Substrate Processing System

Abstract

To improve an operating rate of a substrate processing system by reducing a replacement time of a consumable component in a vacuum processing chamber.SOLUTION: A substrate processing system includes an atmospheric pressure transfer chamber, a vacuum processing chamber, one or more load lock modules, a vacuum transfer chamber, a plurality of mounting units, a first transfer mechanism, a second transfer mechanism, and a control unit. The plurality of mounting units are provided in the atmospheric pressure transfer chamber. Each of the plurality of storage units can be detachably attached to the plurality of mounting units. The control unit causes the first transfer mechanism and the second transfer mechanism to carry out in parallel the transfer of consumable components from the storage unit to the vacuum processing chamber via the atmospheric pressure transfer chamber and one of the one or more load lock modules, and the transfer of consumable components from the vacuum processing chamber via the vacuum transfer chamber and another one of the one or more load lock modules.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The following disclosure relates to a substrate processing system. [Background technology]

[0002] A plasma processing apparatus is known that performs plasma processing on a substrate placed on a mounting table provided inside a processing chamber. Such a plasma processing apparatus includes consumable parts that gradually wear out as the plasma processing is repeatedly performed.

[0003] An example of a consumable part is a focus ring that is provided around the outer periphery of a substrate placed on a mounting table. The focus ring is worn down by exposure to plasma and therefore must be replaced periodically.

[0004] For example, Patent Document 1 proposes a focus ring replacement method in which the focus ring is transferred in and out without opening the processing chamber to the atmosphere. Patent Document 2 also proposes a technique for shortening vacuum processing downtime by checking the condition of the surface of the substrate mounting table and replacing the surface. Patent Document 3 also proposes a pod for replacing consumable parts. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2018-10992 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-216614 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-98540 Summary of the Invention [Problem to be solved by the invention]

[0006] The present disclosure provides a technique that can improve the availability of a substrate processing system by shortening the time required to replace consumable parts in a vacuum processing chamber. [Means for solving the problem]

[0007] A substrate processing system according to one embodiment of the present disclosure includes an atmospheric pressure transfer chamber, a vacuum processing chamber, one or more load lock modules, a vacuum transfer chamber, multiple mounting units, a first transfer mechanism, a second transfer mechanism, and a control unit. The atmospheric pressure transfer chamber transfers substrates and consumable parts in an atmospheric pressure atmosphere. The vacuum processing chamber performs vacuum processing on the substrates. The one or more load lock modules are disposed between the atmospheric pressure transfer chamber and the vacuum processing chamber, through which the transferred substrates and consumable parts pass. The vacuum transfer chamber is disposed between the vacuum processing chamber and the one or more load lock modules, through which the transferred substrates and consumable parts pass in a reduced pressure atmosphere. The multiple mounting units are provided in the atmospheric pressure transfer chamber and have ports through which the substrates or consumable parts can pass between the atmospheric pressure transfer chamber and each of multiple storage units that accommodate the substrates or consumable parts. Each of the multiple storage units can be detachably attached to the multiple mounting units. The first transfer mechanism transfers substrates and consumable parts between the one or more load lock modules and the vacuum processing chamber via the vacuum transfer chamber. The second transfer mechanism transfers substrates and consumable parts between the multiple storage units and the one or more load lock modules via the atmospheric pressure transfer chamber. The control unit causes the first transfer mechanism and the second transfer mechanism to concurrently transfer the consumable parts from the storage unit to the vacuum processing chamber via the atmospheric pressure transfer chamber and one of the one or more load lock modules, and to transfer the consumable parts from the vacuum processing chamber via the vacuum transfer chamber and another of the one or more load lock modules. [Effects of the Invention]

[0008] According to the present disclosure, the availability of a substrate processing system can be improved by reducing the time required to replace consumable parts in a vacuum processing chamber. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a substrate processing system according to an embodiment. [Figure 2]FIG. 2 is a schematic configuration diagram of an example of a process module included in the substrate processing system according to an embodiment. [Figure 3] FIG. 3 is a perspective view for explaining the configuration of the susceptor shown in FIG. [Figure 4] FIG. 4 is a diagram for explaining the flow of a transport process of a consumable part according to one embodiment. [Figure 5] FIG. 5 is a flowchart showing an example of a flow of notification of replacement timing in the substrate processing system according to an embodiment. [Figure 6] FIG. 6 is a flowchart showing an example of a flow of installing an FR FOUP in a substrate processing system according to an embodiment. [Figure 7] FIG. 7 is a flowchart showing an example of the flow of a removal process for an FR FOUP in a substrate processing system according to an embodiment. [Figure 8A] FIG. 8A is a flowchart showing an example of the flow of an exchange reservation process in the substrate processing system according to one embodiment. [Figure 8B] FIG. 8B is a flowchart showing an example of the flow of an exchange reservation cancellation process in the substrate processing system according to an embodiment. [Figure 9] FIG. 9 is a flowchart showing an example of the flow of the replacement process in the substrate processing system according to one embodiment. [Figure 10] FIG. 10 is a flowchart showing an example of the flow of the replacement path securing process in the substrate processing system of one embodiment. [Figure 11] FIG. 11 is a diagram for explaining the exchange execution process in the substrate processing system of one embodiment. [Figure 12] FIG. 12 is a diagram for explaining the effect of reducing downtime when the focus ring is replaced in the substrate processing system of one embodiment. [Figure 13A] FIG. 13A is a view for explaining an operation of the second lifter pins when the focus ring is loaded in the substrate processing system according to an embodiment. [Figure 13B]FIG. 13B is a view for explaining an operation of the second lifter pins when the focus ring is unloaded in the substrate processing system according to an embodiment. [Figure 14A] FIG. 14A is a schematic top view showing an example of the configuration of a pick included in a substrate processing system according to an embodiment. [Figure 14B] FIG. 14B is a schematic front view of the pick shown in FIG. 14A. [Figure 15A] FIG. 15A is a schematic top view showing a state in which a wafer is held on the pick shown in FIG. 14A. [Figure 15B] FIG. 15B is a schematic front view of the pick and wafer shown in FIG. 15A as viewed from the horizontal direction. [Figure 16A] FIG. 16A is a schematic top view showing a state in which the focus ring is held on the pick shown in FIG. 14A. [Figure 16B] FIG. 16B is a schematic front view of the pick and focus ring shown in FIG. 16A as viewed from the horizontal direction. [Figure 17] FIG. 17 is a diagram for explaining the arrangement position of the third sensor in the substrate processing system of one embodiment. [Figure 18A] FIG. 18A is a schematic perspective view of a plate included in a gate valve of one embodiment. [Figure 18B] FIG. 18B is a schematic perspective view showing an enlarged portion of the gate valve of one embodiment. [Figure 18C] FIG. 18C is a schematic perspective view showing a state in which the opening of the gate valve of the embodiment is blocked. [Figure 19A] FIG. 19A is a diagram illustrating the positional relationship between a consumable part being transported and a sensor in one embodiment. [Figure 19B] FIG. 19B is a diagram showing an example of a detection signal in the example of FIG. 19A. [Figure 20A] FIG. 20A is a diagram for explaining the positional deviation of a consumable part during transportation. [Figure 20B] FIG. 20B is a diagram showing an example of a detection signal in the example of FIG. 20A. [Figure 21]FIG. 21 is a diagram showing the positional relationship between the consumable parts and the sensors when four sensors are arranged. [Figure 22] FIG. 22 is a diagram for explaining a method for calculating the positional deviation of the consumable part. DETAILED DESCRIPTION OF THE INVENTION

[0010] The disclosed embodiments will be described in detail below with reference to the accompanying drawings. Note that the embodiments are not limiting. Furthermore, the embodiments can be appropriately combined as long as the processing contents are not inconsistent.

[0011] (Configuration Example of Substrate Processing System According to Embodiment) In one embodiment, the substrate processing system transports used consumable parts from a vacuum processing chamber to a storage unit and transports unused consumable parts from the storage unit to the vacuum processing chamber. In one embodiment, the transport of used consumable parts and the transport of unused consumable parts are performed in parallel.

[0012] Here, the term "consumable parts" refers to parts that wear out and require replacement due to repeated plasma processing in a substrate processing system having multiple chambers (vacuum processing chambers) where plasma processing is performed in a reduced-pressure atmosphere. An example of a consumable part is a focus ring placed on a mounting table inside the chamber. Consumable parts include focus rings as well as any parts that can be transported into and out of a chamber by a device such as a robot arm. In the following description, an embodiment will be described using a focus ring as an example of a consumable part. Note that, in the following description, "vacuum" refers to a space filled with gas at a pressure lower than atmospheric pressure. That is, in the following description, "vacuum" includes a reduced-pressure state and a negative-pressure state. Also, in the following description, "normal pressure" refers to a pressure approximately equal to atmospheric pressure.

[0013] FIG. 1 is a schematic diagram of a substrate processing system 1 according to one embodiment.

[0014] The substrate processing system 1 includes a plurality of process modules PM (PM1 to PM8), a vacuum transfer chamber 10, a plurality of load lock modules LLM (LLM1, LLM2), an atmospheric pressure transfer chamber 20, a plurality of load ports LP (LP1 to LP5), and a control device 30.

[0015] 1 shows eight process modules PM1 to PM8, two load lock modules LLM1 to LLM2, and five load ports LP1 to LP5. However, the numbers of process modules PM, load lock modules LLM, and load ports LP included in the substrate processing system 1 are not limited to those shown in the figure. Hereinafter, unless there is a particular need to distinguish between them, the eight process modules PM1 to PM8 will be collectively referred to as process modules PM. Similarly, the two load lock modules LLM1 to LLM2 will be collectively referred to as load lock modules LLM. Similarly, the five load ports LP1 to LP5 will be collectively referred to as load ports LP. The substrate processing system 1 according to this embodiment includes at least two load lock modules LLM.

[0016] The process module PM processes a semiconductor substrate (hereinafter, referred to as a wafer W) as a processing target in a reduced-pressure atmosphere. The process module PM is an example of a vacuum processing chamber. The process module PM performs processes such as etching and film formation. The process module PM includes a mounting stage that supports the wafer W and a focus ring FR that is disposed on the mounting stage to surround the wafer W. The process module PM also includes first lifter pins (see 172 in FIGS. 2 and 3, which will be described later) that are vertically movable and disposed in an area on the mounting stage where the wafer W is mounted, and second lifter pins (see 182 in FIGS. 2 and 3, which will be described later) that are vertically movable and disposed in an area on the mounting stage where the focus ring FR is mounted. The first lifter pins are raised to lift the wafer W from the mounting stage. The second lifter pins are raised to lift the focus ring FR from the mounting stage. A reduced-pressure atmosphere is maintained inside the process module PM during processing of the wafer W.

[0017] Each process module PM is connected to the vacuum transfer chamber 10 via an openable and closable gate valve GV. The gate valve GV remains closed while a wafer W is being processed in the process module PM. The gate valve GV opens when a processed wafer W is being unloaded from the process module PM and when an unprocessed wafer W is being loaded into the process module PM. The gate valve GV also opens when a focus ring FR is being loaded into or unloaded from the process module PM. The process module PM is provided with a gas supply unit for supplying a predetermined gas and an exhaust unit capable of vacuuming. Details of the process module PM will be described later.

[0018] The interior of the vacuum transfer chamber 10 can be maintained at a reduced pressure. Wafers W are transferred to each process module via the vacuum transfer chamber 10. In the example of FIG. 1, the vacuum transfer chamber 10 is approximately pentagonal in top view, with process modules PM arranged around the vacuum transfer chamber 10 along its four sides. The wafer W processed in the process module PM can be transferred via the vacuum transfer chamber 10 to the process module PM where the next processing will be performed. After all processing has been completed, the wafer W is transferred via the vacuum transfer chamber 10 to the load lock module LLM. The vacuum transfer chamber 10 is equipped with a gas supply unit and an exhaust unit capable of vacuuming, not shown.

[0019] A first transfer mechanism for transferring wafers W and focus rings FR (hereinafter also referred to as transfer objects) is also disposed in vacuum transfer chamber 10. For example, VTM (Vacuum Transfer Module) arm 15 shown in FIG. 1 is an example of the first transfer mechanism. This VTM arm 15 transfers the transfer objects between process modules PM1 to PM8 and load lock modules LLM1 and LLM2.

[0020] The VTM arm 15 shown in FIG. 1 has a first arm 15a and a second arm 15b. The first arm 15a and the second arm 15b are attached to a base 15c. The base 15c is slidable in the longitudinal direction of the vacuum transfer chamber 10 on guide rails 16a and 16b. For example, the base 15c moves within the vacuum transfer chamber 10 by motor-driving a screw threaded into the guide rails 16a and 16b. The first arm 15a and the second arm 15b are rotatably fixed to the base 15c. Furthermore, a first pick 17a and a second pick 17b, each of which is substantially U-shaped, are rotatably connected to the tip of the first arm 15a and the tip of the second arm 15b.

[0021] The VTM arm 15 includes a motor (not shown) for extending and retracting the first arm 15a and the second arm 15b, and a motor (not shown) for raising and lowering the first arm 15a and the second arm 15b.

[0022] The vacuum transfer chamber 10 also includes first sensors S1-S16, which are arranged in correspondence with each process module PM. The first sensors S1-S16 are grouped in pairs, with each group corresponding to one process module PM. Each of the first sensors S1-S16 is a sensor for detecting misalignment of the wafer W and focus ring FR transferred to the corresponding process module PM. The transfer positions are corrected based on the detected positions. Position information of the wafer W and focus ring FR detected by the first sensors S1-S16 is transmitted to the control device 30. Since the first sensors S1-S16 each have the same configuration, only the first sensors S1 and S2 arranged in front of the process module PM1 will be described as representative examples.

[0023] The first sensors S1 and S2 are, for example, transmission-type photoelectric sensors, each having a light-emitting unit and a light-receiving unit located on the ceiling and floor sides of the vacuum transfer chamber 10, respectively. The first sensors S1 and S2 are each located on a transfer path when the wafer W and focus ring FR are transferred from the vacuum transfer chamber 10 to the process module PM1. For example, the first sensors S1 and S2 are located at positions where at least a portion of the wafer W and focus ring FR pass between the light-emitting unit and the light-receiving unit of the first sensors S1 and S2. When the VTM arm 15 holds the wafer W and transfers it to the process module PM1, the wafer W passes under the light-emitting units of the sensors S1 and S2. The light-emitting unit located above the wafer W emits light, and the light-receiving unit located below the wafer W receives the emitted light. While the wafer W passes under the light-emitting unit, light reception by the light-receiving unit stops. Once the wafer W passes under the light-emitting unit, light reception by the light-receiving unit resumes. Therefore, it is possible to detect the positional deviation of the wafer W or the focus ring FR based on the length of the light reception stop period of the first sensors S1 and S2. Based on the position information transmitted from the first sensors S1 and S2, the controller 30 corrects the position of the wafer W, i.e., the position of the VTM arm 15, and transfers the wafer W or the focus ring FR to the process module PM1.

