Cooling devices for electronic devices

The cooling device addresses the issue of obstructed airflow in miniaturized electronic devices by branching air flow and using ribs to enhance heat dissipation, ensuring effective cooling despite downstream components.

JP7776400B2Active Publication Date: 2025-11-26TOSHIBA TEC KK
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Patent Information

Application Number
JP2022178571
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-11-08
Publication Date
2025-11-26
Estimated Expiration
2042-11-08

AI Technical Summary

Technical Problem

The miniaturization of electronic devices often results in components being placed downstream of the heat sink, obstructing the smooth flow of air and reducing heat dissipation performance.

Method used

A cooling device with an air intake port, heat sink, branch wall, and multiple ribs that branch the air flow into two directions, allowing for separate exhaust ports to bypass obstacles, and ribs that increase the apparent surface area of the heat sink for improved cooling.

Benefits of technology

The device achieves effective heat dissipation even with components downstream of the heat sink, enabling miniaturization while maintaining high cooling performance by maximizing the heat sink's surface area and ensuring smooth airflow.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a cooling device for an electronic apparatus that can obtain good heat radiation performance even when there is an obstacle on the leeward side of a heat sink.SOLUTION: A fan duct (cooling device) comprises: an intake port from which air is introduced by a fan; a heat sink that allows the air introduced from the intake port to pass through between a plurality of fins to radiate heat generated from an electronic apparatus; a branch wall that is installed on the downstream side of the flow of air and orthogonal to a longitudinal direction of the fins, and branches the flow of air passing through between the fins to two directions; a plurality of ribs that are installed in parallel to the fins from the branch wall toward the fins, are inserted between the adjacent fins at apices on the leading end side and connected with the branch wall at the root side, branch the flow of air passing through between the fins to two directions on the leading end side, and have two types of forms alternately different from each other; and an exhaust port that exhausts the air branched by the ribs and branch wall. Of the ribs inserted between the adjacent fins, at least the ribs having one of the forms are in contact with the fins.SELECTED DRAWING: Figure 5
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Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a cooling device for an electronic device. [Background technology]

[0002] Conventionally, electronic devices such as PCs (Personal Computers) include components that become hot, such as CPUs (Central Processing Units). Such components are generally equipped with heat sinks for heat dissipation. Air is drawn into the heat sink by a fan installed upstream, and is exhausted downstream of the heat sink, thereby dissipating heat (see, for example, Patent Document 1).

[0003] Due to the recent demand for miniaturization of electronic devices, components such as CPU input / output devices and connectors are sometimes placed downstream of the heat sink inside the housing of an electronic device. Such components undesirably impede the smooth flow of gas that has passed through the heat sink, reducing heat dissipation performance. Summary of the Invention [Problem to be solved by the invention]

[0004] The problem to be solved by the present invention is to provide a cooling device for electronic devices that can obtain good heat dissipation performance even when there is an obstacle downwind of the heat sink. [Means for solving the problem]

[0005] A cooling device for electronic devices according to an embodiment includes an air intake port, a heat sink, a branch wall, multiple ribs, and an exhaust port. The air intake port is equipped with a fan and introduces air. The heat sink dissipates heat generated by the electronic device by passing the air introduced through the air intake port between multiple fins. The branch wall is installed across the multiple fins of the heat sink downstream of the air flow, perpendicular to the longitudinal direction of the fins, and branches the air flow passing between the fins into two directions. The multiple ribs are plate-shaped members with peaks at their tip ends, installed parallel to the fins from the branch wall toward the fins. Their tip ends are inserted between adjacent fins and their base ends connect to the branch wall, branching the air flow passing between the fins into two directions at their tip ends. The ribs have two different shapes when viewed from the side and are inserted alternately between adjacent fins, with at least one of the ribs contacting the fins. The exhaust port exhausts the air branched by the ribs and the branch wall. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view illustrating an example of a fan duct according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing an example of a schematic structure of an electronic device to which a fan duct is attached. [Figure 3] FIG. 3 is a perspective view showing an example of a ventilation hole provided in an electronic device. [Figure 4] FIG. 4 is a plan view showing an example of the shape of the fan duct. [Figure 5] FIG. 5 is a vertical cross-sectional side view showing an example of the shape of the fan duct. [Figure 6] FIG. 6 is a vertical cross-sectional side view illustrating the positional relationship between the fan duct and components near the exhaust port. [Figure 7] FIG. 7 is a diagram showing an example of the shape of the rib. [Figure 8] FIG. 8 is a plan view showing another example of the shape of the fan duct. DETAILED DESCRIPTION OF THE INVENTION

[0007] (First embodiment) A first embodiment in which a cooling device of the present disclosure is applied to a fan duct 1 will be described with reference to the drawings.

