Dual-polarized magnetoelectric antenna array

Abstract

A packaging structure is provided that includes a planar core structure having a first side and a second side opposite the first side. The packaging structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure includes a plurality of first stacks, each stack having a first patterned conductive layer formed on a first insulating layer, and an antenna formed on one or more of the first patterned conductive layers of the first stacks, the antenna including at least one L-shaped structure. The packaging structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feedline structure formed on and routed through the interface structure and the planar core structure, the antenna feedline structure not connected to the planar antenna.

Description

[Technical Field]

[0001] The present disclosure relates generally to wireless communication packaging structures, and more particularly to techniques for packaging antenna structures with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio / wireless communication systems for millimeter wave (mm wave) applications. Specifically, the present disclosure relates to a dual-polarized magnetoelectric antenna array structure for RFIC packaging applications. [Background technology]

[0002] When building wireless communications packaging structures using integrated antennas, it may be desirable to implement a package design that provides a low-cost, highly reliable packaging solution while achieving the appropriate antenna characteristics (e.g., high efficiency, wide bandwidth, good radiation characteristics, etc.). This integration process requires the use of high-precision fabrication techniques that allow for the implementation of minute features in the package structure. Conventional solutions are typically implemented using complex and expensive packaging techniques that are lossy and / or utilize high-dielectric-constant materials. For consumer applications, high-performance package designs using integrated antennas are typically not required. On the other hand, for industrial applications (e.g., 5G cell phone base station applications), high-performance antenna packages are required, typically requiring large-scale phased-array antennas. The ability to design high-performance packages using phased-array antennas is important for millimeter-wave operating frequencies and above.

[0003] One type of antenna design is known as a magneto-electric dipole (MED) antenna. Generally, a MED antenna includes a magnetic dipole and an electric dipole. By simultaneously exciting complementary dipoles with suitable amplitudes and phases, the antenna can produce better radiation characteristics over a wide frequency band. MED antennas may be suitable for certain cellular networks.

[0004] Certain antenna designs do not consider the RFIC packaging environment, such as having many metal layers and some metal layer metal fill requirements. Also, certain phased array applications may have λ / 2 wavelength spacing requirements. In certain instances, antenna performance may be degraded in an antenna-in-package (AiP) environment. Summary of the Invention

[0005] An embodiment of the present disclosure relates to a packaging structure including a planar core structure having a first side and a second side opposite the first side. The packaging structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure includes a plurality of first stacks, each including a first patterned conductive layer formed on a first insulating layer, and an antenna formed on one or more of the first patterned conductive layers of the first stacks and including at least one L-shaped structure. The packaging structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feedline structure formed in and routed through the interface structure and the planar core structure, the antenna feedline structure not connected to the planar antenna. This may enable a high-performance phased array antenna design for wide bandwidth, high horizontal and vertical port isolation, and stable gain.

[0006] In a particular embodiment, the antenna includes four L-shaped structures, which may allow for tuning of a high performance phased array antenna design by varying certain dimensions of the L-shaped structures.

[0007] In certain embodiments, the L-shaped structures are symmetrically positioned with the corners of the L-shaped structures facing inward, which may further allow for tuning of high performance phased array antenna designs by varying certain dimensions of the L-shaped structures.

[0008] In certain embodiments, the packaging structure further comprises a cage wall structure within the antenna structure, the cage wall surrounding the antenna. In certain embodiments, the cage wall structure is electrically connected to the L-shaped structure via the first ground plane layer of the core structure. In certain embodiments, the cage wall structure includes a plurality of conductive ground rings extending vertically through the antenna structure. The cage wall structure (or grounded cage wall) can enable improved antenna performance in many high-precision packaging processes.

[0009] In a specific embodiment, a device is provided that includes a packaging structure comprising a planar core structure including a first side and a second side opposite the first side. The packaging structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure includes a plurality of first stacks, each including a first patterned conductive layer formed on a first insulating layer, and an antenna formed on one or more of the first patterned conductive layers of the first stacks and including at least one L-shaped structure. The packaging structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feedline structure formed in and routed through the interface structure and the planar core structure, the antenna feedline structure not connected to the planar antenna. This may enable a high-performance phased array antenna design for wide bandwidth, high horizontal and vertical port isolation, and stable gain. The device also includes an RFIC (Radio Frequency Integrated Circuit) chip having a semiconductor substrate having an active surface and a non-active surface, and a BEOL (Back End of Line) structure formed on the active surface of the semiconductor substrate, the RFIC chip being attached to the package structure by connecting the BEOL structure of the RFIC chip to the conductor pads of the interface structure, which may enable a high performance phased array antenna design for wide bandwidth, high isolation of horizontal and vertical ports, and stable gain.

[0010] In certain embodiments, the device's antenna includes four L-shaped structures, which may allow for tuning of a high performance phased array antenna design by varying certain dimensions of the L-shaped structures.

[0011] In certain embodiments of the device, the L-shaped structures are symmetrically positioned with the corners of the L-shaped structures facing inward, which may further allow for tuning of high performance phased array antenna designs by varying certain dimensions of the L-shaped structures.

[0012] In certain embodiments of the device, the packaging structure further comprises a cage wall structure within the antenna structure, the cage wall surrounding the antenna. In certain embodiments, the cage wall structure is electrically connected to the L-shaped structure via the first ground plane layer of the core structure. In certain embodiments, the cage wall structure includes a plurality of conductive ground rings extending vertically through the antenna structure. The cage wall structure (or grounded cage wall) can enable improved antenna performance in many high-precision packaging processes.

