Vacuum equipment and processing equipment

Abstract

To provide a vacuum device capable of sucking and holding a wrapped processed material.SOLUTION: In a vacuum device 5, an ejector 40 generates suction force by using water as driving fluid. Therefore, even in the case where water is sucked by the ejector 40 via a suction path 10, the suction force of the ejector 40 is not deteriorated. Thus, in a cutting device 1, the ejector 40 of the vacuum device 5 can apply the suction force to a holding surface of a chuck table while sucking the water. Thus, in the case where a wafer is wrapped, a water seal is formed in an outer peripheral part of the wafer, the wafer can be preferably sucked and held by the holding surface while sucking water of the water seal by the ejector 40.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a vacuum device and a processing device. [Background technology]

[0002] As disclosed in Patent Document 1, in a cutting device that cuts a workpiece with a cutting blade, the workpiece is held by suction using a chuck table. For this purpose, the cutting device uses, for example, an ejector that generates suction force by the flow rate of supplied air as a vacuum device (suction source) for the chuck table.

[0003] When an ejector that generates suction by supplying air is used as a vacuum device, if a water seal is formed to suck and hold a warped workpiece on a chuck table, the ejector will suck in the water from the water seal, which reduces the air flow rate of the ejector, weakening the suction force and making it difficult to suck and hold the workpiece on the chuck table. Therefore, a water-sealed vacuum pump is sometimes used as a vacuum device instead of an ejector that uses air. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-078424 Summary of the Invention [Problem to be solved by the invention]

[0005] However, vacuum pumps consume a lot of water. Furthermore, when circulating water, vacuum pumps require a cooling device to cool the water. Furthermore, when using a vacuum pump, a larger installation space is required compared to when using an ejector. Therefore, incorporating a vacuum pump into a cutting machine results in a larger cutting machine.

[0006] Therefore, the object of the present invention is to provide a vacuum device that can suck and hold even warped workpieces, and to prevent the processing device from becoming larger when the vacuum device is built into the processing device. [Means for solving the problem]

[0007] The vacuum device of the present invention (the present vacuum device) comprises an ejector that generates suction force by the flow rate of water fed thereto, a tank that receives water discharged from the ejector, a drain pipe that connects the ejector to the tank, a pump that feeds water from the tank to the ejector, and a water supply pipe that connects the pump to the ejector; The tank comprises a cylindrical outer cylinder with a bottom having a conical cylindrical portion at the top, an inlet portion connected to the drain pipe for putting water into the outer cylinder, and an inner cylinder forming a centrifugal chamber between the outer cylinder and the inner cylinder, and is configured to send water containing machining debris from the inlet portion and swirl it in the centrifugal chamber to centrifuge the machining debris and water, and the pump is configured to send the water that has been centrifuged and flowed into the inner cylinder to the ejector, Water is circulated through the ejector, the drain pipe, the tank, the pump, the water supply pipe, and the ejector in this order to generate suction force. The processing apparatus of the present invention is a processing apparatus equipped with the present vacuum device, and includes a chuck table that holds a workpiece on a holding surface, a processing unit that processes the workpiece held on the holding surface, and the present vacuum device that is connected to the holding surface. [Effects of the Invention]

[0008] In this vacuum device, the ejector generates suction force using water as a driving fluid. Therefore, even if the ejector sucks in water, the suction force of the ejector does not decrease. Therefore, in a processing machine equipped with this vacuum device, the vacuum device can apply suction force to the holding surface of the chuck table that holds the workpiece while sucking water from the holding surface. Therefore, if the workpiece is warped, a water seal can be formed around the outer periphery of the workpiece, and the workpiece can be sucked in and held by the holding surface while the water seal is sucked in. In this way, by using this vacuum device, it is possible to effectively suck and hold a warped workpiece on the holding surface.

[0009] In addition, in this vacuum device, the water used to generate suction in the ejector is circulated through the ejector, drain pipe, tank, pump, water supply pipe, and ejector in that order, which reduces water consumption.

