Semiconductor packages, electronic devices

Abstract

The present technology relates to: a semiconductor package which has achieved higher reliability by having a configuration that absorbs the thermal expansion coefficient difference between a substrate and a cover glass, thereby being capable of suppressing deterioration of the characteristics; and an electronic device. This semiconductor package is provided with a substrate, a chip that is arranged on the substrate, a frame body that is arranged on the substrate so as to surround the chip, and a cover glass that is arranged on the frame body; and the frame body is formed of a composition that contains two or more materials. In addition, the frame body has a configuration that has a cavity, and a portion of the cavity on the substrate side and a portion of the cavity on the cover glass side are different from each other in size. The present technology is able to be applied, for example, to a semiconductor package which comprises an imaging element as a chip.

Description

[Technical Field]

[0001] The present technology relates to a semiconductor package and an electronic device, and more particularly to a semiconductor package and an electronic device that are suitable for application to, for example, a semiconductor package that includes an optical element. [Background technology]

[0002] BACKGROUND ART Packages used for optical devices incorporating optical elements such as image pickup elements such as CCDs (Charged-Coupled Devices) and CMOSs ​​(Complementary Metal-Oxide Semiconductors), light-receiving elements such as PDs (Photo Diodes), MEMS (Micro Electro Mechanical Systems) elements such as optical switches and mirror devices, and light-emitting elements such as laser diodes (LDs; Laser Diodes), LEDs (Light Emitting Diodes), and vertical cavity surface emitting lasers (VCSELs; Vertical Cavity Surface Emitting Lasers) are made of resin and / or metal package frames and a cover glass as a light-transmitting member that covers the opening of the package frame.

[0003] For example, an optical device having a hollow structure for mounting an optical element is manufactured by mounting an optical element on a package substrate, then mounting a package frame, and bonding a cover glass to the top surface of the package. It has been proposed to configure this package frame to prevent flare due to wire bonding, to have fastening holes for fastening to a housing, or to function as a heat dissipation path (see, for example, Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-217021 [Patent Document 2] International Publication No. 2017 / 090223 [Patent Document 3] Japanese Patent Application Laid-Open No. 2013-222772 Summary of the Invention [Problem to be solved by the invention]

[0005] Conventional package frames have been primarily made of resin, metal, or a combination of these materials, but because the coefficients of thermal expansion (CTE) of the package substrate, optical element, package frame, and cover glass differ, there is a risk of the cover glass cracking, peeling, or warping.

[0006] If warping becomes significant, for example, when a CMOS image sensor is used as the optical element, the resolution may decrease and the effective pixel area may become narrower. It is therefore desirable to prevent cracking, peeling, warping, and other problems in the cover glass caused by differences in thermal expansion coefficients.

[0007] The present technology has been made in view of such circumstances, and is intended to make it possible to prevent the cover glass from cracking, peeling, warping, and the like. [Means for solving the problem]

[0009] One aspect of this technology of The semiconductor package includes a substrate, a chip disposed on the substrate, a frame disposed on the substrate so as to surround the chip, and a cover glass disposed on the frame. a side wall having no cavity on the chip side of the frame; The frame body is configured to have a cavity, and the cavity is configured to have different sizes on the substrate side and the cover glass side.

[0011] One aspect of this technology of The electronic device includes a substrate, an imaging element disposed on the substrate, a frame disposed on the substrate so as to surround the imaging element, and a cover glass disposed on the frame. a side wall of the frame body on the imaging element side that does not have a cavity;The frame is configured to have a cavity, and the cavity is configured to have different sizes on the substrate side and the cover glass side.

[0013] One aspect of this technology of A semiconductor package includes a substrate, a chip disposed on the substrate, a frame disposed on the substrate so as to surround the chip, and a cover glass disposed on the frame. The frame has a side wall on the chip side that does not have a cavity. The frame is configured to have a cavity, and the cavity is configured to have different sizes on the substrate side and the cover glass side.

[0015] One aspect of this technology of The electronic device includes a substrate, an imaging element disposed on the substrate, a frame disposed on the substrate so as to surround the imaging element, and a cover glass disposed on the frame. a side wall of the frame body on the imaging element side that does not have a cavity; The frame is provided with a processing unit that processes signals from the imaging element, and the frame has a cavity, the cavity having different sizes on the substrate side and the cover glass side. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a plan view showing a configuration of an embodiment of a semiconductor package to which the present technology is applied. [Figure 2] FIG. 1 is a diagram illustrating an example of a cross-sectional configuration of a semiconductor package. [Figure 3] FIG. 10 is a diagram illustrating an example of the configuration of a frame body. [Figure 4] FIG. 10 is a diagram illustrating an example of a cross-sectional configuration of a semiconductor package according to a second embodiment. [Figure 5] FIG. 1 is a diagram illustrating an example of the configuration of a three-dimensional structure. [Figure 6] FIG. 2 is a diagram illustrating an example of the configuration of a frame body. [Figure 7] FIG. 10 is a diagram illustrating an example of a cross-sectional configuration of a semiconductor package according to a third embodiment. [Figure 8] FIG. 10 is a diagram illustrating an example of a cross-sectional configuration of a semiconductor package according to a fourth embodiment. [Figure 9]FIG. 13 is a diagram illustrating an example of a cross-sectional configuration of a semiconductor package according to a fifth embodiment. [Figure 10] 1A to 1C are diagrams for explaining a manufacturing process of a semiconductor package. [Figure 11] 10A to 10C are diagrams for explaining other manufacturing processes of a semiconductor package. [Figure 12] FIG. 1 illustrates an example of an electronic device. [Figure 13] FIG. 1 is a diagram illustrating an example of use of an imaging device. [Figure 14] FIG. 1 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system. [Figure 15] FIG. 2 is a block diagram showing an example of the functional configuration of a camera head and a CCU. [Figure 16] 1 is a block diagram showing an example of a schematic configuration of a vehicle control system; [Figure 17] FIG. 2 is an explanatory diagram showing an example of the installation positions of an outside-vehicle information detection unit and an imaging unit. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described.