[0013] An embodiment of the present disclosure relates to a method for fabricating a packaging structure, the method including forming a planar core structure having a first side and a second side opposite the first side. The method also includes forming an antenna structure on the first side of the planar core structure, the antenna structure including a plurality of first stacks, each including a first patterned conductive layer formed on a first insulating layer, and an antenna formed on one or more of the first patterned conductive layers of the first stacks, the antenna including at least one L-shaped structure. The method also includes forming an interface structure on the second side of the planar core structure. The method also includes forming an antenna feedline structure in and through the interface structure and the planar core structure, the antenna feedline structure being unconnected to the planar antenna. This may enable a high-performance phased array antenna design for wide bandwidth, high horizontal and vertical port isolation, and stable gain.

[0014] In a particular embodiment of the method for fabricating the packaging structure, the antenna of the device includes four L-shaped structures, which may allow for tuning of a high performance phased array antenna design by varying certain dimensions of the L-shaped structures.

[0015] In certain embodiments of the method for making the packaging structure, the L-shaped structures are symmetrically arranged with the corners of the L-shaped structures facing inward, which may further allow for tuning of high performance phased array antenna designs by varying certain dimensions of the L-shaped structures.

[0016] In certain embodiments of the method for fabricating a packaging structure, the packaging structure further comprises a cage wall structure within the antenna structure, the cage wall surrounding the antenna. In certain embodiments, the cage wall structure is electrically connected to the L-shaped structure via the first ground plane layer of the core structure. In certain embodiments, the cage wall structure includes a plurality of conductive ground rings extending vertically through the antenna structure. The cage wall structure (or grounded cage wall) can enable improved antenna performance in many high-precision packaging processes.

[0017] It should be noted that exemplary embodiments are described with reference to different subject matter. In particular, some embodiments are described with reference to method-type claims, while other embodiments are described with reference to apparatus-type claims. However, from the above and below description, those skilled in the art will understand that, unless otherwise specified, any combination of features belonging to one type of subject matter, as well as any combination between features relating to different subject matters, in particular between features of method-type claims and features of apparatus-type claims, is considered to be described within this document.

[0018] These and other features and advantages will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.

[0019] The above summary is not intended to describe each illustrated embodiment or every implementation of the present disclosure.

[0020] The drawings included in this application are incorporated into and form a part of the specification. The drawings illustrate embodiments of the present disclosure and, together with the description, explain the principles of the present disclosure. The drawings are merely illustrative of particular embodiments and do not limit the disclosure. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a schematic side cross-sectional view of an example of a wireless communication package, in accordance with certain embodiments. [Figure 2] 2 is a schematic plan view of the wireless communication package of FIG. 1 in accordance with a particular embodiment. [Figure 3] 2 is a perspective view of the wireless communication package of FIG. 1 in accordance with certain embodiments. [Figure 4] 2 is a schematic plan view of the wireless communication package of FIG. 1 illustrating certain principles of operation of the device according to certain embodiments. [Figure 5] 2 is a schematic plan view of an array of wireless communication packages of FIG. 1 in accordance with a particular embodiment. [Figure 6] 1 is a graph illustrating antenna impedance matching and port coupling for a wireless communication package, in accordance with certain embodiments. [Figure 7] 1 is a graph illustrating antenna frequencies for several different wireless communication packages, each having a different shape, in accordance with certain embodiments. [Figure 8] FIG. 1 is a schematic diagram illustrating an impedance matching and wiring feed line design for a wireless communication package, according to certain embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0022] Embodiments are described in detail below regarding wireless communication packaging structures, and in particular regarding techniques for packaging antenna structures with semiconductor RFIC chips to form compact integrated radio / wireless communication systems using high performance integrated antenna systems (e.g., phased array antenna systems).

[0023] The present embodiment provides an antenna array in a packaged implementation for a magnetoelectric dipole (MED) antenna. The present embodiment may also include one or more of the following features: an L-shaped patch structure for antenna performance and tunability, an antenna cavity for reducing antenna coupling and manufacturability, and an antenna feedline technique for antenna impedance matching and feedline routing that may be useful in array applications.

[0024] The phased array antenna design of the present embodiment may be based on the concept of a magnetoelectric dipole (MED) antenna. These embodiments may improve antenna performance, such as having wide bandwidth, high port isolation, and stable gain. The present embodiment may be particularly suitable for antenna-in-package (AiP) applications that utilize a complete package environment. The present embodiment may be used in high-performance and low-cost phased arrays in a package environment.

[0025] It should be understood that the various layers and / or components shown in the accompanying drawings are not drawn to scale, and further, one or more layers and / or components of the type commonly used in constructing wireless communication packages with integrated antennas and RFIC chips may not be explicitly shown in a given drawing. This is not to suggest that the layers and / or components not explicitly shown have been omitted from the actual package structure. Furthermore, the same or similar reference numbers used throughout the drawings are used to indicate the same or similar features, elements, or structures, and thus a detailed description of the same or similar features, elements, or structures will not be repeated for each of the drawings.

[0026] 1 is a schematic side cross-sectional view of a wireless communications package 100 in accordance with a particular embodiment. The wireless communications package 100 includes an RFIC chip 102 and an antenna package 110 coupled to the RFIC chip 102. The antenna package 110 includes a multi-layer package substrate including a central core layer 120, an interface layer 130, and an antenna layer 140.