[0010] Furthermore, in this vacuum device, the ejector, drain pipe, tank, pump, and water supply pipe that form the water circulation path can be arranged in the available space within the processing equipment by, for example, adjusting the shape and length of the drain pipe and water supply pipe. Therefore, while this vacuum device can generate the same suction force (suction capacity) as a vacuum pump, when built into the processing equipment, it can prevent the processing equipment from becoming larger than a vacuum pump. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is an explanatory diagram showing the configuration of a cutting device. [Figure 2] FIG. 2 is an explanatory diagram showing the configuration of a vacuum device. [Figure 3] FIG. 2 is a perspective view showing the configuration of an ejector. [Figure 4] FIG. 2 is a cross-sectional view showing a configuration of a part of an ejector. [Figure 5] FIG. 4 is an explanatory diagram showing the flow of water in the tank. [Figure 6] FIG. 4 is an explanatory diagram showing the flow of water in the tank. DETAILED DESCRIPTION OF THE INVENTION

[0012] 1, a cutting device 1, which is a processing device according to this embodiment, cuts a wafer 100 as a workpiece. The cutting device 1 has a chuck table 20 having a holding surface 22, a cutting unit 30 as a processing unit that processes the wafer 100 held on the holding surface 22, and a vacuum device 5 that communicates with the holding surface 22.

[0013] The wafer 100 is, for example, a disk-shaped wafer made of a semiconductor such as silicon.

[0014] The chuck table 20 is fixed to a table base 18. As shown in Fig. 1, the chuck table 20 includes a porous member 21 and a frame 23 that houses the porous member 21 so that the upper surface of the porous member 21 is exposed. The upper surface of the porous member 21 serves as a holding surface 22 that holds the wafer 100 by suction.

[0015] One end of a suction path 10 serving as a vacuum line extending through the table base 18 and the frame 23 is connected to the porous member 21 of the chuck table 20. The other end of the suction path 10 is connected to a vacuum device 5 serving as a suction source.

[0016] The porous member 21 is connected to the vacuum device 5 via the suction path 10, and when the porous member 21 is sucked by the vacuum device 5, a suction force is applied to the holding surface 22, which is the upper surface of the porous member 21, and the holding surface 22 sucks and holds the wafer 100. In this way, the chuck table 20 holds the wafer 100 by the holding surface 22.

[0017] The cutting unit 30 cuts the wafer 100 held on the holding surface 22. As shown in Fig. 1, the cutting unit 30 includes a spindle 31 having a horizontal rotation axis, and a cutting blade 32 that can rotate together with the spindle 31.

[0018] In the cutting device 1, while the spindle 31 is rotating in the direction of the arrow 501, the cutting unit 30 moves in an indexing feed direction (left-right direction in FIG. 1) and an incision feed direction (up-down direction in FIG. 1). Furthermore, the chuck table 20 holding the wafer 100 moves in a processing feed direction (front-back direction in FIG. 1). This allows the cutting blade 32 of the cutting unit 30 to form, for example, a groove (half-cut) over substantially the entire surface of the wafer 100.

[0019] A cutting fluid supply nozzle 35 is provided near the cutting blade 32. The cutting fluid supply nozzle 35 supplies cutting fluid 36 to the wafer 100, the cutting blade 32, etc. when the wafer 100 is cut by the cutting blade 32. The cutting fluid 36 is, for example, water.

[0020] Here, we will explain in detail the vacuum device 5, which is a characteristic component of the cutting device 1. As described above, the vacuum device 5 is connected to the porous member 21 of the chuck table 20, thereby applying suction force to the holding surface 22.

[0021] The vacuum device 5 is built into the housing of the cutting device 1. As shown in Fig. 2, the vacuum device 5 has an ejector 40 that generates suction force using water, a tank 60 that receives water discharged from the ejector 40, and a pump 80 that supplies water from the tank 60 to the ejector 40. The vacuum device 5 further has a drain pipe 110 that connects the ejector 40 and the tank 60, and a water supply pipe 115 that connects the pump 80 and the ejector 40.

[0022] In the vacuum device 5, suction force is generated by circulating water through the ejector 40, drain pipe 110, tank 60, pump 80, water supply pipe 115, and ejector 40 in that order. The vacuum device 5 is equipped with a filter unit 90 in the water supply pipe 115.

[0023] The ejector 40 generates suction force by the flow rate of the supplied water, and has a main body 41 isolated from the outside, as shown in Figures 3 and 4. The ejector 40 generates suction force by causing water, which is a driving fluid, to flow inside the main body 41.

