Backscattered electron (BSE) imaging in tilt-mode SEM using cap bias voltage

Abstract

1. A method for evaluating a region of a sample, the method comprising: placing the sample in a vacuum chamber; generating an electron beam using a scanning electron microscope (SEM) column having an electron gun at one end and a column cap at an opposite end; focusing the electron beam on the sample while operating the SEM column in a tilt mode, and scanning the focused electron beam over the region of the sample to generate secondary and backscattered electrons from within the region; and collecting the backscattered electrons with one or more detectors while applying a negative bias voltage to the column cap to alter the trajectory of the secondary electrons to prevent them from reaching the one or more detectors.

Description

[Technical Field]

[0001] cross reference This application claims priority to U.S. Patent Application No. 17 / 243,478, filed April 28, 2021, the disclosure of which is incorporated herein by reference in its entirety for all purposes. [Background technology]

[0002] In the study of electronic materials and the processes used to fabricate such materials into electronic structures, specimens of the electronic structures can be subjected to microscopic examination for the purposes of failure analysis and device validation. For example, specimens of electronic structures such as silicon wafers can be analyzed with a scanning electron microscope (SEM) to study certain characteristic features of the wafer. Such characteristic features may include the fabricated circuits or defects formed during the manufacturing process. The electron microscope is one of the most useful instruments for analyzing the microstructure of semiconductor devices.

[0003] When a sample is inspected with an electron beam from an SEM tool, secondary electrons and backscattered electrons are generated as the electron beam strikes the sample. Secondary electrons originate from atoms in the sample itself and are the result of inelastic interactions between the electron beam and the sample. Secondary electrons are relatively low in energy (e.g., 0-20 eV) and originate from or near the surface of the sample. Backscattered electrons (BSEs) are reflected after elastic interactions between the beam and the sample. Backscattered electrons may have energy levels close to those of the electron beam and therefore may originate from deeper regions of the sample.

[0004] These and other differences allow secondary electrons and backscattered electrons to provide different types of information: secondary electrons can provide detailed surface information about a sample, while backscattered electrons are highly sensitive to differences in atomic number, which helps provide material contrast when imaging an object.

[0005] Typically, the secondary electron yield is much greater than the backscattered electron yield. Therefore, when collecting backscattered electrons, the secondary electron signal must be suppressed to accurately view the backscattered electron signal. In typical SEM tools, this is done by placing an energy filter between the sample and the detector, which blocks the relatively low-energy secondary electrons from reaching the detector. While this approach has been used successfully in the past, new methods for detecting backscattered electrons are desired. Summary of the Invention

[0006] Some embodiments of the present disclosure relate to improved methods and techniques for collecting backscattered electrons when imaging a sample with a scanning electron microscope. The collected electrons can be used to characterize the sample, such as by providing material contrast.

[0007] In some embodiments, a method for evaluating a region of a sample includes placing the sample in a vacuum chamber; generating an electron beam using a scanning electron microscope (SEM) column having an electron gun at one end and a column cap at the opposite end; focusing the electron beam on the sample while operating the SEM column in a tilt mode; and generating secondary electrons and backscattered electrons from within the region by scanning the focused electron beam over a region of the sample; and collecting the backscattered electrons with one or more detectors while applying a negative bias voltage to the column cap to alter the trajectory of the secondary electrons, thereby preventing them from reaching the one or more detectors.

[0008] Various implementations of the embodiments described herein may include one or more of the following features: generating an image of at least a portion of the region from the detected backscattered electrons; applying a negative bias of minus 50 volts and minus 1000 volts to the column cap; applying a negative bias of between minus 100 and minus 500 volts to the column cap; the column cap may be conical with an opening at its tip through which the electron beam can be projected; the backscattered electrons may be collected by an in-lens detector and a top detector; the backscattered electrons may be collected by an external detector.

