Powder supply management device for laser forming equipment

Abstract

The technology disclosed in this specification relates to a powder supply management device for a laser forming apparatus that manages powder supply so that a constant amount of powder required for laser forming is supplied, and the powder supply management device for a laser forming apparatus disclosed in this specification comprises a hopper that discharges powder, a main sampling unit that guides a portion of the powder discharged from the hopper to the laser forming apparatus and guides the remaining powder to be discharged elsewhere, and a discharge monitoring unit that calculates the amount of the remaining powder separated from the main sampling unit.

Description

[Technical Field]

[0001] The present specification relates to a powder supply management device for a laser forming apparatus, and more particularly to a powder supply management device for a laser forming apparatus that manages powder supply so that a constant amount of powder required for laser forming is supplied. [Background technology]

[0002] The technology disclosed herein relates to a powder supply management device for a laser forming apparatus, and a representative example is laser-aided direct metal manufacturing (LDMM). DMM utilizes laser cladding technology, which precisely welds functional materials (such as metals, alloys, or ceramics) directly with a laser according to 3D digital shape information stored in a computer. This technology enables the rapid production of 3D products or tools required for product production. 3D shape information refers to 3D CAD data, medical CT (Computer Tomography) and MRI (Magnetic Resonance Imaging) data, digital data measured by a 3D scanner (3D Object Digitizing System), etc. Tools refer to mass-production molds, such as dies and molds, required for product production. This technology can produce metal prototypes, mass-production molds, complex-shaped final products, and various tools in a timeframe unmatched by existing processing methods such as cutting and casting using CNC (Computerized Numerical Control) and other processing machines. It can also be applied to mold restoration, remodeling, and repair using reverse engineering. The basic concept of realizing a physical shape from CAD data is similar to that of a general printer. Just as a printer uses a document data file stored on a computer to create a document by applying ink to a precise location on a 2D paper plane, direct metal fabrication technology uses 3D CAD data to create a 3D physical shape by forming the required amount of functional material at a precise location in 3D space. This technology was developed for 3D printers and has recently been commercialized in various directions depending on the characteristics of the material, such as plastic, ceramic, paper, and metal.In laser direct metal fabrication, two-dimensional planes are physically realized using laser cladding technology.

[0003] Previous Korean Patent Publication No. 10-2017-0097420 (published on August 28, 2017, entitled "Amorphous Metal Manufacturing Apparatus Using a 3D Metal Printer and Amorphous Metal Manufactured Thereby") includes a laser irradiation unit that irradiates a test piece with a laser beam to generate a molten pool; a powder supply unit that supplies metal powder to the generated molten pool; a control unit that controls movement of the laser irradiation unit in accordance with the thickness of a molten metal liquid containing the molten metal powder and 3D CAD data; and a cooling unit that quenches the molten metal liquid with amorphous metal. The amorphous metal manufacturing apparatus using a 3D metal printer may further include an imaging unit that captures an image of the molten metal liquid and an image analysis unit that analyzes the captured image to measure the thickness of the molten metal liquid. The control unit may calculate a tool path from the 3D CAD data, and move the laser irradiation unit along the calculated tool path when the thickness of the molten metal liquid reaches a predetermined thickness. The cooling unit can use an inert gas to quench the metal melt melted along the tool path to the predetermined thickness with the amorphous metal. The metal powder can include one or more of Ni, Ce, La, Gd, Mg, Y, Sm, Zr, Fe, Ti, Co, Al, Cu, Mo, Sn, Nb, and Si. The amorphous metal manufacturing apparatus using the 3D metal printer can further include a laser oscillator for oscillating the laser beam and a laser focusing unit for focusing the oscillated laser beam. The laser irradiation unit can irradiate the focused laser beam onto the test piece. The control unit can control the movement of the laser irradiation unit to maintain the focal length of the laser beam during the laser irradiation process. The control unit can control the spray speed of the metal powder supplied from the powder supply unit in accordance with the movement speed of the laser irradiation unit. The present invention discloses a technology for manufacturing amorphous metal using the amorphous metal manufacturing apparatus using the 3D metal printer.