[0018] First Embodiment The technology described below can be applied to semiconductor packages including chips of imaging elements such as CCDs (Charged-Coupled Devices) and CMOSs ​​(Complementary Metal-Oxide Semiconductors), as well as semiconductor packages including chips of optical elements such as light-receiving elements such as PDs (Photo Diodes), MEMS (Micro Electro Mechanical Systems) elements such as optical switches and mirror devices, and light-emitting elements such as laser diodes (LDs; Laser Diodes), LEDs (Light Emitting Diodes), and vertical cavity surface-emitting lasers (VCSELs).

[0019] In the following description, a semiconductor package including an imaging element as a chip will be taken as an example. Fig. 1 is a plan view showing a configuration example of a semiconductor package 11a according to a first embodiment, and Fig. 2 is a cross-sectional view of the semiconductor package 11a taken along line AB in Fig. 1.

[0020] In the semiconductor package 11a, the chip of the imaging element 21 is disposed approximately in the center of the substrate 23. The substrate 23 and the imaging element 21 are electrically connected via bonding wires 22 and bonding pads (not shown). A frame 24a is disposed so as to surround the sides of the imaging element 21. The frame 24a is disposed on the substrate 23. A cover glass 25 (not shown in FIG. 1) is mounted on the frame 24a.

[0021] The imaging element 21 is disposed in a space surrounded by the substrate 23, the frame 24a, and the cover glass 25. While FIGS. 1 and 2 show an example in which the frame 24a is formed to a position roughly equivalent to the side surface of the substrate 23 and the side surface of the cover glass 25, it may be formed to a size that protrudes outward beyond the substrate 23 and the cover glass 25. A fastening hole may be provided in the protruding frame 24a so that the frame 24a is fastened to the housing. A configuration in which heat is dissipated from the protruding frame 24a may also be used.

[0022] The bonding wire 22 may be enclosed within the frame 24a, thereby suppressing flare that may occur due to light being reflected by the bonding wire 22. Other components may be mounted on the substrate 23.

[0023] The substrate 23 and the frame 24a are bonded together with a predetermined adhesive, etc. The frame 24a and the cover glass 25 are also bonded together with a predetermined adhesive, etc. The substrate 23 is, for example, an organic substrate or a ceramic substrate.

[0024] As described above, the substrate 23 and the frame 24a, and the frame 24a and the cover glass 25 are bonded together with an adhesive. When the semiconductor package 11a is exposed to heat, the cover glass 25 may crack, peel off, or warp due to differences in the coefficient of thermal expansion (CTE) of the substrate 23, the frame 24a, and the cover glass 25. If the warping of the cover glass 25 becomes significant, the resolution may decrease and the effective pixel area may become narrower.

[0025] The frame 24a is configured to absorb the difference in thermal expansion coefficient between the substrate 23 and the cover glass 25. The configuration of the frame 24a will be explained with reference to Fig. 3. In the figure, the lower side is the substrate 23 side, and the upper side is the cover glass 25 side.

[0026] The frame 24a is formed using a plurality of materials, with the compositions of the plurality of materials varying depending on the region. In Fig. 3, an example will be described in which the frame 24a is divided into five regions, region a, region b, region c, region d, and region e, in that order from the substrate 23 side. Each region has a different mixing ratio of the different materials. Here, a material having a thermal expansion coefficient close to that of the material of the substrate 23 is referred to as material A, and a material having a thermal expansion coefficient close to that of the cover glass 25 is referred to as material B.

[0027] The frame 24a is configured so that the mixing ratio of material A is higher on the side of the frame 24a closer to the substrate 23 side, and the mixing ratio of material B is higher on the side of the frame 24a closer to the cover glass 25 side.

[0028] For example, the mixing ratio of material A to material B is material A:material B = 100:0 in region a, material A:material B = 75:25 in region b, material A:material B = 50:50 in region c, material A:material B = 25:75 in region d, and material A:material B = 0:100 in region e.

[0029] The mixing ratios shown here are merely examples and are not limiting. Here, it is described that material A is a material having a thermal expansion coefficient close to that of the material of substrate 23, and material B is a material having a thermal expansion coefficient close to that of the material of cover glass 25. However, for example, the mixing ratio may be set so that the thermal expansion coefficient when materials A and B are mixed at a predetermined mixing ratio is close to that of substrate 23, and materials A and B mixed at such a mixing ratio may be arranged on the substrate 23 side (region a).

[0030] Similarly, for example, the mixing ratio may be set so that the thermal expansion coefficient when material A and material B are mixed at a predetermined mixing ratio is close to the thermal expansion coefficient of cover glass 25, and material A and material B mixed at such a mixing ratio may be placed on the cover glass 25 side (region e).

[0031] Here, an example has been described in which the material is divided into five regions, but the number of regions with different mixing ratios of material A and material B may be greater than or less than five. The mixing ratio of material A and material B may be configured to change continuously. For example, the mixing ratio of material A from the substrate 23 side of frame body 24a to cover glass 25 may change continuously from 100 to 0; in other words, the mixing ratio of material B may change continuously from 0 to 100.

[0032] Here, we have used an example in which two types of materials are mixed to form the frame body 24a, but the types of materials mixed are not limited to two, and the present technology can also be applied to cases in which two or more materials are mixed.

