Component mounting method and component mounting system
The component mounting method and system optimize component placement across multiple board types by using a placement determination unit to allocate components to mounting blocks with multiple nozzles, reducing processing complexity and enhancing production efficiency.
Patent Information
- Application Number
- JP2022016912
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-02-07
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2042-02-07
AI Technical Summary
The increasing number of board types requiring different components necessitates extensive combination processing to determine optimal component layouts, increasing production time and complexity in component mounting processes.
A component mounting method and system that utilizes a component placement determination unit to allocate components to mounting blocks equipped with multiple nozzles, determining a common component placement based on code information to minimize nozzle and component type changes across various board types, thereby optimizing production efficiency.
Reduces the amount of combination processing required to determine component placement, enhancing production efficiency by allowing components to be mounted on multiple board types with minimal changes to the nozzles and heads, thus shortening production time.
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Abstract
Description
[Technical Field]
[0001] The present invention relates to a component mounting method and a component mounting system for mounting components on a board. [Background technology]
[0002] Conventionally, there is a component mounting system for mounting components on a substrate.
[0003] When manufacturing a plurality of types of boards in a mounting process in which components are mounted on a board, when switching between types of boards, it is necessary to change the components to be mounted according to the board.
[0004] Patent Document 1 discloses an optimization method for determining a common component layout when mounting components on boards on which different components are to be mounted, in order to reduce the mounting time when mounting components. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Patent No. 3566785 Summary of the Invention [Problem to be solved by the invention]
[0006] The more types of boards on which different components are mounted, in other words, the more types of components are handled, the more combination processing volume is required to determine a common component layout that optimizes the production time of each board when mounting components on each board.
[0007] The present invention provides a component mounting method and the like that can reduce the amount of combination processing required to determine component placement. [Means for solving the problem]
[0008] A component mounting method according to one aspect of the present invention is a component mounting method for mounting one or more types of components from a plurality of types of components onto a plurality of types of boards, each of which has a different type of component that can be mounted on the other, and includes a component placement determination step for determining a common component placement when mounting components on each of the plurality of types of boards by allocating components to a plurality of mounting blocks, each of which is provided with a head equipped with one or more types of nozzles from a plurality of types of nozzles that can pick up different types of components from each other, and a mounting step for mounting components placed in each of the plurality of mounting blocks, according to the type of board, onto a board, in each of which components are placed in the mounting block according to the type of board, in which the component placement determination step determines the component placement based on code information that indicates a correspondence between the type of head provided in each of the plurality of mounting blocks and the type of component that can be mounted on the board using the head.
[0009] Furthermore, a component mounting system according to one aspect of the present invention is a component mounting system that mounts one or more types of components from a plurality of types of components onto a plurality of types of boards, each of which has a different type of component that can be mounted on the other, and includes: a component placement determination unit that determines a common component placement when mounting components on each of the plurality of types of boards by allocating components to a plurality of mounting blocks, each of which is provided with a head to which one or more types of nozzles from a plurality of types of nozzles that can pick up different types of components are attached; and a mounting unit that mounts the components allocated to the mounting block according to the type of board on each of the plurality of mounting blocks, in which components are placed in a component placement determined based on the component placement, onto the board; and the component placement determination unit determines the component placement based on code information that indicates a correspondence between the type of head provided in each of the plurality of mounting blocks and the type of component that can be mounted on the board using the head.
[0010] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. [Effects of the Invention]
[0011] According to the present invention, it is possible to provide a component mounting method and the like that can reduce the amount of combination processing required to determine component placement. [Brief explanation of the drawings]
[0012] [Figure 1] FIG. 1 is a schematic diagram showing a component mounting system according to an embodiment. [Figure 2] FIG. 2 is a block diagram showing the functional configuration of the component mounting system. [Figure 3] FIG. 3 is a flowchart showing a processing procedure of the component mounting system according to the embodiment. [Figure 4] FIG. 4 is a flowchart showing details of the component placement determination process of the component mounting system according to the embodiment. [Figure 5A] FIG. 5A is a diagram showing a specific example of a co-occurrence matrix. [Figure 5B] FIG. 5B is a diagram showing an example of an isolated component that can be picked up by a nozzle. [Figure 6] FIG. 6 is a diagram illustrating an example of processing in which the component mounting system according to the embodiment groups a plurality of types of components. [Figure 7] FIG. 7 is a diagram illustrating an example of processing in which the component mounting system according to the embodiment groups a plurality of types of components. [Figure 8] FIG. 8 is a diagram showing an example of the target number in each mounting block for each type of board. [Figure 9] FIG. 9 is a flowchart showing details of the repetitive process of component movement of the component mounting system according to the embodiment. [Figure 10]FIG. 10 is a diagram showing an example of a nozzle vector. [Figure 11] FIG. 11 is a flowchart showing the repeated process of replacing components in the component mounting system according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below represents a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangements and connection forms, steps, and step sequences shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not recited in the independent claims of the present invention will be described as optional components.
[0014] Furthermore, each drawing is a schematic diagram and is not necessarily drawn to precise scale, dimensions, etc. Furthermore, in each drawing, the same components are denoted by the same reference numerals.
[0015] (Embodiment) [composition] First, the configuration of a component mounting system according to an embodiment will be described.
[0016] Fig. 1 is a schematic diagram showing a component mounting system 10 according to an embodiment. Fig. 1 is a schematic diagram of the component mounting system 10 when a stage on which a substrate is placed when components are mounted on the substrate is viewed from above. Note that Fig. 1 does not show some of the components of the component mounting system 10, such as a component placement determination unit 200 (see Fig. 2).
[0017] The component mounting system 10 is a system for producing electronic devices such as smartphones and personal computers, and is composed of a mounting machine that mounts electronic components such as integrated circuits (ICs, semiconductors), capacitors, and resistors on a circuit board.
[0018] The component mounting system 10 mounts multiple components on each of multiple types of boards. Specifically, the component mounting system 10 arranges multiple types of components used in board production and mounts those components on multiple types of boards that have different types of components to be mounted (hereinafter simply referred to as component types).
[0019] For example, the component mounting system 10 mounts eight components 31 on the board 21. That is, the component mounting system 10 uses multiple mounters 110 to mount eight components of one type on the board 21. Also, for example, the component mounting system 10 mounts one each of components 31, 32, 33, 34, 35, 36, 37, and 38 on the board 22. That is, the component mounting system 10 uses multiple mounters 110 to mount one each of eight types of components on the board 22. Also, for example, the component mounting system 10 mounts one component 31, two components 31, four components 33, one component 37, and one component 38 on the board 23. That is, the component mounting system 10 uses multiple mounters 110 to mount a total of nine components of five types (components 31, 32, 33, 37, and 38) on the board 23. As described above, component mounting system 10 is a system capable of mounting one or more types of components corresponding to each of a plurality of types of boards on each of which the components to be mounted differ from one another by one or more types.
[0020] The component mounting system 10 is made up of multiple mounting machines 110. Each mounting machine 110 is made up of one or more mounting blocks 120, each of which is made up of a nozzle 140 that picks up a mounted component and a head 130 that moves the component from a component supply unit 150 to a mounting unit (substrate 21).
