Abnormality determination device and abnormality determination method

Abstract

To provide an abnormality determination device and the like capable of easily and accurately determining abnormalities in component supply equipment for component mounting.SOLUTION: An abnormality determination device 110 is an abnormality determination device 110 capable of determining an abnormality of a feeder 7 that sequentially supplies multiple components P to a component mounting device M3 by sending multiple pockets 14a in which multiple components P are individually stored. The abnormality determination device includes: an acquisition unit 111 that acquires position information regarding a supply position of the relevant components P for each of the multiple components P sequentially supplied by the feeder 7 for component mounting with component mounting device M3; an estimating unit 112 that estimates a stop position of one pocket 14a in which one component P out of the multiple components P is stored by performing predetermined statistical processing on the basis of, the acquired multiple position information; and a determination unit 113 that determines the abnormality of the feeder 7 on the basis of the estimated stop position.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to an abnormality determination device that determines an abnormality in a component supply device. [Background technology]

[0002] Patent Document 1 discloses a maintenance method in which feeders of mounting machines in multiple factories are monitored, and the use of a feeder in a mounting machine whose number of component feeds or number of feed errors exceeds a set number is prohibited, and the prohibited feeder is repaired or inspected.

[0003] Patent Document 2 discloses an equipment diagnostic system that can more appropriately diagnose malfunctions in manufacturing equipment. The equipment diagnostic system diagnoses malfunctions in manufacturing equipment by using a diagnostic model based on operation information of the manufacturing equipment and estimating malfunction levels of units that make up each of a plurality of pieces of manufacturing equipment from the operation information. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-140162 [Patent Document 2] Japanese Patent Publication No. 2020-27329 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in Patent Document 1, even if the number of component supplies or supply errors exceeds a set number, the mounting machine does not malfunction, and maintenance such as repair or inspection of the mounting machine may not necessarily be required.

[0006] Furthermore, in Patent Document 2, in order to generate a diagnostic model that can achieve high estimation accuracy, a large amount of learning data including operation information and label information that determines the degree of malfunction is required. Therefore, in order to generate a diagnostic model that can achieve high estimation accuracy, a considerable amount of effort and a huge number of man-hours are required, making it difficult to realize.

[0007] Therefore, the present disclosure provides an abnormality determination device and the like that can easily and accurately determine an abnormality in a component supply device for component mounting. [Means for solving the problem]

[0008] An abnormality determination device according to one aspect of the present disclosure is an abnormality determination device that determines an abnormality in a component supply device that sequentially supplies a plurality of components to a component mounting device by sending a plurality of containers in which the plurality of components are individually stored, and includes: an acquisition unit that acquires position information regarding a supply position of each of the plurality of components sequentially supplied by the component supply device; an estimation unit that estimates a stop position of a container storing one of the plurality of components by performing predetermined statistical processing based on the acquired plurality of pieces of position information; and a determination unit that determines an abnormality in the component supply device based on the estimated stop position. The estimation unit estimates the stop position by performing a first statistical processing when the types of the plurality of parts are a first type, and estimates the stop position by performing a second statistical processing different from the first statistical processing when the types of the plurality of parts are a second type. .

[0009] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may also be a non-transitory recording medium. [Effects of the Invention]

[0010] The abnormality determination device of the present disclosure can easily and accurately determine an abnormality in a component supply device for component mounting.

[0011] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and features described in the specification and drawings, but not all of them necessarily need to be provided to obtain one or more identical features. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a production system including a component mounting line according to an embodiment. [Figure 2] FIG. 2 is an external perspective view of the component mounting apparatus according to the embodiment. [Figure 3] FIG. 3 is a diagram illustrating an example of an internal configuration of the component mounting apparatus according to the embodiment. [Figure 4] FIG. 4 is a diagram partially showing an example of a cross section taken along line AA in FIG. [Figure 5] FIG. 5 is a schematic diagram showing the positional relationship between the mounting head and the feeder in the embodiment. [Figure 6] FIG. 6 is an external view showing the external appearance of a component to be mounted in the embodiment. [Figure 7] FIG. 7 is a top view illustrating an example of a component tape according to an embodiment. [Figure 8] FIG. 8 is a side view showing the configuration of the feeder in the embodiment. [Figure 9] FIG. 9 is a diagram illustrating an example of a functional configuration of the component mounting apparatus according to the embodiment. [Figure 10] FIG. 10 shows the relative positions of the nozzles, component tapes, and cameras when components are being picked up in this embodiment. [Figure 11] FIG. 11 is a diagram for explaining the pickup position and the relative position in the embodiment. [Figure 12] FIG. 12 is a flowchart showing an example of the operation of the abnormality determination device according to the embodiment. [Figure 13]FIG. 13 is a diagram showing the relationship between the actual stop position of the pocket, the supply position of the component, and the estimated stop position in the embodiment. [Figure 14] FIG. 14 is a diagram illustrating an example of a functional configuration of the information processing terminal according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] In order to solve the above-mentioned problems, an abnormality determination device according to one aspect of the present disclosure is an abnormality determination device that determines an abnormality in a component supply device that sequentially supplies a plurality of components to a component mounting device by sending a plurality of containers in which the components are each individually stored, and includes: an acquisition unit that acquires position information regarding the supply position of each of the plurality of components sequentially supplied by the component supply device; an estimation unit that estimates the stop position of a container in which one of the plurality of components is stored by performing predetermined statistical processing based on the acquired plurality of pieces of position information; and a determination unit that determines an abnormality in the component supply device based on the estimated stop position.

[0014] According to this, the stopping position of the container is estimated by performing a predetermined statistical processing on information based on multiple position information regarding the supply position of the parts, and an abnormality in the part supply device is determined based on the estimated stopping position of the container, so that an abnormality in the part supply device can be accurately determined.

[0015] Furthermore, each of the plurality of positional information may include, when a component corresponding to the positional information among the plurality of components is picked up, (i) a suction position at which a suction unit provided in the component mounting device stops, and (ii) a relative position of the component with respect to the suction unit.

