Electronic component manufacturing apparatus and electronic component manufacturing method

Abstract

To provide an electronic component manufacturing device that easily and reliably processes the surface of a chip by laser beam irradiation.SOLUTION: A manufacturing device MD1 includes a rotating portion 30 that rotates around a rotation axis Ax1, a holding portion 40 that holds a chip 1 and is arranged in the rotating portion 30 so as to rotate together with the rotating portion 30 around the rotation axis Ax1, a laser irradiation portion 10 located at predetermined rotation angle positions RP1 and RP2 of the rotation portion 30 and irradiating with the laser beam L1, and a control portion CT1 that controls the respective drives of the rotating portion 30, the holding portion 40, and the laser irradiation portion 10. The control portion CT1 controls the drive of the rotating portion such that the holding portion 40 holding the chip 1 is positioned at predetermined rotational angle positions RP1 and RP2, and controls the respective drives of the holding portion 40 and the laser irradiation portion 10 such that the laser irradiation portion 10 irradiates the predetermined surface 1s with the laser beam L1 at predetermined rotation angle positions RP1 and RP2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an apparatus for manufacturing electronic components and a method for manufacturing electronic components. [Background technology]

[0002] A known electronic component manufacturing apparatus processes a predetermined surface of a chip by irradiating the predetermined surface with laser light (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-277381 Summary of the Invention [Problem to be solved by the invention]

[0004] In this technical field, in order to improve productivity, it is desirable to establish a manufacturing apparatus and a manufacturing method that can easily and reliably process the surface of a chip by irradiating a predetermined surface of the chip including multiple surfaces with laser light. An object of one aspect of the present invention is to provide an electronic component manufacturing apparatus that easily and reliably processes the surface of a chip by irradiating it with laser light.An object of another aspect of the present invention is to provide an electronic component manufacturing method that easily and reliably processes the surface of a chip by irradiating it with laser light. [Means for solving the problem]

[0005] An electronic component manufacturing apparatus according to one aspect of the present invention processes a predetermined surface among multiple surfaces of a chip by irradiating it with laser light, and includes: a rotating unit that rotates about a rotation axis; a holding unit that holds the chip and is disposed on the rotating unit so as to rotate about the rotation axis together with the rotating unit; a laser irradiation unit that is positioned at a predetermined rotation angle position of the rotating unit and irradiates the laser light; and a control unit that controls the driving of the rotating unit, the holding unit, and the laser irradiation unit. The control unit controls the driving of the rotating unit so that the holding unit that holds the chip is positioned at the predetermined rotation angle position, and controls the driving of the holding unit and the laser irradiation unit so that the laser irradiation unit irradiates the predetermined surface with laser light at the predetermined rotation angle position.

[0006] According to the above-described one aspect, the rotating unit positions the chip to be irradiated with the laser light at a predetermined rotational angle, and the laser irradiation unit irradiates the predetermined surface with the laser light at the predetermined rotational angle. Therefore, the predetermined surface of the chip is easily irradiated with the laser light. As a result, the above-described one aspect easily and reliably processes the surface of the chip by irradiating the laser light.

[0007] In one aspect, the predetermined surface may include a first surface and a second surface. The laser irradiation unit may include a first laser irradiation unit located at a first rotational angle position among the predetermined rotational angle positions and a second laser irradiation unit located at a second rotational angle position among the predetermined rotational angle positions. The control unit may control the rotation unit to position the holder that holds the chip at the first rotational angle position, control the rotation unit to position the holder that holds the chip at a third rotational angle position among the predetermined rotational angle positions, control the rotation unit to rotate the orientation of the chip at the third rotational angle position and control the rotation unit to rotate the second laser irradiation unit at the third rotational angle position, and control the rotation unit to position the holder that holds the chip at the second rotational angle position, and control the rotation unit to rotate the holder that holds the chip at the second rotational angle position. The third rotational angle position may be located between the first rotational angle position and the second rotational angle position. In a configuration in which the first surface is irradiated with laser light at the first rotational angle position and the second surface is irradiated with laser light at the second rotational angle position, the first surface and the second surface of the predetermined surface are more likely to be irradiated with laser light, and as a result, this configuration more easily and reliably processes the surface of the chip by irradiating with laser light.

[0008] In one aspect, the predetermined surface may include a first surface and a second surface. The laser irradiation unit may include a first laser irradiation unit positioned at a first rotational angle position among the predetermined rotational angle positions. The control unit may control the drive of the rotation unit so that a holder that holds the chip is positioned at the first rotational angle position, control the drive of each of the holder and the first laser irradiation unit so that the first laser irradiation unit irradiates the first surface with laser light at the first rotational angle position, and control the drive of each of the holder and the first laser irradiation unit so that the orientation of the chip is rotated at the first rotational angle position so that the first laser irradiation unit irradiates the second surface with laser light. In a configuration in which the chip is rotated so that the first and second surfaces are irradiated with laser light at the first rotation angle position, the first and second surfaces of the predetermined surface are more likely to be irradiated with laser light, and as a result, this configuration more easily and reliably processes the surface of the chip by irradiating it with laser light.

[0009] The one aspect may further include an inspection unit, which may perform at least one of a first inspection to inspect the position of the chip and the orientation of the predetermined surface, and a second inspection to inspect the predetermined surface irradiated with the laser light, before the predetermined surface is irradiated with the laser light by the laser irradiation unit at a predetermined rotation angle position. In a configuration in which the inspection unit performs at least one of the first inspection and the second inspection, the control unit accurately inspects the predetermined surface irradiated with the laser light and inspects whether the predetermined surface is irradiated with the laser light, thereby more reliably processing the surface of the chip by irradiating it with the laser light.

[0010] The one aspect may include a storage unit having a plurality of storage portions for storing chips, and the control unit may select a storage portion for storing the chip from among the plurality of storage portions based on the results of the first and second tests. In a configuration in which the control unit performs the first and second inspections and selects a storage portion from among a plurality of storage portions to store a chip, the control unit selects the chip according to the results of the first and second inspections, and as a result, in this configuration, a chip whose surface has been more reliably processed by the irradiation of laser light is accurately selected.

[0011] In one of the above aspects, the storage portion of the storage unit that the control unit selects when it determines to stop irradiating laser light in response to the results of the first test may be different from the storage portion of the storage unit that the control unit selects when it determines to stop irradiating laser light in response to the results of the second test. In a configuration in which the control unit selects different storage portions of the storage unit when determining to stop the laser light irradiation based on the results of the first and second tests, the chips irradiated with laser light and the chips not irradiated with laser light are stored separately from each other. Therefore, among the stored chips, the chips not irradiated with laser light are held in the holding unit again so that they can be irradiated with laser light. As a result, even if there is an error in the judgments made in the first and second tests, a decrease in the yield in the surface processing of the chips is suppressed.

[0012] The one aspect may further include an exhaust unit that exhausts sublimates generated from a predetermined surface by irradiation with the laser light. In a configuration including an exhaust section, sublimates are removed from the optical path of the laser light.

[0013] In the above-mentioned one aspect, the exhaust section may have an exhaust duct that takes the sublimate into the exhaust section. The exhaust duct may be located on the opposite side of the chip holder from the chip holder. In a configuration in which the exhaust duct is located on the opposite side of the chip from the holder, sublimates are reliably removed from the optical path of the laser light.

[0014] In the above-mentioned one aspect, the holder may rotate the tip around the rotation axis of the holder. In a configuration in which the holder rotates the chip around the rotation axis of the holder, the holder reliably rotates the chip, and as a result, this configuration allows for easier and more reliable processing of the surfaces of multiple chips by irradiating them with laser light.

[0015] In the above one aspect, the holder may adsorb the chip. In a configuration in which the holder sucks the chips, the holder holds the chips while further reducing mechanical stress on the chips, and as a result, this configuration allows for easier and more reliable processing of the surfaces of multiple chips by irradiating them with laser light.

[0016] In the above one aspect, the holder may include a material that is optically transparent to the laser light. When the holder is made of a material that is optically transparent to laser light, the holder is less likely to be deteriorated by the laser light irradiated onto the plurality of chips.

[0017] In the above one aspect, the laser irradiation unit may irradiate laser light having a wavelength in the range of 250 nm to 1600 nm. Laser light with a wavelength in the range of 250 nm to 1600 nm easily passes through the optical waveguide and optical lens included in the laser irradiation unit and the atmosphere, so the light intensity of the laser light is less likely to attenuate. Therefore, laser light in this wavelength range is easily absorbed by the chip. The surface of the chip is more reliably processed by the irradiation of the laser light.

[0018] In one aspect of the present invention, the laser irradiation unit has a pulse width of 10 -8 ~10 -15 Alternatively, a pulsed laser beam having a wavelength of 1000 s may be used. Pulse width is 10 -8 ~10 -15 In a configuration in which a pulsed laser beam of 1 / 2 second is irradiated onto the chip, the chip is less susceptible to thermal effects during irradiation with the laser beam, and therefore the surface of the chip is more reliably processed by the irradiation with the laser beam.

[0019] Another aspect of the present invention is a method for manufacturing electronic components using the above-mentioned electronic component manufacturing apparatus, and includes the steps of: a control unit controlling the drive of a rotation unit to rotate the holding unit so that the holding unit that holds the chip is positioned at a predetermined rotation angle position; a control unit controlling the drive of each of the holding unit and the laser irradiation unit so that the laser irradiation unit irradiates laser light onto a predetermined surface at the predetermined rotation angle position; and a control unit controlling the drive of the laser irradiation unit to irradiate laser light onto the predetermined surface at the predetermined rotation angle position.

[0020] According to the above-mentioned another aspect, the rotating unit positions the chip to be irradiated with the laser at a predetermined rotation angle, and the laser irradiating unit irradiates the predetermined surface with the laser light at the predetermined rotation angle. Therefore, the predetermined surface of the chip is easily irradiated with the laser light. As a result, the above-mentioned one aspect easily and reliably processes the surface of the chip by irradiating the laser light. [Effects of the Invention]

[0021] One aspect of the present invention provides an electronic component manufacturing apparatus that easily and reliably processes the surface of a chip by irradiating it with laser light. Another aspect of the present invention provides an electronic component manufacturing method that easily and reliably processes the surface of a chip by irradiating it with laser light. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a diagram showing an electronic component manufacturing apparatus according to one embodiment. [Figure 2] FIG. 2 is a diagram showing an electronic component manufacturing apparatus according to this embodiment. [Figure 3] FIG. 3 is a block diagram of the electronic component manufacturing apparatus according to this embodiment. [Figure 4] FIG. 4 is a diagram showing the laser irradiation unit and the holding unit. [Figure 5] FIG. 5 is a diagram showing the laser irradiation unit, the rotation unit, and the holding unit. [Figure 6] FIG. 6 is a diagram showing the trajectory of laser light irradiation. [Figure 7] FIG. 7 is a diagram showing an example of tip rotation. [Figure 8] FIG. 8 is a diagram showing an example of tip rotation. [Figure 9] FIG. 9 is a diagram showing an example of tip rotation. [Figure 10] FIG. 10 is a diagram showing an example of tip rotation. [Figure 11] FIG. 11 is a perspective view showing the chip. [Figure 12] FIG. 12 is a diagram showing a cross-sectional configuration of the chip. [Figure 13] FIG. 13 is a diagram showing a cross-sectional configuration of the electronic component. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and redundant description will be omitted.

