Device transfer method, device transfer machine, object transfer method and object transfer machine

Abstract

To propose a method and an apparatus for transferring a device arranged on a first substrate to a second substrate by using a laser beam, while correcting the displacement of the device.SOLUTION: Actual positional information of a device on a first substrate is acquired and is grouped according to a reference determined on the basis of an acceptable displacement amount, the position of the first substrate is corrected so that the device will be located within the range of the acceptable displacement amount with the unit of each group, and a laser beam is applied from the back surface of the first substrate and the device is transferred to the second substrate.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a device transfer method, a device transfer machine, an object transfer method, and an object transfer machine. [Background technology]

[0002] In recent years, nitride semiconductor optical devices have come to be used as backlights for liquid crystal displays and signage displays. These applications require large numbers of optical devices to be used at once, so high-speed transfer technology is required. High-speed transfer technology includes bulk transfer using methods such as stamping, which has made it possible to transfer 1,000 to tens of thousands of devices at a time.

[0003] Microdevices up to about 100 μm in size are manufactured as an extension of the conventional semiconductor device manufacturing process. Dicing tape is attached to the semiconductor wafer, and the devices are separated using a mechanical dicer or by scribing with laser irradiation or by creating internal cracks. The dicing tape is then stretched to increase the spacing between the individual devices so that they can be picked up by a handler. The positional accuracy achieved by stretching the dicing tape is about ±30 μm. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2014-036060 [Patent Document 2] Patent Publication No. 2006-041500 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the positional accuracy achieved by stretching the dicing tape is approximately ±30 μm, which is acceptable for a handler to pick up and transfer individual devices, but when performing bulk transfer using a stamping method or the like, this positional accuracy directly affects the device mounting accuracy, which is an issue.

[0006] Patent Document 1 proposes a method of measuring the amount of misalignment of each device before transfer, and then correcting the amount of misalignment for each device before transferring them to a laminating sheet, but since devices are transferred one by one, it takes an enormous amount of time using a single machine. While it is possible to line up multiple machines, this increases costs and makes it impossible to take advantage of the high-speed transfer technology in the subsequent process.

[0007] Furthermore, although Patent Document 2 proposes a technique for selectively transferring microdevices at high speed using a galvanometer scanner, it does not mention a method for correcting positional deviations in the arrangement of the devices to be transferred.

[0008] Therefore, the present invention proposes a method for solving the above-mentioned problem of achieving both improved positional accuracy and high speed. [Means for solving the problem]

[0009] In order to solve the above problem, the method of transferring devices from a first substrate to a second substrate of the present invention uses a first substrate on which devices are mounted at approximately equal intervals on the surface of the first substrate with a displacement that exceeds an allowable displacement amount, and a second substrate that is arranged opposite the first substrate with an approximately uniform gap and is configured to have an adhesive layer on its surface, and is characterized by having the following steps: acquiring actual position information of the devices on the first substrate; comparing the ideal position information with the actual position information and grouping the devices based on predetermined criteria determined from the allowable displacement amount; selecting a group to be transferred; correcting the relative position of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criteria of the selected group; and irradiating a laser from the back of the first substrate continuously to only the devices included in the selected group and transferring them to the second substrate. [Effects of the Invention]

[0010] This has the effect of transferring devices while correcting the amount of misalignment for each group, thereby enabling the high-speed production of a second substrate in which the positional accuracy of all transferred devices is within the allowable amount of misalignment. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a diagram showing a configuration of an LED supply board according to an embodiment of the present invention. [Figure 2] 1 is a schematic diagram showing the arrangement of LEDs according to an embodiment of the present invention (in this diagram, the individual LEDs are misaligned to some extent). [Figure 3] 10 is a schematic diagram illustrating the acquisition of actual position information of an LED according to an embodiment of the present invention. FIG. [Figure 4] FIG. 10 is a diagram showing an algorithm for grouping LEDs according to an embodiment of the present invention. [Figure 5] FIG. 10 is a diagram showing a flow of a transfer operation of the device transfer machine according to the embodiment of the present invention. [Figure 6] FIG. 10 is a diagram showing a processing operation flow of the device transfer machine according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] An example of an embodiment of the present invention will be described below. In all the drawings, the dimensions and proportions of each component are appropriately changed from the actual dimensions to make each component easier to recognize on the drawing.

[0013] In this embodiment, the device will be described as a GaN (gallium nitride) semiconductor LED (light-emitting diode). Generally, LED manufacturers form a large number of LEDs on a sapphire substrate, and after the process, they attach dicing tape to the sapphire substrate, divide it using a laser-based dicer, stretch the dicing tape using a high-precision expander to spread the individual LEDs at predetermined intervals, transfer them to a sheet or substrate, and supply them to manufacturers of LED-based displays. Here, we will explain the processing of a substrate on which LEDs are mounted at roughly equal intervals.

[0014] First, the configuration of the LED supply board will be described with reference to Fig. 1. Fig. 1 is an overall view of the LED supply board. The LED supply board is an example of a board on which devices that are the target of the device transfer method according to this embodiment are mounted.

