub-module may include a first voltage input terminal and a second voltage input terminal, and the first voltage input terminal may be connected between the first substrate and a first end of the second substrate, and the second voltage input terminal may be connected between the first substrate and a second end of the second substrate opposite the first end of the second substrate.

[0017] Each of the first sub-module and the second sub-module may include a first ground terminal and a second ground terminal, the first ground terminal may be connected between a first end of the first substrate and a first end of the second substrate, the second ground terminal may be connected between a second end of the first substrate and a second end of the second substrate, and the first ground terminal and the second ground terminal may be positioned inward from the first voltage input terminal and the second voltage input terminal.

[0018] The first sub-module and the second sub-module may each include a heat sink over the power device. The first sub-module and the second sub-module may be electrically connected.

[0019] These and other features, elements, characteristics, steps, and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention, which proceeds with reference to the accompanying drawings. [Brief explanation of the drawings]

[0020] [Figure 1] 1 shows a perspective view of a power supply module according to a first preferred embodiment of the present invention; [Figure 2] A cross-sectional block diagram of the power supply module of Figure 1 with the resin mold removed is shown. [Figure 3] 2 shows a top view of the power supply module of FIG. 1. [Figure 4A]FIG. 2 shows a front view of a sub-module mounted on the power supply module of FIG. 1. [Figure 4B] 2 shows a rear view of a submodule mounted on the power supply module of FIG. 1. [Figure 5A] 2 shows a top view of the submodule mounted on the power supply module of FIG. 1 with the resin mold and heat sink removed. [Figure 5B] 2 shows a bottom view of a sub-module mounted on the power supply module of FIG. 1. [Figure 6] 2 shows a circuit diagram of a sub-module mounted on the power supply module 1 of FIG. 1. [Figure 7] FIG. 1 shows a perspective view of a power supply module according to a second preferred embodiment of the present invention; [Figure 8] A cross-sectional block diagram of the power supply module of FIG. 7 is shown. [Figure 9] 8 shows a top view of the power supply module of FIG. 7. [Figure 10] 8 shows a top view of the power module of FIG. 7 with the metal plate mold removed. [Figure 11A] FIG. 8 shows a front view of a sub-module mounted on the power supply module of FIG. 7. [Figure 11B] 8 shows a rear view of the submodule mounted on the power supply module of FIG. 7. [Figure 12A] 8 shows a top view of the submodule mounted on the power supply module of FIG. 7 with the resin mold and heat sink removed. [Figure 12B] 8 shows a bottom view of the sub-module mounted on the power supply module of FIG. 7. [Figure 13] 8 shows a circuit diagram of a submodule mounted on the power supply module of FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0021] A power supply module according to a preferred embodiment of the present invention will be described below with reference to the drawings. It should be noted that the following examples all illustrate preferred embodiments of the present invention. The numerical values, shapes, materials, components, layouts, component positions, and connection configurations shown in the following examples are merely examples and are not intended to limit the present invention. Furthermore, the sizes and size ratios of the components shown in each drawing are not necessarily accurate.

[0022] First Preferred Embodiment 1 to 3 show a power supply module 1 including a common substrate (hereinafter referred to as a first substrate 2) and submodules mounted on the first substrate 2. FIGS. 4A to 5B show an example of a submodule 10 that can be used with the power supply module 1. FIG. 6 shows a circuit diagram including the components of the submodule 10.

[0023] As shown in FIGS. 1-3, the power supply module 1 may include six submodules mounted on a first substrate 2. Alternatively, any number of submodules may be used. Each submodule may include a second substrate and associated electronic components. Depending on the design of the power supply module, the power supply module 1 may include active devices such as power elements mounted on the first substrate 2, and may also include passive devices such as resistors, capacitors, and inductors mounted on the first substrate 2. The power elements may include, for example, power transistors, power transistor drivers, etc. For example, the power supply module 1 may include one or more control integrated circuits (ICs). Any suitable control IC may be used, and the number, type, and placement of the ICs depend on the design of the power supply module.