[0024] An electronic component manufacturing apparatus and an electronic component manufacturing method according to the present embodiment will be described with reference to FIGS. 1 to 6. FIG. 1 is an external view showing the electronic component manufacturing apparatus according to the present embodiment. FIG. 2 is a diagram showing the electronic component manufacturing apparatus according to the present embodiment. FIG. 3 is a block diagram of the electronic component manufacturing apparatus according to the present embodiment. FIG. 4 is a diagram showing a laser irradiation unit and a holding unit. FIG. 5 is a diagram showing the laser irradiation unit, a rotation unit, and a holding unit. FIG. 6 is a diagram showing the trajectory of laser light irradiation on a chip. Hatching has been omitted in FIGS. 4 and 5 to clearly show each part.

[0025] As shown in FIGS. 1 to 3, in this embodiment, electronic component manufacturing apparatus MD1 includes a control unit CT1, a laser irradiation unit 10, a supply unit 20, a rotation unit 30, a holding unit 40, an inspection unit 50, and a storage unit 60. The manufacturing apparatus MD1 processes chips 1 by irradiating them with laser light L1 to produce electronic components ED1. The control unit CT1 controls the driving of the laser irradiation unit 10, the supply unit 20, the rotation unit 30, the holding unit 40, the inspection unit 50, and the storage unit 60. The laser irradiation unit 10 irradiates the chips 1 with laser light L1. The supply unit 20 supplies the chips 1 to the holding unit 40. The rotation unit 30 includes a rotor 31. The rotation unit 30 is rotated around a rotation axis Ax1 by the rotor 31. The holding unit 40 holds the chips 1 and rotates together with the rotation unit 30 around the rotation axis Ax1. The holding unit 40 is arranged on the rotating unit 30. The inspection unit 50 inspects the appearance of the chip 1. The storage unit 60 stores the chip 1. The chip 1 is, for example, a fired ceramic body. The electronic component ED1 includes, for example, a multilayer capacitor. The electronic component ED1 includes, for example, a capacitor other than a multilayer capacitor, an inductor, a varistor, or a multilayer solid-state battery. The manufacturing device MD1 includes a mounting table BS1. In the example shown in FIG. 1, the mounting table BS1 mounts the control unit CT1, the supply unit 20, and the rotating unit 30.

[0026] The control unit CT1 includes, for example, a control circuit CT1a, a laser irradiation unit drive circuit 10p, a supply unit drive circuit 20p, a rotation unit drive circuit 30p, a holder drive circuit 40p, an inspection unit drive circuit 50p, and a storage unit drive circuit 60p. The control circuit CT1a controls, for example, the laser irradiation unit drive circuit 10p, the supply unit drive circuit 20p, the rotation unit drive circuit 30p, the holder drive circuit 40p, the inspection unit drive circuit 50p, and the storage unit drive circuit 60p. The laser irradiation unit drive circuit 10p drives the laser irradiation unit 10, for example, in response to a command from the control circuit CT1a. The supply unit drive circuit 20p drives the supply unit 20, for example, in response to a command from the control circuit CT1a. The rotation unit drive circuit 30p drives the rotation unit 30, for example, in response to a command from the control circuit CT1a. The holding unit drive circuit 40p receives, for example, a command from the control circuit CT1a to drive the holding unit 40. The inspection unit drive circuit 50p receives, for example, a command from the control circuit CT1a to drive the inspection unit 50. The storage unit drive circuit 60p receives, for example, a command from the control circuit CT1a to drive the storage unit 60. In this embodiment, the inspection unit drive circuit 50p transmits, for example, the results of the appearance inspection in the inspection unit 50 to the control circuit CT1a.

[0027] The laser irradiation unit 10 receives a command from the laser irradiation unit drive circuit 10p and irradiates the chip 1, which includes multiple surfaces 1s, with laser light L1. In this embodiment, the laser irradiation unit 10 includes laser irradiation units 10a and 10b. The laser irradiation units 10a and 10b have, for example, the same configuration. When viewed from the axial direction of the rotation axis Ax1, the manufacturing apparatus MD1 positions the laser irradiation unit 10a at a rotational angle position RP1 of the rotation unit 30. When viewed from the axial direction of the rotation axis Ax1, the manufacturing apparatus MD1 positions the laser irradiation unit 10b at a rotational angle position RP2 of the rotation unit 30. In this embodiment, as described below, the supply unit 20 is positioned at a rotational angle position RPs of the rotation unit 30. The rotational angle position RP1 forms a rotational angle TH1 with the rotational angle position RPs. When viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP1 forms, for example, a clockwise rotational angle TH1 with the rotational angle position RPs. The rotational angle position RP2 forms a rotational angle TH2 with the rotational angle position RPs. When viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP2 forms, for example, a rotational angle TH2 clockwise with the rotational angle position RPs. The rotational angle TH2 is, for example, larger than the rotational angle TH1. In this embodiment, the manufacturing apparatus MD1 irradiates the laser light L1 twice, for example. For example, the laser irradiation unit 10a irradiates the laser light L1 for the first time, and the laser irradiation unit 10b irradiates the laser light L1 for the second time. For example, when the rotational angle position RP1 constitutes a first rotational angle position, the rotational angle position RP2 constitutes a second rotational angle position.

[0028] As shown in FIG. 4, the laser irradiation section 10 has a light source unit 12 and a scanning unit 14. FIG. 4 shows an example of the configuration of the laser irradiation section 10. The light source unit 12 includes, for example, a fiber laser amplifier 12a and a pumping light source 12b for the fiber laser amplifier. The pumping light source 12b includes, for example, a semiconductor laser. For example, an optical waveguide 12c optically connects the fiber laser amplifier 12a and the pumping light source 12b. The optical waveguide 12c includes, for example, an optical fiber. In this embodiment, the light source unit 12 generates laser light L1 having a wavelength in the range of 250 nm to 1600 nm. The laser light L1 is, for example, pulsed light. When the laser light L1 is pulsed light, the pulse width of the laser light L1 is, for example, 10 -8 ~10 -15 4, the laser beam L1 is indicated by an arrow. The arrow indicating the laser beam L1 is shown separated from the optical path so that the arrow can be easily seen in the drawing.

[0029] As shown in FIG. 4, the laser light L1 generated by the light source unit 12 is guided to the scanning unit 14, for example, through an optical waveguide 12d. The optical waveguide 12d includes, for example, an optical fiber. The scanning unit 14 adjusts the optical path of the laser light L1 and emits the laser light L1 with the adjusted optical path toward the chip 1. In this embodiment, the scanning unit 14 includes, for example, a housing 14a and an optical mirror 14b and an optical lens 14c housed in the housing 14a. The optical mirror 14b adjusts the optical path of the laser light L1 from the light source unit 12 by changing the orientation of the reflective surface of the optical mirror 14b. The optical mirror 14b reflects the laser light L1 toward the optical lens 14c. The optical lens 14c emits the laser light L1 reflected by the optical mirror 14b toward the chip 1. In this embodiment, the optical mirror 14b includes, for example, a galvanometer mirror. The optical lens 14c includes, for example, an f-θ lens. For example, a combination of a galvanometer mirror and an f-θ lens adjusts the optical path of the laser light L1 and emits the laser light L1 toward the chip 1. The scanning unit 14 has an optical window 14d that protects the optical lens 14c and the optical mirror 14b. The optical mirror 14b reflects the laser light in the above wavelength range. The optical lens 14c and the optical window 14d transmit the laser light in the above wavelength range. The laser light L1 is scanned across the chip 1 by the scanning unit 14. In this embodiment, the beam diameter (diameter) of the laser light L1 focused on a predetermined surface 1s of the chip 1 is, for example, 0.03 mm.

[0030] The laser irradiation section 10 includes, for example, a cooling unit 16. The cooling unit 16 includes, for example, a cooling water circulator 16a and a connecting pipe 16b. The cooling unit 16 is connected to the light source unit 12 and the scanning unit 14 by, for example, the connecting pipe 16b. The connecting pipe 16b includes, for example, a connecting pipe 16c that connects the cooling unit 16 and the light source unit 12. The connecting pipe 16b includes, for example, a connecting pipe 16d that connects the cooling unit 16 and the scanning unit 14. The cooling unit 16 supplies cooling water to the light source unit 12 and the scanning unit 14, for example, to cool the light source unit 12 and the scanning unit 14. The cooling water circulates, for example, through the cooling unit 16 and the light source unit 12 and the scanning unit 14. The cooling water circulator 16a cools the circulating cooling water, for example.

[0031] The laser irradiation unit 10 includes, for example, a power meter 18. The power meter 18 measures the light intensity of the laser light L1 irradiated onto the multiple chips 1. When viewed from the scanning unit 14 in a direction toward the position where the chips 1 are held in the holder 40, the power meter 18 is disposed, for example, inside the range scanned by the scanning unit 14 with the laser light L1 and outside the range where the chips 1 are held in the holder 40. When viewed from the scanning unit 14 in a direction toward the position where the chips 1 are held in the holder 40, the power meter 18 is disposed, for example, behind the position where the chips 1 are held in the holder 40. The measurement of the light intensity of the laser light L1 is performed, for example, when the chips 1 are not held in the holder 40. Therefore, the measurement of the light intensity of the laser light L1 is performed, for example, at least either before or after the light source unit 12 irradiates the chips 1 with the laser light L1.

[0032] The laser irradiation unit 10 includes, for example, a rangefinder 19. The rangefinder 19 measures, for example, the distance between the scanning unit 14 and the chip 1. Therefore, by measuring the distance between the scanning unit 14 and the chip 1, for example, the scanning unit 14 causes the focus of the laser light L1 to coincide with a predetermined surface 1s of the chip 1. In this embodiment, the beam diameter (diameter) of the laser light L1 focused on the predetermined surface 1s of the chip 1 is, for example, 0.03 mm.