[0027] The RFIC chip 102 has a metallization pattern (not specifically shown) formed on an active surface (frontside) of the RFIC chip 102, which includes a plurality of bonding / conductor pads, such as ground pads, DC power supply pads, input / output pads, control signal pads, and associated wiring, formed as part of the back-end-of-line (BEOL) wiring structure of the RFIC chip 102. The RFIC chip 102 is electrically and mechanically connected to the antenna package 110, for example, by flip-chip attaching the active (frontside) surface of the RFIC chip 102 to a second side (e.g., underside) of the antenna package 110 using an array of solder ball break-suppressed chip connections (C4) (not shown) or other known techniques. Depending on the application, the RFIC chip 102 may include RFIC circuitry and electronic components formed on its active side, including, for example, receiver, transmitter, or transceiver circuitry and other active or passive circuit elements commonly used to implement wireless RFIC chips. In a particular embodiment, the RFIC chip 102 includes a semiconductor substrate having an active side and a non-active side, and a back-end-of-line (BEOL) structure formed on the active side of the semiconductor substrate, and the RFIC chip is attached to the package structure by connecting the BEOL structure of the RFIC chip to contact pads (not shown) of the interface structure.

[0028] In a particular embodiment, as shown in FIG. 1 , the antenna package 110 comprises a multi-layer structure that can be constructed using known fabrication techniques, such as surface laminar circuit (SLC), high-density interconnect (HDI), or other fabrication techniques, that allow for the formation of highly integrated, organic, multi-layer circuit boards. Using these circuit board fabrication techniques, the antenna package 110 can be formed from a stack of laminates comprising alternating layers of metallization and dielectric / insulator materials, with the metallization layers separated from the metallization layers above, below, or both by respective layers of dielectric / insulator material. The metallization layers can be formed from copper, and the dielectric / insulator layers can be formed from the industry-standard FR4 insulating material, which is made of a fiberglass epoxy material. Other types of materials can be used for the metallization and insulating layers. Additionally, these techniques enable the formation of small conductive vias (e.g., partial or buried vias between adjacent metallization layers) using, for example, laser ablation, photo imaging, etching, or plating to enable the formation of high density wiring and interconnect structures within the antenna package 110.

[0029] In the embodiment of FIG. 1 , the central core layer 120 provides a structurally robust layer for constructing the interface layer 130 and the antenna layer 140 on the opposite side of the core layer 120. In a particular example, the core layer 120 may have a thickness of approximately 500 to 1,000 μm. In one embodiment, the core layer 120 comprises a substrate layer 122 having a first ground plane (i.e., metallization layer BC1, where BC may refer to the rear conductor or bottom conductor) formed on the bottom side of the substrate layer 122 and a second ground plane FC1 (where FC may refer to the front conductor) formed on the top side of the substrate layer 122. The substrate layer 122 can be formed of standard FR4 material or other standard materials commonly used to construct standard printed circuit boards. The substrate layer 122 can be formed of other materials having mechanical and electrical properties similar to FR4, providing a relatively rigid substrate structure that provides structural support for the antenna package 110.

[0030] The interface layer 130 comprises a plurality of stacked layers L1, L2, L3, L4, L5, and L6, each of which comprises a respective patterned metallization layer BC2, BC3, BC4, BC5, BC6, and BC7 formed on a respective dielectric / insulating layer D1, D2, D3, D4, D5, and D6. In a particular embodiment, metallization layer BC1 is an antenna ground plane, metallization layer BC3 is a ground plane, metallization layer BC4 is a power layer, metallization layer BC5 is a low-frequency (or low-F) layer, and metallization layer BC6 is a ground plane. The various metallization layers may be composed of, for example, Cu. Similarly, the antenna layer 140 comprises multiple laminations L1, L2, L3, L4, L5, and L6, each comprising a respective patterned metallization layer FC2, FC3, FC4, FC5, FC6, and FC7 (FC may refer to a front conductor) formed on a respective dielectric / insulating layer D1, D2, D3, D4, D5, and D6, which form various components within the antenna layer 140. Also as shown in FIG. 1 , metallization layer FC7 corresponds to a V-polarized feed, and layer FC5 corresponds to an H-polarized feed. Metallization layer FC6 includes the antenna structure (i.e., L-shaped structure 115, described in more detail below). In certain embodiments, metal plating may be used in a surface laminar circuit (SLC) process for the interface layer 130 and enhancement layers in the antenna layer 140.

[0031] As mentioned above, in one embodiment, the stacked layers L1, L2, L3, L4, L5, and L6 of the interface layer 130 and the antenna layer 140 can be formed using modern fabrication techniques, such as SLC or similar technologies, which can meet the necessary tolerances and design rules required for high-frequency applications, such as millimeter-wave applications. Using an SLC process, each stacked layer is formed separately by a patterned metallization layer, with the first layer L1 of the interface layer 130 and the antenna layer 140 bonded to the core layer 120, and the remaining stacked layers L2, L3, L4, L5, and L6 (of the respective interface layer 130 and antenna layer 140) being sequentially bonded using any suitable bonding technique, for example, using adhesive or epoxy materials. In certain embodiments, if a bonding material is used, a conventional PCB process can be used. However, in the case of SLC, HDI, and LTCC, no bonding material is used. In these situations, the laminates / dielectrics are stacked together directly under heat and pressure.

[0032] As further shown in FIG. 1 , conductive vias are formed through the core layer 120 and through the dielectric / insulating layers D1, D2, D3, D4, D5, and D6 of the interface layer 130 and the antenna layer 140. The conductive vias formed through a given dielectric / insulating layer are connected to via pads patterned from metallization layers disposed on each side of the given dielectric / insulating layer. In a particular example, the thickness of the metallization layers FC1 and BC1 may be approximately 36 μm or any other suitable thickness. In a particular example, the thickness of the metallization layers FC2, FC3, and FC4 may be approximately 15 μm or any other suitable thickness, for example.

