Conductive member for touch panel and touch panel

Abstract

To provide a conductive member for a touch panel configured to suppress fracture of a lead wire while suppressing breakage of an external connection terminal, and a touch panel.SOLUTION: A conductive member for a touch panel includes a substrate (2) and a conductive layer that is disposed on at least one surface of the substrate (2). The conductive layer includes a plurality of detection electrodes, a plurality of lead wires (12) led from the plurality of detection electrodes, and a plurality of external connection terminals (13) connected to the plurality of lead wires (12). A ratio of a thickness D1 of the external connection terminal (13) to a thickness D2 of the lead wire (12) satisfies 1.00<D1 / D2≤3.00.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a conductive member for a touch panel that is used as an electrode for detecting a touch operation. The present invention also relates to a touch panel including the conductive member for a touch panel. [Background technology]

[0002] BACKGROUND ART Conventionally, various electronic devices, including portable information devices such as tablet computers and smartphones, use touch panels that allow input operations to the electronic device by touching or bringing a finger, stylus pen, or the like into contact with or close to the screen, a so-called touch operation.

[0003] Such a touch panel, as disclosed in Patent Document 1, for example, has a conductive member formed on a substrate, on which are formed a plurality of detection electrodes for detecting touch operations, a plurality of lead-out wirings drawn out from the plurality of detection electrodes, and a plurality of external connection terminals electrically connected to the plurality of lead-out wirings. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-194746 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, when a conductive member such as that disclosed in Patent Document 1 is used as a touch panel, it is often electrically connected to a display module or the like for displaying images. At this time, a plurality of external connection terminals of the conductive member are electrically connected to wiring such as a so-called FPC (Flexible Printed Circuit) drawn out from the display module. The external connection terminals are often electrically connected to wiring such as an FPC by being pressure-bonded via a so-called ACF (Anisotropic Conductive Film), but this needs to have a certain thickness to prevent cracking when the FPC is bent after pressure-bonding.

[0006] Furthermore, for example, in the manufacture of a touch panel having a curved touch surface, the substrate supporting the plurality of detection electrodes, the plurality of lead wires, and the plurality of external connection terminals may be formed from a flexible material to impart flexibility to the conductive member. In this case, if the plurality of lead wires is made thicker, the conductivity improves, but there is a problem in that the plurality of lead wires are more likely to break when the conductive member is bent.

[0007] Therefore, in order to prevent both cracking of the external connection terminals and breakage of the draw-out wiring, it is possible to consider, for example, making the external connection terminals thicker while making the draw-out wiring thinner, but this could result in stress concentrating at the boundary between the external connection terminals and the draw-out wiring, causing the boundary to break.

[0008] The present invention has been made to solve such problems, and aims to provide a conductive member for a touch panel that can suppress cracking of external connection terminals while suppressing breakage of lead-out wiring, and a touch panel using the conductive member for a touch panel. [Means for solving the problem]

[0009] The conductive member for a touch panel according to the present invention includes a substrate and a conductive layer disposed on at least one surface of the substrate. The conductive layer has a plurality of detection electrodes, a plurality of lead-out wirings drawn from the plurality of detection electrodes, and a plurality of external connection terminals connected to the plurality of lead-out wirings, and is characterized in that the ratio D1 / D2 of the thickness D1 of the external connection terminal to the thickness D2 of the lead-out wiring satisfies the following inequality (1). 1.00 < D1 / D2 ≤ 3.00 ···(1)

[0010] The thickness of the external connection terminal is preferably greater than 1.00 μm. The thickness of the lead-out wiring is preferably less than 1.00 μm.

[0011] The substrate is preferably a transparent insulating substrate. Further, the substrate preferably has flexibility.

[0012] The touch panel according to the present invention is characterized by using the above-described conductive member for a touch panel.

Advantages of the Invention

[0013] According to this invention, the conductive member for a touch panel includes a substrate and a conductive layer disposed on at least one surface of the substrate. The conductive layer has a plurality of detection electrodes, a plurality of lead-out wirings drawn from the plurality of detection electrodes, and a plurality of external connection terminals connected to the plurality of lead-out wirings, and the ratio D1 / D2 of the thickness D1 of the external connection terminal to the thickness D2 of the lead-out wiring satisfies 1.00 < D1 / D2 ≤ 3.00. Therefore, it is possible to suppress breakage of the lead-out wiring while suppressing cracking of the external connection terminal.

Brief Description of the Drawings

[0014] [Figure 1] It is a partial cross-sectional view of the conductive member for a touch panel according to Embodiment 1. [Figure 2] It is a plan view of the conductive member for a touch panel according to Embodiment 1. [Figure 3]3 is an enlarged view showing a part of a first conductive layer according to the first embodiment. FIG. [Figure 4] 3 is a cross-sectional view showing a boundary portion between a first lead wiring and a first external connection terminal in the first embodiment. FIG. [Figure 5] 1 is a partial cross-sectional view of a touch panel according to a first embodiment. [Figure 6] 10A and 10B are diagrams illustrating a conductive member for a touch panel bent along the side of a cylindrical rod. DETAILED DESCRIPTION OF THE INVENTION

[0015] DETAILED DESCRIPTION OF THE INVENTION A conductive member for a touch panel and a touch panel according to the present invention will be described in detail below based on preferred embodiments shown in the accompanying drawings. In the following, the notation "~" indicating a numerical range includes the numbers written on both sides. For example, "s is a number between t1 and t2" means that the range of s includes numbers t1 and t2, and expressed in mathematical notation as t1≦s≦t2. Unless otherwise specified, angles including "perpendicular" and "parallel" include a range of error generally accepted in the technical field. "Transparent" means that the light transmittance in the visible light wavelength range of 400 nm to 800 nm is at least 40% or more, preferably 75% or more, more preferably 80% or more, and even more preferably 90% or more. The light transmittance is measured according to "Plastics -- Determination of total luminous transmittance and total luminous reflectance" specified in JIS K 7375:2008.

[0016] Embodiment FIG. 1 shows the configuration of a conductive member 1 for a touch panel according to an embodiment of the present invention. The conductive member 1 for a touch panel includes a substrate 2 having a first surface 2A and a second surface 2B that form a front and a back surface of the substrate 2, a first conductive layer 3A disposed on the first surface 2A of the substrate 2, and a second conductive layer 3B disposed on the second surface 2B of the substrate 2. The substrate 2 is insulating, and the first conductive layer 3A and the second conductive layer 3B are electrically insulated from each other. The substrate 2 is flexible, and the conductive member 1 for a touch panel has flexibility corresponding to the flexibility of the substrate 2.