[0024] The vacuum transfer chamber 10 also includes second sensors S17-S18, each associated with a load lock module LLM. The second sensors S17-S18 are located on the transfer path between the load lock modules LLM1 and LLM2 and the vacuum transfer chamber 10. In the example of FIG. 1, one second sensor is located in front of one load lock module LLM. When the VTM arm 15 transfers the object to the load lock module LLM, it waits in front of the load lock module LLM until the second sensor S17 or S18 detects the object. If the second sensor S17 (S18) cannot detect the object, the VTM arm 15, in response to an instruction from the control device 30, pivots the tip of the first pick 17a (17b) in the transfer operation left or right in a horizontal plane to move the object to a position where the second sensor S17 (S18) can detect it. When the second sensor S17 (S18) detects the transported object, the VTM arm 15 resumes transport to the load lock module LLM, which is a predetermined destination.

[0025] The load lock module LLM includes a stage on which a transfer object is placed and support pins for raising and lowering the wafer W and focus ring FR. The support pins may have the same configuration as the first and second lifter pins in the process module PM, which will be described later. The load lock module LLM includes an exhaust mechanism (not shown), such as a vacuum pump and a leak valve, and the interior of the load lock module LLM can be switched between atmospheric and reduced-pressure atmospheres. The load lock modules LLM are arranged side by side along one side of the vacuum transfer chamber 10, where no process module PM is located. The load lock module LLM and the vacuum transfer chamber 10 are configured to be able to communicate with each other via a gate valve GV.

[0026] The VTM arm 15 holds an object lifted by support pins from a pedestal in the load lock module LLM and transports it to a mounting pedestal in the process module PM. The VTM arm 15 also holds a wafer W lifted by the lifting of first lifter pins (172, see FIG. 2) in the process module PM and transports it to the pedestal in the load lock module LLM. The VTM arm 15 also holds a focus ring FR lifted by the lifting of second lifter pins (182, see FIG. 2) in the process module PM and transports it to the pedestal in the load lock module LLM.

[0027] The load lock module LLM is connected to the atmospheric pressure transfer chamber 20 on the side opposite to the side connected to the vacuum transfer chamber 10. The load lock module LLM and the atmospheric pressure transfer chamber 20 are configured so that their interiors can communicate with each other via a gate valve GV.

[0028] The atmospheric pressure transfer chamber 20 is maintained in an atmospheric pressure atmosphere. In the example of FIG. 1, the atmospheric pressure transfer chamber 20 has a substantially rectangular shape in top view. Multiple load lock modules LLM are arranged side by side along one long side of the atmospheric pressure transfer chamber 20. Furthermore, multiple load ports LP are arranged side by side along the other long side of the atmospheric pressure transfer chamber 20. A second transfer mechanism for transferring transfer objects between the load lock modules LLM and the load ports LP is disposed within the atmospheric pressure transfer chamber 20. The LM (Loader Module) arm 25 shown in FIG. 1 is an example of the second transfer mechanism. The LM arm 25 has an arm 25a. The arm 25a is rotatably fixed on a base 25c. The base 25c is fixed near the load port LP3. A substantially U-shaped first pick 27a and a second pick 27b are rotatably connected to the tip of the arm 25a.

[0029] At least one of the first pick 27a and the second pick 27b has a mapping sensor MS (not shown) at its tip. For example, the mapping sensors MS are disposed at the two ends of the substantially U-shape of each of the first pick 27a and the second pick 27b. When a FOUP (Front Opening Unified Pod), which will be described later, is connected to the load port LP, the FOUP lid opens and the mapping sensor MS performs mapping. That is, the mapping sensor MS detects the wafer W or the focus ring FR in the FOUP and transmits the detection results to the controller 30. Note that, because the wafer W and the focus ring FR differ in placement interval and thickness when housed in the FOUP, the controller 30 switches the threshold value of the mapping sensor MS depending on the type (detection target) of the FOUP, which will be described later.

[0030] Third sensors S20 to S27 are also disposed within the atmospheric pressure transfer chamber 20. The third sensors S20 to S27 detect the transferred wafer W and focus ring FR. The third sensors S20 to S23 detect objects being transferred between the load lock module LLM and the atmospheric pressure transfer chamber 20. The third sensors S24 to S27 detect objects being transferred between the atmospheric pressure transfer chamber 20 and the load port LP. The third sensors S20 to S27 are provided on the transfer path of the LM arm 25 between the door of the load port LP (described below) and the load lock module LLM. The third sensors S20 to S27 are arranged in pairs in front of the load lock modules LLM1 and LLM2 and the load ports LP2 and LP4. The third sensors S20 to S27 may be transmission-type photoelectric sensors similar to the first sensors S1 to S16. The third sensors S20 to S27 are configured to be able to detect both the wafer W and the focus ring FR.

[0031] During the transfer of the wafer W or the focus ring FR, a detection error may occur in the first sensors S1-16, the second sensors S17 and S18, and the third sensors S20-S27. In such a case, there is a possibility of a malfunction, such as the transported object falling from the VTM arm 15 or the LM arm 25. For this reason, when a detection error occurs, the substrate processing system 1 suspends processing. However, when a detection error occurs, the substrate processing system 1 may not immediately suspend processing, but may instead horizontally move the tip of the pick of the VTM arm 15 or the LM arm 25 that is the subject of the detection error and perform re-detection. If a detection error occurs again as a result of the re-detection, the substrate processing system 1 suspends processing. If the transported object is detected as a result of the re-detection, the substrate processing system 1 continues processing.

[0032] In the example of Fig. 1, of the load ports LP1 to LP5, only the load ports LP2 and LP4 are provided with corresponding third sensors. In the example of Fig. 1, the third sensors are provided only at positions corresponding to the load ports LP on which the FOUP for the focus ring FR can be installed. In another example, third sensors may be provided in correspondence with all the load ports LP.

[0033] The load port LP is configured to be able to mount a FOUP that accommodates a wafer W or a focus ring FR. A FOUP is a container that can accommodate a wafer W or a focus ring FR. The FOUP has an openable and closable lid. When a FOUP is placed on the load port LP, the FOUP lid engages with the door of the load port LP. The FOUP lid is then disengaged, allowing the FOUP lid to be opened. In this state, opening the door of the load port LP moves the FOUP lid along with the door, opening the FOUP. This establishes communication between the interior of the FOUP and the atmospheric pressure transfer chamber 20 via the load port LP. The FOUP according to one embodiment includes a wafer FOUP that can accommodate a wafer W and a focus ring (FR) FOUP that can accommodate a focus ring FR. The wafer FOUP is an example of a first storage unit, and the FR FOUP is an example of a second storage unit.

[0034] The wafer FOUP has shelf-like storage sections corresponding to the number of wafers W to be stored. The FR FOUP is configured to accommodate, for example, a number of focus rings FR corresponding to the number of process modules PM included in the substrate processing system 1. For example, if there are eight process modules PM in which focus rings FR are arranged, the FR FOUP may be able to accommodate eight unused focus rings FR and eight used focus rings FR. The upper eight storage sections can accommodate unusable focus rings FR, and the lower eight storage sections can accommodate used focus rings FR. The reason used focus rings FR are stored at the bottom is to prevent particles adhering to used focus rings FR from adhering to the unusable focus rings FR. The number of wafers W and focus rings FR that can be stored in the FOUP is merely an example, and a FOUP can be configured to accommodate any number of wafers W and focus rings FR.

[0035] The load port LP includes a first load port to which a wafer FOUP can be attached and a second load port to which an FR FOUP can be attached. In the example of FIG. 1, the load ports LP1, LP3, and LP5 are first load ports. The load ports LP2 and LP4 are second load ports. The first load port is an example of a first attachment unit, and the second load port is an example of a second attachment unit. Note that the second load port in one embodiment can attach both a wafer FOUP and an FR FOUP. The FR FOUP may be attached only when the focus ring FR is replaced, or may be permanently attached. In another example, there may be only one second load port.

[0036] Each load port LP is equipped with a reading unit (not shown) for reading the carrier ID (identifier) ​​of the FOUP. The carrier ID is an identifier for identifying the type of each FOUP. To distinguish between FR FOUPs and wafer FOUPs, a naming convention for the carrier ID can be set in advance in the substrate processing system 1. For example, a carrier ID starting with a predetermined character string may be recognized as the carrier ID of a FR FOUP, and a carrier ID starting with another predetermined character string may be recognized as the carrier ID of a wafer FOUP. For example, a carrier ID starting with "FR_" is set in the substrate processing system 1 as a FR FOUP, and a carrier ID starting with "W_" is set in the substrate processing system 1 as a wafer FOUP. The naming convention for the carrier ID may be set by default or by an operator. When a FOUP is placed on the load port LP and locked, the reading unit reads the carrier ID assigned to the FOUP. The substrate processing system 1 identifies whether each FOUP is a wafer FOUP or a FR FOUP based on the carrier ID. When the carrier ID is authenticated and the FOUP is connected to the load port LP, the lid of the FOUP is opened together with the door of the load port, and the wafer W or focus ring FR housed in the FOUP is detected by the mapping sensor MS of the LM arm 25.

[0037] An aligner AU is disposed on one short side of the atmospheric pressure transfer chamber 20. The aligner AU has a rotary stage on which the wafer W is placed and an optical sensor that optically detects the outer peripheral edge of the wafer W. The aligner AU aligns the wafer W by detecting, for example, an orientation flat or a notch of the wafer W.

[0038] The process module PM, vacuum transfer chamber 10, VTM arm 15, load lock module LLM, atmospheric pressure transfer chamber 20, LM arm 25, load port LP, and aligner AU configured as described above are each connected to and controlled by the control device 30.

[0039] The control device 30 is an information processing device that controls each part of the substrate processing system 1. The specific configuration and functions of the control device 30 are not particularly limited. The control device 30 includes, for example, a storage unit 31, a processing unit 32, an input / output interface (IO I / F) 33, and a display unit 34. The storage unit 31 is, for example, any storage device such as a hard disk, an optical disk, or a semiconductor memory element. The processing unit 32 is, for example, a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The display unit 34 is, for example, a functional unit that displays information, such as an LCD screen or a touch panel.

[0040] The processing unit 32 reads and executes programs and recipes stored in the storage unit 31, thereby controlling each unit of the substrate processing system 1 via the input / output interface 33. The processing unit 32 also identifies the type of FOUP connected to each load port LP based on the carrier ID read by a reader provided on the load port LP and stores the identified information in the storage unit 31. The processing unit 32 also receives information about the wafer W and focus ring FR in the FOUP detected by the mapping sensor MS and stores the information in the storage unit 31. The processing unit 32 also receives information about the process being executed in each process module PM from sensors (not shown) provided in the process module PM and stores the information in the storage unit 31. The control device 30 also receives detection error notifications from the second and third sensors and performs redetection or process cancellation processing. The control device 30 also controls and executes the following processes: replacement timing notification processing, FR FOUP installation processing, FR FOUP removal processing, replacement reservation processing, replacement reservation cancellation processing, and replacement processing, which will be described later.

[0041] (Example of process module PM configuration) 2 is a schematic configuration diagram of an example of a process module PM included in the substrate processing system 1 according to an embodiment. The process module PM shown in FIG. 2 is a parallel plate type plasma processing apparatus.

[0042] The process module PM includes a processing chamber 102 having a cylindrical processing vessel made of, for example, aluminum whose surface has been anodized (alumite treated). The processing chamber 102 is grounded. A substantially cylindrical mounting table 110 for mounting a wafer W thereon is provided at the bottom of the processing chamber 102. The mounting table 110 includes a plate-shaped insulator 112 made of ceramic or the like, and a susceptor 114 that constitutes a lower electrode provided on the insulator 112.

[0043] The mounting table 110 includes a susceptor temperature regulator 117 that can regulate the temperature of the susceptor 114 to a predetermined temperature. The susceptor temperature regulator 117 is configured to circulate a temperature control medium in a temperature control medium chamber 118 provided in the susceptor 114, for example.

[0044] The susceptor 114 has a convex substrate mounting portion formed in the center of its upper side. The upper surface of this substrate mounting portion serves as a substrate mounting surface 115, and the upper surface of the lower portion around it serves as a focus ring mounting surface 116 on which a focus ring FR is mounted. As shown in FIG. 2 , when an electrostatic chuck 120 is provided above the substrate mounting portion, the upper surface of the electrostatic chuck 120 serves as the substrate mounting surface 115. The electrostatic chuck 120 has an electrode 122 interposed between insulating materials. A DC voltage of, for example, 1.5 kV is applied to the electrostatic chuck 120 from a DC power supply (not shown) connected to the electrode 122. This causes the wafer W to be electrostatically attracted to the electrostatic chuck 120. The substrate mounting portion has a diameter smaller than that of the wafer W, so that the peripheral edge of the wafer W extends beyond the substrate mounting portion when the wafer W is mounted thereon.

[0045] A focus ring FR is disposed on the upper peripheral edge of the susceptor 114 so as to surround the wafer W placed on a substrate mounting surface 115 of the electrostatic chuck 120. The focus ring FR is placed on a focus ring mounting surface 116 of the susceptor 114.

[0046] The insulator 112, the susceptor 114, and the electrostatic chuck 120 are provided with gas passages for supplying a heat transfer medium (e.g., a backside gas such as He gas) to the backside of the wafer W placed on the substrate placement surface 115. Heat is transferred between the susceptor 114 and the wafer W via this heat transfer medium, and the wafer W is maintained at a predetermined temperature.

[0047] An upper electrode 130 is provided above the susceptor 114 so as to face the susceptor 114. The space formed between the upper electrode 130 and the susceptor 114 serves as a plasma generation space. The upper electrode 130 is supported on the top of the processing chamber 102 via an insulating shielding member 131.

[0048] The upper electrode 130 is mainly composed of an electrode plate 132 and an electrode support 134 that detachably supports the electrode plate 132. The electrode plate 132 is made of, for example, quartz, and the electrode support 134 is made of, for example, a conductive material such as aluminum whose surface has been anodized.

[0049] The electrode support 134 is provided with a process gas supply unit 140 for introducing a process gas from a process gas supply source 142 into the process chamber 102. The process gas supply source 142 is connected to a gas inlet 143 of the electrode support 134 via a gas supply pipe 144.

[0050] 2, a mass flow controller (MFC) 146 and an on-off valve 148 are provided in this order from the upstream side of the gas supply pipe 144. Note that a flow control system (FCS) may be provided instead of the MFC. A fluorocarbon gas (CxFy) such as C4F8 gas is supplied from the processing gas supply source 142 as a processing gas for etching.

[0051] The processing gas supply source 142 supplies, for example, an etching gas for plasma etching. Although Fig. 2 shows only one processing gas supply system including the gas supply pipe 144, the on-off valve 148, the mass flow controller 146, and the processing gas supply source 142, the process module PM actually includes multiple processing gas supply systems. For example, processing gases such as CF4, O2, N2, and CHF3 are supplied into the processing chamber 102 with their flow rates independently controlled.

