2High-quality signal transmission and high-frequency connection structure based on a floating structure

Abstract

The present disclosure discloses a high-quality signal transmission high-frequency connection structure based on a two-floating structure, the high-quality signal transmission high-frequency connection structure based on the two-floating structure includes a PCB board and a high-frequency signal transmission assembly, the pad for transmitting a high-frequency signal to the PCB board includes a high-frequency signal transmission area and a ground area, the ground area is formed outside the high-frequency signal transmission area and has a gap between the high-frequency signal transmission area and the ground area, the high-frequency signal transmission assembly contacts the pad of the PCB board, the high-frequency signal transmission assembly includes an outer conductor assembly and an inner conductor assembly, the outer conductor assembly contacts the ground area, the inner conductor assembly contacts the high-frequency signal transmission area, and the parts of the outer conductor assembly and the inner conductor assembly that contact the PCB board can be floated, so that the outer conductor assembly and the inner conductor assembly can contact the pad simultaneously. The present disclosure improves the conditions for high-frequency signal transmission, eliminates the air gap in the high-frequency transmission line, avoids signal distortion and energy loss, and enables the transmission speed of high-frequency signals to reach 20 Gbps or more.

Description

[Technical Field]

[0001] The present disclosure relates to the technical field of electrical component connections, and more particularly to connectors and lines for high frequency signal transmission used in chip testing equipment.

[0002] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority based on a Chinese application filed with the State Intellectual Property Office of the People's Republic of China on March 31, 2022, bearing application number 202210344748.8 and entitled "High-quality signal transmission high-frequency connection structure based on two floating structures," the entire contents of which are incorporated herein by reference. [Background technology]

[0003] Chip testing typically involves contact between a probe holder (with a fan-shaped structure as shown in Figure 1) and a PCB board (with a disk-shaped structure as shown in Figure 1) to transmit signals, testing various chip parameters and determining the specific performance of the chip. The probe holder of a chip testing device has multiple ports, and the number of ports is generally determined based on the chip's testing requirements. These ports are generally divided into high-frequency chip ports and low-frequency signal ports. Similarly, as shown in Figure 1, the PCB board docking to these ports also has pads for contacting high-frequency and low-frequency signals.

[0004] In the related art, as shown in FIG. 2, a chip testing device includes a PCB board 1, a base 13, an upper cover 9, a plastic base 12, a low-frequency signal transmission assembly 10, a high-frequency signal transmission assembly 11, a low-frequency signal transmission cable 14, and a high-frequency signal transmission cable 15.

[0005] During actual chip testing, it was discovered that the high frequency signal transmission assembly 11 generally does not have a negative effect on the high frequency signal when the transmission speed is 2G or less, but when the transmission speed exceeds 2G, crosstalk and distortion of the high frequency signal occur. Summary of the Invention

[0006] The present disclosure addresses the shortcomings of conventional chip testing equipment by providing a high-quality signal transmission high-frequency connection structure based on a two-floating structure, which can solve the problem of high-frequency signal crosstalk and distortion occurring when the transmission speed of the high-frequency signal transmission assembly exceeds 2G. The specific technical solution is as follows:

[0007] The high-frequency signal transmission assembly 11 of the related chip testing equipment has the following characteristics. As shown in FIG. 3 , the high-frequency signal transmission assembly 11 is divided into an inner conductor 20 and an outer conductor 21. The outer conductor 21 is a fixed component without a floating function, and therefore does not contact the PCB board 1. Instead, it is connected to the adjacent low-frequency signal transmission assembly 10 via a ground connection piece 22 to achieve elastic contact with the PCB board. The inventors discovered that reducing the gap between the outer conductor 21 and the PCB board can improve the transmission of high-frequency signals to a certain extent. Through research and practice, they found that an air gap occurs between the outer conductor 21 and the PCB board 1, which can cause crosstalk and distortion in high-frequency signals when the transmission speed exceeds 2G. One of the technical objectives of this disclosure is to eliminate the air gap and prevent its negative impact on high-frequency signal transmission.

[0008]

[0003] A high-quality signal transmission high-frequency connection structure based on a floating structure includes a PCB board and a high-frequency signal transmission assembly, and has a pad for transmitting high-frequency signals to the PCB board, the pad including a high-frequency signal transmission area and a grounding area, the grounding area being formed outside the high-frequency signal transmission area with a gap between the high-frequency signal transmission area and the grounding area, the high-frequency signal transmission assembly contacting the pad on the PCB board, the high-frequency signal transmission assembly including an outer conductor assembly and an inner conductor assembly, the outer conductor assembly contacting the grounding area and the inner conductor assembly contacting the high-frequency signal transmission area, and the portions of the outer conductor assembly and the inner conductor assembly that contact the PCB board are capable of floating, so that the outer conductor assembly and the inner conductor assembly can contact the pad simultaneously.

