Component mounting system, component mounting machine, component mounting method

Abstract

This component-mounting system comprises a print inspection machine, a component mounter, and a substrate appearance inspection machine. The print inspection machine inspects a solder pattern printed on a substrate. The component mounter mounts a component on the substrate inspected by the print inspection machine. The substrate appearance inspection machine inspects the substrate on which the component has been mounted by the component mounter. The component mounter comprises a mounting unit that mounts the component on the substrate, and a control unit that controls the mounting unit. The control unit mounts the component at a corrected mounting position for which a preset mounting position was corrected using a correction value when the correction value calculated using at least one of the inspection result of the print inspection machine and the inspection result of the substrate appearance inspection machine is a first set value or greater. On the other hand, the control unit mounts the component at the mounting position without correction using the correction value when the correction value is less than the first set value.

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component mounting system, a component mounting machine, and a component mounting method for mounting components on a board. [Background technology]

[0002] A component mounting line where components are mounted on a board is equipped with multiple pieces of production equipment (e.g., solder printers, component mounters, board inspection machines, reflow ovens, etc.). The boards are transported to the multiple pieces of production equipment in sequence, and each piece of production equipment performs a specific process on the board, thereby mounting the components onto the board. However, each piece of production equipment has mechanical variations, which can cause misalignment when the components are mounted.

[0003] In response to this, a component mounting system has been developed as a conventional technology that determines an offset correction amount based on the misalignment amount obtained through inspection by a board inspection machine, and then mounts components at a position corrected using the determined offset correction amount (for example, JP 2018-56447 A). With this conventional technology, if there is a misalignment within a predetermined range, the misalignment information is automatically fed back to the board inspection machine, and offset correction processing is performed based on this information. However, if the misalignment is excessive, there is a possibility that an abnormality has occurred, so the misalignment information is not fed back and offset correction is not performed. If there is a misalignment between these two ranges, the operator decides whether to provide feedback. Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional component mounting systems, even when the positional misalignment of the mounted components is extremely small, the component offset correction process is uniformly performed on the component mounter. As a result, especially when the number of mounting points is large, the communication time and volume of information sent and received between production facilities becomes enormous, resulting in takt delays. In addition, since a huge amount of information needs to be communicated each time, the processing load on the control device constituting the component mounting system is heavy.

[0005] Therefore, this specification provides a technique that can reduce the burden on a control device that constitutes a component mounting system. [Means for solving the problem]

[0006] This specification discloses a component mounting system. The component mounting system includes a print inspection machine that inspects solder patterns printed on a board, a component mounter that mounts components on the board inspected by the print inspection machine, and a board visual inspection machine that inspects the board on which the components are mounted by the component mounter. The component mounter includes a mounting unit that mounts components on the board and a control unit that controls the mounting unit. When a correction value calculated using at least one of the inspection results of the print inspection machine and the inspection results of the board visual inspection machine is equal to or greater than a first set value, the control unit mounts the component at a corrected mounting position obtained by correcting a predetermined mounting position by the correction value. On the other hand, when the correction value is less than the first set value, the control unit mounts the component at the mounting position without correcting by the correction value.

[0007] In the above-described configuration, when the correction value is equal to or greater than the first set value, the control unit mounts the component at the corrected mounting position. However, when the correction value is less than the first set value, the control unit mounts the component at the mounting position without correction. In other words, correction is not performed for positional deviations that are not necessary and are within an acceptable range. This reduces the frequency of offset correction processing, and reduces the communication time and communication volume of information required for that processing, thereby avoiding takt time delays. It also reduces the processing load performed by the control unit that constitutes the component mounting system.

[0008] This specification also discloses a component mounter. The component mounter includes a mounting unit that mounts components on a board, a board transport device, and a control unit that controls the mounting unit. The board transport device transports a board transported from a print inspection machine that inspects solder patterns printed on the board to a component mounting position. At the same time, the board transport device transports the board, on which components have been mounted by the mounting unit at the component mounting position, to a board visual inspection machine. The control unit mounts the component at a corrected mounting position obtained by correcting a predetermined mounting position using the correction value when a correction value calculated using at least one of the inspection results of the print inspection machine and the board visual inspection machine is equal to or greater than a first set value. On the other hand, when the correction value is less than the set value, the control unit mounts the component at the mounting position without correcting using the correction value.

[0009] With this configuration, similarly to the above, correction is not required, and correction is not performed for misalignment within an allowable range, so that the same effects as those of the component mounting system described above can be achieved.

[0010] This specification also discloses a component mounting method. The component mounting method includes a printing inspection process for inspecting a solder pattern printed on a board, a component mounting process for mounting components on the board inspected in the printing inspection process, and a board appearance inspection process for inspecting the board on which the components have been mounted in the component mounting process. In the component mounting process, if a correction value calculated using at least one of the inspection results of the printing inspection process and the board appearance inspection process is equal to or greater than a first set value, the component is mounted at a corrected mounting position obtained by correcting a predetermined mounting position by the correction value. In addition, in the component mounting process, if the correction value is less than the first set value, the component is mounted at the mounting position without being corrected by the correction value.