[0033] The substrate 23 side of the frame body 24a is configured such that multiple materials are mixed at a mixing ratio that matches (or nearly matches) the thermal expansion coefficient of the substrate 23, and the cover glass 25 side of the frame body 24a is configured such that multiple materials are mixed at a mixing ratio that matches (or nearly matches) the thermal expansion coefficient of the cover glass 25. The mixing ratio of the multiple materials that make up the frame body 24a is determined so that the thermal expansion coefficient gradually changes from the substrate 23 side to the cover glass 25 side of the frame body 24a.

[0034] In this way, by adjusting the mixing ratio of material A and material B that make up frame body 24a and forming frame body 24, frame body 24a made of a material whose thermal expansion coefficient approximately matches that of substrate 23 can be placed on the substrate 23 side, and frame body 24a made of a material whose thermal expansion coefficient approximately matches that of cover glass 25 can be placed on the cover glass 25 side.

[0035] In this way, by placing materials with approximately the same thermal expansion coefficients near the joining surface, the frame body 24a can absorb the forces generated by the difference in thermal expansion coefficients between the substrate 23 and the cover glass 25, thereby preventing the occurrence of the above-mentioned problems, such as the cover glass 25 cracking.

[0036] The frame 24a may be made of an insulating resin material such as glass epoxy resin, and the adhesive used to bond the substrate 23 and the frame 24a may be made of an insulating resin material such as epoxy resin.

[0037] When the frame 24a is made of glass epoxy resin, the thermal expansion coefficient of the frame 24a in the thickness direction may be adjusted by adjusting the filler content of the resin component.The thermal expansion coefficient of the frame 24a may be adjusted by adjusting the mixing ratio of two or more of resin such as glass epoxy, metal, and ceramic.

[0038] The frame 24a can be formed using a device called a 3D printer, which is used to form three-dimensional objects. Any type of 3D printer may be used. A 3D printer is a device that can form a three-dimensional object by stacking cross-sectional shapes. Using such a 3D printer, the frame 24a can be formed from multiple materials with different mixing ratios.

[0039] For example, when forming the frame body 24a with a 3D printer, the frame body 24a can be formed by changing the mixing ratio of the materials each time the cross-sectional shape is layered. Specifically, if the frame body 24a is formed of glass epoxy and metal, the mixing ratio of glass epoxy is increased when forming the frame body 24a on the substrate 23 side, and the cross-sectional shape of the frame body 24a is layered while gradually increasing the content of metal, thereby forming the frame body 24a with a continuously changing mixing ratio.

[0040] Although details will be described later, when forming the semiconductor package 11a, the frame body 24a may be formed using a 3D printer and the formed frame body 24a may be bonded to the substrate 23 with an adhesive, or when forming the frame body 24a using a 3D printer, the substrate 23 may be placed inside the 3D printer and the frame body 24a may be formed directly on the substrate 23. By forming the frame body 24a directly on the substrate 23, the substrate 23 and the frame body 24a can be integrated into one structure. By integrating the substrate 23 and the frame body 24a, an adhesive is not required to bond the substrate 23 and the frame body 24a, and the effects of the adhesive can be eliminated.

[0041] <Second embodiment> 4 is a diagram showing an example of a cross-sectional configuration of semiconductor package 11b according to the second embodiment. The planar configuration of semiconductor package 11b according to the second embodiment is the same as the planar configuration of semiconductor package 11a according to the first embodiment, as shown in FIG. 1, and therefore illustration and description thereof will be omitted here. In semiconductor package 11b according to the second embodiment, parts similar to those of semiconductor package 11a according to the first embodiment shown in FIG. 2 are designated by the same reference numerals, and description thereof will be omitted.

[0042] A frame 24b of a semiconductor package 11b in the second embodiment differs from the semiconductor package 11a in the first embodiment in that it has a lattice structure, but is otherwise similar.

[0043] The frame 24b of the semiconductor package 11b has a lattice structure, and the pitch of the lattice structure differs between the substrate 23 side and the cover glass 25 side. A lattice structure is generally defined as a structure in which branched lattices are periodically arranged. For example, a cubic structure as shown in FIG. 5, in which multiple three-dimensional structures with a hollow center are arranged (stacked) in the vertical, horizontal, and depth directions, will be described as an example. Note that the present technology can also be applied to shapes other than those shown in FIG. 5.

[0044] The frame 24b has a structure in which, for example, three-dimensional structures with different sized cavities in the center are stacked in the vertical, horizontal, and depth directions, based on the lattice-structured object (hereinafter referred to as the three-dimensional structure) shown in FIG. 5. FIG. 6 shows an example of the configuration of the frame 24b. FIG. 6 shows one side of the frame 24b, illustrating an example in which the frame 24b is divided into five layers, frame 24b-1 to 24b-5. The frame 24b-1 side is the substrate 23 side, and the frame 24b-5 side is the cover glass 25.

[0045] Frame body 24b-1 is formed of a smaller three-dimensional structure. If the three-dimensional structure that constitutes frame body 24b-1 is taken as a reference three-dimensional structure (hereinafter referred to as reference three-dimensional structure), frame body 24b-2 is formed of a three-dimensional structure with horizontal sides twice as long as the reference three-dimensional structure. Frame body 24b-3 is formed of a three-dimensional structure with horizontal sides three times as long as the reference three-dimensional structure. Frame body 24b-4 is formed of a three-dimensional structure with horizontal sides four times as long as the reference three-dimensional structure. Frame body 24b-5 is formed of a three-dimensional structure with horizontal sides five times as long as the reference three-dimensional structure.