[0033] The various metallization layers BC1, BC2, BC3, BC4, BC5, BC6, BC7, FC1, FC2, FC3, FC4, FC5, FC6, and FC7, as well as vertical conductive vias, are patterned and interconnected through the various layers (core layer 120, interface layer 130, and antenna layer 140) of antenna package 110 to implement various features required for the intended wireless communications application. Such features include, for example, antenna feed lines, ground planes, RF shielding and isolation structures, power planes for delivering power to RFIC chip 102 (and other RFICs or chips that may be included in wireless communications package 100), signal lines for delivering IF (intermediate frequency) signals, LO (local oscillator) signals, other low frequency I / O (input / output) baseband signals, etc.

[0034] In particular, as shown in the exemplary embodiment of FIG. 1 , antenna package 110 includes first antenna feedline 112 (shown in dashed lines) and second antenna feedline 114 (shown in dashed lines) routed through interface layer 130, core layer 120, and antenna layer 140. First antenna feedline 112 and second antenna feedline 114 comprise a series of interconnected metal traces and conductive vias that are part of the metallization and dielectric layers of interface layer 130, core layer 120, and antenna layer 140 of antenna package 110. As shown in FIG. 1 , first antenna feedline 112 and second antenna feedline 114 are disposed between L-shaped structures 115 (described in more detail below). Furthermore, first antenna feedline 112 and second antenna feedline 114 do not have connections to L-shaped structures 115 or to grounded cage wall 116 (described in more detail below).

[0035] In one embodiment, first antenna feedline 112 and second antenna feedline 114 (as well as all other antenna feedlines formed within antenna package 110) are designed to have equal lengths to optimize antenna operation. For example, in a phased array implementation, forming all antenna feedlines within antenna package 110 to have the same or approximately the same length facilitates phasing of the RF signals supplied to the patch antenna elements of the antenna array, prevents beam squint in the phased array, reduces angular scanning errors, and effectively increases the bandwidth of operation of the antenna elements.

[0036] 1, the lengths of the vertical portions of antenna feed lines 112 and 114 extending vertically through interface layer 130, core layer 120, and antenna layer 140 are fixed lengths based on the thicknesses of the various layers of antenna package 110. However, the lateral distance between the patch antenna elements and RFIC chip 102 varies depending on the horizontal / lateral position of antenna array L-shaped structure 115 relative to the corresponding antenna feed line ports (i.e., V-port 105 and H-port 107) of RFIC chip 102. In this regard, to ensure that each antenna feed line has the same overall length (or approximately the same length), in one embodiment, the lateral routing of antenna feed lines 112 and 114 within antenna package 110 is implemented with transmission lines formed in the same metallization layer of a multilayer package substrate. For example, in the embodiment shown in FIG. 1 , the lengths of the antenna feed lines 112 and 114 are adjusted in the first layer L1 of the interface layer 130 by lengthening or shortening the wiring of the side portions of the antenna feed lines 112 and 114 patterned from the metallization layer BC2 of the interface layer 130.

[0037] 1, horizontal portions 112-2 and 114-2 of first and second antenna feed lines 112, 114 are patterned from first metallization layer BC2 of interface layer 130. The lengths of horizontal portions 112-2 and 114-2 of first and second antenna feed lines 112, 114 are either lengthened or shortened to compensate for differences in the lateral and / or vertical positions of other portions of antenna feed lines 112, 114 routed through interface layer 130, core layer 120, and antenna layer 140.

[0038] Interface layer 130 provides wiring for distributing power to RFIC chip 102 and for routing signals between two or more RFIC chips that are flip-chip mounted to antenna package 110. For example, in one embodiment, metallization layers BC4 and BC5 of interface layer 130 act as power planes that distribute power voltage from an application board (not shown) to RFIC chip 102 using horizontal traces patterned on metallization layers BC4 and BC5 and vertical via structures formed through layers L4, L5, and L6 to connect the power plane metallization to contact pads on RFIC chip 102.

[0039] In a particular embodiment, metallization layer BC6 of interface layer 130 is patterned to form signal lines (e.g., microstrip transmission lines) for transmitting control signals, baseband signals, and other low-frequency signals between the application board and RFIC chip 102 (or between multiple RFIC chips mounted in antenna package 110). In this embodiment, metallization layer BC7 of interface layer 130 may serve as a ground plane for the microstrip transmission lines of metallization layer BC6.

[0040] 1, interface layer 130 further comprises a ground plane used to provide shielding, for example, to provide a ground element for a microstrip or strip transmission line formed by a horizontal trace. For example, metallization layer BC1 of interface layer 120 comprises a ground plane that acts as an RF shield to shield RFIC chip 102 from exposure to incident electromagnetic radiation (EM) captured by the patch antenna.

[0041] Additionally, the ground plane of metallization layer BC1 of interface layer 130 is configured to, for example, (i) provide shielding between horizontal signal line traces formed in adjacent metallization layers, (ii) serve as a ground plane for, for example, microstrip or strip transmission lines formed by the horizontal signal line traces, and (iii) provide ground for vertical shielding structure 133 formed by a series of vertically connected ground vias formed between metallization layers BC3 and BC7 and through layers L3 to L6, for example, surrounding portions of antenna feed lines 112 and 114 that extend through interface layer 130 (e.g., vertical portions of antenna feed lines 112 and 114 adjacent to vertical shielding structure 133). For very high frequency applications, the implementation of strip transmission lines and ground shields can help reduce interference effects of other package components, such as power planes, low frequency control signal lines, and other transmission lines.

