Semiconductor device transfer unit and chamber including the semiconductor device transfer unit for performing a process on a semiconductor device

Abstract

To provide a transport unit for a semiconductor device that can ensure good transport performance in various temperature conditions.SOLUTION: A semiconductor device transport unit according to an example of the present invention includes: a transport shaft that is arranged in an internal space formed by a chamber, and is extended along a transportation direction of a semiconductor device; a moving holder that is mounted on the transport shaft to have a permitted interval, and transports a carrier on which the semiconductor device is mounted along the transportation direction; and a temperature regulator that regulates the temperature of at least one of the moving holder and the transport shaft, so as to prevent the moving holder from being fastened onto the transport shaft in a temperature atmosphere.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device-transfer unit and a chamber for performing a process on a semiconductor device that includes the semiconductor device-transfer unit. [Background technology]

[0002] A device performance tester is a device used to test various devices after they are manufactured. This device performance tester artificially creates various environments for connected devices to test whether the devices are functioning properly. For example, semiconductor devices can include various semiconductor elements such as DRAM, SRAM, SO-DIMM, U-DIMM, LPCAM, SSD, and HBM, semiconductor modules and electronic components, die cut from wafers (DIE), IC chips including die with integrated circuits, and stacks using die (DIE). High-bandwidth memory (HBM) is a high-performance memory formed by vertically stacking DRAM dies, with each die layer communicating signals via through-electrodes such as TSVs (Through Silicon Vias) and microbump structures.

[0003] Due to its structural characteristics, HBM has hundreds to thousands of micro-pins and is extremely small in size, so it requires special care when loading and transporting. For example, since HBM has many micro-pins compared to its small size, it requires highly difficult fine pitch alignment during testing and is vulnerable to damage due to contact.

[0004] The devices that have undergone testing can be classified by a handler into pass, retest, fail, etc., depending on the test results. Here, the handler is a device that loads a number of packaged devices onto a device performance tester and / or separates the devices that have completed testing from the device performance tester, and then classifies them according to the results.

[0005] The tester can continuously perform testing by exchanging trays loaded with devices to be tested and trays loaded with devices that have been tested through a handler.

[0006] On the other hand, one type of device performance test is a temperature load test, which is a test to check whether a device satisfies required performance conditions under specific temperature conditions (high or low temperature).

[0007] The temperature load test was carried out with the internal space of the test chamber where the test process was carried out set to a specific temperature condition. The test chamber was set to maintain the temperature condition until all the target number of devices were tested.

[0008] The system for performing the temperature load test may also include a soak chamber and / or a desoak chamber. The soak chamber is a chamber in which a semiconductor device exposed to room temperature conditions is aged by being exposed to the temperature atmosphere of the temperature load test. On the other hand, the desoak chamber is a chamber in which a semiconductor device that has been tested is aged to be returned to the external environment.

[0009] Meanwhile, various components disposed inside a chamber where the temperature atmosphere changes as tests are performed must be designed with consideration for the effects of temperature changes. In particular, a transfer unit that transfers semiconductor devices and / or carriers carrying semiconductor devices inside such a chamber must be designed with consideration for thermal expansion, condensation, and / or frost so that the transfer unit can transfer semiconductor devices under various temperature conditions. Summary of the Invention [Problem to be solved by the invention]

[0010] SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer unit for semiconductor devices that can ensure good transfer performance under various temperature conditions.

[0011] The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0012] To solve the above problem, a semiconductor device transfer unit according to an embodiment of the present invention includes a transfer shaft disposed in an internal space formed by the chamber and extending along a transport direction of the semiconductor devices, a moving holder attached to the transfer shaft with an allowable gap therebetween and transferring a carrier loaded with the semiconductor devices along the transport direction, and a temperature controller for adjusting the temperature of at least one of the moving holder and the transfer shaft to prevent the moving holder from sticking to the transfer shaft in the temperature atmosphere.

[0013] The temperature controller adjusts the temperatures of the moving holder and the transfer shaft so that the degree of thermal deformation of the moving holder and the transfer shaft due to the temperature atmosphere is reduced.

[0014] The temperature controller is configured to transfer heat to the transfer shaft and includes a heating wire extending a predetermined length along the transport direction.