[0015] The LED supply board is constructed by arranging multiple LEDs 2 as individual devices in a matrix on a double-sided polished synthetic quartz substrate 1. Each LED 2 is arranged at equal intervals within a specified accuracy. The positional accuracy of each LED is defined as the amount of deviation from the lattice points, which are equally spaced in the horizontal X and Y directions based on the center of the synthetic quartz substrate 1 and are the ideal positions of the LEDs, and the amount of deviation in the rotational direction Θ from the lattice lines connecting the lattice points.

[0016] Figure 2 shows the relationship between LEDs 2, grid points 3, and grid lines 4. The specified accuracy depends on the characteristics of the dicing tape and the mechanical accuracy and control of the expander, and is within ±30 μm in the horizontal XY directions, and the specified accuracy of the rotational direction Θ of each device is within ±1 degree. The actual position information of each LED 2 used in transfer can be obtained by converting the coordinates of position information obtained in advance by a visual inspection machine, but we will explain a method for timely acquisition by the device transfer machine.

[0017] In the device transfer machine, the synthetic quartz substrate 1 (which serves as the LED supply substrate) and the carrier substrate 7 are placed on the XYΘ upper substrate stage and the XYZΘ lower substrate stage, respectively. Figure 3 shows a schematic diagram of the acquisition of actual position information. The device transfer machine moves the synthetic quartz substrate 1, using the center of the synthetic quartz substrate 1 as a reference, so that the observation lens tube 6 is positioned directly above the lattice point 5, which corresponds to the ideal position of each LED. The control unit (not shown) of the device transfer machine photographs the LED 2 through the quartz substrate 1 and calculates the amount of positional deviation from the lattice point 5 through image processing. As shown in Figure 3, the LED spacings A and B are not uniform and vary within a specified accuracy range. This information is repeatedly accumulated for all LEDs on the synthetic quartz substrate 1 and used as actual position information. Additionally, visual inspections for cracks, chips, defects, and other defects other than misalignment may be performed, and visual defect information may be included in the actual position information.

[0018] Next, the algorithm for grouping LED2 will be explained using Figure 4. Grouping is determined for each LED individually.

[0019] The first determination is whether the positional misalignment amounts for X, Y, and Θ are all within the reference values, and if this determination is true, the LED is added to group 1. The reference values ​​here are the target allowable positional misalignment amounts for the substrate after transfer, with X and Y being ±10 μm each, and Θ being ±1 μm since misalignment in the rotational direction is rare.

[0020] The second determination is whether the amount of deviation in the positive X direction exceeds the reference value of 10 μm and is within 30 μm, which is three times the reference value. If this determination is met, the LED is added to the second group.

[0021] The third determination is whether the amount of deviation in the negative X direction exceeds the reference value of −10 μm and is within −30 μm, which is three times the reference value. If this determination is met, the LED is added to the third group.

[0022] Similarly, determinations are made for Y positive / negative, the four diagonal directions of X and Y, and Θ positive / negative, and if applicable, the result is added to the fourth to eleventh groups, respectively.

[0023] If neither of these judgments applies, it is determined that the amount of positional deviation exceeds the allowable value, or if the actual position information includes information about a defective appearance, it is managed as a defective LED group.

[0024] Next, the flow of the transfer operation of the device transfer machine will be explained using FIG. In the first step, the lower substrate stage is moved to the transfer position, the carrier substrate is set, and loaded into the alignment position, where alignment is performed based on the outer shape. Specifically, the observation lens barrel is used to detect the edge of the carrier substrate, and a predetermined alignment operation is performed to align it with the stage coordinate system at the position of the orientation flat for circular substrates, or at the positions of the edges and corners for square substrates, and the center coordinates and rotation coordinates of the set carrier substrate based on the observation lens barrel are saved. During the alignment operation, the rotation direction is adjusted to match the stage coordinate system.

[0025] In the second step, the upper substrate stage is moved to the transfer position, the synthetic quartz substrate is set, and it is loaded into the alignment position and aligned based on the LED. Specifically, the observation lens barrel is used to find the edge of the LED array, and a specified alignment operation is performed to align the found edge and the corner of the LED array with the stage coordinate system, and the center coordinates and rotation coordinates of the set synthetic quartz substrate based on the observation lens barrel are saved. During the alignment operation, the rotation direction is already adjusted to match the stage coordinate system.

[0026] The third step is to input the LED arrangement information and the allowable positional deviation amount in the GUI of the control unit. The values ​​to be input are the total number of LEDs, the number of LEDs per row, the column pitch in the X direction, and the row pitch in the Y direction as arrangement information, and EX in the X direction, EY in the Y direction, and EΘ in the Θ direction as allowable positional deviation amounts. Note that this deviation amount is treated as the same value in both the positive and negative directions.

[0027] In the fourth step, the actual position information of each LED is obtained based on the input array information. Specifically, the ideal position coordinates of the corner LEDs are calculated based on the center coordinates of the synthetic quartz substrate and the input array information, and the upper substrate stage is moved to those ideal position coordinates. The LEDs are photographed with an observation lens tube, and the amount of positional deviation is calculated and saved using image processing. This process is repeated for all LEDs, and the actual position information is obtained.

[0028] The grouping based on the actual position information in the fifth step is as explained above with reference to FIG.