[0017] The conductive member for touch panels 1 can be used as a touch panel display device (not shown) by adhering a cover member (not shown) to the surface on the first conductive layer 3A side and a display module (not shown) to the surface on the second conductive layer 3B side. At this time, a user's finger, stylus pen, or the like in contact with or close to the cover member is detected, and a touch operation by the user is detected.

[0018] FIG. 2 shows a plan view of the conductive member 1 for a touch panel. The first conductive layer 3A has a plurality of first detection electrodes 11 for detecting touch operations, which extend along a predetermined X direction and are arranged along a Y direction perpendicular to the X direction, a plurality of first extraction wirings 12 electrically connected to the plurality of first detection electrodes 11, and a plurality of first external connection terminals 13 electrically connected to the plurality of first extraction wirings 12.

[0019] The second conductive layer 3B has a plurality of second detection electrodes 21 for detecting touch operations, which extend along the Y direction and are arranged along the X direction, a plurality of second extraction wirings 22 electrically connected to the plurality of second detection electrodes 21, and a plurality of second external connection terminals 23 electrically connected to the plurality of second extraction wirings 22.

[0020] The region where the plurality of first detection electrodes 11 is arranged and the region where the plurality of second detection electrodes 21 is arranged overlap with each other with the substrate 2 sandwiched therebetween in the Z direction, which is orthogonal to both the X direction and the Y direction.

[0021] As shown in Fig. 3, the first extension wiring 12 has a line width W1 of, for example, 5.0 µm or more and 30.0 µm or less. The first external connection terminal 13 has a terminal width W2 of, for example, 300.0 µm or more and 500.0 µm or less. For ease of explanation, Fig. 3 shows only one set of the first detection electrode 11, the first extension wiring 12, and the first external connection terminal 13.

[0022] 4 shows a cross-sectional view of the first outgoing wiring 12 and the first external connection terminal 13 extending along the Y direction, taken along line AA in FIG. 3 which is parallel to the Y direction, so as to include the boundary between them. The ratio D1 / D2 of the thickness D1 of the first external connection terminal 13 to the thickness D2 of the first outgoing wiring 12 is greater than 1.00 and not more than 3.00. That is, the thickness D2 of the first outgoing wiring 12 and the thickness D1 of the first external connection terminal 13 satisfy the following inequality (1): 1.00 <D1 / D2≦3.00···(1)

[0023] Generally, conductive members used in touch panels are often electrically connected to a display module for displaying images, and at this time, multiple external connection terminals of the conductive member are electrically connected to wiring such as a so-called FPC (Flexible Printed Circuit) drawn out from the display module. The external connection terminals are often electrically connected to wiring such as an FPC by being pressure-bonded via a so-called ACF (Anisotropic Conductive Film), but in order to prevent cracking when the FPC is bent after pressure-bonding, it is necessary for the ACF to have a certain thickness.

[0024] Furthermore, for example, in the manufacture of a touch panel having a curved touch surface, the substrate supporting the plurality of detection electrodes, the plurality of lead wires, and the plurality of external connection terminals may be formed from a flexible material to impart flexibility to the conductive member. In this case, if the plurality of lead wires is made thicker, the conductivity improves, but there is a problem in that the plurality of lead wires are more likely to break when the conductive member is bent.

[0025] Therefore, in order to prevent both cracking of the external connection terminals and breakage of the draw-out wiring, it is possible to consider, for example, making the external connection terminals thicker while making the draw-out wiring thinner, but this could result in stress concentrating at the boundary between the external connection terminals and the draw-out wiring, causing the boundary to break.

[0026] The inventors have found that by designing the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 to satisfy inequality (1), stress is less likely to concentrate at the boundary between the first external connection terminal 13 and the first lead-out wiring 12, and cracking of the first external connection terminal 13 when an external device (not shown), such as a display module, is crimped to the first external connection terminal 13, while also preventing breakage of the first lead-out wiring 12 when the conductive member for a touch panel 1 is bent. If the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 do not satisfy inequality (1), stress is likely to concentrate at the boundary between the first external connection terminal 13 and the first lead-out wiring 12, making the boundary more likely to break.

[0027] Here, by making the thickness D1 of the first external connection terminal 13 thicker than 1.00 μm, for example, the first external connection terminal 13 has sufficient strength, so that cracking of the first external connection terminal 13 is further suppressed. Furthermore, by making the thickness D1 of the first extension wiring 12 thinner than, for example, 1.00 μm, the first extension wiring 12 has sufficient flexibility, which further reduces breakage of the first extension wiring 12 due to bending of the conductive member 1 for a touch panel.

[0028] Although not shown, the ratio E1 / E2 of the thickness E1 of the second external connection terminal 23 to the thickness E2 of the second outgoing wiring 22 is greater than 1.00 and not greater than 3.00. That is, the thickness E2 of the second outgoing wiring 22 and the thickness E1 of the second external connection terminal 23 satisfy the following inequality (2). 1.00 <E1 / E2≦3.00···(2)

[0029] When the thickness E1 of the second external connection terminal 23 and the thickness E2 of the second outgoing wiring 22 satisfy the inequality (2), similar to the case between the first external connection terminal 13 and the first outgoing wiring 12, stress is less likely to concentrate at the boundary between the second external connection terminal 23 and the second outgoing wiring 22, and cracking of the second external connection terminal 23 when the second external connection terminal 23 is crimped to an external device (not shown), such as a display module, can be suppressed, while breakage of the second outgoing wiring 22 can be suppressed when the conductive member for a touch panel 1 is bent.

[0030] From the above, according to the conductive member 1 for touch panels of the embodiment of the present invention, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first outgoing wiring 12 satisfy inequality (1), and the thickness E1 of the second external connection terminal 23 and the thickness E2 of the second outgoing wiring 22 satisfy inequality (2), so that cracking of the first external connection terminal 13 and the second external connection terminal 23 can be suppressed while breakage of the first outgoing wiring 12 and the second outgoing wiring 22 can be suppressed.

