Multilayer electronic components

Abstract

To provide a multilayer electronic component having improved capacitance per unit volume and improved reliability.SOLUTION: A multilayer electronic component includes: a rectangular parallelepiped body 110 including a first internal electrode 121 and a second internal electrode 122 alternately disposed in a first direction with a dielectric layer 111 interposed therebetween, the body having first to sixth faces; a first connection portion 131 including a first conductive layer 131a connected to the first internal electrode and a first insulating layer 131b disposed on the first conductive layer; a second connection portion 132 including a second conductive layer 132a connected to the second internal electrode and a second insulating layer 132b disposed on the second conductive layer; a first external electrode 141 including a first electrode layer 141a connected to the first conductive layer, and a first plating layer 141b disposed on the first electrode layer, the first external electrode disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode 142 including a second electrode layer 142a connected to the second conductive layer and a second plating layer 142b disposed on the second electrode layer, the second external electrode disposed away from the first external electrode, on a surface where the first external electrode is disposed.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small in size, having high capacitance, and being easy to mount, and can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for smaller multilayer ceramic capacitors with higher capacitance.

[0004] Recently, interest in automotive electrical components has increased in the industry, and multilayer ceramic capacitors are being used in automobiles and infotainment systems, so they are being required to have high reliability.

[0005] In order to reduce the size and increase the capacitance of multilayer ceramic capacitors, it is necessary to increase the number of layers by forming the internal electrodes and dielectric layers thin, and it is necessary to increase the effective volume fraction required to achieve capacitance by thinning the external electrodes.

[0006] Conventionally, when forming external electrodes, a method of dipping the exposed surface of the main body where the internal electrodes are located into a paste containing a conductive metal has been mainly used.

[0007] However, the external electrodes formed by the dipping method have a problem in that the thickness of the external electrodes at the center of the thickness direction is too thick, and the external electrodes are formed on the surfaces of the body other than the surface where the internal electrodes are exposed, making it difficult to ensure a high effective volume ratio. Summary of the Invention [Problem to be solved by the invention]

[0008] One of several objects of the present invention is to provide a multilayer electronic component having improved capacitance per unit volume.

[0009] One of several objects of the present invention is to provide a multilayer electronic component with improved reliability.

[0010] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer, first and second internal electrodes alternately arranged in a first direction with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing the third direction; a first connecting portion including a first conductive layer arranged on the third surface and connected to the first internal electrode, and a first insulating layer arranged on the first conductive layer; a second connecting portion including a second conductive layer connected to the second internal electrode and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer and a first plating layer disposed on the first electrode layer, and disposed on one of the first, second, fifth and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer and a second plating layer disposed on the second electrode layer, and disposed spaced apart from the first external electrode on the surface on which the first external electrode is disposed. [Effects of the Invention]

[0012] One of the advantages of the present invention is that the capacitance per unit volume of the multilayer electronic component is improved by arranging the connecting portions on the third and fourth surfaces of the main body and arranging the external electrodes on any one of the first, second, fifth, and sixth surfaces of the main body.

[0013] One of the advantages of the present invention is that an insulating layer is disposed on the conductive layer of the interconnection portion, thereby improving reliability.

[0014] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] 2 is a schematic perspective view of the main body excluding the connecting portion and the external electrode in FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] FIG. 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 5] 1 is an exploded perspective view showing a main body in which dielectric layers and internal electrodes are stacked according to an embodiment of the present invention; [Figure 6] 1 is a diagram illustrating a method for manufacturing a multilayer electronic component according to an embodiment of the present invention; [Figure 7] 1 is a diagram illustrating a method for manufacturing a multilayer electronic component according to an embodiment of the present invention; [Figure 8] 1 is a diagram illustrating a method for manufacturing a multilayer electronic component according to an embodiment of the present invention; [Figure 9] FIG. 2 is a cross-sectional view taken along line II' of FIG. 1, showing a modified example of one embodiment of the present invention. [Figure 10] FIG. 2 is a cross-sectional view taken along line II' of FIG. 1, showing another modified example of one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0017] In addition, in the drawings, parts not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain component, it does not mean that it excludes other components, but that it may further include other components, unless otherwise specified to the contrary.

[0018] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0019] FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic perspective view of a main body excluding connecting portions and external electrodes in FIG. 1, FIG. 3 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 4 is a cross-sectional view taken along line II-II' in FIG. 1, and FIG. 5 is an exploded perspective view schematically showing a main body in which dielectric layers and internal electrodes are stacked according to one embodiment of the present invention.