[0009] Optionally, the high frequency signal transmission area is a solid circle and the gap between the high frequency signal transmission area and the ground area is a circular annulus around the exterior of the high frequency signal transmission area.

[0010] Optionally, the grounding area has a circular or arcuate inner boundary concentric with at least the high frequency signal transmission area.

[0011] Optionally, the contact area is in the shape of a four-leaf clover or a diamond.

[0012] Optionally, the high frequency signal transmission areas are located at the four leaves of the four-leaf clover or the four corners of the diamond, respectively.

[0013] As an optional option, the outer conductor assembly comprises a support ring, a spring, a lower outer conductor, an upper outer conductor, and a collar, the upper outer conductor is fixedly attached to an end of the lower outer conductor, the support ring is ring-mounted on the outside of the upper outer conductor, and the support ring can slide relatively to the upper outer conductor along the axial direction, the spring is ring-mounted on the outer wall of the lower outer conductor, the spring abuts against the support ring, and the other end of the spring is supported by a stepped surface provided on the outer wall of the lower outer conductor.

[0014] Optionally, the projecting end of the upper outer conductor has a position limiting tongue projecting radially relative to the support ring.

[0015] Optionally, the end of the support ring has a stepped surface that mates with the position limiting tongue.

[0016] Optionally, a collar is disposed between the support ring and the lower outer conductor.

[0017] As an optional option, the inner conductor assembly comprises a pin, a small spring, a metal inner housing, and a metal outer housing, the pin pressing the small spring into the metal inner housing to form a set member, the set member being attached to the metal outer housing, the pin having a head portion protruding from the metal inner housing and axial floating achieved by the small spring.

[0018] Optionally, the inner conductor assembly is a pogo pin, which contacts the PCB board with a resilient force due to the pin.

[0019] Optionally, an insulating medium is disposed between the inner conductor assembly and the outer conductor assembly.

[0020] Optionally, the inner conductor assembly and the outer conductor assembly have a floating structure, and the floating direction is along the axial direction of the high frequency signal transmission assembly. [Effects of the Invention]

[0021] The present disclosure has the following beneficial effects: (1) The present disclosure enables the transmission of 20G high-frequency signals through the high-frequency port of a chip testing device, and ensures high-frequency signal transmission quality equivalent to that of the same type of radio-frequency connector. Such chip testing device is connected to pads on a PCB board using elastic contact members, eliminating the need for a limited number of ports and allowing port densities to reach approximately 2mm. (2) The present disclosure provides a floating function to the outer conductor of the high-frequency signal transmission port and improves the shape of the pad on the PCB board that contacts the high-frequency port, allowing both the inner and outer conductors of the high-frequency port to elastically contact the PCB board, simultaneously achieving ground isolation and signal transmission for the high-frequency port. This improves the conditions for high-frequency signal transmission, eliminates air gaps in the high-frequency transmission line, avoids signal distortion and energy loss, and enables high-frequency signal transmission speeds of 20Gbps or more. This improves the usability of the device, increases the range of device applications, indirectly shortens the time required for device replacement, and significantly increases device utilization. (3) The present disclosure further simplifies the replacement of the contact members of the high-frequency port inner conductor and the low-frequency port, solving the problem of maintenance difficulties that arise when the contact members are damaged during use, worn out after repeated use, or lose their contact due to environmental corrosion. This significantly reduces the time required for maintenance, reduces maintenance costs, and extends the service life of the equipment. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a schematic diagram of a connection structure between a probe holder and a PCB board in a related art. [Figure 2] 1 is a schematic diagram showing the overall configuration of a chip testing device according to the prior art; [Figure 3] FIG. 1 is a schematic diagram of a high-frequency signal transmission assembly of a chip testing device according to the prior art; [Figure 4]1 is a schematic diagram of the shape of a pad on a PCB board that contacts a high-frequency signal transmission assembly 11 according to an embodiment of the present disclosure. [Figure 5] 1 is a schematic diagram of a connection between a high frequency signal transmission assembly and a PCB board according to an embodiment of the present disclosure. [Figure 6] 1 is a schematic diagram of an outer conductor assembly 1 according to an embodiment of the present disclosure. [Figure 7] 1 is a schematic diagram of an inner conductor assembly 1 according to an embodiment of the present disclosure. [Figure 8] 1 is a schematic diagram illustrating the overall configuration of a high-frequency signal transmission assembly according to an embodiment of the present disclosure. [Figure 9] FIG. 2 is a schematic diagram of a PCB board 1. [Figure 10] 10 is a diagram showing another shape of a pad that contacts a high frequency signal transmission assembly 11 on a PCB board according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0023] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the present disclosure will be clearly and completely described below with reference to the embodiments.

