Component mounting device, correction data generation method, and component mounting system

Abstract

To provide a component mounting device capable of more precisely correcting a position of a component to be mounted on a board.SOLUTION: A component mounting device includes: a nozzle for holding a component; a mounting head with a nozzle capable of mounting the component in a component mounting area of a board; an imaging unit provided to the mounting head for picking up an image of the component mounting area; a storage unit that stores first positions of multiple components to be mounted in a component mounting area; a calculation unit that measures a second position of the component mounted in a component mounting area on the basis of, the pick-up image picked up by the imaging unit and calculates an amount of misalignment between a second position of the measured component and a first position corresponding to the component; and a generation unit that generates correction data for correcting misalignment of the mounting position of a production component to be mounted in a component mounting area on the basis of, the amount of misalignment of multiple components calculated by the calculation unit.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus, a correction data generation method, and a component mounting system. [Background technology]

[0002] Patent Document 1 discloses a method for mounting electronic components, in which a jig plate on which grid-shaped fiducial marks are formed is imaged and recognized by a board recognition camera, and the amount of misalignment of a mounting head relative to the XY coordinates on the device corresponding to each fiducial mark is determined from the amount of misalignment between the XY coordinates of each fiducial mark as recognized by the camera and the XY coordinates on the device. The mounting position is corrected based on the amount of misalignment. The electronic component mounting method involves holding a jig component for correction with a nozzle head mounted on the mounting head, and then sequentially positioning and mounting the components while correcting the amount of misalignment based on the amount of misalignment on each fiducial mark on the jig plate. The electronic component mounting method involves imaged and recognized each mounted jig component with a board recognition camera, and the amount of misalignment between the XY coordinates of each jig component as recognized by the camera and the XY coordinates on the device of the corresponding fiducial mark is determined as correction data for the nozzle head relative to the fiducial mark. When mounting electronic components on a board using the nozzle head, the XY coordinates on the device corresponding to each fiducial mark are corrected based on the correction data. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-267387 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, the mounting head is equipped with various mechanisms, such as multiple nozzle heads, a rotation mechanism for rotating each nozzle head about the Z axis, an elevation mechanism for raising and lowering each nozzle head in the Z direction, and a board recognition camera, and is mounted on an X-axis or Y-axis beam. When a mounting head equipped with such various mechanisms moves on the X-axis or Y-axis beam, each of the X-axis or Y-axis beams is prone to deflection due to the weight of the mounting head from the center of each beam toward both ends. Furthermore, each of the X-axis or Y-axis beams may have twists in directions such as pitching or yawing. Therefore, workers desire a highly accurate correction of component mounting position deviations caused by the above-mentioned deflection, pitching, yawing, and other twists of the X-axis or Y-axis beams. However, Patent Document 1 aims to correct component mounting position deviations caused by nozzle head tilt, but does not anticipate correcting component mounting position deviations caused by the X-axis or Y-axis beams.

[0005] Furthermore, for small boards, component mounters can mount all components on a board by moving the mounting head within a predetermined range near the center of the X-axis beam and the Y-axis beam. However, for large boards, such as those measuring 650 mm in both the X and Y directions, the component mounter must move the mounting head from one end of the X-axis beam to the other end of the Y-axis beam to mount all components. However, this creates a problem in that the component mounting position shift increases from the center of each beam toward both ends. Furthermore, when high mounting accuracy (e.g., 5 μm) is required, as in a mixed-mount machine, operators desire to accurately correct the component mounting position shift across the entire area of ​​the large board.

[0006] The present disclosure has been devised in consideration of the above-described conventional circumstances, and aims to provide a component mounting device, a method for generating correction data, and a component mounting system that correct the position of components mounted on a board with higher precision. [Means for solving the problem]

[0007] The present disclosure relates to a component mounting device for mounting a plurality of components on a board, the device comprising: a nozzle for holding the components; a mounting head including the nozzle and capable of mounting the components in a component mounting area of ​​the board; an imaging unit provided in the mounting head for imaging the component mounting area; and a first position of the plurality of components to be mounted in the component mounting area. and production data for producing a mounting board on which production components are mounted in the component mounting area. a calculation unit that measures a second position of the component mounted in the component mounting area based on an image captured by the imaging unit and calculates a positional deviation amount between the measured second position of the component and the first position corresponding to the component; and a calculation unit that calculates a positional deviation amount between the measured second position of the component and the first position corresponding to the component based on the positional deviation amount of the plurality of components calculated by the calculation unit. Memorandum a generating unit that generates correction data for correcting misalignment of the mounting position of the manufactured part. The calculation unit selects a predetermined area including the mounting position of the production part based on the mounting position of the production part included in the production data, and calculates an offset value of the mounting position of the production part based on the positional deviation amounts corresponding to four parts included in the predetermined area of ​​the correction data and positioned near the mounting position of the production part, and the respective distances between the first positions of the four parts and the mounting position of the production part. A component mounting device is provided.

[0008] The present disclosure also provides a method for generating correction data for component mounting positions executed by a component mounting device that mounts a plurality of components on a board, the method comprising: and production data for producing a mounting board on which production components are mounted in the component mounting area. a mounting head capable of holding the components and transporting the components to the component mounting area mounts the plurality of components in the component mounting area, an imaging unit provided in the mounting head captures an image of the component mounting area, measures second positions of the plurality of components mounted in the component mounting area based on the captured image, calculates a positional deviation amount between the measured second positions of the components and the first positions corresponding to the components, and performs a pre-processing based on the calculated positional deviation amount of the plurality of components. Memorandum Generates correction data to correct misalignment of the mounting position of manufactured parts a predetermined area including the mounting position of the production part is selected based on the mounting position of the production part included in the production data; and an offset value of the mounting position of the production part is calculated based on the positional deviation amounts corresponding to four parts included in the predetermined area of ​​the correction data and positioned near the mounting position of the production part, and the respective distances between the first positions of the four parts and the mounting position of the production part. A method for generating correction data is provided.

[0009] The present disclosure also provides a component mounting system including a component mounting device that mounts a plurality of components on a board, and a computer that is communicably connected to the component mounting device, wherein the component mounting device is configured to determine first positions of the plurality of components to be mounted in component mounting areas of the board. and production data for producing a mounting board on which production components are mounted in the component mounting area.and mounting the plurality of components in the component mounting area using a mounting head capable of holding the components and transporting the components to the component mounting area, and transmitting a captured image of the component mounting area captured by an imaging unit provided in the mounting head to the computer, the computer measuring second positions of the plurality of components mounted in the component mounting area based on the captured image transmitted from the component mounting device, calculating a positional deviation amount between the measured second positions of the components and the first positions corresponding to the components, and performing a pre-processing based on the calculated positional deviation amount of the plurality of components. Memorandum Generates correction data to correct misalignment of the mounting position of the manufactured parts. a predetermined area including the mounting position of the production part is selected based on the mounting position of the production part included in the production data; and an offset value of the mounting position of the production part is calculated based on the positional deviation amounts corresponding to four parts included in the predetermined area of ​​the correction data and positioned near the mounting position of the production part, and the respective distances between the first positions of the four parts and the mounting position of the production part. and outputs the component placement system. [Effects of the Invention]

[0010] According to the present disclosure, the positions of components mounted on a board can be corrected with higher accuracy. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a top view of the interior of a floor where a component mounting system according to a first embodiment is installed. [Figure 2] FIG. 1 is a block diagram showing an example of the internal configuration of a management computer according to a first embodiment; [Figure 3] FIG. 1 is a top view of a component mounting device according to a first embodiment. [Figure 4] FIG. 1 is a block diagram showing an example of the internal configuration of a component mounting device according to a first embodiment. [Figure 5] Diagram explaining the placement head [Figure 6] A diagram explaining misalignment of component mounting positions [Figure 7] 10A and 10B are diagrams showing an example of the displacement amounts of the substrate recognition camera and the nozzle in pitching and yawing, respectively; [Figure 8] FIG. 10 is a diagram illustrating an example of component mounting position accuracy. [Figure 9] FIG. 10 is a diagram showing an example of imaging a jig chip mounted on a jig substrate. [Figure 10]A diagram showing an example of mounting a jig chip on a jig substrate [Figure 11] Diagram explaining correction data [Figure 12] A diagram explaining how to correct component placement positions during production [Figure 13] A diagram explaining how to correct component placement positions during production [Figure 14] 1 is a flowchart showing an example of a procedure for generating correction data for the component mounting device according to the first embodiment. [Figure 15] 1 is a flowchart showing an example of a procedure for generating correction data for the component mounting device according to the first embodiment. [Figure 16] 1 is a flowchart illustrating an example of a component mounting procedure of the component mounting device according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, with reference to the accompanying drawings, detailed descriptions of embodiments that specifically disclose a component mounting apparatus, a correction data generation method, and a component mounting system according to the present disclosure will be provided. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters or redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

[0013] 1 is a top view of the interior of a floor where a component mounting system 100 according to embodiment 1 is installed. The component mounting system 100 according to embodiment 1 performs a solder printing process of printing solder on a board 3, a printing inspection process of inspecting the solder printed on the board 3 for printing defects, a component mounting process of mounting a component D on the board 3 after solder printing, a mounting inspection process of inspecting the component D mounted on the board 3, and a reflow process of reflowing the solder printed on the board 3, thereby producing a mounted board on which a component D is soldered to the board 3.