[0020] A multilayer electronic component 100 according to one embodiment of the present invention will now be described with reference to FIGS.

[0021] A multilayer electronic component 100 according to one embodiment of the present invention includes a main body 110 including a dielectric layer 111, first and second internal electrodes 121, 122 alternately arranged in a first direction with the dielectric layer sandwiched therebetween, first and second surfaces 1, 2 facing the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing the third direction; a first connecting portion 131 including a first conductive layer 131a arranged on the third surface and connected to the first internal electrode 121, and a first insulating layer 131b arranged on the first conductive layer; a second connecting part 132 including a second conductive layer 132a connected to the second internal electrode 122 and a second insulating layer 132b arranged on the second conductive layer; a first external electrode 141 including a first electrode layer 141a connected to the first conductive layer and a first plating layer 141b arranged on the first electrode layer and arranged on one of the first, second, fifth and sixth surfaces; and a second external electrode 142 including a second electrode layer 142a connected to the second conductive layer and a second plating layer 142b arranged on the second electrode layer and arranged spaced apart from the first external electrode on the surface where the first external electrode is arranged.

[0022] The body 110 is formed by alternately laminating dielectric layers 111 and internal electrodes 121 and 122 .

[0023] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawing, the body 110 may be hexahedral or a similar shape. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0024] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4, and facing each other in the third direction.

[0025] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to the extent that they are difficult to see without using a scanning electron microscope (SEM).

[0026] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can provide sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material may include a BaTiO3-based ceramic powder, and the ceramic powder may be, for example, BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), or the like (BaTiO3). 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3 and the like.

[0027] In addition, the raw material for forming the dielectric layer 111 may be a powder such as barium titanate (BaTiO3), to which various ceramic additives, organic solvents, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0028] On the other hand, the thickness td of the dielectric layer 111 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness td of the dielectric layer 111 may be 0.6 μm or less. Here, the thickness td of the dielectric layer 111 may mean the average thickness of the dielectric layer 111.

[0029] The main body 110 is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 arranged to face each other with a dielectric layer 111 sandwiched therebetween, and may include a capacitance forming portion Ac in which capacitance is formed, and cover portions 112 and 113 formed at the top and bottom of the capacitance forming portion Ac in a first direction.

[0030] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 sandwiched therebetween.

[0031] The cover parts 112 and 113 may include an upper cover part 112 disposed on an upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed on a lower part of the capacitance forming part Ac in the first direction.

[0032] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0033] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0034] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0035] On the other hand, there is no need to particularly limit the thickness of the cover portions 112 and 113. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness tp of the cover portions 112 and 113 can be 20 μm or less.

[0036] Moreover, margin portions 114 and 115 can be arranged on the side surfaces of the capacitance forming portion Ac.

[0037] The margin portions 114, 115 may include a margin portion 114 disposed on the fifth surface 5 of the body 110 and a margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the ceramic body 110 in the width direction.

[0038] The margin portions 114 and 115 may refer to the regions between both ends of the first and second internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG. 3.

[0039] The margin portions 114 and 115 basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0040] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the portions where the margin portions are to be formed, and forming an internal electrode.

[0041] In addition, in order to suppress steps caused by the internal electrodes 121, 122, the laminated internal electrodes can be cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115.

[0042] The internal electrodes 121 and 122 are stacked alternately with the dielectric layers 111 .

[0043] The internal electrodes 121, 122 may include first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 are alternately arranged to face each other with the dielectric layer 111 constituting the body 110 sandwiched therebetween, and may be exposed to the third and fourth surfaces 3, 4 of the body 110, respectively.

[0044] 3, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first conductive layer 131a may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second conductive layer 132a may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0045] That is, the first internal electrode 121 is not connected to the second conductive layer 132a but is connected to the first conductive layer 131a, and the second internal electrode 122 is not connected to the first conductive layer 131a but is connected to the second conductive layer 132a. Therefore, the first internal electrode 121 may be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 may be formed at a certain distance from the third surface 3.

[0046] At this time, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0047] The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked sheets.

[0048] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0049] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof onto a ceramic green sheet. The method for printing the conductive paste for internal electrodes may be screen printing or gravure printing, but the present invention is not limited thereto.

[0050] Meanwhile, the thickness te of the internal electrodes 121, 122 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness te of the internal electrodes 121, 122 may be 0.6 μm or less. Here, the thickness te of the internal electrodes 121, 122 may mean the average thickness of the internal electrodes 121, 122.