[0009] Some embodiments relate to a non-transitory computer-readable medium storing instructions for performing an X-ray spectroscopy surface material analysis of a region of a sample according to any of the methods described above or herein, for example, by placing the sample in a vacuum chamber, generating an electron beam using a scanning electron microscope (SEM) column having an electron gun at one end and a column cap at the opposite end, focusing the electron beam onto the sample while operating the SEM column in a tilt mode, scanning the focused electron beam over a region of the sample to generate secondary electrons and backscattered electrons from within the region, and collecting the backscattered electrons with one or more detectors while applying a negative bias voltage to the column cap to alter the trajectory of the secondary electrons, thereby preventing the secondary electrons from reaching the one or more detectors during the scan.

[0010] Some embodiments relate to a system for performing X-ray spectroscopy surface material analysis of a region of a sample according to any of the methods described above or herein. For example, the system may include a vacuum chamber, a sample support configured to hold the sample within the vacuum chamber during the sample evaluation process, a scanning electron microscope (SEM) column configured to direct a charged particle beam into the vacuum chamber toward the sample, the SEM column including an electron gun at one end of the column and a column cap at the other end of the column, a detector configured to detect backscattered electrons, a processor, and a memory coupled to the processor. The memory may include a plurality of computer-readable instructions that, when executed by the processor, cause the system to place a sample in a vacuum chamber, generate an electron beam using a scanning electron microscope (SEM) column having an electron gun at one end and a column cap at the opposite end, focus the electron beam on the sample while operating the SEM column in a tilt mode, scan the focused electron beam over an area of ​​the sample to generate secondary electrons and backscattered electrons from within the area, and collect the backscattered electrons with one or more detectors while applying a negative bias voltage to the column cap to alter the trajectory of the secondary electrons, thereby preventing them from reaching the one or more detectors.

[0011] For a better understanding of the nature and advantages of the present disclosure, reference should be made to the following description and accompanying drawings, with the understanding that each figure is provided for illustrative purposes only and is not intended to define limitations on the scope of the present disclosure. Furthermore, as a general rule, unless otherwise clear from the description, when elements in different figures use the same reference numerals, those elements are generally identical or at least similar in function or purpose. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a simplified diagram of a sample evaluation system according to some embodiments of the present disclosure. [Figure 2]1 is a simplified diagram illustrating an example of the path of backscattered electrons generated from a sample when the sample is struck by an electron beam produced by an SEM column. [Figure 3] FIG. 1 is a simplified diagram showing the placement of an energy filter in an example of a known SEM column. [Figure 4] 1 is a simplified flowchart illustrating steps associated with some embodiments according to the present disclosure. [Figure 5A] FIG. 10 is a simplified diagram illustrating an example of the effect on secondary electron trajectories when a negative bias voltage is applied to a column cap, according to some embodiments. [Figure 5B] 1 is a simplified diagram illustrating an example of the effect on the trajectories of backscattered electrons when a negative bias voltage is applied to a column cap, according to some embodiments. [Figure 6A] FIG. 10 is a simplified diagram showing an example of a trajectory of secondary electrons when no bias voltage is applied to the column cap. [Figure 6B] FIG. 10 is a simplified diagram showing an example of the trajectory of backscattered electrons when no bias voltage is applied to the column cap. [Figure 7] 1 is a simplified diagram of a sample evaluation system including an external detector, according to some embodiments of the present disclosure. [Figure 8] 1 is a simplified diagram of an area on a semiconductor wafer where backscattered electrons are collected, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0013] Embodiments of the present disclosure relate to improved methods and techniques for collecting backscattered electrons when imaging a sample with a scanning electron microscope.

[0014] Sample assessment tool example To better understand and appreciate the present disclosure, reference is first made to Figure 1, which is a simplified schematic diagram of a sample evaluation system 100 according to some embodiments of the present disclosure. The sample evaluation system 100 can be used for defect review and analysis of structures formed on a sample, such as a semiconductor wafer, among other operations.