[0011] With this configuration, similarly to the above, correction is not required, and correction is not performed for misalignment within an acceptable range, thereby achieving the same effects as the component mounting system described above. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic diagram of a component mounting system according to a first embodiment. [Figure 2] 10 is a diagram for explaining the relationship between the amount of positional deviation for each component and the first correction value and the set value (first set value and second set value). FIG. [Figure 3] FIG. 10 is a schematic diagram of a graph displayed on a graph output device. [Figure 4] FIG. 10 is a schematic diagram of a graph displayed on a graph output device. [Figure 5] 10 is a flowchart illustrating processing in a print inspection machine. [Figure 6] 10 is a flowchart for explaining processing in a component mounter. [Figure 7] FIG. 10 is a schematic diagram of a component mounting system according to a second embodiment. [Figure 8] 10 is a flowchart for explaining processing in a board visual inspection machine of a component mounting system according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0014] (Feature 1) The control unit may stop mounting components onto the board when the correction value is equal to or greater than a second set value that is greater than the first set value.

[0015] Since a correction value equal to or greater than the second set value is likely to be an abnormal value, rather than performing correction by offset correction processing, it is possible that some kind of abnormality has occurred. With this configuration, the cause of the abnormal value can be identified at that time and measures can be taken as necessary, which ultimately contributes to improving productivity.

[0016] (Feature 2) The print inspection machine or the board visual inspection machine may include a correction value calculation unit that calculates a correction value using the inspection result. The print inspection machine or the board visual inspection machine may also include a communication unit that transmits the correction value calculated by the correction value calculation unit to the component mounter when the correction value calculated by the correction value calculation unit is equal to or greater than a first set value, and does not transmit the correction value to the component mounter when the calculated correction value is less than the first set value.

[0017] With this configuration, the communication unit transmits the correction value calculated by the correction value calculation unit to the component mounter only when the correction value is equal to or greater than the first set value, thereby reducing the time required for communication of correction value information during component mounting compared to conventional techniques.

[0018] (Feature 3) The substrate may include at least one land and a lead component mounted on the land. The component mounting system may further include a graph output device that outputs a graph showing time-series changes in the amount of misalignment of the lead component relative to the land. The amount of misalignment of the lead component relative to the land may be calculated based on inspection results from a substrate visual inspection machine.

[0019] With this configuration, the graph output device displays a graph showing the time series change in the amount of misalignment of the lead component relative to the land, allowing the user to visually grasp in more detail the extent to which the offset correction process is effective and the extent to which it contributes, as well as the cause and progress of the misalignment.

[0020] (Feature 4) The print inspection machine may include a first correction value calculation unit that calculates a first correction value using inspection results of a solder pattern printed on a board. The print inspection machine may also include a first communication unit that transmits the first correction value calculated by the first correction value calculation unit to a component mounter and a board visual inspection machine when the first correction value calculated by the first correction value calculation unit is equal to or greater than a first set value, but does not transmit the calculated first correction value to the component mounter and the board visual inspection machine when the calculated first correction value is less than the first set value. The board visual inspection machine may also include a second correction value calculation unit that calculates a second correction value using inspection results of components mounted on the board and the first correction value transmitted from the first communication unit. The board visual inspection machine may also include a second communication unit that transmits the second correction value calculated by the second correction value calculation unit to the component mounter when the second correction value calculated by the second correction value calculation unit is equal to or greater than a third set value, but does not transmit the calculated second correction value to the component mounter when the calculated second correction value is less than the third set value. When the control unit of the component mounter receives the first correction value and the second correction value, the control unit may mount the component at the corrected mounting position calculated using the first correction value and the second correction value.

[0021] According to this configuration, only when a first correction value calculated using the solder pattern inspection results is equal to or greater than a first set value, the first communication unit of the print inspection machine transmits the first correction value to the component mounter and the board visual inspection machine. Also, only when a second correction value calculated using the component visual inspection results and the first correction value is equal to or greater than a second set value, the second communication unit of the board visual inspection machine transmits the second correction value to the component mounter. If the first and second correction values ​​have been received, the control unit of the component mounter mounts the component at the corrected mounting position calculated using the first and second correction values. Also, if either the first or second correction value has been received, the control unit of the component mounter mounts the component at the corrected mounting position calculated using the received correction value. On the other hand, if either the first or second correction value has not been received, the control unit of the component mounter mounts the component at the mounting position without correction.

[0022] (First Example) A component mounting system 10 according to a first embodiment will be described below with reference to Fig. 1 to Fig. 6. As shown in Fig. 1, the component mounting system 10 includes a plurality of pieces of production equipment installed in a component mounting line, and a production management computer 42 that manages the plurality of pieces of production equipment.

[0023] The production equipment constitutes a component mounting line that mounts components onto boards. The component mounting line mounts components onto input boards to manufacture boards with the components mounted on them. The board has at least one land and a lead component mounted on that land. The board may also have at least one pad and a chip component mounted on that pad. Hereinafter, a board after component mounting will be referred to as a circuit board, and a board before or during component mounting will sometimes be simply referred to as a board.

[0024] The component mounting line is equipped with a number of production equipments, including a board loader (not shown), a solder printer 12, a print inspection machine (SPI) 14, a component mounter 16, a board visual inspection machine (AOI) 18, a reflow furnace 20, and a board unloader (not shown). These production equipments can use known machines used in known component mounting lines, so they will be briefly described below.