[0046] 6, the vertical sides of the frames 24b-1 to 24b-5 are the same, but the vertical sides may also have different lengths depending on the layer. Here, the explanation has been given of an example in which the vertical sides are changed by 2 to 5 times the horizontal length of the reference three-dimensional structure, but they may also be changed by different proportions.

[0047] The frame body 24b having such a structure can be formed using a 3D printer. When the frame body 24b is formed using a 3D printer, the cross-sectional shape is formed by stacking layers as described above, so that the frame body 24b having the shape shown in Fig. 6 can also be formed integrally. In other words, although it is described as having layers, the layers are not bonded together using an adhesive or the like, but are instead formed continuously.

[0048] In the structure of the frame 24b shown in Fig. 6, the size of the cavity in each layer is different. When the sizes of the cavity are compared, the following relationship is found. Frame body 24b-1<frame body 24b-3<frame body 24b-3<frame body 24b-4<frame body 24b-5In this case, frame body 24b closer to substrate 23 is configured to have fewer hollow portions, and frame body 24b closer to cover glass 25 is configured to have more hollow portions.The explanation will continue assuming that a portion with fewer (smaller) hollow portions is a portion with sparse hollow portions, and a portion with more (larger) hollow portions is a portion with dense hollow portions.

[0049] The density relationship of the three-dimensional structures that make up the frame body 24b is as follows. Frame body 24b-1 > Frame body 24b-3 > Frame body 24b-3 > Frame body 24b-4 > Frame body 24b-5 In this case, the frame body 24b closer to the substrate 23 is configured so that the three-dimensional structure is densely packed, and the frame body 24b closer to the cover glass 25 is configured so that the three-dimensional structure is sparsely packed.

[0050] The side with more cavities (the side with dense cavities), in other words, the side where the three-dimensional structure is sparsely configured, is a structure that is easily deformed due to thermal expansion. Therefore, the frame body 24b where such three-dimensional structures are sparsely configured is arranged so that it is on the side with a higher thermal expansion coefficient.

[0051] 6 shows an example in which the cavity portion gradually increases in size from the substrate 23 side to the cover glass 25 side, but it may also be configured so that it gradually decreases in size. The density of the cavity is appropriately set depending on the materials of the substrate 23 and the cover glass 25, the material of the frame body 24b, etc.

[0052] In this way, by configuring the three-dimensional structure that makes up frame body 24b to have varying density, in other words, by configuring the hollow portion to have varying density, it is possible to configure frame body 24b to absorb the force that occurs when semiconductor package 11b is exposed to heat due to the difference in thermal expansion coefficients between substrate 23 and cover glass 25.

[0053] The arrangement of the three-dimensional structures shown in Figure 6 is an example and is not intended to be limiting. The shape and size of the three-dimensional structures themselves may be shapes and sizes other than those shown in the example. For example, Figure 6 illustrates a case in which the density of the three-dimensional structures is adjusted by adjusting the width of the three-dimensional structures, but the density of the three-dimensional structures can also be adjusted by adjusting the spacing between the three-dimensional structures.

[0054] For example, the frame body 24b is configured by stacking three-dimensional structures as shown in Figure 5, but the three-dimensional structures are arranged at predetermined intervals, and the intervals are configured to be different for each layer.

[0055] For example, in frame 24b-1, the three-dimensional structures are arranged without any gaps between them, in frame 24b-2, the three-dimensional structures are arranged with a gap of one three-dimensional structure between them, in frame 24b-3, the three-dimensional structures are arranged with a gap of two three-dimensional structures between them, in frame 24b-4, the three-dimensional structures are arranged with a gap of three three-dimensional structures between them, and in frame 24b-5, the three-dimensional structures are arranged with a gap of four three-dimensional structures between them.

[0056] In this way, by changing the spacing between the three-dimensional structures, it is possible to create sparse and dense areas of the three-dimensional structures within the frame body 24b. In this case, it is also possible to configure the frame body 24b to be formed by stacking three-dimensional structures without cavities.

[0057] In this way, by configuring frame body 24b to have a cavity and the density (size) of the cavity portion changing depending on the position, frame body 24b can absorb the force generated by the difference in thermal expansion coefficients between substrate 23 and cover glass 25, thereby preventing the occurrence of the above-mentioned problems, such as the cover glass 25 breaking.

[0058] <Third embodiment> 7 is a cross-sectional view showing an example of the configuration of a semiconductor package 11c according to the third embodiment. The semiconductor package 11c according to the third embodiment is configured by combining the semiconductor package 11a according to the first embodiment (FIG. 2) and the semiconductor package 11b according to the second embodiment (FIG. 4).

[0059] The frame body 24c of the semiconductor package 11c has a structure in which a three-dimensional structure is formed with a sparsely packed structure (the hollow portion is sparsely packed), similar to the frame body 24b of the semiconductor package 11b (Figure 4) in the second embodiment, and is made up of multiple materials, with the composition of the multiple materials gradually changing, similar to the frame body 24a of the semiconductor package 11a (Figure 2) in the first embodiment.

[0060] In this way, by configuring the three-dimensional structure that makes up frame body 24c to have varying densities and by configuring the mixing ratio of the materials to vary in the thickness direction, it is possible to configure frame body 24c to absorb the force that occurs when semiconductor package 11c is exposed to heat due to the difference in thermal expansion coefficients between substrate 23 and cover glass 25.

[0061] <Fourth embodiment> FIG. 8 is a cross-sectional view showing an example of the configuration of a semiconductor package 11d according to the third embodiment.

[0062] The frame body 24d of the semiconductor package 11d shown in Figure 8 is different from the frame body 24b of the semiconductor package 11b in the second embodiment shown in Figure 4 in that it has an additional inner stopper 31, but is otherwise similar.

