Detection Device

Abstract

This detection device includes an annular casing and a sheet-shaped optical sensor including a first flexible substrate provided along the shape of the annular casing, a battery provided on a first surface of the first flexible substrate, a light source provided to the first flexible substrate, a second flexible substrate, and a plurality of photodiodes provided to a detection region of the second flexible substrate. In the optical sensor, one end section of the second flexible substrate is overlapped with one end section of the first flexible substrate, and the second flexible substrate and the first flexible substrate are electrically connected.

Description

[Technical Field]

[0001] The present disclosure relates to a detection device. [Background technology]

[0002] There are known devices that detect biological information from the human body. Patent Document 1 discloses a pulse wave sensor that can measure the pulse wave without restricting the movement of the subject. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-065900 Summary of the Invention [Problem to be solved by the invention]

[0004] If an optical sensor having a plurality of photodiodes, a light source, and a battery are separately secured and housed inside an annular housing, the housing will become large.

[0005] An object of the present disclosure is to provide a small-sized detection device in which an optical sensor having a plurality of photodiodes, a light source, and a battery can be easily accommodated inside an annular housing. [Means for solving the problem]

[0006] A detection device according to one embodiment of the present disclosure includes a ring-shaped housing, a first flexible substrate arranged along the shape of the ring-shaped housing, a battery arranged on the first flexible substrate, a light source arranged on the first flexible substrate, a second flexible substrate, a plurality of photodiodes arranged in a detection area of ​​the second flexible substrate, and a sheet-shaped optical sensor, wherein the optical sensor is configured such that one end of the second flexible substrate overlaps one end of the first flexible substrate, and the second flexible substrate and the first flexible substrate are electrically connected. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing an example of the appearance of the detection device of the first embodiment when a finger is placed inside the detection device, as viewed from the side of the housing. [Figure 2] FIG. 2 is a cross-sectional view taken along the line II-II' shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along the line III-III' shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along the line IV-IV' shown in FIG. [Figure 5] FIG. 5 is a cross-sectional view of the optical sensor module according to the first embodiment before being housed in a housing. [Figure 6] FIG. 6 is a top view of the optical sensor module of FIG. [Figure 7] 7 is a bottom view of the optical sensor module of FIG. 5. FIG. [Figure 8] FIG. 8 is a configuration diagram showing the optical sensor of the first embodiment. [Figure 9] FIG. 9 is a block diagram illustrating an example of the configuration of the optical sensor according to the first embodiment. [Figure 10] FIG. 10 is a circuit diagram of the optical sensor according to the first embodiment. [Figure 11] FIG. 11 is a circuit diagram showing the sensor detection area. [Figure 12] FIG. 12 is a schematic partial cross-sectional view of the optical sensor according to the first embodiment. [Figure 13] FIG. 13 is an explanatory diagram illustrating a procedure for attaching an optical sensor to the first flexible substrate of the first embodiment. [Figure 14] FIG. 14 is a cross-sectional view of the optical sensor module according to the second embodiment before being housed in the housing. [Figure 15] FIG. 15 is a schematic cross-sectional view of the optical sensor according to the second embodiment. [Figure 16] FIG. 16 is a cross-sectional view of the optical sensor module according to the third embodiment before being housed in a housing. [Figure 17] 17 is a top view of the optical sensor module of FIG. 16. FIG. [Figure 18] 18 is a bottom view of the optical sensor module of FIG. 16. FIG. [Figure 19] FIG. 19 is a schematic diagram showing an example of the external appearance of the detection device of the fourth embodiment when an arm is placed inside the detection device, as viewed from the side of the housing. DETAILED DESCRIPTION OF THE INVENTION

[0008] Modes for carrying out the invention (embodiments) will be described in detail with reference to the drawings. The present disclosure is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. Note that the disclosure is merely an example, and any appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present disclosure. Furthermore, for clarity of explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present disclosure. Furthermore, in this specification and each figure, elements similar to those previously described with reference to the preceding figures may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0009] In the present disclosure, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0010] (Embodiment 1) Fig. 1 is a schematic diagram showing an example of the appearance of the detection device of embodiment 1 when a finger is placed inside the detection device as viewed from the side of the housing. Fig. 2 is a cross-sectional view taken along line II-II' in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III' in Fig. 2. Fig. 4 is a cross-sectional view taken along line IV-IV' in Fig. 2.

[0011] 1 and 2 is a ring-shaped device that can be attached to and detached from the human body, and is worn on a detectable object Fg of the human body. The detectable object Fg in the first embodiment is a finger, and may be any of the thumb, index finger, middle finger, ring finger, little finger, etc. The detection device 100 can detect biological information about the living body from the detectable object Fg attached to it.

[0012] 2, the detection device 100 includes a housing 200, and at least a light source 60 and an optical sensor 1 provided on at least a first flexible substrate 70. The housing 200 accommodates the light source 60 and the optical sensor 1 inside. In FIG. 2, components other than the housing 200, the first flexible substrate 70, the light source 60, the light irradiation unit 60R, and the optical sensor 1 are omitted.

[0013] The housing 200 is formed in a ring shape (annular shape) that can be attached to the detection object Fg, and is an attachment member that is attached to a living body. The housing 200 is formed of a housing material such as synthetic resin. The outer surface of the housing 200 is made of a light-blocking resin. This suppresses noise caused by external light. The inner surface of the housing 200 is made of a light-transmitting resin. This allows light emitted by the light source 60 to be irradiated onto the detection object Fg, and light from the detection object Fg to be received by the optical sensor 1.