[0021] Nozzles 140 corresponding to the type of component are attached to the heads 130 provided in each mounting block 120. The multiple nozzles 140 provided in the component mounting system 10 include nozzles 140 that can pick up components corresponding to multiple types of boards (hereinafter also simply referred to as board types).
[0022] In the component mounting system 10, the types of components corresponding to the type of board are mounted on each of a plurality of types of boards by mounting the mounted components on the board in each mounting block 120 without changing the components to be mounted in the mounting block 120 (more specifically, the component supply unit 150 described later) provided in each mounting machine 110. Also, in the component mounting system 10, the types of components corresponding to the type of board are mounted on a plurality of types of boards with minimal changes to the plurality of nozzles 140 attached to the head 130. In other words, in the component mounting system 10, components are mounted on the board without changing the types of components to be placed in each mounting block 120, and with minimal changes to the type of nozzle 140 attached to the head 130.
[0023] FIG. 2 is a block diagram showing the functional configuration of the component mounting system 10 according to the embodiment.
[0024] The component mounting system 10 includes a mounting unit 100 and a component placement determination unit 200.
[0025] Mounting unit 100 is a system that mounts components on a board. Specifically, in each of a plurality of mounters 110 (more specifically, a plurality of mounting blocks 120) in which components have been placed in a component layout determined based on the component allocation determined by component layout determination unit 200, mounting unit 100 mounts the components placed in that mounting block 120 on the board according to the type of board. That is, each mounting block 120 mounts the components placed in its own mounting block 120 on the board according to the type of board.
[0026] When mounting components on a board, it is not necessary for all mounting blocks 120 in the mounting section 100 to mount components on the board. However, the mounting section 100 can increase the production efficiency of boards (shorten the production time) by evenly using multiple mounting blocks 120. In the mounting blocks 120, a turning process is performed to mount the components on the board, and the components are mounted on the board.
[0027] The turning process is a series of processes from an arbitrary initial position, picking up a component onto the nozzle 140, mounting it on the board, and returning to the initial position.
[0028] The mounting section 100 includes a plurality of mounters 110 and a mounting control section 160.
[0029] Mounting machine 110 is a device that mounts components onto a board. Component mounting system 10 includes multiple mounting machines 110, and produces printed circuit boards for electronic devices by moving boards between each mounting machine 110 and mounting the appropriate type of component on each mounting machine 110 depending on the type of board.
[0030] The mounting machine 110 includes one or more mounting blocks 120 .
[0031] The mounting block 120 is a unit having a mechanism for mounting components on a board. In this embodiment, for example, as shown in Fig. 1, each of the four mounting machines 110 includes two mounting blocks 120, and is configured so that components can be mounted on a transported board at one or more placement positions in each of the two mounting blocks 120.
[0032] The mounting block 120 includes a head 130 , a nozzle 140 , and a component supply unit 150 .
[0033] The head 130 is a head to which one or more nozzles 140 for picking up components are attached. The head 130 is attached to a drive unit such as an arm (not shown), for example. In each mounting block 120, components arranged in the component supply unit 150 are picked up by the nozzles 140 by being driven by the arm or the like, and the picked-up components are mounted on a board.
[0034] The heads 130 provided in each mounting block 120 may have the same or different types of mountable nozzles 140. In other words, the types of one or more nozzles 140 attached to the heads 130 provided in each mounting block 120 may be the same or all different.
[0035] The nozzle 140 is attached to the head 130 and comes into contact with a component. Specifically, the nozzle 140 is attached to the head 130 in order to suck up the component and mount it on a board. The nozzle 140 is connected to a vacuum suction source (not shown), for example, via a suction pipe line. This allows the nozzle 140 to suck up the component by vacuum when the vacuum suction source is activated.
[0036] The component mounting system 10 is provided with nozzles 140 according to the types of components to be handled. In other words, the component mounting system 10 is provided with a plurality of nozzles 140 of different types.
[0037] The component supply unit 150 is a storage unit in which components are placed. More specifically, the component supply unit 150 has one or more feeders attached thereto. Components are supplied by component reels stored on tape and attached to the feeders. In addition to feeders, the mounting machine 110 also supports component supply formats such as trays. The mounting machine 110 is equipped with, for example, multiple component supply units 150. Components of the same type or different types are placed in each component supply unit 150.
[0038] Note that the types of one or more components placed in the one or more component supply units 150 provided in each mounting block 120 may be the same as or all different from one another. In other words, the types of the multiple component supply units 150 provided in the component mounting system 10 may be the same as or different from one another. The types of component supply units 150 are types classified by, for example, the types of components that can be placed in the component supply units 150 and / or the feeder width of the trays or feeders provided in the component supply units 150.
[0039] The mounting control unit 160 is a processing unit that mounts components on a board by controlling each mounting machine 110. The mounting control unit 160 is connected to each mounting machine 110, for example, so as to be capable of wireless communication or so as to be capable of wired communication via a control line or the like, and controls each mounting machine 110. The mounting control unit 160 is realized by a computer that includes a communication interface for communicating with each device included in the component mounting system 10, a non-volatile memory for storing programs, a volatile memory that is a temporary storage area for executing the programs, an input / output port for transmitting and receiving signals, a processor that executes the programs, and the like.
[0040] The component placement determination unit 200 is a processing unit that determines the component placement. Specifically, the component placement determination unit 200 determines a common component placement when mounting components on each of a plurality of types of boards by allocating components to a plurality of mounting blocks 120, each of which is provided with a head 130 to which one or more types of nozzles 140 are attached out of a plurality of types of nozzles 140 that can pick up different types of components (more specifically, different by one or more types). More specifically, the component placement determination unit 200 determines the component placement based on code information. The component placement determination unit 200 determines a common component placement when mounting components on each of a plurality of types of boards by determining the component placement of each mounting block 120 based on the determined component placement.
[0041] The code information is information that indicates the availability relationship between the type of head 130 provided on each of the multiple mounting blocks 120 and the type of components that can be mounted on a board using the head 130.
[0042] The component placement determination unit 200 is realized, for example, by a computer having a communication interface for communicating with the mounting unit 100, non-volatile memory for storing the programs executed by each processing unit, volatile memory which is a temporary storage area for executing the programs, input / output ports for sending and receiving signals, and a processor for executing the programs.
[0043] The component placement determination unit 200 includes a first determination unit 210 that determines the allocation of each mounting block 120, a second determination unit 220, a third determination unit 230 that determines the final mounting order and component placement within the mounting block 120 after allocation to each mounting block 120, an output unit 240, and a memory unit 250.
[0044] The first determination unit 210 is a processing unit that determines, based on code information, the allocation (placement) of all types of components to be used in production to the temporary mounting blocks 120. The first determination unit 210 obtains the code information by generating it based on, for example, information indicating the type of head 130 provided in each of the multiple mounting blocks 120 (e.g., head information indicating the type and number of nozzles 140 that can be attached to the head 130), information on the nozzles 140 indicating the types of components that can be picked up (nozzle information), and information indicating the types of components to be mounted (component information).
[0045] Alternatively, such code information may be stored in advance in the storage unit 250, and the first determination unit 210 may acquire the code information from the storage unit 250.
