Liquid-cooled vapor chamber heat dissipation module

Abstract

To provide a highly efficient liquid cooling vapor chamber heat dissipation module composed of a liquid cooling cover and an integrated vapor chamber assembled together.SOLUTION: A liquid-cooling vapor chamber heat dissipation module includes a liquid-cooling cover, a metal top cover plate, and a metal bottom cover plate. The liquid-cooling cover includes an upper portion, a side wall, and an accommodating space. The side wall includes a liquid inlet and a liquid outlet. A heat-dissipating outer surface of the metal top cover plate has a plurality of columnar heat-dissipating structures. An evaporating inner surface of the metal bottom cover plate has a plurality of bottom grooves arranged parallel to each other and a plurality of support structures protruding between the bottom grooves. After the metal top cover plate and the metal bottom cover plate are joined together, an integrated vapor chamber is formed, and the liquid-cooling cover is joined to the heat-dissipating outer surface of the metal top cover plate, and the columnar heat-dissipating structures are installed in the accommodating space, and allows cooling liquid to enter the accommodating space from the liquid inlet and flow through the columnar heat-dissipating structures, and flow out from the liquid outlet.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a vapor chamber heat dissipation module, and more particularly to a liquid-cooled vapor chamber heat dissipation module. [Background technology]

[0002] The explosive development of generative artificial intelligence (generative AI) or AI-generated content (AIGC) is significantly increasing the demand for high-speed computing capabilities and the development of high-end computing chip modules. AIGC applications require massive amounts of data to be processed, and the demand for high-speed processing is driving increasing demand for high-end AI servers. High-end AI servers simultaneously utilize more central processing units (CPUs) and graphics processing units (GPUs). To meet the high-speed, high-capacity computing requirements of generative AI (e.g., ChatGPT), the high-end chips used contain as many as 175 billion transistors. The increasing efficiency and power consumption of AI server chips poses a major challenge in terms of heat dissipation capabilities, which can accommodate the large number of high-density heat sources. For example, server processor power consumption in 2018 was around 180W to 280W, but is expected to double to over 500W by 2023. For example, the 2022 AMD 5nm Genoa processor and the A100 chip developed by GPU manufacturer NVIDIA already consume 400W of power, about 40-50% higher than the previous generation of processors. By 2023, the energy consumption of the Bergamo processor is expected to exceed 500W, and the maximum power of NVIDIA's new generation of high-end GPU H100 chips, created specifically for AI servers, will reach 700W. The number of chips used in servers will increase in line with the number of clients, increasing power consumption and the complexity of modular design for heat dissipation solutions.

[0003] With the upgrade of new generation GPUs and CPUs, server computing, AI image generation, and e-sports applications are the main driving forces behind the growth of the heat dissipation industry. From the perspective of server heat dissipation technologies, they can be mainly divided into air cooling, liquid cooling, and immersion cooling. Currently, air cooling is the mainstream for mid-range computing servers.

[0004] As the computing power of ChatGPT or high-end AI servers continues to expand, their heat dissipation capacity must be at least 700W. NVIDIA's A100 or H100 AI servers typically contain four to eight GPUs, each generating an additional 300 to 700W of heat energy, with the entire AI server's estimated thermal power consumption exceeding 3,000W. Given that traditional air-cooling cannot provide such efficient heat dissipation, the industry currently uses traditional single-phase immersion cooling technology to solve the heat dissipation problem of high-density heat-generating server components, but this remains limited to a 600W limit.

[0005] To solve heat dissipation problems such as high heat energy consumption of high-speed computing components, insufficient heat dissipation capacity, and excessive energy consumption, the introduction of "liquid cooling" technology has become a new trend. Liquid cooling utilizes the fact that liquid conducts heat more easily than gas, and quickly transfers the high-density heat energy generated by heat-generating components to the cooling liquid through the liquid cooling host. The cooling liquid then absorbs heat and is directed to an outdoor cooling tower or heat dissipation module, which then dissipates the heat energy into the atmosphere, achieving rapid cooling and reducing energy consumption.

[0006] A typical liquid cooling module typically consists of a heat sink with a liquid cooling cover covering the heat dissipation structure, which is then fastened together with screws to form a cavity. The liquid cooling cover has an inlet and an outlet. The coolant flows through the inlet into the cavity formed by the attachment of the liquid cooling cover and the heat sink, passes through the heat dissipation structure, and then flows out the outlet and through a conduit to an external heat dissipation system, dissipating the heat carried by the coolant. The continuous and rapid circulation of the coolant quickly removes the large amount of heat generated by the heat-generating component, achieving rapid heat dissipation. However, when the metal base plate of the heat sink contacts the heat-generating component, the lateral heat conduction rate of the metal base plate is limited by its cross-sectional area. This prevents the large amount of heat rapidly generated by the heat-generating component from being efficiently conducted laterally across the entire metal base plate of the heat sink. Instead, the heat accumulates in the local contact area between the heat sink and the heat-generating component. Even with liquid cooling, the heat dissipation performance improvement is very limited.

