Chiller opening / closing connector for substrate processing systems

Abstract

To provide a substrate processing system for connecting a chiller to a processing chamber.SOLUTION: A substrate processing station 400 includes a slide and pivot assembly 402 which allows a process module bias assembly 406 to slide and pivot relative to remaining components of a processing chamber 404, and which allows the process module bias assembly 406 to be pulled out away from the processing chamber 404 and pivoted up to a predetermined angle relative to a front face of the processing chamber 404. The process module bias assembly 406 includes a housing 408, and a portion 410 of a process module including a process bias bowl 412, and may include, in addition to the process bias bowl 412, an electrostatic chuck and / or other substrate support, and a top plate assembly.SELECTED DRAWING: Figure 4A

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Patent Application No. 62 / 984,081, filed March 2, 2020. The disclosures of the above-referenced applications are incorporated herein by reference in their entireties.

[0002] Technical Field FIELD OF THE DISCLOSURE The present disclosure relates to substrate processing systems, and more particularly to systems for connecting a chiller to a processing chamber. [Background technology]

[0003] The "Background" section provided herein is intended to generally present the background of the present disclosure. To the extent described in the "Background" section of the present disclosure, the work of the inventors named herein, as well as aspects of the present disclosure that may not be considered prior art at the time of filing, are not admitted explicitly or implicitly as prior art to the present disclosure.

[0004] Substrate processing systems may be used to treat substrates, such as semiconductor wafers. Examples of processes that may be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and / or other etching, deposition, or cleaning processes. The substrate may be placed on a substrate support, such as a pedestal or electrostatic chuck (ESC), in a processing chamber of the substrate processing system. During etching, a gas mixture including one or more precursors may be introduced into the processing chamber, and a plasma may be used to initiate a chemical reaction. Summary of the Invention

[0005] The substrate processing system includes a hinge assembly configured to allow a substrate support and an RF bias assembly of a processing chamber to slide from a docked position to an undocked position relative to other components of the processing chamber. A closing connector is configured to supply a fluid to at least one of the substrate support and the RF bias assembly. The closing connector includes a first portion including a first fluid passage connected to a first conduit. A second portion includes a second fluid passage connected to a second conduit. The first fluid passage in the first portion is in fluid communication with the second fluid passage in the second portion. A fastener detachably connects the first portion to the second portion. The first portion is configured to slide together with the substrate support and the RF bias assembly relative to the second portion and other portions of the processing chamber. The first portion is positioned inward from the second portion in a direction of sliding from the docked position to the undocked position.

[0006] In other features, when the opening / closing connector is in the docked position, the first portion is connected to the second portion. When the opening / closing connector is in the undocked position, the first portion is disconnected from the second portion. The hinge assembly is configured so that the substrate support and RF bias assembly slide from the docked position to the undocked position and then pivot through a predetermined angle greater than 90 degrees.

[0007] In another feature, the open / close connector is located inside the housing, and the housing is connected to a gas source that is purged during operation, the gas source being molecular nitrogen or clean, dry air.

[0008] In other features, the first portion includes a third fluid passage connected to the third conduit, the second portion includes a fourth fluid passage connected to the fourth conduit, and the third fluid passage in the first portion is in fluid communication with the fourth fluid passage in the second portion.

[0009] The tool includes a front-end equipment module (EFEM), a substrate transfer module, a load lock disposed between the EFEM and the substrate transfer module, and 2N substrate processing systems according to claim 1, where N is an integer between 1 and 5. Half of the 2N substrate processing systems are disposed on one side of the substrate transfer module, and the other half of the 2N substrate processing systems are disposed on the opposite side of the substrate transfer module.

[0010] In other features, a first portion of the opening and closing connector includes a plurality of holes, and a second portion of the opening and closing connector includes a plurality of alignment pins that mate with the plurality of holes, respectively, when the first portion is connected to the second portion.

[0011] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the disclosure.

[0012] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein: [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a perspective view of a portion of two tools including an exemplary slide and pivot assembly.

