Multilayer ceramic electronic components

Abstract

To provide a multilayer ceramic electronic component that includes an external electrode having less defects and improved strength and can prevent a plating layer from floating.SOLUTION: A multilayer ceramic electronic component according to an embodiment of the present invention includes a ceramic body including a dielectric layer and first and second internal electrodes arranged so as to be alternately laminated with the dielectric layer sandwiched between them, a first external electrode connected to the first internal electrode of the ceramic body, and a second external electrode connected to the second internal electrode, and the first external electrode includes a first electrode layer arranged in contact with the ceramic body, and a first conductive layer arranged on the first electrode layer, and the second external electrode includes a second electrode layer arranged in contact with the ceramic body and a second conductive layer arranged on the second electrode layer, and the first conductive layer and the second conductive layer can be porous.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic electronic component. [Background technology]

[0002] As the range of applications for electronic products expands, the technological fields in which multilayer ceramic electronic components are used are also expanding. In particular, with the increasing use of electronics in automobiles, automobile ECUs (Electronic Control Units) and TCUs (Transmission Control Units) are now being placed in the engine compartment or are directly attached to the transmission.

[0003] At the same time, the use of lead-free solder is expanding to prevent environmental pollution. However, typical lead-free solder has a high melting point and requires long-term high-temperature heat treatment. However, when conventional multilayer ceramic electronic components are heat-treated at high temperatures for long periods of time, the plating layer can peel off. Even if no defects are apparent, exposure to harsh environments such as high temperatures and high vibrations can cause repeated expansion and contraction due to high-temperature / low-temperature cycles, resulting in sustained mechanical stress. The application of sustained mechanical stress is a major cause of cracks in terminal electrodes and solder. Summary of the Invention [Problem to be solved by the invention]

[0004] One of several objects of the present invention is to provide a multilayer ceramic electronic component with reduced defects.

[0005] One of several objects of the present invention is to provide a multilayer ceramic electronic component having external electrodes with improved strength.

[0006] One of several objects of the present invention is to prevent lifting of a plating layer of a multilayer ceramic electronic component. [Means for solving the problem]

[0007] A multilayer ceramic electronic component according to one embodiment of the present invention includes a ceramic body including dielectric layers and first and second internal electrodes arranged to be alternately stacked with the dielectric layers sandwiched therebetween; a first external electrode connected to the first internal electrode of the ceramic body; and a second external electrode connected to the second internal electrode, wherein the first external electrode includes a first electrode layer arranged in contact with the ceramic body and a first conductive layer arranged on the first electrode layer; the second external electrode includes a second electrode layer arranged in contact with the ceramic body and a second conductive layer arranged on the second electrode layer, and the first conductive layer and the second conductive layer may be porous.

[0008] A multilayer ceramic electronic component according to another embodiment of the present invention includes a ceramic body including dielectric layers and first and second internal electrodes arranged to be alternately stacked with the dielectric layers sandwiched therebetween; a first external electrode connected to the first internal electrode of the ceramic body; and a second external electrode connected to the second internal electrode, wherein the first external electrode includes a first electrode layer arranged in contact with the ceramic body, a first conductive layer arranged on the first electrode layer, and a first metal layer arranged on the first conductive layer; and the second external electrode includes a second electrode layer arranged in contact with the ceramic body, a second conductive layer arranged on the second electrode layer, and a second metal layer arranged on the second conductive layer, and the average roughness of the surfaces of the first metal layer and the second metal layer may be 0.1 μm or more and / or 10 μm or less. [Effects of the Invention]

[0009] One of the advantages of the present invention is that it can reduce the occurrence of defects in multilayer ceramic electronic components.

[0010] One of the advantages of the present invention is that it can improve the strength of the external electrodes of a multilayer ceramic electronic component.

[0011] One of the advantages of the present invention is that it provides a multilayer ceramic electronic component that can prevent plating layer lifting.

[0012] However, the various yet significant advantages and effects of the present invention are not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view schematically showing a multilayer ceramic electronic component according to one embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically illustrating the ceramic body of FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] FIG. 4 is an enlarged view of region A in FIG. [Figure 5] FIG. 5 is an enlarged view of region B in FIG. [Figure 6] 1 is a SEM image of a cross section of an external electrode according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. This is not intended to limit the technology described in this specification to specific embodiments, but should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention. In describing the drawings, similar reference numerals are used for similar components.