[0046] The second determination unit 220 is a processing unit that determines the final allocation (placement) of components to the mounting block 120 based on the code information. More specifically, the second determination unit 220 determines the component allocation by changing the allocation of one or more components in the tentative component allocation determined by the first determination unit 210 based on the type of the multiple types of boards.
[0047] The specific process by which the first determination section 210 and the second determination section 220 determine the component placement will be described later.
[0048] The third determination section 230 determines the positions of the components to be placed on the mounting blocks 120 and the order in which the components are to be mounted, based on information on the components (component allocation) allocated to each mounting block 120 by the second determination section 220 and the mounting positions.
[0049] The output unit 240 is a processing unit that outputs component placement information indicating the component placement of each mounting block 120 determined by the third determination unit 230. The output unit 240 outputs the component placement information to the mounting unit 100, for example. The mounting control unit 160 controls each mounting machine 110 based on the component placement information, for example, to cause the mounting machine 110 to mount components on a board. Also, for example, the output unit 240 outputs the component placement information to a display device such as a display (not shown). A user checks the component placement indicated by the component placement information displayed on the display device, for example, and places components in each mounting block 120 according to the component placement. Of course, component placement may be performed automatically by a robot or the like based on the component placement information.
[0050] The storage unit 250 is a storage device that stores information on components handled by the component mounting system 10, in other words, the types of components mounted on boards by the component mounting system 10, the type of board, the type of head 130, the type of nozzle 140, and the type of component supply unit 150 provided in the mounting unit 100. The storage unit 250 is realized by, for example, a flash memory or an HDD (Hard Disk Drive).
[0051] [Processing Procedure] Next, the processing procedure of the component mounting system 10 will be described.
[0052] <Summary> FIG. 3 is a flowchart showing the processing procedure of the component mounting system 10 according to the embodiment.
[0053] First, the component placement determination unit 200 determines a common component placement when mounting components on each of a plurality of types of boards by assigning components to a plurality of mounting blocks 120 each provided with a head 130 to which one or more types of nozzles 140 are attached out of a plurality of types of nozzles 140 each capable of picking up different types of components (S10). Specifically, the component placement determination unit 200 acquires code information and determines the component placement based on the acquired code information. The component placement determination unit 200 determines a component placement for each mounting block 120 based on the determined component placement, thereby determining a common component placement when mounting components on each of a plurality of types of boards.
[0054] Next, the mounting unit 100 mounts components on the board in the multiple mounting blocks 120 in which the components are placed in the component placement determined based on the component allocation determined by the component placement determination unit 200 (S20). For example, the mounting control unit 160 acquires component placement information from the component placement determination unit 200, and controls each mounting machine 110 based on the acquired component placement information, thereby causing each mounting machine 110 to mount components according to the type on multiple types of boards.
[0055] <Component placement determination process> Fig. 4 is a flowchart showing details of the component placement determination process of the component mounting system 10 according to the embodiment. Specifically, Fig. 4 is a flowchart showing details of step S10.
[0056] First, the first determination unit 210 acquires code information (S110). As described above, the code information is information indicating the usability relationship between the type of head 130 provided in each of the multiple mounting blocks 120 and the type of component that can be mounted on a board using the head 130. The code information is, for example, information indicating the component code shown below.
[0057] Table 1 below shows an example of a parts-head code (PHC).
[0058] [Table 1]
[0059] Note that H16, H8, and H3 each indicate a head type. For example, H16 indicates that 16 nozzles 140 can be installed. Furthermore, a "1" in Table 1 indicates that the corresponding component type can be mounted on the board, and a "0" in Table 1 indicates that the corresponding component type cannot be mounted on the board. For example, for type PA components, H16, H8, and H3 can all be mounted on the board. In this case, the component code corresponding to type PA components is determined to be, for example, "111," and is called a multi-code. On the other hand, for type PB components, for example, H16 and H8 can be mounted on the board, but H3 cannot be mounted on the board. In this case, the component code corresponding to type PB components is determined to be, for example, "110," and is called a double-code. Furthermore, for example, for type PD components, H16 can be mounted on the board, but H8 and H3 cannot be mounted on the board. In this case, the component code corresponding to type PD components is determined to be, for example, "100."
[0060] A cord of a component that allows only one type of head 130 out of multiple types of heads 130 to be mounted on a board is called a single cord.
[0061] Whether each component can be picked up or not is determined by the type of nozzle 140. Furthermore, whether a nozzle 140 can be mounted or not depends on the type of head 130. For this reason, when allocating a certain component type to a mounting block 120, it is necessary to make a decision based on two conditions: the nozzle 140 and the head 130. Meanwhile, the component code indicates whether the head 130 can mount each component on the board according to the nozzle 140 that can be mounted. By using such a component code when determining component allocation, the influence of the type of nozzle 140 can be eliminated from each subsequent process of determining component allocation.
[0062] Next, the first determination unit 210 groups the multiple components according to the characteristics of each component type based on the code information (S120). More specifically, the first determination unit 210 classifies the multiple components into multiple groups (also called quasi-components) based on the code information. For example, the first determination unit 210 groups component types having the same code information (for example, the same numerical values indicated by the code information) into the same group.
[0063] The multiple groups include, for example, a multiple component group (also referred to as a divided component group) consisting of only component types whose number of components mounted on multiple types of boards (in other words, the number of components used in mounting multiple types of boards) is equal to or greater than a predetermined number. If the components of the multiple component group are allocated to a single mounting block 120, the number of mounting points will be extremely large, which will become a bottleneck in equalizing the mounting points for each mounting block 120. On the other hand, by dividing and arranging these components for each mounting block 120, it is possible to adjust the mounting points for each mounting block 120, with each mounting point allocated to one mounting point. The first determination unit 210 classifies the multiple types of components based on, for example, the number of components (also referred to as the number of mounting points) used in mounting multiple types of boards.
[0064] The predetermined number may be determined arbitrarily and is not particularly limited.
[0065] Table 2 below shows group GA, which is an example of a multiple part group.
[0066] [Table 2]
[0067] Table 3 below shows an example of the number of nozzles 140 that can be attached to the head 130 provided in each mounting block 120 and the number of components when the components of group GA shown in Table 2 are placed in each mounting block 120.
[0068] [Table 3]
[0069] It is assumed that the components in group GA can be mounted on the board in each of the mounting blocks 120 with mounting block numbers 1 to 6, but cannot be mounted on the board in each of the mounting blocks 120 with mounting block numbers 7 and 8.
[0070] The mounting block number is a number (identifier) that is uniquely assigned to each of the multiple mounting blocks 120.
[0071] For example, the first determination unit 210 distributes the components belonging to group GA, which has 66 mounting points, to each of the mounting blocks 120 with mounting block numbers 1 to 6 that can mount the components, so that the number of components is the same in each mounting block 120. If the numbers allocated to each mounting block 120 are not uniform, the number of components may differ, such as by one, between each mounting block 120.
[0072] In this way, for example, the first determination unit 210 determines the allocation of components to the mounting blocks 120 (provisional component allocation) by allocating components by type (i.e., by mounting point unit) so that the number of components included in the majority component group is equal in each of the multiple mounting blocks 120.