[0031] 5 , a touch panel P can be configured by attaching a transparent cover member 5 to a conductive member for touch panel 1 via an adhesive 4. Because the touch panel P includes the conductive member for touch panel 1, even when, for example, the touch panel P is electrically connected to a display module (not shown) by crimping the plurality of first external connection terminals 13 and the plurality of second external connection terminals 23 to wiring drawn out from the display module (not shown), and even if the conductive member for touch panel 1 is arranged in a curved state due to the curved shape of the cover member 5, cracking of the plurality of first external connection terminals 13 and the plurality of second external connection terminals 23 is suppressed, breakage of the plurality of first lead-out wirings 12 and the plurality of second lead-out wirings 22 is suppressed, and further breakage of the boundary between the first external connection terminals 13 and the first lead-out wirings 12 and the boundary between the second external connection terminals 23 and the second lead-out wirings 22 is suppressed.

[0032] When a touch panel P manufactured using the conductive member for touch panels 1 is placed on a display module (not shown), the substrate 2 is preferably a transparent insulating substrate so that a user of the touch panel P can see an image displayed on the display module. In this case, the substrate 2 preferably has a total light transmittance of, for example, 85% to 100%. The total light transmittance is measured, for example, using "Plastics -- Determination of total light transmittance and total light reflectance" as defined in JIS K 7375:2008.

[0033] Furthermore, although it has been described that the first conductive layer 3A is arranged on the first surface 2A of the substrate 2 and the second conductive layer 3B is arranged on the second surface 2B of the substrate 2, the first conductive layer 3A and the second conductive layer 3B may be arranged only on the first surface 2A side or only on the second surface 2B side of the substrate 2, for example, the second conductive layer 3B may be arranged on the first conductive layer 3A via an insulating layer not shown. Furthermore, although the conductive member 1 for a touch panel has been described as having a first conductive layer 3A and a second conductive layer 3B, it may also have only one of the first conductive layer 3A and the second conductive layer 3B. In these cases, the first conductive layer 3A or the second conductive layer 3B is disposed on only one surface of the substrate 2.

[0034] Each of the components constituting the conductive member 1 for a touch panel according to the embodiment will be described below. <Board 2> The type of substrate 2 is not particularly limited as long as it is a member that can support the first conductive layer 3A and the second conductive layer 3B, and examples thereof include a plastic substrate, a glass substrate, and a metal substrate, with a plastic substrate being preferred. A flexible substrate is preferable for the substrate 2 because of its excellent bendability. Examples of flexible substrates include the above-mentioned plastic substrates. The thickness of the substrate 2 is not particularly limited, and is often 25 μm to 500 μm.

[0035] Materials constituting the substrate 2 are preferably resins with a melting point of approximately 290°C or less, such as polyethylene terephthalate (PET) (258°C), polycycloolefin (134°C), polycarbonate (250°C), acrylic film (128°C), polyethylene naphthalate (269°C), polyethylene (135°C), polypropylene (163°C), polystyrene (230°C), polyvinyl chloride (180°C), polyvinylidene chloride (212°C), and triacetyl cellulose (290°C), with PET, polycycloolefin, or polycarbonate being more preferred. Of these, PET is particularly preferred due to its excellent adhesion to the first conductive layer 3A and the second conductive layer 3B. The values ​​in parentheses above are melting points or glass transition temperatures. The total light transmittance of the substrate 2 is preferably 85% to 100%. The total light transmittance is measured according to "Plastics - Determination of total light transmittance and total light reflectance" defined in JIS (Japanese Industrial Standards) K 7375:2008.

[0036] One preferred embodiment of the substrate 2 is a treated substrate that has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By performing the above treatment, hydrophilic groups such as OH groups are introduced into the surface of the treated substrate 2, improving the adhesion between the substrate 2 and the first conductive layer 3A and between the substrate 2 and the second conductive layer 3B. Among the above treatments, atmospheric pressure plasma treatment is preferred because it further improves the adhesion between the substrate 2 and the first conductive layer 3A and between the substrate 2 and the second conductive layer 3B.

[0037] <Undercoat layer> In order to improve the adhesion between the substrate 2 and the first conductive layer 3A and between the substrate 2 and the second conductive layer 3B, an undercoat layer may be disposed between the substrate 2 and the first conductive layer 3A and between the substrate 2 and the second conductive layer 3B. This undercoat layer contains a polymer, which further improves the adhesion between the substrate 2 and the first conductive layer 3A and between the substrate 2 and the second conductive layer 3B.

[0038] The method for forming the undercoat layer is not particularly limited, but examples include a method in which a polymer-containing undercoat layer-forming composition is applied to a substrate and, if necessary, heat-treated. Furthermore, examples of polymer-containing undercoat layer-forming compositions that may be used include gelatin, acrylic resin, urethane resin, and acrylic-styrene latex containing inorganic or polymeric particles.

[0039] If necessary, the conductive member 1 for a touch panel may have a refractive index adjusting layer between the substrate 2 and the first conductive layer 3A and between the substrate 2 and the second conductive layer 3B, in addition to the undercoat layer described above. As the refractive index adjusting layer, for example, an organic layer to which particles of a metal oxide such as zirconium oxide that adjusts the refractive index are added can be used.

[0040] <First Conductive Layer and Second Conductive Layer> The first conductive layer 3A and the second conductive layer 3B can be formed from a metal or alloy, such as silver, copper, gold, aluminum, nickel, chromium, molybdenum, or tungsten. The first conductive layer 3A and the second conductive layer 3B preferably contain copper, but may also contain metals other than copper, such as gold or silver. The first conductive layer 3A and the second conductive layer 3B may also contain metallic silver and a polymer binder, such as gelatin or acrylic-styrene latex, which is suitable for forming a mesh pattern. Other preferred materials include aluminum, silver, molybdenum, and titanium, as well as their alloys. Laminated structures of these metals are also possible, such as thin metal wires with laminated structures such as molybdenum / copper / molybdenum or molybdenum / aluminum / molybdenum.

[0041] Furthermore, the first conductive layer 3A and the second conductive layer 3B may contain, for example, metal oxide particles, metal pastes such as silver paste and copper paste, and metal nanowire particles such as silver nanowires and copper nanowires.

[0042] Next, a description will be given of a method for forming the first conductive layer 3 A and the second conductive layer 3 B. As a method for forming these layers, for example, a sputtering method, a plating method, a silver halide method, a printing method, or the like can be appropriately used. A method for forming the first conductive layer 3A and the second conductive layer 3B by sputtering will be described. First, a copper foil layer is formed by sputtering, and then copper wiring is formed from the copper foil layer by photolithography, thereby forming the first conductive layer 3A and the second conductive layer 3B. Note that instead of sputtering, the copper foil layer can also be formed by so-called vapor deposition. The copper foil layer can be formed using sputtered copper foil, vapor-deposited copper foil, or electrolytic copper foil. More specifically, the process for forming copper wiring described in JP 2014-29614 A can be used.