[0024] The main body 41 has a first wall 42 and a second wall 43 that face each other. The above-mentioned suction path 10 is connected to a third wall 44 that is perpendicular to the first wall 42 and the second wall 43. One end of an inlet pipe 50 for allowing water to flow into the main body 41 is inserted into the first wall 42. One end of an outlet pipe 55 for allowing water to flow out of the main body 41 is inserted into the second wall 43.

[0025] The other end of the inlet pipe 50 is connected to the second water supply pipe 117 of the water supply pipe 115 shown in Figure 2. One end of the inlet pipe 50 located inside the main body 41 includes a first portion 51 that functions as a Venturi tube. The diameter of this first portion 51 decreases and then increases from the first wall 42 of the main body 41 toward the center of the main body 41.

[0026] One end of the inlet pipe 50 has a cylindrical portion 53 provided with a plurality of openings 52. The diameter of the cylindrical portion 53 is approximately equal to the maximum diameter of the first portion 51.

[0027] A socket 56 for the outflow pipe 55 is provided at a position opposite the cylindrical portion 53. The socket 56 has a mortar shape with an open bottom. The diameter of the socket 56 is larger than the diameter of the cylindrical portion 53.

[0028] Furthermore, the outflow pipe 55 includes a second portion 57. The second portion 57 is a portion inside the main body 41 whose diameter increases from the center of the main body 41 toward the second wall 43.

[0029] The main body 41 surrounds the multiple openings 52 of the inlet pipe 50 and the socket 56 of the outlet pipe 55 to prevent fluid from entering or exiting from any place other than the suction path 10, the inlet pipe 50, and the outlet pipe 55. In other words, the main body 41 is sealed except for the suction path 10, the inlet pipe 50, and the outlet pipe 55.

[0030] In the ejector 40, water is supplied to the inlet pipe 50 via the second water supply pipe 117. The water supplied to the inlet pipe 50 is accelerated by the Venturi effect and is sprayed into the inside of the main body 41 from a plurality of openings 52 provided in the cylindrical portion 53. The water sprayed into the inside of the main body 41 flows into the outlet pipe 55 from the receiving port 56.

[0031] At this time, the water pressure inside the main body 41 decreases to offset the increased energy due to the acceleration of the water (Bernoulli's principle). Furthermore, friction occurs between the water and the surrounding air (Newton's law of viscosity). This causes air to flow into the main body 41 through the suction path 10 and into the outlet pipe 55 together with the water. In this way, the ejector 40 generates a suction force by creating a negative pressure inside the main body 41. The generated suction force is transmitted to the holding surface 22 of the chuck table 20 shown in FIG. 1 via the suction path 10.

[0032] The other end of the outlet pipe 55 of the ejector 40 is connected to the drain pipe 110 shown in Figure 2. Therefore, the water that flows into the outlet pipe 55 of the ejector 40 is sent to the tank 60 via the drain pipe 110.

[0033] As shown in Figure 2, the tank 60 comprises a bottomed cylindrical outer cylinder 61 having a conical cylindrical portion 62 at the top, an inlet portion 65 connected to a drain pipe 110 for introducing water into the outer cylinder 61, and an inner cylinder 70 which forms a centrifugation chamber 71 between the outer cylinder 61 and the inner cylinder 70. The tank 60 is configured so that water containing machining waste is fed into it from the feed portion 65 and spun in the centrifugal chamber 71, thereby centrifuging the machining waste and water.

[0034] The outer cylinder 61 is a substantially cylindrical member and includes a bottomed cylinder portion 63, a conical cylinder portion 62 provided above the cylinder portion 63, and an outer cylinder top plate 64 that closes the top of the conical cylinder portion 62. An outer cylinder opening 67 into which the water intake portion 83 of the pump 80 is inserted is provided in the center of the outer cylinder top plate 64. The cylinder portion 63 of the outer cylinder 61 is also formed with the aforementioned inlet portion 65 for introducing water into the outer cylinder 61 and a first outlet 68 for discharging machining waste.

[0035] The inner cylinder 70 is a cylindrical member having an outer diameter smaller than the inner diameter of the outer cylinder 61, and is provided inside the outer cylinder 61, at the center of the bottom 66 of the outer cylinder 61. The space between the inner cylinder 70 and the outer cylinder 61 forms a centrifugal chamber 71. The centrifugal chamber 71 is an elongated circumferential flow path formed by the inner wall of the outer cylinder 61 and the outer wall of the inner cylinder 70, and is connected to the inlet section 65 described above.