[0016] Therefore, the stop position of the container can be estimated based on the pickup position and the relative position obtained by the sensor equipped in the component supply device. This makes it possible to estimate the stop position of the container without adding an additional sensor for detecting the stop position of the container. Therefore, the cost of installing the abnormality determination device can be reduced.

[0017] In addition, the estimation unit may calculate the supply position of the part corresponding to each of the plurality of position information by adding together the pickup position and the relative position included in the position information, and estimate the stop position by performing the specified statistical processing on the calculated plurality of supply positions.

[0018] Therefore, for example, it is possible to effectively reduce variations in the positions of components relative to the container when the components are supplied, and it is therefore possible to accurately estimate the stopping position of the container.

[0019] The determination unit may determine that the component supply device is abnormal when the stop position is outside a predetermined area.

[0020] Therefore, when it is detected that the component supply device has stopped the container in an area outside the predetermined area, it can be determined that the component supply device is abnormal.

[0021] In addition, the component supply device may supply the plurality of components by repeating a predetermined cycle of operation, and the plurality of pieces of position information used to estimate the stop position may include a plurality of pieces of position information detected over the predetermined cycle.

[0022] Therefore, it is possible to effectively reduce variations in the positions of the components relative to the container when the components are being supplied, and it is therefore possible to accurately estimate the stopping position of the container.

[0023] In addition, the estimation unit may estimate the stopping position by performing a first statistical processing when the types of the multiple parts are a first type, and may estimate the stopping position by performing a second statistical processing different from the first statistical processing when the types of the multiple parts are a second type.

[0024] Therefore, it is possible to perform appropriate statistical processing on the plurality of pieces of position information according to the type of part for which the plurality of pieces of position information was acquired, thereby enabling the stopping position of the container to be estimated with high accuracy.

[0025] The size of the one container may be larger than the size of the one part.

[0026] Since the size of the container is larger than the size of the part, the position of the part relative to the container is likely to vary when the part is being supplied. Therefore, the abnormality determination device can reduce high-frequency noise caused by the variation in the position of the part relative to the container when the part is being supplied, and can therefore accurately estimate the stopping position of the container.

[0027] Furthermore, while the component mounting device is mounting components, the estimation unit may estimate a stop position of the one container, and the determination unit may determine an abnormality in the component supply device.

[0028] This allows for the detection of abnormalities in the component supply device during component mounting, enabling early response to the abnormality when it occurs. For example, the component supply device in which the abnormality occurred can be taken out of the line before frequent abnormalities occur, reducing operational losses and loss of mounting quality due to the stoppage of the component mounting device.

[0029] Furthermore, an abnormality determination method according to one aspect of the present disclosure is an abnormality determination method for determining an abnormality in a component supply device that has a plurality of containers in which a plurality of components are individually stored and sequentially supplies the plurality of components to a component mounting device by conveying the plurality of components, and for each of the plurality of components sequentially supplied by the component supply device, obtains position information regarding the supply position of the component, and performs predetermined statistical processing based on the obtained plurality of position information to estimate the stop position of a container in which one of the plurality of components is stored, and determines an abnormality in the component supply device based on the estimated stop position.

[0030] According to this, the stopping position of the container is estimated by performing a predetermined statistical processing on information based on multiple position information regarding the supply position of the parts, and an abnormality in the part supply device is determined based on the estimated stopping position of the container, so that an abnormality in the part supply device can be accurately determined.

[0031] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0032] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concepts are described as optional components.

[0033] In addition, each drawing is a schematic diagram and is not necessarily an exact illustration. In addition, the same components are denoted by the same reference numerals in each drawing.

[0034] (Embodiment) [Production System] FIG. 1 is a diagram illustrating an example of the configuration of a production system including a component mounting line.

[0035] This production system includes a component mounting line L1 and an information processing terminal 200.

[0036] The component mounting line L1 is an example of a production facility for mounted boards. It produces mounted boards by mounting at least one component P on a board B carried in from the upstream side, and then carries the produced mounted board out downstream. In this embodiment, the conveyance direction of the board is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction is referred to as the Y-axis direction. The X-axis direction and the Y-axis direction are directions along a horizontal plane. Furthermore, the direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction. The positive and negative sides of the X-axis direction are the downstream and upstream sides, respectively, in the conveyance direction of the board B, and the positive and negative sides of the Y-axis direction are the rear side (or back side) and front side (or near side) in the front-to-rear direction, respectively. The positive and negative sides of the Z-axis direction are the upper and lower sides, respectively, in the vertical direction. FIG. 1 shows the top surface of the component mounting line L1.

[0037] Component mounting line L1 comprises a solder printing device M1, a print inspection device M2, component mounting devices M3 to M6, a mounting inspection device M7, and a reflow device M8. These devices are arranged in series from upstream to downstream in the conveying direction in the following order: solder printing device M1, print inspection device M2, component mounting devices M3 to M6, mounting inspection device M7, reflow device M8.

[0038] Solder printing device M1, print inspection device M2, component mounting devices M3 to M6, mounting inspection device M7, and reflow device M8 are connected to information processing terminal 200 via communication network 2. Solder printing device M1 prints solder onto board B carried in from the upstream side. Print inspection device M2 inspects the condition of the solder printed on board B using a solder inspection camera.

[0039] The component mounting devices M3 to M6 perform component mounting work to mount components P on the board B. Although the component mounting line L1 is equipped with four component mounting devices M3 to M6, the number is not limited to four and may be one to three, or five or more.

[0040] Mounting inspection device M7 uses a component inspection camera to inspect the condition of components P mounted on board B. Reflow device M8 heats board B that has been brought into the device, hardening the solder on board B and joining the electrodes of board B to components P.

[0041] The information processing terminal 200 is located, for example, in the same building as the component mounting line L1, and communicates with the solder printing device M1, print inspection device M2, component mounting devices M3 to M6, mounting inspection device M7, and reflow device M8 included in the component mounting line L1. The information processing terminal 200 may communicate with these devices wirelessly or via a wired connection. The wireless connection may be Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee, or a specified low-power radio. The information processing terminal 200 may also acquire information indicating the availability rate of each device included in the component mounting line L1 and manage each device based on the acquired information. The information processing terminal 200 may also be configured as a personal computer, tablet terminal, smartphone, or the like.

