Mounting system and mounting method

The mounting system addresses positional deviation challenges by using an imaging unit to capture both the capture unit tip and reference body, enabling real-time deviation detection and enhancing accuracy and maintenance efficiency.

JP7788617B2Active Publication Date: 2025-12-19PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2022018239
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-02-08
Publication Date
2025-12-19
Estimated Expiration
2042-02-08

AI Technical Summary

Technical Problem

Existing mounting systems face challenges in accurately determining the positional deviation of capture units that move in synchronization with mounting heads, necessitating a method to improve positioning accuracy and detect deviations efficiently.

Method used

A mounting system and method that incorporates a mounting head, imaging unit, reference body, determination unit, and output unit, where the imaging unit captures both the capture unit tip and reference body to determine relative positions, allowing for real-time detection of positional deviations and outputting signals for corrective actions.

Benefits of technology

Enables precise determination of positional deviations of capture units during production, enhancing operational accuracy and reducing the need for separate jigs, thereby improving overall system performance and maintenance efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a mounting system and a mounting method which can determine a positional deviation of a capturing unit while using an imaging unit that moves in synchronization with a mounting head.SOLUTION: In a mounting system 1, an imaging unit 3 moves in synchronization with a mounting head 2 and includes at least a tip of a capturing unit 21 in an imaging region. A reference body 8 is provided as a separate body from the mounting head 2. A determination unit 53 detects a relative position between the tip of the capturing unit 21 and the reference body 8 on the basis of a photographed image obtained by imaging the tip of the capturing unit 21 and the reference body 8 in an imaging region by the imaging unit 3 and determines whether or not the relative position satisfies a prescribed condition. An output unit 54 outputs a signal based on the determination result of the determination unit 53.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present disclosure relates to a mounting system and a mounting method. [Background technology]

[0002] The component mounting device of Patent Document 1 includes a suction head unit, a component recognition camera, a board recognition camera, a nozzle recognition camera, and a correction jig.

[0003] The suction head unit has a suction nozzle for suctioning a component, and moves the suction nozzle up and down in a substantially vertical direction, and rotates the suction nozzle around a vertical axis that is substantially aligned with the nozzle axis.

[0004] The component recognition camera captures an image of the component picked up by the suction nozzle and recognizes the orientation of the component.

[0005] The board recognition camera captures an image of the board on which the components are mounted, and recognizes the layout of the board.

[0006] The nozzle recognition camera captures an image of the tip of the suction nozzle at a height position lower than the height position of the suction nozzle when the component is imaged by the component recognition camera, and recognizes the amount of horizontal deviation of the center position of the tip of the suction nozzle as the suction nozzle descends.

[0007] The correction jig is placed above the nozzle recognition camera and is a transparent jig on the top surface of which a correction reference mark is printed, which serves as a reference for recognizing the amount of misalignment.

[0008] The component mounting device then corrects the amount of horizontal deviation of the tip of the suction nozzle caused by the descent of the suction nozzle, and picks up and places the component.

[0009] In Patent Document 1, the nozzle recognition camera is arranged alongside the component recognition camera, and is arranged on the side of the component supply unit. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-117488 Summary of the Invention [Problem to be solved by the invention]

[0011] Even in a mounting system that includes an imaging unit that moves in synchronization with the mounting head, there is a demand for determining the positional deviation of the capture unit.

[0012] An object of the present disclosure is to provide a mounting system and a mounting method that can determine the positional deviation of a capture unit while using an imaging unit that moves in synchronization with a mounting head. [Means for solving the problem]

[0013] A mounting system according to one aspect of the present disclosure mounts a second object on a first object. The mounting system includes a mounting head, an imaging unit, a reference body, a determination unit, and an output unit. The mounting head is movable and has a capture unit capable of capturing the second object. The imaging unit moves in synchronization with the mounting head and includes at least the tip of the capture unit in an imaging area. The reference body is provided separately from the mounting head. The determination unit detects the relative position between the tip of the capture unit and the reference body based on an image captured by the imaging unit with the tip of the capture unit and the reference body included in the imaging area, and determines whether the relative position satisfies a predetermined condition. The output unit outputs a signal based on the determination result of the determination unit.

[0014] A mounting method according to one aspect of the present disclosure mounts a second object on a first object. The mounting method includes an imaging step, a determination step, and an output step. In the imaging step, an imaging unit having a capture unit capable of capturing the second object and moving in synchronization with a movable mounting head captures an image of an imaging area including the tip of the capture unit and a reference body provided separately from the mounting head. In the determination step, a relative position between the tip of the capture unit and the reference body is detected based on the captured image of the imaging unit, and a determination is made as to whether the relative position satisfies a predetermined condition. In the output step, a signal based on the determination result of the determination step is output. [Effects of the Invention]

[0015] The present disclosure has the advantage of being able to determine the positional deviation of the capture unit while using an imaging unit that moves in synchronization with the mounting head. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a configuration diagram showing a mounting system according to an embodiment. [Figure 2] FIG. 2 is a perspective view showing a main part of the mounting system. [Figure 3] FIG. 3 is a block diagram showing the above-mentioned mounting system. [Figure 4] FIG. 4 is a side view showing the vicinity of the capture unit and the imaging unit of the mounting system. [Figure 5] 5A to 5D are diagrams showing the operation of the mounting system. [Figure 6] 6A and 6B are diagrams showing the determination process of the mounting system. [Figure 7] FIG. 7 is a perspective view illustrating the determination process of the mounting system. [Figure 8] FIG. 8 is another perspective view illustrating the determination process of the mounting system. [Figure 9] FIG. 9 is a flowchart showing an implementation method executed by the implementation system. [Figure 10]FIG. 10 is a side view showing a modified example of the imaging unit of the mounting system. [Figure 11] FIG. 11 is a perspective view showing a modified example of the reference body of the mounting system. DETAILED DESCRIPTION OF THE INVENTION

[0017] The following embodiments generally relate to a mounting system and a mounting method, and more particularly to a mounting system and a mounting method that perform a production operation of mounting a second object on a first object.

