Component mounting system, component mounting device, and component mounting method

Abstract

To provide a component mounting system capable of easily setting up reverse transportation of substrates from downstream, a component mounting unit, and a component mounting method.SOLUTION: The component mounting system includes a first component mounting unit that performs component mounting work on a board; and a second component mounting unit placed downstream of the first component mounting unit. The first component mounting unit and the second component mounting unit has a setting unit that sets, as a method of transporting the board, either a first transport mode, in which the board is transported from upstream, or a second transport mode, in which the board is brought in from downstream. When the setting unit of the first component mounting unit accepts the setting of the second transport mode as the transport method (ST1) and the setting unit of the first component mounting unit shifts the transport method to the second transport mode (ST4), the setting unit of the second component mounting unit shifts the transport method to the second transport mode (ST9).SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a component mounting system, a component mounting apparatus, and a component mounting method for mounting components on a board. [Background technology]

[0002] In a component mounting line that produces mounted boards with components mounted on them, the boards are sequentially transported from upstream to downstream in a plurality of connected component mounting devices, and components are mounted on the boards. However, in parameter setting work using a board, test mounting of components, repair mounting of missing components, and other tasks that are performed in the component mounting devices before the production of mounted boards, it is sometimes more efficient to transport a board loaded from the most downstream device back upstream and load it into the component mounting device that is the target of the work, rather than transporting the board from upstream to downstream of the connected component mounting devices (for example, Patent Document 1).

[0003] In the component mounting system of Patent Document 1, reverse transport of boards is achieved by setting the component mounting device that transports boards in the reverse direction to either a board reverse carry-in mode, in which a board loaded from downstream is carried into the device, or a board reverse transport mode, in which a board loaded from downstream is passed through and transported to an upstream device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-102714 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the prior art including Patent Document 1, although it is possible to reverse convey a board in a component mounting device that constitutes a component mounting line, it is necessary to correctly set the board reverse carry-in mode or board arrival conveyance mode in each component mounting device that performs the reverse conveyance. This setting is complicated and prone to setting errors, so there is room for further improvement in order to easily and reliably set the reverse conveyance of boards in a component mounting line.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting system, a component mounting device, and a component mounting method that can easily set up reverse transport of a board from downstream. [Means for solving the problem]

[0007] The component mounting system of the present invention comprises a first component mounting device that performs the work of mounting components on a board, and at least one second component mounting device that is provided downstream of the first component mounting device, and the first component mounting device and the second component mounting device each have a setting unit that sets the transport method for the board to either a first transport mode in which the board is transported from upstream, or a second transport mode in which the board is transported from downstream, and when the setting unit of the first component mounting device sets the transport method of the first component mounting device to the second transport mode, the setting unit of the second component mounting device sets the transport method of the second component mounting device to the second transport mode.

[0008] The component mounting device of the present invention is a component mounting device that is used in conjunction with other devices and performs the task of mounting components onto a board that is brought in from upstream or downstream, and has a setting unit that sets the transport method for the board to either a first transport mode in which the board is brought in from upstream, or a second transport mode in which the board is brought in from downstream, and when the setting unit of the component mounting device connected upstream transitions the transport method to the second transport mode, the setting unit of the component mounting device connected downstream transitions the transport method to the second transport mode.

[0009] The component mounting method of the present invention is a component mounting method in a component mounting system that includes a first component mounting device that performs the work of mounting components on a board, and at least one second component mounting device that is provided downstream of the first component mounting device, wherein the first component mounting device and the second component mounting device each have a setting unit that sets the transport method for the board to either a first transport mode in which the board is transported from upstream, or a second transport mode in which the board is transported from downstream, and the setting unit of the first component mounting device accepts the setting of the second transport mode as the transport method, and when the setting unit of the first component mounting device transitions the transport method to the second transport mode, the setting unit of the second component mounting device transitions the transport method to the second transport mode. [Effects of the Invention]

[0010] According to the present invention, reverse transport of the substrate from downstream can be easily set. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a cross-sectional view showing the configuration and function of a main part of a component mounting device according to an embodiment of the present invention. [Figure 3] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. [Figure 4] FIG. 10 is a diagram showing an example of an operation mode setting screen displayed on a touch panel of the component mounting apparatus according to the embodiment of the present invention. [Figure 5] 1 is a diagram illustrating a process for mounting components according to an embodiment of the present invention; [Figure 6] 1 is a diagram illustrating a process for mounting components according to an embodiment of the present invention; [Figure 7] 1 is a diagram illustrating a process for mounting components according to an embodiment of the present invention; [Figure 8] 1 is a diagram illustrating a process for mounting components according to an embodiment of the present invention; [Figure 9] 1 is a diagram illustrating a process for mounting components according to an embodiment of the present invention; [Figure 10]1 is a flow diagram of a component mounting method according to an embodiment of the present invention; [Figure 11] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the component mounting system and component mounting device. In the following, corresponding elements in all drawings will be given the same reference numerals, and duplicated explanations will be omitted. In FIG. 1 and in some parts described below, two axes that are orthogonal to each other in a horizontal plane are shown: the X-axis in the board transport direction (the left-right direction in FIG. 1) and the Y-axis that is orthogonal to the board transport direction (the up-down direction in FIG. 1). In FIG. 2 and in some parts described below, the Z-axis (the up-down direction in FIG. 2) is shown as the height direction that is orthogonal to the horizontal plane.