[0029] In the sixth step, processing operations are performed for each group. The specific processing operations are explained using the processing operation flow in Figure 5. Note that processing operations are skipped for groups of defective LEDs. If there are LEDs that have been assigned to the group of defective LEDs, this fact is displayed on the GUI of the device transfer machine.

[0030] As the first step of the processing operation, the synthetic quartz substrate and carrier substrate 5 are moved to the processing center of the galvanometer scanner using the mechanically determined horizontal distance between the observation tube and the galvanometer scanner, the previously acquired center coordinates of the observation tube reference for the synthetic quartz substrate, and the center coordinates of the observation tube reference for the carrier substrate 5.

[0031] In the second step of the processing operation, the Z axis of the lower substrate stage is moved so that the gap between the synthetic quartz substrate and the carrier substrate 5 is twice the height of the LED plus a little more; for example, if the height is 100 μm, the gap at the center is 220 μm. The reason for determining the gap at the center is because the center sags depending on the size of the synthetic quartz substrate. If the process range is narrowed depending on the material and precise adjustment is required, the gap at the center can be measured each time using a height sensor that can detect transparent objects.

[0032] As the third step of the processing operation, the ideal position information (coordinate data group) of the LEDs included in the currently selected group is input to the control unit of the galvano scanner as the laser irradiation position. As the fourth step of the processing operation, the upper substrate stage is moved to correct the relative position of the synthetic quartz substrate and the carrier substrate 5 using a correction value corresponding to the currently selected group. The correction value will be explained in detail below. For example, if the allowable positional deviation EX is 10 μm, the second group of X(+) is misaligned in the positive X direction by more than 10 μm but not more than 30 μm, while the others are within the reference value. In this case, the correction value is -20 μm in the X direction. Similarly, for the other groups, the correction value is twice the reference value with the sign reversed.

[0033] As the final step in the machining process, a machining command is sent to the galvanometer scanner's control unit. The galvanometer scanner's control unit receives this command and, based on the input coordinate data, adjusts the laser irradiation position, sends an oscillation trigger to the laser, and irradiates the LED from the backside of the synthetic quartz substrate. This operation is repeated for all coordinate data. The irradiated LED is ejected by thermomechanical and / or chemical explosion phenomena and transferred to the carrier substrate.