[0073] If there are multiple multiple-component groups, the components may be distributed so that the total number of components in each mounting block 120 is the same for the multiple multiple-component groups.
[0074] Table 4 below shows groups GA and GB, which are examples of multiple component groups.
[0075] [Table 4]
[0076] Table 5 below shows an example of the number of nozzles 140 that can be attached to the head 130 provided in each mounting block 120, and the number of components when the components of groups GA and GB shown in Table 4 are allocated to each mounting block 120.
[0077] [Table 5]
[0078] It is assumed that the components in group GB can be mounted on the board in each of the mounting blocks 120 with mounting block numbers 1 to 6, but cannot be mounted on the board in each of the mounting blocks 120 with mounting block numbers 7 and 8.
[0079] For example, the first determination unit 210 distributes components belonging to group GA with a mounting point count of 66 and components belonging to group GB with a mounting point count of 42 to each of the mounting blocks 120 with mounting block numbers 1 to 6 that can mount these components, so that the number of components in each mounting block 120 is the same.
[0080] As shown in Table 5, only the components in group GA and the components in group B that belong to group GA may be allocated to the mounting blocks 120 with mounting block numbers 1 to 3, only the components in group GA and the components in group GB that belong to group GB may be allocated to the mounting blocks 120 with mounting block numbers 5 to 6, and both the components in group GA and the components in group GB may be allocated to the mounting block 120 with mounting block number 4. In this way, even if there are components in multiple component groups, the components may be allocated so that there are fewer mounting blocks 120 to which multiple types of components are allocated. Also, for example, in a component mounting line in which a board is moved in order from mounting block number 1 to mounting block number 8 and components are mounted, the components in group GA may be allocated in order starting from the upstream mounting block 120 (mounting block number 1 in this example), and the components in group GB may be allocated in order starting from the downstream mounting block 120 (mounting block number 6 in this example).
[0081] Other methods of classifying parts will be described below.
[0082] Another example of a classification method is a classification method for components that are mounted in extremely small numbers because the nozzles 140 used are limited. For example, a method of classifying components based on board type includes a method of classifying components that do not overlap with each board type, that is, components that are included in only one of multiple board types, into the same group. These component groups must be extracted and grouped in advance because they will inevitably be component types that will be mounted inefficiently when configuring the mounting turns for each board after being assigned to each mounting block 120.
[0083] For example, the first determination section 210 extracts, from among the multiple types of nozzles 140, nozzles 140 (also called isolated nozzles) that have components that can only be mounted by a specific (one type of) nozzle 140.
[0084] For example, the first determination unit 210 generates, for each type of component, an N-row, 1-column matrix (also referred to as a nozzle vector) in which 1 indicates that the component can be picked up by each of the extracted N types of nozzles 140, and 0 indicates that the component cannot be picked up. Next, the first determination unit 210 generates a co-occurrence matrix using the nozzle vector generated for each type of component.
[0085] FIG. 5A is a diagram showing a specific example of a co-occurrence matrix generated based on nozzle vectors.
[0086] The first determination unit 210 determines, as an isolated nozzle, a type of nozzle 140 for which only the diagonal elements of the generated co-occurrence matrix are 1. Furthermore, a component picked up by an isolated nozzle is also called an isolated component.
[0087] FIG. 5B shows an example of the type of component that can be picked up by a nozzle 140 with nozzle number 200, which is an example of an isolated nozzle. The nozzle number is a number (identifier) uniquely assigned to each type of nozzle 140. The Alloc Table contains values indicating whether the nozzle 140 with nozzle number 200 can be placed in each mounting block 120. For example, the Alloc Table corresponds to mounting block numbers 1 to 8, from left to right, and the numerical values indicate whether the corresponding type of nozzle 140 can be placed in the corresponding mounting block 120. For example, a value of "1" indicates placement is possible, and a value of "0" indicates placement is not possible. If there are restrictions on each mounting block 120 other than whether the nozzle 140 can be attached, the conditions are added to that mounting block 120. The feeder width is the width required when placing components in the component supply unit 150. The component supply unit 150 has a limit on the number of feeders that can be installed, and this is determined based on the total feeder width of the assigned components. The integrated value is the total feeder width required when placing components in the component supply unit 150.
[0088] In the example shown in Fig. 5B, nozzle 140 with nozzle number 200 can only pick up isolated components with component numbers 404, 405, 410, 1320, and 1322. Furthermore, each of these components can be placed on mounting block numbers 1 to 6, but cannot be placed on mounting block numbers 7 and 8. Note that a component number is a number (identifier) that is uniquely assigned to each type of component.
[0089] For example, the first determination unit 210 first extracts components (more specifically, isolated components) that can be picked up by an isolated nozzle (in this example, nozzle 140 with nozzle number 200). In this example, the first determination unit 210 extracts components with component numbers 404, 405, 410, 1320, and 1322.
[0090] Next, the first determination unit 210 calculates, for each board type, the ideal number of turns (the number of turns when the nozzles 140 of all heads 130 are fully loaded and each mounting block 120 is equalized), which is the value obtained by dividing the total number of components for that board type (also referred to as the number of mounting points for each board type) by the total number of nozzles 140 (86 in this example) used in the component mounting system 10. The total number of nozzles 140 used in the component mounting system 10 is, for example, arbitrarily determined in advance.
[0091] For example, if the total number of components for each board type is 688, 688, 516, 430, 430, and 602, respectively, the ideal number of turns for board type 0, board type 1, board type 2, board type 3, board type 4, and board type 5 are calculated as 8, 8, 6, 5, 5, and 7, respectively.
[0092] Next, the first determination unit 210 extracts, for each board type, components (also called remaining components) other than the components that can be mounted on the board within the calculated ideal number of turns, and expresses them in a matrix.
[0093] Table 6 below shows the remaining number of isolated components that can be picked up by nozzle 140 with nozzle number 200.
[0094] [Table 6]
[0095] For example, assuming that one component can be mounted per turn using nozzle 140 with nozzle number 200, the number of remaining components is calculated as shown in Table 6. The type of component to be mounted using nozzle number 200 is set on the vertical axis, and the number of remaining components for each board type is set on the horizontal axis. For example, the first determination unit 210 expresses the number of remaining components shown in Table 6 as a 5x6 matrix.
[0096] Next, when the isolated components are individually assigned to the mounting blocks 120, a turn will occur in which the nozzle 140 with nozzle number 200 is not used. For example, for board type 4, four components (part numbers 405, 404, 1322, and 1320) will have empty turns of 2, 2, 3, and 3 for an ideal turn of 5. To avoid this, the first determination unit 210 uses the matrix to classify the remaining components into one or more groups. For example, the first determination unit 210 classifies part number 410, which is included only in board type 1, into one group because there are no other isolated components. Also, for example, the first determination unit 210 classifies part numbers 405, 404, 1332, and 1320, which are included only in board type 4, into the same group. As a result, by attaching two nozzles 140 with nozzle number 200 to the head 130, mounting can be performed with an ideal turn of 5.
[0097] In this way, by grouping isolated components into the same group, it is possible to reduce the number of nozzles 140 (also called empty nozzles) that do not pick up components during turn processing.
[0098] Alternatively, for example, a method of classifying components based on board type is exemplified by a method of classifying overlapping components in each board type (that is, components included in multiple board types) into the same group.