[0033] As shown in FIG. 6, when irradiating the laser light L1, the laser light L1 is irradiated onto the chip 1, for example, based on the position of the chip 1. Therefore, the laser irradiation unit 10 receives a command from the laser irradiation unit drive circuit 10p and irradiates the laser light L1 only onto the position where the chip 1 is located. The laser irradiation unit 10 does not irradiate the laser light L1 onto the position where the chip 1 is not located. FIG. 6 illustrates an example of a trajectory L1a scanned by the laser light L1 along the direction indicated by the arrow. The solid line indicates that the laser light L1 is irradiated onto the position where the chip 1 is located. The dashed line indicates that the laser light L1 is not irradiated onto the position where the chip 1 is not located. The light source unit 12 includes, for example, a mechanism for turning on and off the laser light L1 from the light source unit 12. This mechanism, for example, transmits the laser light L1 when irradiating the laser light L1 and blocks the laser light L1 when not irradiating the laser light L1, in response to a command from the laser irradiation unit drive circuit 10p. The on / off mechanism is disposed, for example, at the emission port of the laser light L1 of the light source unit 12, and blocks the emission of the laser light L1.

[0034] When irradiating the chip 1 with the laser light L1, the manufacturing device MD1 identifies the position where the chip 1 is placed, for example, using the inspection unit 50. The control unit CT1 controls the scanning unit 14 and a mechanism for turning on and off the laser light L1, for example, based on identification information regarding the position where the chip 1 is placed from the inspection unit 50. In this embodiment, the control unit CT1 may, for example, read in advance position data regarding the position where the chip 1 is placed at the rotational angle positions RP1 and RP2. The control unit CT1 may control the scanning unit 14 and a mechanism for turning on and off the laser light L1, based on the read-in position data.

[0035] As shown in Figures 1 and 2, the manufacturing apparatus MD1 has a supply unit 20 positioned at a rotation angle position RPs of the rotating unit 30. The supply unit 20 receives a command from a supply unit drive circuit 20p and supplies chips 1 to the holding unit 40. The supply unit 20 has, for example, a hopper 22 and a feeder 24. The hopper 22 stores a plurality of chips 1. The supply unit 20 supplies the plurality of chips 1 to the feeder 24, for example, by opening a portion of the bottom of the hopper 22. The feeder 24 includes, for example, a bowl feeder 25 and a linear feeder 26. The bowl feeder 25 receives the plurality of chips 1 from the hopper 22. The plurality of chips 1 are aligned, for example, so as to assume substantially the same posture as one another while passing through the bowl feeder 25. The linear feeder 26 supplies the aligned plurality of chips 1 to the holding unit 40. The supply unit 20 has, for example, a placement portion 27 at the tip of the linear feeder 26 for placing each chip 1 discharged from the linear feeder 26 thereon.

[0036] As shown in FIGS. 1 and 5 , the rotating unit 30 includes, for example, a base 32 and a connecting member 33. The base 32 and the connecting member 33 are connected to, for example, the rotor 31. The control unit CT1 drives the rotating unit 30 so that the holding unit 40, which holds the chip 1, is positioned at a predetermined rotational angle. In this embodiment, the rotating unit 30 rotates around the rotation axis Ax1 in response to a command from the rotating unit drive circuit 30p. The base 32 is located, for example, outside the rotor 31 and rotates around the rotation axis Ax1 together with the rotation of the rotor 31. The base 32 has, for example, a circular ring shape when viewed from the axial direction of the rotation axis Ax1. The inner diameter of the circular ring shape of the base 32 corresponds, for example, to the outer diameter of the rotor 31. The connecting member 33 connects, for example, the base 32 and the holding unit 40. The connecting member 33 rotates the holding unit 40 around the rotation axis Ax1 in accordance with the rotation of the base 32 and the rotor 31. The rotor 31 is, for example, a motor. The rotor 31 has, for example, a cylindrical shape. The rotation axis Ax1 of the rotor 31 coincides, for example, with the center line of the cylindrical shape of the rotor 31. The axial direction of the rotation axis Ax1 is, for example, perpendicular to the connecting body 33.

[0037] The holder 40 rotates around the rotation axis Ax1 together with the rotating unit 30. The holder 40 has a holder 41 and a connector 42. The connector 42 connects the holder 41 to the connector 33, for example. The holder 41 receives a command from the holder drive circuit 40p and picks up the chip 1 placed on the placement portion 27 at the rotation angle position RPs, for example. The holder 41 includes a holding portion 43 at the tip of the holder 41, for example. The holding portion 43 includes a suction nozzle, for example. In this embodiment, the suction nozzle picks up the chip 1. The holder 41 suspends the chip 1, for example. The suction nozzle includes zirconia, quartz glass, or sapphire, for example. In this embodiment, the holder 41 may have a configuration other than a suction nozzle. The holder 41 may have a configuration such as arms that sandwich a pair of side surfaces 1c (see FIG. 11) of the chip 1. Even when the side surface 1c of the chip 1 is sandwiched, the holder 41 suspends the chip 1, for example. The holder 40 holds the chip 1 so that a predetermined surface 1s among the multiple surfaces 1s faces the laser irradiation unit 10 at the rotation angle position RP1. The predetermined surface 1s is, for example, one of the end faces 1a, 1b of the chip 1 (see FIG. 11).

[0038] The holding unit 40 is capable of rotating the holding body 41 around a rotation axis Ax2 of the holding body 41, for example. The holding unit 40 rotates the holding body 41, for example, upon receiving a command from a holding unit drive circuit 40p. The axial direction of the rotation axis Ax2, for example, coincides with the axial direction of the rotation axis Ax1, for example. The holding unit 40 has a rotor 44, for example. The rotor 44 is supported by a connecting body 42, for example. The rotor 44 rotates the holding body 41 around the rotation axis Ax2, for example. The rotor 44 is a motor, for example. The rotor 44 has a cylindrical shape, for example. The holding body 41 has a cylindrical shape except for a holding portion 43 at the tip. The rotation axis Ax2 coincides with the center line of the cylindrical shape of the holding body 41, for example. The holder 41 other than the holding portion 43 includes, for example, anodized aluminum or carbon fiber reinforced plastics (CFRP).

[0039] The holder 40 rotates the holder 41 at, for example, a rotational angle position RP3 of the rotating unit 30, as viewed in the axial direction of the rotation axis Ax1. The rotational angle position RP3 forms a rotational angle TH3 with the rotational angle position RPs. That is, as viewed in the axial direction of the rotation axis Ax1, the rotational angle position RP3 forms, for example, a rotational angle TH3 clockwise with the rotational angle position RPs. As viewed in the axial direction of the rotation axis Ax1, the rotational angle position RP3 is located, for example, between the rotational angle positions RP1 and RP2. The rotational angle TH3 has a magnitude between the rotational angles TH1 and TH2, for example. For example, the rotational angle position RP3 constitutes a third rotational angle position.

[0040] The control unit CT1 controls the driving of the holding unit 40 and the laser irradiation unit 10 so that the laser irradiation unit 10 irradiates the predetermined surface 1s with the laser light L1 at a predetermined rotational angle position. The control unit CT1, for example, adjusts the position of the chip 1 and the orientation of the predetermined surface 1s. The holding unit 40, for example, rotates the chip 1 so that a predetermined surface 1s, among the multiple surfaces 1s, that was not irradiated with the laser light L1 at rotational angle position RP1, faces the laser irradiation unit 10b at rotational angle position RP2. The predetermined surface 1s is, for example, the other of the end faces 1a and 1b. Therefore, if the laser light L1 is irradiated onto the end face 1a at rotational angle position RP1, the holding unit 40 rotates the chip 1 so that the laser light L1 is irradiated onto the end face 1b at rotational angle position RP2. When the laser beam L1 is irradiated onto the end face 1b at the rotational angle position RP1, the holder 40 rotates the chip 1 so that the laser beam L1 is irradiated onto the end face 1a at the rotational angle position RP2, for example.

[0041] 7 to 10, the holder 40 may rotate the chip 1 without rotating the holder 41 around the rotation axis Ax2. FIGS. 7 to 10 are diagrams showing the process of rotating the orientation of the chip 1. The holder 40 rotates the chip 1, for example, at a rotation angle position RP3 as illustrated in FIGS. 7 to 10.

[0042] As shown in FIG. 7, first, for example, a mounting table 45 on which a chip 1 is placed is placed at a rotation angle position RP3. The mounting table 45 has a rotating body 46. The rotating body 46 rotates the mounting table 45 around, for example, a rotation axis Ax3 of the rotating body 46. The rotating body 46 has, for example, a cylindrical shape. The rotation axis Ax3 of the rotating body 46 coincides with, for example, the center line of the cylindrical shape of the rotating body 46. In this embodiment, the rotation axis Ax3 coincides with, for example, the rotation axis Ax2. The mounting table 45 has, for example, a circular or rectangular shape when viewed from the axial direction of the rotation axis Ax2.

[0043] 8, next, for example, holder 40 receives a command from holder drive circuit 40p and temporarily relaxes the force with which holder 41 holds chip 1. As a result, chip 1 is released from holder 41 and placed on mounting table 45, for example.

[0044] 9, for example, the holder 40 then receives a command from the holder drive circuit 40p and rotates the mounting table 45 around the rotation axis Ax3. As a result, the orientation of the surface 1s of the chip 1 is reversed. In the example shown in FIG. 9, the end face 1a and the end face 1b are reversed relative to each other.

[0045] As shown in FIG. 10, the holder 40 then receives a command from the holder drive circuit 40p to have the holder 41 pick up the chip 1 again. When the holder 41 picks up the chip 1 again, for example, the mounting table 45 on which the chip 1 is placed is moved closer to the holder 41 so that the holder 41 will pick up the chip 1 again. After the holder 41 has picked up the chip 1 again, for example, the mounting table 45 is moved away from the holder 41. The holder 40 returns the mounting table 45 to the position shown in FIG. 7, for example.

[0046] As shown in FIGS. 1 and 2, in this embodiment, the inspection unit 50 includes inspection units 50a, 50b, 50c, and 50d. The inspection units 50a, 50b, 50c, and 50d have, for example, the same configuration as one another. The inspection unit 50 receives a command from an inspection unit drive circuit 50p and inspects, for example, the appearance of the chip 1. The inspection unit 50 includes, for example, a camera. For example, before irradiating the predetermined surface 1s with laser light L1, the inspection unit 50 performs a first inspection to inspect the position of the chip and the orientation of the predetermined surface 1s so that the laser irradiation unit 10 irradiates the predetermined surface 1s with laser light L1. For example, the inspection unit 50 performs a second inspection to inspect the predetermined surface irradiated with laser light. The inspection unit 50 performs at least one of the first inspection and the second inspection. In this embodiment, the inspection unit 50 performs the first inspection and the second inspection.

[0047] The manufacturing apparatus MD1, for example, positions the inspection unit 50a at a rotational angle position RP4. The rotational angle position RP4 forms a rotational angle TH4 with the rotational angle position RPs. That is, when viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP4 forms, for example, a rotational angle TH4 clockwise with the rotational angle position RPs. When viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP4 is located, for example, between the rotational angle positions RPs and RP1. The rotational angle TH4 is, for example, smaller than the rotational angle TH1.