[0034] Although the embodiments of the present invention have been described in detail above, the present invention can be expressed from different perspectives as follows (1) to (42). (1) A method for transferring a device from a first substrate to a second substrate, comprising: a first substrate on which devices are mounted at approximately equal intervals with the amount of misalignment exceeding the allowable amount on the surface of the first substrate, and a second substrate that is disposed to face the first substrate with an approximately uniform gap and has an adhesive layer on its surface; obtaining real position information of the device on the first substrate; comparing ideal position information of the devices on the first substrate with the actual position information, and grouping the devices according to a predetermined criterion determined from the allowable positional deviation; selecting a group to be transshipped; correcting the relative positions of the first and second substrates in a surface direction of the substrates based on the predetermined criterion of the selected group; a step of successively irradiating only the devices included in the selected group with a laser from the back surface of the first substrate and transferring them to the second substrate; A method for transferring a device having the above structure. (2) The device transfer method according to (1), wherein the allowable positional deviation is a deviation in the vertical (X) and / or horizontal (Y) and / or rotational (Θ) directions along the substrate surface relative to ideal position information, and the predetermined standard is equal to or less than the allowable positional deviation. (3) The grouping step includes comparing ideal position information with actual position information, and classifying devices whose X, Y, and Θ values ​​are within the predetermined criteria into a first group; The device transfer method described in (2) comprises the steps of classifying devices into second to seventh groups in order from six positive and negative combinations of X, Y, and Θ, which exceed the predetermined standard and are within three times the value of the predetermined standard, and the other five combinations are each within the predetermined standard. (4) the grouping step includes comparing ideal location information with actual location information, and adding devices that are within the predetermined criteria to a first group; The device transfer method described in (2) comprises the steps of selecting at least one pattern from 10 grouping patterns, including six combinations of positive and negative X, Y, and Θ and four combinations of positive and negative X and Y, comparing the selected patterns in order, and adding devices whose compared pattern exceeds the predetermined standard and is within three times the value of the predetermined standard, and whose other selected patterns are within the predetermined standard, to groups (2 to 11) corresponding to the subsequently selected pattern. (5) A device transfer method described in any one of (1) to (4), in which the actual position information of the devices on the first substrate includes information on defects, and the selected group for irradiation is grouped so that defective devices are not included. (6) The device transfer method according to any one of (1) to (5), wherein the laser is irradiated through a galvanometer scanner. (7) The device transfer method according to any one of (1) to (6), wherein the device is an LED. (8) The device transfer method according to any one of (1) to (7), wherein the devices are arranged in a matrix on the first substrate. (9) The device transfer method according to any one of (1) to (8), wherein the devices are arranged with an accuracy of ±30 μm or less in the vertical (X) direction along the first substrate surface relative to the ideal position information. (10) The device transfer method according to any one of (1) to (9), wherein the devices are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (11) The device transfer method according to any one of (1) to (10), wherein the devices are arranged with an accuracy of ±1 degree in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information. (12) A device transfer machine that transfers devices from a first substrate on which devices are mounted at approximately equal intervals with a positional deviation exceeding an allowable amount on the surface of the first substrate to a second substrate that is arranged to face the first substrate with an approximately uniform gap and has an adhesive layer on its surface, an image processing device for acquiring real position information of the device on the first substrate; a processor that compares ideal position information of the device on the first substrate with the actual position information, groups the devices according to a predetermined standard determined from the allowable positional deviation amount, and selects a group to be transferred; a stage and stage controller that corrects the relative positions of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criterion of the selected group; A device transfer machine comprising a laser device and a galvano scanner optical system, which successively irradiates only devices included in a selected group with laser light from the back surface of a first substrate. (13) A transfer method for transferring an object from a first substrate to a second substrate, comprising: a first substrate having an area where the object is positioned in a state where the amount of misalignment on the first substrate exceeds an allowable amount, and a second substrate disposed opposite the first substrate with a gap therebetween; acquiring real position information of an object on a first substrate; comparing ideal position information of the objects on the first substrate with the actual position information and classifying the objects into groups; selecting a group to be transshipped; irradiating the objects included in the selected group with a laser and transferring them to a second substrate; A method for transferring an object having the above structure. (14) A method for transferring an object according to (13), wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount in the first substrate surface direction relative to the ideal position information. (15) A method for transferring an object according to (13) or (14), wherein the step of comparing the ideal position information of the object on the first substrate with the actual position information and grouping the object is performed by grouping the object according to a predetermined criterion determined from the allowable positional deviation amount. (16) The method for transferring an object according to (15), wherein the allowable positional deviation is the predetermined standard. (17) The method for transferring an object according to any one of (14) to (16), wherein the allowable amount of positional deviation in the vertical (X) direction along the surface of the first substrate is within ±10 μm. (18) The method for transferring an object according to any one of (14) to (17), wherein the allowable amount of positional deviation in the lateral (Y) direction of the first substrate surface is within ±10 μm. (19) The method for transferring an object according to any one of (14) to (18), wherein the allowable positional deviation in the rotation direction (Θ) of the first substrate surface direction is within ±1 degree. (20) The grouping step includes a step of comparing ideal position information with actual position information, and classifying objects whose at least one of X, Y, and Θ is within the predetermined standard into a first group; A method for transferring objects described in any of (15) to (19), comprising a step of classifying objects in a second group where at least one of the remaining XYΘ values ​​not determined in the first group is within the predetermined standard, or objects where at least one of the XYΘ values ​​determined in the first group exceeds the predetermined standard. (21) A method for transferring an object described in any one of (13) to (20), wherein the step of irradiating the object included in the selected group with a laser and transferring it to a second substrate involves irradiating the object included in the selected group with a laser continuously. (22) The method for transferring an object according to any one of (13) to (21), wherein the object is a device. (23) The method for transferring an object according to (22), wherein the device is an LED. (24) The method for transferring an object according to any one of (13) to (23), wherein the object is arranged with an accuracy of ±30 μm or less in the vertical (X) direction in the first substrate surface direction relative to the ideal position information. (25) The method for transferring an object according to any one of (13) to (24), wherein the object is arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (26) The method for transferring an object according to any one of (13) to (25), wherein the object is arranged within an accuracy of ±1 degree in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information. (27) An object transfer device that transfers an object from a first substrate, on which the object is placed with a positional deviation exceeding an allowable amount, to a second substrate that is placed opposite the first substrate with a gap therebetween, an image processing device that acquires real position information of an object on the first substrate; a processor that compares ideal position information of the objects on the first substrate with the actual position information, divides the objects into groups, and selects a group to be transferred; An object transfer machine including a laser device and an optical system that irradiates laser light only on objects included in a selected group. (28) The object transfer machine according to (27), wherein the laser device and optical system continuously irradiate laser light only on the objects included in the selected group. (29) The object transfer device according to (27) or (28), wherein the optical system is a galvano scanner optical system. (30) An object transfer device according to any one of (27) to (29), wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount in the first substrate surface direction relative to the ideal position information. (31) The object transfer machine according to any one of (27) to (30), wherein the arithmetic processing device performs grouping based on a predetermined criterion determined from the allowable positional deviation amount. (32) The object transfer machine according to (31), wherein the allowable positional deviation is the predetermined standard. (33) The object transfer device according to any one of (27) to (32), wherein the allowable positional deviation in the vertical (X) direction along the first substrate surface is within ±10 μm. (34) The object transfer device according to any one of (27) to (33), wherein the allowable amount of positional deviation in the lateral (Y) direction of the first substrate surface is within ±10 μm. (35) The transfer device for an object according to any one of (27) to (34), wherein the allowable positional deviation in the rotation direction (Θ) of the first substrate surface direction is within ±1 degree. (36) The grouping step includes a step of comparing ideal position information with actual position information, and classifying objects whose at least one of X, Y, and Θ is within the predetermined standard into a first group; An object transfer machine according to any one of (31) to (35), comprising a step of classifying objects in a second group where at least one of the remaining XYΘ values ​​not determined in the first group is within the predetermined standard, or objects where at least one of the XYΘ values ​​determined in the first group exceeds the predetermined standard. (37) An object transfer device according to any one of (31) to (36), comprising a stage and a stage controller that corrects the relative position of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criteria of the selected group. (38) The object transfer machine according to any one of (27) to (37), wherein the object is a device. (39) The object transfer machine according to (38), wherein the device is an LED. (40) The object transfer device according to any one of (27) to (39), wherein the objects are arranged with an accuracy of ±30 μm or less in the vertical (X) direction of the first substrate surface relative to the ideal position information. (41) The object transfer device according to any one of (27) to (40), wherein the objects are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (42) The object transfer device according to any one of (27) to (41), wherein the object is arranged within an accuracy of ±1 degree in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information.