[0014] The component mounting system 100 according to the first embodiment includes at least one component mounting line L1, a communication network LN, and a management computer P1. Although Fig. 1 shows an example in which there is one component mounting line, there may be multiple component mounting lines.

[0015] The communication network LN connects the management computer P1 and each of the devices that make up the component mounting line L1 so that data communication is possible between them. While the example in Fig. 1 shows the communication network LN connected so that wired communication is possible, wireless communication is also possible. The wireless communication here refers to a communication method provided in accordance with a wireless communication standard such as wireless LAN (Local Area Network), Bluetooth (registered trademark), or Wi-Fi (registered trademark).

[0016] The control computer P1 is, for example, a personal computer (PC), a notebook PC, a tablet, a smartphone, etc., and is communicably connected to the component mounting line L1 via a communication network LN. The control computer P1 also has a user interface (for example, a mouse, keyboard, touch panel, touch pad, pointing device, etc.) that can accept operator operations, and converts inputs based on operator operations into control signals.

[0017] The management computer P1 controls the overall production process of mounted boards, including the solder printing process, print inspection process, and component mounting process, which are performed by various devices that make up the component mounting line L1. For example, the management computer P1 generates production information related to the production processes that has been input or set in advance by an operator, and execution commands for executing the production processes, and sends these to the component mounting line L1 that executes these production processes.

[0018] The management computer P1 may generate correction data for each nozzle 8A used in the component mounting process performed by each of the component mounting devices M3 to M6 based on production data input or set in advance by an operator. In this case, the management computer P1 generates the correction data based on the position data for each nozzle 8A transmitted from each of the component mounting devices M3 to M6. The management computer P1 transmits the generated correction data to the corresponding component mounting device when the component mounting device M3 to M6 starts operating (i.e., when the component mounting device M3 to M6 is powered on) or when a nozzle 8A for which correction data has been generated is used by the component mounting device M3 to M6.

[0019] The production data referred to here is information used in the execution of the component mounting process by each of the component mounting devices M3 to M6, and is generated by the management computer P1 and recorded in the management storage unit 32 (see FIG. 4). The production data includes, for example, the size of the board, the position of the board recognition mark, the size of the component, the suction time of the nozzle 8A, the mounting position of the component D, information about the nozzle 8A, the number of boards produced, etc. The production data is not limited to the data of the above items.

[0020] The component mounting line L1 is configured to include various devices such as a solder printing device M1, a print inspection device M2, a plurality of component mounting devices M3 to M6, a component inspection device M7, a reflow device M8, etc. These various devices that make up the component mounting line L1 are connected to a management computer P1 via a communication network LN so that data can be communicated therewith, and each device performs control based on an execution command sent from the management computer P1.

[0021] In addition, the component mounting line L1 in the component mounting system 100 of embodiment 1 is shown as an example including a solder printing device M1, a printing inspection device M2, each of multiple component mounting devices M3 to M6, a component inspection device M7, and a reflow device M8, but it is sufficient if it is configured to include at least one component mounting device.

[0022] The solder printer M1 executes a solder printing process in which solder is printed via a mask onto the board 3 carried in from the upstream side of the component mounting line L1 (the left side of the solder printer M1 in FIG. 2) based on solder data (e.g., solder print patterns, etc.) for the board 3 transmitted from the management computer P1. The solder printer M1 carries out the board 3 after solder printing to the print inspection device M2.

[0023] The print inspection device M2 executes a print inspection process to inspect the condition of the solder printed on the board 3 carried in from the solder printing device M1 based on solder data (e.g., solder print patterns, etc.) on the board 3 transmitted from the management computer P1. The print inspection device M2 is equipped with a camera (not shown) that captures images of the carried-in board 3, and inspects the condition of the solder (i.e., the presence or absence of solder printing defects) using the images captured by the camera. The print inspection device M2 records the results of the solder print inspection on the board 3 in its memory (not shown), and carries out boards 3 that pass the inspection to the component mounting device M3.

[0024] Each of the component mounting devices M3 to M6 performs a component mounting process of mounting one or more components D on the board 3 carried in from the print inspection device M2 based on an execution command sent from the management computer P1. Note that the component mounting line L1 is not limited to a configuration with four component mounting devices, and may have, for example, one to three component mounting devices, or five or more component mounting devices.

[0025] Each of the multiple component mounting devices M3 to M6 controls a nozzle 8A based on production data for the board 3 transmitted from the management computer P1, and picks up and removes a component D from a tape feeder provided in a component supply unit attached to the component mounting device. Each of the multiple component mounting devices M3 to M6 transports the component D picked up by the nozzle 8A to a predetermined component mounting position on the board 3 and mounts it. Each of the multiple component mounting devices M3 to M5 carries out the board 3 after components have been mounted to the next connected component mounting device. In addition, component mounting device M6 carries out the board 3 after components have been mounted to component inspection device M7.

[0026] Each of the component mounting devices M3 to M6 uses the jig board 3A (see FIG. 9) and each of the multiple jig chips DA (see FIG. 9) to generate correction data for correcting misalignment of the component mounting positions based on each of the Y-axis beams 6A and 6B (see FIG. 3) and X-axis beams 7A and 7B (see FIG. 3) and each of the multiple mounting heads 8. Each of the component mounting devices M3 to M6 generates the correction data, for example, when the component mounting device is installed. The generated correction data is used to correct misalignment of the component mounting positions of each of the components D to be mounted on the board 3 during the component mounting process.

[0027] Based on the production data of the boards 3 transmitted from the management computer P1, the component inspection device M7 executes a mounting inspection process to inspect the condition of the components D mounted on the boards 3 carried in from the component mounting device M6 (for example, whether or not the components D are mounted in the wrong position). The component inspection device M7 is equipped with a camera (not shown) that captures images of the carried-in boards 3, and inspects the condition of the mounted components D using the images captured by the camera. The component inspection device M7 records the component mounting inspection results for the boards 3 in its memory (not shown), and carries out the boards 3 that pass the inspection to the reflow device M8.

[0028] Based on the reflow data for the board 3 sent from the management computer P1 (e.g., the transport speed of the conveyor that transports the board 3, the heating temperature, etc.), the reflow device M8 performs a reflow process to bond the electrode portions of the board 3 carried in from the mounting inspection device M7 to one or more mounted components. The reflow device M8 heats the board 3 carried in the device while transporting it on a belt conveyor, hardening the solder on the board 3 and bonding the electrode portions of the board 3 to one or more mounted components. The reflow device M8 carries out the board 3 after reflow to the downstream side of the component mounting line L1 (to the right of the reflow device M8 in Figure 2).

[0029] The internal configuration of the management computer P1 will be described with reference to Fig. 2. Fig. 2 is a block diagram showing an example of the internal configuration of the management computer P1 according to embodiment 1. It goes without saying that the internal configuration shown in Fig. 2 is an example and is not limited to this.

[0030] The management computer P1 is connected to the various devices that make up the component mounting line L1 so that data can be communicated between them, and controls these devices. The management computer P1 includes a management control unit 31, a management storage unit 32, an input unit 33, a display unit 34, and a communication unit 35.

[0031] The management control unit 31 is configured using, for example, a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and performs various processes and controls in cooperation with the management storage unit 32. Specifically, the management control unit 31 references the programs and data stored in the management storage unit 32 and executes the programs to realize the functions of each unit.

[0032] When the management computer P1 manages the correction data generated by each of the component mounting devices M3 to M6, the management control unit 31, based on a control command sent from each of the component mounting devices M3 to M6 requesting the transmission of correction data, refers to the correction data 32B stored in the management memory unit 32 and extracts the correction data corresponding to the component mounting device that sent the control command. The management control unit 31 outputs the extracted correction data to the communication unit 35 and transmits it to the component mounting device that sent the control command.

[0033] When the management computer P1 generates correction data, the management control unit 31 acquires jig data transmitted from each of the component mounting devices M3 to M6 and captured images or position data of each of the jig chips DA mounted on the jig board 3A. The management control unit 31 generates correction data for each component mounting device based on the acquired jig data and captured images or position data. The management control unit 31 associates the generated correction data with information about the component mounting device and stores the data in the management storage unit 32. The generated correction data may also be transmitted to and stored in the component mounting device that transmitted the position data. The procedure for generating correction data will be described later.