[0015] One end of the hot wire is inserted into the transfer shaft and extends the predetermined length along the transport direction, and the other end protruding from the transfer shaft is connected to a control device.

[0016] The chamber includes a first gate that separates an external space from the internal space, and a second gate that separates the internal space from a space formed by an external chamber in which a process on the semiconductor device is performed.

[0017] The transfer shaft extends between the first gate and the second gate.

[0018] The other end of the heating wire protrudes from the transfer shaft toward the first gate.

[0019] The temperature atmosphere is set to a temperature below room temperature, and the temperature controller transfers heat to the transport shaft and the moving holder to prevent at least one of condensation and frost from forming in the allowed gap.

[0020] The moving holder includes a moving block having a through hole formed therein into which the transfer shaft is inserted, and a ball that is installed inside the moving block so as to protrude into the through hole and support the transfer shaft in a position within the through hole.

[0021] A plurality of the balls protrude into the through-hole to prevent the transfer shaft from contacting the moving block.

[0022] The moving holder includes a moving block that moves back and forth on the transfer shaft, and a holding block that is formed below the moving block so as to be able to move up and down relative to the moving block and that holds the carrier.

[0023] The moving holder further includes a guide rail that extends along the extension direction of the transport shaft, moves up and down together with the holding block, and supports the holding block, which moves forward and backward along the moving block as the moving block moves forward and backward on the transport shaft.

[0024] The holding block includes a first holding frame having downwardly protruding hooks that are inserted into grooves on the carrier when the holding block is lowered, and a second holding frame having downwardly protruding other hooks that are formed to adjust the distance from the first holding frame and are inserted into other grooves on the carrier when the holding block is lowered.

[0025] The carrier mounts the HBM or a die forming the HBM as the semiconductor device, and includes terminals electrically connected to the mounted semiconductor device.

[0026] A chamber for performing a process on a semiconductor device according to an embodiment of the present invention for solving the above problem includes a chamber housing that forms an internal space through which the semiconductor device passes, and a transfer unit that is installed to transfer the semiconductor device.

[0027] The transfer unit includes a transfer shaft disposed in the internal space and extending along the transport direction of the semiconductor devices, a moving holder attached to the transfer shaft with an allowable gap therebetween and transferring a carrier loaded with the semiconductor devices along the transport direction, and a temperature regulator for adjusting the temperature of at least one of the moving holder and the transfer shaft to prevent the moving holder from sticking to the transfer shaft in the temperature atmosphere.

[0028] Other details of the invention are included in the detailed description and drawings. [Effects of the Invention]

[0029] According to the embodiment of the present invention, at least the following effects are obtained.

[0030] Good transport performance can be ensured even under various temperature conditions.

[0031] The effects of the present invention are not limited to the above-mentioned examples, and more diverse effects are included within the present specification. [Brief explanation of the drawings]

[0032] [Figure 1] 1 is a conceptual diagram illustrating a chamber to which a semiconductor device transfer unit according to an embodiment of the present invention can be applied; [Figure 2] FIG. 2 illustrates a semiconductor device transfer unit according to one embodiment of the present invention. [Figure 3] 3 is a diagram showing a transfer unit according to an embodiment of the present invention, viewed from a different angle than in FIG. 2. FIG. [Figure 4] 10 is an enlarged view of a moving holder portion in a transfer unit according to an embodiment of the present invention. FIG. [Figure 5] FIG. 2 is a front view of a transfer shaft and a moving block according to an embodiment of the present invention. [Figure 6] 1 is a conceptual diagram illustrating an example in which a semiconductor device transfer unit according to an embodiment of the present invention is installed inside a chamber. [Figure 7] FIG. 2 is a partial view of a holding block and test tray according to one embodiment of the present invention. [Figure 8] 10 is a diagram showing a state in which a transfer unit according to an embodiment of the present invention is holding a test tray in an initial position. [Figure 9] 10 is a diagram showing a state in which a transfer unit according to an embodiment of the present invention transfers a test tray to a target position. DETAILED DESCRIPTION OF THE INVENTION

[0033] The advantages and features of the present invention, as well as methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely to complete the disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art. The present invention is defined by the scope of the claims.