[0024] Example

[0025] In this embodiment, in order to solve the above-mentioned problems of crosstalk and distortion of high frequency signals, a connection structure between the PCB board 1 and the high frequency signal transmission assembly 11 is redesigned. The connection structure includes the following two parts:

[0026] The first part is the pads distributed on the PCB board 1 that come into contact with the high-frequency signal transmission assembly 11. PCB boards 1 mainly come in two shapes: circular and rectangular. Figure 1 shows a circular PCB board 1, and the number of layers of the PCB board 1 is designed according to usage requirements. Pads are distributed on the PCB board 1, and these pads come into contact with the corresponding low-frequency signal transmission assembly 10 and high-frequency signal transmission assembly 11 to achieve signal transmission. FIG. 9 is a schematic diagram of a PCB board 1, in which contact pads 2 and welding holes 5 are distributed. The contact pads 2 include high-frequency transmission pads 3 and low-frequency transmission pads 4, which contact the high-frequency signal transmission assembly 11 and the low-frequency signal transmission assembly 10, respectively. The welding holes 5 correspond one-to-one to the contact pads 2 and are configured to be connected to a cable or other connector to output a signal.

[0027] 4 is a schematic diagram of the shape of a pad in contact with a high-frequency signal transmission assembly 11 on a PCB board 1 according to this embodiment. The pad includes a high-frequency signal transmission area 6 and a ground area 7. The ground area 7 is formed outside the high-frequency signal transmission area 6, with a gap between the high-frequency signal transmission area 6 and the ground area 7. The high-frequency signal transmission area 6 is a solid circle, and its diameter is determined based on the diameter of the pin of the high-frequency signal transmission assembly 11. The ground area 7 is a ring, and its width is determined based on the size of the portion of the outer conductor assembly 16 of the high-frequency signal transmission assembly 11 that contacts the ring. Contact between the outer conductor assembly 16 of the high-frequency signal transmission assembly 11 and the ground area 7 provides blocking and grounding functions. Contact between the inner conductor 17 of the high-frequency signal transmission assembly 11 and the high-frequency signal transmission area 6 provides high-frequency signal transmission functions.

[0028] The second part is a high-frequency signal transmission assembly 11 corresponding to a pad. As shown in Figure 5, the high-frequency signal transmission assembly 11 includes an outer conductor assembly 16 and an inner conductor assembly 17. Both the outer conductor assembly 16 and the inner conductor assembly 17 have a floating structure, and the floating direction is along the axial direction of the high-frequency signal transmission assembly 11. The outer conductor assembly 16 contacts the PCB board 1 with the elastic force of a spring, and the inner conductor assembly 17 is a pogo pin that contacts the PCB board 1 with the elastic force of the pin. The floating ranges of the outer conductor assembly 16 and the inner conductor assembly 17 can be designed according to actual requirements.

[0029] 6 shows the structure of the outer conductor assembly 16 in detail. The outer conductor assembly 16 comprises a support ring 23, a spring 24, a lower outer conductor 25, an upper outer conductor 26, and a collar 27. The upper outer conductor 26 is attached to the top end of the lower outer conductor 25, so that the upper outer conductor 26 and the lower outer conductor 25 are in elastic contact with each other. The support ring 23 is attached to the outside of the upper outer conductor 26, so that the support ring 23 and the upper outer conductor 26 can slide relative to each other in the axial direction. A spring 24 is attached to the outer wall of the lower outer conductor 25 and abuts against the support ring 23, with the other end of the spring 24 supported by a stepped surface on the outer wall of the lower outer conductor 25. The protruding end of the upper outer conductor 26 has a convex edge protruding radially, and the end of the support ring 23 has a stepped surface that fits with the convex edge, so that the support ring 23 pushes the upper outer conductor 26 to its topmost position. A collar 27 is provided between the support ring 23 and the lower outer conductor 25 to prevent the support ring 23 from slipping off the lower outer conductor 25. A protruding edge is provided on the bottom side of the upper outer conductor 26 to make elastic contact with the inner circumferential surface of the lower outer conductor 25, and two grooves are provided on the bottom side of the upper outer conductor 26 to ensure elastic contact.