[0042] 1, the combination of vertical shielding structure 133 and the vertical portions of antenna feed lines 112 and 114 adjacent to vertical shielding structure 133 (i.e., in interface layer 130) effectively forms a transmission line structure similar to a coaxial transmission line, with the surrounding vertical shielding structure 133 acting as the outer (shielding) conductor and the vertical portions (i.e., antenna feed lines 112 or 114) acting as the center (signal) conductor. A coaxial transmission line configuration may be implemented for the other vertical portions of antenna feed lines 112 and 114 that extend through core layer 120 and antenna layer 140, as shown schematically in FIG.

[0043] Additionally, the metallization layer BC7 of the interface layer 130 serves as a ground plane to isolate the antenna package 110 from the RFIC chip 102 for enhanced EM shielding. The metallization layer BC7 of the interface layer 130 includes via openings to provide contact ports for connections between the RFIC chip 102 and the package feed lines, signal lines, and power lines of the antenna package 110.

[0044] 1 , antenna layer 140 includes grounded cage walls 116 that extend vertically through layers L1 through L6 of antenna layer 140. Grounded cage walls 116 surround L-shaped structures 115 and are connected to L-shaped structures 115 through metallization layer BC1 of core layer 120. L-shaped structures 115 are thereby ground plane structures that are not electrically connected to antenna feedlines 112 and 114. Pillars 113 also ground L-shaped structures 115. Pillars 113 extend from the bottom of L-shaped structures 115 through layers L5 through L1 and downward through substrate layer 122 to metallization layer BC1 of core layer 120. In one example, pillars 113 have a vertical length of approximately λ / 4.

[0045] Referring now to Figure 2, this figure illustrates a schematic plan view of the wireless communications package of Figure 1, in accordance with a specific embodiment. As shown in Figure 2, a grounded cage wall 116 surrounds the entire perimeter of the wireless communications package 100. In a specific embodiment, the structural elements of the grounded cage wall 116 have a semicircular shape (i.e., a semicircle when viewed in plan view). Accordingly, as will be described in more detail below, this allows multiple wireless communications packages 100 to be assembled into an array, with the semicircular structural elements of adjacent package grounded cage walls 116 then meeting at the edges of the wireless communications package 100 to form a fully circular structure.

[0046] As shown in FIG. 2 , wireless communications package 100 includes an antenna structure including a plurality of L-shaped structures 115. In this example, there are four L-shaped structures 115, with each corner of L-shaped structure 115 pointing toward the middle of wireless communications package 100. As described above with respect to FIG. 1 , pillars 113 (in this example, there are five pillars 113 associated with each L-shaped structure 115, although any suitable number may be present) extend from the bottom of L-shaped structures 115 to the first ground plane (i.e., metallization layer BC1). Pillars 113 and metallization layer BC1 thereby connect L-shaped structures 115 to grounded cage wall 116.

[0047] As shown in FIG. 2 , wireless communications package 100 includes an H-port 107 that connects to an H-feed line in metallization layer BC7 (i.e., second antenna feed line 114, as shown in FIG. 1 ). A horizontal portion 114-2 of second antenna feed line 114 is shown crossing from H-port 107 to the center of wireless communications package 100 (i.e., the center portion between the four L-shaped structures 115) at the same height of metallization layer BC2. At the end of horizontal portion 114-2 of second antenna feed line 114 closest to the center of wireless communications package 100, there is an H-structure 136 (as shown in cross section in FIG. 1 ) that extends vertically from metallization layer BC2 to metallization layer FC6. This is the region where the signal for the antenna is applied. There are third and fourth portions of metallization layers FC6-3 and FC6-4 connected by an H-bridge 137 to second antenna feed line 114. H-bridge 137 is formed in metallization layer FC5.

[0048] As shown in FIG. 2, wireless communications package 100 includes a V-port 105 that connects to a V-feed line in metallization layer BC7 (i.e., first antenna feed line 112, as shown in FIG. 1). A horizontal portion 112-2 of first antenna feed line 112 is shown crossing from V-port 105 to the center of wireless communications package 100 at the same height of metallization layer BC2. At the end of horizontal portion 112-2 of first antenna feed line 112 closest to the center of wireless communications package 100, there is a V-structure 134 (as shown in cross section in FIG. 1) that extends vertically from metallization layer BC2 to metallization layer FC6. This is also the region where the antenna signal is applied. To first antenna feed line 112, there are first and second portions of metallization layers FC6-1 and FC6-2 connected by a V-bridge 135. V-bridge 135 (or the second bridge) is formed in metallization layer FC7. It will be understood that the V-bridge 135 is formed on the metallization layer FC7, and the H-bridge 137 (or first bridge) is formed on the metallization layer FC5, which is at a different height. Therefore, when they cross in the middle of the wireless communications package (i.e., the plan view of FIG. 2), they do not contact each other. That is, the V-bridge 135 crosses over the H-bridge 137. In particular, to prevent the V-bridge 135 from crossing the bridge (i.e., to prevent the H and V feeds from crossing each other on the FC6 layer), the H-bridge 137 has a section on the metallization layer FC6, descending toward the metallization layer FC5 for one section and then ascending toward the metallization layer FC6 for another section. The V-bridge 135 has a section on the metallization layer FC6, ascending toward the metallization layer FC7 for one section and then descending toward the metallization layer FC6 for another section. It will further be understood that the L-shaped structure 115 is at the same metallization layer height (i.e., metallization layer FC6) as the first, second, third and fourth portions of the metallization layers FC6-1, FC6-2, FC6-3 and FC6-4.