[0048] The inspection unit 50a, for example, performs a first inspection to inspect whether the holder 40 is holding the chip 1 so that the chip 1 is within the irradiation range of the laser light L1 from the laser irradiation unit 10 at the rotational angle position RP1. The inspection unit 50a also inspects, for example, whether the holder 40 is holding the chip 1 so that the chip 1 does not fall. If the control unit CT1 determines, based on the results of the first inspection by the inspection unit 50a, that the holder 40 is not properly holding the chip 1, the holder 40 changes the position of the held chip 1, for example, in response to a command from the holder drive circuit 40p. If the holding portion 43 includes a suction nozzle, the holder 40 can adjust the magnitude of the force with which it suctions the chip 1. Therefore, the holder 40, for example, temporarily weakens the force with which it suctions the chip 1 to change the position at which it suctions the chip 1. In this case, the mounting table 45 described above is used.

[0049] The holding unit 40 changes the position of the held chip 1, for example, at rotational angle position RP4. The inspection unit 50a inspects the changed position of the chip 1, for example, by a first inspection. If the control unit CT1 determines, based on the results of the first inspection by the inspection unit 50a, that the change in position of the chip 1 has been performed properly, it controls, for example, the laser irradiation unit 10 and the rotation unit 30 to irradiate the chip 1 with laser light L1 at rotational angle position RP1. If the control unit CT1 determines, based on the first inspection, that the change in position of the chip 1 has not been performed properly, it controls the laser irradiation unit drive circuit 10p to prevent the chip 1 from being irradiated with laser light L1 at rotational angle positions RP1 and RP2. The control unit CT1 classifies, for example, a first category, a chip 1 for which it has been determined, based on the results of the first inspection by the inspection unit 50a, that the laser light L1 should not be irradiated at rotational angle positions RP1 and RP2.

[0050] The manufacturing apparatus MD1 places the inspection unit 50b at, for example, a rotational angle position RP5. The rotational angle position RP5 forms a rotational angle TH5 with the rotational angle position RPs. That is, as viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP5 forms, for example, a rotational angle TH5 clockwise with the rotational angle position RPs. As viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP5 is located, for example, between the rotational angle positions RP1 and RP3. The rotational angle TH5 has a magnitude between the rotational angles TH1 and TH3, for example.

[0051] The inspection unit 50b inspects, for example, by a second inspection, whether the laser irradiation unit 10 properly irradiated the chip 1 with the laser light L1. If the control unit CT1 determines, based on the results of the second inspection by the inspection unit 50b, that the laser irradiation unit 10a properly irradiated the chip 1 with the laser light L1, it controls, for example, the rotation unit 30 to rotate the holder 41 at a rotational angle position RP3. Therefore, in response to a command from the holder drive circuit 40p, the holder 40 rotates the chip 1 so that a specific surface 1s, among the multiple surfaces 1s, that was not irradiated with the laser light L1 at the rotational angle position RP1 faces the laser irradiation unit 10 at a rotational angle position RP2. If the control unit CT1 determines, based on the results of the second inspection by the inspection unit 50b, that the laser irradiation unit 10a did not properly irradiate the chip 1 with the laser light L1, it controls the holder 40 not to rotate the chip 1 at the rotational angle position RP3. The control unit CT1 controls the laser irradiation unit drive circuit 10p so as not to irradiate the chip 1 with the laser light L1 at the rotational angle position RP2, for example. The control unit CT1 classifies the chip 1, for which it has been determined that the laser light L1 should not be irradiated at the rotational angle position RP2 based on the result of the second inspection by the inspection unit 50 at the rotational angle position RP5, into, for example, the second category.

[0052] Manufacturing apparatus MD1, for example, positions inspection unit 50c at rotational angle position RP6. Rotational angle position RP6 forms a rotational angle TH6 with rotational angle position RPs. That is, as viewed from the axial direction of rotation axis Ax1, rotational angle position RP6 forms, for example, a rotational angle TH6 clockwise with rotational angle position RPs. As viewed from the axial direction of rotation axis Ax1, rotational angle position RP6 is located, for example, between rotational angle positions RP3 and RP2. Rotational angle TH6 has a magnitude, for example, between rotational angle TH3 and rotational angle TH2.

[0053] For example, in a first inspection, the inspection unit 50c inspects whether the holder 40 is holding the chip 1 rotated at a rotational angle position RP3 so that the chip 1 is within the irradiation range of the laser light L1 from the laser irradiation unit 10 at a rotational angle position RP2. The inspection unit 50c also inspects, for example, whether the holder 40 is holding the chip 1 so that the chip 1 does not fall. If the control unit CT1 determines that the holder 40 is not holding the chip 1 properly, the holder 40 changes the position of the held chip 1, for example, in response to a command from the holder drive circuit 40p.

[0054] The holding unit 40 changes the position of the held chip 1, for example, to a rotational angle position RP6. If the control unit CT1 determines that the position of the chip 1 has been changed appropriately, it controls, for example, the laser irradiation unit drive circuit 10p and the rotation unit drive circuit 30p to irradiate the chip 1 with laser light L1 at a rotational angle position RP2. If the control unit CT1 determines, in response to the results of the first inspection by the inspection unit 50c, that the position of the chip 1 has not been changed appropriately, it controls the laser irradiation unit drive circuit 10p so as not to irradiate the chip 1 with laser light L1 at a rotational angle position RP2. In response to the results of the first inspection by the inspection unit 50c, the control unit CT1 classifies the chip 1 for which it has determined that the laser light L1 should not be irradiated at the rotational angle position RP2 as, for example, a third category.

[0055] Manufacturing apparatus MD1 places inspection unit 50d at rotational angle position RP7, for example. Rotational angle position RP7 forms a rotational angle TH7 with rotational angle position RPs. That is, as viewed from the axial direction of rotation axis Ax1, rotational angle position RP7 forms, for example, a rotational angle TH7 clockwise with rotational angle position RPs. As viewed from the axial direction of rotation axis Ax1, rotational angle position RP7 is located, for example, between rotational angle positions RP2 and RP8. Rotational angle TH7 has a magnitude between rotational angles TH2 and TH8, for example.

[0056] The inspection unit 50d, for example, performs a second inspection to inspect whether the laser irradiation unit 10 properly irradiated the chip 1 with the laser light L1 at the rotational angle position RP2. If the control unit CT1 determines, based on the results of the second inspection by the inspection unit 50d, that the laser irradiation unit 10b did not properly irradiate the chip 1 with the laser light L1, it classifies the chip 1 that it determined to be improper, for example, into the fourth category. If the control unit CT1 determines, based on the results of the second inspection by the inspection unit 50c, that the laser irradiation unit 10 properly irradiated the chip 1 with the laser light L1, it classifies the chip 1 that it determined to be proper, for example, into the fifth category.

[0057] 1 and 2, storage unit 60 stores chips 1 that have been irradiated with laser light L1 and inspected by inspection unit 50. Storage unit 60 stores chips 1 separately according to the above-mentioned classifications, i.e., first to fifth classes. Storage unit 60 includes, for example, storage portions 60a, 60b, 60c, and 60d.

[0058] The manufacturing device MD1 places the storage section 60a at, for example, a rotational angle position RP8. The rotational angle position RP8 forms a rotational angle TH8 with the rotational angle position RPs. That is, as viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP8 forms, for example, a rotational angle TH8 clockwise with the rotational angle position RPs. As viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP8 is located, for example, between the rotational angle positions RP7 and RPs. The rotational angle TH8 is, for example, greater than the rotational angle TH7. The manufacturing device MD1 places the storage section 60b at a rotational angle position RP9, for example. The rotational angle position RP9 forms a rotational angle TH9 with the rotational angle position RPs. When viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP9 is located, for example, between the rotational angle positions RP8 and RPs. The rotational angle TH9 is, for example, larger than the rotational angle TH8. The manufacturing device MD1 places the storage section 60c at a rotational angle position RP10, for example. The rotational angle position RP10 forms a rotational angle TH10 with respect to the rotational angle position RPs. When viewed from the axial direction of the rotation axis Ax1, the rotational angle position RP10 is located, for example, between the rotational angle positions RP9 and RPs. The rotational angle TH10 is, for example, larger than the rotational angle TH9. For example, manufacturing device MD1 positions storage section 60d at rotational angle position RP11. Rotational angle position RP11 forms a rotational angle TH11 with rotational angle position RPs. When viewed from the axial direction of rotation axis Ax1, rotational angle position RP11 is located, for example, between rotational angle positions RP10 and RPs. Rotational angle TH11 is, for example, larger than rotational angle TH10.

[0059] The storage section 60a stores, for example, type 1 chips 1. The chips 1 stored in the storage section 60a are not irradiated with the laser light L1. The manufacturing device MD1 supplies the chips 1 stored in the storage section 60a again, for example, to the hopper 22. For example, the laser irradiation section 10a irradiates the laser light L1 to the chips 1 that have been supplied again to the hopper 22 at the rotation angle position RP1. Storage section 60b stores, for example, second-class and third-class chips 1. The second-class chips 1 and the third-class chips 1 have in common that they are not irradiated with laser light L1 at rotational angle position RP2. In this embodiment, the second-class and third-class chips 1 may be stored in different storage sections. The storage portion 60c stores, for example, a fourth type tip 1. The fourth type tip 1 is irradiated with the laser light L1 at the rotational angle positions RP1 and RP2. The storage portion 60d stores, for example, a fifth-class chip 1. The fifth-class chip 1 is properly irradiated with the laser beam L1 at rotational angle positions RP1 and RP2. In this embodiment, for example, external electrodes 4 and 5 are formed on the fifth-class chip 1 to produce an electronic component ED1 as shown in FIG. 13, which will be described later.

