Assembly and harness assembly

Abstract

To provide an assembly having a substrate structure with a small height direction.SOLUTION: An assembly comprises a substrate structure 200 and a plurality of connection parts. The substrate structure 200 includes a main substrate 300 and a sub-substrate 400. The main substrate 300 includes an upper surface 310 and a loser surface in a vertical direction. In the main substrate 300, a housing part 350 is formed. The housing part 350 is concaved from the upper surface 310 of the main substrate 300 to a lower side in the vertical direction. On the upper surface 310 of the main substrate 300, a plurality of upper side main conductive parts 312 is formed. The sub-substrate 400 includes an upper surface 410 and a lower surface in the vertical direction. On the upper surface 410 of the sub-substrate 400, a plurality of upper side sub-conductive parts 412 is formed. The sub-substrate 400 is at least partially housed in the housing part 350. Some of connection parts each connect the upper side main conductive part 312 with the upper side sub-conductive part 412 each other.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present invention relates to an assembly comprising a substrate structure having a primary substrate and a secondary substrate. [Background technology]

[0002] As shown in FIGS. 25 and 26 , Patent Document 1 discloses this type of assembly 900. The assembly 900 includes a substrate structure 910 and a semiconductor element (device) 950. The substrate structure 910 includes a wiring substrate 920 and an interposer 940. A plurality of electrode pads 922 are formed on the +Z surface of the wiring substrate 920. The interposer 940 has a plurality of contacts 942. The device 950 is mounted on the interposer 940 of the substrate structure 910. A plurality of electrode pads 952 are formed on the -Z surface of the device 950. The interposer 940 electrically connects the electrode pads 952 of the device 950 to the electrode pads 922 of the wiring substrate 920 via the contacts 942. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-144159 Summary of the Invention [Problem to be solved by the invention]

[0004] Substrate structure of Patent Document 1 910 However, there is a problem in that the size in the height direction (Z direction) is large.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an assembly having a substrate structure with a small size in the height direction. [Means for solving the problem]

[0006] The present invention provides a first assembly, An assembly comprising a substrate structure and a plurality of connection portions, The substrate structure includes a main substrate and a sub-substrate, the main substrate has an upper surface and a lower surface in the vertical direction, The main board has a housing portion formed thereon, the housing portion is recessed downward in the up-down direction from the upper surface of the main board, a plurality of upper main conductive portions formed on the upper surface of the main substrate; the sub-substrate has an upper surface and a lower surface in the vertical direction, a plurality of upper sub-conductive portions are formed on the upper surface of the sub-substrate; the sub-board is at least partially accommodated in the accommodation portion, Some of the connecting portions connect the upper main conductive portion and the upper sub-conductive portion to each other. An assembly is provided.

[0007] Furthermore, the present invention provides a second assembly, which is a first assembly, the housing portion penetrates the main board in the up-down direction, a plurality of lower main conductive portions are formed on the lower surface of the main substrate; a plurality of lower sub-conductive portions are formed on the lower surface of the sub-substrate; Some of the connecting portions connect the lower main conductive portion and the lower sub-conductive portion to each other. An assembly is provided.

[0008] The present invention also provides a third assembly, which is the second assembly, the sub-substrate has a side surface in a direction perpendicular to the up-down direction, a side connection portion is provided on the side surface of the sub-board, the side connection portion extends from the upper surface of the sub-board to the lower surface of the sub-board, Some of the lower sub-conductive portions are connected to some of the upper sub-conductive portions by the side connection portions. An assembly is provided.

[0009] Furthermore, the present invention provides a fourth assembly, which is the first or second assembly, the main substrate has a main conductive exposed portion; the main conductive exposed portion is exposed on an inner wall surface of the housing portion, the exposed main conductive portion is connected to the upper main conductive portion, the sub-substrate has a side surface in a direction perpendicular to the up-down direction, the secondary substrate has a secondary conductive exposed portion, the secondary conductive exposed portion is exposed on the side surface, The secondary conductive exposed portion is connected to the upper secondary conductive portion. An assembly is provided.

[0010] The present invention also provides a fifth assembly, which is the fourth assembly, The secondary conductive exposed portion is connected to the upper secondary conductive portion on the side surface of the secondary substrate. An assembly is provided.

[0011] Furthermore, the present invention provides a sixth assembly, which is the fourth assembly, The main substrate further comprises a main inner conductor; the main inner conductor is connected to the upper main conductive portion; the exposed main conductive portion is a part of the main inner conductor, The sub-substrate further includes a sub-internal conductor; the sub-inner conductor is connected to the upper sub-conductive portion, the secondary conductive exposed portion is a part of the secondary inner conductor, When the sub-board is accommodated in the accommodation portion, the primary conductive exposed portion is connected to the secondary conductive exposed portion. An assembly is provided.

[0012] Furthermore, the present invention provides a seventh assembly, which is any one of the fourth to sixth assemblies, At least one of the primary conductive exposed portion and the secondary conductive exposed portion has elasticity. An assembly is provided.

[0013] Furthermore, the present invention provides an eighth assembly, which is any one of the first to seventh assemblies, Some of the connection portions are separate from the substrate structure. An assembly is provided.