[0007] In view of the above problems, the inventors of the present invention replaced the metal base plate of a heat sink with a copper vapor chamber, integrally molding the heat sink's heat dissipation structure and integrating it into the vapor chamber's heat dissipation surface. When a heat-generating component attached to the heat-absorbing surface of the vapor chamber generates a large amount of heat, the heat is rapidly conducted to the vapor chamber, whereupon the working fluid present in the vapor chamber's internal space quickly absorbs the heat and rapidly evaporates to form vapor. Because the vapor chamber's heat dissipation surface is connected to the heat sink, the vapor rapidly rises and contacts the cold metal surface in contact with the heat sink, whereupon it condenses again to form working fluid, quickly absorbing and releasing a large amount of heat through this liquid-gas-liquid phase change cycle. Compared to a conventional copper base plate, the vapor chamber can more quickly diffuse a concentrated large amount of heat source over a wider area of ​​the heat sink, resulting in a larger effective heat dissipation area and faster heat dissipation.

[0008] Vapor chambers utilize the phase change of the working fluid in a sealed working chamber to quickly dissipate heat, and are currently the most efficient heat dissipation method. The purpose of rapid heat dissipation is achieved by utilizing the large amount of latent heat of vaporization involved in the process of the working fluid rapidly vaporizing and condensing in the near-vacuum chamber. The thermal conductivity of vapor chambers is 10,000 W / (m 2 ·℃) or more, which is several dozen times the thermal conductivity of conventional air convection or liquid convection. When the above heat sink is integrated into the heat dissipation surface of the vapor chamber through one-piece molding, it quickly and effectively conducts and dissipates a large amount of heat from inside the vapor chamber to the heat dissipation structure, greatly improving the heat dissipation efficiency.

[0009] However, the AI ​​servers mentioned above often have many high-power chip modules installed, and these AI servers are often densely packed in machine rooms. In such situations, the ambient temperature also rises, making it difficult for the air-cooled heat dissipation method to effectively dissipate the large amount of heat generated by the heat sink, and the heat dissipation efficiency of the heat dissipation modules cannot fully meet demands. Summary of the Invention [Problem to be solved by the invention]

[0010] SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a highly efficient liquid-cooled vapor chamber heat dissipation module, which is constructed by combining a liquid-cooled cover and an integrated vapor chamber. [Means for solving the problem]

[0011] The liquid-cooled vapor chamber heat dissipation module of the present invention includes a liquid-cooled cover and an integrated vapor chamber. The liquid-cooled cover includes an upper portion and a sidewall connected to the upper portion, the sidewall surrounding the upper portion to form a storage space, and the sidewall is provided with at least one liquid inlet and at least one liquid drain port, which communicate with the storage space. The integrated vapor chamber includes a metal upper cover plate, a metal lower cover plate, an air intake channel, a capillary structure, and a working fluid. The metal upper cover plate includes a heat-dissipating outer surface and a condensing inner surface, the heat-dissipating outer surface having a plurality of columnar heat-dissipating structures, and an upper frame of an appropriate height is provided around the condensing inner surface, the upper frame is provided with upper channel grooves, and the condensing inner surface has a plurality of upper grooves arranged parallel to each other. The metal bottom cover plate includes a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface is used for contacting the heat-dissipating electronic component, a lower frame of appropriate height is provided around the evaporation inner surface, the lower frame is provided with a lower channel groove, the evaporation inner surface has a plurality of lower grooves arranged parallel to each other and a plurality of support structures protruding between the lower grooves, the upper frame of the metal top cover plate and the lower frame of the metal bottom cover plate are joined to each other to form a working space, and the condensation inner surface of the metal top cover plate and the evaporation inner surface of the metal bottom cover plate face each other, the arrangement of the upper grooves and the lower grooves can be mapped and overlapped to each other, the support structures protrude and extend from the evaporation inner surface and abut between the upper grooves of the condensation inner surface to support the working space, the intake channel is formed by correspondingly joining the upper channel groove and the lower channel groove and is used for drawing air into the working space, a capillary structure is installed in the lower groove or in the upper and lower grooves, and the working fluid is present in the working space and the capillary structure. The liquid-cooled cover is made of a metal sheet, and the metal upper cover plate is made of a metal sheet, and the metal lower cover plate .... In addition, the liquid-cooled cover is joined to the heat-dissipating outer surface of the metal upper cover plate, and the columnar heat-dissipating structure is installed in the storage space, and the coolant enters the storage space through the liquid supply port, passes between the columnar heat-dissipating structure, and flows out through the liquid discharge port. [Effects of the Invention]