[0060] When storing the first type chip 1, the control unit CT1 controls the driving of the rotation unit 30 and the holding unit 40, for example, so that the storage portion 60a stores the first type chip 1 at the rotation angle position RP8. The rotation unit 30, for example, receives a command from the rotation unit drive circuit 30p to position the holding portion 40 at the rotation angle position RP8. If the holding portion 43 includes a suction nozzle, the holding unit 40, for example, receives a command from the holder drive circuit 40p to weaken the force of suction on the chip 1 so that the chip 1 is stored in the storage portion 60a. The first type chip 1 is no longer held by the holder 40 and is stored in the storage portion 60a. When storing second and third type tips 1, the control unit CT1 controls the driving of the rotating unit 30 and the holding unit 40 so that the storage portion 60b stores the second and third type tips 1, for example, at the rotation angle position RP9. The second and third type tips 1 are no longer held by the holding portion 40 at the rotation angle position RP9, and are stored in the storage portion 60b. When storing the fourth type tip 1, the control unit CT1 controls the driving of the rotating unit 30 and the holding unit 40 so that, for example, at rotational angle position RP10, the storage portion 60c stores the fourth type tip 1. For example, at rotational angle position RP10, the fourth type tip 1 is no longer held by the holding portion 40 and is stored in the storage portion 60c. When storing the fifth type tip 1, the control unit CT1 controls the driving of the rotating unit 30 and the holding unit 40 so that, for example, at the rotation angle position RP11, the storage portion 60d stores the fifth type tip 1. For example, at the rotation angle position RP11, the fifth type tip 1 is no longer held by the holding portion 40 and is stored in the storage portion 60d. The storage sections 60a, 60b, 60c, and 60d may have, for example, an opening for storing the chip 1. For example, the storage section 60d may receive a command from the storage section drive circuit 60p to close the opening so that, for example, the first to fourth type chips 1 are not stored in the storage section 60d.

[0061] As shown in FIG. 5, the manufacturing apparatus MD1 includes, for example, an exhaust unit 70. Irradiation of the laser beam L1 generates, for example, sublimates SB1 from a predetermined surface 1s of the chip 1. The exhaust unit 70 removes, for example, the sublimates SB1 generated from the predetermined surface 1s of the chip 1. The exhaust unit 70 removes the sublimates SB1 from the optical path of the laser beam L1. The exhaust unit 70 is located, for example, on the opposite side of the chip 1 from the holder 41, sandwiching the chip 1 therebetween. The exhaust unit 70 includes, for example, an exhaust duct 71 and a dust collector 72. The dust collector 72 includes, for example, a filter 73 and a pump 74. The exhaust duct 71 is disposed near the predetermined surface 1s of the chip 1 that is irradiated with the laser beam L1. The suction force of the pump 74 sucks the sublimates SB1 generated from the predetermined surface 1s of the chip 1 from the exhaust duct 71 into the dust collector 72. The filter 73 removes the sublimates SB1 from the atmosphere containing the sublimates SB1. The exhaust duct 71 exhausts the atmosphere AR1 from which the sublimate SB1 has been removed to the outside of the manufacturing apparatus MD1.

[0062] Hereinafter, the chip 1 included in the electronic component ED1 and the electronic component ED1 will be described with reference to FIGS. 11 to 13. In this embodiment, the chip 1 has a rectangular parallelepiped shape. As described above, the chip 1 is, for example, a fired ceramic body. The fired ceramic body is formed, for example, by stacking and pressing a plurality of ceramic green sheets together and firing them at a predetermined temperature for a predetermined time. The plurality of ceramic green sheets are stacked, for example, in a first direction D1. The boundaries between the overlapping layers of the green sheets are integrated to an extent that they are not visible. The ceramic green sheets have, for example, electrode patterns of internal electrodes formed thereon. In this embodiment, the chip 1 is, for example, a fired ceramic body before external electrodes are formed on the chip 1. FIG. 11 does not show the internal electrodes. The chip 1 does not necessarily have to have electrode patterns for the internal electrodes formed thereon.

[0063] In this embodiment, the chip 1 has a rectangular parallelepiped shape. The chip 1 has multiple surfaces 1s. The multiple surfaces 1s include, for example, a pair of end faces 1a and 1b facing each other and a side face 1c connecting the end faces 1a and 1b. The side face 1c has a pair of side faces 1c1 and 1c2 facing each other and a pair of side faces 1c3 and 1c4 facing each other. The end faces 1a and 1b, the side faces 1c1 and 1c2, and the side faces 1c3 and 1c4 have, for example, a rectangular shape. The chip 1 shown in FIG. 11 shows the state before the surface 1s is processed by irradiating the above-mentioned laser light L1. In this specification, the term "rectangular parallelepiped shape" includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. In this specification, the term "rectangular shape" includes, for example, a shape with chamfered corners and a shape with rounded corners. For example, when end face 1a constitutes the first surface, end face 1b constitutes the second surface. For example, when end face 1a constitutes the second surface, end face 1b constitutes the first surface.

[0064] The end faces 1a and 1b face each other in a second direction D2 that intersects with the first direction D1. The end faces 1a and 1b define both ends of the chip 1 in the second direction D2. The end faces 1a and 1b are, for example, perpendicular to the second direction D2. The side faces 1c1 and 1c2 are adjacent to the end faces 1a and 1b and face each other in the first direction D1. The side faces 1c1 and 1c2 define both ends of the chip 1 in the first direction D1. The side faces 1c1 and 1c2 are, for example, perpendicular to the first direction D1. The side faces 1c3 and 1c4 are adjacent to the end faces 1a and 1b and the side faces 1c1 and 1c2 and face each other in a third direction D3 that intersects with the first direction D1 and the second direction D2. The side faces 1c3 and 1c4 define both ends of the chip 1 in the third direction D3. The side faces 1c3 and 1c4 are, for example, perpendicular to the third direction D3. In this embodiment, the first direction D1, the second direction D2, and the third direction D3 are perpendicular to one another.

[0065] The end faces 1a and 1b extend in the first direction D1 to connect the side faces 1c1 and 1c2. The end faces 1a and 1b extend in the third direction D3 to connect the side faces 1c3 and 1c4. The side faces 1c1 and 1c2 extend in the second direction D2 to connect the end faces 1a and 1b. The side faces 1c1 and 1c2 extend in the third direction D3 to connect the side faces 1c3 and 1c4. The side faces 1c3 and 1c4 extend in the second direction D2 to connect the end faces 1a and 1b. The side faces 1c3 and 1c4 extend in the first direction D1 to connect the side faces 1c1 and 1c2. The end faces 1a and 1b, the side faces 1c1 and 1c2, and the side faces 1c3 and 1c4 may be indirectly adjacent to each other. In this case, ridges are located between the end faces 1a and 1b, the side faces 1c1 and 1c2, and the side faces 1c3 and 1c4.

[0066] As shown in FIG. 12, the chip 1 includes, for example, a plurality of internal electrodes 2 and 3 inside the chip 1. The internal electrodes 2 and 3 are alternately arranged within the chip 1 so as to face each other at an interval in the first direction D1. The internal electrodes 2 and 3 include, for example, a conductive material. The conductive material includes, for example, Cu, Ni, or Pt. The internal electrodes 2 and 3 are configured, for example, as a sintered body of a conductive paste including the conductive material. The internal electrodes 2 and 3 are, for example, arranged at different positions (layers) in the first direction D1. FIG. 12 illustrates four internal electrodes 2 and four internal electrodes 3.

[0067] The internal electrodes 2 and 3 have a rectangular shape when viewed from the first direction D1. The long side direction of the internal electrodes 2 and 3 is, for example, the second direction D2. The short side direction of the internal electrodes 2 and 3 is, for example, the third direction D3. The internal electrodes 2 and 3 extend, for example, in the second direction D2. The internal electrode 2 has, for example, an end face 2a closer to the end face 1a. The internal electrode 3 has, for example, an end face 3b closer to the end face 1b. As shown in FIG. 12 , before processing the surface 1s by irradiating it with laser light, which will be described later, the internal electrode 2 is not exposed to, for example, the end face 1a. The end face 1a and the end face 2a form a distance P2a in the second direction D2, for example. Before processing the surface 1s by irradiating it with laser light L1, the internal electrode 3 is not exposed to, for example, the end face 1b. The end face 1b and the end face 3b form a distance P3b in the second direction D2, for example.

[0068] The length of the chip 1 in the first direction D1 is, for example, 2.6 mm. The length of the chip 1 in the second direction D2 is, for example, 5.7 mm. The length of the chip 1 in the third direction D3 is, for example, 5.0 mm. In the chip 1, the second direction D2 is, for example, the long side direction.

[0069] As illustrated in FIG. 13, the electronic component ED1 has, for example, a chip 1 including internal electrodes 2 and 3, and external electrodes 4 and 5 arranged on the surface 1s of the chip 1. The internal electrode 2 is connected to the external electrode 4. The external electrode 4 is arranged, for example, so as to cover the end face 1a. The external electrode 4 is also arranged on a portion of the side face 1c. The internal electrode 3 is connected to the external electrode 5. The external electrode 5 is arranged, for example, so as to cover the end face 1b. The external electrode 5 is also arranged on a portion of the side face 1c.

[0070] In the electronic component ED1, the end face 1a is processed by irradiation with the above-described laser beam L1. By processing the end face 1a, for example, a plurality of grooves GR1 are formed. In the example shown in FIG. 13, the plurality of grooves GR1 extend in the third direction D3. By forming the plurality of grooves GR1, the end face 2a of each internal electrode 2 is exposed at the end face 1a. As a result, the internal electrode 2 is electrically and physically connected to the external electrode 4. In the example shown in FIG. 13, the depth of each groove GR1 in the second direction D2 is, for example, equal to or greater than the distance P2a. The width of each groove GR1 in the first direction D1 is, for example, equal to or greater than the width of the end face 2a of the internal electrode 2 in the first direction D1.

[0071] In the electronic component ED1, the end face 1b is processed by irradiating it with the laser beam L1 described above. For example, a plurality of grooves GR1 are formed by processing the end face 1b. In the example shown in FIG. 13, the plurality of grooves GR1 extend in the third direction D3. By forming the plurality of grooves GR1, the end face 3b of each internal electrode 3 is exposed at the end face 1b. As a result, the internal electrode 3 is electrically and physically connected to the external electrode 5. In the example shown in FIG. 13, the depth of each groove GR1 in the second direction D2 is, for example, equal to or greater than the distance P3b. The width of each groove GR1 in the first direction D1 is, for example, equal to or greater than the width of the end face 3b of the internal electrode 3 in the first direction D1.

[0072] In FIG. 13 , the grooves GR1 formed in the end faces 1a and 1b are formed to extend in the third direction D3. In this embodiment, the grooves GR1 may be formed so that at least a portion of the end face 2a of the internal electrode 2 is exposed in the end face 1a. The grooves GR1 may be formed so that at least a portion of the end face 3b of the internal electrode 3 is exposed in the end face 1b. Therefore, in at least one of the end faces 1a and 1b, the grooves GR1 are formed to extend in, for example, the first direction D1. In at least one of the end faces 1a and 1b, the grooves GR1 are formed to extend in, for example, a direction intersecting the first direction D1 and the third direction D3. For example, in one of the end faces 1a and 1b, the grooves GR1 are formed to extend in the third direction D3, and in the other of the end faces 1a and 1b, the grooves GR1 are formed to extend in the first direction D1. The grooves GR1 formed in the end faces 1a and 1b may extend, for example, substantially parallel to each other. The grooves GR1 formed in the end faces 1a and 1b may intersect with each other. When viewed from the second direction D2, one end face 2a may intersect with, for example, one groove GR1 or multiple grooves GR1. When viewed from the second direction D2, one end face 3b may intersect with, for example, one groove GR1 or multiple grooves GR1.