[0018] Hereinafter, a mounting system and a mounting method according to an embodiment will be described in detail with reference to FIGS. 1 to 10. However, each of the drawings described in the following embodiments is a schematic diagram, and the ratios of the sizes and thicknesses of the components do not necessarily reflect the actual dimensional ratios. Note that the configurations described in the following embodiments are merely examples of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications are possible depending on the design, etc., as long as the effects of the present disclosure can be achieved.

[0019] In the following description, unless otherwise specified, mutually orthogonal X-axis, Y-axis, and Z-axis are defined in Figures 1 and 2. In this embodiment, the X-axis and Y-axis extend horizontally, and the Z-axis extends vertically.

[0020] (1) Overview of the implemented system An outline of the mounting system 1 according to this embodiment will be described below.

[0021] 1 and 5A to 5D, the mounting system 1 is a mounting apparatus (mounting machine) that mounts a second object T2 on a first object T1. The mounting system 1 is used in operations for manufacturing various products such as electronic devices, automobiles, clothing, food, medicines, and crafts in facilities such as factories, laboratories, offices, and educational facilities.

[0022] In this embodiment, a case will be described in which the mounting system 1 is used in the manufacture of electronic devices in a factory. A typical electronic device has various circuit blocks, such as a power supply circuit and a control circuit. In the manufacture of these circuit blocks, for example, a solder application process, a mounting process, and a soldering process are performed in this order. In the solder application process, cream solder is applied (or printed) to a substrate (including a printed wiring board). In the mounting process, components (including electronic components) are mounted (mounted) on the substrate. In the soldering process, for example, the substrate with the mounted components is heated in a reflow furnace to melt the cream solder and perform soldering. In the mounting process, the mounting system 1 mounts a component T20, which is a second object T2, on a substrate T10, which is a first object T1. That is, in the mounting system 1 according to this embodiment, the first object T1 is the substrate T10, and the second object T2 is the component T20 to be mounted on the substrate T10.

[0023] As such, the mounting system 1 used to mount a second object T2 (component T20) on a first object T1 (substrate T10) includes a mounting head 2, an imaging unit 3, a drive unit 4, a control unit 5, a base 61, a conveying device 62, multiple component supply devices 63, and a fixed camera 7, as shown in FIG.

[0024] The transport device 62 has a pair of conveyor mechanisms 62a extending in the X-axis direction on the base 61, and transports the substrate T10, which is the first object T1, in the X-axis direction and positions it in a predetermined mounting space.

[0025] The multiple component supply devices 63 have tape feeders attached to a feeder base 65 of a carriage 64 connected to the base 61, lined up in the X-axis direction. Each component supply device 63 pitch-feeds a carrier tape 67 supplied from a reel 66, and supplies a component T20, which is a second object T2 held on the carrier tape 67, to a component supply port 63a. The reel 66 is held on the carriage 64. The fixed camera 7 is attached to the base 61 and captures images above.

[0026] The mounting head 2 is movable along the XY plane and further has a capturing unit 21 for capturing the second target T2. The capturing unit 21 is, for example, made up of a suction nozzle capable of performing a stroke operation to move (up and down) in the vertical direction along the Z axis.

[0027] In the mounting process, the mounting system 1 mounts a component T20 (second object T2) on a board T10 (first object T1). High positioning accuracy is required for controlling the position of the capture unit 21 in the mounting process.

[0028] Therefore, the mounting system 1 of this embodiment includes a mounting head 2, an imaging unit 3, a reference body 8, a determination unit 53, and an output unit 54. The mounting head 2 has a capture unit 21 that can capture a component T20. The imaging unit 3 moves in synchronization with the mounting head 2 and includes at least the tip 210 of the capture unit 21 in an imaging region R1 (see FIG. 4 ). The reference body 8 is provided separately from the mounting head 2. The determination unit 53 detects the relative position between the tip 210 of the capture unit 21 and the reference body 8 based on an image captured by the imaging unit 3 with the tip 210 of the capture unit 21 and the reference body 8 included in the imaging region R1, and determines whether the relative position satisfies a predetermined condition. The output unit 54 outputs a signal based on the determination result of the determination unit 53.

[0029] The above-described mounting system 1 can determine the positional deviation of the capture unit 21 by using the imaging unit 3 that moves in synchronization with the mounting head 2.

[0030] (2) Details (2.1) Premise In this embodiment, as an example, a case will be described in which the mounting system 1 is used to mount the component T20 using surface mount technology (SMT). That is, the component T20 is a surface mount device (SMD) and is mounted by being placed on the mounting surface T11 (surface) of the substrate T10. However, this is not limiting, and the mounting system 1 may also be used to mount the component T20 using insertion mount technology (IMT). In this case, the component T20 is an insertion mounting component having lead terminals and is mounted on the mounting surface T11 of the substrate T10 by inserting the lead terminals into holes in the substrate T10.

[0031] Furthermore, the "imaging optical axis" referred to in the present disclosure is the optical axis of the image captured by the imaging unit 3 (image captured by the imaging unit 3), and is the optical axis determined by both the imaging element 31 (see FIG. 3) and the optical system 32 (see FIG. 3) of the imaging unit 3. In other words, the straight line connecting the center of the light receiving surface of the imaging element 31 and the part within the imaging region R1 (see FIG. 4) that is imaged at the center of the light receiving surface of the imaging element 31 through the optical system 32 is the imaging optical axis AX1 (see FIG. 4) of the imaging unit 3.