[0052] The electrode support 134 is provided with, for example, a substantially cylindrical gas diffusion chamber 135, which can uniformly diffuse the process gas introduced from the gas supply pipe 144. A number of gas discharge holes 136 are formed in the bottom of the electrode support 134 and the electrode plate 132, through which the process gas from the gas diffusion chamber 135 is discharged into the process chamber 102. The process gas diffused in the gas diffusion chamber 135 can be uniformly discharged from the number of gas discharge holes 136 toward the plasma generation space. In this respect, the upper electrode 130 functions as a shower head for supplying the process gas.

[0053] The upper electrode 130 includes an electrode support temperature regulator 137 that can regulate the temperature of the electrode support 134 to a predetermined temperature. The electrode support temperature regulator 137 is configured to circulate a temperature control medium in a temperature control medium chamber 138 provided in the electrode support 134, for example.

[0054] An exhaust pipe 104 is connected to the bottom of the processing chamber 102, and an exhaust unit 105 is connected to this exhaust pipe 104. The exhaust unit 105 is equipped with a vacuum pump such as a turbo molecular pump, and adjusts the interior of the processing chamber 102 to a predetermined reduced pressure atmosphere. A loading / unloading port 106 for the wafer W is provided on the side wall of the processing chamber 102, and a gate valve 108 (corresponding to GV in FIG. 1) is provided at the loading / unloading port 106. The gate valve 108 is opened when loading or unloading the wafer W. Then, the wafer W is loaded or unloaded through the loading / unloading port 106 by a transfer arm (not shown) or the like.

[0055] A first high-frequency power supply 150 is connected to the upper electrode 130, and a first matching box 152 is inserted in the power supply line. The first high-frequency power supply 150 is capable of outputting high-frequency power for plasma generation having a frequency in the range of 50 to 150 MHz. By applying such high-frequency power to the upper electrode 130, high-density plasma in a desirable dissociated state can be formed in the processing chamber 102, enabling plasma processing under lower pressure conditions. The frequency of the output power from the first high-frequency power supply 150 is preferably 50 to 80 MHz, and is typically adjusted to 60 MHz or a frequency in the vicinity of the illustrated frequency.

[0056] A second high frequency power supply 160 is connected to the susceptor 114 as the lower electrode, and a second matching box 162 is inserted in the power supply line of the second high frequency power supply 160. The second high frequency power supply 160 is capable of outputting high frequency power for biasing having a frequency in the range of several hundred kHz to several tens of MHz. The frequency of the output power from the second high frequency power supply 160 is typically adjusted to 2 MHz, 13.56 MHz, or the like.

[0057] In addition, a high-pass filter (HPF) 164 is connected to the susceptor 114 to filter the high-frequency current flowing from the first high-frequency power supply 150 to the susceptor 114, and a low-pass filter (LPF) 154 is connected to the upper electrode 130 to filter the high-frequency current flowing from the second high-frequency power supply 160 to the upper electrode 130.

[0058] The process module PM is connected to a control device 30 of the substrate processing system 1. The control device 30 controls each part of the process module PM. An input / output interface 33 of the control device 30 includes a keyboard through which an operator inputs commands to manage the process module PM, a display that visualizes and displays the operating status of the process module PM, and the like.

[0059] The storage unit 31 also stores programs for implementing various processes in the process modules PM under the control of the controller 30, as well as processing conditions (recipes) required to execute the programs. These processing conditions are a collection of multiple parameter values, such as control parameters and setting parameters, that control each part of the process module PM. Each processing condition has parameter values ​​such as the flow rate ratio of the processing gas, the pressure inside the processing chamber, and the high-frequency power. These programs and processing conditions may be stored on a hard disk or semiconductor memory, or may be stored on a portable, computer-readable storage medium such as a CD-ROM or DVD and set in a predetermined position in the storage unit 31.

[0060] The control device 30 reads out desired programs and processing conditions from the storage unit 31 based on instructions received via the input / output interface 33, and controls each unit to execute desired processing in the process module PM. The processing conditions can also be edited by operating the input / output interface 33. Alternatively, a separate control device may be provided for each process module PM, and the entire substrate processing system 1 may be controlled by communication between each control device and the host device.

[0061] (An example of a lifter pin and drive mechanism) 3, the susceptor 114 of the process module PM is provided with first lifter pins 172 that can move up and down from the substrate mounting surface 115, and second lifter pins 182 that can move up and down from the focus ring mounting surface 116. FIG. 3 is a perspective view for explaining the configuration of the susceptor 114 shown in FIG. 2. Specifically, as shown in FIG. 2, the first lifter pins 172 are driven by a first driving mechanism 170 to lift the wafer W from the substrate mounting surface 115. The second lifter pins 182 are driven by a second driving mechanism 180 to lift the focus ring FR from the focus ring mounting surface 116.

[0062] First drive mechanism 170 and second drive mechanism 180 are motors such as DC motors, stepping motors, and linear motors, piezoelectric actuators, air drive mechanisms, etc. First drive mechanism 170 and second drive mechanism 180 each have drive accuracy suitable for transporting wafer W and focus ring FR.

[0063] The insulator 112 supporting the susceptor 114 of the process module PM is formed in an annular shape. The first lifter pins 172 extend vertically upward from below the susceptor 114 surrounded by the insulator 112 and are provided so as to be freely raised and lowered from a substrate mounting surface 115, which is the upper surface of the electrostatic chuck 120. Each first lifter pin 172 is inserted into a hole formed through the susceptor 114 and the electrostatic chuck 120 and raised and lowered from the substrate mounting surface 115 as shown in FIG. 3 in response to drive control by a first drive mechanism 170. The first drive mechanism 170 may be connected to an annular base on which the first lifter pins 172 are arranged at equal intervals, and the first lifter pins 172 may be driven via the base. The number of first lifter pins 172 is not limited to three. The first lifter pins 172 may be positioned so as not to interfere with the VTM arm 15 when loading and unloading the wafer W.

[0064] The second lifter pins 182 extend vertically upward from below the susceptor 114 and are provided so as to be freely raised and lowered from the focus ring mounting surface 116. Each second lifter pin 182 is inserted into a hole formed penetrating from below the susceptor 114 to the focus ring mounting surface 116 and is raised and lowered from the focus ring mounting surface 116 in response to drive control by the second drive mechanism 180, as shown in FIG. 3 . The second drive mechanism 180 may be connected to an annular base on which the second lifter pins 182 are arranged at equal intervals, and the second lifter pins 182 may be driven via the base. Alternatively, multiple second drive mechanisms 180 may be configured so that each drives one second lifter pin 182. The number of second lifter pins 182 is not limited to three. The second lifter pins 182 may be positioned so as not to interfere with the VTM arm 15 when the focus ring FR is loaded or unloaded. The base connected to such second drive mechanism 180 has a larger diameter than the base connected to first drive mechanism 170 and is positioned further outward than the base connected to first drive mechanism 170. This allows first drive mechanism 170 and second drive mechanism 180 to independently raise and lower first lifter pins 172 and second lifter pins 182 without interfering with each other.

[0065] The first driving mechanism 170 configured in this manner can lift the wafer W from the electrostatic chuck 120 by raising the first lifter pins 172. The second driving mechanism 180 can lift the focus ring FR from the focus ring mounting surface 116 by raising the second lifter pins 182.

[0066] 2, the focus ring FR is formed as a single unit, but it may be divided into two or more parts. For example, the inner diameter side, which is more likely to wear, may be separated from the outer diameter side to form a two-piece configuration. In this case, only the inner focus ring may be replaced by lifting it up with second lifter pins 182.

[0067] (Mode setting) The substrate processing system 1 of this embodiment having the above configuration can be set to the following modes. (1) Access mode of load port LP (2) Maintenance mode for each part (3) Processing mode of the process module PM

[0068] (1) Access mode of load port LP The access mode is a mode for setting whether or not to accept automatic placement of a FOUP on a load port LP. Two types of access mode are set: manual mode and auto mode. In manual mode, the substrate processing system 1 places and removes a FOUP on the condition that an operator inputs instructions. In auto mode, the substrate processing system 1 places and removes a FOUP without any operator input instructions.

[0069] For example, in manual mode, the substrate processing system 1 does not accept placement or removal of a FOUP by an overhead hoist transfer (OHT). On the other hand, in manual mode, the substrate processing system 1 accepts placement and removal of a FOUP by an automated guided vehicle (AGV) if an operator inputs instructions. On the other hand, in auto mode, the substrate processing system 1 accepts placement and removal of a FOUP by an OHT without operator input instructions.

[0070] The manual mode is selected when it is necessary to install and remove a FOUP under the supervision of an operator. In this embodiment, installation and removal of a FR FOUP can only be performed when the manual mode is selected.

[0071] (2) Maintenance mode for each part The maintenance mode is set when normal processing (processing of product wafers W) of each part of the substrate processing system 1 is stopped to perform maintenance. The maintenance mode can be set collectively for a set of modules that operate in cooperation with each other. For example, the atmospheric pressure transfer chamber 20 and all of the load ports LP1 to LP5 can be set collectively to either the normal processing mode or the maintenance mode.

[0072] When the normal processing mode is set, each part of the substrate processing system 1 operates automatically based on a preset processing flow, whereas when the maintenance mode is set, each part of the substrate processing system 1 operates in response to inputs from an operator.

[0073] (3) Processing mode of the process module PM The processing mode of a process module PM is a mode that specifies the processing of product wafers W, such as the execution of plasma processing. Two processing modes can be set: a production mode and a non-production mode. In the production mode, the substrate processing system 1 can perform plasma processing on product wafers W in the process module PM. On the other hand, in the non-production mode, the substrate processing system 1 cannot perform plasma processing on product wafers W in the process module PM. In this embodiment, when a consumable part replacement process is performed, the substrate processing system 1 transitions the process module PM in which the consumable part is located to the non-production mode. After the consumable part is replaced, the process module PM transitions to the production mode and resumes plasma processing on the product wafers W.

[0074] (Example of a flow of a transport process according to an embodiment) 4 is a diagram illustrating the flow of a consumable part transport process according to one embodiment. In FIG. 4, the left side shows processes performed by an operator, and the right side shows processes performed by the substrate processing system 1 (controller 30). However, the processes shown in FIG. 4 as being performed by an operator may be configured to be automatically performed by each unit of the substrate processing system 1, as appropriate.

[0075] First, the substrate processing system 1 executes a process for notifying the operator of the timing for replacing a consumable part (step S21, see FIG. 5). For example, the substrate processing system 1 determines whether it is time to replace the focus ring FR. If the substrate processing system 1 determines that it is time to replace the focus ring FR, it transmits a notification to the operator notifying that it is time for replacement (step S22). For example, the substrate processing system 1 displays information indicating that the replacement timing has arrived on the display unit 34 of the control device 30.

[0076] After checking the information, the operator checks whether an FR FOUP has already been installed on the load port LP of the substrate processing system 1. If an FR FOUP has not been installed, the operator performs processing to install the FR FOUP (step S23, see FIG. 6).

[0077] The substrate processing system 1 detects the installation of the FR FOUP using a sensor, a reading unit, etc., and stores the completion of installation of the FR FOUP in the storage unit 31 (step S24, see FIG. 5). When the FR FOUP is installed, the substrate processing system 1 notifies the operator that a replacement reservation for the focus ring FR is possible. For example, the substrate processing system 1 displays a screen for accepting a replacement reservation on the display unit 34.

[0078] The operator executes a predetermined input to the substrate processing system 1 to make a reservation for replacement of the focus ring FR (step S25). In response to the operator's input, the substrate processing system 1 stores in the storage unit 31 information indicating that the reservation for replacement of the focus ring FR has been completed (step S26). The substrate processing system 1 also notifies the operator that the reservation for replacement of the focus ring FR is in progress (step S27). For example, the substrate processing system 1 displays a message on the display unit 34 indicating that the reservation for replacement is in progress.

[0079] Furthermore, when a replacement reservation is made, the substrate processing system 1 clears (resets) a counter used for notifying the replacement timing (step S28). The counter may be cleared in response to an input from an operator (step S29), or may be cleared automatically by the substrate processing system 1 when a replacement reservation is made.

[0080] Furthermore, when a predetermined condition is satisfied, the substrate processing system 1 starts replacing the focus ring FR (step S30). When the substrate processing system 1 starts replacing the focus ring FR, it notifies the operator that the replacement is in progress (step S31). For example, the substrate processing system 1 displays a message on the display unit 34 indicating that the replacement is in progress.

[0081] Furthermore, when the replacement of the focus ring FR is completed (step S32), the substrate processing system 1 notifies the operator that the replacement is completed (step S33). For example, the substrate processing system 1 erases the display on the display unit 34 indicating that the replacement is in progress.

[0082] When there are no unused focus rings FR housed in the FR FOUP, the operator performs a removal process for the FR FOUP (step S34). The substrate processing system 1 detects that the removal process has been performed and ends the process (step S35). This is the flow of the consumable part transport process in the substrate processing system 1. Note that the process flow shown in FIG. 4 is only an example, and the steps may be performed in an order different from that shown in FIG. 4, or other processes may be additionally performed.

[0083] (Example of display screen) The display unit 34 of the substrate processing system 1 configured as described above displays the status of each process module PM on a screen. The display unit 34 displays, for example, a graphical user interface (GUI) screen. An operator can set the processing of each unit and the replacement timing of consumable parts by performing input operations while viewing the GUI displayed by the display unit 34.

[0084] The display unit 34 displays, among the load ports LP1 to LP5, the load ports LP1, LP3, and LP5 that can accommodate wafer FOUPs and the load ports LP2 and LP4 that can accommodate both wafer and FR FOUPs in a manner that allows them to be distinguished from one another.

[0085] The display unit 34 also displays, in a distinguishable manner, load ports LP to which wafer FOUPs are already connected and load ports LP to which wafer FOUPs are not yet connected.The display unit 34 also displays, in a distinguishable manner, load ports LP to which FR FOUPs are already connected and load ports LP to which FR FOUPs are not yet connected.

[0086] Display unit 34 also identifiably displays the number and positions of wafers W housed in the wafer FOUP connected to the load port LP. Display unit 34 also identifiably displays the number of processed wafers W and the number of unprocessed wafers W, among the wafers W housed in the wafer FOUP. Display unit 34 also identifiably displays the number of focus rings FR housed in the FR FOUP connected to the load port LP. Display unit 34 also identifiably displays the number of unused focus rings FR and the number of used focus rings FR, among the focus rings FR housed in the FR FOUP.

[0087] The display unit 34 also displays processing conditions such as various modes and recipes set in the process modules PM. The display unit 34 switches the display screen in response to an input from the operator. By inputting an instruction, the operator can switch between an individual screen for each process module PM, an overall screen displaying the overall status of the substrate processing system 1, and the like, and display them on the display unit 34.

[0088] (Example of replacement timing notification process flow) Next, a detailed description will be given of each process shown in Fig. 4. First, the replacement timing notification process (step S21) will be described.

[0089] As described above, the substrate processing system 1 according to the embodiment determines whether or not it is time to replace the focus ring FR. If it determines that it is time to replace the focus ring FR, the substrate processing system 1 notifies the operator that it is time to replace the focus ring FR.