[0013] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of manufacturing a mounted board by mounting components on a board. Component mounting system 1 has five component mounting devices M1 to M5 connected in series from upstream (left side of the paper) to downstream (right side of the paper) in the board transport direction. Note that the number of component mounting devices M1 to M5 provided in component mounting system 1 is not limited to five, and may be two to four, or six or more. Component mounting devices M1 to M5 are connected to a management computer CP via a communications network NT.

[0014] The component mounting devices M1 to M5 are multi-line equipment equipped with two rows of board transport units. By connecting these board transport units in series, two board transport lines LA and LB are formed that run from upstream to downstream along the board transport direction (X-axis). In the process of manufacturing mounted boards using the component mounting system 1, the boards to be worked on are transported in order from upstream to downstream along the board transport lines LA and LB, and components are mounted on them by the component mounting devices M1 to M5. In this way, the component mounting devices M1 to M5 have multiple transport lanes (board transport lines LA and LB) that transport boards in parallel. Hereinafter, the side where the board transport line LA is located will be referred to as the "front" and the side where the board transport line LB is located will be referred to as the "rear."

[0015] In FIG. 1, a printing device (not shown) is located upstream of the most upstream component mounting device M1. The printing device prints solder paste onto electrodes formed on a board. The board conveying lines LA and LB of component mounting device M1 receive the boards on which the solder paste has been printed from the printing device (arrow a). The boards on which components have been mounted by component mounting devices M1 to M5 are transported from the board conveying lines LA and LB of the most downstream component mounting device M5 toward the reflow device (arrow b). The reflow device heats the board to melt the solder paste, thereby solder-joining the components to the board.

[0016] In addition, component mounting system 1 may be connected to a connecting conveyor upstream of component mounting device M1 or downstream of component mounting device M5, which can transfer boards between component mounting devices M1 and M5 and can also input and retrieve boards. Workers W, who perform various tasks on component mounting devices M1-M5, such as a component supply task for supplying components to part feeders 4, an error response task for recovering from an equipment error, a setup task for changing the type of mounted board to be manufactured, and a teaching task for setting the operating parameters of the equipment, each carry an information terminal T. Various instructions and information related to the tasks are communicated to information terminal T via wireless communication from component mounting devices M1-M5 and a management computer CP that controls component mounting devices M1-M5 as a whole.

[0017] Next, the configuration and function of component mounting devices M1 to M5 will be described with reference to Figures 1 and 2. Component mounting devices M1 to M5 have the same configuration, and the following description will use component mounting device M4 as an example. Figure 2 shows the configuration of the main parts of component mounting device M4 as seen from the front, component mounting device M3 connected upstream of component mounting device M4, and component mounting device M5 connected downstream. Of the two board transport lines LA and LB, Figure 2 only shows the front board transport line LA (lane A), but the rear board transport line LB (lane B) is similar.

[0018] In FIG. 1, two board transport lines LA and LB are arranged in the X direction at the center of base 2 of component mounting device M4. Two work stations [A1] and [A2] are set up from upstream on front board transport line LA (lane A). Similarly, two work stations [B1] and [B2] are set up from upstream on rear board transport line LB (lane B). Component mounting device M4 performs component mounting work to mount components on boards at at least one of these multiple work stations.

[0019] Component supply units 3A and 3B are located outside the front and rear of board conveying lines LA and LB. During component mounting work, components taken out from part feeders 4 of component supply units 3A and 3B are mounted onto boards carried into one of the work stations. Touch panels 5A and 5B, which are operated by worker W, are installed on both the front and rear sides of component mounting device M4. The touch panels 5A and 5B display various information on their displays, and worker W uses operation buttons and other controls displayed on the displays to input data and operate and set up component mounting device M4.

[0020] In Figure 2, component mounting device M4 is equipped with a board transport section configured with multiple conveyor units (intake conveyor 6, work station conveyors 7L and 7R, and carry-out conveyor 8) that transport boards, arranged in series along the X axis. Component mounting device M4 is equipped with these board transport sections on each of board transport lines LA and LB. The take-in conveyor 6, work station conveyor 7L, work station conveyor 7R, and carry-out conveyor 8 that make up the board transport section are driven by conveyor drive motors D1, D2, D3, and D4, respectively. Conveyor drive motors D1 to D4 are controlled by a control device 13 provided in component mounting device M4.

[0021] By driving the conveyor drive motors D1 to D4 in the forward direction, the board transport unit can transport the board handed over from the upstream component mounting device M3 in the order (arrow c) along the carry-in conveyor 6, work station conveyor 7L, work station conveyor 7R, and carry-out conveyor 8. Moreover, by driving the conveyor drive motors D1 to D4 in the reverse direction, the board transport unit can transport the board handed over from the downstream component mounting device M5 in the reverse direction (arrow d) along the carry-out conveyor 8, work station conveyor 7R, work station conveyor 7L, and carry-in conveyor 6 in that order.