[0032] In addition, in the present disclosure, the captured image of the imaging unit 3 includes a still image (still image) and a video (moving image). Furthermore, "video" includes a captured image composed of a plurality of still images obtained by stop-motion photography or the like. The captured image of the imaging unit 3 does not have to be the data itself output from the imaging unit 3. For example, the captured image of the imaging unit 3 may be subjected to processing such as data compression, conversion to another data format, cutting out a portion of the captured image of the imaging unit 3, focus adjustment, brightness adjustment, or contrast adjustment as needed. In this embodiment, as an example, the captured image of the imaging unit 3 is a full-color video.

[0033] In the following description, three mutually orthogonal axes, the X-axis, the Y-axis, and the Z-axis, are defined as follows: the axes parallel to the mounting surface T11 of the substrate T10 are defined as the "X-axis" and the "Y-axis," and the axis parallel to the thickness direction of the substrate T10 is defined as the "Z-axis." Furthermore, one of the two directions along the Z-axis is defined as the upward direction, and the other as the downward direction. For example, when the capture unit 21 faces the mounting surface T11 of the substrate T10, the substrate T10 is positioned below the capture unit 21. The X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are merely shown for explanatory purposes and do not represent any physical entities. Furthermore, these directions are not intended to limit the directions in which the mounting system 1 is used.

[0034] Furthermore, pipes for circulating cooling water, cables for supplying power, pipes for supplying air pressure (including positive pressure and vacuum), and the like are connected to the mounting system 1, but in this embodiment, these are not shown in the drawings as appropriate.

[0035] (2.2) Overall structure Next, the main parts of the mounting system 1 according to this embodiment will be described with reference to FIGS. 1 to 4, 5A and 5B.

[0036] The mounting system 1 according to this embodiment includes a mounting head 2, an imaging unit 3, a drive unit 4, a control unit 5, and a reference body 8. As shown in FIG. 3 , the mounting system 1 according to this embodiment further includes a conveying device 62, a component supplying device 63, and a fixed camera 7 in addition to the mounting head 2, the imaging unit 3, the drive unit 4, the control unit 5, and the reference body 8. However, the conveying device 62, the component supplying device 63, and the fixed camera 7 are not essential components of the mounting system 1. In other words, all or some of the conveying device 62, the component supplying device 63, and the fixed camera 7 may not be included as components of the mounting system 1. Furthermore, FIG. 2 illustrates only the mounting head 2, the imaging unit 3, the drive unit 4, and the reference body 8, and appropriately omits the illustration of other components of the mounting system 1. Furthermore, FIG. 4 illustrates the periphery of the mounting head 2, and appropriately omits the illustration of other components of the mounting system 1.

[0037] The mounting head 2 has at least one capturing part 21. In this embodiment, the mounting head 2 has a head unit 23, and one capturing part 21 is attached to the head unit 23. Then, with the capturing part 21 capturing the component T20, the mounting head 2 moves the capturing part 21 closer to the board T10, and mounts the component T20 on the mounting surface T11 of the board T10. In other words, the mounting head 2 holds the capturing part 21 so that it can move toward the board T10.

[0038] The imaging unit 3 is fixed to the head unit 23 of the mounting head 2. The imaging unit 3 has an imaging element 31 and an optical system 32. The imaging unit 3 is, for example, a video camera that captures moving images. The imaging unit 3 has an imaging region R1 that includes at least the tip 210 of the capturing unit 21.

[0039] The above-mentioned capturing unit 21 and imaging unit 3 are attached to a head unit 23 , and the capturing unit 21 and imaging unit 3 move in synchronization with the mounting head 2 .

[0040] The control unit 5 controls each component of the implementation system 1. The control unit 5 preferably includes a computer system. Specifically, the control unit 5 implements some or all of its functions by having a processor, such as a central processing unit (CPU) or a microprocessing unit (MPU), read and execute programs stored in memory. The control unit 5 primarily includes a processor that operates according to a program. The type of processor is not important as long as it can implement its functions by executing a program. The processor may be composed of one or more electronic circuits, including a semiconductor integrated circuit (IC) or a large-scale integration (LSI). While ICs and LSIs are used here, the names may vary depending on the degree of integration, and may also be referred to as system LSIs, very large-scale integrations (VLSIs), or ultra-large-scale integrations (ULSIs). Field-programmable gate arrays (FPGAs), which are programmed after LSI fabrication, or reconfigurable logic devices, which can reconfigure the connections within the LSI or set up circuit partitions within the LSI, can also be used for the same purpose. The electronic circuits may be integrated on a single chip or may be provided on multiple chips, and the multiple chips may be arranged in a concentrated manner or in a distributed manner.

[0041] The control unit 5 is electrically connected to, for example, each of the mounting head 2, the imaging unit 3, the drive unit 4, the transport device 62, the component supply device 63, and the fixed camera 7. The control unit 5 outputs control signals to the mounting head 2 and the drive unit 4, and controls the mounting head 2 and the drive unit 4 so that the component T20 captured by the capture unit 21 is mounted on the mounting surface T11 of the board T10. The control unit 5 also outputs control signals to the imaging unit 3 and the fixed camera 7 to control the imaging unit 3 and the fixed camera 7, and to acquire images captured by the imaging unit 3 and the fixed camera 7 from the imaging unit 3 and the fixed camera 7, respectively.

[0042] The drive unit 4 is a device that moves the mounting head 2. In this embodiment, the drive unit 4 moves the mounting head 2 within the XY plane. The "XY plane" here refers to a plane that includes the X and Y axes and is perpendicular to the Z axis. In other words, the drive unit 4 moves the mounting head 2 in the X and Y axis directions. In this embodiment, the imaging unit 3 is fixed to the mounting head 2, so the drive unit 4 also moves the imaging unit 3 together with the mounting head 2. In other words, in FIG. 1, the drive unit 4 moves the mounting head 2 and the imaging unit 3 between above the board T10 positioned in the mounting space of the transport device 62 and above the component supply port 63a of the component supply device 63.