[0014] In the first embodiment, a case will be described in which the light source 60 and the optical sensor 1 are disposed at positions apart from each other so that the angle formed by the imaginary line connecting the light source 60 and the center of the housing 200 and the imaginary line connecting the optical sensor 1 and the center of the housing 200 is 90 degrees, but the present invention is not limited to this. The angle formed by the imaginary line connecting the light source 60 and the center of the housing 200 and the imaginary line connecting the optical sensor 1 and the center of the housing 200 may be an acute angle or an obtuse angle.

[0015] 2 and 3, the optical sensor 1 is disposed inside the first flexible substrate 70 so that light from the object to be detected Fg can be received by the optical sensor 1. As shown in FIG. 3, a control circuit 123 is disposed outside the first flexible substrate 70.

[0016] 2 and 4, light from the light source 60 is irradiated onto the detection object Fg via a light irradiating portion 60R that protrudes inward. The light irradiating portion 60R is, for example, a translucent convex lens. As shown in FIG. 4, a control circuit 124 is disposed on the outer side of the first flexible substrate 70.

[0017] Fig. 5 is a cross-sectional view of the optical sensor module according to embodiment 1 before being housed in a housing, Fig. 6 is a top view of the optical sensor module of Fig. 5, and Fig. 7 is a bottom view of the optical sensor module of Fig. 5.

[0018] As shown in Figures 2, 3, 4, 5, 6 and 7, the optical sensor module 120 includes an optical sensor 1, a light source 60, a control circuit 122, a control circuit 123, a control circuit 124, a control circuit 126, a battery charging coil 127, and a battery 128 mounted on a first flexible substrate 70.

[0019] 8, the width FW of the second flexible substrate 21 in the first direction Dx is greater than the width SW of the sensor region 10, and the length FL of the second flexible substrate 21 in the second direction Dy is greater than the length SL of the sensor region 10. The width FW of the optical sensor 1 in the first direction Dx is equal to or less than the width W of the first flexible substrate 70 in the first direction Dx, and the length FL of the optical sensor 1 in the second direction Dy is smaller than the length FLL of the first flexible substrate 70 in the second direction Dy.

[0020] The light source 60 is provided in a first area AR1 on the second surface 70A of the first flexible substrate 70. One end 1EA of the optical sensor 1 is provided overlapping one end 70EA of the first flexible substrate 70. Therefore, the length L in the second direction Dy of the optical sensor module 120 is smaller than the sum of the length FL of the optical sensor 1 in the second direction Dy and the length FLL of the first flexible substrate 70 in the second direction Dy.

[0021] Battery charging coil 127 for charging battery 128 is formed by winding a conductor inside third region AR3 on second surface 70A of first flexible substrate 70. Battery charging coil 127 is located at a position different from light source 60 and battery 128, and is disposed between light source 60 and battery 128. Control circuit 122 is provided in second region AR2 on second surface 70A of first flexible substrate 70.

[0022] Control circuit 124 is provided in a first region AF1 on the first surface 70B of first flexible substrate 70. Control circuit 126 is provided in a second region AF2 on the first surface 70B of first flexible substrate 70. Control circuit 123 is provided in a third region AF3 on the first surface 70B of first flexible substrate 70.

[0023] 6, the battery 128 is a film-type lithium ion battery and is bendable. The battery 128 is provided in a fourth area AF4 on the first surface 70B of the first flexible substrate 70. The width of the battery 128 in the first direction Dx is equal to or less than the width W of the first flexible substrate 70 in the first direction Dx, and the length BL of the battery 128 in the second direction Dy is smaller than the length L of the first flexible substrate 70 in the second direction Dy. This allows the battery 128 to be mounted on the first flexible substrate 70 without protruding from the first flexible substrate 70.

[0024] The control circuit 124 is disposed in a first region AF1, which is opposite to the first region AR1 of the first flexible substrate 70. The control circuit 124 controls the light emission of the light source 60, and therefore the light source 60 and the control circuit 124 can be electrically connected together while the distance between them is short, thereby suppressing unnecessary noise.

[0025] A control circuit 122 including the detection circuit 48 is disposed on the second surface 70A of the first flexible substrate 70, and is disposed in a second area AR2 adjacent to the optical sensor 1.

[0026] Alternatively, the control circuit 122 may be arranged in the third region AF, and the control circuit 123 may be arranged in the second region AR2. In the first flexible substrate 70, the detection circuit 48 is arranged on the opposite side of the optical sensor 1, and the optical sensor 1 and the detection circuit 48 can be electrically connected with a short distance between them, thereby suppressing unnecessary noise.

[0027] As shown in FIG. 7, the light source 60 may be, for example, an inorganic LED (Light Emitting Diode) or an organic EL (Organic Light Emitting Diode). The light source 60 emits light of a predetermined wavelength. In this embodiment, the light source 60 has a first light source 61 that emits red light and a second light source 62 that emits near-infrared light. The first light has a wavelength of, for example, about 660 nm, and the second light has a wavelength of, for example, about 850 nm.

[0028] Based on the first light emitted from the first light source 61 and the second light emitted from the second light source 62, the optical sensor 1 can detect information about the living body, such as pulse waves, pulse rates, and blood vessel images, as well as blood oxygen levels. Red blood cells contained in blood contain hemoglobin. Near-infrared light emitted from the light source 60 is easily absorbed by hemoglobin. In other words, the absorption coefficient of hemoglobin for near-infrared light is higher than that of other parts of the body. Therefore, by reading the amount of light received by multiple photodiodes PD and identifying areas where the amount of near-infrared light received is relatively low, blood vessel patterns such as veins can be detected.

[0029] The reflected near-infrared light and red light also contain information for measuring the oxygen saturation in the blood (hereinafter referred to as blood oxygen saturation (SpO2)). The blood oxygen saturation (SpO2) is the ratio of the amount of oxygen actually bound to hemoglobin to the total amount of oxygen assumed to be bound to all hemoglobin in the blood. The blood oxygen saturation (SpO2) is calculated using the pulse wave acquired by the first light and the pulse wave acquired by the second light.