[0090] Here, the substrate processing system 1 determines whether or not the timing for replacing the focus ring FR has arrived based on a predetermined parameter. When the predetermined parameter reaches a threshold value, the substrate processing system 1 determines that the timing for replacement has arrived.

[0091] For example, in the substrate processing system 1, parameters for determination and threshold values ​​for the parameters are stored in advance in the storage unit 31 of the control device 30. The parameters include, for example, the number of plasma processes performed by the process module PM after the focus ring FR was replaced, the duration of the plasma processes (discharge time), the number of processed wafers W, and the exposure time of the focus ring FR to plasma. For example, the parameter may be the number of plasma processes performed after the focus ring FR was replaced, and the threshold value may be 4,000 times. Different parameters and threshold values ​​may be set for multiple types of consumable parts. Furthermore, parameters and threshold values ​​may be set in association with other maintenance items, such as cleaning and maintenance to prevent component regrease, in addition to replacement of consumable parts. Furthermore, if multiple process modules PM have the same consumable parts, different parameters and threshold values ​​may be set for each process module PM. The parameters and threshold values ​​may be set in advance in the substrate processing system 1 or may be set and input by an operator. The substrate processing system 1 may also be configured to display information corresponding to a notification received from an external device, such as a host device, without determining the timing of maintenance within the substrate processing system 1.

[0092] FIG. 5 is a flowchart showing an example of a flow of replacement timing notification in the substrate processing system 1 according to an embodiment. First, an operator inputs parameters used to determine replacement timing and threshold values ​​for the parameters to the substrate processing system 1. The substrate processing system 1 sets the parameters and threshold values ​​in response to the input (step S51). Then, the substrate processing system 1 counts the parameters, such as the number of processed wafers W. The substrate processing system 1 determines whether the count value reaches the set threshold value (step S52). If it determines that the threshold value has not been reached (step S52, No), the substrate processing system 1 repeats the determination of step S52. On the other hand, if it determines that the threshold value has been reached (step S52, Yes), the substrate processing system 1 transmits a notification that the replacement timing has arrived (step S53). For example, the substrate processing system 1 displays the replacement timing notification on the display unit 34. Then, the substrate processing system 1 determines whether an instruction to reset the counter has been received (step S54). If it is determined that there is no instruction to reset (step S54, No), the substrate processing system 1 repeats the determination of step S54. On the other hand, if it is determined that there is an instruction to reset (step S54, Yes), the substrate processing system 1 resets the counter (step S55). Then, the substrate processing system 1 returns to step S52 and repeats the process.

[0093] (An example of the FR FOUP installation process flow) Next, an example of the flow of the process for placing an FR FOUP (FIG. 4, steps S23 and S24) will be described. Fig. 6 is a flowchart showing an example of the flow of placing an FR FOUP in the substrate processing system 1 of one embodiment.

[0094] As described above, the substrate processing system 1 of the embodiment distinguishably displays the load ports LP2 and LP4 that can accommodate both wafer and FR FOUPs, and the load ports LP1, LP3, and LP5 that can accommodate wafer FOUPs. For example, the display unit 34 displays the load ports LP that can accommodate FR FOUPs and the load ports LP that can accommodate wafer FOUPs in different colors.

[0095] First, the operator specifies the target load port (e.g., load port LP4) on which the FR FOUP is to be placed on the screen displayed by the display unit 34 of the substrate processing system 1. Then, the operator sets the access mode of the target load port LP4 to manual mode (step S701).

[0096] When the operator sets the load port LP4 to the manual mode, the substrate processing system 1 detects the set mode (step S702) and changes the access mode stored in the memory unit 31 in association with the load port LP4 to the manual mode.

[0097] Next, the operator operates, for example, an AGV to place the FR FOUP on the target load port, load port LP4 (step S703). Then, the operator inputs an instruction to place the FR FOUP to the substrate processing system 1 (step S704). The substrate processing system 1 detects the input instruction (step S705).

[0098] When the substrate processing system 1 detects the input instruction, it first engages the FR FOUP on the load port LP4 (step S706). When the FR FOUP is engaged on the load port LP4, a reading unit included in the load port LP4 reads the carrier ID of the FR FOUP. The carrier ID read by the reading unit is transmitted to the processing unit 32 of the control device 30, and the processing unit 32 determines whether the carrier ID is that of a FR FOUP and authenticates the carrier ID (step S707). Because the load port LP4 is a load port for FR FOUPs, if the carrier ID is that of a wafer FOUP, the processing unit 32 notifies the operator that installation is not permitted. For example, the processing unit 32 displays a notification that installation is not permitted on the display unit 34. On the other hand, if the read carrier ID is that of a FR FOUP, the processing unit 32 authenticates the carrier ID. The authenticated carrier ID is stored in the storage unit 31 in association with the load port LP4. Furthermore, the processing unit 32 sets a threshold value for the mapping sensor MS according to the authenticated carrier ID.

[0099] Once the carrier ID is authenticated, the substrate processing system 1 then connects the placed FR FOUP to the load port LP4 (step S708). Once the connection of the FR FOUP is complete, the substrate processing system 1 opens the lid of the FR FOUP and the door of the load port LP4, thereby connecting the interior of the FR FOUP to the atmospheric pressure transfer chamber 20 (step S709). Once the lid of the FR FOUP is opened, the mapping sensor MS performs mapping of the focus rings FR in the FR FOUP (step S710). The mapping sensor MS detects the positions and number of focus rings FR in the FR FOUP. The mapping sensor MS performs detection based on calibration (calibration reference values ​​and threshold values) appropriate for the size of the focus rings FR. The mapping sensor MS notifies the controller 30 of the detected positions and number of focus rings FR. The controller 30 stores the notified positions and number of focus rings FR in the memory unit 31. Then, the control device 30 updates the screen by displaying the positions and number of the focus rings FR on the display unit 34 (step S711), thereby completing the FR FOUP installation process.

[0100] When an FR FOUP is installed, the display unit 34 updates the display screen according to each stage of installation. The display unit 34 displays, in different ways, a load port to which an FR FOUP has not yet been installed (first state) and a load port to which an FR FOUP has been connected but the mapping of the focus ring FR has not been completed (second state). The display unit 34 also displays, in different ways, load ports in the first and second states and a load port to which an FR FOUP has been connected and the mapping of the focus ring FR has been completed (third state).

[0101] (An example of the process for removing a FR FOUP) Next, an example of the process flow when removing an FR FOUP (FIG. 4, steps S34 and S35) will be described. FIG. 7 is a flowchart showing an example of the process flow for removing an FR FOUP in the substrate processing system 1 of one embodiment.

[0102] The operator first designates the target load port (for example, load port LP4) on the display screen, and then inputs an instruction to remove the FR FOUP (step S901).

[0103] The substrate processing system 1 receives an instruction from the operator (step S902). Upon receiving the instruction, the substrate processing system 1 first closes the lid of the target FR FOUP (step S903). Then, the substrate processing system 1 releases the connection between the FR FOUP and the load port LP4 (step S904). Furthermore, the substrate processing system 1 releases the lock on the FR FOUP (step S905). After releasing the lock, the substrate processing system 1 notifies the operator that removal of the FR FOUP is complete (step S906). For example, the substrate processing system 1 displays a message indicating that removal is complete on the display unit 34. Upon receiving the notification from the substrate processing system 1, the operator operates the AGV to remove the FR FOUP from the load port LP4 and transport it (step S907). Upon completion of transport, the operator inputs a predetermined instruction to the substrate processing system 1 (step S908). When the substrate processing system 1 receives the instruction input from the operator, it stores the information that the removal of the FR FOUP is complete in the storage unit 31 and updates the screen (step S909). This completes the removal of the FR FOUP.

[0104] The display unit 34 may display the load port LP in the process of removing a FOUP (fourth state) in a manner different from any of the first to third states.

[0105] (FR FOUP installation process variation 1) In the above description, the reading unit of the load port LP reads the carrier ID of the FR FOUP, and the processing unit 32 performs authentication and stores the ID in the storage unit 31. However, there are cases where a carrier ID is not assigned to each FOUP in advance. Therefore, the substrate processing system 1 may be configured so that the operator can input the carrier ID when placing the FOUP.

[0106] For example, information on a carrier ID input screen that accepts input from an operator is stored in advance in the storage unit 31. When the process of FIG. 6 starts and the operator inputs an instruction to install a FOUP to the substrate processing system 1 (step S704), the substrate processing system 1 executes steps S705 to S706. Thereafter, in step S707, the substrate processing system 1 displays the carrier ID input screen instead of reading the carrier ID. On the carrier ID input screen, the operator inputs information that identifies the target load port LP and the carrier ID of the FOUP being installed on the target load port LP. When a carrier ID is input on the carrier ID input screen, the processing unit 32 identifies whether the carrier ID is the ID of an FR FOUP or a wafer FOUP. The identification result is stored in the storage unit 31. Thus, during the process of FIG. 6, instead of step S707, the substrate processing system 1 displays the carrier ID input screen, accepts input of a carrier ID, and authenticates the carrier ID. The input of the carrier ID and the processing after authentication are the same as those in the process of FIG. 6 (step S708 and thereafter).

[0107] In step S707, if the substrate processing system 1 fails to read the carrier ID, the carrier ID input screen may be displayed.

[0108] (Modification 2 of FR FOUP installation process) In the above description, the substrate processing system 1 is configured to distinguish between FR FOUPs and wafer FOUPs by carrier IDs. However, the present invention is not limited to this, and the substrate processing system 1 may be configured to distinguish between FR FOUPs and wafer FOUPs based on input from an operator.

[0109] For example, similar to the first modification, information on an input screen for accepting input from an operator is stored in advance in the storage unit 31. When the processing of FIG. 6 starts and the operator inputs an instruction to install a FOUP to the substrate processing system (step S704), the substrate processing system 1 executes steps S705 to S706. Thereafter, in step S707, the substrate processing system 1 displays an input screen rather than reading a carrier ID. Unlike the input screen of the first modification, the input screen of the second modification prompts the operator to specify the type of FOUP. The operator inputs information on the input screen specifying whether the FOUP being installed on the load port is a wafer FOUP or an FR FOUP. For example, during the processing of FIG. 6, instead of step S707, the substrate processing system 1 displays an input screen for the type of FOUP and carrier ID and accepts the input content. The subsequent processing is the same as the processing of FIG. 6 (step S708 and thereafter).

[0110] The input screen of Modification 2 may be configured to be displayed when the substrate processing system 1 fails to read the carrier ID. Also, the input screen of Modification 2 may be configured to be displayed when the information entered into the carrier ID input screen of Modification 1 is invalid.

[0111] By configuring as described above, even if a FOUP without a carrier ID is installed or if the operator makes an input error, the substrate processing system 1 can alert the operator and proceed with processing without delay.

[0112] (An example of the exchange reservation process flow) Next, an example of the flow of the replacement reservation process for the focus ring FR (FIG. 4, steps S25 to S27) will be described.

[0113] Here, the term "replacement reservation" refers to a process of instructing the substrate processing system 1 to replace a consumable part, such as the focus ring FR, whose replacement timing has arrived. In this embodiment, the substrate processing system 1 replaces the consumable part when a replacement reservation is made by an operator. However, the substrate processing system 1 may be configured to automatically start the replacement process when the replacement timing arrives. In this case, the replacement reservation process is omitted.

[0114] (Timing when exchange reservation processing can be performed) In this embodiment, the replacement reservation process is possible when the installation of the FR FOUP on the load port LP is complete. If the FR FOUP is not installed on the load port LP, the substrate processing system 1 cannot execute the replacement reservation process. Alternatively, if the operator attempts to execute the replacement reservation process, the substrate processing system 1 displays an error message.

[0115] FIG. 8A is a flowchart showing an example of the flow of replacement reservation processing in the substrate processing system 1 according to an embodiment. First, the operator inputs an instruction to the substrate processing system 1 requesting the display of a replacement reservation screen (step S1301). The substrate processing system 1 displays the replacement reservation screen in response to the input instruction (step S1302). If an FR FOUP is not installed, the substrate processing system 1 displays an error message and terminates the processing. The replacement reservation screen, for example, displays a list of consumables due for replacement, a list of process modules PM in which the consumables are located, and a button for inputting replacement reservations, in association with each other. When the replacement reservation screen is displayed, the operator inputs a replacement reservation on the replacement reservation screen (step S1303). For example, the operator presses a predetermined button on the screen. Upon receiving the operator's input, the substrate processing system 1 displays a warning screen regarding the replacement reservation (warning display, step S1304). The warning screen notifies the operator of the timing for executing the replacement process, etc. When the operator inputs a confirmation on the warning screen (step S1305), the substrate processing system 1 executes the replacement reservation. That is, the substrate processing system 1 stores the replacement reservation in the storage unit 31 in association with the process module PM to be replaced (step S1306). Then, the substrate processing system 1 displays the message "replacement reservation in progress" in association with the target process module PM on the display unit 34 (step S1307). This completes the replacement reservation process.

[0116] 8B is a flowchart showing an example of the flow of an exchange reservation cancellation process in the substrate processing system 1 according to an embodiment. Even after an exchange reservation has been made, the substrate processing system 1 executes a process of canceling the exchange reservation in response to an input from an operator.

[0117] First, the operator inputs a display instruction for a replacement reservation cancellation screen to the substrate processing system 1 (step S1308). In response to the operator's input, the substrate processing system 1 displays the replacement reservation cancellation screen (step S1309). The replacement reservation cancellation screen displays the load port LP for which replacement is reserved. The replacement reservation cancellation screen also displays an input button for canceling the replacement reservation in association with the load port LP. For example, the replacement reservation cancellation screen displays the process module PM for which replacement is reserved, the consumable to be replaced, and a cancel button in association with each other. The operator executes an input for canceling the replacement reservation on the replacement reservation cancellation screen (step S1310). For example, the operator presses the cancel button on the replacement reservation cancellation screen. In response to the operator's input, the substrate processing system 1 deletes the replacement reservation stored in association with the corresponding process module PM and consumable part from the storage unit 31 (step S1311). Then, the substrate processing system 1 deletes the displayed message "Replacement reserved" (step S1312). This completes the replacement reservation cancellation process.

[0118] (An example of the exchange process flow) Next, an example of the flow of the replacement process of the consumable parts (FIG. 4, steps S30 to S33) will be described. FIG 9 is a flowchart showing an example of the flow of the replacement process in the substrate processing system 1 of one embodiment.