[0015] The system 100 can include a vacuum chamber 110 along with a scanning electron microscope (SEM) column 120. A support element 150 can support a sample 145 (e.g., a semiconductor wafer) within the chamber 110 during processing operations in which the sample 145 (sometimes referred to herein as an "object" or "specimen") is exposed to a charged particle beam 126 from the SEM column.

[0016] The SEM column 120 is connected to the vacuum chamber 110 such that a charged particle beam generated by the column propagates through a vacuum environment formed within the vacuum chamber 110 before impinging on the sample 145. The SEM column 120 can generate an image of a portion of the sample 145 by irradiating the sample with a charged particle beam 126, detecting particles emitted by the irradiation, and generating a charged particle image based on the detected particles. To this end, the SEM column 120 can include an electron beam source 122 (i.e., an "electron gun"), an anode tube 128 that defines an electron beam drift space, a condenser lens assembly 124, one or more deflection lenses such as lenses 130, 132, one or more focusing lenses 134, and a column cap 136.

[0017] During imaging, electron beam source 122 generates electron beam 126, which passes through condenser lens 124, where it is first converged by condenser lens 124 and then focused by lens 134 before striking sample 145. Condenser lens 124 defines the aperture number and current (along with the final aperture) of the electron beam, which directly relates to resolution, and focusing lens 134 focuses the beam onto the sample. Column cap 136, located between the bottom end of anode tube 128 (first electrode) and sample 145 (second electrode), can be a third electrode in the system that adjusts the electric field generated in the vicinity of the wafer.

[0018] The particle imaging process typically involves scanning a charged particle beam back and forth (e.g., in a raster or other scan pattern) over a specific area of ​​the sample to be imaged. The deflection lenses 130, 132 can be magnetic, electrostatic, or a combination of both electric and magnetic lenses to achieve the scan pattern as known to those skilled in the art. The scanned area is typically a small portion of the total area of ​​the sample. For example, the sample may be a 200 or 300 mm diameter semiconductor wafer, and each scanned area on the wafer may be a rectangular area with width and / or length measured in microns or tens of microns.

[0019] The SEM column 120 may also include one or more detectors for detecting charged particles generated from the sample during the imaging process. For example, the SEM column 120 may include an in-lens detector 142 and a top detector 144, which may be configured to detect secondary electrons and backscattered electrons emitted as a result of irradiation of the sample by the charged particle beam 126. The in-lens detector 142 may include a central opening that allows the charged particle beam 126 to pass through the detector and that allows both secondary electrons and backscattered electrons entering the charged particle column 120 to pass through the detector 142 and reach the top detector 144. In some embodiments, the sample evaluation system 120 may also include an external detector (described below with respect to FIG. 6 ), which may also be configured to detect secondary electrons and backscattered electrons.

[0020] Additionally, system 100 can include voltage supply 160 and one or more controllers 170, such as processors or other hardware units. The voltage supply can be operated to provide the required effective voltage to the column, thereby improving image resolution. This can be achieved by appropriately distributing the voltage supply between the first and second electrodes (i.e., between the anode tube and the sample). Controller 170 can control the operation of the system, including voltage supply 160, by executing computer instructions stored in one or more computer-readable memories 180, as known to those skilled in the art. By way of example, computer-readable memory can include solid-state memory (such as random access memory (RAM) and / or read-only memory (ROM) that may be programmable, flash-updateable, etc.), a disk drive, an optical storage device, or a similar non-transitory computer-readable storage medium.

[0021] As shown in FIG. 1 , in some embodiments, the SEM column 120 can be tilted at a non-perpendicular angle relative to the sample 145. For example, as shown in FIG. 1 , the column 120 can be tilted at a 45-degree angle relative to the substantially flat top surface of the sample 145. To allow for tilting of the column 120, the cap 136 can have a conical shape that allows the column to be positioned very close to the sample 145 without the column cap 136 colliding with the sample. Additionally, as described below, in some embodiments, the SEM column 120 does not include an energy filter, which is used by some SEM tools to prevent secondary electrons from reaching the in-lens detector 142. Alternatively, in some embodiments, the SEM column 120 can include an energy filter, but can also be used to evaluate a sample without the energy filter activated.