[0051] The connecting portions 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the main body 110 .

[0052] The connecting portions 131 and 132 may include a first connecting portion 131 disposed on the third surface 3 of the body 110 and a second connecting portion 132 disposed on the fourth surface 4 of the body 110 .

[0053] The first connecting part 131 may include a first conductive layer 131a disposed on the third surface 3 and connected to the first internal electrode 121, and a first insulating layer 131b disposed on the first conductive layer 131a. The second connecting part 132 may include a second conductive layer 132a disposed on the fourth surface 4 and connected to the second internal electrode 122, and a second insulating layer 132b disposed on the second conductive layer 132a.

[0054] Conventionally, external electrodes have been formed by dipping the exposed surface of the body where the internal electrodes are located into a paste containing a conductive metal. However, external electrodes formed using the dipping method can be too thick at the center of the thickness direction. Even if the uneven thickness of the external electrodes caused by the dipping method does not occur, the internal electrodes are exposed on the third and fourth surfaces of the body, so the external electrodes on the third and fourth surfaces are formed to a certain thickness to prevent moisture and plating solution from penetrating through the external electrodes.

[0055] On the other hand, in the present invention, insulating layers 131b and 132b are arranged on the conductive layers 131a and 132a, so that sufficient reliability can be ensured even if the thickness of the conductive layers 131a and 132a on the third and fourth surfaces where the internal electrodes are exposed is made thin.

[0056] 1, the first and second conductive layers 131a and 132a may have shapes corresponding to the third and fourth surfaces, respectively, and the surfaces of the first and second conductive layers 131a and 132a facing the main body may have the same areas as the third and fourth surfaces of the main body, respectively. The first and second conductive layers 131a and 132a may be arranged so as not to deviate from the third and fourth surfaces 3 and 4. The first and second conductive layers 131a and 132a may be arranged so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110.

[0057] Furthermore, the first and second conductive layers 131a and 132a can have a uniform and thin thickness compared to external electrodes formed by a conventional dipping method.

[0058] The method for forming the first and second conductive layers 131a and 132a is not particularly limited, but may be formed, for example, by transferring a sheet containing a conductive metal, an organic material such as a binder, etc. to the third and fourth surfaces.

[0059] The thickness of the conductive layers 131a and 132a is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness of the conductive layers 131a and 132a may refer to the maximum thickness or the size of the conductive layers 131a and 132a in the second direction.

[0060] In one embodiment, the conductive layers 131a, 132a may contain the same metal and glass as the metal contained in the internal electrodes 121, 122. When the conductive layers 131a, 132a contain the same metal as the metal contained in the internal electrodes 121, 122, the electrical connection between the conductive layers 131a, 132a and the internal electrodes 121, 122 may be improved, and when the conductive layers 131a, 132a contain glass, the bonding strength between the insulating layers 131b, 132b and the body 110 may be improved. In this case, the same metal as the metal contained in the internal electrodes 121, 122 may be Ni.

[0061] The first and second insulating layers 131b and 132b are disposed on the first and second conductive layers 131a and 132a, respectively, and serve to prevent a plating layer from being formed on the conductive layers 131a and 132a. In addition, the insulating layers 131b and 132b improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside.

[0062] The insulating layers 131b and 132b may include an insulating material. The insulating material is not particularly limited, but may be, for example, an insulating resin, ceramic, or the like.

[0063] The size of the insulating layers 131b and 132b in the first direction may be 80% or more of the size of the conductive layers 131a and 132a in the first direction. If the size of the insulating layers 131b and 132b in the first direction is less than 80% of the size of the conductive layers 131a and 132a in the first direction, the effect of preventing the formation of a plating layer and the effect of improving sealing properties may be insufficient. On the other hand, there is no particular upper limit, and the insulating layers 131b and 132b may be arranged to extend partially onto the first and second surfaces of the main body 100 as long as the size of the multilayer electronic component 100 in the first direction is not increased.

[0064] The method for forming the insulating layers 131b and 132b is not particularly limited, but may be, for example, a method of transferring a sheet containing an organic material such as BaTiO3 or a binder onto the conductive layers 131a and 131b.

[0065] The thickness of the insulating layers 131b and 132b is not particularly limited, but may be, for example, 3 to 15 μm. Here, the thickness of the insulating layers 131b and 132b may refer to the maximum thickness or the size of the insulating layers 131b and 132b in the second direction.

[0066] The external electrodes 141 and 142 may be disposed on any one of the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the body 110.

