Tips

Abstract

To provide a chip.SOLUTION: A chip according to the present invention is flip-chip bonded to a circuit board. The chip has at least one bump and at least one support member. The support member protrudes from the active surface of the chip and is located between the bump and a first side edge of the active surface. The support member is used to support the leads of the circuit board, preventing the leads from contacting metal burrs protruding from the active surface or from contacting metal cut surfaces exposed on the side walls of the chip, thereby preventing short circuits or electrical abnormalities from occurring in the leads and the chip.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a chip, and more particularly to a chip that can prevent a situation in which leads of a circuit board come into contact with metal burrs or metal cut surfaces of the chip. [Background technology]

[0002] In the scribing process, a tool (not shown) scribes the wafer 10 along scribe lines 11 to separate the wafer 10 into multiple chips 12 (see FIGS. 1 and 2). The tool cuts the metal layer (e.g., circuits and marks) located along the scribe lines 11, and the metal layer forms a metal cut surface 14 on the sidewall 13 of the chip 12. Because the metal layer is ductile, the metal cut surface 14 generates a metal burr 16 that protrudes onto the active surface 15. Summary of the Invention [Problem to be solved by the invention]

[0003] As shown in FIG. 2, when connecting leads 21 of a circuit board to bumps 17 of chip 12, leads 21 may come into contact with metal cut surface 14 or metal burrs 16, potentially causing a short circuit or electrical abnormality.

[0004] Therefore, the present inventors believed that the above drawbacks could be improved, and as a result of extensive research, they came up with the proposal of the present invention, which effectively improves the above problems through rational design.

[0005] The present invention has been made in view of the above, and an object of the present invention is to provide a chip in which leads of a circuit board are supported by at least one support member protruding from an active surface. [Means for solving the problem]

[0006] In order to solve the above problems, a chip according to one aspect of the present invention has at least one bump. and, At least one support member a metal layer and a protective layer;The bump is disposed on an active surface and is used to bond a lead of a circuit board. The support member is disposed on the active surface and is used to support the lead. The support member is located between the bump and a first side edge of the active surface, and the bump and the support member protrude from the active surface. A first height of the bump is equal to or greater than a second height of the support member. The metal layer has a plurality of conductive pads and a seal ring, the seal ring wraps around the conductive pads, the protective layer covers the seal ring but not the conductive pads, the active surface is the surface of the protective layer, the bump is electrically connected to any one of the conductive pads, the seal ring is projected onto the active surface to form a seal ring projection, and the support member is located between the bump and the seal ring projection.

[0007] When bonding the bumps to the leads, a support member protruding from the active surface is used to support the leads, and by suspending the leads above the first side edge of the active surface, problems such as the leads coming into contact with metal cutting surfaces or metal burrs located on the first side edge, which could cause short circuits or electrical abnormalities, are prevented. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing a conventional wafer. [Figure 2] FIG. 1 is a cross-sectional view showing a conventional chip. [Figure 3] 1 is a plan view of a portion of a chip according to an embodiment of the present invention; [Figure 4] 1 is a cross-sectional view showing a chip according to an embodiment of the present invention. [Figure 5] 1 is a plan view of a portion of a chip according to an embodiment of the present invention; [Figure 6] 1 is a cross-sectional view showing a chip according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following describes in detail the embodiments of the present invention, but the present invention is not limited to these, and various modifications are possible within the scope of the description, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention.

[0010] After scribing, a wafer (not shown) has a plurality of chips 100 formed thereon, each of which has an active surface 110, at least one bump 120, at least one support member 130, a metal layer 140, a protective layer 150, and at least one circuit layer 160 (see FIGS. 3 and 4). The bumps 120 and support member 130 are disposed on the active surface 110, and the bumps 120 are located in bump setting areas 112 on the active surface 110 and protrude onto the active surface 110, for bonding to leads 210 of a circuit board 200. The chips are flip-chip bonded to the circuit board.