[0063] 4 has a hollow portion, which may allow dust or moisture to enter the space surrounded by the substrate 23, the frame 24b, and the cover glass 25, potentially affecting the imaging element 21. The frame 24d of the semiconductor package 11d shown in FIG. 8 has an additional inner stopper 31 that prevents dust or moisture from entering the space surrounded by the substrate 23, the frame 24d, and the cover glass 25.

[0064] In the semiconductor package 11d shown in FIG. 8, the imaging element 21 is arranged in a space surrounded by the substrate 23, the inner stopper 31, and the cover glass 25, which prevents dust and moisture from entering the space in which the imaging element 21 is arranged.

[0065] The inner stopper 31 is formed as a side wall without a hollow portion on the side where the imaging element 21 is arranged, that is, on the inside of the frame body 24d.

[0066] The inner stopper 31 may be configured to be integrated with the frame body 24d, or may be configured to be bonded to the substrate 23 and the cover glass 25 and not to be in contact with the frame body 24d. When configured not to be in contact with the frame body 24d, the imaging element 21 is configured to be surrounded by the frame body 24d and the inner stopper 31.

[0067] The inner stopper 31 may have the same configuration as the frame 24a of the semiconductor package 11a in the first embodiment, or may be made of different materials with a varying mixing ratio. By configuring the inner stopper 31 in this manner, the inner stopper 31 can also be configured to absorb the force generated when the semiconductor package 11d is exposed to heat due to the difference in thermal expansion coefficient between the substrate 23 and the cover glass 25.

[0068] The frame 24d may have the same configuration as the frame 24c of the semiconductor package 11c in the third embodiment, with the inner stopper 31 added to the frame 24c.

[0069] In this way, by configuring the three-dimensional structure that makes up the frame body 24d to have varying densities and by providing an inner stopper 31, it is possible to configure the frame body 24d to absorb the force that occurs when the semiconductor package 11d is exposed to heat due to the difference in thermal expansion coefficients between the substrate 23 and the cover glass 25, and to prevent dust and other particles from entering the space in which the imaging element 21 is located.

[0070] <Fifth embodiment> 9 is a cross-sectional view showing an example of the configuration of a semiconductor package 11e according to the fifth embodiment. The semiconductor package 11e according to the fifth embodiment is configured by combining the semiconductor package 11a according to the first embodiment (FIG. 2) and the semiconductor package 11d according to the fourth embodiment (FIG. 8).

[0071] The frame body 24e of the semiconductor package 11e in the fifth embodiment is made of multiple materials, similar to the frame body 24a of the semiconductor package 11a (Figure 2) in the first embodiment, and has a structure in which the mixing ratio of the materials gradually changes, and is configured to have an inner stopper 31, similar to the frame body 24d of the semiconductor package 11d (Figure 8) in the fourth embodiment.

[0072] In this way, by constructing the frame body 24e using multiple materials, configuring the mixing ratio of the materials to gradually change, and configuring it with an inner stopper 31, it is possible to configure the frame body 24e to absorb the force generated when the semiconductor package 11e is exposed to heat due to the difference in thermal expansion coefficients between the substrate 23 and the cover glass 25, and to create a more robust configuration that prevents dust and other particles from entering the space in which the imaging element 21 is located.

[0073] In the first to fifth embodiments, an example has been described in which the imaging element 21 is disposed in the semiconductor package 11, but the present technology can also be applied to a semiconductor package 11 in which a chip other than the imaging element 21 is disposed. In other words, the present technology can be applied regardless of what kind of chip is disposed in the semiconductor package 11.

[0074] <Regarding the manufacturing of semiconductor package 11> With reference to FIG. 10, the manufacture of the semiconductor package 11a according to the first embodiment will be described.

[0075] In step S11, a substrate 23 is prepared. In step S12, an imaging element 21 is fixed (die bonding) onto the substrate 23. In step S13, the imaging element 21 and pads formed on the substrate 23 are connected by bonding wires 22.

[0076] In step S14, a frame body 24a is attached with an adhesive to the substrate 23 outside the area where the imaging element 21 is disposed. The frame body 24a is prepared by molding it in a separate process using, for example, a 3D printer. In step S15, a cover glass 25 is attached to the frame body 24a with an adhesive.

[0077] In this manner, the semiconductor package 11a is manufactured. The semiconductor packages 11b to 11e according to the second to fifth embodiments can also be manufactured using basically the same process. The manufacturing process shown here is an example, and the semiconductor package 11 may be manufactured using other manufacturing processes. For example, a process may be used in which the substrate 23 and the frame 24 are bonded together, or the frame 24 and the cover glass 25 are bonded together, without using an adhesive.

[0078] Another manufacturing process for the semiconductor package 11a according to the first embodiment will be described with reference to FIG.

[0079] In step S31, the substrate 23 is prepared in which the substrate 23 and the frame body 24a are integrated together. For example, the frame body 24a is formed on the substrate 23 using a 3D printer, and the substrate 23 with the frame body 24a formed thereon is prepared.

[0080] In step S32, the imaging element 21 is fixed (die bonding) to the substrate 23 in an area surrounded by the frame 24a. In step S33, the imaging element 21 and pads formed on the substrate 23 are connected by bonding wires 22. In step S34, the cover glass 25 is attached to the frame 24a using an adhesive.

[0081] In this manner, the semiconductor package 11a is manufactured. The semiconductor packages 11b to 11e according to the second to fifth embodiments can also be manufactured using basically the same process. The manufacturing process shown here is an example, and the semiconductor package 11 may be manufactured using other manufacturing processes. For example, the process may involve bonding the frame 24 and the cover glass 25 together without using an adhesive.