[0024] Each sub-module may include active devices such as power elements and passive devices such as resistors, capacitors, and inductors, depending on the design of the sub-module. Power elements may include, for example, power transistors, drivers for the power transistors, etc. Each sub-module may also include a heat sink. Although each sub-module in FIGS. 1-3 is identical or similar, it is also possible to provide sub-modules with different arrangements and / or functions.

[0025] As shown in Figures 1 to 3, the power supply module 1 includes inductors 3a, 3b, 3c, 3d, 3e, and 3f, capacitors 4a, 4b, 4c, 4d, 4e, 4f, 4g, 4h, 4i, and 4j, control ICs 5a and 5b, ground terminals 22a and 22b, voltage input terminals 23a and 23b, and signal transmission boards 24a, 24b, 24c, 24d, 24e, and 24f mounted on the main surface of a first substrate 2. As shown in Figure 2, electronic components such as capacitors 4a, 4b, 4c, 4d, 4e, 4f, 4g, and 4h may be disposed under portions of the respective inductors 3a, 3b, 3c, 3d, 3e, and 3f. Ground terminals 22a and 22b may extend from both ends of each of the second substrates 6a, 6b, 6c, 6d, 6e, and 6f. The voltage input terminals 23a and 23b may extend from both ends of each of the second substrates 6a, 6b, 6c, 6d, 6e, and 6f. The ground terminals 22a and 22b may be located inside the voltage input terminals 23a and 23b.

[0026] As shown in FIG. 2, the power supply module 1 may include: 1. A first sub-module including a second substrate 6a, a signal transmission substrate 24a extending between the second substrate 6a and the first substrate 2, ground terminals 22a, 22b and voltage input terminals 23a, 23b, a capacitor 4j, power elements 7a and 7b and a resistor 8a on the main surface of the second substrate 6a, and a heat sink 9a on the power elements 7a and 7b.

[0027] 2. A second sub-module including a second substrate 6b, a signal transmission substrate 24b extending between the second substrate 6b and the first substrate 2, a ground terminal (not numbered) and a voltage input terminal (not numbered), a capacitor 4k, power elements 7c and 7d, and a resistor 8b on the main surface of the second substrate 6b, and a heat sink 9b above the power elements 7c and 7d.

[0028] 3. A third sub-module including a second substrate 6c, a signal transmission substrate 24c extending between the second substrate 6c and the first substrate 2, a ground terminal (not numbered) and a voltage input terminal (not numbered), a capacitor 4l, power elements 7e and 7f, and a resistor 8c on the main surface of the second substrate 6c, and a heat sink 9c above the power elements 7e and 7f.

[0029] 4. A fourth sub-module including a second substrate 6d, a signal transmission substrate 24d extending between the second substrate 6d and the first substrate 2, a ground terminal (not numbered) and a voltage input terminal (not numbered), a capacitor 4m, power elements 7g and 7h, and a resistor 8d arranged on the main surface of the second substrate 6d, and a heat sink 9d above the power elements 7g and 7h.

[0030] 5. A fifth sub-module including a second substrate 6e, a signal transmission substrate 24e extending between the second substrate 6e and the first substrate 2, a ground terminal (not numbered) and a voltage input terminal (not numbered), a capacitor 4n, power elements 7i and 7j, and a resistor 8e arranged on the main surface of the second substrate 6e, and a heat sink 9e above the power elements 7i and 7j.

[0031] 6. A sixth sub-module including a second substrate 6f, a signal transmission substrate 24f extending between the second substrate 6f and the first substrate 2, a ground terminal (not numbered) and a voltage input terminal (not numbered), a capacitor 4o, power elements 7k and 7l, and a resistor 8f arranged on the main surface of the second substrate 6f, and a heat sink 9f above the power elements 7k and 7l.

[0032] To achieve miniaturization and / or high integration, the power supply module 1 can change the shape of the first substrate 2 depending on the number and position of each submodule. For example, as shown in Figure 1, if six submodules are arranged side by side so that the front and rear sides of each submodule shown in Figures 4A and 4B are generally parallel to the Y-axis direction in Figure 1, the first substrate 2 can be rectangular in shape with the long side parallel to the Y-axis. In other words, the length of the short side can be less than twice the length of the long side of the submodule.