[0067] The external electrodes 141, 142 may include a first external electrode 141 including a first electrode layer 141a connected to the first conductive layer 131a and a first plating layer 141b disposed on the first electrode layer 141a, and a second external electrode 142 including a second electrode layer 142a connected to the second conductive layer 132a and a second plating layer 142b disposed on the second electrode layer 142a.

[0068] The electrode layers 141a and 142a are connected to the conductive layers 131a and 132a, so that the electrode layers 141a and 142a and the internal electrodes 121 and 122 can be electrically connected to each other via the conductive layers 131a and 131b.

[0069] External electrodes formed by the conventional dipping method are thick on the third and fourth sides and extend partially to the first, second, fifth, and sixth sides, making it difficult to ensure a high effective volume ratio.

[0070] Meanwhile, the external electrodes 141 and 142 according to the present invention are arranged on one of the first, second, fifth and sixth surfaces, thereby ensuring a high effective volume ratio. In this case, the surface on which the external electrodes 141 and 142 are arranged may become the mounting surface.

[0071] When the external electrodes 141, 142 are arranged on the first or second surface, the multilayer electronic component 100 can be mounted horizontally on a substrate so that the internal electrodes 121, 122 are parallel to the mounting surface.

[0072] Furthermore, when the external electrodes 141, 142 are arranged on the fifth or sixth surface, the multilayer electronic component 100 can be mounted vertically on the substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0073] The electrode layers 141a and 142a may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc. For example, the electrode layers 141a and 142a may be fired electrodes including a conductive metal and glass, and may be formed by applying a paste including a conductive metal and glass to any one of the first, second, fifth, and sixth surfaces of the main body.

[0074] The conductive metal contained in the electrode layers 141a and 142a may be any material having excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0075] The plating layers 141b and 142b may be disposed on the electrode layers 141a and 142a. The plating layers 141b and 142b serve to improve mounting characteristics. The type of the plating layers 141b and 142b is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0076] As a more specific example of the plating layers 141b and 142b, the plating layers 141b and 142b may be Ni plating layers or Sn plating layers, and may be formed by sequentially forming a Ni plating layer and a Sn plating layer on the electrode layers 141a and 142a.

[0077] The smaller the size of the multilayer electronic component 100, the greater the effect of improving capacitance per unit volume due to thinner external electrodes. Therefore, in a multilayer electronic component 100 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the effect of improving capacitance per unit volume according to the present invention can be significant.

[0078] In the case of a 1005 (length x width, 1.0 mm x 0.5 mm) size, a comparative example in which external electrodes were formed by a conventional dipping method achieved a capacitance of 19.6 μF, while a multilayer electronic component according to one embodiment of the present invention (invention example) achieved a capacitance of 21.73 μF. It can be seen that the effective capacitance of the invention example increased by about 11% compared to the comparison example, demonstrating a significant improvement in capacitance per unit volume.

[0079] Therefore, taking into consideration manufacturing errors, the maximum size of the multilayer electronic component 100 in the second direction may be 1.1 mm or less, and the maximum size in the third direction may be 0.55 mm or less. In this case, the maximum size of the multilayer electronic component in the second direction may refer to the maximum length of the multilayer electronic component, and the maximum size of the multilayer electronic component in the third direction may refer to the maximum width of the multilayer electronic component.

[0080] 6 to 8 are diagrams illustrating a method for manufacturing a multilayer electronic component according to one embodiment of the present invention.

[0081] 6, in the transfer process of the first conductive layer 131a, the conductive layer sheet 130a is placed on the support 200, and the body 110 is then pressed thereon so that the first conductive layer 131a is attached to the third surface of the body 110. The conductive layer sheet 130a may contain components such as a binder and an organic solvent before being sintered. Then, the same process is repeated on the fourth surface of the body 110 so that the second conductive layer 132a is attached to the fourth surface of the body 110.

[0082] 7, the first and second electrode layers 141a and 142a may be formed by applying an external electrode paste to any one of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110. By forming the electrode layers 141a and 142a before forming the insulating layers 131b and 132b, electrical connectivity between the conductive layers 131a and 132a and the electrode layers 141a and 142a may be sufficiently ensured.

[0083] 8, an insulating layer sheet 130b is placed on a support 200, and the body 110 is then pressed onto the insulating layer sheet 130b so that the first insulating layer 131b adheres to the surface of the first conductive layer 131a. The insulating layer sheet 130b may contain components such as a binder and an organic solvent before being sintered. The same process is then repeated on the fourth surface of the body 110 so that the second insulating layer 132b adheres to the surface of the second conductive layer 132a.

