Multilayer ceramic capacitors

Abstract

The present invention provides a multilayer ceramic capacitor which is capable of suppressing the occurrence of electrochemical migration.　A multilayer ceramic capacitor 1 according to one embodiment of the present invention has a hydrophilic part 80 and a hydrophobic part 70 in the surface of a multilayer body 10; the hydrophilic part 80 comprises a first main surface-side hydrophilic part 81 that has a hydroxyl group, a second main surface-side hydrophilic part 82 that has a hydroxyl group, a first lateral surface-side hydrophilic part 83 that has a hydroxyl group, and a second lateral surface-side hydrophilic part 84 that has a hydroxyl group; and the hydrophobic part 70 comprises a first main surface-side hydrophobic part 71 that contains at least one of fluorine and a silicone, a second main surface-side hydrophobic part 72 that contains at least one of fluorine and a silicone, a first lateral surface-side hydrophobic part 73 that contains at least one of fluorine and a silicone, and a second lateral surface-side hydrophobic part 74 that contains at least one of fluorine and a silicone.

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic capacitor. [Background technology]

[0002] In recent years, electronic devices such as mobile phones and portable music players have become smaller and thinner. Accordingly, there is a demand for smaller electronic components built into these devices. Furthermore, the environments in which such electronic devices are used are becoming more diverse, and there is a demand for electronic components with improved reliability in these diverse environments.

[0003] Against this background, electronic components having a pair of external electrodes have been plagued by the problem of electrochemical migration. Specifically, condensation occurs on the surface of electronic components due to differences in temperature or heat capacity between the electronic component and the ambient air. The resulting water droplets form a water film on the surface of the electronic component that connects the external electrodes. When a voltage is applied between the external electrodes of the electronic component in this state, ionized metal species from the external electrodes dissolve and precipitate in the water film, resulting in electrochemical migration.

[0004] One method for solving electrochemical migration is to form a silane coupling treatment film on the surface of electronic components using a silane coupling treatment. In order to achieve high water repellency using this silane coupling agent, it is possible to lengthen the linear chain of the silane coupling agent. However, if the linear chain of the silane coupling agent is lengthened, the steric hindrance caused by this linear chain increases, and the spacing between the silane coupling agents arranged on the surface of the electronic components increases, resulting in a decrease in their density. As a result, the condensation suppression effect becomes insufficient, and condensation occurs on the surface of the electronic components between the silane coupling agents, resulting in electrochemical migration due to the above-mentioned process.

[0005] Therefore, Patent Document 1 proposes a method of suppressing the above-mentioned ion migration using a perfluoroalkylalkylsilane-based water-repellent treatment agent, i.e., a silane coupling agent having F (fluorine) as a functional group. By using this treatment agent to form a water-repellent film on the surface of ceramic electronic components, continuous condensation is suppressed and the occurrence of electrochemical migration is prevented. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2002 / 082480 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in ceramic electronic components, the method described in Patent Document 1 does not sufficiently suppress electrochemical migration. That is, when a silane coupling agent having F as a functional group is used, the steric hindrance caused by the linear chain of the silane coupling agent can be reduced and higher water repellency can be achieved, but the density is not sufficient.

[0008] Furthermore, in Patent Document 1, only the water-repellent treatment is performed by adding a water-repellent agent, and the parts to which the water-repellent agent has not been added are not subjected to a hydrophilic treatment. Therefore, the difference in the water contact angle between the parts to which the water-repellent agent has been added and the parts to which the water-repellent agent has not been added is small, and there are cases in which the water-repellent effect is not sufficiently obtained.

[0009] An object of the present invention is to provide a multilayer ceramic capacitor that can suppress the occurrence of electrochemical migration. [Means for solving the problem]

[0010] The multilayer ceramic capacitor according to the present invention is a multilayer ceramic capacitor comprising: a laminate including a plurality of laminated dielectric layers, the laminate having a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction and the width direction; first internal electrode layers arranged on the plurality of dielectric layers and exposed at the first end surface; second internal electrode layers arranged on the plurality of dielectric layers and exposed at the second end surface; a first external electrode arranged on the first end surface; and a second external electrode arranged on the second end surface, wherein a hydrophilic portion and a hydrophobic portion are arranged on a surface of the laminate, the hydrophilic portion being arranged on at least a part of the first main surface and having a hydroxyl group. The hydrophobic portion has a first main surface-side hydrophilic portion, a second main surface-side hydrophilic portion that is arranged on at least a portion of the second main surface and has a hydroxyl group, a first side surface-side hydrophilic portion that is arranged on at least a portion of the first side surface and has a hydroxyl group, and a second side surface-side hydrophilic portion that is arranged on at least a portion of the second side surface and has a hydroxyl group, and the hydrophobic portion has a first main surface-side hydrophobic portion that is arranged on at least a portion of the first main surface and contains fluorine or silicone, a second main surface-side hydrophobic portion that is arranged on at least a portion of the second main surface and contains fluorine or silicone, a first side surface-side hydrophobic portion that is arranged on at least a portion of the first side surface and contains fluorine or silicone, and a second side surface-side hydrophobic portion that is arranged on at least a portion of the second side surface and contains fluorine or silicone. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a multilayer ceramic capacitor that can suppress the occurrence of electrochemical migration. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is an external perspective view of the multilayer ceramic capacitor according to the first embodiment. [Figure 2] 2 is a cross-sectional view taken along line II-II of the multilayer ceramic capacitor shown in FIG. [Figure 3] 3 is a cross-sectional view taken along line III-III of the multilayer ceramic capacitor shown in FIG. 2. [Figure 4A] 3 is a cross-sectional view taken along line IVA-IVA of the multilayer ceramic capacitor shown in FIG. 2. [Figure 4B] 4 is a cross-sectional view taken along line IVB-IVB of the multilayer ceramic capacitor shown in FIG. 2. [Figure 5] 3 is a cross-sectional view taken along line VV of the multilayer ceramic capacitor shown in FIG. 2. [Figure 6] 6 is a cross-sectional view taken along line VI-VI of the multilayer ceramic capacitor shown in FIG. [Figure 7] 7 is an arrow view of the multilayer ceramic capacitor shown in FIG. 1 when viewed from the first main surface side along the direction of arrow VII. [Figure 8A] FIG. 1 is a diagram showing a multilayer ceramic capacitor with a double structure. [Figure 8B] FIG. 1 is a diagram showing a multilayer ceramic capacitor with a triple structure. [Figure 8C] FIG. 1 is a diagram showing a multilayer ceramic capacitor with a four-element structure. [Figure 9] FIG. 8 is a diagram showing a multilayer ceramic capacitor according to a second embodiment, and corresponds to FIG. 7. [Figure 10] 1. FIG. 4 is a diagram showing a multilayer ceramic capacitor according to a second embodiment, and is an arrow diagram when a second main surface side is viewed along the direction of arrow X shown in FIG. [Figure 11] FIG. 8 is a diagram showing a multilayer ceramic capacitor according to a third embodiment, and corresponds to FIG. 7. [Figure 12] FIG. 8 is a diagram showing a multilayer ceramic capacitor according to a fourth embodiment, and corresponds to FIG. 7. [Figure 13] 13 is a virtual arrow diagram of the multilayer ceramic capacitor shown in FIG. 12 when viewed from the second end face side along the direction of arrow XIII. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, a multilayer ceramic capacitor 1 according to a first embodiment of the present disclosure will be described. Fig. 1 is an external perspective view of the multilayer ceramic capacitor 1 of this embodiment. Fig. 2 is a cross-sectional view taken along line II-II of the multilayer ceramic capacitor 1 of Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III of the multilayer ceramic capacitor 1 of Fig. 2. Fig. 4A is a cross-sectional view taken along line IVA-IVA of the multilayer ceramic capacitor 1 of Fig. 2. Fig. 4B is a cross-sectional view taken along line IVB-IVB of the multilayer ceramic capacitor 1 of Fig. 2.

[0014] The multilayer ceramic capacitor 1 includes a laminate 10 and external electrodes 40.

[0015] 1 to 4B show an XYZ Cartesian coordinate system. The length direction L of the multilayer ceramic capacitor 1 and the laminate 10 corresponds to the X direction. The width direction W of the multilayer ceramic capacitor 1 and the laminate 10 corresponds to the Y direction. The height direction T of the multilayer ceramic capacitor 1 and the laminate 10 corresponds to the Z direction. Here, the cross section shown in FIG. 2 is also referred to as an LT cross section. The cross section shown in FIG. 3 is also referred to as a WT cross section. The cross sections shown in FIGS. 4A and 4B are also referred to as LW cross sections.

[0016] As shown in Figures 1 to 4B, the laminate 10 includes a first main surface TS1 and a second main surface TS2 that face each other in a height direction T, a first side surface WS1 and a second side surface WS2 that face each other in a width direction W that is perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 that face each other in a length direction L that is perpendicular to the height direction T and the width direction W.

[0017] As shown in FIG. 1, the laminate 10 has a substantially rectangular parallelepiped shape. The dimension of the laminate 10 in the length direction L is not necessarily longer than the dimension in the width direction W. The corners and ridges of the laminate 10 are preferably rounded. A corner is a portion where three surfaces of the laminate intersect, and a ridge is a portion where two surfaces of the laminate intersect. Incidentally, some or all of the surfaces constituting the laminate 10 may be formed with irregularities. Furthermore, a hydrophilic portion 80 and a hydrophobic portion 70 are disposed on the surface of the laminate 10. The hydrophilic portion 80 and the hydrophobic portion 70 will be described later. The surface of the laminate 10 is formed by a first main surface TS1, a second main surface TS2, a first side surface WS1, a second side surface WS2, a first end surface LS1, and a second end surface LS2.

[0018] As shown in Figures 2 and 3, the laminate 10 has an inner layer portion 11, and a first main surface side outer layer portion 12 and a second main surface side outer layer portion 13 arranged to sandwich the inner layer portion 11 in the height direction T.

[0019] The inner layer portion 11 includes a plurality of dielectric layers 20 and a plurality of internal electrode layers 30. In the height direction T, the inner layer portion 11 includes the inner electrode layer 30 located closest to the first principal surface TS1 to the inner electrode layer 30 located closest to the second principal surface TS2. In the inner layer portion 11, the plurality of internal electrode layers 30 are arranged opposite each other with the dielectric layer 20 interposed therebetween. The inner layer portion 11 is a portion that generates electrostatic capacitance and essentially functions as a capacitor.

[0020] The plurality of dielectric layers 20 are made of a dielectric material. The dielectric material may be, for example, a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. The dielectric material may also be a material containing these main components plus a secondary component such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound. It is particularly preferable that the dielectric material contain BaTiO3 as the main component.

[0021] The thickness of the dielectric layer 20 is preferably 0.5 μm or more and 10 μm or less. The number of laminated dielectric layers 20 is preferably 15 or more and 1200 or less. Note that this number of dielectric layers 20 is the total number of the dielectric layers in the inner layer portion 11 and the dielectric layers in the first main surface side outer layer portion 12 and the second main surface side outer layer portion 13.