[0082] <Electronic device configuration> The semiconductor package 11 including the above-described imaging element 21 can be applied to various electronic devices, such as imaging devices such as digital still cameras and digital video cameras, mobile phones with imaging functions, or other devices with imaging functions.

[0083] Fig. 12 is a block diagram showing an example of the configuration of an imaging device as an electronic device. The imaging device 1001 shown in Fig. 12 is configured with an optical system 1002, a shutter device 1003, an imaging element 1004, a drive circuit 1005, a signal processing circuit 1006, a monitor 1007, and a memory 1008, and is capable of capturing still images and moving images.

[0084] The optical system 1002 is configured to have one or more lenses, and guides light from a subject (incident light) to the image sensor 1004, forming an image on the light receiving surface of the image sensor 1004.

[0085] The shutter device 1003 is disposed between the optical system 1002 and the image sensor 1004 , and controls the light irradiation period and light blocking period for the image sensor 1004 under the control of a drive circuit 1005 .

[0086] The image sensor 1004 is configured as a package including the image sensor described above. The image sensor 1004 accumulates signal charges for a certain period of time in response to light that is focused on the light receiving surface via the optical system 1002 and the shutter device 1003. The signal charges accumulated in the image sensor 1004 are transferred in accordance with a drive signal (timing signal) supplied from a drive circuit 1005.

[0087] The drive circuit 1005 outputs drive signals that control the transfer operation of the image sensor 1004 and the shutter operation of the shutter device 1003 , thereby driving the image sensor 1004 and the shutter device 1003 .

[0088] The signal processing circuit 1006 performs various signal processing on the signal charges output from the image sensor 1004. The image (image data) obtained by the signal processing performed by the signal processing circuit 1006 is supplied to a monitor 1007 for display, or supplied to a memory 1008 for storage (recording).

[0089] <Example of use of semiconductor package including imaging element> Next, a description will be given of an example of use of the semiconductor package 11 (including an imaging device) including the imaging element 21 to which the present technology is applied.

[0090] FIG. 13 is a diagram showing an example of use of a semiconductor package 11 (including an imaging device) including an imaging element 21 to which the present technology is applied.

[0091] The imaging device according to the above-described embodiment can be used in various cases for sensing light such as visible light, infrared light, ultraviolet light, X-rays, etc. For example, the above-described embodiment can be used in devices used in the fields of appreciation for capturing images for viewing, transportation, home appliances, medicine and healthcare, security, beauty, sports, agriculture, etc.

[0092] Specifically, in the field of appreciation, the above-described embodiments can be applied to devices for capturing images for appreciation, such as digital cameras, smartphones, and mobile phones with camera functions.

[0093] In the field of transportation, the above-mentioned embodiments can be applied to devices used in transportation, such as on-board sensors that capture images of the front, rear, surroundings, and interior of a vehicle for safe driving such as automatic stopping, or for recognizing the driver's condition, surveillance cameras that monitor moving vehicles and roads, and distance measuring sensors that measure distances between vehicles, etc.

[0094] In the field of home appliances, for example, the above-described embodiments can be applied to devices used in home appliances such as television sets, refrigerators, and air conditioners to capture user gestures and operate the appliances in accordance with the gestures.

[0095] In the field of medicine and healthcare, the above-described embodiments can be applied to devices used for medicine and healthcare, such as endoscopes and devices that perform angiography by receiving infrared light.

[0096] In the field of security, the above-described embodiment can be applied to devices used for security purposes, such as surveillance cameras for crime prevention and cameras for person authentication.

[0097] In the field of beauty, the above-described embodiment can be applied to devices used for beauty, such as a skin measuring device that takes pictures of the skin, or a microscope that takes pictures of the scalp.

[0098] In the field of sports, the above-described embodiment can be applied to devices used for sports, such as action cameras and wearable cameras for sports applications.

[0099] In the field of agriculture, the above-described embodiment can be applied to devices used in agriculture, such as cameras for monitoring the conditions of fields and crops.

[0100] This technology can be applied to a variety of other products.

[0101] <Application example to endoscopic surgery system> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0102] FIG. 14 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure (the present technology) can be applied.

[0103] 14 shows an operator (doctor) 11131 performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 is composed of an endoscope 11100, other surgical instruments 11110 such as an insufflation tube 11111 and an energy treatment instrument 11112, a support arm device 11120 that supports the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are mounted.

[0104] The endoscope 11100 is composed of a lens barrel 11101, a region of a predetermined length from the tip of which is inserted into a body cavity of a patient 11132, and a camera head 11102 connected to the base end of the lens barrel 11101. In the example shown, the endoscope 11100 is configured as a so-called rigid scope having a rigid lens barrel 11101, but the endoscope 11100 may also be configured as a so-called flexible scope having a flexible lens barrel.

[0105] An opening into which an objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101, and is irradiated via the objective lens towards an object to be observed inside the body cavity of the patient 11132. The endoscope 11100 may be a direct-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0106] An optical system and an image sensor are provided inside the camera head 11102, and light reflected from the object of observation (observation light) is collected onto the image sensor by the optical system. The observation light is photoelectrically converted by the image sensor to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. The image signal is sent to a camera control unit (CCU) 11201 as RAW data.

[0107] The CCU 11201 is configured with a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc., and comprehensively controls the operations of the endoscope 11100 and the display device 11202. Furthermore, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processing on the image signal, such as development processing (demosaic processing), to display an image based on the image signal.

[0108] Under the control of the CCU 11201, the display device 11202 displays an image based on an image signal that has been subjected to image processing by the CCU 11201.