[0033] Heat sinks 9a-9f may be used to dissipate heat within the power supply modules, although other structures and / or materials may also be used to dissipate heat. In some applications, heat sinks may not be required.

[0034] As shown in FIGS. 1 to 3, the second substrate 6a of the first submodule can be molded with resin 28a so as to cover the electronic components on the main surface of the second substrate 6a that does not face the first substrate 2, the second substrate 6b of the second submodule can be molded with resin 28b so as to cover the electronic components on the main surface of the second substrate 6b that does not face the first substrate 2, and the second substrate 6c of the third submodule can be molded with resin 28c so as to cover the electronic components on the main surface of the second substrate 6c that does not face the first substrate 2. the second substrate 6d of the fourth submodule can be molded with resin 28d so as to cover the electronic components on the main surface of the second substrate 6d that does not face the first substrate 2; the second substrate 6e of the fifth submodule can be molded with resin 28e so as to cover the electronic components on the main surface of the second substrate 6e that does not face the first substrate 2; and the second substrate 6f of the sixth submodule can be molded with resin 28f so as to cover the electronic components on the main surface of the second substrate 6f that does not face the first substrate 2.

[0035] 4A to 5B show an example of a sub-module 10 that can be used with the power supply module 1. FIG. As shown in Figures 4A, 4B, and 5A, the submodule 10 may include power elements 7a, 7b, 7m, and 7n, a resistor 8a, and a capacitor 4j on the top surface of the second substrate 6a. As shown in Figure 5B, the submodule 10 may include an inductor 3a, voltage input terminals 23a and 23b, ground terminals 22a and 22b, and a signal transmission board 24a under the bottom surface of the second substrate 6a. These electronic components may be electrically connected to each other to provide various functions of the submodule 10. The power supply module 1 may be constructed by mounting at least one submodule 10 on the first substrate 2.

[0036] 1, 2, 4A, and 4B, the inductor 3a can be disposed on the main surface of the first substrate 2. The inductors 3a to 3f can be physically connected to the first substrate 2 and each of the second substrates 6a to 6f via a conductive bonding material such as solder.

[0037] As shown in FIGS. 1, 2, 4A, and 4B, for each submodule, the ground terminals 22a and 22b and the voltage input terminals 23a and 23b can be arranged outside the respective inductors 3a-3f along the long side of the main surface of the first substrate 2. As shown in FIGS. 1, 2, 4A, and 4B, for each submodule, the signal transmission boards 24a-24f can be arranged outside the inductor 3a along the short side of the main surface of the first substrate 2. For each submodule, the ground terminals 22a and 22b, the voltage input terminals 23a and 23b, and the signal transmission boards 24a-24f can be physically connected to the first substrate 2 and the respective second substrates 6a-6f. For each submodule, the ground terminals 22a and 22b, the voltage input terminals 23a and 23b, and the signal transmission boards 24a-24f can support the respective second substrates 6a-6f. For each sub-module, the ground terminals 22a and 22b arranged on the main surface of the first substrate 2 and the signal transmission substrates 24a to 24f can transmit signals and / or power.

[0038] 4A and 5B, the inductor 3a, the ground terminals 22a and 22b, the voltage input terminals 23a and 23b, and the signal transmission board 24a can be arranged on the lower surface of the second substrate 6a. The inductor 3a, the ground terminals 22a and 22b, the voltage input terminals 23a and 23b, and the signal transmission board 24a are specific examples of electronic components arranged on the lower surface of the second substrate 6a, but other electronic components can be used instead of or in addition to these electronic components.

[0039] 1 to 4B, the second substrates 6a to 6f can be arranged so as to cover the upper surfaces of the inductors 3a to 3f, the ground terminals 22a and 22b, the voltage input terminals 23a and 23b, and the signal transmission substrates 24a to 24f. That is, the second substrates 6a to 6f can be arranged on the surfaces of the inductors 3a to 3f, the ground terminals 22a and 22b, the voltage input terminals 23a and 23b, and the signal transmission substrates 24a to 24f that face the surfaces that contact the first substrate 2.