[0043] 2, the drive unit 4 has an X-axis drive unit 41 and a Y-axis drive unit 42. The X-axis drive unit 41 moves the mounting head 2 linearly in the X-axis direction. The Y-axis drive unit 42 moves the mounting head 2 linearly in the Y-axis direction. The Y-axis drive unit 42 moves the mounting head 2 linearly in the Y-axis direction by moving the mounting head 2 together with the X-axis drive unit 41 along the Y-axis. In the present embodiment, as an example, each of the X-axis drive unit 41 and the Y-axis drive unit 42 includes a linear motor, and moves the mounting head 2 by a driving force generated by the linear motor when power is supplied.

[0044] The component supply device 63 supplies the components T20 to be captured by the capturing unit 21 of the mounting head 2. As an example, the component supply device 63 has a tape feeder that supplies the components T20 housed on a carrier tape. Alternatively, the component supply device 63 may have a tray on which a plurality of components T20 are placed. The mounting head 2 captures the components T20 from such a component supply device 63 with the capturing unit 21.

[0045] The transport device 62 is a device that transports the board T10. The transport device 62 is realized by, for example, a belt conveyor. The transport device 62 transports the board T10, for example, along the X-axis. The transport device 62 transports the board T10 to a mounting space that is at least below the mounting head 2, that is, that faces the capture unit 21 in the Z-axis direction. Then, the transport device 62 stops the board T10 in the mounting space until the mounting head 2 completes mounting of the components T20 on the board T10.

[0046] 5A to 5D show an outline of the production operations performed in the mounting process. First, in FIG. 5A, the capture unit 21, which has not captured the component T20, is positioned above the component supply port 63a. The capture unit 21 then descends in the vertical direction indicated by arrow M1 to perform a capture operation to capture (hold) the component T20 located at the component supply port 63a. Then, as shown in FIG. 5B, the mounting head 2 moves in the horizontal direction indicated by arrow M2 to approach the board T10. That is, the capture unit 21 capturing the component T20 moves toward the board T10. Then, as shown in FIG. 5C, the mounting head 2 stops when the capture unit 21 reaches above the board T10. Then, as shown in FIG. 5D, the capture unit 21 descends in the vertical direction indicated by arrow M3 to perform a mounting operation to mount the component T20 on the mounting surface T11 of the board T10. In FIG. 5B, the capturing part 21 may start to descend while the mounting head 2 is moving in the horizontal direction.

[0047] In addition to the above configuration, the mounting system 1 may also include a backup device, a lighting device, a communication unit, and the like.

[0048] The backup device backs up the board T10 that has been transported to the mounting space by the transport device 62. That is, the board T10 that has been transported to the mounting space by the transport device 62 is held in the mounting space by the backup device.

[0049] The lighting device illuminates the imaging region R1 of the imaging unit 3. The lighting device only needs to be turned on at least at the timing when the imaging unit 3 captures an image, and for example, emits light in synchronization with the imaging timing of the imaging unit 3. In this embodiment, the captured image of the imaging unit 3 is a full-color video, so the lighting device outputs light in the wavelength range of the visible light region, such as white light. In this embodiment, as an example, the lighting device has multiple light sources such as LEDs (Light Emitting Diodes). The lighting device illuminates the imaging region R1 of the imaging unit 3 by emitting light from these multiple light sources. The lighting device is realized by an appropriate lighting method, such as ring lighting or coaxial epi-illumination. For example, the lighting device is fixed to the mounting head 2 together with the imaging unit 3.

[0050] The communication unit is configured to communicate with a higher-level system directly or indirectly via a network or a relay, etc. This allows the mounting system 1 to exchange data with the higher-level system.

[0051] (2.3) Mounting head The configuration of the mounting head 2 will be described in more detail with reference to FIGS.

[0052] In this embodiment, in addition to the capturing unit 21, the mounting head 2 further includes an actuator 22 (see FIG. 3) for moving the capturing unit 21, and a head unit 23 for holding the capturing unit 21 and the actuator 22. In the mounting system 1 according to this embodiment, one capturing unit 21 and one actuator 22 are attached to one head unit 23. This allows the mounting head 2 to capture one component T20.

[0053] The capturing unit 21 is, for example, a suction nozzle. The capturing unit 21 is controlled by the control unit 5 and is switchable between a capturing state in which it captures (holds) the component T20 and a release state in which it releases (releases the capture) the component T20. However, the capturing unit 21 is not limited to a suction nozzle, and may be configured to capture (hold) the component T20 by pinching (picking) it like a robot hand, for example.

[0054] The mounting head 2 operates by receiving air pressure (vacuum) as power when the capturing unit 21 captures the component T20. That is, the mounting head 2 switches the capturing unit 21 between a captured state and a released state by opening and closing a valve on the air pressure (vacuum) supply path connected to the capturing unit 21.

[0055] The actuator 22 moves the capturing unit 21 linearly in the Z-axis direction. Furthermore, the actuator 22 rotates the capturing unit 21 in a rotational direction (hereinafter referred to as the "θ direction") around an axis along the Z-axis direction. In this embodiment, as an example, the actuator 22 drives the movement of the capturing unit 21 in the Z-axis direction by a driving force generated by a linear motor. The actuator 22 drives the movement of the capturing unit 21 in the θ direction by a driving force generated by a rotary motor. Meanwhile, as described above, the mounting head 2 moves linearly in the X-axis direction and the Y-axis direction by the driving unit 4. As a result, the capturing unit 21 included in the mounting head 2 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the driving unit 4 and the actuator 22.

[0056] As an example, the head unit 23 is made of metal and formed in a rectangular parallelepiped shape. The capturing portion 21 and the actuator 22 are assembled to the head unit 23, whereby the head unit 23 holds the capturing portion 21 and the actuator 22. In this embodiment, the capturing portion 21 is indirectly held by the head unit 23 via the actuator 22 in a state in which it can move in the Z-axis direction and the θ direction. The mounting head 2 moves within the XY plane as the head unit 23 is moved within the XY plane by the drive unit 4.