[0022] Challenges in collecting backscattered electrons As mentioned above, some embodiments collect backscattered electrons without using an energy filter to suppress secondary ion signals. To better understand the advantages and benefits of some embodiments, refer to FIG. 2, which is a simplified schematic diagram of a portion of an SEM column 200 spaced apart from a sample 245. The SEM column 200 may represent the SEM column 120 shown in FIG. 1. For ease of illustration, only selected elements of the SEM column 200 are shown in FIG. 2. As shown, the SEM column 200 includes a column cap 236 at the distal end of the column, an in-lens detector 242, and a top detector 244. A portion of the anode tube 210 is also shown.

[0023] During imaging operations, the SEM column 200 generates an electron beam (not shown) and directs it so that it strikes the sample 245. The interaction of the electron beam with the sample 245 generates various secondary and backscattered electrons that travel away from the sample in all directions. The paths of some of the generated electrons are shown as path 250, path 252, and path 254. As shown, some of the generated electrons travel away from the SEM column along path 250 and therefore cannot reach either detector 242 or 244, some of the generated electrons travel along path 252, which enters the SEM column on a trajectory that causes the electrons to strike the in-lens detector 242, and some of the generated electrons travel along path 254, which enters the SEM column on a trajectory that allows the electrons to pass through the central opening of the in-lens detector 242 and reach the top detector 244.

[0024] In some known SEM tools configured to collect backscattered electrons, the SEM column includes an energy filter 310, as shown in FIG. 3. The energy filter 310 can separate backscattered electrons from secondary electrons by preventing electrons below a predetermined energy level from passing through the filter, and is typically positioned immediately before the top detector 244. Thus, an evaluation system including the SEM column 300 can observe only backscattered electrons that reach the top detector 244 via path 254. Electrons traveling along path 252 and reaching the detector 242 will include both secondary and backscattered electrons. Because the detector 242 cannot distinguish between different types of electrons, the in-lens detector 242 cannot be used to separate the backscattered electron signal from the secondary electron signal. Furthermore, backscattered electrons that follow path 250 will not reach either detector 242 or 244.

[0025] Applying a negative bias to the column cap According to some embodiments disclosed herein, the SEM column (e.g., column 120 or 200) can be operated in a tilted mode (e.g., at a 45 degree angle or other non-perpendicular angle to the sample) and can apply a negative bias voltage to the column cap during the imaging process to suppress secondary electrons from reaching any of the electron detectors (including the in-lens detector 142, 242 and the top detector 144, 244, which are farther from the sample than the column cap).

[0026] 4 is a simplified flowchart illustrating steps associated with a method 400 of imaging a sample according to some embodiments. Method 400 begins with placing a sample in a processing chamber of a sample evaluation system (step 410). The processing chamber, such as chamber 110, may include an SEM column operable in tilt mode and one or more electron detectors, such as in-lens detector 142 or top detector 144. Step 410 may include placing a sample, such as sample 145, on a sample support, such as support 150, within the vacuum chamber.

[0027] A negative bias voltage is then applied to the column cap (step 420), and the SEM column is activated to generate an electron beam (step 430), which is focused and scanned across an area of ​​interest on the sample (step 440). The electron beam may be focused by a focusing lens, such as lens 134, and scanned across an area of ​​the substrate by one or more deflection lenses, such as lenses 130 and 132.

[0028] A negative bias voltage is applied to the column cap while the electron beam is scanned across the region of interest. The negative bias voltage must be high enough to suppress secondary electrons, but not so high that it affects the electron beam 126 and adversely affects the image resolution. While the negative bias voltage is applied to the column cap and the electron beam is scanned across the region of interest, backscattered electrons can be collected by a suitable detector, such as the in-lens detector 142 or the top detector 144 (step 450). In a practical implementation, steps 430, 440, and 450 can be performed essentially simultaneously and can be very fast.