[0099] For example, the first determination unit 210 first extracts components (more specifically, isolated components) that can be picked up by an isolated nozzle (in this example, nozzle 140 with nozzle number 180). In this example, it is assumed that the first determination unit 210 extracts components with part numbers 365, 335, 416, 250, and 1396.
[0100] Next, the first determination unit 210 calculates the ideal number of turns for each board type, as described above, and extracts remaining components, which are components other than those that can be mounted on the board within the calculated ideal number of turns, and expresses them in a matrix.
[0101] Table 7 below shows the remaining number of isolated components that can be picked up by nozzle 140 with nozzle number 200.
[0102] [Table 7]
[0103] For example, the first determination unit 210 classifies components with component numbers 365, 335, and 416 that are included in board type 0 and board type 1 into the same group. Also, for example, the first determination unit 210 classifies component number 250 that is included only in board type 2 into one group. Also, for example, the first determination unit 210 classifies component number 1396 that is included only in board type 5 into one group.
[0104] As described above, empty nozzles can be minimized by grouping isolated components together.
[0105] The method for determining groups for multiple types of parts is not limited to the above. For example, the first determination unit 210 extracts parts that are not classified into groups using the above classification method. For example, the first determination unit 210 classifies parts of types corresponding to the same part code into the same group. Here, for example, the size of the component supply unit 150 occupied by a group (more specifically, the size of the feeder provided in the component supply unit 150, also referred to as the required feeder width) is set to the sum of the required feeder widths occupied by the parts belonging to the group. Information indicating the required feeder width for each part is stored in advance in the storage unit 250, for example.
[0106] For example, the first determination section 210 classifies components whose mounting point counts differ greatly between board types (different board type distributions) into the same group.
[0107] FIG. 6 is a diagram showing an example of processing in which the component mounting system 10 according to the embodiment groups a plurality of types of components.
[0108] In the example shown in FIG. 6, the groups to which the multiple types of components belong are determined based on the number of each type of component for each board type.
[0109] For example, in the example shown in Figure 6, board type 1 is a set of components for mounting 30 components of type PA, 100 components of type PB, 0 components of type PC, 0 components of type PD, 23 components of type PE, 10 components of type PF, and 5 components of type PG on a certain type of board.
[0110] Here, the component codes corresponding to types PB, PC, and PD are the same, and when the numbers of components of types PB, PC, and PD for board type 1, board type 2, and board type 3 are added together, the number of components for board type 1, board type 2, and board type 3 is approximately the same at around 100. Therefore, the first determination unit 210 classifies, for example, components of type PB, components of type PC, and components of type PD into the same group.
[0111] Similarly, for example, if the component codes corresponding to types PE, PF, and PG are the same, and the numbers of components of types PE, PF, and PG are added up for board type 1, board type 2, and board type 3, respectively, the number of components for board type 1, board type 2, and board type 3 is roughly the same, at around 35 to 40. Therefore, the first determination unit 210 classifies, for example, components of type PE, components of type PF, and components of type PG into the same group.
[0112] In this way, for example, the first determination unit 210 classifies components into the same group when the total number of components on multiple board types is approximately the same. More specifically, the first determination unit 210 classifies components that have the same component code, a large number of mounting points, have not yet been classified into a group, and have different distributions of mounting points among board types into the same group so that the number of mounting points is equalized among the board types.
[0113] Note that the term "similar" here does not only mean that the number of parts is exactly the same, but also means that the number of parts differs by, for example, 5% to 10%.
[0114] Furthermore, a component with a large number of mounting points here refers to a component that does not have enough mounting points to be classified into a large component group, but has a number of mounting points equal to or greater than a predetermined threshold value.
[0115] Alternatively, the first determination section 210 classifies, for example, components that have a small number of mounting points within a board type and for which the number of nozzles 140 that can pick them up is limited, into the same group.
[0116] FIG. 7 is a diagram showing an example of processing in which the component mounting system 10 according to the embodiment groups a plurality of types of components.
[0117] In the example shown in FIG. 7, the groups to which the multiple types of components belong are determined based on the types of components that can be picked up by the nozzles 141 to 146 attached to the head 130.
[0118] In the example shown in FIG. 7, nozzles 141, 142, 143, and 144 can pick up components of type PA, nozzle 145 can pick up components of type PB, and nozzle 146 can pick up components of types PC0, PC1, PC2, and PC3.
[0119] Here, the total number of components used in the component mounting system 10 is assumed to be 40 components of type PA, 9 components of type PB, 3 components of type PC0, 2 components of type PC1, 3 components of type PC2, and 1 component of type PC3. In this case, if each of the nozzles 141-146 picks up as many components as possible and mounts them on the board, 10 turns are required for the components of type PA, 9 turns for the components of type PB, and a total of 9 turns are required for the components of types PC0, PC1, PC2, and PC3. Therefore, the first determination unit 210 classifies the components of types PC0, PC1, PC2, and PC3 into the same group so that the number of turns is approximately the same as the number of turns required to mount other components of types PA and PB that are picked up by the same nozzle 146 (i.e., have the same component code) and mounted using the same head 130.
[0120] The term "similar" as used herein does not only mean that the number of turns is completely the same, but also means that the number of turns differs by, for example, 5% to 10%.
[0121] As described above, the first determination unit 210 classifies, into the same group, for example, components that have the same component code, a small number of mounting points, have not yet been classified into a group, have a similar distribution of mounting points among board types, and are included in the same board type, so that the number of turns does not exceed the ideal number of turns for the same board type and is close to the ideal number of turns.
[0122] Referring again to FIG. 4, after step S120, the first determination section 210 determines a tentative target number, which is the number of components to be placed on each mounting block 120 (S130).
[0123] First, the first determination unit 210 calculates the total number of turns for each mounting block 120. The total number of turns for each mounting block 120 is, for example, the total number of components used in the component mounting system 10 (the total number of components mounted on all types of boards to be produced) divided by the total number of nozzles 140 used in the component mounting system 10 (that is, the total number of nozzles 140 provided in the mounting unit 100).
[0124] Next, the first determination unit 210 calculates the product of the total number of turns and the total number of nozzles 140 attached to the head 130 of each mounting block 120 as a tentative target number for each mounting block 120.
[0125] Referring again to FIG. 4, after step S130, the first determination unit 210 determines component allocation (initial component allocation) for each group (S140). For example, the first determination unit 210 arranges each group in order, excluding groups with a large number of components, based on various conditions, such as (i) a small number of mountable heads 130, such as a group containing single-cord components, (ii) a large feeder width required for components belonging to the group, and (iii) a large number of mounting points. For example, the first determination unit 210 arranges each group in order based on the above condition (i). Next, the first determination unit 210 changes the arrangement of each group to the order based on the above condition (ii). Next, the first determination unit 210 further rearranges the changed arrangement of each group to the order based on the above condition (iii), thereby determining the arrangement of each group.
[0126] The first determination unit 210 determines the initial component allocation by determining the mounting blocks 120 to which the components belonging to the groups are allocated, starting from the first group in the determined arrangement. For example, the first determination unit 210 determines the allocation of the components belonging to each group to the mounting block 120 with the lowest fill rate among the mounting blocks 120.