[0014] Furthermore, the present invention provides a ninth assembly, which is any one of the first to eighth assemblies, the upper main conductive portion includes a first upper main conductive portion and a second upper main conductive portion; the first upper main conductive portion is located in front of the accommodating portion in a front-rear direction perpendicular to the up-down direction, the second upper main conductive portion is located behind the accommodation portion in the front-rear direction, The first upper main conductive portion is connected to the second upper main conductive portion via the upper sub-conductive portion and a part of the connecting portion. An assembly is provided.

[0015] Furthermore, the present invention provides a tenth assembly, which is any one of the first to ninth assemblies, the assembly further comprising a device having a device connection; the device is mounted on the sub-substrate; The device connection portion is connected to the upper secondary conductive portion. An assembly is provided.

[0016] The present invention also provides a first harness assembly, the main board has a front end and a rear end in a front-rear direction perpendicular to the up-down direction, The front end of the main board is connected to the connector, The rear end of the main board is connected to the electric wire. A harness assembly is provided. [Effects of the Invention]

[0017] The assembly of the present invention is configured as follows: the main substrate has a receiving portion formed therein; the receiving portion is recessed downward in the vertical direction from the upper surface of the main substrate; and the sub-substrate is at least partially received in the receiving portion. As a result, the assembly of the present invention includes a substrate structure having a small size in the height direction. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a top perspective view showing a harness assembly according to an embodiment of the present invention, in which the outline of the harness assembly is shown by dotted lines and a device is mounted on a sub-board. [Figure 2] FIG. 2 is a top view showing the harness assembly of FIG. 1. [Figure 3] 3 is a cross-sectional view of the harness assembly of Fig. 2 taken along line AA, in which a portion of the assembly is shown enlarged. [Figure 4] FIG. 2 is a bottom perspective view showing the harness assembly of FIG. 1. [Figure 5] FIG. 2 is a bottom view showing the harness assembly of FIG. 1. [Figure 6] 6 is a cross-sectional view showing the harness assembly of FIG. 5 along line BB. [Figure 7] FIG. 2 is a cross-sectional perspective view showing the harness assembly of FIG. 1. [Figure 8] FIG. 5 is a cross-sectional perspective view showing the harness assembly of FIG. 4. [Figure 9] FIG. 2 is a front view showing the harness assembly of FIG. [Figure 10] FIG. 2 is a side view showing the harness assembly of FIG. 1. [Figure 11] 2 is a top perspective view showing the harness assembly of FIG. 1, in which some of the devices and connections are omitted. [Figure 12] FIG. 12 is a top view showing the harness assembly of FIG. [Figure 13]12 is a top perspective view showing a board structure included in the harness assembly of FIG. 11. In the figure, the sub-board is housed in a housing portion of the main board. [Figure 14] FIG. 14 is a top view showing the substrate structure of FIG. [Figure 15] FIG. 14 is a bottom perspective view showing the substrate structure of FIG. [Figure 16] FIG. 14 is a bottom view showing the substrate structure of FIG. [Figure 17] FIG. 14 is a front view showing the substrate structure of FIG. [Figure 18] 14 is a top perspective view showing a main inner conductor and a sub-inner conductor included in the substrate structure of FIG. 13. FIG. [Figure 19] 19 is a top view showing the main inner conductor and the sub-inner conductor of FIG. 18. FIG. [Figure 20] 19 is a front view showing the main inner conductor and the sub-inner conductor of FIG. 18. FIG. [Figure 21] 19 is a side view showing the main inner conductor and the sub-inner conductor of FIG. 18. FIG. [Figure 22] 14 is another top perspective view showing the substrate structure of Fig. 13. In the figure, the sub-substrate is not accommodated in the accommodation portion of the main substrate. [Figure 23] FIG. 23 is a bottom perspective view showing the substrate structure of FIG. 22. [Figure 24] FIG. 23 is a front view showing the substrate structure of FIG. 22. [Figure 25] FIG. 1 is a perspective view showing an assembly of Patent Document 1. [Figure 26] 26 is a partially cutaway perspective view showing an interposer included in the assembly of FIG. 25. DETAILED DESCRIPTION OF THE INVENTION

[0019] As shown in FIG. 1, a harness assembly 10 according to an embodiment of the present invention includes an assembly 100, a connector 700, and electric wires 800.

[0020] 1, connector 700 of this embodiment is a plug. Connector 700 can be mated with a mating connector (not shown) located in front of connector 700 along the front-rear direction from the rear of the mating connector. In this embodiment, the front-rear direction is the X direction. Here, the front is the +X direction and the rear is the -X direction.

[0021] 1, the number of electric wires 800 in this embodiment is plural. However, the present invention is not limited to this, and the number of electric wires 800 may be one. As shown in FIG. 7, the electric wire 800 has a central conductor 810 and an outer conductor 820.

[0022] As shown in FIG. 2, the assembly 100 of this embodiment includes a substrate structure 200 and a plurality of connection portions 500.

[0023] As shown in FIG. 14, the substrate structure 200 of this embodiment includes a main substrate 300 and a sub-substrate 400.

[0024] As shown in FIG. 14, the main board 300 has a front end 302 and a rear end 304 in the front-rear direction perpendicular to the up-down direction. In this embodiment, the up-down direction is the Z direction. Here, the up-down direction is the +Z direction, and the down-down direction is the -Z direction. The up-down direction is also the height direction of the substrate structure 200. As can be seen from FIGS. 2 and 14, the front end 302 of the main board 300 is connected to the connector 700. The rear end 304 of the main board 300 is connected to the electric wire 800.