[0034] The jig data referred to here is used to generate correction data and includes information on the position (coordinates) of each measurement point on the jig board 3A. Each of the component mounting devices M3 to M6 mounts a jig chip DA at the position (coordinates) of each measurement point recorded in the jig data.

[0035] The management storage unit 32 includes, for example, a RAM (Random Access Memory) as a work memory used when executing each process of the management control unit 31, and a ROM (Read Only Memory) that stores programs and data that define the operation of the management control unit 31. The RAM temporarily stores data or information generated or acquired by the management control unit 31. The ROM stores programs that define the operation of the management control unit 31. The management storage unit 32 stores production data 32A. The management storage unit 32 may also store correction data 32B for each component mounting device.

[0036] The production data 32A is generated for each board 3 and is data for producing the board 3. The correction data 32B is generated for each component mounting device and is data for correcting the component mounting position of the component D to be mounted on the board 3 and mounting the component at the component mounting position recorded in the production data.

[0037] The input unit 33 is a user interface that accepts operations by an operator, and is configured using, for example, a mouse, a keyboard, a touch panel, a touch pad, a pointing device, etc. The input unit 33 outputs a signal based on the operator's operation to the management control unit 31.

[0038] The display unit 34 is configured using a display such as an LCD (Liquid Crystal Display) or an organic EL (Electroluminescence) display.

[0039] The communication unit 35 is connected to each of the component mounting devices M3 to M6 via the communication network LN so as to be able to communicate data with them. The communication unit 35 transmits execution commands for executing the production processes generated by the management control unit 31 to the corresponding component mounting devices based on production information relating to the production processes input or set in advance by the operator.

[0040] Next, the configuration of component mounting devices M3 to M6 will be described with reference to Fig. 3. Each of the component mounting devices M3 to M6 has the same configuration, and only component mounting device M3 will be described here. Fig. 3 is a top view of component mounting device M3 according to embodiment 1.

[0041] Each of the component mounting devices M3 to M6 according to the first embodiment is shown as an example in which a plurality of component supply units 4 are provided on each side (Y direction, -Y direction) of a pair of board transport mechanisms 2 that transport a board 3, but may be provided on only one side. Furthermore, each of the component mounting devices M3 to M6 according to the first embodiment is shown as an example in which a single lane configuration (i.e., a pair of board transport mechanisms 2 that can transport one board 3) is provided, but may also be a dual lane configuration in which components can be simultaneously applied to each of a plurality of boards 3.

[0042] The component mounting device M3 shown in Figure 3 is composed of a base 1, a board conveying mechanism 2, each of multiple component supply units 4, Y-axis beams 6A and 6B, X-axis beams 7A and 7B, a mounting head 8, a board recognition camera 9, and a component recognition camera 10.

[0043] The base 1 is provided with a board transport mechanism 2 for transporting a board 3 to the center of the base 1. The board transport mechanism 2 transports the board 3 carried in from the connected print inspection device M2 (or the connected component mounting device in the case of component mounting devices M4 to M6) to a predetermined component mounting position in the center of the base 1 and holds it there. The board transport mechanism 2 also carries out the board 3 after components have been mounted to the next connected component mounting device M4 (or the connected component inspection device M7 in the case of component mounting device M6). When generating correction data, the board transport mechanism 2 carries in or out a jig board 3A.

[0044] Each of the multiple component supply units 4 includes a plurality of tape feeders 5 arranged in parallel, each of which supplies components D to be mounted on the board 3. Furthermore, each of the multiple component supply units 4 includes a plurality of tape feeders 5 arranged in parallel, each of which supplies jig chips DA to be mounted on the jig board 3A when generating correction data. Note that, in the component mounting device M3 according to embodiment 1, an example is described in which the tape feeder 5 is a double feeder capable of mounting two carrier tapes, but it may also be a single feeder capable of mounting one carrier tape. In other words, the component mounting device M3 may be configured with a component supply unit that can mount either a single feeder or a double feeder as desired.

[0045] The component supply unit 4 is provided with each of the plurality of tape feeders 5. A tape feeder address for identifying the position of the carrier tape (component) attached to each of the plurality of tape feeders 5 is assigned and set to the component supply unit 4.

[0046] 3 shows an example in which each of the multiple component supply units 4 has the function of attaching a carrier tape containing components D to be mounted on the board 3 to a tape feeder 5, and pitch-feeding the components stored on this carrier tape to a component pick-up position by the mounting head 8. Each of the multiple component supply units 4 pitch-feeds each of the carrier tapes containing components in a predetermined tape feed direction, thereby supplying each of the components to the component pick-up position by the mounting head 8, which will be described below.

[0047] On the upper surface of the base 1, Y-axis beams 6A and 6B, each equipped with a linear drive mechanism, are arranged along the Y direction at one end in the X direction. Two X-axis beams 7A and 7B, each equipped with a linear drive mechanism, are connected to the Y-axis beams 6A and 6B, respectively, so that they can move freely in the Y and -Y directions. Each of the two X-axis beams 7A and 7B is arranged along the X direction. Each of the two X-axis beams 7A and 7B is equipped with a plate (not shown). The mounting head 8 and the board recognition camera 9 are attached to the X-axis beams 7A and 7B via the plate and are driven (moved) integrally with the X-axis beams 7A and 7B.

[0048] The mounting head 8 is driven (moved) integrally with a board recognition camera (not shown) by X-axis beams 7A and 7B. The mounting head 8 is equipped with a plurality of nozzles 8A. The mounting head 8 uses each of the plurality of nozzles 8A to suck and hold a component D stored on a carrier tape attached to each of the tape feeders 5, and transports the component D to a mounting position on the board 3 for mounting.

[0049] The multiple board recognition cameras 9 are driven (moved) integrally with the mounting head 8 by the X-axis beams 7A and 7B, and capture images of board marks (not shown) provided at predetermined positions on the jig board 3A or board 3 from above the jig board 3A or board 3 positioned on the board transport mechanism 2. Each of the multiple board recognition cameras 9 transmits the captured image to a control unit 41 (see FIG. 4) of the component mounting device M3. The control unit 41 of the component mounting device M3 processes the captured image of the board mark, and recognizes the transport position and posture of the jig board 3A or board 3 transported by the board transport mechanism 2.

[0050] Furthermore, the multiple board recognition cameras 9 capture images of the jig chips DA mounted on the jig board 3A, and output the captured images to the control unit 41 (see FIG. 4). The control unit 41 of the component mounting device M3 processes the captured images of the jig chips DA, and compares the positions (coordinates) of the jig chips DA recorded in the jig data with the actual mounting positions (coordinates) of the jig chips DA mounted on the jig board 3A.

[0051] Each of the multiple component recognition cameras 10 is provided between the component supply unit 4 and the board transport mechanism 2 on the base 1. Each of the multiple component recognition cameras 10 captures an image of the jig chip DA or component D held by the mounting head 8 from below at the same time that the mounting head 8, which has picked up the jig chip DA or component D stored in a carrier tape in the component supply unit 4, moves above the component recognition camera 10. Each of the multiple component recognition cameras 10 transmits the captured image to a control unit 41 (see FIG. 4) of the component mounting device M3. The control unit 41 of the component mounting device M3 processes the captured image of the jig chip DA or component D and recognizes the holding posture of the jig chip DA or component D.

[0052] Next, the internal configuration of each of the component mounting devices M3 to M6 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing an example of the internal configuration of the component mounting devices M3 to M6 according to embodiment 1. Note that since each of the multiple component mounting devices M3 to M6 has approximately the same configuration, the following description will focus on the internal configuration of the component mounting device M3.

[0053] The communication unit 40 is connected to the management computer P1 via the communication network LN so as to be able to communicate data with the management computer P1. The communication unit 40 outputs execution commands, production data, correction data, etc. transmitted from the management computer P1 to the control unit 41.

[0054] The control unit 41, which is an example of a calculation unit, is configured using, for example, a CPU or FPGA, and performs various processes and controls in cooperation with the storage unit 42. Specifically, the control unit 41 references the programs and data stored in the storage unit 42 and executes the programs to realize the functions of each unit.

[0055] When generating the correction data, the control unit 41 controls each of the board conveying mechanism 2, the component mounting mechanism 12, the board recognition camera 9, and the component recognition camera 10 to mount each of the multiple jig chips DA on the loaded jig board 3A.

[0056] Specifically, the control unit 41 drives the substrate transport mechanism 2 to load the jig substrate 3A, and the loaded jig substrate 3A is imaged by the substrate recognition camera 9. Based on the image captured by the substrate recognition camera 9, the control unit 41 acquires information on the load position and load attitude (angle) of the jig substrate 3A.