[0030] Hemoglobin in the blood contains oxygenated hemoglobin and deoxygenated hemoglobin. Blood oxygen saturation (SpO2) is determined by the ratio of hemoglobin in the blood that is bound to oxygen (O2Hb: oxygenated hemoglobin) to that that is not bound to oxygen (HHb: deoxygenated hemoglobin).

[0031] The absorption characteristics of red light are HHb>>O2Hb, with HHb having significantly greater absorbance, whereas the absorption characteristics of near-infrared light are HHb ≒ O2Hb, with O2Hb having slightly greater absorbance.

[0032] This difference in light absorption characteristics can be used to evaluate blood oxygen saturation (SpO2) using the ratio of the near-infrared light measurement value to the red light measurement value.

[0033] In the present disclosure, the light emitted from the light source 60 is not limited to the above. Depending on the application, the light source 60 may emit only near-infrared light having a wavelength of 800 to less than 1000 nm, or may emit only red light having a wavelength of 600 to less than 800 nm.

[0034] The optical sensor 1 has a second flexible substrate 21 , a sensor structure 22 formed on the second flexible substrate 21 , and a protective film 23 covering the sensor structure 22 .

[0035] 8 is a configuration diagram showing the optical sensor of embodiment 1. As shown in FIG. 8, the optical sensor 1 is an optical sensor having a photodiode PD, which is a photoelectric conversion element. The photodiode PD of the optical sensor 1 outputs an electrical signal corresponding to irradiated light as a detection signal Vdet to the signal line selection circuit 16. The optical sensor 1 also performs detection in accordance with a gate drive signal Vgcl supplied from the gate line drive circuit 15.

[0036] The control circuit 122 includes a detection circuit 48 (see FIG. 9). The control circuit 122 is, for example, a field programmable gate array (FPGA). The second connection terminal 29 of the second flexible substrate 21 is electrically connected to the control circuit 122 of the first flexible substrate 70 via an anisotropic conductive film (ACF) 71 (see FIG. 5).

[0037] The control circuit 122 supplies control signals to the optical sensor 1, the gate line driving circuit 15, and the signal line selection circuit 16, and controls the detection operation of the sensor region 10 in the optical sensor 1 (see FIG. 9).

[0038] The charging control circuit 123 controls the power of wireless power transmission, in which electrical energy reaches the battery charging coil 127 from the outside by electromagnetic means. The coupling method for wireless power transmission can be selected from among electromagnetic induction, electromagnetic resonance, radio wave, etc. The control circuit 123 charges the battery 128 using the wirelessly transmitted power.

[0039] The control circuit 124 also supplies a control signal to the light source 60 to control whether the light source 60 is turned on or off. The control circuit 124 also supplies a power supply voltage to the light source 60.

[0040] A control circuit 126 that performs power management supplies voltage signals such as a sensor power supply signal VDDSNS (see FIG. 11) to the photosensor 1, the gate line driving circuit 15, and the signal line selection circuit 16 based on the power of a battery 128.

[0041] The second flexible substrate 21 has a detection area AA and a peripheral area GA. The detection area AA is an area where a plurality of photodiodes PD of the optical sensor 1 are provided. The peripheral area GA is an area between the outer periphery of the detection area AA and the edge of the second flexible substrate 21, and is an area that does not overlap with the photodiodes PD.

[0042] The boundaries between the rectangular detection area AA and the surrounding area GA are sides CP1, CP2, CP3, and CP4 of the detection area AA. The width SW of the detection area AA in the first direction Dx is the distance between sides CP3 and CP4. The length SL of the detection area AA in the DY direction is the distance between sides CP1 and CP2. The width FW of the second flexible substrate 21 in the first direction Dx is greater than the width SW, and the length FL of the second flexible substrate 21 in the second direction Dy is greater than the length SL.

[0043] The gate line driving circuit 15 and the signal line selection circuit 16 are provided in the peripheral area GA. Specifically, the gate line driving circuit 15 is provided in a region of the peripheral area GA extending along the second direction Dy. The signal line selection circuit 16 is provided in a region of the peripheral area GA extending along the first direction Dx, and is provided between the photosensor 1 and the detection circuit 48.

[0044] The first direction Dx is a direction in a plane parallel to the second flexible substrate 21. The second direction Dy is a direction in a plane parallel to the second flexible substrate 21, and is a direction perpendicular to the first direction Dx. The second direction Dy may intersect with the first direction Dx without being perpendicular thereto. The third direction Dz is a direction perpendicular to the first direction Dx and the second direction Dy, and is a normal direction to the second flexible substrate 21.

[0045] 9 is a block diagram showing an example of the configuration of the optical sensor of embodiment 1. As shown in FIG. 9, the detection device 100 further includes a detection control circuit 11 and a detection unit 40. Some or all of the functions of the detection control circuit 11 are included in a control circuit 122. In addition, some or all of the functions of the detection unit 40 other than the detection circuit 48 are included in the control circuit 122.

[0046] The detection control circuit 11 is a circuit that supplies control signals to the gate line drive circuit 15, the signal line selection circuit 16, and the detection unit 40, respectively, and controls their operations. The detection control circuit 11 supplies various control signals, such as a start signal STV, a clock signal CK, and a reset signal RST1, to the gate line drive circuit 15. The detection control circuit 11 also supplies various control signals, such as a selection signal ASW, to the signal line selection circuit 16. The detection control circuit 11 also supplies various control signals to the light source 60, and controls the lighting and non-lighting of each light source.

[0047] The gate line driving circuit 15 is a circuit that drives multiple gate lines GCL (see FIG. 10) based on various control signals. The gate line driving circuit 15 sequentially or simultaneously selects the multiple gate lines GCL and supplies a gate driving signal Vgcl to the selected gate lines GCL. In this way, the gate line driving circuit 15 selects multiple photodiodes PD connected to the gate lines GCL.