[0034] Furthermore, the embodiments described herein are described with reference to cross-sectional views and / or schematic diagrams that are ideal examples of the present invention. Therefore, the shapes of the illustrative views may be modified due to manufacturing techniques and / or tolerances. Furthermore, the components in the drawings shown in the present invention may be slightly enlarged or reduced in size for the convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0035] Hereinafter, the present invention will be described with reference to the drawings illustrating a semiconductor device transfer unit according to an embodiment of the present invention and a chamber including the semiconductor device transfer unit for performing a process on a semiconductor device.

[0036] FIG. 1 is a conceptual diagram showing a chamber to which a semiconductor device transfer unit according to an embodiment of the present invention can be applied.

[0037] A semiconductor device transfer unit according to an embodiment of the present invention may be applied to various chambers c1, c2, and c3 that perform processes on semiconductor devices. For example, the process on the semiconductor devices may be a temperature load test for evaluating the performance of the semiconductor devices. In this case, the semiconductor device transfer unit according to an embodiment of the present invention may be applied to at least one of the various chambers c1, c2, and c3 used for the temperature load test.

[0038] The test chamber c1 may include sockets in which semiconductor devices are mounted. The semiconductor devices may be electrically connected to a test unit while mounted in the respective sockets. The test unit may exchange signals with each of the electrically connected semiconductor devices to evaluate the performance of the semiconductor devices.

[0039] The test chamber c1 can set the internal space to a predetermined temperature atmosphere as needed to test whether the semiconductor device operates properly in a predetermined temperature environment. Such a temperature atmosphere can be set according to the needs of the user. For example, the internal temperature of the test chamber c1 can be set to a specific range from above 150 degrees Celsius to below 70 degrees Celsius.

[0040] The soak chamber c2 is a chamber in which the semiconductor device is aged before being exposed to the temperature atmosphere of the test chamber c1. The semiconductor device can be prepared to be exposed to the temperature of the test chamber c1 for a predetermined period of time inside the soak chamber c2.

[0041] The soak chamber c2 may have a gate formed on one side through which semiconductor devices are introduced from the external space and a gate formed on the other side through which semiconductor devices are transferred to the test chamber c1. The gate may include a structure for maintaining the temperature atmosphere of the internal space of the soak chamber c2 and / or the test chamber c1.

[0042] The desoak chamber c3 is a chamber in which the semiconductor device is aged to return to room temperature after the test is completed. The semiconductor device can be prepared in the desoak chamber c3 for removal from the chamber for a predetermined period of time.

[0043] The desoak chamber c3 may have a gate on one side through which the semiconductor devices are transported to the outside space and a gate on the other side through which the semiconductor devices are transferred from the test chamber c1. The gate may include a structure for maintaining the temperature atmosphere of the internal space of the desoak chamber c3 and / or the test chamber c1.

[0044] The transfer unit according to one embodiment of the present invention is installed in the aforementioned chambers c1, c2, and c3, and can transfer the semiconductor devices themselves or carriers carrying the semiconductor devices between the chambers c1, c2, and c3.

[0045] In this case, the carrier is a unit configured to mount semiconductor devices of any type. For example, the carrier is a test tray capable of mounting a plurality of semiconductor devices. The test tray may include a plurality of inserts corresponding to the sockets, and each insert may be configured to mount a semiconductor device. Alternatively, for example, the carrier may be an insert specifically designed for HBMs, designed to accommodate the fine pitch and fragility of the HBMs. In this case, one or more HBMs may be mounted on the carrier, and the fine fins of the HBMs may be electrically connected to terminals formed on the carrier when mounted on the carrier. Similarly, the carrier may be an insert configured to mount individual dies (DIEs) constituting the HBM. Similarly, in this case, the fine pins or bumps of the mounted dies (DIEs) may be electrically connected to terminals of the carrier when mounted on the carrier.

[0046] In the following description, an example in which a transfer unit according to an embodiment of the present invention picks up / places and transfers a test tray will be described, but the present invention is not necessarily limited to such an example. Therefore, a holding unit for holding a semiconductor device or a carrier according to an embodiment of the present invention may be provided in various ways corresponding to the object to be held.

[0047] Hereinafter, a semiconductor device transfer unit 100 according to an embodiment of the present invention will be described with reference to Fig. 2. Fig. 2 is a diagram showing a semiconductor device transfer unit according to an embodiment of the present invention.

[0048] As shown in FIG. 2, a semiconductor device transfer unit 100 according to an embodiment of the present invention may include a transfer shaft 101, a moving holder 110, and temperature controllers 121 and 123.