[0014] [Figure 2] FIG. 2 is a top view of a portion of one of the tools of FIG.

[0015] [Figure 3] FIG. 3 is a side view of a portion of one of the tools of FIG.

[0016] [Figure 4A] FIG. 4A is a top view of an embodiment of a substrate processing station including a slide and pivot assembly.

[0017] [Figure 4B] FIG. 4B is a simplified cross-sectional view of an embodiment of a substrate support.

[0018] [Figure 5] FIG. 5 is a side view of one embodiment of a processing station including a housing for an open / close fluid connector according to the present disclosure.

[0019] [Figure 6] FIG. 6 is a perspective view of an example housing for a closing connector for cooling fluid delivered to a processing station according to the present disclosure.

[0020] [Figure 7] FIG. 7 is a perspective view of an embodiment of an enclosure with the cover removed in accordance with the present disclosure.

[0021] [Figure 8] FIG. 8 is a side view of an embodiment of a closing connector in a connected position according to the present disclosure. [Figure 9] FIG. 9 is a side view of an embodiment of a closing connector in a disconnected position according to the present disclosure.

[0022] [Figure 10] FIG. 10 is a side cross-sectional view of an embodiment of a switchable connector in a disconnected position according to the present disclosure.

[0023] [Figure 11] FIG. 11 shows various views of the alignment pins of the opening and closing connector. [Figure 12] FIG. 12 shows various views of the alignment pins of the opening and closing connector. [Figure 13] FIG. 13 shows various views of the alignment pins of the opening and closing connector. DETAILED DESCRIPTION OF THE INVENTION

[0024] In the drawings, reference numbers may be reused to identify similar and / or identical elements.

[0025] A semiconductor fabrication (fab) room may include multiple tools, each of which may include multiple substrate processing stations (hereinafter "stations"). Each of the stations may be configured to perform a conductor etch process, a dielectric etch process, or other substrate processing. Space within a fab room is limited, thus limiting the amount of space available to access each of the tools to perform maintenance and / or servicing on the stations. The tool stations may be arranged in a star-shaped or linear pattern.

[0026] In a star pattern, the stations are arranged around a centrally located substrate transport module that contains a robot that moves substrates from the load lock chamber to each of the substrate processing stations and back to the load lock. This arrangement of stations provides some access space between stations, but the density of the stations is less than when arranged in a linear pattern.

[0027] In a linear pattern, the stations are configured side-by-side to form two rows of stations. The rows are located on either side of a substrate transfer module that may operate at atmospheric pressure or vacuum. While a linear configuration allows for more stations to be placed within a dedicated footprint, the linear configuration limits access to the sides of the stations.

[0028] To improve serviceability, the processing station may include a sliding and pivoting assembly that allows the lower portion of the processing chamber (including the front or walkway-facing wall of the processing chamber, the substrate support, and the RF bias assembly) to slide out and then pivot into position between adjacent tools. In some embodiments, the substrate support includes a base plate having coolant channels for flowing fluid to control the temperature of the substrate support and a substrate disposed thereon. The top plate assembly can be removed for servicing, maintenance, or replacement. The remainder of the processing chamber remains in the same position.

[0029] Before the sliding and pivoting assembly can be moved to the maintenance position, the connections to the substrate support and RF biasing assembly must be disconnected. In some embodiments, the substrate support and / or RF biasing assembly may be cooled by a fluid. Therefore, the fluid connections must be disconnected before the sliding and pivoting assembly can be moved to the maintenance position. In some embodiments, a combination of rigid and flexible conduits is used. Some portions of the fluid delivery components remain in place with the rest of the processing chamber, while other portions of the fluid delivery components move with the sliding and pivoting assembly. As can be appreciated, providing reliable open and closed fluid connections in the relatively limited space below the biasing assembly is difficult.