[0036] Furthermore, the inner cylinder 70 is provided with an inner cylinder top plate 72 that closes the top of the inner cylinder 70. An inner cylinder opening 73 into which the water intake part 83 of the pump 80 is inserted is provided in the center of the inner cylinder top plate 72. The inner cylinder opening 73 has a shape and size such that, when the water intake part 83 of the pump 80 is inserted into the inner cylinder opening 73, a circular opening part 75, which is a circumferential opening (gap), is formed between the water intake part 83 and the inner cylinder opening 73.

[0037] 3 of the cutting device 1, the cutting fluid 36 (see FIG. 1) used in the cutting unit 30 may enter the main body 41 through the porous member 21 and the suction path 10. In this case, the cutting fluid 36 contains machining debris such as cutting chips, and water containing these machining debris flows from the outlet pipe 55 of the ejector 40 through the drain pipe 110 and into the tank 60.

[0038] In this regard, in the tank 60, water sent from the ejector 40 via the drain pipe 110 flows into the centrifugal separation chamber 71 between the outer cylinder 61 and the inner cylinder 70 via the inlet portion 65 (see arrow 201), as shown in Fig. 5. Then, as shown by arrow 202 in Figs. 5 and 6, the water that has flowed into the centrifugal separation chamber 71 flows and swirls along the circumferential shape of the centrifugal separation chamber 71 due to its momentum, forming a cyclone flow within the centrifugal separation chamber 71. As a result, the water is centrifuged, and machining debris is separated and removed from the water.

[0039] The processing debris removed from the water swirls within the centrifuge chamber 71 and is drawn outward by centrifugal force, as shown by the black arrow 205 in FIG. 6 . Furthermore, as shown by the arrow 206, the processing debris falls downward along the inclined wall of the upper conical cylindrical portion 62 of the outer cylinder 61 and accumulates at the bottom 66 of the outer cylinder 61. The accumulated processing debris is discharged from the first discharge port 68 together with the water in the centrifuge chamber 71. Discharge from the first discharge port 68 may be performed periodically, for example, when processing of all the wafers 100 in the cassette is completed. A sensor is provided to detect the amount of water stored in the centrifuge chamber 71, and water is supplied from the water supply source to the ejector 40 until the sensor detects the presence of water in the centrifuge chamber 71.

[0040] On the other hand, the water from which the machining debris has been removed by centrifugation is led to the upper part of the centrifuge chamber 71. Then, as shown by arrow 203 in Fig. 6, this water flows into the interior of the inner cylinder 70 from a circular opening 75 between the inner cylinder opening 73 of the inner cylinder top plate 72 of the inner cylinder 70 and the water intake part 83 of the pump 80. As a result, the water from which the machining debris has been centrifuged and which does not contain the machining debris flows into the interior of the inner cylinder 70.

[0041] Pump 80 is configured to send the water that has been centrifuged and flowed into inner cylinder 70 of tank 60 to ejector 40. Pump 80 is, for example, a vertical multi-stage centrifugal pump manufactured by Grundfos Pumps K.K. As shown in FIGS. 2 and 6 , pump 80 has a motor 81, a cylindrical water intake section 83 having a water intake port 84, and a water delivery port 86 for delivering water to the outside. Water intake section 83 is disposed inside inner cylinder 70 of tank 60, via outer cylinder opening 67 at the top of outer cylinder 61 of tank 60 and inner cylinder opening 73 at the top of inner cylinder 70.

[0042] The water intake section 83 has multiple impellers (vane-shaped members) (not shown) that are rotated by a motor 81, a cylindrical housing 85 that covers the impellers, and a hole-shaped water intake port 84 provided at the lower end of the housing 85. The pump 80 is configured to suck water from the inner tube 70 through the water intake port 84 of the water intake section 83 by using the suction force generated by the motor 81 rotating the impeller of the water intake section 83, as shown by arrow 204 in Figures 2 and 6, and to deliver the sucked water from the water delivery port 86.

[0043] Water fed from the pump 80 is sent to a water feed pipe 115 shown in Fig. 2. As shown in Fig. 2, the water feed pipe 115 has a first water feed pipe 116 and a second water feed pipe 117. One end of the first water feed pipe 116 is connected to the water feed port 86 of the pump 80. The other end of the first water feed pipe 116 is connected to the filter unit 90. Furthermore, one end of the second water feed pipe 117 is connected to the filter unit 90. The other end of the second water feed pipe 117 is connected to the ejector 40.