[0057] The control unit 41 drives the component mounting mechanism 12 to suck and hold the jig chip DA on the nozzle 8A of the mounting head 8. The control unit 41 refers to the jig data recorded in the memory unit 42, and based on the acquired information on the carry-in position and carry-in attitude (angle) of the jig substrate 3A, compares the carry-in position and carry-in attitude (angle) of the jig substrate 3A recorded in the jig data with the carry-in position and carry-in attitude (angle) of the jig substrate 3A actually carried in by the substrate transport mechanism 2, and calculates the carry-in deviation in the X and Y directions of the carry-in position of the jig substrate 3A.

[0058] Based on the calculated carry-in deviation of the jig substrate 3A and the positions (coordinates) and mounting attitudes (angles) of each measurement point of the jig chip DA recorded in the jig data, the control unit 41 calculates the movement amounts in the X and Y directions of the mounting head 8 and the rotation amounts (angles) of each nozzle 8A required to mount each of the multiple jig chips DA at each measurement point on the jig substrate 3A. Based on the calculated movement amounts in the X and Y directions of the mounting head 8 and the rotation amounts (angles) of each nozzle 8A, the control unit 41 drives the component mounting mechanism 12 to mount each of the multiple jig chips DA, which are sucked and held by the nozzles 8A, onto the jig substrate 3A.

[0059] After mounting all the jig chips DA on the jig board 3A, the control unit 41 drives the component mounting mechanism 12 and the board recognition camera 9 to capture images of all the jig chips DA mounted on the jig board 3A. The control unit 41 measures the mounting position of each jig chip DA based on the captured image captured by the board recognition camera 9. The control unit 41 also compares the measured mounting position of each jig chip DA with the mounting position of each jig chip DA recorded in the jig data, and calculates the deviation in the mounting position for each jig chip. The control unit 41 generates correction data for the component mounting position of this component mounting device M3 based on the calculated deviation in the mounting position for each jig chip. The generated correction data may be stored in the memory unit 42 or may be transmitted to the management computer P1 via the communication unit 40 and recorded therein.

[0060] Furthermore, during production (execution of the component mounting process), the control unit 41 controls each of the board conveying mechanism 2, the component mounting mechanism 12, the board recognition camera 9, and the component recognition camera 10 to mount each of the multiple components D on the loaded board 3.

[0061] Specifically, the control unit 41 drives the substrate transport mechanism 2 to load the substrate 3, and the substrate recognition camera 9 captures an image of the loaded substrate 3. Based on the image captured by the substrate recognition camera 9, the control unit 41 acquires information on the loading position and loading attitude (angle) of the substrate 3.

[0062] The control unit 41 drives the component mounting mechanism 12 to suck and hold the component D on the nozzle 8A of the mounting head 8. The control unit 41 refers to the production data recorded in the memory unit 42, and based on the acquired information on the carry-in position and carry-in attitude (angle) of the board 3, compares the carry-in position and carry-in attitude (angle) of the board 3 recorded in the production data with the carry-in position and carry-in attitude (angle) of the board 3 actually carried in by the board transport mechanism 2, and calculates the deviation of the carry-in position of the board 3 in each of the X and Y directions.

[0063] Based on the calculated deviation of the carry-in position of the board 3, the mounting positions and mounting attitudes (angles) of the components D recorded in the production data, and the correction data, the control unit 41 calculates the movement amounts in the X and Y directions of the mounting head 8 and the rotation amounts (angles) of each nozzle 8A required to mount each of the multiple components D on the board 3. Based on the calculated movement amounts in the X and Y directions of the mounting head 8 and the rotation amounts (angles) of each nozzle 8A, the control unit 41 drives the component mounting mechanism 12 to mount each of the multiple components D sucked and held by the nozzles 8A onto the board 3.

[0064] Based on the generated correction data, the control unit 41 calculates a correction value for correcting the positional deviation of the tip of the nozzle 8A caused by raising and lowering the component recognition height H1 and the component mounting height H2. Based on the calculated correction value, the control unit 41 drives the component mounting mechanism 12 to move the mounting head 8, thereby mounting the component D on the board 3.

[0065] The storage unit 42 includes, for example, a RAM as a work memory used when the control unit 41 executes each process, and a ROM that stores programs and data that define the operation of the control unit 41. The RAM temporarily stores data or information generated or acquired by the control unit 41. The ROM stores programs that define the operation of the control unit 41. For example, the storage unit 42 stores information about the nozzles 8A and correction data generated for each nozzle 8A.

[0066] The component mounting mechanism 12 includes Y-axis beams 6A and 6B, X-axis beams 7A and 7B, and a mounting head 8. The component mounting mechanism 12 is controlled by a control unit 41, and performs the operation of mounting a jig chip DA or a component D.

[0067] Next, the mounting head 8 will be described with reference to Fig. 5. Fig. 5 is a diagram illustrating the mounting head 8. Note that the mounting head 8 shown in Fig. 5 is a view looking in the direction of the component supply unit 4 from the board transport mechanism 2, and the mounting head 8 attached to the X-axis beam 7A will be described.

[0068] The mounting head 8 is attached to an X-axis rail 71A of the X-axis beam 7A so as to be movable in the X direction. The X-axis beam 7A is also attached to a Y-axis rail 61A (see FIG. 6) of the Y-axis beam 6A, allowing the mounting head 8 to move in the Y direction.

[0069] The mounting head 8 is equipped with a plurality of nozzles 8A each capable of suction-holding a jig chip DA or a component D, and a board recognition camera 9 capable of capturing images of the jig board 3A, the board 3, the jig chip DA mounted on the jig board 3A, or the component D mounted on the board 3. Each of the plurality of nozzles 8A is controlled by a component mounting mechanism 12 to pick up and release the jig chip DA or the component D. Each of the plurality of nozzles 8A is rotated in the X direction and the -X direction by the component mounting mechanism 12 to adjust the suction-holding attitude (angle) of the jig chip DA or the component D that is held by suction.

[0070] The misalignment of the mounting position of the jig chip DA or the component D will be described with reference to Fig. 6. Fig. 6 is a diagram for explaining the misalignment of the component mounting position. Note that Fig. 6 shows the mounting head 8 in a simplified form to make the description easier to understand.

[0071] 6 is a rotation axis whose center of rotation is the extension direction (X direction) of the X-axis rail 71A at the current position of the mounting head 8. The pitching axis R1 coincides with the X-axis when there is no twist in the X-axis rail 71A of the X-axis beam 7A.

[0072] 6 is a rotation axis whose center of rotation is the direction (Z direction) in which the jig chip DA or component D is raised and lowered by the mounting head 8 to mount it on the jig board 3A or board 3 at the current position of the mounting head 8. The yawing axis R2 coincides with the Z axis when there is no distortion in the up-and-down direction of the X-axis rail 71A of the X-axis beam 7A.

[0073] 6 is a rotation axis whose center of rotation is the extension direction (Y direction) of the Y-axis rail 61A at the current position of the X-axis beam 7A. The pitching axis R3 coincides with the Y-axis when there is no twist in the Y-axis rail 61A of the Y-axis beam 6A.

[0074] 6 is a rotation axis whose center of rotation is the direction (Z direction) in which the mounting head 8 raises and lowers the jig chip DA or component D at the current position of the X-axis beam 7A to mount it on the jig board 3A or board 3. The yawing axis R4 coincides with the Z axis when there is no distortion in the up-and-down direction of the Y-axis rail 61A of the Y-axis beam 6A.

[0075] As shown in FIG. 6, component placement devices M3-M6 experience a misalignment in the placement position of jig chip DA or component D due to twisting, distortion, bending, etc., of Y-axis rail 61A and X-axis rail 71A. In the example shown in FIG. 6, the placement head 8 is in a state in which the nozzle 8A is tilted by the angle (acute angle) formed between the Z-axis direction and yawing axis R2, and the angle (acute angle) formed between the X-axis direction and pitching axis R1. In such a case, the placement head 8 is misaligned in the X direction by a distance T between the placement position recorded in the jig data or production data and the placement position of jig chip DA or component D. Note that FIG. 6 does not show the misalignment in the Y direction.

[0076] Similarly, the optical axis 9B of the board recognition camera 9, which is configured integrally with the mounting head 8, is tilted in the same manner as the mounting head 8 to capture an image within the angle of view CR. Specifically, the board recognition camera 9 captures an image of the jig board 3A or the board 3 located within the angle of view CR, and the jig chip DA on the jig board 3A mounted on the jig board 3A, or the component D on the board 3. The optical axis 9B shown in FIG. 9 is the optical axis of a lens (not shown) provided in the board recognition camera 9.

[0077] As a result of the above, deviations occur in the mounting positions of the jig chips DA or the components D on each of the component mounting devices M3 to M6.