[0043] A method for forming the first conductive layer 3A and the second conductive layer 3B by plating will be described. For example, the first conductive layer 3A and the second conductive layer 3B can be formed using a metal plating film formed on an electroless plating base layer by electroless plating the base layer. In this case, the first conductive layer 3A and the second conductive layer 3B are formed by forming a pattern on the substrate with a catalyst ink containing at least metal fine particles, and then immersing the substrate in an electroless plating bath to form a metal plating film. More specifically, the method for manufacturing a metal-coated substrate described in JP 2014-159620 A can be used.

[0044] The first conductive layer 3A and the second conductive layer 3B are formed by forming a pattern of a resin composition having functional groups capable of interacting with at least a metal catalyst precursor on a substrate, applying a catalyst or catalyst precursor, and immersing the substrate in an electroless plating bath to form a metal plating film. More specifically, the method for manufacturing a metal-coated substrate described in JP 2012-144761 A can be applied.

[0045] A method for forming the first conductive layer 3A and the second conductive layer 3B by the silver salt method will be described. First, a silver salt emulsion layer containing silver halide is exposed to light using an exposure pattern that will form the first conductive layer 3A and the second conductive layer 3B, and then developed to form the first conductive layer 3A and the second conductive layer 3B. More specifically, the methods for manufacturing thin metal wires described in JP 2012-6377 A, JP 2014-112512 A, JP 2014-209332 A, JP 2015-22397 A, JP 2016-192200 A, and WO 2016 / 157585 can be used.

[0046] A method for forming the first conductive layer 3A and the second conductive layer 3B by printing will be described. First, a conductive paste containing conductive powder is applied to a substrate in the same pattern as the first conductive layer 3A and the second conductive layer 3B, and then a heat treatment is performed to form the first conductive layer 3A and the second conductive layer 3B. Pattern formation using the conductive paste is performed by, for example, an inkjet method or a screen printing method. More specifically, the conductive paste described in JP 2011-28985 A can be used as the conductive paste.

[0047] <Cover material> The cover member 5 may be made of a material such as reinforced glass, polycarbonate, polyethylene terephthalate, or polymethyl methacrylate (PMMA), and the thickness of the cover member 5 is preferably 0.1 mm or more and 1.5 mm or less. <Adhesive> An optically clear adhesive sheet (OCA) or an optically clear adhesive resin (OCR) can be used as the adhesive 4 that bonds the conductive member 1 for a touch panel and the cover member 5 together, and the preferred film thickness is 10 μm or more and 200 μm or less. For example, the 8146 series manufactured by 3M Company can be used as the optically clear adhesive sheet. [Example]

[0048] The present invention will be described in more detail below with reference to examples. The materials, amounts used, ratios, treatment details and treatment procedures shown in the following examples can be appropriately changed without departing from the spirit of the present invention, and the scope of the present invention should not be construed as being limited by the following examples.

[0049] (Preparation of Silver Halide Emulsion) To the following solution 1, maintained at 30°C and pH 4.5, 90% of each of the following solutions 2 and 3 were added simultaneously over 20 minutes while stirring the solution 1, forming 0.16 μm core particles. Next, the following solutions 4 and 5 were added to the resulting solution over 8 minutes, and then the remaining 10% of the following solutions 2 and 3 were added over 2 minutes, growing the core particles to 0.10 μm. Furthermore, 0.15 g of potassium iodide was added to the resulting solution, and the solution was aged for 5 minutes to complete grain formation.

[0050] 1 liquid: 750ml water 8.6g gelatin 3g potassium bromide 1,3-dimethylimidazolidine-2-thione 20mg Sodium benzenethiosulfonate 10mg Citric acid 0.7g 2 liquid: 300ml water Silver nitrate 150g 3 liquid: 300ml water 38g sodium chloride 32g potassium bromide Potassium hexachloroiridate(III) (0.005%KCl 20% aqueous solution) 5ml Ammonium hexachlororhodate (0.001%NaCl 20% aqueous solution) 7ml 4 liquid: 100ml water Silver nitrate 50g 5 liquid: 100ml water Sodium chloride 13g Potassium bromide 11g Yellow prussic acid 5mg

[0051] The emulsion was then washed by the usual flocculation method. Specifically, the temperature of the resulting solution was lowered to 35°C, and the pH was lowered using sulfuric acid until the silver halide precipitated (pH 3.6 ± 0.2). Approximately 3 L of the supernatant was removed from the resulting solution (first wash). 3 L of distilled water was then added to the resulting solution, and sulfuric acid was added until the silver halide precipitated. Another 3 L of the supernatant was removed from the resulting solution (second wash). The same procedure as the second wash was repeated once more (third wash), completing the washing and desalting steps. The emulsion after washing and desalting was adjusted to pH 6.4 and pAg 7.5, and chemically sensitized to obtain the optimum sensitivity by adding 2.5 g of gelatin, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate, and 10 mg of chloroauric acid at 55°C. Then, 100 mg of 1,3,3a,7-tetraazaindene as a stabilizer and 100 mg of Proxel (trade name, manufactured by ICI Co., Ltd.) as a preservative were added to the resulting emulsion. The finally obtained emulsion was a silver chlorobromide cubic grain emulsion containing 0.08 mol % of silver iodide and a silver chlorobromide ratio of 70 mol % of silver chloride and 30 mol % of silver bromide, with an average grain size (equivalent to a sphere) of 100 nm and a coefficient of variation of 9%.