[0022] 2, in order to control the forward and reverse transport of boards by the board transport section, a plurality of board detection sensors (not shown) that detect boards are arranged on the carry-in conveyor 6, work station conveyor 7L, work station conveyor 7R, and carry-out conveyor 8. The detection results of the boards by the plurality of board detection sensors are sent to control device 13. Control device 13 controls conveyor drive motors D1 to D4 based on the detection results of the boards by the plurality of board sensors, and moves the carry-in conveyor 6, work station conveyor 7L, work station conveyor 7R, and carry-out conveyor 8 to their respective set board stopping positions (positions where the boards are to be kept).

[0023] As described above, component mounting device M4 has an input conveyor 6 for transporting boards, work station conveyors 7L and 7R located downstream of input conveyor 6, and an output conveyor 8 located downstream of work station conveyors 7L and 7R. Each of input conveyor 6, work station conveyor 7L, work station conveyor 7R, and output conveyor 8 has a position where it can hold a board. In other words, component mounting device M4 has multiple stopping positions where it can hold a board.

[0024] In Figure 2, work stations [A1] and [A2] are set up on the work station conveyors 7L and 7R, where component mounting work is performed on the boards. At the work stations [A1] and [A2], board support units 10L and 10R are arranged below the work station conveyors 7L and 7R. The board support units 10L and 10R each have support pins 11 that are raised and lowered (arrow e) by an elevating mechanism 12. When a board is loaded onto the board support units 10L and 10R on the work station conveyors 7L and 7R, the board to be worked on is supported by the support pins 11 by driving the board support units 10L and 10R.

[0025] At each of the work stations [A1] and [A2], component mounting heads 9L and 9R are disposed above the work station conveyors 7L and 7R. The component mounting heads 9L and 9R are moved by a head movement mechanism (not shown) between the component supply units 3A and 3B and the boards positioned at the work stations [A1] and [A2]. This allows the component mounting work to be performed, in which components taken from the component supply units 3A and 3B are mounted on the boards positioned at the work stations [A1] and [A2].

[0026] In FIG. 2, board recognition cameras 14L and 14R are provided on the component mounting heads 9L and 9R, respectively, to capture images of the boards positioned at the work stations [A1] and [A2] from above. The board recognition cameras 14L and 14R move integrally with the component mounting heads 9L and 9R by a head movement mechanism. The board recognition cameras 14L and 14R capture images of marks (not shown) attached to the boards. The position of the positioned board is recognized from the image of the marks. The board recognition cameras 14L and 14R also capture images of codes (not shown), such as barcodes and two-dimensional codes, attached to the boards. The image of the code is transmitted to the control device 13, and identification information that identifies the board is recognized. In this way, the board recognition cameras 14L and 14R are imaging units that read the codes attached to the boards.

[0027] In Fig. 2, the control device 13 of the component mounting device M4 is connected to the control device 13 of the upstream component mounting device M3 via two signal lines E1 and E2. The control device 13 of the component mounting device M4 is also connected to the control device 13 of the downstream component mounting device M5 via two signal lines E3 and E4. More specifically, the signal line E1 of the component mounting device M4 is connected to the signal line E3 of the component mounting device M3 via connector C1. The signal line E2 of the component mounting device M4 is connected to the signal line E4 of the component mounting device M3 via connector C1. The signal line E3 of the component mounting device M4 is connected to the signal line E1 of the component mounting device M5 via connector C2. The signal line E4 of the component mounting device M4 is connected to the signal line E2 of the component mounting device M5 via connector C2.

[0028] In forward conveyance, in which a board is conveyed from upstream to downstream, signal line E1 transmits a signal indicating that a board can be loaded from component mounting device M4 to upstream component mounting device M3 (hereinafter simply referred to as a "loading possible signal"). In forward conveyance, signal line E2 transmits a signal indicating that a board can be loaded from upstream component mounting device M3 to component mounting device M4 (hereinafter simply referred to as a "loading possible signal"). In forward conveyance, signal line E3 transmits a loading possible signal from downstream component mounting device M5 to component mounting device M4 in forward conveyance. In forward conveyance, signal line E4 transmits a loading possible signal from component mounting device M4 to downstream component mounting device M5 in forward conveyance.

[0029] That is, signal lines E1 and E3 are first signal lines indicating that boards can be carried in from upstream. Furthermore, signal lines E2 and E4 are second signal lines indicating that boards can be carried out downstream. Component mounting device M4 has first signal lines (signal lines E1 and E3) and second signal lines (signal lines E2 and E4). Hereinafter, signal lines E1 and E3 will be referred to as first signal lines E1 and first signal lines E3. Furthermore, signal lines E2 and E4 will be referred to as second signal lines E2 and second signal lines E4.

[0030] Next, the configuration of the control system of component mounting devices M1 to M5 will be described with reference to Fig. 3. Component mounting devices M1 to M5 have the same configuration, and the following description will be given taking component mounting device M4 as an example. Component mounting device M4 is provided with a control device 13 that includes a board transport processing unit 15, a component mounting processing unit 16, a setting unit 17, a communication unit 18, a wireless communication unit 19, and a memory unit 20. Memory unit 20 is a storage device that stores mounting data 20a, history information 20b, number of conveyed sheets 20c, etc. Mounting data 20a includes information such as the type of component to be mounted on the board (component name), mounting position (XY coordinates), and the position of part feeder 4 that supplies the component.