[0015] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, thicknesses are enlarged to clearly represent multiple layers and regions, and components that have the same function within the same concept are described using the same reference symbols.

[0016] In this specification, the terms "have," "can have," "include," or "can include" indicate the presence of a given feature (e.g., a value, function, operation, or component such as a part) and do not exclude the presence of additional features.

[0017] As used herein, expressions such as "A and / or B," "at least one of A and / or B," or "one or more of A and / or B" can include all possible combinations of the items listed together. For example, "A and / or B," "at least one of A and B," or "at least one of A or B" can refer to (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0018] In the drawings, the X direction can be defined as the first direction, L direction or length direction, the Y direction can be defined as the second direction, W direction or width direction, and the Z direction can be defined as the third direction, T direction or thickness direction.

[0019] A multilayer ceramic electronic component according to one embodiment of the present invention will be described in detail below with reference to FIGS.

[0020] FIG. 1 is a perspective view schematically showing a multilayer ceramic electronic component 100 according to one embodiment of the present invention, FIG. 2 is a perspective view schematically showing a ceramic body 110 of FIG. 1, FIG. 3 is a cross-sectional view taken along line II' of FIG. 1, FIG. 4 is an enlarged view of region A of FIG. 3, and FIG. 5 is an enlarged view of region B of FIG. 4.

[0021] A multilayer ceramic electronic component 100 according to one embodiment of the present invention may include a ceramic body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged to be alternately stacked with the dielectric layer 111 sandwiched therebetween, a first external electrode 131 connected to the first internal electrode 121, and a second external electrode 132 connected to the second internal electrode 122. The first external electrode 131 may include a first electrode layer 131a arranged in contact with the ceramic body 110 and a first conductive layer 131b arranged on the first electrode layer 131a. The second external electrode 132 may include a second electrode layer 132a arranged in contact with the ceramic body 110 and a second conductive layer 132b arranged on the second electrode layer 132a.

[0022] In this case, the first conductive layer 131b and the second conductive layer 132b may be porous. In this specification, a member being "porous" may mean that the member has a plurality of recesses, pores, and / or voids on its surface. Some of the recesses, pores, and / or voids may be formed only on the surface of the member, and some may penetrate the member. The shape of the recesses, pores, and / or voids is not particularly limited, and may be irregular.

[0023] When the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component 100 of this embodiment are each porous, as described below, the anchoring effect between each layer of the first and second external electrodes 131 and 132 can be utilized to improve the mechanical strength of the first and second external electrodes 131 and 132.

[0024] A multilayer ceramic electronic component 100 according to another embodiment of the present invention may include a ceramic body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately stacked with the dielectric layer 111 sandwiched therebetween, a first external electrode 131 connected to the first internal electrode 121, and a second external electrode 132 connected to the second internal electrode 122. The first external electrode 131 may include a first electrode layer 131a arranged in contact with the ceramic body 110, a first conductive layer 131b arranged on the first electrode layer 131a, and a first metal layer 131c arranged on the first conductive layer 131b. The second external electrode 132 may include a second electrode layer 132a arranged in contact with the ceramic body 110, a second conductive layer 132b arranged on the second electrode layer 132a, and a second metal layer 132c arranged on the second conductive layer 132b.

[0025] In this case, the average surface roughness of the first metal layer 131c and the second metal layer 132c may be 0.1 μm or more and / or 10 μm or less. In this specification, the "average surface roughness" of a surface may refer to the centerline average roughness (Ra) and may be a value measured using an optical surface profiler such as Zygo Corporation's 7300 Optical Surface Profiler or a surface roughness measuring instrument such as Mitutoyo's SV-3200. The average surface roughness may be the arithmetic mean of values ​​measured in the Y-axis direction on an XY cross-section passing through the center of the surface.

[0026] When the first metal layer 131c and the second metal layer 132c of the multilayer ceramic electronic component 100 of this embodiment satisfy the above average surface roughness range, the contact area between each layer of the first and second external electrodes 131, 132 can be increased, as described below, and the anchoring effect can be utilized to improve the mechanical strength of the first and second external electrodes 131, 132.

[0027] The multilayer ceramic electronic component 100 according to the present invention may include a ceramic body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 alternately stacked with the dielectric layer 111 sandwiched therebetween.

[0028] The ceramic body 110 may include first and second surfaces S1 and S2 facing in a first direction (X direction), third and fourth surfaces S3 and S4 facing in a second direction (Y direction), and fifth and sixth surfaces S5 and S6 facing in a third direction (Z direction).