[0035] Furthermore, the present invention can be expressed from yet another perspective as follows (U1) to (U42). (U1) A system for transferring a device from a first substrate to a second substrate, a first substrate on which devices are mounted at approximately equal intervals with the amount of misalignment exceeding the allowable amount on the surface of the first substrate, and a second substrate that is disposed to face the first substrate with an approximately uniform gap and has an adhesive layer on its surface; a mechanism for acquiring actual position information of devices on the first substrate; a mechanism for comparing ideal position information of devices on a first substrate with the actual position information and grouping the devices according to a predetermined criterion determined from the allowable positional deviation amount; a mechanism for selecting a group to be transferred; a mechanism for correcting the relative positions of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criterion of the selected group; a mechanism for sequentially irradiating only devices included in the selected group with a laser from the back surface of the first substrate and transferring them to the second substrate; A device transfer system having the above structure. (U2) A device transfer system as described in (U1), wherein the allowable positional deviation is a deviation in the vertical (X) and / or horizontal (Y) and / or rotational (Θ) direction of the substrate surface relative to ideal position information, and the specified standard is less than or equal to the allowable positional deviation. (U3) The grouping step includes comparing ideal position information with actual position information, and classifying devices whose X, Y, and Θ values ​​are within the predetermined criteria into a first group; The device transfer system described in (U2) comprises the steps of classifying devices into second to seventh groups in order from six positive and negative combinations of X, Y, and Θ, which exceed the specified standard and are within three times the value of the specified standard, and the other five combinations are each within the specified standard. (U4) The grouping step includes comparing ideal location information with actual location information, and adding devices that are within the predetermined criteria to a first group; The device transfer system described in (U2) comprises the steps of selecting at least one pattern from 10 grouping patterns, including 6 combinations of positive and negative X, Y, and Θ and 4 combinations of positive and negative X and Y, comparing in order using the selected patterns, and adding devices whose compared pattern exceeds the predetermined standard and is within 3 times the value of the predetermined standard, and whose other selected patterns are within the predetermined standard, to groups (2nd to 11th) corresponding to the subsequently selected pattern. (U5) A device transfer system described in any of (U1) to (U4), in which the actual position information of the devices on the first substrate includes information on defects, and the selected group for irradiation is grouped so that defective devices are not included. (U6) A device transfer system according to any one of (U1) to (U5), wherein the laser is irradiated through a galvanometer scanner. (U7) The device transfer system according to any one of (U1) to (U6), wherein the device is an LED. (U8) The device transfer system according to any one of (U1) to (U7), wherein the devices are arranged in a matrix on the first substrate. (U9) A device transfer system according to any one of (U1) to (U8), wherein the devices are arranged with an accuracy of ±30 μm or less in the vertical (X) direction along the first substrate surface relative to the ideal position information. (U10) The device transfer system according to any one of (U1) to (U9), wherein the devices are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (U11) The device transfer system according to any one of (U1) to (U10), wherein the devices are arranged within an accuracy of ±1 degree in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information. (U12) A device transfer machine with a substrate installed thereon, which transfers devices from a first substrate on which devices are mounted at approximately equal intervals with a positional deviation exceeding an allowable amount on the surface of the first substrate to a second substrate that is arranged to face the first substrate with an approximately uniform gap and has an adhesive layer on its surface, an image processing device for acquiring real position information of the device on the first substrate; a processor that compares ideal position information of the device on the first substrate with the actual position information, groups the devices according to a predetermined standard determined from the allowable positional deviation amount, and selects a group to be transferred; a stage and stage controller that corrects the relative positions of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criterion of the selected group; A device transfer machine having a substrate placed thereon, comprising a laser device and a galvano scanner optical system, which successively irradiates laser light from the back surface of a first substrate only onto devices included in a selected group. (U13) A transfer system for transferring an object from a first substrate to a second substrate, a first substrate having an area where the object is positioned in a state where the amount of misalignment on the first substrate exceeds an allowable amount, and a second substrate disposed opposite the first substrate with a gap therebetween; a mechanism for acquiring real position information of an object on the first substrate; a mechanism for comparing ideal position information of the objects on the first substrate with the actual position information and classifying the objects into groups; a mechanism for selecting a group to be transferred; a mechanism for irradiating the objects included in the selected group with a laser and transferring them to a second substrate; An object transfer system having the above structure. (U14) The object transfer system described in (U13), wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount in the first substrate surface direction, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount relative to the ideal position information. (U15) An object transfer system as described in (U13) or (U14), in which the mechanism that compares the ideal position information of the object on the first substrate with the actual position information and groups the object groups according to a predetermined criterion determined from the allowable positional deviation amount. (U16) The object transfer system according to (U15), wherein the allowable positional deviation is the predetermined standard. (U17) The