[0109] The light source device 11203 is configured from a light source such as an LED (light emitting diode), and supplies irradiation light to the endoscope 11100 when photographing an operation site or the like.

[0110] The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiating light, magnification, focal length, etc.) of the endoscope 11100.

[0111] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for cauterizing tissue, incising, sealing blood vessels, etc. The insufflation device 11206 inflates the body cavity of the patient 11132 through the insufflation tube 11111 in order to ensure a clear field of view for the endoscope 11100 and a working space for the surgeon. The recorder 11207 is a device capable of recording various types of information related to the surgery. The printer 11208 is a device capable of printing various types of information related to the surgery in various formats such as text, images, or graphs.

[0112] The light source device 11203 that supplies illumination light to the endoscope 11100 when photographing the surgical site can be configured from a white light source configured from, for example, an LED, a laser light source, or a combination of these. When the white light source is configured from a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high precision, making it possible to adjust the white balance of the captured image in the light source device 11203. In this case, it is also possible to capture images corresponding to each RGB in a time-division manner by irradiating the object of observation with laser light from each RGB laser light source in a time-division manner and controlling the drive of the image sensor of the camera head 11102 in synchronization with the irradiation timing. According to this method, a color image can be obtained without providing a color filter to the image sensor.

[0113] Furthermore, the light source device 11203 may be controlled to change the intensity of light it outputs at predetermined time intervals. By controlling the driving of the image sensor of the camera head 11102 in synchronization with the timing of the change in light intensity to acquire images in a time-division manner and combining the images, it is possible to generate an image with a high dynamic range that is free of so-called blocked-up shadows and blown-out highlights.

[0114] The light source device 11203 may also be configured to supply light in a predetermined wavelength band corresponding to special light observation. Special light observation, for example, utilizes the wavelength dependence of light absorption in body tissues to irradiate light with a narrower band than the light irradiated during normal observation (i.e., white light), thereby capturing high-contrast images of specific tissues, such as blood vessels on the surface of mucous membranes, known as narrow-band imaging. Alternatively, special light observation may be performed using fluorescence observation, in which images are obtained using fluorescence generated by irradiating excitation light. Fluorescence observation can involve irradiating excitation light onto body tissues and observing the fluorescence from the tissues (autofluorescence observation), or locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the tissue with excitation light corresponding to the fluorescent wavelength of the reagent to obtain a fluorescent image. The light source device 11203 may be configured to supply narrow-band light and / or excitation light corresponding to such special light observation.

[0115] FIG. 15 is a block diagram showing an example of the functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.

[0116] The camera head 11102 has a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 has a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other by a transmission cable 11400 so that they can communicate with each other.

[0117] The lens unit 11401 is an optical system provided at the connection point with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is composed of a combination of multiple lenses including a zoom lens and a focus lens.

[0118] The imaging unit 11402 may include one imaging element (a so-called single-chip type) or multiple imaging elements (a so-called multi-chip type). When the imaging unit 11402 is configured as a multi-chip type, for example, each imaging element may generate an image signal corresponding to each of RGB, and a color image may be obtained by combining these signals. Alternatively, the imaging unit 11402 may be configured to have a pair of imaging elements for acquiring image signals for the right eye and the left eye corresponding to 3D (dimensional) display. 3D display allows the surgeon 11131 to more accurately grasp the depth of the biological tissue at the surgical site. Note that when the imaging unit 11402 is configured as a multi-chip type, multiple lens units 11401 may be provided corresponding to each imaging element.

[0119] Furthermore, the imaging unit 11402 does not necessarily have to be provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101, immediately after the objective lens.

[0120] The driving unit 11403 is configured by an actuator, and moves the zoom lens and focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. This allows the magnification and focus of the image captured by the imaging unit 11402 to be adjusted appropriately.

[0121] The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 via the transmission cable 11400 as RAW data.

[0122] Furthermore, the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes information on the imaging conditions, such as information specifying the frame rate of the captured image, information specifying the exposure value at the time of imaging, and / or information specifying the magnification and focus of the captured image.

[0123] The image capturing conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0124] The camera head control unit 11405 controls the driving of the camera head 11102 based on a control signal received from the CCU 11201 via the communication unit 11404 .

[0125] The communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

[0126] Furthermore, the communication unit 11411 transmits to the camera head 11102 a control signal for controlling the driving of the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

[0127] The image processing unit 11412 performs various image processing operations on the image signal, which is RAW data sent from the camera head 11102 .

[0128] The control unit 11413 performs various controls related to the imaging of the surgical site, etc. by the endoscope 11100 and the display of the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102.

[0129] Furthermore, the control unit 11413 causes the display device 11202 to display a captured image showing the surgical site, etc., based on the image signal that has been image processed by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition technologies. For example, the control unit 11413 can recognize surgical tools such as forceps, specific biological parts, bleeding, mist generated when using the energy treatment tool 11112, etc., by detecting the shape and color of the edges of objects included in the captured image. When displaying the captured image on the display device 11202, the control unit 11413 may use the recognition results to superimpose various surgical support information on the image of the surgical site. By superimposing the surgical support information and presenting it to the surgeon 11131, the burden on the surgeon 11131 can be reduced and the surgeon 11131 can proceed with the surgery reliably.

[0130] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electrical signal cable for communication of electrical signals, an optical fiber for optical communication, or a composite cable of these.

[0131] In the illustrated example, communication is performed by wire using the transmission cable 11400, but communication between the camera head 11102 and the CCU 11201 may also be performed wirelessly.

[0132] <Application to a moving object> The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of moving body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0133] FIG. 16 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0134] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 16, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053.

[0135] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, a braking device for generating a braking force of the vehicle, etc.