[0025] The board loader loads boards into the component mounting line. The board loader accommodates multiple boards and transports the accommodated boards one by one to the solder printer 12. The solder printer 12 prints a solder pattern on the boards transported from the board loader. The boards with the solder pattern turned and printed are transported from the solder printer 12 to the print inspection machine 14. The print inspection machine 14 inspects whether the solder pattern printed on the board is normal. If there is an abnormality in the printed solder pattern (for example, if there is a printing defect due to clogging of the mask), the board is discarded. On the other hand, if the printed solder pattern is normal, the board is transported from the print inspection machine 14 to the component mounter 16. The component mounter 16 is equipped with a board transport device 40. The board transport device 40 transports the board transported from the print inspection machine to the component mounting position. The component mounter 16 is equipped with a mounting unit 34 that mounts a predetermined number of components on the board transported to the component mounting position. Specifically, the mounting unit 34 has a plurality of detachably attached component feeders, and mounts components supplied from these component feeders onto the board. The board on which components have been mounted by the component mounter 16 is carried out by the board transport device 40 to the board visual inspection machine 18. The board visual inspection machine 18 inspects whether or not the components have been properly mounted on the board. If the components have not been properly mounted on the board (for example, if the components have been mounted in the wrong location), the board is discarded. On the other hand, if the components have been properly mounted on the board, the board is carried out from the board visual inspection machine 18 to the reflow furnace 20. The reflow furnace 20 heats the board carried in to melt the solder and solder the components to the board. The board carried out from the reflow furnace 20 is carried out to the board unloader. The board unloader carries the circuit board on which the components have been mounted out of the component mounting line.

[0026] Each piece of production equipment is equipped with a communication circuit. The communication circuits are communicatively connected to the production management computer 42. Each communication circuit outputs status information indicating the status of the production equipment equipped with that communication circuit to the production management computer 42. For example, a board loader outputs the number of boards it accommodates to the production management computer 42. This allows the production management computer 42 to determine whether or not the board loader needs to be refilled with boards. Also, for example, the component mounter 16 outputs the number of components used for each type of component to the production management computer 42. This allows the production management computer 42 to determine whether or not the component mounter 16 needs to be refilled with components.

[0027] The production management computer 42 is equipped with a CPU and memory, and controls the operation of each piece of production equipment to control the production of circuit boards. For example, the production management computer 42 sends a solder print pattern to the print inspection machine 14. The print inspection machine 14 inspects the board using the received print pattern. Also, for example, the production management computer 42 sends a mounting program (mounting job) to the component mounter 16 that specifies the type of components to be mounted, the mounting order, and the mounting position. The component mounter 16 mounts the components on the board based on the received mounting program.

[0028] Furthermore, the production management computer 42 determines the operating status of each piece of production equipment based on the status information output from each piece of production equipment. For example, when a component feeder needs to be replaced, the component mounter 16 outputs information to that effect to the production management computer 42. Based on the information output from the component mounter 16, the production management computer 42 can determine that the component feeder of the component mounter 16 needs to be replaced.

[0029] The component mounting system 10 of this embodiment is configured to mount components at offset-corrected positions when misalignment occurs within a board. There are two types of misalignment that occur within a board: misalignment that occurs on a board unloaded from the solder printer 12, and misalignment that occurs on a board unloaded from the component mounter 16. The misalignment that occurs on a board unloaded from the solder printer 12 refers to misalignment of the solder pattern printed on the board. For example, this can be misalignment of the solder pattern relative to the lands on the board. Furthermore, the misalignment that occurs on a board unloaded from the component mounter 16 can be misalignment of the lead components after mounting relative to the lands on the board.

[0030] The print inspection machine 14 includes a correction value calculation unit 22 (first correction value calculation unit 23) that calculates a correction value using the inspection results. The first correction value calculation unit 23 calculates a first correction value for performing offset correction to eliminate misalignment using the inspection results of the solder pattern printed on the board. The print inspection machine 14 includes a computer configured with a CPU, memory, etc., and the CPU functions as the first correction value calculation unit 23. FIG. 2 is a diagram illustrating the relationship between the first correction value and the set values ​​(first set value and second set value). In this diagram, the vertical direction is the X axis and the horizontal direction is the Y axis. This diagram depicts a matrix created by drawing multiple lines vertically and horizontally. The center of the matrix is ​​the point where the correction value obtained from the inspection results by the print inspection machine 14 is zero in both the X and Y directions. In other words, this point indicates the predetermined mounting position. In the diagram, "-SX1" indicates a negative first set value in the X direction, and "+SX1" indicates a positive first set value in the X direction. "-SY1" indicates the negative first set value in the Y direction, and "+SY1" indicates the positive first set value in the Y direction. Also, "-SX2" indicates the negative second set value in the X direction, and "+SX2" indicates the positive second set value in the X direction. "-SY2" indicates the negative second set value in the Y direction, and "+SY2" indicates the positive second set value in the Y direction. Points P1, P2, and P3 in the figure indicate the first correction values ​​calculated for each part.

[0031] For example, when the first correction value calculated by the first correction value calculation unit 23 is less than the first set value, that is, when the first correction value is within the range of ±SX1 and the range of ±SY1, point P1 indicating the first correction value is plotted in the area indicated by R1 in Fig. 2. When the first correction value calculated by the first correction value calculation unit 23 is equal to or greater than the second set value, that is, when the first correction value is outside the range of ±SX2 or outside the range of ±SY2, point P3 indicating the first correction value is plotted in the area indicated by R3 in Fig. 2. When the first correction value calculated by the first correction value calculation unit 23 is equal to or greater than the first set value and less than the second set value, that is, when the first correction value is within the range of -SX2 to -SX1, the range of +SX1 to +SX2, the range of -SY2 to -SY1, or the range of +SY1 to +SY2, point P2 indicating the first correction value is plotted in the hatched area indicated by R2 in Fig. 2. The hatched area R2 indicates misalignment that is not within the allowable range and therefore requires offset correction. The range of this hatched area R2 is set in advance, for example, for each component, component type, lot, device type, or module (e.g., each mounting head type). In contrast, the area R1 indicates misalignment that does not require offset correction and is within the allowable range (within the allowable variation range).