[0022] The multiple internal electrode layers 30 include multiple first internal electrode layers 31 and multiple second internal electrode layers 32. The multiple first internal electrode layers 31 are arranged on the multiple dielectric layers 20. The multiple second internal electrode layers 32 are arranged on the multiple dielectric layers 20. The multiple first internal electrode layers 31 and the multiple second internal electrode layers 32 are arranged alternately in the height direction T of the laminate 10, with the dielectric layers 20 interposed between them. The first internal electrode layers 31 and the second internal electrode layers 32 are arranged so as to sandwich the dielectric layers 20 therebetween.

[0023] The first internal electrode layer 31 has a first opposing portion 31A opposing the second internal electrode layer 32, and a first lead portion 31B led from the first opposing portion 31A to the first end face LS1. The first lead portion 31B is exposed at the first end face LS1.

[0024] The second internal electrode layer 32 has a second opposing portion 32A opposing the first internal electrode layer 31, and a second lead portion 32B led from the second opposing portion 32A to the second end face LS2. The second lead portion 32B is exposed at the second end face LS2.

[0025] In this embodiment, the first opposing portion 31A and the second opposing portion 32A face each other via the dielectric layer 20, thereby forming capacitance and exhibiting the characteristics of a capacitor.

[0026] The shapes of the first opposing portion 31A and the second opposing portion 32A are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded or the corners of the rectangular shape may be formed at an angle. The shapes of the first drawer portion 31B and the second drawer portion 32B are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded or the corners of the rectangular shape may be formed at an angle.

[0027] The width direction W dimension of the first facing portion 31A and the width direction W dimension of the first lead portion 31B may be the same dimension, or one of the dimensions may be smaller. The width direction W dimension of the second facing portion 32A and the width direction W dimension of the second lead portion 32B may be the same dimension, or one of the dimensions may be smaller.

[0028] The first internal electrode layer 31 and the second internal electrode layer 32 are made of an appropriate conductive material, such as a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy containing at least one of these metals. When an alloy is used, the first internal electrode layer 31 and the second internal electrode layer 32 may be made of, for example, an Ag-Pd alloy.

[0029] The thickness of each of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably, for example, about 0.2 μm or more and 2.0 μm or less. The total number of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably 15 or more and 1000 or less.

[0030] The first main surface side outer layer portion 12 is located on the first main surface TS1 side of the laminate 10. The first main surface side outer layer portion 12 is an assembly of multiple dielectric layers 20 located between the first main surface TS1 and the internal electrode layer 30 closest to the first main surface TS1. The dielectric layers 20 used in the first main surface side outer layer portion 12 may be the same as the dielectric layers 20 used in the internal layer portion 11.

[0031] The second main surface side outer layer portion 13 is located on the second main surface TS2 side of the laminate 10. The second main surface side outer layer portion 13 is an assembly of multiple dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 closest to the second main surface TS2. The dielectric layers 20 used in the second main surface side outer layer portion 13 may be the same as the dielectric layers 20 used in the internal layer portion 11.

[0032] In this way, the laminate 10 has a plurality of laminated dielectric layers 20 and a plurality of internal electrode layers 30 laminated on the dielectric layers 20. In other words, the multilayer ceramic capacitor 1 has a laminate 10 in which the dielectric layers 20 and the internal electrode layers 30 are alternately laminated.

[0033] The laminate 10 has a counter electrode portion 11E. The counter electrode portion 11E is a portion where the first counter portion 31A of the first internal electrode layer 31 and the second counter portion 32A of the second internal electrode layer 32 face each other. The counter electrode portion 11E is configured as a part of the inner layer portion 11. FIGS. 4A and 4B show the ranges of the counter electrode portion 11E in the width direction W and length direction L. The counter electrode portion 11E is also referred to as the effective portion of the capacitor.

[0034] The laminate 10 has side surface outer layer portions. The side surface outer layer portions include a first side surface outer layer portion WG1 and a second side surface outer layer portion WG2. The first side surface outer layer portion WG1 is a portion including the dielectric layer 20 located between the counter electrode portion 11E and the first side surface WS1. The second side surface outer layer portion WG2 is a portion including the dielectric layer 20 located between the counter electrode portion 11E and the second side surface WS2. Figures 3, 4A, and 4B show the ranges in the width direction W of the first side surface outer layer portion WG1 and the second side surface outer layer portion WG2. The side surface outer layer portions are also referred to as W gaps or side gaps.

[0035] The laminate 10 has end surface side outer layer portions. The end surface side outer layer portions include a first end surface side outer layer portion LG1 and a second end surface side outer layer portion LG2. The first end surface side outer layer portion LG1 is a portion including the dielectric layer 20 located between the counter electrode portion 11E and the first end surface LS1. The second end surface side outer layer portion LG2 is a portion including the dielectric layer 20 located between the counter electrode portion 11E and the second end surface LS2. Figures 2, 4A, and 4B show the ranges in the length direction L of the first end surface side outer layer portion LG1 and the second end surface side outer layer portion LG2. The end surface side outer layer portions are also referred to as L gaps or end gaps.

[0036] The external electrode 40 has a first external electrode 40A arranged on the first end face LS1 side and a second external electrode 40B arranged on the second end face LS2 side.

[0037] The first external electrode 40A is disposed on the first end face LS1. The first external electrode 40A is connected to the first internal electrode layer 31. The first external electrode 40A may also be disposed on a portion of the first main surface TS1 and a portion of the second main surface TS2, as well as a portion of the first side surface WS1 and a portion of the second side surface WS2. In this embodiment, the first external electrode 40A is formed to extend from the first end face LS1 to a portion of the first main surface TS1 and a portion of the second main surface TS2, as well as a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0038] The second external electrode 40B is disposed on the second end face LS2. The second external electrode 40B is connected to the second internal electrode layer 32. The second external electrode 40B may also be disposed on a portion of the first main surface TS1 and a portion of the second main surface TS2, as well as a portion of the first side surface WS1 and a portion of the second side surface WS2. In this embodiment, the second external electrode 40B is formed to extend from the second end face LS2 to a portion of the first main surface TS1 and a portion of the second main surface TS2, as well as a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0039] As described above, in the laminate 10, the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 face each other via the dielectric layer 20, thereby forming a capacitance. Therefore, the characteristics of a capacitor are exhibited between the first external electrode 40A connected to the first internal electrode layer 31 and the second external electrode 40B connected to the second internal electrode layer 32.

[0040] The first external electrode 40A has a first base electrode layer 50A and a first plating layer 60A disposed on the first base electrode layer 50A.

[0041] The second external electrode 40B has a second base electrode layer 50B and a second plating layer 60B disposed on the second base electrode layer 50B.

[0042] The first base electrode layer 50A is disposed on the first end face LS1. The first base electrode layer 50A is connected to the first internal electrode layer 31. In this embodiment, the first base electrode layer 50A is formed to extend from the first end face LS1 to a portion of the first main surface TS1, a portion of the second main surface TS2, and a portion of the first side surface WS1 and a portion of the second side surface WS2.

[0043] The second base electrode layer 50B is disposed on the second end face LS2. The second base electrode layer 50B is connected to the second internal electrode layer 32. In this embodiment, the second base electrode layer 50B is formed to extend from the second end face LS2 to a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2.

[0044] The first and second base electrode layers 50A and 50B of this embodiment are baked layers. The baked layers preferably contain a metal component and either a glass component or a ceramic component, or both. The metal component includes at least one selected from, for example, Cu, Ni, Ag, Pd, an Ag-Pd alloy, and Au. The glass component includes at least one selected from, for example, B, Si, Ba, Mg, Al, and Li. The ceramic component may be the same ceramic material as that of the dielectric layer 20, or a different ceramic material. The ceramic component may include at least one selected from, for example, BaTiO3, CaTiO3, (Ba,Ca)TiO3, SrTiO3, and CaZrO3.

[0045] The baked layer is formed by, for example, applying a conductive paste containing glass and metal to the laminate and baking it. The baked layer may be formed by simultaneously firing a laminated chip having internal electrodes and a dielectric layer with a conductive paste applied to the laminated chip, or by simultaneously firing a laminated chip having internal electrodes and a dielectric layer to obtain a laminate and then applying a conductive paste to the laminate and baking it. When simultaneously firing a laminated chip having internal electrodes and a dielectric layer with a conductive paste applied to the laminated chip, it is preferable to form the baked layer by adding a ceramic material instead of a glass component and baking it. In this case, it is particularly preferable to use the same type of ceramic material as the dielectric layer 20 as the added ceramic material. The baked layer may be formed in multiple layers.

[0046] The thickness in the longitudinal direction of the first base electrode layer 50A located on the first end surface LS1 is preferably, for example, approximately 10 μm or more and 150 μm or less at the center in the height direction T and width direction W of the first base electrode layer 50A.

[0047] The thickness in the longitudinal direction of the second base electrode layer 50B located on the second end surface LS2 is preferably, for example, approximately 10 μm or more and 150 μm or less at the center in the height direction T and width direction W of the second base electrode layer 50B.

[0048] When the first base electrode layer 50A is provided on a portion of at least one of the first main surface TS1 or the second main surface TS2, the thickness in the height direction T of the first base electrode layer 50A provided on this portion is preferably, for example, approximately 10 μm or more and 100 μm or less at the center in the length direction L and width direction W of the first base electrode layer 50A provided on this portion.

[0049] When the first base electrode layer 50A is provided on a portion of at least one of the first side surface WS1 or the second side surface WS2, the widthwise thickness of the first base electrode layer 50A provided on this portion is preferably, for example, approximately 10 μm or more and 100 μm or less at the center in the length direction L and height direction T of the first base electrode layer 50A provided on this portion.

[0050] When the second base electrode layer 50B is provided on a portion of at least one of the first main surface TS1 or the second main surface TS2, the thickness in the height direction T of the second base electrode layer 50B provided on this portion is preferably, for example, approximately 10 μm or more and 100 μm or less at the center in the length direction L and width direction W of the second base electrode layer 50B provided on this portion.

[0051] When the second base electrode layer 50B is provided on a portion of at least one of the first side surface WS1 or the second side surface WS2, the widthwise thickness of the second base electrode layer 50B provided on this portion is preferably, for example, approximately 10 μm or more and 100 μm or less at the center in the length direction L and height direction T of the second base electrode layer 50B provided on this portion.

[0052] The first and second base electrode layers 50A and 50B are not limited to baked layers. The first and second base electrode layers 50A and 50B may include at least one selected from a baked layer, a conductive resin layer, a thin film layer, and the like. For example, the first and second base electrode layers 50A and 50B may be thin film layers. The thin film layers are formed by a thin film formation method such as sputtering or vapor deposition. The thin film layers are layers of metal particles deposited to a thickness of 10 μm or less.

[0053] The first plating layer 60A is disposed so as to cover the first base electrode layer 50A.

[0054] The second plating layer 60B is disposed so as to cover the second base electrode layer 50B.

[0055] The first plating layer 60A and the second plating layer 60B may contain at least one selected from, for example, Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au, etc. The first plating layer 60A and the second plating layer 60B may each be formed of multiple layers. The first plating layer 60A and the second plating layer 60B preferably have a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0056] The first plating layer 60A is disposed so as to cover the first base electrode layer 50A. In this embodiment, the first plating layer 60A has a first Ni plating layer 61A and a first Sn plating layer 62A located on the first Ni plating layer 61A.