[0030] 1 and 2 show a portion of two tools 100, 102 (one shown as a solid line at 100 and the other as a dashed line at 102) arranged side-by-side in a fab room. Each of the tools includes two rows of stations (one row shown for each tool). The stations are located adjacent to a substrate transfer module (not shown in FIG. 1 for clarity). The space between the tools 100, 102 is limited. The width of the passage between the tools 100, 102 is shown as W. The width W provides the minimum amount of space between the tools 100, 102 to open the processing chambers of the stations and access the interior of the process modules and corresponding processing chambers.

[0031] The embodiments described herein include slide and pivot assemblies that can be withdrawn from and pivoted away from the corresponding processing chambers to allow for maintenance or servicing in the walkway. The slide and pivot assemblies are configured to be repeatedly moved from a fully docked state to a fully undocked state and back to the same fully docked location. In one example, the slide and pivot assemblies are configured to return the process module bias assembly to within ±25 micrometers (μm, also referred to as microns) of the fully docked state. The slide and pivot assemblies are configured to handle and compensate for the heavy load of the process module bias assembly. An example combined weight of the process module bias assembly and corresponding slide and pivot assemblies is approximately 300 kilograms (kg).

[0032] The tools 100, 102 include a front opening integrated pod (FOUP) 104, a front end of equipment module (EFEM) and load lock 106, a station having a radio frequency generator 107 and a gas box 108, and a power lockout and tagout panel 110. The station further includes a process module bias assembly 112, which includes respective slide and pivot assemblies (shown in FIG. 4).

[0033] Each of the stations, alone or in combination, may be referred to as a substrate processing system. Each of the stations may be used to etch substrates using, for example, radio frequency (RF) plasma. Each station includes a processing chamber, such as an inductively coupled plasma (ICP) chamber or a conductively coupled plasma (CCP) chamber. The stations may perform, for example, a conductor etch process or a dielectric etch process, or other substrate processing.

[0034] 2 shows a top view of the tool 100. The tool 100 includes a FOUP 104, an EFEM and load lock 106, a station 109, and a power lockout and tagout panel 110. The tool has an overall footprint 220. The tool further includes a substrate transfer module 222 for transferring substrates to and from the station 109. The substrate transfer module 222 may include robots 224, 226 and a buffer 228 for temporary storage of substrates. The robots 224, 226 transfer substrates to and from the station 109 and the buffer 228. In some embodiments, the substrate transfer module 222 operates at vacuum or atmospheric pressure.

[0035] 3 shows a side view of tool 100. Tool 100 includes a FOUP 104, an EFEM and load lock 106, a station 109, and a power lockout and tagout system 110. The station includes a process module bias assembly having an RF generator and gas box (collectively referred to as 300), and a slide and pivot assembly 112. The RF generator may provide RF power to electrodes on the station's substrate support. The gas box provides gas to the station's processing chamber. A substrate transfer module 222 is also shown.

[0036] Substrates to be loaded and processed are stored within the FOUP 104. The substrates are transferred by robots 224, 226 from the FOUP 104 through the EFEM and load lock 106 to the station 109 through respective load ports 302. In some embodiments, an RF generator and gas box 300 is located above the station 109 to provide RF power and process gases to the process modules of the station 109.

[0037] 4A shows a substrate processing station 400 that includes a slide and pivot assembly 402. The slide and pivot assembly 402 allows a process module bias assembly 406 to slide and pivot relative to the remaining components of a processing chamber 404. The slide and pivot assembly 402 allows the process module bias assembly 406 to be withdrawn from the processing chamber 404 and pivoted to a predetermined angle relative to the front surface of the processing chamber 404. The process module bias assembly 406 includes a housing 408, a portion 410 of a process module that includes a process bias bowl 412. In addition to the process bias bowl 412, the process module bias assembly 406 may include an electrostatic chuck and / or other substrate support, as shown in FIG. 4B, and a top plate assembly.