[0052] The above emulsion was treated with 1,3,3a,7-tetraazaindene (1.2 × 10 -4 mol / mol Ag), hydroquinone (1.2 × 10 -2 mol / mol Ag), citric acid (3.0 × 10 -4 The composition was then adjusted to a pH of 5.6 with citric acid. To the above composition, a polymer latex containing a polymer represented by the following formula (P-1) (hereinafter also referred to as "Polymer 1"), a dispersant consisting of a dialkylphenyl PEO (Polyethylene oxide) sulfate ester, and water (the ratio of the mass of dispersant to the mass of Polymer 1 (mass of dispersant / mass of Polymer 1, unit: g / g) was 0.02, and the solid content was 22% by mass) was added so that the ratio of the mass of Polymer 1 to the total mass of gelatin in the composition (mass of Polymer 1 / mass of gelatin, unit: g / g) was 0.25 / 1, thereby obtaining a polymer latex-containing composition. Here, in the polymer latex-containing composition, the ratio of the mass of gelatin to the mass of silver derived from silver halide (mass of gelatin / mass of silver derived from silver halide, unit: g / g) was 0.11. Furthermore, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was added as a crosslinking agent. The amount of the crosslinking agent added was determined so that the amount of the crosslinking agent in the silver halide-containing photosensitive layer described below was 0.09 g / m 2 It was adjusted so that In this manner, a composition for forming a photosensitive layer was prepared. Polymer 1 was synthesized with reference to Japanese Patent Nos. 3305459 and 3754745.

[0053] [ka]

[0054] The above-mentioned polymer latex was applied to a 40 μm thick polyethylene terephthalate film ("Fujifilm Corporation rolled long film") to form a 0.05 μm thick primer layer. This process was carried out by roll-to-roll, and the following processes (steps) were also carried out by roll-to-roll in the same manner. The roll width was 1 m and the length was 1000 m.

[0055] (Process A) Next, a composition for forming a silver halide-free layer, which was a mixture of the above-mentioned polymer latex and gelatin, a composition for forming a photosensitive layer, and a composition for forming a protective layer, which was a mixture of the above-mentioned polymer latex and gelatin, were simultaneously coated in multiple layers on the undercoat layer to form a silver halide-free layer, a silver halide-containing photosensitive layer, and a protective layer on the undercoat layer. The thickness of the silver halide-free layer was 2.0 μm, the mixture mass ratio of polymer 1 to gelatin in the silver halide-free layer (polymer 1 / gelatin) was 2 / 1, and the content of polymer 1 was 1.3 g / m 2 It was. The thickness of the silver halide-containing photosensitive layer was 2.5 μm, the mixture mass ratio of polymer 1 to gelatin in the silver halide-containing photosensitive layer (polymer 1 / gelatin) was 0.25 / 1, and the content of polymer 1 was 0.19 g / m 2 It was. The thickness of the protective layer was 0.15 μm, the mixture mass ratio of polymer 1 to gelatin in the protective layer (polymer 1 / gelatin) was 0.1 / 1, and the content of polymer 1 was 0.015 g / m 2 It was.

[0056] (Process B) The photosensitive layer thus fabricated was exposed to parallel light emitted from a high-pressure mercury lamp as a light source through a photomask having a pattern corresponding to the first conductive layer 3A shown in FIGS. 2 and 3. As shown in FIG. 4, a semi-transparent film was applied to the photomask in the pattern corresponding to the first interconnection wiring 12 so that the first external connection terminal 13 ultimately formed would be thicker than the first interconnection wiring 12. The semi-transparent film reduced the exposure dose in the pattern corresponding to the first interconnection wiring 12 compared to the exposure dose in the pattern corresponding to the first external connection terminal 13, resulting in the first external connection terminal 13 ultimately formed being thicker than the first interconnection wiring 12. The exposure dose in the pattern corresponding to the first interconnection wiring 12 was 0.32 times the exposure dose in the pattern corresponding to the first detection electrode 11 and the pattern corresponding to the first external connection terminal 13.

[0057] After exposure, the obtained sample was developed with a developer described below, and further developed with a fixer (product name: N3X-R for CN16X: manufactured by Fujifilm Corporation), and then rinsed with pure water at 25°C and dried to obtain a sample having a silver-containing layer containing metallic silver formed in a mesh pattern.

[0058] (Developer composition) The following compounds are contained in 1 liter (L) of developer: Hydroquinone 0.037 mol / L N-methylaminophenol 0.016 mol / L Sodium metaborate 0.140 mol / L Sodium hydroxide 0.360 mol / L Sodium bromide 0.031 mol / L Potassium metabisulfite 0.187 mol / L

[0059] The obtained sample was immersed in warm water at 50° C. for 180 seconds, then the water was removed with an air shower and the sample was allowed to dry naturally.

[0060] (Process C) The sample obtained in step B was placed in a superheated steam treatment tank at 110°C and left to stand for 30 seconds to undergo superheated steam treatment. The steam flow rate at this time was 100 kg / h.

[0061] (Process D) The sample obtained in step C was immersed in an aqueous protease solution (40°C) for 30 seconds. The sample was removed from the aqueous protease solution and washed by immersing it in warm water (liquid temperature: 50°C) for 120 seconds. Thereafter, the water was removed with an air shower and the sample was allowed to dry naturally. The aqueous protease solution used was prepared according to the following procedure. Triethanolamine and sulfuric acid were added to an aqueous solution of a protease (Biophrase 30L, manufactured by Nagase ChemteX Corporation) (protease concentration: 0.5% by mass) to adjust the pH to 8.5.

[0062] (Process E) The sample obtained in step D was immersed in a 1% by mass, pH 2.7 aqueous glutaric acid solution (74°C) for 30 seconds. The sample was removed from the aqueous glutaric acid solution and washed by immersing it in water at 30°C for 5 seconds. Glutaric acid manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. was used.

[0063] (Process F) The sample obtained in step E was immersed in plating solution A (30°C) having the following composition for 5 minutes. The sample was removed from plating solution A and then immersed in water (liquid temperature: 20°C) for 120 seconds to be washed. The composition of plating solution A (total volume 1200 ml) was as follows. The pH of plating solution A was 9.9, which was adjusted by adding a specified amount of potassium carbonate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.). All of the following components used were manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. No change in line width was observed before and after plating.

[0064] (Composition of plating solution A) 2.1g AgNO3 Sodium sulfite 86g Sodium thiosulfate pentahydrate 60g Aron T-50 (manufactured by Toagosei Co., Ltd., solid content 40%) 36g Methylhydroquinone 13g Potassium carbonate (prescribed amount) water remainder

[0065] (Process G) The sample obtained in step F was immersed in a solution of water / diethylene glycol monoethyl ether = 30 / 70 (liquid temperature: 50°C) for 60 seconds, and then immersed in water (liquid temperature: 30°C) for 30 seconds to wash. (Process H) The sample obtained in step G was placed in a superheated steam treatment tank at 110°C and left to stand for 30 seconds to undergo superheated steam treatment. The steam flow rate was 100 kg / h. This gave a conductive member for a touch panel of Example 1.