[0136] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches may be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0137] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc., based on the received images.

[0138] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal according to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0139] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0140] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drivetrain control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including avoiding or mitigating collisions between vehicles, following based on the distance between vehicles, maintaining vehicle speed, warning of vehicle collisions, or warning of vehicle lane departure.

[0141] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0142] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12030 based on the information about the outside of the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control for the purpose of preventing glare, such as switching from high beams to low beams.

[0143] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to passengers in the vehicle or to the outside of the vehicle. In the example of Fig. 16, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are exemplified as output devices. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0144] FIG. 17 is a diagram showing an example of the installation position of the imaging unit 12031.

[0145] In FIG. 17, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0146] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided at the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided at the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0147] 17 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 viewed from above can be obtained.

[0148] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera made up of multiple imaging elements, or may be an imaging element having pixels for phase difference detection.

[0149] For example, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (for example, 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of automatic driving, which runs autonomously without relying on driver operation.

[0150] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drivetrain control unit 12010.

[0151] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian is present in the images captured by the image capturing units 12101 to 12104. The pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104, which are infrared cameras, and then performing pattern matching on a series of feature points that indicate the outline of an object to determine whether or not the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0152] The embodiments according to the present technology are not limited to the above-described embodiments, and various modifications are possible within the scope of the present technology.

[0153] Furthermore, the effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0154] It should be noted that the present disclosure is not limited to the above-described embodiment, and various modifications are possible within the scope of the gist of the present disclosure. Furthermore, the effects described in this specification are merely examples and are not intended to be limiting, and other effects may also be obtained.

[0155] The present technology can also be configured as follows. (1) A substrate; a chip disposed on the substrate; a frame disposed on the substrate so as to surround the chip; a cover glass placed on the frame; Equipped with The frame is made of a composition of two or more materials. Semiconductor package. (2) The substrate side and the cover glass side of the frame have different compositions. The semiconductor package according to (1) above. (3) the thermal expansion coefficient of the frame on the substrate side is substantially the same as the thermal expansion coefficient of the substrate; The thermal expansion coefficient of the frame on the cover glass side is approximately the same as the thermal expansion coefficient of the cover glass. The semiconductor package according to (1) or (2). (4) The thermal expansion coefficient of the frame body gradually changes from the substrate side to the cover glass side. The semiconductor package according to (3) above. (5) The material is either a resin, a metal, or a ceramic. The semiconductor package according to any one of (1) to (4). (6) The frame and the substrate are integrally formed. The semiconductor package according to any one of (1) to (5). (7) The frame has a structure having a cavity, The cavity is configured to have different sizes on the substrate side and the cover glass side. The semiconductor package according to any one of (1) to (6). (8) The chip is an image sensor The semiconductor package according to any one of (1) to (7). (9) A substrate; a chip disposed on the substrate; a frame disposed on the substrate so as to surround the chip; a cover glass placed on the frame; Equipped with The frame body has a hollow, The cavity is configured to have different sizes on the substrate side and the cover glass side. Semiconductor package. (10) The size of the cavity is configured to gradually increase or decrease from the substrate side to the cover glass side of the frame body. The semiconductor package according to (9) above. (11) A side wall without a cavity is disposed on the chip side of the frame. The semiconductor package according to (9) or (10) above. (12) The frame is made of a composition of two or more types of materials, The composition of the material of the frame gradually changes from the substrate side to the cover glass side. The semiconductor package according to any one of (9) to (11) above. (13) The material is either a resin, a metal, or a ceramic. The semiconductor package according to (12) above. (14) The chip is an image sensor The semiconductor package according to any one of (9) to (13) above. (15) A substrate; an imaging element disposed on the substrate; a frame disposed on the substrate so as to surround the imaging element; a cover glass placed on the frame; a processing unit that processes a signal from the imaging element; Equipped with The frame is made of a composition of two or more materials. electronic equipment. (16) A substrate; an imaging element disposed on the substrate; a frame disposed on the substrate so as to surround the imaging element; a cover glass placed on the frame; a processing unit that processes a signal from the imaging element; Equipped with The frame body has a hollow, The cavity is configured to have different sizes on the substrate side and the cover glass side. electronic equipment. [Explanation of symbols]

[0156] 11 semiconductor package, 21 imaging element, 22 bonding wire, 23 substrate, 24 frame, 25 cover glass, 31 inner stopper, 1001 imaging device, 1002 optical system, 1003 shutter device, 1004 imaging element, 1005 drive circuit, 1006 signal processing circuit, 1007 monitor, 1008 memory

Claims

1. A substrate; a chip disposed on the substrate; a frame disposed on the substrate so as to surround the chip; a cover glass placed on the frame; a side wall having no cavity on the chip side of the frame; Equipped with The frame body has a hollow, The cavity is configured to have different sizes on the substrate side and the cover glass side. Semiconductor package.

2. The size of the cavity is configured to gradually increase or decrease from the substrate side to the cover glass side of the frame body. The semiconductor package of claim 1 .

3. The frame is made of a composition of two or more types of materials, The composition of the material of the frame gradually changes from the substrate side to the cover glass side. The semiconductor package of claim 1 .

4. The material is either a resin, a metal, or a ceramic. The semiconductor package according to claim 3 .

5. The chip is an image sensor The semiconductor package of claim 1 .

6. A substrate; an imaging element disposed on the substrate; a frame disposed on the substrate so as to surround the imaging element; a cover glass placed on the frame; a side wall of the frame body on the imaging element side that does not have a cavity; a processing unit that processes a signal from the imaging element; Equipped with The frame body has a hollow, The cavity is configured to have different sizes on the substrate side and the cover glass side. electronic equipment.

Images