Multilayer electronic components

Abstract

To provide a multilayer electronic component with reduced ESL and increased bending strength.SOLUTION: A multilayer electronic component according to an embodiment of the present invention includes a body that includes a capacitance forming portion including a plurality of dielectric layers and including first and second internal electrodes alternately arranged in a third direction with the dielectric layers interposed therebetween, and includes first and second surfaces facing in the first direction, third and fourth surfaces connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in the third direction, 1-1 and 1-2 external electrodes arranged on the first surface, connected to the first internal electrode, and spaced apart from each other in the second direction, a 2-1 external electrode arranged on the first surface, connected to the second internal electrode, and arranged between the 1-1 external electrode and the 1-2 external electrode, and a dummy electrode arranged to penetrate the capacitance forming portion in a third direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small in size, having high capacitance, and being easy to mount, and can be used as components of various electronic devices. Recently, as various electronic devices such as computers and mobile devices have become smaller and have higher output, there has been an increasing demand for smaller multilayer ceramic capacitors with higher capacitance.

[0004] Recently, the industry has become increasingly interested in automotive electrical components, and multilayer ceramic capacitors are being used in automobiles and infotainment systems, so they are being required to have high reliability and high strength properties.

[0005] When the equivalent series inductance (ESL) of a multilayer ceramic capacitor increases, the performance of electronic devices can be degraded. As a result, there is growing demand for so-called "Low Inductance Chip Capacitors (LICCs)," which are MLCCs with a vertically stacked three-terminal structure that minimizes the current loops formed inside the MLCC by arranging the internal electrodes perpendicular to the surface of the board on which they are mounted, thereby increasing the number of current loops and reducing ESL. Summary of the Invention [Problem to be solved by the invention]

[0006] One of several objects of the present invention is to provide a multilayer electronic component with reduced ESL.

[0007] One of several objects of the present invention is to provide a laminated electronic component having enhanced bending strength.

[0008] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A multilayer electronic component according to one embodiment of the present invention includes a main body including a plurality of dielectric layers, a capacitance forming portion including first and second internal electrodes alternately arranged in a third direction with the dielectric layers sandwiched therebetween, the main body including first and second surfaces facing the first direction, third and fourth surfaces connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing the third direction; 1-1 and 1-2 external electrodes arranged on the first surfaces, connected to the first internal electrodes, and spaced apart from each other in the second direction; and a 2-1 external electrode arranged on the first surface, connected to the second internal electrode, and arranged between the 1-1 external electrode and the 1-2 external electrode. and a dummy electrode arranged to penetrate the capacitance forming portion in a third direction, wherein the first internal electrode includes a first main portion, a 1-1 lead portion connecting the first main portion to a 1-1 external electrode, and a 1-2 lead portion connecting the first main portion to a 1-2 external electrode, the second internal electrode includes a second main portion and a 2-1 lead portion connecting the second main portion to a 2-1 external electrode, and the dummy electrode includes a 1-1 dummy electrode arranged to penetrate between the 1-1 lead portion and the 2-1 lead portion in the third direction, and a 1-2 dummy electrode arranged to penetrate between the 1-2 lead portion and the 2-1 lead portion in the third direction. [Effects of the Invention]

[0010] One of the various effects of the present invention is that it is possible to reduce ESL by minimizing the current loop formed inside the multilayer electronic component.

[0011] One of the various effects of the present invention is that the bending strength characteristics can be improved by disposing a dummy electrode that penetrates the capacitance forming portion.

[0012] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a diagram schematically illustrating a perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] 2 is a perspective view schematically illustrating the multilayer electronic component of FIG. 1 as viewed from another direction. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] 2 is a view showing a first internal electrode disposed on a dielectric layer included in the main body of FIG. 1; [Figure 5] 2 is a view showing a second internal electrode disposed on a dielectric layer included in the main body of FIG. 1; [Figure 6] 2 is a diagram showing a dielectric layer included in the main body of FIG. 1; [Figure 7] FIG. 2 is an exploded perspective view schematically showing the main body of FIG. 1 in an exploded state. [Figure 8] 2 is a diagram showing a modification of FIG. 1; [Figure 9] 1 is a schematic perspective view of a multilayer electronic component according to another embodiment of the present invention; [Figure 10] 10 is a diagram schematically showing a perspective view of the multilayer electronic component of FIG. 9 as seen from another direction. [Figure 11] 10 is a view showing a first internal electrode disposed on a dielectric layer included in the body of FIG. 9; [Figure 12] 10 is a view showing a second internal electrode disposed on a dielectric layer included in the body of FIG. 9; [Figure 13] 10 is a diagram showing a dielectric layer included in the body of FIG. 9. [Figure 14] FIG. 10 is an exploded perspective view schematically showing the main body of FIG. 9 in an exploded state. [Figure 15] 10 is a diagram showing a modified example of FIG. 9. [Figure 16] 1 is a diagram for explaining a bending strength test. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the illustrations. Furthermore, components that have the same function within the same concept are described with the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain component, it does not mean that it excludes other components, but that it may further include other components, unless otherwise specified to the contrary.