[0004] The powder in the prior art must be controlled together with the laser irradiation unit. A representative example is the prior art Korean Patent Publication No. 10-2016-0124710 (published on October 28, 2016, entitled "Vibration Feeder Trough Device"), which describes a trough device for a vibrating feeder, including large and small supply vibrating feeders and a first trough whose lower surface is fixed to the upper surface of the large and small supply vibrating feeders. The trough device moves the raw material fed by the large supply vibrating feeder forward and feeds the raw material into a measuring unit. a first left side wall having a lower end connected to the left end of the first bottom portion and erected; a first right side wall having a lower end connected to the right end of the first bottom portion and erected; and a first rear wall having a lower end connected to the rear end of the first bottom portion and erected, and the supply section has an internal space surrounded by the first bottom portion, the first left side wall, the first right side wall, and the first rear wall, and has open front and top faces; and large supply and small supply troughs connected to the front end of the first bottom portion and extending forward, and the large supply and small supply troughs have rear ends that are connected to the supply troughs. a large supply trough and a small supply trough, each of which is composed of a width-reducing section that is connected to the front end of the supply section and whose left and right edges gradually approach the left-right center as it moves forward, and a small supply transport section whose rear end is connected to the front end of the width-reducing section and extends forward but whose left and right width is maintained constant; and a large supply emergency trough located below the large supply and small supply trough, which has a second bottom whose lower surface is fixed to the upper surface of the large supply vibratory feeder, a second left side wall whose lower end is connected to the left end of the second bottom and stands upright, and a lower end which is connected to the right end of the second bottom. The technology disclosed includes a second right side wall that stands upright when connected to the rear end of the second bottom, an internal space surrounded by the second bottom, the second left side wall, the second right side wall, and the second rear wall, the front and top faces of which are open, and a large supply trough that is supplied with raw material flowing down from the left and right edges of the width contracting section and discharges the raw material to the metering section through the front edge of the second bottom, and the front end of the small supply transfer section is positioned ahead of the front end of the second bottom.

[0005] Furthermore, as in the previous Korean Patent Publication No. 10-2016-0124710 (published on October 28, 2016, "Trough Device for Vibrating Feeder"), a vibrating feeder used in molding devices such as 3D printers uses vibration to move the object to be fed (powder, etc.) fed via an object feeding device to the outside so that the object to be fed is spread evenly, and the amount discharged to the outside is constant depending on the moving speed of the moving object. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent No. 10-2017-0097420 [Patent Document 2] Korean Patent Publication No. 10-2016-0124710 Summary of the Invention [Problem to be solved by the invention]

[0007] Conventional laser forming devices have a problem in that a fixed amount of powder cannot be uniformly supplied to the laser forming device due to various reasons during the process of supplying the powder from the feeder storing the powder to the laser forming device, resulting in defective molded products.As a result, whether or not the molded product is defective is determined in a separate process.

[0008] As a result, the technology disclosed in this specification aims to solve the problem of providing a powder supply management device for a laser molding device that can manage the flow of powder supplied from a hopper to a laser molding device and determine in advance whether or not the molded product is defective. [Means for solving the problem]

[0009] In one embodiment, a powder feed management system for a laser forming device is disclosed.

[0010] The powder supply management device for a laser forming apparatus disclosed in this specification comprises a hopper 100 that discharges powder, a main sampling unit 200 that guides a portion of the powder discharged from the hopper 100 to the laser forming apparatus 1 and guides the remaining powder to be discharged elsewhere, and a discharge monitoring unit 300 that calculates the amount of remaining powder separated from the main sampling unit 200.

[0011] The powder supply management device for a laser forming apparatus disclosed in this specification can optionally further include a sub-sampling section 400 that directs a portion of the powder discharged from the main sampling section 200 to the monitoring section 300 to be discharged to the monitoring section 300, but directs the remaining powder to the laser forming apparatus 1.

[0012] The powder supply management device for a laser forming apparatus disclosed in this specification may optionally further include a storage monitoring unit 500 that takes pictures of the powder storage state inside the hopper 100.

[0013] The main sampling unit 200 of the powder supply management device for a laser forming apparatus disclosed in this specification may include a main slitter unit 210 connected to the hopper 100 and dividing the powder discharged from the hopper 100, a first main guide pipe 220 connected to one side of the main slitter unit 210 and guiding the divided powder to the laser forming apparatus 1, and a second main guide pipe 230 connected to the other side of the main slitter unit 210 and guiding the remaining divided powder to the discharge monitoring unit 300.