[0008] (Schematic structure of the fan duct) The schematic structure of a fan duct 1, which is an example of a cooling device of the present disclosure, will be described using Figure 1. Figure 1 is a perspective view showing an example of a fan duct of an embodiment. For ease of explanation, a three-dimensional coordinate system XYZ is set in Figure 1. In the three-dimensional coordinate system XYZ, the width direction (left-right direction) of the fan duct 1 is the X-axis direction, the depth direction (front-back direction) is the Y-axis direction, and the height direction (up-down direction) is the Z-axis direction.

[0009] 1, fan duct 1 has a generally box-like shape and is a cover member that covers heat sink 2 and intake fan 3 that blows air to heat sink 2. Fan duct 1 passes air drawn in from intake port 11 by intake fan 3 between fins 22 of heat sink 2 installed inside the ventilation pipe (duct), and then discharges the air from exhaust port 12; it is a member that combines the functions of both an intake duct and an exhaust duct.

[0010] The suction fan 3 draws in air from outside the fan duct 1, introduces the drawn-in air into the fan duct 1, and blows it in the negative direction of the Y axis. The suction fan 3 is an example of a fan in this disclosure. An air intake 11 is provided on the upstream side of the fan duct 1 in the air blowing direction of the suction fan 3, and an exhaust vent 12 is provided on the downstream side.

[0011] Hereinafter, the term "upstream side" simply refers to the upstream side (or upwind) in the air blowing direction of the suction fan 3. Similarly, the term "downstream side" simply refers to the downstream side (or downwind) in the air blowing direction of the suction fan 3.

[0012] The heat sink 2 is attached to a heat-generating electronic component, such as a CPU (Central Processing Unit). The heat generated by the CPU is conducted through the heat sink 2. The heat transmitted through the heat sink 2 is then dissipated into the surrounding air. This prevents malfunctions and other problems caused by overheating of the CPU.

[0013] The heat sink 2 is composed of a base 21 and multiple fins 22. The fins 22 are erected on the base 21. The multiple fins 22 are adjacent to each other at a predetermined interval. The base 21 is in contact with the CPU, and heat from the CPU is conducted therethrough. The fins 22 dissipate the heat conducted from the base 21 into the air.

[0014] The heat sink 2 is fixed onto frames 41, 42, and 43, which are layered at predetermined intervals, with a helical spring 44 and a screw 45. A motherboard 101 (see FIG. 2) is sandwiched between the frames 41 and 42.

[0015] The suction fan 3 blows air by continuously sending it in one direction using blades that are driven to rotate by, for example, an electric motor. In this embodiment, the intake port 11, the suction fan 3, the heat sink 2, and the exhaust port 12 are arranged in this order from the upstream side to the downstream side in the airflow direction of the suction fan 3.

[0016] To fully utilize the effects of the fan duct 1 described above, it is desirable that there are no parts (obstacles) that obstruct exhaust air on the downwind side of the exhaust port 12. However, depending on the size of the electronic device 100 (see FIG. 2) equipped with the fan duct 1 and the arrangement of its built-in components, an obstacle may be placed downstream of the exhaust port 12.

[0017] In order to exhaust air while avoiding such obstacles on the downwind side, the fan duct 1 is equipped with a branch wall 13 and multiple ribs 14 and 15 as shown in Figure 1. The branch wall 13 branches the flow of air that has passed between the fins 22 of the heat sink 2 into two directions. The ribs 14 and 15 are installed on the wall surface of the branch wall 13 in parallel to the fins 22 of the heat sink 2, and branch the flow of air that has passed between the fins 22 of the heat sink 2 into two directions. The branch wall 13 and the ribs 14 and 15 will be described in detail later (see Figures 4 and 5).

[0018] (General structure of electronic device) An electronic device to which a fan duct is attached will be described with reference to Figures 2 and 3. Figure 2 is a perspective view showing an example of a schematic structure of an electronic device to which a fan duct is attached. Figure 3 is a perspective view showing an example of a ventilation hole provided in the electronic device.