[0042] [Component mounting equipment] 2 is a perspective view of the appearance of the component mounting apparatus M3. The component mounting apparatuses M4 to M6 may also have the same appearance as the component mounting apparatus M3.

[0043] The component mounting apparatus M3 includes, for example, two component supply units 6, a presentation unit 17, and two open / close covers 16. Note that in Fig. 2, one of the two component supply units 6 is shown, and the other is hidden at the back (i.e., on the positive side in the Y-axis direction).

[0044] A plurality of feeders 7 are arranged in parallel along the X-axis direction in the component supply unit 6. The feeders 7 supply components P by pitch-feeding a component tape containing the components P in the tape feed direction.

[0045] The presentation unit 17 presents to the operator of the component mounting device M3. For example, the presentation unit 17 presents by displaying the presentation content. As a specific example, the presentation unit 17 is configured as a liquid crystal display or an organic EL (electro-luminescence) display.

[0046] Each of the two openable covers 16 can be opened and closed freely, and covers a mounting head, which will be described later, when closed. In other words, each of the two openable covers 16 covers the interior of the component mounting apparatus M3 when closed. Therefore, when each of the two openable covers 16 is closed, an operator cannot reach inside the component mounting apparatus M3 and cannot touch the mounting head.

[0047] Fig. 3 is a diagram showing an example of the internal configuration of component mounting apparatus M3. Note that component mounting apparatuses M4 to M6 may also have the same internal configuration as component mounting apparatus M3. The configuration of component mounting apparatus M3 shown in Fig. 3 is a configuration of the interior of component mounting apparatus M3 viewed from the positive side in the Z axis direction, and two open / close covers 16 are not shown.

[0048] In addition to the two component supply units 6 mentioned above, the component mounting device M3 also includes a base 4, a substrate conveying mechanism 5, two X-axis beams 9, a Y-axis beam 8, two mounting heads 10, two cameras 12, and a stage 11.

[0049] The two component supply units 6 are arranged to sandwich the board transport mechanism 5 in the Y-axis direction.

[0050] The board transport mechanism 5 has two rails along the X-axis direction and is disposed in the center of the base 4. The board transport mechanism 5 transports the board B carried in from the upstream side, and positions and holds the board B in a position for performing the component mounting work.

[0051] The Y-axis beam 8 is disposed at one end of the upper surface of the base 4 on one side in the X-axis direction (the right side in the example shown in FIG. 3) so as to extend along the Y-axis direction.

[0052] The two X-axis beams 9 are connected to the Y-axis beam 8 so as to be movable in the Y-axis direction while being aligned along the X-axis direction.

[0053] The mounting head 10 is attached to each of the two X-axis beams 9 so as to be movable in the X-axis direction. The mounting head 10 is equipped with multiple suction units 10a that can lift and lower and pick up and hold components P. A nozzle 10b is detachably attached to the tip of each suction unit 10a (see FIG. 4).

[0054] Each of the two mounting heads 10 moves in the X-axis and Y-axis directions by a drive mechanism including a Y-axis beam 8 and an X-axis beam 9. As a result, each of the two mounting heads 10 picks up a component P by suction with a nozzle 10b from a component pick-up position of a feeder 7 arranged in the component supply unit 6 corresponding to that mounting head 10, and mounts the component P at a mounting point on a board B positioned by the board transport mechanism 5.

[0055] Each of the two cameras 12 is attached to the mounting head 10 corresponding to that camera 12. This camera 12 captures an image of the board B in order to recognize the position and type of the board B positioned on the board transport mechanism 5. The camera 12 also captures an image of the component P picked up by the nozzle 10b of the mounting head 10 in order to recognize the type of the component P. The camera 12 also captures an image of the component P when the mounting head 10 picks up the component P in order to recognize the pickup position of the component P when the component P is picked up. The camera 12 also captures an image of the nozzle 10b in order to read information from the nozzle 10b.

[0056] The stage 11 is also called a nozzle changer, and at least one nozzle 10b is mounted on the stage 11. The at least one nozzle 10b mounted on the stage 11 is used to replace the nozzle 10b attached to the suction unit 10a of the mounting head 10. For example, each of the at least one nozzle 10b mounted on the stage 11 has attributes different from those of the nozzle 10b attached to the suction unit 10a of the mounting head 10. Furthermore, each of the at least one nozzle 10b mounted on the stage 11 also has attributes different from each other. Therefore, in the production of mounted boards, a nozzle 10b having attributes suitable for a component P to be mounted on a board B is selected and mounted on the suction unit 10a of the mounting head 10.

[0057] FIG. 4 is a diagram partially showing an example of a cross section taken along line AA in FIG.

[0058] As shown in FIG. 4, the component supply unit 6 includes a feeder base 13a, a plurality of feeders 7 attached to the feeder base 13a, and a carriage 13 supporting the feeder base 13a.

[0059] The carriage 13 is detachably attached to the base 4 and is equipped with a cassette holder 15. The cassette holder 15 is configured to hold multiple component reels C. Each component reel C stores a wound component tape 14. Each of the multiple component reels C is held in the cassette holder 15 at an upper holding position Hu or a lower holding position Hd. The component tape 14 is pulled out from the component reel C held by the cassette holder 15 and loaded into the feeder 7.

[0060] The camera 12 captures an image from an oblique angle so that the field of view includes a range including the side surface of the nozzle 10b. This allows the camera 12 to capture not only the nozzle 10b attached to the mounting head 10 corresponding to that camera 12, but also, for example, the component P to be picked up by that nozzle 10b and the board mark on the board B that is positioned by the board transport mechanism 5. By capturing an image using this camera 12, the component mounting device M3 detects the relative position of the component P with respect to the nozzle 10b when the nozzle 10b picks up the component P. The detected relative position is output (transmitted) to the abnormality determination device 110, which will be described later. Here, the nozzle 10b is an example of a suction unit.