[0029] In some embodiments, the negative bias voltage may be the minimum voltage necessary to suppress secondary electrons. The appropriate value of the negative bias voltage depends in part on the geometry of the column cap and can be determined by simulation or experiment, as can be readily determined by one skilled in the art. In some embodiments, the bias voltage may be between minus 50 volts and minus 1000 volts, and in other embodiments, the bias voltage may be between minus 100 volts and minus 500 volts.

[0030] 5A and 5B are simplified diagrams illustrating the effect of applying a negative bias to the cap of an SEM column 500, according to some embodiments. The SEM column 500 can be representative of the SEM columns 120 or 200 described above. Specifically, FIG. 5A illustrates the effect of applying a negative voltage of 200 volts to the cap 236 of the SEM column 500 on secondary electrons 510 generated during an imaging operation, and FIG. 5B illustrates the effect of applying the same negative voltage (200 volts) to the cap 236 on backscattered electrons 520. In each of FIGS. 5A and 5B, the SEM column 500 generates a 1 kV electron beam during the imaging process.

[0031] 5A and 5B , based on simulation results, it is clear that the negative voltage repels lower energy secondary electrons, preventing secondary electrons 510 from entering SEM column 500. Therefore, applying a negative cap voltage ensures that secondary electrons 510 cannot reach either the in-lens detector or the top detector (not shown in FIGS. 5A or 5B ) within column 500. In contrast, applying a negative voltage to cap 236 minimizes the effect on the more energetic backscattered electrons 520. Thus, some of the backscattered electrons travel along the path they took to enter the SEM column and reach either the in-lens or top detector, allowing the in-lens detector within the column to provide a backscatter signal without the use of a separate filter.

[0032] 6A and 6B are simplified diagrams of a portion of an SEM column 500 illustrating example paths of electrons generated during imaging when no bias is applied to the electron cap (i.e., a bias of 0 volts). Specifically, FIG. 6A illustrates example trajectories of secondary electrons 610 when no bias voltage is applied to the cap 236, and FIG. 6B illustrates example trajectories of backscattered electrons 620 when no bias is applied to the cap 236. As can be seen in FIG. 6B, the trajectories of the backscattered electrons 620 are substantially the same as the trajectories of the backscattered electrons 520 illustrated in FIG. 5B when a negative bias of 200 volts is applied to the cap. However, as shown in FIG. 6A, without a negative cap bias, some secondary electrons 610 may enter the SEM column 500 and reach the lens or one of the upper detectors. Because the detector cannot distinguish between secondary electrons and backscattered electrons, the secondary electrons contaminate the detector signal, resulting in an inaccurate backscattered signal.

[0033] Sample evaluation tool with external detector A sample evaluation system according to some embodiments can include an external detector that can be used to detect backscattered electrons. The external detector can be used in addition to, or instead of, one or both of the in-lens detector and top detector described above. FIG. 7 is a simplified schematic diagram of a sample evaluation system 700 according to some embodiments of the present disclosure. Sample evaluation system 700 can be similar to evaluation system 100, except that it includes an external detector 710. For convenience, other elements of evaluation system 700 that are similar to elements of evaluation system 100 are labeled with the same reference numerals and will not be described below.

[0034] During the sample evaluation process, the SEM column 120 of the evaluation system 700 may be tilted relative to the sample 145, as described above with respect to FIG. 1 . As shown in FIG. 7 , the external detector 710 may be positioned away from the SEM column cap 136 to collect electrons generated from the sample 145 when the sample is irradiated with the electron beam 126. While the in-lens detector 142 and the top detector 144 are limited to detecting backscattered electrons that enter the SEM column through the opening in the cap 136, the external detector 710 may detect backscattered electrons whose trajectories lead the electrons away from the SEM column. Embodiments may apply a negative voltage to the cap 136 during the imaging process to suppress secondary electron signals (i.e., prevent secondary electrons from reaching the external detector 710), ensuring that the external detector 710 collects a signal that includes primarily or only backscattered electrons.