[0038] An exemplary width W of the passageway between station 400 and the opposing station is shown to indicate that the process module bias assembly 406 can slide and pivot into the passageway. This provides an open space 414 to the right of the slide and pivot assembly 402 for technicians to access the process bias bowl 412 and the interior of the processing chamber 404 for maintenance and servicing purposes, including wet cleaning. The process bias bowl 412 and the interior of the processing chamber 404 are accessed from the right side of the process module bias assembly 406 without interference. For example, the open space 414 is free of slides, rails, and / or other components that would not interfere with technicians accessing the interior of the processing chamber. Although the process module bias assembly 406 is shown pivoting to the left, the slide and pivot assembly may be configured and mounted to the right side of the processing chamber such that the process module and bias assembly can be extended and pivoted to the right relative to the processing chamber.

[0039] 4B shows a substrate support 460 that includes a heating layer 470 that includes an electrostatic electrode 472 and / or an RF bias electrode 474. The heating layer 470 may be made of ceramic or other material and is bonded to a base plate 482 by a bonding layer. The base plate 482 is typically made of aluminum and includes coolant channels 480 and fluid passages 484 and 486 to supply coolant to and receive coolant from the base plate 482. The coolant helps to control the temperature of the substrate support and the substrate during processing.

[0040] Referring now to FIG. 5 , one of the stations is shown looking inward from the walkway. The station includes an upper portion 510 and a lower portion 514. The upper portion 510 includes a process module bias assembly and a substrate support having a slide and pivot assembly 112. The slide and pivot assembly 112 of the upper portion 510 allows the process module to slide outward toward the walkway and then pivot to allow access for cleaning, servicing, or other maintenance. In some embodiments, the slide and pivot assembly of the upper portion 510 pivots outward by more than 90 degrees to allow greater access to the processing chamber. The lower portion 514 remains in the same position and includes an enclosure 520 with a removable cover 524. Other components 518 of the processing module (e.g., other fluid and / or electrical components and / or enclosures) are located between the enclosure of the lower portion 514 and the lower edge of the upper portion 510. In some embodiments, the walls of the enclosure and / or conduits within or outside the enclosure can be insulated to prevent condensation.

[0041] As explained further below, the inner portion of the open / close connector (see FIG. 7 ), housed within the housing 520, slides outward with the slide and pivot assembly 112 into the passageway. Prior to sliding or pivoting, the outer portion of the open / close fluid connector is pulled outward and downward to allow the inner portion to move unobstructed. Using this configuration (where the second portion is located outward relative to the first portion) makes it easier to align and connect the second portion to the first portion (compared to when the second portion is located inside the first portion). Furthermore, the use of partial flexible lines avoids tolerance stackup that would occur with fluid delivery using only rigid lines.

[0042] 6, an enclosure 520 for a closing connector for cooling fluid delivered to a station is shown in further detail. The enclosure 520 includes a vertical housing section 610 and a horizontal housing section 612 that connects to the vertical housing section 610. The vertical housing section 610 and the horizontal housing section 612 of the enclosure 520 define an interior volume that houses the closing connector (see FIG. 7) and other components.

[0043] Cover 524 is connected to sidewalls 616, 618, 620, 622 and a top surface 624 of housing 520 by fasteners 614. In some embodiments, cover 524 includes a vertical surface 626 facing the passageway and a top surface 630 extending inward at an angle, such as 90°, relative to surface 626 facing the passageway. Top surface 630 includes an opening 634 to allow fluid conduit 638 and connector 640 to pass through. Flexible sealing material 641 is disposed between top surface 630 and the top surface of sidewall 616 to form a seal around fluid conduit 638. In some embodiments, flexible sealing material 641 includes a foam material having holes and / or slits extending from the holes to one end of flexible sealing material 641 to allow attachment of fluid conduit 638.

[0044] The horizontal housing section 612 includes a cover 650, side walls 652, and a bottom 654. An opening 656 in the side walls 652 and a flexible sealing material 658 (a foam with holes and slits, as described above) can be used to provide a flexible seal for a connector 660, which can include a fluid and / or electrical connector.