[0066] The conductive member for touch panel of Example 1 was subjected to the (conductive processing process) and (cutting processing and observation process) described below to measure the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first outgoing wiring 12 in Example 1, and the ratio D1 / D2 of the thickness D1 of the first external connection terminal 13 to the thickness D2 of the first outgoing wiring 12 was calculated.

[0067] (Conductive treatment process) A vacuum deposition apparatus (IB-29510VET manufactured by JEOL Ltd.) was used to deposit carbon to a thickness of 10 nm on the first conductive layer 3A. Subsequently, a sputter deposition apparatus (E-1030 ion sputter manufactured by Hitachi Ltd.) was used to deposit platinum to a thickness of 10 nm on the 10 nm thick carbon.

[0068] (Cutting and observation process) Ten locations on the plurality of first lead wirings 12 and ten locations on the plurality of first external connection terminals 13 were randomly selected. Next, for all of the selected locations, Ga was detected using the FIB function of a FIB (Focused Ion Beam)-SEM (Scanning Electron Microscope) hybrid device (Helios600i manufactured by Thermo Fisher Scientific). + Cross-section cutting was performed under conditions of an acceleration voltage of 30 kV and a Pt-CVD surface protective film, thereby exposing cross sections of the first outgoing wiring 12 cut along a plane perpendicular to the direction in which the first outgoing wiring 12 extends at 10 positions of the selected first outgoing wiring 12, and exposing cross sections of the first external connection terminals 13 cut along a plane perpendicular to the direction in which the first external connection terminals 13 extend at 10 positions of the selected first external connection terminals 13.

[0069] Furthermore, using the SEM function of the same FIB-SEM composite instrument, the cross section of the first external connection terminal 13 was observed at 10 exposed locations under the conditions of secondary / backscattered electron images, an acceleration voltage of 1 kV, a probe current of 86 pA, and a WD of 4 mm, and the thickness D1 of the first external connection terminal 13 at each of the 10 locations was measured. Similarly, the cross section of the first extension wiring 12 was observed at 10 exposed locations, and the thickness D2 of the first extension wiring 12 at each of the 10 locations was measured.

[0070] Finally, the final values ​​of thickness D1 and thickness D2 were obtained by calculating the average value of thickness D1 measured at each of the 10 locations on the first external connection terminal 13 and the average value of thickness D2 measured at each of the 10 locations on the first extraction wiring 12. The ratio D1 / D2 of the thickness D1 and thickness D2 thus obtained was also calculated.

[0071] The thickness D1 of the first external connection terminal 13 calculated in this manner was 2.40 μm, and the thickness D2 of the first outgoing wiring 12 was 0.90 μm. The ratio D1 / D2 of the thickness D1 of the first external connection terminal 13 to the thickness D2 of the first outgoing wiring 12 was 2.67.

[0072] <Example 2> In step B, the conductive member for a touch panel of Example 2 was produced in the same manner as Example 1, except that a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.70 times the exposure amount in the pattern corresponding to the first detection electrode 11.

[0073] For the conductive member for a touch panel of Example 2, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Example 2, the thickness D1 of the first external connection terminal 13 was 2.00 μm, the thickness D2 of the first lead-out wiring 12 was 0.90 μm, and the ratio D1 / D2 was 2.22.

[0074] Example 3 In step B, the conductive member for a touch panel of Example 3 was produced in the same manner as in Example 1, except that a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.50 times the exposure amount in the pattern corresponding to the first detection electrode 11.

[0075] For the conductive member for a touch panel of Example 3, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Example 3, the thickness D1 of the first external connection terminal 13 was 1.30 μm, the thickness D2 of the first lead-out wiring 12 was 0.90 μm, and the ratio D1 / D2 was 1.44.

[0076] Example 4 In step B, the conductive member for a touch panel of Example 4 was produced in the same manner as in Example 1, except that a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.35 times the exposure amount in the pattern corresponding to the first detection electrode 11.

[0077] For the conductive member for a touch panel of Example 4, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Example 4, the thickness D1 of the first external connection terminal 13 was 1.10 μm, the thickness D2 of the first lead-out wiring 12 was 0.90 μm, and the ratio D1 / D2 was 1.22.

[0078] <Example 5> In process B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.35 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.25 times the exposure amount in the pattern corresponding to the first detection electrode 11. The conductive member for a touch panel of Example 4 was produced in the same manner as Example 1.

[0079] For the conductive member for a touch panel of Example 5, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Example 5, the thickness D1 of the first external connection terminal 13 was 1.10 μm, the thickness D2 of the first lead-out wiring 12 was 0.70 μm, and the ratio D1 / D2 was 1.22.

[0080] Example 6 In step B, the conductive member for a touch panel of Example 4 was produced in the same manner as Example 1, except that the exposure time for the pattern corresponding to the first external connection terminal 13 was increased so that the exposure amount for the photomask pattern corresponding to the first external connection terminal 13 was 1.15 times the exposure amount for the pattern corresponding to the first detection electrode 11.

[0081] For the conductive member for a touch panel of Example 5, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Example 5, the thickness D1 of the first external connection terminal 13 was 2.70 μm, the thickness D2 of the first lead-out wiring 12 was 0.90 μm, and the ratio D1 / D2 was 3.00. 。

[0082] Example 7 > In step B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.50 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.40 times the exposure amount in the pattern corresponding to the first detection electrode 11. 7 The conductive member for a touch panel was manufactured.

[0083] Example 7 For this conductive member for a touch panel, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead wiring 12 were measured in the same manner as in Example 1, and the ratio D1 / D2 was calculated. 7 In this example, the thickness D1 of the first external connection terminal 13 was 1.30 μm, the thickness D2 of the first lead wiring 12 was 1.10 μm, and the ratio D1 / D2 was 1.18.

[0084] Example 8 > In process B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.31 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.25 times the exposure amount in the pattern corresponding to the first detection electrode 11. The conductive member for a touch panel of Example 8 was produced in the same manner as Example 1.

[0085] Example 8 For this conductive member for a touch panel, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead wiring 12 were measured in the same manner as in Example 1, and the ratio D1 / D2 was calculated. 8 In this example, the thickness D1 of the first external connection terminal 13 was 0.90 μm, the thickness D2 of the first lead wiring 12 was 0.70 μm, and the ratio D1 / D2 was 1.29.