[0016] In the drawings, the third direction can be defined as the stacking direction or width (W) direction, the second direction as the length (L) direction, and the first direction as the thickness (T) direction.

[0017] <Multilayer electronic components> FIG. 1 is a schematic perspective view of a multilayer electronic component 100 according to an embodiment of the present invention, FIG. 2 is a schematic perspective view of the multilayer electronic component 100 of FIG. 1 as viewed from another direction, FIG. 3 is a cross-sectional view taken along line I-I' of FIG. 1, FIG. 4 is a diagram showing a first internal electrode disposed on a dielectric layer included in the body of FIG. 1, FIG. 5 is a diagram showing a second internal electrode disposed on a dielectric layer included in the body of FIG. 1, FIG. 6 is a diagram showing a dielectric layer included in the body of FIG. 1, and FIG. 7 is an exploded perspective view showing a schematic exploded view of the body of FIG. 1.

[0018] A multilayer electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to FIGS.

[0019] A multilayer electronic component 100 according to one embodiment of the present invention includes a main body 110 including a plurality of dielectric layers 111, a capacitance forming portion Ac including first and second internal electrodes 121, 122 alternately arranged in a third direction with the dielectric layers sandwiched therebetween, the main body 110 including first and second surfaces 1, 2 facing the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing the third direction, 1-1 and 1-2 external electrodes 131-1, 131-2 arranged on the first surfaces, connected to the first internal electrodes, and spaced apart from each other in the second direction, a 2-1 external electrode 132-1 arranged on the first surface, connected to the second internal electrode, and arranged between the 1-1 external electrode and the 1-2 external electrode, and a dummy electrode DE arranged to penetrate the capacitance forming portion Ac in the third direction, the first internal electrode 121 including a first main portion 121m, a 1-1 lead portion 121-1 connecting the first main portion and the 1-1 external electrode, and a 1-2 lead portion 121-2 connecting the first main portion and the 1-2 external electrode, the second internal electrode 122 including a second main portion 122m and a 2-1 lead portion 122-1 connecting the second main portion and the 2-1 external electrode, and the dummy electrode includes a 1-1 dummy electrode 123-1 arranged to penetrate between the 1-1 lead portion and the 2-1 lead portion in the third direction, and a 1-2 dummy electrode 123-2 arranged to penetrate between the 1-2 lead portion and the 2-1 lead portion in the third direction.

[0020] According to an embodiment of the present invention, the first surface of the multilayer electronic component 100 can serve as a mounting surface by arranging the first-1, first-2, and second-1 external electrodes 131-1, 131-2, and 132-1 on the first surface, and the first-1 and first-2 external electrodes 131-1 and 131-2 are connected to the first internal electrode 121, and the second-1 external electrode 132-1 is connected to the second internal electrode 122 and disposed between the first-1 and first-2 external electrodes 131-1 and 131-2, thereby minimizing current loops and increasing the number of current loops, thereby reducing ESL. In addition, the first and second internal electrodes 121 and 122 are arranged perpendicular to the first surface, which is the mounting surface, thereby further reducing the current loops.

[0021] Furthermore, by including a dummy electrode DE arranged to penetrate the capacitance forming portion Ac in the third direction, the electrode filling rate inside the main body 110 can be improved, the bending strength can be strengthened, and the occurrence of cracks, delamination, etc. can be suppressed.

[0022] Each of the components of the multilayer electronic component 100 will be described in detail below.

[0023] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 alternately stacked.

[0024] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may not be a hexahedral shape with perfectly straight lines, but may have a substantially hexahedral shape.

[0025] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first and second surfaces 1 and 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the third and fourth surfaces 3 and 4 and face each other in a third direction.

[0026] The mounting surface of the multilayer electronic component 100 can be the first surface 1 or the second surface 2 of the main body 110.