[0032] In this embodiment, because multiple components are mounted on the board by the component mounter 16, the above-described first correction value is calculated for each component to be mounted on the board. That is, for each of the multiple components mounted by the component mounter 16, the misalignment of the solder pattern is inspected (measured), and the first correction value is calculated by calculating the difference between the inspection result (measurement result) and the preset mounting position. By calculating the first correction value individually for each component, each component can be mounted on the board with high precision. Alternatively, a single first correction value may be calculated for multiple components mounted by the component mounter 16. For example, if the cause of misalignment caused by the solder printer 12 is misalignment between the board and the mask, the solder pattern for each mounted component will be misaligned in the same direction by the same amount. Therefore, a single first correction value may be calculated and used for all components. In this case, for example, the misalignment of the solder patterns of some of the multiple components mounted by the component mounter 16 may be inspected (measured), the difference between the inspection result (measurement result) and a predetermined mounting position may be calculated, and a single first correction value may be calculated by averaging the calculated values.

[0033] The print inspection machine 14 includes a communication unit 26 (first communication unit 27). A CPU included in the print inspection machine 14 functions as the first communication unit 27. The first communication unit 27 transmits the first correction value calculated by the first correction value calculation unit 23 to the outside via a communication circuit in a predetermined case. That is, when the first correction value is equal to or greater than a first set value, the first communication unit 27 transmits the first correction value to the production management computer 42. On the other hand, when the first correction value is less than the first set value, the first communication unit 27 does not transmit the first correction value to the production management computer 42. Furthermore, when the first correction value is equal to or greater than a second set value, the first communication unit 27 transmits a stop instruction signal to the production management computer 42 to stop the component mounter 16 instead of transmitting the first correction value to the production management computer 42.

[0034] The production management computer 42 receives the first correction values ​​transmitted from the print inspection machine 14, and creates statistical information on the first correction values ​​for each component based on the received first correction values. The production management computer 42 also transmits the received first correction values ​​as first correction value instruction signals to the component mounter 16. Furthermore, if the first correction values ​​are equal to or greater than the second set value, the production management computer 42 transmits the stop instruction signal received from the print inspection machine 14 to the component mounter 16.

[0035] As shown in FIGS. 3 and 4 , the production management computer 42 includes a graph output device 44 that outputs a predetermined graph 48. For example, the graph output device 44 may be a display device such as an LCD having a display screen 46 for displaying the graph 48. The graph 48 shows, for example, the time-series change in the amount of misalignment of a lead component relative to a land. The amount of misalignment of a lead component relative to a land is calculated based on the inspection results of the board visual inspection machine 18. For example, the graph in FIG. 3 shows a point 52 represented by a hollow triangle (△) and a point 54 represented by a solid circle (●). The point 52 indicates the hypothetical misalignment amount when no correction processing is performed for a specific component (or the misalignment amount (statistical value) when a specific component is mounted without correction processing). In contrast, the point 54 indicates the misalignment amount after correction processing for the specific component. Since the point 52 represented by the ● is located closer to the center of the graph than the point 54 represented by the △, it can be seen that the amount of misalignment is reduced by performing correction processing. The graph in FIG. 4 shows multiple points 52 and 54. That is, this graph shows the amount of misalignment for each sequence after a plurality of components are mounted on a board.

[0036] The component mounter 16 includes a control unit 36 ​​that controls the mounting unit 34. The control unit 36 ​​is a computer configured with a CPU, memory, and the like. The control unit 36 ​​receives a first correction value instruction signal transmitted from the production management computer 42 via a communication circuit. When the first correction value calculated using the inspection results of the print inspection machine 14 is equal to or greater than a first set value, the control unit 36 ​​mounts the component at a corrected mounting position obtained by correcting a preset mounting position using the first correction value. Specifically, when the control unit 36 ​​receives the first correction value instruction signal from the production management computer 42, the control unit 36 ​​drives and controls the mounting unit 34 to mount the component at the corrected mounting position. On the other hand, when the first correction value is less than the first set value, the control unit 36 ​​mounts the component at the mounting position without correcting it using the first correction value. Specifically, when neither the first correction value instruction signal nor the stop instruction signal is received from the production management computer 42, the control unit 36 ​​drives and controls the mounting unit 34 to mount the component at the mounting position without correcting it using the first correction value. Furthermore, the control unit 36 ​​stops mounting components onto the board when the first correction value is equal to or greater than a second set value that is greater than the first set value. Specifically, the control unit 36 ​​does not control the driving of the mounting unit 34 when a stop instruction signal is input from the production management computer 42.

[0037] Next, the steps of the component mounting method performed by the component mounting system 10 will be described with reference to the flowcharts of FIGS.