[0073] In the electronic component ED1, for example, the entire end faces 1a and 1b may be removed by irradiating the laser beam L1 without forming the grooves GR1 as illustrated in FIG. 13 . When the entire end face 1a is removed by irradiating the laser beam L1, for example, the depth to which the end face 1a is removed in the second direction D2 is equal to or greater than the distance P2a. As a result, the end face 2a of each internal electrode 2 is exposed at the end face 1a. When the entire end face 1b is removed by irradiating the laser beam L1, for example, the depth to which the end face 1b is removed in the second direction D2 is equal to or greater than the distance P3b. As a result, the end face 3b of each internal electrode 3 is exposed at the end face 1b. In this embodiment, multiple grooves GR1 extending in the third direction D3 may be formed and the intervals between the formed grooves GR1 in the first direction D1 may be narrowed, thereby substantially removing the entire end faces 1a and 1b. When the end face 2a of each internal electrode 2 is exposed by irradiating the end face 1a with the laser beam L1, it is not necessary to remove the entire area of ​​the end face 1a. When the end face 3b of each internal electrode 3 is exposed by irradiating the end face 1b with the laser beam L1, it is not necessary to remove the entire area of ​​the end face 1b.

[0074] The external electrodes 4, 5 have, for example, a baked conductor layer. The external electrodes 4, 5 are formed by baking a conductive paste applied to the surface 1s of the chip 1. The conductive paste contains, for example, a metal powder made of Cu, Ni, or Ag, glass, resin, and an organic solvent. The external electrodes 4, 5 have, for example, a plating layer formed on the baked conductor layer. The plating layer is, for example, a Ni plating layer and a Sn plating layer.

[0075] An example of a method for manufacturing an electronic component ED1 will be described. The order of each process may be reversed. In the above manufacturing method, for example, first, a chip 1 including a plurality of surfaces 1s is prepared. In this embodiment, for example, a plurality of chips 1 are prepared. Next, for example, the prepared chips 1 are placed in a supply unit 20. The supply unit 20 is positioned at a rotation angle position RPs. The supply unit 20 receives a command from a supply unit drive circuit 20a and places the chip 1 on a placement portion 27, for example.

[0076] Next, the holder 40 receives a command from the holder drive circuit 40p and holds the chip 1 placed on the placement portion 27. Next, the rotation unit 30 receives a command from the rotation unit drive circuit 30p and rotates the holder 40 holding the chip 1 around the rotation axis Ax1. In response to a command from the rotation unit drive circuit 30p, the rotation unit 30 stops the holder 40 holding the chip 1 at a rotation angle position RP4, for example.

[0077] Next, the inspection unit 50, which is positioned at rotational angle position RP4, inspects the appearance of the chip 1 held by the holder 40. The control unit CT1 controls the driving of the holder 40 and the laser irradiation unit 10a so that the laser irradiation unit 10a irradiates the first surface 1s with laser light L1 at rotational angle position RP1. The control unit CT1, for example, adjusts the position of the chip 1 and the orientation of the first surface 1s. In response to a command from the rotational unit drive circuit 30p, the rotation unit 30, for example, rotates the holder 40, which holds the chip 1 whose appearance has been inspected, to the rotational angle position RP1. The holder 40 holding the chip 1 stops at the rotational angle position RP1, for example. In response to a command from the laser irradiation unit drive circuit 10p, the laser irradiation unit 10, which is positioned at rotational angle position RP1, irradiates the chip 1, which has been selected as the target for irradiation with laser light L1 based on the results of the appearance inspection, with the first laser light L1. Upon receiving a command from the rotation unit drive circuit 30p, the rotation unit 30 rotates the holder 40, which holds the chip 1 irradiated with the laser light L1, to a rotation angle position RP5. The holder 40 holding the chip 1 stops at the rotation angle position RP5.

[0078] Next, the inspection unit 50, which is positioned at rotational angle position RP5, inspects the appearance of the chip 1 held by the holder 40. In response to a command from the rotational unit drive circuit 30p, the rotation unit 30 rotates the holder 40, which holds the chip 1 that has been selected as the target for the second irradiation of the laser light L1 based on the results of the appearance inspection, to a rotational angle position RP3. The holder 40 holding the chip 1 stops at the rotational angle position RP3, for example. In response to a command from the holder drive circuit 40p, the holder 40 rotates the chip 1 so that a specific surface 1s, among the multiple surfaces 1s, that was not irradiated with the laser light L1 at the rotational angle position RP1, faces the laser irradiation unit 10 at the rotational angle position RP2.

[0079] Next, in response to a command from the rotation unit drive circuit 30p, the rotation unit 30 rotates the holder 40 holding the chip 1, for example, to a rotation angle position RP6. The holder 40 holding the chip 1 stops, for example, at the rotation angle position RP6. The inspection unit 50 arranged at the rotation angle position RP6 inspects the appearance of the chip 1 held by the holder 40. In response to a command from the rotation unit drive circuit 30p, the rotation unit 30 rotates the holder 40 holding the chip 1 whose appearance has been inspected, for example, to a rotation angle position RP2. The holder 40 holding the chip 1 stops, for example, at the rotation angle position RP2.

[0080] Next, the laser irradiation unit 10b, which is positioned at the rotational angle position RP2, receives a command from the laser irradiation unit drive circuit 10p and irradiates the chip 1, which was selected as the target for the second laser light L1 irradiation based on the results of the appearance inspection, with the second laser light L1. The control unit CT1 drives the holder 40 and the laser irradiation unit 10b so that the laser irradiation unit 10b irradiates the second surface 1s with the laser light L1 at the rotational angle position RP2. The control unit CT1 adjusts, for example, the position of the chip 1 and the orientation of the second surface 1s. The rotation unit 30 receives a command from the rotational angle position drive circuit 30p and rotates the holder 40, which holds the chip 1 that was irradiated with the second laser light L1 at the rotational angle position RP2, to the rotational angle position RP7. The holder 40 holding the chip 1 stops at the rotational angle position RP7, for example. The inspection unit 50, which is positioned at the rotational angle position RP7, inspects the appearance of the chip 1 held by the holder 40.

[0081] For example, in response to a command from the rotation unit drive circuit 30p, the rotation unit 30 rotates the holder 40 holding the chip 1 to one of the rotation angle positions RP8, RP9, RP10, and RP11 depending on the results of the first and second tests. The rotation angle positions RP8, RP9, RP10, and RP11 are respectively located at the corresponding storage sections 60a, 60b, 60c, and 60d. When storing the first to fifth types of chips 1 in the storage sections 60a, 60b, 60c, and 60d, the holder 40 rotates around the rotation axis Ax1 in the order of the rotation angle positions RP7, RP8, RP9, RP10, and RP10. The rotation angle position RP11 is farther from the rotation angle position RP7 than the rotation angle positions RP8, RP9, and RP10. The storage sections 60a, 60b, 60c, and 60d sort and store the chips 1 according to the first to fifth types, for example. In this embodiment, for example, external electrodes 4 and 5 are formed on the chip 1 housed in the housing portion 60d to produce the electronic component ED1.

[0082] In the above description, the laser irradiation unit 10a arranged at the rotational angle position RP1 performs the first irradiation of the laser beam L1, and the laser irradiation unit 10b arranged at the rotational angle position RP2 performs the second irradiation of the laser beam L1. At the rotational angle position RP3, the holder 40 rotates the holder 41. In this embodiment, the laser irradiation unit 10a arranged at the rotational angle position RP1 may perform the first and second irradiation of the laser beam L1.

[0083] The control unit CT1 controls the driving of the rotation unit 30, for example, so that the holding unit 40 that holds the chip 1 is positioned at a rotational angle position RP1. The control unit CT1 drives the holding unit 40 and the laser irradiation unit 10a so that the laser irradiation unit 10a irradiates the first surface 1s with laser light L1 at the rotational angle position RP1. The control unit CT1 adjusts, for example, the position of the chip 1 and the orientation of the first surface 1s. The control unit CT1 controls the driving of the holding unit 40 and the laser irradiation unit 10a so that the orientation of the chip 1 is rotated at the rotational angle position RP1 and the laser irradiation unit 10a irradiates the second surface 1s with laser light L1.

[0084] The holding unit 40 may rotate the chip 1 so that a predetermined surface 1s, among the multiple surfaces 1s, that was not irradiated with the laser light L1 at the rotational angle position RP1 faces the laser irradiation unit 10a at the rotational angle position RP1. In this case, the chip 1 to be irradiated with the laser light L1 may remain at the rotational angle position RP1 until the second irradiation of the laser light L1 is completed. After the first irradiation of the laser light L1 is completed, the chip 1 to be irradiated with the laser light L1 may make one revolution around the rotation axis Ax1 and be positioned at the rotational angle position RP1 again. While the chip 1 is positioned at the rotational angle position RP1, inspection by the inspection unit 50 may be performed. While the chip 1 is positioned at a position other than the rotational angle position RP1, inspection by the inspection unit 50 may be performed. In this embodiment, the laser irradiation unit 10b positioned at the rotational angle position RP2 may perform the first and second irradiation of the laser light L1.

[0085] As described above, the manufacturing apparatus MD1 for electronic components ED1 according to this embodiment processes a predetermined surface 1 s among multiple surfaces 1 s of a chip 1 by irradiating the chip 1 with laser light L1, and includes: a rotating unit 30 that rotates about a rotation axis Ax1; a holding unit 40 that holds the chip 1 and is disposed on the rotating unit 30 so as to rotate together with the rotating unit 30 about the rotation axis Ax1; a laser irradiation unit 10 that is positioned at predetermined rotational angle positions RP1 and RP2 of the rotating unit 30 and irradiates the laser light L1; and a control unit CT1 that controls the driving of the rotating unit 30, the holding unit 40, and the laser irradiation unit 10. The control unit CT1 controls the driving of the rotating unit so that the holding unit 40 that holds the chip 1 is positioned at the predetermined rotational angle positions RP1 and RP2, and controls the driving of the holding unit 40 and the laser irradiation unit 10 so that the laser irradiation unit 10 irradiates the predetermined surface 1 s with laser light L1 at the predetermined rotational angle positions RP1 and RP2.

[0086] According to the manufacturing device MD1, the rotation unit 30 positions the chip 1, which is the target of laser light irradiation, at predetermined rotational angle positions RP1 and RP2, and the laser irradiation unit 10 irradiates the predetermined surface 1s with laser light L1 at the predetermined rotational angle positions RP1 and RP2. Therefore, the predetermined surface 1s of the chip 1 is easily irradiated with the laser light L1. As a result, the manufacturing device MD1 easily and reliably processes the surface 1s of the chip 1 by irradiating it with the laser light L1.