[0019] As shown in FIG. 2, the electronic device 100 includes a housing 110, a motherboard 101, a CPU 102, a memory 103, a solid state drive (SSD) 104, a riser card 105, and I / O boards 106 and 107.

[0020] The motherboard 101 is an example of a board on which electronic components (CPU 102 in this embodiment) are mounted, the heat of which is dissipated by the heat sink 2. The memory 103 and SSD 104 also generate heat in accordance with their operation. This heat is also dissipated by the air flow inside the housing 110, which is created by the airflow of the intake fan 3.

[0021] The I / O boards 106 and 107 are connected to the motherboard 101 via sockets (slots) provided in the riser card 105. By connecting the I / O boards 106 and 107 to the sockets provided in the riser card 105, the I / O boards 106 and 107 are arranged parallel to the motherboard 101, which makes it possible to reduce the height dimension of the housing 110.

[0022] However, with the above-described arrangement, if the I / O boards 106, 107 are located downstream of the exhaust port 12, the I / O boards 106, 107 become an obstacle that blocks exhaust. This embodiment is configured so that the exhaust from the fan duct 1 avoids the I / O boards 106, 107.

[0023] 3, fan duct 1 is housed inside housing 110 of electronic device 100. Housing 110 is provided with ventilation holes 161, 162, and 163 that take in air to be introduced into fan duct 1, and ventilation holes 164, 165, 166, and 167 that exhaust air that has passed through fan duct 1.

[0024] Ventilation holes 161, 162, and 163 are provided in front cover 111 that forms the front surface of housing 110. Ventilation holes 164 and 165 are provided in rear cover 112 that forms the back surface of housing 110. Ventilation holes 166 and 167 are provided in I / O panel 113 that forms part of the back surface of housing 110. Note that I / O panel 113 includes connection terminals for various peripheral devices connected to electronic device 100.

[0025] In the electronic device 100 of this embodiment, the I / O boards 106 and 107 are disposed behind the CPU 102. Therefore, the exhaust port 12 of the fan duct 1 is separated into an upper exhaust port 121 that opens upward and a lower exhaust port 122 that opens downward so that the exhaust air avoids the I / O boards 106 and 107 (see FIG. 1). Specifically, the exhaust port 12 is separated into the upper exhaust port 121 and the lower exhaust port 122 by the branch wall 13 and ribs 14 and 15 shown in FIG. 1. The ribs 14 and 15 are erected from the branch wall 13 toward the heat sink 2. Furthermore, a plurality of the ribs 14 and 15 are provided at regular intervals along the X-axis (lined up in the left-right direction). Details will be described later (see FIGS. 4 and 5).

[0026] (Structure of branching walls and ribs) The structures of the branch wall 13 and the ribs 14, 15 will be described with reference to Figures 4 and 5. Figure 4 is a plan view showing an example of the shape of the fan duct. Figure 5 is a vertical cross-sectional side view showing an example of the shape of the fan duct.

[0027] 5, the branch wall 13 has a substantially V-shaped cross section in side view, with the bent portion protruding toward the heat sink 2. The branch wall 13 divides the flow of air that has passed between the fins 22 of the heat sink 2 into two.

[0028] The branch wall 13 is installed across the multiple fins 22 of the heat sink 2 on the downstream side of the air flow, perpendicular to the longitudinal direction of the fins 22. The branch wall 13 has an upper wall portion 131 and a lower wall portion 132. The upper wall portion 131 and the lower wall portion 132 are connected at a side along the X-axis on the upstream side in the airflow direction of the suction fan 3. The upper wall portion 131 and the lower wall portion 132 are inclined with respect to the airflow direction of the suction fan 3 so that the distance between them increases toward the downstream side in the airflow direction of the suction fan 3. The upper wall portion 131 guides the airflow that has passed between the fins 22 of the heat sink 2 obliquely upward. The lower wall portion 132 guides the airflow that has passed between the fins 22 of the heat sink 2 obliquely downward. In this way, the branch wall 13 guides the exhaust air so as to avoid a part of the range downstream of itself (the range where the I / O boards 106 and 107 are installed (see FIG. 6)), and branches the exhaust air.