[0049] The transfer shaft 101 is an axial member disposed in the interior space of the chamber and extending in the direction of transport of the semiconductor device. The transfer shaft 101 may extend along the movement path of the moving holder 110 within the chamber.

[0050] The moving holder 110 is a unit that is attached to the transport shaft 101 at an allowable interval to pick up the test tray and transport it to a target position. At this time, the allowable interval is a design tolerance, and can be set to a tolerance of about 1 / 10 to 5 / 100. The moving holder 110 can have various configurations that can transport the carrier along the transport direction and place it at a target position.

[0051] The temperature controllers 121 and 123 are modules for ensuring various temperature compatibility for the transfer unit 100. The temperature controllers 121 and 123 can prevent the moving holder 110 from being stuck to the transfer shaft 101 due to the temperature atmosphere inside the chamber.

[0052] The temperature regulators 121 and 123 can regulate the temperature of the transport shaft 101 and / or the moving holder 110 to prevent the moving holder 110 from sticking to the transport shaft 101. Such temperature regulators 121 and 123 can be configured to include a control device 121 and a hot wire 123. The temperature regulators 121 and 123 can exchange heat with the transport shaft 101 and / or the moving holder 110 to ensure a minimum gap between the transport shaft 101 and the moving holder 110 that does not interfere with the movement of the moving holder 110.

[0053] The control device 121 may be connected to the hot wire 123 to control the hot wire 123. The hot wire 123 may be heated to a required temperature according to a control signal from the control device 121. The hot wire 123 may be extended to a predetermined length inside the transfer shaft 101. To this end, the transfer shaft 101 may have an accommodation groove for accommodating the hot wire 123. The accommodation groove may be formed along the central axis of the transfer shaft 101 so that heat exchange with the hot wire 123 can be uniformly performed at each location.

[0054] One end of the heating wire 123 is inserted into the receiving groove, and the other end may extend a predetermined length along the transport direction inside the transfer shaft 101. The other end of the heating wire 123 may protrude outside the transfer shaft 101, and the protruding portion may be mounted in a structure that can interact with the control device 121.

[0055] For ease of explanation, the following description will be given assuming that the thermal expansion / contraction rate of the moving holder 110 is higher than that of the transport shaft 101. If the thermal expansion / contraction rate of the moving holder 110 is lower than that of the transport shaft 101, each configuration / situation can be configured / actuated in the opposite manner, and therefore, redundant explanations will be omitted.

[0056] If the thermal expansion / contraction rate of the moving holder 110 is higher than that of the transport shaft 101, the moving holder 110 may become stuck on the transport shaft 101 due to excessive contraction of the moving holder 110 under low temperature conditions.

[0057] To prevent this, the temperature controllers 121 and 123 heat the hot wire 123 to heat the transport shaft 101. At this time, the moving holder 110 can be indirectly heated by receiving heat from the heated transport shaft 101.

[0058] The temperature controllers 121 and 123 can reduce the degree of thermal deformation of the transfer shaft 101 and the moving holder 110 compared to when they are exposed to the temperature atmosphere inside the chamber without protection. Ideally, the temperature controllers 121 and 123 can transfer heat to the transfer shaft 101 and the moving holder 110 so that the gap between the transfer shaft 101 and the moving holder 110 is similar to the gap at room temperature.

[0059] Meanwhile, in low temperature conditions, not only thermal shrinkage but also condensation and frost may form between the moving shaft 101 and the moving holder 110, hindering the movement of the moving holder 110. In one embodiment of the present invention, the moving holder 110 and the moving shaft 101 are heated, so that condensation and frost can be prevented from forming on the surfaces of the moving holder 110 and the moving shaft 101. Therefore, even in such a case, good moving performance of the moving holder 110 can be ensured in one embodiment of the present invention.

[0060] 2, the transfer unit 100 may include a mounting frame 103 for fixing other components of the transfer unit 100 in position inside the chamber. The mounting frame 103 may be fixed to the inner wall of the chamber and may support other components included in the transfer unit 100.

[0061] Hereinafter, the moving holder 110 according to an embodiment of the present invention will be described in detail with reference to Figures 3 and 4. Figure 3 is a view showing a moving unit according to an embodiment of the present invention viewed from a different angle than Figure 2. Also, Figure 4 is an enlarged view of the moving holder portion of the moving unit according to an embodiment of the present invention.