[0031] The history information 20b stores the work history of component mounting work at the component mounting device M4, linked to the identification information of the board. The identification information of the board is acquired by the board recognition cameras 14L, 14R (imaging units) reading the code on the board. The history information 20b also stores information on components that require repair on boards that have been found to require repair in a subsequent process, linked to the identification information of the board. Information related to repair is transmitted from the management computer CP or a repair support device (not shown) that supports the repair work by the worker W, and is stored in the memory unit 20. In this way, the memory unit 20 stores the history information 20b of component mounting on boards.

[0032] 3, the communication unit 18 (first communication unit) transmits and receives various information to and from the management computer CP and the other component mounting devices M1 to M3 and M5 via the communication network NT. The communication unit 18 of the component mounting device M4 is connected to the communication unit 18 of the upstream component mounting device M3 via a first signal line E1 and a second signal line E2, and transmits and receives signals related to the transfer of the board. The communication unit 18 of the component mounting device M4 is connected to the communication unit 18 of the downstream component mounting device M5 via a first signal line E3 and a second signal line E4, and transmits and receives signals related to the transfer of the board. The wireless communication unit 19 (second communication unit) transmits and receives various information to and from the information terminal T carried by the worker W via wireless communication.

[0033] Substrate transport processing unit 15 controls conveyor drive motors D1-D4 and substrate receiving units 10L, 10R provided on substrate transport lines LA, LB (lane A, lane B), respectively, to cause the substrate transport unit to carry out substrate transport and positioning operations. Substrate transport processing unit 15 has first transport processing unit 15a and second transport processing unit 15b as internal processing functions. In the first transport mode, in which substrates are carried in from upstream, each unit of the substrate transport unit is controlled by first transport processing unit 15a. In the second transport mode, in which substrates are carried in from downstream, each unit of the substrate transport unit is controlled by second transport processing unit 15b.

[0034] 3, component placement processing unit 16 controls component supply units 3A and 3B and component placement heads 9L and 9R based on placement data 20a to perform a component placement operation to place components on a board. Component placement processing unit 16 also causes board recognition cameras 14L and 14R to read codes attached to the boards, acquire identification information, and store the information in history information 20b. For boards requiring repair, component placement processing unit 16 also performs a repair component placement operation to place only the components requiring repair on the boards based on the board identification information, information on the components requiring repair included in history information 20b, and the component placement positions included in placement data 20a.

[0035] The setting unit 17 sets the board transport method to either the first transport mode or the second transport mode based on information set on the operation mode setting screen displayed on the touch panels 5A and 5B, information transmitted from the upstream component mounting device M3 or the downstream component mounting device M5, the board stop position in the component mounting device M4, etc. In other words, the setting unit 17 sets the first transport mode or the second transport mode for each of the multiple transport lanes (board transport lines LA and LB).

[0036] Next, the operation mode setting screen 30 displayed on the touch panels 5A and 5B will be described with reference to Fig. 4. The operation mode setting screen 30 has a lane A information setting area 31, a lane B information setting area 32, and a start button 33. In the lane A information setting area 31, information about the operation mode of lane A (substrate transport line LA) is set. In the lane B information setting area 32, information about the operation mode of lane B (substrate transport line LB) is set.

[0037] Normal production mode selection radio buttons 31a, 32a, board reverse carry-in mode selection radio buttons 31b, 32b, and transport number input frames 31c, 32c are arranged in the lane A information setting area 31 and the lane B information setting area 32. When the normal production mode selection radio buttons 31a, 32a are selected, a normal production mode is set in which boards are carried in from upstream using the first transport mode and components are mounted. When the board reverse carry-in mode selection radio buttons 31b, 32b are selected, a board reverse carry-in mode is set in which boards are carried in from downstream using the second transport mode and repair operations and the like are performed.

[0038] In FIG. 4, when the board reverse carry-in mode is selected, the number of boards to be carried into the component mounting device can be input in the transport number input frames 31c, 32c. Furthermore, when the normal production mode is selected, the transport number input frames 31c, 32c are disabled for input. In the example of FIG. 4, lane A is set to carry three boards in the board reverse carry-in mode. Furthermore, lane B is set to produce mounted boards in the normal production mode. When start button 33 is operated, board transport operations and the like are started according to the information entered on operation mode setting screen 30. Furthermore, the number of boards to be carried set in the transport number input frames 31c, 32c is stored in memory unit 20 as transport number 20c.

[0039] Next, with reference to the process explanatory diagrams in FIGS. 5 to 9 and the flow charts in FIGS. 10 and 11, a component mounting method in component mounting system 1 including a first component mounting device and at least one second component mounting device provided downstream of the first component mounting device will be described. Here, an example will be described in which board transport work is started by operating start button 33 on operation mode setting screen 30 shown in FIG. 4 on touch panels 5A and 5B of component mounting device M4 (first component mounting device) of component mounting system 1 shown in FIG. 1. That is, an example will be described in which three boards to be repaired are carried into lane A of component mounting device M4 from downstream, and the setting is made to execute repair component mounting work. Meanwhile, mounted boards continue to be manufactured in lane B in the normal production mode. Hereinafter, a description of the operation of lane B will be omitted.