[0035] Example of sample to be imaged To provide context for some aspects of the embodiments described in this disclosure, reference is made to FIG. 8 . FIG. 8 is a simplified diagram of an area on a semiconductor wafer, which may include multiple areas at different locations on the wafer from which backscattered electrons can be collected to evaluate a sample according to some embodiments. Specifically, FIG. 8 includes a top view of wafer 800 along with two enlarged views of specific portions of wafer 800. Wafer 800 may be, for example, a 200 mm or 300 mm semiconductor wafer and may include multiple integrated circuits 810 (52 in the illustrated example) formed thereon. Integrated circuits 810 may be at an intermediate stage of fabrication, and one or more regions 820 of the integrated circuits may be evaluated and analyzed using the sample evaluation techniques described herein. For example, enlarged view A of FIG. 8 illustrates multiple regions 820 of one of integrated circuits 810 that may be evaluated and analyzed according to the techniques described herein. Enlarged view B illustrates one of regions 820 including different features formed therein.

[0036] Embodiments of the present disclosure can analyze and evaluate region 820 using, for example, method 400 described above with respect to Figure 4. Evaluation can be performed by scanning an SEM beam back and forth within region 820 according to a raster pattern, such as scan pattern 830 shown in simplified form in close-up B of Figure 8.

[0037] Additional Embodiments The foregoing descriptions of the specific embodiments described herein have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. Moreover, while different embodiments of the present disclosure have been disclosed above, the specific details of the particular embodiments can be combined in any suitable manner without departing from the spirit and scope of the embodiments of the present disclosure. Moreover, it will be apparent to those skilled in the art that numerous modifications and variations are possible in light of the above teachings.

[0038] References in the above specification to a method should apply mutatis mutandis to a system capable of carrying out the method and should also apply mutatis mutandis to a computer program product storing instructions that, once executed, perform the method. Similarly, references in the above specification to a system should also apply mutatis mutandis to a method that can be carried out by the system and should also apply mutatis mutandis to a computer program product storing instructions that can be executed by the system, and references in the specification to a computer program product should also apply mutatis mutandis to a method that is performed when executing instructions stored in the computer program product and should also apply mutatis mutandis to a system configured to execute instructions stored in the computer program product.

[0039] To the extent that the illustrated embodiments of the present disclosure can be implemented using electronic components and circuits known to those skilled in the art, such details will not be described more than is deemed necessary for an understanding and appreciation of the underlying concepts of the present disclosure and so as not to obscure or distract from the teachings of the present disclosure, as described above.

Claims

1. 1. A method of evaluating a region of a sample, the method comprising: placing a sample in a vacuum chamber; generating an electron beam using a scanning electron microscope (SEM) column with an electron gun at one end of the column and a column cap at an opposite end of the column, the column cap having a conical shape; focusing the electron beam on the sample and scanning the focused electron beam across the region of the sample while operating the SEM column in a tilt mode to generate secondary electrons and backscattered electrons from within the region; During the scan, applying a negative bias voltage to the column cap to change the trajectory of the secondary electrons, thereby preventing the secondary electrons from reaching an in-lens detector and an upper detector in the SEM column, while the backscattered electrons impinge on the in-lens detector and pass through an opening in the in-lens detector to reach the upper detector, thereby collecting the backscattered electrons with the in-lens detector and the upper detector; A method for assessing an area of ​​a sample, including:

2. The method of claim 1 , further comprising generating an image of at least a portion of the region from the collected backscattered electrons.

3. 10. The method of claim 1, wherein applying a negative bias to the column cap comprises applying a bias voltage between minus 50 volts and minus 1000 volts.

4. 10. The method of claim 1, wherein applying a negative bias to the column cap comprises applying a bias voltage between minus 100 volts and minus 500 volts.