[0011] 3 and 4, the metal layer 140 has a plurality of conductive pads 141, a seal ring 142, and at least one mark 143. In this embodiment, the mark 143 is located on a scribe line (not shown) of the wafer, but the present invention is not limited thereto. The circuit layer 160 is connected to the conductive pads 141, the seal ring 142 surrounds the conductive pads 141, and the protective layer 150 covers the seal ring 142 and the circuit layer 160 but does not cover the conductive pads 141. In this embodiment, the active surface 110 of the chip 100 is the surface of the protective layer 150, and the bumps 120 are electrically connected to at least one conductive pad 141.

[0012] 3 and 4, after the scribing process, at least one sidewall 100a is formed on each of the chips 100, a circuit cut surface 161 is formed on the sidewall 100a of the circuit layer 160, and a mark cut surface 143a is formed on the sidewall 100a of the mark 143. Because the metal layer 140 and the circuit layer 160 are malleable, metal burrs 143b that protrude onto the active surface 110 may be generated on the mark cut surface 143a, and metal burrs (not shown) that protrude onto the active surface 110 may also be generated on the circuit cut surface 161.

[0013] 3 and 4, the support members 130 protrude into the active surface 110 and are located between the bumps 120 and the first side edge 111 of the active surface 110. The material of the support members 130 is selected from polymeric materials and non-conductive materials. Preferably, each chip 100 has a plurality of support members 130, and adjacent support members 130 have openings 170 between them that communicate with the first side edge 111 and the bump setting area 112 of the active surface 110. Underfill (not shown) flows through the openings 170 from the first side edge 111 to the bump setting area 112, sealing the bumps 120 and the leads 210. The bumps 120 and the support members 130 protrude into the active surface 110, and a first height H1 of the bumps 120 is equal to or greater than a second height H2 of the support members 130. In this embodiment, the first height H1 is greater than the second height H2, and the difference between the first height H1 and the second height H2 is 7 μm or less, preferably, the second height H2 is 5 μm or more. When the bonding end 211 of the lead 210 is bonded to the bump 120, the support member 130 is used to support the exposed portion 212 of the lead 210 so as to prevent the exposed portion 212 from coming into contact with the mark cut surface 143 a, the metal burr 143 b, the circuit cut surface 161, or the metal burr of the circuit cut surface 161.

[0014] 4, there is a first distance S1 between the bump 120 and the support member 130, the imaginary line 111a extends along the first side edge 111 of the active surface 110, there is a second distance S2 between the support member 130 and the imaginary line 111a, and the ratio (S1 / S2) of the first distance S1 to the second distance S2 is in the range of 0.5 to 100. By controlling the ratio of the first distance S1 to the second distance S2, the rigidity of the exposed portion 212 is increased, and a situation in which the exposed portion 212 bends and comes into contact with the mark cut surface 143a, the metal burr 143b, the circuit cut surface 161, or the metal burr of the circuit cut surface 161 is prevented.

[0015] As shown in FIGS. 3 and 4 , a seal ring 142 is projected onto the active surface 110, forming a seal ring projection 142a. In this embodiment, the support member 130 is located between the bump 120 and the seal ring projection 142a. An axis extends from the support member 130 toward the first side edge. Along the axis X, the support member 130 has a width W. Preferably, the width W is 5 μm or more and not longer than the distance from the bump 120 to the seal ring projection 142a. An outer wall 131 of the support member 130 is adjacent to the first side edge 111 of the active surface 110, and an inner wall 132 of the support member 130 is adjacent to the bump 120. A third distance S3 between the outer wall 131 and the seal ring projection 142a is 1 μm or more and 100 μm or less. A first distance S1 between the inner wall 132 and the bump 120 is equal to or greater than 1 μm and equal to or less than 100 μm.

[0016] 3 and 4, along a direction perpendicular to the axis X, the bump 120 has a first length L1, and the support member 130 has a second length L2, which is equal to or greater than the first length L1. The bump 120 is projected onto the support member 130 along the axis X, forming a bump projection 121 on the support member 130. The bump projection 121 has a second side edge 121a, and the support member 130 has a third side edge 133 adjacent to the second side edge 121a. A fourth distance S4 from the second side edge 121a to the third side edge 133 along a direction perpendicular to the axis X is equal to or greater than 1 μm and equal to or less than 10 μm. When the lead 210 is bonded to the bump 120 at an angle, the support member 130 supports the exposed portion 212.