[0049] Referring now to FIG. 3 , this figure shows a schematic plan view of the wireless communications package of FIG. 1 , according to a particular embodiment. Elements in FIG. 3 correspond to like elements in FIG. 2 , and therefore their descriptions will not be repeated herein. However, as shown in FIG. 3 , in certain examples, the conductive portions of the grounded cage walls 116 of the central core layer 120 may have a larger diameter than those of the antenna layer 140. Also, the number of conductive portions of the grounded cage walls 116 of the antenna layer 140 may be greater than the number of conductive portions in the core layer 120, as shown in FIG. 3 . This feature is also seen in the plan view of FIG. 2 . However, it should be understood that any other suitable diameter or number of conductive portions may be used for the grounded cage walls 116.

[0050] Referring now to FIG. 4, this figure shows a schematic plan view of the wireless communications package 100 of FIG. 1 to illustrate certain principles of device operation, according to certain embodiments. As shown in FIG. 4, depending on the dimensions, the antenna structure can have one or two resonant frequencies. In the case of two resonant frequencies, the high resonant frequency is determined primarily by the height of or the vertical distance between the metallization layers FC6 and BC1, the substrate layer 122, and the enhancement layer dielectric constant. The low resonant frequency is determined by the parameter PWxc (i.e., the distance between the third side 115-3 and the fourth side 115-4 of the L-shaped structure 115) and the parameter PWyc (i.e., the distance between the first side 115-1 and the second side 115-2 of the L-shaped structure 115) (assuming PWx and Pwy are fixed). By decreasing the values ​​of these parameters, the low resonant frequency also decreases. The high resonant frequency is also pushed slightly higher. As a result, the antenna bandwidth is broadened.

[0051] The low resonant frequency is also determined by the parameter PWx (i.e., the distance between the sixth side 115-6 and the fourth side 115-4 of the L-shaped structure 115) and the parameter PWy (i.e., the distance between the fifth side 115-5 and the second side 115-2 of the L-shaped structure 115). By increasing the values ​​of these parameters, the low resonant frequency decreases. The high resonant frequency is also pushed slightly lower. Another possible shape parameter is portHF shown in FIG. 4. Another possible shape parameter is ring width shown in FIG. 4, which represents the width of the grounded cage wall 116 zone.

[0052] The bandwidth and impedance matching may also need to be optimized by changing one or more of the parameters shown in FIG. 4 (i.e., PWx, PWy, PWyc, PWxc, portHF, and ring width). The reflection coefficient curve (see FIG. 6, S11 and S22) has a "W" shape. Widening the bandwidth suggests that the central tip of the "W" moves up. The ground ring width RW of the pillar 113 also affects antenna performance if it is too wide. The ground ring of the pillar 113 not only improves antenna performance but may also be required for certain high-precision packaging processes. Therefore, the ground ring of the pillar 113 may also be considered part of the antenna structure of the wireless communication package 100, according to certain embodiments.

[0053] Referring now to FIG. 5, this figure is a schematic plan view of an array of wireless communications packages 100 of FIG. 1, according to a specific embodiment. In this example, there is a two-row, two-column array of wireless communications packages 100-1, 100-2, 100-3, and 100-4. As briefly discussed above with respect to FIG. 2, in a specific embodiment, the structural elements of the grounded cage wall 116 have a semicircular shape (i.e., a semicircle when viewed in a plan view). This therefore allows multiple wireless communications packages 100-1, 100-2, 100-3, and 100-4 to be assembled into an array, after which the semicircular structural elements of adjacent package grounded cage walls 116 meet at the edges of the wireless communications packages 100 to form a fully circular structure. As such, the grounded cage walls 116 (or grounded cage structures) may abut against one another. Advantages of this may include: (1) the grounded cage wall 116 may help meet metal density requirements, (2) provide isolation between the antenna structures of the different wireless communications packages 100-1, 100-2, 100-3, and 100-4, and (3) aid in scalability. While a 2x2 array is shown with respect to FIG. 5 , it should be understood that any appropriately sized array (e.g., an 8x8 array of 64 antennas) may be used. In a particular example, the spacing between the centers of the different antennas in the array of adjacent wireless communications packages 100 may be λ / 2 wavelengths. It should also be understood that the underlying RFIC chip 102 is shown to correspond with one of the wireless communications packages (e.g., as shown in FIG. 1 ). It should also be understood that the grounded cage wall 116 may help isolate the antennas of the different wireless communications packages 100 in the array. The grounded cage wall 116 can also aid in the manufacturing process, reducing antenna bandwidth and lowering impedance matching. Adjusting the dimensions of the L-shaped structure 115 also improves the antenna bandwidth and impedance matching.

[0054] FIG. 6 is a graph illustrating antenna impedance matching and port coupling for a wireless communication package according to a specific embodiment. As mentioned above, the antenna bandwidth and impedance matching may also need to be optimized by changing one or more of the parameters shown in FIG. 4 (i.e., PWx, PWy, PWyc, PWxc, portHF, and ring width). The reflection coefficient curve (see FIG. 6, S11 and S22) has a "W" shape. Widening the bandwidth suggests that the central tip of the "W" moves up. In a specific example, the layout of the L-shaped structure 115 has a symmetrical configuration, with PSy and PSx dimensions being the same, PWyc and PWxc dimensions being the same, and PWy and PWx dimensions being the same.