[0048] The signal line selection circuit 16 is a switch circuit that sequentially or simultaneously selects a plurality of signal lines SGL (see FIG. 11 ). The signal line selection circuit 16 is, for example, a multiplexer. The signal line selection circuit 16 connects the selected signal line SGL to the detection circuit 48 based on a selection signal ASW supplied from the detection control circuit 11. As a result, the signal line selection circuit 16 outputs a detection signal Vdet of the photodiode PD to the detection unit 40.

[0049] The detection unit 40 includes a detection circuit 48, a signal processing circuit 44, a coordinate extraction circuit 45, a memory circuit 46, a detection timing control circuit 47, and an image processing circuit 49. Based on a control signal supplied from the detection control circuit 11, the detection timing control circuit 47 controls the detection circuit 48, the signal processing circuit 44, the coordinate extraction circuit 45, and the image processing circuit 49 so that they operate in synchronization.

[0050] The detection circuit 48 is, for example, an analog front end (AFE) circuit. The detection circuit 48 is a signal processing circuit having at least the functions of a detection signal amplifier circuit 42 and an A / D conversion circuit 43. The detection signal amplifier circuit 42 amplifies the detection signal Vdet. The A / D conversion circuit 43 converts the analog signal output from the detection signal amplifier circuit 42 into a digital signal.

[0051] The signal processing circuit 44 is a logic circuit that detects a predetermined physical quantity input to the optical sensor 1 based on the output signal of the detection circuit 48. When the object to be detected Fg comes into contact with or close to the detection surface, the signal processing circuit 44 can detect unevenness of the biological surface of the object to be detected Fg or the palm based on the signal from the detection circuit 48. The signal processing circuit 44 can also detect information about the living body based on the signal from the detection circuit 48. The information about the living body includes, for example, the pulse rate and blood oxygen saturation of the object to be detected Fg.

[0052] The signal processing circuit 44 may also acquire detection signals Vdet (information about the living body) simultaneously detected by a plurality of photodiodes PD and average these signals. In this case, the detection unit 40 can suppress measurement errors caused by noise and relative positional deviation between the optical sensor 1 and a detection target such as the detection target Fg, thereby enabling stable detection.

[0053] The memory circuit 46 temporarily stores the signals calculated by the signal processing circuit 44. The memory circuit 46 may be, for example, a RAM (Random Access Memory), a register circuit, or the like.

[0054] The coordinate extraction circuit 45 is a logic circuit that calculates the detection coordinates of the irregularities on the surface of a living body such as a finger when the signal processing circuit 44 detects contact or proximity of a finger. The coordinate extraction circuit 45 is also a logic circuit that calculates the detection coordinates of the blood vessels of the detection object Fg or the palm. The image processing circuit 49 combines the detection signals Vdet output from each photodiode PD of the optical sensor 1 to generate two-dimensional information indicating the shape of the irregularities on the surface of the living body such as the detection object Fg and two-dimensional information indicating the shape of the blood vessels of the detection object Fg or the palm. The coordinate extraction circuit 45 may output the detection signal Vdet as the sensor output Vo without calculating the detection coordinates. The coordinate extraction circuit 45 and the image processing circuit 49 may not be included in the detection unit 40.

[0055] The detection control circuit 11 has a function of comparing information about the detected biometric information with pre-stored authentication information and authenticating the person to be authenticated based on the comparison result. The detection control circuit 11 also has a function of controlling the transmission of information about the detected biometric information to an external device via a communication device (not shown).

[0056] Next, an example of the circuit configuration of the detection device 100 will be described. Fig. 10 is a circuit diagram of the optical sensor of embodiment 1. Fig. 11 is a circuit diagram showing the sensor detection area. Note that Fig. 11 also shows the circuit configuration of the detection circuit 48.

[0057] 10, the optical sensor 1 has a plurality of unit detection areas PAA arranged in a matrix. A photodiode PD is provided in each of the unit detection areas PAA.

[0058] The gate lines GCL extend in the first direction Dx and are connected to the switching elements of the plurality of unit detection areas PAA arranged in the first direction Dx. The plurality of gate lines GCL(1), GCL(2), ..., GCL(8) are arranged in the second direction Dy and are each connected to a gate line driving circuit 15. In the following description, when there is no need to distinguish between the plurality of gate lines GCL(1), GCL(2), ..., GCL(8), they will be simply referred to as gate lines GCL. In addition, for ease of understanding, eight gate lines GCL are shown in FIG. 11, but this is merely an example, and M gate lines GCL (M is 8 or more, for example, M=256) may be arranged.

[0059] The signal line SGL extends in the second direction Dy and is connected to the photodiodes PD of the plurality of unit detection areas PAA arranged in the second direction Dy. The plurality of signal lines SGL(1), SGL(2), ..., SGL(12) are arranged in the first direction Dx and are each connected to the signal line selection circuit 16 and the reset circuit 17. In the following description, when it is not necessary to distinguish between the plurality of signal lines SGL(1), SGL(2), ..., SGL(12), they will simply be referred to as signal lines SGL.

[0060] For ease of understanding, 12 signal lines SGL are shown, but this is merely an example, and N signal lines SGL (N is 12 or more, for example, N=252) may be arranged. 10 Now, between the signal line selection circuit 16 and the reset circuit 17 Sensor Area 10 However, the present invention is not limited to this, and the signal line selection circuit 16 and the reset circuit 17 may be connected to the ends of the signal lines SGL in the same direction.