[0038] First, the process performed by the print inspection machine 14 will be described. First, the board after solder pattern printing is transported from the solder printer 12 to the print inspection machine 14, and the board is carried into the board inspection position (step S100). Next, the print inspection machine 14 inspects whether the solder pattern printed on the board is normal (step S110), and calculates a first correction value from the inspection result (step S120). Next, the process proceeds to step S130, where the calculated first correction value is compared with a first set value. If it is determined that the first correction value is equal to or greater than the first set value (step S130: Y), the process proceeds to the next step S140, where the first correction value is compared with a second set value. If it is determined that the first correction value is less than the first set value (step S130: N), the first correction value is not sent to the production management computer 42 (step S152). On the other hand, if the comparison of the first correction value with the second set value determines that the first correction value is less than the second set value (step S140: N), the first correction value is sent to the production management computer 42 (step S154). If the comparison of the first correction value with the second set value determines that the first correction value is equal to or greater than the second set value (step S140: Y), a stop instruction signal is sent to the production management computer 42 (step S156). Steps S120 to S156 are performed for each of the multiple components mounted on a single board. After the above steps have been performed for all components, the inspected board is removed from the print inspection machine 14 (step S160).

[0039] Next, the processing performed by the component mounter 16 will be described. First, the post-print inspection board transported from the print inspection machine 14 to the component mounter 16 is carried into the component mounting position (step S300), and the process proceeds to the next step S320. In step S320, it is determined whether or not a stop instruction signal has been input. If a stop instruction signal has been input (step S320: Y), component mounting is stopped (step S336). If a stop instruction signal has not been input (step S320: N), the process proceeds to step S330, where it is determined whether or not a first correction value instruction signal has been input. If a first correction value instruction signal has been input (step S330: Y), a component is mounted at the corrected mounting position (step S332). If a first correction value instruction signal has not been input (step S330: N), a component is mounted at the mounting position without correction (step S334). Note that steps S310 to S336 are performed for each component on one board. After the above steps have been performed for all components, the board is unloaded (step S340).

[0040] As described above, in the component mounting system 10 of this embodiment, if the correction value calculated using the inspection results of the print inspection machine 14 is less than the first set value, the component is mounted at the mounting position without correction using the correction value. In other words, correction is not performed for misalignment that is not necessary and is within the allowable range. This reduces the frequency of offset correction processing, and reduces the communication time and communication volume of information required for that processing, thereby avoiding takt time delays. This contributes to improved productivity. In addition, it reduces the processing load performed by the control unit 36 ​​that constitutes the component mounting system 10. As a result, it is possible to reduce the introduction cost of the system, etc.

[0041] Furthermore, in the component mounting system 10 of the present embodiment described above, the control unit 36 ​​stops mounting components onto the board when the first correction value is equal to or greater than a second set value that is greater than the first set value. When the first correction value is equal to or greater than the second set value, there is a high possibility that an abnormality has occurred in the solder printer 12. By stopping mounting components onto the board, the cause of the abnormal value can be identified at that time and countermeasures can be taken as necessary. This can ultimately contribute to improving productivity. Furthermore, when creating statistical information on the first correction values ​​for each component, first correction values ​​that are equal to or greater than the second set value, which are abnormal values, are effectively excluded, thereby maintaining high accuracy of the first correction values.

[0042] Furthermore, in the component mounting system 10 of this embodiment described above, if the calculated first correction value is less than the first set value, the print inspection machine 14 does not transmit the first correction value to the component mounter 16 via the production management computer 42. Therefore, the time required for information communication of the first correction value during component mounting can be reduced compared to the prior art.

[0043] Furthermore, in the component mounting system 10 of this embodiment described above, the production management computer 42 outputs a graph showing the time-series change in the amount of misalignment (for example, graph 48 showing the time-series change in the amount of misalignment of a lead component relative to a land). By outputting a graph, it is possible to visually grasp in more detail the extent to which the offset correction process is effective and to what extent it contributes. It is also possible to visually grasp the cause and progress of the misalignment.

[0044] (Second Example) A component mounting system 10 according to a second embodiment will be described below with reference to FIGS. 7 and 8. In this embodiment, differences from the first embodiment will be mainly described. Components common to the first embodiment will be denoted by common component numbers and will not be described in detail. In the first embodiment, the print inspection machine 14 includes a correction value calculation unit 22 that calculates a correction value using its own inspection results. In contrast, in this embodiment shown in FIG. 7, the board visual inspection machine 18 includes a correction value calculation unit 22 that calculates a correction value using its own inspection results. That is, the board visual inspection machine 18 includes a correction value calculation unit 22 (second correction value calculation unit 24) that calculates a second correction value using the results of the board visual inspection. The second correction value calculation unit 24 calculates a second correction value for offset correction to eliminate misalignment using the results of the board visual inspection. The board visual inspection machine 18 includes a computer including a CPU, memory, and the like, and the CPU functions as the second correction value calculation unit 24.

[0045] The board visual inspection machine 18 includes a communication unit 26 (second communication unit 28). A CPU included in the board visual inspection machine 18 functions as the second communication unit 28. The second communication unit 28 transmits the second correction value calculated by the second correction value calculation unit 24 to the outside via a communication circuit in a predetermined case. That is, when the second correction value is equal to or greater than a first set value, the second communication unit 28 transmits the first correction value to the production management computer 42. On the other hand, when the second correction value is less than the first set value, the second communication unit 28 does not transmit the first correction value to the production management computer 42. Furthermore, when the second correction value is equal to or greater than the second set value, the second communication unit 28 transmits a stop instruction signal to the production management computer 42 to stop the component mounter 16 instead of transmitting the second correction value to the production management computer 42.