[0030] 7 shows the structure of the inner conductor assembly 17 in detail. The inner conductor assembly 17 includes a pin 29, a small spring 30, a metal inner housing 31, and a metal outer housing 32. The pin 29 presses the small spring 30 into the metal inner housing 31 to form a set member, and the entire assembly is mounted within the metal outer housing 32. The head of the pin 29 protrudes from the metal inner housing 31, and the small spring 30 provides axial floating. If the pin is damaged during use or if it becomes worn and does not make a reliable contact, it can be replaced by simply removing it from the metal outer housing 32, facilitating maintenance and extending the service life of the inner conductor.

[0031] 8 is a schematic diagram of the assembled structure of the inner conductor assembly 17 and the outer conductor assembly 16. During the assembly process, an insulating medium is placed between the metal outer housing 32 and the lower outer conductor 25 to provide insulation.

[0032] FIG. 10 shows other shapes of pads on a PCB board 1 that contact a high-frequency signal transmission assembly 11. In FIG. 10(a), the high-frequency signal transmission area 6 is a solid circle, and the ground area 7 has an inner boundary that is a circle concentric with the high-frequency signal transmission area 6 and an outer boundary that is rectangular, particularly a square. In FIG. 10(b), the high-frequency signal transmission area 6 is a solid circle, and the inner boundary of the ground area 7 is a circle concentric with the high-frequency signal transmission area 6, so that the ground area 7 as a whole has a four-leaf clover shape, with the high-frequency signal transmission areas 6 located at each of the four leaves. In FIG. 10(c), the high-frequency signal transmission area 6 is a solid circle, and the inner boundary of the ground area 7 is a circle concentric with the high-frequency signal transmission area 6, so that the ground area 7 as a whole has a diamond shape, with the high-frequency signal transmission areas 6 located at the four corners and the center of the diamond. The shapes and positional relationship between the high-frequency signal transmission area 6 and the ground area 7 are not limited to these. In particular, the shape of the ground area 7 may be any shape that can ensure communication between the outer conductor assembly 16 of the high-frequency signal transmission assembly 11 and the ground area 7 .

[0033] The above examples are only for illustrating the technical solutions of the present disclosure, but are not intended to limit the same. [Industrial Applicability]

[0034] The high-quality signal transmission high-frequency connection structure based on the two-floating structure disclosed in this application has the following beneficial effects: (1) The high-frequency port of a chip testing device can transmit 20G high-frequency signals and ensure high-frequency signal transmission quality equivalent to that of a similar radio-frequency connector. Such chip testing devices are connected to pads on a PCB board using elastic contact members, eliminating the need for a limited number of ports and allowing port densities to reach approximately 2mm. (2) The outer conductor of the high-frequency signal transmission port is given a floating function, and the shape of the pad on the PCB board that contacts the high-frequency port is improved, allowing both the inner and outer conductors of the high-frequency port to elastically contact the PCB board, simultaneously achieving ground isolation and signal transmission for the high-frequency port. This improves the conditions for high-frequency signal transmission, eliminates air gaps in the high-frequency transmission line, avoids signal distortion and energy loss, and enables high-frequency signal transmission speeds of 20Gbps or more. This improves the usability of the device, expands its application scenarios, indirectly shortens the time required for device replacement, and significantly increases device utilization. (3) Furthermore, the replacement of the conductor inside the high-frequency port and the contact members of the low-frequency port is made easier, solving the problem of difficult maintenance that occurs when the contact members are damaged during use, worn out after repeated use, or lose their contact due to environmental corrosion, and thus significantly shortening the time required for maintenance, reducing maintenance costs, and extending the service life of the equipment.

[0035] Furthermore, the high-quality signal transmission high-frequency connection structure based on the two-floating structure according to the present application is feasible and can be applied to various industrial applications, such as the field of electrical component connection technology. [Explanation of symbols]

[0036] 1 PCB board 6 Transmission Area 7. Grounding Area 9 Top cover 10 Low-frequency signal transmission assembly 11 High frequency signal transmission assembly 12 plastic base 13 Base 14 Low-frequency signal transmission cable 15 High-frequency signal transmission cable 16 Outer conductor assembly 17 Inner conductor assembly 20 Inner conductor 21 outer conductor 22 Ground connection piece 23 Support ring 24 Spring 25 Lower outer conductor 26 Upper outer conductor 27 Color 29-pin 30 Small spring 31 Metal inner housing 32 Metal outer housing