[0025] 14, the main board 300 of this embodiment has a main holding member 305. The main holding member 305 is made of resin. Note that the main board 300 is not a glass epoxy board.

[0026] As shown in FIG. 22, the main board 300 has a housing portion 350 formed thereon.

[0027] 22, the storage section 350 of this embodiment penetrates the main substrate 300 in the vertical direction. However, the present invention is not limited to this, and the storage section 350 may be recessed downward in the vertical direction from the upper surface 310 of the main substrate 300. In other words, the storage section 350 may have a bottom surface that defines the lower end in the vertical direction. The storage section 350 has an inner wall surface 352.

[0028] As shown in FIGS. 14 and 16, the main board 300 has an upper surface 310 and a lower surface 320 in the vertical direction.

[0029] 14, the upper surface 310 of the main substrate 300 faces upward in the vertical direction. The upper surface 310 is a plane perpendicular to the vertical direction. A plurality of upper main conductive portions 312 are formed on the upper surface 310 of the main substrate 300.

[0030] As shown in FIG. 14, the upper main conductive portion 312 of this embodiment includes a first upper main conductive portion 3122 and a second upper main conductive portion 3124.

[0031] 14, the first upper main conductive portion 3122 of the present embodiment is located in front of the accommodating portion 350 in the front-rear direction perpendicular to the up-down direction. The first upper main conductive portion 3122 includes a main wiring path 314 and a ground connection portion 316.

[0032] 14, the main wiring path 314 in this embodiment is a copper wiring pattern. The main wiring path 314 is exposed on the upper surface 310 of the main board 300. A portion of the main wiring path 314 extends in the front-rear direction on the upper surface 310 and reaches the accommodation portion 350.

[0033] 14, the ground connection portion 316 of this embodiment is exposed on the upper surface 310 of the main board 300. The ground connection portion 316 is located near the front end 302 of the main board 300.

[0034] 14 , the second upper main conductive part 3124 in this embodiment is located behind the accommodating part 350 in the front-rear direction. The second upper main conductive part 3124 is exposed on the upper surface 310 of the main board 300. The second upper main conductive part 3124 extends in the front-rear direction from the accommodating part 350 to the rear end of the main holding member 305.

[0035] 16, lower surface 320 of main substrate 300 faces downward in the vertical direction. Lower surface 320 is a plane perpendicular to the vertical direction. A plurality of lower main conductive portions 322 are formed on lower surface 320 of main substrate 300.

[0036] 16, lower main conductive portion 322 of the present embodiment is a wiring pattern made of copper. Lower main conductive portion 322 includes a first lower main conductive portion (3222) and a second lower main conductive portion (3224).

[0037] 16, the first lower main conductive portion 3222 of this embodiment is located in front of the accommodating portion 350 in the front-rear direction perpendicular to the up-down direction. Bottom surface 320 A portion of first lower main conductive portion 3222 extends in the front-rear direction on lower surface 320 and reaches accommodating portion 350.

[0038] 16, the second lower main conductive portion 3224 is located behind the accommodating portion 350 in the front-rear direction. Bottom surface 320 The second lower main conductive portion 3224 extends in the front-rear direction from the accommodating portion 350 to the rear end of the main holding member 305.

[0039] As shown in FIG. 3, the main board 300 further comprises a main inner conductor 340 .

[0040] 18 , the main inner conductor 340 of this embodiment is made of metal. The main inner conductor 340 has a substantially flat plate shape. As shown in FIG. 3 , a portion of the main inner conductor 340 is embedded in the main holding member 305. The main inner conductor 340 forms a ground and suppresses electrical interference between the main wiring path 314 and the first lower main conductor 3222 and between the second upper main conductor 3124 and the second lower main conductor 3224. The main inner conductor 340 has a front main inner conductor 343 and a rear main inner conductor 344.

[0041] 19 , in this embodiment, the front main inner conductor 343 and the rear main inner conductor 344 are separate bodies. The front main inner conductor 343 defines the front end of the main inner conductor 340 in the front-rear direction. The front main inner conductor 343 is located in front of the rear main inner conductor 344 in the front-rear direction. As can be seen from FIGS. 14 and 18 , the front main inner conductor 343 is connected to the ground connection portion 316. That is, the main inner conductor 340 is connected to the upper main conductive portion 312. The front main inner conductor 343 is not connected to the main wiring path 314.

[0042] Figure 14 and 19, the rear main inner conductor 344 of this embodiment defines the rear end of the main inner conductor 340 in the front-rear direction. 304 The rear main inner conductor 344 is located rearward of the front main inner conductor 343 in the front-rear direction. As shown in FIG. 14 , a rear portion of the rear main inner conductor 344 is exposed from the main holding member 305. As shown in FIG. 7 , the outer conductor 820 of the electric wire 800 is connected to the rear portion of the rear main inner conductor 344.

[0043] 3, the main substrate 300 has a main conductive exposed portion 342. The main conductive exposed portion 342 is a part of the main inner conductor 340.

[0044] As shown in FIG. 22 , the main conductor exposed portion 342 of this embodiment is exposed on the inner wall surface 352 of the accommodating portion 350. The main conductor exposed portion 342 is exposed from the main holding member 305. The main conductor exposed portion 342 is elastic. That is, the main conductor exposed portion 342 is configured to be elastically deformable. As shown in FIG. 19 , the main conductor exposed portion 342 is connected to the ground connection portion 316. That is, the main conductor exposed portion 342 is connected to the upper main conductor portion 312. Note that, referring to FIG. 22 , the main conductor exposed portion 342 is not connected to the upper main conductor portion 312 on the inner wall surface 352 of the accommodating portion 350.