[0061] The gate line driving circuit 15 outputs various control signals such as a start signal STV, a clock signal CK, and a reset signal RST1 to a control circuit 122 (see FIG. 5, GCL(8) in a time-division manner. Based on various control signals, the gate line drive circuit 15 sequentially selects the multiple gate lines GCL(1), GCL(2), ..., GCL(8). The gate line drive circuit 15 supplies a gate drive signal Vgcl to the selected gate line GCL. As a result, the gate drive signal Vgcl is supplied to the multiple first switching elements Tr connected to the gate line GCL, and the multiple unit detection areas PAA arranged in the first direction Dx are selected as detection targets.

[0062] The gate line driving circuit 15 may perform different driving for each detection mode of the fingerprint detection and the detection of different types of biological information (e.g., pulse, blood oxygen saturation, etc.). For example, the gate line driving circuit 15 may drive a bundle of multiple gate lines GCL.

[0063] Specifically, the gate line driving circuit 15 simultaneously selects a predetermined number of gate lines GCL from among the gate lines GCL(1), GCL(2), ..., GCL(8) based on the control signal. For example, the gate line driving circuit 15 simultaneously selects six gate lines GCL(1) to GCL(6) and supplies the gate driving signal Vgcl to them. The gate line driving circuit 15 supplies the gate driving signal Vgcl to a plurality of first switching elements Tr via the six selected gate lines GCL. As a result, detection area groups PAG1 and PAG2, each including a plurality of unit detection areas PAA arranged in the first direction Dx and the second direction Dy, are selected as detection targets. The gate line driving circuit 15 drives the predetermined number of gate lines GCL in a bundle and sequentially supplies the gate driving signal Vgcl to each of the predetermined number of gate lines GCL.

[0064] The signal line selection circuit 16 has a plurality of selection signal lines Lsel, a plurality of output signal lines Lout, and a third switching element TrS. The plurality of third switching elements TrS are provided corresponding to the plurality of signal lines SGL, respectively. The six signal lines SGL(1), SGL(2), ..., SGL(6) are connected to a common output signal line Lout1. The six signal lines SGL(7), SGL(8), ..., SGL(12) are connected to a common output signal line Lout2. The output signal lines Lout1 and Lout2 are each connected to a detection circuit 48.

[0065] Here, the signal lines SGL(1), SGL(2), ..., SGL(6) are defined as a first signal line block, and the signal lines SGL(7), SGL(8), ..., SGL(12) are defined as a second signal line block. The multiple selection signal lines Lsel are connected to the gates of the third switching elements TrS included in one signal line block. Furthermore, one selection signal line Lsel is connected to the gates of the third switching elements TrS of multiple signal line blocks.

[0066] Specifically, the selection signal lines Lsel1, Lsel2, ..., Lsel6 are connected to the third switching elements TrS corresponding to the signal lines SGL(1), SGL(2), ..., SGL(6), respectively. The selection signal line Lsel1 is connected to the third switching element TrS corresponding to the signal line SGL(1) and the third switching element TrS corresponding to the signal line SGL(7). The selection signal line Lsel2 is connected to the third switching element TrS corresponding to the signal line SGL(2) and the third switching element TrS corresponding to the signal line SGL(8).

[0067] Control circuit 122 (Fig. 5 The third switching element TrS (see reference 1) sequentially supplies the selection signal ASW to the selection signal line Lsel. As a result, the signal line selection circuit 16 sequentially selects the signal lines SGL in one signal line block in a time-division manner through the operation of the third switching element TrS. The signal line selection circuit 16 also selects one signal line SGL in each of the multiple signal line blocks.

[0068] The signal line selection circuit 16 may bundle a plurality of signal lines SGL together and connect them to the detection circuit 48. Specifically, the control circuit 122 (see FIG. 5 ) simultaneously supplies a selection signal ASW to multiple selection signal lines Lsel. As a result, the signal line selection circuit 16 selects multiple signal lines SGL (e.g., six signal lines SGL) in one signal line block through the operation of the third switching element TrS, and connects the multiple signal lines SGL to the detection circuit 48. As a result, signals detected in the detection area groups PAG1 and PAG2 are output to the detection circuit 48. In this case, signals from multiple unit detection areas PAA (photodiodes PD) included in the detection area groups PAG1 and PAG2 are integrated and output to the detection circuit 48.

[0069] By performing detection for each of the detection area groups PAG1 and PAG2 through the operation of the gate line driving circuit 15 and the signal line selection circuit 16, the strength of the detection signal Vdet obtained in one detection is improved, thereby improving the sensor sensitivity. Furthermore, the time required for detection can be shortened. Therefore, the detection device 100 can repeatedly perform detection in a short period of time, improving the S / N ratio and enabling accurate detection of temporal changes in information related to a living body, such as pulse waves.

[0070] 10, the reset circuit 17 includes a reference signal line Lvr, a reset signal line Lrst, and a fourth switching element TrR. The fourth switching element TrR is provided corresponding to the plurality of signal lines SGL. The reference signal line Lvr is connected to one of the sources or drains of the plurality of fourth switching elements TrR. The reset signal line Lrst is connected to the gates of the plurality of fourth switching elements TrR.

[0071] The control circuit 122 supplies a reset signal RST2 to the reset signal line Lrst. This turns on the multiple fourth switching elements TrR, and the multiple signal lines SGL are electrically connected to the reference signal line Lvr. The control circuit 123 supplies a reference signal COM to the reference signal line Lvr. This causes the reference signal COM to be supplied to the capacitive elements Ca (see FIG. 11) included in the multiple unit detection areas PAA.

[0072] As shown in FIG. 11, the unit detection area PAA includes a photodiode PD, a capacitance element Ca, and a first switching element Tr. Of the multiple gate lines GCL, FIG. 11 shows two gate lines GCL(m) and GCL(m+1) aligned in the second direction Dy. Also, of the multiple signal lines SGL, FIG. 11 shows two signal lines SGL(n) and SGL(n+1) aligned in the first direction Dx. The unit detection area PAA is an area surrounded by the gate lines GCL and the signal lines SGL. The first switching element Tr is provided corresponding to the photodiode PD. The first switching element Tr is formed of a thin-film transistor, and in this example, is formed of an n-channel MOS (Metal Oxide Semiconductor) TFT (Thin Film Transistor).