system for transferring an object according to any one of (U14) to (U16), wherein the allowable positional deviation in the vertical (X) direction along the surface of the first substrate is within ±10 μm. (U18) The transfer system for an object according to any one of (U14) to (U17), wherein the allowable amount of positional deviation in the lateral (Y) direction of the first substrate surface is within ±10 μm. (U19) The transfer system for an object according to any one of (U14) to (U18), wherein the allowable positional deviation in the rotation direction (Θ) of the first substrate surface direction is within ±1 degree. (U20) The grouping step includes a step of comparing ideal position information with actual position information, and classifying objects for which at least one of X, Y, and Θ is within the predetermined standard into a first group; An object transfer system described in any of (U15) to (U19), which includes a step of classifying objects in a second group where at least one of the remaining XYΘ values ​​not determined in the first group is within the specified standard, or objects where at least one of the XYΘ values ​​determined in the first group exceeds the specified standard. (U21) An object transfer system described in any of (U13) to (U20), wherein the mechanism that irradiates the objects included in the selected group with a laser and transfers them to a second substrate irradiates the objects included in the selected group with a laser continuously. (U22) The system for transferring an object according to any one of (U13) to (U21), wherein the object is a device. (U23) The object transfer system according to (U22), wherein the device is an LED. (U24) The object transfer system according to any one of (U13) to (U23), wherein the objects are arranged with an accuracy of ±30 μm or less in the vertical (X) direction in the first substrate surface direction relative to the ideal position information. (U25) The system for transferring an object according to any one of (U13) to (U24), wherein the object is arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information. (U26) The system for transferring an object according to any one of (U13) to (U25), wherein the object is arranged within an accuracy of ±1 degree in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information. (U27) An object transfer device having a substrate placed thereon, the object transfer device transferring the object from a first substrate on which the object is placed with a positional deviation amount exceeding an allowable amount to a second substrate placed opposite the first substrate with a gap therebetween, the first substrate being placed on the object transfer device, an image processing device that acquires real position information of an object on the first substrate; a processor that compares ideal position information of the objects on the first substrate with the actual position information, divides the objects into groups, and selects a group to be transferred; A transfer machine for an object on which a substrate is placed, including a laser device and an optical system that irradiates laser light only onto objects included in a selected group. (U28) The transfer device for an object on which a substrate is placed according to (U27), wherein the laser device and optical system continuously irradiate laser light only onto the objects included in the selected group. (U29) The transfer device for an object on which a substrate is placed according to (U27) or (U28), wherein the optical system is a galvano scanner optical system. (U30) A transfer device for an object on which a substrate is placed, as described in any one of (U27) to (U29), wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount in the first substrate surface direction relative to the ideal position information. (U31) The transfer machine for an object on which a substrate is placed according to any one of (U27) to (U30), wherein the arithmetic processing device performs grouping based on a predetermined criterion determined from the allowable positional deviation amount. (U32) The transfer device for an object on which a substrate is placed according to (U31), wherein the allowable positional deviation amount is the predetermined standard. (U33) The transfer device for an object on which a substrate is placed according to any one of (U27) to (U32), wherein the allowable positional deviation in the vertical (X) direction along the first substrate surface is within ±10 μm. (U34) The transfer device for an object on which a substrate is placed according to any one of (U27) to (U33), wherein the allowable positional deviation in the lateral (Y) direction of the first substrate surface is within ±10 μm. (U35) The transfer device for an object on which a substrate is placed according to any one of (U27) to (U34), wherein the allowable positional deviation in the rotation direction (Θ) of the first substrate surface direction is within ±1 degree. (U36) The grouping step includes a step of comparing ideal position information with actual position information, and classifying objects in which at least one of X, Y, and Θ is within the predetermined standard into a first group; A transfer device for an object on which a substrate is placed, as described in any of (U31) to (U35), which has a step of classifying objects in a second group where at least one of the remaining XYΘ values ​​not determined in the first group is within the predetermined standard, or objects where at least one of the XYΘ values ​​determined in the first group exceeds the predetermined standard. (U37) A transfer device for an object on which a substrate described in any of (U31) to (U36) is placed, having a stage and a stage controller that corrects the relative position of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criteria of the selected group. (U38) The transfer apparatus for an object on which a substrate is placed according to any one of (U27) to (U37), wherein the object is a device. (U39) A transfer machine on which the substrate of the object described in (U38) is installed, wherein the device is an LED. (U40) A transfer machine on which a substrate of the object described in any one of (U27) to (U39) is placed, wherein the object is arranged within an accuracy of ±30 μm in the vertical (X) direction of the first substrate surface relative to the ideal position information. (U41) A transfer device for an object on which a substrate is placed, as described in any one of (U27) to (U40), in which the object is arranged within an accuracy of ±30 μm in the horizontal (Y) direction of the first substrate surface relative to the ideal position information. (U42) A transfer device for an object on which a substrate is placed, as described in any one of (U27) to (U41), in which the object is arranged within an accuracy of ±1 degree in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information.