[0086] <Comparative Example 1> In process B, a conductive member for a touch panel of Comparative Example 1 was produced in the same manner as in Example 1, except that no semi-transparent film was applied to the photomask pattern corresponding to the first outgoing wiring 12, and the exposure amount in the pattern corresponding to the first detection electrode 11, the exposure amount in the pattern corresponding to the first outgoing wiring 12, and the exposure amount in the first external connection terminal 13 were all equal to each other.

[0087] For the conductive member for a touch panel of Comparative Example 1, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Comparative Example 1, the thickness D1 of the first external connection terminal 13 was 2.40 μm, the thickness D2 of the first lead-out wiring 12 was 2.60 μm, and the ratio D1 / D2 was 0.92.

[0088] <Comparative Example 2> In process B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.50 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.50 times the exposure amount in the pattern corresponding to the first detection electrode 11. Except for this, the conductive member for a touch panel of Comparative Example 2 was produced in the same manner as in Example 1.

[0089] For the conductive member for a touch panel of Comparative Example 2, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Comparative Example 2, the thickness D1 of the first external connection terminal 13 was 1.30 μm, the thickness D2 of the first lead-out wiring 12 was 1.50 μm, and the ratio D1 / D2 was 0.87.

[0090] <Comparative Example 3> In process B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.25 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.25 times the exposure amount in the pattern corresponding to the first detection electrode 11. Except for this, the conductive member for a touch panel of Comparative Example 3 was prepared in the same manner as in Example 1.

[0091] For the conductive member for a touch panel of Comparative Example 3, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Comparative Example 3, the thickness D1 of the first external connection terminal 13 was 0.60 μm, the thickness D2 of the first lead-out wiring 12 was 0.70 μm, and the ratio D1 / D2 was 0.86.

[0092] <Comparative Example 4> In step B, the conductive member for a touch panel of Comparative Example 4 was produced in the same manner as in Example 1, except that the exposure time for the pattern corresponding to the first external connection terminal 13 was increased so that the exposure amount for the photomask pattern corresponding to the first external connection terminal 13 was 1.35 times the exposure amount for the pattern corresponding to the first detection electrode 11.

[0093] For the conductive member for a touch panel of Comparative Example 4, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Comparative Example 4, the thickness D1 of the first external connection terminal 13 was 3.00 μm, the thickness D2 of the first lead-out wiring 12 was 0.90 μm, and the ratio D1 / D2 was 3.33.

[0094] <Comparative Example 5> In process B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.70 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.23 times the exposure amount in the pattern corresponding to the first detection electrode 11. Except for this, the conductive member for a touch panel of Comparative Example 5 was produced in the same manner as in Example 1.

[0095] For the conductive member for a touch panel of Comparative Example 5, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Comparative Example 5, the thickness D1 of the first external connection terminal 13 was 2.00 μm, the thickness D2 of the first lead-out wiring 12 was 0.65 μm, and the ratio D1 / D2 was 3.08.

[0096] <Comparative Example 6> In process B, a semi-transparent film was applied to the pattern corresponding to the first external connection terminal 13 so that the exposure amount in the photomask pattern corresponding to the first external connection terminal 13 was 0.50 times the exposure amount in the pattern corresponding to the first detection electrode 11, and a semi-transparent film was applied to the pattern corresponding to the first extraction wiring 12 so that the exposure amount in the photomask pattern corresponding to the first extraction wiring 12 was 0.40 times the exposure amount in the pattern corresponding to the first detection electrode 11. Except for this, the conductive member for a touch panel of Comparative Example 5 was prepared in the same manner as in Example 1.

[0097] For the conductive member for a touch panel of Comparative Example 6, the thickness D1 of the first external connection terminal 13 and the thickness D2 of the first lead-out wiring 12 were measured and the ratio D1 / D2 was calculated in the same manner as in Example 1. In Comparative Example 6, the thickness D1 of the first external connection terminal 13 was 1.50 μm, the thickness D2 of the first lead-out wiring 12 was 0.40 μm, and the ratio D1 / D2 was 3.75.

[0098] Examples 1 to 3 produced in this manner 8The conductive members for a touch panel of Comparative Examples 1 to 6 were evaluated for the rate of increase in resistance as shown below. (Evaluation of resistance increase rate) First, the first linear resistance N1 of the boundary between the first external connection terminal 13 and the first lead-out wiring 12 was measured. Four microprobes (tungsten probes manufactured by Micro Support Co., Ltd., diameter 0.5 μm) were brought into contact with four different locations along the first external connection terminal 13 and the first lead-out wiring 12, respectively, so as to include the boundary between the first external connection terminal 13 and the first lead-out wiring 12. Next, a constant current was applied to the two microprobes located at both outer ends using a source meter (KEITHLEY Model 2400 general-purpose source meter) so that the voltage between the two inner microprobes was 5 mV, and the resistance between the two inner microprobes was measured. The measured resistance was then divided by the distance between the two inner microprobes to calculate the first linear resistance N1 of the boundary between the first external connection terminal 13 and the first lead-out wiring 12. Similarly, the first line resistance value M1 of the first lead wiring 12 of the conductive member for a touch panel was calculated.

[0099] Next, the conductive member for a touch panel was placed on a flat table, and a cylindrical rod S with a diameter of 0.9 mm was placed on top of it so that it was oriented perpendicular to the direction in which the first external connection terminals 13 extended. Furthermore, with the boundary between the first outgoing wiring 12 and the first external connection terminals 13 in contact with the rod S, the conductive member for a touch panel was bent 180° along the cylindrical side of the rod S, as shown in FIG. 6. Note that FIG. 6 shows, as an example, a state in which the conductive member for a touch panel 1 is bent along the side of the rod S with the first conductive layer 3A in contact with the rod S. The conductive member for a touch panel was then returned to its flat state. This operation was repeated five times.

[0100] The conductive member for a touch panel was placed on a flat table, and a cylindrical rod S with a diameter of 0.9 mm was placed on top of it so that it was oriented perpendicular to the direction in which the first outgoing wiring 12 extended. Furthermore, with the first outgoing wiring 12, which was perpendicular to the rod S, in contact with the rod S, the conductive member for a touch panel was bent 180° along the cylindrical side surface of the rod S. The conductive member for a touch panel was then returned to its flat state. This operation was repeated 10 times.

[0101] Next, the second linear resistance value N2 of the first external connection terminal 13 that had been bent five times was measured using a method similar to that used to measure the first linear resistance value N1 of the first external connection terminal 13. Furthermore, the second linear resistance value M2 of the first extension wiring 12 that had been bent ten times was measured using a method similar to that used to measure the first linear resistance value M1 of the first extension wiring 12.