[0057] The second plating layer 60B is disposed so as to cover the second base electrode layer 50B. In this embodiment, the second plating layer 60B has a second Ni plating layer 61B and a second Sn plating layer 62B located on the second Ni plating layer 61B.

[0058] The Ni plating layer prevents the first base electrode layer 50A and the second base electrode layer 50B from being eroded by solder when mounting the multilayer ceramic capacitor 1. The Sn plating layer improves the wettability of the solder when mounting the multilayer ceramic capacitor 1, thereby facilitating mounting of the multilayer ceramic capacitor 1. The thickness of each of the first Ni plating layer 61A, the first Sn plating layer 62A, the second Ni plating layer 61B, and the second Sn plating layer 62B is preferably 1 μm or more and 15 μm or less.

[0059] The first external electrode 40A and the second external electrode 40B of this embodiment may have a conductive resin layer containing, for example, a conductive filler and a thermosetting resin. When a conductive resin layer is provided as the base electrode layer (first base electrode layer 50A, second base electrode layer 50B), the conductive resin layer may be disposed so as to cover the baked layer, or may be disposed directly on the laminate 10 without providing a baked layer. When the conductive resin layer is disposed so as to cover the baked layer, the conductive resin layer is disposed between the baked layer and the plating layer (first plating layer 60A, second plating layer 60B). The conductive resin layer may completely cover the baked layer, or may cover only a portion of the baked layer.

[0060] The conductive resin layer containing a thermosetting resin is more flexible than a conductive layer made of, for example, a plating film or a fired conductive paste. Therefore, even if the multilayer ceramic capacitor 1 is subjected to a physical shock or a shock due to a thermal cycle, the conductive resin layer functions as a buffer layer. Therefore, the conductive resin layer suppresses the occurrence of cracks in the multilayer ceramic capacitor 1.

[0061] The metal constituting the conductive filler may be Ag, Cu, Ni, Sn, Bi, or an alloy containing any of these. The conductive filler preferably contains Ag. The conductive filler is, for example, Ag metal powder. Ag has the lowest resistivity of all metals and is therefore suitable as an electrode material. Furthermore, Ag is a noble metal, so it is resistant to oxidation and has high weather resistance. Therefore, Ag metal powder is suitable as a conductive filler.

[0062] The conductive filler may also be a metal powder whose surface is coated with Ag. When using a metal powder whose surface is coated with Ag, the metal powder is preferably a powder of Cu, Ni, Sn, Bi, or an alloy thereof. In order to maintain the properties of Ag while making the base metal inexpensive, it is preferable to use an Ag-coated metal powder.

[0063] Furthermore, the conductive filler may be Cu or Ni that has been subjected to an anti-oxidation treatment. Furthermore, the conductive filler may be a metal powder whose surface is coated with Sn, Ni, or Cu. When using metal powder whose surface is coated with Sn, Ni, or Cu, the metal powder is preferably Ag, Cu, Ni, Sn, Bi, or an alloy powder thereof.

[0064] The shape of the conductive filler is not particularly limited. The conductive filler may be spherical, flat, or the like, but it is preferable to use a mixture of spherical metal powder and flat metal powder.

[0065] The average particle size of the conductive filler is not particularly limited and may be, for example, 0.3 μm or more and 10 μm or less.

[0066] The conductive filler contained in the conductive resin layer is preferably contained in an amount of 35 vol % or more and 75 vol % or less with respect to the volume of the entire conductive resin layer.

[0067] The conductive filler contained in the conductive resin layer mainly serves to ensure the electrical conductivity of the conductive resin layer. Specifically, when multiple conductive fillers come into contact with each other, a conductive path is formed inside the conductive resin layer.

[0068] The resin constituting the conductive resin layer may include at least one selected from various known thermosetting resins, such as epoxy resin, phenolic resin, urethane resin, silicone resin, and polyimide resin. Among these, epoxy resin, which has excellent heat resistance, moisture resistance, and adhesion, is one of the most suitable resins. Furthermore, the resin of the conductive resin layer preferably includes a curing agent in addition to the thermosetting resin. When an epoxy resin is used as the base resin, the curing agent for the epoxy resin may be any of various known compounds, such as phenolic, amine, acid anhydride, imidazole, active ester, and amide-imide compounds.

[0069] The conductive resin layer may be formed of multiple layers. The thickness of the thickest part of the conductive resin layer is preferably 10 μm or more and 200 μm or less.

[0070] Note that a configuration may also be adopted in which a first plating layer 60A and a second plating layer 60B, which will be described later, are disposed directly on the laminate 10 without providing the first base electrode layer 50A and the second base electrode layer 50B. That is, the multilayer ceramic capacitor 1 may also be configured to include plating layers that are directly and electrically connected to the first internal electrode layer 31 and the second internal electrode layer 32. In such a case, a catalyst may be disposed on the surface of the laminate 10 as a pretreatment, and then the plating layers may be formed.

[0071] Even in this case, the plating layer preferably comprises multiple layers. The lower plating layer and the upper plating layer each preferably contain at least one metal selected from, for example, Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, or Zn, or an alloy containing these metals. The lower plating layer is more preferably formed using Ni, which has solder barrier properties. The upper plating layer is more preferably formed using Sn or Au, which have good solder wettability. For example, when the first internal electrode layer 31 and the second internal electrode layer 32 are formed using Ni, the lower plating layer is preferably formed using Cu, which has good bonding properties with Ni. The upper plating layer may be formed as needed, and the external electrode 40 may be composed of only the lower plating layer. Furthermore, the upper plating layer may be the outermost layer, or another plating layer may be formed on the surface of the upper plating layer.

[0072] The thickness of each plating layer, which is disposed without a base electrode layer, is preferably 1 μm or more and 15 μm or less. The plating layer preferably does not contain glass. The metal content per unit volume of the plating layer is preferably 99% by volume or more.

[0073] Note that when the plating layer is formed directly on the laminate 10, the thickness of the base electrode layer can be reduced. Therefore, the dimension of the multilayer ceramic capacitor 1 in the height direction T can be reduced by the amount of the reduced thickness of the base electrode layer, thereby making it possible to reduce the height of the multilayer ceramic capacitor 1. Alternatively, the thickness of the dielectric layer 20 sandwiched between the first internal electrode layer 31 and the second internal electrode layer 32 can be increased by the amount of the reduced thickness of the base electrode layer, thereby improving the thickness of the element body. In this way, by forming the plating layer directly on the laminate 10, the degree of freedom in designing the multilayer ceramic capacitor can be improved.

[0074] If the lengthwise dimension of the multilayer ceramic capacitor 1 including the laminate 10 and the external electrodes 40 is defined as L, then the L dimension is preferably 0.2 mm or more and 10 mm or less. If the heightwise dimension of the multilayer ceramic capacitor 1 is defined as T, then the T dimension is preferably 0.1 mm or more and 5 mm or less. If the widthwise dimension of the multilayer ceramic capacitor 1 is defined as W, then the W dimension is preferably 0.1 mm or more and 10 mm or less.

[0075] Here, for example, if a voltage is applied between the external electrodes 40 in a state where water droplets formed by condensation have spread continuously between the external electrodes 40 on the surface of the laminate 10, ionized metal species will dissolve and precipitate from the external electrodes 40, causing electrochemical migration. In this embodiment, in order to suppress the occurrence of this electrochemical migration, hydrophobic portions 70 and hydrophilic portions 80 are arranged on the surface of the laminate 10.

[0076] Next, the configurations of the hydrophobic portion 70 and the hydrophilic portion 80 will be described with reference to FIGS. 1, 2, and 4A to 7. FIG. 5 is a cross-sectional view of the multilayer ceramic capacitor 1 shown in FIG. 2 taken along line VV. FIG. 6 is a cross-sectional view of the multilayer ceramic capacitor 1 shown in FIG. 2 taken along line VI-VI. FIG. 7 is an arrow diagram of the multilayer ceramic capacitor 1 shown in FIG. 1 viewed from the first main surface TS1 side along the direction of arrow VII. In FIG. 7, the outline of the laminate 10 covered with the hydrophobic portion 70, the hydrophilic portion 80, and the external electrodes 40 is indicated by a dashed line.

[0077] The hydrophobic portion 70 is a hydrophobic layer disposed on the surface of the laminate 10. The hydrophobic portion 70 is formed by applying, for example, a fluorine-based silane coupling material to the laminate 10. In this embodiment, one hydrophobic portion 70 is disposed on the surface of the laminate 10.

[0078] As shown in Figures 1, 2, 4A, 4B, 5, and 7, the hydrophobic portion 70 has a first main surface side hydrophobic portion 71, a second main surface side hydrophobic portion 72, a first side surface side hydrophobic portion 73, and a second side surface side hydrophobic portion 74.

[0079] The first principal surface-side hydrophobic region 71 is a hydrophobic layer containing at least one of fluorine and silicone. The first principal surface-side hydrophobic region 71 is disposed on at least a portion of the first principal surface TS1. Specifically, as shown in FIG. 2, the first principal surface-side hydrophobic region 71 is disposed in a region TE1 located on the first principal surface TS1 between the first external electrode 40A and the second external electrode 40B. In this embodiment, the first principal surface-side hydrophobic region 71 is disposed in a strip-like shape extending in the width direction W at the center of the length direction L of the laminate 10. As shown in FIGS. 1, 5, and 7, the first principal surface-side hydrophobic region 71 is disposed on the first principal surface TS1 in the width direction W, from the end on the first side surface WS1 side to the end on the second side surface WS2 side.

[0080] The second principal surface side hydrophobic region 72 is a hydrophobic layer containing at least one of fluorine and silicone. The second principal surface side hydrophobic region 72 is disposed on at least a portion of the second principal surface TS2. Specifically, as shown in FIG. 2, the second principal surface side hydrophobic region 72 is disposed in a region TE2 located on the second principal surface TS2 between the first external electrode 40A and the second external electrode 40B. In this embodiment, the second principal surface side hydrophobic region 72 is disposed in a strip-like shape extending in the width direction W at the center of the length direction L of the laminate 10. As shown in FIG. 5, the second principal surface side hydrophobic region 72 is disposed on the second principal surface TS2 in the width direction W from the end on the first side surface WS1 side to the end on the second side surface WS2 side.

[0081] The first side surface-side hydrophobic portion 73 is a hydrophobic layer containing at least one of fluorine and silicone. The first side surface-side hydrophobic portion 73 is disposed on at least a portion of the first side surface WS1. Specifically, as shown in FIGS. 4A and 4B , the first side surface-side hydrophobic portion 73 is disposed in a region WE1 located between the first external electrode 40A and the second external electrode 40B on the first side surface WS1. That is, the first side surface-side hydrophobic portion 73 is disposed between the first external electrode 40A and the second external electrode 40B on the first side surface WS1. In this embodiment, the first side surface-side hydrophobic portion 73 is disposed in a strip-like shape extending in the height direction T at the center of the length direction L of the laminate 10. The first side surface-side hydrophobic portion 73 is disposed on the first side surface WS1 in the height direction T, from the end on the first main surface TS1 side to the end on the second main surface TS2 side.