[0062] 3 and 4, a pair of transfer shafts 101 according to an embodiment of the present invention may be provided, each extending substantially in a straight line along the transport direction. The moving holder 110 is mounted on the pair of transfer shafts 101 and may move forward and backward with both sides supported by the transfer shafts 101.

[0063] 3 and 4, the moving holder 110 according to an embodiment of the present invention may include a moving block 111, a holding block 115, a guide rail 117, and an elevation actuator 119.

[0064] The moving block 111 is a block that is attached to the pair of transfer shafts 101 and moves back and forth along the pair of transfer shafts 101. The moving block 111 may have through holes formed in its body to accommodate each of the transfer shafts 101. The pair of through holes may be formed at intervals corresponding to the intervals between the transfer shafts 101, and the central axes may be positioned on the same plane.

[0065] The advancement and retreat of the moving block 111 can be realized by various conventional driving units, and these driving units can be controlled by the control unit 121 or a control unit that controls the transfer unit 100.

[0066] The holding block 115 is positioned on one side of the moving block 111, and the relative distance between the holding block 115 and the moving block 111 can be adjusted. For the sake of convenience, the following description will be given assuming that the holding block 115 is positioned below the moving block 111. However, depending on the installation direction of the transfer unit 100, the "below" may be expressed as the "upper side," "left side," "right side," etc.

[0067] The holding block 115 can be connected to the moving block 111 so as to be able to move up and down, and can be configured to be able to hold a test tray positioned below. The holding block 115 can include a block housing 1153, a first holding frame 1151, a second holding frame 1152, and rollers 1154.

[0068] For example, the holding block 115 may be configured such that each of the first holding frame 1151 and the second holding frame 1152 carries one test tray, or as another example, the holding block 115 may be configured such that both the first holding frame 1151 and the second holding frame 1152 hold one test tray.

[0069] The block housing 1153 is a housing that is coupled to the moving block 111 so as to be able to move up and down.

[0070] The first holding frame 1151 is a frame that is coupled to the block housing 1153. At least one hook 1151a may protrude from the bottom of the first holding frame 1151. The hook 1151a included in the first holding frame 1151 is referred to as the first hook 1151a for convenience in order to distinguish it from the hook 1152a of the second holding frame 1152.

[0071] The second holding frame 1152 is a frame coupled to the block housing 1153 so as to be positioned to the side of the first holding frame 1151. At least one hook 1152a may protrude from the bottom of the second holding frame 1152. The hook 1152a included in the second holding frame 1152 is referred to as the second hook 1152a for convenience in order to distinguish it from the first hook 1151a.

[0072] The first holding frame 1151 and the second holding frame 1152 may be coupled to a block housing 1153 so that the relative distance between them can be adjusted. A drive unit for adjusting the distance between the first holding frame 1151 and the second holding frame 1152 may be any one of various conventional drive units. In addition, such a drive unit may be controlled by the control device 121 or a control unit that controls the transfer unit 100.

[0073] The rollers 1154 can be arranged on the side of the block housing 1153 to support the transport of the holding block 115. The rollers 1154 are coupled to one side of the block housing 1153, inserted into the inside of the guide rail 117, and can move forward and backward along the guide rail 117.

[0074] The guide rail 117 is a rail that supports the movement of the holding block 115. A roller 1154 may be inserted inside the guide rail 117. The guide rail 117 may extend in the extension direction of the transfer shaft 101. For example, the guide rail 117 may extend along an axis parallel to the central axis of the transfer shaft 101.

[0075] The holding block 115 is coupled to the moving block 111 and can move forward and backward along with the movement of the moving block 111. During this moving forward and backward process, the holding block 115 is supported by the guide rails 117, so that shaking during the moving forward and backward process can be minimized.

[0076] Meanwhile, the front and rear ends of the guide rail 117 may be coupled to lift actuators 119. The lift actuators 119 may be embodied in various configurations, such as being coupled to the mounting frame 103 and / or the inner wall of the chamber to be fixed in position, and having a lower end that is extendable downward in length. The lift actuators 119 may be controlled by the control device 121 or a control unit that controls the transfer unit 100.