[0119] When the replacement reservation is stored in the storage unit 31, the substrate processing system 1 first detects the state of the target process module PM. While the target process module PM is executing a process, the substrate processing system 1 puts the execution of the replacement process on hold. When the target process module PM finishes its process and transitions to an idle state (step S1501), the substrate processing system 1 changes the mode of the target process module PM to non-production mode (step S1502). Then, the substrate processing system 1 stores the change in mode of the target process module PM in the storage unit 31 (step S1503). The substrate processing system 1 changes the display on the display unit 34 from "reserved for replacement" to "replaced" (step S1504). The substrate processing system 1 executes a process to secure a replacement path (step S1505). The process to secure a replacement path will be described in detail later with reference to FIG. 10. Then, the substrate processing system 1 executes the replacement (step S1506). When performing the replacement in step S1506, the substrate processing system 1 transfers the used focus ring FR from the process module PM and the unused focus ring FR from the FR FOUP in parallel. When the replacement is completed, the substrate processing system 1 changes the mode of the target process module PM to the production mode (step S1507). Then, the substrate processing system 1 stores the change in mode of the target process module PM in the storage unit 31 (step S1508). The substrate processing system 1 erases the "Replacing" message displayed on the display unit 34 (step S1509). This completes the replacement process.

[0120] (Processing to secure an exchange route) Before starting replacement of the focus ring FR, the substrate processing system 1 secures replacement paths within the vacuum transfer chamber 10, the load lock module LLM, and the atmospheric pressure transfer chamber 20 (step S1505 in FIG. 9). FIG. 10 is a flowchart showing the flow of replacement path securing processing in the substrate processing system 1 according to one embodiment.

[0121] First, the substrate processing system 1 determines whether a wafer W is present on the transfer path (step S1101). The transfer path refers to the inside of the vacuum transfer chamber 10, the load lock module LLM, and the atmospheric pressure transfer chamber 20. If the substrate processing system 1 determines that a wafer W or a focus ring FR is not present on the transfer path (step S1101, No), it determines whether a wafer W is being processed in a process module PM (step S1102). If it determines that a wafer W is being processed in the process module PM (step S1102, Yes), the substrate processing system 1 interrupts the process to wait for the start of the next step when the process in the process module PM is completed (step S1103). For example, after the process is completed, the substrate processing system 1 keeps the processed wafer W waiting in the process module PM until the replacement process is completed. Then, the substrate processing system 1 replaces the focus ring FR (step S1104). On the other hand, if it is determined that there is no wafer W being processed (No in step S1102), the substrate processing system 1 replaces the focus ring FR (step S1104).

[0122] On the other hand, if it is determined that the wafer W is on the transfer path (step S1101, Yes), the substrate processing system 1 determines whether the wafer W is an unprocessed wafer (step S1105). If it is determined that the wafer W is an unprocessed wafer (step S1105, Yes), the substrate processing system 1 transfers the wafer W to a process module PM that will perform processing (step S1106).

[0123] Returning to step S1105, if it is determined that the wafer is a processed wafer (step S1105, No), the substrate processing system 1 determines whether all processing for the wafer W has been completed (step S1107). If it is determined that all processing has been completed (step S1107, Yes), the substrate processing system 1 returns the wafer W to the wafer FOUP that housed the wafer W (step S1108). On the other hand, if it is determined that all processing has not been completed (step S1107, No), the substrate processing system 1 transports the wafer W to the process module PM that will be processed next (step S1109). Then, processing may be performed. After steps S1106, S1108, and S1109, the process proceeds to step S1104, and the substrate processing system 1 performs replacement.

[0124] In the example of FIG. 10 , once the unprocessed wafer W is unloaded from the FOUP, it is transferred to the destination process module PM without being returned to the wafer FOUP (see step S1106). However, if returning the unprocessed wafer W to the wafer FOUP improves processing efficiency, the unprocessed wafer W may be returned to the wafer FOUP. After the unprocessed wafer W is loaded into the process module PM and the gate valve GV is closed, processing of the wafer W may be performed in the process module PM while the focus ring FR is being replaced. If processing of the wafer W is already being performed in the process module PM when the replacement path is secured, that processing may be continued even during focus ring FR replacement. In other words, loading and unloading of the focus ring FR in and out of the vacuum processing chamber (process module PM) into and out of which the focus ring FR is loaded and unloaded and vacuum processing of the wafer W in a vacuum processing chamber other than the target may be performed in parallel.

[0125] 10 , the process may wait until the temperature of the susceptor 114 (lower electrode) reaches a predetermined temperature. Because the interior of the process module PM becomes hot during plasma processing of the wafer W, even if a transfer path is secured, the focus ring FR in the process module PM may be at a high temperature. If the focus ring FR is at a high temperature, thermal expansion may cause the focus ring FR to come into contact with the electrostatic chuck 120 when the focus ring FR is lifted from the susceptor 114. Furthermore, if the focus ring FR is at a high temperature, it may become slippery when the VTM arm 15 and the LM arm 25 hold and transfer the focus ring FR. Therefore, before step S1104 in FIG. 10 , the process may wait until the temperature of the process module PM reaches the predetermined temperature (room temperature, for example, a temperature within a range of 20°C ± 15°C).

[0126] (Exchange execution process) FIG. 11 is a diagram illustrating replacement in a substrate processing system 1 according to an embodiment. Once a path for replacement of the focus ring FR has been secured, the substrate processing system 1 then performs the replacement (step S1506 in FIG. 9). In this embodiment, during replacement, the substrate processing system 1 transports a used focus ring FR and an unused focus ring FR in parallel. In the example of FIG. 11, the used focus ring FR disposed in the process module PM1 is replaced with an unused focus ring FR in a FOUP for FR disposed on the load port LP4.

[0127] In this case, the substrate processing system 1 first executes steps S1501 to S1505 in FIG. 9 to secure a replacement path. After confirming that the replacement path has been secured, the substrate processing system 1 operates the VTM arm 15 to hold the focus ring FR in the process module PM. The substrate processing system 1 also operates the LM arm 25 to hold the focus ring FR in the FR FOUP. The substrate processing system 1 then transfers the used focus ring FR by the VTM arm 15 (FIG. 11, (1)) and the unused focus ring FR by the LM arm 25 (FIG. 11, (2)) in parallel. The used focus ring FR is transferred to the load lock module LLM2 (FIG. 11, (3)). The substrate processing system 1 opens the load lock module LLM2 to which the used focus ring FR has been transferred to the atmosphere. The unused focus ring FR is transferred to the load lock module LLM1 (FIG. 11, (4)). The substrate processing system 1 evacuates the load lock module LLM1 to which the unused focus ring FR has been transferred. The substrate processing system 1 then causes the VTM arm 15 to hold the unused focus ring FR placed in the load lock module LLM1. Meanwhile, the substrate processing system 1 causes the LM arm 25 to hold the used focus ring FR placed in the load lock module LLM2. The substrate processing system 1 then transfers the used focus ring FR by the LM arm 25 (FIG. 11, (5)) and the unused focus ring FR by the VTM arm 15 (FIG. 11, (6)) in parallel. In this way, the unused focus ring FR is transferred into the process module PM1. The used focus ring FR is also transferred into the FR FOUP. Note that normal product wafer W transfer is not performed during the replacement.

[0128] FIG. 12 is a diagram for explaining the effect of reducing downtime when the focus ring FR is replaced in the substrate processing system 1 according to an embodiment.

[0129] FIG. 12 shows an example of the time required to transport a used focus ring FR and an unused focus ring FR. It takes approximately 25 seconds for the LM arm 25 to grasp the focus ring FR housed in the FR FOUP. It then takes approximately 25 seconds for the LM arm to place the focus ring FR in the load lock module LLM. It takes approximately 10 seconds to close the gate valve of the load lock module LLM and perform vacuum pumping. It then takes approximately 25 seconds for the VTM arm 15 to grasp the focus ring FR from the load lock module LLM. It also takes approximately 25 seconds for the VTM arm 15 to place the focus ring FR held by the VTM arm 15 in the process module PM. It then takes approximately 10 seconds to lower the second lifter pins 182 supporting the focus ring FR in the process module PM to place the focus ring FR in its home position and close the gate valve GV. It also takes approximately 20 seconds for a standby time to allow the load lock module LLM to operate continuously. Therefore, it takes about 140 seconds to transport the focus ring FR from the FOUP to the process module PM.

[0130] On the other hand, the time required to transport a used focus ring FR from the process module PM to a FOUP is as follows: First, it takes approximately 25 seconds for the VTM arm 15 to grasp the focus ring FR in the process module PM. Then, it takes approximately 25 seconds for the VTM arm 15 to place the grasped focus ring FR in the load lock module LLM. Then, it takes approximately 10 seconds for the reduced-pressure atmosphere in the load lock module LLM with the focus ring FR placed therein to be released to the atmosphere. After the load lock module LLM is filled with the atmosphere, the gate valve on the atmospheric-pressure transfer chamber 20 side of the load lock module LLM is opened. Then, it takes approximately 25 seconds for the LM arm 25 to grasp the focus ring FR from the load lock module LLM. The LM arm 25 then transports the grasped focus ring FR to the load port LP and places it in the FOUP. This process takes approximately 25 seconds. Additionally, a waiting time of approximately 20 seconds is required for the load lock module LLM to operate continuously. Therefore, it takes approximately 130 seconds to retrieve the used focus ring FR.

[0131] If, in the replacement process, the used focus ring FR is collected and then an unused focus ring FR is transported into the process module PM, the time required for the process would be approximately 140 seconds + approximately 130 seconds = approximately 270 seconds. In contrast, if the collection of the used focus ring FR and the transport of the unused focus ring FR are performed in parallel, as in this embodiment, the replacement process can be completed in approximately 140 seconds. Therefore, the substrate processing system 1 of this embodiment can significantly reduce downtime due to replacement of consumable parts.

[0132] Furthermore, because the vacuum state within the vacuum transfer chamber 10 is maintained during replacement, processing can continue in process modules PM other than the process module PM being replaced. For example, if the required time for each process performed within the process module PM is 140 seconds or more, the replacement of the consumable part can be performed without stopping the processing in the process module PM that is not being replaced. Furthermore, if the required time for each process performed within the process module PM is less than 140 seconds, the processed wafer W is made to wait within the process module PM. This prevents contamination and other problems caused by the simultaneous presence of the product wafer W and focus ring FR within the vacuum transfer chamber 10.

[0133] (Parameter settings for transport during exchange processing) The substrate processing system 1 according to this embodiment changes the control modes of the VTM arm 15, the LM arm 25, the first lifter pins 172, the second lifter pins 182, the support pins, etc., depending on the size and shape of the wafer W and the focus ring FR during transfer. For example, the substrate processing system 1 changes the following parameters: (1) Drive speed of VTM arm 15 and LM arm 25 (2) Driving speed of the second lifter pin 182 in the process module PM

[0134] (1) Drive speed of VTM arm 15 and LM arm 25 During normal processing of product wafers W, the VTM arm 15 and the LM arm 25 of the substrate processing system 1 are adjusted to suit the transport of wafers W. In contrast, during replacement, the VTM arm 15 and the LM arm 25 are adjusted to suit the transport of focus ring FR. Therefore, before starting replacement, the substrate processing system 1 switches the drive speeds of the VTM arm 15 and the LM arm 25.

[0135] For example, when the replacement starts (at the start of step S1506 in FIG. 9 ), the substrate processing system 1 switches the drive speed of the VTM arm 15 and the LM arm 25 to a speed different from the drive speed used during normal processing of a product wafer W. For example, the substrate processing system 1 switches the drive speed of the VTM arm 15 and the LM arm to a speed slower than the drive speed used during wafer W transport. This is because the focus ring FR has a small ring-shaped support area and is therefore more likely to be misaligned on the VTM arm 15 and the LM arm 25 than the wafer W. For example, the drive speeds of the VTM arm 15 and the LM arm 25 are set in advance in the storage unit 31 of the substrate processing system 1. The substrate processing system 1 is configured to switch the drive speed between replacement processing and normal product wafer W transport. Alternatively, the drive speed may be manually set by an operator.

[0136] (2) Drive speed of the second lifter pin in the process module PM Furthermore, the substrate processing system 1 sets the drive speed of the second lifter pins 182 in the process module PM to suit the focus ring FR. For example, the substrate processing system 1 learns and stores the drive speed of the second lifter pins 182 in advance by machine learning. FIG. 13A is a diagram for explaining the operation of the second lifter pins 182 when the focus ring FR is loaded in the substrate processing system 1 of one embodiment. FIG. 13B is a diagram for explaining the operation of the second lifter pins 182 when the focus ring FR is unloaded in the substrate processing system 1 of one embodiment.

[0137] Before performing each process, the substrate processing system 1 performs machine learning of the first and second lifter pins 172, 182 and the support pins. Then, the substrate processing system 1 sets and stores in the memory unit 31, for example, the maximum speed and minimum speed of the second lifter pins 182 in the process module PM and a pin-up delay when receiving the focus ring FR.

[0138] The operation of the second lifter pins 182 when the focus ring FR is loaded will be described. The second lifter pins 182 are stored inside the susceptor 114 and move up and down when the focus ring FR is loaded and unloaded. Here, the position of the upper surface of the susceptor 114 is referred to as a first height H1, and the position at which the focus ring FR is transported by the VTM arm 15 is referred to as a second height H2.

[0139] In addition, within the distance from the first height H1 to the second height H2, the vicinity of the susceptor 114 is referred to as range R1, and the vicinity of the transfer position is referred to as range R2 (see FIG. 13A ). Here, “vicinity” refers to a predetermined vertical distance, for example, within a range of 0.5 mm. Here, the predetermined distance is a distance for adjusting impact when the focus ring FR comes into contact with the second lifter pins 182 or the focus ring FR comes into contact with the VTM arm 15. For example, in the example of FIG. 13A , range R1 refers to a range within a predetermined vertical distance above the upper surface of the susceptor 114. However, range R1 may also refer to a range within a predetermined vertical distance above and below the upper surface of the susceptor 114. Also, in the example of FIG. 13A , range R2 refers to a range within a predetermined vertical distance below the transfer height H2 of the focus ring FR. However, range R2 may also refer to a range within a predetermined vertical distance above and below the second height H2. The range between the first height H1 and the second height H2, other than the ranges R1 and R2, is referred to as a range R3.

[0140] When not performing loading / unloading, the second lifter pins 182 are housed in the susceptor 114, with their tops positioned at the first height H1 or below H1. When loading / unloading the focus ring FR, the second lifter pins 182 are driven by the second drive mechanism 180 to protrude from the susceptor 114 and rise to a third height H3 below the second height H2 (see FIG. 13A). Next, the VTM arm 15 places the focus ring FR on a pick (17a or 17b), holds it at the second height H2, and loads it into the process module PM. When the focus ring FR placed on the VTM arm 15 reaches the susceptor 114, the second lifter pins 182 rise to the second height H2. At this time, the second lifter pins 182 wait for a predetermined time until the VTM arm 15 stops operating and the focus ring FR stops swinging, and then begin to rise. This waiting time is called the pin-up delay. Then, the second lifter pins 182 receive the focus ring FR at the second height H2. After receiving the focus ring FR, the second lifter pins 182 descend, and the focus ring FR is placed on the susceptor 114.

[0141] When the focus ring FR is loaded, the substrate processing system 1 switches the drive speed of the second lifter pins 182 to a lower speed in range R2 than in ranges R1 and R3 during ascent, and switches to a lower speed in range R1 than in ranges R2 and R3 during descent. This is to suppress the impact when the second lifter pins 182 come into contact with the focus ring FR and prevent damage to the focus ring FR. In the example of FIG. 13A, range R1 is set above the upper surface of the susceptor 114, but range R1 may be set both above and below the upper surface of the susceptor 114. Range R2 may also be set both above and below the second height H2.