[0082] The second side surface side hydrophobic portion 74 is a hydrophobic layer containing at least one of fluorine and silicone. The second side surface side hydrophobic portion 74 is disposed on at least a portion of the second side surface WS2. Specifically, as shown in FIGS. 4A and 4B , the second side surface side hydrophobic portion 74 is disposed in a region WE2 located on the second side surface WS2 between the first external electrode 40A and the second external electrode 40B. In this embodiment, the second side surface side hydrophobic portion 74 is disposed in a strip-like shape extending in the height direction T at the center of the length direction L of the laminate 10. The second side surface side hydrophobic portion 74 is disposed on the second side surface WS2 in the height direction T, from the end on the first main surface TS1 side to the end on the second main surface TS2 side.

[0083] 5 , in the hydrophobic portion 70 of this embodiment, the first main surface-side hydrophobic portion 71 and the second main surface-side hydrophobic portion 72 are arranged continuously via the first side surface-side hydrophobic portion 73 and the second side surface-side hydrophobic portion 74. The first side surface-side hydrophobic portion 73 and the second side surface-side hydrophobic portion 74 are arranged continuously via the first main surface-side hydrophobic portion 71 and the second main surface-side hydrophobic portion 72. That is, the hydrophobic portion 70 is ring-shaped as a whole and is arranged across the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10. With this configuration, since the hydrophobic portion 70 is arranged on the surface of the laminate 10, when water droplets W are generated due to condensation, the water droplets can be prevented from spreading across the surface of the laminate 10. This makes it possible to suppress the formation of a water droplet path, which is a water film that straddles the gap between the first external electrode 40A and the second external electrode 40B.

[0084] The hydrophilic portion 80 is a hydrophilic layer disposed on the surface of the laminate 10. The hydrophilic portion 80 is formed by applying, for example, a hydroxyl group-containing silane coupling material to the laminate 10. In this embodiment, two hydrophilic portions 80, i.e., hydrophilic portions 80a and 80b, are disposed on the surface of the laminate 10. Specifically, the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the first principal surface TS1, the second principal surface TS2, the first side surface WS1, and the second side surface WS2. The hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B on the first principal surface TS1, the second principal surface TS2, the first side surface WS1, and the second side surface WS2. That is, the hydrophobic portion 70 is sandwiched between the hydrophilic portions 80 in the longitudinal direction L.

[0085] As shown in Figures 1, 2, 4A, 4B, 6, and 7, each hydrophilic portion 80 has a first main surface side hydrophilic portion 81, a second main surface side hydrophilic portion 82, a first side surface side hydrophilic portion 83, and a second side surface side hydrophilic portion 84.

[0086] The first principal surface-side hydrophilic portion 81 is a hydrophilic layer having hydroxyl groups. The first principal surface-side hydrophilic portion 81 is disposed on at least a portion of the first principal surface TS1. Specifically, as shown in FIG. 2 , the first principal surface-side hydrophilic portion 81 is disposed in a region TE1 located between the first external electrode 40A and the second external electrode 40B on the first principal surface TS1. In this embodiment, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the first principal surface TS1. Specifically, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed so as to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 on the first principal surface TS1. That is, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed so as to contact the first principal surface-side hydrophobic portion 71 of the hydrophobic portion 70. Furthermore, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B on the first main surface TS1. Specifically, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed so as to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B on the first main surface TS1. That is, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed so as to contact the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70. As shown in FIGS. 6 and 7 , the first main surface-side hydrophilic portion 81 is disposed on the first main surface TS1 from the end portion on the first side surface WS1 side to the end portion on the second side surface WS2 side in the width direction W.

[0087] The second principal surface-side hydrophilic portion 82 is a hydrophilic layer having hydroxyl groups. The second principal surface-side hydrophilic portion 82 is disposed on at least a portion of the second principal surface TS2. Specifically, as shown in FIG. 2 , the second principal surface-side hydrophilic portion 82 is disposed in a region TE2 located between the first external electrode 40A and the second external electrode 40B on the second principal surface TS2. In this embodiment, the second principal surface-side hydrophilic portion 82 of the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the second principal surface TS2. Specifically, the second principal surface-side hydrophilic portion 82 of the hydrophilic portion 80a is disposed so as to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 on the second principal surface TS2. That is, the second principal surface-side hydrophilic portion 82 of the hydrophilic portion 80a is disposed so as to contact the second principal surface-side hydrophobic portion 72 of the hydrophobic portion 70. Furthermore, the second main surface-side hydrophilic portion 82 of the hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B on the second main surface TS2. Specifically, the second main surface-side hydrophilic portion 82 of the hydrophilic portion 80b is disposed so as to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B on the second main surface TS2. That is, the second main surface-side hydrophilic portion 82 of the hydrophilic portion 80b is disposed so as to contact the second main surface-side hydrophobic portion 72 of the hydrophobic portion 70. As shown in FIG. 6 , the second main surface-side hydrophilic portion 82 is disposed on the second main surface TS2 from the end portion on the first side surface WS1 side to the end portion on the second side surface WS2 side in the width direction W.

[0088] The first side surface side hydrophilic portion 83 is a hydrophilic layer having hydroxyl groups. The first side surface side hydrophilic portion 83 is disposed on at least a portion of the first side surface WS1. Specifically, as shown in FIGS. 4A and 4B , the first side surface side hydrophilic portion 83 is disposed in a region WE1 located between the first external electrode 40A and the second external electrode 40B on the first side surface WS1. In this embodiment, the first side surface side hydrophilic portion 83 of the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the first side surface WS1. Specifically, the first side surface side hydrophilic portion 83 of the hydrophilic portion 80a is disposed so as to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 on the first side surface WS1. That is, the first side surface side hydrophilic portion 83 of the hydrophilic portion 80a is disposed so as to contact the first side surface side hydrophobic portion 73 of the hydrophobic portion 70. Furthermore, the first side surface side hydrophilic portion 83 of the hydrophilic portion 80b is disposed between the hydrophobic portion 70 on the first side surface WS1 and the second external electrode 40B. Specifically, the first side surface side hydrophilic portion 83 of the hydrophilic portion 80b is disposed so as to cover the entire surface between the hydrophobic portion 70 on the first side surface WS1 and the second external electrode 40B. That is, the first side surface side hydrophilic portion 83 of the hydrophilic portion 80b is disposed so as to be in contact with the first side surface side hydrophobic portion 73 of the hydrophobic portion 70. As shown in FIG. 6 , the first side surface side hydrophilic portion 83 is disposed on the first side surface WS1 from the end portion on the first main surface TS1 side to the end portion on the second main surface TS2 side in the height direction T.

[0089] The second side surface side hydrophilic portion 84 is a hydrophilic layer having hydroxyl groups. The second side surface side hydrophilic portion 84 is disposed on at least a portion of the second side surface WS2. Specifically, as shown in FIGS. 4A and 4B , the second side surface side hydrophilic portion 84 is disposed in a region WE2 located between the first external electrode 40A and the second external electrode 40B on the second side surface WS2. In this embodiment, the second side surface side hydrophilic portion 84 of the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the second side surface WS2. Specifically, the second side surface side hydrophilic portion 84 of the hydrophilic portion 80a is disposed so as to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70 on the second side surface WS2. That is, the second side surface side hydrophilic portion 84 of the hydrophilic portion 80a is disposed so as to contact the second side surface side hydrophobic portion 74 of the hydrophobic portion 70. Furthermore, the second side surface side hydrophilic portion 84 of the hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B on the second side surface WS2. Specifically, the second side surface side hydrophilic portion 84 of the hydrophilic portion 80b is disposed so as to cover the entire surface on the second side surface WS2 between the hydrophobic portion 70 and the second external electrode 40B. That is, the second side surface side hydrophilic portion 84 of the hydrophilic portion 80b is disposed so as to contact the second side surface side hydrophobic portion 74 of the hydrophobic portion 70. As shown in FIG. 6 , the second side surface side hydrophilic portion 84 is disposed on the second side surface WS2 from the end portion on the first main surface TS1 side to the end portion on the second main surface TS2 side in the height direction T.

[0090] 6 , in the hydrophilic portion 80 of this embodiment, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 are continuously disposed via the first side surface side hydrophilic portion 83, and are also continuously disposed via the second side surface side hydrophilic portion 84. The first side surface side hydrophilic portion 83 and the second side surface side hydrophilic portion 84 are continuously disposed via the first main surface side hydrophilic portion 81, and are also continuously disposed via the second main surface side hydrophilic portion 82. In other words, the hydrophilic portion 80 is ring-shaped as a whole, and is disposed across the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10.

[0091] Here, if a water-repellent agent or the like is added to the surface of the laminate 10 to perform only a hydrophobic treatment, and no hydrophilic treatment is performed on the portion to which the water-repellent agent has not been added, the difference in the water contact angle between the portion to which the water-repellent agent has been added and the portion to which the water-repellent agent has not been added may be small, and a sufficient water-repellent effect may not be obtained.

[0092] In contrast, in the multilayer ceramic capacitor 1 according to this embodiment, not only the hydrophobic portions 70 but also the hydrophilic portions 80 are arranged on the surface of the laminate 10, which is the ceramic body, so that the water droplets W can be guided from the hydrophobic portions 70 to the hydrophilic portions 80, as shown in FIG. 7. This makes it possible to suppress the formation of a water droplet path spanning between the first external electrode 40A and the second external electrode 40B. Therefore, it becomes more difficult for a path between the electrodes due to the water droplets W to be formed, making it possible to significantly suppress deterioration due to electrochemical migration.

[0093] The thickness of the hydrophobic portion 70 is preferably 5 nm or more and 1000 nm or less. This allows water droplets W generated by condensation to be guided to the hydrophilic portion 80, more effectively preventing the formation of a water droplet path spanning the first external electrode 40A and the second external electrode 40B. If the thickness of the hydrophobic portion 70 is less than 5 nm, the contact angle with water decreases, resulting in a reduced water-repellent effect. If the thickness of the hydrophobic portion 70 is greater than 1000 nm, the hydrophobic material forming the hydrophobic portion 70 may adhere to the suction nozzle used to insert the multilayer ceramic capacitor 1 into the tape during transportation, potentially resulting in suction errors. The thickness of the hydrophobic portion 70 is determined by measuring and converting the weight, specific gravity, and surface area of ​​the multilayer ceramic capacitor 1.

[0094] The thickness of the hydrophilic portion 80 is preferably 10 nm or more and 500 nm or less.

[0095] Next, the contact angles of water at the hydrophobic portion 70 and the hydrophilic portion 80 will be described. The difference between the contact angle of water at the hydrophobic portion 70 and the contact angle of water at the hydrophilic portion 80 is preferably 30° or more. It is even more preferable that the difference between the contact angle of water at the hydrophobic portion 70 and the contact angle of water at the hydrophilic portion 80 be 40° or more.

[0096] Next, a method for manufacturing the multilayer ceramic capacitor 1 of this embodiment will be described.

[0097] A dielectric sheet for the dielectric layer 20 and a conductive paste for the internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste for the internal electrode contain a binder and a solvent. The binder and the solvent may be known.