[0040] As shown in Figure 5A, power elements 7a, 7b, 7m, and 7n, capacitor 4j, and resistor 8a can be disposed on the main surface of second substrate 6a that does not face first substrate 2. Any number and arrangement of passive and active devices can be used. For example, any number and arrangement of capacitors, resistors, and power elements can be included in a submodule.

[0041] As shown in FIGS. 4A to 6, the electronic components of the submodule 10 can be electrically connected via the second substrate 6a. By adopting the structure of the power supply module 1 described above, it is possible to provide a power supply module with a structure that allows for more electronic components to be mounted and allows for high flexibility in design of functions, size, performance, etc.

[0042] By using second substrates 6a to 6f arranged in a direction perpendicular or substantially perpendicular to the main surface of first substrate 2 within the manufacturing error range and / or measurement error range, electronic components can be arranged not only on the main plane of first substrate 2 but also on second substrates 6a to 6f, thereby allowing the use of more electronic components than when only the first substrate is present.

[0043] Furthermore, by using two or more second substrates, adjustments can be made such as reducing the area of ​​each of the second substrates 6a to 6f, and as a result, the strength of the second substrates 6a to 6f can be ensured.

[0044] Furthermore, by changing the shapes and sizes of the first substrate 2 and the second substrates 6a to 6f, the number, shapes and sizes of the electronic components in the power supply module can be changed. The number and type of electronic components in the sub-module 10 can be varied to provide power supply modules with a variety of functions.

[0045] In the power supply module 1, two or more sub-modules 10 can be disposed on the main surface of the first substrate 2. For example, a greater power output can be achieved by increasing the number of sub-modules 10. When multiple sub-modules 10 are used, the sub-modules 10 can be electrically connected to each other.

[0046] FIG. 6 shows a possible circuit diagram including components within the submodule 10 and on the first board 2 of the power module 1. Capacitor 4j (C1) of the submodule 10 can be connected in parallel with power supply V1. Power elements 7a, 7b, 7m, and 7n can be used to drive switches Q1-Q8 within the submodule 10. Series-connected switches Q1 and Q2 can be connected in parallel with power supply V1, series-connected switches Q3 and Q4 can be connected in parallel with power supply V1, series-connected switches Q5 and Q6 can be connected in parallel with power supply V1, and series-connected switches Q7 and Q8 can be connected in parallel with power supply V1. Series-connected switches Q1 and Q2, series-connected switches Q3 and Q4, series-connected switches Q5 and Q6, and series-connected switches Q7 and Q8 can be connected in parallel with each other. A node between the series-connected switches Q1 and Q2 can be connected to a sub-inductor L1 of the inductor 3a, a node between the series-connected switches Q3 and Q4 can be connected to a sub-inductor L2 of the inductor 3a, a node between the series-connected switches Q5 and Q6 can be connected to a sub-inductor L3 of the inductor 3a, and a node between the series-connected switches Q7 and Q8 can be connected to a sub-inductor L4 of the inductor 3a. The inductor 3a of the submodule 10 can be connected to a capacitor 4c (C2) on the first substrate 2 of the power supply module 1. The capacitor 4c (C2) can be connected in parallel with the current source I1.

[0047] Second Preferred Embodiment 7 to 13 show a power supply module 11 according to a second preferred embodiment of the present invention. The power supply module 11 of the second preferred embodiment is similar to the power supply module 1, except that the sub-modules of the power supply module 11 have a different arrangement compared to the sub-modules of the power supply module 1.

[0048] As shown in FIGS. 7-9, the power supply module 11 may include six submodules mounted on a first substrate 12. Alternatively, any number of submodules may be used. Each submodule may include a second substrate and associated electronic components. Depending on the design of the power supply module, the power supply module 11 may include active devices such as power elements mounted on the first substrate 12, and may also include passive devices such as resistors, capacitors, and inductors mounted on the first substrate 12. For example, the power supply module 11 may include one or more control integrated circuits (ICs). Any suitable control ICs may be used, and the number, type, and placement of the ICs depend on the design of the power supply module.