[0012] According to an embodiment of the present invention, a liquid-cooled vapor chamber heat dissipation module is provided, which includes a liquid-cooled cover bonded to the heat-dissipating outer surface of a metal top cover plate, a columnar heat dissipation structure disposed in the accommodation space, and a sealed liquid-cooled chamber formed in the accommodation space. The liquid coolant enters the accommodation space through a liquid inlet, flows between the columnar heat dissipation structure to accelerate cooling, and then exits through a liquid outlet. An external pipeline guides the heat-absorbing liquid coolant to an external heat dissipation system to dissipate heat, allowing the liquid coolant to cool and then be recirculated. The liquid-cooled cover is combined with an integrated vapor chamber (formed by joining the metal top cover plate and the metal bottom cover plate) to form the liquid-cooled vapor chamber heat dissipation module of the present invention, providing a more efficient heat dissipation solution using liquid coolant circulation and alleviating the problem of poor air-cooled heat dissipation efficiency due to liquid-cooled heat dissipation in high-end servers and large server machine rooms. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a structural diagram of a liquid-cooled vapor chamber heat dissipation module according to one embodiment of the present invention; [Figure 2] 1 is a side cross-sectional structural diagram of a liquid-cooled vapor chamber heat dissipation module according to one embodiment of the present invention; [Figure 3] 1 is a structural explanatory diagram of the metal upper cover plate of a liquid-cooled vapor chamber heat dissipation module according to one embodiment of the present invention; [Figure 4] 1 is a structural explanatory diagram of the metal lower cover plate of a liquid-cooled vapor chamber heat dissipation module according to one embodiment of the present invention; [Figure 5] 10 is a structural diagram illustrating the cooling cover of a liquid-cooled vapor chamber heat dissipation module according to another embodiment of the present invention; FIG. [Figure 6] 10 is a structural explanatory diagram of a cooling cover of a liquid-cooled vapor chamber heat dissipation module according to yet another embodiment of the present invention; FIG. [Figure 7] 10 is a structural explanatory diagram of a cooling cover of a liquid-cooled vapor chamber heat dissipation module according to yet another embodiment of the present invention; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the liquid-cooled vapor chamber heat dissipation module of the present invention will be described with reference to the accompanying drawings. For clarity and convenience of the drawings, the dimensions and proportions of the various components in the drawings may be exaggerated or reduced. In the following description and / or claims, technical terms used should be interpreted in the sense well known and commonly used in the art. For ease of understanding, the same components in the following embodiments will be labeled with the same reference numerals. The term "about" used herein typically indicates that the actual numerical value is within ±10%, 5%, 1%, or 0.5% of the specified numerical value or range. The term "about" used in the present specification indicates that the actual numerical value is within an acceptable standard error of the mean value, as determined by those skilled in the art. Except in the embodiments, or unless otherwise clearly stated, ranges, quantities, values, and percentages used herein should all be understood to be modified by "about." Therefore, unless otherwise stated, all numerical values ​​or parameters disclosed in the present specification and claims are approximate values ​​and can be changed as necessary.