[0061] The camera 18 captures images from below so that the field of view includes the range including the bottom end of the nozzle 10b. The camera 18 is fixed to the base 4 of the component mounting device M3 or below the component mounting device M3. In other words, the positional relationship between the camera 18 and the base 4 is fixed. As a result, the component mounting device M3 detects the position of the nozzle 10b relative to the reference position of the base 4 by capturing images using the camera 18. This allows the component mounting device M3 to detect the pickup position where the nozzle 10b stopped when the component P was picked up. The detected pickup position is output (transmitted) to the abnormality determination device 110. The component mounting device M3 uses the detected pickup position, for example, to predict the supply position of the next supplied component P.

[0062] Fig. 5 is a schematic diagram showing the positional relationship between the mounting head 10 and the feeder 7. Fig. 6 is an external view showing the appearance of a component P to be mounted. Fig. 7 is a top view showing an example of a component tape 14. Fig. 8 is a side view showing the configuration of the feeder 7.

[0063] 5, a maximum of 10 nozzles 10b can be attached to the mounting head 10. The mounting head 10 with the 10 nozzles 10b attached can simultaneously pick up components P from a maximum of 10 feeders 7 (with one up-and-down movement).

[0064] The feeder 7 feeds the component tape 14 in a pitch direction, sequentially supplying the multiple components P stored on the component tape 14 to the component pick-up position 7a. The mounting head 10 picks up the components P supplied to the component pick-up position 7a with the nozzles 10b and moves the component P to mount the component P at a mounting point on the board B. Note that the method for supplying components P is not limited to the method using the component tape 14, and other supply methods may be used. For example, the components P may be supplied in a stick-shaped case, a tray case, or a bulk component cassette. In such cases, the components P are supplied by a feeder 7 suitable for that supply method. The feeder 7 is an example of a component supply device.

[0065] The components P are chip-type electronic components P1 to P4, such as those shown in FIGS. 6(a) to 6(d). A plurality of such components P are stored consecutively at regular intervals on a component tape 14, as shown in FIG. 7. The component tape 14 has a number of pockets 14a, each containing a component P, and a number of feed holes 14b that engage with the component tape 14 so that the sprocket of the feeder 7 can feed the component tape 14. The pockets 14a are an example of a container that stores the components P, and are larger than the components P. The feeder 7 rotates the sprocket by a predetermined angle to pitch-feed the component tape 14 in the tape feed direction. The component tape 14 also has cover tape that covers the openings of the pockets 14a in which the components P are stored, but this is not shown in FIG. 7.

[0066] A component reel C is attached to the feeder 7, and a component tape 14 (shown in Fig. 8) containing components at equal intervals is wound around it. The feeder 7 has the function of feeding the component tape 14 inside the housing 71 (shown in Fig. 8), thereby pitch-feeding the components P contained on the component tape 14 to the supply port 72.

[0067] A tape feed mechanism 73 is disposed at the tip end of the housing 71. The tape feed mechanism 73 includes a sprocket 74 having pins formed on its outer periphery that engage with feed holes 14b formed at equal intervals in the feed direction of the component tape 14. The tape feed mechanism 73 also includes a drive motor 75 that serves as a rotation drive means for the sprocket 74, a transmission mechanism that transmits the rotation drive of the drive motor 75 to the sprocket 74, and a feeder control unit 78 that serves as a control means for controlling the rotation drive of the drive motor 75.

[0068] When the drive motor 75 is controlled to rotate intermittently in accordance with the storage pitch of the components P, the sprocket 74 performs an indexing rotation, and the component tape 14 wound around the component reel C is pulled into the housing 71 from its rear end and then pitch-fed to its front end. As a result, the components P stored on the component tape 14 are sequentially supplied to the supply port 72, which is the position where they are to be picked up.

[0069] The supply port 72 is formed as an opening in a part of a tape guide 76 that is attached to the top of the housing 71 and guides the feed of the component tape 14. Part of the tape guide 76 forms a folded portion of the cover tape 14c that has been peeled off the surface of the component tape 14, and a cover tape peeling mechanism 77 peels the cover tape 14c from the surface of the component tape 14. As a result, the component tape 14 is supplied to the supply port 72 with the components P exposed, and is picked up by the nozzle 10b aligned above the supply port 72.

[0070] The gear unit 80 is composed of a gear train including a drive gear 81, a first transmission gear 82, a second transmission gear 83, a third transmission gear 84, and a final gear 85. The drive gear 81 is attached to the output shaft of the drive motor 75. The first transmission gear 82 meshes with the drive gear 81. A second transmission gear 83 is coaxially fixed to the first transmission gear 82, and the second transmission gear 83 meshes with the third transmission gear 84. The third transmission gear 84, meshed with the second transmission gear 83, also meshes with the final gear 85 fixed to the rotation shaft of the sprocket 74. Note that the configuration of a transmission mechanism such as the gear unit 80 is not limited to this, and the number of gears included in the gear unit 80 is not limited to five, and may be less than five or more than five.

[0071] Therefore, the causes of malfunctions in the component mounting device M3 configured as above are, for example, as follows: dirt on the supply port 72, wear and rattle at the tip of the sprocket 74, wear and misalignment of the drive motor 75, rattle and misalignment of the feeder 7, and deterioration of the motor torque.

[0072] [Component mounting equipment] FIG. 9 is a block diagram showing an example of the functional configuration of the component mounting apparatus M3.

[0073] The component mounting apparatus M3 includes the mounting head 10, camera 12, Y-axis beam 8, X-axis beam 9, board transport mechanism 5, stage 11, camera 18, and component supply unit 6, as well as a component mounting apparatus control unit 100.

[0074] The component mounting device control unit 100 is a processing unit that controls the operation of the component mounting device M3. The component mounting device control unit 100 includes a component mounting operation processing unit 101, a screen display I / F processing unit 102, a main memory unit 103, and an abnormality determination unit 110.

[0075] The component mounting operation processing unit 101 is a processing unit that controls the operation of each of the components, namely, the mounting head 10, the camera 12, the Y-axis beam 8, the X-axis beam 9, the substrate transport mechanism 5, the stage 11, the camera 18, and the component supply unit 6. The component mounting operation processing unit 101 executes a program stored in the main memory unit 103, acquires the operating status of each component of the component mounting device M3, and controls the operation of each component of the component mounting device M3 according to the operating status.