[0049] Each sub-module may include active devices such as power elements and passive devices such as resistors, capacitors, and inductors, depending on the design of the sub-module. Each sub-module may also include a heat sink. While the sub-modules in Figures 7-9 are identical or similar, it is possible to provide sub-modules with different arrangements and / or functions.

[0050] As shown in Figures 7 to 10, the power supply module 11 includes inductors 13a, 13b, and 13c (only three inductors are shown in Figure 8), capacitors 14a, 14b, 14c, 14d, 14e, 14f, 14g, and 14h mounted on the main surface of the first substrate 2, control ICs 15a and 15b, ground terminals 22a and 22b, voltage input terminals 23a and 23b, and signal transmission substrates 24a, 24b, 24c, 24d, 24e, and 24f under a metal plate 21. As shown in Figure 8, electronic components such as capacitors 14c, 14d, and 14e may be disposed under portions of the respective inductors 13a, 13b, and 13c. Ground terminals 25a and 25b may extend from both ends of the respective second substrates 16a, 16b, 16c, 16d, 16e, and 16f. The voltage input terminals 26a and 26b may extend from both ends of each of the second substrates 16a, 16b, 16c, 16d, 16e, and 16f. The ground terminals 25a and 25b may be located inside the voltage input terminals 26a and 26b.

[0051] Although Figure 8 shows only three sub-modules, it may also include three additional sub-modules positioned adjacent to the three sub-modules shown in Figure 8, as shown in Figures 7, 9, and 10. As shown in Figure 8, the power supply module 11 may include:

[0052] 1. A first sub-module including a second substrate 16a, a signal transmission substrate 27a extending between the second substrate 16a and the first substrate 12, ground terminals 25a, 25b and voltage input terminals 26a, 25b, a capacitor 14f, power elements 17a and 17b and a resistor 18a on the main surface of the second substrate 16a, and a heat sink 19a on the power elements 17a and 17b.

[0053] 2. A second sub-module including a second substrate 16b, a signal transmission substrate 27b extending between the second substrate 16b and the first substrate 12, a ground terminal (not numbered) and a voltage input terminal (not numbered), a capacitor 14g, power elements 17c and 17d, and a resistor 18b on the main surface of the second substrate 16b, and a heat sink 19b above the power elements 17c and 17d.

[0054] 3. A third sub-module including a second substrate 16c, a signal transmission substrate 27c extending between the second substrate 16c and the first substrate 12, a ground terminal (not numbered), and a voltage input terminal (not numbered), a capacitor 14h, power elements 17e and 17f, and a resistor 18c on the main surface of the second substrate 16c, and a heat sink 19c above the power elements 17e and 17f.

[0055] The other three sub-modules arranged in parallel adjacent to the first to third sub-modules may include an arrangement of components similar to that of the first to third sub-modules. As shown in FIGS. 7 to 9, the power supply module 11 can be molded with a metal plate 21 that covers the capacitors 14a and 14b and the control ICs 15a and 15b arranged on the main surface of the first substrate 12.

[0056] Heat sinks 19a-19f may be used to dissipate heat within the power supply modules, although other structures and / or materials may also be used to dissipate heat. In some applications, heat sinks may not be required.

[0057] As shown in FIGS. 7 to 10, the second substrate 16a of the first submodule can be molded with resin 29a so as to cover the electronic components on the main surface of the second substrate 16a that does not face the first substrate 12, the second substrate 16b of the second submodule can be molded with resin 29b so as to cover the electronic components on the main surface of the second substrate 16b that does not face the first substrate 12, and the second substrate 16c of the third submodule can be molded with resin 29c so as to cover the electronic components on the main surface of the second substrate 16c that does not face the first substrate 12. The second substrate 16d of the fourth submodule can be molded with resin 29d so as to cover the electronic components on the main surface of the second substrate 16d that does not face the first substrate 12, the second substrate 16e of the fifth submodule can be molded with resin 29e so as to cover the electronic components on the main surface of the second substrate 16e that does not face the first substrate 12, and the second substrate 16f of the sixth submodule can be molded with resin 29f so as to cover the electronic components on the main surface of the second substrate 16f that does not face the first substrate 12.