[0098] On the dielectric sheets, a conductive paste for the internal electrode layers 30 is printed in a predetermined pattern by, for example, screen printing or gravure printing. In this way, a dielectric sheet on which the pattern of the first internal electrode layer 31 is formed and a dielectric sheet on which the pattern of the second internal electrode layer 32 is formed are prepared.

[0099] A predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed are stacked to form a portion that will become the first main surface-side outer layer portion 12 on the first main surface TS1 side. A dielectric sheet on which the pattern of the first internal electrode layer 31 and a dielectric sheet on which the pattern of the second internal electrode layer 32 are printed are stacked in this order on top of that to form a portion that will become the internal layer portion 11. A predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed are stacked on top of this portion that will become the second main surface-side outer layer portion 13 on the second main surface TS2 side. In this way, a laminated sheet is produced.

[0100] The laminated sheets are pressed in the height direction by means of a hydrostatic press or the like to produce a laminated block.

[0101] The laminated block is cut to a predetermined size to obtain laminated chips, and at this time, corners and ridges of the laminated chips may be rounded by barrel polishing or the like.

[0102] The laminated chip is fired to produce the laminate 10. The firing temperature depends on the materials of the dielectric layers 20 and the internal electrode layers 30, but is preferably 900°C or higher and 1400°C or lower.

[0103] A conductive paste that will become the base electrode layers (first base electrode layer 50A, second base electrode layer 50B) is applied to both end surfaces of the laminate 10. In this embodiment, the base electrode layers are baked layers. A conductive paste containing a glass component and a metal is applied to the laminate 10 by a method such as dipping. A baking process is then performed to form the base electrode layers. The temperature of the baking process at this time is preferably 700°C or higher and 900°C or lower.

[0104] When the unfired laminated chip and the conductive paste applied to the laminated chip are simultaneously fired, the fired layer is preferably formed by firing a material containing a ceramic material instead of a glass component. In this case, it is particularly preferable to use the same type of ceramic material as that of the dielectric layer 20 as the added ceramic material. In this case, the conductive paste is applied to the unfired laminated chip, and the laminated chip and the conductive paste applied to the laminated chip are simultaneously fired to form the laminate 10 with the fired layer.

[0105] Thereafter, a plating layer is formed on the surface of the base electrode layer. In this embodiment, a first plating layer 60A is formed on the surface of the first base electrode layer 50A. Furthermore, a second plating layer 60B is formed on the surface of the second base electrode layer 50B. In this embodiment, a Ni plating layer and an Sn plating layer are formed as the plating layers. Either electrolytic plating or electroless plating may be used for the plating process. However, electroless plating has the disadvantage of requiring pretreatment using a catalyst or the like to improve the plating deposition rate, which complicates the process. Therefore, it is usually preferable to use electrolytic plating. The Ni plating layer and the Sn plating layer are formed sequentially, for example, by barrel plating.

[0106] When the base electrode layer is formed as a thin film layer, the thin film layer is formed as the base electrode layer in the area where the external electrode is to be formed by masking or the like. The thin film layer is formed by a thin film formation method such as sputtering or vapor deposition. The thin film layer is a layer of metal particles deposited to a thickness of 1.0 μm or less.

[0107] When a conductive resin layer is provided as the base electrode layer, the conductive resin layer may be disposed so as to cover the baking layer, or may be disposed directly on the laminate 10 without providing a baking layer. When providing a conductive resin layer, a conductive resin paste containing a thermosetting resin and a metal component is applied to the baking layer or the laminate 10, and then heat-treated at a temperature of 250 to 550°C or higher. This causes the thermosetting resin to thermally harden, forming a conductive resin layer. The atmosphere during this heat treatment is preferably an N2 atmosphere. Furthermore, to prevent the resin from scattering and the various metal components from oxidizing, the oxygen concentration is preferably 100 ppm or less.

[0108] Alternatively, the plating layer may be disposed directly on the exposed portion of the internal electrode layer 30 of the laminate 10 without providing a base electrode layer. In this case, the first end face LS1 and the second end face LS2 of the laminate 10 are plated, and the plating layer is formed on the exposed portion of the internal electrode layer 30. Either electrolytic plating or electroless plating may be used for the plating process. However, electroless plating has the disadvantage of requiring pretreatment using a catalyst or the like to improve the plating deposition rate, which complicates the process. Therefore, electrolytic plating is usually preferred. Barrel plating is preferred as the plating method. Furthermore, if necessary, the upper plating layer formed on the surface of the lower plating layer may be formed by the same method as the lower plating layer.

[0109] Next, the laminate on which the plating layer has been formed is immersed in a hydrophobic agent using a dipping method or the like, thereby forming a hydrophobic portion on the entire surface of the laminate. After trimming the portion of the laminate on which the hydrophobic portion has been formed where the hydrophilic portion is to be formed using a laser or the like, the trimmed laminate is immersed in a hydrophilic agent using a dipping method or the like, thereby forming a hydrophilic portion only in the portion where the hydrophobic portion has not been formed. For example, a fluorine-based silane coupling agent can be used as the hydrophobic agent. For example, a hydroxyl-containing silane coupling agent can be used as the hydrophilic agent.

[0110] Note that the multilayer ceramic capacitor 1 of the fourth embodiment, which will be described later, can also be manufactured by forming convex portions on the first principal surface TS1, the second principal surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate and processing the laminate into a configuration in which hydrophobic portions are disposed in the convex portions. The first principal surface TS1, the second principal surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate are trimmed with a laser to form convex portions of a predetermined thickness.

[0111] Through these manufacturing steps, the multilayer ceramic capacitor 1 is manufactured.

[0112] The configuration of the laminate 10 of the multilayer ceramic capacitor 1 is not limited to the configurations shown in Figures 1 to 6. For example, the multilayer ceramic capacitor 1 may be a multilayer ceramic capacitor having a two-, three-, or four-layer structure, as shown in Figures 8A, 8B, and 8C.

[0113] The multilayer ceramic capacitor 1 shown in FIG. 8A is a double-structure multilayer ceramic capacitor 1, and includes, as the internal electrode layers 30, a first internal electrode layer 33, a second internal electrode layer 34, and a floating internal electrode layer 35 that is not extended to either the first end face LS1 or the second end face LS2. The multilayer ceramic capacitor 1 shown in FIG. 8B is a triple-structure multilayer ceramic capacitor 1, which includes a first floating internal electrode layer 35A and a second floating internal electrode layer 35B as the floating internal electrode layers 35. The multilayer ceramic capacitor 1 shown in FIG. 8C is a quadruple-structure multilayer ceramic capacitor 1, which includes a first floating internal electrode layer 35A, a second floating internal electrode layer 35B, and a third floating internal electrode layer 35C as the floating internal electrode layers 35. By providing the floating internal electrode layers 35 as the internal electrode layers 30 in this way, the multilayer ceramic capacitor 1 has a structure in which the opposing electrode portion is divided into multiple parts. As a result, multiple capacitor components are formed between the opposing internal electrode layers 30, and these capacitor components are connected in series. This reduces the voltage applied to each capacitor component, thereby achieving a high withstand voltage for the multilayer ceramic capacitor 1. It goes without saying that the multilayer ceramic capacitor 1 of this embodiment may have a multi-row structure of four or more rows.

[0114] The multilayer ceramic capacitor 1 of this embodiment provides the following advantages.

[0115] (1) The multilayer ceramic capacitor 1 of this embodiment includes a laminate 10 including a plurality of laminated dielectric layers 20, the laminate 10 having a first main surface TS1 and a second main surface TS2 facing in a height direction T, a first side surface WS1 and a second side surface WS2 facing in a width direction W perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 facing in a length direction L perpendicular to the height direction T and the width direction W; and a laminate 10 disposed on the plurality of dielectric layers 20 and exposed to the first end surface LS1. a first internal electrode layer 31 exposed at the first end face LS1, a second internal electrode layer 32 disposed on the plurality of dielectric layers 20 and exposed at the second end face LS2, a first external electrode 40A disposed on the first end face LS1, and a second external electrode 40B disposed on the second end face LS2, wherein a hydrophilic portion 80 and a hydrophobic portion 70 are disposed on the surface of the laminate 10, and the hydrophilic portion 80 is disposed on at least a part of the first main face TS1, and the hydrophobic portion 70 has a hydroxyl group. The hydrophobic portion 70 has a first main surface-side hydrophilic portion 81, a second main surface-side hydrophilic portion 82 having hydroxyl groups and arranged on at least a portion of the second main surface TS2, a first side surface-side hydrophilic portion 83 having hydroxyl groups and arranged on at least a portion of the first side surface WS1, and a second side surface-side hydrophilic portion 84 having hydroxyl groups. The hydrophobic portion 70 has a first main surface-side hydrophobic portion 71 arranged on at least a portion of the first main surface TS1 and containing at least one of fluorine and silicone, a second main surface-side hydrophobic portion 72 arranged on at least a portion of the second main surface TS2 and containing at least one of fluorine and silicone, a first side surface-side hydrophobic portion 73 arranged on at least a portion of the first side surface WS1 and containing at least one of fluorine and silicone, and a second side surface-side hydrophobic portion 74 arranged on at least a portion of the second side surface WS2 and containing at least one of fluorine and silicone. Thus, by forming the hydrophobic portions 70 and the hydrophilic portions 80 on the surface of the laminate 10, which is the ceramic body portion, the water droplets W generated by condensation can be guided to the hydrophilic portions 80. This makes it possible to suppress the formation of a water droplet path spanning between the first external electrode 40A and the second external electrode 40B, and more reliably suppress the occurrence of electrochemical migration.

[0116] (2) The first main surface-side hydrophilic portion 81 and the second main surface-side hydrophilic portion 82 of the multilayer ceramic capacitor 1 according to this embodiment are arranged continuously via the first side surface-side hydrophilic portion 83 and the second side surface-side hydrophilic portion 84, and the first main surface-side hydrophobic portion 71 and the second main surface-side hydrophobic portion 72 are arranged continuously via the first side surface-side hydrophobic portion 73 and the second side surface-side hydrophobic portion 74. As a result, the hydrophilic portion 80 is arranged continuously across the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10, and the hydrophobic portion 70 is arranged continuously, so that water droplets W generated by condensation can be more reliably guided to the hydrophilic portion 80. This makes it possible to suppress the formation of a water droplet path spanning between the first external electrode 40A and the second external electrode 40B.

[0117] (3) The hydrophobic portions 70 of the multilayer ceramic capacitor 1 according to this embodiment are sandwiched between the hydrophilic portions 80 in the length direction L. This makes the effect of suppressing electrochemical migration more pronounced.

[0118] Next, a multilayer ceramic capacitor 1 according to a second embodiment will be described. In the following description, detailed description of the same configuration as in the first embodiment will be omitted. Fig. 9 is a diagram showing the multilayer ceramic capacitor 1 according to the second embodiment and corresponds to Fig. 7. Fig. 10 is a diagram showing the multilayer ceramic capacitor 1 according to the second embodiment and corresponds to the arrow diagram when the second main surface TS2 side is viewed along the direction of arrow X shown in Fig. 1.

[0119] The multilayer ceramic capacitor 1 of the second embodiment differs from the above embodiment in the configuration of the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70 and the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80.