[0045] As shown in FIG. 19, the primary conductive exposed portion 342 includes a front primary conductive exposed portion 3422 and a rear primary conductive exposed portion 3424 .

[0046] 19 , the front main conductive exposed portion 3422 of this embodiment is provided on the front main inner conductor 343. More specifically, the front main conductive exposed portion 3422 is provided at the rear end of the front main inner conductor 343. The front main conductive exposed portion 3422 is connected to the ground connection portion 316.

[0047] 19 , the rear main conductive exposed portion 3424 of this embodiment is provided on the rear main inner conductor 344. More specifically, the rear main conductive exposed portion 3424 is provided at the front end of the rear main inner conductor 344.

[0048] As shown in FIG. 22, the main board 300 has a plurality of restricting portions 360.

[0049] As shown in Figure 22, each of the restriction portions 360 in this embodiment is recessed outward in the left-right direction. Each of the restriction portions 360 communicates with the storage portion 350 in the left-right direction. In this embodiment, the left-right direction is the Y direction. The restriction portions 360 open upward in the up-down direction.

[0050] As shown in Fig. 22, the sub-substrate 400 of this embodiment is separate from the main substrate 300. As shown in Fig. 14, the sub-substrate 400 has a sub-holding member 405. The sub-holding member 405 is made of resin. Note that the sub-substrate 400 is not a glass epoxy substrate.

[0051] 3 and 14, the sub-substrate 400 of this embodiment is completely accommodated in the accommodation portion 350. That is, when the sub-substrate 400 is accommodated in the accommodation portion 350, the sub-substrate 400 does not protrude in the vertical direction from the main substrate 300. However, the present invention is not limited to this, and it is sufficient that the sub-substrate 400 is at least partially accommodated in the accommodation portion 350. As a result, the substrate structure 200 of this embodiment has a reduced size in the height direction.

[0052] 14 and 16, the sub-substrate 400 has an upper surface 410 and a lower surface 420 in the vertical direction.

[0053] 14, the upper surface 410 of the present embodiment faces upward in the vertical direction. The upper surface 410 is a plane perpendicular to the vertical direction. A plurality of upper sub-conductive portions 412 are formed on the upper surface 410 of the sub-substrate 400.

[0054] As shown in FIG. 14, the upper sub-conductive portion 412 of this embodiment includes a sub-wiring path 414 and a connected portion 416.

[0055] 14, the sub-wiring path 414 of this embodiment is exposed on the upper surface 410 of the sub-substrate 400. The sub-wiring path 414 includes a front sub-wiring path 4142 and a rear sub-wiring path 4144.

[0056] 14, the front sub-wiring path 4142 of this embodiment extends in the front-rear direction and reaches the front end of the sub-board 400. The front sub-wiring path 4142 is located in front of the rear sub-wiring path 4144 in the front-rear direction.

[0057] 14, the rear sub-wiring path 4144 of this embodiment extends in the front-to-rear direction and reaches the rear end of the sub-substrate 400. The rear sub-wiring path 4144 is located behind the front sub-wiring path 4142 in the front-to-rear direction.

[0058] 14, the receptacle 416 in this embodiment is exposed on the upper surface 410 of the sub-board 400. The receptacle 416 is located in the center of the sub-board 400 in the front-to-rear direction. The receptacle 416 is located between the front sub-wiring path 4142 and the rear sub-wiring path 4144 in the front-to-rear direction.

[0059] As shown in FIG. 16, the lower surface 420 of this embodiment is downward The lower surface 420 is a plane perpendicular to the up-down direction. A plurality of lower sub-conductive portions 422 are formed on the lower surface 420 of the sub-substrate 400. The lower sub-conductive portions 422 are exposed on the lower surface 420 of the sub-substrate 400.

[0060] As shown in FIG. 24, the sub-substrate 400 has a side surface 430 in a direction perpendicular to the up-down direction.

[0061] 3, the side surfaces 430 in this embodiment define the front-to-rear end portions of the sub-substrate 400. More specifically, the sub-substrate 400 has two side surfaces 430, one of which is the front surface of the sub-substrate 400 and the other of which is the rear surface of the sub-substrate 400.

[0062] As shown in FIG. 3, the secondary substrate 400 further includes a secondary inner conductor 440 .

[0063] Referring to FIG. 18 , the sub-internal conductor 440 of this embodiment is made of metal. The sub-internal conductor 440 has a generally flat plate shape. The sub-internal conductor 440 forms a ground and suppresses electrical interference between the sub-wiring path 414 and the lower sub-conductive portion 422. The connected portion 416 is connected to the sub-internal conductor 440. That is, the sub-internal conductor 440 is connected to the upper sub-conductive portion 412. The sub-wiring path 414 is not connected to the sub-internal conductor 440. As shown in FIG. 3 , a portion of the sub-internal conductor 440 is embedded in the sub-holding member 405. When the sub-substrate 400 is accommodated in the accommodating portion 350, the sub-internal conductor 440 is located between the front main internal conductor 343 and the rear main internal conductor 344 in the front-rear direction. That is, when the sub-substrate 400 is accommodated in the accommodating portion 350, the front main internal conductor 343 is located in front of the sub-internal conductor 440 in the front-rear direction. Furthermore, when the sub-board 400 is accommodated in the accommodating portion 350, the rear main inner conductor 344 is located behind the sub-inner conductor 440 in the front-rear direction.