[0057] According to the above-described configuration, the mounting head 2 can move the capturing unit 21 that has not captured the component T20 so as to approach the component supply port 63a, and can perform a capturing operation to capture (hold) the component T20 in the component supply device 63. Furthermore, the mounting head 2, in the mounting system 1, can perform a mounting operation to mount the component T20 on the mounting surface T11 of the board T10, by moving the capturing unit 21 so as to approach the board T10 while the capturing unit 21 has captured the component T20.

[0058] (2.4) Imaging unit The configuration of the imaging unit 3 will be described in more detail with reference to FIGS.

[0059] In this embodiment, the imaging unit 3 is composed of one moving camera 3a that moves together with the mounting head 2 as shown in Fig. 4, and has an imaging element 31 and an optical system 32 as shown in Fig. 3. The optical system 32 forms an image of the imaging region R1 on the imaging element 31.

[0060] The imaging element 31 is an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor), etc. The imaging element 31 converts an image formed on a light receiving surface into an electrical signal and outputs the signal.

[0061] The optical system 32 includes one or more lenses, mirrors, etc. In the present embodiment, as an example, the optical system 32 is realized by a combination of a plurality of lenses (a lens group). The optical system 32 forms an image of light from the imaging region R1 on the light receiving surface of the imaging element 31. Note that the optical system 32 is not limited to the above configuration.

[0062] The position of the imaging unit 3 relative to the capturing unit 21 is determined so that at least the tip (bottom) 210 (see FIG. 4) of the capturing unit 21 is included in the imaging region R1. Therefore, at least the tip 210 of the capturing unit 21 is captured in the image captured by the imaging unit 3.

[0063] 1, the imaging unit 3 is disposed below the head unit 23 and to the side of the capturing unit 21 in a plan view seen from the Z-axis direction. In this way, the imaging unit 3 is attached to the head unit 23 together with the capturing unit 21, and the capturing unit 21 and the imaging unit 3 move simultaneously. Therefore, the mounting system 1 can reduce the time required for mounting and improve productivity compared to a configuration in which the capturing unit 21 and the imaging unit 3 move separately.

[0064] Furthermore, the imaging unit 3 has an imaging optical axis AX1 that intersects with the Z axis (vertical direction). In other words, the imaging optical axis AX1 extends obliquely with respect to the vertical direction. That is, the imaging unit 3 is fixed to the head unit 23 so that the imaging direction of the imaging unit 3 intersects with the vertical direction, and images the capturing unit 21 from diagonally above. Therefore, the imaging unit 3 can capture images of the behavior of the capturing unit 21 in the horizontal direction and the behavior of the capturing unit 21 in the vertical direction. The horizontal direction is the direction along the XY plane, and the vertical direction is the direction perpendicular to the horizontal direction (the direction along the Z axis).

[0065] (2.5) Fixed Camera A more detailed configuration of the fixed camera 7 will be described with reference to FIG.

[0066] The fixed camera 7 captures an image from below of the mounting head 2 moving between above the board T10 positioned in the mounting space and above the component supply port 63a of the component supply device 63. Therefore, the image captured by the fixed camera 7 shows the component T20 captured by the capture unit 21. In other words, the image captured by the fixed camera 7 includes information on the relative positional relationship between the capture unit 21 and the component T20, in other words, information on the deviation of the component T20 from the capture unit 21.

[0067] It is preferable that the fixed camera 7 captures an image from below of the mounting head 2 moving from the component supply port 63a to the board T10. In this case, the fixed camera 7 does not capture images all the time, but captures images when the capture unit 21 capturing the component T20 passes above the fixed camera 7.

[0068] The fixed camera 7 may also be installed below the component supply port 63a.

[0069] Moreover, it is preferable that the mounting system 1 further includes an illumination device that illuminates the imaging area of ​​the fixed camera 7.

[0070] (2.6) Reference body The reference body 8 is disposed on the top surface of the base 61 between the fixed camera 7 and the transport device 62. That is, the reference body 8 is provided separately from the mounting head 2, between the fixed camera 7 and the transport device 62. As an example, the reference body 8 is a cylindrical rod extending upward from the top surface of the base 61. The tip surface 81 (upper end surface) of the reference body 8 is circular. Here, the base 61 corresponds to the member on which the reference body 8 is provided.

[0071] The reference body 8 functions as a reference point (or marker) for determining the positional deviation of the tip 210 of the capturing part 21 when the determining part 53 performs the determination process described below.

[0072] (2.7) Control Unit The control unit 5 includes a head control unit 51, an image acquisition unit 52, a determination unit 53, and an output unit .

[0073] (2.7.1) Head control section The head control unit 51 controls the mounting head 2 and the drive unit 4 by outputting control signals to the mounting head 2 and the drive unit 4 .

[0074] Specifically, the head control unit 51 outputs a horizontal control signal to the drive unit 4 and controls the drive unit 4 to move the mounting head 2 and the imaging unit 3 within the XY plane. The head control unit 51 also outputs a vertical control signal to the actuator 22 and controls the actuator 22 to move the capturing unit 21 along the Z axis. The head control unit 51 also outputs a rotation control signal to the actuator 22 and controls the actuator 22 to rotate the capturing unit 21 in the θ direction.

[0075] In particular, in the capturing operation for capturing the component T20 and the mounting operation for mounting the component T20, the head control unit 51 feedback-controls the drive unit 4 and the actuator 22 based on the captured image by the imaging unit 3. The head control unit 51 corrects the capturing position and the mounting position by feedback-controlling the drive unit 4 and the actuator 22 based on the captured image by the imaging unit 3. As a result, the mounting system 1 can improve the capturing accuracy in the capturing operation and the mounting accuracy in the mounting operation.

[0076] (2.7.2) Image acquisition unit The image acquisition unit 52 has a function of a communication interface that acquires (receives) captured image data from the imaging unit 3.