[0046] Next, the steps of the component mounting method performed by the component mounting system 10 will be described with reference to the flowchart of FIG.

[0047] First, the processing performed by the board visual inspection machine 18 will be described. First, the board after component mounting is transported from the component mounter 16 to the board visual inspection machine 18, and the board is carried into the board inspection position (step S200). Next, a visual inspection of the board on which components are mounted is performed (step S210), and a second correction value is calculated from the inspection results (step S220). Specifically, for components mounted on the board, the amount of positional deviation between the mounting position where the component is actually mounted and the mounting position previously set for the component is calculated, and the second correction value is calculated based on the calculated amount of positional deviation. Next, the processing proceeds to step S230, where the calculated second correction value is compared with a first set value. If it is determined that the second correction value is equal to or greater than the first set value (step S230: Y), the processing proceeds to the next step S240, where the second correction value is compared with the second set value. If it is determined that the second correction value is less than the first set value (step S230: N), the second correction value is not transmitted to the production management computer 42 (step S252). On the other hand, if it is determined that the second correction value is less than the second set value as a result of the comparison between the second correction value and the second set value (step S240: N), the second correction value is transmitted to the production management computer 42 (step S254). If it is determined that the second correction value is equal to or greater than the second set value (step S240: Y), a stop instruction signal is transmitted to the production management computer 42 (step S256). Note that steps S220 to S256 are performed for each mounted component on a single board. After the above steps are performed for all mounted components, the inspected board is removed from the board visual inspection machine 18 (step S260). Note that the production management computer 42 statistically processes (e.g., averages) the second correction values ​​for the components transmitted for each board and transmits the resulting value to the component mounter 16 as the second correction value. By using the statistically processed second correction value, the mounting position is corrected based on the tendency of the amount of positional deviation that occurs in the component mounting system 10.

[0048] In the component mounter 16, offset correction is performed through a process basically similar to that shown in the flowchart in FIG. 6. That is, after the board after print inspection is carried in (step S300), it is determined whether or not a stop instruction signal has been input. If a stop instruction signal has been input (step S320: Y), component mounting is stopped (step S336). If a stop instruction signal has not been input (step S320: N) and a first correction value instruction signal has been input (step S330: Y), components are mounted at the corrected mounting position (step S332). If a stop instruction signal has not been input (step S320: N) and a first correction value instruction signal has not been input (step S330: N), components are mounted at the mounting position without correction (step S334). Note that steps S310 to S336 are performed for each component on one board. After the above steps have been performed for all components, the board is unloaded (step S340).

[0049] In the component mounting system 10 of the present embodiment described above, only when the calculated second correction value is equal to or greater than the first set value and less than the second set value (i.e., only when it falls within the range of the hatched area R2 in Fig. 2), the board visual inspection machine 18 transmits the second correction value to the component mounter 16 via the production management computer 42. Therefore, the time required for information communication of the second correction value during component mounting can be reduced compared to the prior art.

[0050] (Third Example) A component mounting system 10 according to a third embodiment will be described below. In this embodiment, differences from the first and second embodiments will be mainly described. Components common to the first and second embodiments will be denoted by common component numbers, and detailed descriptions thereof will be omitted. In the component mounting system 10 according to this embodiment, the print inspection machine 14 and the board visual inspection machine 18 each calculate a correction value. Specifically, the print inspection machine 14 includes a first correction value calculation unit 23 that calculates a first correction value, and a first communication unit 27 that outputs the first correction value calculated by the first correction value calculation unit 23 to the outside in a predetermined case. Specifically, when the first correction value is equal to or greater than a first set value, the first communication unit 27 transmits the first correction value to the component mounter 16 and the board visual inspection machine 18 via the production management computer 42. On the other hand, when the first correction value is less than the first set value, the first communication unit 27 does not transmit the first correction value to the component mounter 16 and the board visual inspection machine 18. Furthermore, when the first correction value is equal to or greater than the second set value, the first communication unit 27 transmits a stop instruction signal to the component mounter 16 via the production management computer 42 to stop the component mounter 16 instead of transmitting the first correction value.

[0051] The board visual inspection machine 18 includes a second correction value calculation unit 24 that calculates a second correction value and a second communication unit 28 that outputs the second correction value calculated by the second correction value calculation unit 24 to the outside in a predetermined case. Here, when the first correction value calculated by the print inspection machine 14 is equal to or greater than a first set value and less than a second set value, the positional deviation amount measured by the board visual inspection machine 18 includes the result corrected with the first correction value output from the print inspection machine 14. Therefore, when calculating the second correction value, the amount of positional deviation between the corrected mounting position obtained by correcting a preset mounting position with the first correction value and the inspection result of the board visual inspection machine 18 (i.e., the actual mounted position) is calculated, and the second correction value is calculated based on the positional deviation amount. Note that when the first correction value is less than the first set value, the component mounter 16 does not perform positional correction using the first correction value. Therefore, the second correction value is calculated similarly to the second embodiment without using the first correction value. The second correction value calculated in this manner is transmitted to the component mounter 16 via the production management computer 42 in a predetermined case. That is, when the second correction value is equal to or greater than the third set value, the second communication unit 28 transmits the second correction value to the component mounter 16. On the other hand, when the second correction value is less than the third set value, the second communication unit 28 does not transmit the second correction value to the component mounter 16. Furthermore, when the second correction value is equal to or greater than the fourth set value, the second communication unit 28 transmits a stop instruction signal to the component mounter 16 to stop the component mounter 16 instead of transmitting the second correction value. Then, when the control unit 36 ​​of the component mounter 16 has received the first correction value and the second correction value, it mounts the component at the corrected mounting position calculated using the first correction value and the second correction value. Furthermore, when the control unit 36 ​​has received only one of the first correction value and the second correction value, it mounts the component at the corrected mounting position calculated using the received correction value (e.g., the first correction value or the second correction value). Furthermore, when the control unit 36 ​​has not received either the first or second correction value, it mounts the component at a predetermined mounting position, except when it has received a stop instruction signal. The third setting value may be set to a value different from the first setting value or may be set to the same value as the first setting value. The fourth setting value may be set to a value different from the second setting value or may be set to the same value as the second setting value.