[0044] The filter unit 90 has a cylindrical case 91 and a cylindrical mesh 94 disposed inside the case 91. The case 91 has a water inlet 92 and a water outlet 93. The water inlet 92 is connected to the other end of the first water supply pipe 116 and is used to introduce water into the case 91. The water outlet 93 is connected to one end of the second water supply pipe 117 and is used to remove water from the case 91.

[0045] In the filter unit 90, water is introduced into the case 91 via the first water supply pipe 116 and the water inlet 92, and passes through the mesh 94 from the outside to the inside. This filters the water, and any machining debris that was not completely removed by the centrifugal separation in the tank 60 is removed from the water. The machining debris removed from the water is discharged from the second discharge port 95 provided at the bottom end of the case 91. Meanwhile, the water from which the machining debris has been removed is discharged to the outside of the filter unit 90 via the water outlet 93, and is introduced into the inlet pipe 50 (see FIG. 3) of the ejector 40 via the second water supply pipe 117.

[0046] The mesh 94 of the filter unit 90 is replaced, for example, periodically. In this embodiment, the first water supply pipe 116 is provided with a pressure gauge 97 for measuring the pressure of the water flowing through the first water supply pipe 116. The measurement value of the pressure gauge 97 increases as the mesh 94 of the filter unit 90 becomes more clogged. Therefore, when the measurement value of the pressure gauge 97 exceeds a predetermined value, it is preferable that an operator replace the mesh 94. Note that a cyclone filter pump manufactured by Nippon Oil Pump Co., Ltd. may be used to reduce the frequency of replacing the mesh 94. The cyclone filter pump can separately discharge dirty fluid containing machining debris from clean fluid not containing machining debris, so the dirty fluid is returned to the centrifugal separation chamber 71 of the tank 60 and the clean fluid is supplied to the ejector 40. Note that by using a cyclone filter pump, the filter unit 90 may be unnecessary.

[0047] As described above, in the vacuum device 5 according to this embodiment, the ejector 40 generates suction force by using water as a driving fluid. Therefore, even if the ejector 40 sucks water through the suction passage 10, the suction force of the ejector 40 does not decrease.

[0048] Therefore, in the cutting device 1, the ejector 40 of the vacuum device 5 can apply suction force to the holding surface 22 of the chuck table 20 that holds the wafer 100 while sucking water from the holding surface 22. Therefore, in the cutting device 1 equipped with the vacuum device 5, when the wafer 100 is warped, a water seal is formed on the outer periphery of the wafer 100, and the wafer 100 can be suction-held by the holding surface 22 while sucking in the water seal. In this way, by using the vacuum device 5, the warped wafer 100 can be satisfactorily sucked and held by the holding surface 22 of the chuck table 20.

[0049] Furthermore, in the vacuum device 5, the water used to generate suction force in the ejector 40 is circulated in the following order: ejector 40, drain pipe 110, tank 60, pump 80, water supply pipe 115, and ejector 40. This reduces water consumption.

[0050] Furthermore, in the vacuum device 5, the ejector 40, drain pipe 110, tank 60, pump 80, and water supply pipe 115, which form the water circulation path, can be arranged in an available space within the cutting device 1, for example, by adjusting the shape and length of the drain pipe 110 and water supply pipe 115. Therefore, while the vacuum device 5 is capable of generating a suction force (suction capacity) equivalent to that of a vacuum pump, when it is built into the cutting device 1, it is possible to prevent the cutting device 1 from becoming larger than a vacuum pump.

[0051] In the vacuum device 5, the tank 60 disposed in the water circulation path has a centrifugal chamber 71 formed between the outer cylinder 61 and the inner cylinder 70. In this centrifugal chamber 71, the water discharged from the ejector 40 is centrifuged to separate and remove machining debris from the water.

[0052] Therefore, in the cutting device 1, chips generated by cutting with the cutting blade 32 of the cutting unit 30 can be effectively removed in the tank 60 of the cutting device 1. Therefore, it is possible to suppress a decrease in the vacuum generation ability and damage of the ejector 40 caused by chips adhering to and accumulating on the ejector 40 over time of use.