[0077] The communication between the imaging unit 3 and the image acquisition unit 52 may be either wireless or wired. The wireless communication is wireless communication that complies with standards such as Wi-Fi (registered trademark) or low-power wireless (specified low-power wireless) that does not require a license. The wired communication is wired communication via, for example, a twisted pair cable, a dedicated communication line, or a LAN (Local Area Network) cable.

[0078] (2.7.3) Judgment part The determination unit 53 determines the positional deviation of the capture unit 21 based on the image captured by the imaging unit 3.

[0079] Specifically, the determination unit 53 detects the relative position between the tip 210 of the capture unit 21 and the reference body 8 based on an image captured by the imaging unit 3, the image capturing area R1 including the tip 210 of the capture unit 21 and the reference body 8, and determines whether the relative position satisfies a predetermined condition. In this embodiment, the relative position is the positional deviation of the tip 210 of the capture unit 21 relative to the position of the reference body 8. The determination unit 53 then determines whether the positional deviation of the tip 210 is within an allowable range. In this case, the predetermined condition used by the determination unit 53 is "the positional deviation is within an allowable range." The mounting system 1 equipped with such a determination unit 53 can accurately determine the positional deviation of the capture unit 21.

[0080] The determination process of the determination unit 53 will be described below with reference to Figures 6A, 6B, 7, and 8. Note that this determination process may be executed when the mounting system 1 is performing a production operation, or may be executed when the mounting system 1 is performing a diagnostic operation for maintenance.

[0081] 6A shows the capture unit 21 in an open state, where it has not captured a component T20. The head control unit 51 then executes a predetermined algorithm to control the drive unit 4 and move the mounting head 2 to a target position on the XY plane. The target position is predetermined in correspondence with the position of the reference body 8. For example, if the drive unit 4 is equipped with an encoder for detecting the position of the mounting head 2, the target position is represented by the count value of the encoder.

[0082] FIG. 6B shows the mounting head 2 moved to the target position. At this time, the capture unit 21 is positioned above the reference body 8, and the imaging region R1 of the imaging unit 3 includes the tip 210 of the capture unit 21 and the reference body 8. Then, the determination unit 53 detects the relative position after the mounting head 2 moves to the target position. Because the imaging unit 3 captures an image of the capture unit 21 from diagonally above, the determination unit 53 can detect the positional deviation on the XY plane between the tip 210 of the capture unit 21 and the reference body 8 based on the image captured by the imaging unit 3. In this case, the relative position is the positional deviation on the XY plane between the tip 210 of the capture unit 21 and the reference body 8. In other words, the relative position is the positional deviation between the tip 210 and the reference body 8 in a planar view seen from the Z-axis direction.

[0083] Specifically, when the capturing unit 21 (see FIG. 6B) located above the reference body 8 is operating normally and without malfunction, the positional deviation of the tip 210 of the capturing unit 21 falls within the allowable range G1, as shown in FIG. 7. The allowable range G1 is the interior of a circle centered on the center P1 of the tip surface 81 on the XY plane and having a radius L1. That is, the positional deviation amount W1 of the tip 210 relative to the center P1 of the tip surface 81 is equal to or less than the threshold value L1. The positional deviation amount W1 is the distance between the center P1 of the tip surface 81 and the tip 210 of the capturing unit 21 in a plan view (XY plane) seen from the Z-axis direction. The threshold value L1 is the radius of the circular allowable range G1 and is the upper limit allowable for the positional deviation amount W1.

[0084] When the capturing part 21 (see FIG. 6B) located above the reference body 8 is malfunctioning, the positional deviation of the tip 210 does not fall within the allowable range G1, as shown in FIG. 8. In other words, the positional deviation amount W1 of the tip 210 relative to the center P1 of the tip surface 81 is greater than the threshold value L1.

[0085] Note that "malfunction" does not only refer to an abnormality but also includes a state where something is not working properly. Specifically, malfunction is a state in which the precision of the position control of the capture unit 21 is reduced, and includes distortion of the shaft of the drive unit 4 due to heat generated by the linear motor or the like provided in the drive unit 4. Malfunction also includes a state in which the precision of the position control of the capture unit 21 is reduced due to deterioration over time, such as wear and distortion of the mechanical structure. Malfunction also includes foreign matter getting caught in the drive unit 4, a lack of lubricant, etc. Malfunction also includes loose bolts.

[0086] Moreover, "normal" refers to a state in which the accuracy of the position control of the capture unit 21 can be maintained at a predetermined accuracy or higher.

[0087] (2.7.4) Output section The output unit 54 outputs a signal based on the determination result of the determination unit 53 .

[0088] Specifically, if the determination result of the determination unit 53 is that "the positional deviation is not within the allowable range G1," the output unit 54 outputs a notification signal notifying that the behavior of the capturing unit 21 is malfunctioning. The notification signal includes information such as a warning, a comparison result between the positional deviation amount W1 and the threshold value L1, and the cause of the malfunction.

[0089] Specifically, the output unit 54 outputs a notification signal to an information terminal used by the manager, such as an equipment monitor, a personal computer, a tablet terminal, or a smartphone. In this case, the notification signal is a signal that includes image information and may also include audio information. This notification signal is a signal that prompts the manager to perform maintenance on the mounting system 1. The manager views the image information displayed on the information terminal, understands the malfunction, and performs maintenance on the mounting system 1. In other words, the manager can take appropriate action to return the behavior of the capture unit 21 to normal behavior.

[0090] The output unit 54 may also output a notification signal to the management system. In this case, the management system updates a maintenance scheduler for performing maintenance on the mounting system 1 based on the notification signal. That is, the management system can take appropriate measures to return the behavior of the capture unit 21 to normal behavior.

[0091] If the determination result of the determination unit 53 is that the positional deviation falls within the allowable range G1, the output unit 54 may output a notification signal notifying that the behavior of the capturing unit 21 is normal. The notification signal includes information indicating that the behavior is normal, information on the comparison result between the positional deviation amount W1 and the threshold value L1, and the like.