[0073] The gates of the first switching elements Tr belonging to the unit detection areas PAA aligned in the first direction Dx are connected to the gate line GCL, the sources of the first switching elements Tr belonging to the unit detection areas PAA aligned in the second direction Dy are connected to the signal line SGL, and the drains of the first switching elements Tr are connected to the cathodes of the photodiodes PD and the capacitance elements Ca.

[0074] A sensor power supply signal VDDSNS is supplied to the anode of the photodiode PD from the control circuit 123. In addition, a reference signal COM, which becomes the initial potential of the signal line SGL and the capacitance element Ca, is supplied from the control circuit 123 to the signal line SGL and the capacitance element Ca.

[0075] When light is irradiated onto the unit detection area PAA, a current corresponding to the amount of light flows through the photodiode PD, which determines the amount of charge accumulated in the capacitance element Ca. When the first switching element Tr is turned on, a current corresponding to the amount of charge accumulated in the capacitance element Ca flows through the signal line SGL. The signal line SGL is connected to the detection circuit 48 via the third switching element TrS of the signal line selection circuit 16. This allows the detection device 100 to detect a signal corresponding to the amount of light irradiated onto the photodiode PD for each unit detection area PAA or for each detection area group PAG1, PAG2.

[0076] During the readout period, the switch SSW of the detection circuit 48 is turned on, and the detection circuit 48 is connected to the signal line SGL. The detection signal amplifier circuit 42 of the detection circuit 48 converts fluctuations in current supplied from the signal line SGL into fluctuations in voltage and amplifies the voltage. A reference voltage Vref having a fixed potential is input to the non-inverting input terminal (+) of the detection signal amplifier circuit 42, and the signal line SGL is connected to the inverting input terminal (-). In this embodiment, a signal identical to the reference signal COM is input as the reference voltage Vref. The detection signal amplifier circuit 42 also has a capacitance element Cb and a reset switch RSW. During the reset period, the reset switch RSW is turned on, and the charge of the capacitance element Cb is reset.

[0077] With this configuration, the detection device 100 has multiple photodiodes PD, and is therefore able to detect information about the subject Fg's biological body, such as the vein pattern, skin pattern, blood oxygen saturation, and pulse rate, and supply the biological information including the detected information to the outside of the device.

[0078] 12 is a schematic partial cross-sectional view of the optical sensor of Embodiment 1. The optical sensor 1 includes a second flexible substrate 21, a sensor structure 22, and a protective film 23. The second flexible substrate 21 is an insulating base material and is a second flexible substrate formed from a film-like resin.

[0079] The sensor structure 22 includes a TFT layer 221 , a cathode electrode 222 , a photodiode PD, and an anode electrode 226 .

[0080] The TFT layer 221 is provided with TFTs (Thin Film Transistors) such as the first switching elements Tr, and various wirings such as gate lines GCL and signal lines SGL. The second flexible substrate 21 and the TFT layer 221 are a drive circuit board that drives sensors for each predetermined unit detection area PAA, and are also called a backplane.

[0081] The photodiode PD has an active layer 224, a hole transport layer 223 (first carrier transport layer) provided between the active layer 224 and the cathode electrode 222, and an electron transport layer 225 (second carrier transport layer) provided between the active layer 224 and the anode electrode 226. In other words, the hole transport layer 223, the active layer 224, and the electron transport layer 225 of the photodiode PD are stacked in this order in a direction perpendicular to the second flexible substrate 21.

[0082] The characteristics (for example, voltage-current characteristics and resistance value) of the active layer 224 change depending on the light irradiated thereon. An organic material is used as the material of the active layer 224. Specifically, the active layer 224 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed. For example, the active layer 224 is made of a low-molecular organic material such as C60 (fullerene), PCBM (phenyl C61-butyric acid methyl ester), CuPc (copper phthalocyanine), F 16 CuPc (fluorinated copper phthalocyanine), rubrene (5,6,11,12-tetraphenyltetracene), PDI (perylene derivative), etc. can be used.

[0083] The active layer 224 can be formed by a vapor deposition (dry process) using these low molecular weight organic materials. In this case, the active layer 224 is formed by a vapor deposition (dry process) using, for example, CuPc and F 16 CuPc laminated film or rubrene and C 60The active layer 224 may be a laminated film of the above-mentioned low molecular weight organic material and high molecular weight organic material. The active layer 224 may also be formed by a wet process. In this case, the active layer 224 is made of a material that is a combination of the above-mentioned low molecular weight organic material and high molecular weight organic material. Examples of high molecular weight organic materials include P3HT (poly(3-hexylthiophene)), F8BT (F8-alt-benzothiadiazole), etc. The active layer 224 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0084] The hole transport layer 223 and the electron transport layer 225 are provided to facilitate the holes and electrons generated in the active layer 224 to reach the cathode electrode 222 or the anode electrode 226. ,mosquito The active layer 224 is in direct contact with the cathode electrode 222. The active layer 224 is in direct contact with the hole transport layer 223. The hole transport layer 223 is a metal oxide layer. Tungsten oxide (WO3), molybdenum oxide, or the like is used as the metal oxide layer.

[0085] The electron transport layer 225 is in direct contact with the active layer 224, and the anode electrode 226 is in direct contact with the electron transport layer 225. The material used for the electron transport layer 225 is ethoxylated polyethyleneimine (PEIE).

[0086] The materials and manufacturing methods of the hole transport layer 223, the active layer 224, and the electron transport layer 225 are merely examples, and other materials and manufacturing methods may be used.