[0029] The branch wall 13 divides the exhaust port 12 into an upper exhaust port 121 and a lower exhaust port 122. The upper exhaust port 121 discharges the exhaust air flowing along the upper wall portion 131 to the outside of the housing 110 through ventilation holes 164 (see FIG. 3). The lower exhaust port 122 discharges the exhaust air flowing along the lower wall portion 132 to the outside of the housing 110 through ventilation holes 165, 166, and 167 (see FIG. 3). As shown in FIG. 5, the branch wall 13 has a substantially V-shaped cross section in a side view, and the bent portion protrudes toward the heat sink 2. The branch wall 13 divides the flow of air that has passed between the fins 22 of the heat sink 2 into two.

[0030] The upper wall portion 131 and the lower wall portion 132 of the branch wall 13 are provided with a plurality of ribs 14 that are parallel to the fins 22 and face the fins 22 of the heat sink 2. The ribs 14 are plate-shaped members molded from, for example, a resin material or a metal material and have pointed tops 141 at their leading ends. The base sides of the ribs 14 are connected to the upper wall portion 131 at the rib upper rear ends Pa and to the lower wall portion 132 at the rib lower rear ends Pb. The ribs 14 are inserted between the fins 22. The areas of the ribs 14 that are inserted between the fins 22 do not contact the fins 22.

[0031] Furthermore, a plurality of ribs 15 are provided on the lower wall portion 132 of the branch wall 13, facing the fins 22 of the heat sink 2 and parallel to the fins 22. The ribs 15 are plate-shaped members molded from, for example, a resin material or a metal material, and having a pointed top 151 at the tip end. The base sides of the ribs 15 are connected to the lower wall portion 132 at the rib upper rear ends Pc and the rib lower rear ends Pd. The ribs 15 are inserted between the fins 22. Both sides of the regions of the ribs 15 inserted between the fins 22 come into contact with the fins 22.

[0032] In this way, the ribs 14 and 15 have different lengths and directions, and are formed alternately along the X-axis. That is, the fan duct 1 includes ribs 14 and ribs 15 having two different shapes.

[0033] The upper edge 142 and the lower edge 143 of the rib 14 are both formed as straight lines when the rib 14 is viewed from the side. The deflection angle θa formed by the upper edge 142 of the rib 14 and the exhaust direction of the air that has passed between the fins 22 of the heat sink 2 (negative direction of the Y axis) is 30° or less. The deflection angle θb formed by the lower edge 143 of the rib 14 and the exhaust direction of the air that has passed between the fins 22 of the heat sink 2 (negative direction of the Y axis) is also 30° or less. The upper edge 142 and the lower edge 143 may be formed as curved lines. Furthermore, the upper edge 142 and the lower edge 143 may be formed as a combination of straight lines and curved lines. This will be described in more detail later (see FIG. 7).

[0034] Both the upper edge 152 and the lower edge 153 of the rib 15 are formed as straight lines when the rib 15 is viewed from the side. The deflection angle θc formed by the upper edge 152 of the rib 15 and the exhaust direction of the air that has passed between the fins 22 of the heat sink 2 (negative direction of the Y axis) is 30° or less. The deflection angle θd formed by the lower edge 153 of the rib 15 and the exhaust direction of the air that has passed between the fins 22 of the heat sink 2 (negative direction of the Y axis) is also 30° or less. The upper edge 152 and the lower edge 153 may be formed as curves. This will be described in more detail later (see FIG. 7).

[0035] The base sides of the ribs 14 and 15 are smoothly connected to the branch wall 13. Details will be described later (see FIG. 7).

[0036] 4 and 5, the ribs 14 are formed across the upper wall portion 131 and the lower wall portion 132, and the ribs 15 are formed in the region of the lower wall portion 132, but this is not limiting. That is, the ribs 14 and 15 may be formed across both the upper wall portion 131 and the lower wall portion 132, or in the region of either one of them.

[0037] Here, at least the ribs 15 that come into contact with the fins 22 of the heat sink 2 may be formed from a material with high thermal conductivity (for example, a metal such as aluminum or copper, or a resin material such as a highly thermally conductive polycarbonate resin). This increases the apparent surface area of ​​the fins 22 of the heat sink 2, thereby further improving the cooling performance.

[0038] (Positional relationship between the fan duct exhaust port and mounted components) The positional relationship between the fan duct 1 of this embodiment and the components mounted near the exhaust port will be described with reference to Figure 6. Figure 6 is a vertical cross-sectional side view illustrating the positional relationship between the fan duct and the components near the exhaust port.

[0039] 6, I / O boards 106 and 107 mounted near the exhaust ports are installed in positions that are not exposed to the exhaust air from upper exhaust port 121 and lower exhaust port 122. Therefore, fan duct 1 allows components to be placed downstream of fan duct 1 without interfering with the cooling performance of CPU 102 in electronic device 100 (see FIG. 2).