[0076] The screen display I / F processing unit 102 displays the status of control by the component mounting operation processing unit 101. The screen display I / F processing unit 102 also receives input from the operator to change the type of control of the component mounting device M3 and to change the settings of the control (for example, settings of control parameters).

[0077] The main storage unit 103 stores programs and control parameters for controlling the component mounting device M3, operation information of the component mounting device M3, and the like.

[0078] The processing unit and the abnormality determination device 110 included in the component mounting device control unit 100 are realized by a processor such as a DSP, but may also be realized by a microcomputer or a dedicated circuit, or may be realized by a combination of two or more of a processor, a microcomputer, and a dedicated circuit. Also, the main memory unit 103 and the memory unit 115 may be realized by a non-volatile memory or storage.

[0079] The abnormality determination device 110 includes an acquisition unit 111 , an estimation unit 112 , a determination unit 113 , an output unit 114 , and a storage unit 115 .

[0080] The acquisition unit 111 acquires position information regarding the supply position of each of the multiple components P. The feeder 7 supplies the multiple components P by repeating a predetermined cycle of operation. Therefore, the multiple pieces of position information include multiple pieces of position information detected over the predetermined cycle. The acquisition unit 111 acquires position information regarding the supply position of the component P each time each of the multiple components is sequentially supplied. In other words, the acquisition unit 111 acquires multiple pieces of position information that are continuous in time series. Each piece of position information includes the pickup position where the nozzle 10b stopped when the component corresponding to the position information among the multiple components P was picked up, and the relative position of the component P with respect to the nozzle 10b. In other words, the position information is a data set that includes the pickup position and the relative position.

[0081] The pickup positions and relative positions will now be described in detail. Figure 10 shows the relative positions of the nozzle 10b, component tape 14, camera 12, and camera 18 when a component is being picked up. Figure 11 is a diagram for explaining the pickup positions and relative positions.

[0082] As shown in Figure 10, when adsorbing a component P, the component mounting device M3, for example, moves and stops the nozzle 10b horizontally to align it with the supply position of the component P, then moves it downward a predetermined amount from the stopped position and stops it at a height where the component P can be adsorbed.

[0083] The pickup position p1 is detected by the component mounting device M3 based on a first image of the nozzle 10b captured from below by the camera 18 during pickup. The pickup position p1 is the horizontal position (i.e., the position in the X-axis direction and the Y-axis direction) when the nozzle 10b stops during pickup (i.e., when the nozzle 10b stops at a position where it can pick up the component P). The pickup position p1 is the position of the nozzle 10b when the reference position pb on the base 4 is set as the origin, and may be expressed by coordinates including positions in the X-axis direction and the Y-axis direction, for example. The X-coordinate x1 of the pickup position p1 is expressed as a positive value if it is located on the positive side of the X-axis direction from the X-coordinate xb of the reference position pb, and is expressed as a negative value if it is located on the negative side of the X-axis direction from the X-coordinate xb of the reference position pb.

[0084] The X-coordinate x1 of the pickup position p1 is indicated as a positive value if it is located on the positive side of the X-axis direction relative to the X-coordinate xb of the reference position pb during pickup, and is indicated as a negative value if it is located on the negative side of the X-axis direction relative to the X-coordinate xb of the reference position pb. The same applies to the Y-coordinate.

[0085] The relative position p2 is detected by the component mounting device M3 based on a second image in which the nozzle 10b and the component P are captured by the camera 12 from an oblique side. The relative position p2 is the position of the component P relative to the nozzle 10b in the horizontal direction when the component P stops during pickup. In other words, the relative position p2 is the position of the component P when the position of the nozzle 10b is the origin, and may be expressed, for example, by coordinates including positions in the X-axis direction and the Y-axis direction. The X-coordinate x2 of the relative position p2 is expressed as a positive value if it is located on the positive side of the X-axis direction from the X-coordinate x1 of the position of the nozzle 10b (same as the pickup position p1), and is expressed as a negative value if it is located on the negative side of the X-axis direction from the X-coordinate x1 of the position of the nozzle 10b. The same applies to the Y-coordinate.

[0086] 11, the Y coordinate y1 of the suction position p1 of the nozzle 10b is located on the negative side of the Y axis relative to the Y coordinate yb of the reference position pb, and is therefore expressed as a negative value with the difference d1 between the Y coordinate y1 and the Y coordinate yb as its absolute value.The Y coordinate y2 of the relative position p2 is located on the positive side of the Y axis relative to the Y coordinate y1 of the suction position p1 of the nozzle 10b, and is therefore expressed as a positive value with the difference d2 between the Y coordinate y1 and the Y coordinate y2 as its absolute value.

[0087] As a result, the position of the component P relative to the reference position pb (that is, the supply position) can be calculated by adding the pickup position p1 and the relative position p2 together.

[0088] The estimation unit 112 performs a predetermined statistical process based on the acquired multiple pieces of position information to estimate the stop position of the pocket 14a where one of the multiple components P is stored. Specifically, the estimation unit 112 calculates the supply position of the component P corresponding to each piece of position information by adding together the pickup position p1 and the relative position p2 included in the multiple pieces of position information. The estimation unit 112 then performs a predetermined statistical process on the calculated multiple supply positions to estimate the stop position of the pocket 14a where the supplied component P is stored. The predetermined statistical process performed by the estimation unit 112 is, for example, one of four statistical methods: low-pass filter, moving average, fitting, and weighted average. The predetermined statistical process may be a statistical method other than the above four statistical methods. Alternatively, the predetermined statistical process may be a combination of two or more statistical methods, including these four statistical methods and another statistical method.