[0087] The cathode electrode 222 and the anode electrode 226 face each other with the photodiode PD interposed therebetween. The anode electrode 226 is made of a light-transmitting conductive material such as ITO (Indium Tin Oxide). The cathode electrode 222 is made of a metal material such as silver (Ag) or aluminum (Al). Alternatively, the cathode electrode 222 may be made of an alloy material containing at least one of these metal materials.

[0088] By controlling the film thickness of the cathode electrode 222, the cathode electrode 222 can be formed as a semi-transparent electrode having light transmittance. For example, by forming the cathode electrode 222 from a 10 nm-thick Ag thin film, the cathode electrode 222 has a light transmittance of about 60%. In this case, the photodiode PD can detect the first light LD irradiated from, for example, the first face FD side of the optical sensor 1.

[0089] The protective film 23 is provided to cover the anode electrode 226. The protective film 23 is a passivation film and is provided to protect the photodiode PD. The second surface FU (see FIG. 12) of the optical sensor 1 faces the second surface 70A of the first flexible substrate 70 shown in FIG.

[0090] The detection device 100, when attached to the object to be detected Fg, turns on the light source 60 at a detection timing. The detection timing may be, for example, a preset date and time, or when a detection command is received. The light emitted by the turned-on light source 60 is received by the optical sensor 1 through the object to be detected Fg.

[0091] As described above, the detection device 100 includes the annular housing 200, the first flexible substrate 70, the battery 128, the light source 60, and the optical sensor 1. The first flexible substrate 70 is provided along the shape of the annular housing 200. The battery 128 is provided on the first surface 70B of the first flexible substrate 70, and the light source 60 is provided on the second surface 70A of the first flexible substrate 70. The second flexible substrate 21 of the optical sensor 1 overlaps one end 1EA of the second flexible substrate 21 with one end 70EA of the first flexible substrate 70, thereby electrically connecting the second flexible substrate 21 and the first flexible substrate 70. As a result, the optical sensor 1 and the first flexible substrate 70 overlap only at the end 70EA, and the overlapping area of ​​the optical sensor 1 with the first flexible substrate 70 is reduced. The optical sensor 1 protrudes from the first flexible substrate 70. As a result, even if the first flexible substrate 70 goes around the annular housing 200 and overlaps with the optical sensor 1, the thickness can be reduced.

[0092] As shown in Figure 2, The first flexible substrate 70 goes around the annular housing 200. The other end 70EB of the first flexible substrate 70 is , th2 overlaps with flexible substrate 21, and when viewed from the outside to the inside of housing 200, battery 128 and optical sensor 1 overlap. Even when battery 128 overlaps with optical sensor 1, a space can be secured that ensures sufficient capacity.

[0093] 2, in the range where the first flexible substrate 70 goes around the annular housing 200 and overlaps with the second flexible substrate 21 of the optical sensor 1, the optical sensor 1 is located further inside the annular housing 200 than the first flexible substrate 70. Since the second surface 70A of the first flexible substrate 70 faces the inside of the annular housing 200, light is emitted from the light source 60 at a position different from the position where the optical sensor 1 is located, and the light that is transmitted through or reflected by the object to be detected Fg can be received.

[0094] FIG. 13 is an explanatory diagram illustrating a procedure for attaching an optical sensor to a first flexible substrate according to the first embodiment. In the first embodiment, the second connection terminal 29 shown in FIG. 13 is exposed on the first surface 21B. As described above, the second flexible substrate 21 of the optical sensor 1 has the second connection terminal 29 on the first surface 21B of the second flexible substrate 21. The first surface 21B of the second flexible substrate 21 faces the second surface 70A of the first flexible substrate 70. The second connection terminal 29 of the second flexible substrate 21 is superimposed on the first flexible substrate 70 so as to face the first connection terminal 79A exposed on the second surface 70A of the first flexible substrate 70. An ACF 71 (FIG. 5) is interposed between the first connection terminal 79A of the first flexible substrate 70 and the second connection terminal 29, electrically connecting the first connection terminal 79A and the second connection terminal 29. This allows the optical sensor 1 and the first flexible substrate 70 to be electrically connected easily.

[0095] (Embodiment 2) Fig. 14 is a cross-sectional view of the optical sensor module according to embodiment 2 before it is housed in a housing. Fig. 15 is a schematic cross-sectional view of the optical sensor according to embodiment 2. In embodiment 2, the same components as those described in embodiment 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0096] In the optical sensor module 120 of the second embodiment, unlike in the first embodiment, the optical sensor 1 is mounted with its orientation reversed. Therefore, as shown in FIG. 14, the first surface 21B of the second flexible substrate 21 faces the first surface 70B of the first flexible substrate 70. The second flexible substrate 21 has a second connection terminal 29 (see FIG. 8) on the first surface 21B of the second flexible substrate 21. The second connection terminal 29 is overlaid so as to face the first connection terminal exposed on the first surface 70B of the first flexible substrate 70. An ACF 71 is interposed between the first connection terminal of the first flexible substrate 70 and the second connection terminal 29, electrically connecting the first connection terminal and the second connection terminal 29. This facilitates electrical connection between the optical sensor 1 and the first flexible substrate 70.

[0097] 15, the photodiode PD can detect the first light LD that is irradiated from, for example, the second surface FU side of the optical sensor 1. This allows the thickness of the cathode electrode 222 to be increased and made opaque, thereby reducing the electrical resistance of the cathode electrode 222.

[0098] The optical sensor 1 and the first flexible substrate 70 are electrically connected by disposing a low melting point metal 71A such as solder so as to cover the end face of the second flexible substrate 21 of the optical sensor 1.