[0078] With reference to FIG. 7, the pitching (i.e., Z direction and −Z direction) and yawing (i.e., XY plane) displacements of the X-axis beam 7A and the Y-axis beam 6A will be described. FIG. 7 is a diagram showing an example of the displacement amounts of the board recognition camera 9 and the nozzle 8A in pitching and yawing, respectively. For example, the X-axis beam 7A and the Y-axis beam 6A shown in FIG. 7 show an example in which the mounting head 8 is supported so as to be movable in the X direction and −X direction between 0 (zero) mm and 850 mm. Note that FIG. 7 describes the pitching and yawing displacements of the X-axis beam 7A and the Y-axis beam 6A as an example.

[0079] Graph GR1 shown in Fig. 7 is a graph showing the displacement (change) in the height of the board recognition camera 9. One end of each of the X-axis beam 7A and the Y-axis beam 6A is set to a reference height of 0 (zero) mm, and graph GR1 shows the displacement (i.e., deviation in the Z direction) between the reference height and the height of the board recognition camera 9 when the X-axis beam 7A is moved from one end 0 (zero) mm to the other end 850 mm.

[0080] Graph GR2 is a graph showing the displacement (change) of the tip height of nozzle 8A. One end of each of X-axis beam 7A and Y-axis beam 6A is set to a reference height of 0 (zero) mm, and graph GR2 shows the displacement (i.e., deviation in the Z direction) between the reference height and the tip height of nozzle 8A when the X-axis beam 7A is moved from one end 0 (zero) mm to the other end 850 mm.

[0081] 7, the displacement of the height of the board recognition camera 9 and the tip height of the nozzle 8A increases as the mounting head 8 moves from one end (0 (zero) mm) to the other end (850 mm). In other words, as the mounting head 8 moves from one end (0 (zero) mm) to the other end (850 mm), a deviation occurs in the height (image capture height) of the board recognition camera 9 and the tip height of the nozzle 8A. Therefore, when mounting a component D on a large board 3, such as a board 3 measuring 650 mm, each of the component mounting devices M3 to M6 experiences a larger error in the component mounting position of the component D between one end and the other end of the X-axis beam 7A and the Y-axis beam 6A, resulting in a further decrease in component mounting accuracy.

[0082] Graph GR3 shown in Fig. 7 is a graph showing the displacement (change) of the position of the board recognition camera 9 on the XY plane. Graph GR3 shows the displacement (i.e., the distance of deviation) between the correct position of the board recognition camera 9 on the XY plane and the actually measured position when one end of each of the X-axis beam 7A and the Y-axis beam 6A is set to a reference position of 0 (zero) mm and the X-axis beam 7A is moved from that end 0 (zero) mm to the other end 850 mm.

[0083] Graph GR4 is a graph showing the displacement (change) of the tip position of nozzle 8A on the XY plane. Graph GR4 shows the displacement (i.e., the distance of deviation) between the correct position of the tip of nozzle 8A on the XY plane and the actually measured position when one end of each of X-axis beam 7A and Y-axis beam 6A is set to a reference position of 0 (zero) μm and the tip of nozzle 8A is moved from one end 0 (zero) mm to the other end 850 mm of X-axis beam 7A.

[0084] 7, the displacement of the position of the board recognition camera 9 and the tip of the nozzle 8A on the XY plane increases as the mounting head 8 moves from one end (0 (zero) mm) to the other end (850 mm). In other words, as the mounting head 8 moves from one end (0 (zero) mm) to the other end (850 mm), a deviation occurs between the position (image capture position) of the board recognition camera 9 and the tip of the nozzle 8A on the XY plane. Therefore, when each of the component mounting devices M3 to M6 mounts a component D on a large board 3, such as a board 3 measuring 650 mm, the error in the component mounting position of the component D between one end and the other end of the X-axis beam 7A and the Y-axis beam 6A increases, further reducing the accuracy of the component mounting position.

[0085] Next, the mounting position accuracy of the component D will be described with reference to Fig. 8. Fig. 8 is a diagram for explaining an example of the mounting position accuracy of the component D.

[0086] 8 is a diagram comparing the mounting positions of components D included in the production data within a 500 μm×500 μm area on the board, the mounting positions of components D recognized (measured) based on images captured by the board recognition camera 9, and the mounting positions of components D measured by another image measuring instrument (not shown). Note that a description of the method for measuring the mounting positions of components D using another image measuring instrument will be omitted here.

[0087] The larger the value of the X coordinate of the mounting position of component D, the greater the positional deviation between the correct mounting position of component D indicated by the production data and the actual mounting position of component D measured using the board recognition camera 9 or another image measuring device. Below, we will explain the mounting position errors of component D mounted at each of the four positions MP1, MP2, MP3, and MP4.

[0088] For example, component D placed at position MP1 shown in Fig. 8 has almost no positional deviation (error) from the actual placement position of component D. In other words, component placement devices M3 to M6 have high component placement position accuracy when placing component D at position MP1.

[0089] The component D placed at position MP2 has a positional deviation (error) of approximately 5 μm between the placement position of component D indicated by the production data and the actual placement position of component D. In other words, component placement devices M3 to M6 have high placement position accuracy when placing component D at position MP2, and satisfy the placement position accuracy (5 μm, etc.) required for a mixed load machine, for example.

[0090] The component D placed at position MP3 has a positional deviation (error) of approximately 10 μm between the placement position of component D indicated by the production data and the actual placement position of component D. In other words, component placement devices M3 to M6 have low placement position accuracy when placing component D at position MP3, and do not meet the placement position accuracy (e.g., 5 μm) required for a mixed load machine, for example.

[0091] The component D placed at position MP4 has a positional deviation (error) of approximately 15 μm between the placement position of component D indicated by the production data and the actual placement position of component D. In other words, component placement devices M3 to M6 have low placement position accuracy when placing component D at position MP4, and do not meet the placement position accuracy (e.g., 5 μm) required for a mixed load machine, for example.

[0092] As described above, in component mounting devices M3 to M6, the more X-axis beams 7A and 7B move toward the ends (here, 500 μm), the greater the positional deviation (error) in the mounting position of component D becomes, and the more the accuracy of the component mounting position decreases. Note that while Fig. 8 shows an example in which the positional deviation (error) in the X coordinate (i.e., X-axis beams 7A and 7B) is large, the same is true for the Y coordinate (i.e., Y-axis beams 6A and 6B).

[0093] An example of measuring the mounting position of a jig chip DA will be described with reference to FIG. 9. FIG. 9 is a diagram showing an example of imaging a jig chip DA mounted on a jig substrate 3A. For the sake of explanation, FIG. 9 shows a schematic diagram in which a mounting head 8 equipped with a substrate recognition camera 9 is attached to each of the Y-axis beam 6A and the X-axis beam 7A, but the mounting head 8 is provided on either the Y-axis beam 6A or the X-axis beam 7A. For ease of explanation, FIG. 9 also shows a schematic diagram in which the mounting head 8, Y-axis beam 6A, and X-axis beam 7A are each positioned outside the jig substrate 3A.

[0094] Each of the component mounting devices M3 to M6 drives the component mounting mechanism 12 to move the mounting head 8 in directions substantially along the Y direction and the -Y direction, and between one end 6AA and the other end 6AC of the Y-axis beam 6A. Similarly, each of the component mounting devices M3 to M6 drives the component mounting mechanism 12 to move the mounting head 8 in directions substantially along the X direction and the -X direction, and between one end 7AA and the other end 7AC of the X-axis beam 7A.

[0095] Each of the component mounting devices M3 to M6 drives the component mounting mechanism 12 to move the mounting head 8 provided on either the Y-axis beam 6A or the X-axis beam 7A to an arbitrary photographing position on the jig board 3A. Each of the component mounting devices M3 to M6 controls the board recognition camera 9 to capture an image of at least one jig chip DA mounted on the jig board 3A. Each of the component mounting devices M3 to M6 measures the mounting position of the jig chip DA based on the current position of the mounting head 8, the angle of view of the board recognition camera 9, and the mounting position of the jig chip DA shown in the captured image. Each of the component mounting devices M3 to M6 repeats the above process until it has finished measuring the mounting positions of all the jig chips DA mounted on the jig board 3A.

[0096] 8, each of the component mounting devices M3 to M6 positions its mounting head 8 at a predetermined position 6AB on the Y-axis beam 6A or a predetermined position 7AB on the X-axis beam 7A, and captures an image of each of the multiple jig chips DA located within the angle of view AR of the board recognition camera 9. Each of the component mounting devices M3 to M6 measures the mounting position of each of the multiple jig chips DA based on the captured image.