[0089] The estimation unit 112 may estimate the stop position by performing different statistical processing on multiple pieces of position information for each type of component P. In this case, the multiple pieces of position information used to estimate the stop position include multiple pieces of position information detected at different times (e.g., predetermined time units) over the rotation period (predetermined period) of the sprocket 74. That is, if the multiple components P on the component tape 14 are of a first type, the estimation unit 112 may estimate the stop position of the pocket 14a by performing a first statistical processing. If the multiple components P on the component tape 14 are of a second type, the estimation unit 112 may estimate the stop position of the pocket 14a by performing a second statistical processing different from the first statistical processing. The first statistical processing may be one of low-pass filtering, moving averaging, fitting, and weighted averaging, and the second statistical processing may be one of low-pass filtering, moving averaging, fitting, and weighted averaging that is different from the first statistical processing. The second statistical processing may be the same statistical method as the first statistical processing, but may use hyperparameters that are set to values ​​different from those used in the first statistical processing. For example, as an appropriate statistical process according to the type of part, a statistical process with a small error can be selected by obtaining in advance the correct pocket stop position actually obtained for each type of part and the estimated pocket stop position.

[0090] The determination unit 113 determines whether there is an abnormality in the feeder 7 based on the estimated stop position. Specifically, the determination unit 113 determines that there is an abnormality in the feeder 7 if the estimated stop position of the pocket 14a is outside a predetermined area. In other words, the determination unit 113 determines whether there is an abnormality in the feeding operation of the component tape 14 by the feeder 7. The area outside the predetermined area may be, for example, an area where the difference between the reference position pb and the stop position is equal to or greater than a predetermined threshold, or may be a predetermined area. The determination unit 113 performs the above determination on the position in the Y-axis direction, that is, the position in the feed direction. Therefore, the estimation unit 112 may estimate only the Y coordinate of the stop position.

[0091] The output unit 114 outputs the determination result by the determination unit 113. Specifically, the output unit 114 may transmit the determination result to the component mounting device M3 or to a terminal (not shown) owned by the user. The output unit 114 may output the determination result when an abnormality in the feeder 7 is determined.

[0092] The processing by the abnormality determination device 110 may be performed in real time while the component mounting device M3 is mounting components. Specifically, the estimation unit 112 may estimate the stop position of the pocket 14a on the component tape 14 while the component mounting device M3 is mounting components, and the determination unit 113 may determine an abnormality in the feeder 7. In other words, the acquisition unit 111 acquires position information including the pickup position and relative position detected each time the component mounting device M3 performs a pickup operation to pick up a component P, the estimation unit 112 estimates the stop position of the pocket 14a each time the position information is acquired, and the determination unit 113 determines an abnormality in the feeder 7 each time the stop position is estimated.

[0093] The storage unit 115 stores various types of information. The storage unit 115 may store acquired position information, may store an estimated stopping position, or may store a determination result.

[0094] [Operation] Next, the operation of the abnormality determination device 110 of the component mounting apparatus M3 will be described.

[0095] The abnormality determination device 110 acquires the pickup position p1 of the nozzle 10b and the relative position p2 of the component P with respect to the nozzle 10b (S1). The process of step S1 is a process performed by the acquisition unit 111 of the abnormality determination device 110.

[0096] Next, the abnormality determination device 110 performs predetermined statistical processing based on the acquired position information to estimate the stopping position of the pocket 14a of the component tape 14 when the component P is picked up (S2). The processing of step S2 is performed by the estimation unit 112 of the abnormality determination device 110.

[0097] Next, the abnormality determination device 110 determines whether the estimated stopping position of the pocket 14a is included in a predetermined area (S3). The process of step S3 is a process performed by the determination unit 113 of the abnormality determination device 110.

[0098] If it is determined that the stop position is included in the predetermined area (Yes in S3), the abnormality determination device 110 determines that the feeder 7 is normal (S4).

[0099] On the other hand, if it is determined that the stop position is not included in the predetermined area (No in S3), the abnormality determination device 110 determines that the feeder 7 is abnormal (S5).

[0100] [Effects, etc.] The abnormality determination device 110 according to this embodiment determines an abnormality in a feeder 7 that sequentially supplies a plurality of components P to a component mounting device M3 by feeding a component tape 14 having a plurality of pockets 14a in which a plurality of components P are individually stored. The abnormality determination device 110 includes an acquisition unit 111, an estimation unit 112, and a determination unit 113. The acquisition unit 111 acquires position information regarding the supply position of each of the plurality of components P sequentially supplied by the feeder 7. The estimation unit 112 performs predetermined statistical processing based on the acquired plurality of position information to estimate the stop position of one pocket 14a in which one of the plurality of components P is stored. The determination unit 113 determines an abnormality in the feeder 7 based on the estimated stop position.

[0101] FIG. 13 is a diagram showing the relationship between the actual stop position of the pocket, the component supply position, and the estimated stop position. The number of feeds on the horizontal axis in FIG. 13 indicates the cumulative number of times the feeder 7 has stopped the component tape 14 for supplying components P. The actual stop position of the pocket is, for example, a position obtained by a camera fixed to the base 4 such that the stopped pocket 14a is included in its imaging range; this camera is not included in the component mounting device M3 of this embodiment. The component supply position is the supply position described in the above embodiment, and is a position obtained by adding the pickup position and the relative position together. The estimated stop position is the stop position estimated by the estimation unit 112, as described in the above embodiment.

[0102] 13, the time-series data of the actual stopping position of pocket 14a includes a component (low-frequency component) in which the position oscillates with the rotation period of sprocket 74. This occurs due to misalignment of the tip of sprocket 74, misalignment of the rotation stopping position of sprocket 74, etc. The time-series data of the actual stopping position of pocket 14a shows that pocket 14a stops at the same position with high precision when sprocket 74 makes one rotation.

[0103] The time-series data of the supply position of the component P includes components (high-frequency components) that vibrate at time intervals shorter than the rotation period of the sprocket 74. This occurs because the size of the pocket 14a is larger than the size of the component P, and because there is a gap between the component P and the side wall of the pocket 14a, the component P can move further by the distance of the gap from the stopping position of the pocket 14a.

[0104] The estimated stopping position is estimated to be close to the actual stopping position of pocket 14a, with high frequency components reduced by performing a predetermined statistical process on the time series data of the supply position of the parts.