[0120] The hydrophobic portion 70 of the second embodiment will be described. The first main surface side hydrophobic portion 71 is arranged so as to extend in the width direction W at the center of the length direction L of the laminate 10. As shown in Fig. 9, the first main surface side hydrophobic portion 71 is arranged on the first main surface TS1 from the first side surface WS1 side to the second side surface WS2 side in the width direction W. The first main surface side hydrophobic portion 71 has a first width direction side portion 711 and a first width direction center portion 712.

[0121] The first width direction side surface portions 711 are located on the first main surface TS1 on the first side surface WS1 side and the second side surface WS2 side in the width direction W. Specifically, the first width direction side surface portions 711 are located at a portion of the first main surface TS1 that intersects with the first side surface WS1 and a portion of the first main surface TS1 that intersects with the second side surface WS2.

[0122] The first width direction central portion 712 is located toward the center of the first main surface TS1 in the width direction W. The dimension d1 of the first main surface-side hydrophobic portion 71 in the length direction L increases from the first width direction side surface portion 711 toward the first width direction central portion 712. That is, the dimension d1 of the first main surface-side hydrophobic portion 71 in the length direction L increases from the first side surface WS1 side or the second side surface WS2 side in the width direction W of the first main surface TS1 toward the center of the width direction W.

[0123] The second main surface side hydrophobic portion 72 is arranged to extend in the width direction W at the center of the length direction L of the laminate 10. As shown in Fig. 10 , the second main surface side hydrophobic portion 72 is arranged on the second main surface TS2 from the first side surface WS1 side to the second side surface WS2 side in the width direction W. The second main surface side hydrophobic portion 72 has second width direction side surface portions 721 and a second width direction center portion 722.

[0124] The second width direction side surface portions 721 are located on the first side surface WS1 side and the second side surface WS2 side of the second main surface TS2 in the width direction W. Specifically, the second width direction side surface portions 721 are located at a portion of the second main surface TS2 that intersects with the first side surface WS1 and a portion of the second main surface TS2 that intersects with the second side surface WS2.

[0125] The second width direction central portion 722 is located toward the central portion of the second main surface TS2 in the width direction W. The dimension d2 of the second main surface-side hydrophobic portion 72 in the length direction L increases from the second width direction side surface portion 721 toward the second width direction central portion 722. That is, the dimension d2 of the second main surface-side hydrophobic portion 72 in the length direction L increases from the first side surface WS1 side or the second side surface WS2 side in the width direction W of the second main surface TS2 toward the central portion in the width direction W.

[0126] The first side surface side hydrophobic portion 73 and the second side surface side hydrophobic portion 74 of this embodiment have the same configuration as those of the first embodiment, but may also have the same configuration as the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of this embodiment. The first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70 of this embodiment are arranged continuously via the first side surface side hydrophobic portion 73, and are also arranged continuously via the second side surface side hydrophobic portion 74.

[0127] The hydrophilic portion 80 of the second embodiment will be described below. Two hydrophilic portions 80, 80a and 80b, are arranged on the surface of the laminate 10.

[0128] 9, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the first principal surface TS1. Specifically, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed so as to cover the entire surface on the first principal surface TS1 between the first external electrode 40A and the hydrophobic portion 70. The first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B on the first principal surface TS1. Specifically, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed so as to cover the entire surface on the first principal surface TS1 between the hydrophobic portion 70 and the second external electrode 40B. That is, the dimension d3 in the longitudinal direction L of the first main surface side hydrophilic portion 81 of the hydrophilic portions 80a, 80b becomes smaller as it moves from the first side surface WS1 side or the second side surface WS2 side in the width direction W of the first main surface TS1 toward the center side in the width direction W.

[0129] 10 , the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a is disposed between the first external electrode 40A and the hydrophobic portion 70 on the second main surface TS2. Specifically, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a is disposed so as to cover the entire surface on the second main surface TS2 between the first external electrode 40A and the hydrophobic portion 70. Furthermore, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b is disposed between the hydrophobic portion 70 and the second external electrode 40B on the second main surface TS2. Specifically, the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b is disposed so as to cover the entire surface on the second main surface TS2 between the hydrophobic portion 70 and the second external electrode 40B. That is, the dimension d4 in the longitudinal direction L of the second main surface side hydrophilic portion 82 of the hydrophilic portions 80a, 80b becomes smaller as it moves from the first side surface WS1 side or the second side surface WS2 side in the width direction W of the second main surface TS2 toward the center side in the width direction W.

[0130] The first side surface side hydrophilic portion 83 and the second side surface side hydrophilic portion 84 of this embodiment have the same configuration as those of the first embodiment, but may also have the same configuration as the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of this embodiment. The first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80 of this embodiment are arranged continuously via the first side surface side hydrophilic portion 83, and are also arranged continuously via the second side surface side hydrophilic portion 84.

[0131] In addition to the above advantages (1) to (3), the multilayer ceramic capacitor 1 of this embodiment has the following advantages.

[0132] (4) The first main surface side hydrophobic portion 71 of the multilayer ceramic capacitor 1 according to this embodiment has a first width direction side portion 711 located on the first side surface TS1 side and the second side surface WS2 side in the width direction W, and a first width direction central portion 712 located toward the center in the width direction W. The second main surface side hydrophobic portion 72 has a second width direction side portion 721 located on the second main surface TS2 side and the first side surface WS1 side and the second side surface WS2 side in the width direction W, and a second width direction central portion 722 located toward the center in the width direction W. The dimension d1 in the length direction L of the first main surface side hydrophobic portion 71 increases from the first width direction side portion 711 toward the first width direction central portion 712, and the dimension d2 in the length direction L of the second main surface side hydrophobic portion 72 increases from the second width direction side portion 721 toward the second width direction central portion 722. As a result, the dimension d1 in the length direction L of the first principal surface side hydrophobic portion 71 and the dimension d2 in the length direction L of the second principal surface side hydrophobic portion 72 increase toward the center in the width direction W, so that water droplets W generated by condensation can be guided to the hydrophilic portion 80 and easily removed from the surface of the laminate 10, as shown in Figures 9 and 10. This makes it possible to more effectively suppress the formation of a water droplet path spanning between the first external electrode 40A and the second external electrode 40B.

[0133] Next, a multilayer ceramic capacitor 1 according to a third embodiment will be described. In the following description, detailed description of the same configuration as in the first embodiment will be omitted. Fig. 11 is a diagram showing the multilayer ceramic capacitor 1 according to the third embodiment, and corresponds to Fig. 7.

[0134] The multilayer ceramic capacitor 1 in accordance with the third embodiment differs from the first embodiment in the configuration of the hydrophobic portion 70 and the hydrophilic portion 80.

[0135] A plurality of hydrophobic portions 70 of the third embodiment are arranged on the surface of the laminate 10. As shown in FIG. 11 , three hydrophobic portions 70, i.e., hydrophobic portions 70a, 70b, and 70c, are arranged at intervals from each other in the longitudinal direction L between the first external electrode 40A and the second external electrode 40B on the surface of the laminate 10. Specifically, as shown in FIG. 11 , the hydrophobic portion 70a is arranged in the center of the longitudinal direction L, the hydrophobic portion 70b is arranged between the first external electrode 40A and the hydrophobic portion 70a, and the hydrophobic portion 70c is arranged between the hydrophobic portion 70a and the second external electrode 40B. Each hydrophobic portion 70 has a ring shape overall and is arranged across the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10.

[0136] Each hydrophobic portion 70 has a first main surface side hydrophobic portion 71 arranged on at least a portion of the first main surface TS1, a second main surface side hydrophobic portion 72 arranged on at least a portion of the second main surface TS2, a first side surface side hydrophobic portion 73 arranged on at least a portion of the first side surface WS1, and a second side surface side hydrophobic portion 74 arranged on at least a portion of the second side surface WS2.

[0137] As shown in FIG. 11 , the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a is arranged so as to extend in a strip-like shape in the width direction W at the center of the length direction L of the laminate 10. The first main surface side hydrophobic portion 71 extends from the end of the first main surface TS1 on the first side surface WS1 side to the end of the second side surface WS2 side in the width direction W. In this embodiment, the second main surface side hydrophobic portion 72, the first side surface side hydrophobic portion 73, and the second side surface side hydrophobic portion 74 of the hydrophobic portion 70a are arranged so as to extend in a strip-like shape in the width direction W at the center of the length direction L of the laminate 10, similar to the first main surface side hydrophobic portion 71. Furthermore, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70a are arranged contiguously via the first side surface side hydrophobic portion 73 and contiguously via the second side surface side hydrophobic portion 74.

[0138] 11, the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70b is disposed so as to extend in a strip-like shape in the width direction W between the first external electrode 40A and the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70a. The first main surface-side hydrophobic portion 71 of the hydrophobic portion 70b extends approximately parallel to the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70a, from the end on the first side face WS1 side to the end on the second side face WS2 side in the width direction W on the first main surface TS1. The first main surface-side hydrophobic portion 71 of the hydrophobic portion 70b is disposed at an interval with respect to the first external electrode 40A and the hydrophobic portion 70a. In this embodiment, the second main surface side hydrophobic portion 72, the first side surface side hydrophobic portion 73, and the second side surface side hydrophobic portion 74 of the hydrophobic portion 70b are arranged to extend in a strip-like shape in the width direction W between the first external electrode 40A and the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a. Furthermore, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70b are arranged continuously via the first side surface side hydrophobic portion 73, and are also arranged continuously via the second side surface side hydrophobic portion 74.

[0139] 11, the first main surface side hydrophobic portion 71 of the hydrophobic portion 70c is disposed so as to extend in a strip-like shape in the width direction W between the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a and the second external electrode 40B. The first main surface side hydrophobic portion 71 of the hydrophobic portion 70c extends approximately parallel to the first main surface side hydrophobic portion 71 of the hydrophobic portion 70c from the end on the first side face WS1 side to the end on the second side face WS2 side in the width direction W on the first main surface TS1. The first main surface side hydrophobic portion 71 of the hydrophobic portion 70c is disposed with a gap between the hydrophobic portion 70c and the second external electrode 40B. In this embodiment, the second main surface side hydrophobic portion 72, the first side surface side hydrophobic portion 73, and the second side surface side hydrophobic portion 74 of the hydrophobic portion 70c are arranged to extend in a strip-like shape in the width direction W between the first main surface side hydrophobic portion 71 of the hydrophobic portion 70a and the second external electrode 40B. Furthermore, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 of the hydrophobic portion 70c are arranged continuously via the first side surface side hydrophobic portion 73, and are also arranged continuously via the second side surface side hydrophobic portion 74.

[0140] A plurality of hydrophilic portions 80 of the third embodiment are arranged on the surface of the laminate 10. As shown in FIG. 11 , four hydrophilic portions 80, i.e., hydrophilic portions 80a, 80b, 80c, and 80d, are arranged at intervals from one another in the longitudinal direction L between the first external electrode 40A and the second external electrode 40B on the surface of the laminate 10. Specifically, as shown in FIG. 11 , the hydrophilic portion 80a is arranged between the first external electrode 40A and the hydrophobic portion 70b, the hydrophilic portion 80b is arranged between the hydrophobic portion 70b and the hydrophobic portion 70a, the hydrophilic portion 80c is arranged between the hydrophobic portion 70a and the hydrophobic portion 70c, and the hydrophilic portion 80d is arranged between the hydrophobic portion 70c and the second external electrode 40B. That is, the hydrophobic portion 70 is sandwiched between the hydrophilic portions 80 in the longitudinal direction L. Each hydrophilic portion 80 has a ring shape as a whole, and is arranged across the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10.