[0097] A method for generating correction data will be described with reference to Fig. 10 and Fig. 11. Fig. 10 is a diagram showing an example of mounting jig chips DA on a jig substrate 3A. Fig. 11 is a diagram explaining the correction data. Note that Fig. 10 shows an example in which 35 jig chips DA are mounted on the jig substrate 3A, but this is just an example and is not limiting.

[0098] 10 is a diagram comparing the positions of the measurement points PS0 of the multiple jig chips DA included in the jig data with the mounting positions PS1 of the multiple jig chips DA mounted on the jig substrate 3A. The positions of the measurement points PS0 of the multiple jig chips DA included in the jig data are set at equal intervals so that the distance between adjacent jig chips is approximately constant. In generating the correction data, it is sufficient for at least five jig chips DA to be mounted on the jig substrate 3A for a jig substrate 3A that is, for example, 650 mm wide. In other words, it is sufficient for at least 25 jig chips DA to be mounted on a jig substrate 3A that is 650 mm x 650 mm in size.

[0099] Each of the component mounting devices M3 to M6 measures the mounting positions of the plurality of jig chips DA based on the captured image taken by the board recognition camera 9.

[0100] Fig. 11 is a partially enlarged view of the area EX1 shown in Fig. 10. Hereinafter, a method for generating correction data for each of the four measurement points PS01, PS02, PS03, and PS04 included in this area EX1 will be described.

[0101] Each of the component mounting devices M3 to M6 acquires the positions (coordinates) of the measurement points PS01, PS02, PS03, and PS04 of the multiple jig chips DA included in the four jig data, as well as the mounting positions PS11, PS12, PS13, and PS14 of the multiple jig chips DA mounted on the jig board 3A corresponding to the measurement points PS01, PS02, PS03, and PS04. Each of the component mounting devices M3 to M6 calculates the difference (amount of misalignment) for each measurement point based on the position (coordinates) of each measurement point and the mounting position corresponding to this measurement point. Each of the component mounting devices M3 to M6 generates and records correction data that associates the position (coordinates) of each measurement point with the difference (amount of misalignment) corresponding to the measurement point.

[0102] Specifically, each of the component mounting devices M3 to M6 calculates the difference (X1-X11, Y1-Y11) = (dX1, dY1) in the X and Y directions between the coordinate (X1, Y1) of the measurement point PS01 of the jig chip DA on the jig data and the coordinate (X11, Y11) of the actual mounting position PS11 of the jig chip DA. Each of the component mounting devices M3 to M6 associates the difference (dX1, dY1) corresponding to the coordinate of the measurement point PS01 with the coordinate (X1, Y1) of the measurement point PS01 as correction data for the measurement point PS01 and records it.

[0103] Furthermore, each of the component mounting devices M3 to M6 calculates the differences (X2-X12, Y2-Y12) = (dX2, dY2) in the X and Y directions between the coordinates (X2, Y2) of the measurement point PS02 of the jig chip DA on the jig data and the actual mounting position PS12 (X12, Y12) of the jig chip DA. Each of the component mounting devices M3 to M6 associates the difference (dX2, dY2) corresponding to the coordinate of the measurement point PS02 with the coordinates (X2, Y2) of the measurement point PS02 as correction data for the measurement point PS02 and records them.

[0104] Furthermore, each of the component mounting devices M3 to M6 calculates the differences (X3-X13, Y3-Y13) = (dX3, dY3) in the X and Y directions between the coordinates (X3, Y3) of the measurement point PS03 of the jig chip DA on the jig data and the actual mounting position PS13 (X13, Y13) of the jig chip DA. Each of the component mounting devices M3 to M6 associates the difference (dX3, dY3) corresponding to the coordinate of the measurement point PS03 with the coordinates (X3, Y3) of the measurement point PS03 as correction data for the measurement point PS03 and records them.

[0105] Similarly, each of the component mounting devices M3 to M6 calculates the differences (X4-X14, Y4-Y14) = (dX4, dY4) in the X and Y directions between the coordinates (X4, Y4) of the measurement point PS04 of the jig chip DA on the jig data and the actual mounting position PS14 (X14, Y14) of the jig chip DA. Each of the component mounting devices M3 to M6 associates the difference (dX4, dY4) corresponding to the coordinate of the measurement point PS04 with the coordinates (X4, Y4) of the measurement point PS04 as correction data for the measurement point PS04 and records them.

[0106] As a result of the above, each of the component mounting devices M3 to M6 according to embodiment 1 generates and records correction data that associates the position of each measurement point of the jig chip DA on the jig data with the positional deviation amount (difference) corresponding to each measurement point.

[0107] A method for correcting the mounting position of component D during production of a mounting board (during the component mounting process) will be described with reference to Figures 12 and 13. Figure 12 is a diagram for explaining the method for correcting the component mounting position during production. Figure 13 is a diagram for explaining the method for correcting the component mounting position during production.

[0108] Each of the component mounting devices M3 to M6 extracts the correction data previously stored in the storage unit 42 when production of the mounting board begins. If the correction data is stored in the management storage unit 32 of the management computer P1, each of the component mounting devices M3 to M6 acquires the correction data corresponding to that component mounting device. Furthermore, each of the component mounting devices M3 to M6 acquires the mounting positions (coordinates) of all components D to be mounted on the board 3 based on the production data of the board 3 to be produced.

[0109] Each of the component mounting devices M3 to M6 corrects the mounting position of each of the acquired components D based on the correction data. The correction method will be described below. Note that the correction method described below will describe a correction process for correcting the mounting positions of each of the components TG1 and D that are mounted in the area EX1 shown in FIGS. 10 and 11 during production.

[0110] First, each of the component mounting devices M3 to M6 acquires the mounting position PS21 (dX t ,dY t ) X coordinate = dX t is compared with the measurement points PS0 of the multiple jig chips DA included in the jig data. Each of the component mounting devices M3 to M6 has an X coordinate = dX t Then, the component mounting apparatuses M3 to M6 extract the row of mounting positions having the X coordinates that are closest in distance to the component TG1, and the row of mounting positions having the second closest X coordinates. For example, as shown in FIG. 12, each of the component mounting apparatuses M3 to M6 extracts two rows AR21 that are closest in distance in the X direction to the component TG1 from among the measurement points PS0 of the multiple jig chips DA.

[0111] Next, each of the component mounting devices M3 to M6 determines the mounting position PS21 (dX t ,dY t ) Y coordinate = dY t is compared with the measurement points PS0 of the multiple jig chips DA included in the jig data. t Then, the component mounting apparatuses M3 to M6 extract the two rows AR22 closest in distance to the component TG1 in the Y direction from among the measurement points PS0 of the multiple jig chips DA, as shown in FIG.

[0112] Each of the component mounting devices M3 to M6 further extracts an area AR23 where the extracted two rows AR21 and AR22 overlap, and extracts four measurement points PS0 (note that in the examples shown in Figures 12 and 13, each of the four measurement points PS01, PS02, PS03, and PS04) contained in this area AR23.

[0113] Each of the component mounting devices M3 to M6 calculates a corrected position PS22 for mounting the component TG1 at the mounting position PS21 using the correction data associated with each of the four extracted measurement points PS01, PS02, PS03, and PS04, the mounting position PS21 of the component TG1, and the following (Equation 1) and (Equation 2).

[0114]

number

[0115]

number

[0116] Here, (Formula 1) and (Formula 2) will be explained. (Formula 1) is a formula for calculating each of the coefficients w1, w2, w3, and w4. Each of the coefficients w1, w2, w3, and w4 is calculated based on the mounting position PS21 (dX t ,dY t ) and the respective positions of the four extracted measurement points PS01 to PS04. In other words, the coefficient w1 is the distance between the mounting position PS21 (dX t ,dY t ) and the position (X1, Y1) of the extracted measurement point PS01. The coefficient w2 is the distance between the mounting position PS21 (dX t ,dY t ) and the position (X2, Y2) of the extracted measurement point PS02. t ,Y t ) and the position (X3, Y3) of the extracted measurement point PS03. The coefficient w4 is the distance between the mounting position PS21 (dX t ,dY t ) and the position (X4, Y4) of the extracted measurement point PS04.

[0117] (Equation 2) is the correction position PS22(dX m ,dY m(Formula 2) is a calculation formula for calculating the corrected position PS22 (dX m ,dY m ) is calculated.

[0118] Each of the component mounting devices M3 to M6 calculates the corrected position PS22 (dX m ,dY m ) is determined as the mounting position of the component TG1. Each of the component mounting devices M3 to M6 determines the corrected mounting position of the component TG1 (i.e., corrected position PS22(dX m ,dY m )), the component mounting mechanism 12 is driven to move the mounting head 8 to the mounting position PS21 (dX t ,dY t ) and attach part TG1 to it.