[0029] The specific shape of the ceramic body 110 is not particularly limited, but as shown in the drawing, the ceramic body 110 may be a hexahedron or a similar shape. Furthermore, the ceramic body 110 may have a substantially hexahedron shape, although not a hexahedron with perfectly straight lines, due to shrinkage of the ceramic powder contained in the ceramic body 110 during the firing process. The ceramic body 110 may be rounded to round corners, if necessary. Examples of the rounding process include, but are not limited to, barrel polishing.

[0030] The ceramic body 110 may have dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 alternately stacked. The dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 may be stacked in a third direction (Z direction). When the plurality of dielectric layers 111 are fired, the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to identify without using a scanning electron microscope (SEM).

[0031] According to one embodiment of the present invention, the dielectric layer 111 is made of (Ba 1-x Ca x )(Ti 1-y (Zr, Sn, Hf) y)O3 (where 0≦x≦1, 0≦y≦0.5). The component may be, for example, a chemical compound in which Ca, Zr, Sn, and / or Hf are partially dissolved in BaTiO3. In the composition formula, x may be in the range of 0 to 1, and y may be in the range of 0 to 0.5, but is not limited thereto. For example, when x is 0, y is 0, and z is 0 in the composition formula, the component may be BaTiO3. In addition, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added to the component according to the purpose of the present invention.

[0032] The dielectric layer 111 can be formed by adding additives as needed to a slurry containing the above-mentioned materials, coating the slurry on a carrier film, and drying the coating to form a plurality of ceramic sheets. The ceramic sheets can be formed by forming the slurry into sheets having a thickness of several μm using a doctor blade method, but are not limited thereto.

[0033] The ceramic body 110 may be formed by alternately stacking ceramic green sheets, each having a dielectric layer 111 on which a first internal electrode 121 is printed, and ceramic green sheets, each having a dielectric layer 111 on which a second internal electrode 122 is printed, in a third direction (Z direction). The first and second internal electrodes may be printed by screen printing, gravure printing, or the like, but are not limited thereto.

[0034] The first and second internal electrodes 121 and 122 may be stacked such that their cross sections are exposed at opposite ends of the ceramic body 110. Specifically, the first and second internal electrodes 121 and 122 may be exposed at both surfaces of the ceramic body 110 in a first direction (X direction), and the first internal electrode 121 may be exposed in a direction of a first surface S1 of the ceramic body 110, and the second internal electrode 122 may be exposed in a direction of a second surface S2 of the ceramic body 110.

[0035] The first and second internal electrodes 121 and 122 may include a conductive metal. The conductive metal may include at least one of silver (Ag), nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The first and second internal electrodes 121 and 122 may be formed using a conductive paste containing the conductive metal.

[0036] In the multilayer ceramic electronic component according to the present invention, a first external electrode 131 and a second external electrode 132 may be disposed on outer surfaces of the ceramic body 110. The first external electrode 131 may be disposed on a first surface S1 of the ceramic body 110 of the multilayer ceramic electronic component 100 according to the present invention, and the second external electrode 132 may be disposed on a second surface S2 of the ceramic body 110.

[0037] The first external electrode 131 may include a first electrode layer 131a and a first conductive layer 131b, and the second external electrode 132 may include a second electrode layer 132a and a second conductive layer 132b. The first electrode layer 131a may be connected to the first internal electrode 121, and the second electrode layer 132b may be connected to the second internal electrode 122. In addition, the first conductive layer 131b may be disposed on the first electrode layer 131a, and the second conductive layer 132b may be disposed on the second electrode layer 132a.

[0038] In one embodiment of the present invention, the first and second electrode layers 131a, 132a of the multilayer ceramic electronic component 100 according to the present invention may include a conductive agent and a base resin. That is, the first and second electrode layers 131a, 132a of this embodiment may be resin-based electrodes. The resin-based electrodes have a structure in which a conductive agent is dispersed within a base resin, and because they are manufactured in a lower temperature environment than sintered electrodes, the conductive agent can be present in particulate form within the base resin. Furthermore, when the first and second electrode layers 131a, 132a are resin-based electrodes, they can insulate against physical stress, such as external impact.

[0039] The conductivity imparting agent may include a conductive metal and / or a conductive polymer. The third conductive metal may be, but is not limited to, one or more selected from the group consisting of calcium (Ca), titanium (Ti), molybdenum (Mo), tungsten (W), iron (Fe), cobalt (Co), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), aluminum (Al), tin (Sn), lead (Pb), and alloys thereof.