[0014] The main slitter section 210 of the powder supply management device for a laser molding device disclosed in this specification comprises a pair of slitters 211 that are separated from each other to form a first passage space 10, and another slitter 211 is located on the side of the slitter 211 to form a second passage space 20, but one of the first passage space 10 and the second passage space 20 is connected to each other and the other is separated in a different direction, and may comprise a slitter guide 212 that covers the side of the slitter 211 and allows powder to be moved to the first passage space 10 and the second passage space 20.

[0015] The first passage space 10 and the second passage space 20 in which a pair of slitters 211 of the powder supply management device for a laser molding device disclosed in this specification are arranged separately from each other can have a vertical space 2 in the vertical direction and a horizontal space 3 connected to the vertical space 2 but tilted horizontally.

[0016] The sub-sampling unit 400 of the powder supply management device for a laser forming apparatus disclosed in this specification may include a sub-slitter unit 410 connected to the main sampling unit 200 and dividing the powder guided to the discharge monitoring unit 300, a first sub-guide pipe 420 connected to one side of the sub-slitter unit 410 and guiding the divided powder to the laser forming apparatus 1, and a second sub-guide pipe 430 connected to the other side of the sub-slitter unit 410 and guiding the remaining divided powder to the discharge monitoring unit 300. [Effects of the Invention]

[0017] The powder supply management device for a laser forming apparatus disclosed in this specification samples a portion of the powder supplied from the hopper 100 to the forming apparatus 1 via the main slitter section 200, and can determine whether or not the amount is fixed via the discharge monitoring section 300.The powder supply management device for a laser forming apparatus has the effect of allowing an operator to manage the flow of powder supplied from the hopper 100 to the laser forming apparatus 1 and determine whether or not the molded product is defective.

[0018] The foregoing provides only selected concepts in a simplified form of what is described in more detail below, and is not intended to limit key or essential features of the claims or to limit the scope of the claims. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a diagram illustrating an embodiment of the technology disclosed in this specification. [Figure 2] FIG. 2 is a diagram illustrating an example of a main sampling unit disclosed in the present specification. [Figure 3] FIG. 3 is an exploded view of an example of the main slitter unit disclosed in FIG. 2. [Figure 4] FIG. 3 is an exploded view of another example of the main slitter unit disclosed in FIG. 2. [Figure 5] 3 is an exploded view of still another example of the main slitter unit disclosed in FIG. 2. FIG. [Figure 6] FIG. 10 is a diagram illustrating another embodiment of the technology disclosed in this specification. [Figure 7] 10A and 10B are diagrams illustrating another example of the slitter unit disclosed in the present specification. [Figure 8] FIG. 10 illustrates another embodiment disclosed in this specification. DETAILED DESCRIPTION OF THE INVENTION

[0020] The embodiments disclosed herein will now be described in detail with reference to the drawings. Unless otherwise specified herein, like reference numerals in the drawings represent like elements. The exemplary embodiments detailed in the detailed description, drawings, and claims are not intended to be limiting, and other embodiments may be utilized, and other modifications may be made without departing from the spirit or scope of the technology disclosed herein. Those of ordinary skill in the art will readily appreciate that the elements of the present disclosure, i.e., the elements generally described herein and illustrated in the drawings, may be arranged, configured, combined, and designed in a variety of other configurations, all of which are expressly contemplated and form a part of this disclosure. In the drawings, the width, length, thickness, or shape of elements may be exaggerated to clearly depict various layers (or films), regions, and shapes.

[0021] When one component is referred to as being "provided" on another component, this can include the case where the component is directly provided on the other component, as well as the case where an additional component is interposed between them.

[0022] When one component is referred to as being "provided" to another component, this can include the case where the one component is provided directly to the other component, as well as the case where additional components are interposed between them.

[0023] The description of the disclosed technology is merely an embodiment for structural or functional description, and therefore the scope of the rights of the disclosed technology should not be construed as being limited by the embodiments described herein. In other words, since the embodiments can be modified in various ways and can have various forms, the scope of the rights of the disclosed technology should be understood to include equivalents that can realize the technical idea.