[0055] FIG. 7 is a graph illustrating antenna frequency for several different wireless communication packages 100, each having a different shape, according to certain embodiments. In particular, FIG. 7 shows simulation results comparing performance when the shape of the L-shaped structure 115 described herein is changed from the actual L-shape shown in FIG. 2 to a more standard square patch. When PWxc=PWyc=0, the L-shaped structure becomes a square patch (see also FIG. 4). By decreasing PWxc and PWyc, the antenna bandwidth is widened (the two resonant frequencies move apart). Changing PWx and PWy can also move the two resonant frequencies. In certain embodiments, antenna performance can be optimized by adjusting PWx, PWy, PWxc, and PWyc. Furthermore, changing the PWxc and PWyc parameters can provide additional design freedom. 7, the curves PWxc=PWyc=0.55 mm and PWxc=PWyc=0.90 mm have a "W" shape that allows for two resonant frequencies. It can also be seen that these two "W" shaped curves have a narrower bandwidth (i.e., the horizontal distance between the two bottom points of the "W") than the curve PWxc=PWyc=0.55 mm. Therefore, it can be seen that the antenna operating characteristics can be adjusted or optimized by changing the physical dimensions of the L-shaped structure 115.

[0056] FIG. 8 is a schematic diagram illustrating an impedance matching and wiring feed line design for a wireless communications package, according to a specific embodiment. Generally, the antenna impedance below the antenna ground plane in metallization layer BC1 is not matched to the RFIC transceiver impedance ZL (typically 50 ohms) in metallization layer BC7. The vertical transition from metallization layer BC7 to metallization layer BC3 transforms the impedance from ZL to Z1. In this array design, the antennas have different distances to the transceiver port. Because the antenna feed line needs to be routed in this antenna package design, it may be necessary to set Z1 = Zs, so changing the wiring length does not affect the impedance at the transceiver port. If adjusting the length and width of the line segment with impedance Z3 cannot ensure Zs = Z2, a quarter-wave transformer with line impedance Zt may be required.

[0057] Those skilled in the art will readily appreciate the various advantages associated with the integrated chip / antenna package structure according to the present embodiments. For example, the package structure can be readily manufactured using known manufacturing and packaging techniques for fabricating and packaging antenna structures with semiconductor RFIC chips to form compact integrated radio / wireless communication systems configured to operate at millimeter-wave frequencies and above. Furthermore, the integrated chip package according to the present embodiments allows an antenna to be integrally packaged with an IC chip, such as a transceiver chip, resulting in a compact design with very low losses between the transceiver and the antenna. Furthermore, the use of the integrated antenna / IC chip package according to the embodiments described herein provides significant savings in space, size, cost, and weight, which are highly beneficial for virtually any commercial or military application.

[0058] Although the present embodiment is described with respect to a given example architecture, it should be understood that other architectures, structures, substrate materials, and process steps / blocks may vary within the scope of this disclosure. Also, certain features may not be shown in all drawings for clarity, which is not intended to be construed as a limitation of any particular embodiment or example, or of the scope of the claims.

[0059] Also, when an element, such as a layer, region, or substrate, is referred to as being "on" or "on" another element, it is understood that it can be directly on the other element, or intervening elements can also be present. Conversely, when an element is referred to as being "directly on" or "directly on" another element, there are no intervening elements present. Also, when an element is referred to as being "connected" or "coupled" to another element, it is understood that it can be directly connected or coupled to the other element, or intervening elements can be present. Conversely, when an element is referred to as being "directly connected to" or "directly coupled" to another element, there are no intervening elements present.

[0060] References in the specification to "one embodiment" or "an embodiment," as well as other variations, mean that a particular feature, structure, characteristic, etc. described in connection with that embodiment is included in at least one embodiment. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification, as well as descriptions of any other variations, do not necessarily all refer to that embodiment.

[0061] For example, it should be understood that the use of any of " / ", "A / B", "A or B or both", and "or" in the case of "at least one of A and B" is intended to encompass the selection of only the first listed option (A), or the selection of only the second listed option (B), or the selection of both options (A and B). As a further example, in the case of "A, B, or C or both" and "at least one of A, B, and C", such phrases are intended to encompass the selection of only the first listed option (A), or the selection of only the second listed option (B), or the selection of only the third listed option (C), or the selection of only the first and second listed options (A and B), or the selection of only the first and third listed options (A and C), or the selection of only the second and third listed options (B and C), or the selection of all three options (A and B and C). This can be expanded for many of the items listed, as would be readily apparent to one of ordinary skill in the art to which this disclosure pertains.

[0062] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit example embodiments. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, it will be further understood that the words "comprises," "comprising," "includes," and / or "comprising," as used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0063] Spatially relative terms such as "below," "below," "low," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature to other elements or features, as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. Thus, for example, if the device in the figures were turned over, an element described as "below" or "below" another element or feature would now be oriented "above" that other element or feature. Thus, the term "below" can encompass both an orientation of above and below. The device may have other orientations (e.g., rotated 90 degrees, rotated to another orientation), and the spatially relative descriptors used herein may be interpreted accordingly. Additionally, when a layer is referred to as being "between" two layers, it should be understood that only the layer between the two layers may be present, or one or more intervening layers may be present.

[0064] Although terms such as "first," "second," etc. may be used herein to describe various elements, it should be understood that these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. Thus, a first element described below may be referred to as a second element without departing from the scope of the present concept.

[0065] The description of various embodiments is provided for illustrative purposes and is not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope of the described embodiments. The terms used herein have been chosen to best explain the principles of the embodiments, practical applications or technical improvements of existing technologies, or to enable others of ordinary skill in the art to which the disclosure pertains to understand the embodiments disclosed herein.

Claims

1. A package structure comprising: a planar core structure having a first side and a second side opposite the first side; an antenna structure disposed on the first side of the planar core structure, a plurality of first stacked layers, each comprising a first patterned conductive layer formed on a first insulating layer; at least one antenna formed on one or more first patterned conductive layers of the first stack, the antenna being L-shaped on a horizontal plane along the first side; the antenna structure comprising: an interface structure disposed on the second side of the planar core structure; an antenna feedline structure formed on and routed through the interface structure and the planar core structure, the antenna feedline structure not being connected to the antenna; A package structure comprising:

2. The package structure of claim 1 , wherein the planar core structure comprises a core substrate formed from an insulating material.