[0058] 11A to 12B show an example of a sub-module 20 that can be used with the power supply module 11. FIG. As shown in FIGS. 11A, 11B, and 12A, the submodule 20 may include power elements 17a, 17b, 17g, and 17h, a resistor 18a, and a capacitor 14f on the top surface of the second substrate 16a. As shown in FIG. 12B, the submodule 20 may include an inductor 13a, voltage input terminals 26a and 26b, ground terminals 25a and 25b, and a signal transmission board 27a under the bottom surface of the second substrate 16a. These electronic components may be electrically connected to each other to provide various functions of the submodule 20. The power supply module 11 may be constructed by mounting at least one submodule 10 on the first substrate 12.

[0059] 7, 8, 11A, and 11B, the inductor 13a can be disposed on the main surface of the first substrate 12. The inductors 13a to 13c can be physically connected to the first substrate 12 and each of the second substrates 16a to 16f via a conductive bonding material such as solder.

[0060] As shown in FIGS. 7, 8, 11A, and 11B, for each submodule, the ground terminals 25a and 25b and the voltage input terminals 26a and 26b can be disposed outside the respective inductors 13a-13c along the long side of the main surface of the first substrate 12. As shown in FIGS. 7, 8, 11A, and 11B, for each submodule, the signal transmission boards 27a-27c can be disposed outside the respective inductors 13a along the short side of the main surface of the first substrate 12. For each submodule, the ground terminals 25a and 25b, the voltage input terminals 26a and 26b, and the signal transmission boards 27a-27c can be physically connected to the first substrate 12 and the respective second substrates 16a-16f. For each submodule, the ground terminals 25a and 25b, the voltage input terminals 26a and 26b, and the signal transmission boards 27a-27c can support the respective second substrates 16a-16f. For each sub-module, ground terminals 25a and 25b arranged on the main surface of first substrate 12 and signal transmission substrates 27a to 27c can transmit signals and / or power.

[0061] 4A to 5B, the inductor 13a, the ground terminals 25a and 25b, the voltage input terminals 26a and 26b, and the signal transmission board 27a can be arranged on the lower surface of the second substrate 16a. The inductor 13a, the ground terminals 25a and 25b, the voltage input terminals 26a and 26b, and the signal transmission board 27a are specific examples of electronic components arranged on the lower surface of the second substrate 16a, but other electronic components can be used instead of or in addition to these electronic components.

[0062] 7 to 11B, the second substrates 16a to 16f can be arranged so as to cover the upper surfaces of the inductors 13a to 13c, the ground terminals 25a and 25b, the voltage input terminals 26a and 26b, and the signal transmission substrates 27a to 27c. That is, the second substrates 16a to 16f can be arranged on the surfaces of the inductors 13a to 13c, the ground terminals 25a and 25b, the voltage input terminals 26a and 26b, and the signal transmission substrates 27a to 27c that face the surfaces that contact the first substrate 12.

[0063] 12A, power elements 17a, 17b, 17g, and 17h, capacitor 14f, and resistor 18a may be disposed on the major surface of second substrate 16a that does not face first substrate 12. Any number and arrangement of passive and active devices may be used. For example, any number and arrangement of capacitors, resistors, and power elements may be included in a sub-module.

[0064] As shown in FIGS. 11A to 13, the electronic components of the submodule 10 can be electrically connected via the second substrate 16a. By adopting the structure of the power supply module 11 described above, it is possible to provide a power supply module with a structure that allows for more electronic components to be mounted and allows for high flexibility in design of functions, size, performance, etc.

[0065] By using second substrates 16a to 26f arranged in a direction perpendicular or substantially perpendicular to the main surface of first substrate 12 within the manufacturing error range and / or measurement error range, electronic components can be arranged not only on the main plane of first substrate 12 but also on second substrates 16a to 16f, thereby allowing the use of more electronic components than when only the first substrate is present.

[0066] Furthermore, by using two or more second substrates, adjustments can be made such as reducing the area of ​​each of the second substrates 16a to 16f, which in turn ensures the strength of the second substrates 16a to 16f.