[0024] Singular expressions shall be understood to include plural expressions unless the context clearly dictates otherwise, and terms such as "comprise" or "have" shall be understood to specify the presence of embodied features, numerals, steps, operations, components, parts, or combinations thereof, and shall not be understood to preclude the presence or additional possibility of one or more other features, numerals, steps, operations, components, parts, or combinations thereof.

[0025] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which the disclosed technology belongs. Terms defined in commonly used dictionaries should be interpreted to be consistent with the meaning they have in the context of the relevant technology, and cannot be interpreted as having an ideal or overly formal meaning unless expressly defined in this application.

[0026] FIG. 1 attached to this specification is a diagram showing one embodiment of the technology disclosed in this specification. FIG. 2 is a diagram showing an example of a main sampling unit disclosed in this specification. FIG. 3 is an exploded view of an example of the main slitter unit disclosed in FIG. 2. FIG. 4 is an exploded view of another example of the main slitter unit disclosed in FIG. 2. FIG. 5 is an exploded view of yet another example of the main slitter unit disclosed in FIG. 2. FIG. 6 is a diagram showing another embodiment of the technology disclosed in this specification. FIG. 7 is a diagram showing another example of the slitter unit disclosed in this specification.

[0027] The powder supply management device for a laser forming apparatus shown in the attached drawings is roughly composed of a hopper 100 for discharging powder, a main sampling unit 200 for guiding a portion of the powder discharged from the hopper 100 to the laser forming apparatus 1 and discharging the remaining powder to another location, and a discharge monitoring unit 300 for calculating the amount of remaining powder separated from the main sampling unit 200.

[0028] The powder supply management device for a laser forming apparatus disclosed in this specification can optionally further include a sub-sampling section 400 that directs a portion of the powder discharged from the main sampling section 200 to the monitoring section 300 to be discharged to the monitoring section 300, but directs the remaining powder to the laser forming apparatus 1.

[0029] The powder supply management device for a laser forming apparatus disclosed in this specification may optionally further include a storage monitoring unit 500 that takes pictures of the powder storage state inside the hopper 100.

[0030] The main sampling unit 200 of the powder supply management device for a laser forming apparatus disclosed in this specification may include a main slitter unit 210 connected to the hopper 100 and dividing the powder discharged from the hopper 100, a first main guide pipe 220 connected to one side of the main slitter unit 210 and guiding the divided powder to the laser forming apparatus 1, and a second main guide pipe 230 connected to the other side of the main slitter unit 210 and guiding the remaining divided powder to the discharge monitoring unit 300.

[0031] The main slitter section 210 of the powder supply management device for a laser molding device disclosed in this specification comprises a pair of slitters 211 that are separated from each other to form a first passage space 10, and another slitter 211 is located on the side of the slitter 211 to form a second passage space 20, but one of the first passage space 10 and the second passage space 20 is connected to each other, and the other is separated in a different direction, and may comprise a slitter guide 212 that covers the side of the slitter 211 and allows powder to be moved to the first passage space 10 and the second passage space 20.

[0032] The first passage space 10 and the second passage space 20 in which a pair of slitters 211 of the powder supply management device for a laser molding device disclosed in this specification are arranged separately from each other can have a vertical space 2 in the vertical direction and a horizontal space 3 connected to the vertical space 2 but tilted horizontally.

[0033] The sub-sampling unit 400 of the powder supply management device for a laser forming apparatus disclosed in this specification may include a sub-slitter unit 410 connected to the main sampling unit 200 and dividing the powder guided to the discharge monitoring unit 300, a first sub-guide tube connected to one side of the sub-slitter unit 410 and guiding the divided powder to the laser forming apparatus 1, and a second sub-guide tube 430 connected to the other side of the sub-slitter unit 410 and guiding the remaining divided powder to the discharge monitoring unit 300.

[0034] The present invention will now be described in more detail with reference to the accompanying drawings.

[0035] The powder supply management device for a laser forming apparatus according to the embodiment disclosed in FIG. 1 is roughly comprised of a hopper 100, a main sampling unit 200, and a discharge monitoring unit 300.