[0087] In the manufacturing apparatus MD1, the predetermined surface 1s includes first surfaces 1a, 1b and second surfaces 1a, 1b. The laser irradiation unit 10 includes a laser irradiation unit 10a located at rotational angle position RP1 of the predetermined rotational angle positions RP1, RP2, and a laser irradiation unit 10b located at rotational angle position RP2 of the predetermined rotational angle positions RP1, RP2. The control unit CT1 controls the driving of the rotating unit 30 so that the holding unit 40 holding the chip 1 is positioned at rotational angle position RP1, controls the driving of each of the holding unit 40 and the laser irradiation unit 10a so that the laser irradiation unit 10a irradiates the first surfaces 1a, 1b with laser light L1 at rotational angle position RP1, controls the driving of the rotating unit 30 so that the holding unit 40 holding the chip 1 is positioned at rotational angle position RP3 among the predetermined rotational angle positions RP1, RP2, RP3, controls the driving of the holding unit 40 so that the orientation of the chip 1 is rotated at rotational angle position RP3 so that the laser irradiation unit 10b irradiates the second surfaces 1b, 1a with laser light L1, controls the driving of the rotating unit 30 so that the holding unit 40 holding the chip 1 is positioned at rotational angle position RP2, and controls the driving of each of the holding unit 40 and the laser irradiation unit 10b so that the laser irradiation unit 10b irradiates the second surfaces 1b, 1a with laser light L1 at rotational angle position RP2. The rotational angle position RP3 is located between the rotational angle positions RP1 and RP2. In this case, the first surfaces 1a, 1b and the second surfaces 1b, 1a of the predetermined surface 1s are more likely to be irradiated with the laser beam L1. As a result, the manufacturing device MD1 processes the surface 1s of the chip 1 more easily and reliably by irradiating it with the laser beam L1.

[0088] In the manufacturing apparatus MD1, the predetermined surface 1s includes first surfaces 1a, 1b and second surfaces 1b, 1a. The laser irradiation unit 10 includes a laser irradiation unit 10a that is located at rotational angle position RP1 among predetermined rotational angle positions RP1, RP2. The control unit CT1 controls the drive of the rotation unit 30 so that the holding unit 40 that holds the chip 1 is located at rotational angle position RP1, controls the drive of each of the holding unit 40 and the laser irradiation unit 10a so that the laser irradiation unit 10a irradiates the first surfaces 1a, 1b with laser light at the rotational angle position RP1, and controls the drive of each of the holding unit 40 and the laser irradiation unit 10a so that the laser irradiation unit 10a irradiates the second surfaces 1b, 1a with laser light L1 at the rotational angle position RP1. In this case, the first surfaces 1a, 1b and the second surfaces 1b, 1a of the predetermined surface 1s are more likely to be irradiated with the laser beam L1. As a result, the manufacturing device MD1 processes the surface 1s of the chip 1 more easily and reliably by irradiating it with the laser beam L1.

[0089] The manufacturing device MD1 includes an inspection unit 50. Before irradiating the predetermined surface 1s with the laser light L1, the inspection unit 50 performs at least one of a first inspection to inspect the position of the chip 1 and the orientation of the predetermined surface 1s so that the laser irradiation unit 10 irradiates the predetermined surface 1s with the laser light L1 at predetermined rotational angle positions RP1 and RP2, and a second inspection to inspect the predetermined surface 1s irradiated with the laser light L2. In this case, the control unit CT1 accurately inspects the predetermined surface 1 s irradiated with the laser beam L1 and whether the predetermined surface 1 s is irradiated with the laser beam L1. As a result, the manufacturing device MD1 more reliably processes the surface 1 s of the chip 1 by irradiating it with the laser beam L1.

[0090] The manufacturing device MD1 is provided with a storage unit 60 having a plurality of storage portions 60a, 60b, 60c, and 60d for storing chips 1. The control unit CT1 receives the results of the first and second inspections and selects one of the storage portions 60a, 60b, 60c, and 60d for storing the chip 1 from among the plurality of storage portions 60a, 60b, 60c, and 60d. In this case, the chips 1 are selected according to the results of the first and second inspections. As a result, the manufacturing device MD1 accurately selects the chips 1 whose surfaces 1s have been more reliably processed by irradiation with the laser light L1. In this embodiment, rotational angle position RP11 is farther from rotational angle position RP7 than rotational angle positions RP8, RP9, and RP10. Therefore, even if, for example, an abnormal operation or an abnormal stop occurs in rotating unit 30 and holding unit 40 when holding unit 40 rotates from rotational angle position RP7 toward rotational angle position RP11, it is unlikely that first- to fourth-class chips 1 that should be stored at rotational angle positions RP8, RP9, and RP10, respectively, will be stored at rotational angle position RP11. Manufacturing apparatus MD1 prevents first- to fourth-class chips 1 from being mixed with fifth-class chips 1.

[0091] In the manufacturing device MD1, the storage portions 60a, 60b, 60c, and 60d of the storage section 60 that the control section CT1 selects when it determines to stop irradiating the laser light L1 based on the results of the first inspection may be different from the storage portions 60a, 60b, 60c, and 60d of the storage section 60 that the control section CT1 selects when it determines to stop irradiating the laser light L1 based on the results of the second inspection. In this case, the chips 1 irradiated with the laser light L1 and the chips 1 not irradiated with the laser light L1 are stored separately. Therefore, among the stored chips 1, the chips 1 not irradiated with the laser light L1 are held again in the holder 40 so as to be irradiated with the laser light L1. As a result, even if there is an error in the judgment in the first and second inspections, for example, a decrease in the yield in the surface processing of the chips 1 is suppressed.

[0092] The manufacturing apparatus MD1 includes an exhaust unit 70 that exhausts the sublimate SB1 generated from a predetermined surface 1s by irradiation with the laser light L1. In this case, the sublimate SB1 is removed from the optical path of the laser light L1.

[0093] In the manufacturing apparatus MD1, the exhaust unit 70 has an exhaust duct 71 that takes in the sublimate SB1 into the exhaust unit 70. The exhaust duct 71 is located on the opposite side of the chip 1 from the holder 40. In this case, the sublimate SB1 is reliably removed from the optical path of the laser light L1.

[0094] In the manufacturing device MD1, the holder 40 rotates the chip 1 around the rotation axis Ax2 of the holder 40. In this case, the holder 40 reliably rotates the chips. As a result, the manufacturing device MD1 processes the surfaces 1s of the plurality of chips 1 more easily and reliably by irradiating them with the laser light L1.

[0095] In the manufacturing device MD1, the holder 40 sucks the chip. In this case, the holding unit 40 holds the chips 1 while further reducing mechanical stress on the chips 1. As a result, the manufacturing device MD1 processes the surfaces 1s of the plurality of chips 1 more easily and reliably by irradiating them with the laser light L1.

[0096] In the manufacturing apparatus MD1, the holding unit 40 includes a material that is optically transparent to the laser light L1. In this case, the holder 40 is less likely to be deteriorated by the laser light L1 irradiated onto the plurality of chips 1.

[0097] In the manufacturing device MD1, the laser irradiation section 10 irradiates laser light L1 having a wavelength in the range of 250 nm to 1600 nm. In this case, the laser light L1 is easily transmitted through the optical waveguide 12d and the optical lens 14c included in the laser irradiation unit 10, and the atmosphere, so the light intensity of the laser light L1 is less likely to attenuate. Therefore, the laser light L1 in the above wavelength range is easily absorbed by the chip 1. The surface 1s of the chip 1 is more reliably processed by the irradiation of the laser light L1.

[0098] In the manufacturing device MD1, the laser irradiation unit 10 has a pulse width of 10 -8 ~10 -15 The sample is irradiated with pulsed laser light of 1000 s. In this case, the chip 1 is less susceptible to the thermal effect when irradiated with the laser light L1, and therefore the surface 1s of the chip 1 is more reliably processed by the irradiation with the laser light L1.

[0099] The manufacturing method of the electronic component ED1 in this embodiment is a manufacturing method of the electronic component ED1 using a manufacturing apparatus MD1 for the electronic component ED1, and includes the steps of: a step in which the control unit CT1 controls the drive of the rotation unit 30 to rotate the holding unit 40 so that the holding unit 40 holding the chip 1 is positioned at a predetermined rotational angle position RP1, RP2; a step in which the control unit CT1 controls the drive of the holding unit 40 and the laser irradiation unit 10 so that the laser irradiation unit 10 irradiates the predetermined surface 1s with laser light L1 at the predetermined rotational angle positions RP1, RP2; and a step in which the control unit CT1 controls the drive of the laser irradiation unit 10 to irradiate the predetermined surface 1s with laser light L1 at the predetermined rotational angle positions RP1, RP2.

[0100] According to the method for manufacturing an electronic component, the rotating unit 30 positions the chip 1, which is the target of laser light irradiation, at predetermined rotational angle positions RP1 and RP2, and the laser irradiation unit 10 irradiates the predetermined surface 1s with laser light L1 at the predetermined rotational angle positions RP1 and RP2. Therefore, the predetermined surface 1s of the chip 1 is easily irradiated with the laser light L1. As a result, the method for manufacturing the electronic component ED1 easily and reliably processes the surface 1s of the chip 1 by irradiating it with laser light L1.

[0101] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0102] The manufacturing equipment MD1 does not need to be equipped with a storage unit 60 having a plurality of storage portions 60a, 60b, 60c, and 60d for storing chips 1. In a configuration in which the manufacturing equipment MD1 is equipped with a storage unit 60 having a plurality of storage portions 60a, 60b, 60c, and 60d for storing chips 1, the chips 1 are selected according to the results of the first and second inspections, as described above. As a result, the manufacturing equipment MD1 accurately selects chips 1 whose surfaces 1s have been more reliably processed by irradiation with the laser light L1. The manufacturing apparatus MD1 may not be provided with the exhaust unit 70 that exhausts the sublimates SB1 generated from the predetermined surface 1s by the irradiation of the laser beam L1. In a configuration in which the manufacturing apparatus MD1 is provided with the exhaust unit 70, the sublimates SB1 are removed from the optical path of the laser beam L1 as described above. In the manufacturing apparatus MD1, the exhaust duct 71 does not have to be located on the opposite side of the holding part 40 across the chip 1. In a configuration in which the exhaust duct 71 is located on the opposite side of the holding part 40 across the chip 1, as described above, the sublimate SB1 is reliably removed from the optical path of the laser light L1. In the manufacturing device MD1, the holding unit 40 does not need to adsorb the chips. In a configuration in which the holding unit 40 adsorbs the chips, as described above, the holding unit 40 holds the chips 1 while further reducing mechanical stress on the chips 1. As a result, the manufacturing device MD1 processes the surfaces 1s of the multiple chips 1 more easily and reliably by irradiating them with the laser light L1.