[0040] Non-limiting examples of the conductive polymer include sulfur (S) and / or nitrogen (N)-containing compounds such as PT (poly(thiophene)), PEDOT (poly(ethylenedioxy)thiophene), PPS (poly(p-phenylene sulfide)), PANI (polyanilines), P3HT (poly(3-hexylthiophene-2,5-diyl)), PolyTPD (poly(4-butylphenyldiphenylamine)), PSS (poly(4-butylphenyldiphenylamine)), PVK (poly(9-vinylcarbazole)), PDBT (poly(4,4'-dimethoxybiphenylphene)), polyaniline, and polypyrrole, and heteroatom-free compounds such as poly(fluorine), polyphenylene, polypyrene, polyazulene, polynaphthalene, PAC (poly(acetylene)), and PPV (poly(p-phenylene vinylene), but are not limited thereto.

[0041] The first and second electrode layers 131a and 132a may contain, if necessary, a carbon filler such as a carbon nanotube, graphene, or fullerene, and / or a conductive filler such as a spherical, ellipsoidal, flake-like, fibrous, or dendritic alloy filler, but are not limited thereto.

[0042] The base resin contained in the first and second electrode layers 131a and 132a may be, for example, a thermosetting resin. Specific examples of the thermosetting resin include, but are not limited to, phenolic resin, urea resin, diallyl phthalate resin, melamine resin, guanamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, melamine-urea co-condensation resin, silicon resin, and polysiloxane resin. When a thermosetting resin is used, a crosslinking agent, a curing agent such as a polymerization initiator, a polymerization accelerator, a solvent, a viscosity modifier, and the like may be further added as needed.

[0043] As one example, the first conductive layer 131b and the second conductive layer 132b disposed on the first electrode layer 131a and the second electrode layer 132a, respectively, of the multilayer ceramic electronic component 100 of the present invention may be plating layers. The first and second conductive layers may contain nickel (Ni) primarily and may include, but are not limited to, one or more selected from the group consisting of copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The plating layers may be formed in a single layer or multiple layers and may be formed by, but are not limited to, sputtering or electroplating.

[0044] As an example, the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component 100 according to the present invention may be porous. As described above, the first conductive layer 131b and the second conductive layer 132b may include a plurality of recesses, pores, and / or voids. By providing the plurality of recesses, pores, and / or voids in the first conductive layer 131b and the second conductive layer 132b, the mechanical strength of the first and second external electrodes 131 and 132 can be improved by utilizing the anchoring effect of the first conductive layer 131b and the second conductive layer 132b.

[0045] As another example, the average surface roughness of the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component 100 according to the present invention may be 0.1 μm or more and / or 10 μm or less. The average surface roughness of the first conductive layer 131b and the second conductive layer 132b may be a value measured by the above-mentioned method. When the average surface roughness of the first conductive layer 131b and the second conductive layer 132b satisfies the above range, the surface area of ​​the first conductive layer 131b and the second conductive layer 132b can be maximized, thereby forming external electrodes with excellent bonding strength.

[0046] As long as the first conductive layer 131b and the second conductive layer 132b of the multilayer ceramic electronic component 100 according to the present invention have the above-described porosity and / or roughness, the method for forming them is not particularly limited. For example, when the first electrode layer 131a and the second electrode layer 132a are resin-based electrodes, unlike plating layers formed on metal surfaces, the plating layer grows mainly around the exposed portions of the conductivity imparting agent that serves as a plating seed. Taking advantage of this, the plating time and plating conditions when forming the first conductive layer 131b and the second conductive layer 132b can be adjusted to form surfaces having the above-described porosity and / or roughness, but the method is not limited to the above.

[0047] In one example of the present invention, the coverage of the first conductive layer with respect to the first electrode layer 131a of the multilayer ceramic electronic component 100 may exceed 80%. Furthermore, the coverage of the second conductive layer 132b with respect to the second electrode layer 132a of the multilayer ceramic electronic component 100 may exceed 80%. In this specification, "coverage" may refer to the proportion of the area covered by a conductive layer disposed on the surface of a metal layer, or the proportion of the area of ​​the conductive layer disposed on the surface of the electrode layer relative to the area of ​​the electrode layer. The coverage may refer to a value calculated using an image analysis program (Image Pro Plus ver. 4.5 by Mediacybernetics) after taking an image of an XY cross-section passing through the center of the multilayer ceramic electronic component using a scanning electron microscope (SEM, Jeol JSM-7400F). The coverage may be greater than 80%, 82% or more, 84% or more, 86% or more, 88% or more, 90% or more, or 93% or more. Furthermore, the upper limit of the coverage may be, for example, less than 100%, since there must be an area where the first and second conductive layers 131b, 132b do not cover the first and second electrode layers 131a, 132a. When the coverage range is satisfied, the bonding between the layers of the external electrodes can be improved.