[0036] The hopper 100 discharges the powder. The hopper 100 may be a normal hopper or a normal feeder. The hopper 100 discharges a certain amount of powder required by the molding apparatus 1.

[0037] 2, the main sampling unit 200 guides a portion of the powder discharged from the hopper 100 to the laser forming apparatus 1 and guides the remaining powder to another location. The main sampling unit 200 can be broadly divided into a main slitter unit 210, a first main guide pipe 220, and a second main guide pipe 230.

[0038] The main slitter unit 210 is connected to the hopper 100 and divides the powder discharged from the hopper 100. More specifically, the main slitter unit 210 may be roughly divided into a slitter 211 and a slitter guide 212.

[0039] The slitter 211 may be provided with a pair of two plates as shown in Figures 3 to 5. The slitter 211 may have a first passage space 10 formed by separating the two plates from each other.

[0040] A plurality of slitters 211 may be provided. A second passage space 20 may be provided by placing another slitter 211 on the side of the slitter 211 having the first passage space 10. In this case, one of the first passage space 10 and the second passage space 20 may be connected to each other, while the other may be separated in a different direction.

[0041] For example, as shown in FIG. 3, the slitter 211 may be a rectangular plate with a notch extending vertically from the top center to the bottom edge. The slitter 211 may have two notched plates separated from each other to form a first passage space 10 having a vertical space 2 and a horizontal space 3 connected to the vertical space 2 but tilted horizontally. Another slitter 211 may be positioned on the side of the slitter 211 with the first passage space 10, but connected with the other slitter 211 with the notch in a different direction. The additional slitter 211 forms a second passage space 20. When multiple slitters 211 are connected to each other, the upper portions of the first passage space 10 and the second passage space 20 are connected to each other, and the lower portions of the first passage space 10 and the second passage space 20 at the edge portions face in different directions.

[0042] Meanwhile, the slitter 211 may be provided in various shapes such as a triangle or a pentagon.

[0043] As another example, the slitter 211 may be a rectangular plate with a notch cut from the top center to the bottom edge, as shown in FIG. The slitter 211 may be formed by separating two notched plates to form a tilted, square-shaped first passage space 10. Another slitter 211 may be positioned on the side of the slitter 211 with the first passage space 10, but connected so that the notches are oriented in different directions. The additional slitter 211 forms a second passage space 20. When multiple slitters 211 are connected to each other, the upper portions of the first passage space 10 and the second passage space 20 are connected to each other, and the lower portions of the first passage space 10 and the second passage space 20 at the edge portions face in different directions.

[0044] As another example, the slitter 211 may be a rectangular plate, as shown in FIG. 5, but may be cut vertically from the top center to the bottom, then further cut out vertically to the bottom. The slitter 211 may separate two cut-out plates, forming a first passage space 10 including a vertical space 2 located in the top center, a horizontal space 3 connected to the vertical space 2 and tilted horizontally, and another vertical space 2 connected to the horizontal space 3 and extending vertically downward. Another slitter 211 may be positioned on the side of the slitter 211 with the first passage space 10, but connected with the cut-outs in different directions. In this case, a second passage space 20 is formed by the additional slitter 211. When multiple slitters 211 are connected to each other, the upper portions of the first passage space 10 and the second passage space 20 are connected to each other, and the lower portions of the first passage space 10 and the second passage space 20 at the edge portions face in different directions.

[0045] In the slitter 211 described above, the upper sides of the first passage space 10 and the second passage space 20 are connected to each other. Powder discharged from the hopper 100 flows into the upper sides of the first passage space 10 and the second passage space 20, allowing it to freely flow into the first passage space 10 and the second passage space 20. That is, the powder flowing into the upper part of the slitter 211 is separated from each other by the first passage space 10 and the second passage space 20 and guided in different directions to be separated. A plurality of slitters 211 may be provided, and the ratio of the first passage spaces 10 to the second passage spaces 20 can be easily adjusted. For example, a total of 10 slitters 211 may be connected, with eight first passage spaces 10 and two second passage spaces 20. Here, eight slitters 211 each having the first passage space 10 may be connected in series, and two slitters 211 each having the second passage space 20 may be connected in series on the side of the eight slitters 211 each having the first passage space 10.