[0102] Finally, the ratios N2 / N1×100% and M2 / M1×100% of the first linear resistance values ​​N1, M1 to the second linear resistance values ​​N2, M2 were calculated to calculate the resistance increase rate of the boundary portion between the first external connection terminal 13 and the first outgoing wiring 12 and the resistance increase rate of the first outgoing wiring 12. For the resistance increase rate of the first external connection terminal 13, a rating of A was given to conductive members for touch panels with a rating of less than 5%, as the boundary portion had excellent bending resistance; a rating of B was given to conductive members for touch panels with a rating of 5% or more but less than 10%, as the boundary portion had sufficient bending resistance; and a rating of C was given to conductive members for touch panels with a rating of 10% or more, as the boundary portion did not have sufficient bending resistance. In addition, the resistance increase rate of the first outgoing wiring 12 was also evaluated based on the same criteria as the resistance increase rate of the boundary between the first external connection terminal 13 and the first outgoing wiring 12, and the conductive member for a touch panel was given an evaluation of A to C. In addition, if an evaluation of C was given to the resistance increase rate at the boundary between the first external connection terminal 13 and the first outgoing wiring 12, the evaluation was stopped at that point and the evaluation of the resistance increase rate of the first outgoing wiring 12 was omitted.

[0103] Table 1 below shows Examples 1 to8 The evaluation results for Comparative Examples 1 to 6 are also shown. In Table 1, the boundary portion between the first external connection terminal 13 and the first lead-out wiring 12 is simply referred to as the boundary portion. In Table 2, "-" indicates that the evaluation was omitted. The item "Exposure amount based on the exposure amount of the first detection electrode" indicates how many times the exposure amount of the first external connection terminal 13 or the first lead-out wiring 12 is compared to the exposure amount of the first detection electrode 11. For example, "×0.32" indicates that the exposure amount is 0.32 times the exposure amount of the first detection electrode 11. [Table 1]

[0104] As shown in Table 1, the conductive members for touch panels of Examples 1 to 6 were evaluated as A for the resistance increase rate of the boundary between the first external connection terminal 13 and the first lead-out wiring 12 and for the resistance increase rate of the first lead-out wiring 12, and it is clear that they have excellent resistance to bending. and 8 The conductive member for touch panels was evaluated as B for the resistance increase rate at the boundary between the first external connection terminal 13 and the first outgoing wiring 12, and for the resistance increase rate of the first outgoing wiring 12, indicating that it has sufficient resistance to bending.

[0105] Example 1 8 In all of the conductive members for touch panels, the value of the thickness ratio D1 / D2 is greater than 1.00 and equal to or less than 3.00, satisfying inequality (1). This is thought to make it difficult for stress to concentrate at the boundary between the first external connection terminal 13 and the first outgoing wiring 12, and as a result, the resistance increase rate at the boundary between the first external connection terminal 13 and the first outgoing wiring 12 was evaluated as A or B.

[0106] Furthermore, in Examples 1 to 6, since the thickness D1 of each of the first external connection terminals 13 was 1.00 μm or more and the thickness D2 of each of the first outgoing wirings 12 was 1.00 μm or less, it is believed that the first external connection terminals 13 and the first outgoing wirings 12 were resistant to bending, and the resistance increase rate of the boundary between the first external connection terminals 13 and the first outgoing wirings 12 and the resistance increase rate of the first outgoing wirings 12 were evaluated as A.

[0107] Example 7 and 8 In this case, since only one of the conditions that the thickness D1 of the first external connection terminal 13 is 1.00 μm or more and the thickness D2 of the first outgoing wiring 12 is 1.00 μm or less is met, it is considered that only one of the first external connection terminal 13 and the first outgoing wiring 12 is relatively resistant to bending, and the evaluation of the resistance increase rate of the boundary portion between the first external connection terminal 13 and the first outgoing wiring 12 and the evaluation of the resistance increase rate of the first outgoing wiring 12 were B.

[0108] In Comparative Examples 1 and 2, the resistance increase rate of the first extension wiring 12 was evaluated as C, and in Comparative Examples 3 to 6, the resistance increase rate of the boundary portion between the first external connection terminal 13 and the first extension wiring 12 was evaluated as C. In Comparative Examples 1 to 3, the first external connection terminal 13 is thinner than the first extension wiring 12, and it is thought that bending of the conductive member for a touch panel makes the first external connection terminal 13 or the first extension wiring 12 more likely to break. In Comparative Examples 4 to 6, the first external connection terminal 13 is thicker than the first extension wiring 12, but the thickness ratio D1 / D2 is greater than 3.00. Therefore, it is thought that stress tends to concentrate at the boundary portion between the first external connection terminal 13 and the first extension wiring 12, making the boundary portion more likely to break.

[0109] The present invention is basically configured as described above. Although the conductive member for a touch panel of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment, and various improvements and modifications may be made without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0110] 1 conductive material for touch panel, 2 substrate, 2A first surface, 2B second surface, 3A first conductive layer, 3B second conductive layer, 4 adhesive, 5 cover member, 11 first detection electrode, 12 first lead-out wiring, 13 first external connection terminal, 21 second detection electrode, 22 second lead-out wiring, 23 second external connection terminal, D1, D2 thickness, P touch panel, S rod, W1 line width, W2 terminal width.

Claims

1. A substrate; a conductive layer disposed on at least one surface of the substrate; Equipped with the conductive layer has a plurality of detection electrodes, a plurality of lead-out wirings led out from the plurality of detection electrodes, and a plurality of external connection terminals connected to the plurality of lead-out wirings; The ratio of the thickness D1 of the external connection terminal to the thickness D2 of the lead-out wiring satisfies the following inequality (1): 1.00<D1 / D2≦3.00...(1) Conductive material for touch panels.

2. The conductive member for a touch panel according to claim 1 , wherein a thickness D1 of the external connection terminal is greater than 1.00 μm.

3. The conductive member for a touch panel according to claim 1 , wherein a thickness D2 of the lead-out wiring is less than 1.00 μm.

4. The conductive member for a touch panel according to any one of claims 1 to 3, wherein the substrate is a transparent insulating substrate.

5. The conductive member for a touch panel according to any one of claims 1 to 4, wherein the substrate is flexible.

6. A conductive member for a touch panel according to any one of claims 1 to 5, Touch panel.

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