[0040] In this configuration, when the electronic device 100 is powered on, the CPU 102, memory 103, SSD 104, etc. generate heat and their temperatures rise. When the intake fan 3 operates to blow air, air flows inside the fan duct 1, cooling the CPU 102 on which the heat sink 2 is installed. At this time, the air exhausted from the upper exhaust port 121 and the lower exhaust port 122 that is not discharged to the outside of the housing 110 (see FIG. 2) moves inside the housing 110, for example, toward the intake port 11. Therefore, an air flow is also generated outside the fan duct 1, and this air flow also cools the memory 103, SSD 104, etc. on which the heat sink 2 is not installed.

[0041] (Rib edge shape) The specific shapes of the upper edge portions 142, 152 and the lower edge portions 143, 153 of the ribs 14, 15 will be described with reference to Fig. 7. Fig. 7 is a diagram showing an example of the shape of the ribs.

[0042] 7, both the upper edge 142 and the lower edge 143 are curved. The upper edge 142 is connected to the upper wall 131 at the rib upper rear end Pa. The lower edge 143 is connected to the lower wall 132 at the rib lower rear end Pb.

[0043] At this time, the tangent line of the upper edge 142 at the rib upper rear end Pa coincides with the tangent line of the upper wall 131 at the rib upper rear end Pa. That is, the upper edge 142 and the upper wall 131 are smoothly connected at the rib upper rear end Pa. Also, the tangent line of the lower edge 143 at the rib lower rear end Pb coincides with the tangent line of the lower wall 132 at the rib lower rear end Pb. That is, the lower edge 143 and the lower wall 132 are smoothly connected at the rib lower rear end Pb.

[0044] 7, both the upper edge 152 and the lower edge 153 are curved. The upper edge 152 is connected to the upper wall 131 at the upper rear end Pc of the rib. The lower edge 153 is connected to the lower wall 132 at the lower rear end Pd of the rib.

[0045] At this time, the tangent line of the upper edge 152 at the rib upper rear end Pc coincides with the tangent line of the upper wall 131 at the rib upper rear end Pc. That is, the upper edge 152 and the upper wall 131 are smoothly connected at the rib upper rear end Pc. Also, the tangent line of the lower edge 153 at the rib lower rear end Pd coincides with the tangent line of the lower wall 132 at the rib lower rear end Pd. That is, the lower edge 153 and the lower wall 132 are smoothly connected at the rib lower rear end Pd.

[0046] The specific shapes of the curves constituting the upper edge 142 and the lower edge 143 of the rib 14 are not limited, but the deflection angle θa of the upper edge 142 of the rib 14 gradually increases from the peak 141 to the rib upper rear end Pa, and is formed so as to be 30° or less from the peak 141 to the rib upper rear end Pa. The deflection angle θb of the lower edge 143 of the rib 14 gradually increases from the peak 141 to the rib lower rear end Pb, and is formed so as to be 30° or less from the peak 141 to the rib lower rear end Pb. The upper edge 142 and the lower edge 143 of the rib 14 may be formed by a combination of curves and straight lines.

[0047] Furthermore, the specific shapes of the curves that form the upper edge 152 and the lower edge 153 of the rib 15 are not limited, but the deflection angle θc of the upper edge 152 of the rib 15 gradually increases from the peak 151 to the rib upper rear end Pc, and is formed so that it is 30° or less from the peak 151 to the rib upper rear end Pc. Furthermore, the deflection angle θd of the lower edge 153 of the rib 15 gradually increases from the peak 151 to the rib lower rear end Pd, and is formed so that it is 30° or less from the peak 151 to the rib lower rear end Pd. Note that the upper edge 152 and the lower edge 153 of the rib 15 may be formed by a combination of curves and straight lines.