[0046] The slitter guide 212 may be provided to cover the side of the slitter 211 and allow the powder to move to the first passage space 10 and the second passage space 20. More specifically, the slitter guide 212 may be provided as a plate. After the plurality of slitters 211 are coupled to each other, the slitter guide 212 may be coupled to the side of the slitter 211 located at both ends. The slitter guide 212 prevents the powder from being released to the side of the first passage space 10 and the second passage space 20 of the slitter 211.

[0047] The main slitter unit 210 described above receives powder flowing from the hopper 100 at its upper portion and guides the powder to be separated and discharged into the first passage space 10 and the second passage space 20. The separation rate of the powder in the main slitter unit 210 is determined by the number of slitters 211 and the ratio of the first passage space 10 to the second passage space 20. For example, a main slitter unit 210 that combines eight slitters 2118 each having a first passage space 10 and two slitters 211 each having a second passage space 20 moves 80% of the powder to the first passage space 10 and discharges 20% of the powder to the second passage space 10.

[0048] The first main guide pipe 220 is connected to one side of the main slitter unit 210 and guides the separated powder to the laser forming apparatus 1. The first guide pipe 220 may be a conventional pipe. One side of the first guide pipe 220 is connected to one side of the lower portion of the main slitter unit 210 where the first passage space 10 of the slitter 211 is located. The other side of the first guide pipe 220 is connected to the forming apparatus 1. For example, the first guide pipe 220 is connected to the first passage space 10 from the main slitter unit 210, which combines eight slitters 21 each having a first passage space 10 and two slitters 2112 each having a second passage space 20. In other words, 80% of the powder discharged from the hopper 100 is transferred to the forming apparatus 1 via the first guide pipe 220.

[0049] The second guide pipe 230 is connected to the other end of the main slitter unit 210 and guides the remaining separated powder to the discharge monitoring unit 300. The second guide pipe 230 may be a conventional pipe. One end of the second guide pipe 230 is connected to one end of the lower portion of the slitter unit 210 where the second passage space 20 of the slitter 211 is located. The other end of the second guide pipe 230 is connected to the discharge monitoring unit 300. For example, the second guide pipe 230 is connected from the main slitter unit 210, which combines eight slitters 211 each having a first passage space 10 and two slitters 211 each having a second passage space 20, to the second passage space 20. In other words, 20% of the powder discharged from the hopper 100 is transferred to the discharge monitoring unit 300 via the second guide pipe 230.

[0050] The main sampling unit 200 supplies a portion of the powder flowing in from the hopper 100 to the molding apparatus 1, and supplies the remaining powder to the discharge monitoring unit 300. In other words, it is possible to sample a portion of the powder supplied to the molding apparatus 1.

[0051] The discharge monitoring unit 300 calculates the amount of powder remaining after separation from the main sampling unit 200. The discharge monitoring unit 300 may include a conventional electrical capacitance tomography (ECT) sensor and an image analysis unit. The discharge monitoring unit 300 may be installed in the second guide pipe 230. The second guide pipe 230 may be sensed in real time, and the sensed image may be analyzed by the image analysis unit to calculate the amount of powder movement. For example, if the second guide pipe 230 is connected to the second passage space 20 from the main slitter unit 210, which combines eight slitters 211 each having a first passage space 10 and two slitters 211 each having a second passage space 20, the discharge monitoring unit 300 may monitor whether the amount of powder movement exceeds or is insufficient by 20% based on the powder discharge amount set in the hopper 100.

[0052] Meanwhile, the discharge monitoring unit 300 may be implemented as a general weighing scale or a general flow meter.

[0053] The powder supply management device for a laser forming apparatus described with reference to the embodiment above samples a portion of the powder supplied from the hopper 100 to the forming apparatus 1 via the main slitter section 200, and can determine whether the amount is constant or not via the discharge monitoring section 300.The powder supply management device for a laser forming apparatus has the advantage that an operator can manage the flow of powder supplied from the hopper 100 to the laser forming apparatus 1 and determine whether the molded product is defective or not.