[0040] 5(a), it is assumed that only boards P1 and P2, on which components are being mounted by component mounting device M3, exist in lane A (board conveying line LA) of component mounting system 1. Board P1, on which components have been mounted by component mounting device M3, is conveyed forward to the carry-out conveyor 8 of component mounting device M3 in the first conveying mode. When board P1 has been conveyed to the carry-out conveyor 8, a carry-out enable signal is turned ON, which is transmitted from communication unit 18 of component mounting device M3 to communication unit 18 of component mounting device M4 via second signal lines E2 and E4.

[0041] Furthermore, the carry-in conveyor 6 of the component mounting device M4 is empty, and the carry-in ready signal, which is transmitted from the communication unit 18 of the component mounting device M4 to the communication unit 18 of the component mounting device M3 via the first signal lines E1 and E3, is ON. In other words, the upstream component mounting device M3 is ready to transport the board P1 to the component mounting device M4. Therefore, the first transport processing unit 15a drives the conveyor drive motor D1 of the component mounting device M4 in the forward direction. As a result, the board P1 is transported forward onto the carry-in conveyor 6 of the component mounting device M4 in the first transport mode, and the carry-in ready signal, which is transmitted from the component mounting device M4 to the component mounting device M3 via the first signal lines E1 and E3, is turned OFF.

[0042] In Figures 5(b) and 5(c), board P1 loaded into component mounting device M4 is conveyed in order by the loading conveyor 6, work station conveyor 7L, and work station conveyor 7R (arrow f1) to the work station [A2]. Board P1 transported to work station [A2] is supported by board support unit 10R (arrow f3), and components are mounted on it. The next board P2 is loaded from component mounting device M3 into component mounting device M4, and is conveyed in order by the loading conveyor 6 and work station conveyor 7L (arrows f2 and f4) to the work station [A1]. When the unloading conveyor 8 of component mounting device M3 becomes empty, the unloading enable signal transmitted from component mounting device M3 to component mounting device M4 via second signal lines E2 and E4 is turned OFF.

[0043] In Fig. 5(c), when the carry-in conveyor 6 of component mounting device M4 becomes empty, the carry-in ready signal transmitted from component mounting device M4 to component mounting device M3 via first signal lines E1 and E3 turns ON. Also, the carry-out conveyor 8 of component mounting device M4 is empty, and the carry-out ready signal transmitted from communication unit 18 of component mounting device M4 to communication unit 18 of downstream component mounting device M5 via second signal lines E2 and E4 turns OFF. In Figs. 5(a) to 5(d), the carry-in conveyor 6 of component mounting device M5 is empty, and the carry-in ready signal transmitted from communication unit 18 of component mounting device M5 to communication unit 18 of component mounting device M4 via first signal lines E1 and E3 turns ON.

[0044] In Fig. 5(d), after the board P1 on which components have been mounted is released from the support by board support unit 10R (arrow f5), it is transported in sequence by work station conveyor 7R and carry-out conveyor 8 to carry-out conveyor 8 (arrow f6). When board P1 is transported to the carry-out conveyor 8 of component mounting device M4, the carry-out enable signal transmitted from component mounting device M4 to component mounting device M5 via second signal lines E2 and E4 turns ON (see also Fig. 6(a)). Furthermore, board P2 transported to work station [A1] is supported from below by board support unit 10L (arrow f7), and components are mounted on it.

[0045] During this process, it is assumed that the start button 33 on the operation mode setting screen 30 shown in FIG. 4 is operated by the operator W, and the board reverse transport mode is set for lane A of the component mounting device M4. That is, it is assumed that the setting unit 17 of the component mounting device M4 (first component mounting device) accepts the setting of the second transport mode as the transport method (ST1 in FIG. 10). Because boards P1 and P2 are present inside the component mounting device M4, the setting unit 17 maintains the first transport mode as the transport method. Hereinafter, this state is referred to as the "reverse transport reservation" state. Furthermore, 3 boards is stored in the transport number 20c of the component mounting device M4.

[0046] 5(d), the setting unit 17 then turns on a signal indicating that boards cannot be carried in (hereinafter simply referred to as a "carry-in disabled signal"), which is transmitted from the communication unit 18 of the component mounting device M4 to the communication unit 18 of the component mounting device M3 via the first signal lines E1 and E3. That is, upon receiving a transition to the second transport mode (after ST1), the setting unit 17 of the component mounting device M4 (first component mounting device) sets the component mounting device M4 to inhibit the carrying of boards from upstream into the component mounting device M4 (ST2 in FIG. 10).

[0047] In Figures 6(b) and 6(c), the board P1 that is transported into the downstream component mounting device M5 has components mounted at the work station [A2], and then is transported forward to the output conveyor 8 in the first transport mode (arrow g1), and then is transported downstream from the component mounting device M5 (arrow g2).

[0048] In Fig. 6(c), next, board P2 is conveyed sequentially from component mounting device M4 to the carry-in conveyor 6 of component mounting device M5 (arrow g3). As a result, all boards P1 and P2 are conveyed downstream from component mounting device M4 (ST3 in Fig. 10). After receiving a request to switch to the second conveyance mode (after ST1), setting unit 17 of component mounting device M4 switches the conveyance method to the second conveyance mode (ST4 in Fig. 10) when all boards P1 and P2 in the device are conveyed downstream in the first conveyance mode (ST3).