[0077] The guide rails 117 may have side wall portions coupled to the lower ends of the lifting actuators 119. As a result, the guide rails 117 may be raised and lowered in response to the lowering and rising of the lower ends of the lifting actuators 119.

[0078] When the guide rail 117 is raised and lowered, the rollers 1154 inserted inside the guide rail 117 may also be raised and lowered. The holding block 115 may also be raised and lowered in response to the raising and lowering of the rollers 1154. However, the present invention is not limited to this embodiment, and the lifting actuator 119 may raise and lower the holding block 115, thereby raising and lowering the guide rail 117.

[0079] Hereinafter, the coupling relationship between the transfer shaft 101 and the moving block 111 according to an embodiment of the present invention will be described in detail with reference to Fig. 5. Fig. 5 is a front view of the transfer shaft and the moving block according to an embodiment of the present invention.

[0080] 5, the moving holder 110 may include a plurality of balls 113 mounted inside the moving block 111 and protruding into the through holes 111a, thereby allowing the moving block 111 to function like a ball bushing that moves along the axis of the transfer shaft 101.

[0081] The plurality of balls 113 may be arranged at regular intervals inside the through hole 111a. More specifically, the plurality of balls 113 may be arranged on the sidewall of the through hole 111a at intervals that evenly divide the circumference of the through hole 111a. The transfer shaft 101 inserted into the through hole 111a may be supported inside the through hole 111a by the plurality of balls 113. Considering the size of the plurality of balls 113, the diameter of the transfer shaft 101 may be slightly smaller than the diameter of the through hole 111a. This difference in diameter may define the above-mentioned allowable interval.

[0082] The plurality of balls 113 allows the transfer shaft 101 to make point contact with the balls 113 without contacting the surface of the moving block 111. This minimizes the contact area between the moving holder 110 and the transfer shaft 101, and also minimizes friction between the moving holder 110 and the transfer shaft 101.

[0083] An example in which a transfer unit according to an embodiment of the present invention is installed inside a chamber will be described below with reference to Fig. 6. Fig. 6 is a conceptual diagram illustrating an example in which a semiconductor device transfer unit according to an embodiment of the present invention is installed inside a chamber.

[0084] Referring to FIG. 6, chamber c is the soak or desoak chamber previously described.

[0085] The chamber c extends in the vertical direction based on FIG. 6, and the test tray can be transported along the extended direction.

[0086] The chamber c may include a chamber housing that defines an internal space cc3 through which the semiconductor device passes and separates the internal space cc3 from an external space. The chamber housing forms an inner wall of the chamber c and may be coupled to the mounting frame 103.

[0087] A first gate cc1 may be formed on one side of the chamber c to separate the external space from the internal space cc3, and a second gate cc2 may be formed on the other side of the chamber c to separate the internal space cc3 from the internal space of another chamber, where the other external chamber is a test chamber.

[0088] The transfer shaft 101 can be arranged in a straight line between the first gate cc1 and the second gate cc2. The mounting frame 103 can be coupled to the inner wall of the chamber c so that the transfer shaft 101 and the moving holder 110 are supported.

[0089] The transfer shaft 101 may be installed with its front end closest to the first gate cc1. The heating wire 123 may be inserted into the receiving groove through the front end of the transfer shaft 101. The other exposed end of the heating wire 123 may protrude from the front end of the transfer shaft 101 toward the first gate cc1.

[0090] Such a position of the hot wire 123 is advantageous in terms of securing space for installing the control device 121 and / or a temperature control configuration. More specifically, such a position of the hot wire 123 allows the control device 121 and / or a temperature control configuration to be installed in the external space. Therefore, such a position of the hot wire 123 does not require consideration of interference with other chamber configurations, and has the advantage of being able to omit a configuration for protecting the control device 121, etc., from the temperature atmosphere inside chamber c.

[0091] Hereinafter, a method for the holding block 115 to pick up the test tray t according to an embodiment of the present invention will be described with reference to Figure 7. Figure 7 is a partial view of the holding block and test tray t according to an embodiment of the present invention.

[0092] The following description will focus on the transport of the test tray t, taking as an example an embodiment of the present invention for transporting a test tray t, but the present invention is not limited thereto. For example, the groove t1 of the test tray t may be formed in the semiconductor device or a separate member or other type of carrier attached thereto, and the holding block 115 may transport the semiconductor device and / or carrier using such groove t1.