[0105] The abnormality determination device 110 estimates the stop position of the pocket 14a by performing a predetermined statistical process on information based on multiple pieces of position information regarding the supply position of the component P (here, time-series data of the supply position of the component P), and determines an abnormality in the feeder 7 based on the estimated stop position of the pocket. For example, the abnormality determination device 110 determines that an abnormality has occurred in the feeder 7 when the stop position of the pocket 14a is outside a predetermined area (i.e., a position outside the predetermined area) as shown in FIG. 13, and determines that an abnormality has not occurred in the feeder 7 when the stop position of the pocket 14a is inside the predetermined area. By performing the predetermined statistical process in this manner, as shown in the time-series data of the estimated stop position in FIG. 12, it is possible to effectively reduce high-frequency noise components included in the time-series data of the supply position of the component P, and it is possible to accurately estimate the stop position of the pocket 14a.

[0106] Furthermore, in the abnormality determination device 110 according to this embodiment, each of the multiple pieces of position information includes (i) the pickup position at which the nozzle 10b provided on the component mounting device M3 stopped when the component P corresponding to the position information among the multiple components P was picked up, and (ii) the relative position of the component P with respect to the nozzle 10b.

[0107] Therefore, the stop position of the pocket 14a can be estimated based on the pickup position based on the first image acquired by the camera 18 provided in the component mounting device M3 and the relative position based on the second image acquired by the camera 12. This makes it possible to estimate the stop position of the pocket 14a without adding a sensor for detecting the stop position of the pocket 14a. Therefore, the cost of installing the abnormality determination device 110 can be reduced.

[0108] Furthermore, in abnormality determination device 110 according to this embodiment, estimation unit 112 calculates the component supply position corresponding to each of a plurality of pieces of position information by adding together the pickup position and the relative position included in the corresponding piece of position information. Then, estimation unit 112 performs a predetermined statistical process on the calculated plurality of supply positions to estimate the stop position.

[0109] Therefore, for example, it is possible to effectively reduce variations in the position of the component P relative to the pocket 14a within the pocket 14a when the component is supplied, and therefore it is possible to accurately estimate the stopping position of the pocket.

[0110] Furthermore, in abnormality determination device 110 according to the present embodiment, determination unit 113 determines that feeder 7 is abnormal when the stop position is outside a predetermined area.

[0111] Therefore, when it is detected that the feeder 7 has stopped the pocket 14a in an area outside the predetermined area, it can be determined that the feeder 7 is abnormal.

[0112] In the abnormality determination device 110 according to the present embodiment, the feeder 7 supplies a plurality of parts by repeating a predetermined cycle of operation. The plurality of pieces of position information used to estimate the stop position includes a plurality of pieces of position information detected over the predetermined cycle.

[0113] Therefore, it is possible to effectively reduce variations in the position of the component P relative to the pocket 14a within the pocket 14a when the component is supplied, and therefore it is possible to accurately estimate the stopping position of the pocket 14a.

[0114] Furthermore, in the abnormality determination device 110 according to this embodiment, when the types of the multiple parts P are of a first type, the estimation unit 112 estimates the stopping position by performing a first statistical processing, and when the types of the multiple parts P are of a second type, the estimation unit 112 estimates the stopping position by performing a second statistical processing different from the first statistical processing.

[0115] Therefore, it is possible to perform appropriate statistical processing on the plurality of pieces of position information according to the type of part for which the plurality of pieces of position information were acquired, and it is therefore possible to accurately estimate the stopping position of the pocket 14a.

[0116] Furthermore, in the abnormality determination device 110 according to this embodiment, the size of one pocket 14a is larger than the size of one part P.

[0117] According to this, since the size of pocket 14a is larger than the size of component P, the position of component P relative to pocket 14a is likely to vary when the component is supplied. Therefore, abnormality determination device 110 can reduce high-frequency noise caused by the variation in the position of component P relative to pocket 14a when the component is supplied. Therefore, the stopping position of the pocket can be estimated with high accuracy.

[0118] In the abnormality determination device 110 according to the present embodiment, the estimation unit 112 estimates the stopping position of one pocket while the component mounting device M3 is mounting components, and the determination unit 113 determines whether the feeder 7 is abnormal.

[0119] According to this, since it is possible to determine whether or not there is an abnormality in the feeder 7 during component mounting, when an abnormality occurs in the feeder 7, it is possible to take measures against the abnormality at an early stage.

[0120] Furthermore, since the abnormality determination device 110 according to this embodiment can determine an abnormality in the feeder 7, as in the recognition process using a machine learning model, it does not need to have high-performance processing capabilities to execute the above recognition process. Therefore, it can be easily implemented as a control unit of the component mounting device M3. Therefore, it is not necessary to acquire data obtained from the component mounting device M3 (multiple pieces of position information and multiple pieces of image data obtained by the cameras 12 and 18 for calculating the multiple pieces of position information). In other words, since the abnormality determination device 110 does not need to acquire data via a network, it can determine an abnormality in the feeder 7 in more real time.

[0121] [Variations] (1) Although the abnormality determination device 110 according to the above embodiment is described as a device provided in the component mounting device M3, the abnormality determination device 110 is not limited to this and may be an external device connected to the component mounting device M3, or may be provided in another device included in the component mounting line L1. For example, the information processing terminal 200 may have the configuration of the abnormality determination device 110.

[0122] FIG. 14 is a block diagram showing an example of a functional configuration of an information processing terminal 200 according to a modification of the embodiment.

[0123] 14, the information processing terminal 200 includes an abnormality determination device 110. In this case, the information processing terminal 200 acquires multiple pieces of position information from the component mounting device M3, or acquires information for calculating multiple pieces of position information (image data acquired by the camera 12 and the camera 18). Note that the configuration of the abnormality determination device 110 is the same as that of the embodiment, and therefore description thereof will be omitted.

[0124] (2) In the above embodiment, the component mounting device M3 detects the pickup position using the first image captured by the camera 18, and detects the relative position using the second image captured by the camera 12, but this is not limited to this. A set of the first image and the second image captured at the same time may be transmitted to the abnormality determination device 110, and the abnormality determination device 110 may calculate (obtain) the pickup position using the first image, and detect (obtain) the relative position using the second image.