[0036] Furthermore, the various mechanisms may each have a different function, or one mechanism may have multiple functions. [Industrial Applicability]

[0037] The present invention can be used in a device transfer method and a device transfer machine. [Explanation of symbols]

[0038] 1 Synthetic quartz substrate 2 LED 3 grid points 4 Grid Lines 5 Carrier Board 6 Observation tube

Claims

1. 1. A method for transferring a device from a first substrate to a second substrate, comprising: a first substrate on which devices are mounted at substantially equal intervals with the amount of misalignment exceeding an allowable amount on the surface of the first substrate, and a second substrate which is disposed to face the first substrate with a substantially uniform gap therebetween and is configured to have an adhesive layer on its surface; obtaining real position information of the device on the first substrate; comparing ideal position information of the devices on the first substrate with the actual position information, and grouping the devices according to a predetermined criterion determined from the allowable positional deviation; selecting a group to be transshipped; correcting the relative positions of the first and second substrates in a surface direction of the substrates based on the predetermined criterion of the selected group; a step of successively irradiating only the devices included in the selected group with a laser from the back surface of the first substrate and transferring them to the second substrate; A method for transferring a device having the above structure.

2. 2. The device transfer method according to claim 1, wherein the allowable positional deviation is a deviation in the vertical (X) and / or horizontal (Y) and / or rotational (Θ) directions along the substrate surface relative to ideal position information, and the predetermined standard is equal to or less than the allowable positional deviation.

3. The grouping step includes a step of comparing ideal position information with actual position information, and classifying devices whose X, Y, and Θ are each within the predetermined criteria into a first group; 3. The device transfer method according to claim 2, comprising the steps of: classifying devices into second to seventh groups in order, for six positive and negative combinations of X, Y, and Θ, that exceed the predetermined standard and are within three times the value of the predetermined standard, and the other five combinations are each within the predetermined standard.

4. The grouping includes a step of comparing ideal location information with actual location information, and adding devices that are within the predetermined criterion to a first group; 3. The device transfer method according to claim 2, comprising the steps of selecting at least one pattern from ten grouping patterns, six combinations of positive and negative X, Y, and Θ and four combinations of positive and negative X and Y, performing comparisons in order using the selected patterns, and adding devices whose compared pattern exceeds the predetermined standard and is within three times the value of the predetermined standard, and whose other selected patterns are within the predetermined standard, to groups (second to eleventh) corresponding to the subsequently selected patterns.

5. A device transfer method according to any one of claims 1 to 4, wherein actual position information of devices on the first substrate includes information on defects, and the selected group for irradiation is grouped so that defective devices are not included.

6. 6. The device transfer method according to claim 1, wherein the laser is irradiated through a galvanometer scanner.

7. The device transfer method according to any one of claims 1 to 6, wherein the device is an LED.

8. 8. The device transfer method according to claim 1, wherein the devices are arranged in a matrix on the first substrate.

9. 9. The device transfer method according to claim 1, wherein the devices are arranged with an accuracy of ±30 μm or less in the vertical (X) direction along the first substrate surface relative to the ideal position information.

10. 10. The device transfer method according to claim 1, wherein the devices are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface relative to the ideal position information.

11. 11. The device transfer method according to claim 1, wherein the devices are arranged with an accuracy of ±1 degree or less in the rotation direction (Θ) of the first substrate surface direction relative to the ideal position information.

12. A device transfer machine that transfers devices from a first substrate on which devices are mounted at approximately equal intervals with a positional deviation exceeding an allowable amount on a surface of the first substrate to a second substrate that is arranged to face the first substrate with an approximately uniform gap and has an adhesive layer on its surface, an image processing device for acquiring real position information of the device on the first substrate; a processor that compares ideal position information of the device on the first substrate with the actual position information, groups the devices according to a predetermined standard determined from the allowable positional deviation amount, and selects a group to be transferred; a stage and stage controller that corrects the relative positions of the first substrate and the second substrate in the surface direction of the substrates based on the predetermined criterion of the selected group; A device transfer machine comprising a laser device and a galvano scanner optical system for continuously irradiating only devices included in a selected group with laser light from the back surface of a first substrate.

13. A transfer method for transferring an object from a first substrate to a second substrate, comprising: a first substrate having an area where the object is positioned in a state where the amount of misalignment on the first substrate exceeds an allowable amount, and a second substrate disposed opposite the first substrate with a gap therebetween; acquiring real position information of an object on a first substrate; comparing ideal position information of the objects on the first substrate with the actual position information and classifying the objects into groups; selecting a group to be transshipped; irradiating the objects included in the selected group with a laser and transferring them to a second substrate; A method for transferring an object having the above structure.

14. 14. The method for transferring an object according to claim 13, wherein the allowable positional deviation includes at least one selected from the group consisting of a vertical (X) deviation in the first substrate surface direction, a horizontal (Y) deviation, and a rotational (Θ) deviation relative to the ideal position information.