[0048] (Operation and effect of the first embodiment) As described above, the fan duct 1 (cooling device) of the first embodiment comprises an intake port 11 equipped with an intake fan 3 (fan) for introducing air, a heat sink 2 for dissipating heat generated from an electronic device by passing the air introduced from the intake port 11 between a plurality of fins 22, a branch wall 13 that is installed across the plurality of fins 22 of the heat sink 2 on the downstream side of the air flow and perpendicular to the longitudinal direction of the fins 22, and that branches the air flow that has passed between the fins 22 into two directions, and a heat sink 2 for distributing the air flow that has passed between the fins 22 between the branch wall 13 and the fins 22. The heat sink 2 includes a plurality of ribs 14, 15, each of which is a plate-like member arranged in parallel and has a top portion 141 at its tip end. The ribs 14, 15 are inserted between adjacent fins 22 at their tip ends and connected to a branch wall 13 at their base ends, and have two alternating shapes. These ribs branch the air flow passing between the fins 22 into two directions at the tip end. The heat sink 2 also includes an exhaust port 12 for exhausting the air branched by the ribs 14, 15 and the branch wall 13. Of the ribs 14, 15 alternately inserted between adjacent fins 22, at least one of the ribs 14 or 15 of one shape contacts the fin 22. Therefore, good cooling performance can be achieved even when there is an obstacle downwind of the heat sink 2. Furthermore, by inserting the ribs 14 between the fins 22 of the heat sink 2, the size of the heat sink 2 can be maximized within a limited space, thereby achieving both miniaturization of the electronic device 100 and improved cooling performance. Furthermore, at least one of the ribs 14 and 15 inserted between the fins 22 of the heatsink 2 comes into contact with the fins 22, thereby increasing the apparent surface area of ​​the fins 22 of the heatsink 2. This further improves the cooling performance. Even if there is a misalignment between the pitch of the fins 22 of the heatsink 2 and the pitch of the ribs 14 and 15, the elasticity of the ribs 14 and 15 can absorb the misalignment, ensuring reliable contact between the fins 22 of the heatsink 2 and the ribs 14 or 15.

[0049] Furthermore, in the fan duct 1 (cooling device) of this embodiment, of the ribs 14 and 15, at least the rib that comes into contact with the fins 22 is made of a material with high thermal conductivity. This increases the apparent surface area of ​​the fins 22 of the heat sink 2, thereby further improving the cooling performance.

[0050] Furthermore, in the fan duct 1 (cooling device) of this embodiment, when the ribs 14, 15 are viewed from the side, the tangents of the ribs 14, 15 and the tangents of the branch wall 13 at the connection points between the bases of the ribs 14, 15 and the branch wall 13 (the rib upper rear end Pa and the rib lower rear end Pb of the rib 14, and the rib upper rear end Pc and the rib lower rear end Pd of the rib 15) coincide with each other. Therefore, the air branched at the tops 141 of the ribs 14 can smoothly flow from the upper edge 142 to the upper wall 131. The air branched at the tops 141 of the ribs 14 can smoothly flow from the lower edge 143 to the lower wall 132. The air branched at the tops 151 of the ribs 15 can smoothly flow from the upper edge 152 to the upper wall 131. In addition, the air branched at the top 151 of the rib 15 can flow smoothly from the lower edge 153 to the lower wall portion 132. This allows for smooth exhaustion.

[0051] Furthermore, in the fan duct 1 (cooling device) of this embodiment, the distance between the upper edge 142 and the lower edge 143 of the rib 14 becomes wider as one approaches the base of the rib 14, and both the upper edge 142 and the lower edge 143 are formed as straight lines, curves, or a combination thereof when the rib 14 is viewed from the side. Furthermore, the distance between the upper edge 152 and the lower edge 153 of the rib 15 becomes wider as one approaches the base of the rib 15, and both the upper edge 152 and the lower edge 153 are formed as straight lines, curves, or a combination thereof when the rib 15 is viewed from the side. Therefore, the air branched at the top 141 of the rib 14 and the air branched at the top 151 of the rib 15 can flow smoothly downstream.

[0052] (Second embodiment) A second embodiment in which the cooling device of the present disclosure is applied to a fan duct 10 will be described with reference to the drawings.

[0053] (Another form of rib) The shape of the ribs 16, 17 provided on the fan duct 10, which is an example of the cooling device of the present disclosure, will be described with reference to Fig. 8. Fig. 8 is a plan view showing another example of the shape of the fan duct.

[0054] As in the first embodiment, the fan duct 10 includes a branch wall 13 that branches the air flow that has passed between the fins 22 of the heat sink 2 into two directions. As in the first embodiment, the branch wall 13 includes an upper wall portion 131 and a lower wall portion 132.

[0055] The upper wall portion 131 and the lower wall portion 132 of the branch wall 13 are provided with a plurality of ribs 16 that are parallel to the fins 22 and that face the fins 22 of the heat sink 2. The lower wall portion 132 of the branch wall 13 is also provided with a plurality of ribs 17 that are parallel to the fins 22 and that face the fins 22 of the heat sink 2.