[0127] In this way, for example, the first determination unit 210 determines the tentative component allocation by grouping multiple types of components into multiple groups based on the code information and determining mounting blocks 120 to allocate the components to each of the multiple groups. Specifically, for example, the first determination unit 210 calculates a tentative target number for the number of components to be allocated to each of the multiple mounting blocks 120 based on the total number of components to be mounted on multiple types of boards, and determines the tentative component allocation by changing the components to be allocated to each of the multiple mounting blocks 120 so that the number of components allocated to each of the multiple mounting blocks 120 approaches the tentative target number.
[0128] The fulfillment rate of each mounting block 120 is, for example, the total number of components already placed divided by the tentative target number for each mounting block 120.
[0129] Next, the first determination unit 210 performs a component movement process for each group (S150). For example, the first determination unit 210 moves the components to be allocated for each group from the mounting block 120 with the highest fulfillment rate to the mounting block 120 with the lowest fulfillment rate. For example, the first determination unit 210 repeats this process a specified number of times, and if the number of mounting points in each mounting block 120 decreases, adopts that component allocation.
[0130] It should be noted that the first determination section 210 does not change the mounting block 120 to which components belonging to a majority component group are allocated, for example.
[0131] Furthermore, the first determination unit 210, for example, repeats the process of moving components for each group a specified number of times, and if the number of mounting points in each mounting block 120 does not decrease, it does not adopt that component allocation and instead adopts the initial component allocation determined in step S140.
[0132] Next, the first determination unit 210 performs a component replacement process for each group (S160). For example, the first determination unit 210 replaces the components assigned to each group in the component allocation adopted in step S140, from the mounting block 120 with the highest fulfillment rate to the mounting block 120 with the lowest fulfillment rate. Here, the groups to be replaced are groups with the same required feeder width. The first determination unit 210 repeats this process a specified number of times, and if the number of mounting points in each mounting block 120 decreases, adopts the component allocation.
[0133] It should be noted that the first determination section 210 does not change the mounting block 120 to which components belonging to a majority component group are allocated, for example.
[0134] Furthermore, the first determination unit 210, for example, repeats the process of replacing components for each group a specified number of times, and if the number of mounting points in each mounting block 120 does not decrease, it does not adopt that component allocation, but instead adopts the component allocation adopted in step S150.
[0135] As a result, the first determination unit 210 determines the parts allocation adopted in step S160 as the tentative parts allocation.
[0136] Next, the second determination unit 220 determines component allocation based on the tentative component allocation determined by the first determination unit 210. Specifically, the second determination unit 220 determines a common component allocation when mounting components on each of multiple types of boards by changing the component allocation of the tentative component allocation based on the type of board used in the component mounting system 10. More specifically, the second determination unit 220 determines a common component allocation when mounting components on each of multiple types of boards by executing a process for changing the allocation of components to be mounted on each board for each type of board.
[0137] After step S160, the second determination section 220 determines a target number, which is the number of components to be allocated to the mounting block 120 (S170).
[0138] The second determination section 220 calculates, for each type of board, the target number of components to be allocated to each mounting block 120 and the target number of turns in each mounting block 120, for example, by performing the following calculations.
[0139] (Total CPH)=(Total CPH of each mounting block 120) Equation (1) (Contribution rate of mounting block 120)=(CPH of mounting block 120) / (Total CPH) Equation (2) (Target mounting points of mounting block 120)=(Total number of mounting points of mounting block 120)×(Contribution rate of mounting block 120) Equation (3) (Target number of turns of mounting block 120)=ROUNDUP((Target mounting points of mounting block 120) / (Number of nozzles of mounting block 120), 0) Equation (4)
[0140] The CPH of the mounting block 120 is the number of components that can be mounted in each mounting block 120 per hour.
[0141] FIG. 8 is a diagram showing an example of the target number in each mounting block 120 for each type of board.
[0142] 8, for example, in each of the mounting blocks 120 with mounting block numbers 1 to 8, the CPH of each mounting block 120 is calculated from the above formula as follows: 75000, 75000, 75000, 75000, 40000, 40000, 15000, and 15000. Also, for example, in each of the mounting blocks 120 with mounting block numbers 1 to 8, the contribution rates of each mounting block 120 are calculated from the above formula as follows: 0.18, 0.18, 0.18, 0.18, 0.10, 0.10, 0.04, and 0.04. For example, in each of the mounting blocks 120 with mounting block numbers 1 to 8, the target numbers of components to be mounted on a type SA board are calculated from the above formula as follows: 128, 128, 128, 128, 68, 68, 26, and 26.
[0143] Referring again to FIG. 4, after step S170, the second determination section 220 performs a repeated process of moving the corresponding components for each type of board (S180).
[0144] Next, the second determination unit 220 performs a repeat process of replacing corresponding components for each type of board (S190).
[0145] As a result, the second determination unit 220 determines a common component allocation when mounting components on each of the multiple types of boards. Specifically, for example, the second determination unit 220 calculates a target number for the number of components to be allocated to each of the multiple mounting blocks 120 based on the number of components to be mounted on each of the multiple types of boards, and determines the component allocation by changing the components to be allocated to each of the multiple mounting blocks 120 so that the number of components to be allocated to each of the multiple mounting blocks 120 approaches the target number.
[0146] Next, the third determining section 230 determines the component placement for each mounting block based on the component allocation determined by the second determining section 220 (S200).
[0147] 9 is a flowchart showing details of the repetitive process of component movement in the component mounting system 10 according to the embodiment. Specifically, Fig. 9 is a flowchart showing details of step S180 shown in Fig. 4.
[0148] The second determination unit 220 calculates, for example, for each type of board, a component allocation such that components of a type with fewer mounting points are moved from the mounting block 120 with the largest number of mounting points to other mounting blocks 120 so that the maximum execution number of mounting points of each mounting block 120 becomes smaller (S181). Note that in this process, the second determination unit 220 does not, for example, target components that belong to a majority component group for movement.
[0149] Here, the number of implemented components R(l, t) (unit: time) is calculated by the following formula, for example.
[0150] R(l, t)=(number of mounting points in mounting block 120 of mounting block number t for board type l) / (mounting speed (CPH) in mounting block 120 of mounting block number t) Equation (5)
[0151] Next, the second determination unit 220 moves mounting points within the component type of the majority component group of the mounting block 120 to which the components included in the majority component group are allocated so that the number of components allocated to each of the multiple mounting blocks 120 approaches the target number for the component allocation calculated in step S181 (S182). In this way, the second determination unit 220 uses the components belonging to the majority component group to level out the number of components allocated to each mounting block 120.
[0152] Next, the second determination unit 220 determines the configuration of the nozzles 140 to be arranged in the head 130 (S183). For example, first, the second determination unit 220 creates a co-occurrence matrix for each mounting block 120 for each type of board. For example, the second determination unit 220 creates a nozzle vector that is 1 if a nozzle 140 that can mount the component can be arranged for each type of component in the mounting block 120, and 0 if not. Next, the second determination unit 220 selects the vector with the smallest number of mounting points from the created nozzle vectors, that is, the nozzle 140 with the fewest number of mounting points (also referred to as the seed nozzle), and determines a nozzle group such that nozzles related to the seed nozzle are grouped together.