[0092] (3) Advantages As described above, the mounting system 1 determines the positional deviation of the capture unit 21 based on the captured image of the capture unit 21, which moves together with (in synchronization with) the mounting head 2. That is, the mounting system 1 can determine the positional deviation of the capture unit 21 during production operations or diagnostic operations, using the imaging unit 3, which moves in synchronization with the mounting head 2. Furthermore, because the reference body 8 provided in the mounting system 1 is used, there is no need to separately prepare a jig for determining the positional deviation.

[0093] Furthermore, by notifying the result of the determination of the positional deviation of the capture unit 21, the mounting system 1 can notify the administrator or management system that the behavior of the capture unit 21 has deviated from normal behavior (desired behavior). "Malfunction" includes not only an abnormality but also a state of being in poor condition. Furthermore, "normal behavior" is behavior that can maintain the positioning accuracy of the position control of the capture unit 21 at a predetermined accuracy or higher. When the administrator or management system is notified that the behavior is malfunctioning, it can take measures to return the behavior of the capture unit 21 to normal behavior. As a result, the mounting system 1 can prevent the behavior of the capture unit 21 from deviating from normal behavior and further improve the accuracy of operation.

[0094] Furthermore, conventionally, mounting system maintenance was performed periodically at set intervals. However, conventional maintenance methods could not reduce the frequency of maintenance, and could not reduce the burden on operators such as managers or workers. Conventional maintenance methods set the maintenance interval shorter than the period during which the mounting system's performance can be maintained, so that maintenance can be performed before the performance degradation of the mounting system becomes unacceptable. Therefore, if the timing of maintenance is changed arbitrarily by the operator, there is a possibility that the performance of the mounting system cannot be maintained.

[0095] Meanwhile, the mounting system 1 can detect signs of malfunction based on the positional deviation of the capture unit 21 and instruct the implementation of maintenance at the timing required for the mounting system 1. As a result, maintenance can be performed at the appropriate timing, which reduces the frequency of maintenance while maintaining the performance of the mounting system 1 and reduces the workload of the operator. It is also possible to prevent excessive degradation of the performance of the mounting system 1 due to delayed maintenance.

[0096] (4) Implementation method The mounting method executed by the mounting system 1 described above can be summarized as shown in the flowchart of FIG.

[0097] The mounting method mounts a component T20 on a board T10. The mounting method includes an imaging step S1, a determination step S2, and an output step S3. In the imaging step S1, an imaging unit 3, which has a capture unit 21 capable of capturing the component T20 and moves in synchronization with a movable mounting head 2, captures an image of an imaging region R1 including a tip 210 of the capture unit 21 and a reference body 8 provided separately from the mounting head 2. In the determination step S2, a determination unit 53 detects the relative position between the tip 210 of the capture unit 21 and the reference body 8 based on the image captured by the imaging unit 3, and determines whether the relative position satisfies a predetermined condition. In the output step S3, an output unit 54 outputs a signal based on the determination result of the determination unit 53.

[0098] The mounting method described above can determine the positional deviation of the capture unit 21 while using the imaging unit 3 that moves in synchronization with the mounting head 2.

[0099] Furthermore, the implementation method can prevent the behavior of the capture unit 21 from deviating from normal behavior by notifying that the behavior is abnormal, thereby further improving the accuracy of the operation.

[0100] Furthermore, the mounting method can reduce the frequency of maintenance while maintaining the performance of the mounting system 1, thereby reducing the workload of the operator. It can also prevent the performance of the mounting system 1 from deteriorating too much due to delayed maintenance.

[0101] (5) First Modification FIG. 10 shows a modified example of the imaging unit 3. In FIG.

[0102] The imaging unit 3 in Figure 10 includes two mobile cameras 3b and 3c. The mobile cameras 3b and 3c are arranged side by side along the Y-axis direction, forming a so-called stereo camera. Therefore, the imaging unit 3 can capture images of the behavior of the capturing unit 21 in both the horizontal and vertical directions.

[0103] (6) Second Modification The mounting system 1 may comprise a number of datums 8 .

[0104] The shape of the reference body 8 is not limited to a rod, and may be other shapes such as a sphere or a disk. The reference body 8 may also be a mark printed or painted on a member such as the base 61. The mark may be, for example, a dot shape, a specific symbol, or a specific graphic.

[0105] 11 shows a reference body 8A, which is a modified example of the reference body. In FIG. 11, a rectangular plate-shaped bar member 68 extending horizontally is installed on the upper surface (top surface) of a base 61. The reference body 8A is a circular mark provided on the upper surface of the rectangular plate-shaped bar member 68. The reference body 8A may be either a paint printed or applied to the base 61, or a concave or convex portion formed on the base 61.

[0106] The reference body 8 may also serve as a thermal correction pole. The thermal correction pole is a rod for correcting positional deviation of the capture unit 21 caused by distortion of the shaft axis of the drive unit 4 due to heat generated by a linear motor or the like provided in the drive unit 4. In this case, the head control unit 51 of the control unit 5 corrects the position control of the mounting head 2 based on the positional deviation amount W1 of the capture unit 21, thereby preventing a decrease in the positioning accuracy of the capture unit 21.

[0107] (7) Third Modification The imaging unit 3 does not have to be fixed to the head unit 23 of the mounting head 2, and may be fixed to an imaging moving body that moves in synchronization (linked) with the mounting head 2. In other words, the imaging moving body moves in the same direction, over the same distance, and at the same speed as the mounting head 2.

[0108] The tolerance range G1 may have a shape other than a circle. For example, the tolerance range G1 may have an oval shape or a rectangle shape that is long in the X-axis or Y-axis direction.