[0064] As shown in FIG. 24, the secondary substrate 400 has secondary conductive exposed portions 432 and 442 .

[0065] 24, the secondary conductive exposed portions 432, 442 of this embodiment are exposed on the side surface 430. The secondary conductive exposed portion 432 is also referred to as a side surface connecting portion 432. The secondary conductive exposed portion 442 is also referred to as a secondary inner conductor exposed portion 442.

[0066] As shown in FIG. 22, the side connection portion 432 of this embodiment is provided on the side surface 430 of the sub-substrate 400. The side connection portion 432 is connected to the sub-wiring path 414 on the side surface 430 of the sub-substrate 400. That is, the sub-conductive exposed portion 432are connected to the upper sub-conductive portions 412 on the side surface 430 of the sub-substrate 400. With reference to FIGS. 22 and 23 , the side surface connecting portions 432 extend from the upper surface 410 of the sub-substrate 400 to the lower surface 420 of the sub-substrate 400. Some of the lower sub-conductive portions 422 are connected to some of the sub-wiring paths 414 by the side surface connecting portions 432. That is, some of the lower sub-conductive portions 422 are connected to some of the upper sub-conductive portions 412 by the side surface connecting portions 432.

[0067] As described above, the sub-substrate 400 is not a glass epoxy substrate, but rather a portion of the sub-internal conductor 440 is embedded in the resin sub-holding member 405, and the sub-substrate 400 is provided with a side connection portion 432 connecting the upper sub-conductive portion 412 and the lower sub-conductive portion 422. If the sub-substrate 400 were made of a glass epoxy substrate and the sub-internal conductor 440 were made of an inner layer of the glass epoxy substrate, a portion corresponding to the side connection portion 432 could not be formed on the side of the glass epoxy substrate. Therefore, via holes connecting the upper sub-conductive portion 412 and the lower sub-conductive portion 422 would be formed in the glass epoxy substrate instead of the side connection portion 432. In this case, the inner layer corresponding to the sub-internal conductor 440 must be formed so as to avoid the via holes. Therefore, the inner layer lacks shielding between the sub-wiring path 414 and the lower sub-conductive portion 422 at the locations avoiding the via holes. On the other hand, in the sub-board 400 of this embodiment, the side connection portion 432 connecting the upper sub-conductor 412 and the lower sub-conductor 422 is provided on the side surface 430. As a result, the sub-board 400 of this embodiment does not have the above-mentioned problem of lack of shielding, and the sub-inner conductor 440 can completely shield the space between the sub-wiring path 414 and the lower sub-conductor 422, thereby improving the shielding effect of the sub-inner conductor 440.

[0068] The main substrate 300 of this embodiment can also provide the same effects as those of the sub-substrate 400 described above.

[0069] As shown in FIG. 19 , the sub-internal conductor exposed portion 442 in this embodiment is a part of the sub-internal conductor 440. That is, the sub-internal conductor exposed portion 442 is a part of the sub-internal conductor 440. The sub-internal conductor exposed portion 442 is connected to the connected portion 416. That is, the sub-internal conductor exposed portion 442 is connected to the upper sub-conductive portion 412. As shown in FIG. 3 , when the sub-substrate 400 is accommodated in the accommodating portion 350, the main conductor exposed portion 342 and the sub-internal conductor exposed portion 442 are in contact with each other. In other words, when the sub-substrate 400 is accommodated in the accommodating portion 350, the main conductor exposed portion 342 is connected to the sub-internal conductor exposed portion 442. That is, when the sub-substrate 400 is accommodated in the accommodating portion 350, the main conductor exposed portion 342 is connected to the sub-internal conductor exposed portion 442. The sub-internal conductor exposed portion 442 is not configured to be elastically deformable.

[0070] As described above, in the substrate structure 200 of this embodiment, the primary conductive exposed portion 342 has elasticity, but the present invention is not limited to this, and the secondary inner conductor exposed portion 442 may also have elasticity. That is, it is sufficient that at least one of the primary conductive exposed portion 342 and the secondary conductive exposed portion 442 has elasticity. This ensures a stable connection between the primary conductive exposed portion 342 and the secondary conductive exposed portion 442.

[0071] As shown in FIG. 19, the sub-inner conductor exposed portion 442 has a front sub-inner conductor exposed portion 4422 and a rear sub-inner conductor exposed portion 4424 .

[0072] 19 , the front sub-internal conductor exposed portion 4422 of the present embodiment defines the front end of the sub-substrate 400 in the front-rear direction. The front sub-internal conductor exposed portion 4422 is located in front of the rear sub-internal conductor exposed portion 4424 in the front-rear direction. The front sub-internal conductor exposed portion 4422 is located in front of the connected portion 416 in the front-rear direction. As shown in FIG. 3 , when the sub-substrate 400 is accommodated in the accommodation portion 350, the front sub-internal conductor exposed portion 4422 is connected to the front main conductor exposed portion 3422.

[0073] 19 , the rear sub-internal conductor exposed portion 4424 of the present embodiment defines the rear end of the sub-substrate 400 in the front-rear direction. The rear sub-internal conductor exposed portion 4424 is located rearward of the front sub-internal conductor exposed portion 4422 in the front-rear direction. The rear sub-internal conductor exposed portion 4424 is located rearward of the connected portion 416 in the front-rear direction. As shown in FIG. 3 , when the sub-substrate 400 is accommodated in the accommodation portion 350, the rear sub-internal conductor exposed portion 4424 is connected to the rear main conductor exposed portion 3424.