[0067] Furthermore, by changing the shapes and sizes of the first substrate 12 and the second substrates 16a to 16f, the number, shapes, and sizes of the electronic components in the power supply module can be changed. The number and type of electronic components in the sub-module 20 can be varied to provide power supply modules with a variety of functions.

[0068] In the power supply module 11, two or more sub-modules 20 can be disposed on the main surface of the first substrate 12. For example, a greater power output can be achieved by increasing the number of sub-modules 20. When multiple sub-modules 20 are used, the sub-modules 20 can be electrically connected to each other.

[0069] When viewed from above, the power supply module 11 is molded so that the first substrate 12 is covered by the metal plate 21 that does not overlap the second substrates 16a to 16f. This ensures the strength of the first substrate 12.

[0070] FIG. 13 shows a possible circuit diagram including components within the submodule 20 and on the first board 12 of the power supply module 11. Capacitor 14f (C1) of the submodule 20 can be connected in parallel with power supply V1. Power elements 17a, 17b, 17g, and 17h can be used to drive switches Q1-Q8 within the submodule 20. Series-connected switches Q1 and Q2 can be connected in parallel with power supply V1, series-connected switches Q3 and Q4 can be connected in parallel to power supply V1, series-connected switches Q5 and Q6 can be connected in parallel to power supply V1, and series-connected switches Q7 and Q8 can be connected in parallel to power supply V1. Series-connected switches Q1 and Q2, series-connected switches Q3 and Q4, series-connected switches Q5 and Q6, and series-connected switches Q7 and Q8 can be connected in parallel with each other. A node between the series-connected switches Q1 and Q2 can be connected to a sub-inductor L1 of the inductor 3a, a node between the series-connected switches Q3 and Q4 can be connected to a sub-inductor L2 of the inductor 3a, a node between the series-connected switches Q5 and Q6 can be connected to a sub-inductor L3 of the inductor 3a, and a node between the series-connected switches Q7 and Q8 can be connected to a sub-inductor L4 of the inductor 3a. The inductor 3a of the submodule s0 can be connected to a capacitor 14c (C2) on the first substrate 2 of the power supply module 1. The capacitor 14c (C2) can be connected in parallel with the current source I1.

[0071] It should be understood that the foregoing description is only illustrative of the present invention. Various alternatives and modifications may be devised by those skilled in the art without departing from the invention. Accordingly, the present invention is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the appended claims.

Claims

1. 1. A power supply module, comprising: a first substrate; a control IC, a capacitor, an inductor, a ground terminal, a voltage input terminal, and a signal transmission substrate on a main surface of the first substrate; A submodule, a second substrate on the inductor, the ground terminal, the voltage input terminal, and the signal transmission substrate; a submodule including a fifth electronic component, a sixth electronic component, and a seventh electronic component on a first main surface of the second substrate opposite to the first substrate, At least one of the ground terminal and the voltage input terminal extends from a main surface of the first substrate to a second main surface of the second substrate facing the first substrate. Power supply module.

2. A module as described in claim 1, wherein the inductor is mounted between the first substrate and the second substrate and extends from a main surface of the first substrate to a second main surface of the second substrate.

3. The module described in claim 1, wherein the ground terminal extends from the main surface of the first substrate to the second main surface of the second substrate.

4. A module as described in claim 1, wherein the voltage input terminal extends from the main surface of the first substrate to the second main surface of the second substrate.

5. The module described in claim 1, wherein the signal transmission substrate extends from a main surface of the first substrate to a second main surface of the second substrate.

6. The module according to claim 1 , wherein the fifth electronic component is a power element.

7. The module of claim 6 further comprising a heat sink over the power device.

8. The module of claim 1 , wherein the sixth electronic component is a capacitor.

9. The module of claim 1 , wherein the seventh electronic component is a resistor.

10. The module according to any one of claims 1 to 9, further comprising one or more additional sub-modules, said sub-module and said one or more additional sub-modules being electrically connected to each other.