[0056] The ribs 16 and 17 of the fan duct 10 have different shapes in a side view, similar to the ribs 14 and 15 described in the first embodiment. The base portions 144 of the ribs 16 and 154 of the ribs 17 have approximately the same thickness. The thicknesses of the base portions 144 of the ribs 16 and 154 of the ribs 17 are narrower than the spacing between the fins 22 of the heat sink 2.

[0057] Furthermore, the thickness of the tip portion 145, including the crest 141, of the rib 16 is formed to be thicker than the thickness of the base portion 144. The tip portion 145 contacts the fins 22 on both sides. The thickness of the tip portion 155, including the crest 151, of the rib 17 is formed to be thicker than the thickness of the base portion 154. The tip portion 155 contacts the fins 22 on both sides. That is, the tip portions 145 of the ribs 16 and the tip portions 155 of the ribs 17 contact the fins 22 at alternately different positions.

[0058] By having such a contact structure, even if there is a misalignment between the pitch of the fins 22 of the heat sink 2 and the pitch of the ribs 16, 17, the elasticity of the ribs 16, 17 absorbs the misalignment in pitch, so that the fins 22 of the heat sink 2 and the ribs 16, 17 are reliably in contact with each other.

[0059] (Effects of the second embodiment) As described above, in the fan duct 10 (cooling device) of the second embodiment, all of the ribs 16, 17 having two types of shapes that are alternately inserted between adjacent fins 22 contact the fins 22 at alternately different positions. Therefore, the dimensional error between the pitch of the fins 22 of the heat sink 2 and the pitch of the ribs 16, 17 can be absorbed, and the fins 22 of the heat sink 2 and the ribs 16, 17 can be brought into contact with each other more reliably.

[0060] Although the embodiments of the present invention have been described above, these embodiments are merely examples and are not intended to limit the scope of the invention. This novel embodiment can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the inventions and their equivalents as defined in the claims. [Explanation of symbols]

[0061] 1,10 Fan duct (cooling device) 2 heat sinks 3. Suction fan (fan) 11 Air intake 12 exhaust port 13 Branching Wall 14, 15, 16, 17 Ribs 22 Finn 100 Electronic equipment 106,107 I / O board 110 Case 121 Upper exhaust port 122 Lower exhaust port 131 Upper wall section 132 Lower wall part 141,151 Top 142,152 Upper edge 143,153 Lower edge 144,154 Base 145,155 Tip 161,162,163,164,165,166 ventilation hole Pa, Pc Upper rear end of rib Pb,Pd Lower rear end of rib θa, θb, θc, θd angle of deviation [Prior art documents] [Patent documents]

[0062] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-283171

Claims

1. an intake port having a fan for introducing air; a heat sink that dissipates heat generated from an electronic device by passing air introduced through the air intake port between a plurality of fins; a branching wall that is installed across the plurality of fins of the heat sink on a downstream side of the air flow, perpendicular to the longitudinal direction of the fins, and that branches the air flow that has passed between the fins into two directions; a plurality of ribs having two types of alternating shapes, which are plate-like members having a peak at a tip end, which are arranged parallel to the fins from the branch wall toward the fins, the tip ends of which are inserted between adjacent fins and the base ends of which are connected to the branch wall, and which cause the air flow passing between the fins to branch into two directions at the tip ends; an exhaust port for exhausting air branched by the rib and the branch wall, At least one of the ribs alternately inserted between the adjacent fins contacts the fin. Cooling devices for electronic devices.

2. All of the ribs having the two types of shapes that are alternately inserted between the adjacent fins contact the fins at alternately different positions. The cooling device for electronic devices according to claim 1 .

3. At least the ribs in contact with the fins are made of a material with high thermal conductivity. The cooling device for electronic devices according to claim 1 or 2.

4. When the rib is viewed from a side, a tangent to the rib and a tangent to the branch wall coincide with each other at a connection point between a root side of the rib and the branch wall. The cooling device for electronic devices according to claim 3 .

5. a distance between an upper edge portion and a lower edge portion of the rib is wider toward a base of the rib, and the upper edge portion and the lower edge portion are both formed by a straight line, a curved line, or a combination thereof when the rib is viewed from the side; The cooling device for electronic devices according to claim 4 .

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