[0084] Thereafter, a plating process is performed to form plating layers 141b and 142b on the electrode layers 141a and 142a. By forming the plating layers 141b and 142b after forming the insulating layers 131b and 132b on the conductive layers 131a and 132a, it is possible to prevent the formation of plating layers on the conductive layers 131a and 132a, minimize the size of the multilayer electronic component in the second direction, and improve the capacitance per unit volume.

[0085] FIG. 9 is a cross-sectional view taken along line II' of FIG. 1 as a modified example of one embodiment of the present invention.

[0086] 9, the first electrode layer 141a' may be disposed to extend to cover one end of the first conductive layer 131a' in the first direction, and the second electrode layer 142a' may be disposed to extend to cover one end of the second conductive layer 132a' in the first direction, thereby increasing the contact area between the electrode layers 141a', 142a' and the conductive layers 131a', 132a', and improving electrical connectivity.

[0087] In this case, the thickness of each of the first and second conductive layers 131a' and 132a' at one end in the first direction may be thinner than the thickness of each of the first and second conductive layers 131a' and 132a' at the center in the first direction. Here, the thickness of each of the first and second conductive layers 131a' and 132a' may refer to the size in the second direction. This increases the contact area between the electrode layers 141a' and 142a' and the conductive layers 131a' and 132a', improving electrical connectivity and preventing a decrease in effective volume ratio.

[0088] Although the sheet transfer method allows the conductive layers 131a', 132a' to have a uniform and thinner thickness than the conventional dipping method, the sheet is cut by pressure bonding and a portion of the sheet adheres to the body, so that both ends of the conductive layers 131a', 132a' in the first direction receive more pressure than the center, which may result in a thinner thickness. Therefore, the thickness of the other ends of the first and second conductive layers 131a', 132a' in the first direction may also be thinner than the thickness at the center in the first direction.

[0089] Furthermore, the insulating layers 131b' and 132b' may be disposed so that their size in the first direction is 80% or more of the size in the first direction of the conductive layers 131a' and 132a'. If the maximum size in the first direction of the insulating layers 131b' and 132b' is smaller than the maximum size in the first direction of the conductive layers 131a' and 132a', as shown in FIG. 9, the insulating layers 131b' and 132b' may be disposed so as not to cover both ends in the first direction of the conductive layers 131a' and 132a'. Furthermore, both ends in the first direction of the insulating layers 131b' and 132b' may also have a thinner thickness than the central portion.

[0090] Therefore, the size in the first direction of the first insulating layer 131b' may be smaller than the size in the first direction of the first conductive layer 131a', and the size in the first direction of the second insulating layer 132b' may be smaller than the size in the first direction of the second conductive layer 132a'.

[0091] As a result, a first additional plating layer 151 may be disposed on the other end in the first direction of the first conductive layer 131a', and a second additional plating layer 152 may be disposed on the other end in the first direction of the second conductive layer 132a'. The first and second additional plating layers 151 and 152 are formed during the plating process for forming the plating layers 141b' and 142b', and may be formed of the same material as the plating layers 141b' and 142b'.

[0092] FIG. 10 is a cross-sectional view taken along line II' of FIG. 1 as another modified example of one embodiment of the present invention.

[0093] According to another variation of an embodiment of the present invention, the first and second external electrodes 141″ and 142″ may be arranged on the second surface of the main body 110″, the first insulating layer 131b″ may be arranged to extend to cover one end of the first electrode layer 141a″ and a portion of the first surface 1 of the main body 110″, and the second insulating layer 132b″ may be arranged to extend to cover one end of the second electrode layer 142a″ and a portion of the first surface.

[0094] Referring to FIG. 10, a step may occur at the end of the body 110" in the second direction because only one of the first and second internal electrodes 121" and 122" is disposed therein. As a result, the end of the body 110" in the second direction may have a shape thinner than the central portion of the body 110" in the second direction, and the first and second surfaces 1 and 2 at the end of the body 110" in the second direction may have a shape contracted toward the central portion of the body 110" in the first direction. Therefore, the size in the first direction at the central portion of the body in the second direction may be larger than the size in the first direction at the end of the body in the second direction. In addition, the internal electrodes 121" and 122" may also have a shape contracted toward the central portion of the body 110" in the first direction at the end of the second direction.