11. 1. A power supply module, comprising: a first substrate; a control IC, a capacitor, an inductor, a ground terminal, a voltage input terminal, and a signal transmission substrate on a main surface of the first substrate; A submodule, a second substrate on the inductor, the ground terminal, the voltage input terminal, and the signal transmission substrate; a submodule including a fifth electronic component, a sixth electronic component, and a seventh electronic component on a first main surface of the second substrate opposite to the first substrate; the ground terminal is adjacent to the signal transmission board while being spaced apart from the signal transmission board; The power supply module, wherein the ground terminal is adjacent to the voltage input terminal.

12. A module as described in claim 11, wherein the inductor is mounted between the first substrate and the second substrate and extends from a main surface of the first substrate to a second main surface of the second substrate facing the first substrate.

13. A module as described in claim 11, wherein the ground terminal extends from a main surface of the first substrate to a second main surface of the second substrate facing the first substrate.

14. A module as described in claim 11, wherein the voltage input terminal extends from a main surface of the first substrate to a second main surface of the second substrate facing the first substrate.

15. A module as described in claim 11, wherein the signal transmission board extends from a main surface of the first board to a second main surface of the second board facing the first board.

16. The module of claim 11 , wherein the fifth electronic component is a power element.

17. The module of claim 16 further comprising a heat sink over the power device.

18. The module of claim 11 , wherein the sixth electronic component is a capacitor.

19. The module of claim 11 , wherein the seventh electronic component is a resistor.

20. The module of any one of claims 11 to 19, further comprising one or more additional sub-modules, the sub-module and the one or more additional sub-modules being electrically connected to each other.

21. 1. A power supply module, comprising: a first substrate; a first sub-module and a second sub-module, each of the first sub-module and the second sub-module comprising: a second substrate; a signal transmission board connected between the first board and the second board; a ground terminal connected between the first substrate and the second substrate; a voltage input terminal connected between the first substrate and the second substrate; a power element on a first main surface of the second substrate opposite to the first substrate; an inductor mounted between the first substrate and the second substrate and electrically connected to the power element; a first sub-module and a second sub-module, each of which has the ground terminal and the voltage input terminal spaced apart from the signal transmission board, respectively;

22. further comprising a third sub-module and a fourth sub-module; the first sub-module and the second sub-module are arranged in a first line; 22. The module of claim 21, wherein the third sub-module and the fourth sub-module are disposed in a second line adjacent to the first line.

23. 23. The module of claim 21 or 22, further comprising a control IC on the first substrate.

24. further comprising a first electronic component and a second electronic component mounted on the first substrate; the first electronic component is located under a portion of the inductor of the first sub-module; 23. The module of claim 21 or 22, wherein the second electronic component underlies a portion of the second sub-module.

25. The ground terminal includes a first ground terminal and a second ground terminal, the first ground terminal is connected between the first substrate and a first end of the second substrate; the second ground terminal is connected between the first substrate and a second end of the second substrate; 23. The module of claim 21 or 22, wherein the inductor is located between the first ground terminal and the second ground terminal.

26. 23. The module of claim 21 or 22, wherein the first sub-module and the second sub-module each include a heat sink over the power device.

27. 23. The module of claim 21 or 22, wherein the first sub-module and the second sub-module are electrically connected.

28. The ground terminal includes a first ground terminal and a second ground terminal, the first ground terminal is connected between the first substrate and a first end of the second substrate; the second ground terminal is connected between the first substrate and a second end of the second substrate; 23. The module of claim 21 or 22, wherein the voltage input terminal is located between the first ground terminal and the second ground terminal.

29. A module as described in claim 21 or 22, wherein at least one of the ground terminal and the voltage input terminal extends from a main surface of the first substrate to a second main surface of the second substrate facing the first substrate.

30. The ground terminal includes a first ground terminal and a second ground terminal, the first ground terminal is connected between the first substrate and a first end of the second substrate; the second ground terminal is connected between the first substrate and a second end of the second substrate; the first ground terminal is adjacent to the signal transmission board; 23. The module of claim 21 or 22, wherein the second ground terminal is adjacent to the voltage input terminal.

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