[0054] The powder supply management device for a laser forming apparatus according to another embodiment shown in Fig. 6 or 7 may optionally further include a sub-sampling unit 400 that guides a portion of the powder discharged from the main sampling unit 200 to the monitoring unit 300 to be discharged back to the monitoring unit 300, while guiding the remaining powder to the laser forming apparatus 1. The sub-sampling unit 400 may be broadly divided into a sub-slitter unit 410, a first sub-guide tube, and a second sub-guide tube 430. The sub-sampling unit 400 may be provided with a configuration similar to that of the main sampling unit 200 described above.

[0055] The sub-sampling unit 400 shown in FIG. 7 can be configured in the same manner as the main sampling unit 200 described above.

[0056] The sub-slitter unit 410 is connected to the main sampling unit 200 and divides the powder introduced into the discharge monitoring unit 300. The sub-slitter unit 410 can be provided in combination with the main slitter unit 210 and the same slitter 211 as described above.

[0057] The first sub-guide pipe may be provided in the same manner as the above-described first main guide pipe 220. The first sub-guide pipe is connected to one side of the sub-slitter unit 410 to guide the separated powder to the laser forming apparatus 1. For example, if the sub-slitter unit 410 is a combination of eight slitters 211 each having a first passage space 10 and two slitters 211 each having a second passage space 20, the first sub-guide pipe is connected to one side of the lower portion of the sub-slitter unit 410 where the first passage space 10 is located.

[0058] The second sub-guide pipe 430 may be provided in the same manner as the above-described second main guide pipe 230. The second sub-guide pipe 430 is connected to the other side of the sub-slitter unit 410 to guide the remaining separated powder to the discharge monitoring unit 300. For example, if the sub-slitter unit 410 is a combination of eight slitters 211 each having a first passage space 10 and two slitters 211 each having a second passage space 20, the second sub-guide pipe 430 is connected to one side of the lower portion of the sub-slitter unit 410 where the second passage space 20 is located.

[0059] The sub-sampling unit 400 re-separates the powder sampled in the main sampling unit 200, thereby further reducing the amount of powder required for calculation in the discharge monitoring unit 300.

[0060] The powder supply management device for a laser forming apparatus according to another embodiment of the present invention shown in FIG. 6 may further include a storage monitoring unit 500 that captures an image of the powder storage status inside the hopper 100. The storage monitoring unit 500 may include a conventional ECT (Electrical Capacitance Tomography) sensor and an image analysis unit. The storage monitoring unit 500 captures an image of the piled shape of the powder stored in the hopper 100. It determines whether the powder inside the hopper 100 has been stored in a biased state. If the discharge monitoring unit 300 determines that the powder is not at the fixed amount, the storage monitoring unit 500 allows the operator to check the powder status stored in the hopper 100, thereby effectively reducing the causes of defects.

[0061] Meanwhile, referring to another embodiment shown in FIG. 8, the main slitter unit 210 may be further coupled with another main slitter unit 210 having a different ratio of the first passage space 10 and the second passage space 20. In this case, a transfer unit 600 for moving the main slitter unit 210 may be further provided. The transfer unit 600 moves the main slitter unit 210 to select the main slitter unit 210 to be connected to the hopper 100. In this case, if all of the slitters 211 of the further coupled main slitter units 210 have the first passage space 10, various combinations may be achieved, such as no sampling being performed or the amount of powder required for sampling being adjustable.

[0062] The transfer unit 600 may be implemented as a conventional air tube. The transfer unit 600 is coupled to the slitter 211 or the slitter guide 212. The transfer unit 600 expands and contracts depending on whether a fluid or gas is introduced. The expansion and contraction of the transfer unit 600 selectively connects the main slitter unit 210 or a further connected main slitter unit 210 to the hopper 100. The first main guide pipe 220 and the second main guide pipe 230 may also be selectively connected. The sub-slitter unit 410 may also be configured as described above to easily adjust the sampling rate. The transfer unit 600 implemented as an air tube effectively prevents malfunction when fine particles such as powder enter the transfer unit 600. This prevents problems associated with devices that move back and forth using gears or pistons, such as increased wear and the likelihood of malfunction due to powder.

[0063] Meanwhile, the conveying unit 600 may be installed in contact with the slitter 211 or the slitter guide 212 at both ends of the main slitter unit 210. In this case, the conveying unit 600 may operate in a manner such that one side expands and the other side contracts.