[0095] The first and second insulating layers 131b″ and 132b″ may be arranged to extend to cover one ends of the first and second electrode layers 141a″ and 142a″ and a portion of the first surface of the body 110″. However, they may be extended within a range that does not increase the size of the multilayer electronic component in the first direction. As described above, the first and second surfaces 1 and 2 at the ends of the body 110″ in the second direction have a shape that is contracted toward the center of the body 110″ in the first direction. Therefore, even if the first and second insulating layers 131b″ and 132b″ are extended to a portion on the ends of the body 110″ in the second direction, the first and second insulating layers 131b″ and 132b″ may be arranged without increasing the size of the multilayer electronic component in the first direction.

[0096] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0097] 100 Multilayer electronic components 110 Main Unit 111 Dielectric layer 112, 113 Cover 114, 115 Margin 121, 122 Internal electrode 131, 132 Connection section 131a, 132a conductive layer 131b, 132b insulating layer 141, 142 External electrode 141a, 142a electrode layer 141b, 142b plating layer 151, 152 Additional plating layer

Claims

1. a main body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer sandwiched therebetween, the main body having first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing the third direction; a first connection part including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection part including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer and a first plating layer disposed on the first electrode layer, the first external electrode being disposed on one of the first, second, fifth, and sixth surfaces; a second external electrode including a second electrode layer connected to the second conductive layer and a second plating layer disposed on the second electrode layer, the second external electrode being disposed on the surface on which the first external electrode is disposed and spaced apart from the first external electrode, the first electrode layer is disposed extending in the second direction from the one surface so as to cover an end portion of the first conductive layer exposed in the first direction or the third direction, and the second electrode layer is disposed extending in the second direction from the one surface so as to cover an end portion of the second conductive layer exposed in the first direction or the third direction.

2. 2. The multilayer electronic component according to claim 1, wherein the first conductive layer is disposed in a range on the third surface that does not deviate from the third surface, and the second conductive layer is disposed in a range on the fourth surface that does not deviate from the fourth surface.

3. 3. The multilayer electronic component according to claim 1, wherein the first and second conductive layers include the same metal as that included in the first and second internal electrodes and glass.

4. 4. The multilayer electronic component according to claim 3, wherein the same metal contained in the first and second internal electrodes is Ni.

5. 5. The multilayer electronic component according to claim 1, wherein the size in the first direction of the first insulating layer is 80% or more of the size in the first direction of the first conductive layer, and the size in the first direction of the second insulating layer is 80% or more of the size in the first direction of the second conductive layer.

6. The multilayer electronic component according to claim 1 , wherein the first and second electrode layers contain a conductive metal and glass.

7. 7. The multilayer electronic component according to claim 1, wherein the maximum size of the multilayer electronic component in the second direction is 1.1 mm or less, and the maximum size of the multilayer electronic component in the third direction is 0.55 mm or less.

8. The multilayer electronic component according to claim 1 , wherein the first and second external electrodes are disposed on the fifth surface or the sixth surface.

9. The multilayer electronic component according to claim 1 , wherein the first and second external electrodes are disposed on the first surface or the second surface.

10. A laminated electronic component described in any one of claims 1 to 9, wherein the first and second electrode layers have a greater thickness in the center than at the ends in the second direction.

11. 11. The multilayer electronic component according to claim 1, wherein thicknesses of the first and second conductive layers at one end in the first direction are thinner than thicknesses of the first and second conductive layers at centers in the first direction.

12. 12. The multilayer electronic component according to claim 1, wherein the thicknesses of the other ends of the first and second conductive layers in the first direction are thinner than the thicknesses of the first and second conductive layers at the centers in the first direction.

13. 13. The multilayer electronic component according to claim 1, wherein the first and second insulating layers are arranged so as not to cover one end and the other end in the first direction of the first and second conductive layers.

14. 14. The multilayer electronic component according to claim 1, wherein thicknesses of one end and the other end of the first and second insulating layers in the first direction are thinner than thicknesses of the first and second insulating layers at centers in the first direction.

15. 15. The multilayer electronic component according to claim 1, wherein a first additional plating layer is disposed on the other end of the first conductive layer in the first direction, and a second additional plating layer is disposed on the other end of the second conductive layer in the first direction.

16. the first and second external electrodes are disposed on the second surface; 16. The multilayer electronic component according to claim 1, wherein the first insulating layer is disposed so as to extend to cover one end of the first electrode layer and a portion of the first surface, and the second insulating layer is disposed so as to extend to cover one end of the second electrode layer and a portion of the first surface.

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