[0027] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0028] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can obtain a sufficient capacitance. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-y Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba<00000​​​​​​​​​​​​​​​​

[0030] The main body 110 may include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed opposite each other with a dielectric layer 111 sandwiched therebetween to form a capacitance, and cover portions 112 and 113 that are formed on both end surfaces of the capacitance forming portion Ac in the third direction.

[0031] Furthermore, the capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121, 122 in the third direction with a dielectric layer 111 sandwiched therebetween.

[0032] The cover portions 112, 113 may include a first cover portion 112 disposed on one side of the capacitance forming portion Ac in the third direction and a second cover portion 113 disposed on the other side of the capacitance forming portion Ac in the third direction.

[0033] The first cover part 112 and the second cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the third direction on both end surfaces of the capacitance forming part Ac in the third direction, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0034] The cover portions 112, 113 do not include internal electrodes, but may include dummy electrodes DE that pass through the cover portions 112, 113.

[0035] The cover parts 112 and 113 may include the same material as the dielectric layer 111. That is, the first cover part 112 and the second cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0036] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layers 111 .

[0037] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 may be alternately arranged to face each other with the dielectric layer 111 constituting the body 110 sandwiched therebetween.

[0038] The first internal electrode 121 may include a first main part 121m, a first lead part 121-1 connecting the first main part 121m to the first external electrode 131-1, and a first lead part 122-2 connecting the first main part 121m to the first external electrode 131-2. The first lead part 121-1 and the first lead part 121-2 are exposed to the first surface 1 of the body 110 and may electrically connect the first internal electrode 121 to the first and second external electrodes 131-1 and 131-2.

[0039] The second internal electrode 122 may include a second main part 122m and a second lead part 122-1 connecting the second main part 122m to the second external electrode 132-1. The second lead part 122-1 may be exposed to the first surface 1 of the body 110 to electrically connect the second internal electrode 122 to the second external electrode 132-1.

[0040] The first and second main parts 121m and 122m may overlap each other in the third direction to form a capacitance. The first and second main parts 121m and 122m may be disposed apart from the first to sixth surfaces.

[0041] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0042] The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed in the third direction, and then firing the stacked sheets.

[0043] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0044] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof onto a ceramic green sheet. The method for printing the conductive paste for internal electrodes may be screen printing or gravure printing, but the present invention is not limited thereto.

[0045] The dummy electrode DE can be arranged to penetrate the capacitance forming portion Ac in the third direction.

[0046] In order to enhance bending strength, it is possible to consider arranging a dummy pattern on the same plane as the internal electrodes. However, arranging the dummy pattern so that it is not electrically connected to the internal and external electrodes imposes spatial constraints, which limits the ability to increase the electrode filling rate of the body 110.

[0047] Meanwhile, according to the present invention, the dummy electrodes DE are arranged to penetrate the capacitance-forming portion Ac in the third direction, which is the stacking direction, so that the dummy electrodes can be arranged on the same plane as not only the internal electrodes 121 and 122 but also the dielectric layer 111, thereby further improving the electrode filling rate of the main body 110 and further improving the bending strength. As shown in Figures 3 and 4, the dummy electrodes DE are arranged on the same plane as the internal electrodes 121 and 122, and also on the same plane as the dielectric layer 111, as shown in Figure 5. Furthermore, as the dummy electrodes DE are arranged to penetrate the capacitance-forming portion Ac in the third direction, which is the stacking direction of the dielectric layers 111, the dummy electrodes DE can serve to improve the bonding strength between the stacked dielectric layers 111 and prevent delamination.

[0048] The dummy electrode DE may not be involved in capacitance formation by being disposed apart from the first and second internal electrodes 121 and 122. In addition, the dummy electrode DE may be electrically insulated from the external electrodes disposed on the first surface by being disposed apart from the first surface.

[0049] Referring to FIG. 3, the dummy electrode DE may include a 1-1 dummy electrode 123-1 arranged to penetrate between the 1-1 lead portion 121-1 and the 2-1 lead portion 122-1 in the third direction, and a 1-2 dummy electrode 123-2 arranged to penetrate between the 1-2 lead portion 121-2 and the 2-1 lead portion 122-1 in the third direction.

[0050] On the other hand, the shape of the dummy electrode DE does not need to be particularly limited, and the specific shape of the dummy electrode can be determined in consideration of the desired bending strength characteristics, the shapes of the internal electrodes 121 and 122, and the like.