[0142] Next, with reference to FIG. 13B, the operation of second lifter pins 182 when unloading focus ring FR will be described. In FIG. 13B, a predetermined distance vertically downward from the upper surface (H1) of susceptor 114 is defined as range R4, and a predetermined distance vertically upward from second height H2 is defined as range R6. In addition, the portion of the range between second height H2 and fourth height H4 that is not included in range R6 is called range R5. The value of the predetermined distance and the setting of the range are the same as in the example of FIG. 13A above.

[0143] When the focus ring FR is being removed, the second lifter pins 182 first rise to the first height H1. Then, when the tops of the second lifter pins 182 contact the focus ring FR, the second lifter pins 182 rise to the fourth height H4 while supporting the focus ring FR. The fourth height H4 is vertically higher than the second height H2 at which the focus ring FR is transported. With the second lifter pins 182 holding the focus ring FR at the fourth height H4, the pick (17a or 17b) of the VTM arm 15 enters the process module PM and stops below the focus ring FR. At this time, the height of the pick of the VTM arm 15 is the second height H2. As with the loading operation, after waiting a predetermined time until the VTM arm 15 stops shaking, the second lifter pins 182 descend and the VTM arm 15 receives the focus ring FR supported on the second lifter pins 182. VTM arm 15, while holding focus ring FR, moves from inside process module PM to vacuum transfer chamber 10 and unloads focus ring FR.

[0144] When the focus ring FR is unloaded, the substrate processing system 1 switches the drive speed of the second lifter pins 182 to a speed slower than the ranges R5 and R6 in range R4 during ascent, and switches the drive speed to a speed slower than the ranges R4 and R5 in range R6 during descent. For example, the substrate processing system 1 sets the drive speed of the second lifter pins to a first speed in range R4 during ascent, and to a second speed faster than the first speed in ranges R5 and R6 and in ranges other than ranges R4, R5, and R6. Furthermore, when the focus ring FR is descent, the substrate processing system 1 sets the drive speed of the second lifter pins to the first speed in range R6, and to the second speed faster than the first speed in ranges R4, R5, and in ranges other than ranges R4, R5, and R6.

[0145] That is, the substrate processing system 1 switches the drive speed of the second lifter pins 182 to a low first speed from just before the second lifter pins 182 come into contact with the focus ring FR until they come into contact. Also, the substrate processing system 1 switches the drive speed to the low first speed from just before the focus ring FR supported by the second lifter pins 182 comes into contact with the susceptor 114 and the VTM arm 15 until the placement is completed. Within the range where the focus ring FR does not come into contact with other components, the substrate processing system 1 drives the second lifter pins 182 at a high second speed.

[0146] For this reason, the substrate processing system 1 sets and stores in advance by machine learning the first speed, second speed, and waiting time (pin-up delay) of the second lifter pins 182. For example, the substrate processing system 1 sets the first speed and second speed within the range of 1 to 15 mm / sec. Also, for example, the substrate processing system 1 sets the waiting time of the second lifter pins 182 within the range of 0.0 to 60.0 seconds.

[0147] In the substrate processing system 1, the drive speed of the support pins in the load lock module LLM can be set in the same manner as the second lifter pins 182. For example, the drive speed of the support pins can be set within the range of 1 to 1700 mm / sec.

[0148] (Fixing the transport route) In this embodiment, as described above, the transport of a used focus ring FR and an unused focus ring FR are performed in parallel. To this end, the substrate processing system 1 includes at least two load lock modules LLM. The substrate processing system 1 uses one load lock module (e.g., LLM1) to transport the used focus ring FR and the other load lock module (e.g., LLM2) to transport the unused focus ring FR.

[0149] To further improve the transfer accuracy, the picks of the VTM arm 15 and the LM arm 25 may be specified as the transfer path for the unused focus ring FR. Transfer accuracy refers to the accuracy and stability of the position of the focus ring FR during transfer. Higher transfer accuracy reduces the positional deviation between the designed transfer path and the actually transferred focus ring FR. Low transfer accuracy increases the positional deviation between the designed transfer path and the actually transferred focus ring FR. Higher transfer accuracy reduces the positional variation of the focus ring FR during each transfer. Low transfer accuracy increases the positional variation of the focus ring FR during each transfer. For example, the substrate processing system 1 specifies the first pick 17a of the VTM arm 15 and the first pick 27a of the LM arm 25 as the transfer path for the unused focus ring FR. The substrate processing system 1 also specifies the load-lock module LLM1 as the transfer path for the unused focus ring FR.

[0150] Furthermore, the substrate processing system 1 specifies the second pick 17b of the VTM arm 15 and the second pick 27b of the in-use LM arm 25 as the transport path for the used focus ring FR. The substrate processing system 1 also specifies the load lock module LLM2 as the transport path for the used focus ring FR. The substrate processing system 1 stores the specified transport path in the storage unit 31.

[0151] For example, information specifying the first pick 17a of the VTM arm 15, the first pick 27a of the LM arm 25, and the load lock module LLM1 is stored in the storage unit 31 as a default value for the transport path of an unused focus ring FR. Also, information specifying the second pick 17b of the VTM arm 15, the second pick 27b of the LM arm, and the load lock module LLM2 is stored in the storage unit 31 as a default value for the transport path of a used focus ring FR. Then, during the replacement process, the substrate processing system 1 determines the transport path based on the information stored in the storage unit 31.

[0152] By specifying the transport path in this manner, the substrate processing system 1 can use a different path for each transport, thereby preventing minute deviations in the transport accuracy of the focus ring FR. For example, even if a positional deviation occurs between the first pick 17a and the second pick 17b of the VTM arm 15, a decrease in transport accuracy can be prevented by transporting an unused focus ring FR along the same path. Note that, since there is little need to precisely control the transport accuracy for a used focus ring FR, the pick to be used for transport is specified preferentially for the unused focus ring FR. However, a transport path may also be specified for a used focus ring FR.

[0153] (Switching processing modes) 9, the substrate processing system 1 switches the target process module PM to the non-production mode, performs the replacement process, and switches back to the production mode after the replacement process is completed. However, the present invention is not limited to this, and the substrate processing system 1 may be configured to switch back to the production mode in response to an operator's input instead of automatically switching back to the production mode after the replacement process.

[0154] For example, the operation mode after the replacement process is completed is set to "non-production mode" by default and stored in the storage unit 31, so that the setting is not automatically changed. By setting it in this manner, when maintenance work, such as seasoning work, needs to be performed on the process module PM after the focus ring FR is replaced, it is possible to prevent a wafer W from being automatically loaded into the process module PM before the maintenance work.

[0155] (Cancellation of exchange process) After the substrate processing system 1 starts the replacement process, the replacement process may become unable to continue due to, for example, the focus ring FR falling from the VTM arm 15 or the LM arm 25. Therefore, the substrate processing system 1 according to this embodiment may be configured to detect such a state and stop the replacement process.

[0156] After the replacement process starts, if the first sensor S1 or the second sensor S2 of the substrate processing system 1 cannot detect the focus ring FR, it notifies the processing unit 32 of that fact. Upon receiving the notification, the processing unit 32 stops the operation of the drive system (VTM arm 15, LM arm 25, etc.). The processing unit 32 notifies the operator of the operation stop. For example, the processing unit 32 displays the operation stop notification on the display unit 34.

[0157] Upon receiving the notification of the operation stop, the operator switches the process module PM, the vacuum transfer chamber 10, the load lock module LLM, and the atmospheric pressure transfer chamber 20 to maintenance mode. The operator then inputs an instruction via the display unit 34 to stop the replacement process of the substrate processing system 1. At this time, the substrate processing system 1 maintains the operation mode of the target process module PM in non-production mode (i.e., a processing mode in which product wafers W cannot be processed). Furthermore, the focus ring FR being replaced is not automatically moved but remains in the state it was in at the time of the suspension. This is because the current state of the focus ring FR is unknown, and the operator can visually check it before recovery. After checking the situation, the operator opens the chamber of the process module PM and performs an operation such as installing the focus ring FR. After recovery is complete, the operator switches each processing unit from maintenance mode to normal processing mode.

[0158] The replacement process may be stopped not only when an abnormality is detected by the substrate processing system 1, but also at the operator's discretion. For example, a screen for receiving an instruction to stop the replacement process may be displayed on the display unit 34. The substrate processing system 1 is configured to stop the VTM arm 15 and the LM arm 25 in response to the operator's instruction. After the VTM arm 15 and the LM arm 25 have stopped operating, the operator performs the same process as when the operator receives the notification of the above-mentioned operation stop.

[0159] Furthermore, even if an operator switches the substrate processing system 1 to maintenance mode and removes the FR FOUP or takes out the focus ring FR from the FR FOUP during a replacement reservation or replacement process, recovery can be achieved using the same procedure as described above. Note that, as a default setting, the substrate processing system 1 is configured so that removal of the FR FOUP cannot be performed during replacement process.

[0160] (Lifter pin maintenance) The lifter pins (second lifter pins 182, support pins) for raising and lowering the focus ring FR, which are provided in various parts of the substrate processing system 1, do not normally operate until replacement processing is performed. Therefore, there is a possibility that the second lifter pins 182 and support pins may become stuck to surrounding structures due to grease or the like. Therefore, the substrate processing system 1 of this embodiment may be configured to perform periodic automatic maintenance.

[0161] For example, a counter for determining the timing of maintenance may be provided in the same manner as a counter for notifying replacement timing. For example, the timing of performing maintenance on the second lifter pins 182 may be set in association with each process module PM. The number of times wafers W have been processed may be used as a parameter for the timing of performing maintenance on the second lifter pins 182. For example, maintenance on the second lifter pins 182 may be performed when 1000 wafers W have been processed.

[0162] The timing of maintenance may be set arbitrarily, or may be selected by the operator from preset parameters. For example, the execution timing may be determined by selecting either the number of processes (number of processed wafers) or the RF discharge time. The timing of maintenance of the support pins of the load lock module LLM can also be set in a similar manner.

[0163] The timing for performing maintenance is, for example, when the processing of the most recent lot is completed after a preset parameter threshold is reached (for example, after 1000 processing operations have been performed). In the case of maintenance of the second lifter pins 182 or the support pins, the substrate processing system 1 raises and lowers the second lifter pins 182 or the support pins. Note that if the timing of this maintenance operation overlaps with the timing of another processing operation, the other operation is given priority, and this maintenance operation is performed after the other operation is completed.

[0164] (Communication with the host) In the above embodiment, some of the processes described as being performed independently by the substrate processing system 1 may be configured to be performed by other devices. For example, the control device 30 of the substrate processing system 1 may be configured as a device separate and independent from the other parts. Furthermore, the substrate processing system 1 may be configured to be remotely controlled from other devices.

[0165] For example, a host (server) may be provided separately from the substrate processing system 1. The plasma processing in each process module PM may be controlled by the host. In this case, a replacement process on the substrate processing system 1 side interrupts the host's control of the process module PM. Therefore, the substrate processing system 1 is configured to notify the host each time a mode change of a process module is performed to execute a replacement process. During the production mode, the host manages control of the process module PM, and during the non-production mode, the host controls the process module PM to stop processing. In this case, the substrate processing system 1 is configured to notify the host of the mode change in steps S1503 and S1507 of FIG. 9.

[0166] (Example of pick shape provided in the transport mechanism) In the above embodiment, the first pick 17a and second pick 17b provided on the VTM arm 15 and the first pick 27a and second pick 27b provided on the LM arm 25 may be configured as follows. Hereinafter, the first pick 17a and second pick 17b provided on the VTM arm 15 and the first pick 27a and second pick 27b provided on the LM arm 25 will also be collectively referred to as picks 50. Pick 50 is an example of a holder that is provided at the tip of an arm provided in a transfer mechanism that transfers wafers W and consumable parts, and that holds the wafers W and consumable parts.

[0167] In the above embodiment, the VTM arm 15 and the LM arm 25 are configured to be able to transport both the wafer W and the consumable part. The following describes the configuration of the pick 50 when transporting a focus ring FR as a consumable part as an example.

[0168] FIG. 14A is a schematic top view showing an example of the configuration of a pick 50 included in the substrate processing system 1 of one embodiment. FIG. 14B is a schematic front view of the pick 50 shown in FIG. 14A. The pick 50 has a base 51 and a first branch 52 and a second branch 53 extending in different directions from two ends of the base 51. The base 51, the first branch 52, and the second branch 53 are formed so that when a triangle is drawn with its center at the center of the wafer W and tangent to the outer diameter of the wafer W, the three vertices of the triangle are located on the base 51, the first branch 52, and the second branch 53, respectively. The shape of the pick 50 is not limited to the bifurcated shape shown in FIG. 14A. The pick 50 may have three or more branches. However, the shape of the pick 50 is such that, when the focus ring FR is placed on the pick 50, a gap is formed between the inner diameter of the focus ring FR and the pick 50 in a top view.

[0169] Pick 50 has a first surface 55 on the side that holds wafer W and focus ring FR. A plurality of first holding portions 60a-60f for holding wafer W are formed on first surface 55. Hereinafter, when it is not necessary to distinguish between the plurality of first holding portions 60a-60f, they will be collectively referred to as first holding portion 60. At least one first holding portion 60 is formed on each of base portion 51, first branch portion 52, and second branch portion 53. While FIG. 14A shows six first holding portions 60, the number of first holding portions 60 is not limited to six and may be less than or greater than six. Furthermore, the plurality of first holding portions 60 are arranged on a first circle C1 whose diameter is smaller than the inner diameter of focus ring FR.

[0170] The plurality of first holding portions 60 have upper surfaces at a height h1 from the first surface 55. The shape of the upper surfaces of the plurality of first holding portions 60 is not particularly limited. The upper surfaces of the plurality of first holding portions 60 may be approximately parallel to the first surface 55, or may be hemispherical with a chamfered outer periphery.

[0171] A plurality of second holders 70a-70d for holding the focus ring FR are further formed on the first surface 55. Hereinafter, when it is not necessary to distinguish between the plurality of second holders 70a-70d, they will be collectively referred to as the second holder 70. Like the first holder 60, at least one second holder 70 is formed on each of the base 51, the first branch 52, and the second branch 53. While FIG. 14A shows four second holders 70, the number of second holders is not limited to four and may be less than or greater than four. One end of each second holder 70 is located on a second circle C2 that is larger in diameter than the outer diameter of the focus ring FR and is substantially concentric with the first circle C1. The other end of each second holder 70 is located on a third circle C3 that is larger in diameter than the inner diameter of the focus ring FR but smaller in diameter than the outer diameter. However, the other end of each second holder 70 may also be located on a fourth circle C4 that is smaller in diameter than the inner diameter of the focus ring FR.