15. 15. A method for transferring an object according to claim 13 or 14, wherein the step of comparing the ideal position information of the object on the first substrate with the actual position information and grouping the object comprises grouping the object based on a predetermined criterion determined from the allowable positional deviation amount.

16. 16. The method for transferring an object according to claim 15, wherein the allowable amount of positional deviation is the predetermined standard.

17. 15. The method for transferring an object according to claim 14, wherein an allowable positional deviation in the vertical (X) direction along the surface of the first substrate is within ±10 μm.

18. 18. The method for transferring an object according to claim 14, wherein an allowable amount of positional deviation in the lateral (Y) direction of the first substrate surface is within ±10 μm.

19. 19. The method for transferring an object according to claim 14, 17 or 18, wherein the allowable positional deviation in the rotational direction (Θ) of the first substrate surface direction is within ±1 degree.

20. The grouping step includes a step of comparing ideal position information with actual position information, and classifying objects for which at least one of X, Y, and Θ is within the predetermined standard into a first group; A method for transferring objects as described in claim 15, further comprising a step of classifying objects in a second group where at least one of the remaining XYΘ values ​​not determined in the first group is within the specified standard, or objects where at least one of the XYΘ values ​​determined in the first group exceeds the specified standard.

21. A method for transferring objects described in any one of claims 13 to 20, wherein the step of irradiating the objects included in the selected group with a laser and transferring them to a second substrate involves irradiating the objects included in the selected group with a laser continuously.

22. The method for transferring an object according to any one of claims 13 to 21, wherein the object is a device.

23. The method for transferring an object according to claim 22, wherein the device is an LED.

24. 24. The method for transferring an object according to claim 13, wherein the object is arranged with an accuracy of ±30 μm or less in the vertical (X) direction in the first substrate surface direction relative to the ideal position information.

25. 25. The method for transferring an object according to claim 13, wherein the object is arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface direction relative to the ideal position information.

26. 26. The method for transferring an object according to claim 13, wherein the object is arranged within an accuracy of ±1 degree in a rotation direction (Θ) of the first substrate surface direction relative to the ideal position information.

27. An object transfer device that transfers an object from a first substrate, on which the object is placed with a positional deviation exceeding an allowable amount, to a second substrate that is placed opposite the first substrate with a gap therebetween, an image processing device that acquires real position information of an object on the first substrate; a processor that compares ideal position information of the objects on the first substrate with the actual position information, divides the objects into groups, and selects a group to be transferred; An object transfer machine including a laser device and an optical system that irradiates laser light only on objects included in a selected group.

28. 28. The object transfer machine according to claim 27, wherein the laser device and optical system continuously irradiate the laser light only onto the objects included in the selected group.

29. 29. The object transfer machine according to claim 27 or 28, wherein the optical system is a galvano scanner optical system.

30. The object transfer machine according to any one of claims 27 to 29, wherein the allowable positional deviation amount includes at least one selected from the group consisting of a vertical (X) deviation amount in the first substrate surface direction, a horizontal (Y) deviation amount, and a rotational (Θ) deviation amount relative to the ideal position information.

31. 31. The object transfer machine according to claim 27, wherein the arithmetic processing unit performs grouping based on a predetermined criterion determined from the allowable positional deviation.

32. 32. The object transfer machine according to claim 31, wherein the allowable positional deviation is the predetermined standard.

33. 31. The object transfer machine according to claim 30, wherein an allowable positional deviation in the vertical (X) direction along the first substrate surface is within ±10 μm.

34. 34. The object transfer machine according to claim 30 or 33, wherein the allowable amount of positional deviation in the lateral (Y) direction of the first substrate surface is within ±10 μm.

35. 35. The object transfer machine according to claim 30, 33 or 34, wherein the allowable positional deviation in the rotation direction (Θ) of the first substrate surface direction is within ±1 degree.

36. The grouping step includes a step of comparing ideal position information with actual position information, and classifying objects for which at least one of X, Y, and Θ is within the predetermined standard into a first group; An object transfer machine as described in claim 31, which has a step of classifying objects in a second group where at least one of the remaining XYΘ values ​​not determined in the first group is within the specified standard, or objects where at least one of the XYΘ values ​​determined in the first group exceeds the specified standard.

37. 32. The object transfer device according to claim 31, further comprising a stage and a stage controller that corrects the relative positions of the first substrate and the second substrate in a surface direction of the substrates based on the predetermined criterion of the selected group.

38. The object transfer machine according to any one of claims 27 to 37, wherein the object is a device.

39. 39. The object transfer machine of claim 38, wherein the device is an LED.

40. 40. The object transfer machine according to claim 27, wherein the objects are arranged with an accuracy of ±30 μm or less in the vertical (X) direction in the first substrate surface direction relative to the ideal position information.

41. 41. The object transfer machine according to claim 27, wherein the objects are arranged with an accuracy of ±30 μm or less in the lateral (Y) direction of the first substrate surface direction relative to the ideal position information.

42. 42. The object transfer machine according to claim 27, wherein the object is arranged within an accuracy of ±1 degree in a rotation direction (Θ) of the first substrate surface direction relative to ideal position information.

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