Claims

1. A PCB board and a high frequency signal transmission assembly (11), The PCB board has a pad for transmitting a high frequency signal, the pad includes a high frequency signal transmission area (6) and a ground area (7), the ground area (7) is formed outside the high frequency signal transmission area (6), and there is a gap between the high frequency signal transmission area (6) and the ground area (7), the high-frequency signal transmission assembly (11) contacts the pad (Pad) of the PCB board, the high-frequency signal transmission assembly (11) includes an outer conductor assembly (16) and an inner conductor assembly (17), the outer conductor assembly (16) contacts the ground area (7), the inner conductor assembly (17) contacts the high-frequency signal transmission area (6), and the portions of the outer conductor assembly (16) and the inner conductor assembly (17) that contact the PCB board are allowed to float, thereby allowing the outer conductor assembly (16) and the inner conductor assembly (17) to contact the pad (Pad) simultaneously; The outer conductor assembly (16) comprises a support ring (23), a spring (24), a lower outer conductor (25), an upper outer conductor (26), and a collar (27), the upper outer conductor (26) is fixedly attached to an end of the lower outer conductor (25), the support ring (23) is fitted around the outside of the upper outer conductor (26), the support ring (23) is capable of sliding relative to the upper outer conductor (26) in the axial direction, the spring (24) is fitted around the outer wall of the lower outer conductor (25), the spring (24) abuts against the support ring (23), and the other end of the spring (24) is supported by a stepped surface provided on the outer wall of the lower outer conductor (25).

2. A high-quality signal transmission high-frequency connection structure based on a floating structure.

2. The high frequency signal transmission area (6) is a solid circle, and the gap between the high frequency signal transmission area (6) and the ground area (7) is a ring around the outside of the high frequency signal transmission area (6).

2. A high-quality signal transmission high-frequency connection structure based on the floating structure according to claim 1.

3. The grounding area (7) has a circular or arc-shaped inner boundary concentric with at least the high frequency signal transmission area (6).

3. A high-quality signal transmission high-frequency connection structure based on the two-floating structure according to claim 1 or 2.

4. The contact area (7) is in the shape of a four-leaf clover or a diamond.

3. A high-quality signal transmission high-frequency connection structure based on the two-floating structure according to claim 1 or 2.

5. The high frequency signal transmission areas (6) are located at the four leaves of the four-leaf clover or the four corners of the diamond, respectively.

5. A high-quality signal transmission high-frequency connection structure based on a two-floating structure according to claim 4.

6. The projecting end of the upper outer conductor (26) has a position limiting protrusion projecting radially relative to the support ring (23).

2. A high-quality signal transmission high-frequency connection structure based on the floating structure according to claim 1.

7. The end of the support ring (23) has a stepped surface that fits with the position limiting protrusion.

7. A high-quality signal transmission high-frequency connection structure based on the two floating structures according to claim 6.

8. The collar (27) is disposed between the support ring (23) and the lower outer conductor (25).

2. A high-quality signal transmission high-frequency connection structure based on the floating structure according to claim 1.

9. The bottom side of the upper outer conductor (26) is provided with a protruding edge that elastically contacts the inner circumferential surface of the lower outer conductor (25), and the bottom side of the upper outer conductor (26) is provided with two grooves.

2. A high-quality signal transmission high-frequency connection structure based on the floating structure according to claim 1.

10. The inner conductor assembly (17) comprises a pin (29), a small spring (30), a metal inner housing (31), and a metal outer housing (32). The pin (29) presses the small spring (30) into the metal inner housing (31) to form a set member, which is attached to the metal outer housing (32). The head portion of the pin (29) protrudes from the metal inner housing (31), and the small spring (30) provides axial floating.

3. A high-quality signal transmission high-frequency connection structure based on the two-floating structure according to claim 1 or 2.

11. The inner conductor assembly (17) is a pogo pin, and the pogo pin contacts the PCB board by the elastic force of the pin.

3. A high-quality signal transmission high-frequency connection structure based on the two-floating structure according to claim 1 or 2.

12. An insulating medium is placed between the inner conductor assembly (17) and the outer conductor assembly (16).

3. A high-quality signal transmission high-frequency connection structure based on the two-floating structure according to claim 1 or 2.

13. The inner conductor assembly (17) and the outer conductor assembly (16) both have a floating structure, and the floating direction is along the axial direction of the high-frequency signal transmission assembly (11).

3. A high-quality signal transmission high-frequency connection structure based on the two-floating structure according to claim 1 or 2.

Images