[0074] As shown in FIG. 22, the sub-substrate 400 has a plurality of restricted portions 460.

[0075] As shown in Fig. 22, each of the regulated portions 460 in this embodiment protrudes outward in the left-right direction. The regulated portions 460 correspond to the regulating portions 360, respectively. Referring to Figs. 14 and 22, when the sub-board 400 is housed in the housing portion 350, each of the regulated portions 460 is housed in the corresponding regulating portion 360. This prevents the sub-board 400 from being misaligned with respect to the main board 300 in an orthogonal plane perpendicular to the up-down direction when the sub-board 400 is housed in the housing portion 350.

[0076] As shown in FIGS. 3 and 19, the connection portion 500 of this embodiment includes a plurality of first connection portions 510, a plurality of second connection portions 520, and a plurality of third connection portions 530.

[0077] 3, the first connection portion 510 of the present embodiment is separate from the substrate structure 200. More specifically, the first connection portion 510 is a chip capacitor or a zero-ohm resistor. The first connection portion 510 includes a plurality of first upper connection portions 512 and a plurality of first lower connection portions 514.

[0078] 2, the first upper connection portion 512 of the present embodiment is located on the upper surface 310 of the main substrate 300. The first upper connection portion 512 is located on the upper surface 410 of the sub-substrate 400. With reference to FIGS. 2 and 14, the first upper connection portion 512 connects the main wiring path 314 of the first upper main conductive portion 3122 and the front sub-wiring path 4142 of the sub-wiring path 414 of the upper sub-conductive portion 412 to each other.

[0079] As shown in FIG. 5, the first lower connection portion 514 of this embodiment is located on the lower surface 320 of the main board 300. First lower connection portion 514 is located on the lower surface 420 of the sub-substrate 400. Referring to Figures 5 and 16, the first lower connection portion 514 connects the first lower main conductive portion 3222 and the lower sub-conductive portion 422 to each other.

[0080] 3, the second connection portion 520 of the present embodiment is a separate body from the substrate structure 200. More specifically, the second connection portion 520 is a chip capacitor or a zero-ohm resistor.

[0081] As described above, the first connecting portion 510 and the second connecting portion 520 are separate from the substrate structure 200. That is, some of the connecting portions 500 are separate from the substrate structure 200.

[0082] Referring to FIG. 3, the second connection portion 520 includes a plurality of second upper connection portions 522 and a plurality of second lower connection portions 524 .

[0083] 2, the second upper connection portion 522 of the present embodiment is located on the upper surface 310 of the main substrate 300. The second upper connection portion 522 is located on the upper surface 410 of the sub-substrate 400. With reference to FIGS. 2 and 14, the second upper connection portion 522 connects the rear sub-wiring path 4144 of the sub-wiring path 414 of the upper sub-conductive portion 412 and the second upper main conductor 3124 to each other.

[0084] 5, the second lower connection portion 524 in this embodiment is located on the lower surface 320 of the main substrate 300. The second lower connection portion 524 is located on the lower surface 420 of the sub-substrate 400. With reference to FIGS. 5 and 16, the second lower connection portion 524 connects the lower sub-conductive portion 422 and the second lower main-conductive portion 3224 to each other.

[0085] As described above, the first lower connection portion 514 connects the first lower main conductive portion 3222 and the lower sub-conductive portion 422 to each other, and the second lower connection portion 524 connects the lower sub-conductive portion 422 and the second lower main conductive portion 3224 to each other. That is, some of the connection portions 500 each connect the lower main conductive portion 322 and the lower sub-conductive portion 422 to each other.

[0086] As shown in FIG. 19, the third connecting portion 530 of this embodiment includes a third front connecting portion 532 and a third rear connecting portion 534.

[0087] 19 , the third front connection portion 532 of the present embodiment is configured with a front main conductor exposed portion 3422 and a front auxiliary inner conductor exposed portion 4422. The front main inner conductor 343 and the auxiliary inner conductor 440 are connected to each other via the third front connection portion 532. As described above, the ground connection portion 316 is connected to the front main inner conductor 343, and the connected portion 416 is connected to the auxiliary inner conductor 440. In this way, the third front connection portion 532 connects the ground connection portion 316 and the connected portion 416 to each other.

[0088] As described above, the first upper connection portion 512 connects the main wiring path 314 and the front sub-wiring path 4142 to each other, the second upper connection portion 522 connects the rear sub-wiring path 4144 and the second upper main conductive portion 3124 to each other, and the third front connection portion 532 connects the ground connection portion 316 and the connected portion 416 to each other. That is, some of the connection portions 500 each connect the upper main conductive portion 312 and the upper sub-conductive portion 412 to each other.

[0089] 19 , the third rear connection portion 534 of the present embodiment is composed of a rear auxiliary inner conductor exposed portion 4424 and a rear main conductor exposed portion 3424. The auxiliary inner conductor 440 and the rear main inner conductor 344 are connected to each other via the third rear connection portion 534.

[0090] As shown in FIG. 1, the assembly 100 further comprises a device 600 .