5. 2. The method of claim 1, wherein the column cap has an opening at a tip of the cone shape, and the method includes irradiating the electron beam through the opening of the cone shape.

6. The method of claim 1 , wherein collecting backscattered electrons comprises collecting the backscattered electrons using an external detector.

7. 1. A system for evaluating an area of ​​a sample, comprising: a vacuum chamber; a sample support configured to hold a sample within the vacuum chamber during a sample evaluation process; a scanning electron microscope (SEM) column configured to project a charged particle beam into the vacuum chamber toward the sample, the SEM column including an electron gun at one end of the column and a column cap at an opposite end of the column, the column cap having a conical shape; a detector configured to detect backscattered electrons; a processor and a memory connected to said processor; When executed by the processor, the memory provides the system with: Place the sample in a vacuum chamber generating an electron beam in the scanning electron microscope (SEM) column; focusing the electron beam onto the sample and scanning the focused electron beam across the region of the sample while operating the SEM column in a tilt mode to generate secondary electrons and backscattered electrons from within the region; While the electron beam is scanned across the region, a negative bias voltage is applied to the column cap to change the trajectory of the secondary electrons, thereby preventing the secondary electrons from reaching an in-lens detector and a top detector in the SEM column, while the backscattered electrons impinge on the in-lens detector and pass through an opening in the in-lens detector to the top detector, thereby collecting the backscattered electrons at the in-lens detector and the top detector. A system comprising a plurality of computer-readable instructions for causing a

8. The system of claim 7 , wherein the plurality of computer-readable instructions, when executed by the processor, further cause the system to generate an image of at least a portion of the region from the detected backscattered electrons.

9. 8. The system of claim 7, wherein applying a negative bias to the column cap comprises applying a bias voltage between minus 50 volts and minus 1000 volts.

10. 8. The system of claim 7, wherein applying a negative bias to the column cap comprises applying a bias voltage between minus 100 volts and minus 500 volts.

11. The system of claim 7 , wherein the column cap has an opening at a tip of the cone shape, and the electron beam is irradiated through the opening of the cone shape.

12. The system of claim 7 , wherein the system comprises an external detector.

13. a non-transitory computer readable memory storing a plurality of computer readable instructions for evaluating an area of ​​a sample, the non-transitory computer readable memory including: Place the sample in a vacuum chamber generating the electron beam using a scanning electron microscope (SEM) column having an electron gun at one end of the column and a column cap at an opposite end of the column, the column cap having a conical shape; focusing the electron beam onto the sample and scanning the focused electron beam across the region of the sample while operating the SEM column in a tilt mode to generate secondary electrons and backscattered electrons from within the region; During the scan, a negative bias voltage is applied to the column cap to change the trajectory of the secondary electrons, thereby preventing the secondary electrons from reaching an in-lens detector and an upper detector in the SEM column, while the backscattered electrons collide with the in-lens detector and pass through an opening in the in-lens detector to reach the upper detector, thereby collecting the backscattered electrons at the in-lens detector and the upper detector. and a non-transitory computer readable memory configured to evaluate the region of the sample by:

14. 14. The non-transitory computer readable memory of claim 13, wherein the plurality of computer readable instructions for evaluating a region of a sample further comprises instructions for generating an image of at least a portion of the region from the collected backscattered electrons.

15. 14. The non-transitory computer-readable memory of claim 13, wherein applying a negative bias to the column cap comprises applying a bias voltage between minus 50 volts and minus 1000 volts.

16. 14. The non-transitory computer-readable memory of claim 13, wherein applying a negative bias to the column cap comprises applying a bias voltage between minus 100 volts and minus 500 volts.

17. 14. The non-transitory computer-readable memory of claim 13, wherein focusing the electron beam on the sample and scanning the focused electron beam across the region of the sample comprises irradiating the electron beam through an opening in a tip of the column cap.

Images