[0045] Referring now to FIG. 7, housing 520 is shown with cover 524 (see FIG. 6) removed. A closing connector 720 is located within housing 520 and includes a first portion 722 connected to a second portion 726 by one or more fasteners 724. In some embodiments, fastener 724 includes a threaded bolt. As shown and described below with reference to FIGS. 11-13, second portion 726 includes two (or more) alignment pins 728, 732. The alignment pins pass through corresponding holes 736, 738 in first portion 722 to facilitate mounting of first portion 722 onto second portion 726.

[0046] The first portion 722 is located adjacent to the passageway, and the second portion 726 is disposed inward relative to the first portion 722, toward the substrate transport module. The ends of conduits 730 and 744 are connected to the first portion 722. The ends of conduits 734 and 746 are connected to opposite ends of conduits 730 and 744. In some embodiments, conduits 730 and 744 are rigid lines, and conduits 734 and 746 are flexible lines. By way of example only, conduits 730 and 744 are joined to conduits 734 and 746, respectively, by miter joints, as shown. Alternatively, conduits 730 and 734 may be joined by tubing with a rounded bend. Additionally, if the height of the enclosure 520 permits, conduits 744 and 746 may also be joined by tubing with a rounded bend.

[0047] A conduit 760 is connected to second portion 726. In some embodiments, conduit 760 comprises a rigid line and / or a flexible line. Housing 520 includes a flange 750 extending inward from a side thereof. Flange 750 includes holes for receiving fasteners to attach cover 524 to housing 520. When cover 524 is attached, tabs 770 on the top edge of housing 520 can be used to interlock with protrusions on the top and inner end of cover 524.

[0048] 8-10, the openable connector 720 is shown in a connected position (see FIG. 8) and a disconnected position (see FIGS. 9 and 10). In these figures, alignment pins 728, 732 and holes 736, 738 have been omitted to allow for the depiction of other features of the openable connector 720. The first portion 722 includes openings fluidly connected to channels 810 and 812 on its side 822. Channels 810 and 812 are aligned with the ends of conduits 730 and 744 (see FIG. 7). Channels 810 and 812 extend into the first portion 722 and then bend 90 degrees toward the side 826 of the first portion 722, where they abut the second portion 726 (see channels 870 and 872, respectively). Channels 874 and 876 in the second portion 726 are in fluid communication with channels 870 and 872. A seal (e.g., O-ring 860 disposed in groove 862) may be disposed on the abutting surface between first portion 722 and second portion 726 around the fluid connection between channels 870 and 872 and channels 874 and 876. Channel 874 makes a 90° turn upward and exits the top surface of second portion 726. One end of channel 874 connects to conduit 760. Channel 876 extends horizontally through the back wall of second portion 726 and includes one end in fluid communication with conduit 830.

[0049] A hole 840 in the first portion 722 and a threaded hole 842 in the second portion 726 receive a threaded fastener to connect the first portion 722 and the second portion 726 together. When the slide and pivot assembly needs to be moved from the closed position to the maintenance position, the first portion 722 and the second portion 726 of the opening and closing connector are pulled apart and the first portion 722 is pulled forward and downward, as shown in Figure 9. As can be seen, the conduits 734 and 746 are flexible and able to bend.

[0050] In other words, fastener 724 (see FIG. 7) is removed and first portion 722 is pulled outward toward the passageway and downward as indicated by arrow 890. Second portion 726, located behind first portion 722, remains with the slide and pivot assembly and moves in the direction indicated by arrow 892.

[0051] 10, the enclosure 520 can be purged by a gas source 1010 connected to the enclosure 520 by a conduit and optional valve 1014. The enclosure 520 may be connected to an exhaust system 1022 by a conduit and optional valve 1020. In some embodiments, the gas source provides an inert gas such as molecular nitrogen (N). In other embodiments, clean dry air (CDA) is used. The use of a purged enclosure reduces condensation in the enclosure 520.