[0141] Each hydrophilic portion 80 has a first main surface side hydrophilic portion 81 arranged on at least a portion of the first main surface TS1, a second main surface side hydrophilic portion 82 arranged on at least a portion of the second main surface TS2, a first side surface side hydrophilic portion 83 arranged on at least a portion of the first side surface WS1, and a second side surface side hydrophilic portion 84 arranged on at least a portion of the second side surface WS2.

[0142] 11 , the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed so as to extend in a strip-like shape in the width direction W between the first external electrode 40A and the hydrophobic portion 70b. Specifically, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed so as to cover the entire surface of the first main surface TS1 between the first external electrode 40A and the hydrophobic portion 70b. That is, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80a is disposed so as to contact the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70b. The first main surface-side hydrophilic portion 81 of the hydrophilic portion 80a extends from the end portion on the first main surface TS1 on the first side surface WS1 side to the end portion on the second side surface WS2 side in the width direction W. In this embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80a are arranged to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70b, similar to the first main surface side hydrophilic portion 81. Furthermore, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80a are arranged continuously via the first side surface side hydrophilic portion 83, and are also arranged continuously via the second side surface side hydrophilic portion 84.

[0143] 11 , the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed so as to extend in a strip-like shape in the width direction W between the hydrophobic portion 70b and the hydrophobic portion 70a. Specifically, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed so as to cover the entire surface between the hydrophobic portion 70b and the hydrophobic portion 70a on the first main surface TS1. That is, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b is disposed so as to be in contact with both the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70a and the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70b. The first main surface-side hydrophilic portion 81 of the hydrophilic portion 80b extends from the end portion on the first side surface TS1 on the first side surface WS1 side to the end portion on the second side surface WS2 side in the width direction W on the first main surface TS1. In this embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80b are arranged to cover the entire surface between the hydrophobic portion 70b and the hydrophobic portion 70a, similar to the first main surface side hydrophilic portion 81. Furthermore, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80b are arranged continuously via the first side surface side hydrophilic portion 83, and are also arranged continuously via the second side surface side hydrophilic portion 84.

[0144] As shown in Fig. 11 , the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80c is disposed so as to extend in a strip-like shape in the width direction W between the hydrophobic portion 70a and the hydrophobic portion 70c. Specifically, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80c is disposed so as to cover the entire surface between the hydrophobic portion 70a and the hydrophobic portion 70c on the first main surface TS1. That is, the first main surface-side hydrophilic portion 81 of the hydrophilic portion 80c is disposed so as to be in contact with both the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70a and the first main surface-side hydrophobic portion 71 of the hydrophobic portion 70c. The first main surface-side hydrophilic portion 81 of the hydrophilic portion 80c extends from the end portion on the first side surface WS1 side to the end portion on the second side surface WS2 side in the width direction W on the first main surface TS1. In this embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80c are arranged to cover the entire surface between the hydrophobic portion 70a and the hydrophobic portion 70c, similar to the first main surface side hydrophilic portion 81. Furthermore, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80c are arranged continuously via the first side surface side hydrophilic portion 83, and are also arranged continuously via the second side surface side hydrophilic portion 84.

[0145] As shown in Fig. 11 , the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80d is disposed so as to extend in a strip-like shape in the width direction W between the hydrophobic portion 70c and the second external electrode 40B. Specifically, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80d is disposed so as to cover the entire surface of the first principal surface TS1 between the hydrophobic portion 70c and the second external electrode 40B. That is, the first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80d is disposed so as to be in contact with the first principal surface-side hydrophobic portion 71 of the hydrophobic portion 70c. The first principal surface-side hydrophilic portion 81 of the hydrophilic portion 80d extends from the end portion on the first principal surface TS1 on the first side surface WS1 side to the end portion on the second side surface WS2 side in the width direction W. In this embodiment, the second main surface side hydrophilic portion 82, the first side surface side hydrophilic portion 83, and the second side surface side hydrophilic portion 84 of the hydrophilic portion 80d are arranged to cover the entire surface between the hydrophobic portion 70c and the second external electrode 40B, similar to the first main surface side hydrophilic portion 81. Furthermore, the first main surface side hydrophilic portion 81 and the second main surface side hydrophilic portion 82 of the hydrophilic portion 80d are arranged continuously via the first side surface side hydrophilic portion 83, and are also arranged continuously via the second side surface side hydrophilic portion 84.

[0146] In addition to the above advantages (1) to (3), the multilayer ceramic capacitor 1 of this embodiment has the following advantages.

[0147] (5) The multilayer ceramic capacitor 1 according to this embodiment has a plurality of hydrophobic portions 70. This structure in which a plurality of hydrophobic portions 70 are arranged allows water droplets W generated by condensation to be guided to the hydrophilic portions 80, more effectively suppressing the formation of a water droplet path spanning the first external electrode 40A and the second external electrode 40B. Furthermore, because each of the plurality of hydrophobic portions 70 is sandwiched between the hydrophilic portions 80 in the length direction L, the water droplets W can be guided from each hydrophobic portion 70 to the hydrophilic portions 80 and efficiently removed from the surface of the laminate 10, as shown in FIG. 11 .

[0148] Next, a multilayer ceramic capacitor 1 according to a fourth embodiment will be described. In the following description, detailed description of the same configuration as in the first embodiment will be omitted. FIG. 12 is a view showing the multilayer ceramic capacitor 1 according to the fourth embodiment, corresponding to FIG. 7. FIG. 13 is a virtual arrow view showing the second end face LS2 of the multilayer ceramic capacitor 1 shown in FIG. 12, excluding the second external electrode 40B from the multilayer ceramic capacitor 1, viewed along the virtual XIII direction. In FIG. 12, the outline of the multilayer body 10 covered with the hydrophobic portion 70, the hydrophilic portion 80, and the external electrode 40 is indicated by a dashed line. In FIG. 13, the outline of the multilayer body 10 covered with the hydrophobic portion 70 is indicated by a dashed line.

[0149] The multilayer ceramic capacitor 1 in accordance with the fourth embodiment differs from the first embodiment in the configuration of the laminate 10 and the hydrophobic portion 70.

[0150] The laminate 10 of this embodiment differs from the laminate 10 of the first embodiment in that it has a first main surface side convex portion 91, a second main surface side convex portion 92, a first side surface side convex portion 93, and a second side surface side convex portion 94 on its surface.

[0151] The first main surface side protrusion 91 protrudes in a direction away from the laminate 10 at the center of the first main surface TS1 in the length direction L. The first main surface side protrusion 91 is formed to extend continuously in the width direction W. The first main surface side protrusion 91 is arranged at a distance from the first external electrode 40A and the second external electrode 40B. The first main surface side protrusion 91 is arranged on the first main surface TS1 in the width direction W, from the end on the first side surface WS1 side to the end on the second side surface WS2 side.

[0152] The second main surface convex portion 92 protrudes in a direction away from the laminate 10 at the center of the second main surface TS2 in the length direction L. The second main surface convex portion 92 is formed to extend continuously in the width direction W. The second main surface convex portion 92 is arranged at a distance from the first external electrode 40A and the second external electrode 40B. The second main surface convex portion 92 is arranged on the first main surface TS1 in the width direction W, from the end on the first side surface WS1 side to the end on the second side surface WS2 side.

[0153] The first side surface convex portion 93 protrudes in a direction away from the laminate 10 at the center of the first side surface WS1 in the length direction L. The first side surface convex portion 93 is formed to extend continuously in the height direction T. The first side surface convex portion 93 is arranged at a distance from the first external electrode 40A and the second external electrode 40B. The first side surface convex portion 93 is arranged on the first side surface WS1 in the height direction T, from the end on the first main surface TS1 side to the end on the second main surface TS2 side.

[0154] The second side surface convex portion 94 protrudes in a direction away from the laminate 10 at the center of the first side surface WS1 in the length direction L. The second side surface convex portion 94 is formed to extend continuously in the height direction T. The second side surface convex portion 94 is arranged at a distance from the first external electrode 40A and the second external electrode 40B. The second side surface convex portion 94 is arranged on the first side surface WS1 in the height direction T, from the end on the first main surface TS1 side to the end on the second main surface TS2 side.

[0155] As shown in Figure 13, in the laminate 10 of this embodiment, the first main surface side convex portion 91 and the second main surface side convex portion 92 are arranged continuously via the first side surface side convex portion 93 and also arranged continuously via the second side surface side convex portion 94.

[0156] The hydrophobic portion 70 of this embodiment has a first main surface side hydrophobic portion 71, a second main surface side hydrophobic portion 72, a first side surface side hydrophobic portion 73, and a second side surface side hydrophobic portion 74.

[0157] The first principal surface side hydrophobic portion 71 is disposed on the first principal surface side convex portion 91. Specifically, the first principal surface side hydrophobic portion 71 is disposed so as to cover the first principal surface side convex portion 91. That is, the first principal surface side hydrophobic portion 71 is disposed so as to extend in the width direction W at the center of the length direction L of the first principal surface TS1. The first principal surface side hydrophobic portion 71 is disposed on the first principal surface TS1 from the end on the first side surface WS1 side to the end on the second side surface WS2 side in the width direction W.

[0158] The second principal surface side hydrophobic portion 72 is disposed on the second principal surface side convex portion 92. Specifically, the second principal surface side hydrophobic portion 72 is disposed so as to cover the second principal surface side convex portion 92. That is, the second principal surface side hydrophobic portion 72 is disposed so as to extend in the width direction W at the center of the length direction L of the second principal surface TS2. The second principal surface side hydrophobic portion 72 is disposed on the second principal surface TS2 in the width direction W from the end portion on the first side surface WS1 side to the end portion on the second side surface WS2 side.

[0159] The first side surface side hydrophobic portion 73 is disposed on the first side surface side convex portion 93. Specifically, the first side surface side hydrophobic portion 73 is disposed so as to cover the first side surface side convex portion 93. That is, the first side surface side hydrophobic portion 73 is disposed so as to extend in the height direction T at the center of the length direction L of the first side surface WS1. The first side surface side hydrophobic portion 73 is disposed on the first side surface WS1 from the end on the first main surface TS1 side to the end on the second main surface TS2 side in the height direction T.

[0160] The second side surface side hydrophobic portion 74 is disposed on the second side surface side protrusion 94. Specifically, the second side surface side hydrophobic portion 74 is disposed so as to cover the second side surface side protrusion 94. That is, the second side surface side hydrophobic portion 74 is disposed so as to extend in the height direction T at the center of the length direction L of the second side surface WS2. The second side surface side hydrophobic portion 74 is disposed on the second side surface WS2 from the end on the first main surface TS1 side to the end on the second main surface TS2 side in the height direction T.