[0049] Next, the setting unit 17 of the component mounting device M4 (first component mounting device) transmits information to the downstream component mounting device M5 (second component mounting device) via the communication unit 18 (first communication unit) that the transport method is set to the second transport mode and that the number of boards to be transported in the reverse direction (the number of transported boards) is three (ST5 in FIG. 10). That is, when the setting unit 17 of the component mounting device M4 (first component mounting device) switches the transport method to the second transport mode (ST4), the communication unit 18 (first communication unit) of the component mounting device M4 transmits information requesting a switch to the second transport mode to the component mounting device M5 (second component mounting device) (ST5).

[0050] 6(c), the setting unit 17 of the component mounting device M4 then turns on the carry-in possible signal transmitted from the component mounting device M4 to the component mounting device M5 via the second signal lines E2 and E4. That is, the second signal lines E2 and E4, which indicate that the board can be carried out downstream in the first transport mode (carry-out possible signal), indicate that the board can be carried in from downstream in the second transport mode (carry-in possible signal).

[0051] The setting unit 17 of the component mounting device M5, which has received the information from the component mounting device M4, places the component mounting device M5 in a reverse transport reservation state and stores three boards in the transport number 20c of the memory unit 20 (ST6 in FIG. 10). Next, the setting unit 17 of the component mounting device M5 turns on the carry-in prohibition signal transmitted from the component mounting device M5 to the component mounting device M4 via the first signal lines E1 and E3. That is, upon receiving the transition to the second transport mode (after ST6), the setting unit 17 of the component mounting device M5 sets the component mounting device M5 to prohibit the carrying-in of boards from upstream to the component mounting device M5 (ST7 in FIG. 10).

[0052] In FIG. 6(d), board P2 is carried into downstream component mounting device M5, and after components are mounted at work station [A1], it is conveyed forward to conveyor 8 in the first conveyance mode (arrow g4).

[0053] 7(a), thereafter, board P2 is transported downstream from component mounting device M5 in the first transport mode (arrow h1). When all boards P1 and P2 inside component mounting device M5 have been transported downstream (ST8 in FIG. 10), setting unit 17 of component mounting device M5 switches the transport method to the second transport mode (ST9 in FIG. 10). Furthermore, if another component mounting device (second component mounting device) is connected downstream of component mounting device M5, setting unit 17 of component mounting device M5 transmits information via communication unit 18 (first communication unit) to the downstream component mounting device (second component mounting device) that the transport method will be set to the second transport mode and that the number of boards to be transported in the reverse direction (number of boards to be transported) is three.

[0054] In this way, in the component mounting method of this embodiment, the setting unit 17 of the first component mounting device (component mounting device M4) accepts the setting of the second transport mode as the transport method (ST1), and when the setting unit 17 of the first component mounting device switches the transport method to the second transport mode (ST4), the setting unit 17 of the downstream second component mounting device (component mounting device M5) switches the transport method to the second transport mode (ST9).

[0055] Next, the wireless communication unit 19 (second communication unit) of component mounting device M5 wirelessly notifies the information terminal T used by the worker W that it is possible to carry in boards from downstream of component mounting device M5 (ST10 in FIG. 10). That is, when the setting unit 17 of the second component mounting device (component mounting device M5) at the most downstream position in component mounting system 1 switches the transport method to the second transport mode, the second communication unit (wireless communication unit 19) of the second component mounting device at the most downstream position notifies the information terminal T used by the worker W that it is possible to carry in three boards from downstream of the second component mounting device at the most downstream position into lane A.

[0056] In FIGS. 7(b) and 7(c), upon receiving the notification, worker W sequentially loads three boards P3, P4, and P5, which are set to a conveyance number of 20c, from downstream of component mounting device M5 (arrow h2) (ST11 in FIG. 11). For example, if a connecting conveyor is connected downstream of component mounting device M5, worker W loads the boards P3, P4, and P5 to be repaired from the connecting conveyor. The boards P3, P4, and P5 loaded into lane A of component mounting device M5 are transported in reverse order within component mounting device M5 in the second transport mode (arrows h3, h4, and h5). That is, second transport processing unit 15b drives conveyor drive motors D1 to D4 in the reverse direction. Note that component mounting operations for boards P3, P4, and P5 are not performed at work stations [A1] and [A2] of component mounting device M5.

[0057] 7(c), when board P3 is transported back to the carry-in conveyor 6, the setting unit 17 turns on the carry-out possible signal transmitted from component mounting device M5 to component mounting device M4 via the first signal lines E1 and E3. That is, the first signal lines E1 and E3, which indicate that boards can be carried in from upstream (carry-in possible signal) in the first transport mode, indicate that boards can be carried out upstream (carry-out possible signal) in the second transport mode.

[0058] 7(d), when board P3 is transported in the second transport mode from component mounting device M5 to component mounting device M4 (arrow h6), the carry-in enable signal transmitted from component mounting device M4 to component mounting device M5 via second signal lines E2 and E4 turns OFF. The carry-out enable signal transmitted from component mounting device M5 to component mounting device M4 via first signal lines E1 and E3 also turns OFF. Subsequently, boards P4 and P5 are transported in the second transport mode in order from component mounting device M5 to component mounting device M4.