[0052] 11-13 show various views of the alignment pins 728, 732 of the opening / closing connector 720. FIG. 11 shows a cross-sectional view of the opening / closing connector 720. In this view, only the alignment pin 732 on the second portion 726 of the opening / closing connector 720 and the corresponding hole 738 on the first portion 722 of the opening / closing connector 720 are visible. In this view, the first and second portions 720, 726 of the opening / closing connector 720 are shown mated. Thus, the alignment pins 728, 732 on the second portion 726 are shown inserted into (i.e., mated with) the corresponding holes 736, 738 in the first portion 722. When the first portion 720 is installed onto the second portion 726, the alignment pins 728, 732 guide the installation and facilitate the insertion and installation of fasteners into the corresponding holes 840.

[0053] 12 shows a top view of the opening and closing connector 720. In this view, the alignment pins 728, 732 of the second portion 726 and the corresponding holes 736, 738 in the first portion 722 are visible. In this view, the first and second portions 720, 726 are again shown mated. Thus, the alignment pins 728, 732 of the second portion 726 are shown inserted into (i.e., mated with) the corresponding holes 736, 738 in the first portion 722.

[0054] 13 shows a top view of second portion 726, showing alignment pins 728, 732. Note that alignment pins 728, 732 and corresponding holes 736, 738 are shown with rounded shapes by way of example only. Alternatively, alignment pins 728, 732 and corresponding holes 736, 738 could be any other shape (e.g., square, hexagonal, etc.).

[0055] The foregoing description is merely exemplary in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the present disclosure may be embodied in a variety of forms. Accordingly, while the present disclosure includes specific examples, other modifications will become apparent upon study of the drawings, the specification, and the following claims, and the true scope of the present disclosure should not be so limited. It should be understood that one or more steps in a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each of the embodiments is described above as having particular features, any one or more of these features described with respect to any embodiment of the present disclosure can be implemented in any of the other embodiments and / or combined with features of any of the other embodiments, even if the combinations are not explicitly described. In other words, the described embodiments are not mutually exclusive, and rearranging the order of one or more embodiments with each other remains within the scope of the present disclosure.

[0056] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including "connected," "engaged," "coupled," "adjacent," "next to," "on," "above," "below," and "disposed." Unless expressly described as "direct," when the above disclosure describes a relationship between a first element and a second element, the relationship can be a direct relationship where no other intervening elements exist between the first and second elements, but can also be an indirect relationship where one or more intervening elements (either spatially or functionally) exist between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical non-exclusive OR (A OR B OR C), and not to mean "at least one of A, at least one of B, and at least one of C." The present invention can be realized, for example, in the following manner. Application example 1: 1. A substrate processing system, comprising: a hinge assembly configured to allow a substrate support and RF bias assembly of a processing chamber to slide relative to other components of the processing chamber from a docked position to an undocked position; a closing connector configured to provide fluid to at least one of the substrate support and the RF bias assembly, a first portion including a first fluid passage connected to the first conduit; a second portion including a second fluid passage connected to the second conduit; a fastener removably connecting the first portion to the second portion; the first fluid passage in the first portion is in fluid communication with the second fluid passage in the second portion; the first portion is configured to slide with the substrate support and the RF bias assembly relative to the second portion and other portions of the processing chamber; the first portion is located inward from the second portion in a sliding direction from the docking position to the undocked position; Substrate processing system. Application example 2: In the substrate processing system of Application Example 1, when the open / close connector is in the docking position, the first part is connected to the second part. Application example 3: A substrate processing system according to Application Example 1, wherein when the opening and closing connector is in the undocked position, the first part is disconnected from the second part. Application example 4: A substrate processing system according to Application Example 1, wherein the hinge assembly is configured to allow the substrate support and the RF bias assembly to slide from the docked position to the undocked position and then pivot to a predetermined angle greater than 90°. Application example 5: The substrate processing system of Application Example 1 further includes a housing, and the opening and closing connector is disposed inside the housing. Application example 6: The substrate processing system of Application Example 5, wherein the enclosure is connected to a gas supply source and is purged during operation. Application example 7: 10. The substrate processing system of claim 6, wherein the gas supply source is purged with molecular nitrogen. Application example 8: 10. The substrate processing system of claim 6, wherein the gas supply source is purged with clean, dry air. Application example 9: The substrate processing system of Application Example 1, the first portion includes a third fluid passage connected to a third conduit; the second portion includes a fourth fluid passage connected to a fourth conduit; The third fluid passage in the first portion is in fluid communication with the fourth fluid passage in the second portion. Application example 10: A tool, Equipment Front-End Module (EFEM), a substrate transfer module; a load lock disposed between the EFEM and the substrate transfer module; and 2N substrate processing systems according to Application Example 1, where N is an integer between 1 and 5; The tool, wherein half of the 2N substrate processing systems are disposed on one side of the substrate transfer module and the other half of the 2N substrate processing systems are disposed on the opposite side of the substrate transfer module. Application example 11: The substrate processing system of Application Example 1, the first portion of the opening and closing connector includes a plurality of holes; A substrate processing system, wherein the second portion of the opening / closing connector includes a plurality of alignment pins that respectively mate with the plurality of holes when the first portion is connected to the second portion.