[0064] The transfer section 600 can be similarly provided in the sub-slitter section 410 described above.

[0065] Meanwhile, the main slitter unit 210 may include a rail that passes through the slitter 211. A slitter guide 212 may be fixed to the end of the rail. A pressure unit that pressurizes the slitter 211 may be provided on the other side of the rail. That is, in the main slitter unit 210, when an operator clamps a required slitter 211 between the rails as needed and then operates the pressure unit, the slitter 211 is pressed by the pressure unit while moving toward the slitter guide 212, and is firmly fixed. In this case, the pressure unit may be configured as the transfer unit 600.

[0066] Furthermore, the slitter unit 210 including the pressure unit and the rail may further include a conventional vibration element. The vibration element may be installed on the rail. The vibration element is activated when the pressure unit is deactivated. The slitter unit 210 including the vibration element applies vibration to the slitter 211 when the pressure is deactivated, thereby creating a gap between the slitter 211. In other words, the gap created by the vibration element has the effect of completely removing powder and other particles trapped between the slitter 211.

[0067] On the other hand, the vibration element can also be operated when the slitter section 210 is pressurized.

[0068] Meanwhile, the slitter unit 210 may further include a plate member with no passage space between the slitter 211 and another slitter 211, thereby providing a main slitter unit 210 or a sub-slitter unit 410.

[0069] It will be understood that the various embodiments of the present disclosure have been described above for illustrative purposes, and that various modifications are possible without departing from the scope and spirit of the present disclosure. The various disclosed embodiments are not intended to limit the spirit of the present disclosure, and the true spirit and scope will be presented in the following claims.

Claims

1. A hopper for discharging powder; A part of the powder discharged from the hopper is guided to the laser forming device, and the remaining powder is A main sampling section that leads to discharge to another location; A discharge monitor that calculates the amount of remaining powder separated from the main sampling section a ring section; The main sampling unit A main sleeve connected to the hopper divides the powder discharged from the hopper. The utter section and The divided powder is fed to the laser. a first main guide pipe leading to a molding device; The remaining powder is fed to the other main slitter unit. a second main guide pipe leading to the discharge monitoring unit; The main slitter section The plate is provided as a pair of plates, and the plates are separated from each other and have a slitter that defines a first passage space; Another slitter is positioned on the side of the slitter to provide a second passage space, but one of the first passage space and the second passage space is shared by the other. and the other is provided so that the passage spaces are separated in different directions, A plurality of the slitters and a plurality of the other slitters are provided, The powder covers the side surface of the slitter and enters the first passage space and the second passage space. A slitter guide is provided so as to be movable between the slitter guides. Powder supply management device for laser molding equipment.

2. A part of the powder discharged from the main sampling unit to the discharge monitoring unit is The remaining powder is led to the laser forming device, while the remaining powder is led to the discharge monitoring unit.

2. The powder supply pipe for a laser molding apparatus according to claim 1, further comprising a sub-sampling unit. equipment.

3. 2. The apparatus according to claim 1, further comprising a storage monitoring unit for taking pictures of the powder storage state inside the hopper.

2. A powder supply management device for a laser forming apparatus according to claim 1.

4. The first passage space and the second passage space in which a pair of slitters are provided separately from each other teeth, Vertical space and A horizontal space connected to the vertical space but tilted horizontally; The powder supply management device for a laser forming apparatus according to claim 1 , comprising:

5. A hopper for discharging powder; A part of the powder discharged from the hopper is guided to the laser forming device, and the remaining powder is A main sampling section that leads to discharge to another location; A discharge monitor that calculates the amount of remaining powder separated from the main sampling section a programming department; A part of the powder discharged from the main sampling unit to the discharge monitoring unit is The remaining powder is led to the laser forming device, while the remaining powder is led to the discharge monitoring unit. A subsampling unit, A powder supply management device for a laser forming apparatus, comprising:

6. The subsampling unit The powder sample is connected to the main sampling unit and guided to the discharge monitoring unit. a sub-slitter section for dividing the The divided powder is formed by a laser beam. a first sub-guide tube leading to the device; The other of the sub-slitter units is connected to the discharge port. a second sub-guide tube leading to the monitoring unit; The powder supply management device for a laser forming apparatus according to claim 5, comprising:

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