[0052] Although the first to third embodiments have been described above, the specific aspects are not limited to the first to third embodiments. In the first to third embodiments, the production management computer 42 is equipped with the graph output device 44, but the present invention is not limited to this configuration. For example, in other embodiments, the component mounter 16 may be equipped with the graph output device 44. Furthermore, the graph 48 output by the graph output device 44 is not limited to those shown in FIGS. 3 and 4. For example, in other embodiments, a bar graph, a pie chart, a line graph, a band graph, a histogram, a Pareto chart, or the like may be used. Furthermore, the method of outputting the graph 48 by the graph output device 44 is not limited to displaying it on the display screen 46 of the display device. For example, in other embodiments, the graph 48 may be printed on paper by a printer.

[0053] In the first embodiment described above, the print inspection machine 14 includes the first correction value calculation unit 23 that calculates the first correction value and the first communication unit 27. However, this configuration is not limited to this. For example, in another embodiment, the production management computer 42 may include the first correction value calculation unit 23 and the first communication unit 27.

[0054] In the second embodiment described above, the board visual inspection machine 18 includes the second correction value calculation unit 24 that calculates the second correction value and the second communication unit 28. However, the present invention is not limited to this configuration. For example, in another embodiment, the production management computer 42 may include the second correction value calculation unit 24 and the second communication unit 28.

[0055] Although specific examples of the present invention have been described in detail above, these are merely examples and do not limit the scope of the claims. The claimed technology includes various modifications and variations of the specific examples exemplified above. The technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings can achieve multiple objectives simultaneously, and achieving one of these objectives alone is technically useful. [Explanation of symbols]

[0056] 10: Component mounting system 14: Print inspection machine 16: Component mounting machine 18: PCB appearance inspection machine 22: Correction value calculation unit 23: First correction value calculation unit 24: Second correction value calculation unit 26: Communications Department 27: First Communications Department 28: Second Communications Department 32: Substrate transport device 34: Mounting unit 36: Control unit 44:Graph output device 48:Graph -SX1, +SX1, -SY1, +SY1: First setting value -SX2, +SX2, -SY2, +SY2: Second setting value

Claims

1. a print inspection machine that inspects solder patterns printed on the board; a component mounter that mounts components on the board inspected by the print inspection machine; a board appearance inspection machine that inspects the board on which the components have been mounted by the component mounter, The component mounter includes: a mounting unit that mounts the components on the board; a control unit for controlling the mounting unit, the control unit being configured to, when a correction value calculated using at least one of the inspection results of the print inspection machine and the inspection results of the board visual inspection machine is equal to or greater than a first set value, mount the component at a corrected mounting position obtained by correcting a pre-set mounting position using the correction value, and, when the correction value is less than the first set value, mount the component at the mounting position without correcting using the correction value; A component mounting system comprising: the substrate includes at least one land and a lead component mounted on the land; the component mounting system further includes a graph output device that outputs a graph showing a time series change in the amount of deviation of the lead component relative to the land, A component mounting system in which the amount of deviation of the lead component from the land is calculated based on the inspection results of the board visual inspection machine.

2. a print inspection machine that inspects solder patterns printed on the board; a component mounter that mounts components on the board inspected by the print inspection machine; a board appearance inspection machine that inspects the board on which the components have been mounted by the component mounter, The component mounter includes: a mounting unit that mounts the components on the board; a control unit for controlling the mounting unit, the control unit being configured to, when a correction value calculated using at least one of the inspection results of the print inspection machine and the inspection results of the board visual inspection machine is equal to or greater than a first set value, mount the component at a corrected mounting position obtained by correcting a pre-set mounting position using the correction value, and, when the correction value is less than the first set value, mount the component at the mounting position without correcting using the correction value; It is equipped with The print inspection machine includes: a first correction value calculation unit that calculates a first correction value using an inspection result of the solder pattern printed on the board; a first communication unit that, when the first correction value calculated by the first correction value calculation unit is equal to or greater than a first set value, transmits the first correction value to the component mounter and the board visual inspection machine, and, when the calculated first correction value is less than the first set value, does not transmit the first correction value to the component mounter and the board visual inspection machine; The substrate appearance inspection machine includes: a second correction value calculation unit that calculates a second correction value using a result of the appearance inspection of the component mounted on the board and the first correction value transmitted from the first communication unit; a second communication unit that transmits the second correction value to the mounter when the second correction value calculated by the second correction value calculation unit is equal to or greater than a third set value, and that does not transmit the second correction value to the mounter when the calculated second correction value is less than the third set value, a component mounting system, wherein, when the control unit of the component mounting machine receives the first correction value and the second correction value, the control unit mounts the component at a corrected mounting position calculated using the first correction value and the second correction value.