[0048] In one embodiment of the present invention, the first external electrode 131 of the multilayer ceramic electronic component 100 may include a first metal layer 131c arranged on the first conductive layer 131b, and the second external electrode 132 may include a second metal layer 132c arranged on the second conductive layer 132b.

[0049] In one example of the present invention, the first and second metal layers 131c and 132c disposed on the first and second conductive layers 131b and 132b of the multilayer ceramic electronic component 100 may be plating layers. The first metal layer 131c may be disposed to cover the first conductive layer 131b, and the second metal layer 132c may be disposed to cover the second conductive layer 132b. The first and second metal layers 131c and 132c may contain palladium (Pd) most predominantly and may include at least one selected from the group consisting of copper (Cu), nickel (Ni), tin (Sn), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof, but are not limited thereto.

[0050] As one example, the average surface roughness of the first metal layer 131c and the second metal layer 132c of the multilayer ceramic electronic component 100 according to the present invention may be 0.1 μm or more and / or 10 μm or less. The average surface roughness of the first metal layer 131c and the second metal layer 132c may be a value measured by the above-mentioned method. As described above, the first and second conductive layers 131b, 132b are formed to have a predetermined roughness. When the first and second metal layers 131c and 132c are formed on the first and second conductive layers 131b and 132b by plating, the first and second conductive layers 131b and 132b are entirely conductive due to the plating layers, so the first and second metal layers 131c and 132c are uniformly formed on the first and second conductive layers 131b and 132b, and the surfaces of the first and second conductive layers 131b and 132b, which have a predetermined range of roughness, also have a predetermined roughness. When the average surface roughness of the first and second metal layers 131c and 132c satisfies the above range, the surface area of ​​the first and second metal layers 131c and 132c can be maximized, thereby forming external electrodes with excellent bonding strength.

[0051] In one embodiment of the present invention, the first and second metal layers 131c and 132c of the multilayer ceramic electronic component 100 may be arranged to cover the first and second conductive layers 131b and 132b, respectively. In this specification, "a layer being arranged so as to cover" another layer may refer to a structure in which the inner layer is not exposed to the outside, or a structure in which the inner layer is arranged inside the outer layer, and only the outer layer is visible from the outside. When the first and second metal layers 131c and 132c are arranged to cover the first and second conductive layers 131b and 132b, respectively, the first and second metal layers 131c and 132c may serve to block external contaminants, moisture, and the like by preventing the first and second conductive layers 131b and 132b from being exposed to the outside.

[0052] As one example, at least a portion of the first external electrode 131 of the multilayer ceramic electronic component 100 according to the present invention may be disposed so as to extend on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. Also, at least a portion of the second external electrode 132 may be disposed so as to extend on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110. In this case, the first external electrode 131 and the second external electrode 132 may be disposed spaced apart from each other. When at least a portion of the first external electrode 131 and / or the second external electrode 132 is disposed so as to extend on the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110, respectively, the extended portions may function as so-called band portions, thereby improving the mounting strength of the multilayer ceramic electronic component 100 according to the present invention and preventing moisture penetration.

[0053] <Experimental Example> A Samsung Electro-Mechanics 1005 size (length x width x thickness: 1.0mm x 0.5mm x 0.5mm) mass-produced chip (temperature characteristics X7R and capacitance 220.0nF) with external electrodes formed on the longitudinal surface of the ceramic body was used to conduct an external electrode connection test.

[0054] First and second electrode layers were formed on a ceramic body having first and second internal electrodes alternately arranged therein, the first and second electrode layers being made of a conductive resin containing epoxy and copper.

[0055] Nickel (Ni) was plated on the first and second electrode layers to form first and second conductive layers, respectively, and palladium (Pd) was plated on the first and second conductive layers to form first and second metal layers, thereby manufacturing a prototype multilayer ceramic electronic component.