[0017] 4, 5, and 6, in another embodiment, a support member 130 is disposed between the seal ring projection 142a and the first side edge 111. The support member 130 is used to support the exposed portion 212 so as to prevent the exposed portion 212 from contacting the mark cut surface 143a, the metal burr 143b, the circuit cut surface 161, or the metal burr of the circuit cut surface 161 when the bonding end 211 is bonded to the bump 120. In another embodiment, the outer wall 131 of the support member 130 is aligned with the side wall 100a of the chip 100 (not shown).

[0018] The present invention supports the leads 210 bonded to the bumps 120 using support members 130 protruding from the active surface 110, and suspends the exposed portions 212 of the leads 210 above the first side edge 111 of the active surface 110, thereby preventing the exposed portions 212 from coming into contact with metal cutting surfaces and / or metal burrs located on the first side edge 111, which could cause short circuits or electrical abnormalities.

[0019] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention. [Explanation of symbols]

[0020] 10 wafers 11 Scribe Line 12 chips 13 Side wall 14 Metal cutting surface 15 Active Surface 16 Metal burrs 17 Bump 21 Lead 100 chips 100a sidewall 110 Active Surface 111 1st side 111a Virtual Line 112 Bump setting area 120 Bump 121 Bump Projection 121a 2nd side 130 Support member 131 Outside wall 132 Inner wall 133 Third side 140 metal layer 141 Conductive Pad 142 Seal ring 142a Seal Ring Projection 143 marks 143a Mark cut surface 143b Metal burrs 150 protective layer 160 circuit layers 161 Circuit cutting surface 170 Opening 210 leads 211 Joint end 212 Exposed part H1 First height H2 Second height L1 First length L2 Second length S1 1st distance S2 2nd distance S3 Third distance S4 4th distance W width X axis

Claims

1. At least one bump disposed on the active surface and used to bond a lead of a circuit board; at least one support member disposed on the active surface and positioned between the bump and a first side edge of the active surface, the support member being used to support the lead, the bump and the support member protruding from the active surface, and a first height of the bump being equal to or greater than a second height of the support member; a metal layer and a protective layer, A chip characterized in that the metal layer has a plurality of conductive pads and a seal ring, the seal ring wraps around the conductive pads, the protective layer covers the seal ring but not the conductive pads, the active surface is the surface of the protective layer, the bump is electrically connected to any one of the conductive pads, the seal ring is projected onto the active surface to form a seal ring projection, and the support member is located between the bump and the seal ring projection.

2. 2. The chip according to claim 1, wherein the first height is greater than the second height, and the difference between the first height and the second height is 7 [mu]m or less.

3. The chip according to claim 2 , wherein the second height is 5 μm or more.

4. 2. The chip of claim 1, wherein the bump has a first distance from the support member, a virtual line extends along the first side edge of the active surface, the support member has a second distance from the virtual line, and the ratio of the first distance to the second distance is in the range of 0.5 to 100.

5. The chip of claim 4, wherein an axis extends from the support member toward the first side edge, and along the axis, the support member has a width, the width being not less than 5 μm.

6. 2. The chip of claim 1, wherein an outer wall of the support member is adjacent to the first side edge, and a third distance between the outer wall and the seal ring projection is 1 [mu]m or greater.

7. 7. The chip of claim 6, wherein an inner wall of the support member is adjacent to the bump, and a first distance from the inner wall to the bump is 1 [mu]m or more.

8. 2. The chip according to claim 1, comprising a plurality of support members, with openings between adjacent support members, the bumps being installed in bump setting areas of the active surface, and the openings being connected to the first side edge and the bump setting areas.

9. The tip of claim 1 , wherein the outer sidewall of the support member is aligned with the sidewall of the tip.

10. The chip described in claim 1, characterized in that an axis extends from the support member toward the first side edge, along the axial direction, the bump has a first length when projected onto the support member, and along a direction perpendicular to the axis, the bump has a first length, the support member has a second length, and the second length is greater than or equal to the first length.

11. 11. The chip of claim 10, wherein the bump forms a bump projection on the support member, the bump projection having a second side edge, the support member having a third side edge adjacent to the second side edge, and a fourth distance from the second side edge to the third side edge along the direction perpendicular to the axis is 1 μm or more.

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