[0015] 1 to 4, FIG. 1 is a structural diagram of a liquid-cooled vapor chamber heat dissipation module 10 according to one embodiment of the present invention, FIG. 2 is a structural diagram of a side cross-section of FIG. 1, FIG. 3 is a structural diagram of a metal upper cover plate 100 of a liquid-cooled vapor chamber heat dissipation module according to one embodiment of the present invention, and FIG. 4 is a structural diagram of a metal lower cover plate 200 of a liquid-cooled vapor chamber heat dissipation module according to one embodiment of the present invention. First, referring to FIGS. 1 and 2, as shown in the figures, the liquid-cooled vapor chamber heat dissipation module 10 of the present invention includes a liquid-cooled cover 300, a metal upper cover plate 100, and a metal lower cover plate 200. The liquid-cooled cover 300 includes an upper portion 301 and a side wall 302 connected to the upper portion 301. The side wall 302 surrounds the upper portion 301 to form an accommodating space 303. The side wall 302 is provided with at least one liquid supply port 304 and at least one liquid drain port 305, and the liquid supply port 304 and the liquid drain port 305 are connected to the accommodating space 303. The metal top cover plate 100 (see Figures 1 to 3) includes a heat dissipating outer surface 110 and a condensing inner surface 120, the heat dissipating outer surface 110 has a plurality of columnar heat dissipating structures 111, an upper edge frame 122 of appropriate height is provided around the condensing inner surface 120, the upper edge frame is provided with upper channel grooves 123, the condensing inner surface 120 has a plurality of upper grooves 121 arranged parallel to each other, and the entire metal top cover plate 100 including the columnar heat dissipating structures 111 is manufactured by being integrally molded from a metal sheet. The metal bottom cover plate 200 (see Figures 1, 2 and 4) includes a heat-absorbing outer surface 210 and an evaporation inner surface 220, the heat-absorbing outer surface 210 is used for contact with heat-dissipating electronic components, a lower frame 222 of appropriate height is provided around the evaporation inner surface 220, the lower frame 222 is provided with a lower channel groove 223, the evaporation inner surface 220 has a plurality of lower grooves 221 arranged parallel to each other and a plurality of support structures 224 protruding between the lower grooves 221, and the entire metal bottom cover plate 200 including the support structures 224 is integrally formed from a metal sheet.The upper frame 122 of the metal top cover plate 100 and the lower frame 222 of the metal bottom cover plate 200 are joined to each other to form the working space 211, and the condensation inner surface 120 of the metal top cover plate 100 and the evaporation inner surface 220 of the metal bottom cover plate 200 face each other, the arrangement of the upper grooves 121 and the lower grooves 221 can be mapped and overlapped to each other, the support structure 224 protrudes and extends from the evaporation inner surface 220 and abuts between the upper grooves 121 of the condensation inner surface 120 to support the working space 211, the intake channel 400 is formed by the corresponding joining of the upper channel groove 123 and the lower channel groove 223 and is used to draw air into the working space 211, the capillary structure 500 is installed in the lower groove 221 or in the upper groove 121 and the lower groove 221, and the working fluid is present in the working space 211 and the capillary structure 500. Here, the liquid-cooled cover 300 is joined to the heat-dissipating outer surface 110 of the metal top cover plate 100, and a columnar heat-dissipating structure 111 is installed in the storage space 303, and the cooling liquid enters the storage space 303 through the liquid supply port 304, passes through the columnar heat-dissipating structure 111, and flows out through the liquid discharge port 305.

[0016] After joining the metal upper cover plate 100 and the metal lower cover plate 200, a vapor chamber is formed, which is characterized by being an integrated vapor chamber in which the columnar heat dissipation structure 111 and the metal upper cover plate 100 are integrated into one unit.

[0017] In one embodiment, the upper frame 122 and the lower frame 222 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention further have welding grooves 1010 for joining the metal upper cover plate 100 and the metal lower cover plate 200 by welding.

[0018] 2 and 3, in one embodiment, the liquid-cooled vapor chamber heat dissipation module 10 of the present invention is characterized by the shape of the metal top cover plate 100 and the columnar heat dissipation structures 111, which are not externally attached but are directly and integrally formed from the same metal sheet (or metal block). That is, the entire metal top cover plate 100 is manufactured by integrally molding a metal sheet (or metal block). More specifically, the plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100 of the liquid-cooled vapor chamber heat dissipation module 10 of this embodiment are directly formed on the heat dissipation outer surface 110 and are inseparable from the heat dissipation outer surface 110 of the metal top cover plate 100, with no heterogeneous or homogeneous boundary surface. Unlike the commonly used prior art in which a heat sink is attached to the heat dissipation surface of a vapor chamber with a heat dissipation paste, nor is a heat dissipation structure formed on the heat dissipation surface of a vapor chamber by welding or sintering. In other words, the columnar heat dissipation structure 111 is formed directly on the heat dissipation outer surface 110 of the metal top cover plate 100 of the vapor chamber, thereby eliminating the heterogeneous boundary surface and thermal resistance that exist between the heat sink and the vapor chamber, thereby improving heat dissipation efficiency.

[0019] 2 and 4, in one embodiment, the liquid-cooled vapor chamber heat dissipation module 10 of the present invention is characterized by the shape and structure of the metal lower cover plate 200, which is integrally formed directly from the same metal sheet (or metal block). In other words, the multiple support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of this embodiment are directly formed on the evaporation inner surface 220 and are made of the same metal as the evaporation inner surface 220 of the metal lower cover plate 200, making them inseparable. There are no heterogeneous or homogeneous interfaces, and the support structures 224 are not sintered to the evaporation inner surface 220 by the commonly used sintering method of the prior art.