[0093] When the first holding frame 1151 and the second holding frame 1152 each carry one test tray t, the first hook 1151a and the second hook 1152a can be inserted into the grooves t1 of different test trays t while the holding block 115 is lowered. The first hook 1151a to the second hook 1152a can have shapes corresponding to the grooves t1 formed on the test tray t.

[0094] At this time, the hooks 1151a, 1152a can each hold one of the test trays t in various ways. For example, each of the hooks 1151a, 1152a may be provided with a protruding member (not shown) at a lower end portion thereof so as to be selectively protruding. The protruding member may protrude outward (in a direction intersecting with the extension direction of the groove and / or a direction intersecting with the thickness direction of the test tray) from the body of the hooks 1151a, 1152a when the hooks 1151a, 1152a are fully inserted into the groove t1 of the test tray t. When protruding, the protruding member may support the rear surface of the test tray t (the surface not facing the first and second holding frames).

[0095] Alternatively, the first holding frame 1151 and the second holding frame 1152 may be formed so that the distance therebetween can be adjusted to hold one test tray t. In this case, when the first holding frame 1151 and the second holding frame 1152 maintain an initial distance, the first hooks 1151a and the second hooks 1152a may have a positional relationship corresponding to a plurality of grooves t1 formed on the test tray t.

[0096] With the block housing 1153, the first holding frame 1151, and the second holding frame 1152 lowered, the first hook 1151a and the second hook 1152a can each be inserted into the corresponding groove t1 on the test tray t.

[0097] Thereafter, when the distance between the first holding frame 1151 and the second holding frame 1152 becomes narrower or wider than the initial distance, the first hook 1151a and the second hook 1152a can apply forces in opposite directions to the side walls of the test tray t. In this state, the test tray t can be held by the holding block 115.

[0098] 8 and 9, Fig. 8 is a diagram showing a state in which the transfer unit according to an embodiment of the present invention holds the test tray at the initial position, while Fig. 9 is a diagram showing a state in which the transfer unit according to an embodiment of the present invention has transferred the test tray to the target position.

[0099] When the test tray t is transferred into the chamber in which the transfer unit 100 is installed, the test tray t may be positioned as shown in Figure 8. In the initial position of the test tray t, the groove t1 of the test tray t may be positioned directly below the hooks 1151a and 1152a of the holding block 115. When the transfer of the test tray t begins, the holding block 115 descends to hold the test tray t as described above.

[0100] 9, the test tray t can be transported to the target position. During the movement of the moving block 111, the holding block 115 is supported by the guide rails 117, so that fluctuations in the height direction of the test tray t can be minimized.

[0101] 6 again, when the moving block 111 is fully advanced, the test tray t can be moved from the internal space cc3 of the chamber c to the external space. In this state, the test tray t can be picked up by a transfer unit or transfer of another chamber and moved to another device.

[0102] A semiconductor device transfer unit according to another embodiment of the present invention will now be described based on the above description. To avoid repetition, the description of the same or similar parts to the above embodiment will be omitted and differences will be mainly described.

[0103] In the above-described embodiment, the hot wire 123 of the temperature controller is inserted into the moving shaft 101, but in this embodiment, the hot wire 123 may be attached to the moving holder 110. Exemplarily, in this embodiment, the hot wire 123 may be attached to the moving block 111. In this embodiment, the moving shaft 101 exchanges heat with the moving block 111, the temperature of which is adjusted by the hot wire 123, thereby reducing the degree of thermal deformation.

[0104] In the above description, in another embodiment of the present invention, the hot wire 123 is attached to the moving block 111 instead of the transfer shaft 101, but the semiconductor device transfer unit according to another embodiment of the present invention is not limited to such an embodiment.

[0105] For example, in the semiconductor device transfer unit according to another embodiment of the present invention, the hot wires 123 can be installed on both the transfer shaft 101 and the moving block 111 .