[0059] In FIG. 8(a), when board P5 is transported backward from component mounting device M5 to component mounting device M4, the transport of three boards P3, P4, and P5 stored in the upstream transport count 20c in the second transport mode is completed (ST12 in FIG. 11). When the transport of all boards P3, P4, and P5 is completed (ST12), setting unit 17 of component mounting device M5 (second component mounting device) switches the transport mode to the first transport mode (ST13 in FIG. 11). When the mode is switched to the first transport mode, the restriction on the transport of boards from upstream to component mounting device M5 is lifted (ST14 in FIG. 11). As a result, since the transport conveyor 6 of component mounting device M5 is empty, the transport enable signal transmitted from component mounting device M5 to component mounting device M4 via first signal lines E1 and E3 is turned ON.

[0060] In Fig. 8(a), boards P3, P4, and P5, which have been transported in reverse from component mounting device M5 in the second transport mode, are transported in reverse within component mounting device M4 to a position (stop position) that has been preset in the second transport mode to hold the boards (ST15 in Fig. 11). The stop position to which the boards are transported in reverse is determined according to the number stored in transport number 20c. For example, if transport number 20c is three, board P3 is transported in reverse to the stop position of input conveyor 6 (arrow i1), board P4 is transported in reverse to the stop position of work station conveyor 7L (arrow i2), and board P5 is transported in reverse to the stop position of work station conveyor 7R (arrow i3).

[0061] When the number of substrates to be transported 20c is two, the substrates are transported back to the stop positions of the work station conveyors 7L and 7R. When the number of substrates to be transported 20c is one, the substrates are transported back to the stop position of the work station conveyor 7R. That is, the substrates are transported back to the stop positions of the input conveyor 6 or the work station conveyors 7L and 7R in the second transport mode according to the number set by the number of substrates to be transported 20c.

[0062] In Fig. 8(b), when the transfer of boards P3, P4, and P5 into component mounting device M4 in the second transfer mode is completed and boards P3, P4, and P5 are transferred to their predetermined positions, setting unit 17 of component mounting device M4 (first component mounting device) switches the transfer method to the first transfer mode (ST16 in Fig. 11). When the transfer mode is switched to the first transfer mode, the restriction on the transfer of boards from upstream to component mounting device M4 is lifted (ST17 in Fig. 11). As a result, when the transfer conveyor 6 of component mounting device M4 becomes empty, the transfer enable signal transmitted from component mounting device M4 to component mounting device M3 via first signal lines E1 and E3 is turned ON (see, for example, Figs. 8(d) and 9(a)).

[0063] Board P5 transported to work station [A2] is supported by board support unit 10R (arrow i4), and repair component mounting work is performed. Also, board P4 transported to work station [A1] is supported by board support unit 10L (arrow i5), and repair component mounting work is performed. In the repair component mounting work, board recognition cameras 14L, 14R read the codes attached to boards P4, P5, and the obtained identification information is compared with history information 20b to identify boards P4, P5 (ST18 in FIG. 11).

[0064] That is, the component mounting device M4 (first component mounting device) identifies the boards P4 and P5 carried in in the second transport mode by comparing the identification information obtained by reading the code with the history information 20b. Thereafter, the component mounting processing unit 16 executes a repair component mounting operation to mount the components to be repaired on the boards P4 and P5 based on the mounting data 20a and the history information 20b (ST19 in FIG. 11).

[0065] In Figures 8(c), 8(d), and 9(a), after the repair component mounting work has been completed, the boards P4 and P5 are released from the support by the board support portions 10L and 10R (arrows i6 and i8), and then transported sequentially to the component mounting device M5 in the first transport mode (arrows i7, i9, i10, and j1).

[0066] 8(d), 9(a), and 9(b), board P3 is transported back to work station [A2] (arrow i11), supported by board support unit 10R (arrow i12), and undergoes repair component mounting. After completing the repair component mounting operation, board P3 is released from support by board support unit 10R (arrow j2) and then transported forward to component mounting device M5 in the first transport mode (arrow j3). As a result, boards P3, P4, and P5 transported into component mounting device M4 in the second transport mode are all transported to downstream component mounting device M5 after the repair component mounting operation (ST20 in FIG. 11).

[0067] 9(b), boards P3, P4, and P5 that have been carried into component mounting device M5 are all carried out downstream without undergoing component mounting work at component mounting device M5 (ST21 in FIG. 11). In normal production mode, board P6 is transported from upstream component mounting device M3 to component mounting device M4 (arrow j4), and component mounting work is performed at work station [A2].

[0068] As described above, component mounting system 1 of this embodiment includes a first component mounting device (component mounting device M4) that mounts components on a board, and at least one second component mounting device (component mounting device M5) located downstream of the first component mounting device. Each of the first and second component mounting devices has a setting unit 17 that sets the board transport method to either a first transport mode in which the board is transported from upstream or a second transport mode in which the board is transported from downstream. When setting unit 17 of the first component mounting device sets the transport method of the first component mounting device to the second transport mode (ST4), setting unit 17 of the second component mounting device sets the transport method of the second component mounting device to the second transport mode (ST9).