[0091] Referring to FIG. 6 , the device 600 of this embodiment is a semiconductor element. The device 600 is mounted on the sub-substrate 400. The device 600 has a device connection portion 610. The device connection portion 610 is connected to the upper sub-conductive portion 412. More specifically, referring to FIGS. 6 and 14 , some of the device connection portions 610 are connected to the sub-wiring paths 414. The remaining device connection portions 610 are connected to the receptacle portions 416. As described above, the receptacle portions 416 are connected to the sub-internal conductors 440, and therefore the device 600 is connected to the sub-internal conductors 440 via the device connection portions 610 and the receptacle portions 416. This allows the device 600 to use the sub-internal conductors 440 as a heat sink. The device 600 connects the front sub-wiring path 4142 and the rear sub-wiring path 4144 to each other.

[0092] As described above, the first upper connection portion 512 connects the main wiring path 314 and the front sub-wiring path 4142 to each other, the device 600 connects the front sub-wiring path 4142 and the rear sub-wiring path 4144 to each other, and the second upper connection portion 522 connects the rear sub-wiring path 4144 to the second upper main conductive portion 3124. That is, the first upper main conductive portion 3122 is connected to the second upper main conductive portion 3124 via the upper sub-conductor 412, the device 600, and some of the connection portions 500.

[0093] Although the present invention has been specifically described above by presenting an embodiment, the present invention is not limited to this and various modifications are possible.

[0094] In the main board 300 of the present embodiment, the main conductive exposed portion 342 is not connected to the upper main conductive portion 312 on the inner wall surface 352 of the accommodating portion 350, but the present invention is not limited to this. That is, the main conductive exposed portion 342 may be connected to the upper main conductive portion 312 on the inner wall surface 352 of the accommodating portion 350.

[0095] Although the assembly 100 of the present embodiment includes the device 600, the present invention is not limited thereto, and the assembly 100 may not include the device 600. In this case, the connected portion 416 is not formed on the upper surface 410 of the sub-substrate 400, and only the sub-wiring path 414 is formed. That is, in this case, the front sub-wiring path 4142 and the rear sub-wiring path 4144 are directly connected to each other. Therefore, when the assembly 100 does not include the device 600, it is sufficient that the first upper main conductor 3122 is connected to the second upper main conductor 3124 via the upper sub-conductor 412 and some of the connecting portions 500.

[0096] Although the harness assembly 10 of the present embodiment includes the assembly 100, the connector 700, and the electric wires 800, the present invention is not limited to this, and the harness assembly 10 does not necessarily include the connector 700. In other words, the harness assembly 10 may be composed of only the assembly 100 and the electric wires 800. In this case, the front end 302 of the main board 300 of the assembly 100 functions as a card edge connector. [Explanation of symbols]

[0097] 10 Harness assembly 100 assemblies 200 Substrate structure 300 Main Board 302 front end 304 Rear end 305 Main retaining member 310 Top 312 Upper main conductive part 3122 First upper main conductive part 3124 Second upper main conductive part 314 Main wireway 316 Ground connection 320 Bottom 322 Lower main conductive part 3222 First lower main conductive part 3224 Second lower main conductive part 340 Main inner conductor 342 Main conductor exposed part 3422 Front side main conductor exposed part 3424 Rear side main conductor exposed part 343 Front main inner conductor 344 Rear main inner conductor 350 storage unit 352 Inner wall 360 Regulatory Department 400 Sub-board 405 Secondary holding member 410 Top 412 Upper secondary conductive part 414 Sub-wireway 4142 Front Secondary Wireway 4144 Rear sub wireway 416 Connected part 420 Bottom surface 422 Lower sub conductive part 430 Side 432 Side connection part (exposed secondary conductive part) 440 Sub-inner conductor 442 Exposed sub-internal conductor (exposed sub-conductor) 4422 Front sub-inner conductor exposed part 4424 Rear sub-inner conductor exposed part 460 Regulated part 500 Connection 510 First connection part 512 First upper connection part 514 First lower connection 520 Second connection part 522 Second upper connection part 524 Second lower connection 530 Third Connection 532 Third front connection 534 Third rear connection 600 devices 610 Device Connection 700 Connector 800 electric wire 810 Center conductor 820 outer conductor

Claims

1. An assembly comprising a substrate structure and a plurality of connection portions, The substrate structure includes a main substrate and a sub-substrate, the main substrate has an upper surface and a lower surface in the vertical direction, The main board has a housing portion formed thereon, the housing portion is recessed downward in the up-down direction from the upper surface of the main board, a plurality of upper main conductive portions formed on the upper surface of the main substrate; the sub-substrate has an upper surface and a lower surface in the vertical direction, a plurality of upper sub-conductive portions are formed on the upper surface of the sub-substrate; the sub-board is at least partially accommodated in the accommodation portion, some of the connection portions connect the upper main conductive portion and the upper sub-conductive portion to each other, the housing portion penetrates the main board in the up-down direction, a plurality of lower main conductive portions are formed on the lower surface of the main substrate; a plurality of lower sub-conductive portions are formed on the lower surface of the sub-substrate; some of the connection portions connect the lower main conductive portion and the lower sub-conductive portion to each other, the sub-substrate has a side surface in a direction perpendicular to the up-down direction, a side connection portion is provided on the side surface of the sub-board, the side connection portion extends from the upper surface of the sub-board to the lower surface of the sub-board, Some of the lower sub-conductive portions are connected to some of the upper sub-conductive portions by the side connection portions. assembly.