[0172] The other end of the second holding portion 70 is positioned closer to the center of the first circle C1 to the fourth circle C4 than the one end of the second holding portion 70. The one end of the second holding portion 70 has an upper surface at a height h2 from the first surface 55. The other end of the second holding portion 70 has an upper surface at a height h3 from the first surface 55. The heights h1, h2, and h3 have at least the relationship h1>h2>h3. As shown in FIG. 14B, the upper surface of the second holding portion 70 is an inclined surface that gradually becomes lower from one end to the other end, i.e., from the circumferential side of the first circle C1 to the fourth circle C4 toward the center. The upper surface of the second holding portion 70 is lower than the upper surface of the first holding portion 60 at any position.

[0173] 15A is a schematic top view showing a state in which a wafer W is held on the pick 50 shown in FIG. 14A. FIG. 15B is a schematic front view of the pick 50 and wafer W shown in FIG. 15A, viewed from the horizontal direction. As shown in FIG. 15A, the pick 50 supports the wafer W using a plurality of first holders 60, and holds the wafer W in a state in which the first surface 55 does not contact the wafer W. Also, as shown in FIG. 15B, when the wafer W is held on the pick 50, the upper surface of the second holder 70, which is lower than the upper surface of the first holder 60, does not contact the wafer W.

[0174] FIG. 16A is a schematic top view showing the focus ring FR held on the pick 50 shown in FIG. 14A. FIG. 16B is a schematic front view showing the pick 50 and focus ring FR shown in FIG. 16A, viewed horizontally. As shown in FIG. 16A, the pick 50 supports the focus ring FR using multiple second holding portions 70, holding the focus ring FR without contact between the first surface 55 and the focus ring FR. Also, as shown in FIG. 16B, the outer periphery of the focus ring FR abuts and is supported by the second holding portions 70 at intermediate portions of the inclined surfaces of the second holding portions 70. Because the focus ring FR is ring-shaped, when the focus ring FR is held on the pick 50, the first holding portions 60 are located in the hollow portion at the center of the focus ring FR. Therefore, when the focus ring FR is held on the pick 50, the focus ring FR and the first holding portions 60 do not come into contact with each other.

[0175] In this way, by providing a first holding part 60 for holding the wafer W and a second holding part 70 for holding the focus ring FR on the pick 50, one pick 50 can be used to transport both the wafer W and the focus ring FR.

[0176] Furthermore, by making the upper surface of the first holding unit 60 higher than that of the second holding unit 70, contamination or damage to the wafer W due to contact with various parts of the pick 50 during wafer transfer can be prevented. Furthermore, by making the upper surface of the second holding unit 70 an inclined surface that becomes lower from the outside to the inside, the contact surface between the focus ring FR and the pick 50 can be reduced. This prevents the focus ring FR from sticking to the pick 50 during transfer. Preventing sticking also prevents the focus ring FR from shifting position during transfer or from bouncing up when placed.

[0177] The moving speed of the pick 50 is set to be slower when transferring the focus ring FR than when transferring the wafer W.

[0178] Furthermore, there are no particular limitations on the materials used for the first retaining portion 60 and the second retaining portion 70. The first retaining portion 60 and the second retaining portion 70 can be made of any material, such as rubber or ceramic. However, as described above, the second retaining portion 70 is preferably made of a material with a low coefficient of friction with the focus ring FR in order to prevent sticking.

[0179] Note that the specific shape of the second holding portion 70 is not limited to those shown in Figures 14A to 16B, as long as at least a portion of the second holding portion 70 is disposed between the inner diameter and the outer diameter of the focus ring FR. For example, if the bottom surface of the focus ring FR is not flat, the positions of one end and the other end of the second holding portion 70 may be adjusted to match the shape of the focus ring FR.

[0180] The second holding portion 70 may be formed integrally with the base portion 51, the first branch portion 52, and the second branch portion 53 of the pick 50. The second holding portion 70 may also be formed from the same material as the base portion 51, the first branch portion 52, and the second branch portion 53 of the pick 50. In addition to the above-mentioned ceramics, titanium, silicon carbide, etc. may also be used.

[0181] 16A and 16B does not have a notch on the top surface of the inner diameter side, unlike Fig. 3. However, the shape of the focus ring FR transported by the pick 50 is not particularly limited, and the focus ring FR having the shape shown in Fig. 3 can also be transported by the pick 50.

[0182] (Detection of misalignment during transport) As described above, the substrate processing system 1 according to the embodiment includes first sensors S1-S16 for detecting misalignment of the wafer W and focus ring FR transferred to the process module PM. The first sensors are arranged in pairs on the transfer path near the gate valve of each process module PM. Third sensors S20-S27 in the atmospheric pressure transfer chamber 20 also detect misalignment in a similar manner. Next, a misalignment detection method that can be commonly applied to the first sensors S1-S16 and the third sensors S20-S27 will be described. In the following description, the third sensors S20 and S21 installed in front of the load lock module LLM1 and the third sensors S24 and S25 installed in front of the load port LP2 will be described as examples.

[0183] 17 is a diagram for explaining the arrangement position of the third sensor in the substrate processing system of one embodiment. Fig. 17 is a cross-sectional view of the atmospheric pressure transfer chamber 20 of the substrate processing system 1 shown in Fig. 1, viewed from the right side to the left side of the page.

[0184] In FIG. 17, on the left is a platform 201 provided on the load port LP2 on which a FOUP is placed. On the right side of the platform 201 is a door 202 for connecting the atmospheric pressure transfer chamber 20 to the inside of the FOUP. When the door 202 moves downward to move the FOUP lid, the inside of the FOUP is connected to the inside of the atmospheric pressure transfer chamber 20. On the side of the atmospheric pressure transfer chamber 20 facing the load port LP2 is a gate valve GV connected to the load lock module LLM1 (see FIGS. 18A to 18C). The gate valve GV is disposed between the load lock module LLM and the atmospheric pressure transfer chamber 20. The gate valve GV includes a plate 220, a movable lid 230, and a movement mechanism 240.

[0185] Fig. 18A is a schematic perspective view of a plate 220 included in a gate valve GV of an embodiment, Fig. 18B is a schematic perspective view enlarging a portion of the gate valve GV of an embodiment, and Fig. 18C is a schematic perspective view showing a state in which an opening 221 of the gate valve GV of an embodiment is blocked.

[0186] The plate 220 is a plate-like member fixed in front of the load lock module LLM1. When placed in front of the load lock module LLM1, the plate 220 shown in Fig. 18A has a generally rectangular shape with an upper side, a right side, a lower side, and a left side when viewed from the atmospheric pressure transfer chamber 20 side. However, the shape of the plate 220 is not particularly limited. The plate 220 is formed with an opening 221, a pair of upper and lower first protrusions 222, and a pair of upper and lower second protrusions 223.

[0187] The opening 221 defines a space through which the wafer W and focus ring FR pass when being transferred between the load lock module LLM1 and the atmospheric pressure transfer chamber 20. In the example of FIG. 18A , the opening 221 is formed above the center of the plate 220. The opening 221 has a generally rectangular shape whose width is greater than the outer diameter of the focus ring FR. The size and shape of the opening 221 are not particularly limited as long as the wafer W and focus ring FR can be placed on the pick 50 and transferred in and out in the horizontal direction.

[0188] The first protrusion 222 protrudes from the plate 220 toward the atmospheric pressure transfer chamber 20. The first protrusion 222 has an upper protrusion 222a and a lower protrusion 222b. The upper protrusion 222a is a plate-like member that protrudes horizontally along the upper edge of the plate 220. The light-emitting unit 20p of the third sensor S20 is disposed on the upper protrusion 222a. The lower protrusion 222b is a plate-like member that protrudes horizontally along the lower edge of the plate 220. The light-receiving unit 20r of the third sensor S20 is disposed on the lower protrusion 222b. It is also possible to dispose the light-emitting unit 20p on the lower protrusion 222b and the light-receiving unit 20r on the upper protrusion 222a.

[0189] Light-projecting portion 20p of upper protrusion 222a emits light vertically downward. Light-receiving portion 20r of lower protrusion 222b is disposed on optical path OP1 of light emitted from light-projecting portion 20p. In the example of FIG. 18A, a line connecting light-projecting portion 20p and light-receiving portion 20r extends vertically and passes in front of the space defined by opening 221.

[0190] The shape of the second protrusion 223 is the same as that of the first protrusion 222. The second protrusion 223 protrudes from the plate 220 toward the atmospheric pressure transfer chamber 20. The second protrusion 223 has an upper protrusion 223a and a lower protrusion 223b. The upper protrusion 223a is a plate-like member that protrudes horizontally along the upper edge of the plate 220. The light-emitting unit 21p of the third sensor S21 is disposed on the upper protrusion 223a. The lower protrusion 223b is a plate-like member that protrudes horizontally along the lower edge of the plate 220. The light-receiving unit 21r of the third sensor S21 is disposed on the lower protrusion 223b.

[0191] Light-projecting portion 21p of upper protrusion 223a emits light vertically downward. Light-receiving portion 21r of lower protrusion 223b is disposed on optical path OP2 of the emitted light. In the example of FIG. 18A, the line connecting light-projecting portion 21p and light-receiving portion 21r extends vertically and passes in front of the space defined by opening 221.

[0192] The gate valve GV includes a connection part 250 that connects each sensor to the control device 30 (see FIG. 18C). The connection part 250 is, for example, a cable for transmitting a signal detected by the light receiving part of each sensor to the control device 30.

[0193] A movable lid 230 is disposed on the atmospheric pressure transfer chamber 20 side of the plate 220 (see FIG. 18C). The movable lid 230 is connected to a moving mechanism 240 and moves up and down between the upper protrusions 222a, 223a and the lower protrusions 222b, 223b of the first protrusion 222 and the second protrusion 223 in response to power transmitted from the moving mechanism 240. When the movable lid 230 is positioned at the top of its movable range (see FIG. 18C), it covers the opening 221 and closes the gap between the load lock module LLM1 and the atmospheric pressure transfer chamber 20. When positioned at the bottom of its movable range, the movable lid 230 opens the opening 221 and connects the load lock module LLM1 and the atmospheric pressure transfer chamber 20. The thickness of the movable cover 230 is such that it does not interfere with the optical paths OP1 and OP2 between the upper protrusions 222a and 223a and the lower protrusions 222b and 223b (see FIG. 17).

[0194] Returning to FIG. 17, the third sensors S24 and S25 disposed on the load port LP2 side will be described. The third sensors S24 and S25 each include a light-projecting unit 24p and a light-receiving unit 24r and a light-receiving unit 25r. As shown in FIG. 17, the light-projecting units 24p and 25p of the third sensors S24 and S25 are provided on the ceiling side of the atmospheric pressure transfer chamber 20. The light-receiving units 24r and 25r of the third sensors S24 and S25 are provided on the floor side of the atmospheric pressure transfer chamber 20. The wafer W and focus ring FR transported by the LM arm 25 pass through the optical path of light emitted from the light-projecting units 24p and 25p and received by the light-receiving units 24r and 25r. The positions of the third sensors S24 and S25 are not particularly limited as long as the wafer W and focus ring FR can pass through the optical path.

[0195] Next, detection of misalignment using a third sensor will be described. FIG. 19A is a diagram illustrating the positional relationship between a consumable part and a sensor during transport in one embodiment. FIG. 19A shows the state in which the focus ring FR is transported to the load lock module LLM1 along the direction of arrow X. In FIG. 19A, the load port LP2 is located at the bottom of the page, and the load lock module LLM1 is located at the top of the page. When the focus ring FR is transported along the transport path, the center of the focus ring FR moves along line L3 by design. The third sensor S20 is positioned so that the optical path OP1 is located on line L2. The third sensor S21 is positioned so that the optical path OP2 is located on line L4. The third sensors S20 and S21 are positioned on a line segment perpendicular to the direction of travel of the focus ring FR. Note that lines L2 and L4 are each parallel to line L3 and are positioned equidistant from line L3.

[0196] At this time, when the focus ring FR is transported to the correct position, the detection signals detected by the third sensors S20 and S21 have the same waveform. FIG. 19B shows an example of the detection signal in the example of FIG. 19A. When the focus ring FR passes between the light-emitting portions 20p and 21p and the light-receiving portions 20r and 21r of the third sensors S20 and S21, the focus ring FR blocks the light emitted from the light-emitting portions 20p and 21p. The light-receiving portions 20r and 21r output a high detection signal when no light is received and a low detection signal when light is received. In the case of FIG. 19A, each portion of the focus ring FR passes through the third sensors S20 and S21 simultaneously. Therefore, as shown in FIG. 19B, the detection signals output from the third sensors S20 and S21 simultaneously become high and low.

[0197] On the other hand, when the focus ring FR is misaligned, the detection signals output from the third sensors S20 and S21 have different waveforms. FIG. 20A is a diagram illustrating misalignment of consumable parts during transport. In the example of FIG. 20A, the center of the focus ring FR is shifted toward the line L2 from the correct position (on the line L3). If the focus ring FR is transported in the direction of arrow X while maintaining the position shown in FIG. 20A, the outer periphery of the focus ring FR blocks the light emitted from the light-projecting unit 20p at the third sensor S20 before it blocks the light emitted from the light-projecting unit 21p at the third sensor S21 after a period P1 (see FIG. 20B). As the focus ring FR further moves in the X direction, the light is blocked again at the third sensor S21, and then the light is also blocked at the third sensor S20. Therefore, the waveform of the detection signal obtained when the focus ring FR is transported with its center shifted from the correct position will be, for example, the waveform shown in FIG. 20B. The control device 30 detects the positional deviation of the focus ring FR based on the difference in waveforms of the detection signals output from the third sensors S20 and S21, and is therefore able to correct the positional deviation of the focus ring FR.

[0198] In the above example, two sensors are arranged above and below the opening 221 of the gate valve GV arranged in front of the load lock module LLM1. However, this is not limiting, and three or more sensors may be arranged. For example, FIG. 21 is a diagram showing the positional relationship between the consumable parts and the sensors when four sensors are arranged. In the example of FIG. 21, in addition to the third sensors S20 and S21, sensors S20A and S21A are also arranged. Note that even when three or more sensors are arranged, each sensor has a light-emitting unit and a light-receiving unit arranged above and below the opening 221.

[0199] In correcting the positional deviation, either the outer diameter position or the inner diameter position of the focus ring FR detected by each sensor may be used, or both the outer diameter position and the inner diameter position may be used. However, from the viewpoint of accurately correcting the positional relationship between the wafer W and the focus ring FR, it is preferable to use the inner diameter position for the correction.

[0200] Furthermore, positional deviation can also be corrected by, for example, calculating the center position of the focus ring FR and moving the focus ring FR by the difference from the correct center position, as shown in FIG. 22. FIG. 22 is a diagram illustrating a method for calculating positional deviation of a consumable part. As shown in FIG. 22, based on the detection signal, a center line is drawn connecting the inner diameter positions of the focus ring FR on line segment L2. Furthermore, a center line is drawn connecting one of the intersections of line segment L2 and the inner diameter position with another of the intersections of line segment L4 and the inner diameter position. The intersection of the two center lines is the center of the focus ring FR. The position of the focus ring FR is corrected based on the distance between the center of the focus ring FR thus calculated and line segment L3.