[0051] Furthermore, the number of dummy electrodes DE does not need to be particularly limited, and can be determined in consideration of the desired bending strength characteristics, the shape of the internal electrodes, etc. For example, a plurality of first-first dummy electrodes 123-1 and a plurality of first-second dummy electrodes 123-2 can be disposed. This can further improve the metal filling rate inside the main body 110, and can further improve the bending strength.

[0052] In one embodiment, the dummy electrodes 123-1, 123-2, 124-1, and 124-2 may further include second dummy electrodes 124-1 and 124-2 disposed to penetrate in the third direction through a region where the second surfaces of the first and second internal electrodes 121 and 122 are spaced apart. By disposing the second dummy electrodes 124-1 and 124-2, the metal filling rate inside the body 110 can be further improved, thereby further improving the bending strength improvement effect and delamination suppression effect according to the present invention.

[0053] In this case, a plurality of second dummy electrodes 124-1, 124-2 may be arranged. Since the area where the first and second internal electrodes 121, 122 and the second surface are separated is wider than the area between the 1-1 lead portion 121-1 and the 2-1 lead portion 122-1 and the area between the 1-2 lead portion 121-2 and the 2-1 lead portion 122-1, it is possible to arrange a greater number of second dummy electrodes 124-1, 124-2.

[0054] The material for forming the dummy electrodes DE is not particularly limited, and a material having strength superior to that of the dielectric layer 111 can be used. For example, a metal material having strength superior to that of the ceramic material constituting the dielectric layer 111 can be used, and like the internal electrodes, the dummy electrodes DE can contain one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. However, the dummy electrodes do not have to be limited to the same material as the internal electrodes, and can be formed of a different material from the internal electrodes.

[0055] The method for forming the dummy electrodes DE is not particularly limited. For example, holes may be drilled in the ceramic green sheets at positions where the dummy electrodes are to be formed using a laser drill, a mechanical pin puncher, or the like, and then a conductive paste may be printed in the holes when the first and second internal electrodes are printed. In this case, the dummy electrodes may not be formed in the ceramic green sheets for forming the cover portions, and thus the dummy electrodes may not be disposed on the cover portions 112 and 113. Of course, holes may also be drilled in the ceramic green sheets for forming the cover portions and the dummy electrodes may be printed thereon so that the dummy electrodes penetrate not only the capacitance-forming portions but also the cover portions, penetrating the entire body in the third direction. Therefore, the dummy electrodes DE may be disposed so as to penetrate the body 110 in the third direction.

[0056] As another example, ceramic green sheets may be stacked to form a laminate, and the laminate may be cut into a unit chip size. Vias may be formed in the cut laminate using a laser drill, a mechanical pin puncher, etc., and then the vias may be filled with a conductive material to form dummy electrodes DE. Thus, the dummy electrodes DE may be disposed to penetrate the body 110 in the third direction.

[0057] On the other hand, when the dummy electrodes DE are arranged to penetrate the main body 110 in the third direction, the multilayer electronic component 100-1 may include insulating layers 141 and 142 arranged on the fifth and sixth surfaces of the main body 110, as shown in Fig. 8. When the dummy electrodes DE are exposed on the fifth and sixth surfaces of the main body, they may become a moisture penetration path for moisture, plating solution, etc. to penetrate into the main body 110. Therefore, by providing the insulating layers 141 and 142, reliability can be improved.

[0058] The external electrodes 131-1, 131-2, and 132-1 may be disposed on the first surface 1 of the body 110.

[0059] The external electrodes 131-1, 131-2, and 132-1 are arranged on the first surface 1 of the main body 110 and may include a 1-1 external electrode 131-1 and a 1-2 external electrode 131-2 connected to the first internal electrode 121, and a 2-1 external electrode 132-1 connected to the second internal electrode.

[0060] The 1-1 external electrode 131-1 and the 1-2 external electrode 131-2 may be spaced apart from each other in the second direction, and the 2-1 external electrode 132-1 may be disposed between the 1-1 external electrode 131-1 and the 1-2 external electrode 131-2, thereby minimizing the current loop and reducing ESL.

[0061] Meanwhile, the external electrodes 131-1, 131-2, and 132-1 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0062] For example, the external electrodes 131-1, 131-2, and 132-1 may include an electrode layer disposed on the body 110 and a plating layer formed on the electrode layer.

[0063] As a more specific example of the electrode layer, the electrode layer may be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and resin. Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the body 110. Also, the electrode layer may be formed by transferring a sheet including a conductive metal onto the body 110, or by transferring a sheet including a conductive metal onto a fired electrode.