[0069] In this way, the operator W only needs to set the first component mounting apparatus (component mounting apparatus M4) that reversely carries in the board. This makes it easy to set the reverse transport of the board from downstream. Furthermore, there is no need to set the second component mounting apparatus (component mounting apparatus M5) downstream. This prevents the operator from setting the second component mounting apparatus downstream incorrectly. Furthermore, by interconnecting the component mounting apparatuses M1 to M5 in this embodiment, it is easy to set the reverse transport of the board from downstream without the intervention of the control computer CP. [Industrial Applicability]

[0070] The component mounting system, component mounting device, and component mounting method of the present invention have the effect of easily setting up reverse transport of a board from downstream, and are useful in the field of mounting components onto a board. [Explanation of symbols]

[0071] 1. Component mounting system 6. Intake conveyor 7L, 7R Work Station Conveyor 8. Discharge conveyor 14L, 14R Board recognition camera (imaging unit) E1,E3 1st signal line E2,E4 Second signal line LA,LB Substrate transport line (transport lane) M1~M3 component placement device M4 component placement device (first component placement device) M5 component placement device (second component placement device) P1~P6 board

Claims

1. a first component mounting device that mounts components on a board; at least one second component mounting device provided downstream of the first component mounting device; the first component mounting device and the second component mounting device each have a setting unit that sets, as a transport method for the board, either a first transport mode in which the board is transported from upstream or a second transport mode in which the board is transported from downstream; A component mounting system, wherein when the setting unit of the first component mounting device sets the transport method of the first component mounting device to the second transport mode, the setting unit of the second component mounting device sets the transport method of the second component mounting device to the second transport mode.

2. the first component mounting device has a first communication unit, 2. The component mounting system of claim 1, wherein when the setting unit of the first component mounting device transitions the transport method to the second transport mode, the first communication unit transmits information requesting transition to the second transport mode to the second component mounting device.

3. the first component mounting device and the second component mounting device each have a first signal line indicating that the board can be carried in from upstream and a second signal line indicating that the board can be carried out downstream in the first transport mode; 3. The component mounting system according to claim 1, wherein in the second transport mode, the second signal line is used to indicate that the substrate can be loaded from downstream, and the first signal line is used to indicate that the substrate can be unloaded upstream.

4. 4. The component mounting system according to claim 1, wherein the setting unit, after accepting a transition to the second transport mode, transitions the transport method to the second transport mode when all of the substrates in the device have been transported downstream in the first transport mode.

5. 5. A component mounting system according to claim 1, wherein the setting unit of the first component mounting device is configured to prevent the substrate from being transported from upstream to the first component mounting device when it receives a transition to the second transport mode.

6. the second component mounting device has a second communication unit, the component mounting system includes a plurality of the second component mounting devices, 6. A component mounting system as described in any one of claims 1 to 5, wherein when the setting unit of the second component mounting device that is the most downstream among the plurality of second component mounting devices transitions the transport method to the second transport mode, the second communication unit of the most downstream second component mounting device notifies an information terminal used by an operator that the board can be transported from downstream of the most downstream second component mounting device.

7. 7. The component mounting system according to claim 1, wherein the setting unit of the first component mounting device transitions the transport method to the first transport mode when the board has been transported into the first component mounting device in the second transport mode.

8. 8. The component mounting system according to claim 1, wherein the setting unit of the second component mounting device transitions the transport method to the first transport mode when the transport of the substrate upstream in the second transport mode is completed.

9. the first component placement device has a plurality of positions for retaining the board; 9. A component mounting system according to claim 1, wherein the setting unit of the first component mounting device transitions the transport method to the first transport mode when a set number of the substrates are transported to the position in the second transport mode.

10. the first component mounting device has an input conveyor for transporting the board, a work station conveyor located downstream of the input conveyor, and an output conveyor located downstream of the work station conveyor, 10. The component mounting system according to claim 9, wherein the boards are transported to the carry-in conveyor or the work station conveyor in the second transport mode according to the set number of boards.

11. the first component mounting device, an imaging unit that reads the code attached to the board; and a storage unit that stores history information of component mounting on the board; 11. The component mounting system according to claim 1, wherein the substrate carried in in the second transport mode is identified by comparing identification information obtained by reading the code with the history information.

12. the first component mounting device and the second component mounting device have a plurality of transport lanes arranged in parallel for transporting the board; The component mounting system according to claim 1 , wherein the setting unit sets each of the plurality of transportation lanes to the first transportation mode or the second transportation mode.

13. A component mounting apparatus that is used in conjunction with other components and performs the task of mounting components on a board carried in from an upstream or downstream side, a setting unit that sets, as a transport method for the substrate, either a first transport mode in which the substrate is transported from upstream or a second transport mode in which the substrate is transported from downstream; When the setting unit of a component mounting device connected upstream transitions the conveying method to the second conveying mode, the setting unit of a component mounting device connected downstream transitions the conveying method to the second conveying mode.

14. A component mounting method in a component mounting system including a first component mounting device that mounts components on a board, and at least one second component mounting device provided downstream of the first component mounting device, comprising: the first component mounting device and the second component mounting device each have a setting unit that sets, as a transport method for the board, either a first transport mode in which the board is transported from upstream or a second transport mode in which the board is transported from downstream; the setting unit of the first component mounting device accepts a setting of the second transport mode as the transport method; When the setting unit of the first component mounting device shifts the conveying method to the second conveying mode, The component mounting method, wherein the setting unit of the second component mounting device switches the transport mode to the second transport mode.

Images