[0119] Next, a procedure for generating correction data for component mounting devices M3 to M6 according to embodiment 1 will be described with reference to Fig. 14 and Fig. 15. Fig. 14 is a flowchart showing an example of a procedure for generating correction data for component mounting devices M3 to M6 according to embodiment 1. Fig. 15 is a flowchart showing an example of a procedure for generating correction data for component mounting devices M3 to M6 according to embodiment 1.

[0120] The process of step St12 may be executed by the management computer P1. In this case, the management computer P1 acquires a plurality of captured images of the jig chip DA transmitted from each of the component mounting devices M3 to M6, and generates correction data based on the acquired captured images and jig data.

[0121] Each of the component mounting devices M3 to M6 generates correction data at predetermined times, such as when the component mounting device is delivered to a customer by a manufacturer that manufactures the component mounting device or a trading company that sells the component mounting device, when the component mounting device is calibrated periodically (for example, weekly or monthly), or when a component is replaced in the component mounting device. Here, an example is described in which correction data is generated when the component mounting device starts operating for the first time when the component mounting device is delivered to a customer by a manufacturer that manufactures the component mounting device or a trading company that sells the component mounting device, but the timing of generating correction data is not limited to this. The correction data may be generated at any time desired by the operator.

[0122] First, each of the component mounting devices M3 to M6 receives an operation start command from an operator, and adjusts the position, height, etc. of each part such as the board transport mechanism 2, the component supply unit 4, or the component mounting mechanism 12, and performs various calibrations (St11).

[0123] Each of the component mounting devices M3 to M6 references the jig data recorded in the storage unit 42 and generates correction data (St12).

[0124] Each of the component mounting devices M3 to M6 uses the generated correction data and the arbitrary production data to start producing the mounting board (executing the component mounting process). Specifically, each of the component mounting devices M3 to M6 mounts each of the multiple components D on the board 3 based on the arbitrary production data. Note that the arbitrary production data may be jig data. Each of the component mounting devices M3 to M6 compares the mounting positions of each of the multiple components D mounted on the board 3 with the mounting positions of each of the multiple components D recorded in the production data, and determines whether each of the multiple components D has been mounted within a predetermined error (e.g., 5 μm) (i.e., whether the required component mounting accuracy is met) (St13).

[0125] When each of the component mounting devices M3 to M6 determines in the processing of step St13 that each of the multiple components D has been mounted within a predetermined error (e.g., 5 μm) (St13, YES), it records the generated correction data in the memory unit 42 (St14).

[0126] On the other hand, if each of the component mounting devices M3 to M6 determines in the processing of step St13 that each of the multiple components D has not been mounted within a predetermined error (e.g., 5 μm) (St13, YES), it returns to the processing of step St12 and generates the correction data again.

[0127] Here, the correction data generation process in step St12 will be described.

[0128] Each of the component mounting devices M3 to M6 refers to the jig data recorded in the memory unit 42, drives the component mounting mechanism 12, and mounts the jig chip DA at the position (coordinates) of each measurement point PS0 on the jig board 3A that has been transported to a predetermined board transport position (St21).

[0129] Each of the component mounting devices M3 to M6 takes an image of each jig chip DA mounted on the jig board 3A with the board recognition camera 9, and measures the mounting position PS1 of each jig chip DA based on the captured image (St22).

[0130] Each of the component mounting devices M3 to M6 compares the measured mounting position PS1 for each jig chip DA with the position of the measurement point PS0 corresponding to each jig chip DA and recorded in the jig data, and calculates the difference (i.e., the amount of positional deviation) (St23).

[0131] Each of the component mounting devices M3 to M6 generates correction data that associates the position of each measurement point PS0 with the calculated positional deviation amount for each measurement point PS0 (St24).

[0132] Next, a procedure for generating correction data for the component mounting devices M3 to M6 according to the first embodiment will be described with reference to Fig. 16. Fig. 16 is a flowchart illustrating an example of a component mounting procedure for the component mounting device according to the first embodiment.

[0133] Each of the component mounting devices M3 to M6 starts producing the mounting board based on the production data specified by the operator. Each of the component mounting devices M3 to M6 drives the board transport mechanism 2 to transport the board 3 to a predetermined board transport position (St31).

[0134] Each of the component mounting devices M3 to M6 drives the component mounting mechanism 12 to move the mounting head 8 onto the board 3. Each of the component mounting devices M3 to M6 uses the board recognition camera 9 to capture an image of the board 3 transported to a predetermined board transport position, recognizes the loaded board 3 based on the captured image, and measures the loading position, loading attitude, etc. of the board 3 (St32).

[0135] Each of the component mounting devices M3 to M6 calculates a corrected position (e.g., corrected position PS22 shown in FIG. 13) obtained by correcting the mounting position (e.g., mounting position PS21 shown in FIG. 13) for each component D to be mounted on the board 3 based on the production data and correction data recorded in the memory unit 42 (St33).

[0136] Each of the component mounting devices M3 to M6 determines the movement amount of the mounting head 8 for mounting each component D at the mounting position based on the corrected mounting position for each component D (i.e., the corrected position), and drives the component mounting mechanism 12. Each of the component mounting devices M3 to M6 drives the component mounting mechanism 12 to move the mounting head 8 by the determined movement amount, and mounts the component D on the board 3 (St34).

[0137] When each of the component mounting devices M3 to M6 determines that all of the components D have been mounted on the board 3, it drives the board transport mechanism 2 to carry out the mounted board after the components have been mounted (St35).

[0138] As a result, each of component mounting apparatuses M3 to M6 according to embodiment 1 can more efficiently execute the process of producing a mounting board based on the correction data generated in advance. Furthermore, the correction data is generated not before starting production of a single mounting board, but at a predetermined timing such as when the component mounting apparatus is delivered to a customer by a manufacturer that manufactures the component mounting apparatus or a trading company that sells the component mounting apparatus, when the component mounting apparatus is calibrated periodically (for example, weekly or monthly), or when a component is replaced on the component mounting apparatus. This reduces the time required to generate the correction data, thereby improving the production efficiency of mounting boards and the operating efficiency of each of component mounting line L1 and component mounting apparatuses M3 to M6.

[0139] Furthermore, because the jig board 3A is large (e.g., 650 mm × 650 mm), each of the component mounting devices M3 to M6 according to embodiment 1 generates correction data by moving the mounting head 8 from one end to the other end of each of the Y-axis beams 6A, 6B and the X-axis beams 7A, 7B. Therefore, even when each of the component mounting devices M3 to M6 moves the mounting head 8 to the end of each of the Y-axis beams 6A, 6B and the X-axis beams 7A, 7B, where misalignment of the mounting position is likely to occur, it is possible to further suppress misalignment of the mounting position and improve the accuracy of the component mounting position based on the generated correction data.

[0140] As described above, each of the component mounting devices M3 to M6 according to the first embodiment mounts a plurality of jig chips DA (an example of a component) on the jig board 3A (an example of a board). Each of the component mounting devices M3 to M6 includes a nozzle 8A that holds a jig chip DA, a mounting head 8 that is equipped with the nozzle 8A and can mount the jig chip DA in a component mounting area of ​​the jig board 3A, a board recognition camera 9 (an example of an imaging unit) that is provided on the mounting head 8 and that captures an image of the component mounting area, a memory unit 42 that stores the positions (an example of a first position) of measurement points PS0 of multiple jig chips DA mounted in the component mounting area, a control unit 41 (an example of a calculation unit) that measures the mounting position PS1 (an example of a second position) of the jig chip DA mounted in the component mounting area based on the captured image captured by the board recognition camera 9 and calculates the amount of positional deviation between the measured mounting position PS1 of the jig chip DA and the position of the measurement point PS0 corresponding to this jig chip DA, and a control unit 41 (an example of a generation unit) that generates correction data to correct the positional deviation of the mounting position of a component D (an example of a production component) mounted in the component mounting area based on the positional deviation amounts of the multiple jig chips DA calculated by the control unit 41. The component mounting area here refers to an area where each of the plurality of jig chips DA mounted on the jig substrate 3A is mounted.

[0141] As a result, each of the component mounting devices M3 to M6 according to embodiment 1 can generate correction data that can correct the component mounting position over the entire component mounting area where the component D is to be mounted, even for a board 3 large enough to mount the component D by moving the mounting head 8 from one end to the other end of each of the Y-axis beams 6A, 6B and the X-axis beams 7A, 7B (for example, 650 mm x 650 mm). Therefore, each of the component mounting devices M3 to M6 can improve the accuracy of the component mounting position.