[0053] Furthermore, in the vacuum device 5, a centrifugation chamber 71 in which centrifugation is carried out is formed between the outer cylinder 61 and the inner cylinder 70. That is, the centrifugation chamber 71 and the interior of the inner cylinder 70 are separated by the side wall of the inner cylinder 70. This makes it possible to prevent water containing machining debris before centrifugation from entering the interior of the inner cylinder 70 and being sucked into the water intake 84 of the pump 80.

[0054] In this embodiment, the ejector 40 (see FIGS. 3 and 4) of the vacuum device 5 generates suction force by injecting water into the inside of the main body 41 from multiple openings 52 of the inlet pipe 50. This increases the surface area of ​​the flow path through which the water is expected to pass inside the main body 41 compared to an ejector that injects water from a single opening. That is, in the ejector 40, the contact area between the water and the surrounding air increases.

[0055] Therefore, the frictional force generated between the water and the surrounding air can be efficiently increased in the ejector 40. Therefore, the desired suction force can be achieved without increasing the complexity and size of the ejector 40 and without significantly increasing the amount of water required.

[0056] In this embodiment, the cutting device 1 is equipped with the ejector 40 shown in Figures 3 and 4. In this regard, the ejector equipped in the vacuum device 5 is not limited to this ejector 40, and may be any conventionally known ejector that generates suction force by the flow rate of the supplied water.

[0057] Furthermore, the processing apparatus that can be equipped with the vacuum device 5 is not limited to the cutting apparatus 1 shown in FIG. 1. The vacuum device 5 may be equipped, for example, in a grinding apparatus having a grinding unit as a processing unit, which grinds the surface of a workpiece with a grinding wheel attached to the tip of a spindle, and a chuck table that holds the workpiece with a holding surface. In grinding apparatuses, grinding is generally performed while supplying grinding water to the surface of the workpiece. Therefore, the vacuum device 5 can be suitably applied to such grinding apparatuses. [Explanation of symbols]

[0058] 1: cutting device, 5: vacuum device, 10: suction path, 18: table base, 20: chuck table, 21: porous member, 22: Holding surface, 23: Frame body, 30: cutting unit, 31: spindle, 32: cutting blade, 35: cutting fluid supply nozzle, 36: cutting fluid, 40: Ejector, 41: Main body, 42: First wall, 43: Second wall, 44: Third wall, 50: inlet pipe, 51: first portion, 52: opening, 53: cylindrical portion, 55: outlet pipe, 56: Underbite, 57: Second part, 60: Tank, 61: Outer cylinder, 62: Conical cylinder portion, 63: Cylinder portion, 64: Outer cylinder top plate, 65: Inlet part, 66: Bottom part, 67: Outer cylinder opening, 68: First discharge port, 70: inner cylinder, 71: centrifugal chamber, 72: inner cylinder top plate, 73: inner cylinder opening, 75: circular opening, 80: Pump, 81: Motor, 83: water intake section, 84: water intake port, 85: housing, 86: water supply port, 90: filter unit, 91: case, 92: water inlet, 93: water outlet, 94: Mesh, 95: Second outlet, 97: Pressure gauge, 100: Wafer, 110: Drain pipe, 115: Water pipe, 116: 1st water pipe, 117: 2nd water pipe

Claims

1. A vacuum device, an ejector that generates suction force by the flow rate of the water; a tank for receiving water discharged from the ejector; a drain pipe connecting the ejector and the tank; a pump that sends water from the tank to the ejector; a water supply pipe connecting the pump and the ejector; Equipped with The tank is an outer cylinder having a bottom and a conical cylindrical portion at its upper portion; an inlet connected to the drain pipe for introducing water into the outer cylinder; an inner cylinder that forms a centrifugal chamber between the inner cylinder and the outer cylinder, The water containing the processing debris is fed from the feed section and spun in the centrifugal chamber, and the processing debris and the water are centrifuged, the pump is configured to send water that has been centrifuged and flowed into the inner cylinder to the ejector, Water is circulated through the ejector, the drain pipe, the tank, the pump, the water supply pipe, and the ejector in this order to generate suction force. Vacuum device.

2. A processing device equipped with the vacuum device according to claim 1, a chuck table that holds the workpiece on a holding surface; a processing unit that processes a workpiece held on the holding surface; the vacuum device communicating with the holding surface; A processing device comprising:

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