[0020] Generally speaking, the method for manufacturing the integrally formed metal top cover plate 100 and metal bottom cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention as described above can employ an etching process or a combined machining process (e.g., an integration of milling and stamping or extrusion processes). The advantage of the etching process is that it can etch more complex structures and is generally used for products that are difficult to manufacture using traditional machining processes. The advantage of the combined machining process is that most of the processes used are mature manufacturing methods and can be produced without the need for extensive development. However, the etching process is relatively time-consuming and can result in uneven surfaces, requiring secondary processing. Therefore, the combined machining process requires relatively many steps and time for production and manufacturing.

[0021] In one embodiment, the liquid-cooled vapor chamber heat dissipation module 10 of the present invention employs cold forging to produce the shape and structure of the metal upper cover plate 100 and the metal lower cover plate 200, which can then be modified using a CNC process. Unlike etching or combined machining processes, cold forging involves placing a metal sheet (or block) to be processed into a female die, and then continuously forging and shaping the metal sheet using a male die at room temperature. Those skilled in the art will appreciate that the cold forging process does not require preheating, softening, and annealing of the metal during the forging process, as is the case with typical stamping processes. Therefore, the internal crystalline grain structure of the forged metal may become voided or enlarged after annealing, resulting in a reduced thermal conductivity. Because the metal after cold forging has not undergone a heating process, its internal grain structure can still maintain a considerable degree of density, and defects such as internal pores can be reduced. This has the advantages of making the metal surface smoother after forging, improving rigidity and density, and making it less susceptible to deformation. Tests have shown that the thermal conductivity and thermal diffusion coefficient of the metal after forging are higher than before forging. That is, in this embodiment, the heat dissipation efficiency of the liquid-cooled vapor chamber heat dissipation module of the present invention is higher than that of general conventional processes.

[0022] In one embodiment, the metal top cover plate 100 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention is manufactured by cold forging, and its characteristic is that the shape and structural features contained in the above-mentioned metal top cover plate 100 are all formed directly in the same metal sheet by cold forging, and include a plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100.

[0023] In one embodiment, the metal bottom cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention is manufactured by cold forging, characterized in that the shape and structural features of the aforementioned metal bottom cover plate 200 are all formed directly on the same metal sheet by cold forging, including a plurality of protruding support structures 224 on the evaporation inner surface 220 of the metal bottom cover plate 200. That is, like the same metal top cover plate 100, the plurality of protruding support structures 224 on the evaporation inner surface 220 of the metal bottom cover plate 200 are not formed externally or by conventional sintering, but are integrally formed with the metal bottom cover plate 200 by forging. In one embodiment, the plurality of protruding support structures 224 are columnar structures.

[0024] In one optional embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention are made of a metal sheet (e.g., pure copper) with a high thermal conductivity and thermal diffusion coefficient, and the above structure is integrally formed by cold forging. In one embodiment, the metal sheet is pure copper.

[0025] As will be understood by those skilled in the art, in the above embodiment, when pure copper is used as the raw material and the metallic top cover plate 100 and the metallic bottom cover plate 200 are manufactured by cold forging, the pure copper material is continuously forged in a mold at room temperature, and the physical properties of the resulting metallic top cover plate 100 and the metallic bottom cover plate 200, such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, are all higher than those of pure copper material that has not undergone cold forging, and are also higher than those of metallic top cover plate 100 and metallic bottom cover plate 200 obtained by other manufacturing methods (e.g., etching, stamping, extrusion, or general forging processes). In other words, after the pure copper material has undergone cold forging, it has relatively high physical properties such as Vickers hardness, thermal conductivity coefficient, and thermal diffusion coefficient, which are different from the material properties obtained by other processing methods.

[0026] For example, in another disclosure, the inventors of the present invention fabricated the metal upper and lower cover plates of a vapor chamber by cold forging, and commissioned a third-party testing institute (Yuanhe) to measure physical properties such as Vickers hardness, thermal conductivity coefficient, and thermal diffusivity of the material after cold forging. The obtained values ​​were compared with the material properties after a conventional composite processing (combining conventional stamping and CNC processing), as shown in Table 1 below. As will be understood by those skilled in the art, the cold forging method imparts relatively high physical properties such as Vickers hardness, thermal conductivity coefficient, and thermal diffusivity to the material due to the characteristics of the process. The degree of increase in these physical properties is related to the number of forgings and the magnitude of force required in the cold forging process, with the greater the number of forgings and the greater the force, the higher the values. Therefore, after cold forging, all of the above values ​​are superior to those of unprocessed or general conventionally processed materials and have significant advantages over conventional composite processing methods.