Claims

1. 1. A substrate processing system, comprising: a hinge assembly configured to allow a substrate support and an RF bias assembly of the processing chamber to slide from a docked position to an undocked position; a closing connector configured to supply a fluid to at least one of the substrate support and the RF bias assembly, a first portion including a first fluid passage; a second portion including a second fluid passage; a fastener removably connecting the first portion to the second portion; the first portion is configured to slide with the substrate support and the RF bias assembly relative to the second portion. Substrate processing system.

2. 2. The substrate processing system according to claim 1, wherein the first portion is connected to the second portion when the openable connector is in the docking position.

3. 2. The substrate processing system of claim 1, wherein the first portion is disconnected from the second portion when the openable connector is in the undocked position.

4. 2. The substrate processing system of claim 1, wherein the hinge assembly is configured to allow the substrate support and the RF bias assembly to slide from the docked position to the undocked position and then pivot through a predetermined angle greater than 90°.

5. The substrate processing system according to claim 1 , further comprising a housing, wherein the opening / closing connector is disposed inside the housing.

6. 6. The substrate processing system of claim 5, wherein the enclosure is connected to a gas supply and is purged during operation.

7. 7. The substrate processing system of claim 6, wherein the gas supply is purged with molecular nitrogen.

8. 7. The substrate processing system of claim 6, wherein the gas supply is purged with clean, dry air.

9. 10. The substrate processing system of claim 1, the first portion includes a third fluid passage connected to a third conduit; the second portion includes a fourth fluid passage connected to a fourth conduit; The third fluid passage in the first portion is in fluid communication with the fourth fluid passage in the second portion.

10. 10. The substrate processing system of claim 1, The hinge assembly is configured to allow the substrate support and the RF bias assembly to slide relative to other components of the processing chamber from the docked position to the undocked position.

11. 10. The substrate processing system of claim 1, The substrate processing system, wherein the first portion, together with the substrate support and the RF bias assembly, is configured to slide relative to the second portion and other portions of the processing chamber.

12. 10. The substrate processing system of claim 1, The substrate processing system, wherein the first portion is located inward from the second portion in a direction of sliding from the docking position to the undocked position.

13. 10. The substrate processing system of claim 1, the first fluid passage is connected to a first conduit; the second fluid passage is connected to a second conduit; The first fluid passage is in fluid communication with the second fluid passage.

14. A tool, an equipment front-end module (EFEM); a substrate transfer module; a load lock disposed between the EFEM and the substrate transfer module; and 2N substrate processing systems according to claim 1, where N is an integer between 1 and 5; The tool, wherein half of the 2N substrate processing systems are disposed on one side of the substrate transfer module and the other half of the 2N substrate processing systems are disposed on an opposite side of the substrate transfer module.

15. 10. The substrate processing system of claim 1, the first portion of the opening and closing connector includes a plurality of holes; The second portion of the opening / closing connector includes a plurality of alignment pins that respectively mate with the plurality of holes when the first portion is connected to the second portion.

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