[0161] 13 , in the hydrophobic portion 70 of this embodiment, the first main surface side hydrophobic portion 71 and the second main surface side hydrophobic portion 72 are arranged continuously via the first side surface side hydrophobic portion 73, and are also arranged continuously via the second side surface side hydrophobic portion 74. That is, the hydrophobic portion 70 is ring-shaped as a whole, and is arranged across the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 of the laminate 10.

[0162] The hydrophilic portion 80 of this embodiment has two hydrophilic portions 80a and 80b arranged therein, similar to the first embodiment. The hydrophilic portion 80a is arranged so as to cover the entire surface between the first external electrode 40A and the hydrophobic portion 70. The hydrophilic portion 80b is arranged so as to cover the entire surface between the hydrophobic portion 70 and the second external electrode 40B. That is, the hydrophobic portion 70 is sandwiched between the hydrophilic portions 80 in the length direction L, and is in contact with both the hydrophilic portion 80a and the hydrophilic portion 80b.

[0163] In addition to the above advantages (1) to (3), the multilayer ceramic capacitor 1 of this embodiment has the following advantages.

[0164] (6) The laminate 10 of the multilayer ceramic capacitor 1 according to this embodiment has a first main surface side protrusion 91 that protrudes in a direction away from the surface of the laminate 10 at the center of the length direction L of the first main surface TS1, a second main surface side protrusion 92 that protrudes in a direction away from the surface of the laminate 10 at the center of the length direction L of the second main surface TS2, a first side surface side protrusion 93 that protrudes in a direction away from the surface of the laminate 10 at the center of the length direction L of the first side surface WS1, and a second side surface side protrusion 94 that protrudes in a direction away from the surface of the laminate 10 at the center of the length direction L of the second side surface WS2. and a second side surface side convex portion 94 protruding in a direction away from the surface of the substrate 0, the first main surface side convex portion 91 and the second main surface side convex portion 92 being arranged continuously via the first side surface side convex portion 93 and also being arranged continuously via the second side surface side convex portion 94, the first main surface side hydrophobic portion 71 being arranged on the first main surface side convex portion 91, the second main surface side hydrophobic portion 72 being arranged on the second main surface side convex portion 92, the first side surface side hydrophobic portion 73 being arranged on the first side surface side convex portion 93, and the second side surface side hydrophobic portion 74 being arranged on the second side surface side convex portion 94. As a result, the first external electrode 40A side and the second external electrode 40B side in the length direction L of the laminate 10 protrude from the surface of the laminate 10 and are partitioned by the areas where the hydrophobic sections 70 are arranged, thereby suppressing the formation of a water droplet path that straddles the first external electrode 40A and the second external electrode 40B. Furthermore, because the hydrophobic sections 70 are sandwiched between the hydrophilic sections 80, water droplets W generated by condensation can be guided to the hydrophilic sections 80, more effectively suppressing the formation of a water droplet path that straddles the first external electrode 40A and the second external electrode 40B.

[0165] The present invention is not limited to the configurations of the above-described embodiments, and can be appropriately modified and applied within the scope of the present invention. Note that the present invention also includes a combination of two or more of the individual desirable configurations described in the above-described embodiments.

[0166] The multilayer ceramic capacitor 1 of the present invention can also be described as follows. <1> a laminate including a plurality of laminated dielectric layers, the laminate having a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction and the width direction; a first internal electrode layer disposed on the plurality of dielectric layers and exposed at the first end surface; a second internal electrode layer disposed on the plurality of dielectric layers and exposed at the second end surface; a first external electrode disposed on the first end surface; a second external electrode disposed on the second end surface, a hydrophilic portion and a hydrophobic portion are disposed on the surface of the laminate; The hydrophilic part is a first-principal-surface-side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the first principal surface; a second-principal-surface-side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the second principal surface; a first side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the first side surface; a second side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the second side surface, The hydrophobic portion is a first-principal-surface-side hydrophobic portion that is disposed on at least a portion of the first principal surface and contains at least one of fluorine and silicone; a second-principal-surface-side hydrophobic portion that is disposed on at least a portion of the second principal surface and contains at least one of fluorine and silicone; a first side surface side hydrophobic portion that is disposed on at least a portion of the first side surface and contains at least one of fluorine and silicone; a second-side hydrophobic portion that is disposed on at least a portion of the second side surface and contains at least one of fluorine and silicone.

[0167] <2> the first main surface side hydrophilic portion and the second main surface side hydrophilic portion are disposed continuously via the first side surface side hydrophilic portion and also continuously via the second side surface side hydrophilic portion, the first main surface side hydrophobic portion and the second main surface side hydrophobic portion are disposed continuously via the first side surface side hydrophobic portion, and are also disposed continuously via the second side surface side hydrophobic portion. <1> The multilayer ceramic capacitor according to claim 1.

[0168] <3> The hydrophobic portion is sandwiched between the hydrophilic portions in the longitudinal direction. <1> or <2> The multilayer ceramic capacitor according to claim 1.

[0169] <4> the first main surface-side hydrophobic portion has a first width direction side portion located on the first side surface side and the second side surface side in the width direction of the first main surface, and a first width direction central portion located on the width direction central portion side, the second main surface-side hydrophobic portion has second width direction side portions located on the first side surface side and the second side surface side in the width direction of the second main surface, and a second width direction central portion located on the width direction central portion side, a dimension in the length direction of the first main surface side hydrophobic portion increases from the first width direction side portion toward the first width direction central portion, the dimension in the length direction of the second main surface side hydrophobic portion increases from the second width direction side portion toward the second width direction central portion; <1> from <3> 10. The multilayer ceramic capacitor according to claim 9, wherein the first and second electrodes are electrically connected to the first and second electrodes.

[0170] <5> The hydrophobic portion is arranged in plurality. <1> from <4> 10. The multilayer ceramic capacitor according to claim 9, wherein the first and second electrodes are electrically connected to the first and second electrodes.

[0171] <6> The laminate is a first main surface side convex portion that protrudes in a direction away from the surface of the laminate at a center portion in the length direction of the first main surface; a second main surface side convex portion that protrudes in a direction away from the surface of the laminate at a center portion in the length direction of the second main surface; a first side surface protrusion protruding in a direction away from the surface of the laminate at a center in the length direction of the first side surface; a second side surface protrusion protruding in a direction away from the surface of the laminate at a center of the second side surface in the length direction, the first main surface convex portion and the second main surface convex portion are arranged continuously via the first side surface convex portion and also continuously via the second side surface convex portion, the first main surface side hydrophobic portion is disposed on the first main surface side convex portion, the second main surface side hydrophobic portion is disposed on the second main surface side convex portion, the first side hydrophobic portion is disposed on the first side protrusion, the second side hydrophobic portion is disposed on the second side protrusion; <1> from <5> 10. The multilayer ceramic capacitor according to claim 9, wherein the first and second electrodes are electrically connected to the first and second electrodes. [Explanation of symbols]

[0172] 1. Multilayer ceramic capacitors 10 Laminate 11 Inner layer 12 First main surface side outer layer portion 13 Second main surface side outer layer 20 dielectric layer 31 First internal electrode layer 32 Second internal electrode layer 40A First outer electrode 40B Second external electrode 70, 70a, 70b, 70c Hydrophobic part 71 first main surface side hydrophobic portion 72 second main surface side hydrophobic portion 73 First side hydrophobic portion 74 Second side hydrophobic portion 80, 80a, 80b, 80c, 80d hydrophilic part 81 first main surface side hydrophilic portion 82 Second main surface side hydrophilic portion 83 First side hydrophilic portion 84 Second side hydrophilic part L lengthwise LS1 First end face LS2 Second end face T Stacking direction TS1 First principal surface TS2 Second principal surface W width direction WS1 First Aspect WS2 Second Aspect

Claims

1. a laminate including a plurality of laminated dielectric layers, the laminate having a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the height direction and the width direction; a first internal electrode layer disposed on the plurality of dielectric layers and exposed at the first end surface; a second internal electrode layer disposed on the plurality of dielectric layers and exposed at the second end surface; a first external electrode disposed on the first end surface; a second external electrode disposed on the second end surface, a hydrophilic portion and a hydrophobic portion are disposed on the surface of the laminate; The hydrophilic part is a first-principal-surface-side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the first principal surface; a second-principal-surface-side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the second principal surface; a first side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the first side surface; a second side hydrophilic portion having a hydroxyl group and disposed on at least a portion of the second side surface, The hydrophobic portion is a first-principal-surface-side hydrophobic portion that is disposed on at least a portion of the first principal surface and contains at least one of fluorine and silicone; a second-principal-surface-side hydrophobic portion that is disposed on at least a portion of the second principal surface and contains at least one of fluorine and silicone; a first side surface side hydrophobic portion that is disposed on at least a portion of the first side surface and contains at least one of fluorine and silicone; a second-side hydrophobic portion disposed on at least a portion of the second side surface, the second-side hydrophobic portion containing at least one of fluorine and silicone.

2. the first main surface-side hydrophilic portion and the second main surface-side hydrophilic portion are disposed continuously via the first side surface-side hydrophilic portion and also continuously via the second side surface-side hydrophilic portion, 2. The multilayer ceramic capacitor according to claim 1, wherein the first main surface side hydrophobic portion and the second main surface side hydrophobic portion are arranged continuously via the first side surface side hydrophobic portion and also arranged continuously via the second side surface side hydrophobic portion.

3. 3. The multilayer ceramic capacitor according to claim 1, wherein the hydrophobic portion is sandwiched between the hydrophilic portions in the lengthwise direction.

4. the first main surface-side hydrophobic portion has first width direction side portions located on the first side surface side and the second side surface side in the width direction of the first main surface, and a first width direction central portion located on the width direction central portion side, the second main surface-side hydrophobic portion has second width direction side portions located on the first side surface side and the second side surface side in the width direction of the second main surface, and a second width direction central portion located on the width direction central portion side, a dimension in the length direction of the first main surface side hydrophobic portion increases from the first width direction side portion toward the first width direction central portion, 3. The multilayer ceramic capacitor according to claim 1, wherein the lengthwise dimension of the second main surface side hydrophobic portion increases from the second widthwise side portion toward the second widthwise central portion.

5. 3. The multilayer ceramic capacitor according to claim 1, wherein a plurality of the hydrophobic portions are arranged.

6. The laminate is a first main surface side convex portion that protrudes in a direction away from the surface of the laminate at a center portion in the length direction of the first main surface; a second main surface side convex portion that protrudes in a direction away from the surface of the laminate at a center portion in the length direction of the second main surface; a first side surface protrusion protruding in a direction away from the surface of the laminate at a center in the length direction of the first side surface; a second side surface protrusion protruding in a direction away from the surface of the laminate at a center of the second side surface in the length direction, the first main surface convex portion and the second main surface convex portion are arranged continuously via the first side surface convex portion and also continuously via the second side surface convex portion, the first main surface side hydrophobic portion is disposed on the first main surface side convex portion, the second main surface side hydrophobic portion is disposed on the second main surface side convex portion, the first side hydrophobic portion is disposed on the first side protrusion, 3. The multilayer ceramic capacitor according to claim 1, wherein the second side surface hydrophobic portion is disposed on the second side surface convex portion.

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