[0027] [Table 1]

[0028] In one embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention are made of pure copper, which has a relatively high thermal conductivity coefficient and thermal diffusion coefficient, and the metal upper cover plate 100 and the metal lower cover plate 200 manufactured after cold forging have a Vickers hardness of 90HV or more, for example, 90HV, 95HV, 100HV or 105HV.

[0029] In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention are made of pure copper with a relatively high thermal conductivity coefficient and thermal diffusion coefficient, and the metal upper cover plate 100 and the metal lower cover plate 200 manufactured after cold forging have a thermal conductivity coefficient of 400 W / (m·K) or more, for example, 400 W / (m·K), 405 W / (m·K), 408 W / (m·K) or 410 W / (m·K).

[0030] In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention are made of pure copper with a relatively high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 100 and the metal lower cover plate 200 manufactured after cold forging are 90 mm 2 / sec or more, e.g., 90mm 2 / sec, 95mm 2 / sec, 100mm 2 / sec or 105mm 2 / sec thermal diffusion coefficient.

[0031] In any one of the above embodiments, the liquid-cooled vapor chamber heat dissipation module 10 is joined by welding after the metal upper cover plate 100 and the metal lower cover plate 200 are joined together.

[0032] In any one of the above embodiments, the working fluid used in the liquid-cooled vapor chamber heat dissipation module 10 of the present invention is pure water.

[0033] In any one of the above embodiments, the air pressure of the working space 211 described in the liquid-cooled vapor chamber heat dissipation module 10 of the present invention is 1×10 after drawing air into the working space 211 through the intake channel 400 and sealing it.‐3 Less than 1×10 torr, e.g., ‐4 torr, or 1×10 ‐5 torr. Note that the sealing performed after the above-mentioned air intake is a well-known technique and is not limited to this. For example, after air is drawn into the working space 211 through a metal intake pipe to a set pressure, the intake pipe can be sealed by pressing, sintering, or welding with a jig.

[0034] Referring to FIG. 1, in one embodiment, the liquid cooling cover 300 of the liquid cooling vapor chamber heat dissipation module 10 of the present invention has at least one liquid supply port 304 and at least one liquid drain port 305, and as shown in the figure, the liquid supply port 304 and the liquid drain port 305 are arranged on different sides of the side wall, and in this embodiment, the liquid supply port 304 and the liquid drain port 305 are arranged on opposite sides of the side wall 302.

[0035] Referring to FIG. 5, in another embodiment of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention, the liquid-cooled cover 310 has at least one liquid supply port 304 and at least one liquid drain port 305, and the liquid supply port 304 and the liquid drain port 305 are arranged on the same side of the side wall 302 of the liquid-cooled cover 310.

[0036] To accommodate the mechanical layout or stacking method of the server, the liquid cooling cover 300 or 310 described in the liquid cooling vapor chamber heat dissipation module 10 of the present invention has at least one liquid inlet 304 and at least one liquid outlet 305. The liquid inlet 304 and the liquid outlet 305 can be located on the same side or on different sides according to customer requirements. In another embodiment, to accelerate the flow of the coolant and improve cooling efficiency, the number of liquid inlet 304 is two or more, and the number of liquid outlet 305 is also two or more. The number of liquid inlet 304 and the number of liquid outlet 305 may be equal or unequal, and the liquid inlet 304 and the liquid outlet 305 may be partially on the same side and partially on different sides, and this is not limited thereto.

[0037] In order to further improve the heat dissipation efficiency of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention, the inventors of the present invention propose another embodiment of the liquid-cooled cover 320, 330, which is characterized in that at least one flow guide plate is further installed in the accommodating space 303, so that the coolant enters the accommodating space 303 through the liquid supply port 304 and is quickly and evenly guided between the multiple columnar heat dissipation structures 111, quickly removing the heat distributed on the surface of the columnar heat dissipation structures and quickly discharging it through the liquid discharge port 305 to the external heat dissipation system, thereby avoiding the coolant from forming turbulence or uneven temperature within the accommodating space, thereby further improving the heat dissipation efficiency. 6, in one embodiment, the liquid-cooled cover 320 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention has a liquid inlet 304 and a liquid outlet 305 disposed on opposite sides of the sidewall 302, and a pair of flow guide plates 3201 disposed at the liquid inlet 304 and the liquid outlet 305 in the receiving space 303, respectively. The pair of flow guide plates 3201 extend to both sides of the liquid inlet 304 and the liquid outlet 305, forming a V-shape. Without the flow guide plates 3201, when the columnar heat dissipation structures 111 are densely arranged and concentrated in the middle region of the heat dissipation outer surface 110, the coolant flow from the liquid inlet 304 into the receiving space 303 will be blocked by the columnar heat dissipation structures and flow to both sides. As a result, the flow rate of the coolant between the columnar heat dissipation structures 111 will be slowed, and the coolant temperature in the center region will be high, preventing it from quickly dissipating heat, resulting in a low liquid-cooled heat dissipation efficiency. Therefore, by installing a pair of flow guide plates 3201 at the liquid inlet 304 and the liquid outlet 305, the coolant can be guided from the liquid inlet 304 toward the columnar heat dissipation structure 111, thereby improving heat dissipation efficiency. Referring to FIG. 7 , in another embodiment, when the liquid inlet 304 and the liquid outlet 305 are located on the same side of the liquid cooling cover 330 and the side wall 302, a flow guide plate 3301 can be installed between the liquid inlet 304 and the liquid outlet 305 to ensure that the coolant flows quickly and evenly between the columnar heat dissipation structure 111, quickly carrying away heat, and smoothly discharging it from the liquid outlet 305 to the external cooling system.