[0064] The conductive metal contained in the electrode layer may be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0065] The plating layer formed on the electrode layer serves to improve mounting characteristics. The type of the plating layer is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0066] Meanwhile, although Figures 1 to 8 show the case where the external electrodes are arranged on the first surface of the main body 110, the present invention is not limited thereto, and according to another embodiment of the present invention, the external electrodes may also be arranged on the second surface of the main body 110.

[0067] A multilayer electronic component 100-2 according to another embodiment of the present invention will be described in detail below with reference to Figures 9 to 14. However, to avoid redundancy, content that overlaps with the content described above will be omitted.

[0068] FIG. 9 is a diagram schematically illustrating a perspective view of a multilayer electronic component 100-2 according to another embodiment of the present invention, FIG. 10 is a diagram schematically illustrating a perspective view of the multilayer electronic component 100-2 of FIG. 9 from another direction, FIG. 11 is a diagram showing a first internal electrode disposed on a dielectric layer included in the body of FIG. 9, FIG. 12 is a diagram showing a second internal electrode disposed on a dielectric layer included in the body of FIG. 9, FIG. 13 is a diagram showing a dielectric layer included in the body of FIG. 9, and FIG. 14 is an exploded perspective view schematically illustrating the body of FIG. 9 disassembled.

[0069] 9 and 10, the 1-1, 1-2, and 2-1 external electrodes 131-1, 131-2, and 132-1 may be arranged on a first surface of the main body 110, and the 1-3, 1-4, and 2-2 external electrodes 131-3, 131-4, and 132-2 may be arranged on a second surface of the main body 110. By arranging the external electrodes 131-3, 131-4, and 132-2 on the second surface of the main body 110 as well, the first surface or the second surface can be used as a mounting surface, thereby improving the degree of freedom in mounting.

[0070] The first, second and third external electrodes 131-3, 131-4 and 132-2 are arranged on the second surface of the body 110, so that the first internal electrode 121 further includes a first-third lead portion 121-3 connecting the first main portion 121m and the first-third external electrode 131-3 and a first-fourth lead portion 121-4 connecting the first main portion 121m and the first-fourth external electrode 131-4, and the second internal electrode 122 further includes a second-second lead portion 122-2 connecting the second main portion 122m and the second-second external electrode 131-2.

[0071] In addition, the dummy electrode DE may further include a 1-3 dummy electrode 123-3 arranged to penetrate between the 1-3 lead portion 121-3 and the 2-2 lead portion 122-2 in the third direction, and a 1-4 dummy electrode 123-4 arranged to penetrate between the 1-4 lead portion 121-4 and the 2-2 lead portion 122-2 in the third direction.

[0072] By disposing the first-third and first-fourth dummy electrodes 123-3 and 123-4, the metal filling rate inside the body 110 can be further improved, and the effects of improving bending strength and suppressing delamination according to the present invention can be further improved.

[0073] In this case, the first-third and first-fourth dummy electrodes 123-3 and 123-4 may each be arranged in plural numbers, thereby further improving the metal filling rate inside the body 110, and further improving the bending strength and the delamination suppression effects.

[0074] 15, the multilayer electronic component 100-4 may include insulating layers 141 and 142 disposed on the fifth and sixth surfaces of the main body 110. If the dummy electrodes DE are exposed on the fifth and sixth surfaces of the main body 110, they may act as a moisture penetration path for moisture, plating solution, and the like to penetrate into the main body 110. Therefore, by disposing the insulating layers 141 and 142, reliability can be improved.

[0075] (Example) Table 1 below shows the evaluation of the bending strength characteristics of a sample (test number 1) in which external electrodes are arranged on the first and second surfaces and no dummy electrode DE is arranged, a sample (test number 2) in which 1-1 and 1-2 dummy electrodes 123-1, 123-2 are arranged, and a sample (test number 3) in which 1-1, 1-2, 1-3 and 1-4 dummy electrodes 123-1, 123-2, 123-3, 123-4 are arranged, as shown in Figures 9 and 10.

[0076] Referring to Figure 16, the bending strength characteristics were measured by preparing 1,000 sample chips for each test number, mounting the sample chips (MLCCs) on a substrate (PCB), and applying stress by pressing the surface opposite the mounting surface of the sample chip (MLCC) up to 5 mm.The sample chips (MLCCs) were then observed under an optical microscope, and if cracks or delamination occurred, they were determined to be defective. The number of defective samples out of the total number of sample chips was recorded.