3. 2. The package structure of claim 1, wherein the interface structure comprises a plurality of second stacked layers, each second stacked layer comprising a second patterned conductive layer formed on a second insulating layer.

4. the interface structure comprises a plurality of second stacked layers, each of the second stacked layers including a second patterned conductive layer formed on a second insulating layer; power planes, ground planes, signal lines, and contact pads are formed on one or more patterned second conductive layers of the plurality of second stacked layers of the interface structure; The package structure of claim 1 .

5. The package structure of claim 1 , wherein the antenna structure has four of the antennas that are L-shaped.

6. A package structure as described in Claim 5, wherein the antennas are arranged so that the L-shapes of the four antennas are symmetrical and the corners of the four L-shapes face inward.

7. The packaging structure of claim 1 , further comprising a cage wall structure within said antenna structure, said cage wall surrounding said antenna.

8. The package structure of claim 7 , wherein the cage wall structure is electrically connected to the L-shape through a first ground plane layer of the core structure.

9. 8. The packaging structure of claim 7, wherein the cage wall structure includes a plurality of conductive ground rings extending vertically through the antenna structure, the ground rings being part of the antenna structure.

10. The package structure includes a plurality of the antenna feed line structures, the plurality of antenna feed line structures being a first antenna feed line structure and a second antenna feed line structure; The package structure comprises: a first bridge formed on one of the one or more first patterned conductive layers and connected to the first antenna feedline structure; a second bridge formed on a different one of the one or more first patterned conductive layers and connected to the second antenna feedline structure; Furthermore, The package structure of claim 1 , wherein the first bridge and the second bridge cross each other at a central portion of the package structure.

11. It is a device, A package structure comprising: a planar core structure having a first side and a second side opposite the first side; an antenna structure disposed on the first side of the planar core structure, a plurality of first stacked layers, each comprising a first patterned conductive layer formed on a first insulating layer; at least one antenna formed on one or more first patterned conductive layers of the first stack, the antenna being L-shaped on a horizontal plane along the first side; the antenna structure comprising: an interface structure disposed on the second side of the planar core structure; an antenna feedline structure formed on and routed through the interface structure and the planar core structure, the antenna feedline structure not being connected to the antenna; the package structure comprising: an RFIC (Radio Frequency Integrated Circuit) chip comprising a semiconductor substrate having an active surface and a non-active surface, and a BEOL (Back End of Line) structure formed on the active surface of the semiconductor substrate, the RFIC chip being attached to the package structure by connecting the BEOL structure of the RFIC chip to conductor pads of the interface structure; An apparatus comprising:

12. The apparatus of claim 11 , wherein the planar core structure comprises a core substrate formed from an insulating material.

13. 12. The device of claim 11, wherein the interface structure comprises a plurality of second stacked layers, each second stacked layer comprising a second patterned conductive layer formed on a second insulating layer.

14. the interface structure comprises a plurality of second stacked layers, each of the second stacked layers including a second patterned conductive layer formed on a second insulating layer; power planes, ground planes, signal lines, and contact pads are formed on one or more patterned second conductive layers of the plurality of second stacked layers of the interface structure; 12. The apparatus of claim 11.

15. The apparatus of claim 11 , wherein the antenna structure has four of the antennas in the L-shape.

16. The device described in Claim 15, wherein the antennas are arranged so that the L-shapes of the four antennas are symmetrical and the corners of the four L-shapes face inward.

17. The apparatus of claim 11 , further comprising a cage wall structure within the antenna structure, the cage wall surrounding the antenna.

18. 20. The apparatus of claim 17, wherein the cage wall structure is electrically connected to the L-shape via a first ground plane layer of the core structure.

19. 20. The apparatus of claim 17, wherein the cage wall structure includes a plurality of conductive ground rings extending vertically through the antenna structure, the ground rings being part of the antenna structure.

20. The package structure includes a plurality of the antenna feed line structures, the plurality of antenna feed line structures being a first antenna feed line structure and a second antenna feed line structure; The package structure comprises: a first bridge formed on one of the one or more first patterned conductive layers and connected to the first antenna feedline structure; a second bridge formed on a different one of the one or more first patterned conductive layers and connected to the second antenna feedline structure; Furthermore, The device of claim 11 , wherein the first bridge and the second bridge cross each other at a central portion of the package structure.

21. 1. A method of making a packaging structure, comprising: forming a planar core structure having a first side and a second side opposite the first side; forming an antenna structure on the first side of the planar core structure, the antenna structure comprising: a plurality of first stacked layers, each comprising a first patterned conductive layer formed on a first insulating layer; at least one antenna formed on one or more first patterned conductive layers of the first stack, the antenna being L-shaped on a horizontal plane along the first side; forming the antenna structure, forming an interface structure on the second side of the planar core structure; forming an antenna feedline structure in the interface structure and the planar core structure, the antenna feedline structure being routed through the interface structure and the planar core structure, the antenna feedline structure not being connected to the antenna; A method comprising:

22. 22. The method of claim 21, wherein the antenna structure has four of the antennas in the L-shape.

23. The method described in claim 22, wherein the antennas are arranged so that the L-shapes of the four antennas are symmetrical and the corners of the four L-shapes face inward.

24. 22. The method of claim 21, further comprising forming a cage wall structure within the antenna structure, the cage wall surrounding the antenna.

25. 25. The method of claim 24, wherein the cage wall structure is electrically connected to the L-shape through a first ground plane layer of the core structure.

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