[0038] The liquid-cooled covers 300, 310, 320, and 330 disclosed in any one of the above embodiments are merely illustrative and do not limit the scope of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention. After considering the embodiments of the present invention, those skilled in the art can set different numbers, positions, sizes, and shapes of flow guide plates according to actual application situations to improve the flow pattern of the coolant, make the coolant flow more smoothly, and increase heat dissipation efficiency.

[0039] In any one of the above embodiments, the liquid-cooled covers 300, 310, 320, 330 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention are joined to the heat-dissipating outer surface 110 of the metal top cover plate 100 by welding.

[0040] The above-mentioned embodiments are only used for illustrative purposes and do not limit the scope of the present invention. Any equivalent modifications or variations based on the liquid-cooled vapor chamber heat dissipation module of the above-mentioned embodiments should still fall within the scope of protection of the present invention.

[0041] Most conventional heat dissipation modules use an external heat sink, which reduces heat dissipation efficiency by adding thermal resistance to the heat sink's thermal interface. The liquid-cooled vapor chamber heat dissipation module of the present invention not only integrates the vapor chamber's top cover with the heat sink, eliminating the limitations of the vapor chamber's thermal resistance, but also incorporates a liquid-cooled cover to further enhance heat dissipation efficiency by combining the vapor chamber's already highly efficient liquid cooling with the vapor chamber's high heat dissipation efficiency. Furthermore, the installation of large server machine rooms and high-density high-end chip modules can easily reduce air-cooled heat dissipation efficiency due to high ambient air temperatures. The liquid-cooled vapor chamber heat dissipation module of the present invention incorporates liquid cooling, eliminating the impact of ambient air temperatures on heat dissipation efficiency. Furthermore, the location and number of liquid inlet and outlet ports can be adjusted according to the machine or chip module stack, streamlining the overall heat dissipation solution and making it more efficient. Furthermore, in addition to being manufactured by an etching process or a combined processing process (such as casting, forging, milling, punching or extrusion), the liquid-cooled vapor chamber heat dissipation module of the present invention can also be manufactured by cold forging, which can make the material's grain structure finer and reduce internal porosity defects, resulting in the material having excellent mechanical properties such as relatively high strength, deformation resistance and fatigue resistance, and improving the material's heat conduction efficiency and heat diffusion efficiency, making the formed liquid-cooled vapor chamber heat dissipation module superior to general heat dissipation modules of similar structure in terms of heat dissipation efficiency, durability and reliability.

[0042] From the above, it is found that the present invention overcomes the problems of the prior art, truly achieves the desired effects, and is not something that a person skilled in the art would easily come up with. It is inventive, practical, and meets the requirements of the patent claims. Therefore, we sincerely request that you grant the patent application of the present invention to your office in accordance with the law, in order to encourage invention.

[0043] The above description is merely illustrative and not limiting. Any other equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the scope of the following claims. [Explanation of symbols]

[0044] 10 Liquid-cooled vapor chamber heat dissipation module 100 Metal top cover plate 110 Heat dissipation outer surface 111 Columnar heat dissipation structure 120 Condensation inner surface 121 Kamimizo 122 Top Frame 123 Upper channel groove 200 Metal lower cover plate 210 Endothermic outer surface 211 workspace 220 Evaporation inner surface 221 Lower groove 222 Bottom Frame 223 Lower channel groove 224 Support structure 300 Liquid Cooling Cover 310 Liquid Cooling Cover 320 Liquid Cooling Cover 330 Liquid Cooling Cover 301 Upper 302 Side wall 303 Containment Space 304 Liquid supply port 305 drain outlet 3201 Current guide plate 3301 Current guide plate 400 intake channel 500 capillary structure 1010 Welding groove