[0106] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be merely illustrative in all respects and not limiting. The scope of the present invention is defined by the claims below rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present invention. [Explanation of symbols]

[0107] 100 transport units 101 Transfer shaft 103 Mounting Frame 110 Moving Holder 111 Moving Block 111a Through Hole 113 Ball 115 Holding Block 1151, 1152 Holding Frame 1151a, 1152a hook 1153 Block Housing 1154 Laura 117 Guide Rail 119 Lifting Actuator 121 Control device 123 Heat ray c Chamber c1 Test chamber c2 Soak chamber c3 Desoak Chamber cc1 First Gate cc2 Second Gate cc3 internal space t Test Tray t1 groove

Claims

1. A semiconductor device transfer unit installed in a chamber that provides a temperature atmosphere as needed, a transfer shaft disposed in an internal space formed by the chamber and extending along a direction in which the semiconductor device is transported; a moving holder attached to the transfer shaft with an allowable gap therebetween, for transferring the carrier loaded with the semiconductor devices along the transport direction; and a temperature regulator that regulates the temperature of at least one of the moving holder and the transfer shaft so as to prevent the moving holder from being stuck on the transfer shaft in the temperature atmosphere.

2. The temperature regulator is 2. The semiconductor device transfer unit of claim 1, wherein temperatures of the moving holder and the transfer shaft are adjusted so that thermal deformation of the moving holder and the transfer shaft due to the temperature atmosphere is reduced.

3. The temperature regulator is 3. The semiconductor device transfer unit according to claim 2, further comprising: a heat wire formed to transfer heat to the transfer shaft and extending a predetermined length along the transport direction.

4. The heat ray is 4. The semiconductor device transfer unit of claim 3, wherein one end is inserted into the transfer shaft to extend the predetermined length along the transport direction, and the other end protruding out of the transfer shaft is connected to a control device.

5. The chamber comprises: a first gate separating an external space from the internal space, and a second gate separating the internal space from a space formed by an external chamber for performing a process on the semiconductor device; the transfer shaft extends between the first gate and the second gate; The semiconductor device transfer unit according to claim 4 , wherein the other end of the hot wire is protruded from the transfer shaft toward the first gate.

6. 2. The semiconductor device transfer unit of claim 1, wherein the temperature atmosphere is set to a temperature below room temperature, and the temperature controller transfers heat to the transfer shaft and the moving holder to prevent the formation of at least one of condensation and frost in the allowed gap.

7. The moving holder includes: a moving block having a through hole formed therein through which the transfer shaft is inserted; and 2. The semiconductor device transfer unit according to claim 1, further comprising: a ball disposed inside the moving block so as to protrude into the through-hole, and supporting the transfer shaft at a position within the through-hole.

8. The ball is 8. The semiconductor device transfer unit according to claim 7, wherein a plurality of protruding members protrude into the through-hole to prevent the transfer shaft from contacting the moving block.

9. The moving holder includes: a moving block that moves back and forth on the transfer shaft; and 2. The semiconductor device transfer unit according to claim 1, further comprising: a holding block formed below said moving block so as to be able to rise and fall relative to said moving block, and for holding said carrier.

10. The moving holder includes:

10. The semiconductor device transfer unit of claim 9, further comprising: a guide rail extending along the extension direction of the transfer shaft, raised and lowered together with the holding block, and supporting the holding block as it moves back and forth along the moving block as it moves back and forth on the transfer shaft.

11. The holding block is a first holding frame having a hook protruding downward, the hook being inserted into a groove on the carrier when lowered; and 10. The semiconductor device transfer unit of claim 9, further comprising: a second holding frame formed so that the distance between the second holding frame and the first holding frame can be adjusted, and having other hooks protruding downwardly that are inserted into other grooves on the carrier when the second holding frame is lowered.

12. The carrier is 2. The semiconductor device transfer unit according to claim 1, wherein the semiconductor device is an HBM or a die forming the HBM, and the unit includes a terminal electrically connected to the semiconductor device.

13. In a chamber for performing a process on a semiconductor device by providing a temperature atmosphere set as required, The chamber comprises: a chamber housing that defines an interior space through which the semiconductor device passes; and a transfer unit configured to transfer the semiconductor device; The transfer unit includes: a transfer shaft disposed in the internal space and extending along a transport direction of the semiconductor device; a moving holder attached to the transfer shaft with an allowable gap therebetween, for transferring the carrier loaded with the semiconductor devices along the transport direction; and a temperature controller that controls the temperature of at least one of the moving holder and the transfer shaft so as to prevent the moving holder from being stuck on the transfer shaft in the temperature atmosphere.

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