[0201] When two sensors are arranged in front of opening 221, the spacing between the two sensors is wider than the width of a pick and shorter than the inner diameter of focus ring FR. When four sensors are arranged in front of opening 221, the spacing between the two outermost sensors is wider than the width of a pick and shorter than the inner diameter of focus ring FR. Because the first, second, and third sensors each correct misalignment of not only focus ring FR but also wafer W, the spacing between the two outermost sensors is shorter than the outer diameter of the wafer.

[0202] The first, second, and third sensors are used not only to detect and correct positional deviations of the wafer W and focus ring FR, but also to detect whether the pick is holding the wafer W or focus ring FR. For example, when the pick reaches the load lock module LLM, if the tip of the pick is moved left and right and the third sensor detects an object, it can be determined that the wafer W or focus ring FR is placed on the pick. Also, when the pick reaches the load port LP, the presence or absence of the wafer W or focus ring FR can be determined by a similar operation.

[0203] The third sensor placed in front of the load port LP is positioned so as not to interfere with the opening and closing of the door 202 of the load port LP. Furthermore, no structures other than the wafer W and focus ring FR are placed on the optical path connecting the light-emitting part and light-receiving part of the third sensor. The same applies to the third sensor placed in front of the load lock module LLM.

[0204] (Other variations) In this embodiment, the execution of installation of the FR FOUP and the completion of removal require input of instructions by the operator. However, the substrate processing system 1 may be configured so that input of instructions by the operator is omitted.

[0205] Furthermore, in this embodiment, the type of FOUP that can be installed on each load port LP is fixed, but it is also possible to configure all load ports LP so that both FR FOUPs and wafer FOUPs can be installed. In this case, a third sensor may be installed in front of all load ports LP. Furthermore, the types of the mapping sensor MS and the first to third sensors are not particularly limited, but a transmission type photoelectric sensor or the like can be used.

[0206] In addition, in this embodiment, the control device 30 is equipped with a display unit 34, but the screen generated by the control device 30 may be transmitted to another device via the input / output interface 33 and displayed on the other device.

[0207] <Effects of the embodiment> The substrate processing system according to the embodiment includes an atmospheric pressure transfer chamber, a vacuum processing chamber, one or more load lock modules, a vacuum transfer chamber, multiple mounting units, a first transfer mechanism, a second transfer mechanism, and a control unit. The atmospheric pressure transfer chamber transfers substrates and consumable parts in an atmospheric pressure atmosphere. The vacuum processing chamber performs vacuum processing on the substrates. The one or more load lock modules are disposed between the atmospheric pressure transfer chamber and the vacuum processing chamber, through which the transferred substrates and consumable parts pass. The vacuum transfer chamber is disposed between the vacuum processing chamber and the one or more load lock modules, through which the transferred substrates and consumable parts pass in a reduced pressure atmosphere. The multiple mounting units are provided in the atmospheric pressure transfer chamber and have ports through which the substrates or consumable parts can pass between the atmospheric pressure transfer chamber and each of multiple storage units that accommodate the substrates or consumable parts. Each of the multiple storage units can be detachably attached to the multiple mounting units. The first transfer mechanism transfers substrates and consumable parts between the one or more load lock modules and the vacuum processing chamber via the vacuum transfer chamber. The second transfer mechanism transfers substrates and consumable parts between the multiple storage units and one or more load lock modules via the atmospheric pressure transfer chamber. The controller controls the first transfer mechanism and the second transfer mechanism to transfer consumable parts from the storage unit to the vacuum processing chamber via the atmospheric pressure transfer chamber and one of the one or more load lock modules, and to transfer consumable parts from the vacuum processing chamber via the vacuum transfer chamber and another of the one or more load lock modules, in parallel. Therefore, the substrate processing system according to the embodiment can shorten the time required to replace consumable parts in the vacuum processing chamber. Therefore, according to the embodiment, the operating rate of the substrate processing system can be improved. When transferring wafers via one load lock module, the transfer process must be suspended while the load lock module is vented to the atmosphere and evacuated. The substrate processing system according to the above embodiment transfers consumable parts via two load lock modules. Furthermore, the substrate processing system according to the embodiment performs the replacement process when no wafers are present on the first transfer mechanism, the second transfer mechanism, or in the load lock module.Therefore, according to this embodiment, two load lock modules can be occupied for carrying in and carrying out, respectively, and the time required for replacing consumable parts can be reduced.

[0208] In the substrate processing system according to the above embodiment, the mounting units include a first mounting unit to which a first storage unit for accommodating substrates can be mounted, and a second mounting unit to which a second storage unit for accommodating consumable parts can be mounted. Therefore, in the substrate processing system according to the embodiment, the substrate storage unit and the consumable part storage unit can be similarly mounted in the atmospheric pressure transfer chamber to perform replacement of consumable parts.

[0209] In the substrate processing system according to the above embodiment, the control unit causes the display unit to display the installation status of the storage units in the installation units, thereby enabling the operator to easily check the installation status of the storage units.

[0210] In the substrate processing system according to the above embodiment, the control unit causes the display unit to distinguish between the first and second mounting units among the plurality of mounting units, thereby enabling the operator to easily confirm where the second storage unit for accommodating consumable parts should be mounted.

[0211] In addition, in the substrate processing system according to the above embodiment, the controller accepts a reservation for replacing consumable parts arranged in the vacuum processing chamber. Then, when the controller determines that there are no substrates or consumable parts being transferred in the vacuum transfer chamber, one or more load lock modules, or atmospheric pressure transfer chamber, the controller causes the first transfer mechanism and the second transfer mechanism to replace the consumable parts. Therefore, the substrate processing system according to the embodiment can replace consumable parts without interrupting substrate processing. Furthermore, the substrate processing system can replace consumable parts without worrying about contaminating or damaging substrates.

[0212] In the substrate processing system according to the above embodiment, the control unit accepts a replacement reservation when the second storage unit is attached to the second attachment unit, and does not accept a replacement reservation when the second storage unit is not attached to the second attachment unit. Therefore, the substrate processing system according to the embodiment can prevent a replacement reservation from being accepted when the consumable part to be used for replacement is not prepared.

[0213] In the substrate processing system according to the above embodiment, the control unit accepts the attachment of the second storage unit to the second attachment unit only when a predetermined instruction is input. Therefore, the substrate processing system according to the embodiment can prevent the second storage unit for storing consumable parts from being installed without the operator's knowledge.

[0214] The substrate processing system according to the above embodiment further includes sensors capable of detecting substrates placed in the first storage unit and consumable parts placed in the second storage unit. The control unit changes the sensor parameters when a predetermined instruction is input. Therefore, the substrate processing system can perform detection using parameters appropriate for the substrates and consumable parts.

[0215] Furthermore, in the substrate processing system according to the above embodiment, a transfer mechanism (first transfer mechanism and second transfer mechanism) for transferring substrates and consumable parts includes an arm equipped with a holder for holding the substrates and consumable parts. The holder includes a first surface, multiple first holders, and multiple second holders. The first surface faces the surfaces of the substrates and consumable parts during transfer. The multiple first holders are formed on the first surface and hold the substrates. The multiple second holders are formed on the first surface and are arranged outside a first circle connecting the multiple first holders to hold the consumable parts. The second holders have an inclined surface that approaches the first surface from one end located on a second circle having a diameter larger than the outer diameter of the consumable parts toward the radially inward direction of the second circle. This reduces the contact area between the second holders and the consumable parts, preventing them from sticking or jumping up. Furthermore, because the second holders are arranged outside the first holders, ring-shaped consumable parts can be held by the second holders without coming into contact with the first holders.

[0216] In addition, in the holder, the height of the first holder from the first surface is greater than the height of one end of the second holder from the first surface. Therefore, the first holder can hold the substrate without the substrate coming into contact with the second holder. Therefore, the holder according to the embodiment can prevent substances adhering to the substrate from adhering to the holder.

[0217] In the above-described holder, the other end of the second holder may be located on a third circle located between the inner diameter and the outer diameter of the consumable part. The other end of the second holder may be located on a fourth circle whose diameter is smaller than the inner diameter of the consumable part. Therefore, the second holder can be configured according to the shape of the consumable part to be transported.

[0218] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0219] 1. Substrate Processing System 10 Vacuum transfer chamber 15 VTM arm (first transfer mechanism) 17a First Pick 17b Second Pick 20. Atmospheric pressure transfer chamber 25 LM arm (second transfer mechanism) 27a First Pick 27b Second Pick 30 Control device 31 Storage section 32 Processing section 33 Input / Output Interface 34 Display section 60 1st holding part 70 Second holding part 220 Plate 221 Aperture 222 First protrusion 223 Second protrusion 230 Movable lid 240 Moving mechanism LLM1, LLM2 Load Lock Module LP1~LP5 Load ports (mounting parts) MS Mapping Sensor PM1~PM8 Process modules (vacuum processing chambers) S1~S16 First sensor S17~S18 Second sensor S20~S27 3rd sensor GV Gate Valve

Claims

1. an atmospheric pressure transfer chamber; a plurality of attachment sections connected to the atmospheric pressure transfer chamber, to which a first storage section for accommodating consumable parts can be detachably attached; one or more load lock modules connected to the atmospheric pressure transfer chamber; a first transfer mechanism disposed in the atmospheric pressure transfer chamber; a first sensor provided in the atmospheric pressure transfer chamber and configured to detect the consumable part held by the first transfer mechanism; a control device; and The control device Controlling the first sensor to detect the consumable part in the atmospheric pressure transfer chamber; controlling the first transport mechanism to transport the consumable part to the one or more load lock modules based on a detection signal from the first sensor; A substrate processing system.

2. an atmospheric pressure transfer chamber; a plurality of attachment sections connected to the atmospheric pressure transfer chamber, to which a first storage section for accommodating consumable parts can be detachably attached; one or more load lock modules connected to the atmospheric pressure transfer chamber; a first transfer mechanism disposed in the atmospheric pressure transfer chamber; a first sensor provided in the atmospheric pressure transfer chamber and configured to output a detection signal indicating the position of the consumable part held by the first transfer mechanism; a control device; and The control device Controlling the first sensor to detect the consumable part in the atmospheric pressure transfer chamber; controlling the first transport mechanism to transport the consumable part to the one or more load lock modules based on a detection signal from the first sensor; controlling the first transport mechanism to correct a positional deviation of the consumable part based on a deviation in the waveform of the detection signal output from the first sensor; A substrate processing system.

3. an atmospheric pressure transfer chamber; a plurality of attachment sections connected to the atmospheric pressure transfer chamber, to which a first storage section for accommodating consumable parts can be detachably attached; one or more load lock modules connected to the atmospheric pressure transfer chamber; a first transfer mechanism disposed in the atmospheric pressure transfer chamber; a first sensor provided in the atmospheric pressure transfer chamber; a control device; a vacuum transfer chamber connected to each of the one or more load lock modules and having a second transfer mechanism for transferring the consumable parts, including used consumable parts or consumable parts before use; a vacuum processing chamber connected to the vacuum transfer chamber; a third sensor provided in the vacuum transfer chamber for detecting the consumable part; and the second transport mechanism transports the consumable part to the vacuum processing chamber based on a detection signal from the third sensor; The control device Controlling the first sensor to detect the consumable part in the atmospheric pressure transfer chamber; controlling the first transport mechanism to transport the consumable part to the one or more load lock modules based on a detection signal from the first sensor; A substrate processing system.

4. an atmospheric pressure transfer chamber; a plurality of attachment sections connected to the atmospheric pressure transfer chamber, to which first storage sections for accommodating consumable parts, which are rings, can be detachably attached; one or more load lock modules connected to the atmospheric pressure transfer chamber; a first transfer mechanism disposed in the atmospheric pressure transfer chamber; a first sensor provided in the atmospheric pressure transfer chamber; a third sensor provided in the vacuum transfer chamber for detecting the consumable part; a control device; and the third sensor is provided in two horizontal directions near a gate valve provided between the vacuum transfer chamber and the vacuum processing chamber, and detects at least one of an outer diameter position or an inner diameter position of the ring; The control device Controlling the first sensor to detect the consumable part in the atmospheric pressure transfer chamber; controlling the first transport mechanism to transport the consumable part to the one or more load lock modules based on a detection signal from the first sensor; A substrate processing system.

5. The substrate processing system according to claim 1 , wherein the first sensor detects a position of the consumable part in the atmospheric pressure transfer chamber.

6. The substrate processing system according to claim 1 , wherein a second storage unit for accommodating substrates can be detachably attached to the plurality of attachment units.

7. The substrate processing system of claim 1 , further comprising a second sensor that detects the consumable part in the first storage section.

8. The first transport mechanism includes: Arm and a pick having a substantially U-shape at the tip of the arm on which the substrate or the consumable part is placed; and The substrate processing system according to claim 7 , wherein the second sensor is a mapping sensor provided at two ends of the substantially U-shaped pick.

9. The substrate processing system according to claim 7 , wherein the second sensor detects at least a position of the consumable part.

10. Further having a display unit, The substrate processing system according to claim 9 , wherein the display unit identifiably displays the position of the consumable part detected by the second sensor.

11. a second storage unit that stores a substrate can be detachably attached to the plurality of attachment units; The substrate processing system of claim 7 , wherein the second sensor further detects the substrate being in the second storage section.

12. The substrate processing system of claim 11, wherein the control device switches the threshold value set for the second sensor when detecting the consumable parts stored in the first storage section and when detecting the substrates stored in the second storage section.

13. The substrate processing system according to claim 7 , wherein the second sensor is a transmission type photoelectric sensor.

14. The substrate processing system according to claim 7 , wherein the second sensor is configured to be movable between the plurality of mounting portions.

15. The substrate processing system according to claim 1 , wherein the first sensor is provided in the atmospheric pressure transfer chamber near the plurality of mounting portions.

16. The substrate processing system according to claim 1 , wherein the first sensor is provided in the atmospheric pressure transfer chamber near the load lock module.

17. the consumable part is a ring, The substrate processing system of claim 1 , wherein the first sensor detects at least one of an outer diameter position and an inner diameter position of the ring.

18. The first transport mechanism includes: Arm and a substantially U-shaped pick at the tip of the arm on which the consumable part is placed; and two first sensors are provided in the atmospheric pressure transfer chamber, The substrate processing system of claim 1 , wherein the distance between two of the first sensors is greater than the width of the outline of the pick.

19. The first transport mechanism includes: Arm and a substantially U-shaped pick at the tip of the arm on which the consumable part is placed; and The substrate processing system of claim 4 , wherein the distance between two of the third sensors is greater than the width of the outer shape of the pick.

20. The substrate processing system of claim 4 or 19, wherein the distance between two of the third sensors is shorter than the width of the inner diameter of the ring.

21. 21. The substrate processing system of claim 4, 19 or 20, wherein a distance between two of the third sensors is shorter than an inner diameter of the ring.

22. two first sensors are provided in the atmospheric pressure transfer chamber, The substrate processing system of claim 1 , wherein the distance between two of the first sensors is less than an outer diameter of the substrate.

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