2. An assembly comprising a substrate structure and a plurality of connection portions, The substrate structure includes a main substrate and a sub-substrate, the main substrate has an upper surface and a lower surface in the vertical direction, The main board has a housing portion formed thereon, the housing portion is recessed downward in the up-down direction from the upper surface of the main board, a plurality of upper main conductive portions formed on the upper surface of the main substrate; the sub-substrate has an upper surface and a lower surface in the vertical direction, a plurality of upper sub-conductive portions are formed on the upper surface of the sub-substrate; the sub-board is at least partially accommodated in the accommodation portion, some of the connection portions connect the upper main conductive portion and the upper sub-conductive portion to each other, the main substrate has a main conductive exposed portion; the main conductive exposed portion is exposed on an inner wall surface of the housing portion, the exposed main conductive portion is connected to the upper main conductive portion, the sub-substrate has a side surface in a direction perpendicular to the up-down direction, the secondary substrate has a secondary conductive exposed portion, the secondary conductive exposed portion is exposed on the side surface, the secondary conductive exposed portion is connected to the upper secondary conductive portion, The secondary conductive exposed portion is connected to the upper secondary conductive portion on the side surface of the secondary substrate. assembly.

3. An assembly according to claim 2, At least one of the primary conductive exposed portion and the secondary conductive exposed portion has elasticity. assembly.

4. An assembly comprising a substrate structure and a plurality of connection portions, The substrate structure includes a main substrate and a sub-substrate, the main substrate has an upper surface and a lower surface in the vertical direction, The main board has a housing portion formed thereon, the housing portion is recessed downward in the up-down direction from the upper surface of the main board, a plurality of upper main conductive portions formed on the upper surface of the main substrate; the sub-substrate has an upper surface and a lower surface in the vertical direction, a plurality of upper sub-conductive portions are formed on the upper surface of the sub-substrate; the sub-board is at least partially accommodated in the accommodation portion, some of the connection portions connect the upper main conductive portion and the upper sub-conductive portion to each other, the main substrate has a main conductive exposed portion; the main conductive exposed portion is exposed on an inner wall surface of the housing portion, the exposed main conductive portion is connected to the upper main conductive portion, the sub-substrate has a side surface in a direction perpendicular to the up-down direction, the secondary substrate has a secondary conductive exposed portion, the secondary conductive exposed portion is exposed on the side surface, the secondary conductive exposed portion is connected to the upper secondary conductive portion, At least one of the primary conductive exposed portion and the secondary conductive exposed portion has elasticity. assembly.

5. 5. The assembly of claim 4, The main substrate further comprises a main inner conductor; the main inner conductor is connected to the upper main conductive portion; the exposed main conductive portion is a part of the main inner conductor, The sub-substrate further includes a sub-internal conductor; the sub-inner conductor is connected to the upper sub-conductive portion, the secondary conductive exposed portion is a part of the secondary inner conductor, When the sub-board is accommodated in the accommodation portion, the primary conductive exposed portion is connected to the secondary conductive exposed portion. assembly.

6. Assembly according to any one of claims 2 to 5, the housing portion penetrates the main board in the up-down direction, a plurality of lower main conductive portions are formed on the lower surface of the main substrate; a plurality of lower sub-conductive portions are formed on the lower surface of the sub-substrate; Some of the connecting portions connect the lower main conductive portion and the lower sub-conductive portion to each other. assembly.

7. 7. An assembly according to any one of claims 1 to 6, Some of the connection portions are separate from the substrate structure. assembly.

8. 8. An assembly according to any one of claims 1 to 7, the upper main conductive portion includes a first upper main conductive portion and a second upper main conductive portion; the first upper main conductive portion is located in front of the accommodating portion in a front-rear direction perpendicular to the up-down direction, the second upper main conductive portion is located behind the accommodation portion in the front-rear direction, The first upper main conductive portion is connected to the second upper main conductive portion via the upper sub-conductive portion and a part of the connecting portion. assembly.

9. 9. An assembly according to any one of claims 1 to 8, the assembly further comprising a device having a device connection; the device is mounted on the sub-substrate; The device connection portion is connected to the upper secondary conductive portion. assembly.

10. A harness assembly comprising the assembly of claim 9, a connector, and an electric wire, the main board has a front end and a rear end in a front-rear direction perpendicular to the up-down direction, The front end of the main board is connected to the connector, The rear end of the main board is connected to the electric wire. Harness assembly.

11. A harness assembly comprising an assembly, a connector, and an electric wire, the assembly includes a substrate structure and a plurality of connectors; The substrate structure includes a main substrate and a sub-substrate, the main substrate has an upper surface and a lower surface in the vertical direction, The main board has a housing portion formed thereon, the housing portion is recessed downward in the up-down direction from the upper surface of the main board, a plurality of upper main conductive portions formed on the upper surface of the main substrate; the sub-substrate has an upper surface and a lower surface in the vertical direction, a plurality of upper sub-conductive portions are formed on the upper surface of the sub-substrate; the sub-board is at least partially accommodated in the accommodation portion, some of the connection portions connect the upper main conductive portion and the upper sub-conductive portion to each other, the assembly further comprising a device having a device connection; the device is mounted on the sub-substrate; the device connection portion is connected to the upper secondary conductive portion; the main board has a front end and a rear end in a front-rear direction perpendicular to the up-down direction, The front end of the main board is connected to the connector, The rear end of the main board is connected to the electric wire. Harness assembly.

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