[0153] FIG. 10 is a diagram showing an example of a nozzle vector.
[0154] For example, the second determination unit 220 selects the nozzle 140 with nozzle number 140 as the nozzle 140 of the vector with the smallest number of mounting points, and determines this nozzle 140 to belong to one group. Next, the second determination unit 220 selects the nozzle 140 with nozzle number 130 as the nozzle 140 with the next fewest number of mounting points, and determines this nozzle 140 to belong to the same group as nozzle number 240 that is related to this nozzle 140, for example, capable of picking up common components. Next, the second determination unit 220 selects the nozzle 140 with nozzle number 115 as the nozzle 140 with the next fewest number of mounting points, and determines this nozzle 140 to belong to the same group as nozzle numbers 120 and 235 that are related to this nozzle 140, for example, capable of picking up common components. In this way, the second determination unit 220 classifies each nozzle 140 so that each nozzle 140 belongs to one of the groups. Next, the second determination unit 220 determines the nozzle 140 in each nozzle group that can mount the largest number of components as the representative nozzle. Next, the second determination unit 220 adds nozzles 140 so that all nozzles 140 can pick up components and mount them on the board in the same turn. For example, the second determination unit 220 determines the configuration of the nozzles 140 (the type of nozzles to be used and the number of nozzles) so that more components can be picked up in one turn. In other words, the second determination unit 220 determines the component allocation by, for example, changing the provisional component allocation for each of multiple types of boards so as to reduce the number of times that a turn process is performed without at least one of the one or more nozzles 140 attached to the head 130 provided in at least one mounting block 120 picking up a component.
[0155] Next, the second determination unit 220 determines the turn configuration for the determined nozzle configuration, i.e., the components to be mounted in each turn, and calculates the total takt time for each mounting block 120 for each type of board for the determined turn configuration (S184).
[0156] For example, the takt time of each mounting block 120 may be calculated by counting the nozzles 140 that do not pick up components in the turn process as part of the number of mounting points performed.
[0157] The second determination section 220 repeats steps S181 to S184 a predetermined number of times to determine the component allocation that minimizes the total takt time (S185).
[0158] 11 is a flowchart showing the repeated process of replacing components in the component mounting system 10 according to the embodiment. Specifically, Fig. 11 is a flowchart showing the details of step S190 shown in Fig. 4.
[0159] For example, for each type of board, the second determination unit 220 exchanges the mounting blocks 120 to be allocated, so that the maximum number of executable mounting points for each mounting block 120 is reduced, by removing components of a type with fewer mounting points from the mounting block 120 with the component supply unit 150 of the mounting block 120 having the same feeder width as the component supply unit 150 of the mounting block 120 (S191). Note that in this process, the second determination unit 220 does not, for example, target components that belong to a majority component group for movement.
[0160] Next, the second determination section 220 executes the processes of steps S182 to S185 described above on the component allocation calculated in step S191, thereby determining the component allocation that minimizes the total takt time.
[0161] As a result, the second determination section 220 determines a common component allocation when mounting components on each of a plurality of types of boards.
[0162] Based on the components allocated to each mounting block 120, the third determination unit 230 determines the component placement in each mounting block 120 (specifically, the final mounting positions of the components to be mounted by the component supply unit 150), the mounting positions of the nozzles 140 on the head 130 for picking up and mounting the components, and the mounting order of the components. The output unit 240, for example, outputs component placement information indicating the component placement thus determined to a display device such as a display (not shown). The user, for example, checks the component placement indicated by the component placement information displayed on the display device and places the components in each mounting block 120 in accordance with the component placement. Furthermore, for example, the output unit 240 outputs the component placement information to the mounting control unit 160. The mounting control unit 160 mounts the components on the board by controlling each mounter 110 based on the component placement information.
[0163] [Effects, etc.] As described above, the component mounting method according to the embodiment is a component mounting method for mounting one or more types of components from among a plurality of types of components onto a plurality of types of boards, each of which has a different type of component to be mounted thereon. The component mounting method includes a component placement determination step (S10) for determining a common component placement for mounting components onto each of a plurality of types of boards by assigning components to a plurality of mounting blocks 120, each of which is provided with a head 130 to which one or more types of nozzles 140 from a plurality of types of nozzles 140 capable of picking up different types of components are attached, and a mounting step (S20) for mounting the components assigned to each of the plurality of mounting blocks 120 according to the type of board, onto the board, in each of the plurality of mounting blocks 120, in which the components have been placed in the component placement determined based on the component placement. In the component placement determination step, the component placement is determined based on code information indicating a correspondence between the type of head 130 provided in each of the plurality of mounting blocks 120 and the type of component that can be mounted on the board using the head 130.
[0164] According to this, when calculating the component layout, component allocation is determined based on code information that does not include information regarding the type of nozzle 140, and the component layout in each mounting block 120 can be determined based on the determined component allocation. Therefore, compared to when the component layout is determined based on information that includes information regarding the type of nozzle 140, the amount of combination processing required to determine the component layout can be reduced.
[0165] Also, for example, the component placement determination step includes a first determination step (e.g., steps S110 to S160) of determining a provisional component allocation for multiple types of components by treating multiple types of boards as a single board based on code information, and a second determination step (e.g., steps S170 to S190) of determining the component allocation by changing the allocation of one or more components in the provisional component allocation based on the types of the multiple types of boards.
[0166] According to this, the final component placement is determined based on the type of board, so that the component placement can be determined so as to shorten the takt time.
[0167] Also, for example, in the first determination step, multiple types of components are grouped into multiple groups based on code information (e.g., step S120), and a mounting block 120 to which the components are allocated for each of the multiple groups is determined, thereby determining a provisional component allocation (e.g., step S140).
[0168] This allows a rough allocation of parts for each group to be determined, further reducing the amount of processing required to determine the final part placement.
[0169] Furthermore, for example, the plurality of groups includes a large-component group that is made up of only component types in which the number of components mounted on the plurality of types of boards is equal to or greater than a predetermined number.
[0170] According to this, even after rough component allocation has been determined, the placement of components belonging to a multiple component group can be changed for each mounting point within that multiple component group, making it easy to fine-tune the component allocation to each mounting block 120.
[0171] Also, for example, in the first determination step, the provisional component allocation is determined by allocating components by type (i.e., by mounting point unit) so that the number of components included in the majority component group is equal in each of the multiple mounting blocks 120.
[0172] This makes it possible to adjust the variation in mounting time for each mounting block 120. Therefore, in a configuration such as a component mounting line in which a plurality of mounting blocks 120 are arranged in series, it is possible to prevent a situation in which only some of the mounting blocks 120 require a long mounting time, resulting in a long total takt time.
[0173] Also, for example, in the first determination step, a tentative target number of components to be allocated to each of the multiple mounting blocks 120 is calculated based on the total number of components to be mounted on multiple types of boards (e.g., S130), and the tentative component allocation is determined by changing the components to be allocated to each of the multiple mounting blocks 120 so that the number of components to be allocated to each of the multiple mounting blocks 120 approaches the tentative target number.