[0125] (3) Although the abnormality determination device 110 according to the above embodiment calculates the supply position of the component P by adding the pickup position and the relative position together, this is not limited to this. When the nozzle 10b is controlled so as to face the component P directly in the Z-axis direction, the pickup position may be identified as the supply position of the component.

[0126] In the above-described embodiments, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that realizes the component mounting device M3 of the above-described embodiments is a program that causes a computer to execute each step included in the flowchart shown in the figure.

[0127] The following cases are also included in this disclosure:

[0128] (1) Each of the above devices is specifically a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or hard disk unit. Each device achieves its function when the microprocessor operates in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to a computer to achieve a predetermined function.

[0129] (2) Some or all of the components constituting each of the above devices may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions when the microprocessor operates in accordance with the computer program.

[0130] (3) Some or all of the components constituting each of the above devices may be configured as an IC card or a standalone module that can be attached to each device. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned ultra-multifunctional LSI. The IC card or module achieves its functions when the microprocessor operates according to a computer program. The IC card or module may be tamper-resistant.

[0131] (4) The present disclosure may be embodied as the methods described above, a computer program for implementing these methods on a computer, or a digital signal comprising the computer program.

[0132] The present disclosure may also be the computer program or the digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray (registered trademark) Disc), semiconductor memory, etc. Alternatively, the present disclosure may be the digital signal recorded on such a recording medium.

[0133] Furthermore, the present disclosure may also be applied to transmitting the computer program or the digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0134] The present disclosure may also be a computer system including a microprocessor and a memory, wherein the memory stores the computer program, and the microprocessor operates in accordance with the computer program.

[0135] The program or the digital signal may also be implemented by another independent computer system by recording it on the recording medium and transferring it, or by transferring it via the network or the like.

[0136] (5) The above-described embodiments and modifications may be combined with each other. [Industrial Applicability]

[0137] The present disclosure can be used in a component mounting apparatus that mounts components on a board, and a production system that includes the component mounting apparatus. [Explanation of symbols]

[0138] 2. Communication Network 4 Foundation 5. Substrate transport mechanism 6. Parts Supply Department 7 Feeder 7a Parts removal position 8 Y-axis beam 9 X-axis beam 10 Mounting head 10a Adsorption unit 10b Nozzle 11 Stages 12 Camera 13 Cart 13a Feeder Base 14 Component tape 14a Pocket 14b Sprocket holes 14c cover tape 15 Cassette holder 16 Opening and closing cover 17 Presentation section 18 Camera 71 Case 72 Supply port 73 Mechanism 74 sprocket 75 drive motor 76 Tape Guide 77 Cover tape peeling mechanism 78 Feeder control section 80 Gear Unit 81 Drive gear 82 Transmission gear 83 Transmission gear 84 Transmission gear 85 Final Gear 100 Component mounting device control section 101 Component mounting operation processing unit 102 Screen display I / F processing unit 103 Main memory 110 Abnormality determination device 111 Acquisition Department 112 Estimation Department 113 Judgment section 114 Output section 115 Storage section 200 Information processing terminal B board C Parts reel Hd lower holding position Hu upper holding position L1 Component Mounting Line M1 printing device M2 Print Inspection Machine M3 component mounting device M4 component mounting device M7 Mounting Inspection Device M8 Reflow Machine P parts P1 Chip-type electronic components d1 difference d2 difference p1 Adsorption position p2 relative position pb reference position y1 Y coordinate y2 Y coordinate yb Y coordinate

Claims

1. 1. An abnormality determination device that determines an abnormality in a component supply device that sequentially supplies a plurality of components to a component mounting device by sending a plurality of containers in which the plurality of components are individually stored, an acquisition unit that acquires position information regarding a supply position of each of the plurality of components sequentially supplied by the component supply device; an estimation unit that estimates a stop position of a container that stores one of the plurality of parts by performing a predetermined statistical process based on the acquired plurality of pieces of position information; a determination unit that determines whether there is an abnormality in the component supply device based on the estimated stop position, The estimation unit If the types of the plurality of parts are a first type, the stop position is estimated by performing a first statistical processing; If the types of the plurality of parts are a second type, the stop position is estimated by performing a second statistical process different from the first statistical process. Abnormality determination device.

2. Each of the plurality of pieces of positional information includes, when a component corresponding to the positional information among the plurality of components is picked up, (i) a pickup position at which a pickup unit included in the component mounting device stops, and (ii) a relative position of the component with respect to the pickup unit. The abnormality determination device according to claim 1 .

3. The estimation unit calculating a component supply position corresponding to each of the plurality of position information by adding together the pickup position and the relative position included in the position information; The stop position is estimated by performing the predetermined statistical processing on the calculated plurality of supply positions. The abnormality determination device according to claim 2 .

4. The determination unit determines that the component supply device is abnormal when the stop position is outside a predetermined area. The abnormality determination device according to any one of claims 1 to 3.

5. the component supply device supplies the plurality of components by repeating a predetermined cycle of operation; The plurality of pieces of position information used to estimate the stop position includes a plurality of pieces of position information detected over the predetermined period. The abnormality determination device according to any one of claims 1 to 4.

6. The size of the container is larger than the size of the part. The abnormality determination device according to any one of claims 1 to 5.

7. While the component mounting device is mounting components, The estimation unit estimates a stop position of the one container, The determination unit determines an abnormality in the component supply device. The abnormality determination device according to any one of claims 1 to 6.

8. 1. A method for determining an abnormality in a component supply device that has a plurality of containers in which a plurality of components are individually stored and that sequentially supplies the plurality of components to a component mounting device by feeding the plurality of components, the method comprising: acquiring position information regarding a supply position of each of the plurality of components sequentially supplied by the component supply device; performing a predetermined statistical process based on the acquired plurality of pieces of position information to estimate a stop position of one container storing one of the plurality of parts; determining whether there is an abnormality in the component supply device based on the estimated stop position; In the above estimation, If the types of the plurality of parts are a first type, the stop position is estimated by performing a first statistical processing; If the types of the plurality of parts are a second type, the stop position is estimated by performing a second statistical process different from the first statistical process. Abnormality determination method.

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