[0099] (Embodiment 3) Fig. 16 is a cross-sectional view of the optical sensor module according to embodiment 3 before it is housed in a housing. Fig. 17 is a top view of the optical sensor module of Fig. 16. Fig. 18 is a bottom view of the optical sensor module of Fig. 16. In embodiment 3, the same components as those described in embodiments 1 and 2 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0100] As shown in FIGS. 16, 17, and 18, the battery charging coil 127 is disposed at a position overlapping the battery 128 in plan view.

[0101] The length FL of the second flexible substrate 21 of the optical sensor 1 in the second direction Dy is smaller than the length BL of the battery 128 in the second direction Dy. As shown in FIG. 2 , in the area where the first flexible substrate 70 wraps around the annular housing 200 and overlaps with the second flexible substrate 21 of the optical sensor 1, the optical sensor 1 is disposed inside the annular housing 200 relative to the first flexible substrate 70. The battery 128 and the optical sensor 1 overlap on the first flexible substrate 70. Because the area of ​​the battery 128 in a plan view is larger than that of the optical sensor 1, the outer shape of the battery 128 surrounds the outer shape of the optical sensor 1. Therefore, even if the first flexible substrate 70 curves along the shape of the housing, stress applied to the optical sensor 1 is less likely to concentrate locally. As a result, the quality of the optical sensor 1 is improved. In this case, the battery charging coil 127 does not overlap the optical sensor 1.

[0102] (Embodiment 4) 19 is a schematic diagram showing an example of the external appearance of the detection device of embodiment 4, as viewed from the side of the housing, with an arm placed inside the detection device of embodiment 4. In embodiment 4, the same components as those described in embodiments 1, 2, and 3 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0103] 19 is a ring-shaped device that can be attached to and detached from the human body, and is worn on a detection target Fg of the human body. The detection target Fg in the fourth embodiment is the wrist. The detection device 100 can detect biological information about the living body from the detection target Fg attached to it.

[0104] The components of each of the above-described embodiments can be combined as appropriate. Furthermore, other effects and advantages brought about by the aspects described in the present embodiments that are obvious from the description in this specification or that can be conceived by a person skilled in the art are naturally understood to be brought about by the present disclosure. [Explanation of symbols]

[0105] 1 light sensor 10 Sensor Area 21 Second flexible substrate 22 Sensor structure 23 Protective film 29 Second connection terminal 48 Detection circuit 60 light source 60R light irradiation section 61 First light-emitting element 62 second light-emitting element 70 1st flexible substrate 71A Low melting point metal 79A First Connection Terminal 100 Detection device 120 Optical Sensor Module 122, 123, 124, 126 Control circuit 127 Battery charging coil 128 Batteries 200 cabinets

Claims

1. A detection device for detecting biological information from a detection object, comprising: an annular housing in which the detection object is mounted; a first flexible substrate provided along the shape of the annular housing and having a first connection terminal; a battery provided on the first flexible substrate; a light source provided on the first flexible substrate; a second flexible substrate having a second connection terminal; an optical sensor including a plurality of photodiodes provided in a detection region of the second flexible substrate; Including, the battery, the light source, and the optical sensor are aligned in a longitudinal direction of the first flexible substrate, and the battery is provided at a position where it does not overlap with the light source; one end of the second flexible substrate is placed over one end of the first flexible substrate, and the second connection terminal is electrically connected to the first connection terminal; the first flexible substrate and the second flexible substrate are housed in the annular housing along a circumferential direction of the annular housing; the first flexible substrate surrounds the annular housing, the other end of the first flexible substrate overlaps the second flexible substrate, and the battery and the optical sensor overlap when viewed from the outside to the inside of the annular housing; Detection device.

2. The first connection terminal is provided on a second surface of the first flexible substrate; the second flexible substrate has a first surface on which the photodiode is formed and a second surface of the second flexible substrate opposite to the first surface of the second flexible substrate; the second connection terminal is provided on a first surface of the second flexible substrate, a first surface of the second flexible substrate facing a second surface of the first flexible substrate; The second connection terminal is electrically connected to the first connection terminal. The detection device according to claim 1 .

3. The first connection terminal is provided on a first surface of the first flexible substrate; the second flexible substrate has a first surface on which the photodiode is formed and a second surface of the second flexible substrate opposite to the first surface of the second flexible substrate; the second connection terminal is provided on a first surface of the second flexible substrate, a first surface of the second flexible substrate facing the first surface of the first flexible substrate; The second connection terminal is electrically connected to the first connection terminal. The detection device according to claim 1 .

4. The detection device according to claim 1 , wherein the optical sensor is located inside the annular housing relative to the first flexible substrate in a range where the first flexible substrate goes around the annular housing and overlaps with the second flexible substrate.

5. the battery is provided on a first surface of the first flexible substrate; the light source is provided in a first region on a second surface of the first flexible substrate opposite to the first surface; The detection device of claim 1 , wherein the second surface of the first flexible substrate faces the inside of the annular housing.

6. a control circuit for controlling light emission from the light source, the control circuit being provided on a first surface of the first flexible substrate; the control circuit is disposed on the opposite side of the first region; The detection device according to claim 5 .

7. the first flexible substrate further includes a coil for charging the battery; The coil is disposed between the light source and the battery at a position different from that of the light source and the battery. The detection device according to claim 5 .

8. the battery is provided on a first surface of the first flexible substrate; a coil for charging the battery, the coil being provided in a first region of a second surface of the first flexible substrate opposite to the first surface; The coil is disposed on the opposite side of the battery, and the battery and the coil overlap when viewed from the outside to the inside of the housing. The detection device according to claim 1 .

9. The first flexible substrate further includes a coil for charging the battery.

7. A detection device according to any one of claims 1 to 6.

10. The second flexible substrate has a width smaller than that of the first flexible substrate.

9. A detection device according to any one of claims 1 to 8.

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