[0174] Also, for example, in the second determination step, a target number of components to be allocated to each of the multiple mounting blocks 120 is calculated based on the number of components to be mounted on each of the multiple types of boards (e.g., step S170), and the component allocation is determined by changing the components to be allocated to each of the multiple mounting blocks 120 so that the number of components allocated to each of the multiple mounting blocks 120 approaches the target number (e.g., steps S180 and S190).
[0175] According to these, the variation in mounting time for each mounting block 120 can be appropriately reduced.
[0176] Also, for example, in the mounting step, a turn process is performed in at least one of the multiple mounting blocks 120 to mount the components on the board, thereby mounting the components on the board, and in the second determination step, the component allocation is determined by changing the provisional component allocation for each of the multiple types of boards (for example, step S183) so as to reduce the number of times the turn process is performed without at least one of the one or more nozzles 140 attached to the head 130 provided in at least one mounting block 120 picking up a component.
[0177] This allows the number of components that can be mounted in each turn to be increased, making it easier to determine the final component placement that shortens the takt time.
[0178] Furthermore, the component mounting system 10 according to the embodiment is a component mounting system that mounts one or more types of components from a plurality of types of components onto a plurality of types of boards on which the types of components to be mounted differ from one another, and includes a component placement determination unit 200 that determines a common component placement when mounting components on each of the plurality of types of boards by allocating components to a plurality of mounting blocks 120 each provided with a head 130 to which one or more types of nozzles 140 from a plurality of types of nozzles 140 that can pick up different types of components from one another are attached, and a mounting unit 100 that mounts components onto the boards in the plurality of mounting blocks 120 in which the components are placed in a component placement determined based on the component placement, and the component placement determination unit 200 determines the component placement based on code information that indicates the correspondence between the type of head 130 provided in each of the plurality of mounting blocks and the type of component that can be mounted on the board using the head 130.
[0179] This provides the same effects as the component mounting method according to the embodiment.
[0180] (Other embodiments) Although the component mounting system according to the present embodiment has been described above based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments.
[0181] For example, in the above embodiment, the component mounting system 10 includes four mounters 110, each of which has two mounting blocks 120. The component mounting system may include multiple mounting blocks, and may include one mounter with two or more mounting blocks, or multiple mounters with one mounting block. In other words, the component mounting system may be realized with one mounter, or may be realized as a component mounting line including multiple mounters.
[0182] Furthermore, for example, the mounting control unit 160 and the component placement determination unit 200 may be realized by one computer.
[0183] Also, for example, in the above embodiment, all or some of the components of component placement determination unit 200 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or semiconductor memory.
[0184] Furthermore, the components of the component placement determination section 200 may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.
[0185] Furthermore, for example, the component mounting system 10 may be realized as a client-server system. For example, information indicating the component placement determined by the component placement determination unit 200 may be provided to the mounting unit 100 as a cloud service.
[0186] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the present invention. [Industrial Applicability]
[0187] The present invention can be used in a mounting apparatus that mounts components on a board. [Explanation of symbols]
[0188] 10 Component Mounting System 21, 22, 23 PCB 31, 32, 33, 34, 35, 36, 37, 38 parts 100 Mounting section 110 Mounting machine 120 Mounting Blocks 130 head 140, 141, 142, 143, 144, 145, 146 nozzles 150 Parts Supply Department 160 Mounting control section 200 Part placement determination unit 210 First Decision Section 220 Second Decision Section 230 Third Decision Section 240 Output section 250 Storage section
Claims
1. A component mounting method for mounting one or more types of components from a plurality of types of components onto a plurality of types of boards on which the types of components to be mounted differ from one another, comprising: a component placement determination step of determining a common component placement when mounting components on each of the plurality of types of boards by assigning components to a plurality of mounting blocks each having a head equipped with one or more types of nozzles among a plurality of types of nozzles capable of picking up different types of components; a mounting step of mounting, on a board, the components arranged in each of the plurality of mounting blocks in accordance with the component arrangement determined based on the component allocation, in accordance with the type of board; In the component placement determination step, the component allocation is determined based on code information indicating a correspondence relationship between the type of head provided in each of the plurality of mounting blocks and the type of component that can be mounted on a board using the head. Component mounting method.
2. The component placement determination step includes: a first determination step of determining a provisional component allocation of the plurality of types of components for the plurality of types of boards as one board based on the code information; a second determination step of determining the component allocation by changing the allocation of one or more components in the temporary component allocation based on the types of the plurality of types of boards. The component mounting method according to claim 1 .
3. In the first determining step, grouping the plurality of types of parts into a plurality of groups based on the code information; The temporary component allocation is determined by determining a mounting block to which the components are allocated for each of the plurality of groups. The component mounting method according to claim 2 .
4. The plurality of groups includes a multi-component group consisting of only component types in which the number of components mounted on the plurality of types of boards is equal to or greater than a predetermined number. The component mounting method according to claim 3 .
5. In the first determination step, the provisional component allocation is determined by allocating components by type so that the number of components included in the majority component group is equal in each of the plurality of mounting blocks. The component mounting method according to claim 4.
6. In the first determining step, calculating a tentative target number of components to be allocated to each of the plurality of mounting blocks based on the total number of components to be mounted on the plurality of types of boards; The provisional component allocation is determined by changing the components allocated to each of the plurality of mounting blocks so that the number of components to be placed in each of the plurality of mounting blocks approaches the provisional target number. The component mounting method according to any one of claims 2 to 5.
7. In the second determining step, calculating a target number of components to be allocated to each of the plurality of mounting blocks based on the number of components to be mounted on each of the plurality of types of boards; The component allocation is determined by changing the components to be arranged in each of the plurality of mounting blocks so that the number of components allocated to each of the plurality of mounting blocks approaches the target number. The component mounting method according to any one of claims 2 to 6.
8. In the mounting step, a turning process is performed in at least one of the plurality of mounting blocks to mount the component on the board, thereby mounting the component on the board; In the second determination step, the component allocation is determined by changing the tentative component allocation so as to reduce the number of times the turning process is performed without at least one of the one or more nozzles attached to a head provided in the at least one mounting block picking up a component, for each of the plurality of types of boards. The component mounting method according to any one of claims 2 to 7.
9. A component mounting system that mounts one or more types of components from a plurality of types of components onto a plurality of types of boards on which the types of components to be mounted differ from one another, a component placement determination unit that determines a common component allocation when mounting components on each of the plurality of types of boards by allocating components to a plurality of mounting blocks each having a head to which one or more types of nozzles out of a plurality of types of nozzles capable of suctioning different types of components are attached; a mounting unit that mounts, on a board, the components allocated to the mounting block in accordance with the type of board, in each of the plurality of mounting blocks in which components are arranged in a component arrangement determined based on the component allocation, The component placement determination unit determines the component allocation based on code information indicating a correspondence between the type of head provided in each of the plurality of mounting blocks and the type of component that can be mounted on a board using the head. Component mounting system.
Citation Information
Patent Citations
Component installing wire
CN102958343A
Optimization apparatus, mounting apparatus and electronic part mounting system
CN1596567A
Method and device for allocating part mounting work
JP1995060579A
Optimizing device, mounting device and electronic part mounting system
JP2003174299A
Component mounting line
JP2013038335A