3. 3. The component mounting system according to claim 1, wherein the control unit stops mounting of the component onto the board when the correction value is equal to or greater than a second set value that is greater than the first set value.

4. The print inspection machine or the board appearance inspection machine is a correction value calculation unit that calculates the correction value using the inspection result; a communication unit that transmits the correction value calculated by the correction value calculation unit to the component mounter when the correction value is equal to or greater than the first set value, and does not transmit the correction value to the component mounter when the calculated correction value is less than the first set value; The component mounting system according to any one of claims 1 to 3, comprising:

5. a mounting unit that mounts components on a board; a board transport device that transports a board transported from a print inspection machine that inspects a solder pattern printed on the board into a component mounting position, and transports the board on which the components have been mounted by the mounting unit at the component mounting position to a board visual inspection machine; a control unit for controlling the mounting unit, the control unit being configured to, when a correction value calculated using at least one of the inspection results of the print inspection machine and the inspection results of the board visual inspection machine is equal to or greater than a first set value, mount the component at a corrected mounting position obtained by correcting a pre-set mounting position using the correction value, and, when the correction value is less than the first set value, mount the component at the mounting position without correcting using the correction value; A component mounter comprising: the substrate includes at least one land and a lead component mounted on the land; the component mounter further includes a graph output device that outputs a graph showing a time series change in the amount of deviation of the lead component relative to the land, A component mounter in which the amount of deviation of the lead component from the land is calculated based on the inspection results of the board visual inspection machine.

6. a mounting unit that mounts components on a board; a board transport device that transports a board transported from a print inspection machine that inspects a solder pattern printed on the board into a component mounting position, and transports the board on which the components have been mounted by the mounting unit at the component mounting position to a board visual inspection machine; a control unit for controlling the mounting unit, the control unit being configured to, when a correction value calculated using at least one of the inspection results of the print inspection machine and the inspection results of the board appearance inspection machine is equal to or greater than a first set value, mount the component at a corrected mounting position obtained by correcting a pre-set mounting position using the correction value, and, when the correction value is less than the set value, mount the component at the mounting position without correcting using the correction value; A component mounter comprising: The print inspection machine includes: a first correction value calculation unit that calculates a first correction value using an inspection result of the solder pattern printed on the board; a first communication unit that, when the first correction value calculated by the first correction value calculation unit is equal to or greater than a first set value, transmits the first correction value to the component mounter and the board visual inspection machine, and, when the calculated first correction value is less than the first set value, does not transmit the first correction value to the component mounter and the board visual inspection machine; The substrate appearance inspection machine includes: a second correction value calculation unit that calculates a second correction value using a result of the appearance inspection of the component mounted on the board and the first correction value transmitted from the first communication unit; a second communication unit that transmits the second correction value to the mounter when the second correction value calculated by the second correction value calculation unit is equal to or greater than a third set value, and that does not transmit the second correction value to the mounter when the calculated second correction value is less than the third set value, When the control unit receives the first correction value and the second correction value, the control unit mounts the component at a corrected mounting position calculated using the first correction value and the second correction value.

7. a print inspection process for inspecting the solder pattern printed on the board; a component mounting step of mounting components on the board inspected in the printing inspection step; a board appearance inspection process for inspecting the board on which the components have been mounted in the component mounting process, In the component mounting step, When a correction value calculated using at least one of the inspection results of the printing inspection process and the inspection results of the board appearance inspection process is equal to or greater than a first set value, the component is mounted at a corrected mounting position obtained by correcting a preset mounting position using the correction value; When the correction value is less than a first set value, the component is mounted at the mounting position without correction by the correction value. A component mounting method, the substrate includes at least one land and a lead component mounted on the land; The component mounting method further includes a graph output step of outputting a graph showing a time series change in the amount of deviation of the lead component from the land, The component mounting method, wherein the amount of deviation of the lead component from the land is calculated based on the inspection results of the board visual inspection process.

8. a print inspection process for inspecting the solder pattern printed on the board; a component mounting process in which components are mounted on the board inspected in the print inspection process by a component mounter; a board appearance inspection process for inspecting the board on which the components are mounted in the component mounting process by a board appearance inspection machine, In the component mounting step, When a correction value calculated using at least one of the inspection results of the printing inspection process and the inspection results of the board appearance inspection process is equal to or greater than a first set value, the component is mounted at a corrected mounting position obtained by correcting a preset mounting position using the correction value; When the correction value is less than a first set value, the component is mounted at the mounting position without correction by the correction value; The print inspection process includes: a first correction value calculation step of calculating a first correction value using an inspection result of the solder pattern printed on the board; a first communication step of transmitting the first correction value to the component mounter and the board visual inspection machine when the first correction value calculated in the first correction value calculation step is equal to or greater than a first set value, and not transmitting the first correction value to the component mounter and the board visual inspection machine when the calculated first correction value is less than the first set value, The substrate appearance inspection step includes: a second correction value calculation step of calculating a second correction value using the visual inspection result of the component mounted on the board and the first correction value transmitted in the first communication step; a second communication step of transmitting the second correction value to the mounter when the second correction value calculated in the second correction value calculation step is equal to or greater than a third set value, and not transmitting the second correction value to the mounter when the calculated second correction value is less than the third set value, The component mounting method includes, when the first correction value and the second correction value are received, mounting the component at a corrected mounting position calculated using the first correction value and the second correction value.

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