[0109] Furthermore, the relative positions of the capture unit 21 and the first object T1 such as the substrate T10 are not limited to a configuration in which they face each other in the vertical direction along the Z axis. That is, the relative positions of the capture unit 21 and the first object T1 may be other configurations, such as a configuration in which they face each other in the horizontal direction.

[0110] The configurations described in the above-described embodiment and each modified example can be applied in appropriate combination.

[0111] (8) Summary A mounting system (1) according to a first aspect of the embodiment mounts a second object (T2) on a first object (T1). The mounting system (1) includes a mounting head (2), an imaging unit (3), a reference body (8, 8A), a determination unit (53), and an output unit (54). The mounting head (2) is movable and has a capture unit (21) capable of capturing the second object (T2). The imaging unit (3) moves in synchronization with the mounting head (2), and includes at least the tip (210) of the capture unit (21) in an imaging region (R1). The reference body (8, 8A) is provided separately from the mounting head (2). The determination unit (53) detects the relative position between the tip (210) of the capture unit (21) and the reference body (8, 8A) based on an image captured by the imaging unit (3) with the tip (210) of the capture unit (21) and the reference body (8, 8A) included in the imaging region (R1), and determines whether the relative position satisfies a predetermined condition. The output unit (54) outputs a signal based on the determination result of the determination unit (53).

[0112] The above-described mounting system (1) can determine the positional deviation of the capture unit (21) using the imaging unit (3) that moves in synchronization with the mounting head (2).

[0113] In the mounting system (1) of the second aspect of the embodiment, in the first aspect, the relative position is the positional deviation of the tip (210) of the capture section (21) relative to the position of the reference body (8, 8A), and it is preferable that the determination section (53) determines whether the positional deviation is within the allowable range (G1).

[0114] The above-described mounting system (1) can accurately determine the positional deviation of the capture part (21).

[0115] Preferably, the mounting system (1) of the third aspect according to the embodiment is the first or second aspect, further including a member (61, 68) on which a reference body (8, 8A) is provided.

[0116] The mounting system (1) described above can realize the reference bodies (8, 8A) used in the determination process of the determination unit (53).

[0117] The mounting system (1) of a fourth aspect according to the present embodiment is preferably any one of the first to third aspects, further including a drive unit (4) that drives and moves the mounting head (2). The determination unit (53) detects the relative position when the mounting head (2) moves to a target position corresponding to the position of the reference body (8, 8A).

[0118] The mounting system (1) described above can accurately detect the relative position between the tip (210) of the capture part (21) and the reference body (8, 8A).

[0119] The mounting system (1) of a fifth aspect according to the present embodiment is preferably any one of the first to fourth aspects, further including a head unit (23) to which a capture unit (21) and an imaging unit (3) are attached. An imaging optical axis (AX1) of the imaging unit (3) extends obliquely with respect to the vertical direction.

[0120] The above-described mounting system (1) can detect the position of the tip (210) of the capture part (21) with high accuracy.

[0121] A mounting method according to a sixth aspect of the present embodiment mounts a second object (T2) on a first object (T1). The mounting method includes an imaging step (S1), a determination step (S2), and an output step (S3). In the imaging step (S1), an imaging unit (3) that moves in synchronization with a movable mounting head (2) having a capture unit (21) capable of capturing the second object (T2) captures an image of an imaging region (R1) that includes a tip (210) of the capture unit (21) and a reference body (8, 8A) that is provided separately from the mounting head (2). In the determination step (S2), the relative position between the tip (210) of the capture unit (21) and the reference body (8, 8A) is detected based on the captured image of the imaging unit (3), and it is determined whether the relative position satisfies a predetermined condition. In the output step (S3), a signal is output based on the determination result of the determination step (S2).

[0122] The above mounting method can determine the positional deviation of the capture unit (21) using the imaging unit (3) that moves in synchronization with the mounting head (2). [Explanation of symbols]

[0123] 1. Mounting system 2 Mounting head 21 Capture unit 210 Tip 23 Head Unit 3. Imaging unit 4 Drive unit 53 Judgment section 54 Output section 61 Base (component) 68 Bar member (member) 8, 8A reference body T1 First Object T2 Second object R1 imaging area W1 Amount of misalignment L1 threshold AX1 Imaging optical axis S1 Imaging step S2 Judgment step S3 Output Step

Claims

1. A mounting system for mounting a second object on a first object, a movable mounting head having a capturing portion capable of capturing the second object; an imaging unit that moves in synchronization with the mounting head and that has an imaging area including at least the tip of the capture unit; a reference body provided separately from the mounting head; a determination unit that detects a relative position between the tip of the capture unit and the reference body based on an image captured by the imaging unit with the tip of the capture unit and the reference body included in the imaging area, and determines whether the relative position satisfies a predetermined condition; and an output unit that outputs a signal based on the determination result of the determination unit; Implementation system.

2. the relative position is a positional deviation of the tip of the capture unit relative to the position of the reference body, The determining unit determines whether the positional deviation falls within an allowable range. The mounting system of claim 1 .

3. The reference body is provided on a member. The mounting system according to claim 1 or 2.

4. a drive unit that drives the mounting head to move the mounting head, The determination unit detects the relative position when the mounting head moves to a target position corresponding to the position of the reference body.

4. The mounting system according to claim 1.

5. The imaging device further includes a head unit to which the capture unit and the imaging unit are attached, The imaging optical axis of the imaging unit extends obliquely with respect to the vertical direction.

5. The mounting system according to claim 1.

6. A mounting method for mounting a second object on a first object, comprising: an imaging step in which an imaging unit having a capture unit capable of capturing the second object and moving in synchronization with a movable mounting head captures an image of an imaging area including a tip of the capture unit and a reference body provided separately from the mounting head; a determination step of detecting a relative position between the tip of the capture unit and the reference body based on an image captured by the imaging unit, and determining whether the relative position satisfies a predetermined condition; an output step of outputting a signal based on the determination result of the determination step. How to implement it.

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