[0077] [Table 1]

[0078] In the case of test numbers 2 and 3, in which dummy electrodes 1-1 and 1-2 were placed, the defect rate was reduced to less than half compared to test number 1, in which dummy electrodes were not placed, and it was confirmed that the bending strength characteristics were significantly improved.

[0079] It can also be seen that test number 3, in which dummy electrodes 1-3 and 1-4 were further arranged, had significantly improved bending strength characteristics compared to test number 2.

[0080] Therefore, it is preferable to arrange two or more dummy electrodes, and more preferably four or more dummy electrodes.

[0081] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0082] 100 Multilayer electronic components 110 Main Unit 111 Dielectric layer Ac capacity forming part 112, 113 Cover 121, 122 Internal electrode 121m, 122m main section 121-1, 121-2, 121-3, 121-4, 122-1, 122-2 Lead part DE, 123-1, 123-2, 123-3, 123-4, 124-1, 124-2 Dummy electrodes 131-1, 131-2, 131-3, 131-4, 132-1, 132-2 External electrode 141, 142 insulating layer

Claims

1. a main body including a plurality of dielectric layers, the main body including a capacitance forming portion including first internal electrodes and second internal electrodes alternately arranged in a third direction with the dielectric layers sandwiched therebetween, the main body including a first surface and a second surface facing the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing the third direction; a first external electrode and a second external electrode disposed on the first surface, connected to the first internal electrode, and spaced apart from each other in the second direction; a second-first external electrode disposed on the first surface, connected to the second internal electrode, and disposed between the first-first external electrode and the first-second external electrode; a dummy electrode disposed so as to penetrate the capacitance forming portion in the third direction, the first internal electrode includes a first main part, a first-1 lead part connecting the first main part to the first-1 external electrode, and a first-2 lead part connecting the first main part to the first-2 external electrode; the second internal electrode includes a second main part and a second-1 lead part connecting the second main part and the second-1 external electrode; the dummy electrodes include a 1-1 dummy electrode arranged so as to penetrate between the 1-1 lead portion and the 2-1 lead portion in the third direction, and a 1-2 dummy electrode arranged so as to penetrate between the 1-2 lead portion and the 2-1 lead portion in the third direction.

2. 2. The multilayer electronic component according to claim 1, wherein the dummy electrodes are disposed apart from the first internal electrodes and the second internal electrodes.

3. The multilayer electronic component according to claim 1 , wherein the dummy electrodes are disposed apart from the first surface.

4. 2. The multilayer electronic component according to claim 1, wherein a plurality of the first-1 dummy electrodes and a plurality of the first-2 dummy electrodes are arranged.

5. 2. The multilayer electronic component according to claim 1, wherein the dummy electrodes further include a second dummy electrode disposed to penetrate in the third direction through a region where the first internal electrode and the second internal electrode are spaced from the second surface.

6. 6. The multilayer electronic component according to claim 5, wherein a plurality of said second dummy electrodes are arranged.

7. The multilayer electronic component according to claim 1 , wherein four or more of the dummy electrodes are arranged.

8. The multilayer electronic component according to claim 1 , wherein the dummy electrodes are arranged to penetrate the main body in the third direction.

9. The multilayer electronic component according to claim 8 , further comprising an insulating layer disposed on the fifth surface and the sixth surface.

10. a first external electrode and a first external electrode connected to the first internal electrode and spaced apart from each other in the second direction; a second-second external electrode disposed on the second surface, connected to the second internal electrode, and disposed between the first-third external electrode and the first-fourth external electrode; the first internal electrode further includes a first-third lead portion connecting the first main portion and the first-third external electrode and a first-fourth lead portion connecting the first main portion and the first-fourth external electrode; 10. The multilayer electronic component according to claim 1, wherein the second internal electrode further includes a second-second lead portion connecting the second main portion and the second-second external electrode.

11. 11. The multilayer electronic component according to claim 10, wherein the dummy electrodes further include a 1-3 dummy electrode arranged to penetrate between the 1-3 lead portion and the 2-2 lead portion in the third direction, and a 1-4 dummy electrode arranged to penetrate between the 1-4 lead portion and the 2-2 lead portion in the third direction.

12. 12. The multilayer electronic component according to claim 11, wherein a plurality of the first-third dummy electrodes and a plurality of the first-fourth dummy electrodes are arranged.

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