[0056] Table 1 below shows the bondability of the same prototype multilayer ceramic electronic component when the plating time was adjusted under the same applied current to change the coverage of the plating layer.

[0057] The bondability was measured using adhesive tape with a peel strength of 30 gf / 25 mm, measured at a speed of 300 mm / min and a 90° angle at 25°C, attached to a glass substrate. The adhesive tape was attached to the surface of a multilayer ceramic electronic component, and after 1 minute, it was separated by applying force at a 90° angle. If the plating layer peeled or lifted after the separation, it was evaluated as NG, and if no lift or peeling of the plating layer occurred, it was evaluated as OK.

[0058] [Table 1]

[0059] Referring to Table 1 above, it can be seen that lifting of the palladium (Pd) plating layer occurred even when the coverage of the first and second metal layers was 80%, but no lifting of the plating layer occurred when the coverage was 93%. It can also be seen that defects in the plating layer occurred even when the plating layer was formed over the entire area. Furthermore, in Figure 6, (a) is an SEM image of a cross section of an external electrode plated with Ni for 45 minutes according to one embodiment of the present invention, and (b) is an SEM image of a cross section of an external electrode plated with Ni for 50 minutes according to one embodiment of the present invention. Therefore, it can be seen that a palladium plating layer with excellent adhesion can be achieved when the coverage of the first and second conductive layers with respect to the first and second metal layers is in the range of more than 80% but less than 100%.

[0060] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person skilled in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0061] 100 Multilayer ceramic electronic components 110 Ceramic body 111 Dielectric layer 121, 122 First and second internal electrodes 131, 132 First and second external electrodes

Claims

1. a ceramic body including a dielectric layer and first and second internal electrodes arranged to be alternately stacked with the dielectric layer sandwiched therebetween; a first external electrode connected to the first internal electrode of the ceramic body, and a second external electrode connected to the second internal electrode; the first external electrode includes a first electrode layer disposed in contact with the ceramic body and a first conductive layer disposed on the first electrode layer; the second external electrode includes a second electrode layer disposed in contact with the ceramic body and a second conductive layer disposed on the second electrode layer; the first conductive layer and the second conductive layer are plating layers, the first conductive layer and the second conductive layer are porous and include a plurality of recesses, pores, and / or voids; A multilayer ceramic electronic component, wherein some of the plurality of recesses, pores and / or voids penetrate the first conductive layer and the second conductive layer.

2. 2. The multilayer ceramic electronic component according to claim 1, wherein the coverage of the first conductive layer with respect to the first electrode layer and / or the coverage of the second conductive layer with respect to the second electrode layer exceeds 80%.

3. 2. The multilayer ceramic electronic component according to claim 1, wherein the first conductive layer and the second conductive layer have an average surface roughness (Ra) of 1.0 [mu]m or more.

4. a first metal layer disposed on the first conductive layer; and The multilayer ceramic electronic component according to claim 1 , further comprising a second metal layer disposed on the second conductive layer.

5. 5. The multilayer ceramic electronic component according to claim 4, wherein the average roughness of the surfaces of the first metal layer and the second metal layer is 0.1 [mu]m or more and / or 10 [mu]m or less.

6. 2. The multilayer ceramic electronic component according to claim 1, wherein the first electrode layer and the second electrode layer are resin electrodes containing a conductivity imparting agent and a base resin.

7. 2. The multilayer ceramic electronic component according to claim 1, wherein the first conductive layer and the second conductive layer contain nickel (Ni).

8. 5. The multilayer ceramic electronic component according to claim 4, wherein the first metal layer and the second metal layer are plated layers.

9. 9. The multilayer ceramic electronic component according to claim 8, wherein the first metal layer and the second metal layer contain palladium (Pd).

10. the ceramic body includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction, and a fifth surface and a sixth surface facing each other in a third direction; the first external electrode is disposed on a first surface of the ceramic body; the second external electrode is disposed on a second surface of the ceramic body; At least a portion of the first external electrode is disposed to extend on a third surface, a fourth surface, a fifth surface, and a sixth surface of the ceramic body, 2. The multilayer ceramic electronic component according to claim 1, wherein at least a portion of the second external electrode is disposed to extend on a third surface, a fourth surface, a fifth surface, and a sixth surface of the ceramic body.

11. the first metal layer is disposed over the first conductive layer; The multilayer ceramic electronic component according to claim 4 , wherein the second metal layer is disposed so as to cover the second conductive layer.

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