[0142] As described above, the storage unit 42 in each of the component mounting devices M3 to M6 according to the first embodiment stores production data for producing a mounting board on which a component D (an example of a production component) is mounted. The control unit 41 selects a predetermined area (e.g., area AR23 shown in FIG. 12) that includes the mounting position of the component D based on the mounting position of the component D included in the production data, and calculates an offset value for the mounting position of the component D based on the positional deviation amounts of the multiple jig chips DA included in the predetermined area of ​​the correction data and the mounting position of the component D. As a result, each of the component mounting devices M3 to M6 according to the first embodiment can correct the mounting positions of the multiple components D to be mounted on the board 3 based on the correction data generated in advance during the production of the mounting board so that the components can be mounted at positions with higher accuracy.

[0143] Furthermore, as described above, the predetermined area (e.g., area AR23 shown in FIG. 12) in each of the component mounting devices M3 to M6 according to the first embodiment includes the measurement points (e.g., measurement points PS01 to PS04 shown in FIG. 12) of the four jig chips DA located near the mounting position of the component D. The control unit 41 calculates an offset value based on the misalignment amount corresponding to each of the four jig chips DA included in the predetermined area of ​​the correction data and the mounting position of the component D. This allows each of the component mounting devices M3 to M6 according to the first embodiment to more accurately correct the mounting position of the component D based on the misalignment amount associated with the measurement points of the four jig chips DA located near the mounting position of the component D to be mounted.

[0144] Furthermore, as described above, the control unit 41 in each of the component mounting devices M3 to M6 according to the first embodiment calculates an offset value based on the positional deviation amount corresponding to each of the four jig chips DA included in a predetermined area of ​​the correction data (for example, area AR23 shown in FIG. 12) and the respective distances (for example, each of the coefficients w1 to w4 shown in FIG. 13) between the positions of the measurement points of the four jig chips DA (for example, the positions of the measurement points PS01 to PS04 shown in FIG. 12) and the mounting position of the component D. As a result, each of the component mounting devices M3 to M6 according to the first embodiment calculates the offset value based on the positional deviation amount corresponding to each of the four jig chips DA included in a predetermined area of ​​the correction data (for example, area AR23 shown in FIG. 12) and the respective distances (for example, each of the coefficients w1 to w4 shown in FIG. 13) between the positions of the measurement points of the four jig chips DA and the mounting position of the component D. n ) to calculate the corrected position of component D. As a result, each of component mounting devices M3 to M6 can correct the mounting position of component D with higher accuracy by performing weighting corresponding to the distance between the mounting position of component D to be mounted and the positions associated with the measurement points of each of the four jig chips DA.

[0145] As a result, the size of the jig board 3A in each of the component mounting devices M3 to M6 according to embodiment 1 is 650 mm × 650 mm. As a result, each of the component mounting devices M3 to M6 according to embodiment 1 can improve the accuracy of the component mounting position of the component D in the area corresponding to the size of the jig board 3A, even when the mounting head 8 is moved from one end to the other end of each of the Y-axis beams 6A, 6B and the X-axis beams 7A, 7B.

[0146] As described above, the component mounting system 100 according to the first embodiment includes component mounting devices M3 to M6 that mount a plurality of jig chips DA on a jig board 3A, and a management computer P1 (an example of a computer) that is communicatively connected to the component mounting devices M3 to M6. The component mounting devices M3 to M6 store the positions (an example of first positions) of measurement points PS0 of the plurality of jig chips DA to be mounted in the component mounting areas of the jig board 3A, mount the plurality of jig chips DA in the component mounting areas using a mounting head 8 that can hold the jig chips DA and transport the jig chips DA to the component mounting areas, and transmit an image of the component mounting areas captured by a board recognition camera 9 (an example of an imaging unit) provided on the mounting head 8 to the management computer P1. The management computer P1 measures the mounting positions PS1 (an example of the second positions) of the multiple jig chips DA mounted in the component mounting area based on the captured images transmitted from the component mounting devices M3 to M6, calculates the amount of positional deviation between the measured mounting positions PS1 of the jig chip DA and the positions of the measurement points PS0 corresponding to the jig chip DA, and generates and outputs correction data for correcting the positional deviation of the mounting positions of the components D mounted in the component mounting area based on the calculated amount of positional deviation of the multiple jig chips DA. Note that the component mounting area here refers to the area where each of the multiple jig chips DA mounted on the jig board 3A is mounted.

[0147] As a result, component mounting system 100 according to embodiment 1 can generate correction data capable of correcting the component mounting position over the entire component mounting area where components D are to be mounted, even when each of component mounting devices M3 to M6 is producing a board 3 (e.g., 650 mm×650 mm) large enough to mount components D by moving mounting head 8 from one end to the other end of each of Y-axis beams 6A, 6B and X-axis beams 7A, 7B. Therefore, component mounting system 100 can improve the accuracy of component mounting position in the component mounting process performed by each of component mounting devices M3 to M6.

[0148] Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that those skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components of the various embodiments described above may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0149] The present disclosure is useful as a component mounting device, a method for generating correction data, and a component mounting system that more accurately correct the positions of components to be mounted on a board. [Explanation of symbols]

[0150] 1 base 2. Substrate transport mechanism 3. Circuit Board 3A Jig Board 4. Parts Supply Department 5 Tape Feeder 6A, 6B Y-axis beam 7A, 7B X-axis beam 8 Placement head 8A nozzle 9. Circuit board recognition camera 10 Parts Recognition Camera 12 Component mounting mechanism 31 Management and Control Unit 32 Management storage unit 41 Control Unit 42 Storage section 100 Component Placement System D parts DA jig chip M3,M4,M5,M6 parts mounting device P1 Management Computer

Claims

1. A component mounting apparatus for mounting a plurality of components on a board, a nozzle for holding the component; a mounting head including the nozzle and capable of mounting the component onto a component mounting area of ​​the board; an imaging unit provided in the mounting head for imaging the component mounting area; a storage unit that stores first positions of the plurality of components to be mounted in the component mounting area and production data for producing a mounting board on which the production components to be mounted in the component mounting area are mounted; a calculation unit that measures a second position of the component placed in the component placement area based on the captured image captured by the imaging unit, and calculates a positional deviation amount between the measured second position of the component and the first position corresponding to the component; a generating unit that generates correction data for correcting misalignment of the mounting positions of the production parts based on the misalignment amounts of the plurality of parts calculated by the calculating unit, The calculation unit selecting a predetermined area including the mounting position of the production part based on the mounting position of the production part included in the production data; calculating an offset value of the mounting position of the production part based on the positional deviation amounts corresponding to four components that are included in the predetermined area of ​​the correction data and that are positioned near the mounting position of the production part, and the respective distances between the first positions of the four components and the mounting position of the production part; Component placement device.

2. The size of the substrate is 650 mm x 650 mm.

2. The component mounting device according to claim 1.

3. 1. A method for generating correction data for component placement positions executed by a component placement device that places a plurality of components on a board, comprising: storing first positions of the plurality of components to be mounted in the component mounting areas of the board and production data for producing a mounting board on which the production components to be mounted in the component mounting areas are mounted; mounting the plurality of components in the component mounting area by a mounting head capable of holding the components and transporting the components to the component mounting area; an imaging unit provided in the mounting head captures an image of the component mounting area; measuring second positions of the plurality of components mounted in the component mounting area based on the captured image; calculating a misalignment between the measured second position of the component and the first position corresponding to the component; generating correction data for correcting misalignment of the mounting positions of the production parts based on the calculated misalignment amounts of the plurality of parts; selecting a predetermined area including the mounting position of the production part based on the mounting position of the production part included in the production data; calculating an offset value of the mounting position of the production part based on the positional deviation amounts corresponding to four components that are included in the predetermined area of ​​the correction data and that are positioned near the mounting position of the production part, and the respective distances between the first positions of the four components and the mounting position of the production part; How to generate correction data.

4. a component mounting device that mounts a plurality of components on a board; a computer connected to the component mounting device so as to be able to communicate with the component mounting device, The component mounting device storing first positions of the plurality of components to be mounted in the component mounting areas of the board and production data for producing a mounting board on which the production components to be mounted in the component mounting areas are mounted; mounting the plurality of components in the component mounting area by a mounting head capable of holding the components and transporting the components to the component mounting area; an image of the component mounting area captured by an imaging unit provided in the mounting head is transmitted to the computer; The computer measuring second positions of the plurality of components placed in the component placement area based on the captured image transmitted from the component placement device; calculating a misalignment between the measured second position of the component and the first position corresponding to the component; generating correction data for correcting misalignment of the mounting positions of the production parts based on the calculated misalignment amounts of the plurality of parts; selecting a predetermined area including the mounting position of the production part based on the mounting position of the production part included in the production data; calculating and outputting an offset value of the mounting position of the production part based on the positional deviation amounts corresponding to four components that are included in the predetermined area of ​​the correction data and that are positioned near the mounting position of the production part, and the respective distances between the first positions of the four components and the mounting position of the production part; Parts mounting system.

Images