Claims

1. The cooling system includes a liquid-cooled cover, a metal upper cover plate, a metal lower cover plate, an intake channel, a capillary structure, and a working fluid; the liquid cooling cover includes an upper portion and a side wall connected to the upper portion, the side wall surrounding the upper portion to form an accommodation space, and the side wall is provided with at least one liquid supply port and at least one liquid drain port, the liquid supply port and the liquid drain port communicating with the accommodation space; The metal top cover plate includes a heat dissipating outer surface and a condensation inner surface, the heat dissipating outer surface has a plurality of columnar heat dissipating structures, and an upper edge frame of an appropriate height is provided around the condensation inner surface, the upper edge frame is provided with an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other, and the entire metal top cover plate including the columnar heat dissipating structures is integrally formed from a metal sheet; the metal bottom cover plate includes a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface is used for contacting a heat-dissipating electronic component, a lower frame of an appropriate height is provided around the evaporation inner surface, the lower frame is provided with a lower channel groove, the evaporation inner surface has a plurality of lower grooves arranged parallel to each other and a plurality of support structures protruding between the lower grooves, the entire metal bottom cover plate including the support structures is integrally formed from a metal sheet, the upper frame of the metal top cover plate and the lower frame of the metal bottom cover plate are joined to each other to form a working space, and the condensation inner surface of the metal top cover plate and the evaporation inner surface of the metal bottom cover plate face each other, the arrangement of the upper grooves and the lower grooves can be mapped and overlapped with each other, the support structures protrude and extend from the evaporation inner surface and abut between the upper grooves of the condensation inner surface to support the working space, The intake channel is configured by joining the upper channel groove and the lower channel groove correspondingly, and is used to draw air into the working space; The capillary structure is disposed in the lower groove or in the upper groove and the lower groove; the working fluid is present in the working space and the capillary structure; The liquid-cooled cover is joined to the heat-dissipating outer surface of the metal top cover plate by welding, and the columnar heat-dissipating structure is installed in the storage space, and the cooling liquid enters the storage space through the liquid supply port, passes through the columnar heat-dissipating structure, and flows out through the liquid discharge port, a liquid-cooled vapor chamber heat-dissipating module.

2. 2. The liquid-cooled vapor chamber heat dissipation module of claim 1, wherein the entire upper metal cover plate including the columnar heat dissipation structure is formed integrally from a metal sheet by cold forging, and the entire lower metal cover plate including the support structure is formed integrally from a metal sheet by cold forging.

3. 2. The liquid-cooled vapor chamber heat dissipation module according to claim 1, wherein the metal sheet is made of pure copper.

4. 3. The liquid-cooled vapor chamber heat dissipation module according to claim 2, wherein the metal sheet is made of pure copper, and the Vickers hardness of the upper metal cover plate and the lower metal cover plate is 90 HV or more.

5. 3. The liquid-cooled vapor chamber heat dissipation module according to claim 2, wherein the metal sheet is made of pure copper, and the thermal conductivity of the upper metal cover plate and the lower metal cover plate is 400 W / (m·K) or more.

6. 3. The liquid-cooled vapor chamber heat dissipation module according to claim 2, wherein the metal sheet is made of pure copper, and the thermal diffusivity of the metal upper cover plate and the metal lower cover plate is 90 mm<2> / sec or more.

7. The liquid-cooled vapor chamber heat dissipation module according to claim 2 , wherein the support structure is a columnar structure.

8. 3. The liquid-cooled vapor chamber heat dissipation module according to claim 2, wherein the upper metal cover plate and the lower metal cover plate are joined by welding.

9. 3. The liquid-cooled vapor chamber heat dissipation module according to claim 2, wherein the working fluid is pure water.

10. The atmospheric pressure in the working space is 1×10 －３ 3. The liquid-cooled vapor chamber heat dissipation module of claim 2, wherein the liquid-cooled vapor chamber heat dissipation module is less than 1000 kPa.

11. The liquid-cooled vapor chamber heat dissipation module according to claim 2 , wherein the liquid supply port and the liquid discharge port are disposed on the same side or different sides of the side wall.

12. 3. The liquid-cooled vapor chamber heat dissipation module according to claim 2, wherein the liquid supply port and the liquid discharge port are male thread connectors protruding from the side wall or screw holes penetrating the side wall.

13. The liquid-cooled vapor chamber heat dissipation module according to claim 2 , wherein at least one flow guide plate is installed in the accommodating space.

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