[0103] As can be understood from the above description of the embodiments, the present specification includes disclosure of the following aspects. (Appendix 1) An electronic component manufacturing apparatus that processes a predetermined surface among a plurality of surfaces of a chip by irradiating the chip with laser light, a rotating part that rotates around a rotation axis; a holder that holds the tip and is disposed on the rotating part so as to rotate together with the rotating part around the rotation axis; a laser irradiation unit that is located at a predetermined rotation angle position of the rotating unit and that irradiates the laser light; a control unit that controls the driving of the rotating unit, the holding unit, and the laser irradiation unit; Equipped with The control unit controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the predetermined rotation angle position; an electronic component manufacturing apparatus that controls driving of the holding unit and the laser irradiation unit so that the laser irradiation unit irradiates the laser light onto the predetermined surface at the predetermined rotation angle position; (Appendix 2) the predetermined surface includes a first surface and a second surface; The laser irradiation unit a first laser irradiation unit located at a first rotational angle position among the predetermined rotational angle positions; a second laser irradiation unit located at a second rotational angle position among the predetermined rotational angle positions, The control unit controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the first rotation angle position; controlling the driving of each of the holding unit and the first laser irradiation unit so that the first laser irradiation unit irradiates the first surface with the laser light at the first rotational angle position; controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at a third rotation angle position among the predetermined rotation angle positions; controlling the driving of the holding unit so that the orientation of the chip is rotated at the third rotation angle position and the second laser irradiation unit irradiates the laser light onto the second surface; controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the second rotation angle position; controlling the driving of each of the holding unit and the second laser irradiation unit so that the second laser irradiation unit irradiates the second surface with the laser light at the second rotational angle position; 2. The electronic component manufacturing apparatus according to claim 1, wherein the third rotational angle position is located between the first rotational angle position and the second rotational angle position. (Appendix 3) the predetermined surface includes a first surface and a second surface; The laser irradiation unit a first laser irradiation unit located at a first rotational angle position among the predetermined rotational angle positions, The control unit controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the first rotation angle position; controlling the driving of each of the holding unit and the first laser irradiation unit so that the first laser irradiation unit irradiates the first surface with the laser light at the first rotational angle position; 2. The electronic component manufacturing apparatus according to claim 1, further comprising: controlling the driving of the holding unit and the first laser irradiation unit so that the orientation of the chip is rotated at the first rotation angle position and the first laser irradiation unit irradiates the laser light onto the second surface. (Appendix 4) Further comprising an inspection unit, The inspection unit a first inspection for inspecting the position of the chip and the orientation of the predetermined surface so that the laser irradiation unit irradiates the laser light onto the predetermined surface at the predetermined rotation angle position before irradiating the laser light onto the predetermined surface; and a second inspection for inspecting the predetermined surface irradiated with the laser light. (Appendix 5) a storage unit having a plurality of storage portions for storing the chip; 5. The electronic component manufacturing apparatus according to claim 4, wherein the control unit selects a storage portion for storing the chip from among the plurality of storage portions based on the results of the first and second inspections. (Appendix 6) 6. The electronic component manufacturing apparatus of claim 5, wherein the storage portion of the storage unit selected by the control unit when it determines to stop irradiating the laser light in response to a result of the first inspection is different from the storage portion of the storage unit selected by the control unit when it determines to stop irradiating the laser light in response to a result of the second inspection. (Appendix 7) 7. The electronic component manufacturing apparatus according to any one of claims 1 to 6, further comprising an exhaust unit that exhausts sublimates generated from the predetermined surface by the irradiation of the laser light. (Appendix 8) the exhaust section has an exhaust duct that takes the sublimate into the exhaust section, 8. The electronic component manufacturing apparatus according to claim 7, wherein the exhaust duct is located on the opposite side of the chip from the holder. (Appendix 9) 9. The electronic component manufacturing apparatus according to any one of claims 1 to 8, wherein the holding unit rotates the chip around a rotation axis of the holding unit. (Appendix 10) 10. The electronic component manufacturing apparatus according to any one of claims 1 to 9, wherein the holding section sucks the chip. (Appendix 11) 11. The electronic component manufacturing apparatus according to any one of claims 1 to 10, wherein the holding unit includes a material that is optically transparent to the laser light. (Appendix 12) 12. The electronic component manufacturing apparatus according to any one of claims 1 to 11, wherein the laser irradiation unit irradiates laser light having a wavelength in the range of 250 nm to 1600 nm. (Appendix 13) The laser irradiation unit has a pulse width of 10 -8 ~10 -15 13. The electronic component manufacturing apparatus according to any one of claims 1 to 12, wherein the apparatus irradiates a pulsed laser beam having a wavelength of 1000 s. (Appendix 14) A method for manufacturing an electronic component using the electronic component manufacturing apparatus according to any one of Supplementary Notes 1 to 13, a step in which the control unit controls the driving of the rotation unit to rotate the holding unit so that the holding unit that holds the tip is positioned at the predetermined rotation angle position; a step in which the control unit controls driving of the holding unit and the laser irradiation unit so that the laser irradiation unit irradiates the laser light onto the predetermined surface at the predetermined rotation angle position; and a step in which the control unit controls the driving of the laser irradiation unit to irradiate the laser light onto the predetermined surface at the predetermined rotation angle position. [Explanation of symbols]

[0104] 1...chip, 1s...surface, 10...laser irradiation section, 20...supply section, 30...rotating section, 31...rotor, 40...holding section, 50...inspection section, 60...storage section, 70...exhaust section, Ax1...rotating axis, Ax2...rotating axis, ED1...electronic component, L1...laser light, MD1...manufacturing equipment, RP1...rotation angle position, RP2...rotation angle position, RP3...rotation angle position.

Claims

1. An electronic component manufacturing apparatus that processes a predetermined surface among a plurality of surfaces of a chip by irradiating the chip with laser light, a rotating part that rotates around a rotation axis; a holder that holds the tip and is disposed on the rotating part so as to rotate together with the rotating part around the rotation axis; a laser irradiation unit that is located at a predetermined rotation angle position of the rotating unit and that irradiates the laser light; a control unit that controls the driving of the rotating unit, the holding unit, and the laser irradiation unit; Equipped with The control unit controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the predetermined rotation angle position; an electronic component manufacturing apparatus that controls driving of the holding unit and the laser irradiation unit so that the laser irradiation unit irradiates the laser light onto the predetermined surface at the predetermined rotation angle position;

2. the predetermined surface includes a first surface and a second surface; The laser irradiation unit a first laser irradiation unit located at a first rotational angle position among the predetermined rotational angle positions; a second laser irradiation unit located at a second rotational angle position among the predetermined rotational angle positions, The control unit controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the first rotation angle position; controlling the driving of each of the holding unit and the first laser irradiation unit so that the first laser irradiation unit irradiates the first surface with the laser light at the first rotational angle position; controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at a third rotation angle position among the predetermined rotation angle positions; controlling the driving of the holding unit so that the orientation of the chip is rotated at the third rotation angle position and the second laser irradiation unit irradiates the laser light onto the second surface; controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the second rotation angle position; controlling the driving of each of the holding unit and the second laser irradiation unit so that the second laser irradiation unit irradiates the second surface with the laser light at the second rotational angle position; 2. The electronic component manufacturing apparatus according to claim 1, wherein the third rotational angular position is located between the first rotational angular position and the second rotational angular position.

3. the predetermined surface includes a first surface and a second surface; The laser irradiation unit a first laser irradiation unit located at a first rotational angle position among the predetermined rotational angle positions, The control unit controlling the driving of the rotation unit so that the holding unit that holds the tip is positioned at the first rotation angle position; controlling the driving of each of the holding unit and the first laser irradiation unit so that the first laser irradiation unit irradiates the first surface with the laser light at the first rotational angle position; 2. The electronic component manufacturing apparatus according to claim 1, further comprising: controlling the driving of the holding unit and the first laser irradiation unit so that the orientation of the chip is rotated at the first rotation angle position and the first laser irradiation unit irradiates the laser light onto the second surface.

4. Further comprising an inspection unit, The inspection unit a first inspection for inspecting the position of the chip and the orientation of the predetermined surface so that the laser irradiation unit irradiates the laser light onto the predetermined surface at the predetermined rotation angle position before irradiating the laser light onto the predetermined surface; 4. The electronic component manufacturing apparatus according to claim 1, further comprising: a first inspection for inspecting the predetermined surface irradiated with the laser light;

5. a storage unit having a plurality of storage portions for storing the chip; 5. The electronic component manufacturing apparatus according to claim 4, wherein the control unit selects a storage portion for storing the chip from among the plurality of storage portions based on the results of the first and second inspections.

6. 6. The electronic component manufacturing apparatus of claim 5, wherein the storage portion of the storage unit selected by the control unit when determining to stop irradiating the laser light in response to the results of the first inspection is different from the storage portion of the storage unit selected by the control unit when determining to stop irradiating the laser light in response to the results of the second inspection.

7. 4. The electronic component manufacturing apparatus according to claim 1, further comprising an exhaust unit that exhausts sublimates generated from the predetermined surface by the irradiation of the laser light.

8. the exhaust section has an exhaust duct that takes the sublimate into the exhaust section, 8. The electronic component manufacturing apparatus according to claim 7, wherein the exhaust duct is located on the opposite side of the chip from the holder.

9. 4. The electronic component manufacturing apparatus according to claim 1, wherein the holding unit rotates the chip around a rotation axis of the holding unit.

10. 4. The electronic component manufacturing apparatus according to claim 1, wherein the holding section sucks the chip.

11. 4. The electronic component manufacturing apparatus according to claim 1, wherein the holding portion includes a material that is optically transparent to the laser light.

12. 4. The electronic component manufacturing apparatus according to claim 1, wherein the laser irradiation unit irradiates laser light having a wavelength in the range of 250 nm to 1600 nm.

13. The laser irradiation unit has a pulse width of 10 －８ ~10 －１５ 4. The electronic component manufacturing apparatus according to claim 1, wherein the laser beam is a pulsed laser beam having a pulse duration of 1000 s.

14. A method for manufacturing an electronic component using the electronic component manufacturing apparatus according to claim 1, a step in which the control unit controls the driving of the rotation unit to rotate the holding unit so that the holding unit that holds the tip is positioned at the predetermined rotation angle position; a step in which the control unit controls driving of the holding unit and the laser irradiation unit so that the laser irradiation unit irradiates the laser light onto the predetermined surface at the predetermined rotation angle position; and a step in which the control unit controls the driving of the laser irradiation unit to irradiate the laser light onto the predetermined surface at the predetermined rotation angle position.

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